WO2002041015A1

WO2002041015A1 - Kit and method for cleaning socket connection terminal, and electronic part tester

Info

Publication number: WO2002041015A1
Application number: PCT/JP2001/010051
Authority: WO
Inventors: Keiji Tsuchida; Hisao Hayama
Original assignee: Advantest Corporation
Priority date: 2000-11-20
Filing date: 2001-11-16
Publication date: 2002-05-23
Also published as: JP2002156408A

Abstract

A kit and a method for cleaning a socket connection terminal; the kit, wherein a rubbing member (110) having a thickness, at a portion sandwiched between the pressing surface of a pusher (30) and the connection terminal (43) of a socket (40), set approximately the same as that of the lead (2a) of an IC chip sandwiched between the pressing surface of the pusher (30) and the connection terminal (43) of the socket (40) and having at least a rough surface coming into contact with the connection terminal (43) of the socket (40) is stored in an insert (16) in place of the IC chip (2), and the insert (16) having the rubbing member (110) stored therein is detachably installed in the socket (40); the method, comprising the step of pressing the pusher (30) against the connection terminal (43) of the socket (40) one or several times at a specified stroke by using a pusher driving device installed in an electronic part tester (10) or manually to bring the rubbing member (110) into contact with the connection terminal (43) of the socket (40), whereby the connection terminal (43) of the socket (40) can be easily cleaned without damaging the connection terminal (43) of the socket (40).

Description

Specification

Socket connection terminal cleaning kit, socket connection terminal cleaning method, and electronic component test apparatus

The present invention provides a kit and a method for removing impurities such as an oxide film adhered to a connection terminal of a socket (cleaning a connection terminal) in an apparatus for testing an electronic component such as an IC chip, and a method of connecting a socket. The present invention relates to an electronic component test apparatus capable of cleaning terminals. Skill

As a type of test device for testing electronic components such as IC chips, the IC chip is transported onto a test head, and the IC chip is pressed against a socket of the test head by a pusher driven by a pusher driving device. Then, the connection terminal of the IC chip is electrically connected to the connection terminal of the socket, and the IC chip is tested by an electric signal from the test head. According to the test result, at least a non-defective chip and a defective chip are determined. There is known an electronic component test apparatus that separates the components.

Examples of the types of the above-mentioned IC chips include a surface mount type peripheral type (SOP (Small Outline Package) type and QFP (Quad Flat Package) type) and a surface mount type area array type (BGA (Ball Grid Array) type and LGA (Land Grid Array) type. The connection terminals of all IC chips are usually soldered or formed with solder poles.

The form of the socket and the connection terminal of the socket depends on the type of the IC chip. Specified according to the type. For example, the connection terminals of a surface-mount type peripheral type IC chip socket are shaped and made of a material suitable for sliding contact with the connection terminals (leads) of the IC chip. A sheet of beryllium copper is punched out with a press so as to have a curved central part so as to have a spring property, and a nickel base metal plating is used as a surface treatment.

For example, a probe-like connection terminal called a probe pin or a spring probe pin is usually used as a connection terminal in a socket for a surface mount area array type IC chip.

By the way, when the test for electrically connecting the connection terminal of the IC chip to the connection terminal of the socket is repeated as described above, the solder of the connection terminal of the IC chip is transferred to the connection terminal of the socket, and the solder is used. An oxide film may be formed on the connection terminal of the socket. Such a state is also likely to occur when so-called burn-in, in which the IC chip is heated to a high temperature and a high voltage is applied in order to remove the initial failure of the IC chip.

When an IC chip is tested with an oxide film formed on the connection terminals of the socket as described above, even if a certain IC chip is determined to be defective, the cause is that the connection terminals of the IC chip and the socket Poor contact may not be possible due to poor contact with the connection terminals.

Such a problem has occurred both in the socket for the surface-mounted peripheral type IC chip and in the socket for the surface-mounted area array type IC chip. DISCLOSURE OF THE INVENTION.

In order to prevent poor contact between the connection terminal of the IC chip and the connection terminal of the socket as described above, the connection of the socket with an oxide film It was necessary to clean the connection terminals, and conventionally, cleaning was performed manually using a nylon brush or metal wire brush. Such manual cleaning was extremely inefficient, especially for test equipment with a large number of sockets. In the case of manual cleaning, there were also problems such as damage to the connection terminals of the socket, or removal of the gold plating due to excessive polishing.

The present invention has been made in view of such circumstances, and a socket connection terminal cleaning kit and a socket connection socket that can easily clean a socket connection terminal without damaging the socket connection terminal. An object of the present invention is to provide a method of cleaning a connection terminal for a socket and an electronic component test apparatus.

In order to achieve the above object, a first socket connection terminal cleaning kit according to the present invention includes a socket having a connection terminal capable of contacting a connection terminal of an electronic component and / or a guide for the socket. An insert that is detachably mounted and stores the electronic component to be tested so that the connection terminal of the electronic component to be exposed is exposed, and the connection terminal of the electronic component is connected to the socket by a specified stroke. A pusher that presses against the terminal; and a rubbing member that is housed in the insert instead of the electronic component and that can contact the connection terminal of the socket in this state, and at least a surface that contacts the connection terminal of the socket is rough. The thickness of a portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is between the pressing surface of the pusher and the connection terminal of the socket. Characterized in that a said rubbing member is set substantially equal to the thickness of the connection terminal of the electronic component (claim 1).

Further, in the first socket connecting terminal cleaning method according to the present invention, the thickness of a portion sandwiched between the pressing surface of the pusher and the connecting terminal of the socket is such that the thickness of the portion between the pressing surface of the pusher and the connecting terminal of the socket is large. Of electronic components sandwiched A rubbing member which is set to be substantially the same as the thickness of the connection terminal and has a rough surface at least in contact with the connection terminal of the socket is housed in an insert instead of an electronic component, and the rubbing member is provided. The inserted insert is detachably attached to the socket and / or the guide of the socket, and the pusher is provided to a specified position by using a pusher driving device installed in an electronic component test apparatus or manually. The rubbing member is pressed against the connection terminal side of the socket once or a plurality of times by a stroke, and the rubbing member is brought into contact with the connection terminal of the socket (claim 5).

Further, the first electronic component test apparatus according to the present invention is configured such that the socket having a connection terminal capable of contacting the connection terminal of the electronic component, and the socket and / or the guide of the socket can be detachably attached to the socket. An insert that houses the electronic component so that the connection terminal of the electronic component to be mounted is exposed, and the connection terminal of the electronic component is pressed against the connection terminal of the socket by a specified stroke. A pusher to be attached; a pusher driving device for driving the pusher; and a rubbing member that is housed in the insert instead of an electronic component and that can contact a connection terminal of the socket in that state, and a connection end of the socket. The contact surface of the pusher is rough, and the thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket has a thickness between the pressing surface of the pusher and the socket. Characterized in that a said rubbing member that is set in thickness and Hobodo one electronic component connection terminals interposed between the terminal (請 Motomeko 7).

