CN117214484B - Chip test socket - Google Patents
Chip test socket Download PDFInfo
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- CN117214484B CN117214484B CN202311484353.9A CN202311484353A CN117214484B CN 117214484 B CN117214484 B CN 117214484B CN 202311484353 A CN202311484353 A CN 202311484353A CN 117214484 B CN117214484 B CN 117214484B
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- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 239000000523 sample Substances 0.000 claims abstract description 97
- 230000000670 limiting effect Effects 0.000 claims abstract description 82
- 238000009423 ventilation Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Abstract
The invention relates to the technical field of semiconductor testing, in particular to a chip testing socket. The invention provides a chip test socket which at least comprises a probe, a socket body and a chip to be tested, wherein the socket body at least comprises a socket main body and a limiting guide plate; the upper surface of the socket main body is provided with a first groove; a probe hole is formed in the first groove; a second groove is formed in the front surface of the limit guide plate; a limiting guide hole is formed in the second groove; the spacing guiding hole is the ladder structure, and the probe is placed in socket body and spacing deflector through probe hole and spacing guiding hole, and the chip that awaits measuring is placed in the second recess of spacing deflector, through spacing guiding hole and probe contact. The invention can simplify the structure, simplify the assembly process, reduce the cost, better ensure the contact between the chip to be tested and the printed circuit board, and ensure the accuracy and stability of the test.
Description
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a stable chip testing socket.
Background
The function test of the chip is an indispensable important step in the research and development of the chip and the production, and the test socket of the chip is an important tool for the function test, and the function of the test socket is to establish electronic signal and current transmission between a solder ball on the chip and a PCB circuit board through a connection conductor probe after the chip is fixed at a specific position, thereby achieving the purpose of chip test.
For larger chips, the number of solder balls is typically more than 100, and thus the size of the test socket is correspondingly increased. In actual testing, when the test socket is fixed on the PCB, the bottom of the probe is pre-pressed for a part of distance, and the greater the pressure is, the better the contact effect of the chip, the probe and the PCB circuit is, so that the greater the bottom pre-pressing is, the higher the stability of the test is.
The existing test socket has the defects that the flatness of the top probe is poor due to the fact that the force generated by the larger number of the probes is larger, and the contact between the chip and the PCB through the probes is unstable. In addition, the existing test socket is complex in structure and high in precision requirement, so that the cost is relatively high.
The Chinese patent No. 116381459A proposes a safe floating PGA chip test socket, which comprises a probe, a PGA chip to be tested, a base plate, a socket, a through slot, a floating plate, a spring, a plurality of chip pin through holes, a plurality of socket body probe through holes, a plurality of base plate probe through holes and the like. However, the technical scheme has the advantages of complex structure, high cost, difficult assembly, low structural stability and unstable probe contact.
Accordingly, there is a need for an improved chip test socket that increases its performance and reduces its cost.
Disclosure of Invention
The invention aims to provide a chip test socket which solves the problems of complex structure and poor stability of the chip test socket in the prior art.
In order to achieve the above object, the present invention provides a chip test socket, which at least includes a probe, a socket body and a chip to be tested, wherein the socket body at least includes a socket main body and a limit guide plate;
the upper surface of the socket main body is provided with a first groove;
a probe hole is formed in the first groove;
a second groove is formed in the front surface of the limit guide plate;
a limiting guide hole is formed in the second groove;
the probe hole, the limit guide hole and the tin ball of the chip to be tested correspond;
the limiting guide hole is of a stepped structure and comprises a guide hole and a limiting hole which are communicated with each other, the guide hole is positioned at the upper part of the limiting hole and used for guiding a chip to be tested, and the limiting hole is used for limiting the probe to be separated from the structure from the upper part;
the probe is placed in the socket body and the limiting guide plate through the probe hole and the limiting guide hole, and the chip to be tested is placed in the second groove of the limiting guide plate and contacted with the probe through the limiting guide hole.
In an embodiment, the inner dimension of the first groove of the socket main body is matched with the outer envelope dimension of the limit guide plate;
the limit guide plate is installed in the first groove.
In one embodiment, a plurality of first positioning pin holes are formed in the first groove;
the back surface of the limit guide plate is provided with a plurality of second positioning pin holes;
the first locating pin hole corresponds with the position of the second locating pin hole, one end of the locating pin is inserted into the first locating pin hole, the other end of the locating pin is inserted into the second locating pin hole, and the relative position of the socket main body and the limiting guide plate is located.
