CN101842712B - Insert, tray and electronic component testing apparatus - Google Patents
Insert, tray and electronic component testing apparatus Download PDFInfo
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- CN101842712B CN101842712B CN200780101442.3A CN200780101442A CN101842712B CN 101842712 B CN101842712 B CN 101842712B CN 200780101442 A CN200780101442 A CN 200780101442A CN 101842712 B CN101842712 B CN 101842712B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
An insert (710) is provided with an insert main body (720) having a device storing hole (721) for storing an IC device; and a device carrier (760) for holding the IC device stored in the device storing hole (721). The device carrier (760) can be finely moved relatively to the insert main body (720).
Description
Technical field
But the present invention relates to the insert of the various electronic components (the following IC device that is called typically) such as holding semiconductor integrated circuit component that but fine motion ground arranges on the pallet of conveyance in electronic component testing apparatus, and the pallet and the electronic component testing apparatus that possess described insert.
Background technology
In the manufacture process of the electronic components such as IC device, for test I C performance of devices and function, use electronic component testing apparatus.
Consist of the processor (handler) of electronic component testing apparatus, have a kind of type of the IC device that between the pallet (hereinafter referred to as test pallet) for the pallet (hereinafter referred to as client's pallet) that holds the IC device after not testing or testing and circulation conveyance in electronic component testing apparatus, changes the outfit.
This processor in the operation that makes IC device contacts measuring head with the test of carrying out the IC device, holds at test pallet under the state of IC device, and the IC device is pressed against on the measuring head.
But hold each IC device the insert fine motion be arranged on the test pallet.The insert of changing as the classification that can tackle flexibly the IC device, known a kind of insert traditionally, component carrier can be in insert main body loading and unloading (for example with reference to patent documentation 1).
In such insert, be profile take the IC device as benchmark, the structure that the IC device is positioned based on component carrier.And, in order to alleviate the load that when pushing the IC device, is applied on IC device, the component carrier, be designed between IC device and component carrier, form the gap.
Patent documentation 1: the international pamphlet that discloses No. 03/075024
Summary of the invention
The problem that the present invention will solve
Yet, if in order further to improve the versatility of the kind of IC device, take the terminal of IC device as benchmark the IC device is positioned, so because the gap that forms during pushing, the IC device can depart from component carrier, has the problem that causes that misconnection is touched.Different therewith, if gap (only make IC device and component carrier near) is not set, there is so the excessive problem of load on IC device and the component carrier when pushing.
The problem that the present invention will solve is, provide a kind of when preventing from pushing tested electronic component and retaining member impaired etc., and suppress insert, pallet and the electronic component testing apparatus of the generation that misconnection touches.
Be used for solving the technical scheme of problem
For reaching above-mentioned purpose, according to the present invention, but provide fine motion ground insert that arrange, that can hold tested electronic component on a kind of pallet of conveyance in electronic component testing apparatus, it possesses: have the insert main body of the accommodation hole that holds aforementioned tested electronic component and the retaining member that maintenance is contained in the aforementioned tested electronic component of aforementioned accommodation hole, aforementioned retaining member can be with respect to aforementioned insert main body fine motion (with reference to claim 1).
Be not particularly limited for foregoing invention, but preferably, aforementioned retaining member can be along the press direction fine motion (with reference to claim 2) that aforementioned tested electronic component is pressed against on the measuring head that the aforementioned electronic component test set has.
Be not particularly limited for foregoing invention, but preferably, aforementioned press direction is vertical direction (with reference to claim 3).
Be not particularly limited for foregoing invention, but preferably, described insert also has aforementioned retaining member releasably is installed in mounting structure on the aforementioned insert main body, and aforementioned retaining member can be with respect to aforementioned insert main body fine motion (with reference to claim 4) under the effect of aforementioned mounting structure.
Be not particularly limited for foregoing invention, but preferably, aforementioned mounting structure has: have on the top Hook member of the hook that engages with aforementioned retaining member, rotatably support the axle of aforementioned Hook member and centered by aforementioned axis to 1st force application structure of a sense of rotation to the aforementioned Hook member application of force, aforementioned Hook member can be along aforementioned press direction fine motion (with reference to claim 5).
Be not particularly limited for foregoing invention, but preferably, aforementioned retaining member has the connecting hole (with reference to claim 6) of the aforementioned hook engaging that aforementioned Hook member has.
Be not particularly limited for foregoing invention, but preferably, aforementioned mounting structure also has to 2nd force application structure (with reference to claim 7) of the direction opposite with aforementioned press direction to the aforementioned Hook member application of force.
Be not particularly limited for foregoing invention, but preferably, aforementioned the 1st force application structure and aforementioned the 2nd force application structure are same force application structure (with reference to claim 8).
Be not particularly limited for foregoing invention, but preferably, the patchhole of the insertion aforementioned axis of aforementioned Hook member is the slotted hole (with reference to claim 9) that has along the major axis of aforementioned press direction.
Be not particularly limited for foregoing invention, but preferably, aforementioned retaining member has a plurality of through holes (with reference to claim 10) of the terminal that inserts aforementioned tested electronic component.
Be not particularly limited for foregoing invention, but preferably, described insert possesses: can be between the open position that the upper surface of the aforementioned tested electronic component that closes the position and hold from aforementioned insert of the upper surface of the aforementioned tested electronic component that holds near aforementioned insert is kept out of the way mobile card door bolt member, with the supporting member that aforementioned card door bolt member rotatably is supported in the insert main body, aforementioned card door bolt member is at least in the plan view of aforementioned insert, take aforementioned supporting member as the rotation center spinning movement.
