JPH09274066A - Semiconductor tester, testing method utilizing tester thereof and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time of the test of a semiconductor device having bump electrodes and the inspection of the protruding electrodes and to improve reliability. SOLUTION: In a semiconductor tester 10, each bump electrode is coupled into each inspecting concave part 17 formed in the upper surface of a forming board 16 by the descending operation of a semiconductor device 11 held by a fixing jig 13. At this time, the appearance shape and the position of each bump electrode 12 are inspected by the coupling with each inspecting concave part 17. Then, each bump electrode 12 is connected to each measuring terminal 19 (191 -193 ) in each inspecting concave part 17, and the electric operation test of the semiconductor device 11 is performed. Thus, the electric operation test of the semiconductor device 11 and the inspection for the appearance shape and the arranging positions of a plurality of the bump electrodes 12 provided at the lower surface of the semiconductor device 11 can be performed at the same time. Therefore, the time for the test and the inspection can be shortened, and the reliability of the inspection can be enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus, a test method using the same, and a semiconductor device, and more particularly, a semiconductor test apparatus suitable for use in testing semiconductor chips and semiconductor devices having protruding electrodes and the semiconductor test apparatus using the same And a semiconductor device.

2. Description of the Related Art In recent years, high density, high speed, and miniaturization of semiconductor devices have been demanded. To meet these demands, a semiconductor chip (so-called bare chip) or a BGA (Ball Grid Array) which is not sealed in a package. A mounting method of mounting a plurality of semiconductor devices having a structure directly on a circuit board has been frequently used.

In this mounting method, for example, if one of a plurality of bare chips or semiconductor devices is abnormal, the entire device is defective, so that each bare chip or semiconductor device has high reliability. Required. Therefore, a test for checking whether or not each bare chip or semiconductor device normally functions has become an important issue.

[0004]

2. Description of the Related Art Conventionally, a test of a semiconductor device (hereinafter, a resin-sealed bare chip and a resin-sealed semiconductor device is generically referred to as a "semiconductor device") having a projecting electrode having a spherical projection on its lower surface. Various test methods have been proposed and implemented as methods.

When conducting an electrical operation test of this type of semiconductor device, the test needle of the tester is brought into contact with the protruding electrode, and therefore the electrical connection of each protruding electrode must be tested without degrading the protruding electrode as much as possible. In addition, the test is required to have high reliability and low cost.

As a conventional semiconductor test apparatus, there is one using a semiconductor test socket, for example. This semiconductor test socket is configured to test the electrical operation of a semiconductor by a test method using a probe (test needle). In this test method, a plurality of probes are arranged on a test substrate so as to correspond to the plurality of protruding electrodes formed on the lower surface of the semiconductor device, and the test is performed by directly contacting the tips of the probes with the protruding electrodes. This is the test method to be performed.

That is, the semiconductor test socket has a plurality of probes provided in the same arrangement as the plurality of protruding electrodes of the semiconductor device, and the probes are provided with a U-shaped bent portion. There is. Then, when the tip of the probe comes into contact with and is pressed by the protruding electrode of the semiconductor device, the bent portion is deformed to reduce damage to the protruding electrode.

Further, since the protruding electrodes are provided in a matrix on the lower surface of the semiconductor device, the connection state of each protruding electrode cannot be confirmed from the outside when the semiconductor device is mounted on the substrate. It is necessary to inspect the size and shape of. An example of this type of inspection device is one that optically measures the protruding height of the protruding electrode. As another inspection method, there is a method of visually checking the shape of the protruding electrodes by an inspector.

[0009]

However, conventionally, the electrical test of the semiconductor device and the inspection of the shape of the bump electrode are separately performed, which not only requires a lot of time and labor until the inspection is completed. However, there is a problem that the inspection efficiency is low.

When conducting an electrical test of a semiconductor device by the above-described probe test method, the height of the protruding electrode may vary, so that the connection with the tip of the probe may not be sufficient. Further, although the probe is provided with a U-shaped bent portion, when the tip of the probe comes into contact with the protruding electrode, the protruding electrode formed by solder may be deformed.

Further, when the projection electrodes are inspected, a large number of the projection electrodes are densely arranged in a predetermined array on the lower surface of the semiconductor device, so that the projection height of the projection electrodes can be optically measured. It is difficult, and it is difficult for the inspector to visually check the external appearances of all the protruding electrodes. Therefore, not only the reliability of the inspection is low but also the inspection time can be shortened.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a semiconductor test apparatus capable of improving the reliability of the protruding electrodes and the efficiency of the test, a test method using the same, and a semiconductor device. And

[0013]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following various means. According to the invention of claim 1, a semiconductor under test having a plurality of projecting electrodes is mounted on one surface, and a test terminal is tested by contacting the measuring electrodes with the projecting electrodes and electrically connecting them. In the semiconductor testing device described above, a substrate is provided so as to face one surface of the semiconductor under test, and a recess having a shape corresponding to the protruding electrode is provided on the substrate, and each of the plurality of protruding electrodes is provided in the recess of the substrate. By fitting, the ends of the protruding electrodes are electrically connected to the measuring terminals, and an electrical operation test is performed.

According to a second aspect of the present invention, in the semiconductor test apparatus according to the first aspect, each of the plurality of projecting electrodes is fitted into a recess of the substrate to form the projecting electrode and It is characterized in that the shape of the protruding electrode is inspected.

According to a third aspect of the present invention, in the semiconductor test apparatus according to the first aspect, the shape inspection of the protruding electrode is performed by fitting each of the plurality of protruding electrodes into the recess of the substrate. At the same time, the end portion of the protruding electrode is electrically connected to the measuring terminal to perform an electrical operation test.

According to a fourth aspect of the invention, in the semiconductor test apparatus according to any one of the first to third aspects, a position adjustment is performed so that the semiconductor under test and the substrate are kept in parallel. A core mechanism is provided.

According to a fifth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to fourth aspects, the semiconductor device under test is arranged so that the relative positions of the protruding electrodes and the recesses coincide with each other. It is characterized in that a positioning mechanism for regulating the relative position with respect to the substrate is provided.

According to a sixth aspect of the present invention, in the semiconductor test apparatus according to any of the first to fourth aspects, the substrate is provided in a floating state, and each of the plurality of protruding electrodes is a concave portion of the substrate. The position of the substrate with respect to the semiconductor under test is positioned so that the relative positions of the protruding electrodes and the recesses coincide with each other.

According to a seventh aspect of the present invention, in the semiconductor test apparatus according to any of the first to sixth aspects, the measurement terminal is provided so as to be vertically movable, and the protruding electrode is fitted in the concave portion of the substrate. It is characterized in that the measurement terminal is moved downward and the projecting electrode is connected to the measurement terminal by combining them.

Further, in the invention described in claim 8, in the semiconductor test apparatus according to any one of claims 1 to 6, between the semiconductor under test and a fixture for supporting the semiconductor under test, or A buffer material having elasticity is provided between the semiconductor under test and the substrate or between the substrate and the measurement substrate on which the measurement terminals are formed.

According to a ninth aspect of the invention, in the semiconductor test apparatus according to any one of the first to sixth aspects, the semiconductor under test and the substrate are provided between the semiconductor under test and the substrate. It is characterized in that a spacer for keeping the clearance between them constant is provided.

According to a tenth aspect of the invention, in the semiconductor test apparatus according to any one of the first to ninth aspects, a protruding terminal is formed at the tip of the measuring terminal. is there. In the invention according to claim 11, in the semiconductor test apparatus according to claim 10,
It is characterized in that the protruding terminals are formed by stud bumps.

According to the twelfth aspect of the present invention, in the semiconductor test apparatus according to the tenth aspect or the eleventh aspect, the projecting terminal has a plurality of stud bumps made of the same kind or different kinds of metal. It is characterized by having a structure formed in.

The invention according to claim 13 is characterized in that, in the semiconductor test apparatus according to any one of claims 1 to 9, a roughened surface is formed on a surface portion of the measuring terminal. is there. According to a fourteenth aspect of the invention, in the semiconductor test apparatus according to any one of the first to ninth aspects, a dissimilar metal film made of a material different from a material of the measurement terminal is provided on a surface portion of the measurement terminal. It is characterized by being formed.

According to a fifteenth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to fourteenth aspects, the shape of the recess formed in the substrate is a hemispherical shape,
It is characterized in that either one of a conical shape and a pyramid shape is used.

According to a sixteenth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to fifteenth aspects, the measuring terminals are provided on a terminal sheet having a flexible structure and a lower portion of the terminal sheet. It is characterized in that it is configured by a base having a convex portion formed at a position facing the concave portion of the substrate and the convex portion pushes out the terminal sheet portion to form a measurement terminal.

According to the seventeenth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to sixteenth aspects, the second concave portion is formed at a position facing the measurement terminal of the substrate. It is a feature.

According to the eighteenth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to seventeenth aspects, the substrate positioning is performed to position the substrate and the measurement substrate on which the measurement terminals are formed. It is characterized in that a mechanism is provided.

According to a nineteenth aspect of the invention, in the semiconductor test apparatus according to any one of the first to eighteenth aspects, a semiconductor positioning mechanism for positioning the substrate and the semiconductor under test is provided. Semiconductor test equipment characterized by.

According to the invention of claim 20, a semiconductor under test having a plurality of protruding electrodes is mounted on one surface, and a measuring terminal is brought into contact with and electrically connected to the protruding electrodes of the semiconductor under test. In a method of testing a semiconductor testing device configured to perform a test, the shape of each protruding electrode is tested by fitting the plurality of protruding electrodes into a recess of a substrate provided so as to face one surface of the semiconductor under test. Along with
The test of the semiconductor device under test is performed by electrically connecting an end of the protruding electrode to the measurement terminal provided in the recess.

According to a twenty-first aspect of the present invention, in the test method for a semiconductor test apparatus according to the twentieth aspect, a recess formed in the substrate by vibrating at least one of the substrate and the semiconductor under test. The projection electrode is positioned at the position.

Further, in the invention according to claim 22, in the test method for a semiconductor testing device according to claim 20, suction holes connected to a vacuum suction device are formed in the substrate, and the suction holes are used to form the suction holes. By sucking the protruding electrodes, the protruding electrodes are positioned in the recesses formed in the substrate.

Further, in the invention of claim 23, in the test method of the semiconductor testing device according to claim 20, the substrate is formed of a porous material, and the substrate is connected to a vacuum suction device, By sucking the protruding electrodes, the protruding electrodes are positioned in the recesses formed in the substrate.

According to a twenty-fourth aspect of the present invention, in the test method of the semiconductor test apparatus according to the twentieth aspect, a moving device that can horizontally move the semiconductor under test is provided along the substrate, and the moving device is used. It is characterized in that the semiconductor under test is horizontally moved to fit and position the protruding electrodes in the recesses.

Further, in the invention of claim 25, in the test method of the semiconductor testing device according to claim 20, first and second inclined surfaces having different slopes are formed in the recess,
It is characterized in that the protruding electrode is fitted and positioned in the recess based on the difference in gradient between the first and second inclined surfaces.

According to a twenty-sixth aspect of the present invention, the semiconductor element has a protruding electrode, and the semiconductor device is mounted on a semiconductor testing apparatus having a substrate in which a recess corresponding to the protruding electrode is formed. In the semiconductor device to be tested, the bump electrode is shaped into a shape that conforms to the shape of the recess by being pressed against the recess formed in the substrate.

Further, in the invention described in Item 27, in the semiconductor device described in Item 26, the shape of the protruding electrode is a conical shape or a cylindrical shape.

