JP2002207065A - Apparatus for holding part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part-holding apparatus which can prevent an attitude abnormality of parts to be tested by turning on/off clamping only necessary parts to be tested, and can speed up operations. SOLUTION: The part-holding apparatus 500 loads a plurality of ICs as the parts to be tested to a plurality of inserts 16 each having a clamping mechanism 163 for fixing and releasing the ICs, or holds the plurality of ICs loaded to the plurality of inserts 16. The apparatus 500 is provided with a plurality of suction pads 504 each for holding one IC, a plurality of clamping-switching pins 506 each for turning on/off the fixing and releasing the IC by one clamping mechanism, a plurality of third base plates 503 to each of which one suction pad and one clamping-switching pin are set, and a plurality of driving means 507 and 508 for moving one third base plate to be close to and away from the insert.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component holding apparatus suitable for use in an electronic component testing apparatus for testing various electronic components (hereinafter, typically referred to as IC chips) such as semiconductor integrated circuit elements.

[0002]

2. Description of the Related Art In a process of manufacturing a semiconductor device or the like, the finally manufactured I
A test device for testing an electronic component such as a C chip is required. As one type of such a test device, an electronic component test device that tests an IC chip under normal or higher or lower temperature conditions than normal temperature is known. This is because, as a characteristic of the IC chip, it is necessary to guarantee that the IC chip operates well at normal temperature or at high or low temperature.

In this type of electronic component test apparatus, a large number of pre-test IC chips mounted on a customer tray are tested after being replaced on a test tray conveyed in the test apparatus. IC chips are replaced on customer trays of different categories according to test results.
A component holding device called a pick and place is used for the operation of replacing the IC chip. Also, a plurality of IC chip mounting tools called inserts are mounted on the test tray, and the IC chips are fixed by clamps so that the IC chips do not jump out of the inserts during transportation.

FIG. 11 is a side view showing an example of a conventional component holding device utilizing vacuum suction. The component holding device includes a suction head 5 having a suction pad 504 attached to the tip.
The head 503 is movable in the Z-axis direction (vertical direction) by a linear guide 507 and an air cylinder 508. Further, the IC chip mounted on the insert 16 is sucked by the suction pad 504, and the IC chip held by the suction pad 504 is sucked by the insert 16.
In order to release the clamp 163 for fixing the IC chip when the IC chip is accommodated in the device, a clamp release head 509 different from the suction head 503 is provided so as to be movable in the Z-axis direction (up-down direction). I have.

[0005] The IC mounted on the insert 16
When adsorbing a chip, first, the head 5 for clamping release
09 toward insert 16 and clamp 1
The clamp 163 is opened by pushing down the lever plate 162 which is linked to the suction head 5.
03 is lowered toward the IC chip to suck the IC chip. After the IC chip is sucked, the suction head 503 is raised, and then the clamp release head 509 is raised to close the clamp 163. Also, the suction pad 50
When the IC chip held by the clamp 4 is accommodated in the insert 16, first, the clamp release head 509 is lowered toward the insert 16, and the lever plate 162 linked with the clamp 163 is pushed down to thereby lower the clamp 1.
63 is opened, the suction head 503 is lowered toward the insert 16 in this state, the IC chip is released by releasing the suction, and after releasing the IC chip, the suction head 503 is raised. The clamp 163 is closed by being raised. The suction head 503 is provided with, for example, eight suction pads 504, and the clamp release head 509 is also configured to open and close the clamps 163 of the eight inserts 16 at the same time.

However, in the conventional component holding device, since the clamps for a plurality of inserts are simultaneously opened and closed, unnecessary clamps for the inserts may be opened in some cases. There has been a problem that the impact of the operation of the clamp releasing head causes the posture of the IC chip normally accommodated up to that time to become abnormal. For this reason, the impact due to the operation of the clamp release head needs to be small enough that the posture of the IC chip does not change, and it has been extremely difficult to speed up the operation of the clamp release head. .