Be not particularly limited for foregoing invention, but preferably, aforementioned supporting member is arranged essentially parallel to holding direction or favour the aforementioned mode of holding direction and being arranged on the aforementioned insert main body of aforementioned tested electronic component with the direction of principal axis of aforementioned supporting member.
Be not particularly limited for foregoing invention, but preferably, aforementioned card door bolt member is favouring on main the plane of aforementioned insert main body spinning movement centered by aforementioned supporting member.
Be not particularly limited for foregoing invention, but preferably, be accompanied by the spinning movement of aforementioned card door bolt member, in holding on the direction of aforementioned tested electronic component, the change in location on the top of aforementioned card door bolt member.
Be not particularly limited for foregoing invention, but preferably, aforementioned card door bolt member at aforementioned open position basically along the length direction of aforementioned insert main body.
Be not particularly limited for foregoing invention, but preferably, aforementioned insert main body has the recess that holds that aforementioned card door bolt member is contained in inside at aforementioned open position.
Be not particularly limited for foregoing invention, but preferably, the aforementioned recess that holds is along the length direction setting of aforementioned insert main body.
Be not particularly limited for foregoing invention, but preferably, described insert also possesses to the aforementioned position of closing the 1st elastic body of the aforementioned card door bolt member application of force.
Be not particularly limited for foregoing invention, but preferably, described insert also possesses the executor (lever) that is arranged on aforementioned insert main body with can pushing aforementioned card door bolt member rear end, the rotation center of aforementioned card door bolt member is between the top and rear end of aforementioned card door bolt member, push the rear end of aforementioned card door bolt member by aforementioned executor, thereby the position spinning movement is closed to aforementioned open position from aforementioned in the top of aforementioned card door bolt member.
Be not particularly limited for foregoing invention, but preferably, described insert possesses from aforementioned insert main body to away from 2nd elastic body of direction to the aforementioned executor application of force.
Be not particularly limited for foregoing invention, but preferably, described insert also possesses and is arranged on the executor plate that can push aforementioned executor on the aforementioned insert main body, and external force acts on the rear end of aforementioned card door bolt member by means of aforementioned executor plate and aforementioned executor.
Be not particularly limited for foregoing invention, aforementioned card door bolt member is at the aforementioned upper surface that closes the aforementioned tested electronic component that the position keeps near aforementioned retaining member but preferably,, at aforementioned open position, the upper surface of the aforementioned tested electronic component that keeps from aforementioned retaining member is kept out of the way.
In order to reach above-mentioned purpose, according to the present invention, provide the retaining member (with reference to claim 11) on a kind of aforementioned insert main body that is installed in above-mentioned insert.
In order to reach above-mentioned purpose, according to the present invention, provide a kind of pallet of conveyance in electronic component testing apparatus, but it has the framing component (with reference to claim 12) of above-mentioned insert and the aforementioned insert of fine motion ground maintenance.
In order to reach above-mentioned purpose, according to the present invention, electronic component testing apparatus with the test of carrying out aforementioned tested electronic component is provided on the contact site that a kind of terminal with tested electronic component presses against measuring head, possess: be contained under the state of above-mentioned pallet the test department that aforementioned tested electronic component is pressed against on the aforementioned contact site at aforementioned tested electronic component, to hold the aforementioned pallet of not testing aforementioned tested electronic component and move into the loading part of aforementioned test department, and will hold tested aforementioned tested electronic component aforementioned pallet from the unloading section that aforementioned test department is taken out of, described electronic component testing apparatus is at aforementioned loading part, aforementioned test department and the aforementioned unloading aforementioned pallet of section's circulation conveyance (with reference to claim 13).
The invention effect
Among the present invention, when the tested electronic component of pushing, because retaining member and the together fine motion of tested electronic component so can alleviate the load that is carried on tested electronic component and the retaining member, are kept the location of the tested electronic component take terminal as benchmark.Therefore, can prevent when pushing tested electronic component and retaining member impaired etc., and suppress the generation that misconnection is touched.
Description of drawings
Fig. 1 is for showing the cross-sectional schematic of electronic component testing apparatus in the embodiments of the invention.
Fig. 2 is for showing the oblique view of electronic component testing apparatus in the embodiments of the invention.
Fig. 3 is for showing the concept map that transports of pallet in the embodiments of the invention.
Fig. 4 is for showing the exploded perspective view of the IC reservoir that uses on the electronic component testing apparatus in the embodiments of the invention.
Fig. 5 is for showing the oblique view of the client's pallet that uses on the electronic component testing apparatus in the embodiments of the invention.
Fig. 6 is for showing the exploded perspective view of the test pallet that uses on the electronic component testing apparatus in the embodiments of the invention.
Fig. 7 is for showing the exploded perspective view of the insert that uses on the test pallet shown in Figure 6.
Fig. 8 A is that planimetric map and the display card of insert in the embodiments of the invention fastened member with a bolt or latch at the figure of the state that closes the position.
Fig. 8 B is that planimetric map and the display card of insert in the embodiments of the invention fastened member with a bolt or latch at the figure of the state of open position.
Fig. 9 A is the cut-open view along IXA-IXA line among Fig. 8 A.
Fig. 9 B is the cut-open view along IXB-IXB line among Fig. 8 B.
Figure 10 A is the cut-open view along XA-XA line among Fig. 8 A.
Figure 10 B is the cut-open view along the XB-XB line of Fig. 8 B.
