TW466567B - Rambus handler - Google Patents

Abstract

A test handler for automatically testing rambus type semiconductor devices. The rambus type test handler includes a user tray stacker for stacking a plurality of user trays which are loaded with semiconductor device that have been, or will be tested; a device loading portion for picking up the semiconductor devices from the user trays at a supplying position and loading the semiconductor devices onto boats at a loading position; a heating/cooling chamber for heating or cooling the boats according to test requirements by order of boat receipt from device loading portion; a test chamber for connecting the heated or cooled semiconductor devices to test sockets for testing; a recovering chamber for recovering the temperature of the semiconductor devices to a normal degree, while elevating the boats and discharging the boats through an upper end, sequentially, by order of boat receipt from a lower end of the test chamber; a device sorting portion for picking up test-completed semiconductor devices from the boats discharged from the recovering chamber and stacking respective grades of semiconductor devices to correspondingly predetermined areas of a plurality of conveying buffers; and a device unloading portion for stacking the semiconductor devices from the conveying buffers to the user trays corresponding to the respective grades of the semiconductor devices. Further, there are provided a device loading portion, displaceable hand for sorting the semiconductor devices, contact picker assembly of the test chamber, and position guiding portion.

Description

, 46 656 7 V. Description of the invention (1) "Background of the invention" Field The present invention relates to a test program processor for testing the performance of electronic components [such as integrated circuit (IC) 'semiconductor wafers, etc., and particularly to a processor Test program processor, KAMMS program processor, which can automatically test ball grid array (BGA) or wafer-size package (csp) type semiconductor devices. The related technology of South Korea * is generally based on 'complete semiconductor devices (in (Hereinafter referred to as "device") always test performance. The test program handler tests the test device in the following manner: A specific number of semiconductor devices are transported and connected to a test head for testing, and are classified, grouped, and stacked according to the test results. Various test heads have been developed to test semiconductor devices of various shapes and types. This type of test program treats a semiconductor structure that tests semiconductor devices that typically have electrodes (so-called leads or pins) protruding from the outer surface of the seal. Recently, a new type of high-capacity device, such as a Ball Grid Array (BGA) or Chip Size Package (CSP) type device, has been mass-produced. The BGA or CSP type device has an area array arrangement in which most electrodes are arranged on the lower surface of the package. Because of the different electrode configurations of BGA or CSP devices (most of which are located on the lower surface of the package), there are not many custom test program processors capable of testing these devices. Therefore, the demand for test machines suitable for testing BGA or CSP devices is increasing.

V. Description of the invention (2) When testing a semiconductor device, since the semiconductor device must directly contact the recess of the test head, a tool must be used in the testing machine to guide and apply a suitable pressure to the semiconductor device. In a general test program processor, there are different intervals between a user tray for supplying semiconductor devices and a semiconductor device receiving section of a semiconductor device test container. Because of the high testing efficiency, a. When picking up and placing semiconductor devices, the interval between the semiconducting devices must be adjusted, and furthermore, two picking up and placing semiconductor devices must be included in the picking up and placing operations. deal with. To compensate for the gap between the trays and the semiconductor device receiving section of the container, adjustment devices such as a preselector or a link type adjusting device (fafa hand) have been used to adjust the pickup And the spacing between the placement cylinders. To further increase the test Θ, the robot arm ^ includes eight pickup & placement cylinders and vacuum pads. However, the conventional test program processor has the following disadvantages: when using a preselector, the pick-up and placement efficiency of the semiconductor device cannot be excellent, and when a link-type adjustment device is used, the cumulative error between the keys hinders Precise pick and place operations. Further, when the test time is relatively shorter than when it is picked up and placed, because the test device is empty excessively, the price inefficiency occurs. [Summary of the Invention] The present invention is completed in order to solve the above-mentioned related technologies. Therefore, one of the purposes of the present invention 466567, invention description (3) ---- is to provide a test program processor, that is, Tests RAMBUS-type devices, such as ball grid array (BGA) or chip or package (CSP) -type devices, RAMBUS program processors. Another object of the present invention is to provide a RAMBUS program processor, which has a mouth-changing mechanical arm that does not cause cumulative errors when adjusting the interval between the cylinders, and it can also be operated in a pick and place operation. The lower number of semiconductor devices can reduce pick-up and placement time. Processing Another object of the present invention is to provide an rAMBUS program processor, which has a device capable of picking up and connecting the device to the test recess in a precise manner when the semiconductor device is picked up from a test chamber for testing. One of the above objects is accomplished by the RAMBUS program processor of the present invention, which includes: a user tray stacker for stacking user trays loaded with semiconductor devices for testing, and placing the user trays one by one Put it in the semiconductor device supply position, put the empty user tray in the semiconductor receiving position, let the empty user tray accommodate the tested semiconductor racks, and stack the user trays with the tested semiconductor devices stacked; A semiconductor device loading section having a double-row interchangeable robotic arm for picking up semiconductors in a user tray at a semiconductor supply position and placing the semiconductor devices on a semiconductor device loading position A heating / cooling chamber, which heats or cools the semiconductor devices on each device according to the test requirements, while lowering the container to the lower outlet in accordance with the order of loading and receiving each device from the semiconductor device through the upper inlet, and unloading through the lower outlet Semiconductor device, a test chamber for connecting a heated or cooled semiconductor device to a test head Testing a semiconductor device and a recess portion, a recovery

466567 Five 'Invention Note (4) --- Chamber' It is used to restore the temperature of the semiconductor device to a normal level, and at the same time, the order of the containers in the test room through the lower end of the test room is improved and the containers are unloaded and the semiconductor is classified Unit with a plurality of single-row collapsible buckets and upper arms for picking up the tested semiconductor devices from the containers in the order in which the containers are contained in the recovery room, and corresponding to each of the ^ 3 levels and half classified by the test results Guide devices, stacking semiconductor devices in a plurality of transfer buffers, and a plurality of predetermined areas, and semiconductor device unloading sections, for stacking punchers from bulk devices to user trays for semiconductor devices of various grades. 〃 丨 The loading section of the special-purpose twisted semiconductor device includes: a dual-axis loading robot attached to a dual-row interchangeable: taxi for placing the dual-row interchangeable conductor loading position, and a semi-conductor for temporary Ground a spare semiconductor device. The semiconductor device unloading section includes: a container moves the shaft in the forward or backward direction (that is, the x_ direction) for the valley adsorption position, two single-axis extension yak conductor device-type mechanical arms from the container I picked up a half ^ because early and late, I changed the individual semiconductor evaluation level of the test results, etc., put Feng =: 3: According to the predetermined position of the buffer, transfer to the conductor = container to semiconductor device unloading = ... It is used to transport the semi- + conductor unloading part on the pick-up machine that picks up the cylinder. The p-loaded robot is attached to further. Further, the above-mentioned double-row interchangeable robotic arm ~ the purpose of the above-mentioned will be accomplished by the single and use according to the present invention.

466567

V. Description of the invention (5) Authorized: 歹 / Interchangeable robotic arm includes: a robotic arm frame, a guide rod, and a plurality of pick-up blocks on the guide frame are inserted into the robot arm frame by the guide rod. Pick-up block interval adjustment device '"To change the guide bar and the number of pick-up blocks to the interval between the relative picks or guides = block _ whole device includes: guide protrusions protruding from a plurality of pick-up blocks i: straight Plate, provided with a plurality of guide grooves to receive the guides so that the guide protrusions on the ends of the guide grooves indicate a narrow interval between pick- :, and at the opposite ends: a wide interval, and a driving device, For lifting =: ^: positive plate. Here, the 1-lead protruding block is formed by the cam follower. The scoop / ground, pick-up block interval adjustment device is installed on the arm frame rod and is formed on the arm frame. It is used to guide the interval adjustment board. The ascending guidance device includes:-a linear motion guide (LM guide) placed on the arm frame, and a linear motion block (LM block) on a plate. &Amp; adjustment The pick-up block is attached to the pick-up for picking up and placing the semiconductor device. Each double-row interchangeable robotic arm includes: a robotic arm frame, a first guide rod with 3 arms, a plurality of pick-up blocks inserted by the first guide rod and sliding on the f-th guide rod, The first position, which is used to change the interval between the first guide rod and the plurality of pick-up blocks by being raised or lowered relative to the robot arm frame, is provided with a width adjustment device of = G on the device It 466567 V. Description of the invention (6) rod, a plurality of pick-up blocks inserted by the second guide rod and sliding on the second guide rod, and a second interval adjustment It is raised or lowered on the arm frame to change the interval between the second guide rod and the plurality of pick-up blocks. The first and second interval adjusting devices include a guide projection protruding from the plurality of pick-up blocks. Part, the first and the second interval adjusting plate are provided with a plurality of guide grooves for receiving the guide protrusions, so that the guide protrusions on the end of the guide grooves indicate the distance between the pick-up blocks. Narrow interval while simultaneously projecting on the other end of the guide groove The wider interval between the pick-up blocks and the first and second driving devices are used to raise and lower the first and second partition adjustment plates. The first-interval adjustment device includes a first ascending guide device, which is provided at The robot arm frame is used for guiding the first interval adjusting plate to rise and fall; the interval adjusting device includes a second rising guide device which is provided on the width adjusting device 'for raising or lowering the second interval adjusting plate. Width adjustment The device includes: a pneumatic cylinder, which is located on the arm frame Z-width adjustment bracket, which is connected to one or two rods of the pneumatic cylinder. A linear motion block is installed on the width adjustment bracket. The guide and the guide are installed on the cabinet frame of the robot arm, and are in vertical relation with the first and second guides, and are used to guide the movement of the linear block. The completion of the above is also to be tested by the RAMBUS program processor according to the present invention. Test room, the test room contains: ―container, which is loaded with most of the upper pick-up guide 2: body device, a contact picker group #, for the recess of the conductor device of the container and directly connected to the test head, ascending 466567 Fives, Explain (7) Placement ', for vertical placement', for moving the loader. The semiconductor valley loader is moved to the test head body device receiving hole and connected to the semiconductor initial test position via the container's connection. The mobile contact picker assembly and the container are moved. The transfer contact picker assembly can pick up the semiconductor device device to the test recess. Move to a contact pick-up set, most pick-ups include four vacuum pad devices, and multiple components and vacuum / vibration vibration absorption-first pick-up and first vibration absorption within a specific range The plurality of compression wires are used to elastically pick up the contacts, and the plurality of semiconductor devices are picked up in the semiconductor device portion, and are held at the initial test positions above. The container has a plurality of semiconductors and a plurality of perforations formed between the semiconductor receiving holes. Hole, contact the pick-up assembly, lower to the test recess, and straighten the device to the test recess. At the same time, by the container conveying device, through the perforation of the container:, is corresponding to the distance of the semiconductor device receiving hole _ half interval. The device assembly includes: a riser plate connected to the riser, connected to the riser plate via a vibration absorbing device, a rectangular pick-up member with a vacuum hole, and a vacuum cymbal, each of which is movably connected to attract Half of the compression coil springs are placed between each picker to elastically support the vacuum capsule. ° The device includes: a first vibration absorbing plate, which is connected to a second vibration absorbing plate, which is connected to the rising plate corresponding to the device, and a plurality of connecting rods, which are used to connect the first absorbing plate, and the connection method The 帛 H and the closing plate are movable (relative to the second vibration absorbing plate), and the ring bomb is placed around a plurality of connecting rods. A vibration absorbing plate is supported on the second vibration absorbing plate. on. The β component lifting device includes: an engine, which is installed in _ p. 466567 466567