In particular, the number of IC chips to be tested in recent years, such as CSPs, has increased significantly, and thus the above-mentioned problem of the abnormal posture of the IC chips has become remarkable.

Further, in the conventional component holding apparatus, the clamp releasing head and the suction head are operated by independent driving sources. Due to the operation sequence, when both the heads are lowered, the clamp releasing head is lowered. Otherwise, the suction head cannot be lowered, and when both heads are raised, the suction release head can only be raised after the suction head has been raised. Therefore, the two-step operation time of both heads Was needed.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component holding device capable of preventing an abnormal posture of a component under test by turning ON / OFF a clamp of only a necessary component under test and increasing the operation speed. I do.

(1) According to the present invention, a plurality of components to be tested are mounted on a plurality of component mounting devices having a clamp mechanism for fixing and releasing the component to be tested, or mounted on the plurality of component mounting devices. What is claimed is: 1. A component holding device for holding a plurality of components under test, wherein a plurality of component holding means respectively holding said one component under test and ON / OFF of fixing and release of said component under test by said one clamp mechanism. A plurality of clamp ON / OFF means, a plurality of bases provided with the one component holding means and the one clamp ON / OFF means, and the one base moving toward and away from the component mounting tool. And a plurality of driving means for driving the component.

Although not particularly limited in the above invention,
More preferably, a plurality of sets of component holding units including the component holding unit, the clamp ON / OFF unit, the base and the driving unit are provided, and a pitch changing unit for changing a holding pitch of the component under test by the component holding unit is more preferable. .

In this case, the pitch varying means has a link mechanism for connecting the component holding means, and a link mechanism driving means for operating the link mechanism, and the link mechanism driving means is provided on both ends of the component holding means. More preferably, they are connected to each other.

In this case, it is more preferable that the link mechanism includes a sub-link mechanism for connecting the component holding means located at the center of the component holding means.

(2) In the component holding apparatus of the present invention, a component holding means for holding the component under test, and a clamp ON for turning on / off the fixing and release of the component under test by the clamp.
The / OFF means is attached to one base, and is moved toward and away from the component mounting tool by the driving means at the same time. This operation is performed independently for one component under test.

Therefore, the fixing and releasing by the clamp can be turned ON / OFF only for the required component holder, and the fixed state is maintained as it is for the component to be tested which does not require the fixing and releasing of the clamp. Thus, the component under test can be maintained in a normal posture. Further, since the fixing / releasing by the clamp can be turned ON / OFF only for the required component to be tested, it is not necessary to suppress the shock as a whole, and thus the operation can be sped up.

(3) In the component holding apparatus of the present invention provided with the pitch changing means for changing the holding pitch of the component under test, the pitch of the stage holding the component under test and the stage releasing the component are different. However, this can be dealt with by changing the pitch in the holding process. Therefore, a separate pitch changing step is not required, and the component can be transferred to a stage having a different pitch by one component holding device.

In particular, by connecting the link mechanism driving means to the component holding means located at both ends, the link mechanism driving means is connected to the component holding means closer to the center.
The mechanical error of the link mechanism is reduced, and the mounting accuracy of the component under test is increased.

In addition, by providing a sub-link mechanism for connecting the component holding means located at the center of the component holding means, the mechanical error of the component holding means is further reduced, and the mounting of the component under test is performed. The accuracy will be higher.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component holding device 500 according to the present invention.
Is a partially cutaway perspective view showing the electronic component test apparatus 1 in which is incorporated, and FIG. 2 is a conceptual view showing a method of arranging trays of the apparatus. FIG. 2 shows an electronic component test apparatus 1 according to the present embodiment.
4A and 4B are diagrams for understanding a tray handling method in FIG. 4A, and in actuality, there is a portion in which members arranged vertically are shown in plan. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

As shown in FIGS. 1 and 2, the electronic component test apparatus 1 of the present embodiment stores a chamber section 100 including a test head and an IC under test to be tested. It is composed of a tray storage unit 200 for sorting and storing, a loader unit 300 for sending ICs to be tested into the chamber unit 100, and an unloader unit 400 for sorting and extracting tested ICs tested in the chamber unit 100. ing.