Figure 11 is the oblique view of the Hook member that uses on the insert in the embodiments of the invention.
Figure 12 is installed in the cut-open view of the state on the insert main body for component carrier in the demonstration embodiments of the invention.
Component carrier was with the cut-open view of the state of IC device fine motion when Figure 13 pushed in the embodiments of the invention for showing.
Figure 14 is the outboard profile that is used in the embodiments of the invention at the anchor clamps of insert main body loading and unloading component carrier.
Figure 15 is for showing the cut-open view that utilizes the state that anchor clamps pull down component carrier from the insert main body in the embodiments of the invention.
Figure 16 is for showing the cut-open view of the structure of pusher, insert, socket guides and the socket of electronic component testing apparatus in the embodiments of the invention.
Symbol description
1... processor
5... measuring head
6... test machine
TST... test pallet
710... insert
720... insert main body
721... device accommodation hole
731... card door bolt member
741... Hook member
741a... hook
741b... slotted hole
741c... jut
742... volute spring
743... axle
750... executor plate
760... component carrier
760a... bottom surface
760b... flange
761... connecting hole
762... pilot hole
Use anchor clamps 800... install
801... pin
Embodiment
The below describes embodiments of the invention based on accompanying drawing.
Fig. 1 is for showing the cross-sectional schematic of electronic component testing apparatus in the embodiments of the invention; Fig. 2 is for showing the oblique view of electronic component testing apparatus in the embodiments of the invention; Fig. 3 is for showing the concept map that transports of pallet in the embodiments of the invention.
In addition, Fig. 3 is for being used for understanding the figure of the Transfer method of pallet in the electronic component testing apparatus, wherein also exist with actual be up and down and the part of the member plane of row arrangement demonstration.Therefore, with reference to Fig. 2 its machinery (three-dimensional) structure is described.
The electronic component testing apparatus of the present embodiment is, under the state that the IC device is applied high temperature or Low Temperature Thermal stress, utilize measuring head 5 and test machine 6 test (inspection) IC devices whether to work, and the device of the IC device being classified based on this test result.Test based on the IC device of this electronic component testing apparatus, the IC device from being mounted with client's pallet KST (with reference to Fig. 5) of many IC devices as tested object, being changed the outfit to the test pallet TST (with reference to Fig. 6) of processor 1 interior circulation conveyance and implements.In addition, represent the IC device with symbol IC among the figure.
As shown in Figure 1, be provided with space 8 in processor 1 bottom, measuring head 5 is configured in this space 8 replaceably.Socket 50 is arranged on the measuring head 5, and is connected with test machine 6 by cable 7.And, by the peristome that forms on the processor 1 socket 50 on IC device and the measuring head 5 is electrically contacted, the electric signal of the test-run a machine 6 that can be used to test oneself carries out the test of IC device.In addition, when the classification of IC device is changed, socket is replaced with the socket of the shape that adapts to such other IC device, number of pins etc.
As shown in Figures 2 and 3, the processor 1 of the present embodiment is made of following part: deposit not test and test I C device storage part 200, will send into the loading part 300 of test department 100 from the IC device that storage part 200 is sent, at the relative test department 100 of the socket 50 of inside and measuring head 5, and the unloading section 400 that the test I C device that test department 100 was tested is classified.
The below describes the each several part of processor 1.
＜storage part 200 〉
Fig. 4 is for showing the exploded perspective view of the IC reservoir that uses on the electronic component testing apparatus in the embodiments of the invention; Fig. 5 is for showing the oblique view of client's pallet that electronic component testing apparatus uses in the embodiments of the invention.
As shown in Figure 4, these reservoirs 201,202 possess: the tray support frame 203 of frame shape, and enter from the bottom of this tray support frame 203 and to the lifter 204 of top lifting.Be stacked with a plurality of client's pallet KST at tray support frame 203, only these stacked client's pallet KST can move up and down under the effect of lifter 204.In addition, as shown in Figure 5, among client's pallet KST of the present embodiment, the concavity accommodation section that holds the IC device is arranged in for example 14 row, 13 row.
Owing to not testing reservoir 201 and testing reservoir 202 and have identical structure, can will not testing reservoir 201 and test reservoir 202 quantity separately and set suitable quantity in case of necessity.
As shown in Figures 2 and 3, in the present embodiment, do not test reservoir 201 and be provided with 2 reservoir STK-B, be provided with 2 empty pallet reservoir STK-E in the place that is adjacent, be stacked with the Air Passenger family pallet KST that is transported to unloading section 400 on each empty pallet reservoir STK-E.
In the place adjacent with empty pallet reservoir STK-E, 8 reservoir STK-1, STK-2 ..., STK-8 is arranged on and tests on the reservoir 202, formation can be divided into maximum 8 structures that store classifiedly according to test result.That is, except certified products and non-certified products, also can be distinguished into the high, medium and low product of operating rate in the certified products, or need product of testing again etc. in the non-certified products.
＜loading part 300 〉
Above-mentioned client's pallet KST is transported into 2 window sections 370 of loading part 300 by being arranged on the tray conveying arm 205 between storage part 200 and the device base station 101 from the downside of device base station 101.And on this loading part 300, will pack into the IC device of client's pallet KST of device transferring device 310 is transplanted on precise localizer (preciser) 360 for the time being, and revises mutual alignment relation of IC device at this.Then, device transferring device 310, the IC device that is transplanted on this precise localizer 360 is again mobile and change the outfit and be parked on the test pallet TST on the loading part 300.
