JPH09175647A - Semiconductor device conveyance and process device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC handler which can give sufficiently long heat suction time or cool section time to an IC to be tested. SOLUTION: Recessed sections 5 for positioning for circular arrangement are formed in N row coaxially on a turn table 4. An IC to be tested which is stored in a tray is supplied sequentially into the recessed sections 5 for positioning for recessed section arrangement for positioning at outermost periphery or innermost periphery at an IC loading position. Every time the IC to be tested turns by one revolution in accordance with the rotation of the turn table 4, it is transferred to the other recessed section 5 for positioning of the recessed arrangement for positioning at the above IC loading position. After the IC to be tested is loaded in the above tray at the above-mentioned loading position and is turned by one revolution at least, a scope of angle from the loading position to a position where it is fed to a test section 7 is further moved to feed it into the test section 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit element (hereinafter referred to as IC) which is a typical example of a semiconductor device.
IC test device (generally IC
A semiconductor device transfer processing apparatus (generally called an IC handler) suitable to be used for transferring an IC to a test section in a tester) and carrying out a tested IC from the test section for classification processing. In particular, regarding semiconductor devices to be tested,
The present invention relates to a semiconductor device transport / processing apparatus capable of being exposed to a predetermined temperature atmosphere for a sufficiently long time, and a semiconductor device transport / processing method used in this apparatus.

[0002]

2. Description of the Related Art FIG. 3 shows a schematic configuration of an example of a conventional semiconductor device transfer processing apparatus called a horizontal transfer system (hereinafter referred to as an IC handler). A plurality of tray groups 2 storing ICs are arranged along a lower side 1A in the drawing of a base 1 which is a base. Each tray group 2A to 2E is composed of a large number of trays stacked vertically,
The leftmost tray group 2A in the figure is at the position of the loader unit. An IC to be tested (IC to be tested) is placed on the tray group 2A of the loader section.

From the uppermost tray of the tray group 2A arranged in a stack, the transfer arm 3 sets the IC 1 in this example.
They are individually carried out and transported to a turntable 4 called a soak stage. On the turntable 4, in order to define the position for receiving the IC, positioning recesses 5 each having four sides of a substantially square shape surrounded by inclined surfaces facing upward are formed concentrically in one row at equal angular intervals. For example, in the example shown in the figure, the carrier arm 3 drops one IC into each of the positioning recesses 5 each time the carrier arm 4 rotates clockwise by one pitch.

[0004] 6 is an IC carried on the turntable 4
Shows a contact arm for sending the contact arm to the test section 7. The contact arm 6 adsorbs and takes out one IC from each positioning recess 5 of the turntable 4, and conveys the IC to the test unit 7. The contact arm 6 has three arms. The three arms rotate to sequentially feed the ICs to the test unit 7, and to deliver the ICs that have been tested by the test unit 7 to the transport arm 8 on the outlet side. To do.
The turntable 4, the contact arm 6 and the test section 7 are housed in a temperature-controlled room (chamber) 9 and
The test is carried out while C is kept at a predetermined temperature in the temperature-controlled room 9. That is, the inside of the temperature-controlled room 9 is controlled to an appropriate temperature of high temperature or low temperature, and a predetermined temperature stress can be applied to the IC under test.

[0005] The IC taken out by the transfer arm 8 on the exit side
Are sorted and stored in any of the three tray groups 2C, 2D, and 2E in this example, which are arranged in the unloader section according to the test results. For example, a defective IC is stored in the tray of the rightmost tray group 2E, a good IC is stored in the tray of the left tray group 2D, and an IC requiring retesting is stored.
Is further stored in the tray of the tray group 2C on the left side. These separations are performed by the carrier arms 10 and 11. The second tray group 2B from the left shows an empty tray group arranged in the buffer section for accommodating the trays empty in the loader section. This empty tray group is carried to the top of the tray groups 2C, 2D, and 2E of the unloader unit when the stacked uppermost trays are full, and is used for storing ICs.

