JP2002156408A - Kit and method for cleaning socket connecting terminal, and electronic part tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a kit and a method for cleaning socket connecting terminals, and an electronic part tester whereby the socket connecting terminals can be simply cleaned without being damaged. SOLUTION: A thickness of a part of a rubbing member 110 to be held between a pressing face of a pusher 30 and the connecting terminals 43 of the socket 40 is set to be nearly equal to a thickness of leads 2a of an IC chip 2 to be held between the pressing face of the pusher 30 and the connecting terminals 43 of the sockets 40. The rubbing member 110 having at least a face to be in contact with the connecting terminals 43 of the socket 40 made rough is stored in an insert 16 in place of the IC chip 2. The insert 16 with the rubbing member 110 stored therein is detachably mounted on the socket 40. The pusher 30 is pressed towards the connecting terminals 43 of the socket 40 once or for a plurality of the number of times by a specified stroke with the use of a pusher drive unit set on the electronic part tester or manually, whereby the rubbing member 110 slides in contact with the connecting terminals 43 of the socket 40.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a kit and a method for removing impurities such as an oxide film adhered to a connection terminal of a socket in an apparatus for testing an electronic component such as an IC chip (cleaning the connection terminal). And an electronic component testing apparatus capable of cleaning connection terminals of a socket.

[0002]

2. Description of the Related Art As one type of a test device for testing electronic components such as an IC chip, an IC chip is transported onto a test head, and the IC chip is pressed against a socket of the test head by a pusher driven by a pusher driving device. Then, the connection terminal of the IC chip is electrically connected to the connection terminal of the socket.
2. Description of the Related Art There is known an electronic component test apparatus that tests a C chip and separates at least a good chip and a defective chip according to the test result.

The types of the IC chips include, for example,
Surface mount type peripheral type (SOP (Small
Outline Package) type, QFP (Quad Flat Packag)
e) type, surface mount area array type (BGA (Ball Grid Array) type, LGA (Land Gr
id Array) type, and the connection terminals of any of the IC chips are usually plated with solder or formed of solder balls.

[0004] The form of the socket and the connection terminal of the socket is specified according to the type of the IC chip. For example, connection terminals in a surface mount type peripheral type IC chip socket are formed in a shape and a material suitable for sliding contact with connection terminals (leads) of the IC chip. For this purpose, a beryllium copper thin plate is punched out by a press so that the central portion is curved, and a gold plated nickel base is used as a surface treatment.

For example, as a connection terminal in a socket for a surface mount area array type IC chip, a probe-shaped connection terminal called a probe pin or a spring probe pin is usually used.

[0006]

By the way, when the test for electrically connecting the connection terminals of the IC chip to the connection terminals of the socket as described above is repeated, the solder of the connection terminals of the IC chip is removed. And the oxide film by the solder may be formed on the connection terminal of the socket. Such a state is also likely to occur when performing so-called burn-in in which the IC chip is heated to a high temperature and a high voltage is applied to remove the initial failure of the IC chip.

When an IC chip is tested with an oxide film formed on the connection terminal of the socket as described above,
Even if a certain IC chip is determined to be defective, the cause may be defective contact between the connection terminals of the IC chip and the connection terminals of the socket, and an accurate test cannot be performed.

[0008] Such a problem has occurred both in the socket for the surface mounted peripheral type IC chip and in the socket for the surface mounted area array type IC chip.

In order to prevent contact failure between the connection terminals of the IC chip and the connection terminals of the socket as described above, it is necessary to clean the connection terminals of the socket on which an oxide film is formed by soldering. Cleaning was performed manually using a brush or a metal wire brush. Such manual cleaning is extremely inefficient, and is particularly difficult in a test apparatus having a large number of sockets. In addition, in the case of manual cleaning, there is a problem that the connection terminal of the socket is damaged or the gold plating is peeled off due to excessive polishing.

The present invention has been made in view of such circumstances, and a socket connection terminal cleaning kit capable of easily cleaning a connection terminal of a socket without damaging the connection terminal of the socket.
An object of the present invention is to provide a socket connection terminal cleaning method and an electronic component test device.

[0011]

To achieve the above object, a first socket connection terminal cleaning kit according to the present invention provides a socket having a connection terminal capable of slidingly contacting a connection terminal of an electronic component. Or, an insert that is detachably mounted on the guide of the socket and stores the electronic component so that the connection terminal of the electronic component to be exposed is exposed, and the connection terminal of the electronic component is connected to the connection terminal of the socket with a prescribed stroke. A pusher to be pressed and a rubbing member which is housed in the insert instead of the electronic component and which can contact the connection terminal of the socket in that state, at least a surface which contacts the connection terminal of the socket is rough. The thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is determined by the pressing surface of the pusher and the socket. Characterized in that a said rubbing member is set substantially equal to the thickness of the connection terminal of the electronic component to be sandwiched between the connection terminal (claim 1).

Further, in the first socket connecting terminal cleaning method according to the present invention, the thickness of a portion sandwiched between the pressing surface of the pusher and the connecting terminal of the socket is such that the thickness of the pressing surface of the pusher and the connecting terminal of the socket are different. The rubbing member, which is set to be substantially the same as the thickness of the connection terminal of the electronic component to be sandwiched and has a rough surface at least in contact with the connection terminal of the socket, is stored in the insert instead of the electronic component, The insert containing the rubbing member is detachably mounted on the socket and / or the guide of the socket, and the pusher is moved to a predetermined stroke by using a pusher driving device installed in an electronic component test apparatus or manually. Press one or more times to the connection terminal side of the socket, and slide the rubbing member against the connection terminal of the socket. Letting tactile characterized (claim 5).

Further, the first electronic component testing apparatus according to the present invention is configured such that the socket having a connection terminal capable of slidingly contacting the connection terminal of the electronic component is detachable from the socket and / or the guide of the socket. An insert for mounting the electronic component so as to expose the connection terminal of the electronic component to be tested, a pusher for pressing the connection terminal of the electronic component against the connection terminal of the socket with a prescribed stroke, and driving the pusher A pusher driving device, a rubbing member that is housed in the insert instead of the electronic component and that can contact the connection terminal of the socket in that state, and a surface that contacts the connection terminal of the socket is rough. The thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket depends on the contact between the pressing surface of the pusher and the socket. Characterized in that a said rubbing member is set substantially equal to the thickness of the electronic component connection terminals interposed between the terminal (claim 7).

The electronic component is not particularly limited as long as it is a type of electronic component having a connection terminal that makes sliding contact with the connection terminal of the socket. Most commonly, a surface-mounted peripheral type IC chip is used. Examples can be given. Such IC chips include, for example, SOP
Type IC chip and QFP type IC chip.

