KR102296954B1 - A test apparatus for dyes obtained from wafer singulation and a test method - Google Patents

Abstract

The present invention relates to a test apparatus and a test method for testing a semiconductor device, a loading unit for loading a plurality of devices on a test board, and a lead on the test board so that the test board and the plurality of devices are electrically connected A lead coupling unit for coupling the parts, at least one test unit for performing a test on a plurality of devices loaded on the test board, and transferring the test board to which the lead unit is coupled in the lead coupling unit to the at least one test unit A semiconductor device testing apparatus including a transfer unit and a test method using the same are provided.

Description

TEST APPARATUS FOR DYES OBTAINED FROM WAFER SINGULATION AND A TEST METHOD

The present invention relates to a test apparatus and a test method for testing a semiconductor device, and more particularly, to a test apparatus and a test method capable of performing a test while minimizing damage to the device.

Recently, as the capacity and speed required in the field of semiconductor devices increase, various attempts have been made to mount a memory having a larger capacity in a narrow area and efficiently drive the memory. In addition, in order to improve the degree of integration of the semiconductor device, a semiconductor device having a three-dimensional structure is being researched and developed. Among them, semiconductor devices using the TSV (Through Silicon Via) method are attracting attention. A semiconductor device having such a three-dimensional structure can be designed with high density, and the length of a connection line between circuits can be reduced by using a TSV as a connection line path, so that various advantages such as an increase in signal speed and a reduction in power consumption can be obtained.

Such a semiconductor device is frequently mounted and used in a singulation die state in which packaging is not performed. However, since the conventional test apparatus is a method of directly or indirectly pressurizing a device to contact a tester when performing a test, damage to the device is inevitable when testing a device that has not been packaged. In addition, if a separate test is not performed to avoid damage during the test, there is a problem in that the loss increases significantly as the defective device is manufactured without detecting the defective device in advance, so the development of a new test apparatus is required. am.

Publication No. 10-2015-0085270 (published on July 23, 2015)

An object of the present invention is to provide a test apparatus and test method capable of minimizing an impact applied to a device during a test process while testing a device in a singulation die state.

In order to achieve the above object, the present invention provides a loading part for loading a plurality of devices on a test board, a lead coupling part for coupling a lead part on the test board so that the test board and the plurality of devices are electrically connected to each other. , at least one test unit for performing a test on a plurality of devices loaded on the test board, and a transfer unit for transferring the test board to which the lead unit is coupled in the lead coupling unit to the at least one test unit Test equipment is provided.

Here, when the test board is inserted, the test unit may be electrically connected to a tester contact formed on an outer surface of the test board to test the plurality of devices.

Meanwhile, the test apparatus may further include a lead separating unit for separating the lead part of the test board from which the test is completed, and an unloading part for unloading the plurality of devices from the test board from which the lead is separated. Furthermore, a lead transfer unit for transferring the leads separated by the lead separation unit and a board transfer unit for transferring the empty test board from which the plurality of devices are unloaded from the unloading unit may be further included.

Here, the lead transfer unit may transfer the separated leads from the lead separation unit to the lead coupling unit, and the board transfer unit may transfer the empty test board from the unloading unit to the loading unit.

Meanwhile, the at least one test unit includes a first test unit that tests the device in a first test environment and a second test unit that tests the device in a second test environment different from the first test environment, and the transfer unit includes: The test board transferred from the lead coupling part may be sequentially transferred to the first test part and the second test part.

Here, the first test unit and the second test unit include a soak chamber for creating an atmosphere in each test environment, a test chamber provided with a tester to test the plurality of devices in the test environment; It may include a de-soak chamber for creating an atmosphere from the test environment to the atmospheric environment.

The test chamber may include a tester connected to a tester contact formed on the lower surface of the test board to perform a test, and a pushing module configured to connect the test contact and the tester by pressing the upper surface of the test board.

And, it may include a chamber temperature controller for adjusting the temperature inside each test chamber, and a board temperature controller for adjusting the temperature of the test board by contacting the test board introduced into the test chamber. The board temperature controller may selectively contact the lead part of the test board to adjust the temperature of the test board.

Here, the plurality of devices loaded on the test board may be devices of a stage before a packaging process is performed.

On the other hand, the above-described object of the present invention, at least one test unit for performing a test on a plurality of devices loaded on the test board, and the test board to which the lead unit is coupled in the lead coupling unit to the at least one test unit and a transfer unit for transferring, wherein the test board is in a state in which a lead unit is coupled to an upper side of a receiving unit loaded with a plurality of devices to electrically connect the test board and the plurality of devices, and the test unit is formed on the outer surface of the test board It may also be achieved by a semiconductor device test apparatus electrically connected to a tester contact to perform a test on the plurality of devices.

In addition, the above-described object of the present invention, loading a plurality of devices on the receiving portion of the test board, coupling the lead portion on the test board so that the plurality of devices are electrically connected to the test board; Testing the plurality of devices in at least one test part by transferring the test board to which the lead part is coupled, separating the lead part from the test board after the test step is performed, and performing a test on the test board It can also be achieved by a semiconductor device testing method comprising unloading the plurality of devices that have been completed.

According to the present invention, since the semiconductor device is transferred and tested while accommodated inside the test board, it is possible to minimize damage to the device during the test step.

In addition, since the device is transferred in a protected state inside the test board, it is possible to perform various tests through one test cycle, thereby improving test process efficiency.

As such, according to the present invention, since it is possible to test a device that is not packaged, such as a TSV type singulation die, it is possible to minimize cost loss due to device defects.

