KR101442704B1 - Insert socket for semiconductor component inspection - Google Patents

Insert socket for semiconductor component inspection Download PDF

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Publication number
KR101442704B1
KR101442704B1 KR1020130126484A KR20130126484A KR101442704B1 KR 101442704 B1 KR101442704 B1 KR 101442704B1 KR 1020130126484 A KR1020130126484 A KR 1020130126484A KR 20130126484 A KR20130126484 A KR 20130126484A KR 101442704 B1 KR101442704 B1 KR 101442704B1
Authority
KR
South Korea
Prior art keywords
lever
uni
latch
carrier
fastening
Prior art date
Application number
KR1020130126484A
Other languages
Korean (ko)
Inventor
이성복
Original Assignee
주식회사 하나엔-텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하나엔-텍 filed Critical 주식회사 하나엔-텍
Priority to KR1020130126484A priority Critical patent/KR101442704B1/en
Application granted granted Critical
Publication of KR101442704B1 publication Critical patent/KR101442704B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G01R31/2603—Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to an insert socket for testing semiconductor chips and, more specifically, to an insert socket for testing semiconductor chips capable of: firmly pressing semiconductor elements placed on a uni-carrier using a latch member which comprises a first latch and a second latch and can be folded; enabling successful testing of the semiconductor elements by adding a shock absorbing member which absorbs shocks of the uni-carrier; and preventing separation of the elements during the testing or movement for accurate examination. The present invention includes: a main body which has a storage unit to insert a uni-carrier into the center, lever mounting units installed on both ends of the storage unit, an installation groove to fix a locking member on the bottom surface of the lever mounting units, and a mounting groove to install a latch member to fix the uni-carrier at one side; a lever member which is combined to the lever mounting units in a single unit; the locking member which controls the operation of the lever member by being mounted in the lower part of the lever member; the latch member which fixes or releases the uni-carrier stored in the storage unit; a shock absorbing member which absorbs shocks applied to the uni-carrier; and the uni-carrier which is stored in the storage unit formed in the main body.

Description

[0001] The present invention relates to an insert socket for semiconductor device inspection,

[0001] The present invention relates to an insert socket for inspecting semiconductor devices, and more particularly, to an insert socket for inspecting a semiconductor device, in which a semiconductor element which is seated on a unicarrier is rigidly pressed using a lever member formed by a first lever and a second lever, Absorbing member for absorbing the impact and vibration of the semiconductor element so as to allow a normal test of the semiconductor element to be carried out while preventing the semiconductor element from being removed during inspection or transportation.

The insert socket is used for placing a semiconductor device on a tray for inspecting the semiconductor device. The insert socket is used for stably mounting the semiconductor device inside the socket and performing a normal test by the handler.

A schematic structure of a conventional insert socket 200 having such a function is as shown in Figs. 11 and 12. Fig.

The lever 215 is mounted on both sides of the receiving portion 212 provided at the center of the main body 210 by the hinge pin 213 to mount the semiconductor device 230 thereon.

A burden 219 having a coil spring 218 coupled to the upper portion of the lever 215 is provided on the upper surface of the lever 215 to prevent the lever 215 from being opened due to impact or vibration. The lever 215 is actuated by the elasticity of the coil spring 218 attached to the upper surface of the burden 222 and presses the semiconductor element 230 so that a stable inspection is performed by the handler.

In the conventional insert socket 200 having the above structure, the length of the lever 215 for pressing the semiconductor element 230 is short and the elasticity applied to the lever 215 is weak, So that the semiconductor device and the insert socket are damaged as well as the accurate inspection is not performed.

Patent Registration No. 0702587

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a semiconductor device in which a lever is folded to secure a wide surface for pressing a semiconductor element, The present invention provides a socket for inspecting a semiconductor device.

It is another object of the present invention to provide an insert socket for inspecting a semiconductor device, which further includes a locking member for controlling the lever member so as to ensure stable operation of the lever.