In the following description, a case is shown in which the component holding device 500 of the present invention is applied to the chamber-type electronic component testing device 1. However, the component holding device 500 according to the present invention replaces an IC under test. The present invention can be applied to any handler that performs the process. The present invention is not limited to the chamber-type electronic component test apparatus described below, and can be applied to, for example, a heat plate type.

[0022] the tray storage section 200 tray storage unit 200 includes a pre-test IC stocker 201 for storing the IC before test, post-test IC stores the IC classified according to the result of the test stocker 20
2 are provided.

Pre-test IC stocker 201 and tested IC
Although not shown in detail, the stocker 202 includes a frame-shaped tray support frame, and an elevator that can enter from a lower portion of the tray support frame and move up and down. The tray support frame includes: A plurality of customer trays KST are stacked and supported.
ST is moved up and down by the elevator.

The pre-test IC stocker 201 includes:
While the customer trays KST in which the ICs to be tested are stored are stacked and held, the customer tray KST in which the ICs to be tested are appropriately classified is stored in the tested IC stocker 202. Laminated and held.

Test IC Stocker 201 and Tested IC
On the upper part of the stocker 202, the IC stocker 201 to be tested and the tested IC stocker 2
A tray transfer arm 205 that moves over the entire range in the array direction of No. 02 is provided. In this example, the IC under test is
Since the windows 306 and 406 of the loader unit 300 and the unloader unit 400 are provided immediately above the stocker 201 and the tested IC stocker 202 (without shifting in the Y-axis direction), the tray transfer arm 205 is also moved in the X-axis and Z-axis directions. It can be moved only to.

The tray transfer arm 205 includes a pair of tray storage sections for holding the customer trays KST side by side (X direction), and includes a loader section 300, an unloader section 400, an IC stocker 201 to be tested, and a tested IC. The customer tray KST is transferred to and from the stocker 202.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the number of the pre-test IC stocker 201 and the number of the tested IC stocker 202 may be appropriately changed as necessary. Can be set. In the example shown in FIG. 1 and FIG.
01 is provided with two stockers STK-B, two empty stockers STK-E to be sent to the unloader unit 400 are provided next to the stocker STK-B, and six stockers STK-1 and STK-2 are provided in the tested IC stocker 202. , ‥ ・, STK-6
Are provided so that they can be sorted and stored in a maximum of six categories according to the test results. For example, in addition to good and bad products, among the good products,
It can be classified into medium-speed ones, low-speed ones, and failures that require retesting.

Loader 300 The above-described customer tray KST is carried to the loader 300, where the customer tray KST is loaded.
The IC under test loaded in ST is transferred to the test tray TST stopped in the loader unit 300.

From the customer tray KST to the test tray T
As an IC transfer device for transferring the IC under test to ST,
As shown in FIG. 1, two rails 301 provided on the upper portion of the substrate 105, and a movable arm capable of reciprocating in the Y direction between the test tray TST and the customer tray KST by the two rails 301. An XY transfer device 304 including a movable head 302 and a movable head 303 supported by the movable arm 302 and capable of moving in the X direction along the movable arm 302 is used.

The movable head 3 of the XY transport device 304
03, a component holding device 500 according to the present invention is mounted downward, and the component holding device 500 moves while sucking air to suck and hold the IC under test from the customer tray KST. Test tray T for IC under test
Transfer to ST. One such component holding device 500 is mounted on the movable head 303, and in this example, eight ICs to be tested can be transferred to the test tray TST at a time. Details will be described later.

The customer tray KST carried to the loader unit 300 is placed on the substrate 105 of the loader unit 300.
05, a pair of windows 306 arranged so as to face the upper surface of
306 are established. Each of the windows 306 has a customer tray K transported to the window 306.
A holding hook (not shown) for holding the ST is provided, and the customer tray KST is held at a position where the upper surface of the customer tray KST faces the surface of the substrate 105 via the window 306.