1 is a perspective view showing a test board according to an embodiment of the present invention;
Figure 2 is a cross-sectional view showing a section of a part of the area in which the device is accommodated on the test board in Figure 1;
3 is a cross-sectional view showing a cross-section of a state in which the lead unit is installed in FIG. 2;
Figure 4 is a perspective view showing the lower surface of the lead part of Figure 1;
5 is a cross-sectional view showing a partial cross-section of a test board according to another embodiment;
Figure 6 is a perspective view showing the bottom of the lead part of Figure 5;
7 is a cross-sectional view showing a partial cross-section of a test board according to another embodiment;
8 is a cross-sectional view showing a partial cross-section of a test board according to another embodiment;
9 is a diagram schematically showing the configuration of a test apparatus according to an embodiment of the present invention;
10 is a block diagram showing the structure of the test unit of FIG. 9;
11 is a view showing a partial configuration of the test chamber of FIG. 10;
12 is a flowchart illustrating a test method using the test apparatus according to the present embodiment;
13 is a flowchart illustrating the test steps in FIG. 12 ;
14 is a flowchart illustrating steps performed in each test step of FIG. 13 .

Hereinafter, a test board for a semiconductor device, a test apparatus, and a test method using the same according to an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, the positional relationship of each component will be described based on the drawings in principle. In addition, the drawings may simplify the structure of the invention for convenience of description or may be exaggerated if necessary. Therefore, the present invention is not limited to the contents shown in the drawings, and it goes without saying that various devices may be added, changed, or omitted.

In the following embodiments, 'device' may mean various semiconductor device elements. In this embodiment, as an example, a high-bandwidth memory device (HBM) configured in a TSV (Through Silicon Via) method will be described as an example, but the present invention is not limited thereto. A semiconductor device manufactured by another method may be included, and a non-memory device other than a memory device may also be included.

In addition, 'electrically connected' does not mean only a substantially energized state, but may be interpreted to include a state in which a connection path is formed to transmit an electric signal when it is applied.

And, that a specific configuration is 'connected', 'coupled', or 'pressurized' with another configuration means that the configuration is actively 'connected', 'coupled', and 'pressurized', as well as passively or in the action of another configuration. It can be interpreted as meaning including 'connection', 'bonding', and 'pressurization' by a reaction by

Furthermore, that two different components are 'connected', 'coupled', and 'pressurized' in an 'electrical' or 'mechanical' way means that the two components are not only directly connected, coupled, and pressed, but also via other configurations. Thus, it can be interpreted as meaning including indirectly connected, combined, and pressed.

1 is a perspective view illustrating a test board according to an embodiment of the present invention. The test board 10 according to the present embodiment is a configuration used in the process of testing the plurality of devices 20 . Here, the plurality of devices 20 are singulation dies obtained by dicing the stacked wafer structure, and may be devices of a stage before a packaging process is performed. As an example, the device may be a high bandwidth memory device configured in a TSV method.

In a conventional test apparatus, a plurality of devices are mounted on a test tray and transferred to a test site, and the test is performed in a state in which the plurality of devices are directly pressed to be connected to a tester terminal. Conventionally, a plurality of devices are drawn in/out of the insert structure of the test tray, and a shock is generated in the device in the process of making direct contact with the tester terminal. Therefore, if the singulation die before the packaging process is tested by a conventional test apparatus, there is a high possibility of device damage in the test process. In contrast, the test board 10 of this embodiment has an in/out structure of the device 20 that can minimize the impact, so that the device 20 is not impacted even in the process of making contact with the tester at the test site. is composed

Specifically, as shown in FIG. 1 , the test board 10 according to this embodiment includes the socket board 200 in which the accommodating part 100 is installed, and the lead part 300 detachably installed in the upper side of the accommodating part. ) and a circuit unit 400 that forms a path through which the device and the tester-side terminal are electrically connected.

First, the socket board 200 forms the body of the test board 10 , and the receiving part 100 in which the device 20 is accommodated is installed. As shown in FIG. 1 , the socket board 200 is composed of a plate-shaped member having a larger area than the accommodating part 100 and the lead part 300 . A portion of the socket board 200 in which the receiving portion is not installed may form a portion pressed by the pushing unit in order to be electrically connected to the tester terminal at a test site (see FIG. 11 ). The socket board 200 is, for example, configured to include a printed circuit board (PCB), and a part of the circuit unit 400 to be described later may be formed on the socket board.

The accommodating part 100 is fixedly installed on the upper surface of the socket board 200 , forms an NxM array structure, and accommodates a plurality of devices 20 . Specifically, the accommodating part 100 is configured to include a socket base 110 and a plurality of pocket units 120 . The socket base 110 is fixedly installed on the socket board 200 and includes a plurality of recesses 111 for installing the pocket unit. In addition, the plurality of pocket units 120 are installed to be movable relative to the socket base 110 , respectively, to form an accommodating space 121 for accommodating the device 20 .

The lead part 300 has a plate-like structure installed on the upper side of the socket board, specifically, the upper side of the accommodating part 100 . The lead unit 300 is installed on the upper side of the receiving unit during the test process to protect the accommodated device and prevent the device from being removed during the transfer and test of the test board 10 . A fastening structure 301 that is fastened to the receiving part or the socket board is formed at the edge of the lead part, and is selectively detachably installed according to the process step. 1, the lead part 300 of this embodiment is configured using a plate-shaped member in which a separate opening is not formed, but it is also possible to configure a plurality of openings so that a part of the accommodated device is exposed. . The lid unit 300 is configured to press at least a portion of the receiving unit while it is installed on the upper side of the receiving unit 100 . Specifically, the lid part 300 of this embodiment is configured to press the pocket unit 120 of the receiving part, whereby the position of the pocket unit 120 may be changed.