The "specified stroke" in the present invention means that the movement of the pusher is restricted so that the connection terminal of the socket or the connection terminal of the electronic component is not destroyed due to excessive movement of the pusher. As the pusher abuts against the stopper provided on the insert or socket guide, the "specified stroke"
Becomes

In the above invention (claims 1, 5 and 7), the rubbing member is housed in the insert instead of the electronic component, and the insert housing the rubbing member is detachably attached to the socket and / or the guide of the socket. Push the pusher one or more times to the connection terminal side of the socket, using the pusher driving device installed in the electronic component tester or manually, and attach the rubbing member to the connection terminal of the socket. By pressing the rubbing member into sliding contact with the connection terminal of the socket, the connection terminal of the socket is polished by the rough surface of the rubbing member. If formed,
The impurities are removed.

At this time, the pusher presses the rubbing member against the connection terminal of the socket with a prescribed stroke.
The stroke of such a pusher is usually set according to the connection terminal of the electronic component. Here, in the rubbing member, the thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is substantially the same as the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. Is set to Therefore, when such a rubbing member is housed in an insert instead of an electronic component, the pusher pushes the rubbing member into the socket with an appropriate pressure that does not destroy the connection terminal of the socket, as in the case where the electronic component is housed in the insert. Can be pressed against the connection terminal.

The rubbing member in the above invention (claims 1, 5 and 7) has a thickness substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket, Preferably, at least one surface is a plate-like body having a rough surface, and the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component. ).

The rubbing member having such a shape can be easily manufactured, and therefore, the manufacturing cost can be reduced. When the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component, the rubbing member can be securely housed in the insert and pressed against the socket in the same manner as the electronic component.

The rubbing member as described above can be composed of, for example, a sandpaper and a plate-like substrate supporting the sandpaper. If the sandpaper is too rough, the connection terminals of the socket may be damaged if it is too rough. If it is too fine, the connection terminals of the socket on which an oxide film is formed by solder cannot be sufficiently cleaned. It is preferably before and after.

The rubbing member may be made of a metal plate, a glass plate, a ceramic plate, or the like whose surface is roughened by sand blasting or the like, or may be formed by spraying or evaporating particles on a metal plate. It may be.

A second socket connection terminal cleaning kit according to the present invention is detachably mounted on a socket having a probe-like connection terminal and / or a guide of the socket, and has a connection terminal of an electronic component to be tested. An insert that stores the electronic component so as to be exposed, a pusher that presses the electronic component against the socket with a prescribed stroke,
A rubbing member that is housed in the insert instead of the electronic component and in which the connection terminal of the socket can pierce, and at least a portion pierced by the connection terminal of the socket is an abrasive fiber aggregate, And a rubbing member having a thickness substantially equal to the thickness of the rubbing member.

Further, in the second socket connection terminal cleaning method according to the present invention, the thickness of the electronic component is substantially the same as that of the electronic component, and at least a portion of the socket where the probe-like connection terminal pierces is formed in the polishing fiber assembly. The rubbing member is stored in an insert instead of an electronic component, and the insert housing the rubbing member is detachably mounted on the socket and / or the guide of the socket, and is installed in an electronic component test apparatus. Using a pusher driving device or manually, the pusher is pressed against the connection terminal side of the socket once or a plurality of times with a prescribed stroke, and the connection terminal of the socket is pierced into the rubbing member. (Claim 6).

Further, the second electronic component testing apparatus according to the present invention is characterized in that a socket provided with a probe-like connecting terminal and an electronic device to be tested which are detachably mounted on the socket and / or the guide of the socket, and which are to be tested. An insert that houses the electronic component so that the connection terminal of the component is exposed, a pusher that presses the electronic component against the socket with a prescribed stroke, a pusher driving device that drives the pusher, and the insert instead of the electronic component. It is a rubbing member that is stored and can pierce the connection terminal of the socket in that state, and at least a portion pierced by the connection terminal of the socket is a polished fiber aggregate, and has a thickness substantially equal to the thickness of the electronic component. And a rubbing member having the rubbing member (claim 8).

The electronic component is not particularly limited as long as it is a type of electronic component having a connection terminal with which a probe-like connection terminal of a socket comes into contact. Most commonly, a surface mount type area array type IC is used. A chip can be exemplified. As such an IC chip, for example, BG
There are A type IC chips and LGA type IC chips. The “thickness of the electronic component” refers to the thickness of the electronic component including the height of the connection terminal of the electronic component.

The above-mentioned abrasive fiber aggregate is an aggregate of fibers having polishing ability such as metal fiber and glass fiber. The aggregate may be formed, for example, by intertwining wool-like fibers or non-woven fabric. Or a knitted object, a woven body, or the like. As a preferable abrasive fiber aggregate, a molded product of metal wool can be exemplified.

In the above invention (claims 3, 6, and 8), the rubbing member is housed in the insert instead of the electronic component, and the insert housing the rubbing member is detachably attached to the socket and / or the socket guide. Pressing the pusher one or more times against the connection terminal side of the socket, using a pusher driving device mounted on the electronic component test device or manually, and pressing the rubbing member against the socket, By piercing the connection terminal of the socket into the rubbing member, the connection terminal of the socket is polished by the polishing fiber aggregate of the rubbing member,
Therefore, when impurities such as an oxide film by solder are formed on the connection terminals of the socket, the impurities are removed.

At this time, the pusher presses the rubbing member against the connection terminal of the socket with a prescribed stroke.
The stroke of such a pusher is usually set according to the electronic component. Here, in the rubbing member, the thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is set to be substantially the same as the thickness of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. ing. Therefore, when such a rubbing member is stored in the insert instead of the electronic component, the pusher is rubbed with an appropriate pressure which does not destroy the socket connection terminal or the rubbing member, as in the case where the electronic component is stored in the insert. The member can be pressed against the connection terminal of the socket.

The rubbing member in the above invention (claims 3, 6 and 8) is a polished fiber assembly having a thickness substantially equal to the thickness of the electronic component, and the width and length of the rubbing member are It is preferable that the width and the length of the component are set to be substantially the same (claim 4).

A rubbing member having such a shape can be easily manufactured by molding an abrasive fiber aggregate or the like, so that the manufacturing cost can be reduced. However, when all the socket connection terminals are automatically cleaned by the electronic component tester, the rubbing member is sucked by the suction head and picked and placed, so that the rubbing member is sufficiently ventilated by the suction head. In order to reduce the property, it is necessary to increase the density of the abrasive fiber aggregate constituting the rubbing member.

When the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component, the rubbing member is securely housed in the insert similarly to the electronic component.
Can be pressed into the socket.

[0032]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 15 are diagrams relating to the first embodiment of the present invention, and FIGS. 16 to 23 are diagrams relating to the second embodiment of the present invention. First, a first embodiment of the present invention will be described.

