JP2002207063A - Pusher and electronic part-testing apparatus with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To test electronic parts without generating damages such as cracks, chips or the like to the electronic parts by connecting contacts of the electronic parts to connecting terminals of sockets without applying a load concentratedly to a part where an adhering substance adheres even when the adhering substance such as a particle or the like adheres to faces to be pressed of the electronic parts. SOLUTION: A sharpened projecting part 312 is set to a face 311 of a pusher block 31 which is opposite to the face 211 to be pressed of a body part 21 of an IC chip 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pusher for pressing an electronic component mounted on a socket in testing an electronic component such as an IC chip, and an electronic component testing apparatus provided with the pusher.

[0002]

2. Description of the Related Art In the manufacturing process of semiconductor devices, etc.,
An electronic component test apparatus for testing the performance and functions of electronic components such as finally manufactured IC chips is required. As one example of such an electronic component test apparatus, an IC test apparatus that tests the performance and function of an IC device such as an IC chip under various temperature conditions such as a low temperature and a high temperature is known.

A test of an IC device using an IC test apparatus is performed, for example, as follows. After transporting the IC device under test above the test head to which the IC socket is attached, the IC device is pressed by pressing the IC device under test.
The connection terminals of the socket are brought into contact with the external terminals of the IC device under test. As a result, the IC device under test is
It is electrically connected to the test main unit through a socket, a test head, and a cable. Then, a test signal supplied from the test main unit to the test head through a cable is applied to the IC device under test, and the IC under test is
By sending a response signal read from the device to the test main device through the test head and the cable, the electrical characteristics of the IC device under test are measured.

In testing an IC device using an IC test apparatus, when a device under test is pressed, a pusher provided with a pusher block descends.
The pressing surface of the pusher block comes into contact with the pressing surface of the IC device under test, and a pressing force is applied to the IC device under test in the direction of the connection terminal of the IC socket.

[0005]

However, when small pieces such as silicon fragments are adhered to the pressed surface of the IC device under test, the pressed surface of the pusher block and the pressed surface of the IC device under test are displaced. When the contacting device applies a pressing force to the IC device under test, a load is intensively applied to the portion to which the small piece is attached, and the IC device under test may be damaged, such as cracking or chipping. In particular, when the IC device under test is an IC device in which a bare chip mounted on a substrate is not sealed with a mold resin, the bare chip itself may be damaged.

Accordingly, the present invention is to provide a method for causing damage to an electronic component under test, such as cracking or chipping, even when small pieces such as silicon fragments adhere to the pressed surface of the electronic component under test. It is another object of the present invention to provide a pusher and an electronic component testing apparatus capable of applying a pressing force in the direction of a connection terminal of a socket to an electronic component under test.

[0007]

(1) In order to solve the above problems, a pusher provided by the present invention is a pusher for pressing a main body of an electronic component mounted on a socket. A projection is provided on a surface of the electronic component facing the pressed surface so as to press the electronic component toward the connection terminal of the socket.

In the pusher according to the present invention, the "body part of the electronic component" means a member or a part other than the external terminals of the electronic component. For example, when the electronic component is an IC chip, it is mounted on a substrate. The “body part of the electronic component” includes a bare chip mounted thereon, a mold resin for sealing the bare chip mounted on the substrate, and the like. The “pressed surface of the electronic component” means an outer surface of the outer surface of the electronic component to which a pressing force is applied by a pusher.
A (Ball Grid Array) type, LGA (Land Grid Arr)
ay) surface mount type area array type IC
In the case of a chip, the surface opposite to the surface on which solder balls, lands, and the like as external terminals are provided is the “pressed surface of the electronic component”.

In the pusher of the present invention, the main body of the electronic component mounted on the socket is pressed by the projection provided on the surface of the electronic component facing the pressed surface.
Even if a small piece such as a piece of silicon adheres to the pressed surface of the electronic component, the probability that the pusher contacts the small piece is low. Also, even if the protrusion of the pusher comes into contact with the attached matter on the pressed surface of the electronic component, the space between the pressed surface of the electronic component and the surface of the pusher opposed to the pressed surface is:
Since a void is formed by the interposition of the projection,
The deposit that has been repelled in contact with the protrusion of the pusher can move to the gap. Thus, it is possible to prevent the attached matter from being sandwiched between the protrusion of the pusher and the pressed surface of the electronic component. Therefore, according to the pusher of the present invention, even when a small piece such as a piece of silicon is attached to the pressed surface of the electronic component, a load is intensively applied to the portion where the small piece is attached. Thus, a pressing force in the direction of the connection terminal of the socket can be applied to the electronic component without damaging the electronic component such as cracking or chipping.