5. Description of the invention (8)-One is installed on the contact pick-up assembly ba. 'Secondary of the self-contacting pick-up assembly: 、,: rack (with rack and one rack) meshes to the long production ;: two out of the J frame, the pick-up assembly 2 moves down and down' and Guiding device for guiding contact trough transmission device contains. According to the technical skills, it can be selectively inserted into the structure, its pivot is attached to the grasping container, and a pivot Qiu ° It is used for the grasping hole on the side of the device; it is inserted into the grasping hole, and a driving part is made by in ::, which is used to move the grasping structure of the grasped container linearly. # 之 知- Insert: connect = moving rod 'is used to pivotally hold the holding member of the building and prevent the extension block from moving. The crotch ^ uses (ball screw). A ball guide screw + " to the engine's rotating shaft,-ball nut, The meshing ball guide screw moves linearly when rotating, so that :: The connecting member is used to connect the ball nut and the pivoting part. The room bag Γ is the position of the two books, and the embodiment of the jump program processor When testing the conductor device: Place two guide contacts in the receiving hole of the body device: empty Γ leads to the semiconductor. When the contact pick-up is lowered, 'for guiding the contact pick-up, so that the semiconductor device f is connected to the test recess, and-the conductor device is connected to the semiconductor device, and when the vacuum of the contact pick-up assembly is The recessed section is used to guide the contact of the picker group. Page 12 4 6 6 5 6 5. Description of the invention (9) ----- The pick-up position guiding device includes: first and second inclined guides, which are opposite to each other. First and second hard stop contact portions formed on the left and right sides and on both sides of the device receiving hole of the vacuum pad for guiding the vacuum pad to move in the X-direction of the semiconductor device receiving hole and a specific curvature radius It is oppositely formed on the front and back sides and formed on both sides of the receiving hole of the semiconductor device of the vacuum pad, and is used to guide the vacuum cymbal movement in the receiving direction of the receiving hole of the semiconductor device. The lowering guide device includes: a plurality of pairs of contacts A guide pin, which is integrated on the contact pick-up assembly and a contact guide plate, is provided on the part of the test head and has a contact hole corresponding to the contact guide pin. The guide device includes The third tilt guide is provided on the two side walls of the test recess corresponding to the first tilt guide of the vacuum art, and is used to guide the movement of the true M in the X-direction and the third hard stop contact. β is provided on both sides of the brake test recess corresponding to the first hard stop contact portion, and is used to guide the movement of the vacuum pad in the γ-direction. [Description of Preferred Implementation] Now, the present invention will be described in detail. The preferred embodiment is illustrated by an example. As shown in FIG. 1, 'RAMBUS program processing of the present invention'-A ^ ^ The heart king includes a user tray stacker 00, a semiconductor device loading section 200. , Heating / cooling room 300, test room 400, recovery room 500, semiconductor device classification section / 00 / and semiconductor device unloading section 700. ° In the entire description of the preferred embodiment of the present invention, the X direction is H &

Page 13 466567

5. Description of the invention (ίο) The tray is placed in the direction above the main frame 1, and the ^ direction is the direction perpendicular to the X direction toward the rear of the main frame 1. Referring also to Fig. 4, the transfer of the semiconductor device 60 of the RAMBUS processor is shown in detail. '' The user tray stacker 100 is placed on the front of the main frame 1, and as shown in FIG. 2, the user tray stacker 100 includes: a tray rack 11 for stacking the user tray 10 and a tray fixing plate. 120 is used for fixing one pallet 10 and one pallet robot 130 for loading and unloading the user pallet 10. Further, 'on the upper side of the user tray stacker, a base plate 2 is provided. The tray rack 110 is a board having guide bars 111, and the user trays 10 are stacked one by one. The tray holder 11 can be moved forward and backward in the Y direction by a cylinder. A plurality of tray racks 110 are arranged in a row on the front of the main frame '. They include: two tray racks UQa for stacking user trays 10 and a tray rack 110b with semiconductor devices 60 to be tested, For stacking empty user trays 10 and five tray racks 110 c 'for stacking user trays 10 loaded with semiconductor devices 60 that have been classified according to test results. The tray fixing plate 120 is placed above the tray holder Π0 and below the bottom plate 2, and corresponds to each tray holder 110, except for the tray holder 11 Ob of the empty user tray 10 of the device. The tray fixing plate 120 is raised / lowered by a cylinder 121. Therefore, when the tray fixing plate 120 is raised and the user tray is loaded, the 'user tray 10' is inserted and exposed through the opening formed in the bottom plate 2 to form a semiconductor device supply position P1 and a semiconductor receiving position P6.

Page 14 466567 V. Description of the invention (11)-The pallet robot 130 is a rectangular robot with a direction axis 131 and two vertical axis 133 ^ The vertical axis 133 has a gripper 135 'for The used tray 10 is loaded / unloaded between the tray fixing plate 120 and the tray rack 110. The operation area of the pallet robot 130 covers the entire pallet rack 110. The semiconductor device loading section 200 holds the semiconductor device 60 from the user tray 10 fixed at the semiconductor device supply position P1, and places the semiconductor device 60 into the receiving hole of the container 20 at the semiconductor device loading position P2. 'The semiconductor device loading unit 200 includes a double-row interchangeable robot arm 21, a loading robot 2 20, and a semiconductor device buffer 23 (). Each double-row interchangeable robot arm 210 includes sixteen pick-up cylinders. 286, in order to pick up the cylinders 286 and 296 are arranged in two rows J = and the interval between the respective cylinders 286 and 296 can be changed from wide to narrow. The narrow interval refers to = Semiconductor Semiconductor Set 60 by the user Tray! 〇 is picked up, @ 时 宽 的 间: The semiconductor device is not placed on the container 20. This will be described in more detail below. Loading robot 22 0 series double-axis Cartesian coordinate robot, basin And the arm 2H) and walking in the XM direction. | Loading machine: 22 ° series placed. At a suitable height, covering the semiconductor device

The user supports and is located in the operating area of the semiconductor device installation J 20. The valley device P1 on the section and the semiconductor device supply position guide ^ w2 device loading position ΪΡ2 'are provided with a plurality of semiconductor-receiving holes in the interior. The semiconductor device buffer 23 0 always has two spares. 466567 V. Description of the invention (12) With the semiconductor device 60, the dual-row interchangeable robotic arm 21 can always attract and transfer sixteen semiconductor devices 60. The heating / cooling chamber 3 0 0 is arranged above the main frame} and has an entrance having a height equal to the semiconductor device loading position P2, so that the container 20 enters there and has a height equal to the upper surface of the main frame The exit 'causes the container to be removed from it. Therefore, the inlet and outlet of the heating / cooling chamber are of different heights. When the container 20 enters the heating / cooling chamber 300 and descends toward the outlet, the semiconductor device 60 on the valley device 20 is appropriately heated or cooled in accordance with the test requirements. The test chamber 40 0 is located in the main frame 1 and is next to the exit of the heating / cooling chamber 300 to connect the semiconductor device to a plurality of test heads located below the main frame 1 for the test. Test the recess. The test chamber 400 will be described in more detail below. The recovery room 500 is connected to the test room 400. The recovery chamber 500 raises the container 20 from the test chamber 400 to a height corresponding to the loading position P2 of the semiconductor device 'and restores the temperature of the semiconductor device to a normal temperature. The entrance of the recovery chamber 500 is higher than the exit ′ of the heating / cooling chamber 3000, and its exit is set at the same height as the semiconductor loading position P2. The exit of the heating / cooling room 300, the test position and conveying path of the container 2 in the test room 400, and the entrance of the recovery room 500 are all the same degree. The container 2 is in a separate room. It is transferred by a container transfer device with a ball screw and a pneumatic cylinder. As shown in FIG. 3 ', the semiconductor device classification section 600 includes: a container transfer shaft 6100, two single-axis robots 620, two transfer buffers 630, and