Each of the above means operates as follows. According to the first aspect of the present invention, since each of the plurality of protruding electrodes is fitted into the recess of the substrate to electrically connect the end of the protruding electrode to the measurement terminal, the shape of each protruding electrode is changed to the recess. It is possible to inspect the semiconductor under test by connecting with the measurement terminal, and it is possible to perform an electrical test of the semiconductor under test. Therefore, the test of the semiconductor under test and the inspection of the bump electrode can be performed at the same time, and the reliability in the inspection process can be improved and the test and inspection time can be shortened.

According to the second aspect of the invention, since the plurality of protruding electrodes are fitted into the recesses of the substrate to form the protruding electrodes and to inspect the shape of the protruding electrodes, the shape of the protruding electrodes is determined. Even if they are different from each other, the shape is formed so as to match the concave portion of the substrate, and the defective shape of the protruding electrode can be reduced.

According to the third aspect of the invention, the shape of the protruding electrode is inspected by fitting each of the plurality of protruding electrodes into the concave portion of the substrate, and at the same time, the end of the protruding electrode is electrically connected to the measuring terminal. Since the electrical operation test is carried out by connecting to, the step of inspecting the protruding electrode is completed in one step, and the inspection time of the protruding electrode can be greatly shortened.

Further, according to the invention of claim 4, since the aligning mechanism for adjusting the position is provided so that the semiconductor under test and the substrate are kept in parallel, the semiconductor under test is mounted in an inclined state. In addition, each of the plurality of protruding electrodes can be accurately fitted into the recess, and the reliability of the test of the semiconductor under test and the inspection of the protruding electrode can be improved.

According to the fifth aspect of the present invention, the positioning mechanism regulates the relative positions of the semiconductor under test and the substrate so that the relative positions of the protruding electrodes and the recesses coincide with each other. Each of them can be fitted into the recess accurately, and the reliability of the test of the semiconductor under test and the inspection of the protruding electrode can be improved.

According to the sixth aspect of the invention, the substrate is provided in a floating state, and each of the plurality of projecting electrodes fits into the recess of the substrate, whereby the relative positions of the projecting electrode and the recess are matched. Since the position of the substrate with respect to the semiconductor under test is positioned as described above, it is possible to accurately fit each of the plurality of protruding electrodes into the recess, and improve the reliability of the test of the semiconductor under test and the inspection of the protruding electrodes. it can.

According to the invention of claim 7, since the measurement terminal is moved downward by fitting the projection electrode into the recess of the substrate, the projection electrode is connected to the measurement terminal.
Even if the semiconductor under test is mounted in a tilted state, each measuring terminal can be individually moved up and down to test the semiconductor under test and inspect the protruding electrodes.

According to the eighth aspect of the present invention, each protruding electrode can be fitted in the recess while the substrate and the semiconductor under test are parallel to each other due to the elastic deformation of the cushioning material, and the impact at the time of fitting can be achieved. Can be absorbed. Further, according to the invention of claim 9, by providing the spacer for keeping the clearance between the semiconductor under test and the substrate constant, it is possible to prevent an unnecessary load from being applied to the protruding electrode, and thus the protruding electrode can be prevented. It is possible to suppress the deformation of the electrodes.

According to the tenth aspect of the invention, since the protruding terminal is formed at the tip of the measuring terminal, the tip of the measuring terminal has a protruding structure, and the protruding electrode provided on the semiconductor under test is formed. The connectivity with can be improved.

According to the eleventh aspect of the present invention, since the protruding terminals are formed by stud bumps, the protruding terminals are formed using a wire bonding technique generally used as a semiconductor device manufacturing technique. Therefore, the protruding terminals can be formed at low cost and with high production efficiency.

Further, the stud bump usually has a small projection formed by cutting the wire at the tip thereof, and the small projection has a sharp shape similar to the tip of the probe. Therefore, the connectivity between the measurement terminal and the projection electrode is also formed. Can be improved. According to the invention as set forth in claim 12, the projecting terminal has a structure in which a plurality of stud bumps made of the same kind or different kinds of metal are formed in a plurality of stages, so that the projection arranged at the most distal end portion. It is possible to select the material of the electrode with good compatibility with the protruding electrode, and the material of the protruding terminal other than the tip part is the one that is placed at the measurement terminal or the tip part and has good compatibility with the protruding terminal. Can be selected.

For this reason, the connectivity between the protruding terminals and the protruding electrodes disposed at the most distal end, the connectivity between the protruding terminals, and the connectivity between the protruding terminals and the measuring terminals are both good. Can be Further, according to the invention of claim 13, by forming the roughened surface on the surface portion of the measurement terminal,
Since the roughened surface has fine irregularities formed on it and its surface area is large, and the fine protrusions bite into the protruding electrodes, it is possible to ensure electrical connection between the measurement terminals and the protruding electrodes. it can.

According to the fourteenth aspect of the present invention, the dissimilar metal film made of a material different from the material of the measuring terminal is formed on the surface portion of the measuring terminal, so that the materials of the measuring terminal and the protruding electrode are bonded. It is possible to select a material that has good bonding properties for both the measuring terminal and the protruding electrode as the dissimilar metal film, and improve the electrical bonding property between the measuring terminal and the protruding electrode. It is possible to achieve protection and protection of the measurement terminal.

Further, as in the invention of claim 15, the shape of the concave portion formed on the substrate may be any of a hemispherical shape, a conical shape and a pyramidal shape capable of inspecting the shape of the protruding electrode. Is. A hemispherical shape is desirable from the aspect of forming property of the protruding electrode, and a conical shape or a pyramidal shape is desirable from the surface of forming the concave portion.

According to the sixteenth aspect of the present invention, the terminal sheet having the flexible structure and the base having the convex portion formed at the lower portion of the terminal sheet and facing the concave portion of the substrate are provided. By configuring the measurement terminals and forming the measurement terminals by the protrusions pushing out the terminal sheet, the measurement terminals have a protruding terminal shape, so that electrical connection with the protruding electrodes can be ensured. it can.

Further, since the measuring terminal is formed on the terminal sheet having a flexible structure, it is not necessary to print the measuring terminal on the base, and the terminal sheet is formed in accordance with the formation of the flexible circuit board. Since it can be performed, it can be easily and inexpensively formed.

According to the seventeenth aspect of the present invention, since the second recess is formed at the position facing the measurement terminal of the substrate, the protruding electrode is exposed to the lower part of the substrate when fitted to the substrate. The surface area of the protruding electrode can be set wide, and the measurement terminal and the protruding electrode can be reliably connected.

According to the eighteenth aspect of the invention, since the board positioning mechanism is provided, the board and the measurement board on which the measurement terminals are formed can be positioned with high accuracy. According to the nineteenth aspect of the invention, since the semiconductor positioning mechanism is provided, the substrate and the semiconductor under test can be positioned with high accuracy.

According to the twentieth aspect of the invention, a plurality of protruding electrodes are fitted into the recesses of the substrate provided so as to face one surface of the semiconductor under test, and the shape of each protruding electrode is tested. Since the semiconductor device under test is tested by electrically connecting the ends of the protruding electrodes to the measurement terminals provided in the recesses, the shape of each protruding electrode can be inspected by fitting with the recesses. By connecting the electrodes to the measurement terminals, the semiconductor under test can be electrically tested.

Therefore, the test of the semiconductor under test and the inspection of the protruding electrodes can be performed at the same time, and the reliability of the inspection process can be improved and the test and inspection time can be shortened. According to the twenty-first aspect of the present invention, by vibrating at least one of the substrate and the semiconductor under test, the semiconductor under test relatively moves on the substrate, and the protruding electrode is eventually formed in the recess formed in the substrate. It is inserted and positioned. Therefore, the projection electrode and the recess can be easily and automatically positioned.

Further, according to the twenty-second and twenty-third aspects of the present invention, the projection electrode is sucked by the vacuum suction device, and the projection electrode is positioned in the recess formed in the substrate, so that the projection electrode is surely recessed. It can be fitted inside. According to the twenty-fourth aspect of the present invention, a moving device capable of horizontally moving the semiconductor under test is provided along the substrate, and the semiconductor under test is horizontally moved by the moving device, so that the semiconductor under test moves. Eventually, the protruding electrode fits into the recess and is positioned. Therefore, it is possible to easily and surely perform the positioning process of the protruding electrode and the recess.

According to the twenty-fifth aspect of the present invention, the first and second inclined surfaces having different inclinations are formed in the concave portion, so that the inclined surface with gentle inclination is used as the guide surface for guiding the projection electrode. The steeply sloped surface can be used as a locking surface for locking the protruding electrode.

Then, the protruding electrode fitted in the recess is guided by the inclined surface functioning as a guide surface by fitting and positioning the protruding electrode in the recess based on the difference in gradient between the first and second inclined surfaces. Positioned by being locked by the inclined surface functioning as a locking surface. Therefore, it is possible to easily and surely perform the positioning process of the protruding electrode and the recess.

According to the twenty-sixth aspect of the present invention, the protruding electrode is pressed against the concave portion formed in the substrate constituting the semiconductor testing device and shaped into a shape that conforms to the shape of the concave portion. It is possible to form a shape other than the shape. Therefore, it is possible to make the shape of the bump electrode suitable for the mounting mode of the semiconductor device.

Furthermore, according to the twenty-seventh aspect of the present invention, when the projection electrode has a conical shape, the tip of the projection electrode is sharp, and the pressing force is concentrated on this tip. When the semiconductor device having the protruding electrodes is mounted on the mounting substrate, the protruding electrodes are melted from their tip portions and bonded to the mounting substrate, so that the mounting process can be performed efficiently and reliably.

Further, when the shape of the protruding electrode is cylindrical, the tip of the protruding electrode is flat and the contact area with the mounting substrate is wide, so that reliable mounting processing can be performed.

[0064]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is an exploded view showing a semiconductor test apparatus 10 according to a first embodiment of the present invention in a vertical direction.

The semiconductor test apparatus 10 includes an electrical operation test of a semiconductor device 11 which is a semiconductor under test and a plurality of protruding electrodes 12 (12 ₁ to ₁ 1 provided on the lower surface of the semiconductor device 11).
This is a device for simultaneously performing 2 _n ) appearance shape and array position inspection. The semiconductor device 11 is a semiconductor chip or an I having a BGA (Ball Grid Array) structure in which the semiconductor chip is molded.
The C package has a plurality of protruding electrodes 12 protruding on a lower surface in a predetermined arrangement. Each of the protruding electrodes 12 is formed into a spherical shape with, for example, solder (material is Pb / Sn), and is generally called a “solder bump” or a “solder ball”.

Further, since the semiconductor device 11 has a structure having a plurality of protruding electrodes 12 on the lower surface thereof, the electrodes are denser than those of the semiconductor device of the QFP (Quad Flat Package) structure in which the electrodes are projected on the side surface of the package. The number of electrodes can be increased and the number of electrodes can be increased.

A fixing jig 13 holds the flat semiconductor device 11 in a horizontal state, and is supported so as to be able to move up and down. Further, the fixing jig 13 is provided with a suction portion 14 connected to a vacuum pump (not shown) as a suction means for sucking the semiconductor device 11.

Further, on the upper part of the fixing jig 13, a centering mechanism 15 for swingably supporting the fixing jig 13 and adjusting surface deviation is provided. The aligning mechanism 15 includes, for example, a spherical support portion 15b provided at an end of a rod 15a of an elevating mechanism (not shown) for elevating the fixing jig 13,
It comprises a bearing portion 15c with which the spherical support portion 15b is fitted.
Therefore, the centering mechanism 15 has the same structure as the universal joint by the spherical support portion 15b and the bearing portion 15c.

For example, when the forming substrate 16 facing below the fixing jig 13 is tilted, a force for tilting the semiconductor device 11 attracted to the fixing jig 13 acts. However, the spherical support portion 15b of the aligning mechanism 15 is tilted in that direction so that the semiconductor device 11 becomes the forming substrate 1.
6, the semiconductor device 11 and the semiconductor test device 10 are prevented from being damaged.

