KR102658477B1 - Apparatus for testing semiconductor package - Google Patents

Abstract

A semiconductor package testing device is disclosed. The device includes a socket board connected to a test board for testing a semiconductor package, an insert socket elastically supported so as to be movable in a vertical direction on the socket board and having an opening into which the semiconductor package is inserted, and the socket board. A connection part disposed on the top, extending inside the opening and electrically connecting the semiconductor package inserted into the opening and the test board, pressurizes the insert socket to move downward, and presses the insert socket to move the semiconductor package inserted into the opening to the It includes a pushing plate that adheres to the connection part.

Description

Semiconductor package testing device {Apparatus for testing semiconductor package}

Embodiments of the present invention relate to a semiconductor package testing device. More specifically, it relates to a device for electrically connecting to a semiconductor package and inspecting the electrical characteristics of the semiconductor package.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as above are packaged into semiconductor packages through a dicing process, bonding process, and packaging process. can be manufactured.

Semiconductor packages manufactured as described above may be determined to be good or defective through electrical characteristic testing. A test handler that handles the semiconductor packages and a tester that inspects the semiconductor packages may be used to inspect the electrical characteristics.

In the case of the electrical characteristics test, the test process can be performed after storing the semiconductor package in an insert assembly mounted on a test tray and electrically connecting the external connection terminals of the semiconductor package stored in the insert assembly with the tester. there is.

The insert assembly may have a pocket in which the semiconductor package is stored, and the tester may be equipped with connection terminals such as pogo pins or probe pins for connection to external connection terminals of the semiconductor package, for example, solder balls. Can contain sockets. Additionally, the insert assembly may include latches to prevent the semiconductor package stored in the pocket from being separated.

As an example, Republic of Korea Patent Publication No. 10-1535245 discloses an insert assembly including an insert body having an opening into which a semiconductor package is inserted, and a support member in the form of a film attached to a lower part of the insert body and supporting the semiconductor package. is disclosed.

In the case of the test handler as described above, when the type of semiconductor package to be tested is changed, the insert assembly and test tray, the test socket coupled with the insert assembly, the high-fix board coupled with the test socket, and the semiconductor package It is necessary to replace a significant number of parts, such as a match plate with a pusher for tight contact with the test socket. As a result, the time required to prepare the test process may increase, thereby increasing the manufacturing cost of the semiconductor package.

The purpose of embodiments of the present invention is to provide a semiconductor package test device that can reduce the manufacturing cost of the semiconductor package by reducing the number of parts that need to be replaced.

A semiconductor package test device according to an aspect of the present invention for achieving the above object includes a socket board connected to a test board for testing a semiconductor package, and elastically supported so as to be movable in the vertical direction on the socket board. An insert socket having an opening into which a semiconductor package is inserted, a connection part disposed on the socket board, extending inside the opening and electrically connecting the semiconductor package inserted into the opening and the test board, and the insert socket. It may include a pushing plate that pressurizes and moves downward and brings the semiconductor package inserted into the opening into close contact with the connection portion.

According to embodiments of the present invention, the connection portion is disposed on the socket board, extends inside the opening, and includes a support member, and a test socket disposed on the support member for connection to the semiconductor package. You can.

According to embodiments of the present invention, the test socket may have a plurality of connection terminals for connection to the semiconductor package.

According to embodiments of the present invention, an alignment member for aligning the semiconductor package may be disposed on the connection part.

According to embodiments of the present invention, the alignment member has a film shape and may have alignment holes or openings into which external connection terminals of the semiconductor package are inserted.

According to embodiments of the present invention, a guide pin may be provided on the socket board to guide vertical movement of the insert socket, and the insert socket may be provided with a guide hole into which the guide pin is inserted.