Page 16 466567 V. Description of the invention (13) Single-row interchangeable mechanical arm 640. After receiving the container 20 from the exit of the recovery chamber 500, the container transfer shaft properly places the container 20. The container transfer shaft 6i0 includes: an engine 611, a ball screw 612, and an LM guide 613. The single-axis robot 620 is placed on the container transfer shaft 61o and the transfer buffer 630 'and picks up the semiconductor device 60 of the container 20 and sets the transfer buffer 630. Each single-axis robot 62 has eight pick-up cylinders 652 to which a single-axis replaceable robot arm 64 is attached to change the interval between the cylinders 652. This will be described in more detail below. ^ The transfer buffer 630 is placed beside the container transfer shaft 610. The transfer plate 631 of the transfer buffer 630 moves back and forth with a linear transfer device, and has a plurality of sections for receiving and stacking the semiconductor device 60. The linear transmission device includes: an engine, a ball screw, and an LM guide. Therefore, after the semiconductor device test, the transfer buffer 630 transfers the semiconductor device ㈢ toward the user tray stacker 100, and more specifically, the semiconductor device unloading position P5. It is expected that the semiconductor device classification section 600 further includes: a first section, a container 20 for receiving 500 from the recovery room, and a second section; it is empty because the semiconductors 6 on it are split. Picked up = placed in the transfer buffer 63) to the semiconductor device loading section 2000. The first and second semiconductor mounting 6 gas packing columns are formed. The syllables are moved by the semiconductor device unloading section 700, and the semiconductor devices are classified and grouped according to the test results.

466567 V. Description of the invention (14) User tray at semiconductor receiving position P6. The semiconductor device unloading section 700 includes a two-axis unloading robot 71 (Cartesian coordinate robot), which is attached to the pick-up robot arm 720 to move in the X and Y axes. The unloading robot 710 is placed at a suitable height so as to cover the semiconductor device unloading position P5 of the two transfer buffers 63o in its operation area and the user tray ιo at the semiconductor receiving position p6. The pick-up robot arm 720 includes sixteen pick-up cylinders 286 and 296. Because the gap between the receiving portion of the semiconductor device of the transfer buffer 630 and the user's gap between the discs 10 are the same as each other, the gap between the picked up cylinders 2 8 6 and 296 has not changed. When the interval of the semiconductor device receiving section is changed ', a replaceable robot arm can be used. Further, although it is not explained, 'a control section is included in this embodiment to control each section. Hereinafter, a RAMBUS program processor according to a preferred embodiment of the present invention will be described in more detail. A worker stacks a user tray 10 on which the semiconductor device 60 is loaded on a supply tray rack located at a square position. After stacking, the pallet rack 110a returns to the starting position. Further, empty user trays 10 without semiconductor devices are stacked in empty tray racks u0b (the number of which is at least equal to the number of body device classification groups) ^ 'When the user trays 10 are stacked on the tray rack 11 ( ), The pallet robot 1 30 detects the top user tray 10 of the user tray in the supply tray rack 丨 丨 a, and grasps the top user tray with the gripper 135 and Move above the adjacent tray rack 110a. Then, the tray fixing plate 466567 V. Description of the invention (15) is lowered to a proper height 'so that the gripper 135 of the tray robot 13 can load / unload the user tray 10. When the tray fixing plate 120 is lowered, the user tray 10 held by the tray robot 130 is loaded by the tray fixing plate 120. When the tray robot 130 loads the user tray and removes it, the tray fixing plate 120 is raised to load the user tray. Therefore, the user tray 10 is exposed through the opening in the bottom plate 2 to form The semiconductor device supply position P1. ”Α If there is a user tray 10 on the tray fixing plate 120, the tray robot 130 unloads the user tray 1 from the tray fixing plate 120 with a gripper not occupied by the user tray 10. 〇 After being removed from the tray fixing plate 120, the tray robot 丨 3 〇 Selectively stack the user tray 10 on the empty tray rack 110a or other trays with semiconductor devices that have been tested and completed When the user tray 10 reaches the semiconductor device supply position? 1, the loading robot 220 sucks the semiconductor device with a double-row interchangeable robotic arm 21, and stacks the semiconductor skirts in place to load the semiconductor device. = 容 ^ 中. Here the 'dual-row interchangeable robotic arm 21〇 picks up the narrower gap between the cylinders 283 and 296' to attract the semiconductor device 6 from the user tray 1 0. In the double-row interchangeable robot When the arm 210 is moved to the semiconductor device loading position? 2, the interval between the picked-up cylinders 286 and 286 is widened, and the semiconductor device is appropriately placed in the container 20. If the number of the semiconductor devices to be adsorbed is 60, Less than sixteen, Be made up by a suitable manner into sixteen square semiconductor device 6, for example, the semiconductor device 60 to make it back to adsorption buffer 23〇 semiconductor device, or

Page 19 466567 V. Description of the invention (16) " ---- Adsorption of a corresponding number of semiconductor devices from the semiconductor device buffer 2 3 〇 ^ When the replaceable robot arm 2 I 〇 insufficient semiconductor devices and no When the semiconductor device is left in the semiconductor device buffer 23o, the replaceable robot arm 210 desorbs the semiconductor device 60 to the semiconductor device buffer 23o. After the semiconductor device 60 is loaded in the container 20 located at the semiconductor device loading position P2, the loading robot 22 is dragged by the guide rod 'located at the lower end of the replaceable robot arm 21 to the heating / cooling chamber. 300. Next, a rotating cylinder is formed before the entrance of the heating / cooling chamber 300, and the container 20 is completely placed in the heating / cooling chamber 300. After a container 20 enters the heating / cooling chamber 300, the lowermost container 20 leaves and enters the test chamber 400. More specifically, the inlet and outlet for heating / cooling to 300 are at different heights' and most of the containers 20 are stacked therebetween. Therefore, when one container 20 enters the heating / cooling chamber 300, the other container 20 leaves the heating / cooling chamber 300 sequentially. Since the container 20 in the heating / cooling chamber 300 takes a certain time to leave, the container 20 is appropriately heated or cooled until it leaves. After leaving from the heating / cooling chamber 300, the container 20 is placed on the test head in the test chamber 400. Then, the pickup assembly of the test chamber 400 picks up and connects thirty-two semiconductor devices 60 to the recesses of the test head for testing. The controller of the program processor memorizes the level of the semiconductor device 60 in the container 20 (measured in accordance with the test result). After the test, the container 20 enters the recovery chamber 500. The test procedures in the test chamber 400 will be described in more detail below. The inlet and outlet of the heating / cooling chamber 3 0 0 ′ recovery chamber 5 0 0

