JP4279413B2 - Insert for electronic component testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component test apparatus for testing an electronic component (hereinafter also simply referred to as an IC) such as a semiconductor integrated circuit element, and a tray and an insert used therefor, and in particular, has excellent retention of an IC under test. The present invention relates to an insert, a tray, and an electronic component testing apparatus.
[0002]
[Prior art]
In an electronic component test apparatus called a handler, a large number of ICs stored in a tray are transported into the test apparatus, and each IC is brought into electrical contact with the test head. Also called a tester). When the test is completed, each IC is unloaded from the test head and placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.
[0003]
In a conventional electronic component testing apparatus, a tray (hereinafter also referred to as a customer tray) for storing pre-test ICs or ICs that have been tested, and a tray that is circulated and conveyed in the electronic component testing apparatus ( (Hereinafter also referred to as test tray)), and in this type of electronic component testing apparatus, the IC is placed between the customer tray and the test tray before and after the test. In a test process in which an IC is brought into contact with a test head for testing, the IC is pressed against the test head while being mounted on a test tray.
[0004]
For example, 64 IC mounting tools called inserts are mounted on a test tray of a conventional electronic component testing apparatus. The insert 16 is a lever plate that approaches and separates from the insert body as shown in FIG. 162. The lever plate 162 is mechanically connected to a latch 163 for holding the IC (preventing popping out), and is shown in the upper diagram of the same figure in an unloaded state by the elastic force of a spring (not shown). Thus, the latch 163 is closed to prevent the IC from jumping out during conveyance. On the other hand, when the lever plate 162 is pushed down from the outside, the latch 163 is opened as shown in the lower diagram of the figure, and IC can be carried in and out.
[0005]
[Problems to be solved by the invention]
By the way, the contact portion of the test head is composed of a plurality of contact pins provided so as to be able to protrude and retract by a spring, and when testing a ball grid array (BGA) type IC, the tip thereof is a ball-shaped input / output. A conical recess is formed according to the terminal.
[0006]
In the conventional electronic component testing apparatus, the IC package mold outer peripheral shape is used to align the IC under test and the contact pins. However, in the case of an IC such as a chip size package (CSP), the package mold Therefore, the positional accuracy between the outer peripheral shape and the solder ball is not necessarily guaranteed. For this reason, if positioning is performed on the outer periphery of the IC package mold, the solder ball is pressed against the contact pin in a state of being displaced, and there is a possibility that the solder ball is damaged by the sharp tip of the contact pin.
[0007]
Therefore, the present inventors have developed a product that is positioned by a solder ball itself rather than a package mold. As a result, damage to the solder balls can be prevented, and as long as the solder ball arrangement matrix is the same, the insert can be shared even if the outer shape is different.
[0008]
However, for example, when two types of ICs having different outer shapes and the same solder ball arrangement matrix as shown in FIG. 17 are mounted on one type of insert, the above-described latch 163 is difficult to hold.
[0009]
That is, if the IC is positioned with respect to the insert 16 with the solder ball, the height of the solder ball itself is extremely small, so that the IC is detached from the guide even by a slight vibration. Therefore, it is necessary to make the vertical clearance z between the latch 163 and the IC as small as possible. To do this, the tip of the latch 163 shown in FIG.
[0010]
However, when the front end of the latch 163 is extended, the opening / closing amount x when the latch 163 is opened is reduced as shown in the lower diagram of the figure, and thus, an IC having a large outer shape and a small IC as shown in FIG. It cannot be held by the same latch 163.
[0011]
However, if the rotation angle of the latch 163, that is, the pressing amount of the lever plate 162 is increased, the opening / closing amount x of the latch 163 also increases. However, the pressing amount of the lever plate 162 cannot be increased due to constraints on the test process of the handler. Have difficulty. Further, even if the rotation center of the latch 163 is moved downward in the drawing, the opening / closing amount x of the latch 163 is increased. However, if the rotation center of the latch 163 is shifted downward, the insert itself is increased downward, so that the test process or the like There is a risk of interfering with other mechanisms during transport.
[0012]
The present invention has been made in view of such problems of the prior art, and an object of the present invention is to provide an insert, a tray, and an electronic component testing apparatus that are excellent in holding ability of an electronic component to be tested.
[0013]
[Means for Solving the Problems]
(1) In order to achieve the above object, according to a first aspect of the present invention, there is provided an insert that is provided on a tray that mounts an electronic device under test and runs in an electronic device testing apparatus so as to be finely movable. ,An insert main body, a latch arm portion supported by the insert main body so as to be rotatable about a direction orthogonal to a direction in which the electronic component to be tested is mounted, and the latch arm portion coupled to the latch arm portion. By rotatingThe insertBodyCover and hold the top surface of the electronic component to be testedRetentionlocation and,A latch portion that moves between a position to be retracted from the upper surface of the electronic device under test,Preparation,The latch arm part is an arm connection part that connects the arm attachment part attached to the insert main body at the rotation center, and the latch part and the arm attachment part at a predetermined interval along a rotation axis direction. AndIn side view of the insert,The tip of the latch part and the rotation center of the latch arm part are arranged on substantially the same vertical line,The arm connecting portion is provided on an outer side with respect to an imaginary straight line connecting a tip of the latch portion and a rotation center of the arm mounting portion.An insert is provided.