In the pusher of the present invention, the material of the projection provided on the surface of the electronic component facing the pressed surface is not particularly limited, but is a material exhibiting elasticity (for example, rubber, plastic, or the like). Is preferred. If the protrusion is made of a material exhibiting elasticity, even if a small piece such as a piece of silicon adheres to the pressed surface of the electronic component, the protrusion may come into contact with the above-mentioned adhering substance even when the protrusion contacts the adhered substance. Since the part is deformed by itself and can reduce the pressing force applied to the attached matter, it is possible to prevent damage such as cracking or chipping of the electronic component which may occur when the projected part comes into contact with the attached matter.

The electronic component that can be pressed by the pusher of the present invention is not particularly limited as long as it is an electronic component that can press the main body thereof.
A (Ball Grid Array) type, LGA (Land Grid Arr)
ay) surface mount type area array type IC
Chips, especially CSP (Chip Size Package)
It can be suitably used for a type of IC chip.

In the pusher of the present invention, the shape, the number, and the number of protrusions provided on the surface of the electronic component facing the pressed surface are described.
The position and the like are not particularly limited, but an embodiment described later is preferable.

(2) In the pusher according to the present invention, it is preferable that the protrusion has a pointed shape.

In the pusher of this aspect, since the projection for pressing the main body of the electronic component has a pointed shape,
Even if the protrusion of the pusher comes into contact with the deposit on the pressed surface of the electronic component, the contact area is small. As a result, a local force is applied to the deposit that has come into contact with the projection of the pusher, and the deposit is repelled by the projection of the pusher, and the pressed surface of the electronic component and the pusher facing the pressed surface. It is easy to move to the gap formed between the surface and the surface. Therefore, according to the pusher of this aspect, it is possible to efficiently prevent the attached matter from being sandwiched between the protrusion of the pusher and the pressed surface of the electronic component.

In the pusher of this aspect, the shape of the projection is not particularly limited as long as it is a pointed shape, and examples of the shape of the projection include a conical shape, a pyramid shape, and a needle shape. In the pusher of this aspect, the term “pointed shape” means a shape that becomes thinner toward the tip (toward the pressing direction), and in addition to the shape that is sharper, the tip is rounded. Shape and a shape having a flat tip.

(3) In the pusher according to the present invention, it is preferable that the protrusion is provided at a position corresponding to an external terminal of the electronic component.

In the pusher of this aspect, the pressing force required for connecting each external terminal of the electronic component to the connection terminal of the corresponding socket is provided at a position corresponding to each external terminal of the electronic component. Can be added by a projection. Therefore, when the electronic component is pressed using the pusher of this aspect, the connection between the external terminal of the electronic component and the connection terminal of the socket can be reliably performed.

In the pusher according to this aspect, it is not necessary that all the projections are provided at positions corresponding to the external terminals of the electronic component, and the number of the projections is smaller or larger than the number of the external terminals of the electronic component. However, it is preferable that protrusions are provided at positions corresponding to all external terminals of the electronic component.

(4) In the pusher according to the present invention, it is preferable that an elastic member is provided for urging the protrusion in the pressing direction of the electronic component.

When a plurality of projections are provided on the pusher, a dimensional error may occur in each projection. If a dimensional error occurs in each projection, there is a possibility that the pressing force applied to the pressed surface of the electronic component by each projection becomes uneven. On the other hand, in the pusher of this aspect, since the elastic member for urging the protrusion in the pressing direction of the electronic component is provided, the elastic member can absorb a dimensional error of each protrusion, and Thereby, the pressing force applied to the pressed surface of the electronic component can be made uniform. That is, in the pusher of this aspect, the pressing force applied to the pressed surface of the electronic component by each projection can be made uniform by managing the stroke of each projection and the load of each projection.

