KR102321728B1 - Test device for semiconductor package equipped with a guide module for preventing pinching - Google Patents

Abstract

The present invention relates to a semiconductor package test device equipped with a guide module for preventing pinching. More specifically, the present invention provides the semiconductor package test device for testing a semiconductor package, wherein the device is provided with a guide module for preventing jamming that can prevent a semiconductor package, which enters and exits an insert module, from being jammed to enhance test efficiency and prevent damage to the semiconductor package. To this end, the semiconductor package test device comprises: a pushing module for transport, which transports and delivers a semiconductor package, which is a test object; an insert module through which the semiconductor package can enter and exit, and which includes a rubber socket having an electrical wire which can be electrically connected to an external electrical wire, and an access block disposed above the rubber socket to guide entry and exit of the semiconductor package module; and a guide module which guides the semiconductor package to be drawn into a planned position when the semiconductor package is drawn into the rubber socket. The guide module comprises: a pressing block disposed on the pushing module for transport; a guide block is arranged to be movable in a horizontal direction toward the rubber socket and moving in the horizontal direction according to the elevation of the pressing block; and an elastic body elastically supporting the guide block toward the rubber socket. The present invention can prevent a semiconductor package from being jammed.

Description

Test device for semiconductor package equipped with a guide module for preventing pinching}

The present invention relates to a test apparatus for a semiconductor package provided with a guide module for preventing pinching, and more particularly, to provide a test apparatus for a semiconductor package for testing a semiconductor package, by preventing the semiconductor package from being caught in and out of an insert module. The present invention relates to a test apparatus for a semiconductor package provided with a guide module for preventing pinching capable of increasing test efficiency and preventing damage to the semiconductor package.

A wide variety of processes are carried out until the semiconductor package in the form of a finished product is manufactured. In brief, after designing a circuit and designing a process for implementing it, it is actually manufactured on a wafer and tested. The above process is repeated again reflecting the solution.

Here, in the process of testing the semiconductor package, a test socket on which the semiconductor package is mounted and a test jig on which the test socket is mounted to apply an electrical signal to the semiconductor package are required.

A conventional test socket includes a base plate in which test pins electrically connecting leads of a semiconductor package and a test jig are formed on all sides, and the test pins are integrally formed with the base plate on an upper surface of the base plate and face the test pins. It consists of a pin press formed with fixing pins for picking and fixing leads together with a top cover that is connected to a base plate and a guide rod to up/down the pin press so that the fixing pins and the test pins are spaced apart and in contact.

Here, the fixing pins have elastic force by bending several times from the upper surface of the pin press facing the test pin to the lower surface along the side surface. So, when the pusher installed in the handler presses the slope of the top cover and lowers the top cover toward the base plate, the pin press formed integrally with the base plate rises, and the fixing pins with elastic force retreat to the outside of the pin press by a predetermined length. Thus, a gap of a predetermined height is generated between the test pins and the fixing pins facing each other so that the leads of the semiconductor chip package can be inserted.

Then, the pusher force is removed from the top cover, the top cover is raised, the pin press is down, and the fixing pins that have been retreated to the outside of the pin press return to their original positions, and the test pins and the fixing pins hold the leads of the semiconductor package with a predetermined pressure. Pick it up and connect the test pins and leads to fix them.

However, as the pin press rises, the fixing pins are pulled back to the outside of the pin press, and when the pin press goes down, the fixing pins return to their original positions repeatedly. There was a problem that the life span was short because it was broken.

Meanwhile, in recent years, a semiconductor package mainly uses a fine spherical solder ball as an input/output terminal, and there is a ball grid array (BGA) semiconductor package as a representative example of a semiconductor package using a solder ball as an input/output terminal.

In order to test such a ball grid array semiconductor package, a plurality of solder balls provided in the ball grid array must be accurately placed on the test pin portion configured in the rubber socket, which is the test socket. There was a problem in that the semiconductor package was not unloaded due to interference with the rubber socket or the inner wall of the insert module on which the rubber socket was disposed when the terminal was unloaded after the test was completed because the terminal centers did not match.