In the above IC handler shown in FIG. 3, one row of concentric positioning recesses 5 for defining an IC receiving position is formed on the turntable 4 in a concentric pattern at equal angular intervals, and the turntable 4 is rotated clockwise. Each time the carrier arm 3 rotates by one pitch, one IC is dropped into each positioning recess 5, but as shown in FIG. Two rows of concentric circles are formed at angular intervals, and two ICs to be tested are transported from the tray of the loader section by the transport arm 3 at a time, and two rows of the turntable 4 are rotated each time the turntable 4 rotates by one pitch. The transfer arm 3 in the two positioning recesses 5 of
An IC handler configured to drop two ICs each from is also in practical use. The IC handler shown in FIG. 4 is
The contact arm 6, the transfer arm 8 on the outlet side, and the carrier arm 10 are similarly configured to transfer two ICs at a time, and the test unit 7 can transfer two ICs at a time.
Since the IC handler has the same configuration as that of the IC handler shown in FIG. 3 except that the IC to be tested can be tested, corresponding parts are designated by the same reference numerals and their description is omitted.

[0007]

In the IC handler shown in FIGS. 3 and 4, the IC under test is the turntable 4
Is placed on the turntable 4 at the angular position A, and is sent from the turntable 4 to the test unit 7 by the contact arm 6 at the angular position B. During this time, an angle range of about 240 ° is placed on the turntable 4 and moved, and the temperature of the IC is raised (or lowered) to the temperature in the temperature-controlled room 9 while moving in this angle range.

Normally, the positioning recesses 5 are formed concentrically on the turntable 4 at a pitch (angle interval) of about 12 °, so that the concentric positioning recesses 5 are formed as shown in FIG. 20 positioning recesses 5 are arranged in the range of 240 ° regardless of whether it is a row or two rows as in the case of FIG. Although the test time of the IC in the test unit 7 is a relatively short time of about several seconds, the test unit 7 has a short moving distance from the angular position A to B.
When the turntable 4 is rotated in synchronism with the test cycle in, the angular position A
In some cases, the target temperature inside the temperature-controlled room 9 may not be reached within the time period from moving from B to B. Therefore, although the test in the test section 7 is completed, there may be a case where it is necessary to wait until the IC rises (or falls) to a predetermined temperature, and as a result, the time required for the test becomes long. There is a drawback that it will end up.

An object of the present invention is to expose a semiconductor device to be tested to a temperature atmosphere for a sufficiently long period of time, so that the turntable is rotated in synchronism with a test cycle in a test section, Provided is a semiconductor device transport / processing apparatus capable of repeating a test of a semiconductor device under test at a test cycle of a test section.

[0010]

According to the present invention, there are arranged concentric N-row (N is an integer of 2 or more) circular positioning recesses formed concentrically on the turntable, and the N-row positioning recesses. First transport means for sequentially feeding the semiconductor devices under test stored in the tray from the tray into the positioning recesses of at least one of the circular arrays of recesses at the semiconductor device loading position, and the semiconductor device loading. At each position, each time the semiconductor device under test housed in each positioning recess is rotated once by the rotation of the turntable, the semiconductor device under test is emptied at the semiconductor device loading position to obtain another circular shape. The means for transferring to the positioning recesses of the array and the positioning recesses that became empty due to the above device transfer Means for sequentially feeding the semiconductor device under test from the tray, and feeding the semiconductor device to the test section when the semiconductor device under test rotated at least once is moved from the semiconductor device loading position to the vicinity of the test section. Provided is a semiconductor device transport processing apparatus including a second transport means.

Further, according to the present invention, at least one of the N-shaped circular array positioning recesses formed on the turntable is positioned in the positioning recesses at the semiconductor device loading position from the tray. When the semiconductor device under test is rotated by the above turntable,
Each time the semiconductor device under test is rotated, the semiconductor device under test is transferred to a positioning recess of another circular array that has arrived in an empty state, and the semiconductor device is moved to a positioning recess that has become empty by the transfer of the device. At the loading position, a step of sequentially feeding a new semiconductor device under test from the tray, and when the semiconductor device under test rotated at least one rotation is moved from the semiconductor device loading position to the vicinity of the test unit, Provided is a semiconductor device transportation / processing method, which comprises the step of sending the semiconductor device to the test section.

