JP2003317845A - Contact pin, forming method of contact pin, socket for electric component, and manufacturing method of electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for electric component with widened contact area of contact pins contact part for an electric component, capable of increasing wiping amount. <P>SOLUTION: The plate-shaped contact pin 15 arranged to a socket body 13 comprises a contact part 15a contacting with a solder ball 12b of an IC package 12 housed in the socket body 13, a lead part to be connected to a printed board, and a spring part 15c formed between the lead part and the contact part 15a. The spring part 15c is elastic transformation capably formed by bending in the direction vertical to the plate surface, and a contact surface part 15e of the contact part 15a contacting with a solder ball 12b is formed by rectangularly bending the plate surface. The contact surface part 15e is formed so as to move in the direction perpendicular to the plate surface, and the thickness of bending part 15f of the contact surface part 15e is made thinner than that of another part. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin used in a socket for an electric component that detachably holds an electric component such as a semiconductor device (hereinafter referred to as "IC package"), a method for molding the contact pin, and an electric component. The present invention relates to a method for manufacturing a socket and a socket for electric parts.

[0002]

2. Description of the Related Art Conventionally, as this type of "electrical component socket", there is an IC socket that detachably holds an "electrical component" IC package.

The IC package has a BGA (Ball Gr
id array) type, which has a large number of solder balls as terminals on the lower surface of a rectangular package body.

Further, the IC socket is provided with a contact pin on the socket body.
A contact portion is formed on the tip portion so as to be brought into contact with and separated from the solder ball of the IC package. Further, a floating plate is disposed on the upper side of the socket body, and the IC package is accommodated on the floating plate.
The C package is pressed by closing the cover rotatably provided on the socket body, so that the solder ball of the IC package and the contact pin contact portion are brought into contact with each other with a predetermined contact pressure.

[0005]

However, in such a conventional one, the pitch of each contact portion of the contact pin is narrowed due to the narrow pitch of the solder ball, and the contact portion with respect to the contact portion of the solder ball is narrowed. There is a problem that it is difficult to secure the contact area and increase the wiping amount.

Therefore, the present invention widens the contact area of the contact pin contact portion with respect to the electric component terminal, and
An object of the present invention is to provide an electrical component socket that can increase the wiping amount.

[0007]

In order to achieve the above object, the present invention as set forth in claim 1, is a contact portion which is disposed in a socket main body and which contacts a terminal of an electric component housed in the socket main body. A plate-shaped contact pin having a lead portion connected to the printed circuit board and a spring portion formed between the lead portion and the contact portion, the spring portion being curved in a direction orthogonal to the plate surface. Is formed so as to be elastically deformable, and the contact portion is formed by bending a contact surface portion that comes into contact with the electric component terminal at a substantially right angle to the plate surface, and the contact surface portion is orthogonal to the plate surface. It is characterized in that the contact pin is formed so as to be displaced in the direction, and the bent portion of the contact surface portion is formed thinner than the plate thickness of other portions.

According to a second aspect of the present invention, there is provided a method of molding the contact pin according to the first aspect, wherein pressure is applied to a portion of the plate material corresponding to the bent portion to make the plate thickness thinner than other portions. The contact pin is formed and then bent to bend the bent portion to form the contact surface portion.

According to a third aspect of the present invention, in addition to the structure of the second aspect, the bending portion is bent, and pressure is applied to the bending portion to form an edge with the outer surface side of the bending portion as a right angle. It is characterized by having done.

The invention according to a fourth aspect is the first to the third aspects.
In the socket for electrical parts provided with the contact pin according to any one of the above, the contact portion of the contact pin is inserted into the through hole of the floating plate of the socket body, and the contact surface portion of the contact portion is displaced. At this time, the tip of the contact surface portion is a socket for electric parts configured so as to cover the partition wall portion between the through holes.

The invention described in claim 5 is the invention as claimed in claims 1 to 3.
In the socket for electric parts provided with the contact pin according to any one of the above items, the contact pin group assembly is fitted and fitted to the insulating plate member in a state where the plurality of contact pins are adjacent to each other. And the contact pin group assembly is a plurality of stacked electrical component sockets.

According to a sixth aspect of the invention, in addition to the structure of the fifth aspect, a holding portion is formed by bending the contact pin between the spring portion and the lead portion. The holding portion is configured to bear the external force acting on the lead portion and the contact portion by the insulating plate member via the holding portion while being fitted in the fitting groove of the insulating plate member. It is characterized by

The invention according to claim 7 is the invention according to claim 5 or 6.
In the method for manufacturing an electrical component socket according to claim 1, a contact pin group is formed in a state where the plurality of contact pins are connected by a connecting portion and are adjacent to each other, and the contact pin group is formed on an insulating plate member of the socket body. After holding, a plurality of insulating plate members to which the contact pin group is fitted are stacked, and then the socket for electrical component is manufactured by cutting the connecting portion.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 12 show a first embodiment of the present invention.