In addition, when the pusher is pressed while the solder ball is in contact with the polyimide film constituting the printed circuit board of the rubber socket, the solder ball moves under the influence of the polyimide film, which causes the semiconductor package to move. There was a problem of jamming during unloading.

In addition, when the semiconductor package undergoes bending deformation, the length of the outer periphery of the semiconductor package is not constant, and the outer size is increased by the pressurization of the pusher after being drawn in, so that the insert module can be drawn in but cannot be pulled out.

Republic of Korea Patent Publication No. 10-2007-0080893 (2007.08.14., published) Republic of Korea Patent Registration No. 10-0894165 (2009.04.22., Announcement) Republic of Korea Registered Utility Model No. 20-0413804 (2006.04.11., Announcement) Republic of Korea Registered Utility Model No. 20-0428504 (2006.10.13., Announcement) Republic of Korea Patent Registration No. 10-1823116 (2018.03.14., Announcement)

The present invention has been proposed to solve the above problems, and a guide module for preventing the semiconductor package from being pinched is provided to prevent the semiconductor package from being pinched during loading and unloading of the insert module, so that a stable test is possible. An object of the present invention is to provide a test apparatus for a semiconductor package provided with a guide module for preventing pinching capable of increasing test efficiency.

In addition, the present invention is provided with a displacement means for ensuring the positional accuracy of the guide module to prevent the occurrence of positional displacement of the guide module during operation, and to quickly correct the positional displacement when the positional displacement occurs. The purpose is to provide a device.

In order to achieve the above object, the present invention

a pushing module for transporting and delivering a semiconductor package, which is a test object;

An insert including a rubber socket having an electrical wiring that allows the semiconductor package to enter and exit and which can be electrically connected to an external electrical wiring, and an entry and exit block disposed above the rubber socket to guide entry and exit of the semiconductor package module;

a guide module for guiding the semiconductor package to be drawn into a predetermined position when the semiconductor package is drawn into the rubber socket; and

The guide module is

a pressing block disposed on the pushing module for transport;

a guide block which is arranged to be movable in the horizontal direction toward the rubber socket and moves in the horizontal direction according to the elevation of the pressing block;

and an elastic body for elastically supporting the guide block toward the rubber socket.

In addition, the pressing block includes a top base and a pressing protrusion protruding downward from the top base, and is formed to be inclined to one side from the lower end of the pressing protrusion to gradually move in a horizontal direction according to a position where the guide block abuts. It is characterized in that it includes a pressing surface.

In addition, the guide block includes a bottom base and a contact protrusion that protrudes upward from the upper surface of the bottom base to abut the pressing block and has a contact surface formed with one end inclined to one side, and the bottom base is mutually at one end. A pair of entry guide surfaces that are spaced apart and formed to have the same inclination angle as the entry surface of the rubber socket, are bent at right angles at the lower end of the entry guide surface, and are disposed at a relatively high position compared to the bottom surface of the bottom base. It is characterized in that it includes a fixing surface for fixing the side end of the rubber socket in contact with the retracted side end, and an elastic chain inlet formed at the other end of the bottom base and into which one end of the elastic body is introduced.

Further, the guide module is further provided with a displacement means for adjusting the position of the pressing block, wherein the displacement means is formed vertically downward from the upper surface of the pushing module for transport, and a lifting hole formed with an ascending and descending screw thread on an inner circumferential surface; A moving long hole formed in communication with the elevating hole in the horizontal direction, a hemispherical displacement block disposed to protrude outward from one end of the pressing block and movably disposed in the moving elongated hole, and formed on the inner circumferential surface of the elevating hole It characterized in that it includes a displacement bolt that is movably engaged with the elevating screw thread and abuts against the displacement block, and a displacement elastic body for elastically supporting the pressing block toward the displacement bolt.

At this time, the displacement bolt is characterized in that it is composed of a moving surface formed with a moving screw thread engaged with the elevating screw thread, and a push surface made of a wedge shape that is in contact with the displacement block but gradually narrows toward the lower end.

According to the present invention made as described above, it is possible to prevent the semiconductor package from being caught in the insert module, thereby preventing a malfunction during loading or unloading, thereby increasing the test efficiency of the semiconductor package and improving the speed of the test. there is an effect

In addition, the present invention prevents the position displacement of the guide module, and when the position displacement of the guide module occurs during operation, it can be quickly corrected. It has the effect of shortening the time required.

