WO2010007653A1 - Socket guide, socket, pusher and electronic part testing device - Google Patents
Socket guide, socket, pusher and electronic part testing device Download PDFInfo
- Publication number
- WO2010007653A1 WO2010007653A1 PCT/JP2008/062682 JP2008062682W WO2010007653A1 WO 2010007653 A1 WO2010007653 A1 WO 2010007653A1 JP 2008062682 W JP2008062682 W JP 2008062682W WO 2010007653 A1 WO2010007653 A1 WO 2010007653A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- socket
- pusher
- atmosphere
- guide
- partition member
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Definitions
- the present invention relates to a socket guide and socket provided on a test head of an electronic component testing apparatus, a pusher for pressing an electronic component to be tested against the socket, an electronic component handling apparatus, and an electronic component testing apparatus.
- an electronic component testing apparatus In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and functions of the finally manufactured electronic components.
- the electronic component test apparatus generally includes a tester body, a handler, and a test head, and a socket on which a device under test is mounted is provided on the test head.
- a test signal is supplied from the tester main body to the test head with the IC device mounted in the socket, the test signal is applied from the socket to the IC device, and a response signal read from the IC device is received.
- the test head By sending the test head to the tester body, the electrical characteristics of the IC device are measured.
- the IC device is often tested by applying high or low temperature heat stress.
- a method of applying thermal stress to the IC device for example, there is a method of heating or cooling the IC device in advance before transporting it to the test head.
- the IC device under test is heated or cooled in advance, and the socket in which the IC device under test is mounted is also heated or cooled. If there is a temperature difference between the IC device under test and the socket, heat transfer occurs between the IC device under test and the socket when the IC device under test is attached to the socket, and the IC device was supplied with the IC device under test. This is because thermal stress may be relieved.
- the present invention has been made in view of such a situation, and an object thereof is to provide a socket guide, a socket, a pusher, an electronic component handling apparatus, and an electronic component testing apparatus that can efficiently control the temperature of the socket.
- the present invention is provided adjacent to a socket having a connection terminal capable of contacting an external terminal of an electronic device under test, and the electronic device under test is provided at a predetermined position of the socket.
- a socket guide for guiding a member (for example, a pusher, a pusher base, a contact arm, etc.) holding the electronic device under test so as to be mounted on the pusher, and pressing the electronic device under test against the socket
- a socket guide is provided that includes an isolation means for isolating the atmosphere on the socket side and the atmosphere on the outside of the socket (Invention 1).
- the “pusher” in this specification refers to a device that presses (presses) the electronic device under test against the socket, and includes a device that sucks and holds the electronic device under test and presses it against the socket.
- the isolation means is a partition member (Invention 2).
- the partition member is erected on the socket guide so as to surround the socket in a plan view (Invention 3).
- the partition member is preferably made of an accordion-like elastic body (Invention 4).
- the isolation means may be an air curtain (Invention 5).
- a heat source capable of heating or cooling the socket may be provided (Invention 6).
- the present invention provides a socket having a connection terminal that can come into contact with an external terminal of an electronic device under test, and the socket between the pusher pressing the electronic device under test against the socket.
- a socket characterized in that it comprises an isolating means for isolating the atmosphere inside and the atmosphere outside the socket (Invention 7).
- the isolation means is a partition member (Invention 8).
- the partition member is preferably erected on the socket so as to surround the connection terminal in a plan view (Invention 9).
- the partition member is preferably made of an accordion-like elastic body (Invention 10).
- the isolation means may be an air curtain (Invention 11).
- a heat source capable of heating or cooling the socket may be provided (Invention 12).
- the present invention provides a pusher for pressing an electronic device under test against a socket of a test head in an electronic component handling apparatus, wherein the socket or the electronic device under test is pressed against the socket.
- a pusher provided with a separating means for isolating the atmosphere on the socket side and the atmosphere on the outside of the socket between the socket guide (invention 13).
- the isolation means is a partition member (Invention 14).
- the pusher includes a suction portion that sucks and holds an electronic device under test and a base portion for aligning the socket guide, and the partition member includes the suction portion. It is preferable that the base is provided so as to surround (Invention 15).
- the partition member is preferably made of a bellows-like elastic body (Invention 16).
- the isolation means may be an air curtain (Invention 17).
- a heat source capable of heating or cooling the pusher may be provided (Invention 18).
- the present invention provides an electronic component testing apparatus comprising the socket guide (Inventions 1 to 6) provided on a test head (Invention 19).
- the present invention provides an electronic component testing apparatus comprising the socket (Invention 7 to 12) provided on a test head (Invention 21).
- invention 21 it is preferable to provide a device capable of heating or cooling the socket and / or the pusher (Invention 22).
- the present invention provides an electronic component handling apparatus comprising the pusher (inventions 13 to 18) and a Z-axis drive device capable of moving the pusher in the Z-axis direction ( Invention 23).
- the present invention provides an electronic component testing apparatus including the electronic component handling apparatus (invention 23) and an apparatus capable of heating or cooling the socket and / or the pusher. (Invention 24)
- the present invention is provided adjacent to a socket having a connection terminal that can come into contact with an external terminal of the electronic device under test, and the electronic device under test is mounted at a predetermined position of the socket.
- a socket guide that guides a member that holds an electronic device under test, the board being located closer to the test head body than the socket guide, wherein the wiring from the socket is connected directly or indirectly Provided is a socket guide provided with an isolation means for isolating the atmosphere on the wiring side and the atmosphere outside the wiring between the substrate and the substrate (Invention 25).
- the isolation means is a partition member (Invention 26).
- the partition member is provided in the socket guide so as to surround the wiring in a plan view (Invention 26).
- the partition member is preferably made of an accordion-like elastic body (Invention 28).
- the partition member may extend from the socket guide toward the substrate (Invention 29).
- the present invention is a socket provided with a connection terminal that can come into contact with an external terminal of an electronic component under test, and is a substrate located closer to the test head body than the socket, and a wiring from the socket is provided.
- a socket characterized by including an isolation means for isolating the atmosphere on the wiring side and the atmosphere on the outside of the wiring between the substrate connected directly or indirectly (Invention 30). ).
- the isolation means is preferably a partition member (Invention 31).
- the partition member is provided in the socket so as to surround the wiring in a plan view (Invention 32).
- the partition member is preferably made of an accordion-like elastic body (Invention 33).
- the partition member may extend from the socket toward the substrate (Invention 34).
- the present invention provides an electronic component testing apparatus comprising the socket guide (Invention 25 to 29) and / or the socket (Invention 30 to 34) provided on a test head ( Invention 35).
- the eleventh aspect of the present invention provides an electronic component testing apparatus comprising the socket guide (Invention 1 to 6) and / or the socket (Invention 30 to 34) provided on a test head ( Invention 36).