First, the structure will be described.
This IC socket 1 is an IC socket as a "socket for electric parts" called a clamshell type.
In order to perform a performance test of the IC package 12 which is an "electrical component", 1 is an electrical connection between a solder ball 12b which is a terminal of the IC package 12 and a printed wiring board (not shown) of a measuring instrument (tester). It is for connection.

This IC package 12 is shown in FIG.
The so-called BGA (Ball Grid)
Array type, in which a large number of substantially spherical solder balls 12b are arranged in a matrix form on the lower surface of a rectangular package body 12a.

As shown in FIG. 2, the IC socket 11 generally has a socket body 13 mounted on a printed wiring board, and the socket body 13 has contacts for contacting with and separating from the solder balls 12b. A pin 15 is arranged, a floating plate 16 for accommodating the IC package 12 is arranged on the upper side of the socket body 13, and a cover 17 is rotatably arranged on the socket body 13. .

As shown in FIG. 5, the contact pins 15 are formed by pressing a large number of conductive plate materials at the same time in a line on substantially the same plane. Each contact pin 15 has an upper end portion. A contact portion 15a that comes into contact with the solder balls 12b of the IC package 12 is formed, and a lead portion 15b that is inserted into the printed wiring board and soldered is formed at the lower end portion of the contact portion 15a.
An elastically deformable spring portion 15c is formed between the lower portion and the lead portion 15b. The large number of contact pins 15 arranged in a line are referred to as a contact pin group 20.

More specifically, the spring portion 15c is formed so as to be elastically deformable by curving in a substantially S shape in a direction orthogonal to the plate surface, and the contact portion 15a side is pressed into a substantially U shape. The contact surface portion 15e that comes into contact with the solder balls 12b of the IC package 12 is formed by bending at a substantially right angle to the plate surface.

The contact surface portion 15e is formed so as to be displaced in the direction X orthogonal to the plate surface by elastic deformation of the spring portion 15c, and the bent portion 15f of the contact surface portion 15e is formed.
However, it is formed thinner than the plate thickness of other portions. Further, the bent portion 15f is formed with an edge with the outer surface side being a right angle.

The contact pins 15 of the contact pin group 20 are adjacent to each other at a pitch between adjacent contact portions 15a by forming a holding portion 15d which is bent at a right angle below the spring portion 15c. Lead part 15b
The pitch between them is wider.

The contact pin group 20 is fitted to the insulating plate member 18, and a large number of these are stacked to form a contact pin group assembly 21 shown in FIG.

More specifically, the insulating plate member 18 is
As shown in FIG. 5, it has a plate-like shape, has through holes 18 a formed at both ends, and holds the contact pin group 20.
A fitting groove 18b into which these are fitted is formed in a shape that matches the d and the connecting portion 15g.

Then, with the contact pin group 20 fitted in the insulating plate member 18, as shown in FIG.
A plurality of these are superposed on each other, and an intermediate insulating plate 22 is arranged at the center and side plates 23 are arranged on both sides. Then, the insulating plate member 18, the intermediate insulating plate 22, and the side plate 2
The hollow spacer 24 of the metal tube is inserted into the through holes 18a, 22a, and 23a of No. 3, and the bolt 25 is inserted into the hollow spacer 24 and screwed into the nut 26. It is configured.

This contact pin group assembly 21 is shown in FIG.
As shown in, the contact pins 15 on both sides are formed symmetrically with the intermediate insulating plate 22 as the center so as to face each other.

Then, this contact pin group assembly 21
Is held by the frame-shaped base member 29 and the body member 30, and the floating plate 16 is biased upward by the spring 32 as shown in FIG.
The floating plate 16 is configured to be restrained from rising by being locked to the body member 30.

In addition, as shown in FIGS. 1, 2 and 10, the floating plate 16 has an IC on the periphery thereof.
Mounting surface 1 on which the peripheral edge of the package body 12a is mounted
6a is formed, and through holes 16b into which the contact portions 15a of the contact pins 15 are inserted are formed in a matrix. Furthermore, this floating plate 1
A guide portion 16c for guiding the IC package 12 when the IC package 12 is housed is formed around the area where the through hole 16b is formed in the upper surface of the IC card 6.

