TWI224198B - Pusher and electronic part-testing apparatus with the same - Google Patents

Abstract

The purpose of the present invention is that even if the deposit such as particles is adhered to the pressed surface thereof, there is no concentrated load applied to the portion of the electronic part having deposit adhered thereto. Thus, the external terminal of an electronic part can be connected to the connection terminal of a socket, and the electronic part can be tested without a damage such as cracking and chipping to the electronic part. A sharp-pointed projected parts (312) are provided on the pusher block (31) opposed to the pressed surface (211) of the body part (21) of an IC chip (2).

Description

1224198 V. Description of the invention (l) [Technical field of the invention] The present invention is a pusher for pushing an electronic component of a device on a socket and an electronic device having the pusher in the test of an electronic component such as an IC chip. Component testing device. [Conventional Technology] In the manufacturing process of a semiconductor device or the like, an electronic component testing device 'is required to test the performance or function of the IC chip finally manufactured. It is conventional to design c-chips and other devices under various temperature conditions such as normal temperature, low temperature, and high temperature.

An IC test device for testing the performance or function of a device is an example of such an electronic component test device. Take, for example, the following test bench and electronic examples that have been 1C inserted from the main test bench to the test bench and the electronic example. After the test, the characteristics of the wires of the IC device under test and the IC device of the test device were transmitted. Using this type of IC test shock, the IC device being tested will be touched by the external terminal being pushed. The stage, the lead and the main test lead are supplied to the top, and the IC device under test is sent to the IC device set in the main test device for testing. The partial voltage sent to the assembled IC socket makes the connection of the IC socket to the test IC. The equipment ϋ test device constitutes the path. The response signal read out by the test signal of the famous test bench was not applied to the IC device under test by 'using this method to determine the test IC setting order test. 〇 When using the IC equipment of the IC device of the 1 C test device, the pressing surface with the pressing block and the pressure surface of the IC component under test will contact the pressing force 1224198 in the direction of the connection terminal of the 1C socket. Explanation (2) [Means to solve the problem] In the case where silicon chips and other debris are attached to the pressure surface of the IC device under test, the pressure surface of the pressure block and the impact of the c component under test After contacting the pressure surface and applying a pushing force to the 1C device under test, a concentrated load will be generated at the place where the debris is attached, and there may be a risk that the test 1 (: device breaks down or = ^ 1 hurts. Especially When the device under test 1 (: is a die mounted on a substrate and made of resin and encapsulated, there will be damage to the die itself. The object of the present invention is to provide a pusher and an electronic component chip: In the middle of the press, silicon chips and other debris are attached to the pressing surface of the pressing block 2 Medium: It will not cause the IC device under test to break or damage isostatic pressure ^ Can test 1C equipment to push the IC socket to the direction of the connection terminal of the socket i1)) Electrical lecture on the resolution Sub-item component 3 is opposite to the pressure-receiving surface of the aforementioned electronic component: the above-mentioned plug = connecting terminal direction, the aforementioned electric = part; in the pushing part of the present invention, Shitian "meaning is other than the external terminal of the electronic component ： ：：：： The body part of the said "* electronic component is an example of IC J, which is a bare chip packaged on a substrate; ::: the body part of the top element". In addition, "元η white belongs to "the surface of the electronic and electronic components that bears _ push =, the pressure surface" meaning is to take the surface of the pushing force of the fine push zone parts 52192-4582.PF (N); ahddub.ptd 1 ^ 24198 Description of the invention (3) For example, in the case of the electronic component being a ⑽a-type 1C chip, the direction opposite to the surface provided with: = face device type area array 2 has 1 卩 ° 卩The solder pin or end is in the pushing member of the present invention, and the pressure-receiving surface of the < " " The protrusion on the surface of the electronic component w々 the sun pushes the body part of the juice piece, even in the case of thunder; -1 When the electronic element such as a piece of electron placed on the socket is π φ ί The silicon is attached to the pressure surface of the piece Mass fragmentation rate. In addition, the attachment on the machine surface where # 偭 执 少 格 广 逆 工 inverse bang film contacts I 砰 ii is in contact with the pressurized attachment of the electronic component at the protrusion of the pusher, because The surface of the electronic component that is opposite to the pressure-receiving surface pushes the above I: 附着 The above-mentioned attachment that has been bounced will move toward the it gap. This can prevent the above-mentioned attachment from being pressed by the protruding portion of the cow and the electronic component. State between surfaces =: In the pressing part, even if it is attached to the pressured surface of the electronic component; ^ = Taxi = in the case, it can prevent the part where the debris is attached; In the case of heavy concentration, you can The testing IC equipment exerts a pushing force in the direction of the Ic socket, and it will not cause damage to the tested C equipment. Wang hard W or broken in the pusher of the present invention, although the material of the protrusions provided on the side opposite to the pressure receiving surface of the electric power is not limited, but ^ spare materials (such as rubber, plastic Etc.) is better. For example, if the protrusion is made of a high-quality material, even if silicon fragments are attached to the electronic component ^ ^ ^, when the protrusion is in contact with the attachment, the protrusion will deform from f, and Reducing the pressing force applied to the above-mentioned attachments, so the order can prevent the description of the invention (4) _ When the protrusions contact the above-mentioned attachments, electrical damage or the like. When 70 pieces are broken or damaged, the pressing parts of the present invention can be used to determine the electronic components that can push the electronic components of the body part. There are no special restrictions. 'Suitable for use on BGA, LGA and other surfaces #but the present invention The pushing wafer 'of which kw / other surface of fKSP type is suitable ^. 1C of area type array type In the pusher of the present invention, the protrusions on the surface opposite to the pressure-receiving surface are limited to be provided in the form described later. The shape, number, position, etc. of 11, but (2) the pushing member of the present invention is shaped. In the afternoon, the aforementioned protrusions are preferably sharp. In the pusher of this form, the wide and the protrusions are sharp, even if they are pressed: to press the attachments on the surface of the body of the electronic component, one of them The above-mentioned product of the dog lifting portion in contact with the protruding portion of the pressure member of the electronic component is small. Because of &, local force will be applied to the protrusions that will be pushed by the pusher ^, the above-mentioned attachment clamped on the protrusion of the pusher: * effectively prevents the above-mentioned attachment from being under .L y ° 卩 The state between 卩 and the pressure surface of the electronic component. It can only be pointed, and the shape of the protrusion ^ ^ is not particularly limited to a shape, a needle shape, and the like. Another Π; for example, it can be conical, pyramidal end ... push the side; in the state "" ... means the shape facing forward, the front end is L: thinner = 前端 the front end is sharp, flat The shape is also included.