According to the semiconductor device transporting / processing apparatus of the above-mentioned claims 1, 2, 4, 5 and 7, and the semiconductor device transporting / processing method of claims 8 and 9, the semiconductor device under test is a semiconductor device. At least one revolution after being placed on the turntable in the loading position,
After that, the semiconductor device is moved from the loading position of the semiconductor device by a predetermined angle and sent to the test unit. Therefore, the time obtained by adding the movement time for at least one rotation to the movement time for the predetermined angle to reach the test portion can be used to apply the predetermined temperature stress to the semiconductor device under test. Since the added moving time for at least one rotation is longer than the moving time for a predetermined angle from the semiconductor device loading position to the test section, the time to be tested is at least twice as long as that of the conventional device. Can be used to raise or lower the temperature to a predetermined temperature. Therefore, since the semiconductor device under test can be given sufficient heat absorption or cooling time, no problem occurs even if the turntable is rotated following the test cycle in the test section. The test time can be shortened.

Further, according to the semiconductor device transporting / processing apparatus of the third and sixth aspects, the depth of the positioning concave portion to be transferred after the semiconductor device under test makes one rotation is positioned first. Since it is formed deeper than the depth of the recess for use, it is possible to make the vertical distances of the plurality of suction heads that suction-hold the semiconductor device under test the same, which improves workability and facilitates control. Further, since the semiconductor device under test sucked and held from each suction head can be dropped at the same distance into the positioning recess, not only can the semiconductor device under test be accurately positioned, but also the semiconductor device under test can be accurately positioned. It is possible to prevent the lead pin (terminal) from being deformed or damaged. Further, since the turntable is a large heat source or cooling source maintained at the temperature in the temperature-controlled room as compared with the semiconductor device under test, the turntable is not included in the semiconductor device under test housed in the deep positioning recess of the turntable. The heat or cold of the table is conducted well. Therefore, it is further ensured that the semiconductor device under test is heated or cooled to a predetermined temperature.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the preferred embodiments of the present invention shown in FIGS. In the following embodiments, an IC, which is a typical example of a semiconductor device, will be described as an example, but the present invention can of course be applied to an apparatus for transporting and processing semiconductor devices other than ICs.

FIG. 1 shows a first IC handler according to the present invention.
2 shows a schematic configuration of the embodiment. In this embodiment, a large number of positioning recesses 5 are formed on the turntable 4 in two concentric circles at equal angular intervals. However, the positioning recesses 5 may be arranged in two or more circular arrays. Needless to say. When two circular arrays of a large number of positioning recesses are concentrically formed in two rows, two suction heads are attached to the transfer arm 3 in correspondence with the number of circular arrays of the positioning recesses. That is, in this embodiment, suction heads 3R and 3F for sucking and transporting the IC under test by, for example, a vacuum suction action are provided on the front end side and the front side of the transfer arm 3, respectively.

ICs to be tested are picked up one by one from the uppermost tray of the tray group 2A of the loader section by the suction head 3F provided on the front side, and at the angular position A on the turntable 4 which is the IC loading position, the turntable is turned on. The IC to be tested adsorbed and held in one positioning recess 5 of the outer array 5A of the two circular arrays of positioning recesses concentrically formed in 4 is dropped. The suction head 3F
When picking up the IC under test from the uppermost tray on the tray group 2A, the suction head 3F is moved downward with the transfer arm 3 stationary, and the suction surface is brought close to the IC under test to suck the IC under test. IC to be adsorbed
When the IC is dropped into the positioning recess 5 at the IC loading position A, the suction head 3F is moved downward while the transfer arm 3 is stationary, and the IC to be tested is discharged close to the bottom surface of the positioning recess 5. The operation of the other suction head 3R is similar.

The turntable 4 makes one round and all the positioning recesses 5 of the outer positioning recess array 5A are tested.
When C is placed (that is, when it is full), the suction head 3F picks up the IC to be tested from the tray group 2A, and the IC of the turntable 4 together with the suction head 3R in an empty state. Although it is moved to the loading position A, first, the outer positioning concave array 5 is added to the empty suction head 3R.
The IC to be tested, which has come around one round from A, is sucked, and then the suction head 3R suction-holding the IC to be tested is moved onto the positioning recesses 5 of the inner positioning recess array 5B. At this time, the suction head 3F holding the IC under test from the tray group 2A moves to the now empty positioning recess 5 of the outer recess array 5A.