As mentioned above, loading part 300 possesses the IC device is turned the device transferring device 310 that installs to test pallet TST from client's pallet KST.As shown in Figure 2, this device transferring device 310 possesses: be erected at 2 tracks 311 on the device base station 101, can move back and forth along described track 311 moveable arm 312 of (establishing this direction is Y-direction) between test pallet TST and client's pallet KST, and supported and can be at the mobile moving head 320 of directions X by this moveable arm 312.
Sucker (not shown) down is installed on the moving head 320 of this device transferring device 310, moves while attracting by this sucker, keeps the IC device from client's pallet KST, and this IC device turned installs on the test pallet TST.But the sucker of setting example as about 8 on the moving head 320 installs on the test pallet TST thereby can once 8 IC devices be turned.
＜test department 100 〉
Above-mentioned test pallet TST packs into by loading part 300 and sends into test department 100 behind the IC device, under the state of test pallet TST, carries out the test of each IC device at the IC component mounting.
As shown in Figures 2 and 3, test department 100 is made of following part: the IC device that is loaded into test pallet TST apply the thermal stress of expectation high temperature or low temperature soaking case 110, will be in IC device under the state that is applied thermal stress by soaking case 110 and press against test cabinet 120 on the measuring head 5, and the heat extraction case 130 removed of the thermal stress of the IC device that will test at test cabinet 120.
In the situation that 110 pairs of IC devices of soaking case apply high temperature, by air-supply room temperature is got back in the cooling of IC device at heat extraction case 130.Different therewith, in the situation that 110 pairs of IC devices of soaking case apply low temperature, by warm braw or well heater etc., the IC device heats is got back to the temperature that dewfall can not occur at heat extraction case 130.
As shown in Figure 2, compare with test cabinet 120, soaking case 110 and the heat extraction case 130 of test department 100 are more outstanding up.In addition, shown in Fig. 3 signal, soaking case 110 is provided with vertical carrying device, and during test cabinet 120 became unprecedentedly, polylith test pallet TST carried out standby when being supported in this vertical carrying device.Mainly be in this standby process, the IC device to be applied high temperature or Low Temperature Thermal stress.
Measuring head 5 is configured in the centre of test cabinet 120, makes the input and output terminal HB (with reference to Figure 16) of IC device electrically contact to test with the pin 51 (with reference to Figure 16) that contacts of the socket 50 of measuring head 5 by test pallet TST being transported to measuring head 5 tops.On the other hand, the test pallet TST that test finishes carries out heat extraction at heat extraction case 130, after the temperature of IC device is got back to room temperature, it is taken out of unloading section 400.
On the top of soaking case 110, be formed with the entrance of moving into from device base station 101 for test pallet TST.Similarly, on the top of heat extraction case 130, be formed with for the outlet with test pallet TST conveyance device base station 101.And, as shown in Figure 2, be provided with by these entrance and exits and test pallet TST moved into the tray conveying device 102 of taking out of test department 100 at device base station 10.This tray conveying device 102 is by consisting of such as rotation roller etc.
After device transferring device 410 (aftermentioned) turns all IC devices of dress loading, by means of unloading section 400 and loading part 300, will be returned to soaking case 110 by the test pallet TST that this tray conveying device 102 is taken out of from heat extraction case 130.
Fig. 6 is for showing the exploded perspective view of the test pallet that electronic component testing apparatus uses in the embodiments of the invention.
As shown in Figure 6, test pallet TST has: square framing component 701, parallel and equally spaced be arranged on the framing component 701 horizontal stripe 702 and from the limit 701a of horizontal stripe 702 or framing component 701 outstanding a plurality of installation sheets 703 equally spaced.And insert accommodation section 704 is made of horizontal stripe 702, limit 701a and installation sheet 703.
Each insert accommodation section 704 accommodates respectively 1 insert 710.At the two ends of insert 710, be formed with respectively for the mounting hole 706 that this insert 710 is installed on the installation sheet 703, insert 710 utilizes securing member 705 to be installed on 2 installation sheets 703 with quick condition (but state of three-dimensional fine motion).As shown in Figure 6, such insert 710 is equipped with 64 with the array of 4 row 16 row on 1 test pallet TST, by the IC device is contained in insert 710, with the IC device test pallet TST that packs into.
Fig. 7 is for showing the exploded perspective view of the insert that test pallet shown in Figure 6 uses, Fig. 8 A and Fig. 8 B are the planimetric map of insert in the embodiments of the invention, Fig. 9 A～Figure 10 B is the cut-open view of Fig. 8 A and Fig. 8 B, Figure 11 is the oblique view of the Hook member that insert uses in the embodiments of the invention, Figure 12 is installed in the cut-open view of the state on the insert main body for component carrier in the demonstration embodiments of the invention, Figure 13 is for showing in the embodiments of the invention that component carrier is with the cut-open view of the state of IC device fine motion when the pushing, Figure 14 is the outboard profile that is used in the embodiments of the invention at the anchor clamps of insert main body loading and unloading component carrier, and Figure 15 is for showing the cut-open view that utilizes the state that anchor clamps pull down component carrier from the insert main body in the embodiments of the invention.
As shown in Figure 7, the insert 710 of the present embodiment possesses insert main body 720, executor plate 750 and component carrier (retaining member) 760.