- this invention provides the electronic component testing apparatus provided with the said socket guide (invention 25-29) and / or the said socket (invention 7-12) provided on the test head ( Invention 37).
- this invention is provided adjacent to the socket provided with the connecting terminal which can contact the external terminal of the electronic device under test, and the electronic device under test is mounted in a predetermined position of the socket.
- a socket guide that guides a member that holds an electronic device under test, wherein the socket-side atmosphere and an atmosphere outside the socket are between the pusher pressing the electronic device under test against the socket.
- a socket guide comprising a second isolation means for isolating the atmosphere on the wiring side and the atmosphere outside the wiring (Invention 38).
- this invention is a socket provided with the connection terminal which can contact the external terminal of an electronic device under test, Comprising: Between the pusher which is pressing the said electronic device under test against the said socket, A first isolating means for isolating the atmosphere inside and the atmosphere outside the socket; and a substrate located closer to the test head body than the socket, wherein the wiring from the socket is directly or indirectly Provided is a socket comprising a second isolating means for isolating the atmosphere on the wiring side and the atmosphere outside the wiring between the substrates to be connected (Invention 39).
- heat dissipation from the socket can be suppressed in the high temperature test, and heat absorption in the socket can be suppressed in the low temperature test, and the socket temperature can be controlled efficiently.
- FIG. 1 is a plan view of an electronic component test apparatus according to an embodiment of the present invention.
- FIG. 2 is a side partial cross-sectional view (II cross-sectional view in FIG. 1) of the electronic component test apparatus according to the same embodiment. It is side surface sectional drawing of the socket and socket guide in the same electronic component test apparatus. It is a top view of the socket and socket guide in the electronic component testing apparatus. It is side surface partial sectional drawing of a pusher, a socket, and a socket guide in the same electronic component test apparatus. It is a side view of the pusher concerning other embodiments of the present invention. It is a bottom view of the pusher which concerns on other embodiment of this invention. It is side surface sectional drawing of the socket and socket guide which concern on other embodiment of this invention.
- FIG. 1 is a plan view of a handler according to an embodiment of the present invention
- FIG. 2 is a side partial sectional view of the handler according to the embodiment (II sectional view in FIG. 1)
- FIG. 4 is a side sectional view of the socket and the socket guide
- FIG. 4 is a plan view of the socket and the socket guide in the electronic component testing apparatus
- FIG. 5 is a side partial sectional view of the pusher, the socket and the socket guide in the electronic component testing apparatus.
- the form of the IC device under test shown in FIG. 5 is, for example, a BGA package or a CSP (ChipCSize Package) package having solder balls as external terminals, but the present invention is not limited to this.
- a QFP (Quad Flat Package) package or a SOP (Small Outline Package) package having lead pins as external terminals may be used.
- the electronic component testing apparatus 1 in this embodiment includes a handler 10, a test head 300, and a tester 20, and the test head 300 and the tester 20 are connected via a cable 21.
- the pre-test IC device on the supply tray stored in the supply tray stocker 401 of the handler 10 is conveyed and pressed against the socket 80 of the contact portion 301 of the test head 300, and the test head 300 and the cable 21 are passed through this IC device.
- the IC device test is executed, the IC device for which the test has been completed is mounted on the classification tray stored in the classification tray stocker 402 according to the test result.
- the handler 10 mainly includes a test unit 30, an IC device storage unit 40, a loader unit 50, and an unloader unit 60.
- the IC device storage unit 40 is a part that stores IC devices before and after the test, and mainly includes a supply tray stocker 401, a classification tray stocker 402, an empty tray stocker 403, and a tray transport device 404. Consists of
- the supply tray stocker 401 a plurality of supply trays loaded with a plurality of IC devices before the test are stacked and stored.
- a stocker 401 is provided.
- the classification tray stocker 402 is loaded with a plurality of classification trays loaded with a plurality of IC devices after the test. In this embodiment, as shown in FIG. Is provided. By providing these four classification tray stockers 402, the IC devices can be sorted and stored in a maximum of four classifications according to the test results.
- the empty tray stocker 403 stores empty trays after all the pre-test IC devices 20 mounted on the supply tray stocker 401 have been supplied to the test unit 30. Note that the number of stockers 401 to 403 can be appropriately set as necessary.
- the tray transfer device 404 is a transfer device that can move in the X-axis and Z-axis directions in FIG. 1, and mainly includes an X-axis direction rail 404a, a movable head 404b, and four suction pads 404c.
- a range including the supply tray stocker 401, a part of the sorting tray stocker 402, and the empty tray stocker 403 is defined as an operation range.
- an X-axis direction rail 404a fixed on the base 12 of the handler 10 supports the movable head unit 404b in a cantilevered manner so as to be movable in the X-axis direction.
- the Z-axis direction actuator not to be used and four suction pads 404c are provided at the tip.
- the tray transport device 404 sucks and holds the empty tray emptied by the supply tray stocker 401 by the suction pad 404c, lifts it by the Z-axis direction actuator, and slides the movable head portion 404b on the X-axis direction rail 404a. By moving it, it is transferred to the empty tray stocker 401.
- the empty tray is sucked and held from the empty tray stocker 403, and is lifted by the Z-axis direction actuator.
- the movable head unit 404b is slid on the rail 404a to be transferred to the sorting tray stocker 402.
- the loader unit 50 is a part that supplies the IC device before the test from the supply tray stocker 401 of the IC device storage unit 40 to the test unit 30, and mainly includes a loader unit transport device 501 and two loader buffer units 502 ( In FIG. 1, it is composed of two in the negative X-axis direction) and a heat plate 503.
- the loader unit transport device 501 moves the IC device on the supply tray of the supply tray stocker 401 of the IC device storage unit 40 onto the heat plate 503, and moves the IC device on the heat plate 503 onto the loader buffer unit 502.
- This is a device to be moved, and mainly comprises a Y-axis direction rail 501a, an X-axis direction rail 501b, a movable head part 501c, and a suction part 501d.
- the loader unit transport device 501 has an operation range including a supply tray stocker 401, a heat plate 503, and two loader buffer units 502.
- the two Y-axis direction rails 501a of the loader unit transport device 501 are fixed on the base 12 of the handler 10, and the X-axis direction rail 502b slides in the Y-axis direction between them. It is supported movably.
- the X-axis direction rail 502b supports a movable head portion 501c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
- the movable head portion 501c includes four suction portions 501d each having a suction pad 501e at the lower end, and the four suction portions 501d are independent of each other by driving the Z-axis direction actuator. Thus, it can be moved up and down in the Z-axis direction.
- Each suction portion 501d is connected to a negative pressure source (not shown), and can suck and hold an IC device by sucking air from the suction pad 501e to generate a negative pressure.
- the IC device can be released by stopping the suction of air from the pad 501e.
- the heat plate 503 is a heating source for applying a predetermined thermal stress to the IC device.
