JP2940483B2 - MCM inspection jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an MCM (multi-chip module) inspection jig, and more particularly to an arrangement in which ball bumps are arranged in a plane as an package (area array, area grid array or ball grid).・ MC used in the manufacturing process of arrays)
It relates to an M inspection jig.

[0002]

2. Description of the Related Art Conventionally, this kind of MCM inspection jig has been
Contacting a pad to which a ball of a ball grid array (BGA) of an M substrate is attached, and a plurality of LSIs
It consisted of a number of spring probes that contacted a test via drawn from a pattern connecting the chips. (See, for example, JP-A-6-196535).

FIG. 4 is a perspective view showing a probe block of a conventional inspection jig. The probe socket 13 is inserted and fixed in a hole previously formed in the support block 15, and has a configuration in which the spring probe 12 is inserted into the probe socket 13.

FIGS. 5A and 5B are a side sectional view and a bottom view showing an example of an object to be inspected. Under the BGA main body 50, pads 51 for attaching balls are arranged in a grid pattern of two rows around. The BGA shown in FIG.
1 and the spring probe 12 shown in FIG. The BGA main body 50 is usually made of a resin mold. The pad 51 has a center line 12a to 1
They are arranged in a grid on the 2h line.

FIG. 6 is a cross-sectional view showing a state in which a plurality of chips are mounted on an MCM substrate and before resin molding. At the stage before the resin molding in the MCM manufacturing process, replacement of the defective LSI chip 61 or LS
When the joint between the I chip 61 and the MCM substrate 63 is defective, the mounting is possible, that is, the repair is possible. MCM substrate 6
The LSI chip 61 is mounted on the pad 3 and a pad 51 for attaching a ball (bump) for making an electrical connection to the outside is provided on the LSI chip 61.
It has a non-lattice pad 62 drawn from a wiring pattern connecting the chips 61.

In order to check whether or not the connection between the LSI chips 61 is defective, a contact is made with a test via (a non-lattice pad 62) drawn out from the wiring pattern. It is arranged inside the lattice of the pad 51 to be attached, and is arranged at an interval smaller than this lattice interval. In order to check whether the connection and wiring connecting the LSI chips 61 are defective, contact is made with a via for inspection drawn from this wiring pattern.
The vias are usually arranged inside the lattice of the pad 51 for attaching the BGA ball, and are arranged at a smaller interval than this lattice interval.

[0007] A plurality of spring probes 121 located inside the two rows of outer grids shown in FIG. 4 are brought into contact with the non-grid pads 62 shown in FIG. Then, a necessary inspection is performed by contacting the surface 51.

The position of the pad 51 for attaching a ball (bump) is determined by the JEDEC standard and the like, and is common without changing depending on the product type. However, the position of the inspection via (non-lattice pad 62) is different. Even if the product is of the same model, it will be different each time it is revised.

[0009]

In the conventional MCM inspection jig, the position of the spring probe which hits the non-lattice pad 62 is different each time the MCM type or the same type is revised, so that FIG. There is a problem that the probe block needs to be reworked, which increases the inspection cost.

It is also conceivable to make the central portion where the spring probe hitting the non-grid pad 62 is independent of the spring probe at the surrounding grid position, that is, to form a two-piece structure. In addition, there is a problem that it is necessary to determine the relative position with high accuracy and the cost is increased.

[0011]

According to a first aspect of the present invention, there is provided an MCM inspection jig comprising: a plurality of conductive rubber probes provided at positions corresponding to lattice pads of an MCM (multi-chip module) substrate; And a plurality of spring probes provided at positions corresponding to the non-lattice pads.

According to a second aspect of the present invention, there is provided an MCM inspection jig according to the first aspect, further comprising a through-hole board which is in contact with the lower surface of the conductive rubber probe to make an electrical connection.

According to a third aspect of the present invention, there is provided an MCM inspection jig according to the first aspect, further comprising a probe socket for inserting the spring probe in a vertical direction to establish an electrical connection.

According to a fourth aspect of the present invention, there is provided an MCM inspection jig according to the first aspect, further comprising a support block for holding the probe socket and the through-hole board.

According to a fifth aspect of the present invention, there is provided an MCM inspection jig comprising: a press portion having an upper surface of an MCM and having a hollowed chip portion; a press mechanism for moving the press portion up and down;
A conductive rubber probe that makes contact with a pad on a predetermined grid of the M substrate at a convex portion, a through-hole substrate that makes electrical contact with the lower surface of the conductive rubber probe, and a non-contact pattern drawn from a pattern connecting chips. A spring probe for making contact with the lattice pad, a probe socket for vertically inserting the spring probe for electrical connection, a support block for holding the probe socket and a through-hole board, and a relative position between the pushing portion and the support block. A push-in part including a base plate having a reference pin for determining a position, a pressing mechanism for raising and lowering the push-in part, and a conductive part for making contact with a pad on a predetermined lattice of the MCM substrate at a convex part. A rubber, a through-hole board that contacts the lower surface of the conductive rubber and makes an electrical connection, and connects the chips to each other. A spring probe for making contact with a non-lattice pad pulled out of the turn, a probe socket for vertically inserting the spring probe to make electrical connection, a support block for holding the probe socket and a through-hole board, and a pushing portion And a base plate having a reference pin for determining a relative position between the support block and the support block.

[0016]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention,
FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a side view showing an example of use of the present invention.

The MCM inspection jig of the present invention comprises an MCM substrate 1
a, a plurality of conductive rubber probes 11 provided at positions corresponding to the lattice pads, and a plurality of spring probes 1 provided at positions corresponding to the non-lattice pads on the MCM substrate 1a.
2 is included.

