KR100465372B1 - Carrier Module for Semiconductor Test Handler - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module for a semiconductor device test handler, in which a lead or a ball is positioned to the edge of the bottom of the device or a microminiaturized semiconductor device can be stably mounted to easily connect to a test socket of a test site. .

To this end, the present invention is a rectangular parallelepiped body and fixed to the test tray; An element access groove recessed in an upper portion of the body; A connection member installed at a lower portion of the element access groove, and having a semiconductor element seated thereon so that a ball or lead forming surface faces downward through the element access groove; Installed in the connecting member in the vertical direction, the upper end is connected to each ball or lead of the semiconductor element seated on the connecting member and the lower end is exposed to the outside of the lower surface of the body is connected to the terminal pin of the socket of the test site A plurality of connecting pins; Provided is a carrier module for a semiconductor device test handler including a fixing means for releasably fixing a semiconductor device mounted on the connection member.

Description

Carrier module for semiconductor device test handler

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module installed in a test tray in a handler for testing a semiconductor device, and in particular, a lead or ball is positioned up to the edge of the bottom of the device, or stably mounts a semiconductor device such as a miniaturized BGA type to a test site A carrier module for a semiconductor device test handler which can be easily connected to a test socket of the present invention.

In general, memory ICs or non-memory semiconductor devices and module ICs having them properly configured on a substrate are shipped after various tests after production.

The handler is a device used to automatically test the semiconductor device and the module as described above. In such a handler, a tray containing the semiconductor device to be tested by the operator is loaded into the loading stacker of the handler, and then the semiconductor of the loading stacker is loaded. Reattach the devices to a separate test tray, send a test tray equipped with these semiconductor devices to a test site, and conduct a predetermined test by electrically connecting the lead or ball portion of the semiconductor devices to the connector of the test socket. Then, it is common to perform the test by separating the semiconductor elements of the test tray and classifying and mounting them on the customer tray of the unloading stacker according to the test result.

1 and 2 of the accompanying drawings show a test tray for transferring a semiconductor device between processes in a handler as described above and a conventional carrier module mounted to the test tray, wherein the test tray 1 is a metal frame A plurality of carrier modules 2 on which semiconductor elements are mounted at 11 are arranged at regular intervals.

The carrier module 2 includes a device seating part 22 on which the semiconductor device D is mounted on a rectangular body 21, and the semiconductor device D is disposed on both sides of the device seating part 22. A pair of latches 23 for holding are provided.

Here, the latch 23 is opened and closed while pivoting up and down about a hinge axis (not shown) installed inside the body 21, and the latch 23 is formed on the device seat 22. The ball Db at both edges thereof is held.

In the conventional carrier module 2 as described above, as shown in FIG. 2, the semiconductor device D is mounted with the ball-forming surface facing upward. The test tray 1 in which the semiconductor device D is mounted is thus mounted. Is transferred to the test site of the handler, the index unit installed at the test site pushes the carrier module 2 toward the test socket, and the ball Db of the semiconductor element D is connected to the terminal pin of the socket (not shown). A test is performed by making a connection with the.

However, in the conventional carrier modules as described above, when the ball Db or the lead of the semiconductor device D is not formed in many, the latch 23 may sufficiently hold the semiconductor device D. As shown in the trend, when the ball or lead is distributed over the entire area of the bottom edge of the semiconductor element or when the semiconductor element is microminiature, since the portion that the latch 23 can hold is not sufficiently secured, There arises a problem that the semiconductor element cannot be mounted.

Accordingly, the present invention has been made to solve the above problems, and the semiconductor device is stably fixed even if the size of the semiconductor device is very small or a ball of the semiconductor device, in particular, a BGA type semiconductor device, is installed over the entire area of the edge of the device. In addition, it is an object of the present invention to provide a carrier module for a semiconductor device test handler which can easily connect the ball or lead of the semiconductor device to the test socket of the test site.

1 is a front view schematically showing the configuration of a test tray installed with a conventional carrier module

2 is a perspective view showing a conventional carrier module

3 is a perspective view showing a carrier module according to the present invention

4 is a plan view of the carrier module of FIG.

5 is a cross-sectional view taken along the line I-I of FIG.