V. Description of the invention (5) The aforementioned protrusion in the pressing part of the present hair: month is preferably provided at a position corresponding to the external terminal of the 7L electronic unit. /. In this form of pushing piece, when connecting the Lebe to the connection terminal of the socket, you can apply the required pressing electrons to the protrusions at the corresponding points of the external terminals i: Γ: the outside of the piece The connection between the terminal and the connection terminal of the socket. In the pressing part of the shape, it is not necessary to set all the protrusions on the adjacent ports corresponding to the external terminals of the electronic component and the number of J rm portions of the external terminals of the electronic component. All electronic component parts "]: It is better to pre-elastically push the electronic component in the direction of pressing of the electronic parts, and to quote the elastic parts that have a percentage of elasticity on the door in advance. In the case where you & A size error may occur at the large starting portion of I. At each projection, jθ will cause each projection to be applied to the electronic component: ^ After the difference, it is possible to pre-stretch the elastic component of the subcomponent in the pushing direction. 2; Absorb the wrong size of each protrusion # ^ ^^ Refining this elastic part can

The pressing force exerted by the pressing surface of the π member on the stroke of the electronic part and the load of each protrusion can be considered as the pressing force on the pressure surface of each protruding wafer. The major scoops of the spoon are applied to 1C (red) i 5) The electronic component testing device provided by the present invention, J: outside-% includes the pushing part of the present invention. Straight eight is characterized by

1224198 V. Description of the invention (6) In the electronic component test of the present invention ^^ In the case where silicon fragments are attached to the pressure surface, even in the case where a load is generated on the portion where the fragments are attached to the electronic component, it can be prevented If the component is damaged or damaged, it will not cause the pressing force in the direction of the connection terminal of the electronic base. J will apply the connection terminal of the electronic component to the socket of the IC socket to perform the connection. Testing of child components. ^ [Inventive Example] The present inventor's first figure based on the drawings is a detailed description of an electronic & example of the present invention. The overall side view I of the ic test device is a perspective view of the control part of one embodiment of the installation i, Fig. 3, which shows the flow chart of the tray of the same IC test skirt, and Fig. 4 shows the same operation method. A perspective view of the structure, FIG. 5 is a perspective view showing the same IC measurement ^ ^ IC storage section-general tray's perspective view 'FIG. 6 is Table II: Columns:: Cross-section view of the main part of the compartment used in the seventh test device Partially exploded perspective view of the test tray '8 ":: The test bench near the socket in the second test device is different from the table-IC test is installed in the exploded three-dimensional structure near the T-Boya test-press device An exploded perspective view of the piece. Figure 9 shows the m-synchronous shape near the socket in the IC test test; Figure 12 shows the table === Figure. I ic is attached to the tablet. The cross section with the attached state is also shown in FIG. 3, which is used to describe the I c test device in this embodiment.