As shown in Figure 7, at the substantial middle place of insert main body 720, be provided be used to the device accommodation hole 721 that holds the IC device.Shown in Fig. 9 A～Figure 10 B, device accommodation hole 721 has the inlet port 721a that enters for the IC device on top, and has the installing port 721b of installing device carrier 760 in the bottom.Inlet port 721a is communicated with installing port 721b, and will guide the component carrier 760 that is installed in installing port 721b into from the IC device that inlet port 721a enters in the device accommodation hole 721.In addition, hold the situation of 1 IC device although an insert 710 has been described in the present embodiment, the present invention specifically is not subject to this, and an insert main body 720 also can form a plurality of device accommodation holes 721, and same insert 710 also can hold a plurality of IC devices.
As shown in Figure 7, insert main body 720 has the card door bolt structure that is made of card door bolt member 731, wind spring 732, axle 733, executor 734 and volute spring 735.
Shown in Fig. 9 A and Fig. 9 B, card door bolt member 731 has and approaches or away from the top 731a of the upper surface of the IC device that is contained in device accommodation hole 721 and the rear end 731c that is pushed by executor 734.In addition, between the top 731a and rear end 731c of this card door bolt member 731, be formed with the through hole as rotation center 731b, by axle 733 is inserted this through hole, card door bolt member 731 rotatably is supported on the insert main body 720.
By card door bolt member 731 is rotated centered by axle 733, the top 731a of card door bolt member 731 can be at the upper surface that approaches the IC device that is contained in device accommodation section 721, prevent the position (state shown in Fig. 8 A, Fig. 9 A and Figure 10 A that the IC device flies out, below be called simply and close the position) and keep out of the way, make between the position that the IC device can pass in and out (state shown in Fig. 8 B, Fig. 9 B and Figure 10 B, below be called simply open position) mobile from the upper surface of the IC device that is contained in device accommodation hole 721.
In the plan view of insert 710, the present embodiment can be guaranteed the large amount of movement of top 731a by making the top 731a spinning movement of card door bolt member 731 shown in Fig. 8 A and Fig. 8 B.Especially, in the insert 710 of the present embodiment, because the top 731a of card door bolt member 731 can move near the central authorities of device accommodation hole 721, not only can hold the smaller IC device that represents with symbol IC among Fig. 8 A, Fig. 9 A and Figure 10 A, and can hold with the larger IC device of the size that represents with symbol ICB among the figure, thereby improved versatility to the IC device size.
Shown in Fig. 7, Figure 10 A and Figure 10 B, wind spring 732 is fastened with a bolt or latch between member 731 and the insert main body 720 between card take axle 733 as rotation center, and to closing the position card is fastened with a bolt or latch member 731 application of forces by its elastic force.Therefore, block in the situation of the rear end 731c that fastens member 731 with a bolt or latch in the elastic force pushing of resisting wind spring 732, the top 731a that card is fastened member 731 with a bolt or latch moves to open position.Relative therewith, if remove pushing to the rear end 731c of card door bolt member 731, under the effect of the elastic force of wind spring 732, the top 731a of card door bolt member 731 gets back to and closes the position so.
In addition, shown in Figure 10 A and Figure 10 B, in the present embodiment, hold the direction (being generally vertical direction) of IC device with respect to insert 710 at axle 733 under the state of IC device-side tilt alpha degree (for example about 45 °), axle 733 is inserted insert main body 720.For this reason, the top 731a of card door bolt member 731 is favouring on main the imaginary plane PL of insert main body 720 spinning movement centered by axle 733.For this reason, because along with the spinning movement of card door bolt member 731, the alterable height of the top 731a of card door bolt member 731 is so can adapt to variation in thickness because of the IC device of classification due to changing.
Shown in Fig. 9 A～Figure 10 B, in the internal face of the device accommodation hole 721 of insert main body 720, along on the face of the length direction of this insert main body 720, be formed be used to what hold card door bolt member 731 and hold recess 722.Shown in Fig. 8 B, Fig. 9 B and Figure 10 B, open position in the present embodiment, card door bolt member 731 is contained in holds in the recess 722 fully, can effectively utilize to greatest extent according to the size of IC device the opening size of device accommodation hole 721.In addition, in the present embodiment, because card door bolt member 731 at the length direction of open position along insert main body 720, is fastened the distance from rotation center 731b to top 731a on the member 731 with a bolt or latch so can lengthen card, and increase the rotary moving amount of top 731a.
As shown in Figure 7, executor 734 is inserted into the executor patchhole 723 that is formed at insert main body 720 by means of volute spring 735.Shown in Fig. 7, Fig. 9 A and Fig. 9 B, be formed with stage portion 734a in the bottom of executor 734, and executor patchhole 723 with hold recess 722 and be communicated with, stage portion 734a can with the rear end 731c butt of card door bolt member 731.
Under the state that does not push executor 734, the top 731a of card door bolt member 731 is positioned at and closes the position; If pushing executor 734, under the effect of executor 734, the rear end 731c of card door bolt member 731 is urged so, and the top 731a of card door bolt member 731 is to the open position rotary moving.In addition, as shown in Figure 7, in order in the rear end 731c that depresses card door bolt member 731 its inboard to insert main body 720 to be released, the surface of contact of the stage portion 734a of executor 734 is not smooth but tilts.
Shown in Fig. 7, Fig. 9 A and Fig. 9 B, be formed with slotted hole 734b in the bottom of executor 734, pin 736 inserts this slotted hole 734b from the outside of insert main body 720.Thus, executor 734 movement upward is restricted.
And as shown in Figure 7, insert main body 720 has the clamping structure (mounting structure) that is made of Hook member 741, volute spring 742 and axle 743.