A semiconductor package testing device according to another aspect of the present invention for achieving the above object includes a socket board connected to a test board for testing a semiconductor package, and elastically supported so as to be movable in the vertical direction on the socket board. an insert socket having an opening into which a semiconductor package is inserted, a connection portion disposed on the socket board, extending inside the opening, and having connection terminals for electrically connecting the semiconductor package inserted into the opening and the test board; an alignment member disposed on the connection unit and for aligning the external connection terminals of the semiconductor package and the connection terminals of the connection unit with each other, pressing the insert socket to move it downward, and moving the insert socket downward to cause the insert socket to It may include a pushing plate that presses the upper exposed semiconductor package downward so that the external connection terminals of the semiconductor package come into close contact with the connection terminals of the connection unit.

According to embodiments of the present invention, the connection portion is disposed on the socket board, extends inside the opening, and includes a support member, and a test socket disposed on the support member for connection to the semiconductor package. You can. At this time, second support members for supporting the alignment member may be disposed on edge portions of the support member, and the insert socket may be provided with second openings into which the second support members are inserted.

According to embodiments of the present invention, latches for opening and closing the opening may be disposed on both sides of the connection portion, and the insert socket may be provided with third openings into which the latches are inserted.

According to embodiments of the present invention, the pushing plate may be provided with fourth openings for receiving the latches that protrude toward the top of the insert socket as the insert socket moves downward.

According to the embodiments of the present invention as described above, the semiconductor package test device includes a socket board connected to a test board for testing the semiconductor package, and elastically supported so as to be movable in the vertical direction on the socket board. An insert socket having an opening into which a semiconductor package is inserted, a connection part disposed on the socket board, extending inside the opening and electrically connecting the semiconductor package inserted into the opening and the test board, and the insert socket. It may include a pushing plate that pressurizes and moves downward and brings the semiconductor package inserted into the opening into close contact with the connection portion.

Therefore, unlike the prior art, a test tray with an insert assembly is not required, and a pushing plate with a flat lower surface can be commonly used for various semiconductor packages instead of a match plate with a pusher, so the match plate No plate replacement is required. As a result, the hassle and cost of providing test trays and match plates for different types of semiconductor packages can be greatly reduced.

1 is a schematic configuration diagram illustrating a semiconductor package testing device according to an embodiment of the present invention.
FIG. 2 is a schematic enlarged front view for explaining the connection part shown in FIG. 1.
FIG. 3 is a schematic enlarged plan view for explaining the alignment member shown in FIG. 2.
FIG. 4 is a schematic enlarged plan view for explaining the support member and guide member shown in FIG. 2.
5 to 7 are schematic plan views for explaining another example of the alignment member shown in FIG. 3.
Figure 8 is a schematic plan view for explaining the insert socket shown in Figure 1.
FIG. 9 is a schematic plan view for explaining the socket board shown in FIG. 1.
FIG. 10 is a schematic diagram illustrating a semiconductor package transfer device for storing a semiconductor package in the opening shown in FIG. 1 .
FIG. 11 is a schematic bottom view for explaining the pushing plate shown in FIG. 1.
12 and 13 are schematic diagrams for explaining a method of electrically testing a semiconductor package using the semiconductor package test device shown in FIG. 1.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

1 is a schematic configuration diagram illustrating a semiconductor package testing device according to an embodiment of the present invention.

Referring to FIG. 1, the semiconductor package test apparatus 100 according to an embodiment of the present invention applies an electrical signal to the semiconductor package 10 and analyzes the output signal from the semiconductor package 10 to test the semiconductor package. It can be used to check the electrical characteristics of (10).

According to one embodiment of the present invention, the semiconductor package test device 100 includes a socket board 110 connected to a test board (not shown) for testing the semiconductor package 10, and a socket board 110 on the socket board 110. An insert socket 120 is elastically supported so as to be movable in a vertical direction and has an opening 122 into which the semiconductor package 10 is inserted, and is disposed on the socket board 110 and inside the opening 122. It extends to the connection part 130 for connection with the semiconductor package 10, and the insert socket 120 is pressed and moved downward, and the semiconductor package 10 inserted into the opening 122 is connected to the connection part 130. ) may include a pushing plate 160 that is in close contact with the.