[First Embodiment] FIG. 1 is an exploded perspective view for explaining how a rubbing member used in an IC test apparatus according to a first embodiment of the present invention is incorporated into an insert, and FIG. FIG. 3 is a perspective view of a handler shown in FIG. 2, FIG. 4 is a flowchart of a tray showing a method of handling an IC under test, and FIG. 5 is a perspective view showing a structure of an IC stocker of the IC test apparatus. Figure 6 shows the IC
FIG. 7 is a perspective view showing a customer tray used in the test apparatus, FIG. 7 is a cross-sectional view of a main part in a test chamber of the IC test apparatus, FIG. 8 is a partially exploded perspective view showing a test tray used in the IC test apparatus, and FIG. 10 is an exploded perspective view showing the structure near the socket in the test head of the IC test apparatus, FIG. 10 is a cross-sectional view near the socket shown in FIG. 9, FIG. 11 is a cross-sectional view showing a state where the pusher is lowered in FIG. Is a plan view and a side view showing a rubbing member used in the IC test apparatus, FIG. 13 is a cross-sectional view around an insert and a socket incorporating the rubbing member, FIG. 14 is a cross-sectional view showing a state where the pusher is lowered in FIG. FIG.
(b) is a side view explaining the state where the connection terminal of the socket is cleaned.

First, the overall configuration of an IC test apparatus as an electronic component test apparatus according to the first embodiment of the present invention will be described. As shown in FIG. 2, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 carries out an operation of sequentially transporting an IC chip to be tested (an example of an electronic component) to a socket provided in the test head 5, sorting the IC chips having undergone the test in accordance with the test result, and storing them in a predetermined tray. I do.

The socket provided in the test head 5 is electrically connected to the main test device 6 through a cable 7, and an IC chip detachably mounted on the socket is connected to the socket.
The IC chip is connected to the test main device 6 through the cable 7 and the IC chip is tested by a test electric signal from the test main device 6.

A control device for mainly controlling the handler 1 is built in a lower portion of the handler 1, but a space portion 8 is provided in a part thereof. In this space portion 8, the test head 5
The IC chip can be mounted in a socket on the test head 5 through a through hole formed in the handler 1.

This IC testing apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at a temperature higher than normal temperature (high temperature) or lower than normal temperature (low temperature). As shown in FIGS. 3 and 4, the thermostat 101, the test chamber 102, and the heat removal tank 10
3 with the chamber 100. The upper part of the test head 5 shown in FIG. 2 is inserted into the test chamber 102 as shown in FIG. 7, where the test of the IC chip 2 is performed.

FIG. 4 is a diagram for explaining a method of mounting the test IC chip in the IC test apparatus of the present embodiment. In practice, the members arranged vertically are shown in plan view. There is also a part shown in. Therefore, its mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

As shown in FIGS. 3 and 4, the handler 1 of the IC test apparatus 10 of the present embodiment stores IC chips to be tested from now on, and stores IC chips for classifying and storing tested IC chips. Classification of the unit 200, the loader unit 300 for sending the IC chip under test sent from the IC storage unit 200 to the chamber unit 100, the chamber unit 100 including the test head, and the tested ICs tested in the chamber unit 100 And an unloader section 400 for taking out the data. Inside the handler 1, the IC chips are stored in a test tray and transported.

A large number of IC chips before being stored in the handler 1 are stored in the customer tray KST shown in FIG. 6, and in this state, are supplied to the IC storage section 200 of the handler 1 shown in FIGS. Then, the test tray T transported in the handler 1 from the customer tray KST
The IC chip 2 is replaced in ST (see FIG. 8). Inside the handler 1, as shown in FIG. 4, the IC chip moves while being placed on the test tray TST, is subjected to high-temperature or low-temperature stress, and is tested (inspected) for proper operation. Are classified according to the test results. Hereinafter, the inside of the handler 1 will be described in detail individually.

First, a portion related to the IC storage section 200 will be described. As shown in FIG.
0, a pre-test IC stocker 201 for storing pre-test IC chips, and a tested IC stocker 202 for storing IC chips classified according to the test results.

As shown in FIG. 5, the pre-test IC stocker 201 and the tested IC stocker 202 enter a frame-shaped tray support frame 203 and move up and down from the lower portion of the tray support frame 203 toward the upper portion. And an elevator 204 that enables it. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.

In the pre-test IC stocker 201 shown in FIG. 3, customer trays KST in which IC chips to be tested are stored are stacked and held. Also,
In the tested IC stocker 202, customer trays KST containing IC chips classified after the test are stacked and held.

The pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure.
It can be used as the stocker 202 and vice versa. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as needed.

As shown in FIGS. 3 and 4, in the present embodiment, two stockers S
TK-B is provided. Next to the stocker STK-B,
The unloader unit 400 is used as the tested IC stocker 202.
There are provided two empty stockers STK-E to be sent to the server. In addition, next to the tested IC stocker 202, 8
Stockers STK-1, STK-2, ..., STK-8
Are provided so that they can be sorted and stored in a maximum of eight categories according to the test results. In other words, besides the non-defective products and the defective products, the operation speed can be sorted into high-speed ones, medium-speed ones, low-speed ones among the non-defective ones, and the ones that need to be retested among the defective ones. .

Second, a portion related to the loader section 300 will be described. The pre-test IC stocker 201 shown in FIG.
Tray K stored in tray support frame 203
As shown in FIG. 3, the ST is carried from the lower side of the device substrate 105 to the window 306 of the loader unit 300 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. In the loader unit 300, the IC chips under test loaded on the customer tray KST are once transferred to a preciser 305 by the XY transfer device 304, where the mutual positions of the IC chips under test are corrected. After that, this Precisor 3
The IC chip under test transferred to the test tray 05 is transferred to the test tray TST stopped on the loader unit 300 again using the XY transfer device 304.

From the customer tray KST to the test tray T
XY transfer device 3 for transferring IC chips under test to ST
As shown in FIG. 3, as shown in FIG. 3, two rails 301 provided on the upper part of the device board 105 and the two rails 301 reciprocate between the test tray TST and the customer tray KST (in this direction). Is a Y direction), and the movable arm 302
And a movable head 303 that can be moved in the X direction along the movable arm 302.

The movable head 3 of the XY transport device 304
At 03, a suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC chip under test from the customer tray KST, and transferring the IC chip under test to the test tray TST. Transshipment. For example, about eight such suction heads are mounted on the movable head 303, and eight IC chips to be tested can be transferred to the test tray TST at a time.

Third, parts related to the chamber 100 will be described. The test tray TST described above is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray TST.

