JPWO2008041334A1 - Electronic component testing equipment - Google Patents

Abstract

An electronic component testing apparatus for testing an IC device (IC) by bringing an IC device (IC) into electrical contact with a contact portion of a test head includes a test tray from a customer tray (800) positioned at a window portion of the loader portion. The device carrying device (310) for transferring the IC device (IC) to the device has a holding head (340) for holding the IC device (IC), and the holding head (340). Holds the IC device (IC) by drawing the IC device (IC) accommodated in the customer tray (800) from a non-contact state.

Description

  The present invention relates to an electronic component testing apparatus for testing an IC device by electrically contacting various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) with a contact portion of a test head. The present invention relates to an electronic component testing apparatus capable of handling an extremely small IC device.

  In the manufacturing process of an electronic component such as an IC device, an electronic component testing apparatus is used to test the performance and function of the IC device in a packaged state.

  In a handler constituting the electronic component testing apparatus, an IC device before the test or a tray (hereinafter referred to as a customer tray) for accommodating the tested IC device is sent from the tray inside the electronic component testing apparatus. A large number of IC devices are transferred to a tray that circulates (hereinafter referred to as a test tray), the test tray is transported into a handler, and each IC device is electrically connected to the contact portion of the test head while being accommodated in the test tray. The electronic component testing apparatus main body (hereinafter also referred to as a tester) performs a test. When the test is completed, the test tray on which each IC device is mounted is unloaded from the test head, and is placed on the customer tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

  As described above, in the electronic component testing apparatus, the IC device is transferred between the customer tray and the test tray before and after the test. For example, the size of the IC device is reduced to about 5 to 20 mm on a side. As the process proceeds, the following problems arise.

First, since the IC device itself becomes lighter as the IC device becomes smaller, when an impact or vibration is applied to the customer tray or test tray, the IC device jumps up from the tray and becomes discrete even if the impact or vibration is slight. May end up.

  Further, when the IC device is held, if the position of the IC device is shifted, there is a high possibility that the IC device is missed because the IC device is small.

  An object of the present invention is to provide an electronic component testing apparatus capable of handling an extremely small electronic device under test.

  In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head. A component conveying means for transferring the electronic device under test from a first container located at a position to a second container located at a second position, wherein the component conveying means comprises the electronic device under test; An electronic component test for holding the electronic device under test by pulling the electronic device under test accommodated in the first container from a non-contact state. An apparatus is provided (claim 1).

  In the present invention, when the holding head of the component conveying means holds the electronic device under test, the electronic device under test is pulled and held from a non-contact state. Thereby, the impact generated when the holding head and the electronic device under test come into contact with each other is not transmitted to the first container. Therefore, even when handling an electronic device under test of an extremely small size, it is possible to prevent another electronic device under test from jumping out of the container due to an impact when holding the electronic device under test.

  Although not particularly limited in the above invention, the holding head has suction means for sucking and holding the electronic device under test, and the holding head holds the electronic device under test accommodated in the first container. In doing so, it is preferable that the suction means sucks and draws the electronic device under test in a non-contact state (see claim 2).

Although not particularly limited in the above invention, the first container is a customer tray that houses the electronic device to be tested before the test, and the first position is formed on a device base of the electronic device test apparatus. It is preferable that the electronic component testing apparatus includes an adjusting unit capable of adjusting a height of the customer tray located in the window (see claim 3).

The height of the customer tray located in the window is adjusted by the adjusting means, and when the holding head holds the electronic device under test, the holding head and the electronic device under test are brought into a non-contact state. As a result, it is possible to prevent an electronic component under test having a very small size from jumping out of the customer tray due to an impact.

  Although not particularly limited in the above invention, the first container is a customer tray that houses the electronic device to be tested before the test, and the first position is formed on a device base of the electronic device test apparatus. The electronic component testing apparatus includes: a storage unit that mounts the customer tray on which the electronic device to be tested before the test is mounted; and the customer tray stored in the storage unit in the window unit. Tray moving means for moving, and the storage means includes elevating means for supporting the customer tray so as to be movable up and down, and buffer means provided between the customer tray and the elevating means. It is preferable to have (refer claim 4).

  By interposing the buffer means between the customer tray and the elevating means, it is possible to suppress the vibration generated when the elevating means moves up and down from being transmitted to the customer tray. It is possible to prevent the position of the test electronic component from being displaced.

  Although not particularly limited in the above invention, the second container is a precursor for storing the electronic device under test before testing and correcting the mutual positional relationship between the electronic devices under test, It is preferable that the electronic component testing apparatus includes first limiting means for limiting the approach of the holding head to the precursor.

With the first restricting means, the electronic device under test can be accommodated in the accommodating portion in a state where the recess and the electronic device under test are not in contact with each other and the distance between them is minimized. Accordingly, even when a very small electronic device under test is accommodated in the accommodating portion, it is possible to suppress the occurrence of positional misalignment such as the electronic device under test being inclined and accommodated.

  Although not particularly limited in the above invention, the precursor has a concave portion for accommodating the electronic device under test, and the first restricting means is provided around the concave portion, The shaft is preferably in contact with the holding head (see claim 6).

  Although not particularly limited in the above invention, it is preferable that the shaft can be replaced with another shaft having a different length in accordance with the exchange of the type of the electronic device under test (see claim 7).

  Although not particularly limited in the above invention, the second container is a test tray that houses the electronic device under test before the test, and the electronic component test apparatus is configured such that the holding head approaches the test tray. It is preferable to include a second restricting means for restricting (see claim 8).

  With the second restricting means, the electronic device under test can be accommodated in the accommodating portion in a state where the test tray and the electronic device under test are not in contact with each other and the distance between them is minimized. Accordingly, even when a very small electronic device under test is accommodated in the test tray, it is possible to suppress the occurrence of misalignment of the electronic device under test such that the electronic device under test is housed in an inclined manner. .

  Although not particularly limited in the above invention, the second restricting means is a stopper provided on the holding head of the component conveying means and abutting against the test tray, and the stopper is a type of the electronic device under test. It is preferable that the stopper can be replaced with another stopper having a different length according to the replacement (see claim 9).

Although not particularly limited in the above invention, the first container is a test tray that houses the tested electronic component that has been tested, and the electronic component test apparatus is configured such that the holding head approaches the test tray. It is preferable to include a third restricting means for restricting (see claim 10).

  By preventing the holding head from coming into contact with the electronic device under test by the third restricting means, it is possible to prevent the electronic device under test having a minimum size from jumping up from the test tray due to an impact.

  Although not particularly limited in the above invention, the third restricting means is preferably a contact portion provided on the holding head and contacting the upper surface of the test tray (see claim 11).

  Although not particularly limited in the above invention, the first container is a test tray that houses the tested electronic component, and the second container is the tested electronic component that has been tested. Preferably, it is a precursor that accommodates and corrects the positional relationship between the electronic devices under test (see claim 12).

  When transferring a tested electronic component from the test tray to the customer tray, it is placed on the Preciseer and the mutual positional relationship between the electronic components to be tested is corrected, thereby minimizing the size of the device under test. Electronic components can be accurately conveyed to the customer tray.

  Although not particularly limited in the above invention, it is preferable that the electronic component testing apparatus includes a fourth limiting unit that limits the approach of the holding head to the precursor (see claim 13).

  The fourth limiting means makes it possible to house the electronic device under test in the housing portion in a state where the recess and the electronic device under test are in a non-contact vegetable state and the distance between them is minimized. Accordingly, even when a very small electronic device under test is accommodated in the accommodating portion, it is possible to suppress the occurrence of positional misalignment such as the electronic device under test being inclined and accommodated.

Although not particularly limited in the above invention, the precursor has a recess for accommodating the electronic device under test, and the fourth restricting means is provided around the recess, Preferably, the shaft is in contact with a holding head, and the shaft is preferably replaceable with another shaft having a different length in accordance with the replacement of the type of the electronic device under test (see claim 14).

  Although not particularly limited in the above invention, the holding head includes a suction nozzle having a flat front end surface that is in close contact with the upper surface of the electronic device under test and a suction port that opens to the front end surface. It is preferable (see claim 15).