1224198 V. Description of the invention (7) The drawing part of the moving method is to show the parts arranged in the up and down direction in a flat way. The construction will be described with reference to FIG. 2. First, the overall structure of the IC test device of this embodiment will be described. As shown in FIG. 1, the 1C test device 10 of this embodiment, the Λ chip (an example of an electronic component) above the package 15 is transferred to the socket of the connection portion 9 provided above the test stand 5, and then the completed IC The wafers are sorted and stored in a predetermined tray according to the test results. The insertion of component 9 constitutes a path through test bench 5 and lead 7 and main test device 6, and can be detached to the socket 1 (: chip, lead 7 and main test device 6 to form a path. Since the main: = Set = Two 1C chips on the socket are applied with the inspection electrons: sheet: the response signal is sent via the wire 7 to the main set 1c: =

The performance or function of the wafer is tested. The main part of the 1C control unit 1 below is the main internal device. The other part is the space part 1. The control part 1 is set in the space part 8. The IC chip H is freely exchangeable. The through-hole assembly is separated from the κ test device 10 provided on the control portion 1 and connected to the connection portion 9. In the case of temperature), the tested electronic components: 7 = = brewed) or low (low control unit 1 as shown in Fig. 2 and Fig. 3 a), the device for grabbing and removing the heat tank 103 The composition of the clamp mQQ temperature bath 101, measurement, the connection part 9 above the test bench 5 will be shown in Fig. 1

1224198 V. Description of the invention (8) Internally, a 1C chip test is performed therein. As shown in FIG. 2 and FIG. 3, the control unit ι in the IC test device 10 includes an ic chip to be tested immediately after storage, and a 1C storage unit 200 for classifying and storing the test wafers. 2. Send 2 1C wafers from the IC storage section 2000 to the loading section 300 of the cabin section 00, the section 100 including the test stand 5 and the IC chips after the test that will complete the test in the cabin section 00 The unloading section 400 is taken out after being classified. The IC chip is stored in a control tray 1 and transferred to a test tray. The IC chips before being stored in the control unit i are stored in the general tray KST in many ways as shown in FIG. 5. In this state, the IC chips that are not supplied to the control unit i according to FIG. 1 (: storage section 200, and then, ic said / since

Generally, the tray K S T is sent to the test tray TSU meat | 隹 ー 隹, 宏 —, macro… call… the test tray TST (refer to Figure 7). Within the control rules, the load-bearing state moves as shown in Figure 3, and it is subjected to high or low temperature; test (inspection) after appropriate action is performed in detail. The “inside” is the first, and the parts related to the 1C storage unit 200 will be described.

In the 22nd of the film, there is an IC storage section 202 for the IC after the test, which stores the IC 1C daily and daily films before the test. Received = storage section 201 and tested ㈣ 20, which has a frame-shaped tray support 柩 currency 203 can be lifted from the bottom, and the tray support frame 插入 lifter 204 is inserted. On the pallet support frame country 2192-4582-PF (N); ahddub.ptd, page 11 丄 丄 705, description of the invention (9) 2 0 3 'supported Futian 204 to move up and down this crystal = from the general It can be borrowed by the lifter t ^, the general tray KST from two dollars. The test sintered crystals are shown on the storage portion 201 before / test 1c, and are held after storage. In addition, i 2 ί: τΐ tray KST, to protect the IC chip in a stacked manner, c storage section 2 02, store the tested === ST, to maintain a rough outline The same structure mouth: 2: 201: Ic storage section 202 after testing has 1C health storage section 202; :: IC storage section 201 before testing is used to change after testing. . Therefore, it can be matched according to needs, as simple as Fig. 2 and Fig. ^ Γ-01 and // tIC storage section 2002. The STK-B unit is a typical product. In this embodiment, two storage units STK-E are provided. ΓΛ side Λ load Λ & test δ results are divided into eight and eight #good and bad, except for good. That is, in addition to those who are quick or bad to distinguish among the defective products, there is still a need for retesting. Second, the parts related to the loading section 300 will be described. As shown in FIG. 4, the tray support frame 203 is stored in the storage unit 201 before the test. The straight tray KST ′ is provided between the IC storage unit 200 and the device substrate 105 as shown in FIG. 2. The pallet moving arm 205 is transported below the device substrate 105 toward the window portion of the loading portion 300. Then, in the loading section 300, the IC chip under test deposited on the general tray KST is transferred by the χ_γ transfer device.

1224198 V. Description of the invention (10) 3: Second operation Λ temporary corrector 305 'Here again, the relative 1C chip stack of the 1c wafer being tested is used. The second tester will be sent to the corrector 305 under the test曰 月 片 隹 在 #Ends in the test tray TST of the loading section 300.

