KR20090061028A

KR20090061028A - Electronic component testing apparatus

Info

Publication number: KR20090061028A
Application number: KR1020097006866A
Authority: KR
Inventors: 켄이치 시마다; 카즈유키 야마시타
Original assignee: 가부시키가이샤 아드반테스트
Priority date: 2009-04-03
Filing date: 2006-09-15
Publication date: 2009-06-15

Abstract

The electronic component test apparatus includes a casing 121 for sealing a space surrounding the pusher 129 and the socket 50, a heat exchanger 122 capable of raising or lowering the fluid present in the casing 121, and circulating the fluid. And a duct 126 for directing the fluid from the heat exchanger 122 to the vicinity of the measuring position 900. The fan 123 also has a measuring position (via the duct 126). Recover the fluid to 900).

Description

Electronic Component Testing Equipment {ELECTRONIC COMPONENT TESTING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component testing apparatus used for testing IC devices by electrically contacting various electronic components such as semiconductor integrated circuit elements (hereinafter, typically referred to as IC devices) with contact portions of a test head.

In an electronic component test apparatus called a handler, a plurality of IC devices housed in a tray are conveyed into a handler, and each IC device is electrically contacted with a test head to assemble the main body of the electronic component test apparatus (hereinafter referred to as a tester). Perform the test on Then, when the test is completed, each IC device is taken out of the test head and transferred to a tray according to the test result, whereby the classification of the good or bad category is performed.

Since the IC device is tested with a thermal stress of about -55 ° C to 150 ° C applied to the IC device, a test chamber is provided above the test head. The test chamber is provided with a heat exchanger and a fan, and the air heated or endotherm with the heat exchanger is circulated by the fan into the casing of the test chamber.

At the start of the electronic component test apparatus, the heat exchanger and the fan are used to prepare the IC device for the test, and the atmosphere at the measurement position where the IC device is positioned at the time of testing in the test chamber is precisely set to a predetermined set temperature. Need to be adjusted.

However, at the time of temperature rise or temperature at the time of startup, it is necessary to heat or cool all the structures existing in the test chamber in addition to the measurement position. In particular, since the measurement position is located on the downstream side of the structure with a large heat capacity in the air circulation path by the fan in the test chamber, it may take a long time for the atmosphere of the measurement position to reach the set temperature. .

In the electronic component test apparatus capable of testing a plurality of IC devices at the same time, a plurality of measuring positions are provided, and among the plurality of measuring positions, one located on the upstream side or downstream on the air circulation path by the fan exists. do. Therefore, a temperature difference occurs among a plurality of measurement positions, and it may be difficult to raise or lower the temperature to a predetermined temperature for each measurement position with good accuracy.

An object of the present invention is to provide an electronic component testing apparatus capable of shortening the starting time at the start and improving the temperature application accuracy.

In order to achieve the above object, according to the present invention, in order to perform a test of an electronic component under test, the electronic component test apparatus capable of bringing the electronic component under test into close contact with a contact portion of a test head by a pressing means, A chamber for enclosing the pressing means and the space surrounding the contact portion, temperature adjusting means capable of raising or lowering the fluid present in the chamber, circulation means for circulating the fluid in the chamber, and the fluid And guide means for directing from the adjusting means to the vicinity of the measurement position at which the electronic component under test is located at the time of the test, wherein the circulation means receives the fluid guided to the vicinity of the measurement position via the induction means. There is provided an electronic component testing apparatus, characterized in that for recovering (see claim 1).

In the present invention, the fluid heated or lowered by the temperature adjusting means is directly induced near the measurement position. As a result, the measurement position can be raised or lowered in preference to other structures in the test chamber, so that the startup time of the electronic component test apparatus can be shortened.

In addition, since the temperature difference between the plurality of measurement positions can be reduced by directly inducing a fluid to the vicinity of each measurement position, the temperature application accuracy can be improved.

Although it does not specifically limit in the said invention, The said press means has the heat absorbing body for heat-absorbing from the said fluid or radiating | heating with the said fluid, It is provided in the vicinity of the said measurement position, The said induction means transfers the said fluid to the said circulation means. It is preferable to directly induce from the heat sink to the heat sink (see claim 2).

Although not particularly limited in the present invention, the induction means preferably has a conduit for guiding the fluid from the temperature adjusting means to the vicinity of the measurement position, and the conduit is preferably provided in the test chamber (see claim 3). .

Although it does not specifically limit in the said invention, It is preferable that the said conduit has an inlet opened in the vicinity of the said temperature adjusting means, and an outlet opened in the vicinity of the said measurement position (refer Claim 4).

Although not particularly limited in the present invention, the electronic component test apparatus includes a plurality of pressing means, each pressing means has a heat absorbing body for absorbing or dissipating heat from the fluid, and the conduits each pressing means. It is preferable to have a plurality of said outlets which are respectively opened toward the vicinity of the said heat dissipation body of (refer Claim 5).