1 is an exemplary view showing a test apparatus for a semiconductor package provided with a guide module for preventing pinching according to the present invention.
Figure 2 is an exemplary view showing a pushing module for transport constituting the present invention.
Figure 3 is an exemplary view showing an insert module constituting the present invention.
Figure 4 is an exemplary view showing a guide module constituting the present invention.
5 to 7 are state diagrams showing the operating state of the guide module constituting the present invention.
8 and 9 are state diagrams showing the displacement means constituting the present invention and the operating state of the displacement means.

Hereinafter, in addition to the above objects, other objects and features of the present invention will become apparent through the description of the embodiments with reference to the accompanying drawings.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, a preferred embodiment of a test apparatus for a semiconductor package provided with a guide module for preventing pinching according to the present invention will be described with reference to the accompanying drawings.

First, the test apparatus 1 for a semiconductor package provided with a guide module for preventing pinching according to the present invention, as shown in FIGS. and a rubber socket 23 having an electrical wiring that can be accessed and electrically connected to an external electrical wiring, and is disposed above the rubber socket 23 to allow the semiconductor package to enter and exit the semiconductor package. It includes an insert module 20 including an access block 25 for guiding and a guide module 30 for guiding the semiconductor package to be drawn into a predetermined position when the semiconductor package is drawn into the rubber socket 23 .

The transport pushing module 10 is for picking up a semiconductor package as a test object, delivering it to the insert module 20 , and loading or unloading the semiconductor package with the insert module 20 .

For this purpose, the pushing module 10 for transport includes a push block 11 in the form of a housing having a pickup vacuum means 15 disposed therein, and the vacuum means 15 for pickup and communicating with a semiconductor package ( A pusher 12 that picks up P) and is arranged to be lifted in the vertical direction, and a pusher spring disposed between the push block 11 and the pusher 12 to elastically support the push block 11 upward ( 13) and a plurality of block guide holes 14 formed at positions spaced apart from each other on the push block 11 to descend to a designated position when descending toward the insert module 20 are provided.

The push block 11 is formed in the form of a housing having a predetermined thickness, and a vacuum means 15 for pickup connected to a vacuum generating means such as a vacuum pump is disposed.

In addition, the push block 11 is arranged to be raised and lowered, and the elevating and lowering of the push block 11 is made through a known driving means such as a cylinder, and thus detailed description thereof will be omitted.

However, in the present invention, the push block 11 is descended, that is, in the process of inserting the semiconductor package into the insert module 20, the descending pressure is sequentially transmitted and the pusher 12 is interlocked with the operation of the guide module 30 to be described later. lower the

The pusher 12 picks up the semiconductor package and delivers it to the insert module 20 , unloads the semiconductor package that has been tested from the insert module 20 and delivers it to the next process, and the pusher 12 is the pick-up The semiconductor package is sucked and picked up through the suction pressure transmitted in communication with the vacuum means 15 for use.

The pusher spring 13 is disposed inside the push block 11 and has one end in contact with the inner wall of the push block 11 and the other end in contact with the pusher 12 so as to resilient the push block 11 upward. support

As shown in FIG. 2, a plurality of these pusher springs 13 are compressed while the pusher springs 13 are disposed at positions spaced apart from each other so that the push block 11 descends toward the insert module 20, and then test In the process of being completed and the push block 11 is raised, the push block 11 is relatively first raised upward compared to the pusher 12, thereby reducing the lifting load of the push block 11 and providing ascending stability. .

The block guide hole 14 is formed to be indented upwardly from the bottom surface of the push block 11, and the block guide pin 24 provided in the insert module 20 to be described later enters and exits.

These block guide holes 14 are composed of positions, shapes and numbers corresponding to the positions, shapes, and numbers of the block guide pins 24, and are not limited to the positions, shapes, and numbers shown in the drawings.

The insert module 20 is provided with a rubber socket 23 having an electrical wiring that can enter and exit the semiconductor package picked up through the pushing module 10 for transfer and can be electrically connected to an external electrical wiring. The semiconductor package loaded into the rubber socket 23 is tested.

