JP2010276621A - Test device and test method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a test device for a semiconductor device capable of carrying out a test, while any one of two or more semiconductor devices is pressed onto a contactor from the back side, and to provide a test method. <P>SOLUTION: The two or more semiconductor devices 20 are aligned on a support substrate 21 and held. The support substrate 21 is placed and fixed on a stage 22 having a space opened toward the contactor 24 inside. A pressing head 25 is arranged in a space inside the stage 22. The support substrate 21 has recessed parts for exposing respective back faces 20b of the two or more semiconductor devices 20 toward the space of the stage 22 and holding them. The stage 22 can be moved in the horizontal direction, and the pressing head 25 can be moved in the vertical direction. The pressing head 25 has a pressing surface 25a for pressing a semiconductor device to be tested, and positioning guides 25b for arranging the semiconductor device to be tested at a predetermined position in the recessed part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a test apparatus and a test method for a semiconductor device, and more particularly to a test apparatus and a test method for performing a characteristic test of a semiconductor device while electrically conducting the semiconductor device.

  In recent years, with an increase in current consumption and an increase in power consumption of semiconductor integrated circuit devices (hereinafter referred to as semiconductor devices) such as MPU (Micro Processing Unit) for high-end servers and CPU (Central Processing Unit) for personal computers, In the characteristic test of a semiconductor device, it is necessary to control the temperature by cooling or heating the semiconductor device.

In an SiP (System in Package) that configures a system by housing a plurality of semiconductor devices in one exterior package (container), another semiconductor device is mounted on the back surface of one semiconductor device. There is a PoP (Package on Package) that constitutes a package.
In a semiconductor device having a PoP structure, an external terminal for electrical connection to the outside is provided even in the second semiconductor device mounted on the back surface of the first semiconductor device. Along with the characteristic test using the external connection terminal of the device, the characteristic test is also performed on the second semiconductor device on the back using the external connection terminal.

In recent years, in order to realize portable electronic devices such as mobile phones, digital still cameras, digital video cameras, notebook computers, and PDAs (Personal Digital Assistants), further downsizing of semiconductor devices has been required.
For this reason, in CSP (Chip Size Non-Lead Package) such as FBGA (Fine-pitch Ball Grid Array), FLGA (Fine-pitch Land Grid Array), and QFN (Chip Size Non-Lead Package), the size is further reduced. The pitch is being promoted.
As described above, since the form of the package of the semiconductor device is diversifying, it is necessary to prepare more kinds of jigs and tools in the manufacturing process and the characteristic test process.

  There has been proposed a method in which aligned flat packages are positioned and brought into contact with a probe board by a stage mechanism, a tray is fed forward, and a measurement test is performed at a predetermined position (see, for example, Patent Document 1).

  In this method, “an IC tray having an IC storage opening provided with an alignment mechanism, a stage mechanism for controlling movement of the IC tray with high accuracy, and a predetermined position within a movement control range of the IC storage opening by the stage mechanism” An IC test handler provided with a probe board attached to the IC and an IC push socket that is provided at a predetermined position and lifts the IC that sucks and fixes the IC from below the storage opening of the tray and contacts the pin with the probe needle ” Used.

  In addition, a method is proposed in which a package is once mounted on a board (alignment plate such as a tray) on which a flat package can be mounted, and the measurement test is carried out at a predetermined position in the same manner as in Patent Document 2 described above. (For example, refer to Patent Document 2).

  The board used in this method is intended to be able to use the same board for packages of the same type. In this method, “a push-up device having a support portion for supporting an IC that moves in the vertical direction, a contact provided above the push-up device and capable of contacting an IC lead, and a contact capable of pushing an IC package are provided. An IC tester, an insertion hole provided between the IC tester and the push-up device so as to be able to advance and retreat, and a support for supporting an IC package in the insertion hole; Boards of the same type and different types of ICs having the same width dimension, a support guide disposed at a predetermined width corresponding to the board dimension, and a feed that feeds the board along the support guide A semiconductor device test handler ".

  In a conventional characteristic test of a semiconductor device, the following method A or B is used as a processing method for electrically connecting the semiconductor device to a characteristic test board.

A. A method in which the semiconductor device under test is transported to the position of the contactor mounted on the characteristic test board with its external connection terminal facing down, and the semiconductor device is mounted in a state where it is positioned on the contactor and pressed by the pressing head. .

B. Place the semiconductor device under test on the stage with its external connection terminals facing upwards, or place it on the stage with it attached to a temporary tape.
Positioning to the contactor by moving the position in the direction, and then pressing the contactor by raising the stage.

  Here, in the test method A, since the transport / pressing head moves in a wide range, temperature control by cooling or heating is difficult. In addition, it is very difficult to perform a characteristic test on a back terminal of a semiconductor device such as PoP. Furthermore, since there are many types of external package forms of the semiconductor device, it is necessary to prepare a contactor having a positioning function corresponding to each semiconductor device.

  In the method B, the semiconductor device is inverted and fixed on the stage with the external connection terminal facing upward and housed in the alignment plate, or fixed on the stage with being attached to a temporary tape. For this reason, the back surface of the semiconductor device is blocked, and it is difficult to perform temperature control and a characteristic test of the back surface terminal as in the method A.

  In particular, with respect to temperature control, the temperature characteristics of each semiconductor device are different. Therefore, the temperature control is performed by detecting the temperature of a part of the stage and feeding back the result to cool or heat the entire stage (for example, In Patent Document 3, it is impossible to control each semiconductor device to a desired temperature.

  The test methods A and B will be described in detail with reference to the drawings.

  FIG. 1 shows a process of performing a characteristic test by the method A.

  In this test method, first, the semiconductor device 2 aligned and stored in the transfer tray 1 is taken out by the suction head 3 (FIG. 1A) and transferred to the positioning stage 4 to be transferred to the positioning stage 4. It is placed on top (FIG. 1B).

  Next, the semiconductor device 2 is sucked and held by the pressing head / adsorber 5, transported to the contactor 7 mounted on the test circuit board 6, and pressed to the contactor 7 by the pressing head / adsorber 5 to be electrically connected. And a characteristic test is performed (FIG. 1C).

  Thereafter, the semiconductor device 2 is taken out from the contactor 7 by the pressing head / adsorber 5, conveyed onto the positioning stage 4 and placed thereon.

  Thereafter, the semiconductor device 2 is taken out from the positioning stage 4 using the suction head 3 (FIG. 1D) and stored in the transfer tray 8 (FIG. 1E).

  FIG. 2 shows a method for performing the characteristic test by the method B.

