WO2007135709A1

WO2007135709A1 - Electronic component testing apparatus

Info

Publication number: WO2007135709A1
Application number: PCT/JP2006/309954
Authority: WO
Inventors: Koya Karino; Akihiko Ito; Kazuyuki Yamashita
Original assignee: Advantest Corporation
Priority date: 2006-05-18
Filing date: 2006-05-18
Publication date: 2007-11-29
Also published as: TW200815774A; TWI352815B

Abstract

An electronic component testing apparatus is provided for testing IC devices by electrically bringing the IC devices into contact with the contact section of a test head (5). Component transfer apparatuses (310, 410) are used for transferring the IC devices from a customer tray (KST) to a test tray (TST) or from the test tray (TST) to the customer tray (KST). The component transfer apparatus is provided with a plurality of transfer arms (320, 330, 420, 430), which can individually move in substantially parallel directions to the main plane of the customer tray (KST) or the test tray (TST), come close to the same customer tray (KST) or the test tray (TST) at the same time, hold the IC devices stored in the customer tray (KST) or the test tray (TST) or place the IC devices on the test tray (TST) or the customer tray (KST).

Description

Specification

Component conveying device and electronic component testing device

Technical field

The present invention relates to an electronic component test in which various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) are electrically contacted with a contact portion of a test head to test the IC device. In the equipment, the customer tray is also used to transfer the IC device to the test tray or the IC device from the test tray to the customer tray, and the electronic component testing apparatus equipped with the same About.

Background art

In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.

[0003] A handler constituting an electronic component testing apparatus includes a loader unit, a chamber unit, and an unloader unit.

[0004] The loader section of the handler circulates and conveys the IC device before the test from the tray (hereinafter referred to as a customer tray) for storing the IC device that has been tested. IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.

[0005] Next, after applying high-temperature or low-temperature thermal stress to the IC device in the chamber portion of the handler, each IC device is brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter referred to as the main part) , Referred to as a tester).

[0006] Next, the test tray loaded with the IC device for which the test has been completed is carried out from the chamber part to the unloader part, and the IC device is mounted on the customer tray according to the test result in the unloader part. Good products are classified into defective products and categories! /

[0007] In the electronic component testing apparatus, further improvement in throughput is desired. In order to improve throughput, increase the number of simultaneous measurements in the chamber (number of IC devices that can be tested simultaneously)! It is not enough to improve the ability to transfer IC devices between the customer tray and test tray by the transport device before and after the test. I have to.

[0008] As measures for improving the capability of the transport apparatus, first, the moving speed of the transport apparatus is increased, or the number of IC devices that can be simultaneously held by the transport apparatus (hereinafter also simply referred to as the simultaneous holding number) is increased. It is possible. However, these measures have a limit in improving the conveyance capability because the mechanical accuracy may cause a problem such as poor positioning accuracy or slowing the conveyance speed.

[0009] As another measure for improving the capability of the transfer device, it is conceivable to provide two transfer devices. However, with this measure, the area of the loader unit and unloader unit is almost doubled, leading to an increase in the size of the electronic component test equipment.

Disclosure of the invention

[0010] An object of the present invention is to provide a component transport device capable of improving throughput while maintaining the size of the electronic component test device, and an electronic component test device including the component transport device.

In order to achieve the above object, according to the present invention, in an electronic component test apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head, A component conveying device used for transferring the electronic device under test accommodated in a first tray to a second tray, a direction substantially parallel to a main surface of the first tray A plurality of transports capable of holding the electronic device under test accommodated in the first tray by simultaneously approaching the same first tray. There is provided a parts conveying device provided with means (see claim 1).

[0012] In the present invention, a component transporting device that transfers electronic devices under test to the first tray and the second tray is provided with a plurality of transporting means that can be independently and simultaneously approached to the same first tray. . As a result, the carrying capacity can be increased while keeping the size of the component carrying device equal to that of the conventional one, so that the throughput can be improved while maintaining the size of the electronic component testing device.

[0013] Although not particularly limited in the above invention, the plurality of transport means can be independently moved in a direction substantially parallel to the main surface of the second tray, and the same Simultaneously approach the second tray and place the electronic device under test on the second tray. (See claim 2).

[0014] In the present invention, a plurality of conveying means can be made to approach the same second tray independently and simultaneously. As a result, the throughput can be further improved while maintaining the size of the electronic component testing apparatus.

[0015] Further, in order to achieve the above object, according to the present invention, an electronic component test for testing the electronic device under test by bringing the electronic device under test into electrical contact with the contact portion of the test head. In the apparatus, a component conveying device used for transferring the electronic component to be tested housed in a first tray to a second tray, substantially with respect to a main surface of the second tray A plurality of transports that can move independently in parallel directions, and can simultaneously approach the same second tray and place the electronic device under test on the second tray. There is provided a parts conveying device provided with means (see claim 3).

