JPH08227769A - Ic socket - Google Patents

Ic socket

Info

Publication number
JPH08227769A
JPH08227769A JP3227195A JP3227195A JPH08227769A JP H08227769 A JPH08227769 A JP H08227769A JP 3227195 A JP3227195 A JP 3227195A JP 3227195 A JP3227195 A JP 3227195A JP H08227769 A JPH08227769 A JP H08227769A
Authority
JP
Japan
Prior art keywords
contact
mounting
ic
portion
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3227195A
Other languages
Japanese (ja)
Inventor
Hideyuki Kobayashi
英之 小林
Original Assignee
Toshiba Corp
Toshiba Microelectron Corp
東芝マイクロエレクトロニクス株式会社
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectron Corp, 東芝マイクロエレクトロニクス株式会社, 株式会社東芝 filed Critical Toshiba Corp
Priority to JP3227195A priority Critical patent/JPH08227769A/en
Publication of JPH08227769A publication Critical patent/JPH08227769A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To provide an IC socket easy to handle and easy to replace without requiring much labor or time for attachment and detachment.
CONSTITUTION: A contact pin 29 having a contact part 34 with the lead of an installed IC is provided on one side provided on a socket body 21, a lower side elastic deforming part 35 and a shortly protruded contact end part 37 to be connected to a mount base are provided on the other side, and the contact end part 37 is pressed onto a prescribed part of the mount base by the lower side elastic deforming part 36 at the mounting on the mount base. Therefore, since the possibility that the contact end part 37 protruded from the socket body 21 is bent in the midst of the handling of the IC socket is minimized, the contact end part 34 can be easily positioned to the prescribed position of the mount base only by mounting the socket body 21, the connection is also attained by energizing the contact end part 37 by the lower side elastic deforming part 36 to press it onto the prescribed position of the mount base, the attachment and detachment can be performed without requiring much labor or time.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、製造過程において集積回路(IC)の電気特性をチェックするIC試験装置等に用いられるICソケットに関する。 The present invention relates to relates to an IC socket used for IC testing device or the like to check the electrical characteristics of the integrated circuit (IC) in the manufacturing process.

【0002】 [0002]

【従来の技術】周知の通り、モールド工程を経てパッケージが形成され、外部リードが所定形状に成形されたI BACKGROUND ART As is well known, the package is formed through a molding process, I the external leads are formed into a predetermined shape
Cは、試験検査工程でIC試験装置等によって電気特性がチェックされて全製造過程を終了する。 C, the electric characteristics are checked by the IC tester or the like in the test inspection step with completed the entire manufacturing process.

【0003】このように製造過程でICの試験検査を行うIC試験装置では、ICソケットが被試験物であるI [0003] In the IC testing device for testing inspection IC in this way the manufacturing process, IC sockets are DUT I
Cを容易に着脱できるものであると共に、装着されたI Together in which C a readily detachable, loaded I
Cの外部リードにICソケットのコンタクトピンが確実に接触するものでなくてはならない。 Contact pins of the IC socket C external lead of must intended to ensure contact. 同時にICソケットは多数のICを連続してチェックするために優れた耐久性も要求される。 At the same time the IC socket is also required excellent durability to check continuously a number of the IC.

【0004】このような要求に対し、従来は次のようなICソケットが用いられていた。 [0004] For such a request, IC socket such as the following have been used in the prior art. 以下、図4乃至図6を参照してこれを説明する。 This will be described in with reference to FIGS. 図4は断面図であり、図5は上面図であり、図6はIC試験装置の基板に取り付けた状態を示す断面図である。 Figure 4 is a sectional view, FIG. 5 is a top view, FIG. 6 is a sectional view showing a state in which the attachment to the substrate of the IC tester.

【0005】図4乃至図6において、1はソケット本体であり、これは台座2とこの台座2の上方に図示しないスプリングに付勢された上下方向に進退可能な枠状の押え体3を備え、被試験物であるIC4を上部に装着し得るように構成されている。 [0005] In FIGS. 4 to 6, 1 is the socket body, which comprises a base 2 and a frame-shaped presser member 3 which can advance and retreat in the spring (not shown) above the base 2 to the energized vertically and it is configured so as to mount the IC4 is the DUT at the top. そしてソケット本体1には複数のコンタクトピン5が、装着するIC4の側面の外部リード6に対応して所定間隔を設けて2列に配列されている。 And in the socket body 1 has a plurality of contact pins 5 are arranged in two rows with a predetermined interval in response to the external lead 6 of the side surface of the IC4 mounting.