The electronic component is not particularly limited as long as it is a type of electronic component having a connection terminal that makes contact (usually sliding contact) with the connection terminal of the socket, but most commonly is a surface-mount type peripheral type. An IC chip can be exemplified. Examples of such an IC chip include an SOP type IC chip and a QFP type IC chip. The term "prescribed strike" in the present invention means that, for example, the movement of the pusher is restricted so that the connection terminal of the socket or the connection terminal of the electronic component is not destroyed by the excessive movement of the pusher. As an example, a “prescribed stroke” is obtained when the pusher comes into contact with a stop provided on an ink-socket guide or the like.

In the above invention (claims 1, 5, and 7), the rubbing member is stored in an insert instead of the electronic component, and the insert in which the rubbing member is stored is connected to a socket and / or a socket. Push the pusher one or more times against the connection terminal side of the socket by using a pusher drive installed on the electronic component tester or manually, and rubbing it. By pressing the member against the connection terminal of the socket and bringing the rubbing member into contact with the connection terminal of the socket, the connection terminal of the socket is polished by the rough surface of the rubbing member. If an impurity such as an oxide film is formed, the impurity is removed.

At this time, the pusher presses the rubbing member against the connection terminal of the socket with a prescribed stroke, and the stroke of the pusher is usually set in accordance with the connection terminal of the electronic component. Here, in the above-mentioned rubbing member, the thickness of the portion sandwiched between the push surface of the pusher and the connection terminal of the socket is the thickness of the connection terminal of the electronic component sandwiched between the push surface of the pusher and the connection terminal of the socket. Are set substantially the same. Therefore, if such a rubbing member is housed in an insert instead of an electronic component, the pusher will apply an appropriate pressure that will not destroy the socket connection terminals, as in the case where the electronic component is housed in an insert. With this, the rubbing member can be pressed against the connection terminal of the socket.

The rubbing member in the above invention (Claims 1, 5, 7) is characterized in that: It has a thickness substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the socket and the connection terminal of the socket, and is a plate-like body having at least one surface roughened. Preferably, the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component. (Claim 2) A rubbing member having such a shape can be easily manufactured, Therefore, manufacturing costs can be kept low. If the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component, the rubbing member can be securely housed in the insert in the same manner as the electronic component and pressed against the socket. .

The rubbing member as described above can be composed of, for example, a sandpaper and a plate-shaped base supporting the sandpaper. If the sandpaper is too rough, the connection terminals of the socket may be damaged if it is too rough.If it is too fine, the connection terminals of the socket with an oxide film formed by solder cannot be sufficiently cleaned. For this reason, it is preferable that it is before or after 300.

The rubbing member may be made of a metal plate, a glass plate, a ceramic plate, or the like whose surface has been roughened by sand blasting or the like, or may be formed by spraying or vapor-depositing particles on a metal plate. You may.

A second socket connection terminal cleaning kit according to the present invention is detachably mounted on a socket having a probe-like connection terminal and a Z or a guide of the socket, and has a connection terminal of an electronic component to be tested. An insert for storing the electronic component so as to be exposed, a pusher for pressing the electronic component against the socket with a prescribed stroke, and a housing for storing the electronic component in the insert instead of the electronic component, and in that state, a connection terminal of the socket. Is a rubbing member that can be pierced, and is pierced at least by a connection terminal of the socket. The rubbing member has a thickness substantially equal to the thickness of the electronic component. Further, in the second socket connection terminal cleaning method according to the present invention, the polishing fiber aggregate has a thickness substantially equal to the thickness of the electronic component, and at least a portion of the socket where the probe-like connection terminal pierces is formed. The rubbing member is stored in an insert instead of an electronic component, and the insert storing the rubbing member is detachably attached to the socket and / or the guide of the socket, and an electronic component test is performed. The pusher is pressed against the connection terminal side of the socket one or more times with a prescribed stroke by using a pusher driving device installed in the device or manually, and the socket is attached to the rubbing member. The connection terminal is pierced (claim 6).

Further, a second electronic component test apparatus according to the present invention includes a socket having a probe-like connection terminal, and a detachably mounted electronic component to be tested which is detachably attached to the socket and Z or a guide of the socket. An insert for housing the electronic component so that the connection terminal is exposed, a pusher for pressing the electronic component against the socket with a prescribed stroke, a pusher driving device for driving the pusher, and a substitute for the electronic component A rubbing member that is housed in the insert, and into which the connection terminal of the socket can pierce, and at least the portion that pierces the connection terminal of the socket is an aggregate of polished fibers, and the thickness of the electronic component And the rubbing member having substantially the same thickness as that of the rubbing member.

The electronic component is not particularly limited as long as it is a type of electronic component having a connection terminal with which a probe-like connection terminal of a socket contacts, but most commonly a surface mount type area array type IC chip. Examples can be given. Examples of such an IC chip include a BGA type IC chip and an LGA type IC chip. The above “Electronic components “Thickness” refers to the thickness of the electronic component including the height of the connection terminal of the electronic component.

The above-mentioned abrasive fiber aggregate is an aggregate of fibers having polishing ability, such as metal fiber and glass fiber. The aggregate may be formed, for example, by entangled wool fibers or non-woven fabric. Shape, or a knitted object or a woven body. As a preferable abrasive fiber aggregate, a molded product of metal wool can be exemplified.

In the above invention (claims 3, 6, 8), the rubbing member is stored in the insert instead of the electronic component, and the insert in which the rubbing member is stored can be detachably attached to the socket and / or the guide of the socket. Press the pusher one or more times against the connection terminal side of the socket using a pusher drive installed in the electronic component tester, or manually, and press the rubbing member against the socket. Then, by piercing the connection terminal of the socket into the rubbing member, the connection terminal of the socket is polished by the abrasive fiber aggregate of the rubbing member, so that impurities such as an oxide film due to solder are formed on the connection terminal of the socket. If so, the impurities are removed.

At this time, the pusher presses the rubbing member against the connection terminal of the socket with a prescribed stroke. The stroke of such a pusher is usually set in accordance with the electronic component. Here, in the rubbing member, the thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is equal to the thickness of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. They are set almost identically. Therefore, when such a rubbing member is housed in an insert instead of an electronic component, the pusher operates in the same manner as when the electronic component is housed in the insert, with an appropriate pressure that does not destroy the socket connection terminal or the rubbing member. To connect the rubbing member to the socket. It can be pressed against the connection terminal.

The rubbing member in the above invention (Claims 3, 6, 8) is a polishing fiber aggregate having a thickness substantially equal to the thickness of the electronic component, and the width and length of the rubbing member are determined by the width of the electronic component. It is preferable that the width and the length are set to be substantially the same (claim 4).