Although it does not specifically limit in the said invention, It is preferable to further provide the distribution means which distributes the said fluid which flows out through the said outlet substantially equally with respect to the said some heat-radiating body (refer Claim 6).

Although it does not specifically limit in the said invention, It is preferable that the said distribution means includes the flap provided around the said outlet in order to adjust the flow volume of the said fluid which flows out from the said exit (refer Claim 7).

Although not particularly limited in the present invention, the electronic component test apparatus further includes a temperature measuring means for measuring the temperature of the fluid, wherein the temperature measuring means is formed in the conduit of the fluid circulated by the circulation means. It is preferably provided near the downstream side of the exit or downstream of the measurement position (see claim 8).

The temperature measuring means can be installed at the downstream side of the outlet of the conduit or near the downstream side of the measuring position in the fluid circulation path, whereby the temperature at the measuring position can be measured with good accuracy.

Although not specifically limited in the said invention, The control which controls the said temperature adjusting means based on the measurement result of the some temperature measuring means which measures the temperature of the said fluid, and at least one temperature measuring means of the said some temperature measuring means. It is preferred to have a means (see claim 9).

Although not particularly limited in the present invention, the plurality of temperature measuring means includes a first temperature measuring means and a second temperature measuring means, wherein the first temperature measuring means includes the electronic component under test at the time of testing. And the second temperature measuring means is provided downstream of the temperature adjusting means and upstream of the measuring position in the circulation path of the fluid circulated by the circulation means. It is preferred that there is (see claim 10).

By providing the first temperature measuring means in the vicinity of the measuring position, it becomes possible to measure the temperature at the measuring position with good accuracy, so that the temperature application accuracy can be improved.

Although it does not specifically limit in the said invention, The said measuring position is provided in multiple numbers so that a plurality of said electronic components under test can be tested simultaneously, and the said 1st temperature measuring means is located in the vicinity of the downstream of the said several measuring positions in the said circulation path. It is preferred to be installed (see claim 11).

Although not particularly limited in the present invention, the control means controls the temperature adjusting means based on only one measurement result of the first temperature measuring means or the second temperature measuring means so as to shorten the temperature raising time or the temperature lowering time. After that, it is preferable to control the temperature adjusting means based only on the measurement result of the second temperature measuring means or the other of the first temperature measuring means (see claim 12).

Although it does not specifically limit in the said invention, The said control means is a said 2nd temperature measuring means, after carrying out the temperature raising or lowering by the said temperature adjusting means until the said 1st temperature measuring means measures a 1st set temperature. Until the second set temperature is measured, it is preferable to limit the temperature raising or lowering by the temperature adjusting means (see claim 13).

Although not particularly limited in the present invention, it is preferable that the control means controls the temperature adjusting means such that the temperature of the measuring position is maintained at a third set temperature based on the measurement result of the second temperature measuring means. (See claim 14).

Although it does not specifically limit in the said invention, It is preferable that the said 1st set temperature is temperature relatively high with respect to the said 3rd set temperature (refer Claim 15).

Although it does not specifically limit in the said invention, It is preferable that the said 2nd set temperature is temperature which is substantially the same as the said 3rd set temperature, or is relatively low with respect to the said 3rd set temperature (refer Claim 16).

Although not particularly limited in the present invention, the control means preferably corrects the second set temperature based on the measurement result of the first temperature measuring means and the measurement result of the second temperature measuring means (claims). 17).

Although it does not specifically limit in the said invention, It comprises a plurality of said 1st temperature measuring means, The said control means is based on the measurement result of all the said 1st temperature measuring means, and the measurement result of the said 2nd temperature measuring means, It is preferable to correct the second set temperature (see claim 18).

1 is a schematic side view showing an electronic component testing apparatus according to an embodiment of the present invention.

2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.

3 is a conceptual diagram showing processing of a tray in the electronic component testing apparatus according to the embodiment of the present invention.

4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.

Fig. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.

6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.

Fig. 7 is a sectional view showing a test chamber of the electronic component testing apparatus according to the embodiment of the present invention.

Fig. 8 is a sectional view showing the pusher unit of the electronic component testing apparatus according to the embodiment of the present invention.

Fig. 9A is a sectional view showing a pusher used in the electronic component testing apparatus according to the embodiment of the present invention, showing a state where the pressing member is in the reference position.

Fig. 9B is a sectional view showing a pusher used in the electronic component testing apparatus according to the embodiment of the present invention, showing a state in which the pressing member is moved upward relative to the guide member.

Fig. 9C is a sectional view showing the pusher used in the electronic component testing apparatus according to the embodiment of the present invention, showing a state in which the pressing member is moved to the left relative to the guide member.

Fig. 9D is a sectional view showing a pusher used in the electronic component testing apparatus according to the embodiment of the present invention, showing a state in which the pressing member is moved to the right with respect to the guide member.