- the heat plate 503 is a metal heat transfer plate having a heat generation source (not shown) at the bottom.
- a plurality of recesses 503a for dropping an IC device are formed.
- a cooling source may be provided instead of the heating source.
- the loader buffer unit 502 is a device that reciprocates the IC device between the operation range of the loader unit transport device 501 and the operation range of the test unit transport device 310, and mainly includes a buffer stage 502a and an X-axis direction actuator. 502b.
- a buffer stage 502a is supported at one end of an X-axis direction actuator 502b fixed on the base 12 of the handler 10, and an IC device is dropped onto the upper surface side of the buffer stage 502a as shown in FIG.
- Four recesses 502c having a rectangular shape in plan view are formed.
- the IC device before the test is moved from the supply tray stocker 401 to the heat plate 503 by the loader unit conveyance device 501 and heated to a predetermined temperature by the heat plate 503, and then again loaded by the loader unit conveyance device 501 by the loader buffer.
- the loader buffer unit 502 introduces the data into the test unit 30.
- the test unit 30 is a part that performs a test by bringing the external terminals (solder balls) of the IC device 2 under test into electrical contact with the contact pins 81 of the socket 80 of the contact unit 301.
- the test unit 30 mainly includes a test unit transport device 310.
- the test unit transport device 310 is a device that moves the IC device between the loader buffer unit 502 and the unloader buffer unit 602 and the test head 300.
- the test section transport device 310 supports two X-axis direction support members 311a slidable in the Y-axis direction on two Y-axis direction rails 311 fixed on the base 12 of the handler 10.
- a movable head portion 312 is supported at the central portion of each X-axis direction support member 311a, and the movable head portion 312 includes a loader buffer portion 502, an unloader buffer portion 602, and a test head 300. Is the operating range. Note that the movable head unit 312 supported by each of the two X-axis direction support members 311a operating simultaneously on the pair of Y-axis direction rails 311 is controlled so that the mutual operations do not interfere with each other.
- Each movable head unit 312 includes four pushers 315 at the bottom thereof.
- the four pushers 315 are provided corresponding to the arrangement of the sockets 80.
- each pusher 315 includes a pusher base 316 having a guide pin 318 that can be fitted to the guide bush 91 of the socket guide 90, and a suction portion 317 positioned below the pusher base 316. Yes.
- Each suction portion 317 is connected to a negative pressure source (not shown), and can suck and hold the IC device 2 by sucking air from the suction portion 317 to generate a negative pressure.
- the IC device 2 can be released by stopping the suction of air from the suction unit 317.
- the pusher 315 may be provided with a heat source for heating or cooling the pusher 315, such as a heater or a Peltier element, or air or the like for heating or cooling the pusher 315. Fluid may be supplied to the pusher 315.
- a heat source for heating or cooling the pusher 315, such as a heater or a Peltier element, or air or the like for heating or cooling the pusher 315. Fluid may be supplied to the pusher 315.
- the four IC devices 2 held by the pusher 315 can be moved in the Y-axis direction and the Z-axis direction and pressed against the contact portion 301 of the test head 300.
- the contact portion 301 of the test head 300 includes four sockets 80, and the four sockets 80 substantially match the arrangement of the pushers 315 of the movable head portion 312 of the test portion transport apparatus 310. Are arranged in such an array. Details of the socket 80 and the socket guide 90 will be described later.
- an opening 11 is formed in the base 12 of the handler 10, and the contact portion 301 of the test head 300 protrudes from the opening 11 and the IC device is pressed against it. It is supposed to be.
- the four pre-test IC devices placed on the loader buffer unit 502 are moved to the contact unit 301 of the test head 300 by the test unit transport device 310 and simultaneously subjected to the test, and then the test unit again.
- the unloader buffer unit 602 moves to the unloader buffer unit 602 and the unloader buffer unit 602 discharges the unloader unit 60 to the unloader unit 60.
- the unloader unit 60 is a part for discharging the tested IC device from the test unit 30 to the IC device storage unit 40.
- the unloader unit 60 mainly includes an unloader unit transport device 601 and two unloader buffer units 602 (in FIG. Two directions).
- the unloader buffer unit 602 is a device that reciprocates the operating range of the test unit transport apparatus 310 and the IC device between the operation range of the unloader unit transport apparatus 601, and mainly includes a buffer stage 602a and an X-axis direction actuator 602b. It consists of and.
- a buffer stage 602a is supported at one end of an X-axis direction actuator 602b fixed on the base 12 of the handler 10, and four recesses 602c for dropping an IC device are provided on the upper surface side of the buffer stage 602a. Is formed.
- the unloader unit conveying device 601 is a device that moves and mounts the IC device on the unloader buffer unit 602 to the classification tray of the classification tray stocker 402, and mainly includes a Y-axis direction rail 601a, an X-axis direction rail 601b, and the like.
- the movable head portion 601c and the suction portion 601d are configured.
- the unloader transport device 601 has an operation range that includes two unloader buffers 602 and a sorting tray stocker 402.
- the two Y-axis direction rails 601a of the unloader unit conveying device 601 are fixed on the base 12 of the handler 10, and the X-axis direction rail 602b slides in the Y-axis direction between them. It is supported movably.
- the X-axis direction rail 602b supports a movable head portion 601c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
- the movable head portion 601c includes four suction portions 601d each having a suction pad at the lower end portion, and the four suction portions 601d are independently raised and lowered in the Z-axis direction by driving the Z-axis direction actuator. be able to.
- the IC device after the test placed on the unloader buffer unit 602 is ejected from the test unit 30 to the unloader unit 60, and the unloader unit transport device 601 extracts the classification tray of the classification tray stocker 402 from the unloader buffer unit 602. Mounted on.
- the socket 80 and the socket guide 90 in this embodiment will be described in detail.
- the socket 80 and the socket guide 90 shown in FIGS. 3 and 4 are provided in the contact portion 301 of the test head 300 shown in FIG.
- the socket 80 includes a plurality of contact pins 81.
- the socket 80 has a concave portion at the center and a convex portion around the socket, and the plurality of contact pins 81 are formed in the concave portions of the socket 80 in an arrangement that substantially matches the arrangement of the external terminals of the IC device 2. Is provided.
- the socket guide 90 guides a pusher 315 that holds the IC device 2 under test so that the IC device 2 under test is mounted at a predetermined position of the socket 80, and is provided on the pusher base 316 of the pusher 315.
- a guide bush 91 that can be fitted to the guide pin 318 is provided.
- the socket guide 90 is provided so as to surround the socket 80, and the central portion of the socket guide 90 is a rectangular opening.
- the contact pin 81 of the socket 80 is exposed at the opening of the socket guide 90.
- the socket guide 90 in the present embodiment covers the convex portion of the socket 80 at the periphery of the opening of the socket guide 90.
