JPH1079281A - Socket structure for semiconductor device testing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate connector exchange by temporarily securing a rubber connector to a lower face of a socket by adhesive tape in a above structure comprising a socket for setting a semiconductor device, a positioning pin, an electrode, and the rubber connector. SOLUTION: A rubber connector 17 is inserted into a step ped part 43 of a socket 31, and a pair of corner parts on diagonal lines are temporarily secured to a lower face of the socket 31. After this socket 31 is vertically inverted, a positioning pin 37 attached to a through hole 35 is fitted with a positioning hole 41 of a substrate 38. In a semiconductor device 5 set to an opening 33 of the socket 31, a bump is in a state opposite to an electrode 39 of the substrate 38 with the rubber connector 17 intervened and is electrically connected by a plurality of wires planted in the rubber connector 17. Conventionally, since the rubber connector is secured to the socket by a bonding agent, exchange work was extremely difficult.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test socket structure suitable for use in a burn-in device or the like.

[0002]

2. Description of the Related Art A so-called screening test is performed on semiconductor devices in order to remove a device that causes a failure depending on time and stress from manufacturing variations. In the screening test, for example, at a high temperature, a power supply voltage that is rated or higher is applied, and a signal close to the actual operation is applied to an input circuit of the device. A burn-in device for performing this type of test requires a socket for connecting an electrode to a bump of a semiconductor device, for example, a chip size package (hereinafter, referred to as “CSP”).

FIG. 8 is an exploded perspective view showing a conventional socket structure for testing a semiconductor device, FIG. 9 is a longitudinal sectional view showing a state where the socket is fixed to a substrate, and FIG. 10 is an enlarged view of bumps and electrodes facing each other with a rubber connector interposed therebetween. FIG. A rectangular opening 3 is formed in the center of the thick rectangular plate-shaped socket 1.
The opening 3 makes the CSP 5 detachable. Socket 1
Positioning pins 7 protrude from the lower surface of the substrate 9, and the positioning pins 7 are fitted into positioning holes 11 formed in the substrate 9.

[0004] A plurality of electrodes 13 are provided on the substrate 9 in parallel, and the electrodes 13 are connected to a burn-in device body (not shown). The socket 1 is provided with positioning pins 7 in positioning holes 11.
Are fixed to the board 9 by fixing bolts (not shown) inserted through the mounting holes 15 at the four corners to the fixing holes 16 of the board 9. As shown in FIG. 9, the CSP 5 is set in the socket 1 which is positioned and fixed, so that the bumps 5a face the electrodes 13 respectively.

[0005] A rectangular plate-shaped rubber connector 17 is provided on the lower surface of the socket 1. The rubber connector 17 is bonded to a step 19 formed by cutting off the periphery of the opening 3 on the lower surface of the socket using an adhesive 21. As shown in FIG. 10, a plurality of conductive wires 2
3 are implanted, and both ends of the wire 23 are rubber connectors 1
7 slightly exposed on the front and back surfaces.

Therefore, only the bumps 5a and the electrodes 13 facing each other with the rubber connector 17 interposed therebetween are electrically connected via the wires 23 of the rubber connector 17 only. By interposing such a rubber connector 17 between the socket 1 and the board 9, a large number of CSPs 5
Is repeated, the electrode 13 of the substrate 9 connected to the apparatus main body is not worn.

[0007]

However, in the above-described conventional socket structure for testing a semiconductor device, the rubber connector 17 is bonded to the socket 1 with an adhesive 21. Therefore, due to wear and dirt of the rubber connector 17,
When the rubber connector 17 needs to be replaced, it is extremely difficult to remove the adhesive 21 remaining after the rubber connector 17 is peeled off. In the case of a screening test or the like, the back surface of the CSP 5, that is, the surface opposite to the bump 5a may be pressurized.
Even if it is attempted to spread outward by an amount corresponding to the pressurization, there is a problem in that the flexibility of the rubber connector 17 is impaired because the entire outer periphery is adhered by the adhesive. Furthermore, if the adhesive flows out and covers the contact surface, the bump 5a and the electrode 13 may not be electrically connected.

In the conventional socket structure for testing a semiconductor device described above, the positioning pins 7 are integrally formed with the socket 1 so as to project therefrom. Therefore, if the positioning pins 7 are worn, the entire socket 1 must be replaced. In addition, the usable socket body must be discarded, which is uneconomical. Further, since the rubber connector 17 uses a silicon rubber, which easily generates static electricity, as a base material, a large number of CSP5
When set repeatedly, static electricity is easily accumulated,
The static electricity may damage the CSP 5.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor device test socket structure that allows easy replacement of a rubber connector by eliminating the need for bonding with an adhesive. is there. Further, the present invention provides
To provide a socket structure for testing a semiconductor device, in which a rubber connector can be easily replaced, a socket can be reused when a positioning pin is replaced, and an adverse effect on a CSP due to charging of the rubber connector can be prevented. It is assumed that.