[0070] 16 in forming the substrate, for example, machine Nara Brucella Miku Ssu is formed by such a plurality of test recesses 17 which are the same sequence as the protrusion electrodes 12 of the semiconductor device 11 on the upper surface (17 ₁ to 17 _n ) Is provided. The inspection recessed portion 17 is a hemispherical recess corresponding to the outer shape of the protruding electrode 12, and whether or not the protruding electrode 12 is formed into a prescribed size by fitting the protruding electrode 12 from above. Is determined.

That is, when each of the plurality of protruding electrodes 12 is not in a predetermined arrangement, or when the protruding electrodes 12 are larger than the prescribed size and shape, the protruding electrodes 12 are inspected recessed portions 17.
It can be determined that the protrusion electrode 12 is not displaced and that the protrusion electrode 12 has a defective shape.

The forming substrate 16 can be formed by fitting the protruding electrode 12 of the semiconductor device 11 into the inspection recessed portion 17. Although the protruding electrode 12 is formed into a spherical shape by soldering or the like, it may not have a predetermined spherical shape during the manufacturing process, and may have an irregular shape, or a part of the spherical shape may have a protrusion.
In such a case, since the forming substrate 16 is made of a material harder than the protruding electrode 12, when the protruding electrode 12 is pressed while being fitted into the inspection recess 17, the protruding electrode 1
The shape of 2 is shaped so as to match the shape of the inspection recessed portion 17.

Therefore, even if the protruding electrode 12 has a defective shape, the outer shape of the protruding electrode 12 is inspected in the inspection recess 1 in the inspection process.
Since it is molded into the shape of No. 7, the defective shape of the bump electrode 12 can be reduced. Therefore, the defective shape rate of the protruding electrodes 12 in the inspection process can be reduced.

Reference numeral 18 denotes a measurement substrate, which is arranged below the forming substrate 16. The upper surface of the measurement substrate 18, a plurality of measuring terminals 19 in the same sequence as the test recess 17 so as to face the bottom center of the plurality of test recesses 17 (19 ₁ ~ 19 _n) is disposed. Incidentally, the measurement terminal 19 (19 ₁ ~19 _n) is substantially formed in a hemispherical shape, is provided so as to protrude from the wiring layer 20 formed on the measurement substrate 18.

[0075] each of the above measurement terminal 19 (19 ₁ ~19 _n)
Are terminals for testing the electrical operation of the semiconductor device 11, respectively. As shown in FIG.
6 test recess 17 (17 ₁ to 17 _n) bottom match the holes 17a provided in the center of the test recesses 17 (17 ₁ to 17
_n ) so as to project into the inside.

The forming substrate 16 and the measuring substrate 1
8 is mounted on the semiconductor test apparatus 10 in a stacked state. Therefore, when the semiconductor device 11 is lowered while being held by the fixing jig 13, as shown in FIG. 3, the ends of the protruding electrodes 12 inserted into the respective inspection recesses 17 of the forming substrate 16 cause the measurement substrate to end. Each measuring terminal 1 on 18
The semiconductor device 11 can be tested by abutting against and being electrically connected.

Reference numeral 21 is a stage for holding the forming substrate 16 and the measurement substrate 18, and is provided below the fixing jig 13 so as to face it. A holding portion 22 for holding the forming substrate 16 and the measuring substrate 18 at a predetermined mounting position is provided on the upper surface of the stage 21.

Further, below the stage 21, the forming substrate 16 and the measurement substrate 1 for the semiconductor device 11 are formed.
A centering mechanism 23 for adjusting the position of No. 8 is provided. The aligning mechanism 23 has the same structure as the aligning mechanism 15 described above. For example, a spherical support portion 23b provided at an end of a rod 23a protruding downward from the center of the lower surface of the stage 21 and a spherical support. Bearing portion 23 with which the portion 23b is fitted
c.

Therefore, the aligning mechanism 23 has the spherical support portion 2
3b and the bearing portion 23c have the same structure as the universal joint. For example, when the semiconductor device 11 is mounted in a tilted state, a force that tilts the stage 21 acts on the forming substrate 16. However, the spherical supporting portion 23b of the aligning mechanism 23 is inclined and the forming substrate 1
Since 6 follows the semiconductor device 11, the stage 21 holding the forming substrate 16 is adjusted to be parallel to the fixing jig 13. This prevents the forming substrate 16 and the measurement substrate 18 from being damaged.

Now, the operation of inspecting and testing the semiconductor device 11 using the semiconductor testing device 10 configured as described above will be described. Incidentally, FIG. 4 shows the semiconductor device 1.
1 shows a state of being separated from the forming substrate 16, and FIG. 5 shows a state of the semiconductor device 11 being close to the forming substrate 16.

When the semiconductor device 11 is conveyed below the fixing jig 13 by a handling device (not shown), the semiconductor device 11 is adsorbed by the adsorption portion 14 and held on the lower surface of the fixing jig 13 as shown in FIG. To be done. When held on the lower surface of the fixing jig 13, the suction position of the semiconductor device 11 is positioned at a predetermined position. As a result, the semiconductor device 11 opposes above the forming substrate 16.

Next, the fixing jig 13 and the semiconductor device 11 are lowered in the direction A by the descending operation of the elevating mechanism, and the stage 2 is moved.
0 is close to the forming substrate 16 held on the surface. Then, as shown in FIG. 5, the protruding electrodes 12 protruding to the lower surface of the semiconductor device 11 as the fixing jig 13 descends.
Each of (12 ₁ ~12 _n) are fitted to each test recess 17 formed on the upper surface of the forming board 16 (17 ₁ ~17 _n).

At this time, each protruding electrode 12 (12 _{1 to} 12
outer shape and position each inspection recess 17 of _n) (17 ₁ to 1
7 _n ) to be tested. Multiple protruding electrodes 12
If at least one of (12 _{1 to} 12 _n ) is larger than the specified size or shape, or if at least one of them is in a position deviated from the predetermined arrangement, the protruding electrode 12 has an inspection recess 17
It is not inserted into the inside and is in a state of riding on the upper surface of the forming substrate 16.

In this case, each protruding electrode 12 (12 _{1 to} 12)
_{Since n)} is not connected to the measurement terminal 19 located at the bottom (19 ₁ ~ 19 _n) for each inspection recess 17 (17 ₁ ~17 _n), can be determined to be a defective shape of the bump electrode 12. In addition, when the external shape and position of each protruding electrode 12 (12 _{1 to} 12 _n ) are accurate, each protruding electrode 12 (1
2 ₁ to 12 _n) are connected to each inspection recess 17 (17 ₁ ~17 _n) fitted into and the measurement terminal 19 (19 ₁ ~19 _n). Then, the electrical operation test of the semiconductor device 11 is performed.

[0085] Thus, by fitting into each test recess 17 of each projection electrode 12 (12 ₁ ~12 _n) for forming the substrate 16 of the semiconductor device 11 (17 ₁ to 17 _n), electric semiconductor device 11 Operation test and semiconductor device 11
A plurality of protruding electrodes 12 (12 _{1 to} 12) provided on the lower surface of the
_Since the appearance shape and array position inspection of step _n ) can be performed at the same time, the test and inspection time can be significantly reduced.

The external shape of the plurality of protruding electrodes 12 is
Since a plurality of inspection recesses 17 arranged facing each other are inspected as gauges, the reliability is higher than that of a visual inspection by an inspector or a method of optically measuring the protruding height of the protruding electrode 12. In addition, the inspection cost can be kept low compared with the case where the test of the semiconductor device 11 and the inspection of the bump electrodes 12 are performed separately.

Further, when the protruding electrode 12 has a distorted shape instead of a predetermined spherical shape, the forming substrate 16 is pressed by the protruding electrode 12 of the semiconductor device 11 being fitted into the inspection recessed portion 17 to thereby form a protrusion. The outer shape of the electrode 12 can be molded into the shape of the inspection recess 17.

That is, in the semiconductor test apparatus 10, the shape inspection of the protruding electrode 12 and the electrical operation test of the semiconductor device 11 are performed, and the outer shape of the protruding electrode 12 is inspected in the concave portion 1.
It can be molded into a shape suitable for 7. Therefore, the outer shape of the protruding electrode 12 is formed into the shape of the inspection recessed portion 17 in the inspection step, and the defective shape of the protruding electrode 12 can be reduced.

After the test and inspection, the fixing jig 1
3 and the semiconductor device 11 are lifted in the B direction by the lifting operation of the lifting mechanism and separated from the forming substrate 16 held on the stage 20. Fixing jig 13 and semiconductor device 1
When 1 returns to the position shown in FIG. 4, the suction operation of the suction unit 14 is stopped and the semiconductor device 11 is taken out of the semiconductor test apparatus 10 by a handling device (not shown).

FIG. 6 is an exploded vertical sectional view showing a first modification of the measuring terminal 19. In FIG. 6, the measuring terminal 25 is formed on the upper surface of the measuring board 18 at the same height as the wiring layer 20, that is, the same film thickness as the copper layer pattern of the printed wiring layer 20 instead of being projected. ing. A hole 17b having a diameter sufficiently larger than the hole 17a is provided at the center of the bottom of the inspection recess 17 of the forming substrate 16.

Therefore, the projection electrode 12 is formed in the inspection recess 17.
When is fitted, the tip end portion of the spherically formed protruding electrode 12 is connected to the measuring terminal 25 having the same height as the wiring layer 20. Thereby, the electrical operation test of the semiconductor device 11 is performed. In addition, the protruding electrode 12 of the semiconductor device 11 is pressed in a state of being fitted into the inspection recess 17 of the forming substrate 16 to perform the electrical operation test of the semiconductor device 11 and to inspect the shape of the protruding electrode 12. And the projection electrode 12 is formed.

In this case, since the measuring terminal 25 does not project upward from the wiring layer 20, the protruding electrode 12 comes into contact with the flat measuring terminal 25, and damage to the protruding electrode 12 is prevented. FIG. 7 is an exploded vertical sectional view showing a second modification of the measuring terminal 19.

In FIG. 7, the measuring terminal 26 is formed in the shape of a pin having a small diameter, protrudes from the upper surface of the measuring substrate 18, and is provided so as to be movable in the vertical direction. That is, the measuring terminal 26 is a support member 2 supported so as to be vertically movable.
7 are provided. The support member 27 is a coil spring 28 housed in a housing hole 18 a formed in the measurement substrate 18.
The measurement terminal 26 is connected to the wiring layer 20 via a coil spring 28. In addition, the tip of the measurement terminal 26 has a hole 17a in the inspection recess 17 from below.
And is projected into the inspection recess 17.

Therefore, when the projecting electrode 12 is fitted into the inspection recess 17, the end of the projecting electrode 12 abuts on the measuring terminal 26 to be electrically connected, and the measuring terminal 26 is pressed downward. . At that time, the coil spring 28 is compressed and the measurement terminal 26 moves downward, so that the protruding electrode 12 is securely connected to the measurement terminal 26 by the spring force of the coil spring 28, and the impact is relieved by the lowering operation to reduce the measurement terminal. The contact portion with 26 is prevented from being damaged.

FIG. 8 is an exploded vertical sectional view showing the third modification of the measuring terminal 19. In FIG. 8, the measuring terminal 29 has a hole 17 a provided at the center of the bottom of the inspection recess 17.
The conductive coating film 29a is formed on the entire circumference of the peripheral portion of the inspection recessed portion 17 and is deposited on the inner surface of the bottom of the inspection recess 17, and the conductive coating film 29b deposited on the lower surface of the forming substrate 16. Therefore, the measurement terminal 29 is continuously formed on the inner surface of the inspection recess 17 and the lower surface of the forming substrate 16.

