KR100748482B1 - Handler for testing semiconductor - Google Patents

Abstract

The present invention relates to a semiconductor device test handler, and to increase the number of semiconductor devices that can be tested at one time.

The semiconductor device test handler according to the present invention includes: a loading unit in which semiconductor devices to be tested are waiting; A test tray comprising a base plate on which a plurality of seating parts on which semiconductor elements are seated are arranged, and a cover plate which is releasably coupled to an upper surface of the base plate and which supports each semiconductor element of the base plate; An exchange unit in which a semiconductor device to be tested is mounted on a test tray and a work for separating the tested semiconductor device is performed; A test unit having a test head electrically connected to semiconductor elements of a test tray conveyed from the exchange unit; An unloading unit in which the semiconductor devices tested in the test unit are classified according to a test result and stored in a tray; At least one picker for transferring semiconductor elements to the loading portion, the exchange portion, and the unloading portion; And a tray conveying apparatus for conveying a test tray between the exchange unit and the test unit.

Semiconductor Devices, Tests, Handlers, Test Trays

Description

Semiconductor Device Test Handler {HANDLER FOR TESTING SEMICONDUCTOR}

1 is a plan view schematically showing the structure of an embodiment of a semiconductor device test handler according to the present invention;

2 is a cross-sectional view of the main portion seen from the side of the handler of FIG.

3 is an exploded perspective view illustrating a configuration of a test tray of the handler of FIG. 1;

4 is a cross-sectional view illustrating main parts of the test tray of FIG. 3.

5 is a plan view schematically showing the structure of another embodiment of a semiconductor device test handler according to the present invention;

Explanation of symbols on the main parts of the drawings

10: loading unit 20: unloading unit

31: Loading Picker 32: Unloading Picker

36: first short picker 37: second short picker

40: exchange part 41: loading standby part

42: tray handling device 50: rotator

70: test unit 71: preheat chamber

72: test chamber 73: heat removal chamber

75 test head 76 contact pusher

100: test tray 110: base plate

111: seating groove 120: cover plate

D: semiconductor device

The present invention relates to a handler for testing a semiconductor device, and more particularly, to perform an electrical performance test by connecting a semiconductor device to a test head, and classifying the tested semiconductor devices according to test results and storing them in a tray. It relates to a semiconductor device test handler to perform.

In general, memory ICs or non-memory semiconductor devices and module ICs having them properly configured on a substrate are shipped after various tests after production.

The handler is a device that is used to automatically test the semiconductor device and the module as described above. In such a handler, the customer trays containing the semiconductor devices to be tested by the operator are loaded into the loading stacker of the handler, the semiconductor devices of the loading stacker are transferred to a separate test tray having heat resistance, and then remounted. A test tray in which semiconductor devices are mounted is sent to a test site to perform a test. At the test site, a lead or ball portion of the semiconductor devices mounted on the test tray is electrically connected to the socket of the test head to perform a predetermined electrical test. Then, the handler performs the test by separating the semiconductor elements of the test tray, which have been tested, and classifying and mounting them on the customer tray of the unloading stacker according to the test result.

The test tray carrying the semiconductor devices in the handler as described above includes a plurality of carrier modules for aligning and fixing the semiconductor devices at the same pitch as the pitch of the test sockets.

However, the conventional handler as described above has a problem in that the number of semiconductor devices that can be tested at one time is limited due to the structure of the test tray, and the productivity is lowered.

This will be described in more detail as follows.

In order to fix the semiconductor element to the test tray of the conventional handler, fixing and releasing means such as a latch for fixing the semiconductor element to both sides of the carrier module and an operation button for operating the latch should be provided. Accordingly, the size of the carrier module is increased, and the number of carrier modules mounted on one test tray is reduced.

Therefore, there is a problem in that a limit is placed on increasing the number of semiconductor devices that can be tested at one time.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor element test handler that can increase the number of semiconductor devices that can be tested at one time.

