JP4082807B2 - Electronic component temperature application method and electronic component test apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component testing apparatus for testing various electronic components (hereinafter also simply referred to as ICs) such as semiconductor integrated circuit elements, and more particularly to a method of applying a temperature of an electronic component with improved temperature raising / lowering performance of the electronic component, and The present invention relates to an electronic component testing apparatus.
[0002]
[Prior art]
In an electronic component testing apparatus called a handler, a large number of ICs stored in a tray are transported into the testing apparatus, and each IC is connected to a test head in a state where high or low temperature stress is applied. Press against the socket terminal (contact), and let the test equipment (tester) perform the test. When the test is completed, each IC is taken out of the test process and placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.
[0003]
A conventional handler stores a pre-test IC or a tray for storing a tested IC (hereinafter also referred to as a customer tray), and a tray that is circulated through the handler (hereinafter also referred to as a test tray). In this type of handler, the IC is replaced between the customer tray and the test tray before and after the test, and the IC is brought into contact with the socket terminal. In the test process for performing the test, the IC is pressed against the test head while being mounted on the test tray.
[0004]
In such a handler, thermal stress is applied to the IC by transporting the above-described test tray into a thermostatic chamber (hereinafter also referred to as a chamber). In a test specification in which high-temperature thermal stress is applied, the IC is heated by a heater. Hot air is sent into the chamber, and a low temperature gas such as liquid nitrogen is sent into the chamber in a test specification where low temperature thermal stress is applied.
[0005]
FIG. 6 is a cross-sectional view showing the inside of the chamber 102 of the conventional electronic component testing apparatus. A test tray TST on which a plurality of ICs are mounted is conveyed immediately above the test head 5 and is provided on the Z-axis drive device provided above this. Each IC is pressed against the terminal 51 of the socket by lowering the pressing portion 111 of 110. Note that a match plate 120 is mounted between the Z-axis drive device 110 and the test tray TST to cope with a change in the pressing portion 111 accompanying a change in the type of the test tray TST. The Z-axis drive device 110 is pressed via a pusher 121 provided on the match plate 120 according to the arrangement.
[0006]
[Problems to be solved by the invention]
By the way, in the electronic component testing apparatus of the type shown in FIG. 6, it is appropriate that the Z-axis drive device 110 for pressing the IC mounted on the test tray TST against the socket terminal 51 is disposed above the test head 5. Therefore, the unit 130 in which the heater 131, the liquid nitrogen nozzle 132, and the blower fan 133 for supplying warm air or cold air into the chamber 102 are generally provided in an extra space such as a corner of the chamber 102. Is.
[0007]
For example, the unit 130 is disposed in the upper corner portion of the chamber 102 as shown in the figure, and hot air or cold air is circulated by the blower fan 133 to raise the IC mounted on the test tray TST to a predetermined temperature. Decrease the temperature.
[0008]
However, in the conventional electronic component test apparatus, the flow of the hot air or the cold air in the chamber 102 is unidirectional as indicated by the white arrow in the figure, so that the IC located on the right side of the figure has a predetermined temperature. However, the IC located on the left side has a problem that it is difficult to raise or lower the temperature.
[0009]
In particular, when a large number of about 64 ICs are mounted on one test tray in order to increase the throughput of the handler, the heat capacity increases to make it difficult to raise or lower the temperature. Warmth occurs.
[0010]
The present invention has been made in view of such problems of the prior art, and a temperature application method for an electronic component and an electronic component capable of uniformly applying temperature to a large number of electronic components in a short time. An object is to provide a test apparatus.
[0011]
[Means for Solving the Problems]
(1) In order to achieve the above object, according to the first aspect of the present invention, electrons for supplying a temperature applying fluid in a chamber to a plurality of electronic components mounted substantially flush with a tray In the temperature application method for components, the temperature application fluid supply means circulates the temperature application fluid throughout the chamber, and a part of the temperature application fluid to be circulated throughout the chamber is directly By spraying the electronic component as well, the temperature applying method for the electronic component is provided, wherein the temperature applying fluid is supplied to the plurality of electronic components substantially straight .