  In this test processing method, the semiconductor device 12 in which the external connection terminal is accommodated as the upper side in the sending tray 11 that functions as an alignment plate is sucked from the suction hole 13a onto the stage 13 that can move in the horizontal direction. To fix. Then, by moving the stage 13 upward, the semiconductor device 12 is pressed against the contactor 15 of the test circuit board 14 installed above to make electrical connection, and test measurement is performed.

  Instead of accommodating the semiconductor device 12 in the transport tray 11 that functions as an alignment plate, as shown in FIG. 3, the semiconductor device 12 is affixed to a UV tape 16 coated with a UV curable adhesive 16a on one side. In some cases, the UV curable adhesive 16a is cured by UV irradiation and the semiconductor device 12 is peeled off.

  According to this method, the semiconductor device 12 is attached to the UV tape 16 and the peripheral portion of the UV tape is transported by being fixed to the ring-shaped fixing frame 17.

JP-A-1-147382 Japanese Unexamined Patent Publication No. Sho 63-114233 JP 2003-66109 A

  The methods described in Patent Document 1 and Patent Document 2 described above have the following problems.

1) Since the tray in which the semiconductor devices are arranged and accommodated is moved in order, the measurement test cannot be performed by arbitrarily selecting the semiconductor device.

2) Due to the above reasons, a measurement test cannot be performed by selecting a plurality of arbitrary semiconductor devices simultaneously.

3) For the purpose of testing flat packages, heating or cooling during semiconductor device measurement tests is performed, so the temperature is controlled from the bottom surface of the package, and the top surface of the chip mounted inside is temperature controlled. Can not.

4) Since a measurement test cannot be performed by selecting a plurality of arbitrary semiconductor devices at the same time, temperature control of the plurality of semiconductor devices cannot be performed.

  On the other hand, in the characteristic test method shown in FIG. 1, since the pressing head / adsorber 5 moves over a wide range, it is difficult to control the temperature of the semiconductor device 2 under test such as cooling and heating. For example, it is difficult to arrange a liquid cooling unit for cooling, a heat radiation fin and blower for air cooling, a heater for heating, a temperature sensor, or the like in the pressing head / adsorber 5.

  Further, in the characteristic test method in which the pressing head / adsorber 5 moves in a wide range as described above, electrical contact is made to the terminal of the semiconductor device having the external connection terminal on the back surface as in the PoP. It is very difficult to perform a characteristic test. For example, it is difficult to arrange a contactor as a contactor and parts / wires for electric wiring thereof in the pressing head / adsorber 5.

  Furthermore, when aligning with the contactor 7 by the pressing head / adsorber 5, when the semiconductor device is dropped into the contactor 7, it is aligned with the normal position following the positioning guide provided in the contactor due to its own weight. However, it is necessary to prepare a positioning portion corresponding to the package form of the semiconductor device. In the contactor 7 described above, it is necessary to prepare a dedicated contactor every time the outer dimensions and terminal arrangement of the package of the semiconductor device are different.

  On the other hand, in the characteristic test method shown in FIG. 2, since the back surface of the semiconductor device 12 is covered by the stage 13, temperature control such as cooling or heating is difficult.

  In the transfer tray 11, a liquid cooling unit for cooling, a heater / temperature sensor for heating, wiring thereof, and the like have been conventionally arranged in a stage 13 that can move in the horizontal direction. Yes. However, heat must be transmitted to the semiconductor device 12 through the transport tray 11 that is placed on and fixed to the stage 13 and becomes an indirect heat conduction path, resulting in a large thermal resistance and difficult temperature control. It is.

  Furthermore, in the characteristic test method shown in FIG. 2, a temperature sensor is attached to a specific location on the stage 13 on which the transfer tray 11 is placed, and cooling is performed by feeding back to the temperature controller in accordance with the detection result of the temperature sensor. It is controlled within a desired temperature range by operating and stopping the unit and heater. Therefore, when performing a characteristic test of semiconductor devices having different temperature characteristics, the temperature of a specific portion can be controlled, but it is difficult to perform the characteristic test while controlling the temperature of all semiconductor devices within a desired temperature range.

  Further, in the characteristic test method shown in FIG. 2, the semiconductor device 12 arranged and accommodated in one compartment of the tray on the transport tray 11 is in a range within the one compartment in order to improve the accommodation property. Have fun at. For this reason, it is difficult to accurately align the semiconductor device 12 and the contactor 15 only with the stage 13. In addition, conducting a characteristic test by making electrical contact with the external connection terminal of a semiconductor device having an external connection terminal on the back surface, such as PoP, covers the back surface of the semiconductor device 12 with the transfer tray 11. Because it is very difficult.

  Further, even when the UV tape 16 is used as shown in FIG. 3, the back surface of the semiconductor device 12 is covered with the UV tape 16 as in the case of the transport tray 11 described above. Temperature control cannot be performed, and electrical connection from the back to the back terminal cannot be achieved.

  The present invention has been made in view of the above-described problems, and a semiconductor device test capable of performing a test by pressing any one of a plurality of semiconductor devices against the contactor from the back side of the semiconductor device. An object is to provide an apparatus and a test method.

  In order to achieve the above object, according to the present invention, a test circuit board including a contactor having a contact corresponding to the electrode of a semiconductor device under test having a plurality of electrodes on one surface, A support substrate having a recess for accommodating the test semiconductor device, a stage for supporting the support substrate, and the other surface of the semiconductor device under test mounted on the support substrate; A pressing head for bringing the electrode on the surface of the contactor into contact with the contactor of the contactor, and the stage is movable to a position corresponding to the contactor at least one of the semiconductor devices to be tested mounted on the support substrate. And the pressing head is provided at a central portion of the pressing head, provided at a pressing surface for pressing the semiconductor device under test, and at a peripheral portion of the pressing head, Test apparatus for a semiconductor device characterized by having a positioning guide to place the test semiconductor device to a predetermined position of the recess is provided.

  According to the present invention, a step of mounting a plurality of semiconductor devices each having an electrode disposed on one side thereof in an aligned state on a support substrate while exposing the electrodes, and A first semiconductor device using a pressing head having a stage corresponding to a contactor, a pressing surface that presses the semiconductor device under test, and a positioning guide that positions the semiconductor device under test at a predetermined position in the recess. Pressing from the other surface, bringing the electrode on the one surface of the semiconductor device into contact with the contactor of the contactor, and testing the first semiconductor device via the contactor; The step of recovering the first semiconductor device onto the support substrate, the step of moving the support substrate, and pressing the second semiconductor device from the other side, and the electrodes of the semiconductor device and the co A step of contacting a contactor of a tactor and a step of testing the second semiconductor device via the contactor, wherein the pressing surface is provided at a central portion of the pressing head, and the positioning guide Is provided in the peripheral portion of the pressing head. A semiconductor device testing method is provided.

