KR101762835B1

KR101762835B1 - A test device

Info

Publication number: KR101762835B1
Application number: KR1020150029951A
Authority: KR
Inventors: 백승하
Original assignee: 리노공업주식회사
Priority date: 2015-03-03
Filing date: 2015-03-03
Publication date: 2017-07-28
Also published as: TW201632889A; WO2016140505A1; TWI605254B; KR20160107035A

Abstract

The present invention relates to an inspection apparatus for inspecting an electrical characteristic of an inspection object having an inspection object to be inspected.
An inspection apparatus according to the present invention comprises: an insert for accommodating an object to be inspected; A socket for supporting a plurality of probes, one end of which is in contact with an inspected contact of the object to be inspected; And an object placing part disposed on the socket and having a probe hole corresponding to the inspected contact of the object to be inspected on the floor at the time of inspecting and receiving the object from the insert at the time of inspection.

Description

[0001] A TEST DEVICE [0002]

The present invention relates to an inspection apparatus for inspecting an electrical characteristic of an inspection object such as a semiconductor.

Semiconductor chips are formed by accumulating fine electronic circuits at high density and test whether each electronic circuit is normal during the manufacturing process.

Such a semiconductor chip includes a socket for supporting a plurality of probes electrically connecting bumps of a semiconductor chip and pads of a test board for applying a test signal, a socket guide for guiding the socket, and an insert The device is used to perform the inspection.

Many semiconductor chips for inspection may have different sizes and positions of inspection contacts such as bump and bump, respectively.

The insert includes a pocket for receiving the semiconductor chip and a first liner for engaging the first align pin of the socket guide.

The socket guide includes a first alignment pin engaged with the first alignment feature of the insert, and a second alignment pin engaged with the second alignment feature of the socket.

The socket includes a plurality of probes, and a second alignment hole engaging a second alignment pin of the socket guide.

The reliability of the test is finally determined by the accuracy of the alignment of the probe under test and the probe under test. However, the factors affecting the alignment of the probe to be inspected and the probe include tolerances of the object such as the outer dimensions of the object, the size of the contact to be inspected, the position of the object to be inspected, the size of the pocket, the tolerance of inserts such as the size and position of the first liner, There are many factors such as the size and position of the first alignment pin, the tolerance of the socket guide, such as the size and position of the second alignment pin, the size and position of the second alignment pin, the tolerance of the socket, do.

Therefore, in order to increase the reliability of the inspection, many factors must be taken into consideration. In addition, it is very difficult to manufacture an inspection apparatus having a degree of accuracy that can be satisfactorily achieved even if all elements are taken into consideration.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problem, and to minimize the number of elements for precise alignment of a probe to be inspected and a probe.

It is another object of the present invention to not only improve the reliability of the inspection of the inspection apparatus but also to reduce the manufacturing cost.

An inspection apparatus for solving the above-mentioned problems includes an insert for accommodating a test subject; A socket for supporting a probe having one end in contact with the inspecting contact of the object to be inspected; And an object placing part disposed on the socket and having a probe hole corresponding to an inspected contact of the object to be inspected on the floor, receiving the object to be inspected from the insert at the time of inspection.

At this time, the inspection apparatus according to the present invention transfers the test object to the test object receiving unit in the process of lowering the insert containing the test object for inspection, so that the inspection target contacts and the probes Can be achieved.

The subject placing portion is floated on the socket, thereby preventing the probe from being damaged at the time of examination.

Since the insert and the subject receiving portion include concave and convex portions for aligning with each other, the subject can be accurately transmitted from the insert to the receiving portion of the socket guide, and the size tolerance of the subject receiving portion can be reduced.

The subject receiving portion partially receives the bottom portion of the insert, and includes a groove portion lower than the bottom of the subject receiving portion, so that interference can be effectively avoided when the insert is lowered.

The subject seat portion includes an inclined wall portion having a tapered inclination toward the inside, so that the subject can be accurately placed on the seat portion of the socket guide from the insert.

The socket includes a plurality of pins for protecting a probe end protruding from a surface of the inspection circuit facing the inspection contact, thereby preventing the probe from being damaged during handling of the inspection apparatus.

The probe includes a plunger in contact with an inspection contact of an inspection circuit, and the plunger includes a radially extended portion with a step difference so that the end portion of the probe protrudes to the outside excessively.

According to the inspection apparatus of the present invention, the object to be inspected can be transferred from the insert to the object seat portion during inspection, so that the elements for precise alignment of the probe to be inspected and the object to be inspected can be limited only by the respective tolerances of the object seat portion and the socket . As a result, tolerances for alignment between the insert and the socket guide can be made large, so that the inspection apparatus can be easily manufactured and the manufacturing cost can be reduced.