【0006】コンタクトピン5は中間部分に弾性変形部7が形成され、上方側にIC4の外部リード6に接触し電気的に導通する接触部8が形成されている。 [0006] the contact pins 5 are elastically deformable portion 7 is formed in the intermediate portion, the contact portion 8 which electrically conductive contact with the outer lead 6 of the upper side IC4 is formed. さらに上方側には押え体3の係合部位9に係合する係合片10が設けられており、押え体3を上下に進退させることで弾性変形部7が変形し、相対するように配列された接触部8がそれぞれ左右方向反対向きに進退するようになっている。 Further upward and the engagement piece 10 that engages the engagement portion 9 of the retainer body 3 is provided, the elastic deformation portion 7 deforms by advancing and retracting the presser member 3 up and down, arranged to relative contact portion 8 which is is adapted to advance and retreat in the left-right direction opposite respectively.

【0007】また、コンタクトピン5は下方側に、台座2の下面の取付面から延出する接続部であるリード11 Further, the leads 11 contact pins 5 on the lower side, a connecting portion extending from the mounting surface of the lower surface of the base 2
が形成されている。 There has been formed. リード11はソケット本体1を例えばIC試験装置の実装基板12に取り付ける際、実装基板12の貫通孔13に差し込み、パッド14に半田付けによって固定される。 Leads 11 when attached to the mounting board 12 of the socket body 1 for example, an IC test apparatus, inserted into the through-hole 13 of the mounting substrate 12 is fixed by soldering to the pads 14.

【0008】このように構成されているので、ソケット本体1をリード11を半田付けすることによって実装基板12に取り付けられる。 [0008] Since the thus configured is mounted to the mounting substrate 12 by soldering the lead 11 to the socket body 1. そして、装着対象であるIC Then, IC is mounted object
4を装着する場合には、先ずソケット本体1の押え体3 4 when the mounting, first pressing body 3 of the socket body 1
を下方向に押し下げ、コンタクトピン5の相対するように配列された接触部8間を広げる。 The depressed downward, spread between the contact portion 8 that is arranged so as to face the contact pins 5.

【0009】続いてIC4を広げられた接触部8の間の台座2上に載置する。 [0009] Subsequently placed on the base 2 between the contact portion 8 which is spread IC 4. その後、押え体3の下方向への押し下げを解除すると、スプリング及び弾性変形部7の付勢力で押え体3が上方に押し上げられ、同時に広げられていた接触部8が弾性変形部7により狭められてIC4 Thereafter, when releasing the depression of the downward pressing member 3, the pressing member 3 by the biasing force of the spring and the elastically deformable portion 7 is pushed upward, the contact portion 8 that has been widened at the same time is narrowed by the elastic deformation portion 7 Te IC4
の外部リード6に接触部8が圧接する。 Contact portion 8 is pressed against the outside leads 6.

【0010】しかしながら上記の従来技術においては、 [0010] However, in the above-mentioned prior art,
台座2の取付面から複数のコンタクトピン5のリード1 Read of the plurality of contact pins 5 from the mounting surface of the base 2 1
1が下方側に長く延出しており、実装基板12に取り付ける等するために取り扱っている際に延出しているリード11を曲げてしまう虞があった。 1 are out longer extends downward, there is a fear that the leads are bent 11 extends when you are working for such attachment to the mounting substrate 12. そのため取り扱い難く、リード11を曲げてしまうと、リード11と実装基板12に形成された貫通孔13のピッチとが合わず、差し込めなくなったりしてしまうものであった。 Therefore difficult to handle and would bend the lead 11, not match and the pitch of the through-hole 13 formed in the lead 11 and the mounting substrate 12 was achieved resulting in or no longer plugged.

【0011】また、ICソケットを実装基板12に取り付けるには、ソケット本体1から延出するリード11を貫通孔13に通しパッド14に半田付けする必要があるので、取り付けに時間を要し、また取り外す場合にもリード11を固定している半田付けを外さなければならず、手間が掛かり時間を要するもので簡単に交換ができるものではなかった。 [0011] To mount the IC socket to the mounting substrate 12, it is necessary to be soldered to pad 14 through a lead 11 extending from the socket body 1 in the through-hole 13, takes time to mounting, also also must remove the soldering that secures the lead 11 If you want to remove, did not time consuming it is what is easy to replace time-consuming. このため、IC4を数多く着脱する例えば製造過程に繰り込まれたIC試験装置等で使用する場合には、ICソケットの交換が迅速かつ容易に行えるものであることが強く望まれている。 Therefore, when used in an IC test apparatus renormalized in example manufacturing process for detaching a number of IC 4, which is highly desirable replacement of the IC socket is what allows quickly and easily.