  According to the present invention, the back surface opposite to the electrode of the semiconductor device is mounted on the support substrate with the back surface facing downward, and the back surface is pressed by the contactor while being supported by the pressing head. The semiconductor device pressed by the contactor is selected by horizontally moving the stage and placing one of the semiconductor devices held on the support substrate on the pressing head. For this reason, the pressing head need only be provided with a mechanism that moves in the vertical direction, and the pressing head can be configured simply. For this reason, the temperature of the semiconductor device can be efficiently controlled by providing a temperature control heater or a cooling mechanism in the pressure head and supporting the back surface of the semiconductor device near the heat radiating plate by the pressure head.

  In addition, since only the semiconductor device that performs the test supported by the pressing head can be selectively temperature-controlled, the temperature control of the semiconductor device can be performed efficiently.

  Furthermore, even when a plurality of pressing heads are provided and a plurality of semiconductor devices are tested simultaneously, the temperature of each of the plurality of semiconductor devices can be individually controlled.

It is a figure for demonstrating the 1st example of the process process in the characteristic test of the conventional semiconductor device. It is a figure for demonstrating the 2nd example of the process process in the characteristic test of the conventional semiconductor device. It is a figure for demonstrating the 3rd example of the process process in the characteristic test of the conventional semiconductor device. It is a figure for demonstrating the test method by 1st Example of this invention. It is a figure for demonstrating the test method by 1st Example of this invention. It is a figure for demonstrating the test method by 1st Example of this invention. It is a perspective view which shows a part of test apparatus used for the test method by 1st Example of this invention. It is a perspective view showing an XY stage having an XY moving mechanism. It is a perspective view of the support substrate which has a recessed part provided with the one-sided mechanism. It is an enlarged view of the recessed part provided with the one-sided mechanism. It is an enlarged view of the recessed part provided with the one-sided mechanism. It is an enlarged view of the recessed part provided with the one-sided mechanism. It is an enlarged view of the recessed part provided with the one-sided mechanism. It is a figure which shows the outline | summary of the positioning mechanism by a press head. It is a figure which shows the test apparatus by which the press head which has an inclined surface was provided in the positioning guide around a press surface. It is a perspective view of the press head in which the positioning guide was provided in the square part of the press surface. It is a figure which shows the test apparatus provided with the press head shown in FIG. It is a perspective view of the press head in which the positioning pin was provided in the front-end | tip of the positioning guide. It is a figure which shows the test apparatus provided with the press head shown in FIG. It is a figure which shows the test apparatus of the structure which moves a semiconductor device minutely with a press head. It is an enlarged view which shows the state which the contact of the ball electrode and contactor of the semiconductor device contacted. It is a figure which shows the test apparatus of the structure which makes a semiconductor device carry out a micro vibration with a press head. It is an enlarged view which shows the state which the contact of the ball electrode and contactor of the semiconductor device contacted. It is a figure which shows the test apparatus of the structure which enabled rocking | fluctuation of the front-end | tip part which has a press surface of a press head. It is a figure which shows the testing apparatus by 2nd Example of this invention which performs a characteristic test, cooling a semiconductor device with a press head. It is a figure which shows the testing apparatus by 2nd Example of this invention which performs a characteristic test, heating a semiconductor device with a press head. It is a figure which shows the testing apparatus by 2nd Example of this invention which performs a characteristic test, heating and cooling a semiconductor device with a press head. It is a figure which shows the testing apparatus by 3rd Example of this invention which performs the characteristic test of the semiconductor device in which the mounting terminal was provided also in the back surface. It is a figure which shows the test apparatus which has the structure which electrically connects the contact of a press head to the contactor of a test circuit board. It is a figure which shows the testing apparatus by 4th Example of this invention which has several contactors and several press head. It is a figure which shows operation | movement of the test apparatus shown in FIG. It is a figure which shows the test apparatus which performs temperature control separately, testing a several semiconductor device simultaneously.

  Next, a test method according to an embodiment of the present invention will be described with reference to the drawings.

  A test apparatus and a test method according to the first embodiment of the present invention are shown in FIGS. FIG. 7 shows the main part of the test apparatus used in the test method shown in FIGS.

  In the test method according to the first embodiment of the present invention, as shown in FIG. 7, a support substrate 21 on which a plurality of semiconductor devices 20 to be tested can be mounted in an aligned state and an outer peripheral portion of the support substrate 21 are supported. And a test apparatus having a stage 22 formed in an annular shape.

  The support substrate 21 is made of a metal material such as aluminum or stainless steel or a resin material such as plastic.

  The support substrate 21 is provided with recesses 21a for accommodating the semiconductor device 20 in a state of being aligned in the X direction and the Y direction.

  Each recess 21a has substantially the same shape as the outer shape of the semiconductor device 20 so as to accommodate one semiconductor device 20, and is formed through the support substrate. Thus, the semiconductor device 20 is prevented from falling (dropping out) (see, for example, FIG. 4).

  Further, the support substrate 21 is appropriately provided with positioning holes 21b.

  The semiconductor device under test 20 is accommodated in the recess 21a in a state where the external connection terminal 20a made of, for example, a ball electrode disposed on one main surface thereof is exposed. Therefore, the other main surface of the semiconductor device 20 is exposed under the recess 21 a of the support substrate 21.

  On the other hand, the stage 22 has a cylindrical shape, and an adsorption hole 22b and a positioning pin 22c are disposed on the upper end surface 22a on which the support substrate 21 is mounted.

  When the support substrate 21 is placed on the upper end surface 22b of the stage 22, the support substrate 21 is positioned by fitting the positioning holes 21b provided in the support substrate 21 with the positioning pins 22c, and the suction is performed. The support substrate is fixed to the stage 22 by vacuum suction through the hole 22b.

The suction hole 22a is connected to a suction device such as a vacuum pump. (Not shown)
A test circuit board 23 is disposed above the stage 22, that is, on the side facing the external connection terminal 20 a of the semiconductor device under test 20.

  A contact 24 a for contacting the external connection terminal 20 a of the semiconductor device under test 20 and electrically connecting the semiconductor device 20 to the test circuit substrate 23 is provided on the lower surface of the test circuit substrate 23. A contactor 24 is provided.

  On the other hand, in the inner space of the stage 22, a pressing head 25 supported by a vertical movement mechanism (not shown) so as to be vertically movable is disposed.

  The pressing head 25 has a pressing surface 25 a that supports and presses the other main surface 20 b of the semiconductor device 20 supported by the support substrate 21.

  The test circuit board 23 and the pressing head 25 do not move in the horizontal (lateral) direction and maintain a predetermined position. However, the pressing head 25 is disposed directly below the contactor 24 so as to correspond to the contactor 24, and Can be moved up and down.