As shown in FIGS. 3 and 4, the chamber 1
00 is the IC under test loaded on the test tray TST
A constant temperature bath 101 for applying a desired high or low temperature thermal stress to the chip; a test chamber 102 in which the IC chip to be tested which is given a thermal stress in the constant temperature bath 101 is mounted on a socket on a test head; From the IC chip under test tested in the test chamber 102,
And a heat removal tank 103 for removing applied thermal stress.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC chip under test is cooled by blowing air to return to room temperature, and when a low temperature is applied in the constant temperature bath 101, the IC chip under test is applied. Is heated with warm air or a heater to return the temperature to a level that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 3, a constant temperature bath 101 and a heat removal bath 103 of a chamber 100 are
It is arranged so as to project upward. As shown conceptually in FIG. 4, the thermostatic chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby, a high-temperature or low-temperature thermal stress is applied to the IC chip under test.

As shown in FIG. 7, the test chamber 102
, A test head 5 is arranged at the lower center thereof, and a test tray TST is carried on the test head 5. Here, all the IC chips 2 held by the test tray TST shown in FIG. 8 are sequentially brought into electrical contact with the test head 5, and the test is performed on all the IC chips 2 in the test tray TST. On the other hand, the test tray TST that has completed the test is heat-removed in the heat-removal tank 103, and after returning the temperature of the IC chip 2 to room temperature, is discharged to the unloader unit 400 shown in FIGS.

As shown in FIG. 3, an opening for feeding the test tray TST from the apparatus substrate 105 is provided above the constant temperature bath 101 and the heat removal tank 103, and the test tray TST is placed on the apparatus substrate 105. An outlet opening for sending out is formed. A test tray transport device 108 for inserting and removing the test tray TST from these openings is mounted on the device substrate 105.
These transfer devices 108 are constituted by, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

FIG. 8 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST has a rectangular frame 12, on which a plurality of crossbars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of these bars 13 and on the inside of the side 12a of the frame 12 parallel to the bars 13 so as to project at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two opposed mounting pieces 14 of a plurality of mounting pieces 14 provided between the crosspiece 13 and between the crosspiece 13 and the side 12a.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is attached to the two attachment pieces 14 in a floating state by using a fastener 17. For example, about 16 × 4 such inserts 16 are attached to one test tray TST. By storing the IC chip 2 under test in the insert 16, the IC chip 2 under test is loaded on the test tray TST. Note that the IC to be tested in this embodiment is
As shown in FIGS. 9 to 11, the chip 2 is formed with gull-wing leads 2 from four sides of a rectangular package body 2 b.
a of a so-called QFP type I
C chip.

In the insert 16 of this embodiment,
As shown in FIG. 9, a rectangular recessed IC housing portion 19 for housing the IC chip 2 to be tested is formed in the central portion.
Bottom plate 191 and four side wall portions 193 constituting storage section 19
Are provided with four slits 192 for exposing the leads 2a of the IC chip 2. Note that the bottom plate 191 and the four side wall portions 193 are connected by connecting portions 194 formed at four corners of the IC housing portion 19.

Pushers 30 are provided on both sides of the IC storage section 19.
A stopper 22 for defining the lower limit of the downward movement of the insert 16 is formed so as to protrude upward, and the guide pin 32 and the socket guide 41 of the pusher 30 are inserted into the center of both ends of the insert 16 from above and below, respectively. A guide hole 20 is formed, and a mounting hole 21 for mounting the test tray TST to the mounting piece 14 is formed at both corners of the insert 16.

As shown in FIG. 11, a guide hole 20 on the left side in the figure is a hole for positioning, and a guide hole 2 on the right side.
The inside diameter is smaller than 0. Therefore, the guide pin 32 of the pusher 30 is inserted into the upper half of the guide hole 20 on the left side, and positioning is performed.
The socket guide 41 of the socket 40 is inserted for positioning. By the way, the guide hole 20 on the right side in the figure,
The guide pin 32 of the pusher 30 and the socket guide 41 of the socket 40 are loosely fitted.

As shown in FIG. 9, a socket board 50 is arranged on the test head 5. The socket boards 50 can be arranged in the test tray TST shown in FIG. 8 in a number (4 rows × 4 columns) corresponding to, for example, every third row of IC chips 2 to be tested in every three rows in the row direction. If the size of each socket board 50 can be reduced, four rows are placed on the test head 5 so that all the IC chips 2 held in the test tray TST shown in FIG. × 16 rows of socket boards 50 may be arranged.

As shown in FIGS. 9 to 11, the socket 40 is fixed to the socket board 50.
The socket guide 41 into which the guide pin 32 of the pusher 30 is inserted is provided at both ends of the pusher 30. Socket 4
0, an opening 42 is formed at the center of the opening 4.
A plurality of connection terminals 43 are provided on four sides surrounding 2. The connection terminals 43 of the socket 40 are provided in a number and a pitch corresponding to the leads 2a of the IC chip 2, and are urged upward by a spring. In addition, the connection terminal 43 includes
Gold plating is applied to a nickel base as a surface treatment.

The pusher 30 shown in FIG.
Are provided on the upper side of the test head 5 in correspondence with the numbers of.
As shown in FIG. 7, each pusher 30 is fixed to a lower end of an adapter 62, and each adapter 62 is elastically held on a match plate 60. The match plate 60 is positioned above the test head 5 and the pusher 3.
The test tray TST is mounted between the socket 0 and the socket 40 so as to be insertable. This match plate 60
Pusher 30 held in the test head 5 or Z
The drive plate (drive body) 72 of the shaft drive device 70 is movable in the Z-axis direction. The test tray T
The ST is transported between the pusher 30 and the socket 40 in a direction (X axis) perpendicular to the sheet of FIG. As a transport unit of the test tray TST inside the chamber 100, a transport roller or the like is used. When the test tray TST is transported, the driving plate of the Z-axis driving device 70 is raised along the Z-axis direction, and between the pusher 30 and the socket 40, there is sufficient space for the test tray TST to be inserted. A gap is formed.

As shown in FIG. 7, the test chamber 102
A number of pressing portions 74 corresponding to the number of the adapters 62 are fixed to the lower surface of the drive plate 72 disposed inside the device, so that the upper surface of the adapter 62 held by the match plate 60 can be pressed. A drive shaft 78 is provided on the drive plate 72.
Is fixed, and a drive source (not shown) such as a motor is connected to the drive shaft 78. The drive shaft 78 can be moved up and down along the Z-axis direction to press the adapter 62. .

The match plate 60 is formed according to the shape of the IC chip 2 to be tested and the number of sockets of the test head 5 (the number of IC chips 2 to be measured simultaneously).
It has a replaceable structure together with the adapter 62 and the pusher 30. By making the match plate 60 exchangeable in this way, the Z-axis driving device 70 can be made a general-purpose one. In the present embodiment, the pressing portion 74
And the adapter 62 correspond one-to-one, for example,
When the number of sockets of the test head 5 is changed to half, the pressing portion 74 and the adapter 62 can be made to correspond to each other by 2: 1 by replacing the match plate 60.

