JPH10275665A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the self inductance of a contact pin and make correspondence to high frequency possible by pressing one end against an electrode pad of a test board for fixing, supporting the other end so as to be capable of sliding, arranging a plurality of contact pins so that the peak part is projected to a positioning groove, and shorten the line length between the lead and the electrode pad of an IC package. SOLUTION: In a contact pin 8, a contact peak part 17 is projected from a positioning groove 5, and a pin fixing part 16 is pressed against an electrode pad 15 of a test board 14 with an elastic body 9 made of hard rubber. When the contact pin 8 is pressed with a lead 13 of an IC package 12, the contact peak part 17 is deformed at an angle within an elastic region, a pin sliding part 18 slides and moves on a pin slide plate 10. The contact peak part 17 comes down, rubs the contact surface of the lead 13, and moves to the outside of the lead 13. The line length of the contact pin 8 is shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used in a system for testing an electronic circuit of a semiconductor device by applying an electric signal, and more particularly to an IC socket for testing an electronic circuit of a high-frequency device.

[0002]

2. Description of the Related Art Conventionally, as an IC socket compatible with such a high frequency, for example, US Pat. No. 5,069,629,
No. 5,207,584 or JP-A-8-236237.

FIG. 5 is a perspective view of an IC socket showing such a conventional example. As shown in FIG. 5, the conventional IC socket has a socket body 5a on which an IC package 1 having leads 2 formed is mounted, and the socket body 5a is mounted on a test board 3 having electrode pads 4. have. In particular, the socket body 5a has an S-shaped contact 31 and two elastomers 32, which are fixed up and down, respectively, to hold the S-shaped contact 31, and the S-shaped contact 31 is processed into the socket body 5a. Into the slot groove 30. Reference numeral 33 denotes surface mounting electrical components such as chip resistors and capacitors mounted on the board 3 side.

First, an IC socket is a surface mount type, and a socket body 5a is fixed to a test board 3 with screws or the like. At this time, the S-shaped contact 31 protrudes from the bottom surface of the socket body 5a by about 0.2 mm. When the S-shaped contact 31 is fixed to the test board 3, the lower elastomer 32 is deformed. 31 is held in contact with the electrode pad 4 of the test board 3.

Next, the lead 2 of the IC package 1 is
When an appropriate contact pressure is applied on the upper surface of the letter-shaped contact 31, the S-shaped contact 31 rotates while deforming the elastomer 32. Thus, the S-shaped contacts 31 are interconnected while rubbing the contact surfaces of the leads 2 of the IC package 1 and the electrode pads 4 of the test board 3.

[0006]

The above-mentioned conventional IC socket uses an S-shaped contact, so that the IC
The distance between the package lead and the electrode pad becomes longer,
Since the self-inductance of the contact itself is increased, it has a disadvantage that it is not suitable for a device that handles high-frequency signals.

In addition, the conventional IC socket has an S-shaped contact and a rotating / fixing mechanism called an elastomer, so that there is a problem that the load contacting the electrode pad of the test board increases. That is, this IC
In the socket, the contact pins slide or rotate on the electrode pads, so that pattern shaving occurs between the contact pins and the electrode pad contact portions.

Normally, an S-shaped contact is manufactured by stamping a plate material, so that a part of the cut surface has a broken surface, and the contact surface is not smooth. Moreover, since the S-shaped contact is in contact with the electrode pad in the width direction of the plate, the contact area is small, a concentrated load is applied, and the contact surface of the electrode pad is further reduced.

As described above, the conventional IC socket has a problem that the contact portion of the electrode pad is scraped due to the sliding (rotational movement and sliding back and forth) and the shape of the S-shaped contact. There is a disadvantage that the contact pressure between the electrode pad and the contact pin is reduced, and stable interconnection cannot be ensured.

An object of the present invention is to reduce the line length between a lead of an IC package and an electrode pad of a test board connected to an electronic circuit tester or the like in a test of an electronic circuit of an IC to reduce a self-inductance of a contact pin. It is an object of the present invention to provide an IC socket which is capable of supporting a high frequency.

It is another object of the present invention to provide an IC socket which stabilizes the contact pressure between a contact pin and an electrode pad and prevents the contact pin from shaving the surface of the electrode pad.