[0014]
In the present invention, the temperature application fluid is supplied to the plurality of electronic components mounted substantially flush with each other, so that the temperature application fluid is evenly supplied to each electronic component. Thus, the occurrence of uneven temperature can be prevented and the temperature raising / lowering time can be shortened.
[0015]
(2 -1) Furthermore, in order to achieve the above object, a third, according to the aspect, the temperature applied fluid supply means for supplying the temperature application fluid for applying a temperature to the electronic component of the present invention A tray having the plurality of electronic components mounted thereon and transported into the chamber, a pressing means for pressing the plurality of electronic components mounted on the tray against the contact of the test head, and the pressing means Drive means for raising and lowering and pressing the pressing means against the contact, and interposed between the electronic component and the pressing means for transmitting the pressing force from the pressing means to each of the electronic components. In the electronic component testing apparatus comprising a mounting plate, the temperature applying fluid is circulated through the entire chamber by the temperature applying fluid supply means. A part of the temperature application fluid circulating in the entire chamber is formed with a through hole through which the temperature application fluid supplied from the temperature application fluid supply means can pass, respectively. However, the electronic component testing apparatus is characterized in that the electronic component can also be sprayed directly through the through hole.
[0016]
In this invention, since the through holes through which the temperature applying fluid can pass are formed in each of the driving means and the interposition plate, the temperature applying fluid blown out from the supply port passes through each through hole, and each electron The parts will be sprayed. Therefore, the temperature application fluid is uniformly supplied to the respective electronic components, so that the occurrence of uneven temperature can be prevented and the temperature raising / lowering time can be shortened.
[0017]
(2-2) is not particularly limited in the present invention, a first through hole formed in said drive means, between a plurality of first pressing portion for applying a pressing force to each of the electronic component It is more preferable that they are formed uniformly.
[0018]
By uniformly forming the first through hole in the driving means, the temperature application fluid blown out from the supply port is more evenly supplied to the electronic component, thereby suppressing the uneven temperature and shortening the heating / lowering time. The effect becomes more remarkable.
[0019]
( 2-3 ) Although not particularly limited in the present invention, the second through hole formed in the intervention plate is between the plurality of second pressing portions that press each of the electronic components. It is preferable that they are formed uniformly.
By uniformly forming the second through-hole in the interposed plate, the temperature application fluid blown out from the supply port is supplied more evenly to the electronic component, thereby preventing the uneven temperature from being suppressed and the temperature increase / decrease time. The shortening effect becomes more prominent.
[0021]
( 2-4 ) Furthermore, although not particularly limited in the present invention, it is more preferable that the first through hole and the second through hole are formed at positions substantially overlapping in a plan view. .
[0022]
By forming the first through hole and the second through hole at positions where they substantially overlap in plan view, the temperature application fluid blown from the supply port is supplied to the electronic components more in parallel and evenly. Thus, the effect of suppressing uneven temperature and the effect of shortening the temperature raising / lowering time become more remarkable.
[0023]
( 3 ) An electronic component test apparatus to which the temperature application method of the present invention is applied and an electronic component test apparatus of the present invention can be applied as long as they have a chamber (constant temperature bath) and perform a high temperature test. All electronic component testing devices are included, such as those that perform low temperature tests, those that perform both, or those that also perform room temperature tests.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus according to the present invention (a part thereof is shown for convenience), and FIG. 2 is an electronic component in the test apparatus (hereinafter also simply referred to as an IC or IC under test). .) Is a conceptual diagram showing a handling method, and FIG. 3 is an exploded perspective view showing a test tray used in the electronic component testing apparatus shown in FIG. Note that FIG. 2 is a diagram for understanding the method of routing the IC under test in the electronic component testing apparatus of this embodiment, and actually shows the members arranged side by side in the vertical direction in plan view. There is also a part. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
[0025]
The electronic component test apparatus according to the present embodiment includes a handler 1 for handling an IC under test, a test head 5 that is electrically contacted with the IC under test, and a test signal sent to the test head 5 to thereby test the IC under test. And a tester (not shown) that performs the above test, and tests (inspects) whether the IC operates properly with high or low temperature stress applied to the IC under test. It is a device that classifies ICs according to. In the operation test in a state where such temperature stress is applied, a test tray TST (see FIG. 3) that is transported in the electronic component test apparatus 1 from a tray (customer tray KST) on which a large number of ICs to be tested are mounted. ) To replace the IC under test.