In addition, inspection of an object such as a semiconductor chip having a short distance from the bump to the outer edge can be easily performed.

In addition, it is possible to effectively protect the end portion of the probe protruding from the socket when the inspection apparatus is handled.

1 is a perspective view of a testing apparatus according to an embodiment of the present invention,
Figure 2 is a bottom view of the insert of Figure 1,
3 is a perspective view showing an assembly of a socket, a socket guide, and a subject placing portion of FIG. 1,
4 is a perspective view of the assembly bottom of Fig. 2, and Fig.
5 to 7 are partial cross-sectional views for explaining the operation of the inspection apparatus according to the embodiment of the present invention.

Hereinafter, an inspection apparatus 1 according to an embodiment of the present invention will be described in detail with reference to FIG. 1 to FIG.

1, the inspection apparatus 1 includes an insert 100 for receiving a test object 10 such as a semiconductor chip, a socket 300 for supporting a plurality of probes, a socket guide 300 for supporting the socket 300, (200), and a subject receiving portion (400) for receiving and receiving the subject (10) received from the insert (100). At this time, the socket guide 200 and the socket 300 may be integrally formed.

The object 10 to be inspected includes an inspecting contact for inspecting electrical characteristics, for example, a bump, a lead terminal, a pad, and the like.

The insert 100 is moved in a state in which the subject 10 is accommodated for inspection and is automatically or manually engaged with the socket guide 200. [ The insert 100 moves away from the socket guide 200 after inspection is completed.

The insert 100 includes a pocket 110 for receiving the subject 10, a first aligning hole 112 engaged with the first aligning pin 212 of the socket guide 200, And a second aligning hole 114 engaging with the second aligning pin 412 of the fixture receiving portion 400. The second aligning pin 114 is provided with a second aligning pin 114 which engages with the second aligning pin 412 of the fixture receiving portion 400,

The insert 100 includes a rectangular through-hole shaped pocket 110 adapted to receive a rectangular test object 10 such as a semiconductor chip. As shown in Fig. 2, the pocket 110 is formed with a receiving portion 115 projecting horizontally from the lower portion of the square through hole in order to prevent the object 10 to be received from falling down. The receiving portion 115 is disposed at four corners and at the center of each side as shown in FIG. Here, the length of the receiving portion 115 protruding horizontally into the pocket 110 should be smaller than the distance from the outer periphery of the test subject to the inspected contact 12. The structure of the receiving portion 115 is not limited to the form shown in Fig. 2, and can be applied in any form as long as the subject 10 can be prevented from falling and interference of the inspected contact 12 can be avoided.

The first aligning protrusion 112 is coupled to the first aligning pin 212 of the socket guide 200 to primarily align the subject 10 and the object seating portion 400 with each other. The second aligning pin 412 of the object placing part 400 is engaged with the second aligning hole 114 formed on the bottom surface of the insert 100 so that the inspection object 10 and the object seating part 400 ). The subject 10 can be accurately placed on the subject receiving portion 400 by the engagement of the second aligning pin 412 and the second aligning hole 114.

3 and 4 are views showing the assemblies of the socket guide 200, the socket 300 and the test object seating portion 400. FIG.

The socket guide 200 includes a through hole at the center. The socket guide (200) receives and fixes the socket (300) to the through hole through the fixing screw (324). The socket guide 200 also includes a first alignment pin 212 for aligning the probes 330 of the socket 300 and the inspected contacts 12 of the test object 10.

4, the first align pin 212 protrudes not only from the top surface of the socket guide 200 but also from the bottom surface. The first alignment pins 212 protruding from the bottom face are engaged to align the alignment marks on the inspection circuit board 500 (not shown).

The socket 300 supports a plurality of probes 330 as shown in FIG.

The probes 330 partially protrude from the upper surface of the socket 300 and partially protrude from the bottom surface of the socket 300 by the upper plunger 332 contacting the inspected contact 12 of the test object 10, A lower plunger 334 contacting the pad, a barrel 336 partially receiving the upper and lower plungers 332 and 334, and a barrel 336 housed in the barrel 336, And a spring (not shown) that elastically expands at least one of the elastic members. Of course, the probe 330 is not limited to the above-described form, and various types of probes can be applied.

As shown in Fig. 5, the lower plunger 334 includes an end portion having a reduced cross-sectional area with a step 335 therebetween. The end portion having the step of the lower plunger 334 may be prevented from protruding from the bottom surface of the socket 300 to prevent the end of the probe from being damaged.