- the socket 80 and / or the socket guide 90 is provided with a heat source for heating or cooling the socket 80, for example, a heater or a Peltier element, or a fluid such as heating air or cooling air.
- a heat source for heating or cooling the socket 80 for example, a heater or a Peltier element, or a fluid such as heating air or cooling air.
- the socket 80 and / or the socket guide 90 are supplied.
- a partition wall member 70 is erected on the periphery of the opening of the socket guide 90 according to the present embodiment (a position surrounding the socket 80 in plan view).
- the partition member 70 in the present embodiment is made of a bellows-like elastic body, for example, a silicone rubber, and has a square cylindrical shape as a whole.
- the partition member 70 was provided in the socket guide 90 side, as shown in FIG.6 and FIG.7, you may provide the partition member 70 in the pusher 315 side.
- the partition member 70 is provided on the pusher base 316 so as to surround the suction portion 317.
- the partition wall member 70 is elastically contracted, and the lower end of the partition wall member 70 is the socket guide 90. Adheres to the top surface. At this time, the atmosphere on the socket 80 side and the atmosphere on the outside of the socket 80 are isolated between the pusher 315 and the socket guide 90, and heat transfer between the two atmospheres is suppressed.
- the loader unit transport device 501 sucks four IC devices on the supply tray located at the uppermost stage of the supply tray stocker 401 of the IC device storage unit 40 by the suction pads 501e of the four suction units 501d. Hold.
- the loader unit transport device 501 raises the four IC devices by the Z-axis direction actuator of the movable head unit 501c while holding the four IC devices, and slides the X-axis direction rail 501b on the Y-axis direction rail 501a.
- the movable head unit 501c is slid on the X-axis direction rail 501b and moved to the loader unit 50.
- the loader unit transport device 501 performs positioning above the recess 503a of the heat plate 503, extends the Z-axis direction actuator of the movable head unit 501c, releases the suction pad 501e, and places the IC device in the recess of the heat plate 503. Drop into 503a.
- the loader unit transfer device 501 holds the four IC devices that have been heated again, and moves above one of the loader buffer units 502 that is on standby. To do.
- the loader unit transport device 501 performs positioning above the buffer stage 502a of one waiting loader buffer unit 502, extends the Z-axis direction actuator of the movable head unit 501c, and the suction pad 501e of the suction unit 501d
- the IC device held by suction is released, and the IC device 2 is placed in the recess 502c of the buffer stage 502a.
- the loader buffer unit 502 extends the X-axis direction actuator 502b while the four IC devices are mounted in the recess 502c of the buffer stage 502a, and tests the test unit 30 from the operating range of the loader unit transport device 501 of the loader unit 50.
- the four IC devices are moved to the operation range of the partial transfer device 310.
- the movable head unit 312 of the test unit transport apparatus 310 is mounted on the recess 502c of the buffer stage 502a. Move to the IC device. Then, the Z-axis direction actuator of the movable head unit 312 extends, and the four IC devices located in the recesses 502c of the buffer stage 502a of the loader buffer unit 502 are moved by the suction units 317 of the four pushers 315 of the movable head unit 312. Adsorb and hold.
- the movable head unit 312 holding the four IC devices is raised by the Z-axis direction actuator of the movable head unit 312.
- the test unit conveyance device 310 slides the X-axis direction support member 311 a that supports the movable head unit 312 on the Y-axis direction rail 311, and holds it by the suction unit 317 of the pusher 315 in the movable head unit 312.
- the four IC devices are conveyed above the four sockets 80 in the contact portion 301 of the test head 300. At this time, the socket 80 is heated to a predetermined temperature.
- the movable head unit 312 extends the Z-axis direction actuator and moves the pusher 315 downward.
- the upper end of the partition member 70 is in close contact with the lower surface of the pusher base 316, and the guide pin 318 of the pusher base 316 is fitted into the guide bush 91 of the socket guide 90.
- the external terminal of the IC device 2 held by the suction portion 317 contacts the contact pin 81 of the socket 80. During this contact, an electrical signal is transmitted / received via the contact pin 81, and the test of the IC device 2 is performed.
- the presence of the partition wall member 70 isolates the atmosphere on the socket 80 side and the atmosphere on the outside of the socket 80 between the socket guide 90 and the pusher 315, and heat dissipation from the socket 80 is performed. It is suppressed.
- the socket 80 can be controlled to a desired temperature, and the temperature of the IC device 2 is suppressed from being lowered by being attached to the socket 80. Therefore, a thermal stress of a desired temperature is applied to the IC device 2. The test can be performed in the state.
- the test unit transport apparatus 310 raises the IC device after the test by contraction of the Z-axis direction actuator of the movable head unit 312 and supports the movable head unit 312 in the X-axis direction supporting member.
- 311a is slid on the Y-axis direction rail 311 and the four IC devices held by the pusher 315 in the movable head unit 312 are on standby within the operation range of the test unit transport device 310. It is conveyed above the buffer stage 602a of the buffer unit 602.
- the movable head unit 312 extends the Z-axis direction actuator and releases the suction unit 317 to drop the four IC devices into the recess 602c of the buffer stage 602a.
- the unloader buffer unit 602 drives the X-axis actuator 602b while mounting the four IC devices after the test, and from the operating range of the test unit transport device 310 of the test unit 30, the unloader unit transport device 601 of the unloader unit 60.
- the IC device is moved to the operation range.
- the Z-axis direction actuator of the movable head unit 601c of the unloader unit transport apparatus 601 located above the unloader buffer unit 602 is extended, and the four suction units 601d of the movable head unit 601c cause the unloader buffer unit 602 to The four IC devices after the test located in the recess 602c of the buffer stage 602a are sucked and held.
- the unloader unit conveyance device 601 lifts the four IC devices by the Z-axis direction actuator of the movable head unit 601c while holding the four IC devices after the test, and slides the X-axis direction rail 601b on the Y-axis direction rail 601a.
- the movable head unit 601c is slid on the X-axis direction rail 601b and moved onto the classification tray stocker 402 of the IC device storage unit 40. Then, according to the test result of each IC device, each IC device is mounted on the classification tray located at the uppermost stage of each classification tray stocker 402. As described above, the IC device is tested once.
- the partition member 70 is an accordion-like elastic body, but may be an elastic body that is not accordion-like, or may not be an elastic body.
- the partition member 70 is made of elastic or hard rubber; plastic (including porous material); thermoplastic elastomer (including porous material); fiber reinforced plastic; fiber aggregate such as woven fabric and non-woven fabric; metal Or may be made of a composite material thereof or the like, and is preferably made of a material excellent in heat insulation. Even when the partition member 70 is made of any material (particularly when it is made of a material having high rigidity), the height of the partition member 70 is set so that the pusher 315 pushes the IC device 2 against the socket 80. It is necessary to set the height so as not to prevent the downward movement of the.