A rubbing member having such a shape can be easily manufactured by molding an abrasive fiber aggregate or the like, and thus the manufacturing cost can be reduced. However, if the cleaning of the socket connection terminal is performed automatically by the electronic component tester, the rubbing member is picked up and picked up by the suction head. In order to reduce the air permeability of the rubbing member to such an extent that it can be adsorbed, it is necessary to increase the density of the abrasive fiber aggregate constituting the rubbing member.

When the width and the length of the rubbing member are set to be substantially the same as the width and the length of the electronic component, the lapping member can be securely housed in the insert like the electronic component and pressed against the socket. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an exploded perspective view illustrating how a rubbing member used in an IC test apparatus according to a first embodiment of the present invention is incorporated into an insert.

FIG. 2 is an overall side view of the IC test apparatus.

FIG. 3 is a perspective view of the handler shown in FIG.

FIG. 4 is a flowchart of a tray showing a method of handling the IC under test.

FIG. 5 is a perspective view showing the structure of the IC stocking force of the IC test apparatus. FIG. 6 is a perspective view showing a customer tray used in the IC test apparatus. is there.

FIG. 7 is a cross-sectional view of a main part in a test chamber of the IC test apparatus.

FIG. 8 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

FIG. 9 is an exploded perspective view showing a structure near a socket in a test head of the IC test apparatus.

FIG. 10 is a sectional view of the vicinity of the socket shown in FIG.

FIG. 11 is a cross-sectional view showing a state where the pusher is lowered in FIG.

FIG. 12 is a plan view and a side view showing a rubbing member used in the IC test apparatus.

FIG. 13 is a cross-sectional view of the vicinity of an insert and a socket incorporating a rubbing member.

FIG. 14 is a cross-sectional view showing a state where the pusher is lowered in FIG.

FIGS. 15A and 15B are side views illustrating a state where the connection terminal of the socket is cleaned. FIG. 15A illustrates a state where the rubbing member is in contact with the connection terminal of the socket, and FIG. It shows the state pressed against the connection terminal of.

FIG. 16 is an exploded perspective view showing a structure near a socket in a test head of an IC test apparatus according to a second embodiment of the present invention.

FIG. 17 is a sectional view of the vicinity of the socket shown in FIG.

FIG. 18 is a cross-sectional view showing a state where the pusher is lowered in FIG.

FIG. 19 is a plan view and a side view showing a rubbing member used in the IC test apparatus. FIG. 20 is an exploded perspective view for explaining how the rubbing member is incorporated into the insert.

FIG. 21 is a cross-sectional view of the vicinity of the insert and the socket incorporating the rubbing member.

FIG. 22 is a cross-sectional view showing a state where the pusher is lowered in FIG.

FIGS. 23A and 23B are side views illustrating a state in which the connection terminal of the socket is cleaned. FIG. 23A illustrates a state in which the rubbing member is in contact with the probe pin of the socket, and FIG. Indicates that the probe pin of the socket has been pierced. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 to 15 are diagrams relating to the first embodiment of the present invention, and FIGS. 16 to 23 are diagrams relating to the second embodiment of the present invention. First, a first embodiment of the present invention will be described.

[First embodiment]

FIG. 1 is an exploded perspective view illustrating how a rubbing member used in an IC test apparatus according to a first embodiment of the present invention is incorporated into an insert. FIG. 2 is an overall side view of the IC test apparatus. 3 is a perspective view of the handler shown in FIG. 2, FIG. 4 is a flowchart of a tray showing a method of handling an IC under test, FIG. 5 is a perspective view showing the structure of an IC stocking force of the IC test apparatus, and FIG. FIG. 7 is a perspective view showing a customer tray used in an IC test apparatus, FIG. 7 is a cross-sectional view of a main part in a test chamber of the IC test apparatus, and FIG. 8 is a partially exploded perspective view showing a test tray used in an IC test apparatus. Fig. 9 is an exploded perspective view showing the structure near the socket in the test head of the IC test apparatus. FIG. 11 is a cross-sectional view of the vicinity of the socket shown in FIG. 11, FIG. 11 is a cross-sectional view showing a state where the pusher is lowered in FIG. 10, FIG. 12 is a plan view and a side view showing a rubbing member used in the IC test apparatus, and FIG. 3 is a cross-sectional view of the vicinity of the insert and the socket incorporating the rubbing member, FIG. 14 is a cross-sectional view showing the state in which the pusher is lowered in FIG. 13, and FIGS. 15 (a) and (b) show the connection terminals of the socket. It is a side view explaining the state where it is cleaned.

First, the overall configuration of an I C test device as an electronic component test device according to the first embodiment of the present invention will be described. As shown in FIG. 2, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a main test apparatus 6. The handler 1 sequentially transports the IC chips to be tested (an example of electronic components) to a socket provided in the test head 5, sorts the IC chips having been tested according to the test results, and stores them in a predetermined tray. Execute. '

The socket provided in the test head 5 is electrically connected to the main test device 6 through the cable 7, and the IC chip detachably mounted in the socket is connected to the main test device 6 through the cable 7. Connect and test the IC chip with the test electrical signal from the test main unit 6. At the lower part of the handler 1, a control device for mainly controlling the handler 1 is incorporated, but a space portion 8 is provided in a part. The test head 5 is exchangeably arranged in the space 8, and the IC chip can be mounted on a socket on the test head 5 through a through hole formed in the handler 1.

This IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at a temperature higher than normal temperature (high temperature) or at a temperature lower than normal temperature (low temperature). As shown in Fig. 4 and consisting of a constant temperature bath 101, a test chamber 102 and a heat removal bath 103 It has a champer 100. The upper part of the test head 5 shown in FIG. 2 is inserted into the test champ 102 as shown in FIG. 7, where the IC chip 2 is tested.

FIG. 4 is a diagram for understanding the method of handling the test IC chips in the IC test apparatus of the present embodiment, and actually shows the members arranged vertically in a plan view. There are also parts. Therefore, its mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

As shown in FIGS. 3 and 4, the handler 1 of the IC test apparatus 10 of the present embodiment stores an IC chip to be tested from now on and an IC storage unit for classifying and storing tested IC chips. 200 and the loader section 3 for sending the IC chip under test sent from the IC storage section 200 to the chamber section 100

0, a chamber section 100 including a test head, and an unblocker section 400 for classifying and extracting the tested ICs tested in the chamber section 100. I have. Inside the handler 1, the IC chip is transported in a test tray.

A large number of IC chips before being stored in the handler 1 are stored in the customer tray KST shown in FIG. 6, and in that state, the IC chips are transferred to the IC storage section 200 of the handler 1 shown in FIGS. 3 and 4. The test tray TST (see Fig. 8) is supplied from the customer tray KS and transported inside the handler 1.

1 C chip 2 is replaced. As shown in Fig. 4, inside the handler 1, the IC chip moves while being placed on the test tray TST, and is subjected to high or low temperature stress to test whether it operates properly (inspection). And classified according to the test results. Hereinafter, the inside of Handler 1 will be described in detail individually.