【0012】 [0012]

【発明が解決しようとする課題】上記のように従来のものでは半田付けによって実装基板に取り付けを行うようにしているので、ソケット本体から延出する半田付けをするためのリードを変形させないよう注意して取り扱わなければならず扱い難く、またICソケットの取り付け取り外しには手間が掛かると共に時間を要するもので、 Because of conventional as described above [0008] are to perform the attachment to the mounting substrate by soldering, care not to deform the leads for soldering extending from the socket body difficult to handle must be handled, also the installation and removal of the IC socket in which takes time with time-consuming,
その交換は簡単に行えるものではない。 The exchange is not intended to be carried out easily. このような状況に鑑みて本発明はなされたもので、その目的とするところは、取り扱いが容易で、取り付け取り外しに手間や時間が掛からず、交換が簡単に行えるICソケットを提供することにある。 The present invention in view of such a situation has been made, and an object, is easy to handle, labor and time is not Kakekara the installation and removal, is to provide an IC socket in which replacement can be performed easily .

【0013】 [0013]

【課題を解決するための手段】本発明のICソケットは、実装基板に取り付けを行うソケット本体と、このソケット本体に設けられた装着ICのリードに対応して配列され且つ片方側に該ICのリードとの接触部を有し他方側に実装基板への接続部を有する複数のコンタクトピンとを備えたICソケットにおいて、コンタクトピンは他方側に弾性変形部とソケット本体から短く突出する接続部となる接触端部を有していると共に、接触端部が実装基板に取り付けを行う際に弾性変形部によって該実装基板の所定部位に圧接されるものであることを特徴とするものであり、さらに、コンタクトピンは、他方側に設けられた接触端部がソケット本体の取付面から突出していると共に該接触端部以外の部位が略々突出しないよう該ソケット本体内に IC socket of the present invention, in order to solve the problems] includes a socket body for performing mounting on a mounting substrate, of the IC in this are arranged corresponding to the mounting IC leads provided on the socket body and one side in the IC socket comprising a plurality of contact pins having a connection to the mounting board on the other side has a contact portion of the lead, the contact pins as the connection portion protruding short elastic deformation part and the socket body on the other side together have a contact end portion, the elastic deformation portion when the contact end carries a mounting to the mounting board is characterized in that it is intended to be pressed against the predetermined portion of the mounting board, further, contact pin in the socket body so as to contact end portion provided on the other side is not a site other than the contact end portion is substantially protruding with protruding from the mounting surface of the socket body められていることを特徴とするものである。 And it is characterized in that has been fit.

【0014】 [0014]

【作用】上記のように構成されたICソケットは、ソケット本体に設けられた片方側に装着ICのリードとの接触部を有するコンタクトピンが、他方側に弾性変形部と実装基板への接続部となる短く突出する接触端部を有し、この接触端部が実装基板に取り付けを行う際に弾性変形部によって実装基板の所定部位に圧接されているので、ICソケットを取り扱っている最中にソケット本体から突出する接触端部を曲げてしまう虞が少なく、また単にソケット本体の取り付けを行うだけで実装基板の所定部位と接触端部との位置合わせが行え、さらにその接続も弾性変形部によって接触端部が付勢され実装基板の所定部位に圧接することでなされるために手間や時間が掛からずに取り付けが行える。 [Action] configured IC socket as described above, the connection portion of the contact pin having a contact portion between the mounting IC leads on one side provided on the socket body, to a mounting board elastically deformable portion on the other side has a contact end projecting short becomes, because it is pressed against a predetermined portion of the mounting board by elastic deformation portion when installing this contact end is mounted board, in the middle of dealing with IC socket less feared that bend the contact end portion protruding from the socket body, also simply perform the positioning of the only contact end with a predetermined portion of the mounting substrate in performing the mounting of the socket body, further also the connection by the elastic deformation portion labor and time to contact end is made by pressing a predetermined portion of the mounting substrate is biased can be performed is mounted in less. そして、取り外しも半田付を伴わないためにソケット本体を実装基板から取り外すだけで実装基板の所定部位と接触端部との接続が外せ、手間や時間が掛からずに行える。 The removal also trouble releasing the connection between the predetermined portion and the contact end portion of only the mounting board detaching the socket body from the mounting substrate to without soldering, performed in less time and effort and time. その結果、ICソケットの交換が簡単かつ容易に行える。 As a result, replacement of the IC socket can be performed simply and easily.