Page 20 466567 V. Description of the invention (π) Yes-different heights. Therefore, the temperature of the semiconductor device 60 on the container is returned to the normal temperature in the recovery room 500, and at the same time, the container 2 0 is sequentially passed. Enter and exit. The test chamber 400 is an exception to the heating / cooling chamber 300 in that the outlet is higher than the inlet, and the container 20 exits from above the tester 400. After leaving from the recovery room 500, the container 20 is stacked on the container transfer shaft 610 of the semiconductor device sorting section 600. The container transfer shaft 61o transfers the container 20 forwards and backwards (i.e., in the Υ direction), and stops at a position where the single-axis robot 62 holds the semiconductor device 60 from the container 20. Each early axis robot 620 uses a single row of robotic arms 640. Eight semiconductor devices 60 are sucked from the container 20, and the semiconductor devices 60 are transported in the X direction, and will be transported according to the level of the semiconductor devices 60 determined by the test results. The semiconductor device 60 in the semiconductor device receiving section of the buffer 630 is placed in the semiconductor device receiving position P4. Because there are various level groups in the program processor controller, and the semiconductor device 60 allocation area, the semiconductor I absorbed by the single-axis robot 62 is set to 60, which can be based on the test results memorized by the controller. Receive the appropriate area of the transmission buffer 63. This program consists of the movement of the single-axis robot 620 in the X direction and the movement of the transfer buffer 63 in the ¥ axis. When the semiconductor device 60 is withdrawn by the single-axis robot 6 20, the empty capacity 20 is moved from the container transfer shaft 6 to the container loading position η ^ The transfer buffer 6 3 with the semiconductor device 6 is loaded by linear transfer The device (composed of a ball screw) is transferred to the semiconductor device unloading position M. There are two transmit buffers 630 for uninterrupted operations. Therefore, when — the transfer buffer 6 3 0 is moved to the semiconductor device unloading position? At 5 o'clock, the second pass is 466567. V. Description of the invention (18) == 630 Continuously receives and groups semiconductor devices 60 of each grade from the semiconductor device classification unit. When the transfer buffer 6 3 0 is moved to the semiconductor device unloading position p5, the: J robot 7 0 picks up the robot arm 72 0 (composed of sixteen pick-up cylinders). The punch 63G sucks the semiconductor devices and stacks them. The corresponding tray 10 is positioned at the semiconductor impact receiving position P6. Therefore, the semiconductor devices 60 located in the first, second, and poorer areas of the transfer buffer 630 are damaged, and the users for the first and second damage levels are stacked, respectively. Tray 1 0. = 4 is a flowchart showing the transmission path of the semiconductor device 60 in the rambus sequence processor of the preferred embodiment of the present invention. The semiconductor device 60 in the user tray 10 located at the semiconductor device supply position is a container that is adsorbed sixteen times by a double replaceable robotic arm 2i0-times, and is stored in a container indicated by the loading position arrow (a). 2〇 on. When the semiconductor device 60 is completely closed to the container 20, the container 20 is transferred to the heating / cooling room 300, the test room, the recovery room 500, and the semiconductor device classification section 600 (denoted by arrow 8) ;. When the container 20 is transferred to the semiconductor device sorting unit 600, the respective grades of the semiconductor device 60 are received by two single-row interchangeable robotic arms 64 (represented by arrows) (㈣) The empty container 20 is transferred to the container loading position P2. When the transfer buffer 63o is moved to the semiconductor loading / unloading position P5, the semiconductor devices of each grade 6 are fixed by the fixing machine and the arm 720 (arrows (Represented by D) Loading from the transfer buffer 63 to the relative user tray 10. The arrow E shows the movement path of the user tray 10. As shown in the figure, the empty 466567 V. User's tray of the invention description (19) The 10 series is moved to a position of 60. The semiconductor device that has already been tested and loaded will be loaded. In the article 5, Xiongpi will describe the single-row interchangeable machine # 640 and the dual-arm interchangeable robot arm 21 according to the present invention in more detail. 〇。 哲 ϋ 5〗 π⑧ According to the book * the preferred embodiment of the list Interchangeable machine block ..., the plurality of pick-up cylindrical portions 642, and the plurality of pick-up guide portions 642 include ^ cylindrical space adjustment devices for each other. The rods at the two ends of the frame 在 are slidably passed through the robot arm 642. The number of pick-up blocks 644 are guided by a guide rod 3, and the interval adjustment device includes: a plurality of pick-up blocks "4 protruding from the guide ib. The interval adjustment plate 648, drive ^ 66 0. Sigh 5 丨 Guide device. The interval adjusting plate 648 includes a plurality of guide grooves 648a for guiding the protrusions 646. Among the plurality of guide grooves 648a—the upper guide protrusions indicate the contraction of the pick-up block 644. At the same time, The guide grooves on the other ends of the plurality of grooves 648a indicate the spread of the pick-up block. The driving device 65 raises the interval adjustment plate 6 48 and wraps two. At the two upper ends of the interval adjustment plate 648 At the same time, the pneumatic stalk-rod is pneumatically fixed and its main system is fixed on the robot arm frame 64i. When the interval adjustment plate 648 is raised or lowered by the drive device 650, the guide device 660 guides the interval adjustment Plate 6 48 ascend / descend. Bow 丨 device 660 contains linear motion guide Guide 664 and motion block 662. Linear motion

^ I 466567 V. Description of the invention (20) The guidance system is formed on the end of the robot arm frame 641, while the linear movement 662 is formed on the two ends of the interval adjustment plate 648 'for guiding linear ascent / descend. Further, on both ends of each pick-up block 644, a pick-up cylinder 6 is provided to suck and transfer a specific number of semiconductor devices (not shown): a single-row interchangeable robotic arm 64, which will be described in more detail below . When the densely arranged semiconductor devices 6 S ^ ^, B0, 〇 # ^ use early-row interchangeable robot arms as follows: 644 ^ ^ t64 ° ^ ^ # ^ ^ ^ ^ When the cylindrical rod is raised, it is also raised, and most of the guide grooves 6483 of L are moved into the guide groove "8a Γ Π ΐ6 convex 48; two: the guide protrusion _ the guide protrusion _ includes the cam follower out 2 6 = over, * lifting block ... plate = slidingly guided by the rod "2 slides through 642, widens the movement of the pick-up and adjustment plate 648 and extends along the horizontal distance of the guiding rod 646 ~ to make it protrude like a guide The interval of the conductor device 60 shown in FIG. 6B, which enables the lane-strength single-row interchangeable robotic arm 64 to desorb the semi-semiconductor semiconductor device 60. FIG. 7 is a perspective view showing a widened state. Interchangeable robotic arm. Double row of preferred embodiments of the invention

Page 24 466567 V. Description of the invention (21) As shown in Fig. 7, in the second preferred embodiment, most of the picked cylinders are arranged in two columns, and the interval between them can be changed. A row of replaceable robotic arms 2 1 0 mainly includes: a robotic arm frame 2 4 j, first and first guide rods 242 and 244, a plurality of pick-up blocks 282, first and first interval adjusting devices, and width adjusting devices. The Mo β first guide rod 242 includes two guide rods 242 which are fixed to each other at the two ends of the robot arm frame 241 at a predetermined distance from each other. At the same time, most of the picking blocks 282 are slidably guided by two second guides. Stick 242 passes through. The first interval adjusting device includes a guide projection 284 protruding from the plurality of pickup blocks 282, a first interval adjusting plate 280, a first driving portion 246, and a first ascending guide portion 250. The first interval adjusting plate 280 has a plurality of guide grooves 280a, respectively, for receiving the guide protrusions 284. The guide protrusions 284 on one end of one of the guide grooves 28〇a indicate that there is a narrow gap between the pick-up blocks 282, and at the same time, t, the majority on the other end of the guide groove 280a The guide projections 284 indicate a wide interval between the pick-up blocks 282. m The first driving section 246 raises the first interval adjusting plate 280 and includes two pneumatic cylinders. The rod of the pneumatic cylinder is fixed on one side of the first interval adjusting plate 28 and its main system is fixed on the arm frame 241. When the first interval adjusting plate 280 is raised by the first driving portion 246, the first ascending guide portion guides the rising / falling of the first interval adjusting plate 280. The first rise? The guide 250 includes a linear motion guide 254 and a linear motion block 252 ° The linear motion guide 254 is placed on the two ends of the robot arm frame 241 and the 'simultaneous' linear motion block 252 is placed on the first interval adjustment plate 2 8 0 ,

Page 25 4 6 65 6 7 V. Description of the invention (22)-For guiding the linear movement of the first interval adjusting plate 280. The width adjusting device 2 70 includes: two pneumatic cylinders 272, four linear motion guides 276 and a linear motion block 2 及, and a sub-frame 278. The linear motion guides 276 are formed on the robot arm frame 241 'and form the first guide rod 242. Vertical relationship. Here, the linear motion guide 2 7 6 is placed on the side of the robot arm frame 241, one of which is above the first guide rod 242 and the other is below. The linear motion guide 276 is respectively connected to the linear motion block 274, and at the same time, the linear motion block 274 is connected to the sub-frame 278. The rods of the two pneumatic cylinders 272 are respectively connected to the two upper sides of the sub-frame 278, and at the same time, the pneumatic cylinders 272 are fixed on the robot arm frame 241. The second guide rod 244 includes two guide rods 244 which are fixed to the sub-frame 278 at a predetermined distance from each other. That is, two ends of each first guide rod 244 are fixed to the sub-frame 278. The pick-up block 292 is slidably passed by two second guide rods 244. The second interval adjusting device includes a guide projection protruding from the pick-up block 292, a second interval adjusting plate 290, a second driving portion 248, and a second lifting guide 260, respectively. The second spacer guide plate 290 includes a plurality of guide grooves for receiving the guide protrusions. The guide projection on one end of the guide groove indicates a narrow interval between the pick-up blocks 292. At the same time, the guide projection on the other end of the guide groove indicates a wide gap between the pick-up blocks 292. Interval. The second driving portion 248 raises the second interval adjusting plate 290 and includes two pneumatic cylinders. The rods of the pneumatic cylinder are fixed on the two upper sides of the second interval adjusting plate 29 (), and at the same time, the main system is fixed on the sub-frame 278.