[0010]

In order to achieve the above object, a semiconductor device test socket structure according to the present invention comprises: a socket having an opening for setting a semiconductor device to be inspected; A positioning pin that protrudes from the socket and fits into a positioning hole formed in the substrate, a plurality of electrodes formed on the substrate and opposed to bumps on the lower surface of the semiconductor device set in the socket, and interposed between the socket and the substrate; And a plate-shaped rubber connector for electrically connecting the opposed bumps and electrodes to each other, wherein the rubber connector is temporarily fixed to the lower surface of the socket with an adhesive tape. is there.

In the semiconductor device test socket structure thus constructed, when a plurality of semiconductor devices are tested, when the rubber connector becomes worn, the socket is removed from the substrate and temporarily placed on the lower surface of the socket. Remove the fixed rubber connector together with the adhesive tape. This eliminates the need for removing the adhesive after peeling off the rubber connector, which is necessary when the rubber connector is bonded to the socket with an adhesive. A new rubber connector is temporarily fixed again with an adhesive tape on the lower surface of the socket from which the worn rubber connector has been removed.

Further, the structure of the semiconductor device test socket structure according to the present invention comprises a socket having an opening for setting a semiconductor device to be inspected, a positioning hole protruding from the socket and drilled in a substrate. A plurality of electrodes formed on the substrate and opposed to the bumps on the lower surface of the semiconductor device set in the socket;
A plate-shaped rubber connector for electrically connecting the bump and the electrode interposed between the socket and the substrate and electrically connecting the bump and the electrode, wherein the socket is a socket into which the rubber connector is fitted. A main body, having the opening, and a holder formed detachably with the socket main body, wherein when the holder is mounted on the socket main body, a bump on the lower surface of the semiconductor device set in the opening and An electrode of a substrate is connected via a rubber connector fitted into the socket body, and the rubber connector fitted into the socket body becomes detachable when the holder is removed from the socket body. It is a feature.

In the semiconductor device test socket structure thus configured, the holder is detached from the socket main body when the rubber connector is worn by testing a plurality of semiconductor devices. As a result, the rubber connector fitted into the socket body can be removed from the socket body. Then, after inserting a new rubber connector into the socket body from which the worn rubber connector was removed,
Attach the holder to the socket body again. Therefore, according to this semiconductor device test socket structure, when replacing a worn rubber connector with a new one, the rubber connector is required to be bonded to the socket with an adhesive. Removal of the agent is not required.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a semiconductor device test socket structure according to the present invention will be described below in detail with reference to the drawings. 1 is an exploded perspective view of a semiconductor device test socket structure according to the present invention, FIG. 2 is a bottom view of the socket with a rubber connector temporarily fixed, and FIG. 3 is a longitudinal sectional view of the semiconductor device test socket structure according to the present invention. is there. In addition,
The same members as those shown in FIGS. 8 to 10 are denoted by the same reference numerals, and redundant description will be omitted.

A thick rectangular plate-shaped socket 31 has a rectangular opening 33 formed in the center portion thereof.
SP5 is detachable. Through holes 35 are respectively formed in the four corners of the socket 31, and detachable positioning pins 37 are inserted into a pair of diagonal through holes 35. The positioning pin 37 can be detachably attached to the socket 31 by, for example, a screwing structure.

On the other hand, a plurality of electrodes 39 are juxtaposed on the substrate 38, and the electrodes 39 are connected to a burn-in device body (not shown). The socket 31 has a positioning pin 37 fitted in a positioning hole 41 formed in the substrate 38, and another through hole 35.
Is fixed to the substrate 38 by fixing the bolt (not shown) inserted into the other positioning hole 41 of the substrate 38. The CSP 5 is set in the socket 31 that is positioned and fixed, so that the bumps 5a face the electrodes 39, respectively.

On the lower surface of the socket 31, there is formed a step 43 having a rectangular shape in which the periphery of the opening 33 is cut off. The rubber connector 17 is inserted into the step 43. The rubber connector 17 inserted in the step 43 closes the lower surface of the opening 33. That is, the CSP set in the opening 33
5 is placed on the rubber connector 17. The rubber connector 17 has a pair of diagonal corners temporarily fixed to the lower surface of the socket 31 with a heat-resistant adhesive tape 45. The thickness of the adhesive tape 45 is smaller than the height of the electrode 39.