[0026]
For this reason, as shown in FIGS. 1 and 2, the electronic component testing apparatus 1 of the present embodiment stores ICs to be tested to be tested from now on, and also classifies and stores tested ICs. A loader unit 300 that sends an IC under test sent from the IC storage unit 200 to the chamber unit 100, a chamber unit 100 to which the test head 5 is mounted, and a tested IC that has been tested in the chamber unit 100. And an unloader unit 400 to be taken out.
[0027]
IC storage unit 200
The IC storage unit 200 is provided with a pre-test IC stocker 201 that stores ICs to be tested before testing, and a tested IC stocker 202 that stores ICs to be tested classified according to the test results.
[0028]
As shown in FIG. 1, the pre-test IC stocker 201 and the tested IC stocker 202 can enter a frame-like tray support frame 203 and enter the lower part of the tray support frame 203 and move up and down. An elevator 204 is provided. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
[0029]
The pre-test IC stocker 201 holds and holds the customer trays KST storing the ICs to be tested, and the tested IC stocker 202 holds the ICs to be tested. Are stacked and held in a customer tray KST appropriately classified.
[0030]
Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 are appropriately set as necessary. be able to.
[0031]
In the example shown in FIG. 1 and FIG. 2, two stockers STK-B are provided in the pre-test stocker 201, and two empty stockers STK-E to be sent to the unloader unit 400 are provided next to them, and a tested IC stocker is provided. Eight stockers STK-1, STK-2,..., STK-8 are provided in 202, and are configured to be classified into a maximum of eight categories according to the test results and stored. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0032]
Loader unit 300
The above-described customer tray KST is carried from the lower side of the device substrate 105 to the window portion 306 of the loader unit 300 by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. Then, in the loader unit 300, the ICs to be tested loaded on the customer tray KST are once transferred to a precursor (preciser) 305 by the XY transport device 304, where the mutual positions of the ICs to be tested are determined. After the correction, the IC under test transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.
[0033]
As shown in FIG. 1, an IC transfer device 304 that reloads ICs to be tested from the customer tray KST to the test tray TST includes two rails 301 installed on the upper part of the device substrate 105, and the two rails 301. , The movable arm 302 that can reciprocate between the test tray TST and the customer tray KST (this direction is the Y direction), and is supported by the movable arm 302 and can move in the X direction along the movable arm 302. And a movable head 303.
[0034]
The movable head 303 of the XY transport device 304 is mounted with a suction head downward, and the suction head moves while sucking air, thereby sucking the IC under test from the customer tray KST, The IC under test is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and eight ICs to be tested can be transferred to the test tray TST at a time.
[0035]
Chamber portion 100
The test tray TST described above is loaded into the chamber portion 100 after the ICs to be tested are loaded by the loader unit 300, and each IC under test is tested in a state of being mounted on the test tray TST.
[0036]
The chamber section 100 includes a soak chamber 101 that preliminarily applies a target high temperature or low temperature heat stress to the IC under test loaded on the test tray TST, and a state in which the preheat stress is applied in the soak chamber 101 The target thermal stress is further applied to the IC under test, and the applied thermal stress is removed from the test chamber 102 in which the IC under test is brought into contact with the test head and the IC under test tested in the test chamber 102. And an unsoak chamber 103.