In one embodiment, a plurality of first spring limiting holes are formed in the first groove;
the back surface of the limiting guide plate is provided with a plurality of second spring limiting holes;
the first spring limiting hole corresponds to the second spring limiting hole in position, one end of the spring is installed in the first spring limiting hole, and the other end of the spring is installed in the second spring limiting hole to provide spring supporting force.
In one embodiment, the upper surface of the socket main body is provided with a plurality of countersunk grooves;
the countersunk head bolt penetrates through the countersunk head groove to be matched and assembled with the fastening nut, and the socket main body is fixedly installed on the printed circuit board.
In one embodiment, the countersunk grooves are provided in corners of the upper surface of the socket body.
In one embodiment, a plurality of limit screw grooves are formed in the upper surface of the socket main body;
the front surface of the limit guide plate is provided with a plurality of screw limit grooves;
the position of the screw limit groove corresponds to the position of the limit screw groove;
the limit screw passes through the screw limit groove and the limit screw groove, and the limit guide plate and the socket main body are installed and fixed.
In one embodiment, the limit screw grooves are arranged on two opposite sides of the upper surface of the socket main body;
each side is provided with 2 limit screw grooves;
the screw limit groove is formed in the front surface of the limit guide plate.
In an embodiment, the diameter of the guide hole is larger than the diameter of the limit hole.
In an embodiment, the probe hole has a stepped structure, and the diameter of the tail end of the probe hole is smaller than the diameter of the probe hole main body.
In an embodiment, the socket body and the limit guide plate have a polygonal structure.
In an embodiment, a side groove is formed at the periphery of the second groove, so as to provide an operation space for taking out or placing the chip to be tested.
The invention provides a stable chip test socket, which effectively solves the problems that in the prior art, the probe flatness is low due to the fact that the bottom of a probe is pre-pressed and the top limiting plate of the probe is too thin, and the chip and the probe cannot be contacted simultaneously, so that the stability of a test result is affected. The test socket can simplify the structure, simplify the assembly process, reduce the cost, better ensure the contact between the chip and the PCB circuit board, and ensure the accuracy and stability of the test.
Drawings
The above and other features, properties and advantages of the present invention will become more apparent from the following description of embodiments taken in conjunction with the accompanying drawings in which like reference characters designate like features throughout the drawings, and in which:
FIG. 1 is a schematic diagram showing the overall structure of a chip test socket according to an embodiment of the invention;
FIG. 2a illustrates a schematic front view of a spacing guide plate according to an embodiment of the present invention;
FIG. 2b illustrates a schematic back view of a spacing guide plate according to an embodiment of the present invention;
FIG. 3 discloses a cross-sectional view of a structure in a test state according to an embodiment of the present invention;
FIG. 4 discloses a structural cross-sectional view of a spacing guide plate according to an embodiment of the present invention;
FIG. 5 discloses a structural cross-sectional view of a prior art chip test socket;
fig. 6 discloses a partial schematic view of a chip test socket according to an embodiment of the invention.
The meaning of the reference numerals in the figures is as follows:
1, a chip to be tested;
2, a limit screw;
3, a screw limit groove;
4, limiting the guide holes;
41 guide holes;
42 limit holes;
5, limiting the guide plate;
6, a spring;
7, positioning pins;
8, a probe;
9, ventilation through holes;
10a first locating pin holes;
10b second registration pin holes;
11a first spring limiting hole;
11b second spring limit holes;
12 limit screw grooves;
13 countersunk head bolts;
14, fastening a nut;
15 countersunk grooves;
16 probe holes;
17 a socket body;
18 a first groove;
19 a second groove.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that, the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the illustrations, not according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Fig. 1 discloses a schematic overall structure of a chip test socket according to an embodiment of the present invention, and as shown in fig. 1, the present invention provides a stable chip test socket, which at least includes a probe 8, a socket body and a chip 1 to be tested;
the socket body at least comprises a socket main body 17 and a limit guide plate 5.