As shown in figure 11, Hook member 741 has the hook 741a that engages with the connecting hole 761 of component carrier 760 on the top.As shown in Figure 7, this Hook member 741 is contained in the clamping accommodation section 724 of insert main body 720, and is rotatably supported by the axle 743 that inserts from the outside of insert main body 720.In the present embodiment, as shown in figure 11, be formed with the slotted hole 741b that inserts axle 743 at Hook member 741.Under the state (state of Figure 12) of 742 pairs of Hook member 741 application of forces of volute spring, the section configuration of the press direction of pushing IC device when this slotted hole 741b has the long axis test.By this slotted hole 741b, allow the minute movement of Hook member 741 on above-below direction that is supported in axle 743.In addition, press direction is basically consistent with vertical direction in the present embodiment.
Such as Fig. 7 and shown in Figure 12, volute spring 742 is contained in Hook member 741 and clamps accommodation section 724, and the jut 741c of Hook member 741 inserts the endoporus of volute spring 742.This volute spring 742 centered by axle 743, to a sense of rotation (being rotated counterclockwise among Figure 12) to Hook member 741 application of forces.In addition, as shown in figure 12, this volute spring 742 upwards pushes Hook member 731 all the time when no-load (not pushing), and axle 743 is relatively mobile downwards in the slotted hole 741b of Hook member 741.
On the other hand, as shown in figure 13, if push the IC device to measuring head 5 during test, this pushing force is resisted the elastic force of volute spring 742 so, axle 743 relatively is moved upward in the slotted hole 741b of Hook member 741, and Hook member 741 together can descend with respect to insert main body 720 with the IC device.
Since in the present embodiment same volute spring 742 simultaneously as to a sense of rotation to the structure of Hook member 741 application of forces with upward to the structure of Hook member 741 application of forces, so reduced the quantity of formation insert 710 members.In addition, among the present invention, also can be by 2 above-mentioned structures of formation such as different springs.In addition, as substituting of volute spring 742, also can use other elastic bodys such as rubber, sponge.
Be provided with 2 such clamping structures in insert main body 720, thus retainer member carrier 760 releasably.In addition, among the present invention, the quantity of clamping structure can for example can arrange 4 clamping structures an insert main body 720 for a plurality of, and this is not subjected to concrete restriction.
As shown in Figure 7, executor plate 750 is installed in the upside of insert main body 720 by means of volute spring 754.This volute spring 754 upward (away from the direction of insert main body 720) to executor plate 750 application of forces.For this reason, if be subject to the pushing force of (near the direction of insert main body 720) downwards, the elastic force of executor plate 750 opposing volute springs 754 is mobile downwards so, if remove this pushing, so above the effect lower-pilot device plate 750 of the elastic force of volute spring 754 returns.In addition, shown in Fig. 7, Figure 10 A and Figure 10 B, because the long limit 751 of executor plate 750 engages with the groove 725 of the side that is formed at insert main body 720, so executor plate 750 movement upward is restricted.
As shown in Figure 7, be provided with opening 752 at the substantial middle place of executor plate 750, so that the device accommodation hole 721 of insert main body 720 exposes.This opening 752 forms more slightly larger than inlet port 721a, thereby does not hinder the IC device via inlet port 721a turnover device accommodation hole 721.
In addition, as shown in Figure 7, the position corresponding with the clamping accommodation section 724 of insert main body 720 on executor plate 750 is provided with through hole 753, and this through hole 753 uses from insert main body 720 loading and unloading component carrier 760 time.
As shown in Figure 7, at the downside of insert main body 720 component carrier 760 is installed, is provided with many pilot holes 762 of the bottom surface 760a that runs through component carrier 760.In the present embodiment, chimeric by terminal HB (with reference to Fig. 9 A～Figure 10 B and Figure 16) and these pilot holes 762 of making the IC device, position with respect to 760 pairs of IC devices of component carrier.For this reason, even changing because of the classification of IC device in the situation that the profile that makes the IC device changes, if the size of terminal HB, pitch are identical, that does not just need to change component carrier 760, has improved the versatility of component carrier 760.In addition, although pilot hole 762 corresponding terminal HB in the present embodiment, the present invention specifically is not subject to this, and a pilot hole 762 can corresponding a plurality of terminal HB.
On the flange 760b of the encirclement bottom surface 760a that component carrier 760 is provided with, 2 places on same diagonal line are provided with connecting hole 761.Each connecting hole 761 forms linearity, in order to engage with the hook 741a of the Hook member 741 of clamping structure.For example, changing in the situation of the pitch change that makes between the terminal HB because of the classification of IC device, change component carrier 760.
In the situation that insert main body 720 loading and unloading component carrier 760 are utilized unit clamp 800 as shown in figure 14.
For example, in the situation that from insert main body 720 dismounting component carrier 760, at first, the pin 801 of anchor clamps 800 inserted via the through hole 753 of executor plate 750 from the top clamp accommodation sections 724.As shown in figure 15, because the insertion of this pin 801, the elastic force of Hook member 741 opposing volute springs 742 is upright, and hook 741a is (clockwise among Figure 15) rotation to the inside.Thus, owing to the engage releasing of hook 741a with connecting hole 761, so can pull down component carrier 760 from insert main body 720.
On the other hand, in the situation that component carrier 760 is installed on insert main body 720, the pin 801 insertion clamping accommodation sections 724 with anchor clamps 800 make Hook member 741 upright.Under this state, component carrier 760 is set in the below of insert main body 720, extract the pin 801 of anchor clamps 800 from clamping accommodation section 724, component carrier 760 is remained on the insert main body 720.