  When the suction nozzle sucks and holds the electronic device under test, the electronic device under test can be held at an accurate position without being displaced by contacting the upper surface of the electronic device under test with a flat surface. Further, in the present invention, since the electronic device under test is brought into contact with the flat surface, the electronic device under test is easily detached after the suction is stopped as compared with the case where the electronic device under test is held through the pad.

  Although not particularly limited in the above invention, the component conveying means includes a plurality of the holding heads and a pitch conversion mechanism that converts a pitch between the holding heads, and the component conveying means includes the holding head. The pitch between each other is an integral multiple of the first pitch between the accommodating portions in the first container and is the closest pitch to the second pitch between the accommodating portions in the second container. In this state, the electronic device under test housed in the first container is held, and the pitch conversion mechanism converts the pitch between the holding heads to be substantially the same as the second pitch. After that, it is preferable to transfer the electronic device under test to the second container (see claim 16).

  As a result, the difference in pitch before and after conversion is reduced, so that the accumulation of errors occurring in each pitch during pitch conversion can be reduced, and the positional deviation of the electronic device under test can be suppressed to a minimum.

  Although not particularly limited in the above invention, the first container is a customer tray that houses the electronic device under test before testing, and the second container is the electronic device under test before testing. Preferably, it is a precursor for accommodating and correcting the mutual positional relationship between the electronic devices under test (see claim 17).

Although not particularly limited in the above invention, the component conveying means includes a plurality of the holding heads and a pitch conversion mechanism that converts a pitch between the holding heads, and the component conveying means includes the holding The pitch conversion is performed by holding the electronic device to be tested housed in the first container in a state in which the pitch between the heads is the first pitch between the housing parts in the first container. Due to the mechanism, the pitch between the holding heads is an integral multiple of the second pitch between the receiving portions in the second receiving tool, and the first pitch between the receiving portions in the first receiving tool. It is preferable to transfer the electronic device under test to the second container after converting to the nearest pitch (see claim 18).

  As a result, the difference in pitch before and after conversion can be reduced, so that the accumulation of errors that occur in each pitch during pitch conversion can be reduced, and the positional deviation of the electronic device under test can be reduced.

Although not particularly limited in the above invention, the first container is a test tray that houses the tested electronic component, and the second container is the tested electronic component that has been tested. It is preferable that the customer tray to be accommodated or a precursor that accommodates the tested electronic components to be tested and corrects the positional relationship between the electronic components to be tested (see claim 19).

  Although not particularly limited in the above invention, the second container is a test tray that houses an electronic device under test before testing, and the test tray includes a housing portion that can house the electronic device under test; A clamp mechanism for fixing / releasing the electronic device under test in the accommodating portion, and the component conveying means includes clamp operation means for operating fixing / releasing of the clamp mechanism, and the second accommodating When the electronic device under test is accommodated in a tool, the holding head releases the electronic device under test into the accommodating portion, and the clamp mechanism is moved into the accommodating portion by operation of the clamp operating means. It is preferable that the holding head is detached from the housing portion after fixing (see claim 20).

  As a result, when the holding head is detached from the housing portion, it is possible to prevent the electronic device under test of a very small size that should have been released from lifting together with the holding head.

Although not particularly limited in the above invention, the first container is a test tray that houses a tested electronic component to be tested, and the test tray includes a container that can accommodate the electronic device to be tested; A clamp mechanism for fixing / releasing the electronic component under test in the housing portion, and the component conveying means includes a plurality of the holding heads, and a clamp operation means for operating fixing / releasing of the clamp mechanism. And when holding the electronic device under test from the first container, the plurality of holding heads approach the housing portion, respectively, and at least one of the plurality of holding heads is the device under test. After the electronic component is held and detached from the housing portion, and the clamp mechanism is operated to operate the clamp mechanism, the clamp mechanism fixes the electronic device under test housed in the housing portion. , It is preferable that the remaining of the holding head is detached from the housing part (see claim 21).

  Thereby, when at least one of the plurality of holding heads holds the electronic device under test, it is possible to prevent the electronic device under test housed in the other housing portion from being displaced due to an impact or the like. .

In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head. A component carrying means for transferring the electronic device under test from the first container located at the second position to the second container located at the second position; A test tray for accommodating the electronic device under test, the test tray comprising: a housing portion capable of housing the electronic device under test; and a clamp mechanism for fixing / releasing the electronic device under test in the housing portion. And the component conveying means includes a clamp operating means for operating fixing / releasing of the clamp mechanism, and when the electronic component to be tested is accommodated in the second container, the holding head is Electronic components under test An electronic component testing apparatus is provided in which the holding head is released from the housing portion after being released into the housing portion and the clamp mechanism fixes the electronic device under test in the housing portion by operation of the clamp operating means. .

As a result, when the holding head is detached from the housing portion, it is possible to prevent the electronic device under test of a very small size that should have been released from lifting together with the holding head.

In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head. The first container is provided with a component conveying means for transferring the electronic device under test from the first container located at the second position to the second container located at the second position. A test tray that accommodates an electronic device under test, the test tray having a housing portion that can house the electronic device under test, and a clamp mechanism that fixes / releases the electronic device under test in the housing portion. The component conveying means includes a plurality of holding heads and a clamp operating means for operating fixing / releasing of the clamp mechanism, and holds the electronic device under test from the first container. When all Each holding head approaches the housing portion, and at least one of the plurality of holding heads holds the electronic component to be tested and is detached from the housing portion, and the clamp mechanism is operated by operating the clamp operation means. An electronic component testing apparatus is provided in which the remaining holding head is detached from the housing portion after the electronic device under test housed in the housing portion is fixed.

  Thereby, when at least one of the plurality of holding heads holds the electronic device under test, it is possible to prevent the electronic device under test housed in the other housing portion from being displaced due to an impact or the like. .

In order to achieve the above-described object, according to the present invention, a test tray provided with a storage unit capable of storing an electronic device under test and a clamp mechanism for fixing / releasing the electronic device under test in the storage unit, An electronic component accommodation method for accommodating the electronic device under test held by a component conveyance means, the releasing step for releasing the electronic device under test held by the component conveyance means into the accommodation portion; Provided is an electronic component housing method comprising: a fixing step in which the clamp mechanism fixes the electronic component to be tested housed in the housing portion; and a detaching step in which the component transport means separates from the housing portion. .

As a result, when the holding head is detached from the housing portion, it is possible to prevent the electronic device under test of a very small size that should have been released from lifting together with the holding head.

In order to achieve the above object, according to the present invention, from a test tray provided with a storage unit that can store an electronic device under test, and a clamp mechanism that fixes / releases the electronic device under test in the storage unit, The component conveying means having a plurality of holding heads capable of holding the electronic device under test is an electronic component holding method for holding the electronic device under test, and the approaching step in which the plurality of holding heads approach the housing portion, respectively. And a holding step in which at least one of the plurality of holding heads holds the electronic device under test and separates from the accommodating portion, the first detaching step, and the clamp mechanism are accommodated in the accommodating portion. And holding the electronic component comprising: a fixing step for fixing the electronic device under test; and a second detaching step in which the remaining holding head is detached from the housing portion. The law is provided.

Thereby, when at least one of the plurality of holding heads holds the electronic device under test, it is possible to prevent the electronic device under test housed in the other housing portion from being displaced due to an impact or the like. .