Fig. 10A is a sectional view of principal parts of a pusher unit of an electronic component testing apparatus according to an embodiment of the present invention, showing a state in which the pusher is in a reference position.

Fig. 10B is a sectional view showing the principal parts of a pusher unit of the electronic component test apparatus according to the embodiment of the present invention, showing a state in which the pusher is moved upward with respect to the base member.

Fig. 10C is a sectional view of principal parts of a pusher unit of an electronic component testing apparatus according to an embodiment of the present invention, showing a state in which the pusher is moved to the left relative to the base member.

Fig. 10D is a sectional view of principal parts of a pusher unit of an electronic component testing apparatus according to an embodiment of the present invention, showing a state in which the pusher is moved relative to the base member to the right.

11 is a sectional view of principal parts of a pusher unit in another embodiment of the present invention;

Fig. 12 is a flow chart showing a method of temperature application and temperature monitoring in a test chamber in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 13 is a graph showing an example of transition of measured values by the first and second temperature sensors when the temperature is adjusted by the method shown in FIG.

Explanation of the sign

One… Handler

100... Chamber

120... Test chamber

122... heat transmitter

123... Pan

124a, 124b... temperature Senser

126... duct

126a... Inlet Duct

126b... Entrance

126c... Separator

126d... exit

128... Pusher Unit

128a, 128b... Base member

129... Pusher

129a... Pushing member

129c... Heatsink

129e... Guide member

200... Storage

300... Loader

400... Unloader section

5... Test head

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 3 is a tray in an embodiment of the present invention. It is a conceptual diagram showing the processing of.

3 is a figure for understanding the processing method of the tray in the electronic component test apparatus which concerns on this embodiment, In fact, there exists a part which shows planarly the member arrange | positioned side by side in the up-down direction actually. Thus, this mechanical (three-dimensional) structure will be described with reference to FIG.

The electronic component test apparatus according to the present embodiment tests (inspects) whether the IC device operates properly in a state in which high or low heat stress is applied to the IC device, and classifies the IC device based on the test result. As an apparatus, it consists of the handler 1, the test head 5, and the tester 6. As shown in FIG. The test of the IC device according to the electronic component test apparatus includes a tray (hereinafter referred to as a test tray) conveyed into the handler 1 from a tray in which a plurality of IC devices to be tested are mounted (hereinafter referred to as a customer tray, see FIG. 5). The IC device is moved to and loaded into the cell.

Therefore, the handler 1 according to the present embodiment, as shown in Figs. 1 to 3, stores the IC device that performs the test in the future, or the storage unit 200 that classifies and stores the IC device that has been tested. And the loader 300 for transferring the IC device sent from the storage 200 to the chamber 100, the chamber 100 including the test head 5, and the chamber 100. And an unloader unit 400 for classifying and taking out the performed test-ended IC device.

The socket 50 provided in the test head 5 is connected to the tester 6 via the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the cable 7. The tester 6 is connected to the tester 6 and the IC device is tested by the test signal from the tester 6. On the other hand, as shown in Fig. 1, a space is provided in a part of the lower part of the handler 1, in which the test head 5 is disposed so as to be replaceable, and a penetration formed in the device base of the handler 1 is provided. The ball makes it possible to electrically contact the IC device and the socket 50 on the test head 5. At the time of varietal exchange of IC devices, it is exchanged with another test head having a socket suitable for the shape and the number of pins of the IC device of this variety.

Each part of the handler 1 will be described in detail below.

4 is an exploded perspective view showing an IC stocker used in the electronic component test apparatus according to the embodiment of the present invention, and FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus according to the embodiment of the present invention.

The storage unit 200 includes a pre-test IC stocker 201 for storing the IC devices before the test, and a test-ended IC stocker 202 for storing the IC devices classified according to the test results.

As shown in Fig. 4, these stockers 201 and 202 are provided with a tray-shaped tray support frame 203 and an elevator which enters from a lower portion of the tray support frame 203 and moves up and down. 204 is provided. The plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. On the other hand, in the customer tray KST according to the present embodiment, as shown in Fig. 5, the accommodating portion accommodating the IC devices is arranged in 10 rows x 6 columns.

Since the pre-test IC stocker 201 and the test termination IC stocker 202 have the same structure, each number of the pre-test IC stocker 201 and the test termination IC stocker 202 can be set to an appropriate number as necessary. have.

In the present embodiment, as shown in Figs. 2 and 3, two stockers STK-B are provided in the IC stocker 201 before the test, and the empty customer trays are sent to the unloader unit 400 in the neighborhood. Two empty stockers STK-E are stacked. In the neighborhood of the empty tray stocker STK-E, eight stockers STK-1, STK-2, ..., STK-8 are provided in the test termination IC stocker 202. Up to 8 IC devices can be classified and stored. As a result, in addition to the distinction between good and defective products, it is possible to classify the products into high-speed, medium-speed, low-speed, or defective products that require retesting.