Although not specifically illustrated in FIG. 1 , the circuit unit 400 has a configuration provided on the test board 10 , and includes a plurality of device contact terminals 410 , a plurality of tester contact terminals 430 , and the multiple contact terminals and the tester. and a circuit 420 forming a path through which the contact terminals are electrically connected. In detail, the device contact terminals 410 are configured to be electrically connected to each of the devices 20 and are provided in plurality to correspond to the number of accommodated devices. Each device contact terminal 410 may be electrically connected to the accommodated device as the position of the pocket unit is changed as the lead part is installed. Meanwhile, the tester contact terminal 430 is electrically connected to the tester terminal 1422 during testing, and is formed on the outer surface of the test board 10 to allow direct access from the outside. Therefore, when the lead part 300 is installed after the plurality of devices 20 are accommodated in the test board 10 , the test board 10 and the tester 1421 are connected without applying an additional external force to the device 20 . It is possible to perform tests.

2 is a cross-sectional view showing a cross section of a partial region in which the device is accommodated on the test board in FIG. 1, FIG. 3 is a cross-sectional view showing a cross-section in a state in which the lead part is installed in FIG. 2, and FIG. 4 is the lower surface of the lead part of FIG. It is a perspective view shown. Hereinafter, the relative movement of the pocket unit according to the installation of the lead unit and the connection mechanism between the device and the device contact terminal will be described in detail with reference to FIGS. 2 to 4 .

As shown in FIGS. 2 and 3 , the pocket unit 120 is installed in the recess 111 of the socket base 110 and is configured to be lifted up and down in the vertical direction. At this time, the pocket unit 120 is elastically supported and installed on the socket base 110 . For example, at least one elastic member 130 is provided between the recess 111 of the socket base and the bottom surface of the pocket unit 120 . Accordingly, it is possible to alleviate an impact generated while the device 20 is accommodated in the pocket unit or the pocket unit is pressed by the lid unit.

Each pocket unit 120 forms an accommodation space 121 in which a device is accommodated. The accommodating space 121 has an upper opening and is configured to be surrounded by the partition wall 122 of the pocket unit. Accordingly, the device 20 is supported by the bottom surface of the pocket unit while being accommodated in the accommodation space.

The accommodation space 121 is formed to be spaced apart from each partition wall 122 by a predetermined distance in a state in which the device is seated. Accordingly, the operation of loading or unloading the device 20 onto the accommodation space 121 may be performed. Specifically, the accommodation space 121 of the pocket unit is configured to have a tapered structure in which the cross-sectional area of the space is gradually reduced along the direction in which the device is introduced. In this case, the device can be easily introduced into the upper opening of the accommodation space, the entered device can be easily guided to a seating position on the bottom surface of the pocket unit, and movement of the seated device in the horizontal direction can be minimized. Accordingly, the lower side of the accommodation space 121 of the pocket unit may be configured to have a tolerance of 5 to 15 μm along the outside in a state in which the device is accommodated, and the upper side may be configured to have a tolerance of 20 to 50 μm. In this embodiment, the lower side of the receiving space 121 may be designed to have a tolerance of 10 μm along the outside of the device, and the upper side of the receiving space may be designed to have a tolerance of 25 μm.

Meanwhile, as shown in FIGS. 2 and 3 , the device contact terminal 410 forming one end of the circuit unit 400 is configured in the form of a connecting pin protruding upward from the bottom of the socket base 110 . In addition, at least one through hole 123 is formed in the bottom surface of the pocket unit 120 , and the device contact terminal 410 is inserted and installed in a form penetrating the through hole 123 . Accordingly, the device contact terminal 410 may be selectively exposed to the inside of the accommodation space according to the position of the pocket unit to be electrically connected to the device 20 .

The device contact terminals 410 are provided in plurality to be individually connected to each device 20 accommodated in the receiving unit, and may be installed in each pocket unit 120 . In addition, each device contact terminal 410 may be electrically connected to each of the tester contact terminals 430 exposed on the lower side of the socket board by a circuit formed on the socket board.

On the other hand, as described above, the lid portion 300 is installed on the upper side of the receiving portion is configured to selectively press the pocket unit (120). The lead part 300 of this embodiment, as shown in FIG. 4, is configured to include a lead plate 310 and a plurality of pressing modules 320 composed of a plate-shaped member. The lead plate 310 may be formed to have a size corresponding to the size of the receiving part. The pressing module 320 is provided on the lower surface of the lead plate 310 in a number corresponding to the number of pocket units 120 of the receiving part, and is configured to protrude from the upper side to the lower side of each pocket unit. Accordingly, when the lead part 300 is installed on the receiving part, the pressing module 320 can selectively press the pocket unit 120 without interfering with the partition wall 112 of the socket base.

As shown in FIG. 3 , each pressing module 320 includes a pressing part 321 positioned at the edge of the pressing module and pressing the partition wall 122 of the pocket unit from the upper side of the pocket unit, and the pressing module. It is provided on the central side and includes a step portion 322 disposed on the upper side of the accommodation space 121 in which the device is accommodated. The pressing part 321 and the stepped part 322 may form a structure in which a step is formed by a predetermined depth (D).

As shown in FIG. 3 , when the lid part 300 is installed and the pressure module presses the partition wall 122 of the pocket unit, the pocket unit 120 descends a predetermined distance to change the position. At this time, since the pocket unit 120 descends while being elastically supported by the above-described elastic member 130 , the impact applied to the device 20 can be minimized. As the pocket unit 120 descends, the device contact terminal 410 protrudes upward from the bottom of the pocket unit, comes in contact with the device 20 and is electrically connected, and supports the device 20 .