In addition, below each window 306,
An elevating table 307 for elevating and lowering the customer tray KST is provided.
Is loaded with the empty customer tray KST and lowered, and transfers the empty tray to the tray storage section of the tray transfer arm 205.

Chamber section 100 The electronic component test apparatus 1 of this embodiment tests (tests) whether or not the IC operates properly in a state where high or low temperature stress is applied to the IC or in a state where no temperature stress is applied to the IC. This is a device for classifying ICs according to the test results. In an operation test under such a temperature stressed condition, the IC under test is reloaded from a customer tray KST on which a large number of ICs under test are mounted to a test tray TST transported in the electronic component test apparatus 1. Implemented.

The test tray TST is loaded into the chamber section 100 after the ICs to be tested are loaded by the loader section 300, and each IC under test is tested in the chamber section 100 while being mounted on the test tray TST. After the tested ICs are carried out to the unloader section 400, the ICs are replaced on the customer tray KST according to the test results in the unloader section 400. The tested IC is the customer tray KS
The test tray TST that has been emptied after being replaced with T
The test tray transport device 108 allows the loader unit 300
Is returned to the thermostat 101 via the.

FIG. 3 is an exploded perspective view showing a test tray TST used in the electronic component test apparatus of this embodiment, and FIG.
(B) is sectional drawing which similarly shows an insert. As shown in the figure, the test tray TST has a plurality of bars 13 provided in parallel on a rectangular frame 12 at equal intervals, and a frame 12 facing both sides of the bars 13 and facing the bars 13.
On the side 12a, a plurality of mounting pieces 14 are formed so as to protrude at equal intervals. Between these 13 and 1
An insert storage portion 15 is formed by the space between the side 3 and the side 12a and the two mounting pieces 14.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is attached to the two attachment pieces 14 using a fastener 17 in a floating state (a state in which the insert 16 can be finely moved). For this purpose, mounting holes 21 for mounting the mounting pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.

The inserts 16 have the same shape and the same dimensions.
A C storage portion 19 is formed, and an IC to be tested
Is stored.

The insert 16 is shown in FIGS. 4A and 4B.
As shown in FIG. 7, the lever plate 162 approaches and separates from the insert body 161. The lever plate 162 is mechanically connected to a clamp 163 for holding the IC (preventing the IC from jumping out), and is shown in FIG. Thus, the clamp 163 is in the closed state to prevent the IC from jumping out during transport. On the other hand, when the lever plate 162 is pressed down from the outside, the clamp 163 is opened as shown in FIG.

Here, the IC under test connected to the test head 104 at one time has four rows × 1 as shown in FIG.
If the ICs to be tested are arranged in six columns, for example, ICs to be tested in four rows every four columns are tested simultaneously. That is, 1
In the first test, 16 rows arranged every 4 rows from the first row
The test ICs are connected to the contact pins of the test head, and the test is performed. In the second test, the test trays TST are moved by one row, and the test ICs arranged in every fourth row from the second row are similarly tested. By repeating this four times, all the ICs to be tested are tested (so-called simultaneous measurement of 16 ICs).
The result of this test is stored in an address determined by, for example, the identification number given to the test tray TST and the number of the IC under test allocated inside the test tray TST.

Returning to FIG. 1 and FIG.
Is a thermostatic chamber 1 for applying a desired high or low temperature stress to the IC under test loaded on the test tray TST.
01, a test chamber 102 for bringing an IC under test thermally stressed in the thermostatic chamber 101 into contact with a test head 104, and a given thermal streak from the IC under test tested in the test chamber 102. And a heat removal tank 103 to be removed.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC under test is cooled by blowing air to return it to room temperature, and when a low temperature of approximately −30 ° C. is applied in the constant temperature bath 101, Then, the IC under test is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. And
The heat-removed IC under test is carried out to the unloader section 400.