Handle H = C wafers from the general tray KST stack to the test tray TST XY, as shown in Figure 2, including: set up on the device substrate test tray m η -3G1, through these two ways-general tray touch st And test 1; the movable arm 302 that moves privately (the direction is the γ direction), the movable arm 302 is supported, and the movable head that moves along the movable arm in the χ direction is used to move the movable 4 of the X-Υ On the head 3 () 3, the device has a downward suction head, which sucks air at the same time as KST.,] IC,,, ,,,,, ^ ^ For the movable head 303, there can be eight With this type of suction head, eight IC chips under test are stacked on a test tray at a time. The second 'explains the part related to the cabin 100. The test tray TST of the wafer under test 1c was robbed by the loading unit 300, and each test was performed! "The wafers were tested in the same manner as the test trays. As shown in Figures 2 and 3, the surplus The 100 includes: constant = test carried by the test tray m to apply the target's high temperature or thorium stress, test the capsule 丨 02, where 1C, 敎 庳, and the force state are measured by the thermostatic bath 101. The wafer is set on the test bench 5, and the demon tank 10 is removed; = the resistive wafer previously applied to the test grab 102 to complete the test is thermally stressed

2192-4582.PF (N); ahddub.ptd 1224198 V. Description of the invention (11) When a high temperature is applied to the thermostatic bath 101, in the heat removal tank 丨 03, the IC chip to be tested is sent by air. After cooling to bring it back to room temperature, and when a low temperature is applied to the thermostatic bath, in the heat removal tank 103, the test lc wafer is heated by means of a heater or the like to rise to a temperature not to cause condensation. Then, the 1C chip under test whose heat has been removed is transferred to the carrier 400. As shown in Fig. 2, the constant temperature tank 丨 00 of the cabin 丨 00 and the heat removal tank 103 are arranged in such a manner as to protrude above the test capsule 〇02. In addition, as shown in Fig. 3, a vertical transfer device is provided in the thermostatic bath 101 until the test chamber 102 is emptied, and a plurality of test trays TST are thereby transferred vertically.

Support and stand by. The IC chip under test is mainly subjected to high or low temperature thermal stress during this standby time. As shown in FIG. 6, on the test capsule 102, a test chamber is provided below the center, and the reduced tray TST is transported above the test bench 5. Here, all the wafers 2 and c that are not held by the test tray TST are sequentially connected to the test 2 =, and + to form a path, and all the 1 (: wafer 2 in the test tray TST are also sequentially • two ^! In addition The test tray TST of the Wucheng test is 2 mi / ... in the heat removal tank 1 〇3, and after the temperature of the IC chip 2 returns to room temperature, it is discharged from the unloading part 400 in FIGS. 2 and 3. As shown in FIG. 2, I and Y are formed at the upper opening Qiu Dao of the constant temperature tank 101 and the heat removal tank 〇03, and an entrance β / where the test tray TST is fed from the device substrate 105 is formed. The exit openings sent to the device substrate 105 are moved into the shovel. The soil plate 105 is equipped with the test tray TS from the openings and the right side of the test tray transfer device 108. These transfer devices 108 are lifted:子 等。 By measuring on the device substrate 105

1224198 V. Description of the invention (12) The test tray handling device 108, the test tray TST discharged from the heat removal tank 103 is returned to the thermostatic tank 101 through the unloading section 400 and the loading section 300. Fig. 7 is a partial perspective view showing the structure of a test tray used in this embodiment. The test tray TST has a rectangular frame 12, and the frame 12 is provided with a plurality of rods 13 arranged at equal intervals in parallel. A plurality of combination pieces 14 are provided on both sides of the rods 13 and on the inner side of the sides 1 2 a of the frame 12 parallel to the rods 13 at equal intervals in the length direction. A plurality of combination pieces 14 are provided between the rods 13 and between the rods 13 and the edges 1 2 a, and the opposite two combination pieces 14 constitute the insertion piece storage portions 15.

In each of the insertion piece storage portions 15, one insertion piece 丨 6 is respectively stored, and the insertion pieces 16 are assembled in an overhead manner on the two combination pieces 丨 4 by the fasteners 17. In this way, the insert sheet 16 and, for example, 16 × 4 are combined on the test tray T S T. The test wafer IC 2 is stored by the insert wafer 16 and the test wafer IC 2 is stacked on the test tray TS. In addition, in the present embodiment, the test object I [wafer 2, as shown in FIG. 10 to FIG. 13, the rectangular body portion below the solder pin external terminals 22 arranged in a matrix, also known as BGA IC chip. On the insert sheet 16 of this embodiment, as shown in FIG. 8 and FIG. 10, a rectangular 1C storage portion 19 that houses the 1C wafer 2 to be tested is formed. An opening for exposing the external terminals of the IC chip 2 is provided at the bottom of the 1 (: accommodating part 19), and a 1C holding part 195 for holding the 1C chip 2 is provided at a peripheral portion of the opening. The center of both sides of the insertion sheet 16 On the part, a guide hole 20 is formed for the guide pin 32 of the gasket seat 34 and the guide gasket 41 j of the socket guide 41 to be inserted from top to bottom, respectively, at the corners on both sides of the insert piece 16, Forming and testing trays TST