The above-described customer tray KST is provided from the lower side of the device base 101 to the window portion 306 of the loader 300 by a tray transfer arm 205 provided between the storage unit 200 and the device base 101. Is carried. Then, the IC device loaded in the customer tray KST by the loader 300 is transferred to the preciser 305 by the device transfer device 304, where the IC devices are mutually transferred. After correcting the positional relationship, the IC device transferred to the presizer 305 is further transferred to the test tray TST stopped by the loader 300 using the device transfer device 304 and loaded. .

As the device conveying apparatus 304 which transfers and loads an IC device from the customer tray KST to the test tray TST, as shown in FIG. 2, two rails 301 hypothesized on the apparatus base 101, The movable arm 302 which can reciprocate between the test tray TST and the customer tray KST by these two rails 301, and is supported by this movable arm 302, and is movable arm 302 The movable head 303 which is movable along () is provided.

An adsorption pad (not shown) is attached to the movable head 303 of the device conveying apparatus 304 in a downward direction, and the adsorption pad moves while being sucked to hold the IC device from the customer tray KST. Transfer the device to the test tray (TST) to load it. About eight such suction pads are mounted with respect to one movable head 303, and eight IC devices can be moved to a test tray TST at once, and can be loaded.

Fig. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention. The test tray TST is provided with a plurality of shelves 13 in parallel and at equal intervals on the rectangular frame 12, and the sides of the shelves 13 and the periphery of the frame 12 facing the shelves 13 ( A plurality of mounting pieces 14 are formed to protrude at equal intervals in 12a), respectively. The insert holding portion 15 is formed between these shelves 13 or between the shelves 13 and the periphery 12a and the two mounting pieces 14.

The insert 16 is accommodated in each insert accommodation part 15 one by one, and this insert 16 is attached to the two mounting pieces 14 in the floating state using the fastener 17. As shown in FIG. Therefore, the mounting holes 21 for the mounting pieces 14 are formed at both ends of the insert 16, respectively. Such inserts 16 are provided, for example, about 16 × 4 in one test tray TST.

On the other hand, each insert 16 has the same shape and the same dimension, and an IC device is accommodated in each insert 16. The IC accommodating part 19 of the insert 16 is determined according to the shape of the IC device accommodated, and in the example shown in FIG. 6, it is a rectangular recess. Moreover, the guide hole 20 into which the guide pin 129f of the pusher 129 is inserted is provided in the both sides of the IC accommodating part 19. As shown in FIG.

7 is a cross-sectional view showing a test chamber of an electronic component testing apparatus according to an embodiment of the present invention, FIG. 8 is a cross-sectional view showing a pusher unit of the electronic component testing apparatus according to an embodiment of the present invention, and FIGS. 9A to 9D are 10A to 10D are cross-sectional views of essential parts of the pusher unit of the electronic component test apparatus according to the embodiment of the present invention, and FIG. 11 is a cross-sectional view of the pusher used in the electronic component test apparatus of the present invention. Is a sectional view of main parts of the pusher unit.

The test tray TST described above is transferred to the chamber unit 100 after the IC device is loaded in the loader unit 300, and the test of each IC device is carried out with the IC device mounted on the test tray TST. Is executed.

The chamber unit 100 includes a soak chamber 110 for applying a high temperature or low temperature heat stress to an IC device loaded in a test tray TST, and a state in which the heat stress is applied to the soak chamber 110. And a test chamber 120 for electrically contacting the IC device in the test head 5 and an unsoaking chamber 130 for removing heat stress from the IC device tested in the test chamber 120.

On the other hand, it is preferable that the unsoak chamber 130 is thermally insulated from the soak chamber 110 or the test chamber 120, and in reality, a predetermined thermal stress is applied to the regions of the soak chamber 110 and the test chamber 120. Although applied and the unsoak chamber 130 is thermally insulated from them, in this embodiment, these are collectively called the chamber part 100 for convenience.

The soak chamber 110 is provided with a vertical conveying apparatus as conceptually shown in FIG. 3, and a plurality of test trays TST are supported by the vertical conveying apparatus while the test chamber 120 is empty. Wait In this atmosphere, heat stress is applied to the IC device.

As illustrated in FIG. 7, the pusher unit 128 including the plurality of pushers 129 is provided in the test chamber 120 so as to be movable in the Z-axis direction above the test head 5. The plurality of pushers 129 are arranged in the pusher unit 128 to correspond to the arrangement of the sockets 50 on the test head 5. In addition, a drive plate 127b supported by the drive shaft 127a of the Z-axis drive device 127 is provided above the pusher unit 128, and the drive plate 127b is driven through the drive shaft 127b. It is connected to the actuator (not shown) of the Z-axis drive apparatus 127, and can be moved up and down by the drive of this actuator. The lower surface of the drive plate 127b is provided with a plurality of convex portions 127c for pressing the pushers 129. These convex portions 127c are disposed on the lower surface of the drive plate 127b so as to correspond to the arrangement of the pushers 129 in the pusher unit 128.