(5) An electronic component test apparatus provided by the present invention includes the pusher of the present invention.

In the electronic component test apparatus according to the present invention, even if small pieces such as silicon fragments are attached to the pressed surface of the electronic component, the load is concentrated on the portion where the small pieces are attached. Applying a pressing force to the electronic component in the direction of the connection terminal of the socket without causing damage to the electronic component such as cracking or chipping, the external terminal of the electronic component and the connection terminal of the socket can be prevented. Can be connected to test the electronic component.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall side view showing an IC test apparatus as an embodiment of an electronic component test apparatus according to the present invention.
FIG. 3 is a perspective view showing a handler in the IC test apparatus, and FIG.
FIG. 4 is a flowchart of a tray showing a method of handling an IC under test, FIG. 4 is a perspective view showing a structure of an IC stocker in the IC test apparatus, and FIG. 5 is a perspective view showing a customer tray used in the IC test apparatus. 6 is a cross-sectional view of a main part in a test chamber of the IC test apparatus, FIG.
8 is an exploded perspective view showing a structure near a socket in the test head of the IC test apparatus, FIG. 9 is an exploded perspective view of a pusher in the IC test apparatus, FIG. 10 is a cross-sectional view showing a state in which the pusher is lowered in FIG. 10, and FIG. 12 is a cross-sectional view showing a state of a substance adhering to the pressed surface of the IC chip before and after the pusher is lowered.

FIG. 3 is a view for explaining a method of arranging the IC under test in the IC test apparatus according to the present embodiment. There is also a part shown in. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

First, the overall configuration of the IC test apparatus according to the present embodiment will be described. As shown in FIG. 1, an IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6. Handler 1
An IC chip (an example of an electronic component), which is an electronic component to be tested, is sequentially conveyed to a socket of a contact portion 9 provided on the upper side of the test head 5, and the tested IC chips are classified according to the test result and classified into a predetermined format. Execute the operation of storing in the tray.

The socket of the contact section 9 is electrically connected to the test main unit 6 through the test head 5 and the cable 7, and the IC chip detachably mounted on the socket is connected to the test head 5 and the cable 7. It is electrically connected to the test main device 6. A test electric signal from the test main device 6 is applied to the IC chip mounted on the socket, and a response signal read from the IC chip is sent to the test main device 6 through the cable 7, thereby The performance and function of the IC chip are tested.

Although a control device for mainly controlling the handler 1 is built in a lower portion of the handler 1, a space portion 8 is provided in a part. In this space portion 8, the test head 5
The IC chip can be attached to and detached from a socket of a contact portion 9 provided above the test head 5 through a through hole formed in the handler 1.

The IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at a temperature higher than normal temperature (high temperature) or lower than normal temperature (low temperature). As shown in FIG. 2 and FIG.
A chamber 100 including a thermostat 101, a test chamber 102, and a heat removal tank 103 is provided. The contact portion 9 provided on the upper side of the test head 5 shown in FIG.
Is inserted into the test chamber 102 as shown in FIG.
Therefore, a test of the IC chip is performed.

As shown in FIG. 2 and FIG. 3, the handler 1 in the IC test apparatus 10
An IC storage unit 200 that stores C chips and classifies and stores tested IC chips, a loader unit 300 that sends IC chips to be tested sent from the IC storage unit 200 to the chamber unit 100, and a test head 5 Chamber part 1 including
00 and the tested I that has been tested in the chamber 100.
And an unloader section 400 for classifying and extracting the C chips. Note that inside the handler 1, I
The C chip is stored in a test tray and transported.

A large number of IC chips before being stored in the handler 1 are stored in the customer tray KST shown in FIG. 5, and in that state, are supplied to the IC storage section 200 of the handler 1 shown in FIGS. Then, the test tray T transported in the handler 1 from the customer tray KST
In ST (see FIG. 7), the IC chip is replaced. Inside the handler 1, as shown in FIG. 3, the IC chip moves while being placed on the test tray TST, is subjected to high-temperature or low-temperature stress, and is tested (inspected) for proper operation. Are classified according to the test results. Hereinafter, the inside of the handler 1 will be described in detail individually.

First, a portion related to the IC storage section 200 will be described. As shown in FIG.
0, a pre-test IC stocker 201 for storing pre-test IC chips and a tested IC stocker 202 for storing IC chips classified according to the test results.