[0042] Also in the unloader section 400 unloader section 400, X-Y transport device having the same structure as X-Y conveyor 304 provided in the loader section 300 40
4, 404 are provided, and the XY transfer devices 404, 4 are provided.
At 04, the tested IC under test is transferred from the test tray TST carried out to the unloader section 400 to the customer tray KST. This XY transfer device 404
The movable head 403 also has the component holding device 5 according to the present invention.
00 is mounted downward, and the component holding device 500
Moves while sucking air, the test tray T
From the ST, the IC under test is sucked and held, and the IC under test is transferred to the customer tray KST according to the test result. One such component holding device 500 is mounted on the movable head 403, and in this example, eight ICs under test are
Can be transferred to the test tray TST. Details will be described later.

The substrate 105 of the unloader unit 400 has a customer tray KST carried to the unloader unit 400.
There are two pairs of windows 406, 406, which are arranged so as to face the upper surface of the substrate 105. Each of the window portions 406 is provided with a holding hook (not shown) for holding the customer tray KST carried to the window portion 406, and the customer tray KS
The customer tray KST is held at a position where the upper surface of T faces the surface of the substrate 105 via the window 406.

Further, below each window 406,
An elevating table 407 for elevating and lowering the customer tray KST is provided.
Is loaded with the full customer tray KST and lowered, and the full tray is moved to the tray transfer arm 20.
5 to the lower tray storage unit.

In the electronic component test apparatus 1 of this embodiment, a buffer section 405 is provided between the test tray TST of the unloader section 400 and the window section 406, and the buffer section 405 is provided.
In this case, the IC under test of a category that rarely occurs is temporarily stored.

Component holding device The component holding device 500 provided in the XY transfer device 304 of the loader unit 300 and the XY transfer device 404 of the unloader unit 400 will be described with reference to FIGS.

FIG. 5 is a side view showing an embodiment of the component holding device of the present invention, and FIG. 6 is a perspective view showing an example of a pitch changing means according to the component holding device of the present invention. 7 to 10 are cross-sectional views for explaining the operation of the component under test by the component holding device of the present invention. FIGS. 7 and 8 show, for example, an IC mounted on a test tray TST by an unloader unit 400 or the like. 9 and 10 show a process of taking out chips.
Is the customer tray KS in the loader unit 300, for example.
7 shows a process of replacing an IC chip mounted on T with a test tray TST. Note that the component holding device 500 of the present embodiment
The XY transport device 30 provided in the loader unit 300
4. XY transport device 4 provided in unloader section 400
Since the same configuration can be applied to any of the components No. 04, the following describes an example provided in the XY transport device 304 of the loader unit 300.

First, as shown in FIG. 5, the component holding device 500 of the present embodiment comprises a movable head 30 of an XY transport device 304.
3, a first base plate 501 attached to the first base plate 501, a linear guide mechanism 507 attached to the first base plate 501, a second base plate attached to the linear guide mechanism 507, and a second base plate attached to the second base plate 502. And three base plates 503. Further, the air cylinder 508 has a main body attached to the first base plate 501 and a tip attached to the second base plate 502.

At approximately the center of the third base plate 503, a suction pad 504 for vacuum-sucking an IC chip is mounted, and on both sides of the suction pad, reference holes 22 formed in an insert body 161 shown in FIG. The pressing pin 505 that engages with the lever 1 and the lever plate 162 that is also
A clamp opening / closing pin 506 for opening / closing 63 is attached. That is, the suction pad 504 as the component holding means of the present invention and the clamp opening / closing pin 506 as the clamp ON / OFF means of the present invention are integrally attached to the third base plate 503 as the base of the present invention. . The clamp opening / closing pin 506 includes a spring 506
It is provided on the third base plate 503 via a.

The suction pad 504 can hold the IC chip by vacuum suction via the second base plate 502 and the third base plate 503, and release the IC chip to a desired place by releasing the vacuum. .

The positioning pin 505 attached to the third base plate 503 is
The position of the IC chip mounted on the IC housing 19 and the position of the suction pad 504 are aligned by engaging with the reference hole 22 of FIG.

As shown in FIG. 5, the relationship between the length of the suction pad 504 and the length of the clamp opening / closing pin 506 in the present embodiment is such that the clamp opening / closing pin 506 pushes the lever plate 162 of the insert 16 down to the bottom dead center. Spring 50
6a is in a compressed state), the suction pad 504 can come into contact with the IC chip to suck or release it.