The base member 29 and the body member 30
Are attached by bolts 33 along the vertical direction and nuts (not shown).

Further, as shown in FIGS. 1 and 2, a cover 17 is rotatably provided on the body member 30 via a shaft 36, and the IC accommodated on the floating plate 16 by the cover 17. The package 12 is pressed.

The cover 17 is urged in the opening direction by a spring 37, and a latch member 38 is rotatably provided at the tip of the cover 17 and the latch member 3 is provided.
8 is engaged with and disengaged from the body member 30. The latch member 38 is biased in the closing direction by a spring (not shown).

Next, the molding of the contact pin group assembly 21 will be described.

First, the contact pin group 20 is formed by pressing. The contact portion 15a of the contact pin 15 is formed by pressing from the state shown in FIG. 12 (a) to a portion corresponding to the bent portion 15f of the flat plate material by pressing as shown in FIG. 12 (b). The plate thickness is made thinner than the part. Next, as shown in FIG. 12C, the contact surface portion 15e is bent from the bent portion 15f, and thereafter, the contact surface portion 15e is bent.
As shown in (d), pressure was applied to the bent portion 15f to cause plastic deformation, thereby forming an edge with the outer surface side of the bent portion 15f as a right angle.

Each contact pin 15 is formed in this manner, and the contact pin group 20 connected by the connecting portion 15g is fitted into the fitting groove 18b of the insulating plate member 18 (see FIG. 6).

Then, a plurality of insulating plate members 18 to which the contact pin group 20 is fitted are stacked to prevent the insulating plate members 18 from falling off, and the side plates 23 are arranged on both side surfaces of the stacked insulating plate members 18, and then all of them are arranged. Bolt 25 / Nut 2
Tighten and fix with 6 (see Figure 4).

Then, from that state (the state shown in FIG. 7), the connection part 15g of the contact pin group 20 is cut together with the insulating plate member 18 and the like by the fine cutter (see FIG. 8). As a result, each contact pin 15 independently serves as a contact member.

Thereafter, the contact pin group assembly 21 thus formed is assembled with the base member 29, the body member 30 and the like.

Next, the operation will be described.

When accommodating the IC package 12,
With the cover 17 open, the IC package 12 is conveyed by an automatic machine and placed on the floating plate 16. At this time, the IC package 12 has the guide portion 1
6c is guided and placed in a predetermined position.

When the cover 17 is closed from this state, the latch member 38 is locked to the body member 30, and the cover 17 is completely closed.

At this time, the cover pressing portion 1 of the cover 17
The IC package 12 is pressed by the 7a, the floating plate 16 is lowered against the urging force of the spring 32, and the contact surface portion 15e of the contact pin 15 becomes IC.
The solder balls 12b of the package 12 are contacted.

When the floating plate 16 is lowered, the contact surface portion 15e of the contact pin 15 projects above the through hole 16b of the floating plate 16. Then, as shown in FIG. 11, the solder ball 12b comes into contact with the contact pin contact surface portion 15e, the contact pin contact surface portion 15e is pressed by the solder ball 12b, and the spring portion 15c of the contact pin 15 is elastically deformed, From the state shown in FIG. 10 of the contact pin 15 to FIG.
Lean forward to the state shown in.

As a result, the solder ball 12b and the contact pin contact surface portion 15e move relative to each other to be wiped.

In this case, the contact pin bent portion 15
Since the plate thickness of f is thinner than other portions, the radius of curvature on the outer surface side of the bent portion 15f becomes smaller, so that the area of the plane portion of the contact pin contact surface portion 15e becomes wider and the solder ball 12b contacts. The area can be expanded. By the way, if the plate thickness is the same, the radius of curvature increases, and the area of the plane portion decreases accordingly. Moreover, since the R-shaped portion is eliminated by forming an edge with the outer surface side of the bent portion 15f as a right angle, the area of the flat surface portion of the contact surface portion 15e can be further widened, so that the contact area with the solder ball 12b is also increased. Can be expanded more. The contact pin 15 tilts forward to increase the wiping amount. Further, the plate thickness of the contact pin 15 other than the bent portion 15f can be secured, and the elastic force of the spring portion 15c and the strength of other portions can be secured.

Moreover, when the contact pin 15 is tilted forward,
As shown in FIG. 11, the tip of the contact surface portion 15e is configured to cover the upper side of the partition wall portion 16d of the floating plate 16, so that the wiping amount can be increased and the thickness of the partition wall portion 16d can be secured. Therefore, the strength of the floating plate 16 can be secured.