  Here, with the support substrate 21 placed and fixed on the stage 22, the semiconductor device 20 held on the array plate 21 is disposed between the pressing head 25 and the contactor 24.

  As shown in FIG. 8, the stage 22 is an XY stage having an XY moving mechanism 26 composed of a linear guide 26A in the X direction and a linear guide 26B in the Y direction, and is movable in the XY direction (horizontal direction).

  Therefore, the stage 22 can be moved in the horizontal (lateral) direction, and one of the plurality of semiconductor devices 20 held on the support substrate 21 can be moved directly below the contactor 24 of the test circuit board 23. That is, the stage 22 can be moved horizontally so that the electrode 20a of the selected semiconductor device 20 is positioned directly below the contactor 24a of the contactor 24.

  As shown in FIG. 4, when the pressing head 25 is raised in this state, the pressing surface 25 a of the pressing head 25 comes into contact with the other main surface of the semiconductor device 20.

  The top of the pressing head 25 is smaller than the semiconductor device 20 and can enter the recess 21 a of the support substrate 21. Accordingly, the semiconductor device 20 is pushed up by the pressing surface 25a of the pressing head 25, and the external connection electrode 20a of the semiconductor device 20 comes into contact with and is pressed by the contactor 24a of the contactor 24 disposed above the semiconductor device 20.

  Thereby, the semiconductor device 20 is electrically connected to a test apparatus (not shown) via the test circuit board 23.

  An electrical test of the semiconductor device 20 is performed in a state where the semiconductor device 20 is electrically connected to the test device via the test circuit board 23.

  When the test is completed, the pressing head 25 moves downward, and the semiconductor device 20 is accommodated in the recess 21 a of the support substrate 21.

  After that, as shown in FIG. 5, the stage 22 is moved in the horizontal direction, and the next semiconductor device 20 to be tested is positioned directly below the contactor 24 of the test circuit board 23.

  In the example shown in FIG. 5, the stage 22 is moved so that the semiconductor device 20 located next to the tested semiconductor device 20 is located directly below the contactor 24. The semiconductor device 20 at the position can be selected.

  With the next semiconductor device 20 to be tested positioned directly below the contactor 24, the pressing head 50 is moved upward again to bring the external connection terminal of the semiconductor device 20 to be tested into contact with the contactor of the contactor 24. Perform the desired electrical test.

  After the test, the pressing head is moved downward to accommodate the semiconductor device 20 to be tested in the recess 21a of the support substrate 21, and then the stage 22 is moved horizontally. As shown in FIG. Is positioned directly below the contactor 24, and the pressing head 25 is moved upward to perform an electrical test while bringing the external connection terminal of the semiconductor device 20 into contact with the contactor of the contactor 24.

  As described above, in the test apparatus and test method according to the first embodiment of the present invention, the semiconductor device to be tested is moved horizontally (laterally) on the support substrate 21 on which a plurality of semiconductor devices are mounted in an aligned state. 20 is sequentially moved directly below the contactor 24, and then the pressing head 25 is raised to push up the semiconductor device 20, and the external connection terminal of the semiconductor device 20 is brought into contact with the contactor of the contactor 24 to perform an electrical test.

  At this time, the contactor 24 does not move and is maintained at a fixed position, and only the pressing head 25 moves up and down.

  That is, since there is no complicated component such as the contactor 24 in the vertically moving part, the structure of the test apparatus can be simplified. Further, any one of a plurality of semiconductor devices can be selectively tested by simply moving the stage 22 horizontally (laterally).

  Further, it is not necessary to move the test circuit board 23 and the contactor 24, and the structure of the test apparatus can be simplified.

  Further, by making it possible to mount the support substrate 21 itself holding the semiconductor device 20 on the stage 22, the support substrate 21 can be used as a storage / transport tray, and the semiconductor device 20 is moved from the tray to the positioning stage. There is no need to change, and the test process can be simplified.

  In the present embodiment, the stage 22 is configured to be movable only in the horizontal direction, but the stage 22 including the pressing head 25 may be movable in the vertical direction (vertical direction).

  For example, when the support substrate 21 is attached to or removed from the stage 22, the stage 22 is moved down greatly to form a large space between the stage 22 and the contactor 24, thereby restricting the movement of the support substrate 21. It can be set as the structure which does not.

  Here, one semiconductor device 20 is accommodated in each of the plurality of recesses 21a of the support substrate 21, and it is desirable to provide a positioning and fixing mechanism for the semiconductor device 20 accommodated in the recesses 21a.

  As an example of the positioning and fixing mechanism, a shift mechanism will be described with reference to FIGS. 9 to 13. FIG. 9 shows a support substrate 21A having a recess 21Aa provided with a one-sided mechanism 27. As shown in FIG.

  As shown in FIGS. 10 to 13, the side shift mechanism 27 includes a side shift plate 27 </ b> A and a spring 27 </ b> B.

  The biasing plate 27A is urged by a spring 27B and comes into contact with a corner portion of the semiconductor device 20 accommodated in the concave portion 21Aa formed in a quadrilateral shape. The semiconductor device 20 is moved to one corner side of the concave portion 21Aa. Press.

  As shown in FIG. 10, the recess 21 </ b> Aa is a rectangle having a shape and an area that can accommodate the semiconductor device 20, and a one-side plate 27 </ b> A is provided at one corner of the recess 21 </ b> Aa so as to be movable in a diagonal direction. .

  The spring 27B biases the one-side plate 27A in a diagonal direction.

  Each recess 21 </ b> Aa in the support substrate 21 </ b> A is formed by accurately positioning two sides that form corners to which the semiconductor device 20 is pressed by the shift mechanism 27.

  Therefore, as shown in FIG. 11, each semiconductor device 20 is accurately positioned at a predetermined position of the support substrate 21A by pressing the semiconductor device 20 so as to contact the two sides by the one-side plate 27A. Become.

  As described above, the support substrate 21A is accurately positioned with respect to the stage 22 by the positioning pins 22c of the stage 22. Therefore, the semiconductor device 20 mounted on the support substrate 21 </ b> A is accurately arranged with respect to the stage 22.

  In the state before the semiconductor device 20 is accommodated, the one-sided plate 27A must be pulled toward the corner against the spring 27B. For this reason, the side plate 27A is provided with an opening / closing hole 27Aa. For example, by inserting a pin into the opening / closing hole 27Aa and moving the pin, the side plate 27A is moved against the spring 27B and held. be able to.

  By using such a side-alignment mechanism 27, semiconductor devices of different sizes can be accommodated and positioned in the recesses 21Aa having the same size.