As shown in FIGS. 9 to 11, the pusher 30 attached to the lower end of each adapter 62 has an IC under test.
A plate-like pressing element 31 for pressing the lead 2a of the chip 2 against the connection terminal 43 of the socket 40 is provided downward. Specifically, two sets (two in total) of two pressers 31 parallel to each other are provided via the presser holder 33. Further, guide pins 32 inserted into the guide holes 20 of the insert 16 and the socket guide 41 are provided at both ends of the pusher 30.

In this embodiment, four pushers 31 of the pusher 30 are provided in accordance with the IC chip 2 to be tested, that is, the QFP type IC chip 2, but the IC chip to be tested is an SOP type IC chip. In the case of a chip, that is, an IC chip of a type in which a plurality of gull-wing-shaped leads are protruded from two parallel sides of a rectangular package body, the pusher 30 includes two pressing members 31 parallel to each other. A set will be provided.

In order to connect the leads 2 a of the IC chip 2 under test to the connection terminals 43 of the socket 40, as shown in FIG.
9, the leads 2 a of the IC chip 2 are exposed from the slits 192, and the insert 16 containing the IC chip 2 is attached to the socket 40. In this state, the Z-axis driving device 70 is driven, and the driving shaft 7 shown in FIG.
When the drive plate 8 and the drive plate 72 are moved down along the Z-axis direction, the pressing portion 74 of the drive plate 72 contacts the upper surface of the adapter 62 of the match plate 60 and presses the pusher 30 as shown in FIG. Then, as shown in FIG. 11, the pressing element 31 of the pusher 30 presses the lead 2a of the IC chip 2 against the connection terminal 43 of the socket 40,
The lead 2a of the IC chip 2 is connected to the connection terminal 4 of the socket 40.
3 is connected. At this time, the connection terminal 4 of the socket 40
The lower and socket 4 are biased upward by a spring.
The lead 2 a of the IC chip 2 comes into sliding contact with the connection terminal 43 of the socket 40 because it moves inward of the opening 42.

The downward movement of the pusher 30 is limited by the contact of the pusher 30 with the upper end of the stopper 22 of the insert 16. Therefore, the pusher 30 is pressed with an appropriate pressure that does not destroy the connection terminal 43 of the socket 40.
Can press the leads 2 a of the IC chip 2 against the connection terminals 43 of the socket 40.

In this embodiment, in the chamber 100 configured as described above, as shown in FIG. 7, a temperature control blowing device 90 is mounted inside a closed casing 80 forming a test chamber 102. is there. The temperature control blower 90 has a fan 92 and a heat exchange unit 94,
The air inside the casing is sucked by the fan 92 and discharged into the inside of the casing 80 through the heat exchanging section 94, whereby the inside of the casing 80 is set to a predetermined temperature condition (high or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchanging section 94 of the blower 90 for temperature control is constituted by a heat radiating heat exchanger or an electric heater through which a heating medium flows. It is possible to provide a sufficient amount of heat to maintain a high temperature of room temperature to about 160 ° C. When the inside of the casing is to be cooled, the heat exchanging section 94 is constituted by a heat absorbing heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates. A sufficient amount of heat can be absorbed to maintain a low temperature. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the fan 9 is controlled so that the internal temperature of the casing 80 is maintained at a predetermined temperature.
2 and the amount of heat of the heat exchange unit 94 are controlled.

Hot air or cold air generated through the heat exchange section 94 of the temperature control blower 90 flows along the Y-axis direction in the upper part of the casing 80, and descends along the casing side wall opposite to the apparatus 90, and It returns to the device 90 through the gap between the plate 60 and the test head 5 and circulates inside the casing.

Fourth, a portion related to the unloader section 400 will be described. 3 and 4 also has XY transfer devices 404, 404 having the same structure as the XY transfer device 304 provided in the loader unit 300.
The test tray T carried out to the unloader unit 400 by the XY transfer devices 404
From ST, the tested IC chips are transferred to the customer tray KST.

As shown in FIG. 3, a pair of windows 406 on which the customer tray KST conveyed to the unloader section 400 is arranged so as to face the upper surface of the apparatus board 105 is provided on the apparatus board 105 of the unloader section 400. There are 406 pairs.

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406. Here, the tested IC chips to be tested are reloaded. The customer tray KST which is full is placed on the tray and descends, and the full tray is transferred to the tray transfer arm 205.

Next, a rubbing member used in the IC test apparatus of the present embodiment will be described. IC of the present embodiment
The rubbing member 110 used in the test apparatus is, as shown in FIGS.
And a sandpaper 112 attached to the lower side of the base 111, and has a rectangular shape having notches 113 at four corners. The rubbing member 110 having such a structure can be manufactured at extremely low cost.

The thickness T ₁ of the rubbing member 110 is I
In C leads 2a of the chip 2 are set substantially equal to the thickness T ₂ of the portion sandwiched between the connecting terminal 43 of the pushing member 31 and the socket 40 of the pusher 30, and the width and length of the rubbing member 110 , And the width and length of the IC chip 2 (including the lead 2a).

The base 111 of the rubbing member 110 may be made of any material as long as it has sufficient rigidity to support the sandpaper 112 so as to exert the polishing function of the sandpaper 112. Examples of such a material include metals such as aluminum and stainless steel, plastics, glass, and ceramics.

Sandpaper 11 of rubbing member 110
As 2, an ordinary commercial product can be used, and the roughness of the rough surface is preferably about # 3000. If the roughness is too rough, the connection terminals of the socket may be damaged.On the other hand, if the roughness is too fine, the connection terminals of the socket having an oxide film formed by solder cannot be sufficiently cleaned. .

The notches 113 formed at the four corners of the rubbing member 110 are used to insert the IC when the rubbing member 110 is incorporated into the IC housing 19 of the insert 16.
The rubbing member 110 is fitted to the connecting portion 194 connecting the bottom plate 191 and the side wall portion 193 of the storage portion 19, and has a role of fixing the rubbing member 110 to the insert 16.

In order to clean the connection terminal 43 of the socket 40 using such a rubbing member 110, first, as shown in FIGS. 1 and 13, the rubbing member 110 is placed in the IC housing portion 19 of the insert 16. Incorporate. At this time, the rubbing member 110 is
Of the rubbing member 110 is exposed from the slit 192 of the IC accommodating portion 19, and the notch 113 of the rubbing member 110 is fitted to the connecting portion 194 of the IC accommodating portion 19. I do. The incorporation of the rubbing member 110 into the insert 16 may be performed in the same manner as when the IC chip 2 is automatically stored in the insert 16 using a suction head, or may be performed manually. When the rubbing member 110 is automatically incorporated into the insert 16, the rubbing member 110 may be stored in the customer tray KST similarly to the IC chip 2.