[0016] In the present invention, the component conveying device that transfers the electronic devices under test to the first tray and the second tray is provided with a plurality of conveying means that can simultaneously and independently approach the same second tray. . As a result, it is possible to increase the carrying capacity while keeping the size of the component carrying device the same as the conventional one, so that the throughput can be improved while maintaining the size of the electronic component testing device.

[0017] Although not particularly limited in the above invention, the transport means is a transport arm having a holding unit for holding the electronic device under test, and the component transport device is capable of moving the transport arm. Preferably, the plurality of transfer arms are supported by the same support means, and each of the transfer arms can move independently on the support means.ヽ (See claim 4).

[0018] In the above invention, although not particularly limited, the support means supports the transfer arm so as to be movable in a predetermined direction, and the plurality of transfer arms are attached to the same support means. It is preferable that they are arranged side by side along the predetermined direction (see claim 5).

[0019] Although not particularly limited in the above invention, it is preferable that each of the transfer arms is assigned with a corresponding area in the same first tray or the second tray that can be simultaneously accessed. (See claim 6). [0020] Although not particularly limited in the above invention, it is preferable that the first tray is one of a customer tray and a test tray, and the second tray is the other of the test tray and the customer tray. (See claim 7).

In order to achieve the above object, according to the present invention, an electronic component test apparatus used for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head An electronic component test apparatus including a loader unit having any one of the above-described component transfer devices for transferring the electronic device under test before the test from a customer tray to a test tray (see claim 8). .

In order to achieve the above object, according to the present invention, an electronic component used for testing the electronic device under test by bringing the electronic device under test into electrical contact with the contact portion of the test head. An electronic component testing apparatus comprising an unloader unit having any one of the above-described component conveying devices for transferring a tested electronic component to be tested to a test tray force customer tray is provided (see claim 9). ).

[0023] Although not particularly limited in the above invention, the apparatus further includes detection means for detecting a lot end of the electronic component under test, and the component transfer device includes a first transfer arm and a second transfer arm. In the customer tray, the first area is assigned to the first transfer arm as the area in charge of the first transfer arm, and the second transfer arm is in charge of the customer tray. As the second area is assigned to the second transfer arm, and when the detection means detects a lot end, the parts transfer apparatus determines that the first area is based on the detection result! Alternatively, it is preferable to control the first transfer arm and the second transfer arm so that the electronic device under test is placed in one of the second regions (see claim 10). .

[0024] When the lot end of the electronic device under test is processed, the electronic device under test is packed in one of the first region or the second region, so that the first region is stored in the customer tray. It is possible to prevent a missing portion between the second region and the second region.

[0025] Specifically, for example, when the detection unit detects a lot end, the component transfer device determines that both the first and second transfer arms are based on the detection result. To the one of the first area and the second area of the electronic device under test The first transfer arm and the second transfer arm may be controlled such that the first transfer arm and the second transfer arm are controlled (see claim 11).

[0026] As another specific example, when the detection unit detects a lot end, the component transfer device determines whether one of the first transfer arm or the second transfer arm is based on the detection result. The electronic device under test is transported from the test tray to one of the first region or the second region, and the other of the second transport arm or the first transport arm transports the electronic device under test. The first transfer arm and the second transfer arm may be controlled so as to stop the operation (see claim 12).

[0027] As yet another specific example, the unloader unit includes a buffer unit provided separately from the test tray and the customer tray for temporarily storing the electronic device under test, and the detection unit When the means detects the lot end, based on the detection result, the component transport device causes the second transport arm to transport the electronic component to be tested to the test tray, and to the buffer unit. The first transfer arm and the second transfer arm are controlled so that the stored electronic device under test is transferred to one of the first area or the second area by the first transfer arm. (See claim 13).

[0028] As yet another specific example, when the detection means detects a lot end, the parts carrying device, based on the detection result, the first carrying arm or the second carrying arm. At least one of the first transfer arm and the second transfer arm so that the electronic device under test is transferred from the second region or the first region to the first region or the second region. May be controlled (see claim 14).

Brief Description of Drawings

FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 7 is a plan view showing a loader unit and an unloader unit of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 8 is a plan view showing a loader unit of the electronic component test apparatus according to the embodiment of the present invention.

FIG. 9 is a plan view showing an unloader unit of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 10 is a schematic diagram showing a first example of a lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 11 is a block diagram showing delivery of a lot end signal in the electronic device test apparatus according to the embodiment of the present invention.

FIG. 12 is a schematic diagram showing a second example of a lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 13 is a schematic diagram showing a third example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 14 is a schematic diagram showing a fourth example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.