The insert module 20 is disposed above the rubber socket 23 and the rubber socket 23 having an electrical wiring that the semiconductor package can enter and exit and can be electrically connected to an external electrical wiring. It includes an access block 25 for guiding the entry and exit of the semiconductor package, an insert block 21 having the rubber socket 23 disposed therein, and an insert block 21 formed in the insert block 21, the rubber socket ( 23) having an inclination angle gradually narrowing toward the insert portion 22, in which the entry and exit blocks 25 are disposed, and the block of the pushing module 10 for transport protruding upward from the upper surface of the insert block 21 It includes a block guide pin 24 that enters and exits the guide hole 14 .

The insert block 21 is in the form of a housing and is disposed above the test board and the board support for supporting the test board, and the rubber socket 23 electrically connected to the test board (B) at the lower center. this is placed

The insert part 22 is formed in the center of the insert block 21 to have an inclination angle that gradually narrows from the top to the bottom.

And an access block 25 for guiding the entry and exit of the semiconductor package is disposed on the insert part 22, the entry block 25 is detachably coupled to the insert part 22 and the rubber socket 23 at the center A doorway 251 having an inclination angle that is gradually narrowed toward is formed.

When the surface constituting the doorway 251 is damaged due to friction during use, the access block 25 can reuse the insert module 20 after only replacing the access block, thereby reducing the cost and time required for maintenance and repair. There is a saving effect.

The rubber socket 23 is provided with an electrical wiring that can be electrically connected to an external electrical wiring, and is disposed on the upper surface of the test board and is electrically connected to the test board to test a semiconductor package in contact.

The block guide pin 24 protrudes upward from the upper surface of the insert block 21 , and serves to guide the lowering position during the lowering of the pushing module for transport.

Meanwhile, in the present invention, the rubber socket is one embodiment, and when the lead wire of the test object is configured as a pin type, it may be formed of a corresponding pogo socket.

The guide module 30 prevents the pushing module 10 for transport from being caught in the insert part 22 while the pushing module 10 for transport loads or unloads the semiconductor package into the insert module 20. This is to guide you to the planned position.

The guide module 30 for this purpose is arranged to be movable in the horizontal direction toward the pressing block 31 disposed in the pushing module 10 for transport, and the rubber socket 23, and the pressing block 31 a guide block 32 moving in the horizontal direction according to the elevation of the 30) are arranged to face each other with the rubber socket 23 as a center.

The pressing block 31 is disposed in the pushing module 10 for transport to pressurize or release the pressure of the guide block 32 when the pushing module for transport is raised or lowered.

To this end, the pressing block 31 includes a top base 311 and a pressing protrusion 312 protruding downward from the top base 311, and is formed to be inclined to one side from the lower end of the pressing protrusion 312, It includes a pressing surface 313 for gradually moving the guide block 32 in the horizontal direction according to the abutting position.

It is preferable that the top base 311 is disposed in the coupling slot 111 of the push block 11 and is formed in a rectangular block shape so as to be movable a predetermined distance in the horizontal direction inside the push block 11 . . At this time, a sealing packing for closing the gap between the top base 311 and the push block 11 is further disposed, and the sealing packing is made of a material such as rubber or urethane having elastic restoring force and a displacement means 40 to be described later. ) to seal the gap generated when the pressing block 31 moves in the horizontal direction.

And in the top base 311, the push block 11 descends and a pressing block elastic body 314 for elastically supporting the top base 311 downward in order to limit movement upward when it comes into contact with the guide block 32. is disposed, and a recess 311a into which one end of the pressing block elastic body 314 is introduced is formed on the upper surface of the top base 311 .

The pressing surface 313 is formed at the lower end of the pressing block 31 and inclined to one side to move the guide block 32 in the horizontal direction.

Here, the inclination direction of the pressing surface 313 is gradually inclined toward the direction away from the lower end as it goes upward from the lower end of the pressing block 31 as shown in FIGS. 5 to 7 .

The guide block 32 is disposed on the insert module 20 and prevents the pusher 12 from which the semiconductor package is picked up from being caught while the pressing block 31 comes into contact with each other and moves away from each other when descending.