As shown in FIG. 2, the suction heads 3R and 3F are arranged on the transfer arm 3 at intervals matching the diametrical interval PY between the concentric recess arrays 5A and 5B. Therefore, the suction head 3R on the tip side is located above the positioning recess 5 of the inner recess array 5B, and the suction head 3F on the front side is located above the positioning recess 5 of the outer recess array 5A. The IC to be tested can be dropped into the positioning recess 5 of FIG. However, the spacing between the suction heads 3R and 3F is not always the same as the concentric concave portion arrays 5A and 5B.
Does not have to match the diametrical spacing PY. Interval PY
When the distance between the suction heads 3R and 3F is larger, the IC to be tested coming around the outer positioning recessed array 5A for one round is sucked onto the empty suction head 3R, and then a new IC to be tested is attached. The suction head 3F for suction holding is moved onto the positioning recesses 5 of the outer positioning recess array 5A to drop the IC under test, and then the IC under test from the outer positioning recess array 5A is suction held. Suction head 3
R is a positioning recess 5 of the inner positioning recess array 5B.
The IC to be tested may be dropped by moving the IC under test.

Each IC to be tested is provided with a positioning recess 5
Then, the transport arm 3 returns to the uppermost tray of the tray group 2A again, and the suction head 3F moves the tray group 2 to the tray group 2A.
One IC to be tested is adsorbed from A. After that, the transport head 3 moves the empty suction head 3R onto the positioning recesses 5 of the outer recess array 5A on the turntable 4. During this time, since the turntable 4 is rotated by one pitch, when the empty suction head 3R returns to above the positioning recess 5 located at the IC loading position A of the outer recess array 5A, the empty suction head 3R is removed. The next IC to be tested, which has been placed on the turntable 4 and has gone around once, has arrived underneath.

Therefore, the suction head 3R is the IC to be tested.
And the suction head 3F for adsorbing and holding the IC to be tested from the tray group 2A and advancing by the distance PY, and dropping the ICs respectively retained in the positioning recesses 5 of the inner and outer recess arrays 5B and 5A. (State of FIG. 2). By repeating this operation, the ICs under test can be sequentially transferred from the outer concave array 5A and placed in the inner concave array 5B.

When the head of the IC under test transferred to the inner concave array 5B reaches the angular position B for sending the IC under test to the test section 7, the contact arm 6 picks up the IC under test from the inner concave array 5B. Then, the IC under test held by suction is conveyed to the test section 7. Here, the contact arm 6 electrically contacts the suction-held IC under test with a contact pin (socket) of the IC tester arranged in the test unit 7 and when the suction-held IC under test is tested by the test unit 7. In some cases, it may be transported on the transfer table. Tested ICs that have completed the test in the test section 7
Is transferred to the transfer arm 8, and the tray group 2 of the unloader section is transferred from the transfer arm 8 through the carrier arms 10 and 11.
It is sorted into C, 2D, and 2E based on the test result data and stored.

As shown in FIG. 2, the positioning recesses 5 of the circular recess array 5B inside the turntable 4 are formed deeper than the positioning recesses 5 of the outer recess array 5A. The suction head 3F for sucking and holding the IC under test from the tray group 2A is stopped at a position higher than the surface of the turntable 4 by a predetermined distance as shown in FIG. Drop into 5. This is because accurate positioning cannot be performed unless the IC to be tested falls naturally over a certain distance, and when the suction head 3F approaches the positioning recess 5 too much, the IC to be tested is too close.
This is because the lead pins (terminals) contact the tapered wall of the recess 5 and are deformed or damaged. On the other hand, from the viewpoint of workability, it is preferable that the suction heads 3F, 3R have a short ascent / descent distance, and the same ascent / descent distance is preferable for simplifying control. Therefore, in this embodiment, the lifting distance of the suction head 3F is determined by the tray group 2 of the loader unit.
It is set to be the same as the ascending / descending distance when the IC to be tested is suction-held from A.