Explanation of symbols

1 ... Nondra

100 ... Chamber part

200 ... storage

300 ··· Loader

310 ··· Conveyor

311 ... Lenore

320 ... First transfer arm 330 ... Second transfer arm

400 ... unloader

410 ... Conveyor

411

412 ... Control device

420 ... 1st transfer arm

430 ... Second transfer arm

5 ... Test head

6 ... Tester

TST ... Test tray

21 ... 1st area

22 ··· Second area

KST ... Customer train

31 ... 1st area

32 ... 2nd area

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a conceptual diagram which shows the handling of the tray in the electronic component testing apparatus which concerns on this.

FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment. In practice, the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.

[0034] The electronic device test apparatus according to the present embodiment tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. IC device testing using this electronic component testing equipment The IC device is transferred from the Tamatre KST to the test tray TST.

Therefore, as shown in FIGS. 1 to 3, the handler 1 in the present embodiment includes a storage unit 200 that stores a customer tray KST in which an IC device before the test and an IC device after the test are mounted, The chamber unit 100 includes a loader unit 300 for transferring the IC device sent from the storage unit 200 to the test tray TST and feeding it to the chamber unit 100, and the test head 5 and testing the IC device in a state mounted on the test tray TST. The unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.

[0036] The socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned. As shown in FIG. 1, a space is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in this space, and through a through-hole formed in the device base of the handler 1. Thus, the IC device and the socket 50 on the test head 5 can be brought into electrical contact. When changing the type of IC device, the test head is replaced with another test head having a socket suitable for the shape and number of pins of the IC device of that type.

[0037] Each part of the handler 1 will be described in detail below.

[0038] <Storage unit 200>

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment.

[0039] The storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to the test results! / RU

As shown in FIG. 4, these stockers 201 and 202 include a frame-like tray support frame 203 and an elevator 204 that can be moved up and down by the lower force of the tray support frame 203 also entering the upper part. And. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. Moved.

[0041] In this embodiment, as shown in FIG. 5, the customer train KST is a force in which 60 accommodating portions 33 for accommodating IC devices are arranged in 10 rows X 6 columns. There are various array variations depending on the device type.

[0042] Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the number of the pre-test IC stocker 201 and the tested IC stocker 202 is set to an appropriate number as necessary. can do.

In this embodiment, as shown in FIGS. 2 and 3, two stockers S TK-B are provided in the stock force 201 before the test, and two empty tray stocks STK-E are provided next to the stocker S TK-B. It has been. Each empty tray stock strength STK-E is obtained by stacking empty customer trays K ST sent to the unloader section 400! /.

[0044] Eight tray stockers STK-1, STK-2, ..., STK-8 are installed in the tested IC stocker 202 next to the empty tray stock force STK-E. It is configured so that it can be sorted and stored in up to 8 categories. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.

[0045] <Loader unit 300>

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 7 is a plan view showing the loader unit and the unloader unit of the electronic component testing apparatus according to the embodiment of the present invention. FIG. 8 is a plan view showing a connector part of the electronic device test apparatus according to the embodiment of the present invention.

[0046] The above-described customer tray KST is transported from the lower side of the device base 101 to the two window portions 306 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. It is. In the loader unit 300, the IC device loaded on the customer tray KST is transferred by the device transfer device 310 to the precursor 305, where the mutual positional relationship of the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by the transfer device 310. [0047] As shown in FIG. 6, the test tray TST has bars 13 provided in parallel to the rectangular frame 12 at equal intervals. Both sides of the bars 13 and the side 12a of the frame 12 facing the bars 13 are A plurality of mounting pieces 14 are formed so as to protrude at equal intervals. An insert accommodating portion 15 is constituted by the crosspieces 13 or between the crosspiece 13 and the side 12a and the two attachment pieces 14.

[0048] Each insert accommodating portion 15 accommodates one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. . For this purpose, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in FIG. 6, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.

Each insert 16 has the same shape and the same dimensions, and an IC device is accommodated in each insert 16. The IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular concave portion in the example shown in FIG.

As shown in FIG. 7, the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST. The device transfer device 310 includes two rails 311 erected along the Y-axis direction on the device base 101, and a first transfer arm 320 and a first transfer arm 320 that can reciprocate along the Y-axis direction on the rail 311. It consists of two transfer arms 330 and a force. The rail 311 in the present embodiment corresponds to an example of the support means in the claims, and the first transfer arm 320 and the second transfer arm 330 in the present embodiment are examples of the transfer arm in the claims. Equivalent to.

[0051] The first transfer arm 320 reciprocates on the rail 311 between the two customer trays KST located in the two window portions 306 and the test tray TST located in the loader portion 300. Movable arm 321 movably provided, movable head 322 supported by movable arm 321 so as to be movable along the X-axis direction, and 16 pieces arranged in 2 rows and 8 columns downward on movable head 322 A suction pad 323. Each suction pad 323 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be transferred to the customer tray KST force test tray TST at a time. It has become. [0052] Similarly, the second transfer arm 330 reciprocates on the rail 311 between the customer tray KST located in the two window portions 306 and the test tray TST located in the loader portion 300. Movable arm 331, movable head 332 supported by movable arm 331 so as to be movable along the X-axis direction, and 16 suctions arranged in two rows and eight columns downward on movable head 332 And a pad 333. Each suction pad 323 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be transferred to the customer tray KST force test tray TST at a time. It has become.