[0037]
In the unsoak chamber 103, when a high temperature is applied in the soak chamber 101, the IC under test is cooled by air blowing to return to room temperature, and when a low temperature of about −30 ° C. is applied in the soak chamber 101, for example, The IC is heated with warm air or a heater to return it to a temperature at which no condensation occurs. Then, the heat-removed IC under test is carried out to the unloader section 400.
[0038]
As shown in FIG. 1, the soak chamber 101 and the unsoak chamber 103 of the chamber unit 100 are disposed so as to protrude upward from the test chamber 102. Further, as shown conceptually in FIG. 2, the soak chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. Wait while. During this standby, high or low temperature heat stress is preliminarily applied to the IC under test.
[0039]
On the other hand, the test head 5 is disposed in the center of the test chamber 102, and the test tray TST is carried on the test head 5 to electrically contact the terminals of the IC under test with the contact pins of the test head 5. The test is performed. The test tray TST for which the test has been completed is removed by the unsoak chamber 103, and the temperature of the IC is returned to room temperature, and then discharged to the unloader unit 400.
[0040]
FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 2 and shows the inside of the test chamber 102. The test tray TST conveyed directly above the test head 5 is at a position immediately above it. Then, it is pressed against each contact 51 of the test head 5 via a match plate 120 (corresponding to an interposed plate of the present invention) provided in a state supported by the test chamber 102. The match plate 120 is a component that is appropriately replaced according to the type of IC under test in order to give versatility to the Z-axis driving means 110 described later, and is not mounted on the test tray TST although detailed drawings are omitted. The shape and arrangement of the pusher 121 are determined according to the state, the type of IC under test, and the like.
[0041]
A pressing force is applied to the IC under test by a Z-axis driving device 110 (corresponding to the driving means of the present invention) provided on the upper portion of the test head 5, and a part of the driving unit is omitted. However, as the Z-axis drive device 110 is moved up and down, the pressing portion 111 is moved up and down, so that the IC under test is pressed against the contact 51.
[0042]
In particular, in the present embodiment, as shown in FIG. 5, a plurality of through holes 122 (hereinafter referred to as second through holes) are formed between the pushers 121 of the match plate 120, and the Z-axis drive corresponding to the upper part thereof is also provided. A plurality of through holes 112 (hereinafter referred to as first through holes) are also formed at the position of the device 110. The shape, quantity, or setting position of the first and second through holes 112 and 122 are not particularly limited. In the present embodiment, as shown in FIG. 5, one second through hole 122 is formed so as to be surrounded by four pushers 121, and the second through hole 122 is substantially even in the entire match plate 120. It is formed so that it may be located in.
[0043]
Further, as shown in FIG. 4, a temperature application unit 130 is provided at the upper corner portion of the test chamber 102 (or may be passed to the soak chamber 101). There are provided a heater 131 for performing low temperature, a liquid nitrogen blowing nozzle 132 for performing low temperature application, and a scroll fan 133 for supplying the hot air or the cold air into the chamber 102. In addition, the unit 130 is formed with a supply port 134 and a suction port 135 so that warm air or cold air flows as indicated by white arrows in the figure.
[0044]
As shown in FIG. 1, an apparatus substrate 105 is handed over in the vicinity of the chamber unit 100, and a test tray transfer device 108 is provided on the apparatus substrate 105. The test tray TST discharged from the unsoak chamber 103 by the test tray transfer device 108 provided on the apparatus substrate 105 is returned to the soak chamber 101 via the unloader unit 400 and the loader unit 300.
[0045]
FIG. 3 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. In the test tray TST, a plurality of crosspieces 13 are provided on the rectangular frame 12 in parallel and at equal intervals, and a plurality of mounting pieces 14 are provided on both sides of the crosspieces 13 and on the side 12a of the frame 12 facing the crosspieces 13, respectively. Are formed protruding at equal intervals. An insert storage portion 15 is configured by the space between these bars 13, between the bars 13 and the side 12 a, and the two attachment pieces 14.