The MCM substrate 1a has pads arranged on the lower surface as shown in FIG. 6, and a conductive rubber probe 11 having a convex contact portion is arranged opposite to the area of the pad 51 in FIG. The spring probe 12 is arranged to face the (non-lattice pad 62). The conductive rubber probe 11 is positioned without being adhered to the upper surface of the through-hole board 14 to be electrically connected. The spring probe 12 is composed of a movable pin whose tip moves up and down due to the elasticity of a spring. Electrical connection is made by inserting the probe into a probe socket 13.

The support block 15 holds the probe socket 13 and the through-hole board 14 and is fixed to the base plate 5.

The base plate 5 has a reference pin 4 for positioning the MCM substrate 1a relative to the push-in portion 2 for sinking.

The pushing section 2 has a slide guide 101 which can be moved up and down by a press mechanism 3, and is formed in a shape in which a chip portion is hollowed out so that the MCM substrate 1a can be sucked and fixed at the chip 1b portion.

The conductive rubber probe 11 is composed of a conductive portion 111 in a convex portion and an insulating portion 112 in a concave portion. The through-hole substrate 14 has a through-hole 19 formed at the position of the BGA pad, and electrically connects the wiring 16 at the electrode connection portion 17 of solder to conduct electric connection with the pad.

The probe socket 13 draws out the wiring 16 from the electrode connection part 17 of the solder at the part opposite to the insertion port of the spring probe 12.

The support block 15 is provided with a vertical through-hole 18 at a position facing all the pads on the lower surface of the MCM substrate, and the processing hole 18 is fixed through the wiring 16 and the probe socket 13. .

The operation of the present invention will be described below.

The chip 1b of the MCM of the object to be inspected is fitted into the hollow portion of the push-in portion 2, and the MCM of the object to be inspected is fixed by suction just above the conductive rubber probe 11 and the spring probe 12 held by the support block 15.

Thereafter, the pressing mechanism 2 presses the pressing portion 2
Is lowered to a predetermined position, whereby the tips of the conductive rubber probe 11 and the spring probe 12 are brought into contact with the MCM pad of the inspection object at a predetermined pressure.

In this state, the wiring 16, the electrode connecting portion 17,
Via a probe socket 13, a spring probe 12, a through-hole board 14, and a conductive rubber probe 11, M
The CM pads can be electrically connected to the outside.

The conductive rubber probe is, for example, 2.5
When the electrodes are arranged on a predetermined grid such as 4 mm or 1.27 mm, a large standard product can be obtained, which can be cut out to a required size and used. The cost is further reduced by taking a plurality of objects of a required size from a large conductive rubber probe sheet.

[0031]

According to the present invention, a conductive rubber probe which comes into surface contact with a BGA pad is used by using a support block which holds a conductive rubber probe which comes into contact with a grid-like pad and a spring probe which comes into contact with a non-lattice pad. The contact area can be expanded by contacting the conductive rubber probe. Even if the block of the conductive rubber probe and the block of the spring probe are separated from each other, there is no need to determine the relative position with high precision even if the two-piece structure is used. Since it is not necessary to perform the block with high processing accuracy, there is an effect that the cost can be reduced.

Further, the MCM can be made into a two-piece structure,
Even if the inspection via is changed due to the change of the product type or the revision, only the replacement of the spring probe portion is sufficient, so that the inspection cost is reduced.

Further, by making contact with the pads of the BGA with the conductive rubber probe, it is possible to perform batch replacement at the time of maintenance and to easily perform the replacement work.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view of FIG. 1 taken along line AA.

FIG. 3 is a side view showing an example of use of the present invention.

FIG. 4 is a perspective view showing an example of the related art.

FIGS. 5A and 5B are a side sectional view and a bottom view showing an example of an inspection object.

FIG. 6 is a cross-sectional view showing a state in which a plurality of chips are mounted on an MCM substrate and before resin molding is performed.

[Explanation of symbols]

 1a MCM board 1b chip 2 push-in part 3 press mechanism 4 reference pin 5 base plate 11 conductive rubber probe 12 spring probe 13 probe socket 14 through-hole board 15 support block 16 wiring 17 electrode connection part 18 processing hole 19 through-hole 50 BGA body 51 Pad for attaching ball 61 LSI chip 62 Non-lattice pad 63 MCM substrate 101 Slide guide 111 Conductive part 112 Insulating part

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁶ , DB name) G01R 31/26 G01R 31/28 H01L 21/66

Claims (5)

(57) [Claims] 1. An MCM (multi-chip module)
An MCM inspection jig comprising: a plurality of conductive rubber probes provided at positions corresponding to lattice pads on a substrate; and a plurality of spring probes provided at positions corresponding to non-lattice pads on the MCM substrate. . 2. The MCM inspection jig according to claim 1, further comprising a through-hole board for making electrical contact with a lower surface of said conductive rubber probe. 3. The MCM inspection jig according to claim 1, further comprising a probe socket for inserting said spring probe in a vertical direction to establish an electrical connection. 4. The MCM inspection jig according to claim 1, further comprising a support block for holding said probe socket and said through-hole board. 5. A push-in portion having a shape in which a chip portion is hollowed out on an upper surface of the MCM, a press mechanism which moves up and down the push-in portion, and a contact with a pad on a predetermined lattice of the MCM substrate by a convex portion. A conductive rubber probe to be performed, a through-hole substrate that contacts and electrically connects a lower surface of the conductive rubber probe, a spring probe that contacts a non-grid pad drawn from a pattern connecting chips, and a vertical direction of the spring probe. And a base plate having a reference pin for determining a relative position between the push-in portion and the support block, and a support block for holding the probe socket and the through-hole board. MCM inspection jig.