Although not shown, the socket board 110 may be mounted on an interface board (not shown), and the interface board may be connected to the test board through a cable, connector, etc. In addition, although one socket board 110 is shown in FIG. 1, a plurality of socket boards 110 may be disposed on the interface board, through which simultaneous testing of a plurality of semiconductor packages 10 can be performed. You can.

An elastic member 112 such as a coil spring may be disposed between the socket board 110 and the insert socket 120. The elastic member 112 may elastically support the insert socket 120 so that it can move in the vertical direction. Additionally, the semiconductor package test device 100 may be provided with a guide member for guiding the vertical movement of the insert socket 120. For example, guide pins 114 extending in a vertical direction may be provided on the socket board 110, and the insert socket 120 may be provided with guide holes 124 into which the guide pins 114 are inserted. It can be.

The opening 122 of the insert socket 120 may be formed in a vertical direction, and the semiconductor package 10 transferred by the semiconductor package transfer device 200 (see FIG. 10) may be inserted into the opening 122. there is. At this time, a connection portion 130 for connection to the semiconductor package 10 may be disposed within the opening 122. The connection portion 130 is disposed on the socket board 110 and on a pillar-shaped support member 132 extending into the opening 122 and on the support member 132 and the semiconductor package 10. It may include a test socket 134 for connection with.

The test socket 134 may have a plurality of connection terminals 136 (see FIG. 2) for connection to the semiconductor package 10. For example, the connection terminals 136 may be arranged to correspond to external connection terminals 12 (see FIG. 2) of the semiconductor package 10, for example, solder balls. Although not shown, the connection terminals 136 may be used for signal transmission between the test board, the interface board, and the semiconductor package 10. As an example, the test socket 134 is the connection terminal It may have a plurality of pogo pins or probe pins used as pins 136 . In addition, although not shown, a plurality of signal lines connected to the connection terminals 136 may be provided within the support member 132.

As another example, connection pads made of an elastic conductive rubber material may be used as the connection terminals 136. In this case, the test socket 134 may also be made of an elastic rubber material.

The pushing plate 160 can move the insert socket 120 downward by pressing it. At this time, the semiconductor package 10 stored in the opening 122 may be exposed to the upper part of the insert socket 120 by moving the insert socket 120 downward. The semiconductor package 10 may be pressed downward together with the insert socket 120 by the pushing plate 160. As a result, the external connection terminals 12 of the semiconductor package 10 can be in close contact with the connection terminals 136 of the test socket 132, thereby providing a stable signal through the connection terminals 136. Delivery can take place.

Although not shown, the pushing plate 160 may be configured to be movable in the vertical direction by a vertical driving unit (not shown). As an example, the vertical driving unit may move the pushing plate 160 in the vertical direction using a pneumatic cylinder, and elastic members for shock relief may be disposed between the pneumatic cylinder and the pushing plate 160. there is.

FIG. 2 is a schematic enlarged front view for explaining the connection part shown in FIG. 1, FIG. 3 is a schematic enlarged plan view for explaining the alignment member shown in FIG. 2, and FIG. 4 is a support member shown in FIG. 2 and This is a schematic enlarged plan view to explain the guide members.

Referring to FIGS. 2 to 4 , the support member 132 may have a substantially square pillar shape, and the test socket 134 may be disposed on the support member 132.

According to one embodiment of the present invention, an alignment member 140 for aligning the position of the semiconductor package 10 may be disposed on the connection portion 130. That is, the alignment member 140 connects the semiconductor package so that the external connection terminals 12 of the semiconductor package 10 inserted into the opening 122 correspond to the connection terminals 136 of the test socket 134. (10) can be sorted. For example, the alignment member 140 may have alignment holes 142 corresponding to the external connection terminals 12 of the semiconductor package 10.