【0015】 [0015]

【実施例】以下、本発明の一実施例を図1乃至図3を参照して説明する。 EXAMPLES Hereinafter, a description will be given of an embodiment of the present invention with reference to FIGS. 図1は断面図であり、図2は上面図であり、図3はIC試験装置の基板に取り付けた状態を示す断面図である。 Figure 1 is a sectional view, FIG. 2 is a top view, FIG. 3 is a sectional view showing a state in which the attachment to the substrate of the IC tester.

【0016】図1乃至図3において、21はソケット本体であり、これは第1及び第2の台座22,23と、これらの第1及び第2の台座22,23の上方に、図示しないスプリングに付勢された上下方向に進退可能な枠状の押え体24を備えて略直方体状に構成されている。 [0016] In FIGS. 1 to 3, 21 is a socket body, which is above the first and the second seat 22 and 23, these first and second pedestals 22 and 23, a spring (not shown) It is configured in a substantially rectangular parallelepiped shape provided with a frame-shaped pressing member 24 that can advance and retreat in the biased vertically. そして、直方体状のパッケージ25の側面から延出しJ形状に成形された複数の外部リード26を有する被試験物であるIC27を、押え体24の装着開口部24a内の第2の台座23の上部に装着し得るようになっている。 Then, the IC27 is the test object having a plurality of external leads 26 molded into the rolled out J shape from the side surface of the rectangular parallelepiped package 25, upper portion of the second base 23 of the mounting opening 24a of the pressing member 24 which is adapted to be attached to.

【0017】また第2の台座23には、断面がL字形状の揺動片28が揺動中心Zを中心に押え体24が上下に進退することで、押え体24に片端部が係合して揺動するように取り付けられている。 [0017] The second base 23 cross section that swinging piece 28 of the L-shaped pressing member 24 around the swing center Z is moved in the up and down, one end portion is engaged with the pressing member 24 It is attached so as to swing in.

【0018】さらにソケット本体21には複数のコンタクトピン29が、装着するIC27の外部リード26に対応して両長辺にそれぞれ沿って所定間隔で相対するように2列に配列され、第1の台座22と第2の台座23 Furthermore a plurality of contact pins 29 in the socket body 21 are arranged in two rows so as to face at predetermined intervals along on both long sides in correspondence with the external lead 26 of the IC27 for mounting, first pedestal 22 and the second pedestal 23
とに挟持されている。 It is sandwiched door. すなわち、コンタクトピン29は中間部に、第1の台座22の嵌合部30に嵌合する切欠き31が形成された固定部32を有し、この固定部32 That is, the contact pins 29 in the intermediate part has a fixed portion 32 cutout 31 which fits into the fitting portion 30 of the first seat 22 is formed, the fixing portion 32
は第1の台座22に第2の台座23を固定する際に嵌合部30に切欠き31が嵌合するようにして同時に固定される。 The cutout 31 in the fitting portion 30 is fixed at the same time so as to fit in securing the second base 23 to the first seat 22.

【0019】また、コンタクトピン29はその片端側である上方側にS字状に形成された上側弾性変形部33が形成され、その先端部にIC27の外部リード26に接触し電気的に導通する接触部34が形成されている。 Further, the contact pins 29 are upper elastically deformable portion 33 formed in an S-shape is formed on the upper side which is the one end side, in contact with electrically conductive to the external lead 26 of the IC27 at its distal end contact portion 34 is formed. さらに上側弾性変形部33の中間部には、揺動片28の他端部に係合する係合片35が設けられており、押え体2 More middle portion of the upper elastic deformation part 33 is provided with the engaging piece 35 which engages the other end of the swinging piece 28, the holding member 2
4を上下に進退させることで揺動片28が揺動し、係合片35が左右方向に移動して上側弾性変形部33が変形する。 4 the swinging piece 28 is swung by advancing and retracting vertically, an upper elastically deformable portion 33 is deformed engagement piece 35 is moved in the lateral direction. これにより、相対するように配列された2列の接触部34がそれぞれ左右方向反対向きに進退するようになっている。 Accordingly, the contact portions 34 of the two rows which are arranged so as to face is adapted to advance and retreat in the left-right direction opposite respectively.