First, a part related to the IC storage unit 200 will be described. As shown in FIG. 3, the IC storage unit 200 stores a pre-test IC stocker 201 for storing pre-test IC chips and a tested IC chip for storing IC chips classified according to the test results. An IC stocker 202 is provided.

As shown in FIG. 5, the pre-test IC stocker 201 and the tested IC stocker 202 intrude from the frame-shaped tray support frame 203 and the lower portion of the tray support frame 203. And an elevator 204 that can move up and down toward the top. A plurality of stack trays K ST are supported by being stacked on the tray support frame 203, and only the stacked customer trays K ST are moved up and down by the elevator 204.

In the pre-test IC stocker 201 shown in FIG. 3, customer trays K ST in which the IC chips to be tested are stored are stacked and held. In addition, the tested IC stocker 202 was classified after the test.

Customer tray K ST containing 1 C chips is stacked and held.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure, the pre-test IC stocker 201 is replaced with the tested IC stocker 202. And vice versa. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers

The number of 202 can be easily changed as needed.

As shown in FIGS. 3 and 4, in the present embodiment, two stockers S TK-B are provided as the pre-test stock force 201. Next to the stocker S TK-B, two empty stocking forces S TK-E to be sent to the unloader unit 400 are provided as tested IC stockers 202. Eight stockers S TK-1, S TK-2,..., S TK-8 are provided next to the tested IC stockers 202, and a maximum of 8 according to the test results. It is configured so that it can be sorted into two categories and stored. In other words, good and bad In addition to these, it is possible to sort non-defective products that have high operating speeds, medium speed ones, low speed ones, or failures that require retesting.

Second, a part related to the loader unit 300 will be described.

As shown in FIG. 5, the customer tray KST housed in the tray support frame 203 of the pre-test IC stocker 201, as shown in FIG. It is carried from the lower side of the device substrate 105 to the window portion 300 of the loader portion 300 by the tray transfer arm 205 provided between the two. Then, in the loader section 300, the IC chip to be tested loaded on the waste tray KST is once transferred to a pre-sizer 300 by the XY transfer device 304, where it is subjected to the test. After correcting the mutual positions of the test IC chips, the test IC chips transferred to the precisor 2005 are again stopped at the loader section 300 by using the XY transfer device 304. Transfer to test tray TST.

As shown in Fig. 3, the X-Y transfer device 304 transfers the IC chips under test from the waste tray KS T to the test tray TST. As shown in Fig. 3, two rails 3 are installed on the top of the device substrate 105. And a movable arm 302 that can reciprocate between the test tray TST and the waste tray KST by using these two rails 310 (this direction is defined as the Y direction). A movable head 303 supported by the movable arm 302 and movable in the X direction along the movable arm 302 is provided.

A suction head is attached to the movable head 303 of the XY transfer device 304 in a downward direction. The IC chip under test is sucked from the tray KST, and the IC chip under test is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and at a time, Eight IC chips under test can be transferred to the test tray TST.

Third, a portion related to the chamber 100 will be described.

The test tray T ST described above is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray T ST.

As shown in FIGS. 3 and 4, the chamber 100 is provided with a constant temperature chamber 101 for applying a desired high or low temperature thermal stress to the IC chip under test loaded in the test tray TST, and a constant temperature chamber 1 01 The IC chip under test that has been subjected to thermal stress in 1 is mounted on the socket on the test head in the test chamber 102, and the IC chip under test tested in the test chamber 102. And a heat removal tank 103 for removing a given thermal stress.

In the heat removal tank 103, when the high temperature is applied in the constant temperature chamber 101, the IC chip under test is cooled by blowing air to return to room temperature, and when the low temperature is applied in the constant temperature chamber 101, the Heat the test IC chip with warm air or a heater to return it to a temperature that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 3, the constant temperature bath 101 and the heat removal bath 103 of the chamber 100 are arranged so as to protrude above the test chamber 102. As shown conceptually in Fig. 4, the thermostatic bath 101 is provided with a vertical transfer device, and a plurality of test trays TST hold the vertical transfer device until the test chamber 102 becomes empty. Stand by while being supported by the device. Mainly during this standby, a high or low temperature stress is applied to the IC chip under test.

As shown in Fig. 7, the test chamber 102 has a The test head 5 is arranged, and the test tray TST is carried on the test head 5. There, all the IC chips 2 held by the test tray TST shown in FIG. 8 are brought into electrical contact with the test head 5 sequentially, and the test is performed on all the IC chips 2 in the test tray TST. On the other hand, the test tray TST for which the test was completed is heat-removed in the heat-removal tank 103. After the temperature of the chip 2 is returned to room temperature, it is discharged to the unloader section 400 shown in FIG. 3 and FIG.

In addition, as shown in FIG. 3, the upper part of the constant temperature bath 101 and the heat removal tank 103 has an opening for entrance of the test tray TST from the device substrate 105, and the device substrate 10. An outlet opening for sending out the test tray TST to 5 is formed. The device board 105 has a test tray transport device for inserting and removing the test tray TST from these openings.

108 is attached. These transfer devices 108 are constituted by, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transfer device 108 provided on the device substrate 105 is kept at a constant temperature via the unloader unit 400 and the loader unit 300. Vessel 1 0

Returned to 1.

FIG. 8 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment. The test tray TST has a rectangular frame 12 on which a plurality of bars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of these bars 13 and on the inside of the side 12a of the frame 12 parallel to the bars 13 so as to protrude at regular intervals in the longitudinal direction. Each insert storage section 15 is constituted by two opposed mounting pieces 14 of a plurality of mounting pieces 14 provided between the crosspiece 13 and between the crosspiece 13 and the side 12a. Have been.

Each insert storage section 15 contains one insert 16 The insert 16 is fastened to the two mounting pieces 14 using fasteners 17. For example, about 16 × 4 such sensors 16 are attached to one test tray TST. By storing the IC chip 2 under test in this insert 16, the IC chip 2 under test is loaded on the test tray TST. As shown in FIGS. 9 to 11, the IC chip 2 to be tested in the present embodiment has a plurality of gull-wing leads 2a protruding from four sides of a rectangular package body 2b. It is a so-called QFP type IC chip.

In the insert 16 of the present embodiment, as shown in FIG. 9, a rectangular concave IC housing portion 19 for housing the IC chip 2 to be tested is formed at the center, and the IC housing portion 19 is formed. At the boundary between the bottom plate 191 and the four side walls 193, four slits 192 for exposing the leads 2a of the IC chip 2 are provided. The bottom plate 191 and the four side walls 193 are connected by connecting portions 19 formed at the four corners of the IC storage portion 19.

