JPH0618616A - Measuring method for semiconductor device - Google Patents

Abstract

PURPOSE:To obtain the measuring method for a semiconductor device, which can make electrical connection excellent and can maintain continuous stability, in the inspection of electric characteristics. CONSTITUTION:High-pressure air is blown on a measuring head 1, which inspects the electric characteristics of a semiconductor device 2, with a high- pressure air gun 3. Thus, the semiconductor device 2 and the peripheral part of the measuring head 1 for inspecting the electric characteristics are cleaned. The semiconductor device 2 is sucked with a semiconductor-device setting jig 4 and placed on the measuring head 1 for inspecting the electric characteristics. The semiconductor device 2 is pushed with the semiconductor-device setting jig 4. The semiconductor-device setting jig 4 is vibrated. Thus, the surfaces of a contact pin 5 and a lead pin 6 of the semiconductor device are polished so as to obtain the excellent electric contact. Since the surfaces of the contact pin 5 and the lead pin 6 are polished and dust is generated around the measuring set, the high-pressure air is blown with the high-pressure air gun 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring a semiconductor device, which enables good electrical connection and continuous stability in the inspection of electric characteristics of the semiconductor device.

[0002]

2. Description of the Related Art In recent years, as semiconductor devices have become smaller and the number of pins has increased, the pitch between pins has become narrower, and there has been a strong demand for improved inspection accuracy and a method for stable measurement over a long period of time. The conventional electrical characteristic inspection of the semiconductor device will be described below. FIG. 2 is a view showing a part of an electrical characteristic test of a conventional semiconductor device, and FIG. 3 is a perspective view of the semiconductor device of FIG.
In FIGS. 2 and 3, 1 is a measuring head for inspecting electrical characteristics of a semiconductor device, 2 is a semiconductor device, 4 is a semiconductor device setting jig, 5 is a contact pin for measuring electrical properties of the semiconductor device, and 6 is a lead pin of the semiconductor device. Is.

In order to inspect whether the semiconductor device is electrically operating correctly in such a structure, the assembled semiconductor device 2 is attached to the measuring head 1 with the semiconductor device setting jig 4 and the lead pins 6 are attached. The electrical characteristics are inspected from the contact pin 5 by pressing it against the contact pin 5.

[0004]

However, in the above-described conventional structure, when the contact pin 5 contacts the lead pin 6 of the semiconductor device, only the pressure from the vertical surface of the semiconductor device setting jig 4 is obtained. Absent. Further, even if the pressurizing condition at the time of contact between the lead pin 6 and the contact pin 5 of the conventional semiconductor device is examined, the problem cannot be completely removed, and contact failure due to scattering or adhesion of peripheral dust, metal powder, etc. Alternatively, there is a problem in that it is not possible to accurately and reproducibly set the electrical characteristic inspection of the semiconductor device due to the occurrence of an electrical short circuit.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a method for measuring a semiconductor device having good electrical contact between a contact pin and a lead pin of the semiconductor device during an electrical characteristic test.

[0006]

In order to achieve the above object, the present invention provides a method for measuring a semiconductor device in which a lead pin is pressed onto a contact pin by a jig to inspect electrical characteristics. The pin is vibrated and then the vibration is stopped to inspect the electrical characteristics. In addition to the constitution, a high-pressure air is blown to blow dust generated during the vibration.

[0007]

With this configuration, when vibration occurs in the contact of the lead pin after the contact pin is pressed, the electrical connection between the lead pin and the contact pin is improved, and the dust and metal powder adhered by the high pressure air are removed for a long time. The stable measurement condition is maintained.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a diagram showing an electrical characteristic inspection apparatus for a semiconductor device according to an embodiment of the present invention. In FIG. 1, the same parts as those of the conventional example of FIGS. 2 and 3 are designated by the same reference numerals, and the description thereof will be omitted. That is, the features of the present invention are that the high pressure air gun 3 is provided and the semiconductor device setting jig 4 is made to vibrate.

The operation of the method for measuring the electrical characteristics of the semiconductor device having the above-described structure according to this embodiment will be described below. First, high-pressure air is blown to the measurement head 1 for inspecting the electrical characteristics of the semiconductor device 2 by the high-pressure air gun 3, to clean the semiconductor device 2 and the periphery of the measurement head 1 for the electrical characteristics inspection, and the semiconductor device 2 is set by the semiconductor device setting jig 4. Measuring head 1 for sucking and inspecting semiconductor device 2 for electrical characteristics
On the other hand, the semiconductor device setting jig 4 is kept in pressure contact with the semiconductor device setting jig 4 and the semiconductor device setting jig 4 is vibrated to polish the surfaces of the contact pins 5 and the lead pins 6, thereby improving electrical contact. Also, since the surfaces of the contact pin 5 and the lead pin 6 are polished, dust is generated around the measurement set, but by blowing high pressure air with the high pressure air gun 3, the contact pin 5 and the lead pin 6 of the semiconductor device are cleaned, By keeping the contact surface of 6 clean and removing foreign matter, troubles such as poor electrical connection and short circuit can be prevented, good electrical contact can be obtained, and stable electrical characteristic inspection can be performed.

[0011]

EFFECTS OF THE INVENTION As is apparent from the above embodiments, according to the present invention, in addition to the structure for inspecting the electrical characteristics by applying vibration to the lead pin and the contact pin by a jig and then stopping the vibration, Since high-pressure air is blown to blow off dust generated during the above-mentioned vibration, the surface of the contact portion between the contact pin and the lead pin of the semiconductor device is polished and dust is also removed, resulting in good electrical contact. It is possible to provide an excellent semiconductor device measuring method that is accurate and has good reproducibility.

[Brief description of drawings]

FIG. 1 is a perspective view showing a method for measuring a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional method for measuring a semiconductor device.

FIG. 3 is a perspective view of the semiconductor device of FIG.

[Explanation of symbols]

 1 Measuring Head 2 Semiconductor Device 3 High Pressure Air Gun (High Pressure Air) 4 Semiconductor Device Setting Jig (Jig) 5 Contact Pin 6 Lead Pin

Claims (2)

[Claims] 1. A method for measuring a semiconductor device in which a lead pin is pressed onto a contact pin with a jig to inspect electrical characteristics, and the jig is vibrated to the lead pin and the contact pin, and then vibration is stopped to stop the electric characteristic. A method for measuring a semiconductor device, which comprises inspecting characteristics. 2. A method for measuring a semiconductor device, in which a lead pin is pressed onto a contact pin with a jig to inspect electrical characteristics, and high pressure air is blown onto the lead pin and its vicinity while the lead pin and the contact pin are pushed by the jig. A method for measuring a semiconductor device, which comprises inspecting electrical characteristics after applying a vibration to a substrate to improve a contact state.