The rubber connector 17 is prevented from moving in the plane direction by being inserted into the step portion 43. Adhesive tape 4
5 may be any as long as the rubber connector 17 can be temporarily fixed to the extent that the rubber connector 17 does not fall from the lower surface of the socket 31 when the socket 31 is turned upside down in the state shown in FIG.

An earth electrode 47 is provided on the substrate 38 near the electrode 39, and the earth electrode 47 is provided at a position where it comes into contact with the rubber connector 17 while the socket 31 is positioned and fixed to the substrate 38 (FIG. 1). 3).

In the semiconductor device test socket structure thus constructed, the rubber connector 17 is inserted into the step 43 of the socket 31 and a pair of diagonal corners is adhered to the adhesive tape 45.
After temporarily fixing to the lower surface of the socket 31 and turning it upside down,
The positioning pins 37 attached to the through holes 35 are fitted into the positioning holes 41 of the substrate 38. Next, a bolt (not shown) inserted through the other pair of through holes 35 is fixed to the board 38, and the socket 31 is positioned and fixed to the board 38. As a result, the rubber connector 17 is connected to the ground electrode 47 provided on the substrate 38.

The CSP 5 set in the opening 33 of the socket 31 has the bump 5 a facing the electrode 39 of the substrate 38 with the rubber connector 17 interposed therebetween, and the bump 5 a and the electrode 39 are connected to the rubber connector 17. It is electrically connected by a plurality of implanted wires 23 (see FIG. 10). A power supply voltage is applied to the electrodes 39 of the substrate 38 from a burn-in device main body (not shown), and a screening test is performed at a high temperature, for example.

When a plurality of CSPs 5 are tested and the rubber connector 17 becomes worn, the fixing bolt is removed and the rubber connector 1 temporarily fixed to the lower surface of the socket 31 is removed.
7 is removed together with the adhesive tape 45. The new rubber connector 17 is temporarily fixed again with the adhesive tape 45 to the lower surface of the socket 31 from which the worn rubber connector 17 has been removed. Thereafter, the socket 31 is turned over, and the socket 31 is fixed to the substrate 38 with the fixing bolt, thereby completing the replacement of the rubber connector 17.

When the positioning pin 37 is worn out by removing the socket 31 a plurality of times, the positioning pin 37 is removed from the socket 31 and a new positioning pin 37 is mounted in the through hole 35 of the socket 31.

According to the socket structure for testing a semiconductor device according to the above-described embodiment, the rubber connector 17 is temporarily fixed to the lower surface of the socket 31 with the heat-resistant adhesive tape 45.
When the rubber connector 17 is replaced, the rubber connector 17 can be easily replaced simply by peeling off the adhesive tape 45, and the rubber connector 17 is connected to the stepped portion 4 of the socket 31 by using an adhesive or the like.
The operation of removing the adhesive after peeling off the rubber connector, which is required in the conventional structure bonded to the third connector, can be eliminated.

Also, since the positioning pin 37 is detachably provided separately from the socket 31, the positioning pin 37
When is worn out, only the positioning pin 37 can be replaced, and the socket 31 can be reused. Since two of the four through holes 35 formed in the socket 31 are used for the positioning pin 37 and the other two are used for fixing, the fixing bolt is inserted through all of the four through holes 35. Compared with the conventional fixing structure, the number of fixing bolts can be reduced, and workability at the time of removing and attaching the socket can be facilitated.

Furthermore, since the static electricity generated by the replacement of the CSP 5 can flow to the ground electrode 47 provided on the substrate 38, the static electricity is not charged in the rubber connector 17, and the adverse effect on the CSP 5 due to the accumulated static electricity is prevented. Can be prevented.

Next, a second embodiment of the semiconductor device test socket structure according to the present invention will be described. FIG. 4 is a bottom view of a socket showing a semiconductor device test socket structure according to a second embodiment of the present invention, and FIG. 5 is a longitudinal sectional view of the second embodiment. On the lower surface of the socket 51, there is formed a square step 43 in which the outer periphery of the opening 33 is cut off.
Has a rubber connector 17 inserted therein.

At the four corners of the step 43, for example, triangular holding pieces 53 made of a heat-resistant sheet or the like are provided. Therefore, the rubber connector 1 is provided between the holding piece 53 and the step 43.
A holding space for inserting the tip of the corner of No. 7 is formed. The holding piece 53 is bonded to the socket 51 only with a bonding surface with the lower surface of the socket with an adhesive. That is, the contact surface with the rubber connector 17 does not have adhesiveness. Other portions are configured in the same manner as the above-described semiconductor device test socket structure, that is, the first embodiment.