- an air curtain may be used instead of the partition member 70.
- a plurality of air discharge ports 71 are formed at positions corresponding to the partition member 70 in the pusher 315, and correspond to the partition member 70 in the socket guide 90 (or socket 80).
- a plurality of air air suction ports are formed at positions where the air is discharged, air having a temperature similar to that of the socket 80 is discharged from the air discharge port 71, and the air is sucked from the air suction port 72.
- the air discharge port 71 and the air suction port 72 may be reversed.
- the atmosphere on the socket 80 side and the atmosphere outside the socket 80 are isolated between the pusher 315 and the socket guide 90, and heat transfer between the two atmospheres is suppressed.
- FIG. 13 is a side cross-sectional view of the upper part of the test head in the electronic component testing apparatus according to the second embodiment of the present invention.
- a board called a performance board 320 is provided above the test head 300 and below the socket 80.
- the socket 80 and the performance board 320 are electrically connected by the wiring 350 connected via the several board
- substrates 331, 332, and 333 are supported by the support column 340, and is larger toward the lower side (performance board 320 side).
- a partition wall member 73 is provided between the socket 80 and the performance board 320 so as to surround the plurality of substrates 331, 332, 333 and the wiring 350 assembled in the shape of the tower. Specifically, the upper end portion of the partition wall member 73 is fixed to the lower surface of the socket 80, and the lower end portion of the partition wall member 73 is in close contact with the upper surface of the performance board 320.
- the partition member 73 in the present embodiment is made of a bellows-like elastic body, for example, a silicone rubber, and has a rectangular tube shape that expands downward (to the performance board 320 side) as a whole.
- a partition wall member 74 is provided between the socket guide 90 and the performance board 320 so as to surround the plurality of substrates 331, 332, 333, the wiring 350, and the partition wall member 73 assembled in the shape of the tower. Yes. Specifically, the upper end portion of the partition wall member 74 is fixed to the lower surface of the socket guide 90, and the lower end portion of the partition wall member 74 is in close contact with the upper surface of the performance board 320.
- the partition member 74 in the present embodiment is made of a bellows-like elastic body, for example, a silicone rubber, and has a square cylindrical shape as a whole.
- the atmosphere on the wiring 350 side and the atmosphere outside the wiring 350 are isolated between the socket guide 90 and the performance board 320, and heat transfer between the two atmospheres is suppressed. . Accordingly, heat dissipation from the lower surface of the socket 80, the lower surface of the socket guide 90 and the wiring 350 in the high temperature test, and heat absorption in the lower surface of the socket 80, the lower surface of the socket guide 90 and the wiring 350 in the low temperature test are suppressed. It becomes possible to perform temperature control efficiently.
- the heat insulation effect is enhanced as compared with the case where only one partition member is provided, and the heat between the atmosphere on the wiring 350 side and the atmosphere outside the wiring 350 is increased.
- the movement can be suppressed more effectively, and the temperature control of the socket 80 can be performed more efficiently.
- the partition wall member 73 spreads downward in accordance with the plurality of substrates 331, 332, 333 that are enlarged downward, and thus can be provided at a position closer to the wiring 350. . Therefore, heat dissipation from the wiring 350 or heat absorption in the wiring 350 can be more effectively suppressed, and therefore the temperature control of the socket 80 can be performed more efficiently.
- the two partition members 73 and 74 are provided, but only one of them may be provided, and the effect of the present invention can be obtained.
- the socket 80 and the performance board 320 are electrically connected by the wiring 350 connected via the several board
- the socket 80 and the performance board 320 may be electrically connected via a plurality of blocks 361 and 362 that incorporate wiring.
- a partition wall member 74 is provided between the socket guide 90 and the performance board 320 so as to surround the plurality of blocks 361 and 362. Further, as in the above embodiment, a partition member 73 may be further provided between the socket 80 and the performance board 320 so as to surround the plurality of blocks 361 and 362, or the partition member 74 is omitted. Thus, only the partition member 73 may be provided.
- the partition member 74 in the second embodiment and the partition member 70 in the first embodiment may be provided together. Thereby, heat dissipation or heat absorption on both the upper and lower sides of the socket 80 can be effectively suppressed, and thus the temperature control of the socket 80 can be performed more efficiently.
- the partition member 70 is erected on the socket guide 90, but may be erected on the socket 80.
- a partition member 73 may be further provided between the socket 80 and the performance board 320, or the partition member 74 may be omitted and only the partition member 73 is provided. Good.
- partition members 70, 73, 74 may be changed to air curtains.
- the present invention is useful for an electronic component testing apparatus that performs a test by applying high or low temperature thermal stress to the electronic component.
Abstract
Description
2…ICデバイス(電子部品)
10…電子部品ハンドリング装置(ハンドラ)
70,73,74…隔壁部材
71…エア吐出口
72…エア吸引口
80…ソケット
81…コンタクトピン(接続端子)
90…ソケットガイド
300…テストヘッド
315…プッシャ
316…プッシャベース(基部)
317…吸着部
320…パフォーマンスボード(基板)
350…配線 DESCRIPTION OF SYMBOLS 1 ... Electronic
10 ... Electronic component handling device (handler)
70, 73, 74 ...
90 ...
317 ... Adsorption
350 ... wiring
〔第1の実施形態〕
図1は本発明の一実施形態に係るハンドラの平面図、図2は同実施形態に係るハンドラの側面部分断面図(図1におけるI-I断面図)、図3は同電子部品試験装置におけるソケットおよびソケットガイドの側面断面図、図4は同電子部品試験装置におけるソケットおよびソケットガイドの平面図、図5は同電子部品試験装置におけるプッシャ、ソケットおよびソケットガイドの側面部分断面図である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a plan view of a handler according to an embodiment of the present invention, FIG. 2 is a side partial sectional view of the handler according to the embodiment (II sectional view in FIG. 1), and FIG. 4 is a side sectional view of the socket and the socket guide, FIG. 4 is a plan view of the socket and the socket guide in the electronic component testing apparatus, and FIG. 5 is a side partial sectional view of the pusher, the socket and the socket guide in the electronic component testing apparatus.
以上のようにして、ICデバイスの試験が1回行われる。 The unloader
As described above, the IC device is tested once.
例えば、図8~図10に示すように、ソケット80の凸部がソケットガイド90に覆われずにプッシャ315側に露出している場合には、隔壁部材70は、ソケット80の凸部に立設されてもよい。 In the above embodiment, the following modifications may be made.
For example, as shown in FIGS. 8 to 10, when the convex portion of the
次に、本発明の第2の実施形態について説明する。
図13は、本発明の第2の実施形態に係る電子部品試験装置におけるテストヘッド上部の側面断面図である。 [Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 13 is a side cross-sectional view of the upper part of the test head in the electronic component testing apparatus according to the second embodiment of the present invention.