Therefore, when the protruding electrode 12 is fitted in the inspection recess 17, the surface of the protruding electrode 12 is brought into contact with the entire surface of the conductive film 29a of the measuring terminal 29 to be connected. Therefore, the bump electrode 12 is connected to the wiring layer 20 via the measurement terminal 29.
Is electrically connected to Further, since the measuring terminal 29 is a thin film, it does not interfere with the fitting operation of the protruding electrode 12,
Moreover, when the protruding electrode 12 is fitted into the inspection recess 17, the surface of the protruding electrode 12 is not damaged.

FIG. 9 is a diagram showing the semiconductor testing apparatus 31 according to the second embodiment of the present invention in a vertically disassembled state. The fixing jig 13 of the semiconductor testing device 31 is provided with a positioning portion 32 on the lower surface for regulating the position for holding the semiconductor device 11. The positioning portion 32 has a triangular cross-section, and has a corner portion 11 a on the outer periphery of the upper surface of the semiconductor device 11.
Has an inclined surface 32a that is in sliding contact with. The inclined surfaces 32a are formed so as to come into contact with the four sides of the outer periphery of the semiconductor device 11 from above.

The semiconductor device 11 may be held in a tilted state when mounted by a handling device (not shown). In that case, during the process in which the fixing jig 13 descends and the protruding electrodes 12 of the semiconductor device 11 are fitted into the inspection recesses 17, the corners 11a of each of the four sides on the outer periphery of the upper surface are slid on the inclined surface 32a of the positioning portion 32. They are guided so that they abut and evenly abut.

Therefore, in the semiconductor device 11, the corner portion 11a on the outer periphery of the upper surface is guided to the center position of the fixing jig 13 while being in sliding contact with the inclined surface 32a of the positioning portion 32, and is in a state parallel to the forming substrate 16. Be positioned at. As a result, each protruding electrode 12 of the semiconductor device 11 is
It is possible to accurately fit the inspection recesses 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved.

FIG. 10 is an exploded view showing a semiconductor testing apparatus 41 according to a third embodiment of the present invention in the vertical direction. The forming board 16 of the semiconductor test apparatus 41 is provided with a positioning portion 42 on the upper surface for regulating the mounting position of the semiconductor device 11. The positioning portion 42 has a trapezoidal cross section, and the corner portion 1 on the outer periphery of the lower surface of the semiconductor device 11 is formed.
It has an inclined surface 42a with which 1b is in sliding contact. This inclined surface 42
The a is formed so as to come into contact with each of the four sides of the outer periphery of the lower surface of the semiconductor device 11 from below.

When the semiconductor device 11 is attracted to the fixing jig 13, it may be held in an inclined state. In that case, in the process in which the fixing jig 13 descends and the protruding electrodes 12 of the semiconductor device 11 are fitted into the inspection recesses 17, the corners of each of the four sides of the outer periphery of the lower surface of the semiconductor device 11 are attached to the inclined surface 42a of the positioning portion 42. The parts 11b are slidably contacted and evenly contacted.

Therefore, in the semiconductor device 11, the corner portion 11b on the outer periphery of the lower surface is guided to the center position of the forming substrate 16 while slidingly contacting the inclined surface 42a of the positioning portion 42.
It is positioned so as to be parallel to the forming substrate 16. Thereby, each protruding electrode 1 of the semiconductor device 11
2 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved.

FIG. 11 is a diagram showing a semiconductor testing apparatus 51 which is a fourth embodiment of the present invention. The semiconductor test equipment 51 is
A positioning mechanism 52 for guiding the lifting operation of the fixing jig 13 holding the semiconductor device 11 to position the mounting position of the semiconductor device 11 is provided. The positioning mechanism 52 includes a guide pin 53 standing upright on the upper surface of the stage 21 and a guide hole 5 provided in the fixing jig 13 and through which the guide pin 53 is inserted.
4 and up.

Further, the positioning mechanism 52 includes the fixing jig 13
Also provided at the four corners of the stage 21 are to guide the raising / lowering operation of the fixing jig 13 so that the semiconductor device 11 moves up and down in a horizontal state, and to position the mounting position of the semiconductor device 11 to the forming substrate 16 at a predetermined position. To do.

As a result, each protruding electrode 12 of the semiconductor device 11 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved. FIG. 12 is a diagram showing a semiconductor testing device 61 which is a fifth embodiment of the present invention.

In the semiconductor testing device 61, a fixing jig side positioning portion 62 for guiding the semiconductor device 11 to a predetermined suction position is provided on the lower surface 13a of the fixing jig 13. The positioning portion 62 has an inclined surface 62a with which a corner portion 11a on the outer periphery of the upper surface of the semiconductor device 11 is in sliding contact. The inclined surfaces 62a are formed so as to come into contact with the four sides of the outer periphery of the semiconductor device 11 from above.

In this embodiment, the lower surface 13a of the fixing jig 13 is used.
Are formed to have the same dimensions as the upper surface of the semiconductor device 11.
Therefore, if the semiconductor device 11 is displaced, the corner portion 11a in the displaced direction rides on the inclined surface 62a.
Then, the semiconductor device 11 is adsorbed and the inclined surface 6
It is displaced so as to come into contact with the lower surface 13a of the fixing jig 13 along 2a.

The semiconductor testing device 61 also has a stage side positioning mechanism 63 for positioning the forming substrate 16 so as to follow the semiconductor device 11. The positioning mechanism 63 includes guide pins 6 that stand on the upper surface of the stage 21.
4 and the guide pins 64 provided on the forming substrate 16
Is formed with a guide hole 65 through which is inserted. The guide pin 64 is also inserted into the hole 18a of the measurement board 18 to position the mounting position of the measurement board 18.

The positioning mechanism 63 is used for the forming substrate 1
6 and the four corners of the stage 21, the forming substrate 16 is biased upward by a coil spring (not shown) or the like to support the forming substrate 16 in a floating state. Further, the positioning mechanism 63 has a guide pin 64.
Is inserted into the guide hole 65 in a loosely fitted state, so that the forming substrate 16 is supported so as to be movable in the horizontal direction.

Here, when the semiconductor device 11 held on the lower surface 13a of the fixing jig 13 descends, each protruding electrode 12 of the semiconductor device 11 causes each of the inspection recesses 1 of the forming substrate 16 to move.
7 is fitted and the shape inspection of the protruding electrode 12 is performed. Further, as the semiconductor device 11 descends, the forming substrate 16 also descends and comes into contact with the upper surface of the measurement substrate 18.

Now, each protruding electrode 12 is connected to the measurement substrate 18
The semiconductor device 11 is connected to each of the measurement terminals 19 provided above and an electrical operation test of the semiconductor device 11 is performed. Further, when the relative position between the forming substrate 16 and the semiconductor device 11 is deviated, the protruding electrodes 12 cannot fit into the inspection recesses 17.
However, in this semiconductor testing device 61, since the guide pin 64 is loosely fitted in the guide hole 65, the forming substrate 16 can be displaced in the horizontal direction. Therefore, as the semiconductor device 11 descends, the forming substrate 16 is displaced to a position where each protruding electrode 12 fits into each inspection recess 17.

As described above, the forming substrate 16 is moved up and down in the horizontal state, and the horizontal position of the forming substrate 16 with respect to the semiconductor device 11 is adjusted so that each protruding electrode 12 is fitted into each inspection recess 17. Operate. As a result, each protruding electrode 12 of the semiconductor device 11 is
It is possible to accurately fit the inspection recesses 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved.

FIG. 13 is a diagram showing a semiconductor testing device 71 which is a sixth embodiment of the present invention. The semiconductor test equipment 71 is
A gel-like cushioning material 72 is fixed to the lower surface 13a of the fixing jig 13. Since the cushioning material 72 formed in a flat plate shape is relatively soft and easily deformed, when a pressing force from the outside acts, that portion is deformed in the pressing direction. Further, when the semiconductor device 11 is removed after the test is completed, the pressing force on the cushioning material 72 is removed, so that the cushioning material 72 returns to the original flat plate shape.

Therefore, when the forming substrate 16 is inclined with respect to the semiconductor device 11 in the process of lowering the semiconductor device 11 attracted to the lower surface 13a of the fixing jig 13, the forming substrate 16 is inclined to the semiconductor device 11. Since the contact is made in the state, the cushioning material 72 is deformed so that the semiconductor device 11 and the forming substrate 16 are parallel to each other.

For example, when the forming substrate 16 is tilted, a force that tilts the semiconductor device 11 attracted to the fixing jig 13 acts. However, the cushioning material 72
The deformation of the semiconductor device 11 causes the semiconductor device 11 to tilt in that direction and follow the forming substrate 16, so that the forming substrate 16
And the semiconductor device 11 are kept parallel to each other.

Therefore, each protruding electrode 1 of the semiconductor device 11 is
2 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved. In addition, the shock when the protruding electrodes 12 are fitted into the inspection recesses 17 is buffered by the buffer material 72, so that the semiconductor device 11 and the forming substrate 16 are prevented from being damaged.

FIG. 14 is a diagram showing a semiconductor testing device 73 which is a seventh embodiment of the present invention. The semiconductor test equipment 73 is
A gel-like cushioning material 7 is formed on the upper surface 16a of the forming substrate 16.
4 is fixed. This buffer material 74 is used for each inspection recess 1
It is formed in a frame shape so as to surround the outside of the portion where 7 is provided, and when a pressing force from the outside acts, that portion is deformed in the pressing direction. Further, when the semiconductor device 11 moves upward and away after the test is completed, the pressing force on the cushioning material 74 is removed, so that the cushioning material 74 returns to its original shape.

For example, when the semiconductor device 11 is tilted and mounted, a force for tilting the forming substrate 16 acts. However, the cushioning material 7 of the pressed portion
Due to the deformation of 4, the semiconductor device 11 tilts in that direction and follows the direction of the forming substrate 16, so that the forming substrate 16 and the semiconductor device 11 are kept parallel to each other.

Therefore, each protruding electrode 1 of the semiconductor device 11 is
2 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved. In addition, the shock when the protruding electrodes 12 are fitted into the inspection recesses 17 is buffered by the buffer material 74, so that the semiconductor device 11 and the forming substrate 16 are prevented from being damaged.

FIG. 15 is a diagram showing a semiconductor testing device 75 according to the eighth embodiment of the present invention. The semiconductor test equipment 75
A gel-like cushioning material 76 is provided between the measurement substrate 18 and the forming substrate 16. The buffer material 76 is formed in a frame shape so as to surround the outside of the portion where each measurement terminal 19 is provided, and when a pressing force from the outside acts,
That part is deformed in the pressing direction. Further, when the semiconductor device 11 is separated upward after the test is completed, the pressing force on the cushioning material 76 is removed, and thus the cushioning material 76 returns to its original shape.

For example, when the semiconductor device 11 is tilted and mounted, a force for tilting the forming substrate 16 acts. However, the cushioning material 7 of the pressed portion
The deformation of 6 causes the forming substrate 16 to tilt in that direction and follow the direction of the semiconductor device 11, so that the forming substrate 16 and the semiconductor device 11 are kept parallel to each other.

Therefore, each protruding electrode 1 of the semiconductor device 11 is
2 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved. Further, since the shock when the protruding electrodes 12 are fitted into the inspection recesses 17 is buffered by the buffer material 76, the semiconductor device 11 and the forming substrate 16 are prevented from being damaged.

FIG. 16 is a diagram showing a semiconductor testing device 77 which is a ninth embodiment of the present invention. The semiconductor test equipment 77
Between the measurement substrate 18 and the stage 21, a gel-like cushioning material 7
8 are provided. This cushioning material 78 is formed in a flat plate shape, and when a pressing force from the outside acts, that portion is deformed in the pressing direction. Further, when the semiconductor device 11 is lifted and separated after the test is completed, the pressing force on the cushioning material 78 is removed, so that the cushioning material 78 returns to its original shape.