Pre-test IC stocker 201 and tested I
As shown in FIG. 4, the C stocker 202 includes a frame-shaped tray support frame 203 and an elevator 204 that can enter from a lower portion of the tray support frame 203 and move up and down. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.

In the pre-test IC stocker 201 shown in FIG. 2, customer trays KST storing IC chips to be tested are stacked and held. Also,
In the tested IC stocker 202, customer trays KST containing IC chips classified after the test are stacked and held.

The pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure.
The part of the pre-test IC stocker 201 can be used as the tested IC stocker 202 and vice versa.
Therefore, the number of pre-test IC stockers 201 and the tested I
The number of C stockers 202 can be easily changed as needed.

As shown in FIGS. 2 and 3, in this embodiment, two stockers STK-B are provided as the pre-test IC stockers 201. Next to the stocker STK-B, as the tested IC stocker 202, the unloader unit 4
Two empty stockers STK-E sent to 00 are provided. Adjacent to the tested IC stockers 202 are eight stockers STK-1, STK-2,.
STK-8 is provided, and is configured to be able to sort and store up to eight categories according to test results. In other words, besides the non-defective products and the defective products, the operation speed can be sorted into high-speed ones, medium-speed ones, low-speed ones among the non-defective ones, and the ones that need to be retested among the defective ones. .

Second, a portion related to the loader section 300 will be described. The pre-test IC stocker 201 shown in FIG.
Tray K stored in tray support frame 203
As shown in FIG. 2, the ST is carried from below the device substrate 105 to the window 306 of the loader unit 300 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. In the loader unit 300, the IC chips under test loaded on the customer tray KST are once transferred to a preciser 305 by the XY transfer device 304, where the mutual positions of the IC chips under test are corrected. After that, Precisor 305
The IC chip under test transferred to the XY transfer device 3
04, the test tray TST stopped on the loader unit 300 is reloaded.

From the customer tray KST to the test tray T
XY transfer device 3 for transferring IC chips under test to ST
As shown in FIG. 2, as shown in FIG. 2, as shown in FIG. 2, two rails 301 provided on the upper part of the device board 105 and the two rails 301 reciprocate between the test tray TST and the customer tray KST (in this direction). Is a Y direction), and the movable arm 302
And a movable head 303 that can be moved in the X direction along the movable arm 302.

The movable head 303 of the XY transport device 304
, A suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC chip under test from the customer tray KST and placing the IC chip under test on the test tray TST. Transship. For example, about eight such suction heads are mounted on the movable head 303, and eight IC chips to be tested can be transferred to the test tray TST at a time.

Third, parts related to the chamber 100 will be described. The test tray TST described above is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray TST.

As shown in FIGS. 2 and 3, the chamber 1
00 is the IC under test loaded on the test tray TST
A constant temperature chamber 101 for applying a desired high or low temperature thermal stress to the chip and an IC chip to be tested in a state where the thermal stress is applied in the constant temperature chamber 101 include a test head 5.
It comprises a test chamber 102 mounted in the upper socket, and a heat removal tank 103 for removing a given thermal stress from an IC chip under test tested in the test chamber 102.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC chip under test is cooled by blowing air to return to room temperature, and when a low temperature is applied in the constant temperature bath 101, the IC chip under test is applied. Is heated with warm air or a heater to return the temperature to a level that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 2, a constant temperature bath 101 and a heat removal bath 103 of a chamber 100 are
It is arranged so as to project upward. As shown conceptually in FIG. 3, the thermostatic chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby, a high-temperature or low-temperature thermal stress is applied to the IC chip under test.

As shown in FIG. 6, the test chamber 102
, A test head 5 is arranged at the lower center thereof, and a test tray TST is carried on the test head 5. In this case, all the IC chips 2 held by the test tray TST shown in FIG. 7 are sequentially brought into electrical contact with the test head 5, and a test is performed on all the IC chips 2 in the test tray TST. On the other hand, the test tray TST that has completed the test is heat-removed in the heat-removal tank 103, and after returning the temperature of the IC chip 2 to room temperature, is discharged to the unloader section 400 shown in FIGS.