Claims (39)
- 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットに隣接して設けられ、被試験電子部品が前記ソケットの所定の位置に装着されるように、前記被試験電子部品を保持する部材をガイドするソケットガイドであって、
前記被試験電子部品を前記ソケットに押圧しているプッシャとの間において、前記ソケット側の雰囲気と、前記ソケットの外側の雰囲気とを隔離する隔離手段を備えたことを特徴とするソケットガイド。 The electronic device under test is held adjacent to a socket having a connection terminal that can come into contact with an external terminal of the electronic device under test so that the electronic device under test is mounted at a predetermined position of the socket. A socket guide for guiding members,
A socket guide comprising isolation means for isolating the atmosphere on the socket side and the atmosphere on the outside of the socket between the pusher pressing the electronic device under test against the socket. - 前記隔離手段が、隔壁部材であることを特徴とする請求項1に記載のソケットガイド。 The socket guide according to claim 1, wherein the separating means is a partition member.
- 前記隔壁部材が、平面視において前記ソケットを囲繞するように前記ソケットガイドに立設されていることを特徴とする請求項2に記載のソケットガイド。 3. The socket guide according to claim 2, wherein the partition member is erected on the socket guide so as to surround the socket in a plan view.
- 前記隔壁部材が、蛇腹状の弾性体からなることを特徴とする請求項2または3に記載のソケットガイド。 The socket guide according to claim 2 or 3, wherein the partition member is made of a bellows-like elastic body.
- 前記隔離手段が、エアカーテンであることを特徴とする請求項1に記載のソケットガイド。 The socket guide according to claim 1, wherein the isolating means is an air curtain.
- 前記ソケットを加熱または冷却することのできる熱源を備えたことを特徴とする請求項1~5のいずれかに記載のソケットガイド。 The socket guide according to any one of claims 1 to 5, further comprising a heat source capable of heating or cooling the socket.
- 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットであって、
前記被試験電子部品を前記ソケットに押圧しているプッシャとの間において、前記ソケットの内側の雰囲気と、前記ソケットの外側の雰囲気とを隔離する隔離手段を備えたことを特徴とするソケット。 A socket having a connection terminal that can come into contact with an external terminal of an electronic device under test,
A socket comprising isolating means for isolating the atmosphere inside the socket and the atmosphere outside the socket between the pusher pressing the electronic device under test against the socket. - 前記隔離手段が、隔壁部材であることを特徴とする請求項7に記載のソケット。 The socket according to claim 7, wherein the isolating means is a partition member.
- 前記隔壁部材は、平面視において前記接続端子を囲繞するように前記ソケットに立設されていることを特徴とする請求項8に記載のソケットガイド。 The socket guide according to claim 8, wherein the partition member is erected on the socket so as to surround the connection terminal in a plan view.
- 前記隔壁部材が、蛇腹状の弾性体からなることを特徴とする請求項8または9に記載のソケット。 The socket according to claim 8 or 9, wherein the partition member is made of a bellows-like elastic body.
- 前記隔離手段が、エアカーテンであることを特徴とする請求項7に記載のソケット。 The socket according to claim 7, wherein the isolation means is an air curtain.
- 前記ソケットを加熱または冷却することのできる熱源を備えたことを特徴とする請求項7~11のいずれかに記載のソケット。 The socket according to any one of claims 7 to 11, further comprising a heat source capable of heating or cooling the socket.
- 電子部品ハンドリング装置において被試験電子部品をテストヘッドのソケットに押圧するためのプッシャであって、
前記被試験電子部品を前記ソケットに押圧している状態で、前記ソケットまたはソケットガイドとの間において、前記ソケット側の雰囲気と、前記ソケットの外側の雰囲気とを隔離する隔離手段を備えたことを特徴とするプッシャ。 A pusher for pressing an electronic device under test against a socket of a test head in an electronic component handling device,
Isolation means for isolating the atmosphere on the socket side and the atmosphere on the outside of the socket between the socket and the socket guide while the electronic device under test is pressed against the socket. A featured pusher. - 前記隔離手段が、隔壁部材であることを特徴とする請求項13に記載のプッシャ。 14. The pusher according to claim 13, wherein the separating means is a partition member.
- 前記プッシャは、被試験電子部品を吸着保持する吸着部と、前記ソケットガイドとの位置合わせを行うための基部とを備えており、
前記隔壁部材は、前記吸着部を囲繞するように前記基部に設けられていることを特徴とする請求項14に記載のプッシャ。 The pusher includes a suction part for sucking and holding an electronic component to be tested, and a base part for performing alignment with the socket guide,
The pusher according to claim 14, wherein the partition member is provided on the base portion so as to surround the adsorption portion. - 前記隔壁部材が、蛇腹状の弾性体からなることを特徴とする請求項14または15に記載のプッシャ。 The pusher according to claim 14 or 15, wherein the partition member is made of a bellows-like elastic body.
- 前記隔離手段が、エアカーテンであることを特徴とする請求項13に記載のプッシャ。 The pusher according to claim 13, wherein the isolating means is an air curtain.
- 前記プッシャを加熱または冷却することのできる熱源を備えたことを特徴とする請求項13~17のいずれかに記載のプッシャ。 The pusher according to any one of claims 13 to 17, further comprising a heat source capable of heating or cooling the pusher.
- テストヘッド上に設けられた請求項1~6のいずれかに記載のソケットガイドを備えたことを特徴とする電子部品試験装置。 An electronic component testing apparatus comprising the socket guide according to claim 1 provided on a test head.
- 前記ソケットおよび/または前記プッシャを加熱または冷却することのできる装置を備えたことを特徴とする請求項19に記載の電子部品試験装置。 20. The electronic component testing apparatus according to claim 19, further comprising a device capable of heating or cooling the socket and / or the pusher.
- テストヘッド上に設けられた請求項7~12のいずれかに記載のソケットを備えたことを特徴とする電子部品試験装置。 An electronic component test apparatus comprising the socket according to any one of claims 7 to 12 provided on a test head.
- 前記ソケットおよび/または前記プッシャを加熱または冷却することのできる装置を備えたことを特徴とする請求項21に記載の電子部品試験装置。 The electronic component testing device according to claim 21, further comprising a device capable of heating or cooling the socket and / or the pusher.
- 請求項13~18のいずれかに記載のプッシャと、
前記プッシャをZ軸方向に移動させることのできるZ軸駆動装置と
を備えたことを特徴とする電子部品ハンドリング装置。 The pusher according to any one of claims 13 to 18,
An electronic component handling device comprising: a Z-axis drive device capable of moving the pusher in the Z-axis direction. - 請求項23に記載の電子部品ハンドリング装置を備えるとともに、
前記ソケットおよび/または前記プッシャを加熱または冷却することのできる装置を備えたことを特徴とする電子部品試験装置。 The electronic component handling apparatus according to claim 23 is provided.