In this case, the position of the upper surface of the device 20 is fixed while being in contact with the step portion 322 of the pressing module, thereby limiting the movement of the device 20 in the accommodation space during the transfer of the test board. At this time, in order to prevent the device from being damaged by the pressing module 320 , the step portion 322 is formed with a step difference from the pressing portion 321 by a predetermined depth (D). In this case, the size D of the step may be a size corresponding to a height at which the device contact terminal 410 protrudes from the bottom surface of the pocket unit and the upper surface of the device protrudes above the height of the partition wall of the pocket unit. That is, in the case of FIG. 3 , it may be a value corresponding to the difference between the sum of the height h of the device and the protrusion height d of the device contact and the height H of the partition wall of the pocket unit. However, it is also possible to design by securing a predetermined tolerance to prevent the device from being damaged by being pressed by the step when the lead part is installed. Furthermore, it is also possible to configure the bottom surface of the step portion 322 or the pocket unit 120 using a cushioning material or to coat it with a cushioning material, and if necessary, to provide a cushioning structure using a separate elastic member to the step portion. It is also possible

In the case of the test board described above, while the position of the device 20 is fixed when the lead part 300 is installed, the device 20 and the circuit part 400 of the test board may be electrically connected. At this time, it is possible to minimize the impact applied to the device by using a structure that elastically supports the pocket unit, tolerances of the pocket unit and the pressure module, and a cushioning material. In addition, a plurality of devices 20 to be tested are embedded in the test board 10 and transferred to the test site in a protected state, without additionally applying an external force to the device, test using the tester contact terminal 430 of the test board is possible, so it is possible to perform various tests without damaging the device.

Here, the test board 10 is exposed to an environment with a large range of temperature change as the test is performed in a test environment with a significant high temperature. Therefore, it is preferable that the pocket unit 120 and the socket base 110 constituting the receiving part are made of a material having a thermal expansion coefficient similar to that of the device 20, for example, a material such as ceramic. Furthermore, the lead part 300 and the socket board 200 may also be manufactured by selecting a material having a similar thermal expansion coefficient to that of the device material in consideration of such a temperature change environment.

In the above description, an example of the test board according to the present invention is mainly described in FIGS. 2 to 4, but the present invention is not limited thereto. While configuring the device to elastically support the device in the test board, the test board structure can be variously modified so that the device and the circuit part of the test board can be selectively connected when the lead part is fastened.

Hereinafter, a structure of a test board having a structure different from that of the above-described embodiment will be described with reference to FIGS. 5 to 8 as an example. However, in order to avoid repetitive descriptions of configurations and similar technical matters corresponding to those of the above-described embodiments, detailed descriptions thereof will be omitted.

5 is a cross-sectional view illustrating a partial cross-section of a test board according to another embodiment, and FIG. 6 is a perspective view illustrating a bottom surface of the lead part of FIG. 5 .

In the above-described embodiment, the pocket unit is inserted into the socket base when the lid is pressed, and the partition wall of the pocket unit moves to a lower position than the partition wall of the socket base. Accordingly, the press module of the lid unit is composed of a plurality of modules matched to each pocket unit so as not to interfere with the partition wall of the socket base during pressurization (see FIG. 4 ).

In contrast, in the receiving part 100 shown in FIG. 5 , the position of the partition wall 122 of the pocket unit protrudes higher than the partition wall 112 of the socket base in a state where the pressure by the lead part 300 does not occur. configured to be And, when the lead part 300 is installed and pressurizes the pocket unit 120, the lead part 300 is configured so that the partition wall 122 of the pocket unit can be lowered to the same height as the partition wall 112 of the socket base. can do. And, in this pressurized state, the device 20 is electrically connected to the device contact terminal 410 and the pocket unit size, the height of the device contact terminal and the lead portion so that it can be fixed on the lower surface of the lead part 300 . It is possible to design the step difference of the bottom.

According to this, in configuring the pressing module 320 of the lower surface of the lead part, instead of having a plurality of pressing modules corresponding to each pocket unit, as shown in FIG. 6 , using a single member It is possible to configure the pressing module 320 . At this time, the portion located above the receiving space 121 of the pressure module forms a step portion in consideration of the relative increase in the position of the device (see FIG. 5 ), or a device using a cushioning material on the lower surface of the lead plate. It can be configured to minimize the impact when in contact with the upper surface.

7 is a cross-sectional view illustrating a partial cross-section of a test board according to another embodiment. In the embodiment described above, the device contact terminal has a pin structure that protrudes and protrudes through the through hole of the pocket unit, but in the embodiment of FIG. 410 may be formed.

As shown in FIG. 7 , in the pocket unit 120 according to the present embodiment, a part of the bottom surface on which the device is accommodated and supported is made of a conductive material, and the device contact terminal 410 electrically connectable when the device 20 is accommodated. ) to form In addition, a terminal 440 capable of electrically connecting the device contact terminal and the circuit 420 on the socket board to a lower side of the device contact terminal 410 of the socket base 110 is formed. Accordingly, when the lead part 300 is installed, the pocket unit 120 pressed by the lead part descends in a state supported by the elastic member 130 , whereby the device contact terminal 410 formed on the bottom surface of the pocket unit. may be connected to the circuit 420 on the socket board to selectively connect the device 20 and the circuit unit 400 .