As shown in FIG. 2, an entrance opening for feeding the test tray TST from the apparatus substrate 105 is provided above the constant temperature bath 101 and the heat removal tank 103, and the test tray TST is placed on the apparatus substrate 105. An outlet opening for sending out is formed. A test tray transport device 108 for inserting and removing the test tray TST from these openings is mounted on the device substrate 105.
These transfer devices 108 are constituted by, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

FIG. 7 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST has a rectangular frame 12, on which a plurality of crossbars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of these bars 13 and on the inside of the side 12a of the frame 12 parallel to the bars 13 so as to project at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two opposed mounting pieces 14 of the plurality of mounting pieces 14 provided between the crosspieces 13 and between the crosspiece 13 and the side 12a.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is attached to the two attachment pieces 14 in a floating state by using a fastener 17. For example, about 16 × 4 such inserts 16 are attached to one test tray TST. By storing the IC chip 2 under test in the insert 16, the IC chip 2 under test is loaded on the test tray TST. Note that the IC to be tested in this embodiment is
As shown in FIGS. 10 to 13, the chip 2 is a so-called BGA type IC in which solder balls as external terminals 22 are arranged in a matrix on the lower surface of a rectangular main body 21.
Chip.

In the insert 16 of the present embodiment,
As shown in FIGS. 8 and 10, a rectangular IC housing portion 19 for housing the IC chip 2 under test is formed. IC
The lower end of the storage portion 19 is opened so that the external terminals 22 of the IC chip 2 are exposed, and an IC holding portion 195 for holding the IC chip 2 is provided at the periphery of the opening.

Guide holes 20 into which the guide pins 32 of the pusher base 34 and the guide bushes 411 of the socket guide 41 are inserted from above and below are formed at the center of both sides of the insert 16. The portion is formed with a mounting hole 21 for mounting the test tray TST to the mounting piece 14.

As shown in FIGS. 10 and 11, the guide hole 20 is a hole for positioning. For example, if the left guide hole 20 in the figure is used as a positioning hole and the inner diameter is smaller than that of the right guide hole 20, the guide pin 32 of the pusher base 34 is provided in the upper half of the left guide hole 20. The positioning is performed by inserting the guide bush 411 of the socket guide 41 into the lower half thereof. On the other hand, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher base 34, and the guide bush 411 of the socket guide 41 are loosely fitted.

As shown in FIG. 8, a socket board 50 is arranged on the test head 5. The socket boards 50 can be arranged in the test tray TST shown in FIG. 7 in a number (4 rows × 4 columns) corresponding to, for example, every three rows of IC chips 2 to be tested in every three rows in the row direction. If the size of each socket board 50 can be reduced, four rows are placed on the test head 5 so that all the IC chips 2 held in the test tray TST shown in FIG. × 16 rows of socket boards 50 may be arranged.

As shown in FIG. 8, a socket 40 is provided on a socket board 50. As shown in FIGS. 10 and 11, probe pins 44 (socket connection terminals) provided on the socket 40 are provided. The socket guide 41 is fixed to the socket 40 so that the socket guide 41 is exposed. The probe pins 44 of the socket 40 are provided at the number and positions corresponding to the external terminals 22 of the IC chip 2, and are urged upward by a spring (not shown). On both sides of the socket guide 41, two guide pins 32 formed on the pusher base 34 are inserted, and guide bushes 411 for positioning between the two guide pins 32 are provided.

The pusher 30 shown in FIG.
Are provided on the upper side of the test head 5 in correspondence with the numbers of.
As shown in FIG. 6, each pusher 30 is elastically held on a match plate 60. The match plate 60 is positioned above the test head 5 and the pusher 30.
The test tray TST is mounted between the socket and the socket 40 so as to be insertable. The pusher 30 held by the match plate 60 is moved with respect to the test head 5 or a driving plate (driving body) 72 of the Z-axis driving device 70.
It is movable in the Z-axis direction. The test tray TST
Is transported between the pusher 30 and the socket 40 in a direction (X axis) perpendicular to the plane of FIG. As a transport unit of the test tray TST inside the chamber 100, a transport roller or the like is used. Test tray TS
At the time of the transport movement of T, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the pusher 30
A sufficient gap into which the test tray TST is inserted is formed between the socket and the socket 40.