Figure 16 is for showing the cut-open view of the structure of pusher, insert, socket guides and the socket of electronic component testing apparatus in the embodiments of the invention.
As shown in figure 16, pusher 121 is arranged on the top of measuring head 5 in the test cabinet 120, under the effect of not concrete illustrated Z axis drive unit (for example fluid cylinder), moves up and down along Z-direction (press direction).This pusher 121 is installed on the Z axis drive unit with for example array of 4 row, 16 row, so that the corresponding IC device of testing simultaneously.
Centre at pusher 121 is provided with for the thrust piece 122 that pushes the IC device.In addition, at the two ends of pusher 121, be provided with the guiding pin 123 of the guide liner 56 of the pilot hole 726 that is inserted into insert 710 and socket guides 55.
In addition, at the two ends of insert 710, the guide liner 56 that is formed with the guiding pin 123 of pusher 121 and socket guides 55 is the pilot hole 726 from inserting up and down respectively.
On the other hand, at the two ends of the socket guides 55 that is fixed in measuring head 5, be provided with the guide liner 56 of the guiding pin 123 that inserts pusher 121.
When the test of IC device, if the Z axis drive unit descends, the guiding pin 123 of pusher 121 inserts the pilot hole 726 of insert 710 from the top so, thereafter, the guide liner 56 of socket guides 55 inserts the pilot hole 726 of insert 710 from the below, the guiding pin 123 of pusher 121 inserts in the guide liner 56 simultaneously, and pusher 121, insert 710 and socket 5 are located mutually thus.
At this moment, as shown in figure 13, because component carrier 760 descends with respect to insert main body 720 with the IC device that is pushed device 121 pushings in the present embodiment, so not only alleviated the load that loads on IC device, component carrier 760, and the IC device take terminal HB as origin reference location can not depart from component carrier 760.
The test of IC device is carried out contacting under the state that pin 51 electrically contacts of the terminal HB that makes the IC device and socket 50 by test machine 6.The test result of IC device is stored in the address that is determined by the identification number that for example invests test pallet TST and the IC device number that distributes in test pallet TST.
＜unloading section 400 〉
Get back to Fig. 2, also be provided with in the unloading section 400 be arranged on loading part 300 on identical 2 the device transferring devices 410 of device transferring device 310 structure, by described device transferring device 410, will turn from the test I C device of the test pallet TST that transports unloading section 400 and install to the client pallet KST corresponding with test result.
As shown in Figure 2, on the device base station 101 of unloading section 400, be formed with two groups so that a pair of window section 470 that is transported into from storage part 200 that the mode of upper surface of client's pallet KST facing device base station 101 of unloading section 400 configures.
In addition, at each window section 370,470 downside, be provided be used to the lifting table that makes client's pallet KST lifting (omitting diagram).In unloading section 400, client's pallet KST of fully loaded test I C device is descended, and transfer this loaded pallets to tray conveying arm 205.
For example, if utilizing device transferring device 410 to take out in the situation of the IC device that is contained in test pallet TST, under the state shown in Fig. 8 A, Fig. 9 A and Figure 10 A (the top 731a of card door bolt member 731 is in the state that closes the position), the sucker of device transferring device 410 is near each insert 710, and the part by this sucker pushes executor plate 750 so.Follow in this, executor 734 pushes the rear end 731c of card door bolt member 731, and card door bolt member 731 rotates centered by axle 733, and the top 731a of card door bolt member 731 is to the status transition of open position.
Fig. 8 B, Fig. 9 B and Figure 10 B have shown this state, and card door bolt member 731 is kept out of the way from the upper surface of IC device, and are contained in the holding in the recess 722 of insert main body 720 fully, and sucker can keep the IC device.
As mentioned above, in the present embodiment, owing to making at least spinning movement on the plan view of insert 710 of card door bolt member 731, so the amount of movement of the top 731a of card door bolt member 731 is increased, can improve the versatility of the size of IC device.
In addition, since the present embodiment in when the pushing of IC device component carrier can with the fine motion of IC device, so not only can alleviate the load that is carried on IC device, the component carrier 760, can also keep the location of the IC device take terminal HB as benchmark.Therefore, can prevent that not only IC device, component carrier 760 are impaired etc. when pushing, can also suppress the generation that misconnection is touched.
In addition, embodiment described above describes for ease of understanding the present invention, is not that the present invention is consisted of restriction.Therefore, disclosed each key element should comprise whole design alterations and the equivalent that belongs to the technology of the present invention scope in above-described embodiment.
Although in the above-described embodiment to card door bolt member 731 is illustrated in the situation that the plane P L with respect to the main face tilt of insert main body 720 rotates,, the present invention specifically is not subject to this.For example, card door bolt member 731 is being rotated with respect to main of insert main body 720 substantially parallel plane.In addition, in this case, when power is delivered to card door bolt member 731 from executor 734, utilize for example chock principle (wedge principle), will convert from the power of the vertical direction of executor input the power of horizontal direction to.
In addition, although in the above-described embodiment can be by hook structure in insert main body 720 loading and unloading component carrier 760, the present invention specifically be subject to this.In this situation, as substituting of hook structure, can will allow that the structure of component carrier 760 with respect to 720 fine motions of insert main body is installed between insert main body 720 and the component carrier 760.