It is still another object of the present invention to provide an insert socket for inspecting a semiconductor device, which further comprises an impact absorbing member and is capable of preventing an external deviation of the semiconductor device due to an external impact applied to the unicarrier during transportation.

In order to accomplish the above object, the entire construction of the present invention is characterized in that a housing portion for inserting a unicarrier is formed at the center, a lever mounting portion provided on both sides of the housing portion, A main body having a mounting groove for mounting a latch member for fixing the unicarear to one side thereof; A lever member integrally coupled to the lever mounting portion; A locking member mounted on a lower portion of the lever member to control its operation; A latch member for fixing and releasing a uni-carrier which is seated in the receiving portion; An impact absorbing member for absorbing an impact applied to the unicarrier; And a uni-carrier which is seated in a receiving portion formed in the main body.

The lever member coupled to the lever mounting portion includes a fastening piece for fastening the second lever to the pin, a fastening protrusion for fastening the first torsion spring, and a fastening groove for fastening and detaching the rocker in the transverse direction; A second lever fixed to the fastening piece formed on the first lever by a pin; And a second torsion spring attached to one side of the second lever for imparting tension thereto.

The locking member for controlling the operation of the lever member includes an insertion groove into which a spring is inserted, a tapered portion formed on an outer surface of the locking member, and a support piece coupled to and separated from a coupling groove provided on the first lever, And is mounted laterally in an installation groove formed in the bottom surface of the housing.

And the latch member pressing the unicarrier comprises: a latch; And a torsion spring coupled to a protrusion attached to an outer surface of the latch, and is coupled to a mounting groove formed in the main body by a pin.

The shock absorbing member may include a head portion for supporting a bottom surface of the unicarrier; A tension pin including a support piece which is cut in half and is split in half so that an end of the support piece is formed with a catching jaw; And a torsion spring coupled to the support piece to impart elasticity thereto.

As described above, according to the present invention, the folded lever member can firmly fix the upper surface of the semiconductor chip element while the operation of the lever member is controlled by the locking member, so that the impact applied by the external shock or vibration can be absorbed, The present invention is a useful invention that can stably support a uni-carrier on which a semiconductor element is mounted by a member, thereby preventing a semiconductor element from being detached or an error from occurring during inspection of the semiconductor element.

1 is an exploded perspective view illustrating the overall configuration of the present invention.
Fig. 2 is a perspective view showing a state in which the present invention is combined.
Fig. 3 is a perspective view
4 is a vertical cross-sectional view illustrating the configuration of the present invention
5 is a cross-sectional view illustrating the configuration of the hook member constituting the present invention
6 is a cross-sectional view illustrating a configuration of a locking member constituting the present invention
7 to 10 are views illustrating an operating state of the present invention,
Figs. 7 (a) and 7 (b) are cross-sectional views
8 (a) and 8 (b) are cross-sectional views of the state in which the lever member is folded
9 (a) and 9 (b) are cross-sectional views illustrating a state in which the lever member is widened
10 (a) and 10 (b) are cross-sectional views illustrating a state in which the lever member is lowered to press the semiconductor element
11 is a perspective view illustrating a state of a conventional insert socket;
12 is a longitudinal sectional view of a conventional insert socket

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a bottom perspective view of the present invention, FIG. 4 is a longitudinal sectional view illustrating the constitutional state of the present invention, and FIG. 5 is a cross-sectional view illustrating a configuration of a hook member constituting the present invention, and Fig. 6 is a cross-sectional view illustrating a configuration of a locking member constituting the present invention.

1 and 2, the insert socket 100 according to the present invention includes a main body 10, a lever member 20 which is integrally coupled to the main body 10 and presses the semiconductor element 70 A locking member 30 for controlling the operation of the lever member 20 and an upper surface of a unicarrier 60 seated in a receiving portion 2 formed at the center of the main body 10 A latch member 40, a shock absorbing member 50 for absorbing the swinging motion of the unicarrier 60 and a unicarrier 6 seated in a receiving portion 2 formed in the main body 10.

The main body 10 has a receiving portion 2 for receiving a unicarrier 60 at its center and a lever mounting portion 2 for engaging a lever member 20, (4).