FIG. 1 is a schematic cross-sectional view showing an electronic device testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 6 is a side view showing the holding head of the device transport apparatus provided in the loader unit of the electronic component test apparatus according to the embodiment of the present invention. FIG. 7 is a perspective view showing a suction nozzle provided at the tip of the holding head shown in FIG. FIG. 8 is a perspective view showing the pitch conversion mechanism of the device transport apparatus provided in the loader unit of the electronic component test apparatus according to the embodiment of the present invention. FIG. 9 is a plan view showing the periphery of the window portion of the loader portion in the embodiment of the present invention. FIG. 10A is a plan view of the adjustment mechanism in the embodiment of the present invention, and is an enlarged view of the XA portion in FIG. 9. FIG. 10B is a cross-sectional view showing the adjustment mechanism in the embodiment of the present invention, and is a view taken along line XB-XB in FIG. 10A. 10C is a cross-sectional view taken along line XC-XC in FIG. 10A. FIG. 11A is a schematic cross-sectional view showing a state immediately before the IC device is sucked and held from the customer tray in the loader unit. FIG. 11B is a schematic cross-sectional view showing a state in which the IC device is sucked and held from the customer tray in the loader unit. FIG. 12A is a schematic cross-sectional view showing a state in which the holding head shown in FIG. 6 holds the IC device from the precursor, and is a diagram showing a state in which the holding head is approaching the precursor. FIG. 12B is a schematic cross-sectional view showing a state in which the holding head shown in FIG. 6 holds the IC device from the precursor, and shows a state in which the holding head is in contact with the first shaft. FIG. 12C is a schematic cross-sectional view showing a state in which the holding head shown in FIG. 6 holds the IC device from the precursor, and shows a state in which the holding head sucks the IC device. FIG. 13 is a schematic plan view showing a pitch conversion method in the loader unit of the electronic device test apparatus according to the embodiment of the present invention. FIG. 14A is a schematic side view showing the conversion operation of the pitch conversion mechanism in the loader unit of the electronic device test apparatus according to the embodiment of the present invention. FIG. 14B is a schematic side view showing a conventional pitch conversion operation in the loader unit. FIG. 15 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 16 is an exploded perspective view showing an insert used in the electronic device test apparatus according to the embodiment of the present invention. FIG. 17A is a partial cross-sectional view (No. 1) for explaining the procedure for mounting the guide core to the insert body by the hook mechanism in the embodiment of the present invention. FIG. 17B is a partial cross-sectional view (No. 2) for explaining the procedure for mounting the guide core to the insert body by the hook mechanism in the embodiment of the present invention. FIG. 17C is a partial cross-sectional view (No. 3) for explaining the procedure for mounting the guide core to the insert body by the hook mechanism in the embodiment of the present invention. FIG. 18A is a cross-sectional view along the short direction of the insert for explaining the operation of the clamp mechanism in the embodiment of the present invention, and is a view showing a state where the clamp mechanism is in an open position. FIG. 18B is a cross-sectional view of the insert along the short direction for explaining the operation of the clamp mechanism in the embodiment of the present invention, and is a view showing a state where the clamp mechanism is in the closed position. FIG. 19A is a schematic cross-sectional view for explaining a state in which an IC device is placed on a test tray in the embodiment of the present invention, and shows a state in which a holding head is approaching the test tray. FIG. 19B is a schematic cross-sectional view for explaining a state in which the IC device is placed on the test tray in the embodiment of the present invention, and shows a state in which the holding head is in contact with the second shaft. FIG. 19C is a schematic cross-sectional view for explaining a state in which the IC device is placed on the test tray in the embodiment of the present invention, and is a view showing a state where the holding head places the IC device. FIG. 20A is a schematic cross-sectional view for explaining a detaching procedure of the holding head in which the IC device is placed on the test tray in the embodiment of the present invention, and is a diagram showing a state in which the holding head has entered the insert. FIG. 20B is a schematic cross-sectional view for explaining the detachment procedure of the holding head in which the IC device is placed on the test tray in the embodiment of the present invention, and shows a state where the suction of the IC device is released. FIG. 20C is a schematic cross-sectional view for explaining the detachment procedure of the holding head in which the IC device is placed on the test tray in the embodiment of the present invention, and shows a state where the clamp is closed. FIG. 20D is a schematic cross-sectional view for explaining a detaching procedure of the holding head in which the IC device is placed on the test tray in the embodiment of the present invention, and is a diagram showing a state in which the holding head is detached from the insert. FIG. 21 is an exploded perspective view around the socket of the test head in the embodiment of the present invention. FIG. 22 is a cross-sectional view around the socket of the test head in the embodiment of the present invention. FIG. 23 is a side view showing the holding head of the device transport apparatus provided in the unloader section of the electronic component test apparatus according to the embodiment of the present invention. FIG. 24A is a cross-sectional view showing a state in which the holding head shown in FIG. 23 holds the IC device from the test tray, and shows a state in which the contact portion of the holding head is in contact with the upper surface of the insert. FIG. 24B is a cross-sectional view showing a state in which the holding head shown in FIG. 23 holds the IC device from the test tray, and shows a state in which the holding head sucks the IC device. FIG. 24C is a cross-sectional view illustrating a state in which the holding head illustrated in FIG. 23 holds the IC device from the test tray, and illustrates a state in which the holding head is detached from the test tray. FIG. 25 is a schematic plan view showing a pitch conversion method in the unloader unit of the electronic device test apparatus according to the embodiment of the present invention. FIG. 26A is a schematic side view showing the conversion operation of the pitch conversion mechanism in the unloader unit of the electronic device test apparatus according to the embodiment of the present invention. FIG. 26B is a schematic side view showing a conventional pitch conversion operation in the unloader section. FIG. 27A is a schematic cross-sectional view for explaining a procedure for detaching the holding head that holds the IC device from the test tray in the embodiment of the present invention, and shows a state in which the clamp operating head opens the clamp mechanism. FIG. 27B is a schematic cross-sectional view for explaining the detaching procedure of the holding head that holds the IC device from the test tray in the embodiment of the present invention, and shows the state in which the holding head has entered the insert. FIG. 27C is a schematic cross-sectional view for explaining the detachment procedure of the holding head that holds the IC device from the test tray in the embodiment of the present invention, and shows a state where one holding head holds the IC device. . FIG. 27D is a schematic cross-sectional view for explaining the detachment procedure of the holding head that holds the IC device from the test tray in the embodiment of the present invention, and shows a state in which the clamp operation head closes the clamp mechanism. FIG. 27E is a schematic cross-sectional view for explaining a procedure for detaching the holding head that holds the IC device from the test tray in the embodiment of the present invention, and shows a state in which the holding head is detached from the insert.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Handler 100 ... Chamber part 200 ... Storage part 300 ... Loader part 310 ... Device conveyance apparatus 320 ... Movable head 330 ... Pitch conversion mechanism 340 ... Holding head 350 ... Clamp operation head 360 ... Preciser 362 ... Shaft 380 ... Adjustment mechanism 390 ... Frames 392a to 392g... 1st to 7th step portion 400... Unloader portion 410.
442 ... Abutting portion 700 ... Test tray 800 ... Customer tray

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 3 is an electronic diagram according to the embodiment of the present invention. It is a conceptual diagram which shows the handling of the tray in a components test apparatus.

  FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment, and actually shows the members arranged in the vertical direction in plan view. There is also a part. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

The electronic component test apparatus according to the embodiment of the present invention tests (inspects) whether or not the IC device operates properly in a state where high temperature or low temperature stress is applied to the IC device, and based on the test result. It is an apparatus for classifying IC devices, and comprises a handler 1, a test head 5, and a tester 6. The test of the IC device by the electronic component test apparatus is performed from the customer tray 800 (see FIG. 5) on which many IC devices to be tested are mounted to the test tray 700 (see FIG. 15) conveyed into the handler 1. It is carried out by changing the device. The IC device is indicated by the symbol IC in the drawing.

  As shown in FIGS. 1 to 3, the handler 1 in the present embodiment stores an IC device to be tested from now on, a storage unit 200 that classifies and stores tested IC devices, and a transmission from the storage unit 200. A loader unit 300 that feeds IC devices to the chamber unit 100, a chamber unit 100 including the test head 5, and an unloader unit 400 that classifies and extracts tested IC devices that have been tested in the chamber unit 100. Has been.

  The socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. The IC device is tested by the test signal from the tester 6. As shown in FIG. 1, a space is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in this space, and through a through hole formed in the apparatus base of the handler 1, It is possible to make electrical contact between the IC device and the socket 50 on the test head 5. When changing the type of IC device, the test device is replaced with another test head having a socket suitable for the shape and number of pins of the IC device of that type.

  Below, each part of the handler 1 is demonstrated.

<Storage unit 200>
4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention. .

  The storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to test results.

  As shown in FIG. 4, these stockers 201 and 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the bottom of the tray support frame 203 and moves up and down. A plurality of customer trays 800 are stacked on the tray support frame 203, and only the stacked customer trays 800 are moved up and down by the elevator 204. In the customer tray 800 according to the present embodiment, as shown in FIG. 5, storage units 801 for storing IC devices are arranged in 14 rows × 13 columns.