1224198 V. Description of the invention (13) Combination hole 14 1 combined with combination piece 1 4. As shown in Fig. 10 and Fig. 1, the guide hole 20 is a hole for position determination. For example, in the case where the guide hole 20 on the left side of the figure is used as the position = fixed hole and the inner diameter is smaller than the guide hole 20 on the right side, the guide 2 is used. In the upper part, the insertion position of the guide pin 32 of the upper pad seat 34 is as follows: The position where the guide pad 411 of the lower socket guide 41 is inserted is determined accordingly. In addition, the guide hole 20 on the right side in the figure is loosely fitted between the guide pin 32 of the upper pad seat 34 and the guide pad 41 J of the socket guide 41. σ As shown in FIG. 8, a socket board 50 is provided on the test stand 5. Although the socket board 50 corresponds to the test tray TST shown in FIG. 7 as an example, there are three in the row direction and a total of four columns of 1 (: the number of wafers 2 (4 rows and columns), but each socket can be reduced. The size of the board 50 can test all the IC chips 2 held by the test tray TST shown in FIG. 7 at the same time, and the socket board $ 0 is arranged in a manner of 4 rows X 1 6 columns on the test 5. As shown in FIG. 8 As shown in the figure, the socket board 50 is provided with an IC socket 40. As shown in FIGS. 10 and 11, the IC socket 40 is provided so that the probe pin 44 (an example of a connection terminal of the socket for testing electronic components) can be used. The socket guide 4 1 is fixed in an exposed manner. The probe pins 4 4 of the socket 40 are provided in accordance with the number and position of the external terminals of the IC chip 2, and have an upward elastic force by a spring located outside the figure. On both sides of the socket guide 41, two guide pins 3 2 ′ forming a spacer seat 3 4 are inserted, and a guide spacer 411 for determining the position is provided between the two guide pins 32. It is assumed that as shown in FIG. 9, the pressing member 30 is corresponding to the number of the socket 40. Page 16 2192-4582-PF (N); ahddub. ptd 1224198

Above the test bench 5. As shown in FIG. 6, each pressing member 30 is held elastic by the combination plate ⑼. The combination board 60 is positioned above the test stand 5 so that the test tray TST can be inserted between each of the pressing members 30 and the socket 40. The pressing member 30 holding the combination plate 60 can move freely in the z-axis direction with respect to the driving plate (driving member) 72 of the test stand 5 or the Z-axis driving device 70. In addition, the test tray TST can be transported between the pusher 30 and the socket 40 from the direction (X-axis) perpendicular to the paper surface in the sixth figure. A transporting roller or the like can be used as a transporting device for the test tray TST in the pod 100. When the test tray TST is transported, the drive plate of the Z-axis drive device 70 is raised in the z-axis direction, and a sufficient gap is formed between the pusher 30 and the socket 40 for the test tray TST to be inserted. As shown in FIG. 6, on the bottom surface of the driving plate 72 provided in the test capsule 2, a pressing portion 74 corresponding to the number of pressing members 30 is fixed, and can be pressed by the combination plate 60. Hold the top surface of the pressing member 30 (the top surface of the lead pressing table ^). A driving shaft 78 is fixed to the driving board 72, and the driving shaft 78 is connected to a driving source (not shown in the figure) such as a motor. The driving shaft 78 moves up and down along the z-axis to push the pressing member 30. . In addition, the 'combination board 60 has a structure that can be exchanged freely according to the shape of the IC chip 2 to be tested or the number of sockets of the test stand 5 (the number of IC chips 2 to be tested at the same time). Because these combination boards 60 are freely interchangeable, they allow the Z-axis drive to be used in different applications. In this embodiment, although the pressing part 74 and the pressing part 3 are in a one-to-one correspondence manner, for example, when the number of sockets on the test bench is changed to half, the combination board 6 is exchanged. 0 can make the pressing portion 74 and the pressing member 3 0 two-to-one

1224198

Corresponding. The pressing member 3 in the figure includes: a lead pressing table 35, a pressing table 34, and a pressing block 31 on the two f pressing table 34, which are combined to move up and down in the Z-axis direction of the Z-axis driving device. And the spring 36 (an example of an elastic part) that pushes and pushes between the cymbals. As shown in Figure g, between 35 and the guide pushing $ 3 5 and the pushing table 3 and 4 are fixed with bolts 2. On both sides of the pressing table 34, there are inserting pieces 16 plus 22 sockets. Guide pin of guide pad 411. In addition, in the bow 丨 push holes ^ to 4, 6 again when the corresponding push table 34 descends.