Now, the spring portion 15 of the contact pin 15 is
By elastically deforming c, the contact portion 15a of the contact pin 15 and the solder ball 12b of the IC package 12
And a predetermined contact pressure.

As a result, the IC package 12 is electrically connected to the printed wiring board through the contact pins 15, and the burn-in test is performed.

Further, in such a structure, a plurality of contact pins 15 are arranged in a line at a predetermined pitch on the same plane to form a contact pin group 20, and the contact pin group 20 is an insulating plate. The member 18 is fitted and arranged so as to be overlapped with each other, and the contact portion 15a
Are arranged in a matrix. Therefore, it is not necessary to press-fit each contact pin 15 into the socket body 13, and the work of disposing the contact pin 15 can be easily performed.

Further, in the contact pin group 20, since the pitch interval between the lead portions 15b on the lower end side is wider than the pitch between the contact portions 15a of the adjacent contact pins 15, the solder balls 12b of the IC package 12 are sandwiched. Even with a pitched structure, the contact pins 15 can be easily arranged on the printed wiring board.

Moreover, in order to widen the pitch of the lead portions 15b from the contact portion 15a side, the holding portion 15d is bent at a substantially right angle, and the holding portion 15d is fitted to the insulating plate member 18. , The input from the contact pin contact portion 15a side and the input from the contact pin lead portion 15b side can be borne by the insulating plate member 18 through the holding portion 15d, and compared with the one simply press-fitted into the socket body 13, the contact pin It is possible to reliably hold the contact pin 15 without the 15 coming off.

Further, since the plurality of contact pins 15 are connected to the insulating plate member 18 in a state where they are connected by the connecting portion 15g, and these are stacked, the connecting portion 15g is cut off. The workability of disposing the contact pins 15 can be improved as compared with the case of assembling the contact pins 15 one by one.

[Second Embodiment of the Invention] FIGS. 13 and 14
2 shows Embodiment 2 of the present invention.

The second embodiment is a contact pin group 2
This is different from the first embodiment in that 0 is divided into two right and left.

Three contact pins 1 each on the left and right
5 are connected to each other by connecting portions 15g.

The other structure and operation are the same as those of the first embodiment, and therefore the description thereof is omitted.

Although the present invention is applied to the IC socket 11 as the "electrical component socket" in the above-described embodiment, it is needless to say that the present invention can be applied to other devices as well. Further, in the above-described embodiment, the present invention is applied to the clamshell type IC socket, but the present invention is not limited to this, and may be applied to a so-called open top type IC socket.

[0057]

As described above, according to the first aspect of the present invention, the contact portion of the contact pin is formed by bending the contact surface portion contacting the electric component terminal at a substantially right angle to the plate surface. At the same time as being formed, this contact surface portion is formed so as to be displaced in the direction orthogonal to the plate surface, and since the bent portion of this contact surface portion is formed thinner than the plate thickness of other portions, the outer surface side of this bent portion The radius of curvature can be reduced, the area of the contact surface portion can be maximized, and the wiping amount can be increased. Further, since the plate thickness other than the bent portion can be secured, the elastic force of the spring portion and the strength of other portions can be secured.

According to the second aspect of the present invention, the contact pin having the above effect can be easily formed thin without cutting the bent portion.

According to the third aspect of the present invention, since the bending portion is bent and pressure is applied to the bending portion to form an edge with the outer surface side of the bending portion as a right angle, the area of the contact surface portion can be further expanded. You can

According to the fourth aspect of the invention, the contact portion of the contact pin is inserted into the through hole of the floating plate of the socket body, and when the contact surface portion of the contact portion is displaced, the tip portion of the contact surface portion is Since it is configured to cover the partition wall portion between each through hole, the displacement amount of the contact surface portion can be increased, the wiping amount can be increased, and the plate thickness of the partition wall portion between adjacent through holes can be increased. The strength of the floating plate can be secured.

According to the fifth aspect of the present invention, the plurality of contact pins are fitted and attached to the insulating plate member in a state where the contact pins are adjacent to each other, and the plurality of contact pins are arranged so as to overlap each other. The workability of arranging the pins can be improved.

According to the sixth aspect of the present invention, the contact pin is formed by bending the holding portion between the spring portion and the lead portion, and the holding portion is formed in the fitting groove of the insulating plate member. In the fitted state, the external force acting on the lead and the contact part is borne by the insulating plate member via the holding part, so the contact pin will come off when compared with the one simply press-fitted into the socket body. Therefore, the contact pin can be securely held.