On the other hand, the suction head 3R, as described above, has been rotated by one turn from the outer array 5A to be tested IC.
Is picked up, and the IC sucked and held in the positioning recess 5 of the inner array 5B is dropped. When the suction head 3R picks up the IC from the outer array 5A, the tip of the suction head 3R is lowered to the vicinity of the surface of the IC in the positioning recess 5 and suction is performed. Therefore, in FIG.
Although R is shown in a state where the IC under test held by suction is released, the positioning recess 5 of the outer array 5A is shown.
As for the suction head 3R, the suction head 3R descends to almost the surface position of the turntable 4, which is the same position as the release position, and suction-holds the IC under test. Therefore, the suction head 3F moves lower than the position where the IC under test is dropped into the positioning recesses 5 of the outer array 5A. At this time, it is preferable that the suction head 3R has a short ascending / descending distance, and the same as the ascending / descending distance of the suction head 3F is convenient for control. It is attached to the transfer arm 3 so as to be lowered by a distance corresponding to the difference in the descending position, and the IC to be tested can be sucked from the positioning concave portion 5 of the outer array 5A with the same short lifting distance as the suction head 3F. There is. Therefore, in this embodiment, the lifting distance of the suction head 3R is set to be the same as the lifting distance of the suction head 3F.

Thus, the suction head 3R is the suction head 3
It is attached to the transfer arm 3 so as to be lower than F, and the vertical movement distance of the suction head 3R is the suction head 3F.
2 is set to be the same as the ascending / descending distance of No. 1, and is shorter, the suction recess head 5 has a depth equal to that of the positioning recess 5 of the outer array 5A. The inner side of the IC under test in which the 3R is adsorbed 5
The distance when dropped into the B positioning recess 5 becomes very short, and the IC under test cannot be accurately positioned. In addition, the lead pin (terminal) of the IC under test is attached to the tapered wall of the recess 5. Contact it and transform it,
It will be damaged. Therefore, in this embodiment, the positioning recesses 5 of the inner array 5B are formed deeper than the positioning recesses 5 of the outer array 5A, and the IC under test is released from the suction head 3R that descends to a position lower than the suction head 3F. In this case, the IC under test is configured to fall naturally by the same distance as when it falls into the positioning recess 5 of the outer array 5A.

Further, the turntable 4 is an IC to be tested.
Compared with the above, since it is a large heat source or cooling source maintained at the temperature in the temperature-controlled room 9, the IC under test housed in the deep positioning recess 5 of the inner arrangement 5B of the turntable 4 has the turntable 4 Good conduction of heat or cold. Therefore, deeply accommodating the IC under test in the positioning recess 5 of the turntable 4 also has an advantage of further reliably heating or cooling the IC under test to a predetermined temperature.

Further, in the above-mentioned embodiment, the case where the circular positioning concave array is concentrically formed in two rows is shown. However, the circular concave array is two or more N rows (N is an integer of 2 or more). be able to. If the circular array of concave portions is N rows, the transfer arm 3 may be provided with N suction heads. For example, in the case of an IC handler configured to transfer two ICs at a time as shown in FIG. 4, four circular concavity arrays for positioning are formed concentrically and four transfer arm 3 are provided. After mounting the suction heads, the transfer arm 3 loads two ICs to be tested at one time from the tray group 2A of the loader unit into the concave array of the outer two rows, and the loaded ICs to be tested rotate once. , The ICs to be tested are transferred from the recessed array of the outer two rows to the recessed arrays of the inner two rows, and at the same time, the two ICs to be tested are loaded from the tray group 2A of the loader section into the recessed arrays of the outer two rows and tested. The ICs to be tested having the two inner rows of recesses may be sent to the section.

Further, in the above-described embodiment, first, the ICs under test from the loader section are loaded into the outer concave array 5A, and after each IC under test makes one rotation, the outer concave array 5A is moved to the inner concave array 5B. The ICs to be tested are configured to be transferred and delivered to the test section. First, the ICs to be tested from the loader section are loaded into the inner recess array 5B, and after each IC to be tested has rotated once, the inner recess array 5B is placed. The IC to be tested may be transferred to the outer concave array 5A and sent to the test section. However, in this case, the depth of each positioning recess of the outer recess array 5A is formed deeper than the depth of each positioning recess of the inner recess array 5B. And
The suction head 3F is attached to the transfer arm 3 so as to be lower than the suction head 3R (a distance corresponding to the difference between the lowered positions of both suction heads).