On both sides of the IC storage section 19, stoppers 22 for defining the lower limit of the downward movement of the pusher 30 are formed so as to protrude upward, and the center of both ends of the insert 16 is formed. The guide hole 32 into which the guide bin 32 of the pusher 30 and the socket guide 41 are inserted from the top and bottom, respectively, is formed. The mounting holes 21 for the mounting pieces 14 are formed.

As shown in FIG. 11, the guide hole 20 on the left side of the figure is a hole for positioning, and has an inner diameter smaller than that of the guide hole 20 on the right side. Therefore, the guide hole 32 of the pusher 30 is inserted into the upper half of the guide hole 20 on the left side to perform positioning, and the lower half of the guide hole 20 is provided with the socket 40. The socket guide 41 is inserted for positioning. Incidentally, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the socket guide 41 of the socket 40 are loosely fitted.

As shown in FIG. 9, a socket port 50 is arranged on the test head 5. The socket boards 50 can be arranged in the test tray TST shown in FIG. 8 in a number corresponding to the IC chips 2 to be tested 2 in four rows, for example, every three rows (four rows and four columns). If the size of each socket board 50 can be reduced, all the IC chips 2 held in the test tray TST shown in FIG. 4-row x 16-column socket pod

50 may be arranged.

As shown in FIGS. 9 to 11, a socket 40 is fixed to the socket board 50, and a socket guide 4 into which guide pins 32 of a pusher 30 are inserted is provided at both ends of the socket 40. 1 is provided. An opening 42 is formed in the center of the socket 40, and a plurality of connection terminals 43 are provided on four sides surrounding the opening 42. The connection terminals 43 of the socket 40 are provided with a number and a pitch corresponding to the leads 2a of the IC chip 2, and the panel is biased upward. The connection terminals 43 are provided with gold plating on a nickel base as a surface treatment.

The pushers 30 shown in FIG. 9 are provided on the upper side of the test head 5 corresponding to the number of the sockets 40. As shown in FIG. 7, each pusher 30 is fixed to the lower end of an adapter 62, and each adapter 62 is a match plate.

It is elastically held at 60. The match plate 60 is mounted so as to be located at the upper part of the test head 5 so that the test tray TST can be inserted between the pusher 30 and the socket 40. The pusher 30 held in the match plate 60 is used for the test head 5 or the Z-axis drive device. It is movable in the Z-axis direction with respect to the drive plate (drive body) 72 of the device 70. The test tray TST is transported between the pusher 30 and the socket 40 in the direction perpendicular to the paper surface (X axis) in FIG. As a transport means of the test tray TST inside the chamber 100, a transport port is used. During the transport movement of the test tray TST, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is inserted between the pusher 30 and the socket 40. There are enough gaps to be made.

As shown in FIG. 7, the number of pressing portions 74 corresponding to the number of adapters 62 is fixed to the lower surface of the driving plate 72 arranged inside the test chamber 102, The upper surface of the adapter 62, which is held at a position, can be pressed. A drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78. The drive shaft 78 is moved along the Z-axis direction. To move up and down, so that the adapter 62 can be pressed.

Note that the match plate 60 depends on the shape of the IC chip 2 to be tested and the number of sockets of the test head 5 (the number of IC chips 2 to be measured at the same time). In addition, it has a replaceable structure. By making the match plate 60 freely replaceable in this way, the Z-axis drive device 70 can be made a general-purpose one. In the present embodiment, the pressing portion 74 corresponds to the adapter 62 in a one-to-one correspondence.For example, when the number of sockets of the test head 5 is changed to half, the match plate 60 is replaced. This makes it possible to make the pressing portion 74 correspond to the adapter 62 two-to-one.

As shown in FIGS. 9 to 11, the pusher 30 attached to the lower end of each adapter 62 connects the lead 2a of the IC chip 2 under test to the socket 40 as shown in FIGS. A plate-like pressing element 31 for pressing the connection terminal 43 is provided downward. Specifically, two sets (two in total) of two pressers 31 parallel to each other are provided via the presser holder 33. At both ends of the pusher 30, guide holes 20 of the insert 16 and guide bins 32 inserted into the socket guides 41 are provided.

In this embodiment, four pushers 31 of the pusher 30 are provided in accordance with the IC chip 2 to be tested, that is, the QFP type IC chip 2, but the IC chip to be tested is S〇P. Type IC chip, that is, an IC chip in which a plurality of gull-wing-shaped leads are protruded from two parallel sides of a rectangular package body, the pusher 30 has two parallel pieces. One set of the pressing elements 31 is provided.

To connect the lead 2 a of the IC chip 2 under test to the connection terminal 43 of the socket 40, as shown in FIG. 10, store the IC chip 2 in the IC storage section 19 of the insert 16, The lead 2 a of the IC chip 2 is exposed from the slit 19 2, and the insert 16 containing the IC chip 2 is attached to the socket 40. In this state, the Z-axis driving device 70 is driven, and the driving shaft Ί8 and the driving plate 72 shown in FIG. 7 are moved downward along the Z-axis direction. As shown in FIG. The pressing portion 74 of the contact plate 72 comes into contact with the upper surface of the adapter 62 of the match plate 60 to press the pusher 30. Then, as shown in FIG. 11, the pusher 31 of the pusher 30 presses the lead 2 a of the IC chip 2 against the connection terminal 43 of the socket 40, and the lead 2 a of the IC chip 2 fits the socket 40. Connected to connection terminals 4 and 3 At this time, the connection terminal 43 of the socket 40 moves downward and into the opening 42 of the socket 40 while being urged upward, so that the lead 2a of the IC chip 2 is connected to the socket. Contact with the connection terminal 4 3 And '

The downward movement of the pusher 30 is limited by the contact of the pusher 30 with the upper end of the stopper 22 of the insert 16, and therefore, an appropriate pressure that does not rupture the connection terminal 43 of the socket 40. Thus, the pusher 30 can press the lead 2 a of the IC chip 2 against the connection terminal 43 of the socket 40.

In the present embodiment, as shown in FIG. 1, in the champer 100 configured as described above, a temperature-controlling blower 90 is provided inside a closed casing 80 constituting the test chamber 102. Is installed. The temperature control blower 90 has a fan 92 and a heat exchanging unit 94, and draws air inside the casing by the fan 92 and discharges the air into the casing 80 through the heat exchanging unit 94. The inside of the casing 80 is subjected to a predetermined temperature condition.

(High or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchange section 94 of the temperature control blower 90 is constituted by a heat radiating heat exchanger or an electric heater through which a heating medium flows. For example, sufficient heat can be provided to maintain a high temperature of room temperature to about 160 ° C. When the inside of the casing is to be cooled to a low temperature, the heat exchange section 94 is constituted by a heat-absorbing heat exchanger or the like through which a refrigerant such as liquid nitrogen circulates. A sufficient amount of heat can be absorbed to maintain the temperature between 0 ° C and room temperature. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the air volume of the fan 92 and the heat volume of the heat exchange section 94 are controlled so that the inside of the casing 80 is maintained at a predetermined temperature. Is done. The hot or cold air generated through the heat exchange section 94 of the temperature control blower 90 flows through the upper part of the casing 80 along the Y-axis direction, and along the casing side wall opposite to the apparatus 90. Descends to match plate 60 and test The device 90 is returned to the device 90 through the gap between the case 5 and the device, and circulates inside the casing.