【0020】一方、コンタクトピン29は他端側である下方側に下側弾性変形部36が、挟持されている第1の台座22の下面の取付面22aに沿うように形成されており、この下側弾性変形部36の小さくL状に折曲された先端には接触端部37が設けられている。 Meanwhile, the contact pins 29 the lower elastically deformable portion 36 on the lower side which is the other end side, is formed along the lower surface of the mounting surface 22a of the first seat 22 which is held, this the smaller is bent in an L-shaped distal end of the lower elastically deformable part 36 contact end 37 is provided. また接触端部37は、常時は第1の台座22の取付面22aから下方向に先端部分だけが短く突出したものとなっており、 The contact end 37 is normally serves as that only protrude a short tip portion downward from the mounting surface 22a of the first seat 22,
下側弾性変形部36を弾性変形させて接触端部37を取付面22aと面一もしくは取付面22aよりも内側に引っ込まれた状態にすると、この接触端部37には取付面22aから突出する方向に所定の力が付勢されるようになっている。 When the state of being retracted the contact end 37 of the lower elastically deformable portion 36 is elastically deformed inward than the mounting surface 22a flush with or mounting surface 22a, in this contact end 37 projecting from the mounting surface 22a predetermined force is adapted to be biased in the direction.

【0021】そしてICソケットを、例えばIC試験装置の実装基板38に取り付ける際には、ソケット本体2 [0021] Then an IC socket, for example, when attaching the mounting board 38 of the IC tester, the socket body 2
1の第1及び第2の台座22,23に形成された孔3 1 of the first and second holes 3 formed in the base 22, 23
9,40によって両台座を組み合わせて出来た貫通孔4 The through-hole 4, which can be a combination of both pedestal by 9,40
1と実装基板38の取付孔42とに固定ボルト43とナット44によって行われる。 Performed by the fixing bolts 43 and nuts 44 to 1 and the mounting hole 42 of the mounting substrate 38. この固定ボルト43とナット44による固定がなされたときに、ソケット本体21 When fixing by the fixing bolt 43 and the nut 44 is made, the socket body 21
の取付面22aが実装基板38に当接し、接触端部37 The mounting surface 22a is in contact with the mounting board 38 of the contact end 37
が実装基板38の表面に設けられた対応するパッド45 Corresponding pads 45 but provided on the surface of the mounting board 38
に、下側弾性変形部36の弾性変形により付勢されて圧接し、接触端部37とパッド45とが電気的に接続される。 A is urged in pressure contact by the elastic deformation of the lower elastically deformable portion 36, and a contact end 37 and the pad 45 are electrically connected. なお、実装基板38からのICソケットの取り外しは、固定ボルト43とナット44の固定状態を解除することにより行えるようになっている。 Incidentally, removal of the IC socket from the mounting board 38 is able to perform by releasing the fixed state of the fixing bolts 43 and nuts 44.

【0022】以上のように構成されているので、ソケット本体21の取付面22aからの接触端部37の突出寸法が短く、実装基板38への取り付け等のためにICソケットを取り扱う際にも接触端部37を曲げてしまう虞が少なく、取り扱いに格別の配慮を必要とせず取り扱いが容易である。 [0022] which is configured as described above, shorter projecting distance of the contact end 37 of the mounting surface 22a of the socket body 21, contact also when handling the IC socket for such attachment to the mounting substrate 38 less fear that by bending the ends 37, it is easy to handle without requiring special consideration in handling. また接触端部37が曲がってその位置がずれてしまう虞も少ないことから、ICソケットを固定ボルト43及びナット44により実装基板38に固定する際にも、実装基板38に設けられた対応する所定のパッド45に確実に接触させることができる。 Also since the risk is small that the contact end 37 resulting in its position displaced bent, corresponding predetermined been also provided on the mounting board 38 when fixed to the mounting board 38 of the IC socket by the fixing bolts 43 and nuts 44 it is possible to reliably contact with the pad 45.

【0023】また、実装基板38のパッド45との電気的な接続を行うのも半田付けが不要で、固定ボルト43 Further, also perform the electrical connection between the pads 45 of the mounting board 38 requires no soldering, fixing bolts 43
及びナット44によりICソケットを実装基板12に取り付け固定するだけで対応する接触端部37とパッド4 And the contact ends corresponding only to fix attaching the IC socket to the mounting substrate 12 by a nut 44 37 and the pad 4
5との接続が、取り付けに時間を要することなく簡単に行える。 Connecting and 5, easily performed without requiring the time for mounting. さらにICソケットを実装基板12から取り外すのも、固定ボルト43とナット44の固定状態を解除するだけでよく、簡単かつ速やかに行うことができる。 Even further remove the IC socket from the mounting board 12, it is only necessary to release the fixed state of the fixing bolt 43 and the nut 44 can be performed easily and quickly.