  In the present embodiment, as shown in the figure, a buffer material 206 is interposed between the elevator 204 and the customer tray 800 supported by the elevator 204. Examples of the material constituting the buffer material 206 include a sponge made of rubber, a synthetic resin material, or the like.

By interposing the buffer material 206 between the customer tray 800 and the elevator 204, it is possible to suppress the vibration generated when the elevator 204 moves up and down from being transmitted to the customer tray 800.

The stockers 201 and 202 in this embodiment correspond to an example of storage means in the claims, the elevator 204 in this embodiment corresponds to an example of lifting means in the claims, and the cushioning material 206 in this embodiment. This corresponds to an example of the buffer means in the claims.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the lower diagrams of the pre-test IC stocker 201 and the tested IC stocker 202 can be appropriately set as necessary. .

  In this embodiment, as shown in FIG. 2 and FIG. 3, two stockers STK-B are provided in the pre-test IC stocker 201, and two empty tray stockers STK-E are provided next to them. In each empty tray stocker STK-E, empty customer trays KST sent to the unloader unit 400 are stacked.

  Next to the empty tray stocker STK-E, eight stockers STK-1, STK-2,..., STK-8 are provided in the tested IC stocker 202, and a maximum of eight stockers are provided depending on the test results. It is configured so that it can be classified and stored. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.

<Loader unit 300>
6 is a side view showing a holding head of a device transport apparatus provided in a loader section of an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 7 is a suction nozzle provided at the tip of the holding head shown in FIG. FIG. 8 is a view showing a pitch conversion mechanism of the device transport apparatus provided in the loader unit of the electronic component testing apparatus according to the embodiment of the present invention.

The customer tray 800 described above is carried from the storage unit 200 to the lifting table 207 (see FIG. 10B) by the tray transfer arm 205 provided between the storage unit 200 and the apparatus base 101. The lifting table 207 is provided below the two window portions 370 of the loader unit 300, and can move along the Z-axis direction while supporting the customer tray 800. The customer tray 800 is carried from the lower side of the apparatus base 101 to the window unit 307 by the lifting table 207. In the loader unit 300, the device transporter 310 temporarily transfers the IC devices loaded on the customer tray 800 to a precursor 360, where the mutual positional relationship of the IC devices is corrected. After that, the device transport device 310 reloads the IC device held in the precursor 360 on the test tray 700 stopped at the loader unit 300.

The loader unit 300 includes a device transfer device 310 that transfers an IC device from the customer tray KST to the test tray TST. As shown in FIG. 2, the device transport device 310 reciprocally moves between the two rails 311 installed on the device base 101 and between the customer tray 800 and the test tray 700 by the two rails 311 ( This direction is defined as a Y direction.) And a movable head 320 supported by the movable arm 312 and movable in the X-axis direction along the movable arm 312.

  As shown in FIG. 6, a holding head 340 having a suction nozzle 41 at the tip is attached to the movable head 320 of the device transport apparatus 310. In addition, a stopper 344 for contacting a shaft 363 provided on a preciseer 360 (to be described later) and a protrusion 721 provided on a test tray 700 is provided beside the suction nozzle 341. The holding head 340 is movable in the Z-axis direction (vertical direction) by the linear guide 322 and the air cylinder 321.

In addition, when the IC device is released to the insert 710 (described later) of the test tray 700, a clamp operation head 350 for opening and closing a clamp mechanism 750 for fixing the IC device is provided separately from the holding head 340. Yes. The clamp operation head 350 can move in the Z-axis direction (vertical direction) independently of the holding head 340.

  As shown in FIG. 7, the suction nozzle 341 according to the present embodiment has a flat front end surface 342 that can be in close contact with the upper surface of the IC device, and opens to the front end surface 342 and communicates with a suction source (not shown). And a suction pad 343, which is made of a synthetic resin material or the like and does not have a flexible pad.

  When the suction nozzle 341 sucks and holds the IC device, the IC device can be held at an accurate position without inducing a positional shift by contacting the upper surface of the IC device with the flat tip surface 342.

  Further, when the IC device is held through the pad, the IC device may remain attached to the pad even if the suction is stopped. In the present invention, instead of the pad, a rigid and flat tip surface is provided. By contacting the IC device at 342, the IC device can be easily removed after the suction is stopped.

Further, eight sets of component holding units including the holding head 340 having the suction nozzle 341, the linear guide 322, and the air cylinder 321 are provided in the X direction shown in FIG. Then, the pitch in the X direction of the eight sets of component holding units can be changed by the pitch conversion mechanism 330 shown in FIG.

The pitch conversion mechanism 330 includes a link mechanism 331 to which each component holding unit is attached, an air cylinder 334 that moves both ends 332 and 333 of the link mechanism 331 along the X-axis direction, and a center of the link mechanism 331. And a linear guide 335 which is connected to the link located and operates along only the Y-axis direction. When the air cylinder 334 is operated, both ends 332 and 333 of the link mechanism 331 are opened and closed along the X-axis direction. At this time, the center ring of the link mechanism 331 is moved along the Y-axis direction only by the linear guide 335. Since it operates, the error of the pitch of the component holding unit can be kept small.

9 is a plan view showing the periphery of the window portion of the loader portion in the embodiment of the present invention, FIG. 10A is a plan view of the adjustment mechanism in the embodiment of the present invention, an enlarged view of the XA portion in FIG. 9, and FIG. It is sectional drawing which shows the adjustment mechanism in embodiment of invention, The figure along the XB-XB line | wire in FIG. 10A, FIG. 10C is sectional drawing along the XC-XC line | wire of FIG. 10A, FIG. 2 is a schematic cross-sectional view showing a state in which an IC device is sucked and held from a customer tray in FIG.

In the present embodiment, as shown in FIG. 9, a frame-like frame 390 surrounding the periphery of the window 390 is provided around each window 390 formed on the device base 101. Further, the window 390 is provided with an adjusting mechanism 380 for adjusting the relative height of the customer tray 800 with respect to the device transport apparatus 310.

As shown in FIGS. 10A and 10B, the adjustment mechanism 380 includes a bolt 383, a dial 381 that can support the head 384 of the bolt 383, a nut 384 that can be screwed into the male screw portion 385 of the bolt 383, and a frame The through-hole 391 formed in 390 and the first to seventh step portions 392a to 392g formed in the upper portion of the through-hole 391 are configured. The dial 381 has two protrusions 382 that protrude so as to face each other in the radial direction.

  As illustrated in FIG. 10C, the step portions 392 a to 392 g are formed in a step shape so as to surround the upper portion of the through hole 371. The difference in depth between the adjacent stepped portions 392a to 392g is, for example, about 0.15 mm.

  In the present embodiment, the bolts 383 are mounted with the protrusions 382 of the dial 381 aligned with the step portions 392a to 392g (second step portion 392b in the example shown in FIGS. 10A and 10B) suitable for the type of IC device. The nut 386 is inserted into the through hole 391 and screwed into the male screw portion 385. At this time, a bolt 383 protrudes below the nut 386 by a predetermined amount according to the step portions 392a to 392g. Therefore, the height of the frame 390 can be arbitrarily changed depending on which step 392a to 392g the projection 382 of the dial 381 is matched with. The frame 390 is fixed to the device base 101 with a bolt or the like (not shown).

  As shown in FIG. 10B, the customer tray 800 raised by the lifting table 207 contacts the inner periphery of the frame 390, whereby the relative height of the customer tray 800 with respect to the apparatus base 101 is determined. Therefore, for example, when the projection 382 of the dial 381 is set on the second step 392b as in the example shown in FIGS. 10A and 10B, compared to the case where the dial 381 is set on the first step 392a, The height of the customer tray 800 located in the window portion 370 is relatively high, and the customer tray located in the window portion 370 is compared with the case where the dial 381 is set on the third to seventh step portions 392c to 392g. The height of 800 is relatively low.

In this state, when the holding head 340 of the device transport apparatus 310 approaches the IC device, when the holding head 340 is lowered to the lowest point, as shown in FIG. 11A, the tip of the suction nozzle 341 and the upper surface of the IC device predetermined distance C ₁ is formed between. Then, the suction nozzle 341 starts suction from this state, and draws and holds the IC device by suction as shown in FIG. 11B. As a result, the impact generated when the holding head 340 and the IC device come into contact with each other is not transmitted to the customer tray 800. Therefore, even when handling an extremely small size IC device, the impact caused when holding the IC device causes the customer to It is possible to prevent other IC devices from jumping out of the tray.