The first transfer arm 320 and the second transfer arm 330 are supported by the same set of rails 311. In FIG. 7, the first transfer arm 320 and the second transfer arm 330 are arranged so that the first transfer arm 320 is positioned on the lower side and the second transfer arm 330 is positioned on the upper side in FIG. They are arranged in parallel along the Y-axis direction and can move independently on the rail 311. Since the first and second transfer arms 320 and 330 cannot cross each other on the rail 311, the first transfer arm 320 is positioned on the upper side and the second transfer arm 330 is set on the lower side in FIG. Never be located.

In this embodiment, as shown in FIG. 8, the same customer tray KST located in the first transfer arm 320, the second transfer arm 330, and the force window 306 can be simultaneously accessed. Yes. In the customer train KST, the first transfer arm 320 has a lower half of the first area 31 (in the customer tray KST in FIG. Half 30 rows of 6 rows and 5 columns 33) are allocated. In addition, in the customer tray KST, the second transfer arm 330 has an upper half of the second area 32 (the customer tray KST in FIG. 30 holding parts 33) of 6 rows and 5 columns in the left half are assigned. Note that two customer trays KST are located in the loader unit 300! /, And the first and second areas 31 and 32 are allocated to each customer tray KST.

Similarly, in the present embodiment, the first transfer arm 320 and the second transfer arm 330 can simultaneously approach the same test tray TST located in the order section 300. . Then, in the test tray TST, the first transfer arm 320 has a lower half of the first area 21 (in the test tray TST shown in FIG. 6) as the area handled by the first transfer arm 320. In other words, 32 storage units 18) of 2 rows and 16 columns in the lower right half are allocated. Further, in the test tray TST, the second transfer arm 330 has an upper half of the second region 22 (the test tray TST shown in FIG. The upper left half has 32 rows 18) in 2 rows and 16 columns.

As described above, in the device transport apparatus 310 in the present embodiment, the first transport arm 320 and the second transport arm 330 are simultaneously approaching the same customer tray KST or the same test tray TST. Is possible.

That is, the first transfer arm 320 sucks 16 IC devices from the first area 31 of the customer tray KST by the suction pad 323, moves the IC devices, and moves the first IC device of the test tray TST. At the same time, the suction of the suction pad 323 is released in area 21, and the second transfer arm 330 absorbs 16 IC devices from the second area 32 of the customer tray KST by the suction pad 333 and moves the IC devices. By releasing the suction of the suction pad 333 in the second area 22 of the test tray TST, the customer tray KST force can also simultaneously load 32 IC devices on the test tray TST. Thereby, the device carrying device 310 can be doubled in its carrying capacity while keeping the size of the device carrying device 310 equivalent to that of the conventional device, so that the throughput can be improved while maintaining the size of the electronic component testing device.

As shown in FIG. 1 and FIG. 8, a precursor 305 is provided between the customer tray KST and the test tray TST. Although not shown, each precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, the IC device to be transferred from the customer tray KST to the test tray TST is dropped into the Preciseer 305 before being moved to the test tray TST, so that the mutual positional relationship of the IC devices is accurately determined. It is now possible to accurately transfer to the tray TST.

[0059] In the present embodiment, the force that two precursors 305 are provided between the customer tray KST and the test tray TST. The lower precursor 305 in Fig. 8 is dedicated to the first transfer arm 320. This is a precursor, and the upper precursor 305 in the figure is a precursor exclusively for the second transfer arm 330.

[0060] When the IC devices are accommodated in all the accommodating portions 18 of the test tray TST, the tray conveying device 1 02, the test tray TST is carried into the chamber part 100.

[0061] On the other hand, when all the IC devices mounted on the customer tray KST are transferred to the test tray TST, the empty customer tray KST is lowered by the lifting table, and the tray transfer device 205 receives the empty tray. hand over. The tray transfer device 205 stores the empty tray in the empty tray force STK-E, and supplies the empty tray to the stocker 202 when it is fully loaded with the customer tray KST force C device of the tested IC stocker 202.

[0062] <Chamber part>

The above-described test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.

[0063] As shown in Figs. 2 and 3, the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature thermal stress to the IC device loaded on the test tray TST, and the soak chamber 110. The test chamber 120 that contacts the IC device in the state where thermal stress is applied with the test head 5 and the unsoak chamber 130 that also removes the thermal stress from the IC device force that has been tested are configured. .