【0024】このためIC試験装置等で使用する場合、 [0024] When used in this order IC tester or the like,
ICソケットの交換が迅速かつ容易に行え、ICソケットに不具合が発生した時などのメンテナンス性も優れている。 Exchange of the IC socket is quick and easy to, failure to IC socket is superior maintainability, such as when that occurred. またコンタクトピン29は略全体がソケット本体21内に略収納され、接触端部37の先端部分が僅かにソケット本体21から突出するだけであるから、ICソケットに外部から加わる力が要因となってコンタクトピン29が変形し使用できなくなるのが低減される。 The whole substantially the contact pin 29 is substantially housed in the socket body 21, since the tip portions of the contact end 37 is only slightly protruding from the socket body 21, the force exerted from the outside to the IC socket is a factor the contact pins 29 can not be used to deform is reduced.

【0025】 [0025]

【発明の効果】以上の説明から明らかなように、本発明は、ソケット本体に設けられた片方側に装着ICのリードとの接触部を有するコンタクトピンが、他方側に弾性変形部と実装基板への接続部となる短く突出する接触端部を有し、この接触端部が実装基板に取り付けを行う際に弾性変形部によって実装基板の所定部位に圧接される構成としたことにより、取り扱いが容易で、取り付け取り外しに手間や時間が掛からず、交換が簡単に行える等の効果が得られる。 As apparent from the above description, the present invention is a mounting substrate contact pin having a contact portion between the mounting IC leads on one side provided on the socket body, the elastically deformable portion on the other side has a contact end projecting short a connection to, with the construction in the contact end portion which is pressed against a predetermined portion of the mounting board by elastic deformation part when installing the mounting board, to handle easy, labor and time is not Kakekara the installation and removal, the effect of such replacement can be performed easily is obtained.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例を示す断面図である。 1 is a sectional view showing an embodiment of the present invention.

【図2】本発明の一実施例の平面図である。 2 is a plan view of an embodiment of the present invention.

【図3】本発明の一実施例に係るIC試験装置の基板に取り付けた状態を示す断面図である。 3 is a sectional view showing a state in which the attachment to the substrate of the IC testing device according to an embodiment of the present invention.

【図4】従来例を示す断面図である。 4 is a sectional view showing a conventional example.

【図5】従来例の平面図である。 5 is a plan view of a conventional example.

【図6】従来例に係るIC試験装置の基板に取り付けた状態を示す断面図である。 6 is a sectional view showing a state in which the attachment to the substrate of the IC testing device according to a conventional example.

【符号の説明】 DESCRIPTION OF SYMBOLS

21…ソケット本体 22…第1の台座 22a…取付面 23…第2の台座 24…押え体 26…外部リード 27…IC 29…コンタクトピン 33…上側弾性変形部 34…接触部 36…下側弾性変形部 37…接触端部 38…実装基板 45…パッド 21 ... socket body 22 ... first seat 22a ... mounting surface 23 ... second seat 24 ... holding member 26 ... outer leads 27 ... IC 29 ... contact pins 33 ... upper elastically deformable portion 34 ... contact portion 36 ... lower elastic deformable portion 37 ... contact end 38 ... mounting board 45 ... pad

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 実装基板に取り付けを行うソケット本体と、このソケット本体に設けられた装着ICのリードに対応して配列され且つ片方側に該ICのリードとの接触部を有し他方側に前記実装基板への接続部を有する複数のコンタクトピンとを備えたICソケットにおいて、前記コンタクトピンは他方側に弾性変形部と前記ソケット本体から短く突出する前記接続部となる接触端部を有していると共に、前記接触端部が前記実装基板に取り付けを行う際に前記弾性変形部によって該実装基板の所定部位に圧接されるものであることを特徴とするICソケット。 And 1. A socket body for performing mounting to the mounting board, the other side has a contact portion between the arrayed to correspond to the mounting IC leads provided on the socket body and the IC leads on one side in the IC socket comprising a plurality of contact pins having a connection to the mounting board, the contact pin has a contact end to be the connecting portion projecting shortened from the socket body and the elastically deformable portion on the other side together are, IC socket, wherein the contact end portion is intended to be pressed against a predetermined portion of said mounting substrate by the elastic deformation portion when installing on the mounting substrate.
  2. 【請求項2】 コンタクトピンは、他方側に設けられた接触端部がソケット本体の取付面から突出していると共に該接触端部以外の部位が略々突出しないよう該ソケット本体内に納められていることを特徴とする請求項1記載のICソケット。 Wherein the contact pins, contact end portion provided on the other side is a site other than the contact end portion is disposed within the socket body so as not to substantially protrude with projecting from the mounting surface of the socket body IC socket according to claim 1, wherein the are.
JP3227195A 1995-02-21 1995-02-21 Ic socket Pending JPH08227769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3227195A JPH08227769A (en) 1995-02-21 1995-02-21 Ic socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3227195A JPH08227769A (en) 1995-02-21 1995-02-21 Ic socket