[0014]
At this time, although not particularly limited, it is more preferable to have an elastic body that biases the latch arm in a direction in which the latch portion moves to the holding position.
[0015]
In the insert of the present invention, when holding and releasing the electronic device under test, the latch portion and the rotation center of the latch arm portion are arranged on substantially the same straight line in a side view, so that the rotation angle of the latch arm portion is small. However, geometrically, the opening / closing amount (the difference between the holding position and the retracted position) of the front end of the latch portion increases. Accordingly, electronic components having different package mold sizes can be mounted on the same insert. Further, in the insert of the present invention, the latch part and the rotation center of the latch arm part are offset in plan view, so that the latch arm part does not get in the way when an electronic component is taken in and out of the insert.
[0016]
Although not particularly limited in the above invention, the force point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, and the lever arm is provided on the insert body through the lever plate. Even if it is configured so that an external force acts on the force point (see FIGS. 6 and 11), the force point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, You may comprise so that external force may act directly on the said power point (refer FIG. 12).
[0017]
(2) In order to achieve the above object, according to a second aspect of the present invention, there is provided an insert provided on a tray that mounts an electronic device under test and runs in an electronic device testing apparatus so as to be finely movable. ,An insert main body, a latch arm portion supported by the insert main body so as to be rotatable about a direction orthogonal to a direction in which the electronic component to be tested is mounted, and the latch arm portion coupled to the latch arm portion. By rotatingThe insertBodyCover the top surface of the electronic component under testRetentionRetreat from the position and top surface of the electronic device under testRefugeA latch that moves between positions;A lever plate provided so as to be close to or away from the insert body, a guide core capable of mounting the electronic device under test, and provided so as to be close to or away from the insert body;WithThe guide core is connected to the lever plate via a first pin, and the guide core moves away from the insert body as the lever plate approaches the insert body. As the lever plate presses one end of the latch arm portion, the latch portion rotates toward the retracted position, and the lever portion moves away from the insert body, the latch portion moves to the holding position. And the guide core approaches the insert bodyAn insert is provided.
[0018]
Further, a predetermined clearance is provided between the one end of the latch arm portion and the lever plate, and after the lever plate approaches the insert body by the predetermined clearance, the lever plate is moved to the latch arm. By pressing the one end of the part,After the guide core is separated from the insert body, the latch portion isAboveIt is preferable to move to the retreat position. Also,A second pin that is provided in the insert body and holds the guide core before the lever plate is closest to the insert body;The latch partAboveAfter moving to the holding position,Held by the second pinThe guide coreThe lever plate via the first pinIt is preferable to approach the insert body.
[0019]
In the insert of the present invention, when the electronic component is held and released by the latch mechanism, the guide core on which the electronic component is mounted is also moved closer to and away from the insert body.
[0020]
That is, when mounting an electronic component, the latch unit is moved to the retracted position, the electronic component is mounted with the guide core moved to the separation position, and then the latch unit is moved to the holding position. To the insert body. That is, at least when the latch portion is closed, the guide core is in the separated position, so that the latch portion does not interfere with the electronic component even if the thickness of the electronic component is different.
[0021]
When taking out the electronic component, the guide core is first separated from the insert body from the state in which the latch portion is in the holding position and the guide core is in the approach position, and then the latch portion is moved to the retracted position. That is, at least when the latch portion is opened, the guide core is in the separated position, so that the latch portion does not interfere with the electronic component even if the thickness of the electronic component is different.
[0022]
Thus, according to the insert of the present invention, electronic components having different package mold thicknesses can be mounted on the same insert.
[0023]
(3) The electronic device under test applied in the present invention is not particularly limited, and includes all types of electronic components. In particular, the so-called ball grid array type in which the terminals of the electronic device under test are ball terminals. The effect is particularly remarkable when applied to ICs.
[0024]
At this time, the insert of the present invention preferably has a guide that contacts and positions the terminal of the electronic component under test.
[0025]
In this way, the positioning accuracy of the terminals of the electronic device under test with respect to the contact portions is improved by positioning the terminals themselves pressed against the contact portions directly with the guides rather than positioning the package mold of the electronic devices under test. It can be remarkably improved and damage to the terminal can be prevented.
[0026]
Moreover, if the arrangement matrix of the terminals of the electronic components under test is common, the insert can be shared even if the shape of the package mold is different, reducing the cost required for setup work time such as the production and replacement of dedicated components. be able to.
[0027]
This type of guide is not particularly limited in shape, set position, number, material, etc. as long as it has a function of contacting and positioning the terminal of the electronic device under test. included.