The upper surface of the socket body 17 is provided with a first groove 18;
a probe hole 16 is formed in the first groove 18;
a second groove 19 is formed in the front surface of the limit guide plate 5;
a limiting guide hole 4 is formed in the second groove 19;
the probe holes 16 and the limit guide holes 4 correspond to solder balls of the chip 1 to be tested;
the limiting guide hole 4 is of a stepped structure and comprises a guide hole and a limiting hole which are communicated with each other, the guide hole is positioned at the upper part of the limiting hole and is used for guiding the chip 1 to be tested, and the limiting hole is used for limiting the probe 8 to be separated from the structure from the upper part;
wherein, probe 8 is placed in socket main part 17 and spacing deflector 5 through probe hole 16 and spacing guiding hole 4, and chip 1 that awaits measuring is placed in spacing deflector 5's second recess 19, contacts with probe 8 through spacing guiding hole 4.
The socket main body 17 and the limit guide 5 have a polygonal structure, more specifically, a quadrangular structure.
As shown in fig. 1, the inner dimension of the first groove 18 of the socket body 17 is matched with the outer envelope dimension of the limit guide plate 5;
the limit guide plate 5 is arranged in the first groove 18.
In the present embodiment, the limit guide 5 is divided into a front face and a rear face. The back surface of the limit guide plate 5 is a lower surface, and is opposite to the upper surface of the socket main body 17.
Fig. 2a shows a schematic front view of a limit guide plate according to an embodiment of the present invention, as shown in fig. 1 and 2a, the upper surface of the socket body 17 is provided with a plurality of limit screw grooves 12;
the front surface of the limit guide plate 5 is provided with a plurality of screw limit grooves 3;
the position of the screw limit groove 3 corresponds to the position of the limit screw groove 12;
the limit screw 2 passes through the screw limit groove 3 and the limit screw groove 12 to fix and install the limit guide plate 5 and the socket main body 17.
Further, the limit screw grooves 12 are formed on two opposite sides of the upper surface of the socket body 17, and 2 limit screw grooves 12 are formed on each side.
The screw limiting grooves 3 are arranged on two opposite side edges of the front surface of the limiting guide plate, and the specific positions of the screw limiting grooves correspond to the positions of the limiting screw grooves 12.
As shown in fig. 1 and 2a, the second groove 19 is provided with side grooves on four sides, and these side grooves are used for providing an operation space for taking out or placing the chip to be tested.
Fig. 2b shows a schematic back view of the limiting guide plate according to an embodiment of the present invention, as shown in fig. 1 and 2b, a plurality of first positioning pin holes 10a are formed in the first groove 18;
the back surface of the limit guide plate 5 is provided with a plurality of second positioning pin holes 10b;
the first positioning pin hole 10a corresponds to the position of the second positioning pin hole 10b, one end of the positioning pin 7 is inserted into the first positioning pin hole 10a, the other end of the positioning pin 7 is inserted into the second positioning pin hole 10b, and the relative position of the socket main body 17 and the limit guide plate 5 is positioned.
Further, the number of the first positioning pin holes 10a is 2, and is disposed at the diagonal position of the first groove 18. The number and positions of the second positioning pin holes 10b correspond to those of the first positioning pin holes 10 a.
Further, the second positioning pin hole 10b is a through hole structure.
As shown in fig. 1 and 2b, a plurality of first spring limiting holes 11a are formed in the first groove 18;
the back surface of the limit guide plate 5 is provided with a plurality of second spring limit holes 11b;
the first spring limiting hole 11a corresponds to the second spring limiting hole 11b in position, one end of the spring 6 is installed in the first spring limiting hole, and the other end of the spring 6 is installed in the second spring limiting hole to provide spring supporting force.
Further, the number of the second spring limiting holes 11b is 4, and the second spring limiting holes are arranged at the 4 corner positions of the limiting guide plate 5. The number and positions of the first spring limit holes 11a correspond to those of the second spring limit holes 11 b.
As shown in fig. 1, the upper surface of the socket body 17 is provided with a plurality of countersunk grooves 15;
the countersunk head bolts 13 pass through countersunk head grooves 15 and are matched and assembled with the fastening nuts 14, so that the socket main body 17 is fixedly arranged on the printed circuit board.
Further, the number of the countersunk grooves 15 is 4, and the countersunk grooves are arranged at 4 corner positions on the upper surface of the socket main body 17.
As shown in fig. 1, a ventilation through hole 9 is formed in the first groove.