d 6 6 5 6 7 V. Description of the invention (23)-When the second interval adjusting plate 29 is raised by the second driving portion 248, the first rising guide portion 260 guides the rising of the second driving portion 248. The second ascending guide 2 6 0 includes a linear motion guide and a linear motion block β. Here, the linear motion guide system is placed on the two ends of the sub-frame, and at the same time, the linear motion block system is placed on the second interval adjustment plate 2 9 The two ends of 〇 are used to guide the linear movement of the adjustment plate 290. Brother Yi ^ Further, on each of the two sides of the pick-up block, pick-up cylinders 286 and 296 'are provided to suck and transfer a specific amount of semiconductor device 60. Hereinafter, the operation of the dual-row interchangeable robotic arm according to the preferred embodiment of the present invention will be explained in more detail. Here's because the change in the interval between the pick-up cylinders has been described in the description of the operation of the single-row interchangeable robotic arm 640 above, now focus on the second pick-up cylinder 298 and the first pick-up cylinder 2 88 The operation of the interval change. When the rod of the pneumatic cylinder 272 fixed on the robot arm frame 241 advances, the sub-frame 278 connected to the rod of the pneumatic cylinder 272 moves linearly along the linear motion guide 2 7 6, thereby widening the first pickup The spacing between the pick-up cylinders 288 and between the second pick-up cylinders 298. When the rod of the pneumatic cylinder 272 is retracted, the interval between the first picked-up cylinder 288 and the second picked-up cylinder 298 becomes narrow. Although there is no limitation on the number of picked up cylinders 288 and 298, it is better to use eight cylinders, that is, sixteen, on each of the two columns, as used in this embodiment. Finally, the “test setup” is provided to the test room of the rAMBUS processor. 466567 5. In the description of the invention (24), the operation and effect will be described in more detail. Fig. 8 is a schematic perspective view showing a test chamber of a RAMBUS program processor according to a preferred embodiment of the present invention. Fig. 9 is a front view and a side view of Fig. 96, showing the structure of the test chamber of Fig. 8 in more detail. Figs. 11A and Uβ are a plan view and a sectional view, respectively, showing the structure of a recess used in a test head of a test chamber according to the present invention. Figures 丨 2 Α and 丨 2B are a plan view and a sectional view, respectively, showing the structure of a contact guide plate of a test chamber according to the present invention. Figures 13A, 13B and 13C are front, bottom and side views, respectively, showing the configuration of a vacuum pad according to the present invention. Figs. 14A and 14B are sectional views respectively in the Y and Y directions, showing that the semiconductor device is picked up by the contact picker assembly of the present invention. 15A and 15B are cross-sectional views in the X and γ directions, respectively, showing that the semiconductor device is connected by the contact picker button of the present invention. Fig. 16 is an enlarged sectional view 'showing the main part of the preferred embodiment of the present invention, that is, the vacuum cleaner of the contact pick-up assembly connected to the test recess. The test head 490 is connected to a tester (not shown) and is located below the test chamber 400 of the ra sequence processor. As shown in FIG. 9B, the test head 49 is provided with a plurality of test recesses 491 arranged above it. A plurality of connection leads 4 9 2 are provided in the test recess 4 91 to form an area array configuration covering the entire lower area of the test recess 49m for testing the BGA or CSP type semiconductor device 60. Further, each test recess 491 is provided with a third tilt guide 411 a ′ on its left and right sides for guiding when the semiconductor device 60 is connected to the test recess 491 by contacting the picker assembly 430; and A third hard stop contact 4Ub is provided on the front and rear sides, and its use is similar to ^

28 X 466567

The three-tilt guide 411 a (which will be described in detail later). The initial test position β of the container 20 carrying the semiconductor device 60 to the upper part of the test head 490 is shown in FIGS. 10A, 10B, and 10c. Each container 20 includes a square body 21 and a plurality of receiving holes 22. The square body 21 is provided for receiving the semiconductor device 60 and the through hole 23 ′ has a predetermined size and is provided between the receiving holes 22. Although this embodiment illustrates that thirty-two semiconductor devices 60 are arranged in four rows of semiconductor device receiving holes 22, and the container is provided with eighteen perforations 2 3 between the receiving holes 22, respectively, The number of the semiconductor device receiving holes 22 and the through holes 23 can be increased. Further, the second inclined guide portions 22a are provided on the left and right sides of each semiconductor device receiving hole 22 of the container 20, and are used for guidance when the semiconductor device 60 is picked up by the contact picker assembly 430. The second hard stop contact portion 22b is also provided in front of and behind the receiving hole 22, and its use is similar to that of the second inclined guide portion 22a (to be described in detail later). The contact picker assembly 430 can be moved vertically above the test head 490. Therefore, after picking up a specific number of semiconductor devices 60 from the semiconductor device receiving hole 22 of the container 20 located at the initial test position to a predetermined height, the contactor assembly 4 3 0 lowers the semiconductor device 60 to the test recess 4 91, so that the semiconductor device 60 is electrically connected to the test recess 4 91 for testing. As shown in FIG. 8, FIG. 9A, and FIG. 9B, this type of picker assembly 430 includes a plurality of pickers 431, a rising plate 434, and a vibration absorbing device 438. The picker 431 includes four picker members 4 32, which are substantially rectangular ', more preferably rectangular. The picker members 432 each include a vacuum space 432a defined vertically therebetween. Pickup member 432

Page 29 46 656 7 V. Description of the invention (26) The upper part is connected to the vacuum hose 437 'and the lower part is connected to the vacuum pad 4 33 for adsorbing the semiconductor device 60. The vacuum pad 4 33 is connected to the pickup member 432 in the following manner; the vacuum pad 433 independently moves with respect to the pickup member 43 2 within a predetermined range. Between the picker member 432 and the vacuum pad 433. The compression coil spring 435 is provided to elastically support the vacuum pad 433 downwardly toward the pick-up member 432. Therefore, when there is an assembly error due to contact with the picker assembly 4 31 and the position of the specific vacuum pad 4 3 3 is shifted from the initial desired recessed connection position, the specific vacuum pad 433 moves to adjust its position ' 'Semiconductor device 60 can be correctly inserted into a desired recess. Although it is preferable that each picker 431 has four vacuum pads 433, it is not strictly limited thereto. Therefore, the number and configuration of the vacuum pads 433 and the pickers 431 may be changed according to specific circumstances. As shown in FIGS. 13A, 13B, and 13C, each vacuum pad 433 includes first inclined guide portions 433a provided on the left and right sides, which correspond to the second inclined guide portions 22a and 22a of the semiconductor device receiving hole 22. The third inclined guide portion 491a of the concave portion 491. Each vacuum pad 433 also includes a first hard stop contact portion 433b provided on the front and rear sides thereof, which corresponds to a second hard stop contact portion of the semiconductor device receiving hole 22 and a third hard stop of the recess 491. As shown in FIG. 14A, the first inclined guide portion 433 a of the vacuum pad 433 and the second inclined guide portion 22 a of the semiconductor device receiving hole 22 guide the vacuum pad 433 to move in the χ direction in the semiconductor device receiving hole 22. As shown in FIG. 14B, the first hard stop contact portion 43 of the vacuum pad 433 and the second hard stop contact portion 22b of the device receiving hole 22 also guide the vacuum. 4 6 65 6 7 V. Description of the invention (27) 433 in semiconductor The device moves in the gamma direction in the contact hole 22. As a result, the vacuum krypton 433 can be made to suck the semiconductor device 60 'at the correct pick-up position and thus the pick-up error can be reduced. Further, as shown in FIG. 15A, the first inclined guide portion 433a and the third inclined guide portion 491a of the recessed portion 491 guide the movement of the vacuum pad 433 in the X direction in the recessed portion 491. As shown in FIG. 15B, the vacuum pad The first hard stop contact portion 433b of 433 and the third hard stop contact portion 491b of the recess 491 guide the movement of the vacuum pad 433 in the Y direction in the recess 491. As described above, because the vacuum pad 433 enables the semiconductor device 60 to be correctly inserted and electrically connected to the recessed portion 491, any possibility of a bad connection can be avoided. At the same time, a vibration absorbing device 438 is provided between the picker 431 and the rising plate 434 to absorb the extra weight of the picker. A pair of contact guide pins 436 are also provided below the pickup 431 to guide the lowering of the pickup 431. The rising plate 4 34 supports the picker 431 'so that the plurality of pickers 431 can pick up and connect the semiconductor device 60 to the recess 491 at the same time. The shock absorbing device 438 is provided between the picker 431 and the rising plate 4 34 'to elastically connect the picker 431 to the rising plate 434, so that the picker 431 can move within a predetermined range relative to the rising plate 434. . The vibration absorbing device 438 includes a first vibration absorbing plate 438a connected to the upper portion of the picker 431, and a second vibration absorbing plate 438b connected to the rising plate 434 and the connecting rod 4 corresponding to the first vibration absorbing plate 438a. 38c, which connects the first vibration absorbing plate 438a to the second vibration absorbing plate 438b so that the first vibration absorbing plate 438a can move in a predetermined range relative to the second vibration absorbing plate 438b, and the compression coil spring 438d is provided at Link around 438c for Country I

31 Page 31 4 6 656 7 V. Description of the invention (28) The first vibration absorbing plate 438a to the second vibration absorbing plate 438b are elastically supported. Therefore, the 'pickup 4 3 1 moves elastically to contact the test recess 4 91 and correctly connects the semiconductor device 60 to the test recess 491. A contact picker assembly lifting device 44 is also provided. The contact picker assembly raising device 440 vertically moves the contact picker assembly wo, and picks up the semiconductor device 60 from the container 20 with its picker 431, so that the semiconductor device 60 is inserted and electrically connected to the test recess 491. As shown in FIGS. 8, 9A, and 9B, the ascending device 440 includes a driving source, that is, an engine 441, a pinion 442, a rack 443, and a guide portion 444. The engine 441 is fixed above the frame 445, and the frame 445 is provided on the contact pick-up assembly 430. The engine 441 is an AC servo engine. The pinion 4 4 2 is meshed to the shaft of the engine 4 41. The rack 4 4 3 is picked up by contacting the upper portion of the assembly 430 ′. More specifically, the rack 443 stands up from the center upper portion of the rising plate 434 and passes through the frame 445. The rack 443 includes a rack 443a 'which is engaged with a pinion 442 in the length direction. Therefore, when the engine 441 is operated, the rack 443 moves vertically. The guide portion 444 guides the contact picker assembly 430 to rise. The guide portion 444 includes a pair of guide shafts 444a 'fixedly protruding from two upper sides of the riser plate 4 34 through a frame 445 and a pair of guide bushes 444b which are fixed to the frame 4 45' and are movably supported. Guide shaft 444a. A container transfer device 4 50 is also provided. The container transfer device 4 50 moves the container 20 a distance from the initial test position (corresponding to half of the interval of the container receiving hole 22), thereby allowing the semiconductor device 60 to contact the picker assembly 430 through the container 20 The through hole 23 lowers the semiconductor device 60 to the test recess