  For example, as shown in FIG. 12, even if the semiconductor device 20A has a size larger than that of the semiconductor device 20 shown in FIG. As shown in FIG. 13, in the case of the semiconductor device 20B having a size smaller than that of the semiconductor device 20 shown in FIG. 11, the biasing plate 27A is largely extended by keeping the stroke of the spring 27B sufficiently large. Can respond.

  As described above, the semiconductor device can be positioned on the support substrate and can be brought into contact with the contactor of the contactor 24 with high precision. When the is supported, the external connection terminal of the semiconductor device can be accurately positioned with respect to the contact of the contactor 24.

  A positioning mechanism using the pressing head 25 will be described.

  An outline of the positioning mechanism by the pressing head is shown in FIG.

  In order to position the semiconductor device 20 by the pressing head 25, the pressing surface 25a of the pressing head 25 is processed so that the semiconductor device 20 is positioned on the pressing surface 25a when the semiconductor device 20 is supported. That's fine.

  That is, as shown in the figure, by forming the positioning guide 25b around the pressing surface 25a of the pressing head 25, the semiconductor device 20 can be dropped and positioned inside the positioning guide 25b. The pressing head 25 and the contactor 24 are configured not to move in the horizontal direction, and the pressing head and the contactor 24 can be accurately aligned in advance.

  The positioning guide 25b is not necessarily provided on the entire circumference of the pressing surface 25a, but may be provided on a part of each side.

  FIG. 15 illustrates an example in which the semiconductor device 20 is easily dropped onto the pressing surface 250a by using the positioning guide 25b around the pressing surface 25a as an inclined surface.

  In the figure, the positioning guide 25 b is provided at the center of each side of the pressing surface 25 a, and the four corners of the semiconductor device 20 are supported by the recess 21 a of the support substrate 21. Therefore, although not shown in the figure, the four corners of the pressing head 25 are also cut out correspondingly.

  In the example shown in the figure, even if the positional accuracy of the semiconductor device 20 disposed on the support substrate 21 is not sufficiently high, when the pressing head 25 is raised and the semiconductor device 20 is supported, the semiconductor device 20 is positioned as a positioning guide. It slides on the inclined surface 25b and is guided onto the pressing surface 25a, so that positioning with high accuracy is performed.

  In the example shown in FIG. 15, the stage 22 is also movable up and down, and before the semiconductor device 20 is pressed by the pressing head 25, the stage 22 is raised and the semiconductor device 20 and the contactor 24 approach each other. It is possible to raise the pressing head 25.

  Therefore, the external connection terminal can be brought into contact with the contactor of the contactor by slightly lifting the semiconductor device.

  FIG. 16 shows an example of the pressing head 25 in which the positioning guide 25b is provided at the square portion of the pressing surface 25a.

  In the figure, a concave portion 21 a of the support substrate 21 and a semiconductor device 20 disposed in the concave portion 21 a are drawn above the pressing head 25.

  Within the recess 21a, the semiconductor device 20 is supported by a support portion 21b protruding at a position corresponding to the central portion of each side. Positioning guides 25b having inclined surfaces are arranged outside the four corners of the pressing surface 25a of the pressing head 25.

  Since the pressing surface 25a is smaller than the region surrounded by the support portion 21b of the support substrate 21, it protrudes through the recess 21a of the support substrate from below.

  Therefore, as shown in FIG. 17, the semiconductor device 20 supported on the pressing surface 25a is lifted above the supporting substrate 21 by the pressing head 25 moving further upward, and its external connection electrode is in contact with the contactor 24. Pressed by the child.

  In the example shown in FIG. 17, the stage 22 can also be moved up and down. Before the semiconductor device 20 is lifted by the pressing surface 25 a of the pressing head 25, the stage 22 rises and the semiconductor device 20 and the contactor 24 approach each other. In this state, the pressing head 25 is raised. Therefore, the contactor can be brought into contact with the semiconductor device by slightly lifting it.

  FIG. 18 shows a pressing head 25 in which a positioning guide 25b is provided at a square portion of the pressing surface 25a and a positioning pin 25c is provided at the tip thereof.

  When the pressing head is raised, the positioning pin 25c erected at the tip of the positioning guide 25b is fitted into the positioning hole 24b provided in the contactor 24 as shown in FIG. As a result, the contactor 24 and the pressing head 25 are aligned with high accuracy, and the semiconductor device 20 is also positioned with respect to the contactor 24 with high accuracy.

  Next, in the embodiment described above, a configuration for improving the electrical connection between the ball electrode 20a of the semiconductor device 20 and the contact 24a of the contactor 24 will be described.

  A configuration in which the semiconductor device 20 is slightly moved by the pressing head 25 is shown in FIG.

  That is, after the pressing head 25 is raised to bring the semiconductor device 20 into contact with the contactor 24, the pressing head 25 is slightly moved in the horizontal direction.

  As a result, as shown in FIG. 21, the external connection terminal (ball electrode) 20a of the semiconductor device 20 moves horizontally while being in contact with the contact 24a of the contactor 24.

  That is, since the external connection terminal 20a moves minutely while rubbing the surface of the contactor 24, the oxide film formed on the surface of the external connection terminal 20a or the contactor 24a or attached foreign matter is removed, and the external connection terminal 20a. The electrical continuity between the contact 24a and the contact 24a is improved.

  As an example of means for finely moving the pressing head 25, it is possible to apply a piezoelectric actuator such as a piezo element to the pressing head 25.

  Another configuration in which the semiconductor device 20 is minutely vibrated by the pressing head 25 is shown in FIG.

  After the pressing head 25 is raised and the semiconductor device 20 is brought into contact with the contactor 24, the pressing head 25 is slightly vibrated in the horizontal direction.

  As a result, as shown in FIG. 23, the external connection electrode 20a of the semiconductor device 20 vibrates in the horizontal direction while being in contact with the contact 24a of the contactor 24.

  That is, since the external connection terminal 20a vibrates minutely while rubbing the surface of the contactor 24, the oxide film formed on the surface of the external connection terminal 20a or the contactor 24a or the attached foreign matter is removed, and the ball electrode 20a The electrical continuity with the contact 24a is improved.

  As an example of a mechanism for minutely vibrating the pressing head 25, it is possible to apply an ultrasonic transducer using a piezoelectric element to the pressing head 25.

  Here, if the parallelism between the pressing surface 25a of the pressing head 25 and the surface formed by the tip surface of the contactor 24a of the contactor 24 is not maintained, a part of the external connection terminal (ball electrode) 20a of the semiconductor device 20 There is a possibility that a large pressing force is applied to and that a sufficient pressing force is not applied to other portions. In such a case, the electrical connection of the semiconductor device 20 deteriorates and a predetermined test cannot be performed.

  In order to solve such a problem, the configuration shown in FIG. 24 is effective.