The probe 8 comprises three parts of a needle cylinder, a needle point and a needle tail, and the diameters of the needle point and the needle tail are smaller than that of the needle cylinder.
Probes can be customized according to user requirements and are of various specifications. In this example, the probe specifications involved were as follows: the radius of the needle tip is 0.25mm, the radius of the needle cylinder is 0.58mm, the radius of the needle tail is 0.25mm, the length of the needle tip is 0.45mm, the length of the needle cylinder is 3.05mm, and the length of the needle tail is 1mm.
The examples given herein are by way of reference only, and in actual design, the length of the tip and tail may be adjusted as desired, either the same or different.
Furthermore, the probe hole 16 has a stepped structure, the diameter of the tail end of the probe hole is smaller than that of the main body of the probe hole, the tail end of the probe hole is matched with the needle tail of the probe 8, the main body of the probe hole is matched with the needle cylinder of the probe 8, and therefore the probe hole 16 is matched with the needle tail and the needle cylinder of the probe 8 to achieve limit.
The stable chip test socket provided by the invention takes the socket main body 17 as a fixing piece, the front surface of the socket main body 17 is upwards placed, the probe 8 is placed from the upper part through the probe hole 16, the positioning pin 7 and the spring 6 are installed, the limit guide plate 5 is placed, the limit guide plate 5 is pressed down, the limit screw 2 is installed, and finally, the whole chip test socket is assembled on the PCB through the countersunk bolt 13, so that the assembly test is completed. The chip test socket is simple in structure and convenient to operate, chip test can be effectively performed, and stability and accuracy of the test are guaranteed.
Fig. 3 is a structural cross-sectional view of a test state according to an embodiment of the present invention, and the following describes a mounting process and an operating principle of a novel chip test socket according to the present invention with reference to fig. 1 to 3:
the socket body 17 is fixedly installed with the center.
The socket main body 17 faces upwards, the probe 8 is placed into the probe hole 16 from above, and the positioning pin 7 and the spring 6 are installed, so that the installation of the fittings in the first groove is completed.
Then, the limit guide plate 5 and the locating pin 7 are arranged in an aligned mode, the limit screw 2 is arranged in a pressing mode, and the limit screw 2 controls the maximum pressing stroke of the limit guide plate 5.
The specific setting needs to be regulated by the relevant technician.
After the installation is finished, the needle head of the probe 8 is ensured to be positioned in the limit guide hole 4 so as to ensure the contact stability of the probe 8 and the solder ball, thereby ensuring the accuracy of the test result.
The whole structure is fixedly arranged on a Printed Circuit Board (PCB) through countersunk bolts 13, and then the chip 1 to be tested is placed.
Fig. 4 shows a structural cross-sectional view of a limit guide plate according to an embodiment of the present invention, as shown in fig. 4, the limit guide hole 4 has a stepped structure, and includes a guide hole 41 and a limit hole 42 which are communicated with each other, and the diameter of the guide hole 41 is larger than that of the limit hole 42;
the diameter of the limiting hole 42 is generally between the diameter of the needle cylinder and the diameter of the needle tip of the probe 8, so that the limiting hole 42 plays a limiting role on the probe 8, plays a key role in preventing the probe 8 from being separated from the structure, and ensures that the probe 8 cannot be separated from the upper side.
In this embodiment, syringe placement within the cradle is limited by syringe length and radius. The radius of the needle tip to the needle tail is 0.25mm, while the limiting aperture 42 in the hub is designed to be greater than 0.25mm and less than 0.58mm of the barrel radius. Because the radius of the needle cylinder is large, the needle cylinder cannot pass through the limiting hole 42 smaller than the needle cylinder, so that the limiting effect is achieved.
The guide holes 41 play a role in guiding the chip 1 to be tested, so that the chip 1 to be tested can be stably positioned in the limit guide holes 4 and kept in contact with the probes 8.
The following describes in detail the technical effects of the chip test socket according to the present invention, with reference to fig. 5 and 6, compared with the prior art.
Fig. 5 shows a cross-sectional view of a prior art chip test socket, and as shown in fig. 5, the prior art CN116381459a shows a chip test socket structure, which comprises three main structures from top to bottom: chip deflector, socket main part and socket bottom plate.
The main function of the chip guide plate is to protect the chip and provide guide function for the chip at the same time, so as to ensure that the chip is accurately inserted into the socket.