The insert 16 incorporating the rubbing member 110 as described above is mounted on the socket 40, and the Z-axis driving device 70 is driven in this state, and the driving shaft 78 and the driving plate 72 shown in FIG. The pressing portion 74 of the drive plate 72 comes into contact with the upper surface of the adapter 62 of the match plate 60 and the pusher 3
Press 0. Then, as shown in FIG. 14, since the pressing element 31 of the pusher 30 presses the rubbing member 110 against the connection terminal 43 of the socket 40, the rough surface of the sandpaper 112 of the rubbing member 110 comes into contact with the connection terminal 43 of the socket 40. I do.

At this time, the connection terminal 43 of the socket 40
As shown in FIG. 15, the rubbing member 110 moves downward and inside the opening 42 of the socket 40 while being spring-biased upward, so that the rough surface of the sandpaper 112 of the rubbing member 110 is connected to the connection terminal 43 of the socket 40. It comes into contact while sliding. FIG. 15A shows the rubbing member 110.
Is in contact with the connection terminal 43 of the socket 40,
FIG. 15B shows a state in which the rubbing member 110 is pressed against the connection terminal 43 of the socket 40.

Here, as shown in FIG.
When the pusher 30 moves the insert 16
It is limited by contacting the upper end of the wrapper 22. This push
The stroke of the shaft 30 is determined by the lead 2a of the IC chip 2.
Thickness T₂Rubbing member 1
10 thickness T₁Is the thickness T of the lead 2a of the IC chip 2. ₂
Is set to be almost the same as that of the IC chip 2
When the rubbing member 110 is incorporated into the insert 16
The pusher 30 is connected to the connection end of the socket 40.
Rubbing member with an appropriate pressure that does not destroy
Pressing 110 against connection terminal 43 of socket 40
Can be.

By driving the Z-axis driving device 70, the driving shaft 78
And by raising the drive plate 72,
The pressing of the pusher 30 is released, and the connection terminal 43 of the socket 40 can be returned to the original position as shown in FIG. Such pressing and releasing of the pusher 30 is repeated an appropriate number of times, and the rubbing member 110 and the connection terminal 43 of the socket 40 are slidably contacted an appropriate number of times, thereby oxidizing by the solder formed on the connection terminal 43 of the socket 40. The connection terminals 43 of the socket 40 can be cleaned by removing impurities such as films.

The number of repetitions of pressing and releasing of the pusher 30 may be appropriately changed depending on the roughness of the sandpaper 112 of the rubbing member 110 and the degree of impurities such as an oxide film formed on the connection terminal 43 of the socket 40. However, for example, the sandpaper 11 of the rubbing member 110
When about 3000 is used as 2, it is preferable to repeat pressing and releasing the pusher 30 about 5 times.

In the above description, the push of the pusher 30 is
The test was performed using the Z-axis driving device 70 of the IC testing device,
By pressing the pusher 30 manually, the connection terminal 43 of the socket 40 can be cleaned as described above. Such manual cleaning can be performed together with, for example, a case of performing a calibration for correcting a propagation delay time due to a variation in the length of a signal path between the connection terminals 43 in the socket 40.

[Second Embodiment] Next, a second embodiment of the present invention will be described. 16 is an exploded perspective view showing the structure near the socket in the test head of the IC test apparatus according to the second embodiment, FIG. 17 is a cross-sectional view near the socket shown in FIG. 16, and FIG. 18 shows the pusher lowered in FIG. FIG. 19 is a sectional view showing the state, FIG. 19 is a plan view and a side view showing a rubbing member used in the IC test apparatus, and FIG.
0 is an exploded perspective view for explaining how the rubbing member is incorporated into the insert, FIG. 21 is a cross-sectional view of the vicinity of the insert and the socket incorporating the rubbing member, and FIG.
1 is a sectional view showing a state in which the pusher is lowered, FIG.
FIGS. 3A and 3B are side views illustrating a state in which the connection terminal of the socket is cleaned.

In the above-described first embodiment, a QFP type IC chip was subjected to a test as an IC chip. In the second embodiment, a BGA type IC chip was used as an IC chip.
The C chip shall be subjected to the test. Therefore, in the second embodiment, the overall IC test apparatus described in the first embodiment can be used. However, the structure near the socket in the test head of the IC test apparatus, the pusher, Since the structure of the insert, socket guide, etc. will be different,
A second embodiment will be described. Regardless of the difference between the embodiments, members and the like represented by the same name in the drawings include:
The same number may be assigned.

As shown in FIGS. 17 to 19, the IC chip 2A to be tested in the present embodiment has external terminals 2 made of solder balls on the lower surface of a rectangular package body 2b.
A so-called BGA type IC provided with a plurality of c.
Chip.

As shown in FIGS. 16 to 18, an IC under test is provided at the center of the insert 16 for the IC chip 2A.
A rectangular IC housing 19 for housing the chip 2A is formed. The lower end of the IC housing portion 19 is opened so that the external terminals 2c of the IC chip 2A are exposed, and an IC holding portion 195 that holds the IC chip 2A is provided on the periphery of the opening.

On the other hand, as shown in FIG. 16, a socket board 50 is arranged on the test head 5, and a socket 40 having probe pins 44 as connection terminals is fixed thereon. The probe pins 44 are provided in a number and a pitch corresponding to the external terminals 2c of the IC chip 2A, and are urged upward by a spring (not shown).

As shown in FIGS. 16 to 18, the socket guide 41 is fixed on the socket board 50 so that the probe pins 44 provided on the socket 40 are exposed. On both sides of the socket guide 41, two guide pins 32 formed on the pusher 30 are inserted, and guide bushes 411 for positioning between the two guide pins 32 are provided.

As shown in FIGS. 16 to 18, a pusher 3 for pressing the package body 2b of the IC chip 2A under test against the socket 40 is provided at the center of the pusher 30.
1 is provided downward, and guide pins 32 inserted into the guide hole 20 of the insert 16 and the guide bush 411 of the socket guide 41 are provided at both ends of the pusher 30. When the pusher 30 is moved downward by the Z-axis driving device 70, the stopper surface 4 of the socket guide 41 is located between the presser 31 and the guide pin 32.
A stopper pin 34 is provided which can abut on the stopper 12 and define a lower limit.