  As shown in FIG. 24, the tip portion 25Ab of the pressing head 25A is separated from the main body portion 25Ac, and a ball A25d is disposed between the tip portion 25Ab and the main body portion 25Ac, and the tip portion 25Ab and the main body The portion 25Ac is connected by a spring 25Ae around the ball 25Ad.

  According to the configuration of the pressing head 25A, the tip portion 25Ab having the pressing surface 25Aa is supported at one point by the ball 25Ad and can be inclined in all directions.

  Therefore, even when the plane formed by the tip of the contactor 24a of the contactor 24 and the pressing surface 25Aa are not in a parallel state, the pressing surface 25Aa corresponds to the inclination of the contactor 24a in the operation of pressing the pressing head. The pressing surface 25Aa and the surface formed by the tip end surface of the contactor 24a are parallel to each other (so-called surface copying operation).

  Thereby, all the external connection terminals 20a of the semiconductor device 20 can be equally pressed against the corresponding contacts 24a, and the electrical continuity can be improved.

  Next, a second embodiment of the present invention will be described with reference to FIGS.

  FIGS. 25 to 27 show the configuration of a pressing head for performing the test method according to the second embodiment of the present invention.

  FIG. 25 shows a test apparatus that performs a characteristic test while cooling the semiconductor device 20 by the pressing head 25B.

  The pressing head 25B is provided with cooling fins 30, and a blower 31 is disposed in the vicinity of the pressing head 25B. The pressure head 25 is cooled by flowing air toward the fins 30 by the blower 31.

  That is, when the semiconductor device 20 subjected to the characteristic test while being pressed against the contactor 24 by the pressing head 25B generates heat during the test, the heat is transmitted from the back surface 20b of the semiconductor device 20 to the pressing head 25 and released from the fin 30 to the atmosphere. Is done.

  Thereby, the semiconductor device 20 is cooled.

  Since the pressing surface 25Ba of the pressing head 25B contacts almost the entire back surface 20b of the semiconductor device 20, the area for transferring heat is large, and the semiconductor device 20 can be efficiently cooled.

  Since the pressing head 25B only contacts one semiconductor device 20, the semiconductor device 20 is efficiently cooled.

  FIG. 26 shows a test apparatus for performing a characteristic test while heating the semiconductor device 20 by the pressing head 25C.

  The pressing head 25C is provided with a heater 32 for heating. By heating the heater 32, the pressing head 25C is heated.

  That is, when the pressing head 25C is heated, the heat is transmitted to the semiconductor device 20 subjected to the characteristic test while being pressed against the contactor 24, and the semiconductor device 20 is heated.

  As described above, the pressing surface 25Ca of the pressing head 25C is in contact with almost the entire back surface 20b of the semiconductor device 20, so that the area for transferring heat is large and the semiconductor device 20 can be efficiently heated.

  Since the pressing head 25B only contacts one semiconductor device 20, the semiconductor device 20 is efficiently heated.

  FIG. 27 shows a test apparatus and a test method for performing a characteristic test while heating and / or cooling the semiconductor device 20 with the pressing head 25D.

  The pressing head 25D is provided with a cooling fin 30 and a heating heater 32, and a blower 31 is disposed in the vicinity of the pressing head 25D. The pressure head 25D is heated by heating the heater 32, and the pressure head 25D is cooled by flowing air toward the fins 30 by the blower 31.

  A temperature sensor 33 is embedded in the pressing head 25D.

  The temperature sensor 33 detects the temperature in the vicinity of the pressing surface 25 </ b> D and sends it to the temperature controller 34.

  The temperature in the vicinity of the pressing surface 25D approximates the temperature of the semiconductor device 20. Therefore, the temperature detected by the temperature sensor 33 can be regarded as the temperature of the semiconductor device 20.

  The temperature controller 34 adjusts the power supplied to the heater 32 or the power supplied to the blower 31 based on the temperature detected by the temperature sensor 33, and the temperature detected by the temperature sensor 33 (that is, the temperature of the semiconductor device 20). Control to achieve a desired target temperature.

  Since the pressing surface 25Da of the pressing head 25D contacts almost the entire back surface 20b of the semiconductor device 20, the area for transferring heat is large, and the semiconductor device 20 can be efficiently cooled or heated.

  Since the pressing head 25B only contacts one semiconductor device 20, the semiconductor device 20 is efficiently heated or cooled.

  Next, a semiconductor device test apparatus and test method according to a third embodiment of the present invention will be described with reference to FIGS.

  FIG. 28 shows a test apparatus and a test method for performing a characteristic test of the semiconductor device 20 in which the external connection terminals are also provided on the back surface 20b.

  As shown in FIG. 28, a contact 25Eb is provided on the pressing surface 25Ea of the pressing head 25E.

  The contact 25Eb has a shape that contacts the external connection terminal 20c formed on the back surface 20b of the semiconductor device 20, and receives the external terminal if necessary.

  That is, the contact 25Eb of the pressing head 24E contacts and presses the external connection terminal 20c of the semiconductor device 20, thereby pressing the external connection terminal of the semiconductor device 20 against the contact of the contactor 24. Therefore, the pressing head 25E functions as a pressing head and contactor.

  As described above, according to this embodiment, even when the semiconductor device 20 has the external connection terminals on both the front and back surfaces, it is possible to contact the mounting terminals on both surfaces at the same time. Tests can be performed.

  FIG. 29 is a modification of the embodiment shown in FIG. 28 and shows an example in which the contact 25Eb of the pressing head 25E is electrically connected to the contactor 24 of the test circuit board 23.

  A contact 25Ec is further disposed around the contact 25Eb provided on the pressing head 25E, and the contact 25Eb and the contact 25Ec are electrically connected on the pressing head 25E side.

  Therefore, a through electrode 21b that penetrates the support substrate 21 is disposed at a position corresponding to the contact 25Ec. Therefore, in this embodiment, the support substrate 21 is formed of an insulator such as a synthetic resin.

  Further, a contact 24c is disposed around the contact 24a of the contactor 24.

  Further, the stage 22 can be moved in the vertical direction (vertical direction).

  In the above configuration, when the stage 22 and the pressing head 25E are raised and the semiconductor device 20 is pressed against the contactor 24, the external connection terminal 20c on the back surface 20b of the semiconductor device 20 contacts the contact 25Eb of the pressing head 20E. In addition, the contact 25Ec of the pressing head 25E is in contact with the through electrode 21b of the support substrate 21.

  Furthermore, the through electrode 21 b of the support substrate 21 contacts the contact 24 c of the contactor 24.

  Thereby, the external connection terminal 20c on the back surface 20b of the semiconductor device is electrically connected to the test circuit board 23 via the contact 25Eb, the contact 25Ec, the through electrode 21b, and the contact 24c.