The function of the hub body is that the hub upper surface limits the needle cannula from falling out of the structure above the hub, i.e., the thin wall pointed by the upward arrow.
The function of the socket bottom plate is that the socket bottom plate restricts the needle tube from being separated from the structure from the lower part of the structure, namely, the down arrow points to the thin wall.
The existing chip test socket needs to invert the socket main body when the existing chip test socket is installed, then a probe is inserted from bottom to top from the bottom plate, the socket bottom plate is covered, then the socket main body is reversed again, and the chip guide plate is installed, so that the whole installation process is completed.
As shown in fig. 1 to 4, the chip test socket provided by the present invention is mainly divided into two structures from top to bottom: limit guide plate 5 and socket body 17.
The lower surface of the socket body 17 restricts the detachment of the probe 8 from underneath the socket, as indicated by the thin wall pointed by the arrow in fig. 3.
The limit guide plate 5 has the function of protecting the chip and guiding the chip to be inserted, and the limit guide hole 4 on the lower surface of the limit guide plate 5 limits the probe 8 to be separated from the upper part.
Compared with the prior art, the chip test socket provided by the invention is installed through the following steps: firstly, the socket main body 17 is arranged in the normal direction, then the probe 8 is installed, and finally, the limit guide plate 5 is installed, so that the installation can be completed.
The chip test socket provided by the invention has the advantages of simple structure, successful cost reduction, convenience in installation and more effective improvement of assembly efficiency. Compared with the inverted assembly mode in the prior art, the socket can be assembled in a positive mode, and greater convenience is brought to operation.
As shown in fig. 5, the up arrow points to the up limit position and the down arrow points to the down limit position. The active space of the probe in the socket is the "upper limit to the lower limit distance". Since the prior art as shown in fig. 5 is of an integrated design with the probe aperture, the probe is supported by the socket base plate (thin wall pointed by the down arrow), which results in the probe being pressed up as a whole, resulting in poor flatness of the stop surface. Therefore, the probe cannot contact the solder ball at the same time, resulting in a problem of poor test stability.
According to the chip test socket provided by the invention, the novel limiting guide plate is adopted, the limiting hole and the probe hole are separated, the movable distance is increased in the middle of the socket, and the problem of poor surface flatness is solved by reasonably increasing the thickness of the limiting hole.
Fig. 6 is a schematic diagram of a portion of a chip test socket according to an embodiment of the present invention, as shown in fig. 6, in which the chip test socket according to the present invention is in an inactive state, and an up arrow points to an up limit position and a down arrow points to a down limit position. The active space of the probe in the socket is the "upper limit to the lower limit distance".
The restricted space is intended to define the range of motion of the barrel of the probe.
For example, if the diameter of the probe cylinder is 0.5mm and the diameters of the tip and the tail are 0.3mm, respectively, the diameter of the limiting hole may be set to 0.4mm, thereby effectively limiting the movable range of the cylinder.
It should be emphasized that the thickness of the limiting aperture is related to the length of the probe barrel and the needle tip. The range of motion of the probe is limited primarily by the length of the barrel and the needle tip.
In existing probe designs, the length of the barrel may be 1-5mm. However, in the related art shown in fig. 5, the following problems may occur. For example, during the mounting of the socket onto the PCB, the tail portion may be depressed in advance (so-called pre-compression). The pre-compression of the probe in the existing socket structure is 0.2mm. When the probe is mounted in the socket structure, the tip and tail of the needle are exposed to the structure, while the barrel is restrained. Thus, the tail of the needle is compressed, typically 0.2mm, when the probe is secured to the socket floor. If the needle tail is too long, the pre-compression is too large (typically 0.2mm-0.5 mm) and may subject the upper limiting thin wall to excessive pressure.
Compared with the prior art, the invention increases the upper limiting position by a section of moving distance (generally 0.5 mm) like a rectangular area through the design of the limiting guide hole and the probe hole because the upper limiting thin wall influences the overlarge pressure which cannot be born originally, namely the space between the lower edge of the limiting guide plate 5 and the upper edge of the socket main body 17, which means that the length of the probe tail is increased, therefore, the pre-pressing length can be increased to 0.7mm to a greater extent when the probe is pre-pressed, thereby improving the contact effect of the probe and solving the problems in the prior art.
The above values are merely illustrative of specific examples and can be adjusted in practice according to the design of the needle.