6 is a cross-sectional view taken along the line II-II of FIG. 4.

7 is an enlarged view of a portion A of FIG.

8 is a cross-sectional view illustrating an operation of a carrier module according to the present invention, in which a semiconductor device is mounted on a carrier module.

9 is a cross-sectional view illustrating an operation of a carrier module according to the present invention, in which a semiconductor device is connected to a test socket terminal pin of a test site in a carrier module.

Explanation of symbols on the main parts of the drawings

1: test tray 200: carrier module

201: Body 202: Device Access Groove

204: holder 207: coil spring

210: device seating block 211: through hole

212: compression coil spring 214: fixed block

215: pogo pin D: semiconductor element

Db: ball

In order to achieve the above object, the present invention is a rectangular parallelepiped body fixed to the test tray; An element access groove recessed in an upper portion of the body; A connection member installed at a lower portion of the element access groove, and having a semiconductor element seated thereon so that a ball or lead forming surface faces downward through the element access groove; Installed in the connecting member in the vertical direction, the upper end is connected to each ball or lead of the semiconductor element seated on the connecting member and the lower end is exposed to the outside of the lower surface of the body is connected to the terminal pin of the socket of the test site A plurality of connecting pins; Provided is a carrier module for a semiconductor device test handler including a fixing means for releasably fixing a semiconductor device mounted on the connection member.

Hereinafter, exemplary embodiments of a carrier module for a semiconductor device test handler according to the present invention will be described in detail with reference to the accompanying drawings.

3 to 7 show the structure of a carrier module according to the present invention, the carrier module 200 of the present invention has a rectangular parallelepiped shape and a body 201 fixed to the test tray, the body of the 201 A device entrance groove 202 formed through the center of the upper surface, and a device seating block 210 installed on the lower portion of the device entrance groove 202 so as to be movable up and down and on which the semiconductor device D is mounted. And a fixed block 214 fixedly installed at the lower portion of the body 201 under the device mounting block 210 and between the fixed block 214 and the device mounting block 210. A plurality of compression coil springs 212 elastically supporting the element mounting block 210.

Guide grooves 203 are formed horizontally on both sides of the device access grooves 202 on the upper surface of the body 201, and semiconductor devices mounted on the device mounting blocks 210 are formed in each guide groove 203. A pair of holders 204 for fixedly supporting D) are movably installed.

In addition, the upper surface of the body 201 is formed so that the two support 206 is integrally protruded, the support 206 is ring-coiled coil spring 207 is coupled across, the coil spring 207 Is connected to an outer side of the holder 204 and elastically supports the holder 204.

The holder 204 is formed to be inclined at an inner upper portion, which is a device mounting block 210 through the device access groove 202 as the holder 204 naturally opens when the picker head picking up the semiconductor device from the upper side of the carrier module enters. In order to allow the semiconductor device (D) to be seated on or in or out of the semiconductor device (D) on the device seating block (210). The inner end of the holder 204 is formed to protrude toward the device mounting block 210 to support the top surface of the semiconductor device D seated on the device mounting block.

In addition, a horizontal long hole 205 is formed in the lower part of the holder 204, the stopper pin 208 for restricting the movement of the holder 204 is inserted and fixed to the long hole 205.

On the other hand, the through hole 211 is formed in a position corresponding to the ball (Db) or the lead of the semiconductor element (D) seated in the device mounting block 210, the fixed block 214, each through hole A plurality of pogo pins 215 (pogo pins) arranged to be inserted into the 211 is fixed, wherein the pogo pins 215 is a ball of the semiconductor element (D) whose upper end is seated on the upper end of the through hole (211) Adjacent to Db, the lower end of the pogo pin 215 is exposed to the outside through the lower surface of the fixing block 214.

8 and 9 illustrate an operation in which the semiconductor device D is mounted on the carrier module 200, and the semiconductor device D mounted on the carrier module 200 is connected to the test socket terminal pins 51 of the test site. 8 is a cross-sectional view illustrating an operation of the carrier module 200 with reference to FIGS. 8 and 9.