According to the invention described in claim 7, a contact pin group is formed in a state where a plurality of contact pins are connected to each other by a connecting portion so as to be adjacent to each other, and the contact pin group is formed by the insulating plate member of the socket body. After that, a plurality of insulating plate members to which the contact pin group is fitted are overlapped with each other, and then the connecting portion is cut, so that a large number of contact pins can be easily and surely arranged.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention in which a half of a cover is omitted.

FIG. 2 is a sectional view of the IC socket according to the first embodiment.

FIG. 3 is a sectional view of the IC socket according to the first embodiment taken along a direction orthogonal to FIG.

FIG. 4 is a partial cross-sectional view of a contact pin group assembly showing an arrangement state of the contact pin group and the like according to the first embodiment.

FIG. 5 is an exploded perspective view showing a contact pin group and an insulating plate member according to the first embodiment.

FIG. 6 is a perspective view showing a state in which the contact pin group according to the first embodiment is fitted to the insulating plate member.

FIG. 7 is a front view of the contact pin group assembly showing a state before cutting the connecting portion of the contact pin according to the first embodiment.

FIG. 8 is a front view of the contact pin group assembly showing a state after cutting the connecting portion according to the first embodiment.

FIG. 9 is a side view of the contact pin according to the first embodiment.

FIG. 10 is a cross-sectional view showing a state where the contact portion of the contact pin according to the first embodiment is inserted into the through hole of the floating plate.

FIG. 11 is a perspective view showing a contact portion of a contact pin according to the first embodiment inserted into a through hole of a floating plate,
It is a sectional view of a state where a package was stored.

FIG. 12 is a diagram showing a step of molding a contact portion of the contact pin according to the first embodiment.

FIG. 13 is a perspective view showing a contact pin group according to the second embodiment of the present invention.

FIG. 14 is a front view showing a contact pin group according to the second embodiment.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12 IC package (electrical parts) 12a package body 12b Solder ball (terminal) 13 Socket body 15 contact pins 15a contact part 15b Lead part 15c Spring part 15d holding part 15e Contact surface part 15f bending part 15g connection 16 floating plate 16a Mounting surface 16b through hole 16c guide section 16d bulkhead 18 Insulation plate member 18a through hole 18b Mating groove 20 Contact pin group 21 Contact pin group assembly

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01R 43/00 H01R 43/00 B 43/16 43/16

Claims (7)

[Claims] 1. A contact portion which is disposed in a socket body and which comes into contact with a terminal of an electric component housed in the socket body,
In a plate-shaped contact pin having a lead part connected to a printed circuit board and a spring part formed between the lead part and the contact part, the spring part bends in a direction orthogonal to the plate surface and is elastic. The contact portion is formed so as to be deformable, and the contact surface portion that contacts the electric component terminal is formed by bending at a substantially right angle to the plate surface, and the contact surface portion is formed in a direction orthogonal to the plate surface. A contact pin, wherein the contact pin is formed so as to be displaced, and the bent portion of the contact surface portion is formed thinner than the plate thickness of other portions. 2. The method for forming a contact pin according to claim 1, wherein a portion of the plate material corresponding to the bent portion is pressed to form a plate thickness thinner than other portions, and then bending is performed. The contact pin is formed by bending the bent portion to form the contact surface portion. 3. The method for molding a contact pin according to claim 2, wherein the bent portion is bent and pressure is applied to the bent portion to form an edge with the outer surface side of the bent portion as a right angle. . 4. A socket for an electric component provided with the contact pin according to claim 1, wherein the contact portion of the contact pin is inserted into a through hole of a floating plate of the socket body. , When the contact surface portion of the contact portion is displaced, the tip of the contact surface portion,
An electrical component socket, which is configured to cover a partition wall portion between the through holes. 5. An electric component socket provided with the contact pin according to claim 1, wherein a plurality of the contact pins are adjacent to each other and are fitted to the insulating plate member. A socket for electrical parts, characterized in that a contact pin group assembly is formed by being attached, and a plurality of the contact pin group assemblies are superposed. 6. The contact pin is formed by bending a holding portion between the spring portion and the lead portion, and the holding portion is fitted in a fitting groove of the insulating plate member. The socket for electrical parts according to claim 5, wherein, in this state, an external force acting on the lead portion and the contact portion is configured to be borne by the insulating plate member via the holding portion. 7. The method for manufacturing an electrical component socket according to claim 5, wherein the plurality of contact pins are connected by a connecting portion to form a contact pin group in a state of being adjacent to each other, and the contact pin is formed. After holding the group on the insulating plate member of the socket body, a plurality of insulating plate members to which the contact pin group is fitted are stacked, and then the connecting portion is cut off, to manufacture a socket for an electric component. Method.