  When all the IC devices loaded on the customer tray 800 are transferred to the test tray 700 located in the loader unit 300, the lifting table 207 descends the empty customer tray 800, and this empty tray Is transferred to the tray transfer arm 205.

12A to 12C are schematic cross-sectional views showing how the holding head shown in FIG. 6 holds the IC device from the precursor.

  The IC devices held on the holding head 340 of the device transport apparatus 310 by the customer tray 800 are once transferred to the precursor 360 in order to correct the mutual positional relationship of the IC devices.

As shown in FIG. 12A, the precursor 360 has a comparatively deep concave portion 361, and the peripheral edge of the concave portion 361 is surrounded by an inclined surface. Therefore, before the IC device to be transferred from the customer tray 800 to the test tray 700 is placed on the test tray 700, the IC device is once dropped into the precursor 360 so that the mutual positional relationship of the eight IC devices is accurately determined. Each IC device can be accurately transferred to the test tray TST.

Further, in the present embodiment, as shown in the figure, shafts 362 projecting upward are provided around the respective recesses 361 of the precursor 360. For this reason, when the device transport apparatus 310 approaches the IC device accommodated in the concave portion 361 of the precursor 360 (see FIG. 12A), the stopper 344 of the holding head 340 comes into contact with the shaft 362, and the tip of the suction nozzle 341 and the IC device access to precisor 360 holding head 340 in a state where a predetermined gap C ₂ is formed between the upper surface is limited (see FIG. 12B), the suction nozzle 341 starts sucking from this state, attract IC device Adsorb and hold (see FIG. 12C).

The shaft 362 is detachably attached to the precursor 360 by a method such as screwing. Therefore, in this embodiment, by selecting the shaft 362 suitable for the type of IC device, when the holding head 340 is lowered to the lowest point, a predetermined interval is provided between the tip of the suction nozzle 341 and the upper surface of the IC device. C ₂ can be formed. Thus, the IC device can be accommodated in the recess 361 in a state where the holding head 340 and the IC device are not in contact with each other and the distance between them is minimal. Therefore, even when handling an extremely small size IC device, it is possible to suppress the occurrence of positional deviation of the IC device such that the IC device is tilted and accommodated.

FIG. 13 is a schematic plan view showing a pitch conversion method in the loader unit of the electronic component test apparatus according to the embodiment of the present invention, and FIG. 14A is a conversion of the pitch conversion mechanism in the loader unit of the electronic component test apparatus according to the embodiment of the present invention. FIG. 14B is a schematic side view showing a conventional pitch conversion operation in the loader unit.

As shown in FIG. 13, the pitch P ₁ (for example, 10.8 mm) between the IC devices accommodated in the customer tray 800 is different from the pitch P ₂ (for example, 25 mm) between the IC devices accommodated in the test tray 700. When the IC device is moved from the customer tray 800 to the precursor 360 by the device transport device 310, the pitch between the holding heads 340 holding the IC device is converted by the pitch conversion mechanism 330 described above.

Usually, as indicated by the broken line arrows and 14B in FIG. 13, when holding the IC device from the customer tray 800, the pitch between the holding head 340, matched to the pitch _{P 1} of the customer tray 800, a customer tray 800 while moving the preciser 360 from widening the pitch between the holding head 340 by the pitch changing mechanism 330 to fit the pitch _{P 2} of the test tray 700.

On the other hand, in the present embodiment, as shown in the solid arrow in FIG. 13 and FIG. 14A, when holding the IC device from the customer tray 800, the pitch between the holding heads 340 is set to the pitch P ₁ on the customer tray 800. 2 times (21.6 mm in this example), every other IC device is held from the accommodating portion 801 of the customer tray 800, and the holding head is held by the pitch conversion mechanism 330 while moving from the customer tray 800 to the precursor 360. widen the pitch of between 340 to _{P 2.}
As described above, in this embodiment, when the IC device is transferred from the customer tray 800 to the precursor 360, the pitch between the holding heads 340 is P ₁ × 2 (an integral multiple of the pitch P ₁ on the customer tray 800). from the closest pitch) to the pitch _{P 2} of the test tray 700 Te, pitch conversion to the pitch _{P 2} of the test tray 700. Thereby, since the amount of pitch conversion decreases compared with the conventional case, the cumulative error of the link mechanism that occurs at the time of pitch conversion can be kept small. When handling an extremely small size IC device, it is effective because an accumulation error caused by pitch conversion may induce a suction / placement error of the holding head 340.

  FIG. 15 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 16 is an exploded perspective view showing an insert used in the electronic component testing apparatus according to the embodiment of the present invention. 17A to 17C are partial cross-sectional views for explaining the procedure for mounting the guide core to the insert body by the hook mechanism in the embodiment of the present invention, and FIGS. 18A and 18B illustrate the operation of the clamp mechanism in the embodiment of the present invention. It is sectional drawing of the insert for doing.

  The IC devices whose mutual positional relationship has been corrected by the precursor 360 are held again by the device transport device 310 and transferred to the test tray 700 located in the loader unit 300.

  As shown in FIG. 15, the test tray 700 includes a rectangular frame 701 with parallel bars 702 provided at equal intervals. A plurality of test trays 700 are provided on both sides of the bars 702 and on a side 701 a of the frame 701 facing the bars 702. Mounting pieces 703 are formed to protrude at equal intervals. An insert accommodating portion 704 is configured by the space between these bars 702 or between the bars 702 and the side 701a and the two attachment pieces 703.

  Each insert accommodating portion 704 accommodates one insert 710, and this insert 710 is attached to the attachment piece 703 in a floating state using a fastener 705. Therefore, attachment holes 706 for attaching the insert 710 to the attachment piece 703 are formed at both ends of the insert 710. As shown in FIG. 15, 64 of these inserts 710 are attached to one test tray 700 and arranged in 4 rows and 16 columns.

  Each insert 710 has the same shape and the same size, and an IC device is accommodated in each insert 710. The device accommodating portion 761 of the insert 710 is determined according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG.

  As shown in FIG. 16, the insert 710 in the present embodiment includes an insert main body 720, a guide core 760, and a lever plate 770.

  As shown in FIG. 16, the insert main body 720 includes a main body portion 730, a hook mechanism 740, and a clamp mechanism 750.

An opening 731 having a size through which a suction nozzle 441 of a device transporting device 410 provided in an unloader unit 400 (to be described later) can pass is formed through substantially the center of the main body 730 of the insert main body 720. Has been.

A lever plate 770 is attached to the upper side of the insert main body 730 via a spring 771 as shown in FIG. The lever plate 770 is biased upward by a spring 771 and moves downward when a downward pressing force is received, and moves upward by the biasing force of the spring 771 when the pressing force is released. ing.

In the approximate center of the lever plate 770, an opening 772 having a size through which the suction nozzle 441 of the device transport apparatus 410 provided in the unloader unit 400 described later can pass is formed.

As shown in FIG. 16, a guide core 760 is attached to the lower side of the body portion 730 of the insert body 720. The guide core 760 includes a device housing portion 761 configured from a bottom surface and a side surface standing from the bottom surface, and a flange portion 763 provided at an upper peripheral edge of the side surface of the device housing portion 761. . An opening 762 is provided substantially at the center of the device housing portion 761, and the device housing portion 761 can support the lower surface of the IC device by the peripheral edge 764 of the opening 762. The input / output terminals of the IC device accommodated in the device accommodating portion 761 are exposed toward the socket 50 through the opening 762. The inner peripheral surface of the flange portion 763 is tapered so that the IC device can be reliably guided to the device housing portion 761.

Two hook entry holes 765 are formed in the flange portion 763 at positions facing each other. The hook entry hole 765 is provided with a hook receiving portion 766 (see FIGS. 17A to 17C) so as to be continuous with the inner surface of the hook entry hole 765, and the hook 741 that has entered the hook entry hole 765 is connected to the hook receiving hole 765. It can be engaged with the portion 766.

  The main body portion 730 of the insert main body 720 is formed with hook accommodating portions 732 penetrating along the vertical direction on both sides of the opening 731. A hook mechanism 740 including a hook 741, a spring 742, and a shaft 743 is accommodated in the hook accommodating portion 732.