As shown in FIG. 8, the pusher unit 128 includes a plurality of pushers 129 that contact and press the IC device during the test, and an upper base member 128a that supports the upper portion of each pusher 129 in a floating state. And a lower base member 128b for supporting the lower portion of each pusher 129 in a floating state. On the other hand, only four pushers 129 are shown in Figs. 7 and 8, but the pusher unit 128 actually corresponds to the socket 50 on the test head 5, for example, a total of 64 pushers 129. Equipped with.

As shown in Fig. 9A, the pusher 129 includes a pusher block 129b pressed against the upper surface of the IC device, a heat sink 129c for absorbing or dissipating the pusher block 129b, and a Z-axis driving device. The convex part 127c of 127 has the pressing member 129a comprised from the shaft 129c which abuts. In addition, the pusher 129 has a guide member 129e in which the guide pin 129f protrudes downward. As shown in Figs. 9A to 9D, the pressing member 129a is provided in the guide member 129e, and it is possible to move up, down, left and right with respect to the guide member 129e. 9A shows a state in which the pressing member 129a is in the reference position with respect to the guide member 129e due to the weight of the pressing member 129a. Fig. 9B shows a state in which the pressing member 129a moves minutely upward relative to the guide member 129e, and Fig. 9C shows that the pressing member 129a moves minutely relative to the guide member 129e. One state is shown, and FIG. 9D shows a state in which the pressing member 129a is moved to the right relative to the guide member 129e.

The upper base member 128a of the pusher unit 128 is, for example, a metal member made of aluminum or the like, and an opening having a degree to which the pusher 129 can pass is formed. Similarly, the lower base member 128b is a metal member made of aluminum or the like, and an opening having a degree to which the pusher 129 can pass is formed.

Each pusher 129 is inserted into and supported by an opening of the upper base member 128a and the lower base member 128b, and each pusher 129 has a base member 128a as shown in FIGS. 10A to 10D. It is possible to move finely up, down, left and right with respect to, 128b. Fig. 10A shows a state in which the pusher 129 is in the reference position with respect to the base members 128a and 128b due to the weight of the pusher 129. Figs. Fig. 10B shows a state in which the pusher 129 is moved slightly upward relative to the base members 128a and 128b, and Fig. 10C shows the pusher 129 relative to the base members 128a and 128b. Fig. 10D shows a state in which the pusher 129 is moved to the right relative to the base members 128a and 128b.

In addition, in this embodiment, the separator 126c is provided between the upper base member 128a and the lower base member 128b. The separator 126c is a metal flat member made of aluminum or the like, for example. The separator 126c is formed with an outlet 126d that is open toward the heat sink 129c of the pusher 129.

The test chamber 120 is sealed by the casing 121, as shown in FIG. Inside the casing 121, a heat exchanger 122, a fan 123, first and second temperature sensors 124a and 124b, a pusher unit 128 and a socket 50 are installed. In the present embodiment, a duct 126 is provided inside the casing 121 to directly direct hot or cold air from the fan 123 to the heat sink 129c of the pusher 129 via the heat exchanger 122. It is.

As shown in Fig. 7, the duct 126 is composed of an inlet duct 126a, a separator 126c, and an upper base member 128a of the pusher unit 128.

As shown in Fig. 7, the inlet-side duct 126a is a tubular member that is bent at a right angle, and the fan 123 is located at the inlet 126b. As the fan 123, for example, a sirocco fan, a turbo fan, a cross prop fan, or a propeller fan can be used.

A heat exchanger 122 is provided between the inlet 126b of the inlet duct 126 and the end point. When the inside of the casing 121 is used at a high temperature, the heat exchanger 122 is composed of a heat exchanger for heat dissipation or heat transfer through a heating medium, and the inside of the casing 121 is maintained at a high temperature such as room temperature to 160 ° C. It is possible to supply sufficient amount of heat in order to do so. On the other hand, when the inside of the casing 121 is cooled, the heat exchanger 122 is composed of an endothermic heat exchanger through which refrigerant such as liquid nitrogen circulates, and the inside of the casing 121 is, for example, about -60 ° C to room temperature. It is possible to absorb sufficient amount of heat in order to keep it at low temperature. On the other hand, in some cases, a refrigerant such as liquid nitrogen may be directly supplied into the casing 121 to circulate.

In the vicinity of the end point of the inlet-side duct 126a, a second temperature sensor 124b for measuring the temperature of the atmosphere in the casing 121 is provided. On the other hand, in the circulation path of the warm air or cold wind by the fan 123 in the casing 121, the 1st temperature sensor for measuring the temperature of the atmosphere in the casing 121 near the downstream of the measuring position 900 ( 124a) is provided. As the first and second temperature sensors 124a and 124b, for example, a platinum sensor, a thermocouple, or the like can be used. On the other hand, in this embodiment, only "upstream" means upstream in the circulation path of the warm air or cold wind by the fan 123 in the casing 121, and only "downstream" means the upstream in the said circulation path. Means downstream.