[0028]
For example, as a guide, a hole into which a ball-shaped terminal of a ball grid array type IC is fitted can be cited. In this case, it is possible to provide holes to be fitted to all the ball-shaped terminals or to provide holes to be fitted to several ball-shaped terminals. Further, in addition to means for fitting one ball-like terminal into one hole, one end of one ball-like terminal and one end of another ball-like terminal can be fitted into one hole. . In addition, the term “hole” used herein includes not only a through hole that passes through the guide core but also a recess that does not pass through the guide core.
[0029]
(4) In order to achieve the above object, according to a third aspect of the present invention, there is provided a tray for carrying in an electronic device under test to a contact portion of a test head of an electronic device testing apparatus and carrying it out. A tray having the insert is provided.
[0030]
(5) Furthermore, in order to achieve the above object, according to a fourth aspect of the present invention, there is provided an electronic component testing apparatus for performing a test by pressing a terminal of an electronic device under test against a contact portion of a test head, An electronic component testing apparatus having the tray is provided.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an electronic component testing apparatus of the present invention,
FIG. 2 is a flow chart of a tray showing a method for handling the electronic device under test in the electronic device testing apparatus of FIG.
FIG. 3 is a perspective view showing the structure of an IC stocker of the electronic component testing apparatus of FIG.
4 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG.
FIG. 5 is a partially exploded perspective view showing a test tray used in the electronic component testing apparatus of FIG.
FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention,
7 is a plan view of the insert shown in FIG.
8 is a sectional view (latch closed) taken along the line VIII-VIII in FIG.
9 is a cross-sectional view (latch open) taken along the line VIII-VIII in FIG.
10 is a cross-sectional view showing the structure of the pusher, insert, socket guide, and contact pin in the test head of FIG.
FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention,
FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention,
FIG. 13 is an exploded perspective view showing still another embodiment of the insert of the present invention,
14 is a cross-sectional view taken along line XIV-XIV in FIG.
FIG. 15 is an exploded perspective view showing still another embodiment of the insert of the present invention,
FIG. 16 is a sectional view showing a conventional insert,
FIG. 17 is a side view showing a general ball grid array type IC.
[0032]
Note that FIG. 2 is a diagram for understanding a method of routing an electronic device under test (hereinafter also simply referred to as an IC to be tested or an IC) in the electronic device testing apparatus of the present embodiment. There is also a portion showing the members arranged side by side in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
[0033]
[First Embodiment]
The electronic component test apparatus 1 according to the present embodiment tests (inspects) whether or not the IC operates properly in a state where high or low temperature stress is applied to the IC under test or in a state where no temperature stress is applied. An apparatus for classifying ICs according to test results, and an operation test with or without such temperature stress is performed in a tray (hereinafter referred to as customer tray KST) on which a large number of ICs to be tested are mounted. This is also performed by replacing the IC under test on the test tray TST (see FIG. 5) transported from the electronic component testing apparatus 1 to the test apparatus 1 (see FIG. 4).
[0034]
For this reason, as shown in FIGS. 1 and 2, the electronic component testing apparatus 1 of the present embodiment stores ICs to be tested to be tested from now on, and also classifies and stores tested ICs. Then, the loader unit 300 for sending the IC under test sent from the IC storage unit 200 to the chamber unit 100, the chamber unit 100 including the test head, and the ICs that have been tested in the chamber unit 100 are classified and taken out. The unloader part 400 is comprised.
[0035]
IC storage unit 200
The IC storage unit 200 is provided with a pre-test IC stocker 201 that stores ICs to be tested before testing, and a tested IC stocker 202 that stores ICs to be tested classified according to the test results.
[0036]
As shown in FIG. 3, the pre-test IC stocker 201 and the tested IC stocker 202 can enter a frame-like tray support frame 203 and enter the lower part of the tray support frame 203 and move up and down. An elevator 204 is provided. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
[0037]
The pre-test IC stocker 201 holds and holds the customer trays KST storing the ICs to be tested, and the tested IC stocker 202 holds the ICs to be tested. Are stacked and held in a customer tray KST appropriately classified.
[0038]
Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 are appropriately set as necessary. be able to.
[0039]
In the example shown in FIG. 1 and FIG. 2, two stockers STK-B are provided in the pre-test stocker 201, and two empty stockers STK-E to be sent to the unloader unit 400 are provided next to the stocker STK-B. Eight stockers STK-1, STK-2,..., STK-8 are provided in 202, and are configured to be classified into a maximum of eight categories according to the test results and stored. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0040]
Loader unit 300
The above-described customer tray KST is carried from the lower side of the device substrate 105 to the window portion 306 of the loader unit 300 by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. In the loader unit 300, the ICs to be tested loaded on the customer tray KST are once transferred to the precursor 305 by the XY transport device 304, where the mutual positions of the ICs to be tested are corrected. Further, the IC under test transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.