  In the insert 710 in the present embodiment, the hook core 760 is provided, so that the guide core 760 can be attached to and detached from the insert main body 720 by the following procedure. Therefore, when changing the type of the IC device to be tested, it is possible to handle the type change by simply changing to the guide core 760 suitable for the type.

  That is, as shown in FIGS. 17A to 17C, the hook portion 741a of the hook 741 is urged outward by the elastic force of the spring 742 in the no-load state (see FIG. 17A). With the shaft 901 inserted into the hook accommodating portion 732 and the hook 741 pressed against the inside, the guide core 760 is approached from below toward the insert body (see FIG. 17B), and the hook entry hole 765 of the guide core 760 is obtained. After inserting the hook portion 741a into the guide body 760, the shaft 901 of the jig 900 is extracted from the hook housing portion 732, and the hook portion 741a is engaged with the hook receiving portion 766 of the guide core 760, whereby the insert core 720 is engaged with the guide core 760. Is mounted (see FIG. 17C).

  As shown in FIG. 16, the body portion 730 of the insert body 720 is provided with a clamp mechanism 750 including a clamp 751, a spring 752, and a shaft 753.

  The clamp 751 includes an action part 751a, a clamp part 751b, and an arm part 751c that connects the action part 751a and the clamp part 751b.

  The arm part 751c is composed of a second arm 751e and two first arms 751d provided opposite to both ends of the second arm part 751e. When the second arm 751 e is accommodated in the opening 731 along the inner side surface in the longitudinal direction of the opening 731, the first arm 751 d is moved along the inner side surface in the short direction of the opening 731. It is accommodated in the opening 731.

  An action portion 751a is provided at the edge portion of the two opposing first arms 751d so as to extend in the direction opposite to the extending direction of the second arm 751e. In addition, two opposing first arms 751d are formed with through holes 751f into which the shafts 753 are fitted. Furthermore, a clamp portion 751b that protrudes inward and downward is provided at the approximate center of the second arm 751e.

  One end portion of the shaft 753 is fitted in each through hole 751 f of the first arm 751 d, and the other end portion of the shaft 753 is supported by the shaft support portion 733 of the main body portion 730 of the insert main body 720. Thereby, the clamp part 751b is supported so that the main-body part 730 can rotate. Two clamp mechanisms 750 supported in this manner are provided on the main body 730 of the insert main body 720 so as to face each other as shown in FIG.

  When the IC device is accommodated in the insert 710 having the above-described configuration, the clamp portion 751b (see FIG. 18A) in the closed position is moved to the open position in the following order (see FIG. 18B).

When the lever plate 770 moves downward, the lever plate 770 contacts the action part 751a and presses the action part 751a downward. The action portion 751a that has received the downward pressing force from the lever plate 770 rotates and moves downward. The first arm 751d is rotated by the rotational movement of the action part 751a, and the second arm 751e is rotated and moved in the opposite direction (upward) to the action part 751a by the rotation of the first arm 751d. As the second arm 751e rotates, the clamp portion 751b also moves upward. At this time, the distal end portion of the clamp portion 751 b moves outward from the approximate center of the opening portion 731 of the main body portion 730.

A spring 752 is provided in the opening 731 of the main body 730, and the spring 752 biases the action portion 751a upward. Therefore, when the lever plate 770 moves upward and the downward pressing force received by the action portion 751a by the lever plate 770 is released, the action portion 751a is pushed upward by the spring 752 and rotates. By this operation, the clamp part 751b is rotationally moved from the open position to the closed position.

19A to 19C are schematic cross-sectional views for explaining a state in which the IC device is placed on the test tray in the embodiment of the present invention, and FIGS. 20A to 20D are views for placing the IC device on the test tray in the embodiment of the present invention. It is a schematic sectional drawing for demonstrating the removal procedure of the holding | maintenance head set | placed.

In the present embodiment, as shown in FIGS. 19A to 19C, the stopper 344 of the holding head 340 is formed on the upper surface of the insert main body 720 immediately before the IC device is placed on the test tray 700. It comes to contact with.

In the present embodiment, the stopper 344 is detachable from the holding head 340, and when the IC device type to be tested is changed, the stopper 344 is replaced with another stopper 344 having the optimum length for the IC device type. The Therefore, in this embodiment, by selecting a stopper 344 suitable for the type of IC device, when the holding head 340 is lowered to the lowest point, a predetermined distance is provided between the bottom surface of the insert 710 and the IC device. C ₃ it is possible to form. Accordingly, the IC device can be accommodated in the insert 710 in a state where the holding head 340 and the IC device are not in contact with each other and the distance between them is minimal. Therefore, even when handling an IC device of a very small size, it is possible to prevent the IC device from being displaced such that the IC device is tilted and accommodated.

  Although not particularly shown in FIGS. 19A to 19C, before the holding head 340 inserts the IC device into the opening 731 of the insert main body 720, the clamp operation head 350 is lowered as shown in FIG. 20A. Then, the lever plate 770 is pressed, and the clamp mechanism 750 is opened.

  In this embodiment, after the suction of the suction nozzle 341 is released and the IC device is placed on the test tray 700 (see FIG. 20B), the clamp operation head 350 is raised before the holding head 340, The clamp mechanism 750 is closed, and the IC device is fixed to the device support portion 762 of the guide core 760 (see FIG. 20C). Next, the holding head 340 moves up and separates from the test tray 700 (see FIG. 20D).

  Thus, when the holding head 340 is detached from the test tray 700 by raising the clamp operation head 350 earlier than the holding head 340 and closing the clamp mechanism 750 before the holding head 340 is raised, It is possible to prevent the extremely small IC device that should have been released from lifting with the holding head 340.

<Chamber part 100>
FIG. 21 is an exploded perspective view around the socket of the test head in the embodiment of the present invention, and FIG. 22 is a sectional view around the socket of the test head in the embodiment of the present invention.

  The above-described test tray 700 is loaded with the IC device by the loader unit 300 and then sent to the chamber unit 100, and the test of each IC device is executed with the IC device mounted on the test tray 700.

  The chamber unit 100 tests the IC device loaded in the test tray 700 with a target high temperature or low temperature stress soak chamber 110 and the IC device in a state in which thermal stress is applied in the soak chamber 110. The test chamber 120 is brought into contact with the head 5, and the unsoak chamber 130 is used to remove thermal stress from the IC device tested in the test chamber 120.

  The unsoak chamber 130 is preferably thermally insulated from the soak chamber 110 and the test chamber 120. Actually, a predetermined thermal stress is applied to the region between the soak chamber 110 and the test chamber 120, and the unsoak chamber is Although 130 is thermally insulated from these, these are collectively referred to as the chamber portion 100 for convenience.

  As shown in FIG. 2, the soak chamber 110 is disposed so as to protrude above the test chamber 120. As conceptually shown in FIG. 3, a vertical transfer device is provided inside the soak chamber 110, and a plurality of test trays 700 are attached to the vertical transfer device until the test chamber 120 is empty. Wait while being supported. Mainly, high-temperature or low-temperature heat stress is applied to the IC device during this standby.

  A test head 5 is disposed at the center of the test chamber 120. As shown in FIGS. 21 and 22, a socket 50 having a large number of contact pins 51 is arranged on the top of the test head 5 in the same arrangement as the insert 710 of the test tray 700. On the other hand, in the test chamber 120, as shown in the figure, a plurality of pushers 121 for pressing the IC device toward the socket 50 at the time of testing are respectively opposed to the sockets 50 on the test head 5. Is provided. Further, a socket guide 55 is provided on each socket 50 so that each insert 710 pressed by the pusher 121 is accurately positioned with respect to the socket 50.

  When the test tray 700 is carried from the soak chamber 110 into the test chamber 120, the test tray 700 is transferred onto the test head 5, and then each pusher 121 presses the IC device toward the socket 50. The IC device is tested by electrically contacting the input / output terminals of the I / O terminals with the contact pins 51 of the socket 50.

  The test result is stored at an address determined by, for example, an identification number assigned to the test tray 700 and an IC device number assigned inside the test tray 700.