For example, when the semiconductor device 11 is mounted while being tilted, a force that tilts the forming substrate 16 and the measuring substrate 18 acts. However, the forming substrate 16 is deformed due to the deformation of the cushioning material 78 in the pressed portion.
Since the measurement substrate 18 tilts in that direction and follows the direction of the semiconductor device 11, the forming substrate 16 and the semiconductor device 11 are kept parallel to each other.

Therefore, each protruding electrode 1 of the semiconductor device 11 is
2 can be accurately fitted into each inspection recess 17 of the forming substrate 16. Therefore, the reliability of the semiconductor device 11 test and the bump electrode 12 test is improved. In addition, the shock when the protruding electrodes 12 are fitted into the inspection recesses 17 is buffered by the buffer material 76, so that the semiconductor device 11, the forming substrate 16, and the measurement substrate 18 are prevented from being damaged.

Further, the forming board 16 is provided with a guide hole 16b into which a guide rod 79 standing upright from the measurement board 18 is inserted. Therefore, the forming substrate 16 is supported by the guide rod 79 so as to be vertically movable in a horizontal state, and is regulated in horizontal movement to be positioned at a predetermined position.

FIG. 17 is a side view showing a semiconductor testing device 80 according to the tenth embodiment of the present invention, and FIG. 18 is a plan view of the semiconductor testing device 80. The semiconductor testing device 80 has a plurality of inspection units 81 (81 ₁ to 8 ₁ ) arranged in an array corresponding to the array of the plurality of protruding electrodes 12 protruding on the lower surface of the semiconductor device 11.
1 _n ) are provided. At the upper end of the inspection unit 81, a measurement terminal 82 facing the protruding electrode 12 is provided. That is, the plurality of measuring terminals 82 are formed by dividing the forming substrate 16 into each protruding electrode 12.

In each inspection unit 81, a spherical inspection recess 83 corresponding to the external shape of the protruding electrode 12 is formed on the upper surface of the measurement terminal 82 as shown in an enlarged view in FIG. Further, since the measuring terminal 82 is made of a conductive material, it is electrically connected to the protruding electrode 12 when the protruding electrode 12 is inserted into the inspection recess 83.

Therefore, when the protruding electrode 12 is fitted into the inspection recess 83, the external shape is inspected and the electrical operation test is performed, so that the test and inspection time can be shortened. Further, the measurement terminal 82 is biased upward by the spring force of the coil spring 85 housed in the housing case 84, and when the protruding electrode 12 is larger than the prescribed size and shape, the coil spring 85 is compressed. Has become. The storage case 84 is formed of an insulating material because the protruding electrodes 12 are arranged close to each other and come into contact with the adjacent storage case 84.

Further, the measuring terminal 82 has a rod 86 extending downward, and the rod 86 is a hollow hole (not shown) of a hollow guide portion 87 supported in the storage case 84.
It is slidably inserted inside. The lower end of the rod 86 penetrates the bottom of the storage case 84 and projects downward.

At the upper end of the storage case 84, the measuring terminal 82
A cushioning material 88 is provided which is in contact with the lower surface of the cushioning pad 88 to reduce the impact of the measuring terminal 82. In this embodiment, each measuring terminal 82
Are individually supported so that they can be moved up and down, the measuring terminal 8 can be used even when the semiconductor device 11 is mounted in an inclined state.
Since each of the two electrodes 2 can be pressed downward to be displaced, the respective protruding electrodes 12 can be fitted into the inspection recesses 83 of the respective measuring terminals 82 regardless of the mounting state of the semiconductor device 11, and the respective protruding electrodes 12 can be fitted. Shape inspection and semiconductor device 11
The electrical operation test of can be performed simultaneously.

FIG. 20 is a side view showing a semiconductor testing device 91 according to the eleventh embodiment of the present invention. Semiconductor test equipment 9
1, the outer circumference of the storage case 84 of each of the inspection units 81 is covered with an insulator 92. Therefore, the storage case 8
4 can be formed of a conductive material.

In this embodiment, after each protruding electrode 12 is fitted in the inspection recess 83 of each measuring terminal 82, each measuring terminal 82 is inserted.
Is pressed by each of the projecting electrodes 12 and moves downward to come into contact with the upper end of the storage case 84. As a result, the respective bump electrodes 12 are electrically connected to each other, and the electrical operation test of the semiconductor device 11 becomes possible.

Further, the appearance shape of each protruding electrode 12 is inspected by fitting each protruding electrode 12 into the inspection recess 83 of each measuring terminal 82, and then each measuring terminal 82 contacts the upper end of the storage case 84. Semiconductor device 1
Since the electrical operation test of No. 1 is performed, the appearance inspection of the protruding electrode 12 and the operation test of the semiconductor device 11 can be performed individually. Therefore, the reliability of the inspection of the bump electrode 12 and the test of the semiconductor device 11 can be improved.

FIG. 21 is an enlarged view showing a main part of a semiconductor testing device according to the twelfth embodiment of the present invention. The present embodiment is characterized in that the projecting terminals 101 are formed on the measuring terminals 100 formed on the measuring board 18. The protruding terminal 101 is a stud bump formed by using, for example, a wire bonding method. In addition, in the present embodiment, the measuring terminal 100 is formed in a flat plate shape, that is, a pattern formed on the measuring substrate 18.

In order to form the protruding terminal 101 by the wire bonding method, first, a so-called nail head portion is formed on the measuring terminal 100 by using a cavity provided in the wire bonding apparatus, and then the cavity is slightly moved up. And then cut the wire. The protruding terminals 101 are formed by such a simple process.

By thus forming the protruding terminal 101 on the upper surface of the measuring terminal 100, the measuring terminal 100 has a structure that substantially protrudes from the measuring substrate 18 to the upper side.
Then, the protruding terminal 101, which is a portion protruding upward from the measurement substrate 18, enters the inspection recessed portion 17, and the protruding electrode 12
Will be connected with. Therefore, it is possible to improve the electrical connectivity between the measurement terminal 100 and the protruding electrode 12 while protecting the measurement terminal 100.

Further, in this embodiment, since the protruding terminal 101 is formed by the stud bump, the protruding terminal 101 can be formed by using the wire bonding technique generally used as the manufacturing technique of the semiconductor device. Therefore, the protruding terminal 1 can be manufactured at low cost and efficiently.
01 can be formed.

Further, the stud bumps usually have small protrusions formed by cutting the wire at the tips thereof, and these small protrusions have a sharp shape. Therefore, the measurement terminal 100 (protruding terminal 101) and the protruding electrode 12 are also formed. The electrical connectivity of can be improved. 22 and 23 show a modification of the twelfth embodiment. FIG. 22 shows the protruding electrode 101A.
Is a structure in which a plurality (three in this modification) of stud bumps are stacked in multiple stages. As shown in the figure, it is possible to stack a plurality of stud bumps, and by stacking a plurality of stud bumps, the protrusion amount of the protruding electrode 101A can be increased.

Therefore, it is possible to provide the protruding electrode 101A having an optimum height for the configuration of the forming substrate 16 used, the diameter dimension of the protruding electrode 12, etc., and to improve the electrical connectivity with the protruding electrode 12. it can. In FIG. 23, the protruding electrode 101B is formed by forming a plurality of stud bumps made of different kinds of metal in multiple stages. This modification has a structure in which stud bumps are laminated in three layers, and the stud bump 1 at the most distal end is formed.
The material of 02a is palladium (Pd), and the material of the other stud bumps 102b and 102c is gold (A).
u).

In this way, the stud bump 1 at the leading edge is
The reason that the material of 02a is palladium (Pd) is that the bump electrodes 12 of the semiconductor device are generally plated with solder, and compatibility with solder is taken into consideration. The material of the other stud bumps 102b and 102c is gold (Au).
The material of the measuring terminal 100 is copper (Cu), and the copper (Cu) and the stud bump 101a at the tip end are selected.
This is in consideration of compatibility with both palladium (Pd) which is a material of.

As described above, a plurality of stud bumps made of different kinds of metal are formed in a plurality of stages to form the protruding electrode 10.
By configuring 1B, it is possible to select the material of the stud bumps 102a arranged at the most distal end that has good compatibility with the protruding electrode 12, and measure the material of the stud bumps 102b and 102c other than the most distal end. It is possible to select a terminal 100 or a terminal which is disposed at the most distal end and has a good compatibility with the stud bump 102a.

As a result, the connectivity between the stud bumps 102a arranged at the leading edge and the projecting electrodes 12, the connectivity between the stud bumps 102a to 102c, and the connectivity between the stud bumps 102c and the measuring terminals 100 are confirmed. Both can be good. FIG. 24 is an enlarged view showing a main part of a semiconductor testing device which is a thirteenth embodiment of the present invention. The present embodiment is characterized in that the roughened surface 106 is formed on the surface portion of the measurement terminal 105 formed on the measurement substrate 18.

The roughened surface 106 is blasted or chemically roughened (for example, immersed in a strong acid) on the surface of the measurement terminal 105 formed by printing on the measurement substrate 18.
It is formed by doing. In this way, the measuring terminal 10
Since the roughened surface 106 formed on the surface portion of No. 5 is in a state where fine irregularities are formed, the surface area thereof becomes large, and when the bump electrode 12 comes into contact with the roughened surface 106, the fine convex portion becomes the bump electrode 1.
Since it is in a state where it bites into 2, the electric connection between the measurement terminal 105 and the protruding electrode 12 can be surely made.

FIG. 25 is an enlarged view showing a main part of a semiconductor test apparatus according to the fourteenth embodiment of the present invention. The present embodiment is characterized in that the dissimilar metal film 107 is formed on the surface portion of the measurement terminal 100 formed on the measurement substrate 18. The dissimilar metal film 107 is a metal film that is a material different from the material of the measurement terminal 100. Specifically, the measurement terminal 100 is copper (Cu), and as the material of the dissimilar metal film 107, for example, palladium (Pd) different from the material of the measurement terminal 100 is selected.

The reason why palladium (Pd) is selected as the material of the dissimilar metal film 107 in this embodiment is the same as that described with reference to FIG. That is, in general, the protruding electrode 12 of the semiconductor device is plated with solder, and palladium (Pd) is selected as a material capable of achieving both compatibility with this solder and compatibility with the measuring terminal 100 made of copper. ing.

As described above, by forming the dissimilar metal film 107 which is compatible with both the measurement terminal 100 and the protruding electrode 12 on the surface of the measurement terminal 100, the measurement terminal 10
0 and the protruding electrode 12 have poor bonding properties, the measurement terminal 100 is formed by the dissimilar metal film 107 interposed therebetween.
It is possible to improve the electrical bondability between the bump electrode 12 and the bump electrode 12. Further, the measuring terminal 100 is made of the dissimilar metal film 1.
Since the structure is covered with 07, the measuring terminal 100 can be protected.

FIG. 26 is an enlarged view of the essential parts of a semiconductor testing device according to the fifteenth embodiment of the present invention. In this embodiment, the inspection recess 1 formed on the forming substrate 16
The shape of 10 is a conical shape. As described above, the shape of the inspection recess 110 formed on the forming substrate 16 is not limited to the hemispherical shape, and may be any other shape as long as the shape inspection can be performed.

Specifically, the inspection recess 110 may have a pyramidal shape other than the conical shape described above.
It should be noted that a hemispherical shape is desirable from the aspect of forming property of the bump electrode 12, and a conical shape or a pyramidal shape is desirable from the surface of forming the inspection recess 110.

Further, in this embodiment, the terminal sheet portion 111 having a flexible measuring terminal structure, and the convex portion 114 located at the lower portion of the terminal sheet portion 111 and facing the inspection concave portion 110 of the forming substrate 16 are provided. And a base 113 on which the

The terminal sheet portion 111 is formed of, for example, a flexible circuit board, and the pattern of the measuring terminals 112 is formed at a predetermined position. In addition, the terminal sheet portion 111 is configured such that the convex portion 114 pushes the measurement terminal 112 upward from the back side thereof when mounted on the base 113. Therefore, the measurement terminal 112
Has a protruding terminal shape as compared with other portions, so that electrical connection with the protruding electrode 12 can be reliably performed.