[0064] It is preferable that the unsoak chamber 130 is thermally insulated from the soak chamber 110 and the test chamber 120. In practice, the region between the soak chamber 110 and the test chamber 120 is maintained at a high temperature or a low temperature. The unsoak chamber 130 is thermally insulated from these chambers. For convenience, these are collectively referred to as the chamber portion 100.

The soak chamber 110 is disposed so as to protrude upward from the test chamber 120. As conceptually shown in FIG. 3, a vertical transfer device is provided in the soak chamber 110, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 120 is empty. Waiting while being. Mainly, high-temperature or low-temperature thermal stress of about 55 to 150 ° C. is applied to the IC device during this standby.

[0066] In the test chamber 120, the test head 5 is arranged at the center thereof, and the test tray TST is carried above the test head 5, and the input / output terminals of the IC device are electrically connected to the contact bin of the test head 5. IC devices are tested by contacting them.

[0067] The result of this test is the identification number assigned to the test tray TST and the test tray TST. The assigned IC device number and the address determined by are stored in the storage device of the electronic component testing device.

[0068] Like the soak chamber 110, the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120, and a vertical transfer device is provided as conceptually shown in FIG. In this unsoak chamber 130, when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400. . On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return it to a temperature at which condensation does not occur, and then the IC device with the heat removed is unloaded. Transport to part 400.

[0069] In the upper part of the soak chamber 110, an inlet for carrying the test tray TST from the apparatus base 101 is formed. Similarly, at the upper part of the unsoak chamber 130, an outlet for carrying out the test tray TST to the apparatus base 101 is formed. The apparatus base 101 is provided with a tray transfer apparatus 102 for taking the test tray TST out of and out of the chamber section 100 through these inlets and outlets. The tray conveying device 102 is composed of, for example, a rotating roller. The test tray TST unloaded from the unsoaked tank 130 by the tray transfer device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.

[0070] <Unloader unit 400>

[0071] The unloader unit 400 reloads the IC device that has been tested for the test tray TST force carried to the unloader unit 400 into the customer tray KST corresponding to the test result.

As shown in FIG. 2, the apparatus base 101 in the unloader unit 400 has four windows in which the customer tray KST carried from the storage unit 200 to the unloader unit 400 is arranged as desired on the upper surface of the apparatus base 101. A portion 406 is formed.

[0073] The unloader unit 400 transfers the tested IC device from the test tray TST to the customer tray K.

A device transfer device 410 for transshipment to ST is provided. Device transfer device 410 As shown in FIG. 7, two rails 411 erected on the apparatus base 101 along the Y-axis direction, a first transfer arm 420 and a first transfer arm 420 that can reciprocate on the rail 411 along the axis direction. Two transfer arms 430 and force are also configured. Note that the rail 411 in the present embodiment corresponds to an example of the support means in the claims, and the first transport arm 420 and the second transport arm 430 in the present embodiment correspond to the transport arm in the claims. It corresponds to an example.

[0074] The first transfer arm 420 has two test trays TST located in the unloader section 400 and four window sections 406; and four standing customer trays KST. Movable arm 421 that can be moved back and forth on rail 411, movable head 422 supported by movable arm 421 so as to be movable along the X-axis direction, and two rows downward on movable head 422 16 suction pads 423 arranged in 8 rows. Each suction pad 423 can be moved up and down along the Z-axis by an actuator (not shown), and 16 IC devices can be transferred from the test tray TST to the customer tray KST at a time. ing.

[0075] Similarly, the second transfer arm 430 has two test trays TST located in the unloader section 400 and four windows 406 respectively; ^ four customer trays standing up KST A movable arm 431 that can be moved back and forth on the rail 411, a movable head 432 supported by the movable arm 431 so as to be movable along the X-axis direction, and a downward movement of the movable head 432 2 16 suction pads 433 arranged in 8 rows and 8 columns. Each suction pad 433 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be loaded from the test tray TST to the customer tray KST at a time. Become.

The first transfer arm 420 and the second transfer arm 430 are supported by the same rail 411. In FIG. 7, the first transfer arm 420 and the second transfer arm 430 are arranged so that the first transfer arm 420 is positioned on the lower side and the second transfer arm 430 is positioned on the upper side in FIG. They are arranged in parallel along the Y-axis direction, and each can move independently on the rail 411.

[0077] The first and second transfer arms 420 and 430 cannot cross each other on the rail 411. In FIG. 7, the first transfer arm 420 is not positioned on the upper side, and the second transfer arm 430 is not positioned on the lower side.