  As in the soak chamber 110, the unsoak chamber 130 is also arranged so as to protrude above the test chamber 120 as shown in FIG. 2, and a vertical transfer device is provided as conceptually shown in FIG. Yes. In the unsoak chamber 130, when a high temperature is applied in the soak chamber 110, the IC device is cooled by air blowing and returned to room temperature. On the other hand, when a low temperature is applied in the soak chamber 110, the IC device is heated with warm air, a heater, or the like to return to a temperature at which dew condensation does not occur, and then the heat-removed IC device is removed from the unloader 400 To be taken out.

  In the upper part of the soak chamber 110, an inlet for carrying the test tray 700 from the apparatus base 101 is formed. Similarly, an outlet for carrying out the test tray 700 to the apparatus base 101 is also formed in the upper part of the unsoak chamber 130. The apparatus base 101 is provided with a tray transport apparatus 102 for taking the test tray 700 out and in from the chamber section 110 through these inlets and outlets. The tray transport device 102 is constituted by, for example, a rotary loader. The test tray 700 carried out of the unsoak chamber 130 by this tray transport device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.

<Unloader unit 400>
FIG. 23 is a side view showing the holding head of the device transport apparatus provided in the unloader section of the electronic component testing apparatus according to the embodiment of the present invention, and FIGS. 24A to 24C are views showing the holding head shown in FIG. It is sectional drawing which shows a mode that a device is hold | maintained.

  When the test tray 700 containing the tested IC device is carried out from the unsoak chamber 130 to the unloader unit 400, the two device transfer apparatuses 410 transfer the IC device from the test tray 700 to the customer tray 800 corresponding to the test result. Transship.

  As shown in FIG. 2, the device transport apparatus 410 provided in the unloader unit 400 includes two rails 411 installed on the apparatus base 101, like the device transport apparatus 310 provided in the loader unit 300. A movable arm 412 that can reciprocate between the test tray 700 and the customer tray 800 by two rails 411, and is supported by the movable arm 412, and can move along the movable arm 412 in the X-axis direction. And a movable head 420.

  As shown in FIG. 23, a holding head 440 having a suction nozzle 441 at the tip is attached to the movable head 420 of the device transport apparatus 410, and this holding head 440 is Z-shaped by a linear guide 422 and an air cylinder 421. It can move in the axial direction (vertical direction).

  In addition, when the IC device mounted on the insert 710 of the test tray 700 is sucked by the suction nozzle 441, a clamp operation head 450 for opening and closing the clamp mechanism 750 to release the IC device is referred to as the holding head 440. It is provided separately. The clamp operation head 350 can move in the Z-axis direction (vertical direction) independently of the holding head 440.

  The suction nozzle 441 in the present embodiment is not particularly illustrated, but, like the suction nozzle 341 of the device transport apparatus 310 provided in the loader unit 300, a flat tip surface that can be in close contact with the upper surface of the IC device, and the tip surface And a suction port communicating with a suction source, and is not provided with a flexible pad made of a synthetic resin material or the like.

  When the suction nozzle 441 sucks and holds the IC device, the IC device can be held at an accurate position without inducing a positional shift by contacting the upper surface of the IC device with a flat tip surface.

  In addition, when the IC device is held through the pad, the IC device may remain attached to the pad even when the suction is stopped. However, in the present invention, a rigid and flat tip surface is used instead of the pad. Since the IC device is contacted, the IC device can be easily detached after the suction is stopped.

  Further, as shown in FIG. 23, the suction nozzle 411 in the present embodiment includes a contact portion 744 that can contact the upper surface of the guide core 760 of the insert 700. The contact portion 441 protrudes along the radial direction from a position away from the tip surface 442 of the suction nozzle 441 by a predetermined distance.

When the device transport apparatus 410 holds the IC device accommodated in the test tray 700, the holding head 440 approaches the insert 710, and the contact portion 444 is on the upper surface of the guide core 760 as shown in FIG. 24A. When the contact is made, the lowering of the holding head 440 is restricted in a state where the predetermined distance C ₄ is formed between the upper surface of the IC device and the tip surface 442 of the suction nozzle 441. In this state, suction by the suction nozzle 441 is started, and the IC device is attracted and held as shown in FIG. 24B. As a result, the impact generated when the holding head 440 and the IC device come into contact with each other is not transmitted to the test tray 700. Therefore, even when handling an extremely small IC device, the test is performed by the impact when holding the IC device. It is possible to prevent other IC devices from jumping out of the tray 700. When the suction nozzle 441 sucks and holds the IC device, the holding head 440 is detached from the test tray 700 as shown in FIG. 24C.

  Eight sets of component holding units including the holding head 440 having the suction nozzle 441, the linear guide 422, and the air cylinder 421 are provided in the X direction shown in FIG. Then, the pitch in the X direction of the eight sets of component holding units can be changed by the pitch conversion mechanism having the same configuration as the pitch conversion mechanism 330 (see FIG. 10) provided in the loader unit 300.

FIG. 25 is a schematic plan view showing a pitch conversion method in the unloader unit of the electronic component test apparatus according to the embodiment of the present invention, and FIG. 26A is a conversion of the pitch conversion mechanism in the unloader unit of the electronic component test apparatus according to the embodiment of the present invention. FIG. 26B is a schematic side view showing a conventional pitch conversion operation in the unloader section.

As shown in FIG. 25, the pitch P ₂ (for example, 25 mm) between the IC devices accommodated in the test tray 700 and the pitch P ₁ (for example, 10.8 mm) between the IC devices accommodated in the customer tray 800 are different. When the IC device is moved from the test tray 700 to the customer tray 800 by the device transport device 410, the pitch conversion mechanism (not shown) provided in the device transport device 410 is used to hold the IC devices between the holding heads 340. Change the pitch.

Normally, as indicated by the broken line arrows and 26B in FIG. 25, when holding the IC device from the test tray 700, the pitch between the holding head 340, matched to the pitch _{P 2} of the test tray 700, from the test tray 700 while moving to the customer tray 800, to match the pitch P ₁ of the customer tray 800, reducing the pitch between the holding head 340 by the pitch changing mechanism.

On the other hand, in the present embodiment, as shown in the solid arrow in FIG. 25 and FIG. 26A, when holding the IC device from the test tray 700, the pitch between the holding heads 340 is set to the pitch P ₂ on the test tray 700. The IC device is held at the same time. Then, while moving from the test tray 700 to the customer tray 800, the pitch between IC devices by the pitch changing mechanism, as 2 times the pitch _{P 1} of the customer tray 800 (21.6 mm in this example), customer tray 800 Every other IC device is placed in the housing portion 801.

Thus, in this embodiment, when transferring the IC device from the test tray 700 to the customer tray 800, the pitch between the holding head 340, _{P 1} × 2 from the pitch _{P 2} of the test tray 700 (customer tray 800 The pitch is converted to a pitch that is twice the upper pitch P ₁ and closest to the pitch P ₂ on the test tray 700. Thereby, since the amount of pitch conversion decreases compared with the conventional case, the cumulative error of the link mechanism that occurs at the time of pitch conversion can be kept small. When handling an extremely small IC device, it is effective because an accumulation error caused by pitch conversion may induce a suction / placement error of the holding head 440.

  FIGS. 27A to 27E are schematic cross-sectional views for explaining a procedure for detaching the holding head that holds the IC device from the test tray in the embodiment of the present invention. FIG. 27A shows a state in which the clamping operation head opens the clamping mechanism. 27B is a view showing a state in which the holding head has entered the insert, FIG. 27C is a view showing a state in which one holding head holds the IC device, and FIG. 27D is a state in which the clamp operation head is closing the clamp mechanism. FIG. 27E is a diagram showing a state in which the holding head is detached from the insert.

  When holding the IC device from the test tray 700 containing the tested IC device, as shown in FIG. 27A, first, the clamp operation head 450 is lowered and the clamp mechanism 750 provided in each insert 710 is opened. Then, the IC device is released from the device support portion 762 of the guide 760, and then all the holding heads 440 are lowered and approach the device IC (see FIG. 27B).

  Next, as shown in FIG. 27C, at least one of the plurality of holding heads 440 (the holding head 440 located at the leftmost in the example shown in the figure) starts suction and holds the IC device by suction. The IC device to be held in this step is an IC device that is sorted into the customer tray 800 corresponding to the test result based on the test result, and two or more holding heads 440 are simultaneously connected to the IC device according to the test result. May be held.