In the semiconductor device test socket structure thus configured, each corner of the rubber connector 17 is
By inserting the rubber connector 17 into the holding space formed between the holding piece 53 and the step 43, the rubber connector 17 is temporarily fixed to the lower surface of the socket 51. The rubber connector 17 bends a corner part by using the flexibility of being a rubber plate,
The tip can be inserted into and detached from the holding space to allow easy replacement. The thickness of the holding piece 53 is set to be smaller than the height of the electrode 39 as in the case of the adhesive tape 45 described above.
Further, the amount by which the corners of the rubber connector 17 are swallowed into the holding space may be any as long as the holding force is such that the rubber connector 17 does not drop when the socket 51 is inverted.

As described above, according to the semiconductor device test socket structure according to the second embodiment, the holding pieces 53 are provided at the four corners of the stepped portion 43, and the rubber connector 17 is formed by the holding pieces 53 and the stepped portion 43. Since the holding space for holding the tip of the corner is formed, the rubber connector 17 can be temporarily and detachably fixed to the lower surface of the socket 51 by utilizing the flexibility of the rubber connector 17. As a result, the application and removal of the adhesive or the adhesive tape 45 at the time of replacing the rubber connector becomes unnecessary, and the replacement operation can be performed more easily and economically.

Next, a third embodiment of the semiconductor device test socket structure according to the present invention will be described. FIG. 6 is an exploded perspective view showing a third embodiment of the semiconductor device test socket structure according to the present invention, and FIG. 7 is a longitudinal sectional view of the third embodiment. In the present embodiment, the socket includes a socket main body 61 and a holder 62.

The socket body 61 has a rectangular opening 61a at the center thereof into which the rubber connector 63 can be fitted. In addition, the socket main body 61 includes the first,
Similarly to the second embodiment, the positioning pin 37 and the fixing bolt are used to position and fix on the substrate 38. A plurality of electrodes 39 are arranged on the substrate 38 at the position of the opening 61a when the socket body 61 is positioned and fixed.

The holder 62 has a square plate-like base portion 62a.
And a claw part 62b (two places) having a latch mechanism, and the base part 62a is provided with an opening 61a of the socket body 61.
It is formed so that it can be inserted into. When the base 62a is inserted into the opening 61a, the holder 62
Is fixed to the socket body 61 by the latch mechanism.
That is, the holder 62 is provided detachably from the socket main body 61. However, the holder 62 is positioned when it is mounted on the socket body 61 by inserting the base portion 62a into the opening 61a. In the holder 62, similarly to the first and second embodiments described above, an opening 33 into which the CSP 5 can be detachably attached is provided at the center of the base 62a.
Is formed.

The rubber connector 63 is fitted in an opening 61a of the socket body 61, which is positioned and fixed, in a predetermined direction. The fitting direction of the rubber connector 63 is determined by a notch 63 a provided at a corner of the rubber connector 63.

In the semiconductor device test socket structure thus configured, when the holder 62 in which the CSP 5 is set in the opening 33 is mounted on the socket body 61, the bump 5a of the CSP 5 is The electrode 38 is opposed to the electrode 39. That is, the holder 62
Is attached to the socket body 61, the rubber connector 63
Is held in a state sandwiched between the bump 5a and the electrode 39. Therefore, even if the rubber connector 63 is not bonded to the bump 5a and the electrode 39, the plurality of wires 23 implanted in the rubber connector 63 (see FIG. 10)
Are electrically connected by The set CSP
5 is a CSP rotatably provided on the socket body 61.
The back of the CSP5, that is, the bump 5
A screening test or the like is performed in a state where the opposite surface of a is pressed and a force is applied.

When a plurality of CSPs 5 are tested and the rubber connector 63 becomes worn, when the latch mechanism of the claw portion 62b is released and the holder 62 is pulled up,
Since the holder 62 can be removed from the socket body 61, the worn rubber connector 63 is removed from the opening 61a of the socket body 61 in this state. And new rubber connector 6
3 is inserted again into the opening 61a, and then the holder 62 is attached to the socket body 61 again. Thus, the rubber connector 63 is replaced.

As described above, according to the semiconductor device test socket structure of the third embodiment, the socket is composed of the socket main body 61 and the holder 62 that can be detachably mounted on the socket main body. If you take it off
Since the rubber connector 63 becomes detachable, it is not necessary to bond the rubber connector 63 with an adhesive unlike the conventional one, and the problem caused by the adhesive can be solved.