[0041]
As shown in FIG. 1, an IC transfer device 304 that reloads ICs to be tested from the customer tray KST to the test tray TST includes two rails 301 installed on the upper part of the device substrate 105, and the two rails 301. , The movable arm 302 that can reciprocate between the test tray TST and the customer tray KST (this direction is the Y direction), and is supported by the movable arm 302 and can move in the X direction along the movable arm 302. And a movable head 303.
[0042]
A suction head (detailed illustration is omitted) is mounted downward on the movable head 303 of the XY transport device 304, and the suction head moves while sucking air, so that the customer tray The IC under test is adsorbed from the KST, and the IC under test is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and eight ICs to be tested can be transferred to the test tray TST at a time.
[0043]
Chamber portion 100
The test tray TST described above is loaded into the chamber portion 100 after the ICs to be tested are loaded by the loader unit 300, and each IC under test is tested in a state of being mounted on the test tray TST.
[0044]
The chamber unit 100 includes a constant temperature bath 101 that applies a target high or low temperature thermal stress to the IC under test loaded on the test tray TST, and the IC under test in a state where the thermal stress is applied in the constant temperature bath 101. The test chamber 102 is brought into contact with the test head 104, and a heat removal tank 103 for removing a given thermal stress from the IC under test tested in the test chamber 102.
[0045]
In the heat removal tank 103, when a high temperature is applied in the thermostatic chamber 101, the IC under test is cooled by blowing to return to room temperature, and when a low temperature of, for example, about −30 ° C. is applied in the thermostatic chamber 101, The IC is heated with warm air or a heater to return it to a temperature at which no condensation occurs. Then, the IC under test with the heat removed is carried out to the unloader unit 400.
[0046]
As shown in FIG. 1, the constant temperature bath 101 and the heat removal bath 103 of the chamber unit 100 are arranged so as to protrude upward from the test chamber 102. Further, as shown conceptually in FIG. 2, the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. Wait while. Mainly during this standby, high or low temperature thermal stress is applied to the IC under test.
[0047]
A test head 104 is arranged at the center of the test chamber 102, and a test tray TST is carried on the test head 104, so that the input / output terminal HB of the IC under test is electrically connected to the contact pin 51 of the test head 104. The test is performed by contacting. On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after the temperature of the IC is returned to room temperature, it is discharged to the unloader section 400.
[0048]
Further, as shown in FIG. 1, an apparatus substrate 105 is handed over the front sides of the thermostatic chamber 101 and the heat removal chamber 103, and a test tray transfer device 108 is attached to the apparatus substrate 105. The test tray TST discharged from the heat removal tank 103 by the test tray transfer device 108 provided on the apparatus substrate 105 is returned to the thermostatic chamber 101 via the unloader unit 400 and the loader unit 300.
[0049]
FIG. 5 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment.
In this test tray TST, a plurality of crosspieces 13 are provided on the rectangular frame 12 in parallel and at equal intervals, and a plurality of mounting pieces 14 are provided on both sides of the crosspiece 13 and on the side 12a of the frame 12 facing the crosspiece 13 respectively. Are projected at equal intervals. An insert storage portion 15 is configured by the space between these bars 13, between the bars 13 and the side 12 a, and the two attachment pieces 14.
[0050]
Each insert storage portion 15 is configured to receive one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state (finely movable state) using fasteners 17. ing. For this purpose, attachment holes 21 for attachment pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.
[0051]
Each insert 16 has the same shape and the same size, and each insert 16 has an IC storage portion 19 in which an IC to be tested is stored. Details thereof will be described later.
[0052]
Here, if the IC under test connected to the test head 104 at one time is an IC under test arranged in 4 rows × 16 columns as shown in FIG. Test ICs are tested simultaneously. That is, in the first test, 16 ICs to be tested arranged every fourth row from the first row are connected to the contact pins 51 of the test head 104, and in the second test, the test tray TST is set. The ICs to be tested are moved in the same way by one row and arranged every fourth row from the second row, and all of the ICs to be tested are tested by repeating this four times (so-called 16 simultaneous measurements). The result of this test is stored in an address determined by, for example, the identification number assigned to the test tray TST and the number of the IC under test assigned inside the test tray TST.
[0053]
A guide hole 191 (guide according to the present invention) having an opening as shown in FIG. 7 is formed in the IC housing part 19, and this guide hole 191 is formed of a ball grid array type IC that is an IC under test. It is formed corresponding to the position of the solder ball HB. Even if the size of the outer peripheral surface of the package mold is slightly different, as long as the arrangement matrix of the solder balls HB of the IC under test is the same, the solder balls HB fit smoothly into the guide holes 191 without any obstacles. A slight gap S is formed on the bottom surface of the IC storage portion 19 so that it can be made.