An electronic component testing apparatus comprising a device capable of heating or cooling the socket and / or the pusher. - 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットに隣接して設けられ、被試験電子部品が前記ソケットの所定の位置に装着されるように、前記被試験電子部品を保持する部材をガイドするソケットガイドであって、
前記ソケットガイドよりもテストヘッド本体側に位置する基板であって、前記ソケットからの配線が直接的または間接的に接続される前記基板との間において、前記配線側の雰囲気と、前記配線の外側の雰囲気とを隔離する隔離手段を備えたことを特徴とするソケットガイド。 The electronic device under test is held adjacent to a socket having a connection terminal that can come into contact with an external terminal of the electronic device under test so that the electronic device under test is mounted at a predetermined position of the socket. A socket guide for guiding members,
A board located closer to the test head body than the socket guide, and the wiring side atmosphere between the board and the board to which the wiring from the socket is directly or indirectly connected, and the outside of the wiring A socket guide comprising an isolating means for isolating the atmosphere. - 前記隔離手段が、隔壁部材であることを特徴とする請求項25に記載のソケットガイド。 26. The socket guide according to claim 25, wherein the separating means is a partition member.
- 前記隔壁部材が、平面視において前記配線を囲繞するように前記ソケットガイドに設けられていることを特徴とする請求項26に記載のソケットガイド。 27. The socket guide according to claim 26, wherein the partition member is provided on the socket guide so as to surround the wiring in a plan view.
- 前記隔壁部材が、蛇腹状の弾性体からなることを特徴とする請求項26または27に記載のソケットガイド。 28. The socket guide according to claim 26 or 27, wherein the partition member is made of a bellows-like elastic body.
- 前記隔壁部材が、前記ソケットガイドから前記基板に向かって広がっていることを特徴とする請求項26~28のいずれかに記載のソケットガイド。 The socket guide according to any one of claims 26 to 28, wherein the partition member extends from the socket guide toward the substrate.
- 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットであって、
前記ソケットよりもテストヘッド本体側に位置する基板であって、前記ソケットからの配線が直接的または間接的に接続される前記基板との間において、前記配線側の雰囲気と、前記配線の外側の雰囲気とを隔離する隔離手段を備えたことを特徴とするソケット。 A socket having a connection terminal that can come into contact with an external terminal of an electronic device under test,
A board located closer to the test head body than the socket, wherein the wiring side atmosphere and the outside of the wiring are between the board to which the wiring from the socket is directly or indirectly connected. A socket comprising an isolating means for isolating the atmosphere. - 前記隔離手段が、隔壁部材であることを特徴とする請求項30に記載のソケット。 The socket according to claim 30, wherein the isolating means is a partition member.
- 前記隔壁部材が、平面視において前記配線を囲繞するように前記ソケットに設けられていることを特徴とする請求項31に記載のソケット。 The socket according to claim 31, wherein the partition member is provided in the socket so as to surround the wiring in a plan view.
- 前記隔壁部材が、蛇腹状の弾性体からなることを特徴とする請求項31または32に記載のソケット。 The socket according to claim 31 or 32, wherein the partition member is made of a bellows-like elastic body.
- 前記隔壁部材が、前記ソケットから前記基板に向かって広がっていることを特徴とする請求項31~33のいずれかに記載のソケットガイド。 The socket guide according to any one of claims 31 to 33, wherein the partition member extends from the socket toward the substrate.
- テストヘッド上に設けられた請求項25~29のいずれかに記載のソケットガイドおよび/または請求項30~34のいずれかに記載のソケットを備えたことを特徴とする電子部品試験装置。 An electronic component testing apparatus comprising the socket guide according to any one of claims 25 to 29 and / or the socket according to any one of claims 30 to 34 provided on a test head.
- テストヘッド上に設けられた請求項1~6のいずれかに記載のソケットガイドおよび/または請求項30~34のいずれかに記載のソケットを備えたことを特徴とする電子部品試験装置。 An electronic component testing apparatus comprising the socket guide according to any one of claims 1 to 6 and / or the socket according to any one of claims 30 to 34 provided on a test head.
- テストヘッド上に設けられた請求項25~29のいずれかに記載のソケットガイドおよび/または請求項7~12のいずれかに記載のソケットを備えたことを特徴とする電子部品試験装置。 An electronic component testing apparatus comprising the socket guide according to any one of claims 25 to 29 and / or the socket according to any one of claims 7 to 12 provided on a test head.
- 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットに隣接して設けられ、被試験電子部品が前記ソケットの所定の位置に装着されるように、前記被試験電子部品を保持する部材をガイドするソケットガイドであって、
前記被試験電子部品を前記ソケットに押圧しているプッシャとの間において、前記ソケット側の雰囲気と、前記ソケットの外側の雰囲気とを隔離する第1の隔離手段と、
前記ソケットガイドよりもテストヘッド本体側に位置する基板であって、前記ソケットからの配線が直接的または間接的に接続される前記基板との間において、前記配線側の雰囲気と、前記配線の外側の雰囲気とを隔離する第2の隔離手段と
を備えたことを特徴とするソケットガイド。 The electronic device under test is held adjacent to a socket having a connection terminal that can come into contact with an external terminal of the electronic device under test so that the electronic device under test is mounted at a predetermined position of the socket. A socket guide for guiding members,
A first isolating means for isolating the atmosphere on the socket side and the atmosphere on the outside of the socket between the pusher pressing the electronic device under test against the socket;
A board located closer to the test head body than the socket guide, and the wiring side atmosphere between the board and the board to which the wiring from the socket is directly or indirectly connected, and the outside of the wiring And a second isolating means for isolating the atmosphere. - 被試験電子部品の外部端子と接触し得る接続端子を備えたソケットであって、
前記被試験電子部品を前記ソケットに押圧しているプッシャとの間において、前記ソケットの内側の雰囲気と、前記ソケットの外側の雰囲気とを隔離する第1の隔離手段と、
前記ソケットよりもテストヘッド本体側に位置する基板であって、前記ソケットからの配線が直接的または間接的に接続される前記基板との間において、前記配線側の雰囲気と、前記配線の外側の雰囲気とを隔離する第2の隔離手段と
を備えたことを特徴とするソケット。 A socket having a connection terminal that can come into contact with an external terminal of an electronic device under test,
First isolating means for isolating the atmosphere inside the socket and the atmosphere outside the socket between the pusher pressing the electronic device under test against the socket;
A board located closer to the test head body than the socket, and the wiring side atmosphere between the board and the board to which the wiring from the socket is directly or indirectly connected, and the outside of the wiring A socket comprising a second isolating means for isolating the atmosphere.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117001989A KR101222505B1 (en) | 2008-07-14 | 2008-07-14 | Socket guide, socket, pusher and electronic part testing device |
PCT/JP2008/062682 WO2010007653A1 (en) | 2008-07-14 | 2008-07-14 | Socket guide, socket, pusher and electronic part testing device |