The alignment member 140 may have a film shape and preferably has a thickness equal to or thinner than the height of the external connection terminals 12 of the semiconductor package 10. The alignment member 140 may be disposed on the test socket 134 or spaced a predetermined distance upward from the test socket 134 .

Meanwhile, second support members 138 for supporting the alignment member 140 may be disposed on edge portions of the support member 132, and the alignment member 140 may be formed on the second support members. (138) It can be placed on top. At this time, the upper surface of the second support members 138 may be configured to be equal to or higher than the connection terminals 136 of the test socket 134. In particular, when the external connection terminals 12 of the semiconductor package 10 are inserted into the alignment holes 142, the external connection terminals 12 of the semiconductor package 10 are connected to the test socket 134. The height of the second support members 138 may be adjusted to contact the connection terminals 136. Meanwhile, the alignment member 140 may be attached to the second support members 138 using adhesive or heat compression using an adhesive resin.

On the other hand, the second support members 138 may function as guide members for guiding the vertical movement of the insert socket 120. As shown, second support members 138 extending in the vertical direction are disposed at each of the four corners of the support member 132, but the positions and shapes of the second support members 138 are different from each other. Since various changes are possible, the scope of the present invention will not be limited by these.

5 to 7 are schematic plan views for explaining another example of the alignment member shown in FIG. 3.

As shown in FIG. 5 , an alignment member 144 having one opening 144A into which the external connection terminals 12 of the semiconductor package 10 are inserted may be used. Additionally, an alignment member 146 having a plurality of openings 146A having a slit shape as shown in FIG. 6 may be used. Additionally, as shown in FIG. 7, alignment members 148 may be used to guide the four corners of the semiconductor package 10.

FIG. 8 is a schematic plan view for explaining the insert socket shown in FIG. 1, and FIG. 9 is a schematic plan view for explaining the socket board shown in FIG. 1.

Referring to FIG. 8, the insert socket 120 may have an opening 122 into which the semiconductor package 10 is inserted. The connection part 130 can be inserted upward into the opening 122, and second openings 126 into which the second support members 138 are inserted are positioned at edges of the opening 122. ) may be provided. Additionally, guide holes 124 into which guide pins 114 on the socket board 110 are inserted may be provided.

1 and 9, the semiconductor package test device 100 includes latches 150 disposed on both sides of the connection portion 130 to open and close the opening 122 of the insert socket 120. It can be included. At this time, the position of the semiconductor package 10 stored in the opening 122 can be stably maintained by the latches 150. For example, pillar-shaped boss members 152 may be disposed on the socket board 110 to be located on both sides of the connection portion 130, and the latches 152 may be disposed on the boss members 152. ) can be rotatably mounted. In particular, although not shown in detail, the rotation axes of the latches 150 are provided with torsion springs (not shown) for downwardly pressing the semiconductor package 10 stored in the opening 122. ) can be installed.

Referring again to FIG. 8, the insert socket 120 may have third openings 128 into which the latches 150 and the boss members 152 are inserted. The third openings 128 may be connected to the opening 122 for operation of the latches 150 .

FIG. 10 is a schematic diagram illustrating a semiconductor package transfer device for storing a semiconductor package in the opening shown in FIG. 1 .

Referring to FIG. 10, the semiconductor package transfer device 200 includes a picker 210 for vacuum adsorbing the semiconductor package 10, a picker head 220 on which the picker 210 is mounted, and the latches 150. ) may be provided with latch open pins 230 for opening. In particular, the latch open pins 230 may extend vertically downward from the lower part of the picker head 220. Although not shown, the picker head 220 can be moved in the vertical and horizontal directions by a driving unit in the form of a Cartesian coordinate robot, and the semiconductor package 10 is moved to the insert socket 120 by the operation of the driving unit. It may be received within opening 122.