In the present embodiment, as shown in FIG. 9, it is possible to simultaneously approach the first transfer arm 420, the second transfer arm 430, and the same test tray TST located in the force unloader unit 400. Yes. In the test tray TST, the first transfer arm 420 has a lower half of the first area 21 (in the test tray TST shown in FIG. The lower half has 32 rows and 2 columns and 16 columns. Further, in the test tray TST, the second transfer arm 430 has an upper half of the second area 22 (in the test tray TST shown in FIG. In the upper left half, 32 storage units 18) of 2 rows and 16 columns are allocated. The unloader unit 400 has a force at which two test trays TST are positioned. The first and second regions 21 and 22 are assigned to each test tray TST.

Similarly, in the present embodiment, the first transfer arm 420 and the second transfer arm 430 can simultaneously approach the same customer tray KST located in the window portion 406. In the customer train KST, the first transfer arm 420 is assigned to the first area 31 in the lower half as the area handled by the first transfer arm 420 (in the customer train KST in FIG. 5). In other words, 30 holding parts 33) of 6 rows and 5 columns in the right half are assigned. Further, in the force stator tray KST, the second transfer arm 430 has an upper half of the second area 32 (in the customer tray KST in FIG. 30 holding parts 33) of 6 rows and 5 columns in the left half are assigned. Note that four customer trays KST are located in the unloader unit 400, and first and second areas 31 and 32 are allocated to each customer tray KST.

[0080] In the device transport apparatus 410 configured as described above, the first transport arm 420 and the second transport arm 430 can simultaneously approach the same customer tray KST or the same test tray TST. Become.

That is, the first transfer arm 420 sucks the IC device from the first area 21 of the test tray TST by the suction pad 423, moves the IC device, and sucks it in the first area 31 of the customer tray KST. At the same time as the suction of the pad 423 is released, the second transfer arm 430 Sucks the IC device from the second area 22 of the test tray TST by the suction pad 433, moves the IC device, and releases the suction of the suction pad 433 in the second area 32 of the customer tray KST. Test tray TST power Customer tray Up to 32 IC devices can be loaded into KST at the same time. Thus, the device transport apparatus 410 can be doubled in capacity while maintaining the size of the device transport apparatus 410 as before, so that the throughput can be improved while maintaining the size of the electronic component test apparatus.

[0082] Force not shown In the figure, under each window 406, an elevating table for elevating the customer tray KST is provided. Here, the tested IC devices are reloaded and loaded. The customer tray KST is lowered and the full tray is transferred to the tray transfer arm 205.

[0083] Incidentally, in the electronic component test apparatus of this embodiment, although the maximum number of categories that can be sorted is eight, the apparatus base 101 of the unloader section 400 has only four windows 406 formed therein. In the unloader section 400, only a maximum of 4 customer trays KST can be placed. Therefore, the categories that can be sorted in real time are limited to 4 categories. Generally, non-defective products are classified into three force categories: high speed, medium speed, and low speed, and the power that is sufficient in the four categories with the defective products in this category, for example, retesting. There may be rare categories that do not belong to these categories, such as what you need.

[0084] As described above, when an IC device classified into a category other than the category assigned to the four customer trays KST arranged in the window 406 of the unloader unit 400 is generated, one IC is generated from the unloader unit 400. The customer tray KST is returned to the storage unit 200, and instead, the customer tray KST assigned with the newly generated category is transferred to the unloader unit 400 to store the IC device. However, in this case, the sorting operation must be interrupted, and there is a problem when throughput decreases. For this reason, in the electronic component testing apparatus according to the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and an IC device of a category that rarely generates force is provided in the buffer unit 405. The vice is temporarily deposited.

FIG. 10 is a schematic diagram showing a first example of a lot end processing method in the unloader section of the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 11 is an electronic section according to the embodiment of the present invention. It is a block diagram which shows delivery of the lot end signal in a goods test apparatus.

Note that when the customer tray KST is divided into the first area 31 and the second area 32 in the unloader unit 400 as in the present embodiment, the first area 31 is used when the lot of IC devices is completed. At the end of the IC, there is a case where an IC device is accommodated and a tooth missing portion 3 la is generated.

In the present embodiment, the first region 31 is formed in the lot end of the IC device without generating a tooth-missing portion between the first region 31 and the second region 32 by the method described below. The device transfer device 410 of the unloader unit 400 controls the first and second transfer arms 420 and 430 so as to be fully loaded with IC devices.

That is, in this embodiment, when the device transport apparatus 410 of the unloader unit 400 receives the lotend signal, the control unit 412 of the device transport apparatus 410 moves the IC device to the test tray TST as shown in FIG. The first and second transfer arms 420 and 430 are both transferred to the first area 31 of the customer tray KST when moving the IC device to the customer tray KST according to the test result. And the second transfer arms 420 and 430 are controlled.

Based on this control signal, the first transport arm 420 moves the IC device to the first region 31 of the customer tray TST, and the second transport arm 430 also moves the first transport arm TST of the customer tray TST. The IC device is moved to the region 32 so that the tooth-missing portion 3 la is not generated between the first region 31 and the second region 32.