In this embodiment, since the 1st temperature sensor 124a is provided in the vicinity of the measuring position 900, since the temperature of the measuring position 900 can be measured with high precision, temperature application precision is further improved. You can.

In the present invention, the number of temperature sensors provided in the casing 121 of the test chamber 120 is not limited to two, but three or more temperature sensors may be provided, for example. In particular, when there are a plurality of measuring positions 900, by providing a temperature sensor in the vicinity of each measuring position 900, the temperature application accuracy can be further improved.

As shown in Fig. 7, the heat exchanger 122 and the two temperature sensors 124a and 124b are connected to the control device 125, and the control device 125 is the first temperature sensor 124a. B) It is possible to control the heat exchanger 122 based on the measurement result of the second temperature sensor 124b.

The end point of the inlet side duct 126a is connected to the separator 126c and the upper base member 128a, and the separator 126c and the upper base member 128a comprise a tubular structure. Therefore, the warm air or cold air generated by the heat exchanger 122 passes through the inlet side duct 126a as shown by the dashed-dotted arrow in FIG. 7, so that the upper base member 128a and the separator 126c are separated. Guided to the heat sink 129d of the pusher 129 by passing through each outlet 126d formed in the separator 126c, and also pressing member 129a and guide member 129e of the pusher 129. It passes through and leads to the measuring position 900. The warm air or cold air that has passed through the measurement position 900 is recovered by the fan 123, and is again introduced into the inlet 126b of the inlet duct 126a to circulate.

As described above, in the present embodiment, the hot air or cold air is directly guided to the heat sink 129c of the measurement position 900 or the pusher 129 by the duct 126. As a result, the measurement position 900 and the heat sink 129d can be raised or lowered prior to other structures in the casing 121 when the electronic component test apparatus is started. Therefore, the startup time of the electronic component test apparatus is shortened. can do.

In addition, since the temperature difference between the plurality of measurement positions 900 and the heat sink 129d can be reduced by directly inducing hot or cold air to each of the measurement positions 900 and the heat sink 129d, the temperature is applied. The precision can be improved.

11, the flap 126e may be provided around the downstream side of the outlet 126d of the separator 126c. By adjusting the height, width or angle of the flap 126e at each outlet 126d, the temperature difference between the plurality of measurement positions 900 and the heat sink 129d can be further reduced.

When testing an IC device, as shown in FIG. 8, the test tray TST is conveyed between the pusher unit 128 and the socket 50, and the Z-axis drive device 127 drives the drive plate 127b. Move to the lower side of the Z-axis, thereby the pusher unit 128 as a whole is lowered. During this lowering, the guide pin 129f of the pusher 129 is inserted into the guide hole 20 of the insert 16, and each pusher 129 is positioned with respect to the insert 16, respectively. Further, when the pusher 129 is lowered, the pressing member 129a is guided into the insert 16, and the pusher block 129b contacts and presses the upper surface of the IC device to contact the contact between the input / output terminal of the IC device and the socket 50. The pins are in electrical contact. In this state, the tester carries out the IC device and the test signal through the test head, so that the test of the IC device is executed. The result of this test is stored in the storage of the electronic component test apparatus, for example, as an address determined by, for example, an identification number assigned to the test tray TST and a number of IC devices assigned to the test tray TST.

In addition, although not specifically shown as a conveyance means of the test tray TST in the test chamber 120, a conveyance roller etc. are mentioned, for example. In addition, when the test tray TST is conveyed, the driving plate 127 of the Z-axis drive device 127 is formed such that a gap between the pusher 129 and the socket 50 is allowed to pass through is formed. It is raised enough.

Returning to FIGS. 1 to 3, after the test is completed, the test tray TST is removed from the unsoak chamber 130 by the IC device after the test is removed and returned to room temperature, and then transported to the unloader unit 400. In addition, the tray conveying apparatus 102 is installed on the apparatus base 101, and the test tray TST discharged from the unsock chamber 130 by this tray conveying apparatus 102 is the unloader part 400. And the soak chamber 110 through the loader 300.

In the unloader 400, two device carriers 404 having the same structure as the device carrier 304 provided in the loader 300 are provided. The IC device that has been tested from the test tray TST taken out to the unloader 400 by the device transfer device 404 is transferred to the customer tray KST according to the test result.

As shown in FIG. 2, in the device base 101 of the unloader unit 400, four customer trays KST exported to the unloader unit 400 are disposed to face the upper surface of the device base 101. Windows 406 are formed.

Although not shown, an elevation table for elevating the customer tray KST is provided below each window portion 406. The lifting table lowers the customer tray KST filled with the IC devices that have been tested and descends, and guides the full tray to the tray transfer arm 205.