Publications (1)

Publication Number Publication Date
JPH08227769A true JPH08227769A (en) 1996-09-03

Family

ID=12354337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3227195A Pending JPH08227769A (en) 1995-02-21 1995-02-21 Ic socket

Country Status (1)

Country Link
JP (1) JPH08227769A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2573884A1 (en) * 2011-03-31 2013-03-27 Enplas Corporation Socket for electric component
US8833987B2 (en) 2005-09-14 2014-09-16 Donnelly Corporation Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US8884788B2 (en) 1998-04-08 2014-11-11 Donnelly Corporation Automotive communication system
US8908039B2 (en) 2000-03-02 2014-12-09 Donnelly Corporation Vehicular video mirror system
EP2611269A3 (en) * 2011-12-28 2015-04-15 Enplas Corporation Socket for electric parts
EP2611270A3 (en) * 2011-12-28 2015-04-15 Enplas Corporation Socket for electric parts
US9014966B2 (en) 2000-03-02 2015-04-21 Magna Electronics Inc. Driver assist system for vehicle
US9019091B2 (en) 1999-11-24 2015-04-28 Donnelly Corporation Interior rearview mirror system
US9019090B2 (en) 2000-03-02 2015-04-28 Magna Electronics Inc. Vision system for vehicle
US9073491B2 (en) 2002-09-20 2015-07-07 Donnelly Corporation Exterior rearview mirror assembly
US9090211B2 (en) 2002-09-20 2015-07-28 Donnelly Corporation Variable reflectance mirror reflective element for exterior mirror assembly
US9278654B2 (en) 1999-11-24 2016-03-08 Donnelly Corporation Interior rearview mirror system for vehicle
US9352623B2 (en) 2001-01-23 2016-05-31 Magna Electronics Inc. Trailer hitching aid system for vehicle
US9557584B2 (en) 2003-05-19 2017-01-31 Donnelly Corporation Rearview mirror assembly for vehicle
US10175477B2 (en) 2008-03-31 2019-01-08 Magna Mirrors Of America, Inc. Display system for vehicle