The semiconductor device test handler of the present invention for achieving the above object, the loading unit waiting for the semiconductor device to be tested; A test tray comprising a base plate on which a plurality of seating parts on which semiconductor elements are seated are arranged, and a cover plate which is releasably coupled to an upper surface of the base plate and which supports each semiconductor element of the base plate; An exchange unit in which a semiconductor device to be tested is mounted on a test tray and a work for separating the tested semiconductor device is performed; A test unit having a test head electrically connected to semiconductor elements of a test tray conveyed from the exchange unit; An unloading unit in which the semiconductor devices tested in the test unit are classified according to a test result and stored in a tray; At least one picker for transferring semiconductor elements to the loading portion, the exchange portion, and the unloading portion; And a tray conveying apparatus for conveying a test tray between the exchange unit and the test unit.
The semiconductor device further includes a loading buffer unit disposed between the loading unit and the exchange unit to temporarily wait for the semiconductor device to be tested, and an unloading buffer unit disposed between the unloading unit and the exchange unit to temporarily wait for the test. It may be characterized in that the configuration.
The exchange part may include a loading standby part on which the base plate is placed, and a tray handling device installed on the loading standby part so as to be movable to couple and release the cover plate to the base plate.
The base plate may be further provided with a through hole communicating with the outside.

Hereinafter, a preferred embodiment of a semiconductor device test handler according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1 and FIG. 2, the semiconductor device test handler according to the present invention includes a loading unit 10 in which customer trays C containing the semiconductor devices to be tested are loaded, and test results of the semiconductor devices that have been tested. The unloading unit 20, which is classified and stored according to the present invention, an exchange unit 40 in which a semiconductor element to be tested is mounted on the test tray 100, and a test semiconductor element is separated, and the exchange unit 40 A test unit 70 electrically connected to the semiconductor elements of the test tray 100 conveyed from the test tray 100, and a semiconductor device between the loading unit 10, the exchange unit 40, and the unloading unit 20. It consists of a loading picker 31 and an unloading picker 32 for conveying.

The loading picker 31 and the unloading picker 32 are installed on the upper part of the handler so as to be movable in the X-Y-Z direction, and vacuum-suck the semiconductor element to carry it. The loading picker 31 and the unloading picker 32 are moved in the X-Y-Z direction by, for example, a known linear motion device such as a linear motion device using a linear motor, a ball screw and a servo motor.

Between the test unit 70 and the exchange unit 40, a rotator 50 for transferring and transferring the test tray 100 from a horizontal posture to a vertical posture is disposed.

The test unit 70 includes a preheating chamber 71, a test chamber 72, and a heat removing chamber 73. The preheat chamber 71 performs a function of enabling a temperature test by heating and cooling the semiconductor elements of the test tray 100 to a predetermined temperature. To this end, the preheating chamber 71 is provided with a temperature composition device (not shown) capable of heating and cooling the interior to a predetermined temperature state, and the test tray 100 is conveyed backward by one step in an upright state. A tray feeder (not shown) is provided.

The test chamber 72 is equipped with a test head 75 to which semiconductor elements of the test tray 100 are connected. The test head 75 is electrically connected to a device called a tester (TESTER) provided separately from the handler to serve as an interface to exchange electrical signals with the tester. Immediately in front of the test head 75 presses the test tray 100 toward the test head 75 so that the semiconductor elements D are connected to a socket (not shown) of the test head 75 at a predetermined pressure. The contact pusher 76 is installed.

Like the preheating chamber 71, the test unit 70 is preferably provided with a temperature composition device (not shown) capable of heating and cooling the interior to a predetermined temperature state.

The heat removal chamber 73 serves to return the semiconductor device to a normal temperature state by applying heat stress to the preheat chamber 71 and the test chamber 72. Like the preheat chamber 71, the heat removal chamber 73 is provided with a temperature composition device (not shown) which can heat and cool the inside to a predetermined temperature state, and the test tray 100 is placed upright by one step. A tray feeder (not shown) for conveying forward is provided.

Front and rear tray transfer units 77 and rear tray transfer units 78 which transfer the test trays 100 to the respective chambers are installed at the front and rear portions of the test unit 70, respectively.

The test tray 100 includes a base plate 110 on which a plurality of seating parts on which semiconductor elements are mounted are arranged, and a cover for fixing each semiconductor element of the base plate to be fixed to the upper surface of the base plate. Plate 120. The base plate 110 and the cover plate 120 is made of a heat resistant material that is not easily deformed by heat.

The exchange part 40 is installed on the loading standby part 41 on which the base plate 110 of the test tray 100 is placed, and is movable up and down on a plurality of the loading standby parts. ) Is composed of a tray handling device 42 for engaging and releasing with the base plate 110.