A mounting groove 8 for coupling the locking member 30 is formed on the bottom surface of the lever mounting portion 4.

A mounting groove 6 is formed at one side of the lever mounting portion 4 to receive the latching member 40 and the shock absorbing member 50.

The lever member 20 coupled to the lever mounting portion 4 constituting the main body 10 includes a first lever 12, a second lever 14, a first lever 12 and a second lever 14 and a second torsion spring 16. The first torsion spring 15 and the second torsion spring 16 apply elasticity to the first torsion spring 14 and the second torsion spring 16, respectively.

More specifically, the first lever 12 includes a fastening piece 12a for fastening the second lever 14 using the pin 11 and a fastening piece 12b for fastening the first lever 12 to an elasticity A fastening protrusion 12b for fixing the first torsion spring 15 to be provided and a fastening groove 12c for fastening and detaching the rocker 23 in the transverse direction are formed.

The second lever 14 integrally joined to the fastening piece 12a constituting the first lever 12 is provided with a crimping portion 14a for pushing the upper surface of the semiconductor element 70 on the front side, And a seating groove 14b for coupling the second torsion spring 16 is formed.

The inner end of the first torsion spring 15 for applying tension to the first lever 12 is supported on the upper surface of the first lever 12 and the other end is supported on the outer surface of the lever mounting portion 4 .

The second torsion spring 16 that applies elasticity to the second lever 14 is supported on the first lever 12 at the front side and supported at the other side by the second lever 14.

The locking member 30 for controlling the operation of the lever member 20 includes the locker 23 and the coil spring 26 and is fixed to the mounting groove 8 provided on the bottom surface of the main body 10 in the lateral direction will be.

The rocker 23 constituting the locking member 30 includes an insertion groove 21a for inserting the coil spring 26 and a head 21 having a tapered portion 21b formed on the outer surface thereof, And a support piece 22 which is elongated outwardly from the base 22 is integrally formed.

The support pieces 22 are engaged with and separated from the engagement grooves 12c provided laterally in the first lever 12 to control the operation of the lever member 20. [

The structure of the latch member 40 to be pressed on the upper portion in order to prevent the unicarrier 60 seated in the receiving portion 2 formed at the center of the main body 10 from coming off is provided with the latch 33 and the torsion spring 36 ).

The outer end of the latch 33 is formed with a compression piece 33a for supporting the upper surface of the unicarrier 60 and a torsion spring 36 is coupled to the protrusion 33b provided on the inner side of the latch 33, And one end of the torsion spring 36 is connected to the outer surface of the hook 33 and the other end of the torsion spring 36 is connected to the mounting groove 6 provided on the body 10 using the hinge pin 37. [ As shown in Fig.

The shock absorbing member 50 having a function of absorbing the up and down movement of the unicarrier 60 is composed of a tension pin 44 and a coil spring 48 coupled to the tension pin 44.

The tension pin 44 is composed of a head portion 42 protruding outward from a fastening hole 6a formed in a vertical line on the mounting groove 6 and a supporting piece 43 inserted into the fastening hole 6a, The support piece 43 is half-split in half and has an engagement protrusion 43a at its end.

In addition, the coil spring 48 coupled to the support piece 43 functions to absorb the shock applied from the outside, thereby stably maintaining the uni-carrier 60 in a fixed position.

The unicarrier 60 which is seated in the accommodating portion 2 constituting the main body 10 and on which the semiconductor element 70 is to be mounted is provided with a mounting portion 54 including the guide portion 52 and an outer diagonal line The flange portion 56 is integrally formed.

The mounting portion 56 constituting the unicarrier 60 is inserted into the accommodating portion 2 constituting the main body 10 and the flange portion 54 attached to the outside is inserted into the mounting groove 2 of the main body 10 6).

Hereinafter, the operation state of the present invention will be described with reference to the drawings.

First, the uni-carrier 60 and the semiconductor device 70 are coupled to each other and placed in a receptacle 2 provided in the main body 10 constituting the insert socket 100, as follows.