[0054]
Incidentally, the guide hole 191 shown in the figure is configured as one opening so that only the outermost solder ball HB among the solder balls HB of the BGA type IC is fitted, but the guide of the present invention is Various other forms are conceivable. For example, a large number of guide holes are provided in the bottom surface of the IC housing portion 19 so that all the solder balls HB of the BGA type IC can be fitted, and the contact pins 51 can come into contact with all the solder balls HB from below. It may be a through hole. Further, a guide hole 191 into which only two rows of solder balls HB, for example, are fitted from the outside of the solder balls HB of the BGA type IC is provided on the bottom surface of the IC housing portion 19, and contact pins are also provided to the other solder balls HB. An opening may be formed in the center of the bottom surface of the IC storage portion 19 so that 51 can contact.
[0055]
In particular, the insert 16 of this embodiment has a latch mechanism including a latch 163, a coil spring 164, and a pin 165 shown in FIG. The latch 163 of this latch mechanism has a latch portion 163a formed at one end, to which a latch arm portion 163d is connected, and a force point 163c is provided on the latch arm portion 163d. Further, the latch arm 163d between the latch part 163a and the force point 163c is formed with a through hole serving as the rotation center 163b, and the pin 165 is inserted therein, whereby the latch 163 is attached to the insert body 161. It is rotatably supported.
[0056]
As shown in FIG. 8, the latch portion 163a of the latch 163 covers a top surface of the IC mounted on the IC storage portion 19 to prevent the IC from popping out (hereinafter also referred to as a holding position or a closed position). As shown in FIG. 9, it can be moved from a position where it can be retracted from the upper surface of the IC (hereinafter also referred to as a retracted position or an open position).
[0057]
On the other hand, the force point 163c of the latch arm portion 163d is in contact with a lever plate 162, which will be described later, and an external force is input from the force point 163c as the lever plate 162 moves up and down, thereby opening the latch 163.
[0058]
In the latch mechanism of the present embodiment, the tip end of the latch portion 162a and the rotation center 163b of the latch arm portion 163d are arranged on substantially the same vertical line in a side view of the insert 16 shown in FIG. Accordingly, even when the lever plate 162 moves up and down about 1.5 mm, the opening / closing movement amount D of the tip of the latch portion 163a shown in FIG. Further, in the latch mechanism of the present embodiment, the latch arm portion 163d is provided at a position offset from the latch portion 163a, that is, the IC storage portion 19, in a plan view of the insert 16 shown in FIG. Thereby, the IC can be taken in and out without any interference with respect to the IC storage portion 19. The coil spring 164 interposed between the other end of the latch arm portion 163d and the insert body 161 maintains the latch 163 in the holding position shown in FIG. 8 when no external force is applied from the lever plate 162. For example, when the test tray TST is being transported, the IC is held by the latch portion 163a to prevent popping out.
[0059]
The lever plate 162 provided in the insert 16 is urged to the raised position shown in FIG. 8 by a coil spring 166 provided between the insert main body 161, the convex portion 162a formed in the lever plate 162, and the insert main body. The upper limit of the ascending position is regulated by the engagement with the recess 161a formed in 161.
[0060]
FIG. 10 is a cross-sectional view showing a structure of a socket 50 having a pusher 30, an insert 16 (test tray TST side), a socket guide 40 and a contact pin 51 in the test head 104 of the electronic component testing apparatus. It is provided on the upper side of the head 104 and moves up and down in the Z-axis direction by a Z-axis driving device (not shown) (for example, a fluid pressure cylinder). The pushers 30 are attached to the Z-axis drive device in accordance with the interval between ICs to be tested at one time (a total of 16 rows in 4 rows every 4 columns in the test tray).
[0061]
In the center of the pusher 30, a pressing element 31 for pressing the IC under test is formed, and guide pins 32 to be inserted into a guide hole 20 of the insert 16 (to be described later) and a guide bush 41 of the socket guide 40 are provided on both sides thereof. ing. In addition, a stopper guide 33 is provided between the presser 31 and the guide pin 32 for restricting the lower limit when the pusher 30 is lowered by the Z-axis driving means. By contacting the stopper surface 42 (only one side is shown) of the socket guide 40, the lower limit position of the pusher that is pressed with an appropriate pressure that does not destroy the IC under test is determined.
[0062]
As described with reference to FIG. 5, the insert 16 is attached to the test tray TST using the fastener 17, and the guide pin 32 of the pusher 30 and the guide of the socket guide 40 described above are provided on both sides thereof. A guide hole 20 into which the bush 41 is inserted from above and below is formed. In the lowered state of the pusher 30, the guide hole 20 on the left side of the figure is a small-diameter hole in which the upper half is positioned by inserting the guide pin 32 of the pusher 30, and the lower half is the guide bush 41 of the socket guide 40. Is a large-diameter hole into which positioning is performed. Incidentally, in the drawing, the right guide hole 20, the guide pin 32 of the pusher 30, and the guide bush 41 of the socket guide 40 are loosely fitted.
[0063]
On the other hand, on both sides of the socket guide 40 fixed to the test head 104, two guide pins 32 of the pusher 30 are inserted, and guide bushes 41 for positioning between the two guide pins 32 are provided. The left side of the guide bush 41 is also positioned with respect to the insert 16.