ϋΐίί: piece 33, the stop guide 33 is in contact with the taxi moving surface 42 of the socket guide 40, and the basic size of the lower limit position of the pressing member 30 is determined; ϊ ΐ 件 3 (3 可Thereby, the pressing operation is performed without damaging the proper pressure of the 1C chip on the socket 40. As shown in FIG. 9, the pressing block 31 is inserted into the through LLt provided in the center of the pressing table 34, and the pressing is performed. Between the block 31 and the guide and pushing table 35, there is a spring 2 "and also a shimming sheet 37. The spring 36 is the direction in which the pushing block 31 pushes the main and placed lc chips (the tenth The pre-stressed compression spring 'on the figure and 11th' has an elastic coefficient corresponding to the reference load of the IC chip.

In addition, the interstitial sheet 37 is used to adjust the reference length of the device state of the elastic spring 36 to adjust the initial load acting on the pressing table. That is, even in the case of using the spring 36 having the same elastic coefficient, the shim 37 can increase the initial load acting on the pressing block 31. In the other figure, although the interstitial sheet 37 is mounted on the spring 36 and the push block "

1224198 V. Description of the invention (16) ---- ^ — It is possible to adjust the reference length of the elastic yellow 36, for example, it can also be installed between the guide pusher 35 and the spring 36. In the case where the spring 36 is used as the elastic part of the present invention, a plurality of types of springs having different elastic coefficients may be used, and an appropriate one may be used in accordance with the reference load corresponding to the IC chip under test. Alternatively, the pressing block 31 may have a structure in which a plurality of springs are arranged in parallel, and the number of devices may be selected in accordance with the reference load corresponding to the IC chip under test. As shown in FIG. 10, on the pressing block 31, a rectangular surface 3 11 opposite to the pressure-receiving surface 211 (a surface opposite to the surface on which the external terminal 22 is provided) of the body portion 21 of the IC chip 2 is provided. There are conical protrusions 3 丨 2. The protrusions 3 1 2 are provided in accordance with the numbers and positions corresponding to the external terminals 2 2 of the IC chip 2. Since the protrusions 312 are provided in accordance with the number and positions corresponding to the external terminals 22 of the wafer 2 (2: the external terminals 22 of the 1C wafer and the probe pins 44 of the socket 40 can be applied to each external terminal 22). Pushing force required for connection. The material of the protrusion 312 is a flexible material (such as rubber, plastic, etc.). 'To enable the external terminal 2 2 of the IC chip under test to be connected to the probe pin 4 4 of the socket 4 〇 'As shown in FIG. 10, the IC chip 2 is housed in the IC storage section 19 of the insert 16, and the bottom surface (the surface on which the external terminal 22 is provided) of the body section 21 of the IC chip 2 is surrounded. It is held by the 1C holding portion 195, and at the same time, the external terminal 2 2 of the chip 2 is exposed from the opening at the lower end of the IC storage portion 19. In this way, the insertion piece 16 that stores the IC chip is mounted on the socket guide 41 ' The IC chip 2 is mounted on the socket 40. In this mounting state, the z-axis driving device is driven to 'press the pressing member 30. Then, the pressing block 31 of the pressing member 30 will be pressed.

2192-4582-PF (N); ahddub.ptd

1224198 5 = As shown in FIG. N, the body portion 21 of the IC chip is pressed against the socket 40. As a result, the external terminal 22 of the 1C chip 2 is connected to the probe pin 44 of the socket 40. At this time, the probe pin 44 of the socket 40 is retracted into the socket 40 because of the preset upward elastic force, but the front end of the probe pin 44 abuts against the external terminal 22.

After the body portion 21 of the IC chip 2 is pressed by the pressing block 31, as shown in FIG. 12 (c), the pressure-receiving surface 211 and the pressure-receiving surface 211 of the body portion 21 of the ic chip 2 are opposite to each other. Between the surfaces 31m of the pressing block 31, a gap r is formed by being caught by the protruding portion 312. Then, as shown in FIG. 12 (&), in the case where there are attachments s such as silicon fragments on the pressure-receiving surface 211 of the body of the 1C chip inserted with the f 40, when the IC chip is pushed by the pressing member, 30. After the pressing, as shown in FIG. 12 (b), the attachment 8 comes into contact with the protrusion M2 provided on the pressing block 31. Because the protruding portion 312 is pointed, the protruding portion 312 is in point contact with the attachment (or a surface contact with a smaller contact area), which exerts local force on the attachment. Then, the adhering matter in contact with the protruding portion 312 is ejected, and moves to the gap portion s as shown in FIG. 12 (c). This can prevent the part with attachment s from being subjected to a concentrated load, and can apply a pushing force to the test chip 2 in the direction of the probe pin 44 of the socket 40 without breaking or breaking the sheet 2. damage. Yue