  According to such a configuration, it is not necessary to connect an electric circuit to the pressing head 25 </ b> E side that is a moving part, and all signals supplied to the semiconductor device 20, electric power, and signals output from the semiconductor device 20 are from the test circuit board 23. Or supplied to the test circuit board 23.

  Next, a semiconductor device testing apparatus and testing method according to a fourth embodiment of the present invention will be described with reference to FIGS.

  In the semiconductor device testing apparatus according to the fourth embodiment of the present invention shown in FIG. 30, a plurality of contactors 24-1, 24-2, 24-3 are provided on the test circuit board 23, and a plurality of contactors are provided. Pressure heads 25-1, 25-1, 25-3 are provided.

  One of the contactors 24-1, 24-2, 24-3 and the corresponding pressing heads 25-1, 25-2, 25-3 can simultaneously contact a plurality of semiconductor devices.

  In the test apparatus having such a configuration, as shown in FIG. 31, the rising of the plurality of pressing heads is individually controlled by a signal from the outside, and the plurality of pressing heads are selectively raised to selectively select the semiconductor device. Can be tested.

  In the example shown in the figure, the pressing heads 25-1 and 25-3 are raised, and the pressing head 25-2 is not raised.

  According to such a configuration, for example, when the semiconductor device 20 corresponding to the pressing head 25-2 is determined to be defective in advance, the corresponding pressing pressure head is not raised, and the semiconductor device 20 The efficiency of the test can be improved by not performing the test.

  According to the configuration shown in FIG. 30, a plurality of semiconductor devices 20 can be tested at a time.

  Moreover, various effects can be obtained by appropriately combining the configurations of the above-described embodiments.

  For example, by adding a configuration for controlling the temperature of the semiconductor device as in the second embodiment described above, even when testing a plurality of semiconductor devices 20, temperature control suitable for each semiconductor device can be performed individually. it can.

  FIG. 32 shows an example in which temperature control is individually performed while simultaneously testing a plurality of semiconductor devices.

  In the example shown in the figure, a pressing head 25-1 and a pressing head 25-2 are provided, and two semiconductor devices 20 can be tested simultaneously.

  The pressure head 25-1 is provided with a heater 32-1, a cooling unit 35-1 to which cooling water is applied, and a temperature sensor 33-14, while the pressure head 25-2 is applied with a heater 32-2 and cooling water. The cooling unit 35-2 and the temperature sensor 33-2 are provided.

  The heater 32-1 and the cooling unit 35-1 are controlled by the temperature controller 34-1, and the heater 32-2 and the cooling unit 35-2 are controlled by the temperature controller 34-2.

  Therefore, the temperature of the semiconductor device 20 pressed by the pressing head 25-1 is controlled by the temperature controller 34-1 and the temperature of the semiconductor device 20 pressed by the pressing head 25-2 is controlled by the temperature controller 34-2. .

  That is, the semiconductor device 20 is tested in a state where the temperature is individually controlled.

  As described above, the present specification discloses the following invention.

(Appendix 1)
A test circuit board including a contactor including a contact corresponding to the external connection terminal of the semiconductor device under test;
A support substrate capable of mounting the semiconductor device under test in an aligned state;
A stage for supporting the support substrate;
A pressing head that presses a semiconductor device to be tested mounted on the support substrate and brings an external connection terminal of the semiconductor device to be tested into contact with a contactor of the contactor;
The stage is configured such that at least one of the semiconductor devices to be tested mounted on the support substrate can be moved to a position corresponding to the contactor.

(Appendix 2)
An apparatus for testing a semiconductor device according to attachment 1, wherein
A test apparatus for a semiconductor device, further comprising a positioning mechanism for positioning the support substrate with respect to the stage.

(Appendix 3)
An apparatus for testing a semiconductor device according to attachment 1, wherein
A test apparatus for a semiconductor device, wherein the support substrate is provided with a recess for accommodating a semiconductor device under test.

(Appendix 4)
An apparatus for testing a semiconductor device according to attachment 1, wherein
An apparatus for testing a semiconductor device, wherein a positioning guide for guiding the semiconductor device to the pressing surface protrudes around a pressing surface of the pressing head.

(Appendix 5)
An apparatus for testing a semiconductor device according to appendix 4, wherein
A test apparatus for a semiconductor device, wherein a positioning pin is provided so as to protrude from the positioning guide, and a positioning hole is provided at a position corresponding to the positioning pin of the contactor.

(Appendix 6)
An apparatus for testing a semiconductor device according to attachment 1, wherein
A test method for a semiconductor device, wherein the pressing head is slightly moved or vibrated in a horizontal direction.

(Appendix 7)
An apparatus for testing a semiconductor device according to attachment 1, wherein
Test method for semiconductor device, wherein the pressing head is capable of tilting the pressing surface in an arbitrary direction with respect to a horizontal direction (Appendix 8)
An apparatus for testing a semiconductor device according to attachment 1, wherein
A test apparatus for a semiconductor device, comprising a temperature control mechanism for controlling the temperature of the pressing surface of the pressing head.

(Appendix 9)
An apparatus for testing a semiconductor device according to appendix 8, wherein
The temperature control mechanism includes a cooling fin provided in the pressing head and a blower that blows air toward the cooling fin.

(Appendix 10)
An apparatus for testing a semiconductor device according to appendix 8, wherein
The semiconductor device testing apparatus, wherein the temperature control mechanism includes a heater provided in the pressing head.

(Appendix 11)
An apparatus for testing a semiconductor device according to appendix 8, wherein
The semiconductor device testing apparatus, wherein the temperature control mechanism includes a cooling unit provided in the pressing head and having a flow path through which a refrigerant flows.

(Appendix 12)
An apparatus for testing a semiconductor device according to appendix 8, wherein
The temperature control mechanism includes a temperature sensor that detects a temperature in the vicinity of the pressing surface of the pressing head, and a temperature controller that controls the temperature based on the temperature detected by the temperature sensor. Equipment testing equipment.

(Appendix 13)
An apparatus for testing a semiconductor device according to attachment 1, wherein
The semiconductor device test apparatus according to claim 1, wherein the semiconductor device has a mounting terminal on a back surface, and a first contact that contacts the mounting terminal is provided on the pressing surface of the pressing head.

(Appendix 14)
An apparatus for testing a semiconductor device according to attachment 13, wherein
A second contact is provided around the first contact on the pressing surface of the pressing head, and a through electrode that contacts the second contact is provided through the support substrate. 3. A test apparatus for a semiconductor device, wherein a third contact that contacts the contactor is provided on the contactor.