In this embodiment, a relative position change between the pocket unit 120 and the device 20 does not occur when the pocket unit is pressed. Therefore, the lead part 300 of the present embodiment may not have a concave step structure as in FIGS. 2 and 3 when configuring the pressing module. Rather, as shown in FIG. 7, the upper part of the pocket unit partition wall and the upper part of the accommodation space are configured to form a plane (when the height of the pocket unit partition wall and the upper surface of the device are the same as in FIG. 7), or the upper side of the device In order to fix the position, it is also possible to configure a step portion (not shown) of a downward convex shape using a cushioning material at the upper position of the device (when the height of the upper surface of the device is lower than the partition wall of the pocket unit).

8 is a cross-sectional view illustrating a partial cross-section of a test board according to another embodiment. In the above-described embodiments, the circuit unit is formed through the receiving unit and the socket board, but the present invention is not limited thereto, and the circuit unit may be configured to be formed in the lead unit.

As shown in FIG. 8 , the accommodating part 100 according to the present embodiment includes a pocket unit 120 that is elastically supported on the socket base 110 to accommodate the device 20 . And, as the lead part 300 is installed on the receiving part, the device is accommodated in the test board while pressing the pocket unit or the device to the upper side, and the position is fixed.

In this case, the circuit unit 400 may be provided in the lead unit 300 . Specifically, the device contact terminal 410 is exposed to be in contact with the device 20 on the upper side of the receiving space of the pocket unit, and the tester contact terminal 430 is formed to be exposed on the upper surface of the lead part 300 , A circuit connecting them may be formed inside the lead part 300 . Therefore, when the lead part is installed, the device contact terminal 410 connects the device 20 and the circuit part 400 by making contact with the upper surface of the device, and at the test site, the tester contact terminal 430 formed on the outer surface of the lead part 300 . ) may be in contact with the tester 1421 to proceed with the test.

In the above, the embodiments of various test boards that can implement the present invention have been described, and it is revealed that it can be changed and implemented in various ways in addition to the configuration discussed above.

Hereinafter, a test apparatus for device testing according to the present invention will be described in detail with reference to FIGS. 9 to 11 . Hereinafter, the test board used in the test device will be described using the test board according to the embodiment of FIGS. 1 to 4 . However, it should be noted that the test apparatus according to the present invention is not limited thereto, and various test boards may be applied in addition to this.

9 is a diagram schematically illustrating a configuration of a test apparatus according to an embodiment of the present invention. The test apparatus 1 according to the present embodiment is an apparatus for testing a device using the above-described test board 10 . According to this embodiment, since the device is loaded on the test board and moved to the test site in a protected state and the test is performed, it is possible to perform various tests without damaging the device.

Specifically, the test device 1 may be composed of a loading/unloading site and a test site. The loading/unloading site includes a loading part 1110 on which untested devices are loaded, a loading part 1210 on which the devices of the loading part are loaded onto the test board, and a lead coupling part 1220 on which the lead part is coupled and installed. Furthermore, it is configured to include a lead separation unit 1230 for separating the lead unit 300 from the test board 10 on which the test is made, and an unloading unit 1240 for sorting and unloading the device according to the test result. In addition, the test site includes at least one test unit 1400 and a transfer unit 1300 for transferring the test board to the test unit.

First, the loading unit 1110 is a position where a plurality of untested devices wait to perform a test step. As an example, a plurality of devices are loaded onto a wafer cassette in a singulated die state on the wafer. In the present embodiment, the loading unit 1110 is illustrated as one component of the present test apparatus, but the present invention is not limited thereto.

The loading unit 1210 is a location for loading a plurality of devices to be tested on the above-described test board 10 . The loading unit 1210 constitutes a part of the loading-side stage in the loading/unloading site. When the empty test board 10 on which the device is not loaded is positioned on the loading unit 1210 in a state where the lead unit is not installed, the loading unit ( A plurality of devices loaded on the 1110 are loaded on the test board 10 . At this time, each device is accommodated in the accommodating space of each pocket unit, and as described above, since the pocket unit is elastically supported on the test board, it is possible to minimize the impact applied to the device during loading.

The lead coupling part 1220 is a position at which the lead part 300 is installed on the test board, and forms a part of the loading-side stage adjacent to the aforementioned loading part. A transfer module (not shown) such as a transfer rail or a transfer robot is provided between the lead coupling unit 1220 and the loading unit 1210 , and the test board 10 on which the device loading in the loading unit 1210 is completed is transferred to the transfer module. by the lead coupling unit 1220 . Then, the lead unit 300 is transferred through a lead transfer unit 1250 to be described later, and is coupled to the test board from the upper side of the test board. In this case, the coupling of the lead part 300 may be performed by a lead transfer module (not shown), which will be described later, and may be variously configured according to a fastening structure of the lead part. As described above, as the lead unit is coupled to the test board, the plurality of devices 20 accommodated in the test board 10 may be protected from the inside of the test board while maintaining an electrically connected state with the circuit unit 400 of the test board.

Meanwhile, the lead separation unit 1230 is a position at which the lead unit 300 is separated from the test board 10 on which the test is completed, and constitutes a part of the unloading-side stage at the loading/unloading site. In the lead separation unit 1230 , the coupling structure of the lead unit is released through a separate module (eg, a lead transfer module), and the lead unit is separated from the test board. Thereby, the plurality of devices of the test board are released from the electrical connection state with the circuit part, and as the pocket unit rises to the initial position by the elastic force, it is exposed to the outside so that the unloading step can be performed.

The unloading unit 1240 constitutes a part of the unloading-side stage and is a location for unloading a plurality of devices that have been tested from the test board. A transfer module (not shown) such as a transfer rail or a transfer robot is provided between the lead separating unit 1230 and the unloading unit 1240 , and the test board from which the lead is separated from the lead separating unit 1230 is transferred by the transfer module. It is transferred to the unloading unit 1240 . A pick-and-place device (not shown) is provided in the unloading unit 1240 to unload the device of the tester board to the take-out tray provided in the take-out unit 1120 . At this time, at least one or more take-out trays are provided in the take-out unit 1120, and the unloading unit 1240 may classify devices according to the test results and unload them into the corresponding take-out trays.