As shown in FIG. 6, the test chamber 102
The number of pressing portions 74 corresponding to the number of pushers 30 is fixed to the lower surface of the drive plate 72 disposed inside the upper surface of the drive plate 72, and the upper surface of the pusher 30 held on the match plate 60 (the upper surface of the lead pusher base 35) Can be pressed. A drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78. The drive shaft 78 is moved up and down along the Z-axis direction. 30 can be pressed.

The match plate 60 is formed according to the shape of the IC chip 2 to be tested, the number of sockets of the test head 5 (the number of IC chips 2 to be measured simultaneously), and the like.
It has a structure that can be exchanged together with the pusher 30. By making the match plate 60 exchangeable in this way, the Z-axis driving device 70 can be made a general-purpose one. In the present embodiment, the pressing portion 74 and the pusher 30
For example, when the number of sockets of the test head 5 is changed to half, the match plate 6
By exchanging 0, it is possible to make the pressing portion 74 and the pusher 30 correspond to each other in a two-to-one correspondence.

As shown in FIG. 9, the pusher 30 includes a lead pusher base 35 attached to the above-described Z-axis driving device and vertically moved in the Z-axis direction, and a pusher base 34.
, A pusher block 31 attached to the pusher base 34, and a spring 36 (an example of an elastic member) provided between the lead pusher base 35 and the pusher block 31.

As shown in FIG. 9, the lead pusher base 35 and the pusher base 34 are fixed by bolts, and the guide hole 20 of the insert 16 and the guide bush 411 of the socket guide 41 are provided on both sides of the pusher base 34. A guide pin 32 is provided which is inserted into the guide pin 32. Further, the pusher base 34 is provided with a stopper guide 33 for regulating the lower limit when the pusher base 34 is lowered by the Z-axis driving means. By contacting the pusher 412, the reference dimension of the lower limit position of the pusher 30 is determined.
The IC chip 2 mounted on the socket 40 can be pressed with an appropriate pressure that does not destroy it.

As shown in FIG. 9, the pusher block 31
Is inserted into a through hole formed in the center of the pusher base 34, and a spring 36 and a shim 37 as necessary are interposed between the pusher block 31 and the lead pusher base 35. The spring 36 is a compression spring that urges the pusher block 31 in a direction of pressing the IC chip 2 mounted on the socket 40 (downward in FIGS. 10 and 11), and according to a reference load on the IC chip 2. It has an elastic modulus.

The shim 37 adjusts the reference length when the spring 36 is mounted, and adjusts the initial load acting on the pusher block 31. That is, even when the springs 36 having the same elastic coefficient are used, the initial load acting on the pusher block 31 is increased by interposing the shim 37. In FIG. 9, the shim 37 is interposed between the spring 36 and the pusher block 31, but it is sufficient if the reference length of the spring 36 can be adjusted. For example, the shim 37 is mounted between the lead pusher base 35 and the spring 36. May be.

The spring 3 is used as the elastic member according to the present invention.
In the case of using 6, a plurality of types of springs having different elastic coefficients are prepared in advance, and an appropriate spring can be used from these according to the reference load on the IC chip under test. Alternatively, the pusher block 31 may have a structure in which a plurality of springs can be mounted in parallel, and the number of these mounted may be selected according to the reference load on the IC chip 2.

As shown in FIG. 10, the pusher block 3
1 includes a pressed surface 211 of the main body 21 of the IC chip 2.
A conical protruding portion 312 is provided on a rectangular surface 311 facing the surface opposite to the surface on which the external terminals 22 are provided.

The protrusion 312 is connected to the external terminal 2 of the IC chip 2.
The number and the position corresponding to 2 are provided. Projection 3
12 are provided in a number and a position corresponding to the external terminals 22 of the IC chip 2,
A pressing force required for connection between the external terminal 22 and the probe pin 44 of the socket 40 can be applied. The material of the protrusion 312 is a material exhibiting elasticity (for example, rubber, plastic, or the like).

In order to connect the external terminals 22 of the IC chip 2 under test to the probe pins 44 of the socket 40, FIG.
As shown in the figure, the IC chip 2 is housed in the IC housing 19 of the insert 16 and the lower surface of the main body 21 of the IC chip 2 (the surface on which the external terminals 22 are provided) in the IC holder 195.
And the external terminals 22 of the IC chip 2 are exposed from the lower end opening of the IC housing 19.

