JPH08227769A - Ic socket - Google Patents

Abstract

PURPOSE: To provide an IC socket easy to handle and easy to replace without requiring much labor or time for attachment and detachment. CONSTITUTION: A contact pin 29 having a contact part 34 with the lead of an installed IC is provided on one side provided on a socket body 21, a lower side elastic deforming part 35 and a shortly protruded contact end part 37 to be connected to a mount base are provided on the other side, and the contact end part 37 is pressed onto a prescribed part of the mount base by the lower side elastic deforming part 36 at the mounting on the mount base. Therefore, since the possibility that the contact end part 37 protruded from the socket body 21 is bent in the midst of the handling of the IC socket is minimized, the contact end part 34 can be easily positioned to the prescribed position of the mount base only by mounting the socket body 21, the connection is also attained by energizing the contact end part 37 by the lower side elastic deforming part 36 to press it onto the prescribed position of the mount base, the attachment and detachment can be performed without requiring much labor or time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used in an IC tester or the like for checking the electrical characteristics of an integrated circuit (IC) in the manufacturing process.

[0002]

As is well known, a package is formed through a molding process, and external leads are molded into a predetermined shape.
The electrical characteristics of C are checked by an IC tester or the like in the test inspection process, and the entire manufacturing process is completed.

In the IC testing apparatus for testing and inspecting ICs in the manufacturing process as described above, the IC socket is an object to be tested.
The C can be easily attached and detached, and the attached I
The contact pin of the IC socket must surely contact the external lead of C. At the same time, the IC socket is required to have excellent durability in order to continuously check a large number of ICs.

In response to such demands, the following IC sockets have been conventionally used. This will be described below with reference to FIGS. 4 to 6. 4 is a cross-sectional view, FIG. 5 is a top view, and FIG. 6 is a cross-sectional view showing a state where the IC test apparatus is attached to a substrate.

In FIGS. 4 to 6, reference numeral 1 denotes a socket body, which is provided with a base 2 and a frame-shaped pressing body 3 above the base 2 which can be advanced and retracted vertically by a spring (not shown). The IC4 as the DUT can be mounted on the upper part. The socket body 1 has a plurality of contact pins 5 arranged in two rows at predetermined intervals corresponding to the external leads 6 on the side surface of the IC 4 to be mounted.

The contact pin 5 has an elastically deforming portion 7 formed at an intermediate portion thereof, and a contact portion 8 which is in contact with the external lead 6 of the IC 4 and electrically conducts at the upper side thereof. Further, an engaging piece 10 that engages with the engaging portion 9 of the pressing body 3 is provided on the upper side, and the elastic deformation portion 7 is deformed by moving the pressing body 3 up and down, and the elastic deformation portions 7 are arranged so as to face each other. The contact portions 8 are moved back and forth in opposite lateral directions.

The contact pin 5 is a lead 11 which is a connecting portion extending downward from the mounting surface of the lower surface of the pedestal 2.
Are formed. The lead 11 is inserted into the through hole 13 of the mounting substrate 12 and fixed to the pad 14 by soldering when the socket body 1 is attached to the mounting substrate 12 of the IC test apparatus, for example.

With this structure, the socket body 1 is attached to the mounting substrate 12 by soldering the leads 11. And the IC to be mounted
When attaching 4, the pressing body 3 of the socket body 1
Is pushed down to widen the space between the contact portions 8 of the contact pins 5 arranged so as to face each other.

Subsequently, the IC 4 is placed on the pedestal 2 between the expanded contact portions 8. After that, when the downward pressing of the presser body 3 is released, the presser body 3 is pushed upward by the spring and the urging force of the elastically deformable portion 7, and at the same time the contact portion 8 that has been widened is narrowed by the elastically deformable portion 7. IC4
The contact portion 8 comes into pressure contact with the outer lead 6 of.

However, in the above prior art,
Leads 1 of a plurality of contact pins 5 from the mounting surface of the pedestal 2
1 extends to the lower side for a long time, and there is a fear that the lead 11 extending during the handling for attaching to the mounting substrate 12 may be bent. Therefore, it is difficult to handle, and when the lead 11 is bent, the lead 11 and the pitch of the through holes 13 formed in the mounting substrate 12 do not match, and the lead 11 cannot be inserted.

Further, in order to attach the IC socket to the mounting board 12, it is necessary to pass the lead 11 extending from the socket body 1 through the through hole 13 and solder it to the pad 14. Even when detaching, the soldering fixing the lead 11 must be removed, which is troublesome and time consuming, and cannot be easily replaced. For this reason, when a large number of ICs 4 are attached and detached, for example, when used in an IC tester or the like that has been put into the manufacturing process, it is strongly desired that the IC socket can be replaced quickly and easily.