Page 32 466567 V. Description of the Invention (29) 491. Therefore, the 'contact pick-up assembly 430 can pick up the semiconductor device 60 from the container 20 in the initial test position, and insert the semiconductor device 60 into the test recess 491 via the perforation 23 of the container 20 that has been moved by half a space. The container conveying device 450 includes a grasping member 451, a pivoting portion 452, and a driving portion 4 5 3 〇 The grasping member 4 5 1 is inserted into a grasping bar 25 ′ provided on one side of the container 20 and is near the container 20 Pivot, thereby selectively grasping the container 20. Herein, the grasping holes 25 may include two holes provided in front of the container 20 and on the rear end. One end of the grasping member 45 1 may be shaped so as to correspond to the grasping hole 25. The pivoting portion 452 supports the grasping member 451 and pivots the grasping member 451 into the grasping hole 25. The pivoting portion 452 includes a pivoting rod 452a for pivotally supporting the grasping member 451, a pivoting block 4 52b, connected to the end of the pivoting rod 452a, and a pneumatic cylinder 452c, which is connected to the pivot The opposite end of the connecting end of the moving rod is used to pivot the pivoting block 452b. When the pneumatic cylinder 452c is operated, the pivot block 452b is pivoted, and therefore, the pivot rod 452a connected to the pivot block 452b is extremely moved. As a result, the grasping member 451 is inserted into the grasping hole of the container 20, and the driving portion 4 5 3 linearly moves the grasping member 4 51. The grasping member 451 and the pivoting portion 452 assist in grasping the container 20. The driving part 453 includes a driving source, that is, the engine 453a, a ball screw 45 3b, which is connected to the shaft of the engine 453a, a ball nut 453c, and moves linearly in accordance with the rotational movement of the ball screw 4 5 3b. And a connecting member 453d 'for connecting the ball nut 453c to the pivot rod 452a of the pivot portion 452. Pivot rod 452a is connected through

^ 66567 V. Description of the invention (30) The connecting member 453d is pivotally connected to the pivot block 452b. The pivot block 45213 is supported on the other side of the connecting member 4 5 3d. Therefore, when the engine 453a is operated, the ball nut 4 5 3 c moves linearly along the ball lead screw 453 b connected to the engine 4 5 3 a and is connected to the ball nut 453 (: the pivot rod 452 & via the connection The member 453d is moved in the forward direction of the ball nut 453c, and the container 20 is moved. At the same time, as shown in FIG. 9B, the contact guide plate 46 is mounted on the test head 490, and the semiconductor device 6 is guided by the pick-up 431. Contact with the recessed portion 491. As shown in FIGS. 12A and 12B, the contact guide plate 46 includes a plurality of recessed exposure holes 462 provided in the square body 461, and the configuration is the same as that of the test recessed portion 491 in the test head 490. The picker 431 The semiconductor device 60 is inserted and connected to the test recess 491 via the recess exposure hole 462. Further, the contact guide plate 460 includes a contact guide pin hole 463 provided between each of the recess exposure holes 462. In the picker 431 During the descent, the contact guide pin hole 463 receives the contact guide pin 436 protruding from the picker 431, so that the guide semiconductor $ 60 is connected to the test recess 491. As a result, the semiconductor device 60 can be correctly inserted into the recess 491 and The contact portion 492 electrically connected to the recessed portion 491. In the following, the position adjustment when the pick-up assembly 43 is attached to the semiconductor device for testing will be described in more detail. ^ When the RAMBUS processor is operating, a plurality of When the container 20 of the half-body device to be tested is moved to the test position of the test head 49, the pick-up assembly 430 is made by contacting the pick-up assembly ′ 从 from the container 2. A predetermined number of semiconductor devices are adsorbed: ^ 466567 V. Description of the invention (31)-Secondly, the container 20 is moved by the container conveying device 450 and half of the interval of the receiving hole 22 'aligns the perforation 2 of the container 2 3 with the recess 49 of the test head 4 9 0. 'The contact picker assembly 4 3 0 is lowered by the contact picker assembly raising device 440, passes through the perforation 23 and reaches the recessed portion 491, so that the semiconductor device 60 is inserted into and contacts the recessed portion 491. As shown in FIG. When descending, the movement of the picker 431 is first guided, and at the same time, a pair of contact guide pins 4 3 6 provided on both sides of the picker 4 3 1 is inserted into the contact guide plate 4 6 0 installed in the test head 4 9 0. Contact guide pin 4 6 1. Here, even when the contact guide pin 436 is inserted into the contact guide pin hole 461 of the contact guide plate 460, due to the assembly error of the contact picker assembly 430, a certain number of vacuum pads 433 may not be reliably Connecting to the recessed portion 491 'causes a bad connection. However, according to the present invention, the corresponding vacuum pad 433 compensates the position error, and the semiconductor device 60 can be reliably connected. For example, as shown by the two dotted lines in FIG. When the recessed portion 491 is incorrectly inserted, the vacuum pad 433 movably connected to the pick-up member 32a moves and adjusts its position to the position originally desired in the recessed portion 491 (as shown by the solid line in FIG. 16). As a result, possible bad connections can be avoided. After the semiconductor device 60 is connected to the recess 491 for a predetermined time, the contact picker assembly 430 rises to the initial test position through the perforation 23 of the container 20. After that, the contact pick-up assembly 43 is lowered, and the semiconductor device 60 which has completed the test is loaded into the container 20 which has returned to the original test position. 17 ', 17B and 18, in accordance with the present invention

466567 V. Description of the invention (32) The test operation in the test room of the RAMBUS program processor of structure-structure will be explained in more detail. 'Figures 17 A and 17 B are front views showing semiconductor devices 60 that are attracted by a pick-up device and connected to test recesses, respectively. Figure 8 is a flowchart explaining a method for testing a semiconductor device 6 in a test chamber of a RAMBUS processor of the present invention. 0 First, a plurality of semiconductor devices 60 are semiconductors that are lifted by the semiconductor device loading section 200 and stacked on each device. The device receiving hole 22 (step S100). The container 2o on which the semiconductor device 60 is stacked is moved to the test room 400 of the RAMBUS processor through a predetermined set of roads and stopped at the initial position of the test head 490 of the test room 400 (step. When the container 20 is stopped at When the test head 90 is above, the picker 431 above it is lowered and sucks a certain number of semiconductor devices 60 (step si20). After picking up the semiconductor device 60, the picker 431 rises to the initial test position_ "When the picker rises, the container conveying device 450 moves the container 20 from the initial test position at a distance corresponding to half the interval of the perforation 23 of the volume = 20 so that the perforation 23 of the trough 20 is aligned with the ascending path (step sl30) After that, the picker 431 is lowered to the test recess 2 through the perforation 23 of the container 20 and the semiconductor device 60 is inserted and electrically connected to the test recess step m 2 i. Here, because the picker 431 is powered by the shock absorbing device Connecting $ ^ &, the semiconductor device 60 can be connected to the recess 4 91 and the lead 4 92 with a uniform pressure. Then, the test process is performed (step s 15). When the test is completed, the semiconductor device 6 is picked up 〇 picked up 431 via

466567 V. Description of the invention (33) The perforation 23 of the passenger 20 is raised to the initial test position. After the picker 431 is raised to the initial test position, the container 20 returns to the initial test position (step S160). When the container 20 returns to the initial test position, the picker 431 is lowered and the semiconductor device 60 is stacked on the receiving hole 22 of the container (step S1 70), and raised to the initial test position (step S1 80). After all the desired containers 20 have passed the test procedure, the above procedure is repeated. As described above, in the RAMBUS program processor of the present invention, a container 20 having a plurality of receiving holes 22 and a plurality of perforations 23 (between the receiving holes 22) is used. First, the picker 431 sucks a certain number of semiconductor devices 60 from the container 20, and conveys the container 20 at a distance of half the interval with respect to the perforation 23, so that the perforation 2 3 of the valley device 20 is aligned with the recess of the test head 4 9 0 4 91. Then, the picker 431 is lowered to the recessed portion 491 via the perforation 23 of the trough 20, and the semiconductor device 60 picked up by the picker 431 is directly connected to the recessed portion 49m. Although the preferred embodiment is described for the test area array Configuration (such as BGA or CSP type) semiconductor device 60-device and method, the present invention can also be applied to the type device (which has a plurality of electrodes protruding from the two sides of the package). FIG. 19 shows a main part of a test chamber which has been partially modified to test a RAMBUS program processor of a TS0p semiconductor device. The electrode disposed in the concave portion 4 9 Γ bis. Connected to the pick-up pressing member 4 3 3, a, used to press the semiconductor in the half-recessed part as shown in Figure 19 'connecting lead 4 9 2, side side' configuration is the same as the vacuum at the end of the semiconductor device 70 Pad 433 'has a non-conductive conductor device 70 connected to it by a vacuum pad 433'

466567 V. Description of the invention (34) Equipped with 70 electrodes. Since the structure and operation of other components have already been described, repeated descriptions are omitted. Therefore, not only the BGA or CSP type semiconductor device 60, but also the TSOP or semiconductor device 70 can be directly modified by being partially connected to the test recess and automatically tested. As described above, according to the present invention, , RAM bus program processor can automatically test RAMBUS type semiconductor devices, such as BGA or CSP type semiconductor devices. '' Further, according to the present invention, even when the interval of the receiving holes is changeable during pick-up and placement of the semiconductor device, the cam follower as the guide projection is guided through the guide groove of the interval adjusting plate. And adjust the interval between individual cylinders to avoid cumulative errors. Further, since the present invention is in the same semiconductor device ', the work efficiency of the pick-and-place operation test equipment can be reduced. Time to pick up and place for sixteen time, and improve phase measurement step 1 at the same time. According to the present invention, even when the position of the vacuum pad is changed from the original contact error of the assembly of the picker assembly, etc., it is possible to prevent the spot of the semiconductor device from standing. f touches the recess. Performance, and at the same time improve the reliability of the test. Anyone who has a bad connection may be used. Although those skilled in the preferred embodiments of the present invention will understand that the scope of the present invention will be shown and described without departing from these embodiments. The principle and spirit of this technique can be changed. This is determined by the scope of patent application and its equivalent.