Fourth, a portion related to the unloader section 400 will be described.

The unloader section 400 shown in FIGS. 3 and 4 also has an X—Y transfer apparatus 4 0 4, 4 0 having the same structure as the X—Y transfer apparatus 304 provided in the mouth section 3 0 0. 4 The X-Y conveyors 4 0 4 and 4 0 4 are used to transfer the tested IC chips from the test tray TST carried out to the opening 4 Can be

As shown in FIG. 3, a pair of customer trays KST carried to the unloader unit 400 are arranged on the device substrate 105 of the unloader unit 400 so as to face the upper surface of the device substrate 105. Windows 406 and 406 are open. '

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406. Here, the tested IC chips to be tested are reloaded. The fully loaded customer tray KST descends, and the full tray is delivered to the tray transfer arm 205.

Next, a rubbing member used in the IC test apparatus of the present embodiment will be described. As shown in FIGS. 1 and 12, the rubbing member 110 used in the IC test apparatus of the present embodiment is a rigid plate-shaped base 111 and affixed to the lower side of the base 111. It has a rectangular shape having four notched portions 113 at four corners. The rubbing member 110 having such a structure can be manufactured at extremely low cost. The thickness T of the rubbing member 1 1 0 Oite the lead 2 a of the IC chip 2, the pusher 3 0 of the presser 3 1 and the socket 4 0 parts of thickness T ₂ and substantially sandwiched between the connection terminal 4 3 It is set to the same The width and length of the material 110 are set substantially the same as the width and length of the IC chip 2 (including the lead 2a).

The substrate 111 of the rubbing member 110 is made of any material having a rigidity enough to support the sandpaper 112 so that the sanding function of the sandpaper 112 can be exhibited. May be done. Examples of such a material include metals such as aluminum and stainless steel, plastic, glass, and ceramics.

As the sandpaper 112 of the rubbing member 110, a normal commercial product can be used, and the roughness of the rough surface thereof is preferably about 300. If the roughness is too rough, the connection terminals of the socket may be damaged.On the other hand, if the roughness is too fine, the connection terminals of the socket on which the oxide film is formed by soldering will be sufficiently cleaned. Can not do.

The cutouts 113 formed at the four corners of the rubbing member 110 are provided with the bottom plate of the IC housing 19 when the rubbing member 110 is incorporated into the IC housing 19 of the insert 16. The rubbing member 110 is fitted to the connecting portion 194 that connects the 191 and the side wall portion 193, and has a role of fixing the rubbing member 110 to the insert 16.

In order to clean the connection terminal 43 of the socket 40 using such a rubbing member 110, first, as shown in FIG. 1 and FIG. Into the IC storage section 19 of the sensor 16. At this time, the rubbing member 110 is placed on the bottom plate 191 of the IC storage part 19, but the peripheral part of the rubbing member 110 is separated from the slit 192 of the IC storage part 19. The notched part 113 of the rubbing member 110 exposed is fitted to the connecting part 194 of the IC storage part 19. The incorporation of such a rubbing member 110 into the insert 16 can be achieved by automatically attaching the IC chip 2 using a suction head. This may be done in the same way as it is dynamically stored in Insert 16 or it may be done manually. When the rubbing member 110 is automatically incorporated into the insulator 16, the rubbing member 110 may be housed in the customer tray KST similarly to the IC chip 2.

The insert 16 incorporating the rubbing member 110 as described above is attached to the socket 40, and in this state, the Z-axis drive device 70 is driven, and the drive shaft 78 and the drive plate 72 shown in FIG. Is moved down along the Z-axis direction, the pressing portion 74 of the drive plate 72 comes into contact with the upper surface of the adapter 62 of the match plate 60 and presses the pusher 30. Then, as shown in FIG. 14, the pressing element 31 of the pusher 30 presses the rubbing member 110 against the connection terminal 43 of the socket 40. The rough surface contacts the connection terminal 43 of the socket 40.

At this time, as shown in FIG. 15, the connection terminal 43 of the socket 40 moves downward and inside the opening 42 of the socket 40 while being urged upward by the panel. The roughened surface of the sandpaper 11 of 12 is corroded while moving on the connection terminal 43 of the socket 40. FIG. 15 (a) shows a state where the rubbing member 110 is in contact with the connection terminal 43 of the socket 40, and FIG. 15 (b) shows a state where the rubbing member 110 is in contact with the socket 40. This shows a state where the connection terminal 43 is pressed.

Here, as shown in FIG. 14, the downward movement of the pusher 30 is restricted by the pusher 30 abutting on the upper end of the stopper 22 of the insert 16. The strike of the pusher 30 is set according to the thickness T ₂ of the lead 2 a of the IC chip 2, but the thickness 1 of the rubbing member 110 is equal to the thickness T of the lead 2 a of the IC chip 2. ₂ and the rubbing member 110 is inserted into the insert 16 instead of the IC chip Even if the rubbing member is inserted, the pusher 30 can press the rubbing member 110 against the connection terminal 43 of the socket 40 with an appropriate pressure that does not destroy the connection terminal 43 of the socket 40.

By driving the Z-axis drive device 70 and moving the drive shaft 78 and the drive plate 72 upward, the pressing of the pusher 30 is released, and as shown in FIG. The connection terminal 43 can be returned to the original position. Such pushing and releasing of the pusher 30 is repeated an appropriate number of times, and the rubbing member 110 is brought into sliding contact with the connection terminal 43 of the socket 40 an appropriate number of times. Impurities such as an oxide film formed by the solder formed on 43 are removed, and the connection terminals 43 of the socket 40 can be cleaned.

The number of times pressing and releasing of the pusher 30 is repeated depends on the roughness of the sandpaper 111 of the rubbing member 110 and the degree of impurities such as oxide film formed on the connection terminal 43 of the socket 40. For example, if a rubbing member 110 of sandpaper 1 1 2 of about 30000 is used, pressing and releasing of the pusher 30 should be repeated about 5 times. Is preferred.

In the above description, the pushing of the pusher 30 was performed using the Z-axis driving device 70 of the IC test apparatus. However, the pushing of the pusher 30 by manual operation causes the socket 4 to be pushed as described above. The 0 connection terminal 43 can also be cleaned. Such manual cleaning should be performed in addition to, for example, performing calibration for correcting the propagation delay time due to variation in the length of the signal path between the connection terminals 43 of the socket 40. Can be.