[0064]
A socket 50 having a plurality of contact pins 51 is fixed to the lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, while the contact pins 51 can contact all the ball terminals HB even if the IC under test is pressed with a slight inclination. It has become.
[0065]
Unloader unit 400
The unloader unit 400 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300. The XY transport devices 404 and 404 allow the unloader unit 400 to Tested ICs are transferred from the test tray TST carried out to the customer tray KST.
[0066]
As shown in FIG. 1, the device substrate 105 of the unloader unit 400 has a pair of windows 406 and 406 arranged so that the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105. Two pairs have been established.
[0067]
Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window 406. Here, the tested ICs to be tested are reloaded and become full. The customer tray KST is loaded and lowered, and the full tray is transferred to the tray transfer arm 205.
[0068]
Incidentally, in the electronic component testing apparatus 1 of the present embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, non-defective products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices. In addition to these, four categories are sufficient, but retesting is required, for example. Categories that do not belong to these categories, such as things, may occur.
[0069]
As described above, when an IC under test that is classified into a category other than the category assigned to the four customer trays KST arranged in the window 406 of the unloader unit 400 is generated, one customer from the unloader unit 400 is generated. The tray KST is returned to the IC storage unit 200. Instead, the customer tray KST that should store the newly generated IC under test category is transferred to the unloader unit 400, and the IC under test is stored. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, resulting in a problem that the throughput is reduced. For this reason, in the electronic component testing apparatus 1 of the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and the IC under test is a category that rarely occurs in the buffer unit 405. Is temporarily stored.
[0070]
For example, the buffer unit 405 is provided with a capacity capable of storing about 20 to 30 ICs to be tested, and a memory for storing each category of IC stored in each IC storage position of the buffer unit 405 is provided. The category and position of the IC under test temporarily stored in the table are stored for each IC under test. Then, at the time of sorting work or when the buffer unit 405 is full, the customer tray KST of the category to which the IC under test stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. . At this time, the IC under test temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when calling the customer tray KST, a plurality of customer trays KST are loaded at a time in the window portion of the unloader unit 400. Call to 406.
[0071]
Next, the operation of the insert 16 will be described mainly with reference to FIGS.
For example, a case where an IC mounted on the test tray TST is taken out using the XY transport device 304 will be described as an example. FIG. 8 shows a state in which the IC under test is mounted on the test tray TST. When the suction head of the XY transport device 304 approaches each insert 16 in this state, the lever plate 162 is pushed down by a part of the suction head. It is done. Along with this, the force point 163c of the latch arm portion 163d is also pushed down, and the latch arm portion 163d rotates in the clockwise direction around the rotation center 163b. In this example, it is about 20 °.
[0072]
This state is shown in FIG. 9, and the latch portion 163a is moved from the upper surface of the IC to a position where it is completely retracted, whereby the IC can be held by the suction head. FIG. 8 shows an IC with a large device size and an IC with a small device size. As shown in the figure, as long as each IC has the same arrangement matrix of the solder balls HB, the size of the package is the same. Even if there is a difference, the latch portion 163a of this example can completely hold it.
[0073]
11 and 12 show a modification of the first embodiment. The insert 16 shown in FIG. 11 has an elastic body interposed between the latch arm portion 163d and the insert main body 161 as a winding spring 164, which is attached to the rotation center 163b. Further, the insert shown in FIG. 12 is configured such that the lever plate 162 is omitted and the force point 163c of the latch arm portion 163d is pushed down directly. Since other configurations are the same as those in FIG. 6 described above, the same reference numerals are given and detailed descriptions thereof are omitted.
[0074]
[Second Embodiment]
According to the insert 16 of the first embodiment described above, an IC having a large device size and an IC having a small device size can be mounted on the same insert 16 as shown in FIG. In addition, since the clearance between the tip of the latch portion 163a and the upper surface of the IC can be minimized, the clearance from the guide hole 191 does not occur even when positioning with the solder ball HB is performed.
[0075]
However, in the insert according to the first embodiment described above, if an IC with a thick package mold and a thin IC are to be mounted on the same insert, the tip of the latch portion 163a may interfere with the IC when the thick IC is placed. is there. However, if the clearance between the latch portion when the thick IC is mounted and the upper surface of the IC is used as a reference, interference can be avoided, but when the thin IC is mounted, the clearance becomes large and the solder ball HB is removed from the guide hole 191. May come off.
[0076]
In the second embodiment described below, ICs having different thicknesses can be mounted on the same insert. As shown in FIG. 13, in this embodiment, a guide core 167 is attached to the insert body 161 via a pin 170 in the center of the insert 16. Both ends of the pin 170 are attached to the insert main body 161 and contact the flange 1671 of the guide core 167 as shown in the sectional view of FIG. 14 to prevent the guide core 167 from coming off. The insert main body 161 is three-dimensionally movable, and is provided in a so-called floating state.