Meanwhile, the loading/unloading site of the test apparatus may further include a lead transfer unit 1250 and a board transfer unit 1260 . The lead transfer unit 1250 is a path through which the lead unit 300 separated from the lead separation unit 1230 is transferred to the lead coupling unit 1220, and a lead transfer module (not shown) for lifting and transporting the lead unit on the path. This may be provided. In this case, the lead transfer module may include a function of fastening and separating the lead part on the test board. Accordingly, the lead transfer module separates the lead unit from the lead separation unit 1230 , lifts the lead unit and moves it along the lead transfer unit 1250 to the lead coupling unit 1220 , and in the lead coupling unit 1220 , the lead unit is a test board. It can be configured to fasten the fastening structure after descending on the bed. In addition, the board transfer unit 1260 is a path through which the device is unloaded from the unloading unit 1240 and the empty test board is transferred to the loading unit 1210 side. On the path, a board transfer module such as a transfer rail or transfer robot (not shown) city) is provided. Accordingly, the empty test board of the unloading unit may be transferred to the loading unit 1210 along the board transfer unit 1260 by the board transfer module.

On the other hand, the transfer unit 1300 of the test site transfers the test board 10 delivered from the unloading/loading site to each test unit, and transfers the tested test board 10 back to the unloading/loading site. As shown in FIG. 9 , the transfer unit 1300 includes a shuttle 1320 on which the test board is seated, and a transfer rail 1310 that forms a path on which the shuttle moves. Accordingly, the shuttle 1320 transports the test board 10 along the transport rail 1310 , and returns to preset positions such as the lead coupling part 1220 , each test part 1400 , and the lead separation part 1230 . Perform movement and stop motions.

Although not shown in FIG. 9 , a plurality of transfer units are provided between the transfer unit and the loading/unloading site, and between the transfer unit and the test unit. Thereby, the test board may be transferred from the lead coupling unit to the shuttle, the test board may be transferred between the shuttle and each test unit, and the test board may be transferred from the shuttle to the lead separation unit. In addition, the shuttle is provided with a support portion 1321 on which two test boards can be seated, and each support portion 1321 is configured to be rotatable about the shuttle as an axis, so that the two test boards ( 10) is delivered or configured to be delivered.

Meanwhile, the test site includes at least one test unit 1400 . The test unit 1400 is a space where the test board 10 enters and tests for each device are performed, and each test unit 1400 is provided with a tester 1421 that performs a test operation.

As shown in FIG. 9 , the test site of this embodiment may be configured to include three test units 1400a, 1400b, and 1400c. In the conventional test apparatus, it is difficult to perform a plurality of tests in various environments due to the risk of damage to the device during the test. On the other hand, in the present embodiment, since the test is performed in a state in which an external force is not separately applied to the device in a state in which the device is accommodated in the test board, the test can be performed a plurality of times while moving the test board.

Specifically, the first test unit 1400a performs the test in the first test environment, the second test unit 1400b performs the test in the second test environment, and the third test unit 1400c performs the third test Testing can be performed in the environment. Here, the first to third test environments may have different environmental conditions, respectively. For example, the first test environment may be a very high temperature environment, the second test environment may be a high temperature environment, and the third test environment may be a low temperature environment. As such, in the present embodiment, it is possible to perform tests in various environmental conditions through one test cycle.

FIG. 10 is a block diagram illustrating the structure of the test unit of FIG. 9 , and FIG. 11 is a diagram illustrating a partial configuration of the test chamber of FIG. 10 . Hereinafter, the configuration of each test unit will be described in more detail with reference to FIGS. 10 and 11 .

9 , each test unit 1400 includes a soak chamber 1410 , a test chamber 1420 , and a de-soak chamber 1430 . do. Here, the soak chamber 1410 and the de-soak chamber 1430 are configured to buffer a temperature difference applied to the test board before and after the test. In addition, the test chamber 1420 is configured to test a device using a tester in a set test environment. In this case, the soak chamber 1410 , the test chamber 1420 , and the de-soak chamber 1430 may be configured such that two test boards transferred through the shuttle are simultaneously processed.

Specifically, when the test board is introduced into the soak chamber 1410 , the internal temperature of the soak chamber 1410 is gradually adjusted from the normal temperature to the test environment of the corresponding test unit. Accordingly, the test board can be gradually acclimatized from room temperature to the temperature of the test environment before performing the test. And, when the test board on which the test has been completed is introduced from the test chamber, the internal temperature of the desoak chamber 1430 is gradually adjusted from the temperature of the test environment to the temperature of the room temperature. Therefore, the test board can be gradually acclimatized from the test environment to room temperature before moving to the transfer unit after the test is finished. As described above, when the temperature difference between the room temperature and the test environment is large, the soak chamber and the de-soak chamber are provided, but when the temperature difference between the room temperature and the test environment is small, the soak chamber and the de-soak chamber may not be provided.

Meanwhile, the test chamber 1420 sets the temperature of the internal space to a preset test environment using a temperature control device, and when the test board 10 is introduced, a device is tested using the tester 1421 . Specifically, as shown in FIG. 11 , the pushing unit 1423 of the test chamber 1420 presses the upper surface of the socket board 200 on which the receiving part is not formed among the introduced test boards, thereby allowing the tester of the test board. The contact terminal 430 and the terminal 1422 on the tester side are in contact and are electrically connected. As described above, since the plurality of devices 20 accommodated in the test board 10 are electrically connected to the circuit unit 400 of the test board, the tester contact terminal 430 and the tester terminal 1422 are in contact with each other. Tests can be performed on all devices. However, in the drawings, for convenience of explanation, two tester terminals are provided on the tester board to be connected to the tester, but it is also possible to include more contact terminals depending on the design of the circuit unit.