The loading picker 31 and the unloading picker 32 to prevent the interference between the picker and the cover plate 120 when mounting and detaching the semiconductor device on the base plate 110 of the test tray 100 It is preferable that the standby part 41 is comprised so that a movement to the front-back direction is possible.

The structure of the test tray 100 will be described in more detail with reference to FIGS. 3 and 4 as follows.

As described above, a plurality of seating recesses 111 on which the semiconductor device D is seated are arranged on the upper surface of the base plate 110 of the test tray 100 at predetermined intervals. An opening 112 is formed in the mounting groove 111 of the base plate 110 so that the terminal portion of the semiconductor device D, that is, the lead L, may be exposed to the outside.

In addition, it is preferable that the through hole 113 is formed in the center portion of the seating recess 111 so that the front surface of the semiconductor device is exposed to the outside. This is because a heat transfer medium such as a heat sink when hot air or low temperature air comes into contact with the surface of a semiconductor device from the outside through the through hole 113 or the semiconductor device is connected to a test socket at a test site. This is to allow the contact with the semiconductor device.

A plurality of support parts 121 are formed to protrude from the bottom surface of the cover plate 120 while being in contact with the semiconductor elements of each of the mounting recesses 111. In addition, it is preferable that through-holes 122 are formed in each of the support parts 121 so that cooling gas may be injected into the semiconductor device from the outside, or the heat sink or the pressurizing device may contact the surface of the semiconductor device.

The base plate 110 and / or the cover plate 120 are easily detachable by a coupling means not shown in the drawing. The coupling means may, for example, have a structure similar to a latch and an operation button mounted on a carrier of a conventional test tray. Of course, in addition to the coupling means of a variety of structures, such as elastic hook, clamp structure can be applied.

The semiconductor device test handler of the present invention configured as described above operates as follows.

The operator or the automatic transport equipment loads the customer trays C containing the semiconductor elements to be tested in the loading unit 10. When the handler starts to operate, the loading picker 31 transfers the semiconductor elements to be tested of the loading unit 10 to the exchange unit 40 and mounts them on the base plate 110 of the test tray 100.

When all the semiconductor devices to be tested are filled in the base plate 110, the tray handling device 42 moves the cover plate 120 downward to couple the upper surface of the base plate 110.

Subsequently, the rotator 50 rotates 90 degrees to transfer the test tray 100 to the test unit 70. At this time, the test tray 100 is switched from a horizontal posture to a vertical posture. Thereafter, the front side tray transferr 77 conveys the test tray 100 to the preheating chamber 71. In the preheating chamber 71, the test tray 100 is heated or cooled to a predetermined temperature while advancing step by step by a tray feeder (not shown).

When the test tray 100 is located at the rear of the preheat chamber 71, the rear tray transfer 78 conveys the test tray 100 into the test chamber 72, and the test tray 100 is connected to the test head ( 75) is aligned just in front of it.

Thereafter, the contact pusher 76 presses the test tray 100 toward the test head 75 to connect the semiconductor elements D to a socket (not shown) of the test head 75, and performs an electrical performance test for a predetermined time. Is done.

When the test is finished, the contact pusher 76 moves forward again, and the connection between the test head 75 and the semiconductor device D is released. Subsequently, the back side tray transferr 78 conveys the test tray 100 to the heat removal chamber 73.

In the heat removal chamber 73, the test tray 100 moves forward by one step by a tray feeder (not shown) and returns to a normal temperature state.

When the test tray 100 is positioned at the forefront of the heat removal chamber 73, the front tray transferr 77 conveys the test tray 100 to the front center of the test unit 70, and the rotator 50 is upper side. The test tray 100 is transmitted to the loading standby portion 41 of the exchanger 40 while rotating by 90 degrees. At this time, the test tray 100 is switched from a vertical posture to a horizontal posture.

Then, the tray handling device 42 separates the cover plate 120 of the test tray 100 on the loading standby portion 41. Then, the unloading picker 32 conveys the tested semiconductor devices on the base plate 110 to the unloading unit 20 to classify and store them in the customer tray C according to the test result.

While the unloading picker 32 draws out and transports the tested semiconductor devices in the base plate 110, the loading picker 31 carries new semiconductor devices from the loading unit 10 to transfer the new semiconductor devices from the base plate 110. Fill in the empty spaces.

The handler tests the semiconductor devices while repeatedly performing the above-described process.