For example, the semiconductor package transfer device 200 may be lowered after being positioned on the upper part of the insert socket 120 by the driving unit, thereby allowing the semiconductor package 10 to move through the opening of the insert socket 120 ( 122). In particular, before the semiconductor package 10 is received in the opening 122, the latches 150 may be opened by the latch open pins 230.

Specifically, the latch open pins 230 may press down the rear ends of the latches 150, thereby allowing the front ends of the latches 150 to rotate upward. After the opening 122 of the insert socket 120 is opened by rotation of the latches 150, the semiconductor package 10 can be accommodated in the opening 122. Subsequently, the semiconductor package transfer device 200 may be raised and the opening 122 may be closed as the latches 150 return to their initial positions. At this time, the semiconductor package 10 stored in the opening 122 may be pressed down by the front end portion of the latches 150, thereby adjusting the position of the semiconductor package 10 within the opening 122. can be maintained stably.

FIG. 11 is a schematic bottom view for explaining the pushing plate shown in FIG. 1.

Referring to FIG. 11, the pushing plate 160 may have a flat lower surface, and the latches 150 protrude toward the top of the insert socket 120 when the insert socket 120 is pressed downward. It may have fourth openings 162 to accommodate. At this time, the semiconductor package 10 may be pressed downward by the central portion of the flat lower surface of the pushing plate 160 (the portion indicated by a dotted line).

In addition, the pushing plate 160 may be provided with second guide pins 164 as shown, and the insert socket 120 has second guide holes 129 into which the second guide pins 164 are inserted. ; see Figure 8) may be provided. However, the second guide pins 164 and second guide holes 129 are optional and can be omitted. This is because the pushing plate 160 has a flat lower surface and therefore does not require separate alignment with the insert socket 120.

12 and 13 are schematic diagrams for explaining a method of electrically testing a semiconductor package using the semiconductor package test device shown in FIG. 1.

Referring to FIG. 12 , after the semiconductor package 10 is received in the opening 122 by the semiconductor package transfer device 200, the pushing plate 160 may be moved downward. At this time, the semiconductor package 10 within the opening 122 can be aligned by the alignment member 140, whereby the external connection terminals 12 of the semiconductor package 10 are connected to the test socket 134. It may be located on the connection terminals 136.

Referring to FIG. 13, as the pushing plate 160 continues to descend, the insert socket 120 may descend together with the pushing plate 160, and thus the semiconductor package 10 may be relatively raised. You can.

In particular, the semiconductor package 10 may be exposed to the upper part of the insert socket 120 by lowering the pushing plate 160 and the insert socket 120. That is, the upper surface of the semiconductor package 10 may be in close contact with the lower surface of the pushing plate 160, whereby the semiconductor package 10 is connected to the pushing plate 160 together with the insert socket 120. It can be pressurized downward.

As a result, the external connection terminals 12 of the semiconductor package 10 may be in close contact with the connection terminals 136 of the test socket 134, whereby the semiconductor package 10 is connected to the test board and Can be electrically connected. The test board may apply test signals to the semiconductor package 10 through the connection terminals 136 of the test socket 134, and analyze output signals from the semiconductor package 10 to determine the semiconductor package 10. The electrical characteristics of (10) can be inspected.

Meanwhile, as the insert socket 120 is lowered, the boss members 152 and the latches 150 may protrude toward the upper part of the insert socket 120, and the protruding boss members 152 The upper portions of and the latches 150 may be inserted into the fourth openings 162 of the pushing plate 160.

According to the embodiments of the present invention as described above, the semiconductor package test device 10 includes a socket board 110 connected to a test board for testing the semiconductor package 10, and a socket board 110 on the socket board 110. An insert socket 120 is elastically supported so as to be movable in the vertical direction and has an opening 122 into which the semiconductor package 10 is inserted, and is disposed on the socket board 110 and inserted into the opening 122. A connecting portion 130 extends and electrically connects the semiconductor package 10 inserted into the opening 122 and the test board, and presses the insert socket 120 to move downward and open the opening 122. It may include a pushing plate 160 that brings the semiconductor package 10 inserted therein into close contact with the connection portion 130 .