On the other hand, the test chamber includes a plurality of temperature control unit for adjusting the temperature inside the chamber to create a preset test environment. As the conventional test chamber is designed to individually press all devices, there is insufficient space inside the chamber. exist. Accordingly, it is possible to precisely control the test temperature by providing a plurality of temperature controllers 1424 and 1425 .

Specifically, the test chamber 1420 may include a chamber temperature controller 1424 and a board temperature controller 1425 . The chamber temperature controller 1424 is configured to control the temperature of the internal space of the test chamber, and may be configured using a heater and/or a blower installed on the inner wall of the chamber. The board temperature control unit 1425 is configured to control the temperature of the test board 10 by selectively contacting the test board, and as shown in FIG. It is possible to regulate the temperature of the device by means of heat conduction. In this case, it is possible to more accurately control the temperature of the device in which the test is performed, and it is possible to perform control to compensate for the occurrence of a temperature deviation according to the location of the device. At this time, it is preferable that the lead part 300 and/or the accommodating part 100 of the test board be made of a material having excellent thermal conductivity so that temperature control by the board temperature controller 1425 can be easily performed.

Hereinafter, a test method using the test apparatus according to the present embodiment will be described in detail with reference to FIGS. 12 to 14 . 12 is a flowchart illustrating a test method using the test apparatus according to the present embodiment, FIG. 13 is a flowchart illustrating the test steps in FIG. 12, and FIG. 14 is a flowchart illustrating steps performed in each test step of FIG. It is a flowchart.

This test method is a method for testing a plurality of devices in a preset environment, and for this purpose, a step of loading a plurality of devices to be tested on a test board is performed (S100). In this step, a plurality of untested devices 20 loaded on the loading unit 1110 are loaded into the receiving unit 100 of the test board using a pick and place device. At this time, since the device is loaded on the pocket unit installed to be elastically supported, it is possible to minimize the impact applied to the device during loading.

When a plurality of devices are loaded on the test board, the test board 10 moves from the loading part 1210 to the lead coupling part 1220 by the transfer module, and coupling the lead part 300 on the test board. perform (S200). This step may be performed by a lead transport module that transports the lead part, and after lowering the lead part lifted from the upper side of the test board, it is fastened to the test board using a fastening structure. In this step, the position of the pocket unit is moved by the pressurization of the lead part, whereby all the devices 20 of the test board are electrically connected to the circuit part 400 of the test board.

When the lead unit is coupled to the test board, the test board moves to the test unit by the transfer unit and the transfer unit, and the test unit performs a test step (S300). At this time, the test apparatus of the present embodiment includes first to third test units 1400a, 1400b, and 1400c, and this test step is performed in a first test step S310 performed by the first test unit, and in the second test unit. It includes a second test step S320 performed, and a third test step S330 performed by a third test unit (see FIG. 13 ). As described above, in the first to third test steps, tests are performed in different test environments, so that it is possible to continuously perform various tests through one test cycle.

To this end, in a state in which the shuttle of the transfer unit moves to the gate position of the first test unit, the test board is brought into and out of the first test unit by the transfer unit, and the test boards into and out of the second and third test units are also similarly performed. is performed with

And, in the first to third test steps, specifically, the steps shown in FIG. 14 are respectively performed. First, when the test board is brought into the gate of the test unit 1400 by the transfer unit, the step of adapting to the temperature corresponding to each set test environment is performed while the test board is accommodated in the soak chamber 1410 . Then, the test board moves from the soak chamber 1410 to the test chamber 1420 . At this time, the test chamber 1420 controls the temperature inside the test chamber to the preset test environment temperature by driving the chamber temperature controller 1424 ( S301 ). Then, the pushing unit 1423 presses and moves the upper surface of the test board so that the tester contact terminal 430 of the test board is in contact with the tester terminal 1422 and is electrically connected (S302). When the position of the test board is determined through the above steps, the board temperature controller 1425 moves to finely adjust the temperature of the device while in contact with the lead part 300 of the test board (S303). Then, the tester 1421 tests the plurality of devices accommodated in the test board by transmitting and receiving electrical signals to and from the test board through the terminal 1422 ( S304 ).

14, when the test is completed by performing the first test step (S310), the second test step (S320), and the third test step (S330), respectively, the transfer unit leads the test board on which the test is completed It moves to the separation unit 1230 . Then, the lead transfer module separates the lead unit from the test board located in the lead separation unit (S400). By separating the lead part, the pocket unit 120 of the test board returns to its original position by the elastic force, and the state of electrically connected to the circuit part 400 is released from the plurality of devices 20 that have been tested. Then, the lead transfer module operates to lift the separated lead part 300 and transfer it to the lead coupling part 1220 side along the lead transfer part 1250, and to couple it on the test board to be tested thereafter.

The test board from which the lead part is separated from the lead separation part is transferred to the unloading part 1240 by the transfer module, and the step of unloading the test device 20 to the lead part 1120 is performed (S500). The unloading step is performed using a pick-and-place device, and may be taken out by sorting them into different take-out trays according to test results. In addition, the empty test board from which all devices are drawn through the unloading step moves to the loading unit 1210 along the board transfer unit 1260 by the transfer module, and performs a loading step of loading a device that has not been tested again.