Note that, as shown in FIG. 11, the lot end of the IC device is, for example, a customer stored in the pre-test IC stocker 201 by a detection device 206 that is also configured with a sensor equal force provided in the storage unit 200. This is detected based on the absence of the tray KST, and the detection device 206 sends it to the device transfer device 410 of the unloader unit 400 as a lot end signal.

[0091] Note that the detection timing as the lot end is not limited to the time when the customer tray KST stored in the pre-test IC stocker 201 becomes zero. For example, the customer tray KST stored in the pre-test IC stocker 201 is used. For example, it may be the time when the number becomes less than a predetermined number, for example, two or three. Further, the lot end detection method is not limited to physical detection by a sensor or the like. For example, even if it is detected on a program incorporated in the node 1 good.

FIG. 12 is a schematic diagram showing a second example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.

The above-described processing method is excellent in that a quick lot end processing is possible. However, when the second transfer arm 430 transfers the IC device to the first area 31 of the customer tray KST, The first transfer arm 420 is inferior in that it requires a space for retraction.

If a very high processing speed is not required at the lot end, the second example of the processing method shown in FIG. 12 that does not require a space for the first transfer arm 420 to retreat may be applied.

In the second example of the lot end processing method in the unloader unit of the electronic component test apparatus according to the present embodiment, when the device transport device 410 of the unloader unit 400 receives the lot end signal, the control unit of the device transport device 410 As shown in FIG. 12, when the IC device is moved from the test tray TST to the customer tray KST corresponding to the test result, only the first transfer arm 420 is placed in the first area 31 of the customer tray KST. When the device is transferred, the second transfer arm 430 controls the first and second transfer arms 420 and 430 to stop the transfer of the IC device to the customer tray KST.

[0096] Based on this control signal, the second transfer arm 430 stops transferring the IC device, and only the first transfer arm 420 moves from the test tray TST to the first area 31 of the customer tray KST. The device is moved so as not to generate a tooth missing portion 31 a between the first region 31 and the second region 32.

At this time, the first transfer arm 420 is configured so that the first area 21 and the second area of the test tray TST are

It is possible to approach both of the two, and from the first area 21 of the test tray TST I

May carry a C device.

[0098] It should be noted that even if the first transfer arm 420 stops the transfer, the IC device can be transferred from the test tray TST to the first area 31 of the customer tray KST only by the second transfer arm 430. good.

FIG. 13 is a schematic diagram showing a third example of the rod end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention. The numbers attached to the arrows in Fig. 13 Indicates the order in which the transfer arms 420 and 430 move.

[0100] If a very high processing speed is not required at the lot end, the third example of the processing method shown in FIG. 13 that does not require a space for the first transfer arm 420 to retreat may be applied.

[0101] In the third example of the lot end processing method in the unloader unit of the electronic component test apparatus according to the present embodiment, when the device transport device 410 of the unloader unit 400 receives the lot end signal, the control unit of the device transport device 410 As shown in FIG. 13, when the IC device is moved from the test tray TST to the customer tray KST according to the test result, the second transfer arm 430 force is transferred to the second area 32 of the customer tray KST as shown in FIG. The first and second IC devices are transported to the buffer unit 405, and the IC device stored in the buffer unit 405 is transported to the first area 31 of the customer tray KST. The transfer arm controls the 430.

[0102] Based on this control signal, first, the second transfer arm 430 transfers the IC device to the buffer unit 405, and then the first transfer arm 420 force is temporarily stored in the buffer unit 405. The IC device thus moved is moved to the first area 31 of the customer tray KST so as not to generate the tooth-missing portion 3 la between the first area 31 and the second area 32.

FIG. 14 is a schematic diagram showing a fourth example of a lot end processing method in the unloader section of the electronic device testing apparatus according to the embodiment of the present invention. Note that the numbers attached to the arrows in FIG. 14 also indicate the order in which the transfer arms 420 and 430 move.

[0104] If the number of IC devices to be processed at the lot end is small, the fourth example of the processing method shown in Fig. 14 may be applied.

In the fourth example of the lot end processing method in the unloader unit of the electronic component test apparatus according to the present embodiment, when the device transfer device 410 of the unloader unit 400 receives the lot end signal, the control unit of the device transfer device 410 As shown in FIG. 14, when the IC device is moved from the test tray TST to the customer tray KST according to the test result, the second transfer arm 430 is moved to the second area 32 of the customer tray KST as usual. Control the first and second transfer arms 420 and 430 so that the first transfer arm 420 transfers the IC device from the second region 32 to the first region 31 after the IC device is transferred to the first region 31. . [0106] Based on this control signal, the second transfer arm 430 transfers the IC device from the test tray TST to the second area 32 of the customer tray KST as usual, and then fills the missing portion 31a. At the same time, the first transfer arm 420 moves to the last tail of the first area 31 in the second area 32 of the customer train KST.