Therefore, unlike the prior art, a test tray with an insert assembly is not required, and instead of a match plate with a pusher, a pushing plate 160 with a flat lower surface is used for various semiconductor packages 10. Since it can be used as a replacement, replacement of the match plate is not required. As a result, the hassle of providing test trays and match plates for different types of semiconductor packages 10 and the resulting costs can be greatly reduced.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: semiconductor package 12: external connection terminal
100: semiconductor package test device 110: socket board
112: elastic member 114: guide pin
120: insert socket 122: opening
124: Guide hole 126: Second opening
128: third opening 130: connection part
132: Support member 134: Test socket
136: Connection terminal 138: Second support member
140: Alignment member 142: Alignment hole
150: Latch 152: Boss member
160: Pushing plate 162: Fourth opening
200: semiconductor package transfer device 210: picker
220: Picker head 230: Latch open pin

Claims (15)

delete delete delete delete A socket board connected to a test board for testing semiconductor packages;
an insert socket disposed on the socket board and having an opening formed in a vertical direction for inserting the semiconductor package;
an elastic member disposed between the socket board and the insert socket and elastically supporting the insert socket so that the insert socket can move in a vertical direction;
a support member disposed on the socket board and extending into the opening of the insert socket;
a test socket disposed on the support member and having connection terminals for electrically connecting the semiconductor package inserted into the opening of the insert socket and the test board;
A film-shaped film disposed on the test socket and having alignment holes or alignment openings into which the external connection terminals of the semiconductor package are inserted to align the external connection terminals of the semiconductor package with the connection terminals of the test socket. lack of alignment;
a semiconductor package transfer unit for receiving the semiconductor package within an opening of the insert socket so that the semiconductor package is placed on the alignment member; and
It has a flat lower surface and is disposed on the upper part of the insert socket, and after the semiconductor package is stored in the opening of the insert socket by the semiconductor package transfer unit, the insert socket is pressed downward using the flat lower surface. The semiconductor package placed on the alignment member is exposed to the upper part of the insert socket by moving the insert socket downward, and the semiconductor package is pressed downward so that the external connection terminals of the semiconductor package are connected to the test socket. A semiconductor package test device comprising a pushing plate that is brought into close contact with the terminals. delete The method of claim 5, wherein second support members for supporting the alignment member are disposed at edge portions of the support member,
The insert socket is a semiconductor package test device characterized in that it has second openings formed in a vertical direction to insert the second support members. The method of claim 5, wherein latches for opening and closing the opening of the insert socket are disposed on both sides of the test socket, respectively,
The insert socket is a semiconductor package test device characterized in that it has third openings formed in a vertical direction into which the latches are inserted. The semiconductor package testing device of claim 8, wherein boss members on which the latches are rotatably mounted are disposed on the socket board to be inserted into the third openings. The semiconductor package testing device of claim 9, wherein torsion springs are mounted on the rotation axes of the latches to press the semiconductor package placed on the alignment member downward by the latches. delete The method of claim 10, wherein the semiconductor package transfer unit,
A picker for vacuum adsorbing the semiconductor package;
A picker head on which the picker is mounted;
a driving unit for moving the picker head in vertical and horizontal directions; and
A semiconductor package test device comprising latch open pins for opening the latches. The semiconductor package testing device of claim 10, wherein the pushing plate has fourth openings formed in a vertical direction to accommodate the latches that protrude upward from the insert socket as the insert socket moves downward. . delete The method of claim 5, wherein a guide pin is provided on the socket board to guide vertical movement of the insert socket,
A semiconductor package test device, characterized in that the insert socket is provided with a guide hole into which the guide pin is inserted.

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