The semiconductor devices under test loaded on the loading stacker (not shown) of the handler are picked up by the picker robot and mounted on the carrier module 200 of the test tray 1 (see FIG. 1). Likewise, when the picker head 30 of the picker robot picking up the semiconductor device enters the upper side of the carrier module 200, the bottom edge of the picker head 30 contacts the inclined inner edge of each holder 204. 204 moves to the outside to open naturally, and in this state, the picker head 30 mounts the holding semiconductor element on the element mounting block 210. At this time, the semiconductor device (D) is mounted so that the ball forming surface toward the inside of the carrier module 200, that is toward the device seating block 210, the seated semiconductor device (D) is each ball (Db) The through holes 211 of the device mounting block 210 are positioned.

Subsequently, when the picker head 30 again exits the carrier module 200, the holder 204 returns to its original position by the action of the coil spring 207, and the inner end of the holder 204 is a semiconductor device D. ).

When the semiconductor devices D are all mounted on the carrier module 200 of the test tray 1, the test tray 1 is transferred to the test site by a separate tray transfer means provided in the handler.

When the test tray 1 is located at the test site, a separate pushing unit (not shown) pushes the carrier module body 201 toward the test socket 214 so that the bottom of the pogo pin 215 is connected to the end of the terminal pin 51. At the same time, as shown in FIG. 9, the pushing unit 40 enters the upper side of the semiconductor device D of the carrier module 200 to push the semiconductor device D toward the test socket 50.

Accordingly, the device seating block 210 on which the semiconductor device D is seated is pushed to the lower part of the body, and each ball Db of the semiconductor device D is connected to the upper end of each pogo pin 215, thereby performing a test. .

When the test is completed, the pushing unit 40 holding the semiconductor element D retreats and the connection between the pogo pin 215 and the terminal pin 51 of the test socket 50 is released, and the test tray 1 is Transferred to the front of the handler is performed to separate the semiconductor device (D) from the carrier module (200). Separation of the semiconductor device from the carrier module 200 may be performed by reversely performing the device mounting operation described above with reference to FIG. 8.

Meanwhile, in the above-described embodiment, the holder 204 is used to move laterally to fix the semiconductor element on the carrier module. However, since the ball forming surface of the semiconductor element is mounted in the carrier module inwardly, the above-described method is used. In addition to the holder structure of the embodiment may be used by configuring a fixing means having a structure similar or identical to the conventional latch described in FIG.

As described above, according to the present invention, the semiconductor device is mounted on the carrier module and is first connected to a connection pin such as a pogo pin embedded in the carrier module, and then the connection pin is connected to the terminal pin of the test socket to perform the test. Therefore, even when the ball of the semiconductor device is distributed over the edge or the size of the semiconductor device is very small, it is possible to stably fix the semiconductor device to the carrier module to perform the test.

Claims (6)

A body having an element access groove formed in a recess in an upper portion thereof and fixed to a test tray; It is installed to be movable up and down in the lower portion of the element access groove, the semiconductor element is seated so that the ball or lead forming surface is face down through the element access groove, and at a position corresponding to each ball or lead of the seated semiconductor element A device seating block having a plurality of through holes formed therein; A fixed block fixed to the lower part of the body from the lower portion of the device mounting block; A plurality of first elastic members installed between the fixed block and the element mounting block to elastically support the element mounting block with respect to the fixed block; The fixing block is fixed to be inserted into each through hole of the device mounting block, and the lower end is exposed to the lower part of the fixing block, and the upper end is connected to the ball or lead of the semiconductor device seated on the device mounting block, and the lower end is tested. A plurality of pogo pins connected to the terminal pins of the socket of the site; A horizontal guide groove formed in communication with both side portions of the device access grooves, and slidably movable in both directions along the guide grooves, and having an inner end protruding from the semiconductor device mounted on the device mounting block; And a holder adapted to support the upper surface of the second elastic member, a second elastic member elastically supporting the holder, and a stopper for limiting the movement position of the holder, to release the semiconductor element mounted on the device mounting block. Carrier module for a semiconductor device test handler comprising a fixing means for fixing. delete delete According to claim 1, A plurality of supports protruding upwards on the upper body is formed to face each other, The second elastic member is a ring-shaped coil spring is supported across the respective support, the coil spring is And a carrier module configured to elastically support the holder while being in contact with a portion of the holder. delete delete