Further, the first base plate 50
1, second base plate 502, third base plate 5
03 (including the suction pad 504, the positioning pin 505, and the clamp release pin 506), the linear guide mechanism 50
7 and the air cylinder 508 are provided in eight sets in the X direction shown in FIG. Then, as shown in FIG.
The pitch P in the X direction of the eight sets of suction pads, positioning pins 505 and clamp opening / closing pins 506 can be changed.

The variable pitch mechanism 600 includes a link mechanism 601 to which each component holding unit is attached, an air cylinder 604 for moving both ends 602 and 603 of the link mechanism 601 in the X direction, and a link mechanism 601.
And a linear guide 605 (corresponding to a sub-link mechanism of the present invention) which is connected to a link located at the center of the linear guide and operates only in the Y direction. When the air cylinder 604 is operated, both ends 602 and 603 of the link mechanism 601 are operated.
Opens and closes in the X direction. At this time, the link at the center of the link mechanism 601 is operated only in the Y direction by the linear guide 605, so that an error in the pitch P of the component holding units can be suppressed. That is, if the air cylinder 60
When the link 4 is connected to a link other than the link at both ends, the link at both ends has a larger movement amount than the movement amount of the air cylinder, so that the manufacturing error of the link mechanism also increases,
By setting the connection position of the air cylinder 604 to the links at both ends as in this example, manufacturing errors of the link mechanism 601 can be minimized. In addition, the provision of the linear guide 605 limits the movement of the center link in the Y direction, so that the manufacturing error of the link mechanism 601 is further reduced.

Next, the operation will be described. First, FIGS. 7 and 8
The process of taking out the IC chip mounted on the test tray TST by the unloader unit 400 or the like in the component holding device 500 of the present invention will be described with reference to FIG.
As shown in (C), the air cylinder 508 is operated to lower the second base plate 502 and the third base plate 503. When the clamp opening / closing pin 506 provided on the third base plate 503 is lowered to the position shown in FIG.
2 and push it down. As a result, the clamp 163 to which the IC chip has been fixed is opened, and the fixing is released. In the state shown in FIG.
04 is not in contact with the IC chip.

When further lowered, the spring 50 provided on the clamp opening / closing pin 506 as shown in FIG.
6a is shrunk, and the positioning pin 505 is engaged with the reference hole 22 of the insert 16 at about the same time as the insert body 1
The relative position between 61 and the third base plate 503 (and thus the suction pad 504) is determined. Also, the suction pad 50
Reference numeral 4 denotes the I stored in the IC storage portion 19 of the insert 16.
Touch C chip.

Here, the IC chip is sucked by operating the vacuuming device, and the cylinder 508 is operated to operate the second base plate 502 and the third base plate 503.
To rise. This state is shown in FIGS. 8D to 8F.

As shown in FIG.
Until the IC chip sucked and held by the clamp 16 is positioned above the clamp 163 of the insert 16.
06 keeps pushing down the lever plate 162. As shown in FIG.
Is closed, but the IC chip is taken out of the insert 16 in a state where the IC chip is already suction-held by the suction pad 504.

The above operation is controlled for each insert. That is, only for the required insert 16
The corresponding cylinder 508 of the cylinders operates, and the other cylinders 508 do not operate. Therefore, I needlessly
There is no change in the attitude of the C chip.

Next, with reference to FIGS. 9 and 10, the process of replacing the IC chip mounted on the customer tray KST with the loader unit 300 or the like on the test tray TST will be described. ), The air cylinder 508 is operated to lower the second base plate 502 and the third base plate 503. At this time,
An IC chip from a customer tray KST or the like is suction-held on the suction pad 504. When it is lowered to the position shown in FIG. 7B, the clamp opening / closing pin 506 provided on the third base plate 503 comes into contact with the lever plate 162 of the insert 16 and pushes it down. Thus, the closed clamp 163 starts to open. In the state shown in FIG. 8B, the IC chip sucked and held by the suction pad 504 does not contact the bottom of the IC housing 19.