  Next, as shown in FIG. 27D, the holding head 440 that does not hold the IC device remains as it is, and only the holding head 440 that holds the IC device by suction is lifted and detached from the test tray 700, and then the clamping operation is performed. The head 450 is raised, the clamp mechanism 750 of each insert 710 is closed, and the IC device remaining on the test tray 700 is fixed to the device support portion 762 of the guide core 760. Next, the holding head 440 is raised while being lowered to the insert 710 and is detached from the test tray 700.

  In this way, by raising only the holding head 440 holding the IC device first and keeping the other holding head 440 lowered during that time, the IC device that is not the holding target at the time of sucking and holding is affected. It is possible to suppress displacement due to vibration or the like.

  As shown in FIG. 2, two sets of a pair of window portions 470 are formed on the device base 101 in the unloader unit 400 so that the customer tray 800 carried into the unloader unit 400 faces the upper surface of the device base 101. ing.

  Although not shown in the drawings, an elevating table for elevating and lowering the customer tray 800 is provided below each window portion 470. Here, a fully loaded IC device has been loaded. The customer tray 800 is placed and lowered, and the full tray is transferred to the tray transfer arm 205.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the precursor 370 provided in the loader unit 300 may be provided in the unloader unit 400. As a result, the positional relationship between the IC devices is corrected. Therefore, the IC device can be placed after being positioned on the customer tray 800 located in the unloader unit 400 with high accuracy. Even if it exists, a mounting mistake can be prevented.

  In addition, when the unloader unit 400 is provided with a precursor, a shaft is provided around the concave portion of the precursor (see FIGS. 12A to 12C), and when it is lowered to the lowest point of the holding head, the suction nozzle and the IC device A predetermined interval may be formed between the two.

Claims (21)

An electronic component test apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head,
A component transporting means for transferring the electronic device under test from the first container located at the first position to the second container located at the second position;
The component conveying means has a holding head that holds the electronic component to be tested.
The holding head pulls the electronic device under test accommodated in the first container from a non-contact state to hold the electronic device under test. The holding head has suction means for sucking and holding the electronic device under test,
The suction unit draws and draws the electronic device under test in a non-contact state when the holding head holds the electronic device under test housed in the first container. Electronic component testing equipment. The first container is a customer tray that houses the electronic device under test before testing,
The first position is a window formed in a device base of the electronic component testing device,
The electronic component testing apparatus according to claim 1, wherein the electronic component testing apparatus includes an adjusting unit capable of adjusting a height of the customer tray located in the window portion. The first container is a customer tray that houses the electronic device under test before testing,
The first position is a window formed in a device base of the electronic component testing device,
The electronic component testing apparatus is
Storage means for loading the customer tray loaded with the electronic device under test before testing,
Tray moving means for moving the customer tray stored in the storage means to the window,
The storage means includes
Elevating means for supporting the customer tray so as to be movable up and down;
The electronic component testing apparatus according to claim 1, further comprising a buffer unit provided between the customer tray and the elevating unit. The second container is a precursor for accommodating the electronic device under test before testing and correcting the mutual positional relationship between the electronic devices under test,
3. The electronic component testing apparatus according to claim 1, further comprising a first limiting unit that limits the approach of the holding head to the precursor. 4. The precursor has a recess for accommodating the electronic device under test,
6. The electronic component testing apparatus according to claim 5, wherein the first restricting means is a shaft that is provided around the recess and is in contact with the holding head of the component conveying means. The electronic part testing apparatus according to claim 6, wherein the shaft can be replaced with another shaft having a different length in accordance with the exchange of the type of the electronic part under test. The second container is a test tray that houses the electronic device under test before testing,
3. The electronic component testing apparatus according to claim 1, further comprising a second limiting unit configured to limit the approach of the holding head to the test tray. The second restricting means is a stopper provided on the holding head of the component conveying means and contacting the test tray,
9. The electronic component testing apparatus according to claim 8, wherein the stopper can be replaced with another stopper having a different length in accordance with replacement of the type of the electronic device under test. The first container is a test tray that houses the tested electronic components that have been tested,
3. The electronic component testing apparatus according to claim 1, further comprising a third limiting unit that limits the approach of the holding head to the test tray.   The electronic component testing apparatus according to claim 10, wherein the third limiting means is a contact portion that is provided on the holding head and contacts the upper surface of the test tray. The first container is a test tray that houses the tested electronic components that have been tested,
3. The electronic component testing apparatus according to claim 1, wherein the second container is a precursor that houses the tested electronic component to be tested and corrects the positional relationship between the electronic devices to be tested.   The electronic component testing apparatus according to claim 12, further comprising a fourth limiting unit that limits the approach of the holding head to the precursor. The precursor has a recess for accommodating the electronic device under test,
The fourth limiting means is a shaft that is provided around the concave portion and abuts on the holding head of the component conveying means,
13. The electronic component testing apparatus according to claim 12, wherein the shaft can be replaced with another shaft having a different length in accordance with the exchange of the type of the electronic device under test. The holding head is
A flat tip surface closely contacting the upper surface of the electronic device under test;
The electronic component testing apparatus according to claim 2, further comprising a suction nozzle having a suction port that is open to the distal end surface. The component conveying means includes
A plurality of the holding heads;
A pitch conversion mechanism for converting the pitch between the holding heads,
The component conveying means is configured such that a pitch between the holding heads is an integral multiple of a first pitch between the receiving portions in the first holding tool, and a pitch between the holding portions in the second receiving tool is set. The electronic device under test accommodated in the first container is held in a state where the pitch is closest to the pitch of 2, and the pitch between the holding heads is set to the second pitch by the pitch conversion mechanism. The electronic component testing apparatus according to claim 1, wherein the electronic device under test is transferred to the second container after the conversion so as to be substantially the same. The first container is a customer tray that houses the electronic device under test before testing,
The electronic component testing apparatus according to claim 16, wherein the second container is a precursor for accommodating the electronic device under test before the test and correcting the mutual positional relationship between the electronic devices under test. The component conveying means includes
A plurality of the holding heads;
A pitch conversion mechanism for converting the pitch between the holding heads,
The component conveying means includes the electronic devices to be tested housed in the first container in a state in which the pitch between the holding heads is the first pitch between the housing parts in the first container. The component is held, and the pitch between the holding heads by the pitch converting mechanism is an integral multiple of the second pitch between the receiving portions in the second receiving tool, and the receiving portion in the first receiving tool The electronic component testing apparatus according to claim 1, wherein the electronic component under test is transferred to the second container after the pitch is converted to a pitch closest to the first pitch between each other. The first container is a test tray that houses the tested electronic components that have been tested,
The second container accommodates the tested electronic component to be tested or the tested electronic component to be tested, and corrects the positional relationship between the electronic devices to be tested. The electronic component testing apparatus according to claim 18, wherein the electronic component testing apparatus is a precursor. The second container is a test tray that houses an electronic device under test before testing,
The test tray is
An accommodating portion capable of accommodating the electronic device under test; and
A clamp mechanism for fixing / releasing the electronic device under test in the housing portion,
The component conveying means includes a clamp operating means for operating fixing / releasing of the clamp mechanism,
When the electronic device under test is accommodated in the second container, the holding head releases the electronic device under test into the accommodating portion, and the clamp mechanism is moved into the accommodating portion by operation of the clamp operating means. The electronic component testing apparatus according to claim 1, wherein the holding head is detached from the housing portion after the electronic device under test is fixed. The first container is a test tray that houses tested electronic components to be tested.
The test tray is
An accommodating portion capable of accommodating the electronic device under test; and
A clamp mechanism for fixing / releasing the electronic device under test in the housing portion,
The component conveying means includes
A plurality of the holding heads;
Clamping operation means for operating fixing / releasing of the clamping mechanism;
With
When holding the electronic device under test from the first container, the plurality of holding heads respectively approach the housing portion, and at least one of the plurality of holding heads holds the electronic device under test. And then the remaining holding head is detached from the accommodating portion after the clamp mechanism fixes the electronic device under test accommodated in the accommodating portion by the operation of the clamp operating means. The electronic component testing apparatus according to claim 1 or 2.

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