[0012]

According to the IC socket of the present invention, a package positioning portion for mounting an IC package having leads around it is formed at the center,
A pin positioning groove is formed around the package positioning portion, a socket body for mounting on a test board having an electrode pad, and a vertex portion is arranged to protrude from the pin positioning groove of the socket body, and one end is provided. And a plurality of contact pins having a straight line between the apex and the one end, and the one end of the plurality of contact pins for fixing the one end of the socket body. A pin fixing plate disposed corresponding to a peripheral portion, an elastic member disposed between the pin fixing plate and the peripheral portion of the socket body, and pressing the plurality of contact pins against the electrode pads of the test board; Positioning the package of the socket body to support the other end of the plurality of contact pins so as to be slidable; Constructed and a pin sliding plate disposed under the parts.

The elastic body in this IC socket is formed using hard rubber, and is formed so that one ends of the plurality of contact pins to be fixed are pressed and fixed to the electrode pads of the test board.

The plurality of contact pins in the IC socket include an apex formed in the middle, a fixed portion and a sliding portion formed at both ends, and the apex is located between the pin positioning groove of the socket body. The fixing portion and the sliding portion are formed so as to be housed inside the socket main body.

The plurality of contact pins in the IC socket are formed such that the apexes are angularly deformed within the elastic range when pressed by the leads of the IC package.

The socket body of the IC socket is configured such that a groove is formed by the bottom surface of the package positioning portion and the pin slide plate so that the other ends of the plurality of contact pins can slide. .

In the IC socket of the present invention, a package positioning portion for mounting an IC package having leads around the center is formed at the center, and a pin positioning groove is formed around the package positioning portion to form an electrode. A socket body for mounting on a test board having a pad, and a vertex portion is arranged to protrude into the pin positioning groove of the socket body, so that one end is fixed and the other end is slidable, A plurality of contact pins having a straight line between the apex and the one end, and a rectangular pin fixing plate disposed immediately below the positioning portion of the socket body to fix the one end of the plurality of contact pins. And the other end of the contact pin, which is slidable, is supported at a peripheral portion of the socket body. It is made.

The plurality of contact pins in the IC socket include the apex formed in the middle, fixed portions and sliding portions formed at both ends, and the apex is the pin positioning groove of the socket body. Further, the fixing portion and the sliding portion are formed so as to be housed inside the socket body.

The plurality of contact pins in the IC socket are formed such that the top portions are angularly deformed within the elastic region when pressed by the leads of the IC package.

[0020]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of an IC socket for explaining an embodiment of the present invention, in which a left half of the IC socket is cut away.
As shown in FIG. 1, an IC socket 1 according to the present embodiment is mounted on a test board connected to an external tester or the like, and is used for measuring characteristics of an electronic circuit such as an IC package. In particular, this socket 1
Is provided with a socket body 2 having a package positioning portion 3 formed of a concave portion 6 and a tapered portion 4 formed at the center for mounting an IC package.
A pin positioning groove 5 is formed around the package positioning portion 3 so that the top of the contact pin 8 protrudes. Also, at the lower part and inside of the socket body 2,
A contact pin 8 provided along the outer periphery of the package positioning portion 3, a pin fixing plate 7 having an outer frame shape for fixing one end of the contact pin 8, and an elastic body 9 for holding the contact pin 8. , Contact pin 8
And a rectangular pin slide plate 10 for sliding the other end of the pin slide plate. In addition, the space portion 11 is located at a linear portion where the contact pin 8 rises, and continues to the pin positioning groove 5 described above.

FIGS. 2 (a) and 2 (b) show the IC of FIG.
A before and after measurement with IC package mounted on socket
FIG. 4 is a partial cross-sectional view taken along line -A ′. As shown in FIG.
This IC socket is, as described above, a socket body 2
And a plurality of contact pins 8 and a pin fixing plate 7
, An elastic body 9 and a pin slide plate 10. The socket body 2 has a lead 13 around it.
A package positioning portion 3 for mounting an IC package 12 having a center is formed at the center, and a pin positioning groove 5 is formed around the package positioning portion 3 to be mounted on a test board 14 having an electrode pad 15. belongs to. Moreover, the socket body 2 has a groove formed by the bottom surface of the package positioning portion 3 and the pin slide plate 10 so that the pin slide portion 18 of the contact pin 8 can slide.