Since the measuring terminal 112 is formed on the terminal sheet portion 111 having a flexible structure, it is not necessary to dispose the measuring terminal 112 directly on the base 113.
Moreover, since the terminal sheet portion 111 can be formed in accordance with the formation of the flexible circuit board, the terminal sheet portion 111 can be formed easily and inexpensively.

FIG. 27 is an enlarged view showing a main part of a semiconductor test apparatus according to the 16th embodiment of the present invention. In this embodiment, the protruding electrode 12 provided on the semiconductor device 11 and
The method is characterized by a method of positioning with respect to the inspection concave portion 17 formed on the forming substrate 16. Specifically, in this embodiment, a vibration generator 115 is connected to the forming substrate 16, and the vibration generator 11 is connected to the vibration generator 115.
The forming substrate 16 can be vibrated by driving 5.

By vibrating the forming substrate 16, the semiconductor device 11 relatively moves (vibrates) on the forming substrate 16, and the protruding electrode 12 is eventually fitted into the inspection recessed portion 17 formed in the forming substrate 16. Positioned. Therefore, the projection electrode 12 and the inspection recess 17 can be easily and automatically positioned.

FIG. 28 is an enlarged view showing the essential parts of a semiconductor testing apparatus according to the seventeenth embodiment of the present invention. In this embodiment, a suction passage 118 connected to a vacuum suction device (vacuum pump) is formed on the forming substrate 116, and the suction passage 118 has a suction port 117 in the inspection recess 17. There is. Therefore, the vacuum pump is driven and the projection electrode 12 is drawn from the suction port 117 through the suction passage 118.
By sucking the projection electrode 12, the projection electrode 12 is forcibly sucked into the inspection recess 17, and thus the projection electrode 1 is inserted into the inspection recess 17.
2 can be accurately positioned.

FIG. 29 is an enlarged view showing a main part of a semiconductor testing apparatus according to the 18th embodiment of the present invention. The present embodiment is characterized in that the forming substrate 119 is made of a porous material and the forming substrate 119 is connected to a vacuum suction device (vacuum pump).

When the vacuum pump is driven in the above structure, since the forming substrate 119 is made of a porous material, the semiconductor device 11 is sucked by the forming substrate 119 over the entire surface thereof, so that the bump electrodes 12 are inspected for a dented shape. It fits in the recess 17. Therefore, the protruding electrode 12 can be accurately positioned in the inspection recess 17.

FIG. 30 is an enlarged view of the essential parts of a semiconductor testing apparatus according to the nineteenth embodiment of the present invention. The present embodiment is characterized in that a moving device 120 capable of horizontally moving the semiconductor device 11 along the forming substrate 135 is provided, and the semiconductor device 11 can be horizontally moved by the moving device 120.

The moving device 120 has a hook-shaped claw portion 120a at its tip, and the claw portion 120a is configured to engage with one side surface of the semiconductor device 11. Therefore, by moving the moving device 120 in the direction of the arrow shown in the figure, the semiconductor device 11 also moves in the same direction.

In this way, the semiconductor device 11 can be urged to move by the moving device 120, so that the protruding electrode 12 will soon move into the inspection recess 130 formed on the forming substrate 135 as the semiconductor device 11 moves. It will be inserted and positioned. Therefore, the positioning process of the protruding electrode 12 and the inspection recess 130 can be performed easily and reliably.

On the other hand, the inspection recess 130 according to this embodiment is
It is formed by first and second inclined surfaces having different slopes. Then, the first inclined surface having a gentle slope is formed on the protruding electrode 1
2 is used as a guide surface 131, and the steeply inclined second inclined surface is used as a locking surface 132 for locking the protruding electrode 12. Further, a positioning surface 133 for positioning the protruding electrode 12 is formed between the guide surface 131 and the locking surface 132.

Therefore, when the moving device 120 causes the protruding electrode 12 formed on the semiconductor device 11 to reach the formation position of the inspection recess 130, the protruding electrode 12 is first guided by the guide surface 131 and advances, and then the locking surface 132. Is locked and positioned. Then, while being locked by the locking surface 132, it moves downward and fits into the positioning surface 133.

As described above, the guide surface 13 is formed in the inspection recess 130.
By forming the locking surface 132 and the positioning surface 133, the projection electrode 12 and the inspection recess 13 can be easily and reliably formed.
Positioning processing with 0 can be performed. FIG. 31 is an enlarged view showing a main part of a semiconductor test device which is a twentieth embodiment of the present invention. Inspection recess 130 used in this embodiment
Is formed between the guide surface 131 that guides the protruding electrode 12, the locking surface 132 that locks the protruding electrode 12, and the guide surface 131 and the locking surface 132, as in the nineteenth embodiment. Positioning surface 13 for positioning protruding electrode 12
3 is included.

However, in this embodiment, the semiconductor substrate 11 is not moved and biased by using the moving device 120 as in the nineteenth embodiment, but the forming substrate 135 is tilted (in FIG. 31A, the angle θ is tilted). By showing the state), the semiconductor device 11 is configured to be urged to move by gravity.

In the above structure, in order to position the protruding electrode 12 and the inspection recess 130, the semiconductor device 11 is placed on the forming substrate 135 and then the forming substrate 135 is tilted. As a result, the semiconductor device 11 moves on the forming substrate 135 by its own weight, and the protruding electrode 12 reaches the formation position of the inspection recess 130.

Then, first, as shown in FIG. 31A, the protruding electrode 12 is guided by the guide surface 131 and advances.
Then, as shown in FIG.
Is locked by the locking surface 132 and positioned. And
As shown in FIG. 31C, the protruding electrode 12 moves downward in a state of being locked by the locking surface 132 and fits into the positioning surface 133.

As described above, the guide surface 13 is formed in the inspection recess 130.
By forming the locking surface 132 and the positioning surface 133, the projection electrode 12 and the inspection recess 13 can be easily and reliably formed.
Positioning processing with 0 can be performed. In particular, the first
Since the protruding electrode 12 can be positioned in the inspection recess 130 without using the moving device 120 as in the ninth embodiment, the configuration of the semiconductor inspection device can be simplified.

FIG. 32 is an enlarged view showing a main part of a semiconductor testing device according to the 21st embodiment of the present invention. In this embodiment, the second concave portions 138, 13 are formed at positions facing the measuring terminals 100 (not shown in the figure) of the forming substrate 136.
9 is formed.

The second recesses 138 and 139 are formed at positions facing the formation position of the inspection recess 17 (first recess), and the shape thereof is rectangular as shown in FIG. 32 (A). It may be a disk-shaped concave portion, or may have a shape (hemispherical shape, conical shape, triangular pyramid shape, etc.) substantially the same as the shape of the inspection concave portion 17 as shown in FIG.

As described above, the second concave portions 138, 13 are formed on the forming substrate 136 at positions facing the measuring terminals 100.
By forming 9 in the state where the protruding electrode 12 is fitted in the forming substrate 136 (inspection recess 17),
The protruding electrode 12 exposed at the bottom of the forming substrate 136
The surface area of can be set wide.

As described above, since the surface area of the protruding electrode 12 exposed from the forming substrate 136 is increased,
The electrical connection between the measurement terminal 100 and the protruding electrode 12 can be surely made. FIG. 35 shows a semiconductor test apparatus which is the 24th embodiment of the present invention, and FIG. 36 shows a semiconductor test apparatus which is the 25th embodiment of the present invention. The twenty-fourth and twenty-fifth embodiments are the semiconductor device 1
1 is provided with a semiconductor positioning mechanism for positioning the 1 and the forming substrate 16.

The substrate positioning mechanism according to the twenty-fourth embodiment shown in FIG. 35 is composed of a positioning pin 145 provided upright on the semiconductor device 11 and a positioning hole 146 formed in the forming substrate 16. . Then, the positioning pins 145 are inserted into the positioning holes 146 and mounted on the forming substrate 16 of the semiconductor device 11, so that the protruding electrodes 12 formed on the semiconductor device 11 are accurately aligned with the inspection recesses 17 formed on the forming substrate 16. It is configured to match well.

Therefore, by simply positioning and mounting the semiconductor device 11 and the forming substrate 16 so that the positioning hole 146 and the positioning pin 145 are engaged with each other,
The projection electrode 12 and the inspection recess 17 can be accurately positioned. On the other hand, the substrate positioning mechanism according to the twenty-fifth embodiment shown in FIG. 36 includes a positioning groove 148 formed in the semiconductor device 11 and a positioning pin 147 standingly formed in the forming substrate 16. Then, the semiconductor device 11 is formed so that the positioning pin 147 is inserted into the positioning groove 148.
The projection electrode 12 formed on the semiconductor device 11 is configured to be accurately aligned with the inspection recessed portion 17 formed on the forming substrate 16 by being mounted on the forming substrate 16.

Therefore, by simply positioning and mounting the semiconductor device 11 and the forming substrate 16 so that the positioning pin 147 and the positioning groove 148 are engaged with each other,
The projection electrode 12 and the inspection recess 17 can be accurately positioned. 37 and 38 show a semiconductor device and a method of manufacturing the same according to the present invention. First, FIG.
7 will be described. FIG. 37 (A) shows a state in which the semiconductor device 11 provided with the spherical protruding electrodes 12 is mounted on a semiconductor test device (only the forming substrate 150 of the semiconductor test device is shown in the figure).

The forming substrate 150 is formed with a conical shaping recess 151. Semiconductor device 1
When 1 is mounted on the semiconductor test apparatus, the spherical projection electrode 12 provided on the semiconductor device 11 is located inside the conical recess 151.

In this state, the semiconductor device 11 is pressed toward the forming substrate 150. As a result, the protruding electrode 12 is pressed against the shaping recess 151, and the shaping recess 1
It is shaped into a shape corresponding to the shape of 51 (the shaped protruding electrode 12 is referred to as a shaped protruding electrode 152). That is, the shaping protrusion electrode 152 has an electrode shape having a conical shape corresponding to the shape of the shaping recess 151. FIG. 37B shows the semiconductor device 11 in which the shaping protrusion electrode 152 having a conical shape is formed.

As described above, by shaping the shaping protrusion electrode 152 into a conical shape, the shaping protrusion electrode 152 has a sharp tip. Therefore, this shaped protrusion electrode 152
When the semiconductor device 11 having the above is mounted on a mounting substrate (not shown), first, the sharp tip end of the shaping protrusion electrode 152 contacts the mounting substrate, and the pressing force is concentrated on this portion. Therefore, at the time of mounting, the shaping protrusion electrode 152 is melted from the tip end portion and bonded to the mounting substrate, so that the mounting process can be performed efficiently and reliably.

On the other hand, FIG. 38 shows another embodiment of the semiconductor device and the manufacturing method thereof according to the present invention. The forming substrate 155 used in this embodiment has a shaping hole 156 having a circular cross section. The diameter of the shaping hole 156 is set smaller than the diameter of the spherical projection electrode 12. Further, when the semiconductor device 11 is mounted on the semiconductor test apparatus, the spherical protruding electrode 12 provided on the semiconductor device 11 is located above the shaping hole 156.

In this state, the semiconductor device 11 is pressed toward the forming substrate 155. As a result, the protruding electrode 12 is forcibly inserted into the shaping hole 156 and shaped into a shape corresponding to the shape of the shaping hole 156 (the shaped protruding electrode 12 is referred to as a shaping protruding electrode 157).