7 to 10, when the lever open plate 150 is raised from the lower portion of the insert socket 100 disposed on the tray, the lever lock 150, which is provided on both sides of the lever open plate 150, The locking member 30 is formed by the open protrusion 130 and the locker 23 aligned with the engaging groove 12c formed in the first lever 12 is moved to one side to release the lever member 20 do.

In this state, the lever open plate 150 continues to rise, and the lever open protrusion 140 pushes the bottom surface of the first lever 12 constituting the lever member 20 upward.

The first lever 12 constituting the lever member 20 which is moved upward by the lever open protrusion 140 is blocked by the stopper 57 attached to the unicarrier 60 so that the pin 11 The folding is completed as shown in Figs. 8 (a) and 8 (b).

When the lever member 20 is folded, the semiconductor device 70 moves to the upper portion of the insert socket 100 and descends to the lower portion of the unicarrier 60, so that the semiconductor device 70 stably stays without any interference.

When the lever open plate 150 is lowered in a state where the semiconductor element 70 is seated inside the unicarrier 60 as described above, the folded second lever 14 is retracted by the elasticity of the torsion spring 16 The first lever 12 and the second lever 14 return to the parallel state as illustrated in Fig.

When the lever open plate 150 is continuously lowered in a state in which the first lever 12 and the second lever 14 are kept in parallel with each other, the lever member 20 is moved downward as shown in FIG. 10 and the first lever 12 The upper surface of the semiconductor chip 70 is in a compressed state.

The semiconductor element 70 in which the first lever 12 constituting the lever member 20 is accommodated in the unicarear 60 maintains the state of being continuously compressed by the restoring force of the first torsion spring 15 .

At this time, the coil spring 48 coupled to the tension pin 44 supporting the unicarrier 60 maintains the balance of the force at the intermediate position of the restoring force to return to the original state, The locker 23 is released and can be operated only within a certain range.

When pushing the semiconductor element 70, the pusher (not shown) is gradually lowered from the upper portion to push the unicarrier 60 so that the semiconductor element 70 can be tested. It will be done.

The lever member 20 interlocks with the semiconductor element 70 to guide the semiconductor element 70 to be stably tested.

The semiconductor element 7 seated on the uni-carrier 6 is firmly pressed by the lever member 20 during the test of the semiconductor element 70 and the shock or vibration generated during the operation The shock absorbing member 50 can be relieved and stable inspection can be performed.

It should be understood that the present invention is not limited to the above-described embodiments of the present invention, but may be implemented by other structures for realizing functions corresponding to the configurations of the embodiments of the present invention. It should be apparent to those skilled in the art that the present invention can be readily implemented by those skilled in the art and it is also within the scope of the present invention.

10: main body 20: lever member 30: locking member 40: hook member
50: shock absorbing member 60: uni-carrier 70: semiconductor device 100: insert socket

Claims (5)

A lever mounting portion provided on both sides of the accommodating portion, a mounting groove for fixing the locking member on the bottom surface of the lever mounting portion, and a latch member for fixing the unicarrier on one side A main body having a mounting groove formed therein; A lever member integrally coupled to the lever mounting portion; A locking member mounted on a lower portion of the lever member to control its operation; A latch member for fixing and releasing a uni-carrier which is seated in the receiving portion; An impact absorbing member for absorbing an impact applied to the unicarrier; And a uni-carrier which is seated in a receiving portion formed in the main body. 2. The lever device according to claim 1, wherein the lever member coupled to the lever mounting portion includes a fastening piece for fastening the second lever with a pin, a fastening protrusion for fastening the first torsion spring, and a fastening groove for fastening and detaching the rocker in the lateral direction A first lever formed; A second lever fixed to the fastening piece formed on the first lever by a pin; And a second torsion spring that is attached to one side of the second lever and applies a tension thereto. 2. The locking device according to claim 1, wherein the locking member for controlling the operation of the lever member comprises an insertion groove into which a spring is inserted, a tapered portion formed on an outer surface of the locking member, Wherein the socket is mounted in a lateral direction in a mounting groove formed in a bottom surface of the main body. 2. The apparatus of claim 1, wherein the latch member for pressing the unicarear comprises: a latch; And a torsion spring coupled to a protrusion formed on an outer surface of the latch, and coupled to a mounting groove formed in the main body by a fin. The shock absorber according to claim 1, wherein the shock absorbing member comprises: a head portion supporting a bottom surface of the unicarrier; A tension pin including a support piece which is cut in half and is split in half so that an end of the support piece is formed with a catching jaw; And a torsion spring coupled to the support piece for imparting elasticity thereto.
KR1020130126484A 2013-10-23 2013-10-23 Insert socket for semiconductor component inspection KR101442704B1 (en)