The plurality of contact pins 8 are arranged along the outer periphery of the positioning portion 3 so that the contact apex portion 17 projects into the pin positioning groove 5 of the socket body 2.
The pin fixing portion 16 at one end is fixed and the pin sliding portion 1 at the other end is fixed.
8 is slidable, and a linear portion is formed between the contact apex portion 17 and the pin fixing portion 16. That is, the contact pin 8 includes an apex portion 17 formed in the middle, a fixed portion 16 and a sliding portion 18 formed at both ends, and the apex portion 17 protrudes from the pin positioning groove 5 of the socket body 2. The fixed portion 16 and the sliding portion 18 are housed inside the socket body 2.
Further, when the contact pin 8 is pressed by the lead 13 of the IC package 12, the vertex 17 is angularly deformed within the elastic region.

The contact pin 8 having a structure in which one side is fixed and the other side is slid, is provided on the IC package 12.
The lead 13 and the electrode pad 15 of the test board 14 are interconnected by a linear portion having a line length of about 3 mm, the pin fixing portion 16 is directly fixed on the electrode pad 15, and only the pin sliding portion 18 slides.

As described above, the pin fixing plate 7 is formed in a frame shape, and corresponds to the peripheral portion 19 of the socket body 2 for fixing the fixing portion 16 which is one end of the contact pin 8. Be placed. This pin fixing plate 7
Is screwed and fixed to the socket body 2.

The elastic body 9 is arranged between the peripheral portion 19 of the socket body 2 and the pin fixing plate 7 and has a function of pressing the contact pins 8 against the electrode pads 15 of the test board 14. The elastic body 9 presses and fixes the fixing portion 16 of the contact pin 8 to the electrode pad 15 of the test board 14 using, for example, hard rubber having high insulating properties.

Further, the pin slide plate 10 is disposed below the package positioning portion 3 of the socket body 2 to support the pin slide portion 18 of the contact pin 8 and is screwed and fixed to the socket body 2. As described above, it is formed in a rectangular shape.

As described above, in the IC socket according to the present embodiment, a plurality of contact pins 8 are inserted into the grooves 5 formed in the socket body 2 and fixed to the socket body 2 by the pin fixing plate 7 via the elastic body 9. Is done. further,
The pin slide plate 10 is arranged below the pin slide portion 18 of the contact pin 8 and fixed to the socket body 2 to restrict the operation of the pin slide portion 18 of the contact pin 8 only in the horizontal direction. The IC socket thus configured is positioned at a predetermined position on the test board 14,
When the IC socket is fixed, the IC socket is fixed to the test board 14 while bending the elastic body 9, so that the contact is secured between the electrode pad 15 and the contact pin 8 while securing the contact pressure.

As shown in FIG. 2B, the IC package 12 to be tested is automatically supplied to the IC socket by the automatic supply device, and the lead 1 of the IC package 12 is supplied.
Appropriate load is applied to 3 and contact pins 8. That is, the IC package 12 is conveyed to a predetermined position of the socket body 2 while being suction-held by the package suction section 21, and then the IC package 12 is released and dropped into the positioning section 3 of the socket body 2. The position of the dropped IC package 12 is automatically corrected by the positioning unit 3. Next, the lead pressing unit 20 descends and stops at a predetermined descending position.

Although a device for supplying the IC package 12 and providing an appropriate contact pressure for the leads 2 is used here, it is also possible to supply these and supply the contact pressure by manual operation. In that case, a lid-type structure of an IC socket, which is a well-known technique, can be used.

However, since the pin fixing portion 16 of the contact pin 8 is fixed by the pin fixing plate 7, the pressure applied to the lead 13 by the lead pressing portion 20 is reduced by the contact apex portion 17 of the contact pin 8. Is deformed within the elastic range. Accordingly, the pin sliding part 1
8 can move while sliding on the pin slide plate 10. By these operations, the contact apex portion 17 moves to the outside of the lead 13 while rubbing the contact surface of the lead 13 while descending.

According to the above-described embodiment, it is possible to measure a high-frequency device by keeping the line length of the contact pin 8 short and ensuring a low inductance. Specifically, the line length of the contact pin 8 is about 3 mm.
H or less. The contact pins 8 of the socket can be made of a plate material by press bending to secure a pin width, to further smooth the contact contact surface, and to form electrode pads of the test board 14. By employing a structure in which the contact pins 8 are fixed to the contact pins 15, the scraping of the electrode pad portions due to friction can be solved.