That is, the shaping protrusion electrode 157 has the shaping hole 15
The electrode shape has a cylindrical shape corresponding to the shape of No. 6.
FIG. 38B shows a shaped protrusion electrode 157 having a cylindrical shape.
1 shows a semiconductor device 11 in which the is formed. As described above, by shaping the shaping protrusion electrode 157 into a cylindrical shape, the tip of the shaping protrusion electrode 157 has a flat shape, and thus the contact area with the mounting substrate is wide, so that reliable mounting processing can be performed. Becomes

As described above, according to the present embodiment, the protruding electrodes 12 form the forming substrate 1 which constitutes the semiconductor testing device.
The shaping recess 151 or the formation hole 1 is pressed against the shaping recess 151 or the formation hole 156 formed in the holes 50 and 155.
The shape is shaped according to the shape of 56. As a result, it becomes possible to shape the spherical special electrode 12 arranged in the semiconductor device 11 into the shaped protrusion electrodes 152, 157 having a shape other than the spherical shape by the semiconductor test device, and thus the shaped protrusion electrodes 152, 157. The shape of 157 is the semiconductor device 11
It is possible to make the shape suitable for the mounting mode.

The shape of the shaping protrusion electrode is not limited to the conical shape and the columnar shape described above, and can be set to an arbitrary shape by appropriately setting the shape of the shaping recess formed on the forming substrate. it can. Further, in each of the above-described embodiments, the shaping recess formed on the forming substrate is configured to engage with the entire circumference of the protruding electrode. However, the width dimension of the forming substrate is set to be narrower than the diameter of the protruding electrode, and the shaping recess is formed. May engage with a part of the outer circumference of the protruding electrode.

[0183]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, since each of the plurality of protruding electrodes is fitted into the recess of the substrate to electrically connect the end of the protruding electrode to the measurement terminal, the shape of each protruding electrode is changed to the recess. It is possible to inspect the semiconductor under test by connecting with the measurement terminal, and it is possible to perform an electrical test of the semiconductor under test.

Therefore, the test of the semiconductor under test and the inspection of the bump electrodes can be performed at the same time, and the reliability of the inspection process can be improved and the test and inspection time can be shortened. Therefore, the automation of the inspection process can be promoted and the inspection cost can be reduced.

According to the second aspect of the invention, since the plurality of protruding electrodes are fitted into the recesses of the substrate to form the protruding electrodes and to inspect the shape of the protruding electrodes, the shape of the protruding electrodes is determined. Even if they are different from each other, the shape is formed so as to match the concave portion of the substrate, and the defective shape of the protruding electrode can be reduced.

Therefore, by pressing the protruding electrode while it is fitted in the concave portion of the substrate, an electrical operation test can be performed, and at the same time, the shape inspection of the protruding electrode and the molding of the protruding electrode can be performed. It is possible to shorten the inspection time and reduce the defect rate. In the invention according to claim 3, the plurality of protruding electrodes are fitted into the recesses of the substrate to inspect the shape of the protruding electrodes, and at the same time, the ends of the protruding electrodes are electrically connected to the measurement terminals. Since the electrical operation test is performed, the step of inspecting the protruding electrode is completed in one step, and the inspection time of the protruding electrode can be significantly shortened. Therefore, it is possible to improve the inspection efficiency in the inspection process and reduce the inspection cost.

Further, according to the invention described in claim 4, since the aligning mechanism for adjusting the position is provided so as to keep the semiconductor under test and the substrate in parallel, the same effect as in claim 1 can be obtained. At the same time, even if the semiconductor under test is mounted in an inclined state, each of the plurality of protruding electrodes can be accurately fitted into the recess, and the semiconductor under test or the substrate can be prevented from being damaged. As a result, the reliability of the test of the semiconductor under test and the inspection of the bump electrode can be further improved.

Further, according to the invention of claim 5, the relative position of the semiconductor under test and the substrate is regulated by the positioning mechanism so that the relative positions of the protruding electrode and the concave portion coincide with each other. The same effect can be obtained, and each of the plurality of protruding electrodes can be accurately fitted into the recess, and the reliability of the test of the semiconductor under test and the inspection of the protruding electrode can be further improved.

According to the sixth aspect of the present invention, the substrate is provided in a floating state, and each of the plurality of protruding electrodes fits into the recess of the substrate, so that the relative positions of the protruding electrode and the recess match. Since the position of the substrate with respect to the semiconductor under test is positioned as described above, it is possible to accurately fit each of the plurality of protruding electrodes into the recess, and improve the reliability of the test of the semiconductor under test and the inspection of the protruding electrodes. it can.

According to the invention of claim 7, the measuring electrode is moved downward by fitting the protruding electrode into the concave portion of the substrate, and the protruding electrode is connected to the measuring terminal.
In addition to the same effect as the above-mentioned claim 1, even if the semiconductor under test is mounted in a tilted state, each measuring terminal can be individually moved up and down to test the semiconductor under test and inspect the protruding electrodes. . Therefore, the test of the semiconductor under test and the inspection of the bump electrode can be stably performed regardless of the mounted state of the semiconductor under test.

According to the eighth aspect of the present invention, each bump electrode can be fitted into the recess in a state where the substrate and the semiconductor under test are parallel to each other due to the elastic deformation of the cushioning material, and the bump electrode can be fitted to the substrate. It is possible to absorb the shock generated when fitting it into the concave portion by the buffer material and prevent the semiconductor under test or the substrate from being damaged.

According to the ninth aspect of the present invention, it is possible to prevent an unnecessary load from being applied to the protruding electrodes, and it is possible to suppress deformation of the protruding electrodes. Further, according to the invention described in claim 10, the tip portion of the measurement terminal has a projecting structure, and the connectivity with the bump electrode provided on the semiconductor under test can be improved.

According to the eleventh aspect of the present invention, the protruding terminals can be formed by using the wire bonding technique generally used as a semiconductor device manufacturing technique, and therefore, the production cost is low and the production efficiency is high. A protruding terminal can be formed. In addition, a stud bump usually has a small projection formed by cutting a wire at its tip, and this small projection has a sharp shape similar to the tip of the probe, which also improves the connectivity between the measurement terminal and the projection electrode. be able to.

According to the twelfth aspect of the invention, it is possible to select the material of the protruding electrode provided at the most distal end portion so as to have a good compatibility with the protruding electrode, and to make the protruding portion other than the most distal end portion. The material of the terminal can be selected as a measuring terminal or a material which is arranged at the most distal end and has a good compatibility with the protruding terminal. Therefore, the connectivity between the protruding terminals and the protruding electrodes disposed at the most distal end, the connectivity between the protruding terminals, and the connectivity between the protruding terminals and the measurement terminals should be good. You can

Further, according to the invention of claim 13, the roughened surface is in a state where fine irregularities are formed and the surface area thereof is large, and the fine convex portions are in a state of biting into the protruding electrode. The electrical connection between the terminal and the protruding electrode can be surely made. Further, according to the invention of claim 14, even if the materials for the measuring terminal and the protruding electrode have poor bonding properties, a material having good bonding properties for both the measuring terminal and the protruding electrode is selected as the dissimilar metal film. It is possible to improve the electrical connection between the measurement terminal and the protruding electrode, and protect and protect the measurement terminal.

Further, as in the invention of claim 15, the shape of the recess formed in the substrate may be any of a hemispherical shape, a conical shape, and a pyramid shape capable of inspecting the shape of the protruding electrode. Is. A hemispherical shape is desirable from the aspect of forming property of the protruding electrode, and a conical shape or a pyramidal shape is desirable from the surface of forming the concave portion.

According to the sixteenth aspect of the present invention, since the convex portion pushes out the terminal sheet portion to form the measuring terminal, the measuring terminal has a protruding terminal shape, so The electrical connection can be surely made. Further, since the measuring terminals are formed on the terminal sheet having a flexible structure, it is not necessary to print the measuring terminals on the base, and the terminal sheet can be formed in accordance with the formation of the flexible circuit board. Therefore, it can be formed easily and inexpensively.

According to the seventeenth aspect of the present invention, since the second recess is formed at the position facing the measurement terminal of the substrate, the protruding electrode is exposed to the lower portion of the substrate when fitted to the substrate. The surface area of the protruding electrode can be set wide, and the measurement terminal and the protruding electrode can be reliably connected.

According to the eighteenth aspect of the invention, since the board positioning mechanism is provided, the board and the measurement board on which the measurement terminals are formed can be positioned with high accuracy. According to the nineteenth aspect of the invention, since the semiconductor positioning mechanism is provided, the substrate and the semiconductor under test can be positioned with high accuracy.

According to the twentieth aspect of the present invention, it becomes possible to simultaneously test the semiconductor under test and inspect the protruding electrode, and improve the reliability in the inspection process and the test.
The inspection time can be shortened, so that the automation of the inspection process can be promoted and the inspection cost can be reduced.

According to the twenty-first aspect of the invention, by vibrating at least one of the substrate and the semiconductor under test, the semiconductor under test moves relatively on the substrate and eventually becomes a recess formed in the substrate. Since the protruding electrode is fitted and positioned, the protruding electrode and the recess can be easily and automatically positioned.

Further, according to the twenty-second and twenty-third aspects of the present invention, the projection electrode is sucked by the vacuum suction device, and the projection electrode is positioned in the recess formed in the substrate, so that the projection electrode is surely recessed. It can be fitted inside. According to the twenty-fourth aspect of the present invention, a moving device capable of horizontally moving the semiconductor under test is provided along the substrate, and the semiconductor under test is horizontally moved by the moving device, so that the semiconductor under test moves. Since the protruding electrode is fitted into the recess and positioned, the positioning process of the protruding electrode and the recess can be performed easily and reliably.

According to the twenty-fifth aspect of the present invention, the projection electrode fitted in the recess is guided by the guide surface by fitting and positioning the projection electrode in the recess based on the difference in slope between the first and second inclined surfaces. Since it is guided by the inclined surface that functions as and is positioned by being locked by the inclined surface that functions as the locking surface, it is possible to easily and reliably perform the positioning process of the protruding electrode and the recess.

According to the twenty-sixth aspect of the present invention, the protruding electrode is pressed against the concave portion formed in the substrate constituting the semiconductor testing device and shaped into a shape conforming to the shape of the concave portion, thereby forming a spherical shape. It is possible to form the projection electrode in a shape other than the above, and thus the shape of the protruding electrode can be made a shape suitable for the mounting mode of the semiconductor device.

Furthermore, according to the twenty-seventh aspect of the present invention, when the projection electrode has a conical shape, the tip of the projection electrode is sharp, and the pressing force is concentrated on this tip. When the semiconductor device having the electrodes is mounted on the mounting substrate, the protruding electrode is melted from the tip portion and bonded to the mounting substrate, so that the mounting process can be performed efficiently and reliably.

Further, when the shape of the protruding electrode is cylindrical, the tip of the protruding electrode is flat and the contact area with the mounting substrate is wide, so that reliable mounting processing can be performed.

[Brief description of drawings]

FIG. 1 is a semiconductor test device 10 according to a first embodiment of the present invention.
It is a block diagram which decomposes | disassembles and shows in the up-down direction.

FIG. 2 is an enlarged vertical cross-sectional view showing an inspection recess and a measurement terminal of a forming substrate.

FIG. 3 is an enlarged vertical cross-sectional view showing a state in which a protruding electrode of a semiconductor device is fitted in an inspection recess.

FIG. 4 is a diagram for explaining a state in which a semiconductor device is mounted on a fixing jig of the semiconductor test device 10 of the first embodiment.

FIG. 5 is a diagram for explaining the operation when inspecting the protruding electrodes and testing the semiconductor device using the semiconductor testing device of the first embodiment.

FIG. 6 is a longitudinal sectional view showing an exploded first modified example of the measuring terminal.

FIG. 7 is a vertical cross-sectional view showing an exploded second modification of the measuring terminal.

FIG. 8 is an exploded vertical sectional view showing a third modification of the measuring terminal.