JP2010520692A JPWO2010007653A1 (en) | 2008-07-14 | 2008-07-14 | Socket guide, socket, pusher and electronic component testing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/062682 WO2010007653A1 (en) | 2008-07-14 | 2008-07-14 | Socket guide, socket, pusher and electronic part testing device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010007653A1 true WO2010007653A1 (en) | 2010-01-21 |
Family
ID=41550072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/062682 WO2010007653A1 (en) | 2008-07-14 | 2008-07-14 | Socket guide, socket, pusher and electronic part testing device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2010007653A1 (en) |
KR (1) | KR101222505B1 (en) |
WO (1) | WO2010007653A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183740A1 (en) * | 2012-06-06 | 2013-12-12 | 東京エレクトロン株式会社 | Wafer inspection interface and wafer inspection device |
JP2017116369A (en) * | 2015-12-24 | 2017-06-29 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
WO2020148947A1 (en) * | 2019-01-15 | 2020-07-23 | 株式会社 Synax | Contactor and handler |
US11231456B2 (en) | 2018-12-21 | 2022-01-25 | Synax Co., Ltd. | Handler |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102037926B1 (en) * | 2013-04-10 | 2019-10-29 | 세메스 주식회사 | Apparatus for controlling temperature in semiconductor package inspection |
KR102211488B1 (en) | 2014-10-31 | 2021-02-03 | 삼성전자주식회사 | Adaptor structure and apparatus for testing a semiconductor package including the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0385586U (en) * | 1989-12-20 | 1991-08-29 | ||
JPH0452572A (en) * | 1990-06-20 | 1992-02-20 | Nec Kyushu Ltd | High-temperature characteristic measuring device |
JPH07239362A (en) * | 1994-02-28 | 1995-09-12 | Ando Electric Co Ltd | Suction hand with floating mechanism and transferring/ touching mechanism |
JPH1068756A (en) * | 1996-08-28 | 1998-03-10 | Advantest Corp | Constant temperature oven fro ic testing |
JP2007113949A (en) * | 2005-10-18 | 2007-05-10 | Genesis Technology Inc | Device testing mechanism, handler, and testing method of device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3848785B2 (en) * | 1997-05-12 | 2006-11-22 | 株式会社アドバンテスト | Semiconductor device test equipment |
-
2008
- 2008-07-14 WO PCT/JP2008/062682 patent/WO2010007653A1/en active Application Filing
- 2008-07-14 KR KR1020117001989A patent/KR101222505B1/en active IP Right Grant
- 2008-07-14 JP JP2010520692A patent/JPWO2010007653A1/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0385586U (en) * | 1989-12-20 | 1991-08-29 | ||
JPH0452572A (en) * | 1990-06-20 | 1992-02-20 | Nec Kyushu Ltd | High-temperature characteristic measuring device |
JPH07239362A (en) * | 1994-02-28 | 1995-09-12 | Ando Electric Co Ltd | Suction hand with floating mechanism and transferring/ touching mechanism |
JPH1068756A (en) * | 1996-08-28 | 1998-03-10 | Advantest Corp | Constant temperature oven fro ic testing |
JP2007113949A (en) * | 2005-10-18 | 2007-05-10 | Genesis Technology Inc | Device testing mechanism, handler, and testing method of device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183740A1 (en) * | 2012-06-06 | 2013-12-12 | 東京エレクトロン株式会社 | Wafer inspection interface and wafer inspection device |
US9689894B2 (en) | 2012-06-06 | 2017-06-27 | Tokyo Electron Limited | Wafer inspection interface and wafer inspection apparatus |
JP2017116369A (en) * | 2015-12-24 | 2017-06-29 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
US11231456B2 (en) | 2018-12-21 | 2022-01-25 | Synax Co., Ltd. | Handler |
WO2020148947A1 (en) * | 2019-01-15 | 2020-07-23 | 株式会社 Synax | Contactor and handler |
JP2020112468A (en) * | 2019-01-15 | 2020-07-27 | 株式会社 Synax | Contactor and handler |
CN111989578A (en) * | 2019-01-15 | 2020-11-24 | 株式会社Synax | Contactor and treater |
TWI737023B (en) * | 2019-01-15 | 2021-08-21 | 日商賽納克股份有限公司 | Contactor and handler |
US11353500B2 (en) | 2019-01-15 | 2022-06-07 | Synax Co., Ltd. | Contactor and handler |
Also Published As
Publication number | Publication date |
---|---|
KR20110022719A (en) | 2011-03-07 |
JPWO2010007653A1 (en) | 2012-01-05 |
KR101222505B1 (en) | 2013-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5161870B2 (en) | Socket guide, socket unit, electronic component test apparatus, and socket temperature control method | |
KR100708283B1 (en) | Testing device and testing method of a semiconductor device | |
US8207744B2 (en) | Testing apparatus | |
JP4331165B2 (en) | Electronic component testing equipment | |
US9176169B2 (en) | Probe apparatus and test apparatus | |
WO2010007653A1 (en) | Socket guide, socket, pusher and electronic part testing device | |
JPWO2004106945A1 (en) | Electronic component testing equipment | |
WO2008041334A1 (en) | Electronic component testing apparatus | |
US20050036275A1 (en) | Insert and electronic component handling apparatus comprising the same | |
JP4222442B2 (en) | Insert for electronic component testing equipment | |
KR101969214B1 (en) | Semiconductor device pick-up module and apparatus testing semiconductor devices having the same | |
KR100957561B1 (en) | Unit for transferring customer trays and test handler having the unit for transferring customer trays | |
KR100962632B1 (en) | Method of transferring customer trays, unit for transferring customer trays, and test handler having the unit for transferring customer trays | |
JPH09152466A (en) | Method and apparatus for testing ic | |
KR100946335B1 (en) | Unit for transferring customer trays, method of transferring customer trays, and test handler having the unit for transferring customer trays | |
KR100747076B1 (en) | Pusher and electronic part tester with the pusher | |
JP2002181887A (en) | Testing device for electronic component | |
JP3379077B2 (en) | IC test equipment | |
JP2001116800A (en) | Electronic part tester | |
JP5423627B2 (en) | Semiconductor device test apparatus and test method | |
JP2011044462A (en) | Conveying device and conveying means | |
KR102531189B1 (en) | A test apparatus for dyes obtained from wafer singulation and a test method | |
JP2002207065A (en) | Apparatus for holding part | |
JP2000171521A (en) | Electronic part attraction apparatus and electronic part-testing apparatus | |
KR20180012973A (en) | Apparatus for testing semiconductor devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08778153 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010520692 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20117001989 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08778153 Country of ref document: EP Kind code of ref document: A1 |