4 6 6 5 6 7 V. Description of Invention (35)

1IHI Page 39 466567 Brief Description of Drawings Γ Brief Description of Drawings] Fig. 1 is a perspective view showing a RAMBUS program processor according to a preferred embodiment of the present invention. FIG. 2 is a perspective view showing the user tray of FIG. 1. FIG. FIG. 3 is a perspective view showing a semiconductor device classification section of FIG. Fig. 4 is a diagram showing a semiconductor device in Fig. 丨 muscle "program transmission path. Fig. 5 is a perspective view showing a diagram! Single-row interchangeable machine Figs. 6A and 6B are single-row interchangeable machines shown in Fig. 5 Diagrams of various intervals between the sum of arms, of which FIG. 6A shows a narrowed interval. Rounded branches show a widened interval. Θ ′ and FIG. 6B. The detailed display of the preferred embodiment is shown in FIG. 8 and FIG. 7 FIG. 8 is a perspective view showing a dual-row interchangeable machine, and FIG. 8 is a perspective view roughly showing a test chamber of the RA BUS program processor of the present invention. FIGS. 9A and 9B are front and rear views, respectively, of the structure of the test room. Fig. 10A, Fig. 10B and Fig. 10c show the dipping of the container of the present invention. Fig. 10A is a plan view, and Fig. 10B and Fig. 10c are along the I-I and I-I lines. Sectional view of II. Fig. 10 Line A, Fig. 1 U, and Fig. 11B are plan and sectional views, respectively, showing the recesses in the test head of the eighth invention test room. Π is used in Fig. 12A and Fig. 12B are plan views, respectively. And a sectional view showing the structure of the contact guide plate of the test chamber. Figure 1 3A, Figure 1 3B of the present invention FIG. 1 3C are respectively a front view system, hemp now facing a bottom view and a side _

Page 466567

Fig. 14 shows the shape β of the vacuum pad of the present invention. Figs. 14A and m4B are sectional views in the X and γ directions, respectively, showing a semiconductor device picked up by the invention by contacting a pick-up assembly. 15A and 15B are cross-sectional views in X and Υ directions, respectively, of a semiconductor device connected by a contact picker of the invention. Fig. 16 is an enlarged cross-sectional view showing the main part of the preferred embodiment of the present invention, that is, the vacuum pad of the contact pickup assembly connected to the test recess. Figures 17A and 17B are front views showing the semiconductor devices classified by the pick-up and connected to the test recess. Fig. 18 is a flowchart for explaining a method for testing a semiconductor device in a test chamber of a ramms program processor according to the present invention. Fig. 19 is a cross-sectional view for explaining a main part of a modification of the present invention 'wherein a TSOP type semiconductor device is connected to a test recess developed to test a TS0P type semiconductor device. [Illustration of Symbols] 1 Main frame 10 Tray 100 User tray stacker 110 Tray rack 110a Tray rack 110b Tray rack 110c Tray rack

Page 466567

Schematic description on page 42 1Π Guide bar 120 Tray fixing plate 121 Cylinder 130 Tray robot 131 X-direction axis 133 Vertical axis 135 Grabber 2 Base plate 20 Container 200 Semiconductor device loading section 21 Square body 210 Interchangeable robot arm 22 Receiving hole 220 Loading robot 22a Second tilt guide 22b Second hard stop contact 23 Perforation 230 Semiconductor device buffer 241 Robot arm frame 242 First guide rod 244 Second guide rod 246 First drive portion 248 Second drive Section 25 Grab hole 466567 Simple illustration of the drawing 2 5Ό First ascending guide 2 5 2 Linear motion block 254 Linear motion guide 260 Rise guide 270 Width adjustment device 272 Pneumatic cylinder 274 Linear motion block 276 Linear motion guide 278 Sub frame 280 First interval adjustment plate 28 0a Guide groove 282 Pick up block 283 Pick up cylinder 284 Guide protrusion 2 8 6 Pick up cylinder _ 288 Pick up cylinder 2 9 0 Second gap guide plate 2 9 2 Pick up block 296 Pick up Pick up cylinder 298 Second pick up cylinder 298 Pick up cylinder 3 0 0 Heating / cooling chamber 32a Pick up member 40 0 Test Room

Page 466567 Brief description of drawings 411a Third tilt guide 411b Third hard stop contact 43 43 Contact picker assembly 431 Picker 432 Pickup member 432a Vacuum interval 433 Vacuum pad 433'a Pressing member 433a First tilt guide 433b First hard stop contact 4 3 4 Rising plate 435 Compression coil spring 436 Contact guide pin 437 Vacuum hose 438 Vibration absorbing device 438a First vibration absorbing plate 438b Second vibration absorbing plate 438c Connecting rod 438d Compression Coil spring 440 lifting device 441 engine 442 pinion 44 3 rack 443a rack

Page 44 4 6 6 5 6 7 Brief description of drawings 44-4 Guide section 444a Guide shaft 444b Guide bushing 445 Frame 450 Container transfer device 451 Grab member 452 Pivot section 452a Stick rod 45 2b Pivot block 452c Pneumatic Cylindrical 4 5 3 Drive 4 5 3a Engine 453b Ball screw 4 5 3c Ball nut 453d Connecting member 460 Contact guide plate 461 Square body 462 Recess exposed hole 463 Contact guide pin hole 490 Test head 491 Recess 491a Third tilt guide 491b Third hard stop contact 492 Connecting lead

Page 45 466567 Brief description of the drawing 5 0Ό Recovery room 60 Semiconductor device 6 0 0 Semiconductor device classification section 610 Container transfer shaft 611 Engine 612 Ball screw 613 LM guide 620 Single-axis robot 630 Transfer buffer 631 Transfer board 640 Machinery Arm 641 Robot arm frame 642 Guide 6 42 Guide rod 644 Pick-up block 646 Guide projection 648 Space adjustment plate 648a Guide groove 6 50 Drive device 6 5 2 Column 6 6 0 Guide device 662 Movement block 6 6 4 Motion guide 70 semiconductor device

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Claims (1)