According to the stable chip test socket provided by the invention, the limit guide plate is used for combining the limit of the probe with the guide of the chip, so that the moving distance of the probe is increased, the compression amount of the probe is larger, the contact between the chip and the PCB is better ensured, and the accuracy and the stability of the test are ensured.
As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be internal to two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The embodiments described above are intended to provide those skilled in the art with a full range of modifications and variations to the embodiments described above without departing from the inventive concept thereof, and therefore the scope of the invention is not limited by the embodiments described above, but is to be accorded the broadest scope consistent with the innovative features recited in the claims.
Claims (10)
1. The chip test socket at least comprises a probe, a socket body and a chip to be tested, and is characterized in that the socket body at least comprises a socket main body and a limiting guide plate;
the upper surface of the socket main body is provided with a first groove;
the inner dimension of the first groove of the socket main body is matched with the outer envelope dimension of the limit guide plate;
a probe hole is formed in the first groove;
the limiting guide plate is arranged in the first groove;
a second groove is formed in the front surface of the limit guide plate;
a limiting guide hole is formed in the second groove;
the probe hole, the limit guide hole and the tin ball of the chip to be tested correspond;
the probe hole is of a stepped structure, and the diameter of the tail end of the probe hole is smaller than that of the probe hole main body;
the limiting guide hole is of a stepped structure and comprises a guide hole and a limiting hole which are communicated with each other, the guide hole is positioned at the upper part of the limiting hole and used for guiding a chip to be tested, the limiting hole is used for limiting the probe to be separated from the structure from the upper part, and the diameter of the guide hole is larger than that of the limiting hole;
the probe is placed in the socket main body and the limiting guide plate through the probe hole and the limiting guide hole, and the chip to be tested is placed in the second groove of the limiting guide plate and contacted with the probe through the limiting guide hole.
2. The chip test socket of claim 1, wherein a plurality of first positioning pin holes are formed in the first groove;
the back surface of the limit guide plate is provided with a plurality of second positioning pin holes;
the first locating pin hole corresponds with the position of the second locating pin hole, one end of the locating pin is inserted into the first locating pin hole, the other end of the locating pin is inserted into the second locating pin hole, and the relative position of the socket main body and the limiting guide plate is located.
3. The chip test socket of claim 1, wherein a plurality of first spring limiting holes are formed in the first groove;
the back surface of the limiting guide plate is provided with a plurality of second spring limiting holes;
the first spring limiting hole corresponds to the second spring limiting hole in position, one end of the spring is installed in the first spring limiting hole, and the other end of the spring is installed in the second spring limiting hole to provide spring supporting force.
4. The chip test socket according to claim 1, wherein the upper surface of the socket body is provided with a plurality of countersunk grooves;
the countersunk head bolt penetrates through the countersunk head groove to be matched and assembled with the fastening nut, and the socket main body is fixedly installed on the printed circuit board.
5. The chip test socket of claim 4, wherein the countersunk grooves are provided in corners of the upper surface of the socket body.
6. The chip test socket of claim 1, wherein the upper surface of the socket body is provided with a plurality of limit screw grooves;
the front surface of the limit guide plate is provided with a plurality of screw limit grooves;
the position of the screw limit groove corresponds to the position of the limit screw groove;
the limit screw passes through the screw limit groove and the limit screw groove, and the limit guide plate and the socket main body are installed and fixed.
7. The chip test socket of claim 6, wherein the limit screw grooves are formed on opposite sides of the upper surface of the socket body;
each side is provided with 2 limit screw grooves;
the screw limit groove is formed in the front surface of the limit guide plate.
8. The chip test socket of claim 1, wherein a ventilation through hole is formed in the first groove.
9. The chip test socket of claim 1, wherein the socket body and the limit guide plate are of polygonal configuration.
10. The chip test socket of claim 1, wherein a side groove is formed at a periphery of the second recess for providing an operation space for taking out or placing a chip to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484353.9A CN117214484B (en) | 2023-11-09 | 2023-11-09 | Chip test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484353.9A CN117214484B (en) | 2023-11-09 | 2023-11-09 | Chip test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117214484A CN117214484A (en) | 2023-12-12 |
| CN117214484B true CN117214484B (en) | 2024-02-02 |
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| CN117214484A (en) | 2023-12-12 |
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