[0046]
Each insert storage portion 15 stores one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. For this purpose, attachment holes 21 for attachment pieces 14 are formed at both ends of the insert 16. For example, 4 × 16 (64) of such inserts 16 are attached to one test tray TST.
[0047]
Each insert 16 has the same shape and the same dimensions, and the IC under test is accommodated in each insert 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC under test to be accommodated, and is a rectangular recess in the example shown in FIG.
[0048]
Here, if the ICs to be tested connected to the test head 5 at a time are ICs to be tested arranged in 4 rows × 16 columns as shown in FIG. Rows (16) of ICs under test are tested simultaneously. That is, in the first test, 16 ICs to be tested arranged in every fourth row from the first row are connected to the contact pins of the test head 5, and in the second test, the test tray TST is set to 1. Sixteen ICs to be tested are moved in the same manner and arranged every fourth row from the second row, and all of the ICs to be tested are tested by repeating this four times (16 simultaneous measurements). The result of this test is stored in an address determined by, for example, the identification number assigned to the test tray TST and the number of the IC under test assigned inside the test tray TST.
[0049]
Unloader unit 400
The unloader unit 400 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300. The XY transport devices 404 and 404 allow the unloader unit 400 to Tested ICs are transferred from the test tray TST carried out to the customer tray KST.
[0050]
As shown in FIG. 1, the device substrate 105 of the unloader unit 400 has a pair of windows 406 and 406 arranged so that the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105. Two pairs have been established.
[0051]
Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window 406. Here, the tested ICs to be tested are reloaded and become full. The customer tray KST is loaded and lowered, and the full tray is transferred to the tray transfer arm 205.
[0052]
Incidentally, in the electronic component testing apparatus 1 of the present embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, non-defective products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices. In addition to these, four categories are sufficient, but retesting is required, for example. Categories that do not belong to these categories, such as things, may occur.
[0053]
As described above, when an IC under test that is classified into a category other than the category assigned to the four customer trays KST arranged in the window 406 of the unloader unit 400 is generated, one customer from the unloader unit 400 is generated. The tray KST is returned to the IC storage unit 200. Instead, the customer tray KST that should store the newly generated IC under test category is transferred to the unloader unit 400, and the IC under test is stored. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, resulting in a problem that the throughput is reduced. For this reason, in the electronic component testing apparatus 1 of the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and the IC under test is a category that rarely occurs in the buffer unit 405. Is temporarily stored.
[0054]
For example, the buffer unit 405 is provided with a capacity capable of storing about 20 to 30 ICs to be tested, and a memory for storing each category of IC stored in each IC storage position of the buffer unit 405 is provided. The category and position of the IC under test temporarily stored in the table are stored for each IC under test. Then, at the time of sorting work or when the buffer unit 405 is full, the customer tray KST of the category to which the IC under test stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. . At this time, the IC under test temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when calling the customer tray KST, a plurality of customer trays KST are loaded at a time in the window portion of the unloader unit 400. Call to 406.
[0055]
Next, the operation will be described.
The customer tray on which the IC to be tested is loaded is sent from the pre-test stocker 201 to the window 306, and is transferred to the test tray TST stopped in the loader unit 300 by the XY transport device 304. A predetermined temperature is applied to the test tray TST in the soak chamber 101 and the test chamber 102 while being fed into the chamber unit 100 and being sequentially fed by the vertical transfer device.
[0056]
In this embodiment, hot air or cold air is supplied from the temperature applying unit 130 in this embodiment, and this hot air or cold air is supplied when the air flows along the ceiling surface of the test chamber 102 as shown in FIG. The part is sprayed directly onto the IC under test through the first through hole 112 formed in the Z-axis drive device 110 and the second through hole 122 formed in the match plate 120. Other hot air or cold air circulates along the right side wall of the test chamber 102 and returns to the inlet 135 of the unit 130 through the gap between the match plate 120 and the test tray TST.