The guide block 32 for this purpose includes a bottom base 321 and a contact surface 326 that protrudes upward from the upper surface of the bottom base 321 to abut the pressing block 31 and has one end inclined to one side. It includes a formed contact protrusion 322, and the bottom base 321 is spaced apart from each other at one end and has a pair of entry guide surfaces 323 formed to have the same inclination angle as the entry surface of the rubber socket 23 and , bent at a right angle at the lower end of the entry guide surface 323 is disposed at a relatively high position compared to the bottom surface of the bottom base 321 so that the side end of the rubber socket 23 is retracted and abutted against the retracted side end. It includes a fixing surface 324 for fixing, and an elastic chain inlet 325 formed at the other end of the bottom base 321 and into which one end of the elastic body 33 is introduced.

The bottom base 321 has a rectangular block shape and is disposed on the insert block 21 to be movable in the horizontal direction.

The contact protrusion 322 is formed to protrude upward from the upper surface of each bottom base 321, and each contact protrusion 322 has a contact surface corresponding to the pressing surface 313 of the pressing block 31. 326) is formed. The contact surface 326 is formed to be inclined downwardly from the upper end side of the contact protrusion 322 downward, and is formed to correspond to the inclination angle and the inclination length of the pressing surface 313 .

The pair of entry guide surfaces 323 are spaced apart from each other at one end of the bottom base 321 , and are inclined downward to face the rubber socket 23 .

That is, the entry guide surface 323 is formed to have the same inclination angle as that of the entrance 251 of the entry and exit block 25, so that the entry and exit pusher 12 and the semiconductor package picked up by the pusher 12 are smoothly carried out. It is designed to be accessible.

The fixing surface 324 is bent at a right angle at the lower end of the entry guide surface 323 and is positioned relatively higher than the bottom surface of the bottom base 321 so as to form a space into which the side end of the rubber socket 23 is introduced. is placed on

This fixing surface 324 prevents positional displacement of the rubber socket 23 by abutting against the upper surface of the retracted rubber socket 23 and fixing it. In addition, when the fixing surface 324 moves toward the rubber socket 23 in the process of moving the bottom base 321 in the horizontal direction, the end of the rubber socket 23 abuts against the fixing surface 324, so that the position movement is limited. .

One end of the elastic body 33 for elastically pressing the bottom base 321 toward the rubber socket 23 is introduced into the elastic chain inlet 325 , and is recessed at one end of the bottom base 321 .

The elastic body 33 is for elastically pressing the guide block 32 toward the rubber socket 23. One end is inserted into the elastic chain inlet 325 and abuts against the end, and the other end is the insert module 20. It abuts against the insert block 21 constituting it.

This elastic body 33 is compressed when the guide block 32 moves in a direction away from the rubber socket 23 by the pressure block 31, and then the pressure block 31 presses the guide block 32. The guide block 32 is returned to its original position by pushing the guide block 32 toward the rubber socket 23 while releasing the pressure and restoring it at the same time.

Looking at the operating state of the guide module 30 made as described above with reference to FIGS. 5 to 7 , the pushing module 10 for transport is located directly above the rubber socket 23 after picking up the semiconductor package P. , the semiconductor package P is lowered by the rubber socket 23 .

At this time, when the push block 11 is lowered, the pressing surface 313 of the pressing block 31 arranged to protrude downward of the push block 11 is the contact surface of the guide block 32 arranged on the insert module 20 . (326) abuts.

After that, when the push block 11 is lowered to a position in contact with the insert block 21, the pressing surface 313 pushes the contact surface 326 away from the rubber socket 23 to the space away from the rubber socket 23, while the pusher 12 and this A space in which the picked-up semiconductor package P can move is provided, and the pusher 12 descends through the provided space to place the semiconductor package P in contact with the rubber socket 23 to conduct a test.

After the test of the semiconductor package is completed, the pusher 12 rises, and when the pusher 12 rises to a certain height and then the push block 11 rises, the pressing block 31 also rises at the same time, and at this time, the compressed elastic body (33) moves the guide block 32 to the rubber socket 23 side and waits for the next operation.