As such, the test apparatus of the present embodiment uses a test board that accommodates the device and maintains an electrically connected state with the device, so it is possible to minimize damage to the device during transport and testing, and various tests can be performed through one test cycle. It is possible to follow the steps.

However, although the test apparatus of the above-described embodiment is configured to include a plurality of test units, the present invention is not limited thereto, and it is of course possible to include a single test unit. In addition, although the test apparatus of this embodiment is configured to include a configuration for loading the device on the test boss and coupling the lead part by itself, loading the device in a separate apparatus and receiving the test board combining the lead part, the test site described above It should be noted that it is also possible to configure the test to proceed in

In the above, the test board, the test apparatus, and the test method of the present invention have been mainly described with reference to some embodiments, but the present invention is not limited to the above embodiments. It is revealed that those of ordinary skill in the art to which the present invention pertains can practice the present invention with various modifications or changes without departing from the scope of the technical features of the present invention as defined in the appended claims. put

1: test device 10: test board
20: device 100: receiving part
200: socket board 300: lead part
1210: loading unit 1220: lead coupling unit
1230: lead separation unit 1240: unloading unit
1400: test unit

Claims (19)

a loading unit for loading a plurality of devices on the test board;
a lead coupling part for coupling the lead part on the test board;
at least one test unit configured to perform a test on a plurality of devices loaded on the test board by using a tester contact terminal formed on an outer surface of the test board; and
a transfer unit for transferring the test board to which the lead unit is coupled in the lead coupling unit to the at least one test unit; and
The plurality of devices are loaded by the loading part and accommodated to be elastically supported in the test board, and as the lead part is coupled to the test board, the plurality of devices and the test board are electrically connected to each other. test device. According to claim 1,
The test unit is electrically connected to the tester contact terminal formed on an outer surface of the test board when the test board is inserted, and tests the plurality of devices. According to claim 1,
a lead separator for separating the lead part of the test board on which the test is completed; and
and an unloading unit for unloading the plurality of devices from the test board from which the leads are separated. 4. The method of claim 3,
a lead transfer unit for transferring the leads separated from the lead separation unit; and
and a board transfer unit for transferring the empty test board from which the plurality of devices are unloaded by the unloading unit. 5. The method of claim 4,
The lead transfer unit transfers the separated lead from the lead separation unit to the lead coupling unit,
The board transfer unit transfers the empty test board from the unloading unit to the loading unit. According to claim 1,
The at least one test unit includes a first test unit that tests the device in a first test environment and a second test unit that tests the device in a second test environment different from the first test environment,
The transfer unit sequentially transfers the test board transferred from the lead coupling unit to the first test unit and the second test unit. 7. The method of claim 6,
The first test unit and the second test unit include a soak chamber for creating an atmosphere in each test environment, a test chamber including a tester to test the plurality of devices in the test environment, and a test environment A semiconductor device test apparatus comprising a de-soak chamber for creating an atmosphere from the atmosphere to the atmosphere. 8. The method of claim 7, wherein the test chamber is
and a tester connected to the tester contact terminal formed on the lower surface of the test board to perform a test, and a pushing module configured to connect the tester contact terminal and the tester by pressing the upper surface of the test board. Device. 8. The method of claim 7,
The first test part and the second test part are in contact with a chamber temperature controller for controlling the temperature inside each test chamber and the test board introduced into the test chamber to control the temperature of the test board. A semiconductor device testing apparatus comprising a section. 10. The method of claim 9,
The board temperature controller selectively contacts the lead part of the test board to adjust the temperature of the test board. According to claim 1,
The plurality of devices loaded onto the test board are devices of a stage before a packaging process is performed. at least one test unit for performing a test on a plurality of devices loaded on the test board; and
Including; a transfer unit for transferring the test board to which the lead unit is coupled in the lead coupling unit to the at least one test unit;
The test board is loaded so that the plurality of devices are elastically supported in the accommodating part, and the lead part is coupled to the upper side of the accommodating part so that the test board and the plurality of devices are electrically connected,
The test unit is electrically connected to a tester contact terminal formed on an outer surface of the test board to perform a test on the plurality of devices. loading the plurality of devices such that the plurality of devices are elastically supported on the receiving portion of the test board;
coupling a lead part on the test board so that the test board and the plurality of devices are electrically connected;
transferring the test board to which the lead part is coupled, and testing the plurality of devices in at least one test part using a tester contact terminal formed on an outer surface of the test board;
separating the lead part from the test board after the test step is performed; and
and unloading the plurality of devices that have been tested from the test board. 14. The method of claim 13,
The test board on which the plurality of devices are unloaded is transferred to a loading unit on which the devices are loaded,
The semiconductor device test method, characterized in that the lead part separated in the step of separating the lead part is transferred to a lead coupling part to be coupled on a test board on which the device is loaded. 14. The method of claim 13,
The testing of the plurality of devices comprises testing the plurality of devices by electrically connecting the tester of the test unit and the tester contact terminal formed on an outer surface of the test board. The method of claim 13, wherein testing the plurality of devices comprises:
a first test step of testing the plurality of devices in a first test environment; and a second test step of testing the plurality of devices in a second test environment different from the first test environment. 17. In claim 16,
The first test step and the second test step are sequentially performed while maintaining the state in which the lead portion is coupled to the test board. The method of claim 13, wherein the testing of the plurality of devices comprises:
adjusting the temperature of the test chamber by using the chamber temperature controller;
electrically connecting the test board to a test in the test chamber; and
and controlling a temperature of the test board by contacting a board temperature controller with the test board. 14. The method of claim 13,
The plurality of devices loaded onto the test board are devices of a stage before a packaging process is performed.

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