In order to connect the external terminals 2c of the IC chip 2A to be tested to the probe pins 44 of the socket 40, as shown in FIG.
As shown in FIG. 7, the IC chip 2A is
The IC chip 2A is stored in the C storage section 19, and the outer periphery of the package body 2b of the IC chip 2A is held by the IC holding section 195, and the external terminals 2c of the IC chip 2A are exposed from the lower end opening of the IC storage section 19.

The insert 16 accommodating the IC chip 2A is mounted on the socket guide 41, and the Z-axis driving device is driven in this state, and the pusher 30 is pressed. Then, the pressing element 31 of the pusher 30 is
As shown in (2), the package body 2b of the IC chip 2A is pressed against the socket 40. As a result, the external terminals 2c of the IC chip 2A are connected to the probe pins 44 of the socket 40. At this time, the probe pins 44 of the socket 40
Is retracted into the socket 40 while being urged upward, but the tip of the probe pin 44 slightly penetrates the external terminal 2c.

The downward movement of the pusher 30 is limited by the stopper pin 34 of the pusher 30 abutting on the stopper surface 412 of the socket guide 41.
The pusher 30 can press the IC chip 2A against the socket 40 with an appropriate pressure that does not destroy the package body 2b of the IC chip 2A.

Here, the rubbing member used in the IC test apparatus of this embodiment will be described. I of the present embodiment
The rubbing member 120 used in the C test apparatus is shown in FIG.
As shown in the figure, the metal wool is formed into a rectangular plate shape.
A flange portion 121 that can be held by the flange 95 is formed. The rubbing member 120 having such a structure can be manufactured at extremely low cost.

[0098] The thickness _{T 3} of the rubbing member 120, I
The thickness and the length of the rubbing member 120 are set substantially equal to the thickness T ₄ of the C chip 2A (including the thickness of the external terminals 2c), and are set substantially equal to the width and length of the IC chip 2A. ing.

The metal wool constituting the rubbing member 120 can remove impurities such as an oxide film by solder formed on the tip of the probe pin 44 by piercing the tip of the probe pin 44 of the socket 40. What is necessary is just to select suitably. However, when all the cleaning of the probe pins 44 of the socket 40 are automatically performed by the electronic component test apparatus, the rubbing member 120 is picked up and placed by the suction head. In order to reduce the air permeability of the rubbing member 120, the rubbing member 12
It is necessary to increase the density of the metal wool constituting 0.

In order to clean the probe pins 44 of the socket 40 using such a rubbing member 120, first, as shown in FIGS. 20 and 21, the rubbing member 120 is placed in the IC housing 19 of the insert 16. Incorporate. At this time, the rubbing member 110 is held by the IC holding portion 195 at the flange portion 121, and the bottom surface of the rubbing member 110 is exposed from the lower end opening of the IC housing portion 19. The incorporation of the rubbing member 110 into the insert 16 may be performed in the same manner as when the IC chip 2A is automatically stored in the insert 16 using a suction head, or may be performed manually. When the rubbing member 120 is automatically incorporated into the insert 16, the rubbing member 120 may be stored in the customer tray KST as in the case of the IC chip 2A.

The insert 16 incorporating the rubbing member 120 as described above is mounted on the socket guide 41, and in this state, the Z-axis driving device is driven, and the pusher 30 is driven.
When is pressed, the pressing element 31 of the pusher 30 presses the rubbing member 120 against the probe pin 44 of the socket 40 as shown in FIG. Thereby, the socket 40
Although the probe pin 44 is retracted into the socket 40 while being urged upward by a spring, the tip of the probe pin 44 is slightly rubbed by the rubbing member 1 as shown in FIG.
Pierce 20. The probe pins 44 are polished with metal wool constituting the rubbing member 120 by piercing the rubbing member 120. In addition,
FIG. 23A shows a state in which the rubbing member 120 is in contact with the probe pin 44 of the socket 40, and FIG.
The probe pin 44 of the socket 40 is attached to the rubbing member 120.
Indicates a state of being pierced.

Here, the downward movement of the pusher 30 is limited by the stopper pin 34 of the pusher 30 abutting on the stopper surface 412 of the socket guide 41. The stroke of the pusher 30, since it has been set in accordance with the thickness _{T 4} of the IC chip 2A, the thickness _{T 3} of the rubbing member 120 is set substantially equal to the thickness _{T 4} of the IC chip 2A, IC chip Rubbing member 12 instead of 2A
Even when the rubbing member 120 is incorporated in the insert 16, the pusher 30 can press the rubbing member 120 against the probe pin 44 of the socket 40 with an appropriate pressure that does not destroy the rubbing member 120.

By driving the Z-axis driving device, the pressing of the pusher 30 is released, and the probe pin 44 of the socket 40 can be returned to the original position as shown in FIG. Such pressing and releasing of the pusher 30 is repeated an appropriate number of times, and the probe pin 44 of the socket 40 is pierced the rubbing member 120 an appropriate number of times, whereby impurities such as an oxide film by solder formed on the probe pin 44 of the socket 40 are formed. And the probe pins 44 of the socket 40 can be cleaned.

The number of repetitions of pressing and releasing of the pusher 30 may be appropriately changed depending on the polishing ability of the metal wool constituting the rubbing member 120 and the degree of impurities such as an oxide film formed on the probe pins 44 of the socket 40. .

In the above description, the push of the pusher 30 is
Although the test was performed using the Z-axis drive device of the IC test apparatus, the probe pins 44 of the socket 40 can be cleaned as described above by manually pressing the pusher 30. This manual work is particularly necessary for the rubbing member 1.
This is effective when 20 cannot be sucked by the suction head.

[Other Embodiments] The embodiments described above are described to facilitate understanding of the present invention, but are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the rubbing member 110 in the first embodiment may be made of a metal plate, a glass plate, a ceramic plate, or the like whose surface is roughened by sand blasting or the like, or particles are sprayed on the metal plate. Alternatively, it may be formed by vapor deposition. Further, the rubbing member 120 in the second embodiment may be formed by molding a knitted or woven metal thin wire.

Furthermore, the IC test apparatus is not limited to the chamber type described in the above embodiment,
For example, a chamberless type or a heat plate type may be used.

[0109]

As described above, according to the socket connection terminal cleaning kit, the socket connection terminal cleaning method or the electronic component test apparatus of the present invention, the socket connection terminal can be removed without damaging the socket connection terminal. It can be easily cleaned.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view illustrating a state in which a rubbing member used in an IC test apparatus according to a first embodiment of the present invention is incorporated into an insert.

FIG. 2 is an overall side view of the IC test apparatus.

FIG. 3 is a perspective view of the handler shown in FIG. 2;

FIG. 4 is a flowchart of a tray showing a method of handling an IC under test.

FIG. 5 is a perspective view showing a structure of an IC stocker of the IC test apparatus.

FIG. 6 is a perspective view showing a customer tray used in the IC test apparatus.