Claims (8)
1. but fine motion ground insert that arrange, that can hold tested electronic component on the pallet of a conveyance in electronic component testing apparatus possesses:
Have the accommodation hole that holds described tested electronic component the insert main body, keep being contained in described accommodation hole described tested electronic component retaining member and described retaining member releasably is installed in mounting structure on the described insert main body,
Described retaining member can relatively described insert main body fine motion on the press direction on the contact site that described tested electronic component is pressed against the measuring head that described electronic component testing apparatus has,
Described retaining member can be with respect to the fine motion of described insert main body under the effect of described mounting structure,
Described mounting structure has:
Have on the top hook that engages with described retaining member Hook member,
Rotatably support described Hook member axle,
Centered by described axle to 1st force application structure of a sense of rotation to the described Hook member application of force, and
By thereby described Hook member is realized 2nd force application structure of described retaining member in the direction application of force opposite with described press direction in the direction application of force opposite with described press direction;
Described Hook member can be along described press direction fine motion.
2. insert according to claim 1 is characterized in that, described press direction is vertical direction.
3. insert according to claim 1 is characterized in that, the connecting hole that the described hook that described retaining member has with described Hook member has engages.
4. insert according to claim 1 is characterized in that, described the 1st force application structure and described the 2nd force application structure are same force application structure.
5. insert according to claim 1 is characterized in that, is formed with the patchhole that inserts described axle on the described Hook member, and described patchhole is the slotted hole that has along the major axis of described press direction.
6. insert according to claim 1 is characterized in that, described retaining member has a plurality of through holes of the terminal that inserts described tested electronic component.
7. the pallet of a conveyance in electronic component testing apparatus has:
But each described insert and fine motion ground keeps the framing component of described insert in the claim 1～6.
8. the terminal with tested electronic component presses against the electronic component testing apparatus that carries out the test of described tested electronic component on the contact site of measuring head, possesses:
Be contained at described tested electronic component under the state of pallet of claim 7 record the test department that described tested electronic component pressed against on the described contact site,
The described pallet that will hold the described tested electronic component of not testing is moved into the loading part of described test department, and
To hold the described pallet of the described tested electronic component of having tested from the unloading section that described test department is taken out of,
At described loading part, described test department and the described pallet of described unloading section's circulation conveyance.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/072789 WO2009069190A1 (en) | 2007-11-26 | 2007-11-26 | Insert, tray and electronic component testing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101842712A CN101842712A (en) | 2010-09-22 |
| CN101842712B true CN101842712B (en) | 2013-01-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780101442.3A Active CN101842712B (en) | 2007-11-26 | 2007-11-26 | Insert, tray and electronic component testing apparatus |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2009069190A1 (en) |
| KR (1) | KR101149747B1 (en) |
| CN (1) | CN101842712B (en) |
| PT (1) | PT104140A (en) |
| TW (1) | TWI396847B (en) |
| WO (1) | WO2009069190A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013053991A (en) * | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | Handler and component inspection device |
| KR101488488B1 (en) * | 2013-07-09 | 2015-02-02 | 주식회사 오킨스전자 | LED module testing device |
| TW201610444A (en) * | 2014-09-11 | 2016-03-16 | Motech Taiwan Automatic Corp | Open/close device of electronic component test module |
| KR101887071B1 (en) * | 2016-09-01 | 2018-09-10 | 리노공업주식회사 | A slider operating mechanism of the testing device |
| CN116643065B (en) * | 2023-07-26 | 2023-11-07 | 中国电子科技集团公司第十研究所 | Flexible clamping device for simulation module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW530159B (en) * | 1999-07-16 | 2003-05-01 | Advantest Corp | Insert for electric devices testing apparatus |
| CN1610832A (en) * | 2002-03-06 | 2005-04-27 | 株式会社爱德万测试 | Insertosome and electronic parts processing device with the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6369595B1 (en) * | 1999-01-21 | 2002-04-09 | Micron Technology, Inc. | CSP BGA test socket with insert and method |
| JP4279413B2 (en) * | 1999-07-16 | 2009-06-17 | 株式会社アドバンテスト | Insert for electronic component testing equipment |
| JP4222442B2 (en) * | 1999-07-16 | 2009-02-12 | 株式会社アドバンテスト | Insert for electronic component testing equipment |
| WO2004095038A1 (en) * | 2003-04-23 | 2004-11-04 | Advantest Corporation | Insert and tray respectively for electronic component handling device and electronic component handling device |
-
2007
- 2007-11-26 CN CN200780101442.3A patent/CN101842712B/en active Active
- 2007-11-26 JP JP2009543597A patent/JPWO2009069190A1/en not_active Ceased
- 2007-11-26 KR KR1020107008080A patent/KR101149747B1/en active IP Right Grant
- 2007-11-26 WO PCT/JP2007/072789 patent/WO2009069190A1/en active Application Filing
-
2008
- 2008-07-25 PT PT104140A patent/PT104140A/en not_active Application Discontinuation
- 2008-11-24 TW TW097145327A patent/TWI396847B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW530159B (en) * | 1999-07-16 | 2003-05-01 | Advantest Corp | Insert for electric devices testing apparatus |
| CN1610832A (en) * | 2002-03-06 | 2005-04-27 | 株式会社爱德万测试 | Insertosome and electronic parts processing device with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI396847B (en) | 2013-05-21 |
| PT104140A (en) | 2008-09-17 |
| JPWO2009069190A1 (en) | 2011-04-07 |
| TW200946917A (en) | 2009-11-16 |
| KR20100052564A (en) | 2010-05-19 |
| KR101149747B1 (en) | 2012-06-01 |
| WO2009069190A1 (en) | 2009-06-04 |
| CN101842712A (en) | 2010-09-22 |
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