^ In addition, because of the location of the attachment, the attachment S will not occur.卩 3 1 2 contact, in this case, because the attachment $ is located in the gap R, the wafer 2 will not be damaged by the attachment s, such as cracking or damage. Because the material of the protruding portion 312 is an elastic material, when the protruding portion 312 contacts the attachment s, the protruding portion 312 will deform itself to reduce the impact on

1224198 V. Description of the invention (18) = Pushing force applied by the object s' Therefore, the protrusions 312 are in contact with the attached object 8 and can prevent damage such as cracking or destruction of the 1C wafer 2. Even in the case where the projections 312 provided on the pressing block 31 of the pressing member 30 are different in size from each other, each of the projections M has a preset elastic force in the pressing direction of the wafer 2, The percentage of the time when the ICaB sheet is pressed is absorbed by the spring 36, and the size between the protrusions 312 is mistakenly exerted by the protrusions 312 on the pressing surface 211 of the IC chip. That is, 'by simultaneously managing the load of each protrusion 312, the pressing force exerted by each protrusion 312 on the pressing surface 211 of the 1C wafer can be averaged. In the first embodiment, a clip having the same structure as described above is provided as shown in FIG. 6. If the inside of the sealed casing 80 constituting the test capsule 102 is provided with an if adjusting device 90. The 1-degree adjusting air supply device 90 includes a fan 92 and a portion 94 'that sucks out the air inside the casing through the fan 92, and then passes through the inside of the casing 8Q to keep the inside of the casing 80 at a pre-conditioned temperature condition ( High or low temperature). Ancient ,, = tone! In the case where the inside of the casing is equal to two, the heat exchanging part 94 of the air blowing device 90 has a heat exchanger for heat radiation or electricity that circulates a heating medium, and a heater. 0, ^ 〇,,, 2: The heat absorption that allows the refrigerant such as liquid nitrogen to circulate Λ Absorption keeps the interior of the shell at, for example, 0 "heat ° The internal temperature of the shell 80 can be ^ degrees m82 for example Check it out '

1224198

The predetermined temperature can control the air volume of the fan 92 and the heat exchange section 94. The hot wind H generated by the heat exchange section 94 of the over-temperature adjustment air supply device 90. The wind 'flows along the γ axis above the casing 80' and then follows The shell opposite to the device 90, you will be able to recognize it, and the soil will drop back to the device 90 through the gap between the combination board 60 and the test bench 5, and circulate inside the shell. Fourth, the parts related to the unloading section 40 will be described.

The unloading unit 400i shown in FIG. 2 and FIG. 3 is also provided with a χ_γ transporting device having the same structure as the X-γ transporting device 300 installed on the loading / mounting unit 300. In the device, the self-testing trays S and T wafers shipped from the unloading section 400 will be stacked on a moving tray g $ τ. As shown in FIG. 2, on the device substrate 105 of the unloading section 400, two pairs of pairs corresponding to the general tray KST carried to the corresponding unloading section 400, which are close to the top surface of the device base 105, are provided in pairs. Window portions 406 and 406. In addition, although omitted in the illustration, a lift table is provided on each side of the window section 406 where the general tray KST can be raised and lowered. The IC chips for the test IC that have been tested here are filled. Generally, the tray KST is lowered, and the stacked tray is moved to the tray transfer arm 205.

The embodiments described above are described in order to make the present invention easier to understand, and are not intended to limit the present invention. Therefore, all the elements mentioned in the above embodiments are all design changes and equivalents included in the technical scope of the present invention. For example, the shape of the protruding portion 312 provided on the pressing block 31 of the pressing member 30 can be on a surface that is in point contact with the attachment or has a relatively large contact area.

1224198 Description of the invention (20) Change within the range of contact-'For example, the shape of a pyramid, needle, and other circular shapes, for example, the shape of the protrusion 312 may be pointed other than the shape of the button 3 1 2. As shown in FIG. 13, in the pressured surface of the body portion 21 and the obstacle condition of the fish, because the gap R formed between the IC chip 2 is large, the & ^ ★ surface 2 1 1 is opposite, When the surface 3 1 1 of the pressing block 3 1 is pressed, the attachment S is easily moved to the f J portion 312 f. When the shape of the attachment S is in a needle shape, f is combined. In addition, the probability at the protruding portion 312 (that is, the adhesion: since: large 12 is in contact with the attachment S) is increased. Probability that the object exists in the gap R. In addition, the IC test device is not limited to the cabin type. For example, it can also be a non-capping type and a clamping hot plate type described in force ::. [Possibility of industrial use] The pieces of silicon chip and the like ^, 丄 17 attached to the pressing surface of the pressing piece and the electronic component test of the present invention are applied to the direction of the connecting terminal of the pressing block component to the socket 4 2, which can cause damage to the electronic components under test, such as cracks or damage,