The bottom surface of the socket 300 includes four pins 322 that are higher than the height of the protruding probe end, i.e., the end of the lower plunger 334. The pin 322 may serve to protect the end of the probe 300 protruding from the socket 300 or the inspection apparatus 1 during handling.

The subject placing portion 400 is disposed on the socket 300 so as to be floated by an elastic body 420 such as a spring.

The object placing part 400 partly receives the inspecting contact 12 of the inspection object 10 on the upper part of the floor and communicates with the guide hole 415 and the guide hole 415 to connect the upper plunger And a probe hole 415 into which a probe 332 is inserted.

The subject receiving portion 400 includes a subject receiving space 410 to be placed on the subject 10. [ At this time, the subject receiving space 410 is formed in a shape similar to the external shape of the subject 10, for example, a quadrangular groove. The subject receiving space 410 is formed by a bottom on which the guide hole 415 is disposed and a plurality of wall portions 417 surrounding the bottom. A total of eight wall portions 417 are projected separately for each side of the subject receiving space 410. A second aligning pin 412 is formed on the upper portion of the four wall portions 417 facing each other. A groove portion 419 is formed in the space between the protruding wall portion 417 and the wall portion 417 to accommodate the bottom portion of the insert 100. The groove portion 419 is required to be lower than the bottom of the subject receiving space 410 so that the subject 10 accommodated in the insert 100 can be delivered to the subject receiving space 410.

Each of the wall portions 417 includes an inclined surface 415 inclined toward the interior of the subject receiving space 410. The inclined surface 415 of the wall portion 417 allows the subject 10 to be turned to slide and seat through the inclined surface even if it is not placed in the subject seating space 410 correctly.

Hereinafter, the inspection operation of the inspection apparatus 1 of the present invention will be described in detail with reference to FIGS. 5 to 7. FIG.

First, the first aligning hole 112 of the insert 100 and the first aligning pin 212 of the socket guide 200 are engaged. As a result, the bottom surface of the insert 100 approaches the subject seat 400. 5 to 7, the engagement of the first alignment pin 112 and the first alignment pin 212 is omitted.

The second aligning pin 412 of the fixture 400 and the second aligning hole 114 on the bottom surface of the insert 100 are engaged with each other so that the bottom surface of the insert 100 The receiving unit 115 is placed on the bottom of the seating space 410 of the subject receiving unit 400 while descending to the groove 419 lower than the bottom of the subject receiving unit 400 .

Next, when the inspected object 10 is pressed through the pusher (not shown) of the handler, as shown in FIG. 7, the inspected object seating part 400 floated is pressed and the upper plunger (not shown) 332 and the contact 12 to be inspected of the object 10 can be inspected.

When the insert 100 is lifted up, the subject 10 placed on the subject placing part 400 is pulled out of the receiving part 115 of the insert 100. When the pushing force of the pusher (not shown) To the insert 100 again.

As described above, the inspection apparatus 10 of the present invention is configured such that the actual inspection is performed by the inspection object 10 placed on the object placing part 400 and the probe 330 of the socket 300, The reliability of the inspection is influenced only by the tolerance of the body posture 400 and the subject 10. [ That is, the tolerances associated with the insert 100 and the socket guide 200 can be completely excluded.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, . Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

1: Inspection device
100: Insert
200: Socket guide
300: Socket
400: object mounting part
500: Inspection circuit board

Claims

An inspection apparatus for inspecting an electrical characteristic of an inspection object having an inspection object to be inspected,
An insert for accommodating the object to be inspected;
A socket for supporting a plurality of probes, one end of which is in contact with an inspected contact of the object to be inspected;
An object placing part disposed on the socket and having a probe hole corresponding to an inspection object contact point of the inspection object on the bottom of the socket;
A plurality of wall portions projecting higher than the subject seat portion on the outer periphery of the subject seat portion and having an inclined surface inclined downward toward the subject seat portion;
And an interposable alignment member formed on a bottom surface of the insert and on an upper surface of the wall portion.

The method according to claim 1,
Wherein the inspection object placing portion is floated on the socket.

delete

The method according to claim 1,
Wherein the test object placing part partially accommodates the bottom part of the insert and includes a groove part lower than the bottom of the test object placing part.

delete

The method according to claim 1,
Wherein the socket comprises a plurality of pins for protecting a probe end protruding from a surface of the inspection circuit facing the inspection contact.

The method according to claim 1,
Said probe comprising a plunger contacting an inspection contact of an inspection circuit,
Wherein the plunger includes an extension extending radially with a step difference.