According to the above-described embodiment, the IC under test is placed on the turntable 4 at the angular position A which is the IC loading position.
At least 1 after being placed in each positioning recess 5 of
It rotates, and then a predetermined angle (about 240 °) from the angular position A to the angular position B which is the feeding position to the test section.
It is moved and sent to the test unit 7. Therefore, at least 1 is required for the movement time for the predetermined angle to reach the test unit 7.
The IC to be tested is exposed to the temperature in the temperature-controlled room 9 for a time period in which the moving time for the rotation is added, and a predetermined temperature stress is applied thereto. Since the added moving time for at least one rotation is longer than the moving time for a predetermined angle from the IC loading position to the test section 7, the time to be tested is at least twice as long as that of the conventional IC handler. Can be used to raise or lower the temperature to a predetermined temperature. Therefore, since the IC under test can be given sufficient heat absorption or cooling time, no problem occurs even if the turntable 4 is rotated following the test cycle in the test section 7, and accordingly, the IC under test is The IC test time can be shortened.

In the above embodiments, the IC, which is a typical example of the semiconductor device, has been described as an example. However, a semiconductor device transfer processing apparatus and a semiconductor device transfer processing method for transferring and processing semiconductor devices other than the IC are also applicable. It goes without saying that the present invention can be applied and equivalent operational effects can be obtained.

[0030]

As described above, according to the present invention, the circular positioning concave array is formed concentrically in N rows on the turntable, and at least one of the N positioning concave arrays is covered. The IC to be tested is loaded at the loading angular position of the test IC, and the IC to be tested that has returned to the loading angular position after making one round is transferred to another positioning recess array, and then the IC to be tested is loaded at the sending angular position. Since the test IC is configured to be transported to the test section, the IC to be tested is placed on the turntable and rotated at least once, and then moves from the loading angular position to the sending angular position of the IC to be tested. It is possible to give the test IC extra movement time for at least one rotation. Therefore, since the IC under test can sufficiently absorb the temperature in the temperature-controlled room, the IC under test can be sufficiently heated or cooled even if the turntable is rotated by one pitch in synchronization with the test cycle of the test section. Then, the target temperature can be reached. Thus, the number of ICs that can be tested per unit time can be increased,
Moreover, there is a remarkable effect that the time required for the test can be shortened.

[Brief description of the drawings]

FIG. 1 is a plan view for explaining a schematic configuration of an embodiment of an IC handler according to the present invention.

FIG. 2 is an enlarged cross-sectional view for explaining a configuration of a main part of the embodiment shown in FIG.

FIG. 3 is a plan view for explaining a schematic configuration of an example of a conventional horizontal transfer type IC handler.

FIG. 4 is a plan view for explaining a schematic configuration of another example of a conventional horizontal transfer type IC handler.

[Explanation of symbols]

 1: Stand 2: Tray group 3, 8: Transfer arm 3F, 3R: Suction head 4: Turntable 5: Positioning recess 5A: Outer positioning recess circular array 5B: Inner positioning recess circular array 6: Contact arm 7: Test section

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/68 H01L 21/68 A

Claims (9)