[0057]
That is, in the handler 1 of the present embodiment, the hot air or the cold air blown from the supply port 134 of the temperature application unit 130 is blown in a plane and parallel to a plurality of ICs mounted in a plane. Therefore, the amount of heat supplied to each IC under test is equalized, and the temperature rise / fall times of the plurality of ICs under test are equalized. Accordingly, even when 64 ICs to be tested are mounted, for example, the occurrence of uneven temperature can be prevented, and as a result, the temperature raising / lowering time can be shortened.
[0058]
The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
[0059]
For example, in the above-described embodiment, 64 ICs to be tested are mounted on one test tray TST. However, the number of mounted ICs is not limited at all in the present invention, and the number of mounted ICs may be larger or smaller than this. Within range.
[0060]
【The invention's effect】
As described above, according to the present invention, the temperature application fluid is evenly supplied to the respective electronic components, so that the occurrence of uneven temperature can be prevented and the temperature raising / lowering time can be shortened.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an electronic device test apparatus according to the present invention.
FIG. 2 is a conceptual diagram showing a method for handling electronic components in the electronic component testing apparatus shown in FIG.
3 is an exploded perspective view showing a test tray used in the electronic component testing apparatus shown in FIG. 1. FIG.
4 is a cross-sectional view taken along line IV-IV in FIG.
FIG. 5 is a plan view showing an embodiment of an intervention plate according to the present invention.
FIG. 6 is a cross-sectional view showing a conventional electronic device testing apparatus.
[Explanation of symbols]
1 ... Handler (Electronic component testing equipment)
100 ... Chamber part 110 ... Z-axis drive device (drive means)
111 ... Pressing part (first pressing part)
112 ... 1st through-hole 120 ... Match plate (interposition plate)
121 ... pusher (second pressing part)
122 ... 2nd through-hole 130 ... temperature application unit 200 ... IC storage part 300 ... loader part 400 ... unloader part 5 ... test head 51 ... contact TST ... test tray

Claims (5)

In a temperature application method for an electronic component that supplies a temperature application fluid in a chamber to a plurality of electronic components mounted substantially flush with a tray,
The temperature application fluid supply means circulates the temperature application fluid throughout the chamber,
A part of the temperature application fluid circulated throughout the chamber is directly sprayed onto the electronic component, thereby supplying the temperature application fluid to the plurality of electronic components substantially in a plane. A temperature application method for electronic components. A chamber having temperature applying fluid supply means for supplying a temperature applying fluid for applying temperature to the electronic component; a tray on which the plurality of electronic components are mounted and conveyed into the chamber; and the tray A pressing means for pressing a plurality of electronic components mounted on the contact of the test head; a driving means for raising and lowering the pressing means to press the pressing means against the contact; the electronic component and the pressing means; In an electronic component testing apparatus comprising an interposed plate that is interposed between and transmits the pressing force from the pressing means to each of the electronic components,
The temperature application fluid circulates in the entire chamber by the temperature application fluid supply means,
Each of the driving means and the interposition plate is formed with a through-hole through which the temperature applying fluid supplied from the temperature applying fluid supply means can pass, and the temperature applying fluid circulating in the entire chamber. An electronic component testing apparatus, wherein a part of the electronic component is sprayed directly through the through hole. First through hole formed in said drive means, according to claim 2, characterized in that are evenly formed between the plurality of first pressing portion for applying a pressing force to each of the electronic component Electronic component testing equipment. Second through hole formed in the interposed plate, according to claim 2 or 3 further characterized in that are evenly formed between the second pressing portion of the plurality of pressing each of the electronic component Electronic component testing equipment. 5. The electronic component testing apparatus according to claim 3, wherein the first through hole and the second through hole are formed at positions substantially overlapping in a plan view.

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