By mounting the insert 16 containing the IC chip 2 on the socket guide 41 in this manner, the IC chip 2 is mounted on the socket 40. In this state, the Z-axis driving device is driven, and the pusher 30 is pressed.
Then, the pusher block 31 of the pusher 30
As shown in FIG. 11, the main body 21 of the IC chip 2 is pressed against the socket 40, and as a result, the external terminals 22 of the IC chip 2 are connected to the probe pins 44 of the socket 40. At this time, although the probe pin 44 of the socket 40 is retracted into the socket 40 while being urged upward, the tip of the probe pin 44 slightly penetrates the external terminal 22.

When the main body 21 of the IC chip 2 is pressed by the pusher block 31, as shown in FIG.
A gap R is formed between the pressed surface 211 of the main body 21 of the C chip 2 and the surface 311 of the pusher block 31 facing the pressed surface 211 by the interposition of the protrusion 312. Therefore, the I attached to the socket 40
The pressed surface 211 of the main body 21 of the C chip 2 is
As shown in FIG. 3A, when an adhering substance S such as a piece of silicon is present, the IC chip 2 is pushed into the pusher 3.
When pressed at 0, as shown in FIG.
Contacts the projection 312 provided on the pusher block 31. Since the protrusion 312 has a pointed shape, the protrusion 312 and the attached matter S make point contact (or surface contact with a small contact area), and a local force is applied to the attached matter S. Therefore, the deposit S in contact with the protrusion 312 is repelled,
As shown in FIG. 12 (c), it moves to the gap R. As a result, it is possible to prevent a concentrated load from being applied to the portion where the deposit S is attached, and to prevent the IC chip 2 from being damaged by the crack or chipping of the IC chip 2 without damaging the socket 40. A pressing force in the direction of the probe pin 44 can be applied.

Further, depending on the position of the deposit S, there is a case where the deposit S does not come into contact with the protrusion 312. In this case, however, the deposit S is present in the gap R.
The attachments S do not cause damage such as cracking or chipping of the IC chip 2.

Since the material of the projection 312 is a material exhibiting elasticity, when the projection 312 comes into contact with the deposit S, the projection 312 is deformed by itself, and the pressing force applied to the deposit S can be reduced. Therefore, damage such as cracking or chipping of the IC chip 2 that may occur when the protrusion 312 and the attached matter S come into contact with each other can be prevented.

Even when there is a dimensional error between the projections 312 provided on the pusher block 31 of the pusher 30, each projection 312 is urged by the spring 36 in the pressing direction of the IC chip 2. IC
When the chip 2 is pressed, the dimensional error of each protrusion 312 can be absorbed by the spring 36, and the pressing force applied to the pressed surface 211 of the IC chip can be made uniform by each protrusion 312. In other words, by controlling the stroke of each protrusion 312 and the load of each protrusion 312, each protrusion 312 causes the pressed surface 21 of the IC chip to be pressed.
The pressing force applied to 1 can be made uniform.

In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 6, a temperature control blowing device 90 is mounted inside a closed casing 80 forming a test chamber 102. is there. The temperature control blower 90 has a fan 92 and a heat exchange unit 94,
The air inside the casing is sucked by the fan 92 and discharged into the inside of the casing 80 through the heat exchanging section 94, whereby the inside of the casing 80 is set to a predetermined temperature condition (high or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchanging section 94 of the temperature adjusting blower 90 is constituted by a heat radiating heat exchanger or an electric heater through which a heating medium flows. It is possible to provide a sufficient amount of heat to maintain a high temperature of room temperature to about 160 ° C. When the inside of the casing is to be cooled, the heat exchanging section 94 is constituted by a heat absorbing heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates. A sufficient amount of heat can be absorbed to maintain a low temperature. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the fan 9 is controlled to maintain the internal temperature of the casing 80 at a predetermined temperature.
2 and the amount of heat of the heat exchange unit 94 are controlled.