(Appendix 15)
An apparatus for testing a semiconductor device according to attachment 1, wherein
A test apparatus for a semiconductor device, wherein a plurality of contactors are attached to the test circuit board, and a plurality of the pressing heads are provided corresponding to the plurality of contactors.

(Appendix 16)
Mounting a plurality of semiconductor devices having external connection terminals on one main surface in an aligned state on a support substrate while exposing the external connection terminals;
Associating the support substrate with a contactor of a test apparatus;
Pressing the first semiconductor device from the other main surface, bringing the external connection terminal of the semiconductor device into contact with the contactor of the contactor;
Testing the first semiconductor device via the contactor;
Recovering the first semiconductor device onto the support substrate;
Moving the support substrate;
Pressing the second semiconductor device from the other main surface to bring the external connection terminal of the semiconductor device into contact with the contactor of the contactor;
And testing the second semiconductor device through the contactor.

(Appendix 17)
A test method for a semiconductor device according to appendix 16, wherein
A method for testing a semiconductor device, wherein the semiconductor device is micro-moved or micro-vibrated when the semiconductor device is pressed against the contactor.

(Appendix 18)
A test method for a semiconductor device according to appendix 16, wherein
A method for testing a semiconductor device, comprising: cooling or heating a back surface of only the semiconductor device to be tested when the semiconductor device is tested.

(Appendix 19)
A test method for a semiconductor device according to appendix 18, wherein
A method for testing a semiconductor device, comprising: detecting a temperature in the vicinity of a back surface of the semiconductor feeding to be tested, and controlling the temperature of the semiconductor device to be tested based on the detected temperature.

(Appendix 20)
A test method for a semiconductor device according to appendix 16, wherein
The method for testing a semiconductor device, wherein the first semiconductor device is one or a plurality of semiconductor devices selected from the group consisting of a plurality of semiconductor devices among the semiconductor devices.

DESCRIPTION OF SYMBOLS 20 Semiconductor device 20a Ball electrode 20b Back surface 20c Mounting terminal 21 Support substrate 21a Recessed part 21b Through electrode 22 Stage 23 Test circuit 24, 24-1, 24-2, 24-3 Contactor 24a, 24c Contactor 24b Positioning hole 25, 25A, 25B, 25C, 25D, 25E, 25-1, 25-2 Pressing head 25a, 25Aa, 25Ba, 25Ca, 25Da, 25Ea Pressing surface 25b Positioning guide 25c Positioning pin 26 XY moving mechanism 27 Shift mechanism 30 Fin 31 Blower 32, 32-1, 32-2 Heater 33, 33-1, 33-2 Temperature sensor 34, 34-1, 34-2 Temperature controller 35-1, 35-2 Cooling unit

Claims (13)

A test circuit board including a contactor including a contact corresponding to the electrode of a semiconductor device under test having a plurality of electrodes on one surface;
A support substrate having a recess for accommodating the semiconductor device under test;
A stage for supporting the support substrate;
A pressing head that presses the other surface of the semiconductor device under test mounted on the support substrate and brings the electrode on the one surface of the semiconductor device under test into contact with the contactor of the contactor;
The stage is movable to a position where at least one of the semiconductor devices under test mounted on the support substrate corresponds to the contactor,
The pressing head is provided at a central portion of the pressing head, and is provided at a pressing surface for pressing the semiconductor device under test and a peripheral portion of the pressing head, and the semiconductor device under test is placed at a predetermined position in the recess. A test apparatus for a semiconductor device, comprising: a positioning guide to be arranged. A test apparatus for a semiconductor device according to claim 1,
A test apparatus for a semiconductor device, comprising a temperature control mechanism for controlling the temperature of the pressing surface of the pressing head. A test apparatus for a semiconductor device according to claim 2,
The temperature control mechanism includes a temperature sensor that detects a temperature in the vicinity of the pressing surface of the pressing head, and a temperature controller that controls the temperature based on the temperature detected by the temperature sensor. Equipment testing equipment. A test apparatus for a semiconductor device according to claim 1,
A test apparatus for a semiconductor device, wherein a first contact that contacts a mounting terminal provided on the other surface of the semiconductor device under test is provided on a pressing surface of the pressing head. A test apparatus for a semiconductor device according to claim 1,
A test apparatus for a semiconductor device, wherein a plurality of contactors are attached to the test circuit board, and a plurality of the pressing heads are provided corresponding to the plurality of contactors. A test apparatus for a semiconductor device according to any one of claims 1 to 5,
The semiconductor device testing apparatus, wherein the positioning guide has an inclined surface inclined with respect to the pressing surface. A test apparatus for a semiconductor device according to any one of claims 1 to 6,
The test apparatus for a semiconductor device, wherein the test circuit board has a first positioning hole, and the positioning guide has a first positioning pin. A test apparatus for a semiconductor device according to any one of claims 1 to 7,
The stage includes a second positioning pin, and the support substrate includes a second positioning hole at a position corresponding to the second positioning pin. Mounting a plurality of semiconductor devices having electrodes disposed on one side thereof in an aligned state on a support substrate while exposing the electrodes;
Associating the support substrate with a contactor of a test apparatus;
Using a pressing head having a pressing surface for pressing the semiconductor device under test and a positioning guide for placing the semiconductor device under test at a predetermined position in the recess, the first semiconductor device is pressed from the other surface. And bringing the electrode on the one surface of the semiconductor device into contact with the contactor of the contactor;
Testing the first semiconductor device via the contactor;
Recovering the first semiconductor device onto the support substrate;
Moving the support substrate;
Pressing the second semiconductor device from the other surface to bring the electrode of the semiconductor device into contact with the contactor of the contactor;
Testing the second semiconductor device through the contactor,
The method of testing a semiconductor device, wherein the pressing surface is provided at a central portion of the pressing head, and the positioning guide is provided at a peripheral portion of the pressing head. A test method for a semiconductor device according to claim 9, comprising:
A method for testing a semiconductor device, wherein the semiconductor device is micro-moved or micro-vibrated when the semiconductor device is pressed against the contactor. A test method for a semiconductor device according to claim 9, comprising:
A method for testing a semiconductor device, wherein when the semiconductor device is tested, the other surface of only the semiconductor device to be tested is cooled or heated. A test method for a semiconductor device according to claim 9, comprising:
A method for testing a semiconductor device, comprising: detecting a temperature in the vicinity of a back surface of the semiconductor device to be tested, and controlling the temperature of the semiconductor device to be tested based on the detected temperature. A test method for a semiconductor device according to any one of claims 9 to 12,
The test circuit board has a first positioning hole,
The positioning guide has a first positioning pin;
A test method for a semiconductor device, wherein the first positioning pin is inserted into the first positioning hole in the step of pressing the first semiconductor device and the step of pressing the second semiconductor device.

Images