When the above operation is performed, the pusher 12 and the semiconductor package P picked up thereon are prevented from being caught or jammed when the pusher 12 and the semiconductor package P picked up therein enter and exit the doorway 251 and the rubber socket 23 of the insert module 20, thereby preventing the pusher or semiconductor. Damage to the package can be prevented, and the test process of the semiconductor package can be performed quickly and accurately, thereby increasing test efficiency.

Next, the displacement means 40 is for preventing the position displacement of the guide module 30 and at the same time adjusting the position of the guide module 30 in which the displacement occurs, and the displacement means 40 is for the transfer The elevating hole 41 formed vertically downward from the upper surface of the pushing module 10 and having an elevating screw thread 411 on the inner circumferential surface, and a moving long hole 42 formed in communication with the elevating hole 41 in the horizontal direction, and the A hemispherical displacement block 43 disposed to protrude outward from one end of the pressing block 31 and movably disposed in the movable long hole 42 , and the elevation formed on the inner circumferential surface of the elevation hole 41 . A displacement bolt 44 movably engaged with the screw thread 411 and abutting the displacement block 43 and a displacement elastic body 45 for elastically supporting the pressing block 31 toward the displacement bolt 44 are included.

The elevating hole 41 is vertically formed downward from the upper surface of the pushing module 10 for transfer, more precisely, the push block 11, and a moving elevating screw 411 is formed on the inner circumferential surface.

Here, the forming position of the elevating hole 41 is formed at a position capable of controlling the movement of the pressing block 31 disposed on the push block 11. As shown in FIGS. 8 and 9, the pressing It is formed in proximity to one side of the top base 311 of the block 31 .

The movable long hole 42 communicates the space in which the elevating hole 41 and the pressing block 31 are disposed, and at the same time provides a space in which the displacement block 43 formed in the pressing block 31 can be disposed and moved. For this purpose, it is formed in the horizontal direction inside the push block 11 .

The displacement block 43 is disposed to protrude outwardly from one end of the pressing block 31 and is disposed in the movable long hole 42, so that the protruding end is made in a hemispherical shape and abuts against a displacement bolt 44 to be described later. are placed

The displacement bolt 44 is disposed so as to be able to move up and down in the elevating hole 41, and a moving spiral is formed on the outer circumferential surface to engage the elevating screw 411, and the outer face abuts against the displacement block 43 and presses it.

To this end, the displacement bolt 44 has a moving surface 441 having a moving screw thread 441a engaged with the elevating screw thread 411 and a wedge shape that is in contact with the displacement block 43 but gradually narrows toward the bottom. It consists of a push surface 442 made of.

The displacement elastic body 45 elastically supports the pressing block 31 toward the displacement bolt 44 , and one end abuts against the side surface of the pressing block 31 and the other end is a coupling formed in the push block 11 . It is arranged to abut against the inner wall of the slot (111).

The displacement means 40 made as described above presses the displacement block 43 in contact with the push surface 442 of the displacement bolt 44 while raising or lowering the displacement bolt 44 disposed in the lifting hole 41, In addition, the position of the displacement block 43 is adjusted by the rising or falling of the displacement bolt 44 .

By pressing the displacement block 43, the pressing block 31 connected to the displacement block 43 is supported, and the position of the displacement block 43 is arbitrarily changed even if pressure or shock is transmitted to the pressing block 31 through this. it can be prevented

In addition, the position of the pressing block 31 on which the displacement block is disposed is adjusted by adjusting the position of the displacement block 43 , and the adjusted position of the pressing block 31 is determined such that the pressing surface 313 is the contact surface 326 . It is possible to control the movement time and movement distance of the guide block 32 by controlling the abutting position. The control of the moving time and the moving distance of the guide block 32 has an effect that semiconductor packages having different thicknesses can be tested in one rubber socket.

In addition, when the position of the guide module including the pressure block is arbitrarily changed, the guide module can be returned to the designed position by raising or lowering the displacement bolt, thereby enabling rapid maintenance.

As described above, the present invention has been described with specific matters such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , various modifications and variations are possible from these descriptions by those of ordinary skill in the art to which the present invention pertains.

Therefore, the spirit of the present invention should not be limited to the described embodiments, and not only the claims to be described later, but also all those with equivalent or equivalent modifications to the claims will be said to belong to the scope of the spirit of the present invention. .