[0012]

As described above, since the conventional one is mounted on the mounting board by soldering, be careful not to deform the leads for soldering extending from the socket body. It is difficult to handle because it is difficult to handle, and it takes time and effort to attach and remove the IC socket,
The exchange is not easy. The present invention has been made in view of such circumstances, and an object of the present invention is to provide an IC socket that is easy to handle, does not require labor and time for attachment and detachment, and can be easily replaced. .

[0013]

An IC socket according to the present invention is arranged so as to correspond to a socket body for mounting on a mounting board and a lead of a mounted IC provided on the socket body, and the IC body is provided on one side of the socket body. In an IC socket having a plurality of contact pins having a contact portion with a lead and a connecting portion to a mounting substrate on the other side, the contact pin serves as an elastically deforming portion and a connecting portion protruding short from the socket body on the other side. It is characterized in that it has a contact end portion, and the contact end portion is pressed against a predetermined portion of the mounting board by an elastically deformable portion when it is attached to the mounting board. The contact pin has a contact end portion provided on the other side protruding from the mounting surface of the socket body, and the contact pin is provided inside the socket body so that the portions other than the contact end portion do not substantially project. And it is characterized in that has been fit.

[0014]

In the IC socket constructed as described above, the contact pin having the contact portion with the lead of the mounted IC is provided on one side provided on the socket body, and the elastic deformation portion and the connection portion to the mounting board are provided on the other side. Has a short protruding contact end portion, and this contact end portion is pressed against a predetermined portion of the mounting board by the elastically deforming portion when mounting on the mounting board. There is little risk of bending the contact end protruding from the socket body, and by simply attaching the socket body, the predetermined part of the mounting board and the contact end can be aligned, and the connection is also made by the elastic deformation part. Since the contact end portion is biased and pressed against a predetermined portion of the mounting substrate, the mounting can be performed without trouble and time. Further, since the removal is not accompanied by soldering, it is possible to disconnect the predetermined portion of the mounting board and the contact end portion by simply removing the socket body from the mounting board, which can be done without trouble and time. As a result, the IC socket can be replaced easily and easily.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 is a cross-sectional view, FIG. 2 is a top view, and FIG. 3 is a cross-sectional view showing a state where the IC test apparatus is attached to a substrate.

In FIGS. 1 to 3, reference numeral 21 denotes a socket body, which is composed of first and second pedestals 22 and 23, and a spring (not shown) above the first and second pedestals 22 and 23. It is provided with a frame-shaped pressing body 24 that can be moved back and forth in the vertical direction and is configured to have a substantially rectangular parallelepiped shape. Then, the IC 27, which is a DUT having a plurality of external leads 26 formed in a J shape and extending from the side surface of the rectangular parallelepiped package 25, is attached to the upper portion of the second pedestal 23 in the mounting opening 24 a of the pressing body 24. It can be attached to.

On the second pedestal 23, a swinging piece 28 having an L-shaped cross section moves up and down around the swing center Z, so that one end of the pusher 24 is engaged. It is attached so as to swing.

Further, in the socket body 21, a plurality of contact pins 29 are arranged in two rows corresponding to the external leads 26 of the IC 27 to be mounted so as to face each other at predetermined intervals along both long sides, Pedestal 22 and second pedestal 23
It is sandwiched between and. That is, the contact pin 29 has a fixing portion 32 having a notch 31 that fits in the fitting portion 30 of the first pedestal 22 in the middle portion.
When the second pedestal 23 is fixed to the first pedestal 22, the notch 31 fits into the fitting portion 30 and is fixed at the same time.

Further, the contact pin 29 has an upper elastic deforming portion 33 formed in an S shape on the upper side which is one end side thereof, and the tip end thereof is brought into contact with the external lead 26 of the IC 27 to be electrically conducted. The contact portion 34 is formed. Further, an engaging piece 35 that engages with the other end of the swinging piece 28 is provided in the middle portion of the upper elastically deforming portion 33, and the pressing body 2 is provided.
By moving 4 up and down, the rocking piece 28 rocks, the engaging piece 35 moves in the left-right direction, and the upper elastic deformation portion 33 deforms. As a result, the two rows of contact portions 34 arranged so as to face each other advance and retreat in opposite lateral directions.