[0107] The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

[0108] For example, in the above-described embodiment, the force provided with two transport arms 320, 330, 420, and 430 in each of the device transport apparatuses 310 and 410 is not particularly limited in the present invention, and three or more A transfer arm may be provided.

[0109] Further, only one transfer arm 320, 420 is provided in the device transfer apparatus 310, 410, and a plurality of movable heads 322, 422 (holding unit) are arranged in the X-axis direction on the transfer arm 320, 420 (transfer arm). A plurality of movable heads may be provided so as to be independently movable along the X-axis direction. As a result, the throughput can be improved while maintaining the size of the electronic component testing apparatus.

Claims

The scope of the claims

[1] In an electronic component test apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head, the electronic device under test contained in a first tray A component conveying device used for transfer to a second tray, which is independently movable in a direction substantially parallel to the main surface of the first tray, and is identical to the first tray. A component transport apparatus comprising a plurality of transport means capable of simultaneously approaching one tray and holding the electronic device under test accommodated in the first tray.

[2] The plurality of transport means can be independently moved in a direction substantially parallel to the main surface of the second tray, and simultaneously approach the same second tray. 2. The component conveying device according to claim 1, wherein the electronic device under test can be placed on the second tray.

[3] In an electronic component testing apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head, the electronic device under test accommodated in a first tray A component conveying device used for transfer to a second tray, which is independently movable in a direction substantially parallel to the main surface of the second tray, A component conveying device comprising a plurality of conveying means capable of simultaneously approaching two trays and placing the electronic device under test on the second tray.

[4] The transport means is a transport arm having a holding section for holding the electronic device under test,

The component conveying device includes a supporting unit that movably supports the conveying arm, and the plurality of conveying arms are supported by the same supporting unit,

4. The component conveying device according to claim 1, wherein each of the conveying arms is independently movable on the support means.

[5] The support means supports the transfer arm to be movable along a predetermined direction, and the plurality of transfer arms are arranged side by side along the predetermined direction on the same support means. The component conveying device according to claim 4.

[6] In each of the transfer arms, a region in charge is assigned to each of the same first tray or second tray that can be accessed simultaneously! The component conveying apparatus according to any one of the above.

[7] The first tray is one of a customer tray or a test tray,

The component conveying apparatus according to claim 1, wherein the second tray is the other of a test tray and a customer tray.

[8] An electronic component testing apparatus used to test an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head,

A customer trayer also transfers the electronic device under test before testing to a test tray.

An electronic component test apparatus including a loader unit having the component conveying device according to any one of 1 to 7.

[9] An electronic component test apparatus used to test an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head,

8. An electronic component testing apparatus comprising an unloader unit having the component conveying apparatus according to claim 1, wherein the tested electronic component to be tested is transferred to a test tray customer tray.

[10] The apparatus further comprises detection means for detecting a lot end of the electronic device under test,

The component transfer device includes a first transfer arm and a second transfer arm. In the customer tray, the first area is the first transfer arm as an area in charge of the first transfer arm. The second transfer arm is assigned to the second transfer arm, and when the detection means detects the lot end, the component transfer device Based on the detection result, the first transfer arm and the second transfer arm are arranged so that the electronic device under test is placed in one of the first area and the second area. The electronic component test apparatus according to claim 9 to be controlled.

[11] When the detection means detects the lot end, the parts conveying device determines that both the first and second conveying arms are from the test tray to the first area or the based on the detection result. In order to transport the electronic device under test to one of the second regions, 11. The electronic component test apparatus according to claim 10, wherein the first transfer arm and the second transfer arm are controlled.

[12] When the detection means detects a lot end, the component transfer device determines whether one of the first transfer arm or the second transfer arm is moved from the test tray based on the detection result. The electronic device under test is transferred to one of the region 1 or the second region, and the other of the second transfer arm or the first transfer arm stops the transfer of the electronic device under test, 11. The electronic component test apparatus according to claim 10, wherein the first transfer arm and the second transfer arm are controlled.

[13] The unloader section includes a buffer section provided separately from the test tray and the customer tray for temporarily storing the electronic device under test.

When the detection means detects the lot end, the component transport device, based on the detection result, the second transport arm transports the electronic device under test to the buffer section by the second test arm. The first transport arm and the second transport so that the electronic component under test stored in the buffer unit is transported to one of the first region or the second region by the first transport arm. 11. The electronic component test apparatus according to claim 10, which controls the arm.

[14] When the detection means detects a lot end, the component transfer device determines that at least one of the first transfer arm or the second transfer arm is the second area based on the detection result. 11. The electron according to claim 10, wherein the first transfer arm and the second transfer arm are controlled so that the electronic device under test is reloaded in the first area or the second area. Component testing equipment.