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Application Number Priority Date Filing Date Title
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101457962B1 (en) * 2013-11-01 2014-11-05 주식회사 하나엔-텍 Insert socket for semiconductor component inspection
WO2016159548A1 (en) * 2015-04-03 2016-10-06 Leeno Industrial Inc. A test socket
KR20180076526A (en) * 2016-12-28 2018-07-06 주식회사 티에프이 One touch coupling type socket assembly for testing semiconductor package
KR102036202B1 (en) * 2018-10-26 2019-10-24 (주) 나노에이스 Support for inspection of semiconductor chips
KR102047252B1 (en) * 2018-12-06 2019-11-21 (주) 나노에이스 Support for inspection of semiconductor chips
KR102106093B1 (en) * 2019-12-12 2020-05-04 에이엠텍서비스 주식회사 Jig for fixing biopsy needle of ultrasonic probe
KR102190547B1 (en) * 2019-08-14 2020-12-14 주식회사 오킨스전자 Semiconductor device insert carrier

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156408A (en) 2000-11-20 2002-05-31 Advantest Corp Kit and method for cleaning socket connecting terminal, and electronic part tester
KR100639704B1 (en) 2005-09-30 2006-11-01 삼성전자주식회사 Insert for semiconductor package comprising latch possible independent motion
KR100702587B1 (en) 2005-04-16 2007-04-04 주식회사 대성엔지니어링 An insert apparatus with sliding latch for semiconductor test handler
KR100983395B1 (en) 2010-02-17 2010-09-20 이우교 A carrier module of a handler equipment to test a semiconductor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156408A (en) 2000-11-20 2002-05-31 Advantest Corp Kit and method for cleaning socket connecting terminal, and electronic part tester
KR100702587B1 (en) 2005-04-16 2007-04-04 주식회사 대성엔지니어링 An insert apparatus with sliding latch for semiconductor test handler
KR100639704B1 (en) 2005-09-30 2006-11-01 삼성전자주식회사 Insert for semiconductor package comprising latch possible independent motion
KR100983395B1 (en) 2010-02-17 2010-09-20 이우교 A carrier module of a handler equipment to test a semiconductor element

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101457962B1 (en) * 2013-11-01 2014-11-05 주식회사 하나엔-텍 Insert socket for semiconductor component inspection
WO2016159548A1 (en) * 2015-04-03 2016-10-06 Leeno Industrial Inc. A test socket
KR20180076526A (en) * 2016-12-28 2018-07-06 주식회사 티에프이 One touch coupling type socket assembly for testing semiconductor package
KR101886205B1 (en) 2016-12-28 2018-08-07 주식회사 티에프이 One touch coupling type socket assembly for testing semiconductor package
KR102036202B1 (en) * 2018-10-26 2019-10-24 (주) 나노에이스 Support for inspection of semiconductor chips
KR102047252B1 (en) * 2018-12-06 2019-11-21 (주) 나노에이스 Support for inspection of semiconductor chips
KR102190547B1 (en) * 2019-08-14 2020-12-14 주식회사 오킨스전자 Semiconductor device insert carrier
KR102106093B1 (en) * 2019-12-12 2020-05-04 에이엠텍서비스 주식회사 Jig for fixing biopsy needle of ultrasonic probe

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