FIGS. 3A and 3B are partial cross-sectional views taken along the line AA 'of the IC socket before and after measurement, respectively, for explaining another embodiment of the present invention. As shown in FIG. 3A, in the IC socket according to the present embodiment, a package positioning portion 3 for mounting an IC package 12 having leads 13 around the center is formed at the center, and the package positioning portion 3 A pin positioning groove 5 is formed around the socket body 2 for mounting on a test board 14 having an electrode pad 15, and an apex 17 is disposed so as to project into the pin positioning groove 5 of the socket body 2, Are pin fixing portions 16, the other end is a pin sliding portion 18, a plurality of contact pins 8 having a straight line between the apex portion 17 and the pin fixing portion 16, and a pin fixing portion 16 of the plurality of contact pins 8. And a rectangular pin fixing plate 7 disposed immediately below the positioning portion 3 of the socket body 2 in order to fix the pin. Moreover, this contact pin 8
Is formed so as to support a pin sliding portion 18 slidable by a peripheral portion 19 of the socket body 2.

In this case, the contact pin 8 also includes an apex portion 17 formed in the middle, a fixed portion 16 and a sliding portion 18 formed at both ends, and the apex portion 17 is provided in the pin positioning groove 5 of the socket body 2. More protruding and fixed part 1
6 and the sliding portion 18 are housed inside the socket body 2, and when the contact pin 8 is pressed by the lead 13 of the IC package 12,
7 is formed so as to be angularly deformed in the elastic range.

As described above, in the IC socket according to the present embodiment, a plurality of contact pins 8 are inserted into the grooves 5 formed in the socket body 2 and fixed to the socket body 2 by the pin fixing plates 7. The I thus constructed
The C socket is positioned at a predetermined position on the test board 14 and fixed with screws.

Further, as shown in FIG. 3B, the steps from the supply of the IC package 12 to the test are the same as those in the above-described embodiment, and the description is omitted. In the present embodiment, the contact pin 8 is
6 is fixed by the pin fixing plate 7,
The pressure applied to the lead 13 by the lead pressing unit 20 changes the angle of the contact apex 17 within the elastic range. Accordingly, the pin sliding portion 18 slides while applying pressure to the upper surface of the electrode pad 15. By these operations, the contact apex portion 17 moves down to the inside of the lead 13 while rubbing the contact surface of the lead 13.

In short, in the present embodiment, the vertex 17
Is different from that of the above-described embodiment, in that the pin-removing portion 18 moves directly on the pad 15. These differences are that, when viewed in terms of the member configuration, the elastic body is not used, so that the assembly is simple, but the electrode pad 15 is slightly damaged.

FIGS. 4A and 4B are conceptual views showing the order of steps in manufacturing the contact pin shown in FIG. As shown in FIG. 4A, in manufacturing the contact pin 8 in FIG. 3, a plate-like member having good electrical characteristics and having spring properties, such as beryllium copper, is used.
The lead frame 22 is manufactured by punching. Here, the plate thickness and the width of the contact pin 8 are determined by the lead width and pinch of the semiconductor device to be tested. Thereafter, the lead frame 22 is plated with gold.

Next, as shown in FIG. 4 (b), the lead frame 22 plated with gold is set in a molding machine.
Pressing is performed by the lower mold 23 and the upper mold 24. Thereafter, the contact pins 8 are cut into individual pieces and subjected to an annealing process and a cleaning process to complete the contact pins 8.

In the above-described embodiment,
The contact pin 8 can be formed in a similar step.

According to the above-described embodiment, the measurement of the high-frequency device can be made possible by keeping the line length of the contact pin 8 short and ensuring low inductance. In addition, even if one end of the contact pin 8 slides on the electrode pad 15, a stress is applied to the electrode pad 15, so that the contact portion of the contact pin 8 may cause the stress to fall.
Can be suppressed.

[0042]

As described above, the IC socket according to the present invention has a socket body in which a package positioning portion is formed in the center and a pin positioning groove is formed around the package body, and a contact apex protrudes from the pin positioning groove. A contact pin having a linear portion having a pin fixing portion and a pin sliding portion formed at both ends, a pin fixing plate corresponding to the pin fixing portion, and a sliding contact corresponding to the pin sliding portion. When testing an electronic circuit of an IC by having a mechanism, the line length between the IC lead and the electrode pad is shortened, the self-inductance is reduced, and high-frequency operation is enabled. This has the effect of preventing scraping of the steel.