Hereinafter, the temperature application method of the test chamber at the time of starting of the electronic component test apparatus concerning this embodiment, and the temperature monitoring method after the temperature in a test chamber is stabilized are demonstrated. In the following description, a case where the inside of the casing 121 of the test head 5 is elevated by the heat exchanger 122 will be described. However, the present invention is not particularly limited thereto, and the temperature of the casing 121 is lowered. It can also be applied.

Fig. 12 is a flowchart showing a method of applying temperature and monitoring a temperature in a test chamber in the electronic component testing apparatus according to the embodiment of the present invention. It is a graph which shows an example of transition of the measured value by 2 temperature sensors.

When the power supply of the handler 1 is turned on at the start of the electronic component test apparatus, the heat exchanger 122 and the fan 123 in the casing 121 operate, and the heat exchanger 122 maintains the atmosphere in the casing 121. At the same time as the temperature is raised, the fan 123 circulates the warm air generated by the heat exchanger 122 (step S10 in FIG. 12).

The warm air blown by the fan 123 is directly guided through the duct 126 to each outlet 126d of the separator 126c, respectively, and toward the heat sink 129d and the measurement position 900 of the pusher 129. Flushed.

In the meantime, the 1st temperature sensor 124a provided in the downstream of the measuring position 900 measures the temperature of the atmosphere of the vicinity of the measuring position 900. FIG. Until the temperature Ta [° C.] measured by the first temperature sensor 124a becomes equal to or higher than the first set temperature A [° C.] (Ta≥A), the controller 125 increases the temperature of the heat exchanger 122. The control is continued (NO at step S20).

As shown in Fig. 13, the first set temperature A is a temperature higher than the third set temperature C [° C] which is intended to be applied to the measurement position 900 during the test (A > C). ). In this embodiment, the atmosphere near the downstream side of the measurement position 900 is raised to the first set temperature A, and the temperature of the entire measurement position 900 is overshooted with respect to the third set temperature C. At this time, since the second temperature sensor 124b is closer to the heat exchanger 122 than the first temperature sensor 124a, the first temperature sensor 124a is measured as shown in FIG. The measurement temperature Tb of the second temperature sensor 124b is higher than the temperature Ta.

When the measured temperature Ta of the first temperature sensor 124a becomes equal to or higher than the first set temperature A (YES in step S20), the controller 125 controls to stop the temperature increase of the heat exchanger 122 ( Step S30) and the temperature sensor for measuring the temperature of the atmosphere in the casing 121 are switched from the first temperature sensor 124a to the second temperature sensor 124b (step S30). Then, until the temperature Tb [° C.] measured by the second temperature sensor 124b becomes equal to or less than the second set temperature B [° C.] (Tb ≦ B), the controller 125 operates the heat exchanger 122. It is left in the stopped state (NO in step S50).

As shown in Fig. 13, the second set temperature B is a temperature below the third set temperature C (B≤C). During this period, while the air is blown by the fan 123 while the temperature of the heat exchanger 122 is not increased, the temperature is lowered from being located upstream of the plurality of measurement positions 900 and the heat sink 129d. Proceed. Therefore, the measured temperature Tb of the second temperature sensor 124b is lowered faster than the measured temperature Ta of the first temperature sensor 124a. In the example shown in FIG. 13, the first temperature sensor 124a is measured. The measurement temperature Tb of the second temperature sensor 124b is lower than the temperature Ta.

When the measured temperature Tb of the second temperature sensor 124b becomes equal to or less than the second set temperature B (YES in step S50), the heat exchanger 122 resumes the temperature increase (step S50). Thereafter, the temperature in the casing 121 is monitored by the second temperature sensor 124b.

As described above, in the present embodiment, the temperature of the entire measurement position 900 is set once with respect to the third set temperature C by using the first temperature sensor 124a located near the downstream side of the measurement position 900. After overshooting, the heat exchanger 122 is stopped and the temperature is lowered from being located upstream of the plurality of measurement positions 900 and the heat sink 129d. Therefore, the temperature of the whole measuring position 900 can be made uniform in a short time, and the starting time of an electronic component test apparatus can be shortened. In addition, since the temperature difference between the plurality of measurement positions 900 and the heat sink 129d can be reduced, the temperature application accuracy can be improved.

In the present embodiment, the second set temperature B is corrected while the second temperature sensor 124b performs temperature monitoring.

Specifically, first, after executing step S40, the control device 125 starts timekeeping, and each time a predetermined time elapses (YES in step S60), both temperature sensors 124a and 124b are performed. The temperature is measured, and the difference ΔT (ΔT = Tb-Ta) between the measured temperature Ta of the first temperature sensor 124a and the measured temperature Tb of the temperature sensor 124b is calculated (step S70). .

Next, the controller 125 subtracts ΔT calculated in step S70 from the measured temperature Tb of the second temperature sensor 124b (B = Tb−ΔT), and subtracts this value into a new second value. The set temperature is set as B (step S80). By performing the temperature monitoring by this new second set temperature B (steps S90 to S110), the temperature difference between the upstream and downstream sides can be further reduced at the plurality of measurement positions 900, further improving the temperature application accuracy. Can be improved.