2192-4582-PF (N); ahddub.ptd Page 23 1224198 Brief Description of Drawings Figure 1 shows the entire side view of the 1C testing device of the electronic device of the present invention. Table setting-Example = 2 shows the flow chart of the tray in the same IC test device where the control unit shows the moving method of the IC under test. Fig. 4 is a graph showing the kappa storage in the same IC test device. Biting Li Zhao Figure 5 is a perspective view showing the same IC test device. Figure 6 of a general tray is a cross-sectional view showing the same j c test. The main part of the test margin in the center. Figure 7 is a three-dimensional view showing the same IC test # # +. Partial disassembly of the test tray in the u device. Figure 8 is an exploded perspective view showing the same I c test build. 、 // 1 / / To the structure near the socket Figure 9 shows the same I c measured ancient style. "The exploded three-dimensional view of the pressing part in the device 2 shows the same Ic test split socket with the 12th ~ ~ ⑷ The figure is a cross-sectional view showing the pressing / / ^. Wafer = 2 cross-sectional view of the state of attachment, IC It is the 表示 of the protruding part of the pressing member. [Symbol Description]

2192-4582-PF (N); ahddub.ptd Page 24 1224198 Schematic description of 10 ~ IC test device; 12 ~ frame; 13 ~ rod; 15 ~ insert piece storage; 17 ~ fastener; 1 9 5 ~ IC holding section; 1 0 1 ~ constant temperature tank; 103 ~ 3 heat removal tank; 2 ~ 1C wafer; 211 ~ pressure receiving surface; 2 0 0 ~ IC storage section; 202 ~ 1C storage section after test 2 0 4 ~ lifter; 3 0 0 ~ loading section; 3 5 5 ~ temporary corrector; 3 b push block; 32 ~ guide pin; 33 ~ stop guide; 35 ~ lead pusher 40 ~ IC socket; 41 3 ~ gas flow channel; 422 ~ gas flow channel; 400 ~ unloading section; 4 Bu socket guide; Bu control section; 1 2 a ~ side; 1 4 ~ combination piece; 1 6 ~ insert piece; 19 ~ IC storage section; 100 ~ cage compartment; 102 ~ test clamp grab; 105 ~ device substrate; 2 ~ body part; 2 ~ external terminal; 2 (H ~ Before the test, the IC storage section 203 to the tray support frame; 205 to the tray moving arm; 304 to XY conveying device; 306 to the window; 3 1 2 to the protrusion; 3 2 1 to the gas outlet ; 3 4 ~ pushing table; 3 7 ~ interstitial sheet; 41 ~ socket Lead member; 1 ~ 42 gas outlet; 44~ probe pin; window portion 6 ~ 40; 1 ~ 41 guide pad; _

2192-4582-PF (N); ahddub.ptd Page 25 1224198 Schematic description of 5 ~ test bench; 5 1 ~ gas inlet; 5 3 ~ piping; 7 ~ lead; 7 2 ~ drive board; 8 ~ space Part; 8 2 ~ temperature sensor; 90 ~ temperature adjusting air supply device 9 4 ~ heat exchange section; TST ~ test tray; S ~ attachment. 5 0 ~ test board; 5 2 ~ gas flow channel; 6 ~ main test device 7 0 ~ Z axis drive device 7 8 ~ drive shaft; 8 0 ~ case; 9 ~ connecting part; 9 2 ~ fan; KST ~ general tray ; R ~ gap; 9

2192-4582-PF (N); ahddub.ptd Page 26

Claims (1)

"Chinese reading patent scope 1. A pressing member for pressing the body of the electronic component of the device on the socket, characterized in that: on the pressing surface opposite to the pressing surface of the aforementioned electronic component, A protrusion 2 is provided which can press the electronic component in the direction of the connection terminal of the socket. If the protrusion is 3, the protrusion is provided. 4. If the protrusion is provided. 5. If the elastic bomb is provided. 6. — The scope of patents The scope of patents described in item 1 of the aforementioned patent scope of application, wherein, they are pointed. The pressing member according to item 1 of the scope of patent application, wherein the aforementioned is at a position corresponding to the external terminal of the aforementioned electronic component. The pressing member according to item 2 of the scope of patent application, wherein the aforementioned is at a position corresponding to the external terminal of the aforementioned electronic component. The pressing member according to item 1, 2, 3 or 4 of the scope of the patent application, which presses the aforementioned protrusion in the pressing direction of the electronic component, and the component. A pre-applied electronic component testing device is characterized in that it includes a pressing member as described in item 1, 2, 3, or 4.凊 An electronic component testing device, characterized in that it includes a pressing member according to item 5. π application _ 2192-4582-PF (N); ahddub.ptd p. 27