466567 6. Scope of patent application 1 / A RAMBUS program processor includes: a user tray stacker for stacking user trays loaded with semiconductor devices for testing, placing the user trays one by one & A semiconductor device supply position, an empty user tray is placed at a semiconductor receiving position, the empty user tray accommodates the tested semiconductor device, and a user tray loaded with the tested semiconductor device is stacked; a semiconductor device loading The section 'it has a double-row exchangeable robotic arm for picking up a semiconductor set in a user tray at a semiconductor supply position' and placing the semiconductor device in a container located at a semiconductor device loading position; a heating / Cooling chamber 'which heats or cools the semiconductor device according to the test requirements' and simultaneously lowers and unloads the container through the lower opening in the order of receiving the container from the semiconductor device loading section through the upper opening; a test room for connecting the heated or cooled The semiconductor is inserted into the recess of the test head and the semiconductor device is tested; A recovery room for recovering the temperature of the semiconductor device to a normal level, and at the same time, receiving the contents of the test room through the lower end of the test room, improving and unloading the containers through the upper end; A changeable robotic arm is used to pick up and test the body device from the container in accordance with the order of the containers released from the recovery room, and to stack semiconductor devices in a plurality of units corresponding to the body devices of each level classified by the test results. A predetermined area of a transfer buffer; and a 1U semiconductor device unloading section for stacking semiconductor devices to respective levels Ιϋ ^ Page 48 4 6 6 5 6 7 The RAMBUS program processor described in item ^ of the semiconductor device loading range of the user tray for the transmission buffer semi-conductor device, wherein the dual-axis loading robot on the robot arm is used above; And, the type robot arm is at the user's tray or semiconductor loading position. The body device semiconductor device buffer 11 'is used to temporarily hold a spare semiconductor t such as •. The RAMBUS program processor described in item 1 of the patent application scope, wherein the mother-single-row interchangeable robotic arm includes: a robotic arm frame; a guide rod placed on the robotic arm frame; and a plurality of pick-up blocks, It is inserted by the guide rod and slides on the guide rod; The frame-to-frame and arm-to-frame machines are equipped with a number of pairs of blocks. Shaoxijia and rod-mounted full-guided transformers are changed to take off or land. 4. If the scope of the patent application is the third item In the RAMBUS program processor, the pickup block interval adjusting device includes: a guide projection protruding from a plurality of pickup blocks; a gap adjustment plate provided with a plurality of guide grooves to receive the guide projections; And the guide protrusion on the end of the guide groove indicates the Page 49 466567 VI. Narrow gaps between patent applications 'At the same time, the guide slot on the opposite end indicates a wider gap between the pick-up blocks; the drive device' is used to raise and lower the gap adjustment plate; and ascent The guide device 'is provided on the robot arm frame, and is used for guiding the ascending / descending of the interval adjusting plate. 5. The RAMBUS program processor according to item 4 of the scope of patent application, wherein the ascending guidance device includes: a linear motion guide placed on a mechanical arm frame; and a linear motion block placed on an interval adjustment plate. 6. The rambus processor according to item 3 of the scope of patent application, wherein the pick-up block includes a pick-up cylinder attached to the pick-up cylinder for picking up and placing the semiconductor device. 7. The RAMBus program processor according to item} of the patent application scope, wherein each double-row interchangeable robotic arm includes: 〃 a robotic arm frame; a first guide rod placed on the robotic arm frame; The plurality of pick-up blocks inserted by the first guide rod and sliding on the first guide rod; the second interval adjusting device changes the first-guide rod and the plurality of pickups by raising or lowering relative to the robot arm frame. The interval between the blocks; the width adjusting device installed on the frame of the robot arm; Page 50 466567 6. The scope of patent application: 'a second guide bar placed on the width adjustment device; a number of pick-up blocks inserted through the second guide bar and sliding on the second guide bar; and The two-space adjustment device is used to change the distance between the second guide rod and the plurality of pick-up blocks by being lowered relative to the robot arm frame. 8. The rAMBUS program processor according to item 7 in the scope of the patent application, the first and second interval adjusting devices include: a guide protrusion protruding from a plurality of pick-up blocks; first and second interval adjusting plates There are a plurality of guide grooves for receiving the bows of the guide grooves, so that the bows located on one end of the guide grooves can not guide the narrow gaps between the pick-up blocks and simultaneously guide the guides. The protrusions on the recesses_protrusions indicate the wider interval between the pick-up blocks; and the other ~ the interval adjustment; and the second drive " for raising and lowering the first and second spaces 9 as above Taijijia asks for the RAMBUS program processor described in item 7 of the patent scope. Fu Shi's rr device contains the first ascending guide device, which is installed on the machine: two interval adjustment plates ascending ...; and ΐ on the device 'for Raise or lower the second interval adjustment plate. , The old program processor described in item 7 of the patent scope of Ling Bao P t kiss, its T width adjusting device includes: 狂 汁 处 " 466567 6. Scope of patent application Pneumatic pillars are installed on the arm frame; the last width adjustment bracket is connected to one of the rod ends of the pneumatic round cylinder and the first linear motion block. Most of the linear motion guides on the width adjustment bracket are installed on the robot arm frame in a vertical relationship for guiding the linear block. 11. If the test chamber of Shenzhong is set up to carry a large number of conductor devices, it will move up to the recessed part from the head of the container. The container will be tested from the initial test. The processor includes: a Dan test head, provided with a plurality of test recesses, in which a test is inserted; a Ding piping device, provided with a plurality of receiving holes for receiving a semiconductor device, and a plurality of perforations between the receiving holes. Transport the majority to the beginning test position above the test head; touch the picker assembly, which is placed above the test head and will be vertical. The contact picker has a buffer device i, and the contact picker picks up the semiconductor device and Directly connect the semiconductor device to the test device for vertically moving the contact picker assembly; and: the special delivery device 'for moving the trough device at a distance of 3 positions at a distance of one and a half of the container receiving hole, so that the container reaches a place so that the The contact picker assembly can be lowered through the perforation of the container to Page 52 46 65fi ^ VI. Patent application scope 12 \ The RAMBUS program processor described in item n of the patent application scope, wherein the contact picker assembly includes: a plurality of pickers, with four rectangular pickers Component, a vacuum pad is provided on the end of the picker component for sucking semiconductor devices;-a riser plate for the majority of pickers in the branch building, so that the plurality of pickers simultaneously suck and directly connect a predetermined number The semiconductor device to the test recess; and a vibration absorbing device provided between the rising plate and the pick-up device, which is used to absorb and release vibration when the semiconductor device is connected to the test recess by the pick-up device. 13. The RA0us program processor described in item 丨 丨 of the patent scope, wherein the vibration absorbing device comprises: a first absorbing plate connected to the upper part of each picker; a second absorbing plate connected to To the rising plate corresponding to the first vibration absorbing device; a plurality of connecting rods for connecting the first and second absorbing plates, and the connection manner is such that the first absorbing plate is within a specific range relative to the second absorbing plate The system is movable; and a plurality of compression coil springs 'which are placed around a plurality of connecting rods' are used to elastically support the first absorption plate on the second absorption plate. 14‘The RAMBUS program processor according to item 11 of the scope of patent application, wherein the contact pick-up assembly raising device comprises: 'an engine mounted on a contact pick-up assembly Page 53 4 6 6 5 6 7 The upper side of the frame; a pinion gear that meshes with the shaft of the engine; a rack bar that protrudes from the center of the contact picker assembly through the frame; the rack has a rack bar that meshes with A pinion in the longitudinal direction for vertical movement when the engine is operating; and a guide device for guiding the ascending / descending of the pickup assembly. 15. The rambus (R) according to item 14 of the scope of patent application, the guide device comprises: a pair of guide shafts' two self-contacting picker assemblies, two upper sides of which protrude upward and pass through the frame; and a pair of guide bushes It is provided on the frame for movably supporting the guide shaft. 16. The RAMBUS program processor according to item 11 of the patent scope, wherein the container conveying device comprises: a grasping member which is pivoted near the container, and is selectively inserted into the grasping opening provided on one side of the container. Taking a hole for holding the container; a pivoting part for pivoting the grasping member until the grasping member is inserted into the grasping hole; and for linearly moving a driving part with the assistance of the pivoting part The holding member β 17 ′ holding the container is a RAMBUs program processor described in item 16 of the scope of patent application, which 466567 6. Scope of patent application The pivoting part includes: a pivoting rod 'for pivotally supporting the grasping member; a pivoting block' which is connected to one end of the pivoting rod; and a pneumatic cylinder for pivoting Pivot block. 18_ The RAMBUS program processor described in item 16 of the patent scope, wherein the driving part includes: an engine; a ball lead screw, coupled to the shaft of the engine; a ball nut 'meshed to the ball lead screw, in The ball lead screw moves linearly as it rotates; and a connection member 'for connecting the ball nut and the pivot part. 19. The RAMBUS program processor according to item 丨 丨 of the patent scope, wherein the test recess has a connection lead configuration for testing a BGA or CSP type semiconductor device. 2 0. The RAMBUS program processor described in item 丨 丨 of the patent scope, wherein the test recess is provided with a connecting lead to test a TS0p type semiconductor device; and a non-conductive pressurizing member 'which is provided in the contact pickup The lower end of the starter assembly is used to add the connection lead from the electrode of the TSOP semiconductor device to the test recess when the TSOP semiconductor device is connected to the test recess. 21. The RAMBUS program processor according to item π of the patent application scope, which 466567 The test room contains: the pick-up position guides the setting, and when used, it is used to contact the correct position in the pick-up receiver receiving hole; the lowering guide device, when contacting the pick-up hammer, the oil t β is °°, 'When the part is lowered, it is used to guide the contact to pick up Is. * Semiconductor mounting earthen cart $ .a, μ is connected to the test recess connection guide device. When contacting the buckle μ and the test recess, use Attach the lead hammer to connect the thousand-conductor device to guide the vacuum pad contacting the pick-up assembly to the salute position. 22. The RAMBUs program processor according to item 21 of the Chinese Patent Application, wherein the pick-up position guidance device includes: "first and second tilt guides, which are oppositely formed on the left and right sides of the vacuum pad and the semiconductor The two sides of the device receiving hole are used to guide the vacuum pad to move in the χ_ direction in the semiconductor device receiving hole; and the first and second hard stop contact portions with a specific radius of curvature are formed in front of the vacuum cavity and The rear side is formed on both sides of the receiving hole of the semiconductor device and is used to guide the vacuum pad to move in the direction of the receiving hole of the semiconductor device. 23. The RAMBUS program processor according to item 21 of the patent application scope, wherein The guide includes: a plurality of pairs of contact guide pins integrated into a contact picker assembly; and Page 56 46 656 6. Scope of patent application A contact guide plate is provided on the upper part of the test head and has a contact guide pin hole corresponding to the contact guide pin. 24. The RAMBUS program processor according to item 21 of the patent application scope, wherein the connection guide device includes: a second tilt guide portion provided on both sides of the test recess corresponding to the first tilt guide portion of the vacuum pad On the wall for guiding the movement of the vacuum pad in the χ_ direction; and a third hard stop contact portion, which is provided on both sides of the test recess corresponding to the first hard stop contact portion of the vacuum pad, for guiding the vacuum Pad of Υ-direction of movement. 25. The RAMBUS program processor according to item 1 of the scope of patent application, wherein the semiconductor device classification section includes: a trough transfer shaft for transferring the container forward and backward (in the γ direction) and stopping the container at the semiconductor device adsorption position ; A plurality of single-axis robots 'which use a single-row exchangeable robotic arm to pick up semiconductor devices from a container' and place the semiconductor devices in a predetermined area of a multi-action buffer according to the test results; and two moving buffers Device for carrying a semiconductor device from a container and a conductor device unloading section. 26. The RAMBUS program processor according to item 1 of the scope of patent application, wherein the semiconductor device unloading section includes: ^ 466567 6. Patent application scope-a dual-axis unloading robot with a plurality of pick-up cylinders attached Pick up his head. 111 Page 58