1: Test device for semiconductor package equipped with a guide module for preventing pinching
10: pushing module for transport
11: push block 12: pusher
13: pusher spring 14: block guide ball
15: vacuum means
20: insert module
21: insert block 22: insert part
23: rubber socket 24: block guide pin
25: entrance block 251: entrance
30: guide module
31: pressure block 32: guide block
33: elastic body
311: top base 312: pressing protrusion
313: pressurized surface 314: pressurized block elastic body
321: bottom base 322: contact projection
323: entry guide surface 324: fixed surface
325: elastic chain hole 326: contact surface
40: displacement means
41: elevating hole 42: moving long hole
43: displacement block 44: displacement bolt
45: elastic body for displacement
411: elevating thread
441: moving surface 442: push surface
441a: moving thread

Claims (5)

A transport pushing module 10 for transporting and delivering a semiconductor package, which is a test object;
A rubber socket 23 provided with an electrical wiring that can be accessed by the semiconductor package and can be electrically connected to an external electrical wiring, and is disposed above the rubber socket 23 to guide entry and exit of the semiconductor package an insert module 20 including an entry and exit block 25;
and a guide module (30) for guiding the semiconductor package to be drawn into a predetermined position when the semiconductor package is drawn into the rubber socket (23);
The guide module 30,
A pressing block 31 disposed on the pushing module 10 for transport, and
It is arranged movably in the horizontal direction toward the rubber socket 23, and protrudes upward from the bottom base 321 and the top surface of the bottom base 321 to bring the pressing block 31 into contact with one end. A guide block 32 provided with a contact protrusion 322 having a contact surface 326 formed at an angle and moving in the horizontal direction according to the elevation of the pressing block 31,
and an elastic body 33 for elastically supporting the guide block 32 toward the rubber socket 23,
In the guide module 30,
Displacement means 40 for adjusting the position of the pressing block 31 is further provided,
The displacement means 40,
An elevating hole 41 formed vertically downward from the upper surface of the pushing module 10 for transport and having an elevating screw thread 411 formed on an inner peripheral surface thereof;
A moving long hole 42 formed in communication with the elevating hole 41 in the horizontal direction,
A hemispherical displacement block 43 disposed to protrude outward from one end of the pressing block 31 and movably disposed in the movable long hole 42;
A displacement bolt 44 that is movably engaged with an elevation screw thread 411 formed on the inner circumferential surface of the elevation hole 41 and abuts the displacement block 43, and
A test apparatus for a semiconductor package provided with a guide module for preventing pinching, characterized in that it includes a displacement elastic body (45) for elastically supporting the pressing block (31) toward the displacement bolt (44). The method according to claim 1, The pressing block (31),
a top base 311, and
and a pressing protrusion 312 protruding downward from the top base 311,
A pressing surface 313 that is inclined to one side from the lower end of the pressing protrusion 312 and abuts against the contact surface 326 of the guide block 32 when descending to move the guide block 32 in the horizontal direction. A test device for a semiconductor package provided with a guide module for preventing pinching, characterized in that it comprises a. The method according to claim 1, The guide block (32),
The bottom base 321 is spaced apart from each other at one end and has a pair of entry guide surfaces 323 formed to have the same inclination angle as the entry surface of the rubber socket 23;
It is bent at a right angle from the lower end of the entry guide surface 323 and is disposed at a relatively high position compared to the bottom of the bottom base 321 so that the side end of the rubber socket 23 is retracted and abuts the retracted side end to fix it. and a fixed surface 324 to
A test apparatus for a semiconductor package provided with a guide module for preventing pinching, characterized in that it is formed on the other end of the bottom base (321) and includes an elastic chain inlet hole (325) through which one end of the elastic body (33) is introduced. delete The method according to claim 1, The displacement bolt (44),
a moving surface 441 having a moving screw thread 421a engaged with the elevating screw thread 411;
A test apparatus for a semiconductor package provided with a guide module for preventing pinching, characterized in that it abuts against the displacement block (43) and has a push surface (442) formed in a wedge shape that gradually narrows toward the bottom.

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