On the other hand, the contact pin 29 has a lower elastic deformation portion 36 formed on the lower side which is the other end side so as to extend along the attachment surface 22a of the lower surface of the first pedestal 22 which is clamped. A contact end portion 37 is provided at the tip of the lower elastically deformable portion 36 that is bent in a small L shape. Further, the contact end portion 37 is always one in which only the front end portion is shortly projected downward from the mounting surface 22a of the first pedestal 22,
When the lower elastically deformable portion 36 is elastically deformed to bring the contact end 37 flush with the mounting surface 22a or retracted inward of the mounting surface 22a, the contact end 37 projects from the mounting surface 22a. A predetermined force is applied in the direction.

When the IC socket is attached to the mounting board 38 of the IC tester, for example, the socket body 2
Hole 3 formed in the first and second pedestals 22 and 23
Through hole 4 made by combining both pedestals with 9, 40
1 and the mounting hole 42 of the mounting substrate 38 by fixing bolts 43 and nuts 44. When the fixing bolts 43 and the nuts 44 are fixed, the socket body 21
The mounting surface 22a of the abutting contact the mounting substrate 38, and the contact end 37
Is a corresponding pad 45 provided on the surface of the mounting substrate 38.
Then, the lower elastically deformable portion 36 is elastically deformed to be pressed into contact therewith, so that the contact end portion 37 and the pad 45 are electrically connected. The IC socket can be removed from the mounting board 38 by releasing the fixing state of the fixing bolt 43 and the nut 44.

With the above structure, the contact end portion 37 of the socket body 21 has a short projecting dimension from the mounting surface 22a, so that it can be contacted when handling the IC socket for mounting on the mounting substrate 38 or the like. There is little risk of bending the end portion 37, and no special consideration is required for handling, and handling is easy. Further, since there is little possibility that the contact end portion 37 is bent and its position is displaced, when the IC socket is fixed to the mounting board 38 by the fixing bolts 43 and the nuts 44, the corresponding predetermined positions provided on the mounting board 38 are fixed. The pad 45 can be surely contacted.

Moreover, soldering is not required to electrically connect to the pad 45 of the mounting substrate 38, and the fixing bolt 43 is used.
The corresponding contact end portion 37 and pad 4 can be obtained by simply attaching and fixing the IC socket to the mounting substrate 12 with the nut 44.
The connection with the 5 can be easily made without requiring time for installation. Further, the IC socket can be removed from the mounting substrate 12 simply by releasing the fixed state of the fixing bolt 43 and the nut 44, which can be easily and quickly performed.

Therefore, when it is used in an IC tester, etc.,
The IC socket can be replaced quickly and easily, and the maintainability is excellent when a failure occurs in the IC socket. Further, since the contact pin 29 is substantially entirely housed in the socket body 21 and the tip end portion of the contact end portion 37 only slightly projects from the socket body 21, the force applied from the outside to the IC socket becomes a factor. It is reduced that the contact pin 29 is deformed and cannot be used.

[0025]

As is apparent from the above description, according to the present invention, the contact pin having the contact portion with the lead of the mounted IC is provided on one side of the socket body, and the elastic deformation portion and the mounting board are provided on the other side. It has a short projecting contact end that becomes a connection part to the mounting board, and this contact end is pressed against a predetermined part of the mounting board by the elastically deforming part when the mounting board is mounted, so that the handling is easy. The advantages are that it is easy, it does not take time and effort to attach and detach, and it can be easily replaced.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view of one embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state in which the IC test apparatus according to the embodiment of the present invention is attached to a substrate.

FIG. 4 is a cross-sectional view showing a conventional example.

FIG. 5 is a plan view of a conventional example.

FIG. 6 is a cross-sectional view showing a state in which the IC test apparatus according to the conventional example is attached to a substrate.

[Explanation of symbols]

 21 ... Socket main body 22 ... First pedestal 22a ... Mounting surface 23 ... Second pedestal 24 ... Presser body 26 ... External lead 27 ... IC 29 ... Contact pin 33 ... Upper elastic deformation part 34 ... Contact part 36 ... Lower elasticity Deformation part 37 ... Contact end part 38 ... Mounting board 45 ... Pad

Claims (2)

[Claims] 1. A socket body to be mounted on a mounting board, and a socket body arranged in correspondence with the leads of a mounting IC provided on the socket body, and having a contact portion with the lead of the IC on one side and the other side. In an IC socket provided with a plurality of contact pins having a connecting portion to the mounting board, the contact pin has an elastically deforming portion on the other side and a contact end portion to be the connecting portion protruding from the socket body for a short time. In addition, the IC socket is characterized in that the contact end portion is pressed against a predetermined portion of the mounting board by the elastically deformable portion when the mounting end is mounted on the mounting board. 2. The contact pin is housed in the socket body such that a contact end portion provided on the other side projects from the mounting surface of the socket body and a portion other than the contact end portion does not substantially project. The IC socket according to claim 1, wherein: