WO2008032397A1

WO2008032397A1 - Electronic component testing apparatus

Info

Publication number: WO2008032397A1
Application number: PCT/JP2006/318361
Authority: WO
Inventors: Kenichi Shimada; Kazuyuki Yamashita
Original assignee: Advantest Corporation
Priority date: 2006-09-15
Filing date: 2006-09-15
Publication date: 2008-03-20
Also published as: CN101512357A; TWI346787B; TW200821598A

Abstract

An electronic component testing apparatus is provided with a casing (121) hermetically sealing a space surrounding a pusher (129) and a socket (50); a heat exchanger (122) for increasing or reducing temperature of a fluid that exists in the casing (121); and a fan (123) for circulating the fluid; a duct (126) for directly guiding the fluid from the heat exchanger (122) to the vicinity of a measuring position (900). Furthermore, the fan (123) recovers the fluid guided to the measuring position (900) through the duct (126).

Description

Specification

Electronic component testing equipment

Technical field

The present invention is used to test an IC device by electrically contacting various electronic components such as a semiconductor integrated circuit element (hereinafter also referred to as an IC device) with a contact portion of a test head. The present invention relates to an electronic component testing apparatus.

Background art

[0002] In an electronic component test apparatus called a handler, a large number of IC devices housed in a tray are transported into a nodola, and each IC device is brought into electrical contact with a test head to perform an electronic component test. Have the device body (hereinafter referred to as a tester) perform the test. When the test is completed, each IC device is ejected from the test head and placed on the tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.

[0003] Such an IC device test is performed in a state where a thermal stress of about 55 ° C. to 150 ° C. is applied to the IC device. Therefore, a test chamber is provided above the test head. This test chamber is equipped with a heat exchanger and a fan, and the air heated or absorbed by the heat exchanger is circulated in the casing of the test chamber by the fan.

[0004] At the time of starting up the electronic component testing apparatus, in preparation for the IC device test, the heat exchanger and the fan are used to change the atmosphere at the measurement position where the IC device is located in the test chamber to the predetermined set temperature. It is necessary to adjust with high accuracy.

[0005] However, when the temperature is raised or lowered at the time of starting, it is necessary to heat or cool all structures existing in the test chamber in addition to the measurement position. In particular, since the measurement position is located downstream of the structure with a large heat capacity in the air circulation path by the fan in the test chamber, it takes a lot of time for the atmosphere at the measurement position to reach the set temperature. You may need it.

[0006] In addition, an electronic component test apparatus capable of simultaneously testing a plurality of IC devices has a plurality of measurement positions, and among the plurality of measurement positions, the upstream side of the air circulation path by the fan is provided. Some are located and some are located downstream. others Therefore, a temperature difference may occur among a plurality of measurement positions, and it may be difficult to accurately raise or lower the temperature to the set temperature intended for each measurement position.

Disclosure of the invention

[0007] An object of the present invention is to provide an electronic component testing apparatus capable of shortening the startup time at startup and improving the temperature application accuracy.

In order to achieve the above object, according to the present invention, in order to test an electronic device under test, an electronic device capable of pressing the electronic device under test against a contact portion of a test head by pressing means. A component testing apparatus comprising: a chamber for sealing a space surrounding the pressing unit and the contact portion; a temperature adjusting unit capable of raising or lowering a fluid existing in the chamber; and circulating the fluid in the chamber. And circulating means for directing the fluid from the temperature adjusting means to the vicinity of the measurement position where the electronic device under test is located at the time of the test. There is provided an electronic component test apparatus for recovering the fluid that has been guided to the vicinity of the measurement position via (see claim 1).

In the present invention, the fluid whose temperature has been raised or lowered by the temperature adjusting means is directly guided to the vicinity of the measurement position. As a result, the measurement position can be preferentially raised or lowered over the other structures in the test chamber, so that the start-up time of the electronic component test apparatus can be shortened.

[0010] In addition, since the temperature difference between the plurality of measurement positions can be reduced by directly guiding the fluid in the vicinity of each measurement position, it is possible to improve the temperature application accuracy.

[0011] In the above invention, although not particularly limited, the pressing means includes a heat absorbing / dissipating body for absorbing heat from the fluid or dissipating heat to the fluid, and is provided in the vicinity of the measurement position. The means preferably induces the fluid directly from the circulation means to the heat sink / radiator (see claim 2).

[0012] In the above invention! /, Although not particularly limited !, the guiding means includes a conduit for guiding the fluid from the temperature adjusting means to the vicinity of the measurement position, and the conduit includes: It is preferably provided in the test chamber (see claim 3).

[0013] Although not particularly limited in the above invention, the conduit is close to the temperature adjusting means. It is preferable to have an inlet that opens near the outlet and an outlet that opens near the measurement position (see claim 4).

[0014] Although not particularly limited in the above invention, the electronic component test apparatus includes a plurality of the pressing means, and each pressing means has a heat absorbing / dissipating body for absorbing heat or radiating heat from the fluid. It is preferable that the conduit has a plurality of outlets that open to the vicinity of the heat-absorbing and radiating bodies of the pressing means, respectively (see claim 5).

[0015] In the above invention, the fluid flowing out through the outlet is not particularly limited.

And a distribution means for substantially evenly distributing the plurality of heat absorbing / dissipating bodies.

V, preferably (see claim 6).

[0016] Although not particularly limited in the above invention, the distribution means preferably includes a flap provided around the outlet in order to adjust the flow rate of the fluid flowing out from the outlet. 7).

[0017] In the above invention, although not particularly limited, the electronic component test apparatus further includes a temperature measuring means for measuring the temperature of the fluid, and the temperature measuring means is circulated by the circulation means. It is preferable that the fluid circulation path is provided in the vicinity of the downstream side of the outlet of the conduit or in the vicinity of the downstream side of the measurement position (see claim 8).

[0018] By providing the temperature measurement means in the vicinity of the downstream side of the outlet of the conduit or in the vicinity of the downstream side of the measurement position in the fluid circulation path, the temperature at the measurement position can be accurately measured.

[0019] Although not particularly limited in the above invention, based on the measurement results of a plurality of temperature measurement means for measuring the temperature of the fluid and at least one temperature measurement means of the plurality of temperature measurement means, And a control means for controlling the temperature adjusting means (refer to claim 9).

[0020] Although not particularly limited in the above invention, the plurality of temperature measuring means includes a first temperature measuring means and a second temperature measuring means, and the first temperature measuring means is configured to perform the test at the time of the test. The second temperature measuring means is provided in the vicinity of the measurement position where the electronic device under test is located, and the second temperature measuring means is downstream of the temperature adjusting means in the fluid circulation path circulated by the circulating means. And provided upstream of the measurement position. Preferred (see claim 10).

[0021] By providing the first temperature measuring means in the vicinity of the measurement position, the temperature at the measurement position can be measured with high accuracy, so that the temperature application accuracy can be improved.

[0022] Although not particularly limited in the above invention, a plurality of the measurement positions are provided so that a plurality of the electronic devices to be tested can be simultaneously tested, and the first temperature measurement means is provided in the circuit. ! / Is preferably provided near the downstream side of the plurality of measurement positions (see claim 11).

[0023] Although not particularly limited in the above invention, the control means is a measurement result of one of the first temperature measuring means or the second temperature measuring means so as to shorten the temperature rising time or the temperature falling time. It is preferable to control the temperature adjusting means based only on the measurement result of the other of the second temperature measuring means or the first temperature measuring means after controlling the temperature adjusting means based only on (See claim 12).

[0024] Although not particularly limited in the above invention, the control means performs temperature increase or decrease by the temperature adjustment means until the first temperature measurement means measures the first set temperature, and then It is preferable to limit the temperature increase or decrease by the temperature adjusting means until the second temperature measuring means measures the second set temperature (see claim 13).

[0025] Although not particularly limited in the above invention, the control unit is configured to control the temperature so that the temperature at the measurement position is maintained at a third set temperature based on the measurement result of the second temperature measurement unit. It is preferable to control the adjusting means (see claim 14).

[0026] Although not particularly limited in the above invention, it is preferable that the first set temperature is relatively higher than the third set temperature (see claim 15).

[0027] Although not particularly limited in the above invention, the second set temperature is substantially the same as the third set temperature, or is relatively low with respect to the third set temperature. Preferably it is temperature (see claim 16).

[0028] Although not particularly limited in the above invention, the control means sets the second set temperature based on the measurement result of the first temperature measurement means and the measurement result of the second temperature measurement means. It is preferable to correct it (see claim 17).

[0029] In the above invention, although not particularly limited, a plurality of the first temperature measuring means, The control means preferably corrects the second set temperature based on the measurement results of all the first temperature measurement means and the measurement results of the second temperature measurement means. (See claim 18).

Brief Description of Drawings

FIG. 1 is a schematic side view showing an electronic device test apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a test chamber of the electronic device test apparatus according to the embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a pusher unit of the electronic component test apparatus according to the embodiment of the present invention.

FIG. 9A is a cross-sectional view showing a pusher used in the electronic device test apparatus according to the embodiment of the present invention, and is a view showing a state where the pressing member is at the reference position.

FIG. 9B is a cross-sectional view showing a pusher used in the electronic device test apparatus according to the embodiment of the present invention, and shows a state in which the pressing member is relatively moved upward with respect to the guide member. is there.

FIG. 9C is a cross-sectional view showing a pusher used in the electronic device testing apparatus according to the embodiment of the present invention, and shows a state in which the pressing member is moved relative to the left side with respect to the guide member. .

[FIG. 9D] FIG. 9D shows a pusher used in the electronic device test apparatus according to the embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state where the pressing member is moved relative to the right side with respect to the guide member.

[10A] FIG. 10A is a cross-sectional view of the main part of the pusher unit of the electronic device test apparatus according to the embodiment of the present invention, and shows a state where the pusher is at the reference position.

[10B] FIG. 10B is a cross-sectional view of the main part of the pusher unit of the electronic device test apparatus according to the embodiment of the present invention, showing a state in which the pusher is relatively moved upward with respect to the base member.

[10C] FIG. 10C is a cross-sectional view of the main part of the pusher unit of the electronic device test apparatus according to the embodiment of the present invention, showing a state in which the pusher is moved relative to the left side with respect to the base member.

[10D] FIG. 10D is a cross-sectional view of the main part of the pusher unit of the electronic device test apparatus according to the embodiment of the present invention, showing a state in which the pusher is moved relative to the right side with respect to the base member.

FIG. 11 is a cross-sectional view of a principal part of a pusher unit according to another embodiment of the present invention.

FIG. 12 is a flowchart showing a method of applying temperature and monitoring temperature in the test chamber in the electronic device test apparatus according to the embodiment of the present invention.

FIG. 13 is a graph showing an example of transition of measured values by the first and second temperature sensors when the temperature is adjusted by the method shown in FIG.

Explanation of symbols

1 ... Nondra

100 ··· Chamber section

120 ... Test Channo

122… Heat exchanger

123 ··· Fan

124a, 124b ... Temperature sensor

126

126a… Inlet side duct 126b ... Entrance

126c ... Seno router

126d ... Exit

128 ··· Pusher unit

128a, 128b… Base member

129 ... pusher

129a ... Pressing member

129c… heat sink

129e ... Guide member

200 ... storage

300 ··· Loader

400 ... unloader

5 ... Test head

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a conceptual diagram which shows the handling of the tray in.

FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment. In practice, the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.

[0035] The electronic device test apparatus according to the present embodiment tests (inspects) whether or not the IC device can properly operate in a state in which a high-temperature or low-temperature thermal stress is applied to the IC device. It is a device that classifies IC devices based on it, and consists of a handler 1, a test head 5, and a tester 6. The IC device test using this electronic component test equipment is a tray in which a large number of IC devices to be tested are mounted (hereinafter referred to as customer tray; see Fig. 5). This is called a tray (see Fig. 6). It is carried out by changing the chair.

Therefore, as shown in FIGS. 1 to 3, the handler 1 in the present embodiment stores IC devices to be tested from now on, and a storage unit 200 that classifies and stores tested IC devices. And classifying the loader unit 300 that sends IC devices sent from the storage unit 200 into the chamber unit 100, the chamber unit 100 including the test head 5, and the IC devices that have been tested in the chamber unit 100. The unloader part 400 to be taken out and the power are also configured! RU

[0037] The socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned. As shown in FIG. 1, a space is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in this space, and through a through hole formed in the device base of the handler 1, It is possible to make electrical contact between the IC device and the socket 50 on the test head 5. When changing the type of IC device, it is replaced with another test head that has a socket suitable for the shape and pin count of the IC device of that type.

[0038] Each part of the handler 1 will be described in detail below.

[0039] <Storage unit 200>

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component test apparatus according to the embodiment of the present invention, and FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus according to the embodiment of the present invention. .

[0040] The storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to the test results! /ヽ.

As shown in FIG. 4, these stockers 201 and 202 include a frame-like tray support frame 203 and an elevator 204 that can be moved up and down by entering the lower force of the tray support frame 203 and moving upward. And. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. In the customer tray KST in this embodiment, as shown in FIG. 5, the accommodating portions for accommodating the IC devices are arranged in 10 rows × 6 columns. [0042] Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the number of the pre-test IC stocker 201 and the tested IC stocker 202 is set to an appropriate number as necessary. can do.

In this embodiment, as shown in FIG. 2 and FIG. 3, two stock forces STK-B are provided in the pre-test IC stocker 201, and an empty customer tray sent to the unloader unit 400 is provided next to the stock force STK-B. There are two stacked empty stock forces STK-E. This empty tray stocks force STK

— Next to E, 8 stockers in tested IC stocker 202 STK— 1, STK— 2, S

TK 8 is provided, and can be sorted and stored in up to 8 categories according to test results. In other words, in addition to non-defective products and defective products, it can be classified into non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It becomes possible.

[0044] <Loader unit 300>

In the customer tray KST described above, the lower force of the device base 101 is also transferred to the window 306 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. In the loader unit 300, the IC device loaded in the customer tray KST is transferred to the precursor 305 by the device transport device 304 and the mutual positional relationship between the IC devices is corrected. The IC device transferred to the precursor 305 is stopped again at the loader unit 300 by using the device transfer device 304 and is loaded on the test tray TST.

[0045] As shown in FIG. 2, the device transport device 304 for transferring IC devices from the customer tray KST to the test tray TST includes two rails 301 installed on the device base 101 and the two rails 301. A movable arm 302 capable of reciprocating between the test tray TST and the customer tray KST by a rail 301, and a movable head 303 supported by the movable arm 302 and movable along the movable arm 302. I have.

[0046] A suction head (not shown) is mounted downward on the movable head 303 of the device transport device 304, and the suction head moves while sucking to hold the IC device from the customer tray KST. Then, transfer the IC device to the test tray TST. For example, about eight of these suction heads are attached to one movable head 303. IC devices can be transferred to the test tray TST.

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention. In this test tray TST, a plurality of crosspieces 13 are provided in parallel at equal intervals on the rectangular frame 12, and a plurality of mounting pieces 14 are provided on both sides of the crosspieces 13 and on the side 12a of the frame 12 facing the crosspieces 13, respectively. It is formed to protrude at equal intervals. An insert accommodating portion 15 is constituted by the space between these bars 13 or between the bars 13 and the side 12a and the two attachment pieces 14.

[0048] Each insert receiving portion 15 is adapted to receive one insert 16 and the insert 16 is attached to the two attachment pieces 14 using a fastener 17 in a floating state. Therefore, holes 21 for attachment to the attachment pieces 14 are formed at both ends of the insert 16. For example, about 16 X 4 inserts 16 are attached to one test tray TST.

Each insert 16 has the same shape and the same dimensions, and an IC device is accommodated in each insert 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG. Further, guide holes 20 into which the guide pins 129f of the pusher 129 are inserted are provided on both sides of the IC housing portion 19.

[0050] <Chamber part 100>

FIG. 7 is a cross-sectional view showing a test chamber of the electronic device test apparatus according to the embodiment of the present invention. FIG. 8 is a cross-sectional view showing a pusher unit of the electronic device test apparatus according to the embodiment of the present invention. 9D is a cross-sectional view showing a pusher used in the electronic component test apparatus of the present invention, FIGS. 10A to 10D are cross-sectional views of the main parts of the pusher of the electronic component test apparatus according to the embodiment of the present invention, and FIG. It is principal part sectional drawing of the pusher unit in other embodiment of invention.

[0051] After the IC device is loaded in the loader unit 300, the test tray TST described above is sent to the chamber unit 100, and the test of each IC device is performed with the IC device mounted on the test tray TST. The

[0052] The chamber unit 100 has a high temperature intended for IC devices loaded on the test tray TST. Alternatively, the soak chamber 110 to which a low temperature thermal stress is applied, the test chamber 120 in which the IC device in the state where the thermal stress is applied in the soak chamber 110 is electrically contacted with the test head 5, and the test chamber 120 are tested. The integrated IC device force is also composed of an unsoak chamber 130 that removes thermal stress.

[0053] The unsoak chamber 130 is preferably thermally insulated from the soak chamber 110 and the test chamber 120. In practice, a predetermined thermal stress is applied to the region between the soak chamber 110 and the test chamber 120, The unsoak chamber 130 is thermally isolated from these. In the present embodiment, these are collectively referred to as the chamber portion 100 for convenience.

[0054] The soak chamber 110 is provided with a vertical transfer device as conceptually shown in FIG. 3, and a plurality of test trays TST are placed in the vertical transfer device until the test chamber 120 is empty. Wait while being supported. Mainly, thermal stress is applied to IC devices during this standby.

In the test chamber 120, as shown in FIG. 7, a pusher unit 128 including a plurality of pushers 129 is provided above the test head 5 so as to be movable in the Z-axis direction. The plurality of pushers 129 are arranged in the pusher 128 so as to correspond to the arrangement of the sockets 50 on the test head 5. Further, above the pusher unit 128, a drive plate 127b supported by the drive shaft 127a of the Z-axis drive device 127 is provided. The drive plate 127b is connected to the Z-axis drive device 127 via the drive shaft 127b. This actuator is connected to an actuator (not shown), and can be moved up and down by driving this actuator. A plurality of convex portions 127c that press the pushers 129 are provided on the lower surface of the drive plate 127b. These convex portions 127c are arranged on the lower surface of the drive plate 127b so as to correspond to the arrangement of the pushers 129 in the pusher unit 128.

As shown in FIG. 8, the pusher unit 128 includes a plurality of pushers 129 that contact and press the IC device during a test, and an upper base member 128a that supports the top of each pusher 129 in a floating state. A lower base member 128b that supports the lower portion of each pusher 129 in a floating state and a force are also configured. Although only four pushers 129 are shown in FIGS. 7 and 8, in reality, the pusher unit 128 corresponds to the socket 50 on the test head 5, for example, a total of 64 pushers. A pusher 129 is provided. As shown in FIG. 9A, the pusher 129 includes a pusher block 129b that is in close contact with the upper surface of the IC device, a heat sink 129c that absorbs or dissipates the pusher block 129b, and a Z-axis drive device 127. And a pressing member 129a including a shaft 129c with which the convex portion 127c abuts. The pusher 129 has a guide member 129e from which a guide pin 129f protrudes downward. As shown in FIGS. 9A to 9D, the pressing member 129a is provided in the guide member 129e, and can be slightly moved up and down and left and right with respect to the guide member 129e. FIG. 9A shows a state in which the pressing member 129a is at the reference position with respect to the guide member 129e due to the weight of the pressing member 129a. FIG. 9B shows a state in which the pressing member 129a is slightly moved upward relative to the guide member 129e, and FIG. 9C is a state in which the pressing member 129a is minutely moved to the left relative to the guide member 129e. FIG. 9D shows a state where the pressing member 129a has slightly moved to the right relative to the guide member 129e.

[0058] The upper base member 128a of the pusher unit 128 is a metal member made of, for example, aluminum, and has an opening that allows the pusher 129 to pass therethrough. Similarly, the lower base member 128b is a metal member that also has, for example, an aluminum isotropic force, and has an opening that allows the pusher 129 to pass therethrough.

[0059] Each pusher 129 is inserted into and supported by the openings of the upper base member 128a and the lower base member 128b, and each pusher 129 is attached to the base member 128a, 128b as shown in FIGS. 10A to 10D. On the other hand, it can be moved minutely in the vertical and horizontal directions. FIG. 10A shows a state where the pusher 129 is at the reference position with respect to the base members 128a and 128b due to the weight of the pusher 129. FIG. 10B shows a state in which the pusher 129 has moved slightly upward relative to the base members 128a and 128b, and FIG. 10C shows that the pusher 129 has moved slightly to the left relative to the base members 128a and 128b. FIG. 10D shows a state in which the pusher 129 has slightly moved to the right relative to the base members 128a and 128b.

[0060] Further, in the present embodiment, a separator 126c is provided between the upper base member 128a and the lower base member 128b. The separator 126c is a metal flat plate member made of, for example, aluminum. The separator 126c is formed with an outlet 126d that opens toward the heat sink 129c of the pusher 129. The test chamber 120 is sealed with a casing 121 as shown in FIG. Inside the casing 121, a heat exchanger 122, a fan 123, first and second temperature sensors 124a and 124b, a pusher unit 128, and a socket 50 are provided. Further, in the present embodiment, a duct 126 is provided inside the casing 121 to guide hot air or cold air directly from the fan 123 to the heat sink 129c of the pusher 129 via the heat exchanger 122.

As shown in FIG. 7, the duct 126 includes an inlet side duct 126a, a separator 126c, and an upper base member 128a of the pusher unit 128.

[0063] As shown in the figure, the inlet-side duct 126a is a tubular member bent at a right angle, and the fan 123 force is placed on the inlet 126b. As the fan 123, for example, a sirocco fan, a turbo fan, a cross flow fan, or a propeller fan can be used.

[0064] A heat exchange ^^ 122 is provided between the inlet 126b of the inlet duct 126 and the end point. When the inside of the casing 121 is heated to a high temperature, the heat exchanger 122 is configured by a heat exchanger for heat release through which a heating medium circulates or an electric heater, and the inside of the casing 121 is, for example, about room temperature to 160 ° C. It is possible to supply a sufficient amount of heat to maintain a high temperature. On the other hand, when the inside of the casing 121 is cooled, the heat exchanger 122 is composed of an endothermic heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates, and the inside of the casing 121 is, for example, about 60 ° C. to room temperature. It has become possible to absorb a sufficient amount of heat to maintain a low temperature. In some cases, a coolant such as liquid nitrogen is directly supplied into the casing 121 for circulation.

[0065] Near the end point of the inlet duct 126a, a second temperature sensor 124b for measuring the temperature of the atmosphere in the casing 121 is provided. In contrast, the first temperature sensor 124a for measuring the temperature of the atmosphere in the casing 121 in the vicinity of the downstream side of the measurement position 900 in the hot or cold air circulation path by the fan 123 in the casing 121. Is provided. As the first and second temperature sensors 124a and 124b, for example, platinum sensors, thermocouples, or the like can be used. In the present embodiment, simply “upstream” means upstream in the circulation path of hot air or cold air by the fan 123 in the casing 121, and simply “downstream” means downstream in the circulation path. Means. [0066] In the present embodiment, by providing the first temperature sensor 124a in the vicinity of the measurement position 900, the temperature at the measurement position 900 can be measured with high accuracy, so that the temperature application accuracy is further improved. be able to.

In the present invention, the number of temperature sensors provided in the casing 121 of the test chamber 120 is not limited to two, and for example, three or more temperature sensors may be provided. In particular, when there are a plurality of measurement positions 900, the temperature application accuracy can be further improved by providing a temperature sensor in the vicinity of each measurement position 900.

[0068] As shown in FIG. 7, the heat exchanger 122 and the two temperature sensors 124a, 124b are connected to the control device 125, and the control device 125 includes the first temperature sensor 124a and the second temperature sensor. The heat exchange 22 can be controlled based on the measurement result of the support 124b.

[0069] The end point of the inlet duct 126a is connected to the separator 126c and the upper base member 128a, and the separator 126c and the upper base member 128a form a tubular structure. For this reason, the hot air or the cold air generated by the heat exchanger 122 passes through the inlet duct 126a between the upper base member 128a and the separator 126c as shown by a dashed line arrow in FIG. To the heat sink 129d of the pusher 129 and further passed between the pressing member 129a of the pusher 129 and the guide member 129e to measure the position. Guided to 900. The hot or cold air that has passed through the measurement position 900 is collected by the fan 123 and is again introduced into the inlet 126b of the inlet duct 126a to circulate!

As described above, in this embodiment, the hot air or the cold air is directly guided to the heat sink 129c at the measurement position 900 from the duct 129 by the duct 126. As a result, when the electronic component test apparatus is started, the measurement position 900 and the heat sink 129d can be heated or lowered in preference to the other structures in the casing 121. It can be shortened.

[0071] Further, by directly inducing hot air or cold air to each measurement position 900 and heat sink 129d, the temperature difference between the plurality of measurement positions 900 and heat sink 129d can be reduced. Can be improved.

[0072] As shown in FIG. 11, a flap 1 is formed around the downstream side of the outlet 126d of the separator 126c. 26e may be provided. By adjusting the height, width or angle of the flap 126e for each outlet 126d, the temperature difference between the plurality of measurement positions 900 and the heat sink 129d can be further reduced.

[0073] When testing an IC device, as shown in FIG. 8, the test tray TST is transported between the pusher unit 128 and the socket 50, and the Z-axis drive device 127 moves the drive plate 127b below the Z-axis. As a result, the entire pusher unit 128 is lowered. During this lowering, the guide pin 129f of the pusher 129 is inserted into the guide hole 20 of the insert 16, and each pusher 129 is placed upright with respect to the insert 16. When the pusher 129 is further lowered, the pusher block 129b is pressed against the upper surface of the IC device while the pressing member 129a is guided in the insert 16, and the input / output terminals of the IC device and the contact pins of the socket 50 are electrically connected. To touch. In this state, the tester exchanges test signals with the IC device via the test head, and the IC device test is executed. The result of this test is, for example, an address determined by the identification number assigned to the test tray TST and the IC device number assigned inside the test tray TST. Stored in a storage device.

[0074] Note that, as a means for transporting the test tray TST in the test chamber 120, although not particularly illustrated, for example, a transport roller or the like can be used. In addition, when the test tray TST is transported, the drive plate 127b of the Z-axis drive device 127 is sufficiently raised so that a gap through which the test tray TST can pass is formed between the pusher 129 and the socket 50. is doing.

[0075] Returning to FIGS. 1 to 3, the test tray TST for which the test has been completed is carried out to the unloader section 400 after the IC device that has been tested in the unsoak chamber 130 is removed from heat and returned to room temperature. . Further, a tray transfer device 102 is provided on the device base 101, and the test tray TST discharged from the unsoak chamber 130 by the tray transfer device 102 is soaked via the unloader unit 400 and the loader unit 300. Returned to chamber 110.

[0076] <Unloader unit 400>

The unloader section 400 is also provided with two device transport apparatuses 404 having the same structure as the device transport apparatus 304 provided in the loader section 300. By this device transport device 404, the test tray TST force tested IC device carried out to the unloader unit 400 is Can be transshipped to customer train KST according to test results.

As shown in FIG. 2, the device base 101 in the unloader unit 400 includes the unloader unit 40.

Four window portions 406 are formed so that the customer tray KST transported to 0 faces the upper surface of the apparatus base 101 !!

[0078] Although not shown, an elevating table for elevating the customer tray KST is provided below each window 406. This lifting table is lowered with a customer tray KST full of tested IC devices, and this full tray is transferred to the tray transfer arm 205.

Hereinafter, a test chamber temperature applying method at the time of starting the electronic component testing apparatus according to the present embodiment and a temperature monitoring method after the temperature in the test chamber is stabilized will be described. In the following description, the case where the temperature inside the casing 121 of the test head 5 is raised by the heat exchanger 122 will be described. However, the present invention is not particularly limited to this, and the temperature inside the casing 121 is lowered. It can also be applied to cases.

FIG. 12 is a flowchart showing a method for temperature application and temperature monitoring in the test chamber in the electronic component test apparatus according to the embodiment of the present invention, and FIG. 13 shows the first and second methods when the method shown in FIG. 12 is executed. It is a graph which shows an example of transition of the measured value by the 2nd temperature sensor

[0081] When the power of the handler 1 is turned on at the time of starting the electronic component test apparatus, the heat exchanger 122 and the fan 123 in the casing 121 are operated, and the heat exchanger 122 raises the atmosphere in the casing 121. At the same time, the fan 123 circulates the hot air generated by the heat exchange 122 (step S10 in FIG. 12).

The warm air blown by the fan 123 is directly guided to the outlets 126d of the separator 126c through the duct 126, and blown toward the heat sink 129d and the measurement position 900 of the pusher 129 with direct force.

During this time, the first temperature sensor 124a provided on the downstream side of the measurement position 900 measures the temperature of the atmosphere in the vicinity of the measurement position 900. Until the temperature Ta [° C] measured by the first temperature sensor 124a becomes equal to or higher than the first set temperature A [° C] (Ta≥A), the controller 125 continues to heat up the heat exchanger 122. (NO in step S20). [0084] As shown in Fig. 13, the first set temperature A is higher than the target third set temperature C [° C] to be applied to the measurement position 900 during the test ( A> C). In this embodiment, the atmosphere in the vicinity of the downstream side of the measurement position 900 is raised to the first set temperature A, and the temperature of the entire measurement position 900 is overshot with respect to the third set temperature C. At this time, since the second temperature sensor 124b is closer to the heat exchanger 122 than the first temperature sensor 124a, as shown in the figure, the measured temperature Ta of the first temperature sensor 124a is The measured temperature Tb of the second temperature sensor 124b is higher.

[0085] When measured temperature Ta of first temperature sensor 124a is equal to or higher than first set temperature A (YES in step S20), control device 125 controls to stop the temperature increase of heat exchanger 122. (Step S30) The temperature sensor that measures the temperature of the atmosphere in the casing 121 is switched from the first temperature sensor 124a to the second temperature sensor 124b (step S30). Then, until the temperature Tb [° C] measured by the second temperature sensor 124b becomes equal to or lower than the second set temperature B [° C] (T b ≤ B), the control device 125 stops the heat exchange 122. Leave as is (N 0 at step S50).

The second set temperature B is a temperature equal to or lower than the third set temperature C (B≤C) as shown in FIG. During this time, air is blown by the fan 123 while there is no temperature increase due to the heat exchange 122, so that the temperature decrease proceeds from the plurality of measurement positions 900 and the heat sink 129d located upstream. Therefore, the measurement temperature Tb of the second temperature sensor 124b drops faster than the measurement temperature Ta of the first temperature sensor 124a, and in the example shown in the figure, the measurement temperature Ta of the first temperature sensor 124a is measured. The measured temperature Tb of the second temperature sensor 124b is lower than that.

[0087] When measured temperature Tb of second temperature sensor 124b is equal to or lower than second set temperature B (YES in step S50), heat exchanger 122 resumes the temperature increase (step S50). Thereafter, the temperature in the casing 121 is monitored by the second temperature sensor 124b.

[0088] As described above, in the present embodiment, the first temperature sensor 124a located in the vicinity of the downstream side of the measurement position 900 is used to change the temperature of the entire measurement position 900 relative to the third set temperature C. After overshooting, the heat exchange 122 is stopped, and the temperature is lowered from the plurality of measurement positions 900 and the heat sink 129d located on the upstream side. Because of this, measurement The temperature of the entire position 900 can be made uniform in a short time, and the start-up time of the electronic component test apparatus can be shortened. In addition, since the temperature difference between the plurality of measurement positions 900 and the heat sink 129d can be reduced, the temperature application accuracy can be improved.

Furthermore, in the present embodiment, the second set temperature B is corrected while the second temperature sensor 124b is monitoring the temperature.

[0090] Specifically, first, after executing step S40, the control device 125 starts timing, and every time a predetermined time has elapsed (YES in step S60), the temperature is measured by both temperature sensors 124a and 124b. Measure and calculate the difference Δ T (Δ T = Tb−Ta) between the measured temperature Ta of the first temperature sensor 124a and the measured temperature Tb of the second temperature sensor 124b (step S70).

Next, the controller 125 subtracts Δ calculated in step S70 from the measured temperature Tb force of the second temperature sensor 124b (B = Tb—ΔΤ), and sets this value as the new second set temperature B. Set (Step S80). By monitoring the temperature with the new second set temperature B (steps S90 to S110), the temperature difference between the upstream side and the downstream side can be further reduced at the plurality of measurement positions 900, and the temperature application accuracy is further improved. Can be improved.

[0092] It should be noted that a plurality of first temperature sensors 124a may be arranged in the vicinity of a plurality of measurement positions 900, and in this case, the average value of the measured temperatures of all the first temperature sensors 124a is calculated. By using Ta used in step S 70 in FIG. 13, the temperature application accuracy can be further improved.

Note that the embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

Claims

The scope of the claims

[1] An electronic component testing apparatus capable of pressing the electronic device under test against a contact portion of a test head by a pressing means in order to test the electronic device under test, wherein the pressing means and the contact portion are A chamber that seals the surrounding space, temperature adjusting means that can raise or lower the temperature of fluid in the chamber, and circulation means that circulates the fluid in the chamber;

Guidance means for directly guiding the fluid from the temperature adjustment means to the vicinity of the measurement position where the electronic device under test is located during testing,

The pre-circulation means is an electronic component testing apparatus that collects the fluid guided to the vicinity of the measurement position via the guidance means.

[2] The pressing means has a heat absorbing / dissipating body for absorbing heat from the fluid or radiating heat to the fluid, and is provided in the vicinity of the measurement position.

2. The electronic component testing apparatus according to claim 1, wherein the guide means directly guides the fluid from the circulation means to the heat sink / radiator.

[3] The guiding means includes a conduit for guiding the fluid from the temperature adjusting means to the vicinity of the measurement position,

3. The electronic component testing apparatus according to claim 1, wherein the conduit is provided in the test chamber.

[4] The conduit is

An inlet opening near the temperature adjusting means;

4. The electronic component testing apparatus according to claim 3, further comprising an outlet opening near the measurement position.

[5] The electronic component test apparatus includes a plurality of the pressing means,

Each pressing means has a heat absorbing / dissipating body for absorbing heat from or dissipating heat from the fluid,

5. The electronic component testing apparatus according to claim 4, wherein the conduit has a plurality of the outlets that open in the vicinity of the heat-absorbing and radiating bodies of the pressing means.

[6] The fluid flowing out through the outlet is substantially discharged with respect to the plurality of heat sinks. 6. The electronic component testing apparatus according to claim 5, further comprising distribution means for evenly distributing.

7. The electronic component testing apparatus according to claim 6, wherein the distribution means includes a flap provided around the outlet for adjusting a flow rate of the fluid flowing out from the outlet.

[8] The electronic component test apparatus further includes a temperature measuring means for measuring the temperature of the fluid,

The temperature measuring means is provided in the vicinity of the downstream side of the outlet of the conduit or the downstream side of the measurement position in the circulation path of the fluid circulated by the circulation means. The electronic component testing device according to claim 1.

[9] A plurality of temperature measuring means for measuring the temperature of the fluid;

The control unit according to any one of claims 1 to 7, further comprising a control unit that controls the temperature adjusting unit based on a measurement result of at least one of the plurality of temperature measuring units. Electronic component testing equipment.

[10] The plurality of temperature measurement means includes a first temperature measurement means and a second temperature measurement means. The first temperature measurement means is in the vicinity of a measurement position where the electronic device under test is located during a test. It is provided in

The second temperature measurement means is provided downstream of the temperature adjustment means and upstream of the measurement position in the circulation path of the fluid circulated by the circulation means. The electronic component test apparatus according to claim 9.

[11] A plurality of the measurement positions are provided so that a plurality of the electronic devices under test can be tested simultaneously.

11. The electronic component testing apparatus according to claim 10, wherein the first temperature measuring means is provided in the vicinity of the downstream side of the plurality of measurement positions in the circulation path.

[12] The control means controls the temperature adjustment means based only on the measurement result of one of the first temperature measurement means and the second temperature measurement means so as to shorten the temperature rise time or the temperature fall time. 11. The electronic component testing apparatus according to claim 9 or 10, wherein after the control, the temperature adjusting means is controlled based only on the measurement result of the other of the second temperature measuring means or the first temperature measuring means.

[13] The control means performs temperature increase or decrease by the temperature adjustment means until the first temperature measurement means measures the first set temperature, and then the second temperature measurement means performs the second temperature measurement. 13. The electronic component testing apparatus according to claim 12, wherein temperature rise or temperature drop by the temperature adjusting means is limited until a set temperature is measured.

[14] The control means controls the temperature adjustment means based on the measurement result of the second temperature measurement means so that the temperature at the measurement position is maintained at a third set temperature. Term

13. The electronic component testing apparatus according to 13.

[15] The electronic component test apparatus according to [14], wherein the first set temperature is a temperature relatively higher than the third set temperature.

16. The electronic component according to claim 15, wherein the second set temperature is substantially the same as the third set temperature or a temperature relatively lower than the third set temperature. Test device.

[17] The control unit according to any one of claims 15 and 16, wherein the control unit corrects the second set temperature based on a measurement result of the first temperature measurement unit and a measurement result of the second temperature measurement unit. The electronic component testing apparatus described.

[18] comprising a plurality of the first temperature measuring means,

18. The control means corrects the second set temperature based on the measurement results of all the first temperature measurement means and the measurement results of the second temperature measurement means. Electronic component testing equipment.