[Second embodiment]

Next, a second embodiment of the present invention will be described. Figure 16 shows the second FIG. 17 is an exploded perspective view showing the structure near the socket in the test head of the IC test apparatus according to the embodiment, FIG. 17 is a cross-sectional view near the socket shown in FIG. 16, and FIG. FIG. 19 is a plan view and a side view showing a lapping member used in the IC test apparatus, and FIG. 20 is an exploded perspective view illustrating a state in which the rubbing member is incorporated into an insert. Fig. 21 is a cross-sectional view of the vicinity of the insert and the socket incorporating the rubbing member, Fig. 22 is a cross-sectional view showing the state where the pusher is lowered in Fig. 21, and Figs. 23 (a) and (b) are the sockets. FIG. 6 is a side view illustrating a state where the connection terminal is cleaned.

In the above-described first embodiment, a QFP-type IC chip is used for the test as the IC chip. However, in the second embodiment, a BGA-type IC chip is used as the IC chip for the test. Therefore, in the second embodiment, the overall IC test apparatus described in the first embodiment can be used, but the IC test apparatus has a test head near the socket in the test head. Since the structure and the structure of the pusher, insert, socket guide, and the like are different, the second embodiment will be described below focusing on these. Regardless of the difference between the embodiments, members and the like represented by the same name in the drawings may be given the same number.

As shown in FIGS. 17 to 19, the IC chip 2A to be tested in this embodiment has a plurality of external terminals 2c formed of solder poles provided on the lower surface of the rectangular package body 2b. It is a so-called BGA type IC chip.

As shown in FIGS. 16 to 18, a rectangular IC housing portion 19 for housing the IC chip 2A to be tested is formed in the center of the insert 16 for the IC chip 2A. The lower end of the IC housing section 19 is opened so that the external terminal 2c of the IC chip 2A is exposed, and the IC chip is formed around the opening. An IC holding section 195 for holding the loop 2A is provided.

On the other hand, as shown in FIG. 16, a socket port 50 is arranged above the test head 5, and a socket 40 having probe pins 44 as connection terminals is fixed thereon. It is. The probe pins 44 are provided in a number and a pitch corresponding to the external terminals 2c of the IC chip 2A, and are urged upward by a spring (not shown). .

As shown in FIGS. 16 to 18, the socket guide 41 is fixed on the socket pod 50 so that the probe pins 44 provided in the socket 40 are exposed. ing. On both sides of the socket guide 4 1, two guide pins 32 formed in the pusher 30 are inserted, and guide bushings 4 for positioning between the two guide bins 32 are provided. 1 1 is provided.

As shown in FIGS. 16 to 18, a pusher 31 for pressing the package body 2b of the IC chip 2A under test into the socket 40 faces downward in the center of the pusher 30. Guide pins 32 inserted into guide holes 20 of the inserts 16 and guide bushes 41 1 of the socket guides 41 are provided at both ends of the pusher 30. When the pusher 30 moves down with the Z-axis drive device 70 between the presser 31 and the guide pin 32, the pusher 30 contacts the stopper surface 4 1 2 of the socket guide 4 1 to lower the lower limit. A stopper pin 34 that can be specified is provided.

To connect the external terminals 2 c of the IC chip 2 A under test to the probe pins 44 of the socket 40, insert the IC chip 2 A into the IC housing 19 of the insert 16, as shown in Figure 17. While holding the periphery of the package body 2b of the IC chip 2A with the IC holding section 1995 and exposing the external terminals 2c of the IC chip 2A from the lower end opening of the IC housing section 19. . The insert 16 containing the IC chip 2A in this manner is attached to the socket guide 41, and in this state, the Z-axis driving device is driven to push the pusher.

Press 30. Then, the pusher 31 of the pusher 30 presses the package body 2b of the IC chip 2A into the socket 40 as shown in FIG. 18, and as a result, the external terminal 2c of the IC chip 2A Is connected to the socket pin 44 of the socket 40. At this time, the probe pin of socket 40

Although 44 retracts into the socket 40 while being biased upward, the tip of the probe pin 44 slightly penetrates the external terminal 2c. The downward movement of the pusher 30 is limited by the contact of the stopper pin 34 of the pusher 30 with the stopper surface 41 of the socket guide 41, and therefore, the package body 2b of the IC chip 2A is broken. With an appropriate pressure, the pusher 30 can press the IC chip 2A into the socket 40.

Here, the rubbing member used in the IC test device of the present embodiment will be described. As shown in FIG. 19, the rubbing member 120 used in the IC test apparatus of the present embodiment is made of a metal wool formed into a rectangular plate shape, and the IC holding portion of the insert 16 is provided on the periphery. A flange portion 121 that can be held at 195 is formed. The rubbing member 120 having such a structure can be manufactured at extremely low cost.

The thickness T ₃ of the rubbing member 120 is set substantially equal to the thickness Τ ₄ of the IC chip 2 も (including the external terminal 2 c), and the width of the lapping member 120 is also set. The length and the length are set substantially equal to the width and the length of the IC chip 2A.

As the metal wool constituting the rubbing member 120, impurities such as an oxide film due to solder formed on the tip of the probe pin 44 can be removed by piercing the tip of the probe pin 44 of the socket 40. What is necessary is just to select suitably. However, if the cleaning of the probe pins 44 of the socket 40 is performed automatically by the electronic component tester, the rubbing member 120 is picked up and picked up by the suction head. In order to reduce the air permeability of the rubbing member 120 to such an extent that the rubbing member 120 can be adsorbed, it is necessary to increase the density of the metal wool constituting the rubbing member 120.

To clean the probe pin 44 of the socket 40 using such a rubbing member 120, first, as shown in FIGS. 20 and 21, the rubbing member 1 20 is incorporated into IC storage section 19 of sensor 16. At this time, the rubbing member 120 is held by the IC holding portion 195 at the flange portion 121 thereof, and the bottom surface of the rubbing member 120 is exposed from the lower end opening of the IC housing portion 19. . The rubbing member 120 may be incorporated into the insert 16 in the same manner as when the IC chip 2A is automatically stored in the insert 16 using a suction head. It may be done by work. When the rubbing member 120 is automatically incorporated into the insulator 16, the rubbing member 120 may be stored in the customer tray KST similarly to the IC chip 2 A.