[0077]
The guide core 167 has a guide hole 171 (guide according to the present invention) formed of an opening, and the guide hole 171 corresponds to the position of the solder ball HB of the ball grid array type IC which is the IC under test. Is formed. Even if the size of the outer peripheral surface of the package mold is slightly different, as long as the arrangement matrix of the solder balls HB of the IC under test is the same, the solder balls HB fit smoothly into the guide holes 171 without any obstacles. As can be done, the bottom surface of the guide core 167 is relatively wide.
[0078]
Incidentally, the guide hole 171 shown in the figure is configured as one opening so that only the outermost solder ball HB of the solder balls HB of the BGA IC is fitted, but the guide of the present invention is As with the guide hole 191 of the first embodiment described above, various other forms can be considered.
[0079]
Further, the guide core 167 is provided with two guide holes 1672 into which the guide pins of the suction head of the XY conveyance device 304 described above are fitted, and the guide pins of the suction head are fitted into the guide holes 1672 of the guide core 167. In this case, the suction head and the guide core 167 are directly aligned regardless of the position error of the insert body 161 or the test tray TST itself.
[0080]
Note that a guide pin (not shown) of the socket can be fitted into the guide hole 1672 of the guide core 167 from below.
[0081]
Since the latch mechanism 163 has the same configuration as that of the first embodiment described above, the same reference numeral is given and a detailed description thereof is omitted, but in this embodiment, the lever plate 162 further includes two pins 169. 14 and the flange 1671 of the guide core 167 is placed on the pin 169 as shown in FIG. Further, a coil spring 168 is interposed between the guide core 167 and the insert body 161 to push the guide core 167 downward in FIG. 14. The pins 169 and 170 and the coil spring 168 allow the lever plate 162 to move up and down. The relationship between the movement, the vertical movement of the guide core 167, and the opening / closing movement of the latch mechanism 163 is as follows.
[0082]
First, when no external force is applied to the insert 16, as shown in FIG. 14A, the lever plate 162 is raised with respect to the insert body 161, whereby the latch mechanism 163 is in the closed position, and the guide The core 167 is raised by a pin 169. At this time, the clearance H1 between the latch portion 163a and the bottom surface of the guide core 167 is the smallest. For example, by setting the thickness of the thinnest IC to H1, the latch portion 163a is surely secured even with a thicker IC. The closed state can be maintained, and the positional deviation of the IC can be prevented.
[0083]
FIGS. 7B to 7D show a state where the lever plate 162 gradually descends from the state of FIG. First, since the H2 clearance is set between the lever plate 162 and the force point 163c of the latch arm portion 163d, the latch mechanism 163 does not operate until the lever plate 162 is lowered by H2. On the other hand, since the guide core 167 is supported by the pins 169, when the lever plate 162 is lowered by H2, the guide core 167 is also lowered by H2. A state where the lever plate 162 is lowered by H2 is shown in FIG. In this state, the clearance between the latch portion 163a and the bottom surface of the guide core 167 is changed from the initial H1 to H1 + H2.
[0084]
When the lever plate 162 is further lowered, the force point 163c of the latch arm portion is pushed down, so that the latch portion 163a starts to open. Also, the guide core 167 continues to descend to a position where the pin 169 becomes the same height as the pin 170. This state is shown in FIG.
[0085]
As shown in FIG. 4D, when the lever plate 162 is lowered to the lower limit position, the latch portion 163a is completely opened and the IC can be taken out. Further, the guide core 167 is supported by the pins 170 and does not descend further.
[0086]
The operation when an IC is mounted is the reverse of this. As described above, according to the insert 16 of the present embodiment, when the IC is taken out, the guide core 167 is lowered to form a clearance between the IC and the latch portion 163a, and then the latch portion 163a starts to open. On the contrary, when the IC is mounted, since the guide core 167 starts to rise after the latch part 163a is closed and moved to a position where it covers the upper surface of the IC, the latch part 163a may interfere from the side of the IC. The same insert 16 can be used even for ICs having different thicknesses.
[0087]
The specific structure of the guide core 161 according to the present invention is not limited to that shown in FIG. 13, and various other forms are conceivable. For example, in another embodiment shown in FIG. 15, a pin 169 is press-fitted into the guide core 167 and a long hole 162 b is formed in the lever plate 162.
[0088]
The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
[0089]
【The invention's effect】
As described above, according to the present invention, even when the rotation angle of the latch arm portion is small, the opening / closing amount of the tip of the latch portion is geometrically increased. Can be mounted on.
[0090]
Further, since the guide core is separated from the insert body when the latch portion is opened and closed, electronic components having different package mold thicknesses can be mounted on the same insert.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an electronic device test apparatus according to the present invention.
2 is a flow chart of a tray showing a method for handling electronic components under test in the electronic component testing apparatus of FIG.
3 is a perspective view showing a structure of an IC stocker of the electronic component test apparatus of FIG. 1. FIG.