On the other hand, the plurality of first temperature sensors 124a may be arranged in the vicinity of the plurality of measurement positions 900, respectively, in which case the average value of the measured temperatures of all the first temperature sensors 124a is shown in FIG. By setting it as Ta used at step S70, the temperature application precision can be improved more.

In addition, embodiment described above was described in order to make understanding of this invention easy, and was not described in order to limit this invention. Therefore, each element disclosed in the said embodiment is intended to include all the design changes and equivalents which belong to the technical scope of this invention.

Claims

An electronic component test apparatus capable of bringing the electronic component under test into close contact with a contact portion of a test head by a pushing means, in order to perform a test of the electronic component under test,

A chamber for sealing a space surrounding the pressing means and the contact portion;

Temperature adjusting means capable of raising or lowering the fluid present in the chamber;

Circulation means for circulating the fluid in the chamber;

Induction means for directly inducing the fluid from the temperature adjusting means to the vicinity of the measurement position where the electronic component under test is located at the time of the test,

And the circulation means recovers the fluid guided to the vicinity of the measurement position via the guide means.

The method according to claim 1,

The pressing means has a heat absorbing body for absorbing heat from the fluid or radiating heat into the fluid, and is provided in the vicinity of the measurement position,

And said induction means induces said fluid directly from said circulation means to said heat dissipation member.

The method according to claim 1 or 2,

The guiding means has a conduit leading the fluid from the temperature adjusting means to the vicinity of the measuring position,

And the conduit is installed in the test chamber.

The method according to claim 3,

The conduit,

An inlet opening in the vicinity of the temperature adjusting means,

And an outlet that is opened in the vicinity of the measurement position.

The method according to claim 4,

The electronic component test apparatus is provided with a plurality of the pressing means,

Each pressing means has a heat absorbing body for absorbing or radiating heat from the fluid,

And said conduit has a plurality of said outlets respectively opened toward the vicinity of said heat dissipation member of said pressing means.

The method according to claim 5,

And distribution means for distributing the fluid flowing out through the outlet substantially equally to the plurality of heat sinks.

The method according to claim 6,

And the distributing means includes a flap provided around the outlet to adjust the flow rate of the fluid flowing out of the outlet.

The method according to any one of claims 1 to 7,

The electronic component test apparatus further includes a temperature measuring means for measuring the temperature of the fluid,

And the temperature measuring means is provided in the vicinity of the downstream side of the outlet of the conduit or the downstream side of the measurement position in the circulation path of the fluid circulated by the circulation means.

The method according to any one of claims 1 to 7,

A plurality of temperature measuring means for measuring the temperature of the fluid;

And control means for controlling the temperature adjusting means based on a measurement result of at least one temperature measuring means of the plurality of temperature measuring means.

The method according to claim 9,

The plurality of temperature measuring means includes a first temperature measuring means and a second temperature measuring means,

The first temperature measuring means is provided near a measurement position where the electronic component under test is located at the time of the test,

And the second temperature measuring means is provided downstream of the temperature adjusting means and upstream of the measuring position in the circulation path of the fluid circulated by the circulation means.

The method according to claim 10,

A plurality of the measurement positions are provided so that a plurality of the electronic components under test can be tested simultaneously.

And the first temperature measuring means is provided in the vicinity of the downstream side of the plurality of measuring positions in the circulation passage.

The method according to claim 9 or 10,

The control means controls the temperature adjusting means based on only one measurement result of the first temperature measuring means or the second temperature measuring means so as to shorten the temperature raising time or the temperature lowering time, and then the second temperature. And the temperature adjusting means is controlled based only on the measurement result on the other side of the measuring means or the first temperature measuring means.

The method according to claim 12,

The control means performs a temperature raising or lowering by the temperature adjusting means until the first temperature measuring means measures the first set temperature, and then the second temperature measuring means measures the second set temperature. Until then, the temperature rising or falling temperature by the temperature adjusting means characterized in that the electronic component test apparatus.

The method according to claim 13,

And the control means controls the temperature adjusting means such that the temperature of the measuring position is maintained at a third set temperature based on the measurement result of the second temperature measuring means.

The method according to claim 14,

And said first set temperature is a temperature relatively high relative to said third set temperature.

The method according to claim 15,

And the second set temperature is a temperature substantially equal to the third set temperature or a temperature relatively low with respect to the third set temperature.

The method according to claim 15 or 16,

And said control means corrects said second set temperature based on a measurement result of said first temperature measuring means and a measurement result of said second temperature measuring means.

The method according to claim 17,

A plurality of first temperature measuring means is provided,

And the control means corrects the second set temperature based on the measurement results of all the first temperature measuring means and the measurement results of the second temperature measuring means.