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9481306B2 (en) 1998-04-08 2016-11-01 Donnelly Corporation Automotive communication system
US8884788B2 (en) 1998-04-08 2014-11-11 Donnelly Corporation Automotive communication system
US9221399B2 (en) 1998-04-08 2015-12-29 Magna Mirrors Of America, Inc. Automotive communication system
US9278654B2 (en) 1999-11-24 2016-03-08 Donnelly Corporation Interior rearview mirror system for vehicle
US10144355B2 (en) 1999-11-24 2018-12-04 Donnelly Corporation Interior rearview mirror system for vehicle
US9019091B2 (en) 1999-11-24 2015-04-28 Donnelly Corporation Interior rearview mirror system
US9376061B2 (en) 1999-11-24 2016-06-28 Donnelly Corporation Accessory system of a vehicle
US10053013B2 (en) 2000-03-02 2018-08-21 Magna Electronics Inc. Vision system for vehicle
US9014966B2 (en) 2000-03-02 2015-04-21 Magna Electronics Inc. Driver assist system for vehicle
US10131280B2 (en) 2000-03-02 2018-11-20 Donnelly Corporation Vehicular video mirror system
US9019090B2 (en) 2000-03-02 2015-04-28 Magna Electronics Inc. Vision system for vehicle
US9809168B2 (en) 2000-03-02 2017-11-07 Magna Electronics Inc. Driver assist system for vehicle
US9783114B2 (en) 2000-03-02 2017-10-10 Donnelly Corporation Vehicular video mirror system
US8908039B2 (en) 2000-03-02 2014-12-09 Donnelly Corporation Vehicular video mirror system
US10179545B2 (en) 2000-03-02 2019-01-15 Magna Electronics Inc. Park-aid system for vehicle
US9315151B2 (en) 2000-03-02 2016-04-19 Magna Electronics Inc. Driver assist system for vehicle
US9809171B2 (en) 2000-03-02 2017-11-07 Magna Electronics Inc. Vision system for vehicle
US10239457B2 (en) 2000-03-02 2019-03-26 Magna Electronics Inc. Vehicular vision system
US9352623B2 (en) 2001-01-23 2016-05-31 Magna Electronics Inc. Trailer hitching aid system for vehicle
US9694749B2 (en) 2001-01-23 2017-07-04 Magna Electronics Inc. Trailer hitching aid system for vehicle
US9073491B2 (en) 2002-09-20 2015-07-07 Donnelly Corporation Exterior rearview mirror assembly
US9341914B2 (en) 2002-09-20 2016-05-17 Donnelly Corporation Variable reflectance mirror reflective element for exterior mirror assembly
US9545883B2 (en) 2002-09-20 2017-01-17 Donnelly Corporation Exterior rearview mirror assembly
US10029616B2 (en) 2002-09-20 2018-07-24 Donnelly Corporation Rearview mirror assembly for vehicle
US9878670B2 (en) 2002-09-20 2018-01-30 Donnelly Corporation Variable reflectance mirror reflective element for exterior mirror assembly
US9090211B2 (en) 2002-09-20 2015-07-28 Donnelly Corporation Variable reflectance mirror reflective element for exterior mirror assembly
US10166927B2 (en) 2003-05-19 2019-01-01 Donnelly Corporation Rearview mirror assembly for vehicle
US9783115B2 (en) 2003-05-19 2017-10-10 Donnelly Corporation Rearview mirror assembly for vehicle
US9557584B2 (en) 2003-05-19 2017-01-31 Donnelly Corporation Rearview mirror assembly for vehicle
US9758102B1 (en) 2005-09-14 2017-09-12 Magna Mirrors Of America, Inc. Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US9694753B2 (en) 2005-09-14 2017-07-04 Magna Mirrors Of America, Inc. Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US8833987B2 (en) 2005-09-14 2014-09-16 Donnelly Corporation Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US10150417B2 (en) 2005-09-14 2018-12-11 Magna Mirrors Of America, Inc. Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US9045091B2 (en) 2005-09-14 2015-06-02 Donnelly Corporation Mirror reflective element sub-assembly for exterior rearview mirror of a vehicle
US10175477B2 (en) 2008-03-31 2019-01-08 Magna Mirrors Of America, Inc. Display system for vehicle
EP2573884A4 (en) * 2011-03-31 2015-04-15 Enplas Corp Socket for electric component
EP2573884A1 (en) * 2011-03-31 2013-03-27 Enplas Corporation Socket for electric component
EP2611269A3 (en) * 2011-12-28 2015-04-15 Enplas Corporation Socket for electric parts
EP2611270A3 (en) * 2011-12-28 2015-04-15 Enplas Corporation Socket for electric parts

Similar Documents

Publication Publication Date Title
KR100295305B1 (en) Testing ic socket
US6007357A (en) Chip socket assembly and chip file assembly for semiconductor chips
US6160412A (en) Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US4536955A (en) Devices for and methods of mounting integrated circuit packages on a printed circuit board
US6407566B1 (en) Test module for multi-chip module simulation testing of integrated circuit packages
US20040166702A1 (en) Semiconductor device having external contact terminals and method for using the same
US4571542A (en) Method and unit for inspecting printed wiring boards
JP2746763B2 (en) Burn-in apparatus and burn methods of using the same
EP0310302A2 (en) Multipurpose socket
KR100423683B1 (en) Interconnect assembly for printed circuit boards and method of fabrication
US5705933A (en) Resuable carrier for burn-in/testing on non packaged die
US7637783B2 (en) Contact member having multiple contact parts and connector including same
US6336816B1 (en) Electrical circuit connector with support
US5033675A (en) Connector
US5569039A (en) Electrical connectors
EP1063727A2 (en) IC socket
US6033235A (en) Socket apparatus particularly adapted for BGA type semiconductor devices
EP0632545B1 (en) Apparatus for interconnecting electrical contacts
JPWO2004102207A1 (en) Electrical test probe
US6079987A (en) Connector for electronic parts
US5543725A (en) Reusable carrier for burn-in/testing on non packaged die
US5882221A (en) Socket for semiconductor devices
US5847572A (en) Partly replaceable device for testing a multi-contact integrated circuit chip package
KR20010074710A (en) Interconnect assembly for printed circuit boards and method of fabrication
JPH07263092A (en) Electrical assembly, and method to carry out electrical connection between electrical part and circuit board