Meanwhile, in the above-described embodiment, the semiconductor elements are directly transferred between the loading unit 10 and the exchange unit 40, and the unloading unit 20 and the exchange unit 40.

However, as shown in FIG. 5, between the loading unit 10 and the exchange unit 40, a loading buffer unit 81 on which the semiconductor device to be tested temporarily stands by is disposed and exchanged with the unloading unit 20. An unloading buffer unit 82 may be disposed between the units 40 to temporarily wait for the tested semiconductor devices.

The loading buffer unit 81 and the unloading buffer unit 82 are configured to be moved by a predetermined distance by a known linear motion device.

In addition, a shortening frame 35 is disposed across the upper portion of the loading buffer portion 81, the exchange portion 40, and the unloading buffer portion 82, and the semiconductor element is vacuum-adsorbed on the shortening frame 35. The 1st 1st 1st and 2nd axis pickers 36 and 37 to convey are installed so that horizontal movement is possible.

The first short picker 36 transfers the semiconductor devices to be tested of the loading buffer unit 81 to the exchanger 40, and the second short picker 37 freezes the tested semiconductor devices of the exchanger 40. It conveys to the loading buffer part 82.

The loading picker 31 conveys the semiconductor elements of the loading unit 10 to the loading buffer unit 81, and the unloading picker 32 unloads the tested semiconductor elements of the unloading buffer unit 82. ) To return.

For the sake of clarity, the same reference numerals are given to the same parts as those of the handler of the above-described embodiment, and the detailed description thereof is omitted.

The handler in this embodiment works as follows.

When the handler is operated, the loading picker 31 conveys the semiconductor elements to be tested of the loading unit 10 to the loading buffer unit 81. In addition, the first short picker 36 vacuum-absorbs the semiconductor elements on the loading buffer unit 81, transfers them to the exchange unit 40, and mounts them on the test tray 100. Since the process is the same as the operation of the handler of the above-described embodiment, a detailed description thereof will be omitted.

When the test tray 100 containing the tested semiconductor elements through the test unit 70 is returned to the exchange unit 40, the second short-term picker 37 unloads the tested semiconductor elements into the buffer unit 82. The unloading picker 32 transfers the semiconductor elements on the unloading buffer unit 82 to the unloading unit 20 and classifies and stores them in the customer tray C according to the test result.

While the second short picker 37 separates the semiconductor devices from the exchanger 40, the first short picker 36 replaces the new semiconductor devices that have been prepared on the loading buffer part 81. ), And fill it in an empty position of the base plate 110 of the test tray 100.

As described above, the handler of this embodiment has an advantage that the loading and unloading operations can be performed more efficiently by providing the loading buffer section 81 and the unloading buffer section 82.

As described above, according to the present invention, since the test tray is composed of two parts coupled to each other, the semiconductor device can be moved in a fixed state, thereby increasing the number of semiconductor devices that can be accommodated in the test tray. Therefore, the number of semiconductor devices that can be tested at one time is increased, thereby improving test productivity.

Claims (5)

A loading unit waiting for semiconductor devices to be tested; A cover plate having a plurality of seating parts on which semiconductor elements are seated is arranged, and a cover plate which is fixedly supported on the upper surface of the base plate and fixedly supports each semiconductor element of the base plate and communicates with the outside. A test tray consisting of; An exchange unit in which a semiconductor device to be tested is mounted on a test tray and a work for separating the tested semiconductor device is performed; A test unit having a test head electrically connected to semiconductor elements of a test tray conveyed from the exchange unit; An unloading unit in which the semiconductor devices tested in the test unit are classified according to a test result and stored in a tray; At least one picker for transferring semiconductor elements to the loading portion, the exchange portion, and the unloading portion; And a tray conveying apparatus for conveying a test tray between the exchange unit and the test unit. The method of claim 1, The semiconductor device further includes a loading buffer unit disposed between the loading unit and the exchange unit to temporarily wait for the semiconductor device to be tested, and an unloading buffer unit disposed between the unloading unit and the exchange unit to temporarily test the semiconductor device. Semiconductor device test handler, characterized in that configured to. delete The apparatus of claim 1, wherein the exchange part includes a loading standby part on which the base plate is placed, and a tray handling device installed on the upper part of the loading standby part to couple and release the cover plate to the base plate. Semiconductor device test handler. The method of claim 1, The base plate further comprises a through hole communicating with the outside.

Images