FIG. 7 is a sectional view of a main part in a test chamber of the IC test apparatus.

FIG. 8 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

FIG. 9 is an exploded perspective view showing a structure near a socket in a test head of the IC test apparatus.

FIG. 10 is a sectional view showing the vicinity of the socket shown in FIG. 9;

FIG. 11 is a sectional view showing a state where the pusher is lowered in FIG.

FIG. 12 is a plan view and a side view showing a rubbing member used in the IC test apparatus.

FIG. 13 is a sectional view showing the vicinity of an insert and a socket incorporating a rubbing member.

FIG. 14 is a sectional view showing a state where the pusher is lowered in FIG.

FIG. 15 is a side view illustrating a state where the connection terminal of the socket is cleaned. FIG. 15A shows a state in which the rubbing member is in contact with the connection terminal of the socket.
(b) shows a state where the rubbing member is pressed against the connection terminal of the socket.

FIG. 16 is an exploded perspective view showing a structure near a socket in a test head of an IC test apparatus according to a second embodiment of the present invention.

17 is a sectional view of the vicinity of the socket shown in FIG.

FIG. 18 is a sectional view showing a state where the pusher is lowered in FIG. 17;

FIG. 19 is a plan view and a side view showing a rubbing member used in the IC test apparatus.

FIG. 20 is an exploded perspective view illustrating how a rubbing member is incorporated into an insert.

FIG. 21 is a cross-sectional view of the vicinity of an insert and a socket incorporating a rubbing member.

FIG. 22 is a sectional view showing a state where the pusher is lowered in FIG. 21;

FIG. 23 is a side view illustrating a state where the connection terminal of the socket is cleaned. FIG. 23A shows a state in which the rubbing member is in contact with the probe pin of the socket.
FIG. 3 (b) shows a state in which the probe pin of the socket pierces the rubbing member.

[Explanation of symbols]

 2, 2A: IC chip (electronic component) 2a: lead (connection terminal) 2c: external terminal (connection terminal) 10: IC testing device (electronic component testing device) 16: insert 30: pusher 40: socket 41: socket guide 43 … Connection terminal 44… probe pin (connection terminal) 110, 120 rubbing member

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (reference) H01R 33/76 H01R 43/00 Z 43/00 G01R 31/28 J F term (reference) 2G003 AA07 AG01 AG08 AG11 AH04 AH05 AH07 2G011 AA15 AC06 AC13 AC14 AE02 AF02 2G032 AE04 AF05 AL00 AL03 5E024 CA02 CA07 CA18 CB01 5E051 GB10

Claims (8)

[Claims] 1. A socket provided with a connection terminal capable of sliding contact with a connection terminal of an electronic component and / or a guide mounted on said socket so as to be detachably attached to said socket so that the connection terminal of the electronic component to be tested is exposed. An insert for storing the electronic component; a pusher for pressing the connection terminal of the electronic component against the connection terminal of the socket with a prescribed stroke; and a housing for storing the electronic component in the insert instead of the electronic component. A rubbing member to be obtained, wherein at least a surface of the socket that contacts the connection terminal is rough, and a thickness of a portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is a pressing surface of the pusher. And the rubbing member having a thickness substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the connection terminals of the socket. Socket connection terminal cleaning kit characterized and. 2. The rubbing member has a thickness substantially equal to a thickness of a connection terminal of an electronic component sandwiched between a pressing surface of the pusher and a connection terminal of the socket, and at least one surface has a rough surface. 2. The socket connection terminal cleaning kit according to claim 1, wherein the width and the length of the rubbing member are set substantially equal to the width and the length of the electronic component. . 3. An insert which is detachably mounted on a socket provided with a probe-like connection terminal and / or a guide of said socket and houses said electronic component so as to expose the connection terminal of the electronic component to be tested. A pusher that presses the electronic component against the socket with a prescribed stroke, a rubbing member that is housed in the insert instead of the electronic component, and in which state the connection terminal of the socket can pierce, and at least the connection terminal of the socket A rubbing member having a thickness substantially equal to the thickness of the electronic component, the socket connection terminal cleaning kit comprising: 4. The rubbing member is a polishing fiber aggregate having a thickness substantially equal to the thickness of the electronic component, and the width and length of the rubbing member are substantially the same as the width and length of the electronic component. The socket connection terminal cleaning kit according to claim 3, wherein the kit is set. 5. The thickness of a portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is set substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. A rubbing member having a rough surface at least in contact with a connection terminal of the socket is housed in an insert instead of an electronic component, and the insert housing the rubbing member is inserted into the socket and / or the socket. The pusher is detachably mounted on the guide of the socket, and the pusher is moved once or more than once with a prescribed stroke to the connection terminal side of the socket by using a pusher driving device installed in the electronic component testing device or manually. And pressing the rubbing member into sliding contact with the connection terminal of the socket. 6. The electronic component has a thickness substantially equal to the thickness of the electronic component,
A rubbing member in which at least a portion of the socket into which the probe-like connection terminal pierces is an abrasive fiber assembly is housed in an insert instead of an electronic component, and the insert housing the rubbing member is inserted into the socket and / or the socket. The pusher is detachably mounted on the guide of the socket, and the pusher is moved once or more than once with a prescribed stroke to the connection terminal side of the socket by using a pusher driving device installed in the electronic component testing device or manually. A method for cleaning a socket connection terminal, comprising pressing and piercing the connection terminal of the socket into the rubbing member. 7. A socket provided with a connection terminal capable of slidingly contacting a connection terminal of an electronic component, and detachably mounted on the socket and / or a guide of the socket, exposing the connection terminal of the electronic component to be tested. An insert for accommodating the electronic component, a pusher for pressing the connection terminal of the electronic component to the connection terminal of the socket with a prescribed stroke, a pusher driving device for driving the pusher, and the insert instead of the electronic component. A rubbing member that is stored and can contact the connection terminal of the socket in that state, the surface of the rubbing member that contacts the connection terminal of the socket is rough, and the pressing surface of the pusher and the connection terminal of the socket are The thickness of the portion sandwiched between the connecting terminals of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket Electronic device test apparatus is characterized in that a said rubbing member is set substantially equal. 8. A socket having a probe-like connection terminal, and an electronic component which is detachably mounted on the socket and / or a guide of the socket so that the connection terminal of the electronic component to be tested is exposed. An insert to be stored; a pusher for pressing the electronic component against the socket with a prescribed stroke; a pusher driving device for driving the pusher; and a housing inserted in the insert instead of the electronic component. A rubbing member to be obtained, wherein at least a portion pierced by the connection terminal of the socket is an abrasive fiber aggregate, and the rubbing member has a thickness substantially equal to a thickness of an electronic component. Electronic component testing equipment.