The insert 16 incorporating the rubbing member 120 as described above is attached to the socket guide 41, and the Z-axis driving device is driven in this state, and when the pusher 30 is pressed, the pusher 30 is pressed. At 31, as shown in FIG. 22, the rubbing member 120 is pressed against the probe pin 44 of the socket 40. As a result, the probe pin 44 of the socket 40 is retracted into the socket 40 while being urged upward, but the tip of the probe pin 44 is slightly moved as shown in FIG. It pierces the rubbing member 120. The probe pins 44 are polished with the metal wool constituting the rubbing member 120 by piercing the rubbing member 120. Becomes FIG. 23 (a) shows a state in which the rubbing member 120 is in contact with the opening pin 44 of the socket 40, and FIG. 23 (b) shows a state in which the rubbing member 120 has a socket. This shows a state where the 40 probe pin 44 is pierced. Here, the downward movement of the pusher 30 is limited by the stopper pin 34 of the pusher 30 abutting the stopper surface 4 12 of the socket guide 41. Stroke of the pusher 3 0 has been set according to the thickness T ₄ of the IC chip 2 A, the thickness T ₃ of the rubbing member 1 2 0 is set substantially equal to the thickness T ₄ of the IC chip 2 Alpha Therefore, even when the rubbing member 120 is incorporated into the insert 16 instead of the IC chip 2 Α, the pusher 30 has an appropriate pressure that does not destroy the rubbing member 120, and 120 can be pressed against probe pin 44 of socket 40.

By driving the Z-axis driving device, the pressing of the pusher 30 is released, and the probe pin 44 of the socket 40 can be returned to the original position as shown in FIG. The push and release of the pusher 30 is repeated an appropriate number of times, and the probe pin 44 of the socket 40 is pierced the rubbing member 120 an appropriate number of times to form the probe pin 44 of the socket 40. The probe pins 44 of the socket 40 can be cleaned by removing impurities such as an oxide film formed by the solder.

The number of times the pusher 30 is pressed and released is appropriately changed according to the polishing ability of the metal wool constituting the rubbing member 120 and the degree of impurities such as an oxide film formed on the probe pins 44 of the socket 40. do it.

In the above description, the pushing of the pusher 30 was performed using the Z-axis driving device of the IC test apparatus. However, the pushing of the pusher 30 by manual operation makes the socket 40 as described above. Clean the probe pins 4 4 You can also. This manual operation is particularly effective when the rubbing member 120 cannot be sucked by the suction head.

[Other embodiments]

The embodiments described above are described for facilitating the understanding of the present invention, but are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the lapping member 110 in the first embodiment may be made of a metal plate, a glass plate, a ceramic plate, or the like whose surface is roughened by sandblasting or the like, or may be formed by spraying particles on the metal plate. Alternatively, it may be formed by vapor deposition. Further, the rubbing member 120 in the second embodiment may be formed by molding a knitted or woven metal thin wire.

Further, the IC test apparatus is not limited to the chamber type described in the above embodiment, and may be, for example, a chamberless type or a heat plate type. Industrial applicability

As described above, according to the socket connection terminal cleaning kit, the socket connection terminal cleaning method, or the electronic component test apparatus of the present invention, the socket connection terminal can be connected without damaging the socket connection terminal. It can be easily cleared. That is, the socket connection terminal cleaning kit, the socket connection terminal cleaning method, or the electronic component test apparatus of the present invention is useful for cleaning connection terminals of a socket.

Claims

The scope of the claims

1. A socket provided with a connection terminal that can come into contact with the connection terminal of the electronic component or a socket or a guide of the socket so as to be detachably mounted and house the electronic component so that the connection terminal of the electronic component to be tested is exposed. With the teacher who

A pusher for pressing the connection terminal of the electronic component against the connection terminal of the socket with a prescribed stroke;

A rubbing member that is housed in the insert instead of the electronic component and that can contact the connection terminal of the socket in that state, at least a surface of the rubbing member that contacts the connection terminal of the socket is roughened. The thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the busher and the connection terminal of the socket. With the rubbing member set identically

A socket connection terminal cleaning kit comprising:

2. The rubbing member has a thickness substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket, and at least one surface is roughened. 2. The socket connection terminal according to claim 1, wherein the width and the length of the rubbing member are set to be substantially the same as the width and the length of the electronic component. Wing kit.

3. A socket with a probe-like connection terminal and an insert which is detachably mounted on the guide of the Z or the socket and houses the electronic component so as to expose the connection terminal of the electronic component to be tested.

A pusher for pressing an electronic component against the socket with a prescribed stroke; A rubbing member which is housed in the insert instead of the electronic component and in which a connection terminal of the socket can pierce, and at least a portion pierced by the connection terminal of the socket becomes an abrasive fiber assembly. And a rubbing member having a thickness substantially equal to the thickness of the electronic component.

4. The rubbing member is a polished fiber aggregate having a thickness substantially equal to the thickness of the electronic component, and the width and length of the rubbing member are set to be substantially the same as the width and length of the electronic component. 4. The socket connection terminal cleaning kit according to claim 3, wherein:

5. The thickness of the portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is set to be substantially the same as the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. A rubbing member having a rough surface at least in contact with the connection terminal of the socket is housed in an insert instead of an electronic component,

The insert containing the rubbing member is detachably attached to the socket and the guide of the Z or the socket,

Using a pusher driving device installed in an electronic component tester, or manually, the pusher is pressed against the connection terminal side of the socket one or more times with a prescribed stroke, and the rubbing member is pushed into the socket. Contact the connection terminal of

A method of cleaning a socket connection terminal.

6. A rubbing member having a thickness substantially equal to the thickness of the electronic component and at least a portion where the probe-like connection terminal of the socket pierces is a polished fiber aggregate is stored in the insert instead of the electronic component,

Attaching the insert containing the rubbing member to the socket and / or the guide of the socket so as to be detachable, Using a pusher driving device installed in an electronic component test device, or manually, the pusher is pressed against the connection terminal side of the socket one or more times with a prescribed stroke, and the rubbing member is pressed against the rubbing member. Puncture the socket connection terminal

A method for cleaning a socket connection terminal, characterized in that:

7. A socket provided with a connection terminal capable of contacting a connection terminal of an electronic component, and detachably mounted on the socket and / or a guide of the socket to expose the connection terminal of the electronic component to be tested. As described above, an insulator for storing the electronic component,

A pusher that presses the connection terminal of the electronic component against the connection terminal of the socket with a specified stroke;

A pusher driving device for driving the pusher;

A rubbing member that is housed in the insert instead of the electronic component and that can contact the connection terminal of the socket in that state, and the surface of the rubbing member that contacts the connection terminal of the socket is roughened. The thickness of a portion sandwiched between the pressing surface of the pusher and the connection terminal of the socket is set substantially equal to the thickness of the connection terminal of the electronic component sandwiched between the pressing surface of the pusher and the connection terminal of the socket. Said rubbing member and

An electronic component test apparatus comprising:

8. A socket with a probe-like connection terminal,

An inserter detachably mounted on the socket and / or the guide of the socket and housing the electronic component to be tested so that connection terminals of the electronic component to be tested are exposed;

A pusher for pressing an electronic component against the socket with a prescribed stroke;

A pusher driving device for driving the pusher; A rubbing member which is housed in the insert instead of the electronic component and in which the connection terminal of the socket can pierce, and at least a portion pierced by the connection terminal of the socket becomes an abrasive fiber aggregate. And a rubbing member having a thickness substantially equal to the thickness of the electronic component.