More specifically, since the length of the line for electrically connecting the contact pins of the socket is about 3 mm, the inductance can be made about 3 nH, and an electronic circuit of a high-frequency device can be tested.

Further, for the shaving of the surface of the electrode pad, a contact pin made by press-bending a plate material can be used, so that the contact surface of the pin becomes smooth and the width of the pin can be made wider than before. In addition, it is possible to disperse the stress with the increase in the contact area, and it is possible to suppress the chipping of the electrode pad. In addition, if the contact pins are fixed on the electrode pads, the surface of the electrode pads can be basically prevented from being scraped.

[Brief description of the drawings]

FIG. 1 is a plan view in which a left half of an IC socket is cut out for explaining an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view taken along line AA ′ before and after mounting an IC package on the IC socket of FIG.

FIG. 3 is an IC for explaining another embodiment of the present invention.
It is an AA 'line partial sectional view before and after measurement of a socket.

FIG. 4 is a conceptual diagram showing the order of steps when manufacturing the contact pin in FIG. 3;

FIG. 5 is a perspective view of an IC socket for explaining an example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Socket main body 3 Positioning part 5 Groove 7 Pin fixing plate 8 Contact pin 9 Elastic body 10 Pin slide plate 12 IC package 13 Lead 14 Test board 15 Electrode pad 16 Pin fixing part 17 Contact apex part 18 Pin sliding part 19 Around the body

Claims (8)

[Claims] 1. A test board provided with an electrode pad, wherein a package positioning portion for mounting an IC package having leads around the center is formed at the center, and a pin positioning groove is formed around the package positioning portion. A socket body for mounting, arranged so that a vertex protrudes from the pin positioning groove of the socket body, so that one end is fixed and the other end is slidable,
A plurality of contact pins having a straight portion between the apex and the one end, and a pin fixing plate arranged to correspond to a peripheral portion of the socket body for fixing the one end of the plurality of contact pins; An elastic member disposed at a peripheral portion of a socket body and between the pin fixing plates and pressing the plurality of contact pins against the electrode pads of the test board; and the other end slidable by the plurality of contact pins. And a pin slide plate disposed below the package positioning section of the socket body to support the IC socket. 2. The IC socket according to claim 1, wherein said elastic body is formed using hard rubber, and said one end to which said plurality of contact pins are fixed is pressed and fixed to said electrode pad of said test board. 3. The plurality of contact pins include the apex portion formed in the middle, a fixed portion and a sliding portion formed at both ends, and the apex portion is located between the pin positioning groove of the socket body. 2. The IC socket according to claim 1, wherein said fixing portion and said sliding portion protrude and are accommodated inside said socket body. 4. The method according to claim 1, wherein the plurality of contact pins are connected to the IC.
The IC socket according to claim 1, wherein when pressed by the lead of the package, the vertex is angularly deformed within an elastic region. 5. The IC according to claim 1, wherein the socket body has a groove formed by the bottom surface of the package positioning portion and the pin slide plate so that the other ends of the plurality of contact pins can slide. socket. 6. A test board having an electrode pad, wherein a package positioning portion for mounting an IC package having leads around the center is formed at the center, and a pin positioning groove is formed around the package positioning portion. A socket body for mounting, arranged so that a vertex protrudes from the pin positioning groove of the socket body, so that one end is fixed and the other end is slidable,
A plurality of contact pins having a straight line between the apex and the one end, and a rectangular pin fixing plate disposed immediately below the positioning portion of the socket body to fix the one end of the plurality of contact pins. And
The other end of the contact pin, which is slidable, is supported by a peripheral portion of the socket body.
C socket. 7. The plurality of contact pins include the apex portion formed in the middle, a fixed portion and a sliding portion formed at both ends, and the apex portion is located between the pin positioning groove of the socket body. 7. The IC socket according to claim 6, wherein the fixing portion and the sliding portion protrude and are accommodated inside the socket body. 8. The method according to claim 1, wherein the plurality of contact pins are connected to the IC.
7. The IC socket according to claim 6, wherein when pressed by the lead of the package, the vertex is angularly deformed within an elastic range.