[Claims] 1. A semiconductor device under test housed in a tray is sequentially placed in a circular array of positioning recesses formed on a turntable at a semiconductor device loading position, and the turntable is rotated to form the positioning recesses. The mounted semiconductor device under test is transported to the vicinity of the test section, and a predetermined temperature stress is applied to the semiconductor device under test during transportation on the turntable. In a semiconductor device transfer / processing apparatus configured to send a test semiconductor device to a test section and test a semiconductor device under test, N rows (N is an integer of 2 or more) concentrically formed on the turntable. Of the circular array of positioning concaves and the circular array of the N rows of positioning concaves Also, a first conveying means for sequentially feeding the semiconductor device under test from the tray at the semiconductor device loading position into the positioning recesses in one array, and the target to be accommodated in each positioning recess at the semiconductor device loading position. A means for transferring the semiconductor device under test to another circular array of positioning recesses that have arrived in an empty state at the semiconductor device loading position each time the test semiconductor device makes one revolution by the rotation of the turntable; A means for sequentially feeding a new semiconductor device under test from the tray to a positioning recess made empty by the transfer of the device, and a semiconductor device under test rotated at least once, from the semiconductor device loading position to the vicinity of the test unit. When this semiconductor device is moved up to The semiconductor device transporting apparatus, characterized by comprising a second conveying means for feeding to the test unit. 2. The number of circular arrays of positioning recesses formed concentrically on the turntable is two rows, and the first conveying means has an outer array of the two rows of circular arrays. The semiconductor devices under test are sequentially fed into the positioning recesses one by one from the tray, and each time the semiconductor devices under test housed in the positioning recesses in the outer array are rotated once by the rotation of the turntable, The semiconductor device under test operates so as to be transferred to the positioning recesses of the inner array, and the second transport means transfers the semiconductor devices under test to the positioning recesses of the inner array. 2. The semiconductor device according to claim 1, wherein the semiconductor device operates so as to feed the semiconductor devices under test one by one to the test section when the semiconductor device is moved to the vicinity of the test device. Transport processing equipment. 3. The semiconductor device transfer / processing apparatus according to claim 2, wherein the depth of the positioning recesses of the inner array is formed deeper than the depth of the positioning recesses of the outer array. 4. The first conveying means is provided with two suction heads for sucking a semiconductor device under test, one suction head for positioning the semiconductor device under test from the tray in an outer circular array. An operation of sequentially feeding the semiconductor devices under test, in which the other suction head makes one rotation, is performed to transfer the semiconductor device under test from the positioning recesses of the outer array to the positioning recesses of the inner array. Item 2. The semiconductor device transport processing apparatus according to Item 2. 5. The number of circular arrays of positioning concavities formed concentrically on the turntable is two, and the first conveying means has an inner array of the two circular arrays. The semiconductor devices under test are sequentially fed into the positioning recesses one by one from the tray, and each time the semiconductor devices under test housed in the positioning recesses of the inner array are rotated once by the rotation of the turntable, The semiconductor device under test operates so as to be transferred to the positioning recesses of the outer array, and the second transporting means transfers the semiconductor device under test to the positioning recesses of the outer array. 2. The semiconductor device according to claim 1, wherein the semiconductor device operates so as to feed the semiconductor devices under test one by one to the test section when the semiconductor device is moved to the vicinity of the test device. Transport processing equipment. 6. The semiconductor device transfer / processing apparatus according to claim 5, wherein the depth of the positioning recesses of the outer array is formed deeper than the depth of the positioning recesses of the inner array. 7. The number of circular arrays of concentric positioning recesses formed concentrically on the turntable is four, and the first conveying means is two rows outside of the four circular arrays. Two semiconductor devices to be tested are sequentially fed from the tray to the positioning recesses of the arrangement described above, and the semiconductor devices to be tested housed in the two positioning recesses on the outer side are rotated once by the rotation of the turntable. Each time the semiconductor device is tested, the semiconductor device under test is moved to the positioning recesses in the inner two-row array, and the second transfer means is transferred to the positioning recesses in the inner two-row array. The semiconductor device under test is moved so as to feed two semiconductor devices under test to the test unit when the semiconductor device under test is moved to the vicinity of the test unit. The semiconductor device transport processing apparatus described. 8. A semiconductor device under test stored in a tray is sequentially placed in a circular array of positioning recesses formed on a turntable at a semiconductor device loading position, and the turntable is rotated into the positioning recesses. The mounted semiconductor device under test is transported to the vicinity of the test section, and a predetermined temperature stress is applied to the semiconductor device under test during transportation on the turntable. A semiconductor device transport / processing method used in a semiconductor device transport / processing apparatus configured to send a test semiconductor device to a test section and test a semiconductor device under test, wherein N rows are concentrically arranged on the turntable. (N is an integer of 2 or more) And a step of sequentially feeding the semiconductor device under test from the tray at the semiconductor device loading position into the positioning recesses in one array, and the semiconductor device under test loaded in each positioning recess at the semiconductor device loading position. Every time the turntable rotates once, the semiconductor device under test is transferred to the positioning recesses of another circular array which has arrived in an empty state at the semiconductor device loading position, and the transfer of the device. The step of sequentially feeding a new semiconductor device under test from the tray to the positioning recess made empty by the replacement, and the semiconductor device under test rotated at least once is moved from the semiconductor device loading position to the vicinity of the test part. When this semiconductor device is A method of transporting a semiconductor device, comprising: a step of sending the semiconductor device to a test section. 9. The step of transferring the semiconductor device under test to a positioning recess of another circular array that has arrived in an empty state at the semiconductor device loading position, and the transfer of the device has made it empty. A method for carrying and processing a semiconductor device, wherein the step of sequentially feeding a new semiconductor device under test from the tray to the positioning recess is performed substantially at the same time.