FIG. 9 is a configuration diagram showing a semiconductor test apparatus, which is a second embodiment of the present invention, exploded in the vertical direction.

FIG. 10 is a configuration diagram showing a semiconductor testing device, which is a third embodiment of the present invention, in an exploded vertical direction.

FIG. 11 is a configuration diagram showing a semiconductor test device which is a fourth embodiment of the present invention.

FIG. 12 is a configuration diagram showing a semiconductor test apparatus which is a fifth embodiment of the present invention.

FIG. 13 is a configuration diagram showing a semiconductor test apparatus which is a sixth embodiment of the present invention.

FIG. 14 is a configuration diagram showing a semiconductor test device which is a seventh embodiment of the present invention.

FIG. 15 is a configuration diagram showing a semiconductor test device which is an eighth embodiment of the present invention.

FIG. 16 is a configuration diagram showing a semiconductor test device which is a ninth embodiment of the present invention.

FIG. 17 is a configuration diagram showing a semiconductor test device which is a tenth embodiment of the present invention.

FIG. 18 is a plan view showing a state in which each inspection unit of the semiconductor test device according to the tenth embodiment of the present invention is provided in a predetermined array.

FIG. 19 is an enlarged longitudinal sectional view showing an inspection unit of a semiconductor test device which is a tenth embodiment of the present invention.

FIG. 20 is a configuration diagram showing a semiconductor test device which is an eleventh embodiment of the present invention.

FIG. 21 is an enlarged view showing a main part of a semiconductor testing device according to a twelfth embodiment of the present invention.

FIG. 22 is an enlarged view showing a main part of a modified example of the semiconductor testing device according to the twelfth embodiment of the present invention.

FIG. 23 is an enlarged view showing a main part of a modified example of the semiconductor test device according to the twelfth embodiment of the present invention.

FIG. 24 is an enlarged view showing a main part of a semiconductor testing device according to a thirteenth embodiment of the present invention.

FIG. 25 is an enlarged view showing a main part of a semiconductor test device which is a fourteenth embodiment of the present invention.

FIG. 26 is an enlarged view showing a main part of a semiconductor test device which is a fifteenth embodiment of the present invention.

FIG. 27 is an enlarged view showing a main part of a semiconductor test device which is a sixteenth embodiment of the present invention.

FIG. 28 is an enlarged view showing a main part of a semiconductor test device which is a seventeenth embodiment of the present invention.

FIG. 29 is an enlarged view showing a main part of a semiconductor testing device according to an eighteenth embodiment of the present invention.

FIG. 30 is an enlarged view showing a main part of a semiconductor testing device according to a nineteenth embodiment of the present invention.

FIG. 31 is an enlarged view showing a main part of a semiconductor test device which is a twentieth embodiment of the present invention.

FIG. 32 is an enlarged view showing a main part of a semiconductor test device which is a twenty-first embodiment of the present invention.

FIG. 33 is an enlarged view showing a main part of a semiconductor test device which is a 22nd embodiment of the present invention.

FIG. 34 is an enlarged view showing a main part of a semiconductor testing device which is a 23rd embodiment of the present invention.

FIG. 35 is an enlarged view showing a main part of a semiconductor test device which is a twenty-fourth embodiment of the present invention.

FIG. 36 is an enlarged view showing a main part of a semiconductor test device which is a twenty-fifth embodiment of the present invention.

FIG. 37 is a drawing for explaining the semiconductor device and the manufacturing method thereof according to the embodiment of the present invention.

FIG. 38 is a drawing for explaining the semiconductor device and the manufacturing method thereof according to another embodiment of the present invention.

[Explanation of symbols]

10, 31, 41, 51, 61, 71, 73, 75, 7
7, 80, 91 Semiconductor test device 11 Semiconductor device 12 (12 _{1 to} 12 _n ) Projection electrode 13 Fixing jig 14 Adsorption part 15, 23 Aligning mechanism 16, 116, 119, 135-137, 150, 15
5 forming substrate _{17 (17 1 ~17 n),} 110,130 inspection recess 18 measured substrate _{19 (19 1 ~19 n),} 25,26,29,100,
105,112 Measuring terminal 20 Wiring layer 21 Stage 29a, 29b Conductive film 32,42 Positioning part 52 Positioning mechanism 53,64 Guide pin 54,65 Guide hole 62 Fixing jig side positioning part 63 Stage side positioning mechanism 72,74, 76, 78 Buffer material 81 (81 _{1 to} 81 _n ) Inspection unit 82 Measurement terminal 83 Inspection recess 84 Storage case 85 Coil spring 86 Rod 87 Guide portion 88 Buffer material 92 Insulator 101, 101A, 101B Projection terminal 102a to 102c Stud bump 106 roughened surface 107 dissimilar metal 111 terminal sheet portion 113 base 114 convex portion 115 vibration generator 117 suction port 118 suction passage 120 moving device 131 guide surface 132 locking surface 133 positioning surface 138, 139 second concave portion 140 measurement substrate 1 1,143,145,147 positioning pins 142, 146 positioning holes 144, 148 positioning groove 151 shaped recesses 152,157 shaping protruding electrodes 156 shaped hole

Claims (27)

[Claims] 1. A semiconductor having a structure in which a semiconductor under test having a plurality of projecting electrodes is mounted on one surface, and a test terminal is tested by contacting and electrically connecting a measuring terminal to the projecting electrodes. In the test apparatus, a substrate is provided so as to face one surface of the semiconductor under test, a recess having a shape corresponding to the protruding electrode is provided on the substrate, and each of the plurality of protruding electrodes is fitted into the recess of the substrate. Thus, the semiconductor test apparatus is configured such that an end portion of the protruding electrode is electrically connected to the measurement terminal to perform an electrical operation test. 2. The semiconductor test apparatus according to claim 1, wherein each of the plurality of projecting electrodes is fitted into a recess of the substrate to form the projecting electrode and to inspect the shape of the projecting electrode. Semiconductor test equipment characterized by. 3. The semiconductor testing apparatus according to claim 1, wherein each of the plurality of projecting electrodes is fitted into a recess of the substrate to inspect the shape of the projecting electrode, and at the same time, an end of the projecting electrode. A semiconductor testing device, wherein a part is electrically connected to the measurement terminal to perform an electrical operation test. 4. The semiconductor test apparatus according to claim 1, further comprising a centering mechanism for performing position adjustment so that the semiconductor under test and the substrate are kept parallel to each other. Semiconductor test equipment. 5. The semiconductor testing device according to claim 1, wherein the relative position between the semiconductor under test and the substrate is regulated so that the relative positions of the protruding electrode and the recess match. A semiconductor test apparatus, which is provided with a positioning mechanism for 6. The semiconductor test apparatus according to claim 1, wherein the substrate is provided in a floating state, and each of the plurality of protruding electrodes is provided in a recess of the substrate. The semiconductor test apparatus is characterized in that the position of the substrate with respect to the semiconductor under test is positioned such that the relative positions of the protruding electrode and the recess coincide with each other by fitting. 7. The semiconductor test apparatus according to claim 1, wherein the measurement terminal is provided so as to be vertically movable, and the projection electrode is fitted into a recess of the substrate so that the measurement terminal is A semiconductor test apparatus, characterized in that it is moved downward and the protruding electrode is connected to the measuring terminal. 8. The semiconductor test apparatus according to claim 1, wherein the semiconductor under test is provided between the semiconductor under test and a fixture for supporting the semiconductor under test, or the semiconductor under test and the substrate. A semiconductor test apparatus, wherein a buffer material having elasticity is provided either between or between the substrate and the measurement substrate on which the measurement terminals are formed. 9. The semiconductor test apparatus according to claim 1, wherein a clearance between the semiconductor under test and the substrate is kept constant between the semiconductor under test and the substrate. A semiconductor testing device characterized by having a spacer. 10. The semiconductor test device according to claim 1, wherein a protruding terminal is formed at a tip portion of the measuring terminal. 11. The semiconductor test apparatus according to claim 10, wherein the protruding terminals are formed by stud bumps. 12. The semiconductor testing device according to claim 10 or 11, wherein the protruding terminal has a structure in which a plurality of stud bumps made of the same or different metals are formed in multiple stages. Characteristic semiconductor test equipment. 13. The semiconductor test device according to claim 1, wherein a roughened surface is formed on a surface portion of the measurement terminal. 14. The semiconductor test apparatus according to claim 1, wherein a dissimilar metal film made of a material different from a material of the measurement terminal is formed on a surface portion of the measurement terminal. Semiconductor test equipment. 15. The semiconductor testing device according to claim 1, wherein the recess formed in the substrate has one of a hemispherical shape, a conical shape, and a pyramidal shape. Semiconductor test equipment characterized by the above. 16. The semiconductor test apparatus according to claim 1, wherein the measurement terminal has a terminal sheet having a flexible structure, and the recessed portion of the substrate is located below the terminal sheet. A semiconductor test apparatus, comprising: a base having convex portions formed at opposing positions, wherein the convex portions push out the terminal sheet portion to form measuring terminals. 17. The semiconductor test device according to claim 1, wherein a second recess is formed at a position facing the measurement terminal of the substrate. 18. The semiconductor test apparatus according to claim 1, further comprising a substrate positioning mechanism that positions the substrate and the measurement substrate on which the measurement terminals are formed. Semiconductor test equipment. 19. The semiconductor test apparatus according to claim 1, further comprising a semiconductor positioning mechanism that positions the substrate and the semiconductor under test. 20. A semiconductor having a structure in which a semiconductor under test having a plurality of projecting electrodes is mounted on one surface, and a test of the semiconductor under test is performed by bringing a measuring terminal into contact with the projecting electrodes and electrically connecting them. In the test method of the test apparatus, the shape of each protruding electrode is tested by fitting the plurality of protruding electrodes into the recess of the substrate provided so as to face one surface of the semiconductor under test, and the end of the protruding electrode is also tested. A method for testing a semiconductor testing device, wherein a portion of the semiconductor device under test is electrically connected to the measuring terminal provided in the recess. 21. The test method for a semiconductor test apparatus according to claim 20, wherein the protruding electrode is positioned in a recess formed in the substrate by vibrating at least one of the substrate and the semiconductor under test. A method for testing a semiconductor testing device, characterized by: 22. The test method for a semiconductor test device according to claim 20, wherein a suction hole connected to a vacuum suction device is formed in the substrate, and the projection electrode is suctioned by the suction hole, A test method for a semiconductor test apparatus, wherein the protruding electrode is positioned in a recess formed in the substrate. 23. The test method for a semiconductor testing device according to claim 20, wherein the substrate is formed of a porous material, the substrate is connected to a vacuum suction device, and the protruding electrode is sucked onto the substrate. A test method for a semiconductor test apparatus, wherein the protruding electrode is positioned in a recess formed in the substrate. 24. The test method for a semiconductor test device according to claim 20, further comprising a moving device capable of horizontally moving the semiconductor under test along the substrate, and horizontally moving the semiconductor under test by the moving device. Thus, the test method of the semiconductor test apparatus, wherein the protruding electrode is fitted into the recess and positioned. 25. The test method for a semiconductor testing device according to claim 20, wherein first and second inclined surfaces having different slopes are formed in the recess, and a difference in slope between the first and second inclined surfaces is formed. A test method for a semiconductor test apparatus, characterized in that the protruding electrode is fitted and positioned in the recess based on the above. 26. The semiconductor element has a protruding electrode,
In a semiconductor device in which a predetermined electrical operation test is carried out by being mounted on a semiconductor test device having a substrate in which a recess corresponding to the protruding electrode is formed, the protruding electrode is pressed against the recess formed in the substrate. As a result, the semiconductor device is shaped into a shape that conforms to the shape of the recess. 27. The semiconductor device according to claim 26, wherein the shape of the protruding electrode is a conical shape or a cylindrical shape.