When the holder 62 is removed from the socket body 61, the rubber connector 63 can be removed without removing the socket body 61 from the board 38. Therefore, once the socket body 61 and the board 38 are once positioned and fixed. The rubber connector 6 can be removed simply by removing the holder 62.
3 can be exchanged. Further, since the holder 62 is fixed to the socket body 61 by the latch mechanism of the claw portion 62b, the holder 62 can be removed from the socket body 61 only by releasing the latch mechanism. Therefore, according to the semiconductor device test socket structure according to the third embodiment, the replacement operation can be performed more easily and economically.

Furthermore, in the near future, the Japan Electronic Machinery Manufacturers Association (E
IAJ; Electronic Industries Association of Japa
Even if the dimensions of the CSP 5 are standardized according to n), if the number of the electrodes 39 on the substrate 38 is set according to the maximum number, the holder 62 and the outer diameter of the CSP 5 will be replaced. By simply preparing the rubber connector 63, all types of CSPs can be supported.

[0040]

As described in detail above, according to the socket structure for testing a semiconductor device of the present invention, it is not necessary to bond the rubber connector with an adhesive. Elimination work can be eliminated, and workability at the time of rubber connector replacement can be greatly improved. In addition, the flexibility of the rubber connector is not impaired, and the adhesive does not cover the contact surface. As a result, the reliability and reliability of the electrical connection can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a semiconductor device test socket structure according to the present invention.

FIG. 2 is a bottom view of the socket with the rubber connector temporarily fixed in the first embodiment.

FIG. 3 is a longitudinal sectional view of the first embodiment.

FIG. 4 is a bottom view of the socket showing a second embodiment of the semiconductor device test socket structure according to the present invention.

FIG. 5 is a longitudinal sectional view of a second embodiment.

FIG. 6 is an exploded perspective view illustrating a third embodiment of a semiconductor device test socket structure according to the present invention.

FIG. 7 is a longitudinal sectional view of a third embodiment.

FIG. 8 is an exploded perspective view of a conventional semiconductor device test socket structure.

FIG. 9 is a longitudinal sectional view of a conventional semiconductor device test socket structure in which the socket is fixed to a substrate.

FIG. 10 is an enlarged view of bumps and electrodes facing each other across a rubber connector.

[Explanation of symbols]

5 CSP (semiconductor device) 5a bump 17,
63 Rubber connector 31, 51 Socket 33 Opening 37 Positioning pin 38 Substrate 39 Electrode 41 Positioning hole 4
5 Adhesive tape 47 Earth electrode 53 Holding piece 61 Socket body 62 Holder

Claims (5)

[Claims] A socket having an opening for setting a semiconductor device to be inspected; a positioning pin protruding from the socket to fit into a positioning hole formed in the substrate; A plurality of electrodes facing the bumps on the lower surface of the semiconductor device set in the socket; and a plate-like rubber interposed between the socket and the substrate to electrically connect the facing bumps and the electrodes. A semiconductor device test socket structure comprising a connector, wherein the rubber connector is temporarily fixed to a lower surface of the socket with an adhesive tape. 2. The socket structure for testing a semiconductor device according to claim 1, wherein said positioning pin is detachably provided on said socket. 3. The socket structure for testing a semiconductor device according to claim 1, wherein an earth electrode contacting the rubber connector is provided on the substrate. 4. The socket for testing a semiconductor device according to claim 1, wherein a holding piece for holding a corner of the rubber connector formed in a square shape is provided on a lower surface of the socket instead of the adhesive tape. Construction. 5. A socket having an opening for setting a semiconductor device to be inspected, a positioning pin projecting from the socket and fitting into a positioning hole formed in the substrate, and formed on the substrate. A plurality of electrodes facing the bumps on the lower surface of the semiconductor device set in the socket; and a plate-like rubber interposed between the socket and the substrate to electrically connect the facing bumps and the electrodes. In a socket structure for testing a semiconductor device comprising a connector, the socket comprises a socket body into which the rubber connector is fitted, and a holder having the opening and being detachably formed with the socket body. When the holder is mounted on the socket body, the bumps on the lower surface of the semiconductor device set in the opening and the electrodes on the substrate are connected to the socket. A semiconductor connector test is characterized in that the rubber connector fitted into the socket body becomes detachable when the holder is detached from the socket body by connecting via a rubber connector fitted into the semiconductor device. Socket structure.