4 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 1. FIG.
5 is a partially exploded perspective view showing a test tray used in the electronic component testing apparatus of FIG. 1. FIG.
FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention.
7 is a plan view of the insert shown in FIG. 6. FIG.
8 is a cross-sectional view (latch closed) taken along line VIII-VIII in FIG.
9 is a cross-sectional view (latch open) taken along line VIII-VIII in FIG.
10 is a cross-sectional view showing structures of a pusher, an insert, a socket guide, and a contact pin in the test head of FIG.
FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention.
FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention.
FIG. 13 is an exploded perspective view showing still another embodiment of the insert of the present invention.
14 is a cross-sectional view taken along line XIV-XIV in FIG.
FIG. 15 is an exploded perspective view showing still another embodiment of the insert of the present invention.
FIG. 16 is a cross-sectional view showing a conventional insert.
FIG. 17 is a side view showing a general ball grid array type IC.
[Explanation of symbols]
IC: IC, IC under test (electronic component under test)
HB ... Solder ball (terminal of electronic component under test)
1 ... Electronic component testing equipment
100 ... Chamber part
104 ... Test head
51 ... Contact pin (contact part)
300 ... loader section
304 ... XY transport device
KST ... Customer tray
TST ... Test tray (tray)
16 ... Insert
161 ... Insert body
162 ... lever plate
163 ... Latch mechanism
167 ... Guide core

Claims (12)

An insert that is mounted on a tray around which an electronic device under test is mounted and is arranged in an electronic device testing apparatus,
The insert body,
A latch arm portion supported by the insert body so as to be rotatable about a direction orthogonal to a direction in which the electronic device under test is mounted;
Coupled to the latch arm, the rotation of the latch arm, and a holding position for holding overlaying the upper surface of the device under test which is accommodated in the insert body, retracted position retracted from the upper surface of the electronic device to be tested When, and a latch portion that moves between,
The latch arm portion is
An arm attachment portion attached to the insert body at the rotation center;
An arm connecting portion for connecting the latch portion and the arm mounting portion at a predetermined interval along the rotation axis direction;
In the side view of the insert, the leading end of the latch portion and the rotation center of the latch arm portion are arranged on substantially the same vertical line, and the arm connecting portion includes the leading end of the latch portion and the rotation center of the arm attachment portion. Insert provided outside the virtual straight line connecting the two . The insert according to claim 1, further comprising an elastic body that biases the latch arm in a direction in which the latch portion moves to the holding position. The force point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, and an external force acts on the force point via a lever plate provided on the insert body. Or the insert of 2. The insert according to claim 1 or 2, wherein a force point of the latch arm portion is provided on an opposite side of the latch portion with respect to a rotation center of the latch arm portion, and an external force directly acts on the force point. An insert that is mounted on a tray around which an electronic device under test is mounted and is arranged in an electronic device testing apparatus,
The insert body,
A latch arm portion supported by the insert body so as to be rotatable about a direction orthogonal to a direction in which the electronic device under test is mounted;
Coupled to the latch arm, the rotation of the latch arm, and a holding position for holding overlaying the upper surface of the device under test which is accommodated in the insert body, retracted position retracted from the upper surface of the electronic device to be tested A latch portion that moves between
A lever plate provided so as to be close to or away from the insert body;
The electronic component to be tested can be mounted, and provided with a guide core that can be approached or separated from the insert body ,
The guide core is connected to the lever plate via a first pin;
As the lever plate approaches the insert body, the guide core is separated from the insert body, the lever plate presses one end of the latch arm portion, and the latch portion is in the retracted position. Rotate towards
As the lever plate moves away from the insert body, the latch portion rotates toward the holding position, and the guide core approaches the insert body . A predetermined clearance is provided between the one end of the latch arm portion and the lever plate,
After the lever plate approaches the insert main body by the predetermined clearance, the lever plate presses the one end of the latch arm portion to separate the guide core from the insert main body, and then the latch The insert according to claim 5, wherein the part is moved to the retracted position. A second pin that is provided in the insert body and holds the guide core before the lever plate is closest to the insert body;
After moving the latch portion to the holding position, according to claim 5 or 6, wherein the guide core held by the second pin the lever plate to approach to the insert body through the first pin Inserts. The insert according to any one of claims 1 to 7, wherein a terminal of the electronic device under test is a ball-shaped terminal. The insert according to any one of claims 1 to 8, further comprising a guide for contacting and positioning a terminal of the electronic component to be tested. The insert according to claim 9, wherein the guide is a hole into which the ball-shaped terminal is fitted. 11. A tray that carries an electronic component under test into a contact portion of a test head of an electronic component testing apparatus and carries it out, and has the insert according to any one of claims 1 to 10. An electronic component testing apparatus having a tray according to claim 11, wherein the electronic component testing apparatus performs a test by pressing a terminal of an electronic component to be tested against a contact portion of a test head.

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