The hot or cold air generated through the heat exchange section 94 of the temperature control blower 90 flows along the Y-axis direction along the upper part of the casing 80, descends along the casing side wall opposite to the apparatus 90, and matches. It returns to the device 90 through the gap between the plate 60 and the test head 5 and circulates inside the casing.

Fourth, a portion related to the unloader section 400 will be described. The unloader unit 400 shown in FIGS. 2 and 3 is also provided with an XY transfer device 404 having the same structure as the XY transfer device 304 provided in the loader unit 300. Tested IC chips are reloaded from the test tray TST carried out to the unit 400 to the customer tray KST.

As shown in FIG. 2, a pair of windows 406 on which the customer tray KST conveyed to the unloader unit 400 is arranged so as to face the upper surface of the device substrate 105 is provided on the device substrate 105 of the unloader unit 400. There are 406 pairs.

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406. Here, the tested IC chips to be tested are reloaded. The customer tray KST which is full is placed on the tray and descends, and the full tray is transferred to the tray transfer arm 205.

The embodiments described above are described for facilitating the understanding of the present invention, but not for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the shape of the projection 312 provided on the pusher block 31 of the pusher 30 can be changed within a range in which it makes point contact with the deposit S or makes surface contact with a small contact area. For example, the protrusion 31
The shape of 2 can be a pointed shape other than a cone shape such as a pyramid shape or a needle shape. As shown in FIG.
When the shape of 12 is needle-shaped, the gap R formed between the pressed surface 211 of the main body 21 of the IC chip 2 and the surface 311 of the pusher block 31 facing the pressed surface 211 is large. Therefore, when the protrusion 312 and the attached matter S come into contact with each other, the attached matter S easily moves to the gap R. When the shape of the projection 312 is needle-like,
The probability that the protruding portion 312 comes into contact with the attached matter S decreases (that is, the probability that the attached matter S exists in the gap R from the beginning increases).

The IC test apparatus 10 is not limited to the chamber type described in the above embodiment, but may be, for example, a chamberless type or a heat plate type.

[0077]

According to the pusher and the electronic component testing apparatus of the present invention, even if small pieces such as silicon fragments are adhered to the pressed surface of the electronic component, the electronic component does not crack or chip. A pressing force in the direction of the connection terminal of the socket can be applied to the electronic component under test without causing damage.

[Brief description of the drawings]

FIG. 1 is an overall side view showing an IC test apparatus which is an embodiment of an electronic component test apparatus according to the present invention.

FIG. 2 is a perspective view showing a handler in the IC test apparatus.

FIG. 3 is a flowchart of a tray showing a method of handling an IC under test.

FIG. 4 is a perspective view showing a structure of an IC stocker in the IC test apparatus.

FIG. 5 is a perspective view showing a customer tray used in the IC test apparatus.

FIG. 6 is a sectional view of a main part in a test chamber of the IC test apparatus.

FIG. 7 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

FIG. 8 is an exploded perspective view showing a structure near a socket in a test head of the IC test apparatus.

FIG. 9 is an exploded perspective view of a pusher in the IC device.

FIG. 10 is a sectional view of the vicinity of the socket in the IC device.

FIG. 11 is a sectional view showing a state where the pusher is lowered in FIG.

FIG. 12 is a cross-sectional view showing a state of a substance adhering to the pressed surface of the IC chip before and after the pusher is lowered.

FIG. 13 is a cross-sectional view showing another embodiment of the protrusion of the pusher.

[Explanation of symbols]

 2 IC chip (electronic component) 21 body part 211 pressed surface 22 external terminal 10 IC testing device (electronic component testing device) 30 pusher 312 projecting portion 40 ... Socket 44 ... Probe pin (connection terminal)

Claims (5)

[Claims] 1. A pusher for pressing a body portion of an electronic component mounted on a socket, wherein the electronic component is pressed toward a connection terminal of the socket on a surface facing a pressed surface of the electronic component. A pusher, characterized in that the pusher is provided with a protruding portion. 2. The pusher according to claim 1, wherein said projection has a pointed shape. 3. The pusher according to claim 1, wherein the protrusion is provided at a position corresponding to an external terminal of the electronic component. 4. The pusher according to claim 1, further comprising an elastic member for urging the projection in a direction in which the electronic component is pressed. 5. An electronic component test apparatus comprising the pusher according to claim 1.