When further lowered, the spring 50 provided on the clamp opening / closing pin 506 as shown in FIG.
6a is shrunk, and the positioning pin 505 is engaged with the reference hole 22 of the insert 16 at about the same time as the insert body 1
The relative position between 61 and the third base plate 503 (and thus the suction pad 504 and the IC chip) is determined. Also,
The IC chip sucked and held by the suction pad 504 comes into contact with the bottom of the IC housing 19 of the insert 16.

At this point, the evacuation device is stopped, the IC chip is released, and the cylinder 508 is operated, so that the second
The base plate 502 and the third base plate 503 are raised. This state is shown in FIGS.

As shown in FIG.
The clamp opening / closing pin 506 keeps pushing down the lever plate 162 until the tip of the insert 16 is positioned above the clamp 163 of the insert 16. As shown in FIG. 11F, when the IC is further raised, the clamp 163 is closed and the IC housing portion 19 is closed.
The IC chip mounted on the device is fixed.

The above operation is also controlled for each insert. That is, only for the required insert 16
The corresponding cylinder 508 of the cylinders operates, and the other cylinders 508 do not operate. Therefore, I needlessly
There is no change in the attitude of the C chip.

The variable pitch mechanism 600 shown in FIG.
May be activated during the transfer of the IC chip held by suction, or may be activated when the specification or lot of the IC chip under test is changed.

The embodiments described above are described for the purpose of facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component test apparatus in which a component holding device of the present invention is incorporated.

FIG. 2 is a conceptual diagram showing a method of routing trays of the electronic component test apparatus shown in FIG.

FIG. 3 is an exploded perspective view showing a test tray used in the electronic component test apparatus shown in FIG.

FIG. 4 is a cross-sectional view showing an insert used in the electronic component test device shown in FIG.

FIG. 5 is a side view showing an embodiment of the component holding device of the present invention.

FIG. 6 is a perspective view showing an example of a pitch changing unit according to the component holding device of the present invention.

FIG. 7 is a cross-sectional view illustrating the operation of the component under test by the component holding device of the present invention.

FIG. 8 is a cross-sectional view illustrating the operation of the component under test by the component holding device of the present invention.

FIG. 9 is a cross-sectional view illustrating the operation of the component under test by the component holding device of the present invention.

FIG. 10 is a cross-sectional view illustrating the operation of the component under test by the component holding device of the present invention.

FIG. 11 is a side view showing a conventional component holding device.

[Explanation of symbols]

 500: component holding device 501: first base plate 502: second base plate 503: third base plate 504: suction pad 505: positioning pin 506: clamp opening / closing pin 506a: spring 507: linear guide 508: air cylinder

Claims (4)

[Claims] 1. A plurality of components to be tested are mounted on a plurality of components mounting tools having a clamp mechanism for fixing and releasing the components to be tested, or a plurality of components to be tested mounted on the plurality of component mounting tools are held. A plurality of component holding means for respectively holding the one component under test, and a plurality of clamps O for turning on / off fixing and release of the component under test by the one clamp mechanism, respectively.
N / OFF means, a plurality of bases provided with the one component holding means and the one clamp ON / OFF means, and a plurality of drives for moving the one base toward and away from the component mounting device. Means for holding a component. 2. The component holding means, clamp ON / OFF.
2. The component holding apparatus according to claim 1, wherein a plurality of sets of component holding units including a unit, a base, and a driving unit are provided, and a pitch changing unit that changes a holding pitch of the component under test by the component holding unit is provided. 3. The variable pitch means has a link mechanism for connecting the component holding means, and a link mechanism driving means for operating the link mechanism, wherein the link mechanism driving means is one of the component holding means at both ends. 3. The component holding device according to claim 2, wherein the component holding device is connected to the component holding device. 4. The component holding device according to claim 3, wherein said link mechanism includes a sub-link mechanism for connecting a component holding means located at the center of said component holding means.