KR20200143064A - Semiconductor device inspection apparatus, and device pressing tool - Google Patents

Abstract

The present invention relates to a device inspection apparatus and a device pressing tool used therein. According to the present invention, the device inspection apparatus comprises: a loading unit (100); a test unit (300) having a plurality of test sockets (310); an unloading unit (500); one or more device pressing units (830, 840); and a temperature control unit (739). According to the present invention, the reliability of an inspection can be improved.

Description

Device inspection apparatus and device pressing tool used therein {Semiconductor device inspection apparatus, and device pressing tool}

The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting electrical characteristics of an element, and an element pressing tool used therein.

Semiconductor devices (hereinafter referred to as'devices') are subjected to various tests such as electrical characteristics, heat or pressure reliability tests by a semiconductor device inspection device after completing the package process.

The device inspection is performed at room temperature in a room temperature environment, depending on the type of device such as memory device or non-memory device such as CPU (Central Processing Unit), GPU (Graphic Processing Unit), LED device, and solar device. There are various tests, such as a heating test performed.

Meanwhile, as the types of IT devices such as smart phones, smart pads, and smart TVs are diversified and popularized, the demand for non-memory devices such as CPUs, that is, LSI (Large Scale Integration), is increasing rapidly.

In addition, the LSI is being inspected for smooth operation in a harsh environment, that is, a high temperature environment, a low temperature environment, and the like.

In order to perform such a device test, various device test apparatuses have been proposed according to the type of device and the test contents.

However, due to the thinning, miniaturization, and nano manufacturing processes of devices such as LSI, the test temperature conditions also need to be precisely set.

(Patent Document 1) KR10-1169406 B

(Patent Document 2) KR10-2012-0004068 A

(Patent Document 3) KR10-1177746 B

(Patent Document 4) KR10-1216359 B

(Patent Document 5) KR10-2013-0099781 A

(Patent Document 6) KR10-1417773 B

(Patent Document 7) KR10-2017-0095655 A

It is an object of the present invention to provide a device inspection device capable of establishing an accurate test temperature condition and a device pressing tool used therein by recognizing the problems and necessities of the prior art described above.

The present invention has been created to achieve the object of the present invention as described above, the present invention, the loading unit 100 and a plurality of elements (1) is loaded; A test unit 300 provided with a plurality of test sockets 310 for testing the element 1 transferred from the loading unit 100; An unloading unit 500 for classifying the device 1 tested by the test unit 300 according to a test result; At least one pickup head 700 for picking up the device 1 by vacuum pressure is provided, and a loading position receiving the device 1 directly or indirectly from the loading unit 100, the test socket 310 The device 1 is transferred directly or indirectly to the unloading unit 500 at the pressing position where the test is performed while the device 1 is pressed, and the device 1 that has been tested in the test unit 300 At least one element pressing unit (830, 840) for sequentially moving the unloading position; It includes a temperature control unit 739 for controlling the temperature of the element 1 picked up in the pickup head 700, the pickup head 700 is a vacuum for picking up the element 1 by vacuum pressure. A main block 710 having a forming means; A temperature change unit 720 that is coupled to the main block 710 and changes the temperature of the main block 710 in order to control a test temperature for the element 1 picked up in the main block 710; A first temperature sensor 731 coupled to the temperature change unit 720 to directly or indirectly measure the temperature of the temperature change unit 720; A second temperature sensor 732 coupled to the main block 710 to directly or indirectly measure the temperature of the main block 710; A third installed in the main block 710 and for measuring the temperature of the element 1 picked up in the main block 710 in contact with the upper surface of the element 1 picked up in the main block 710 Disclosed is an element inspection apparatus comprising a temperature sensor 733.

The main block 710 may further include a temperature cut-off means for blocking the temperature of the main block 710 from affecting the third temperature sensor 733.

The temperature blocking means may include a heat insulating member in which the third temperature sensor 733 is installed between the main blocks 710.

The temperature blocking means may maintain a non-contact state of the third temperature sensor 733 to the main block 710.

When the third temperature sensor 733 is adsorbed on the main block 710, the element 1 is connected to the main block 710 so as to maintain a close contact state of the element 1 with the main block 710. It may be installed on the main block 710 so as to be movable in the direction of adsorption when adsorbed on.

When it is determined that the element 1 has not been picked up based on whether the element 1 is picked up by the main block 710, the temperature control unit 739 is configured with the first temperature sensor 731 and the second A standby mode in which the temperature change unit 720 is controlled so that the temperature of the main block 710 is a preset temperature using a temperature sensor 732, and when it is determined that the element 1 is picked up, the first Using the temperature sensor 731 and the third temperature sensor 733, an operation mode of controlling the temperature change unit 720 so that the temperature of the third temperature sensor 733 becomes a preset temperature may be performed. .

The temperature control unit 739 may switch to the standby mode when the temperature of the third temperature sensor 733 changes to a predetermined size or more after the operation mode.

When it is determined that the element 1 is not picked up after the operation mode, the temperature control unit 739 may switch to the standby mode.

The device pressing units 830 and 840 may include one or more of the pickup heads 700; A support part 700 to which the pickup head 700 is detachably coupled; The support part 700 may include a tool moving part for sequentially moving the loading position, the pressing position, and the unloading position.

The loading unit 100 is loaded with at least one tray 2 in which a plurality of elements 1 are loaded, and the element 3 is loaded from the tray 2 of the loading unit 100 through a loading transfer tool 810. ) And temporarily loading the loading buffer unit 200 is installed, and the test unit 300 performs a test by receiving the elements 3 from the loading buffer unit 200, and the test unit 300 ), the unloading buffer unit 400 is installed at a position facing the loading buffer unit 200 to receive the devices 1 tested by the test unit 300, and the unloading The unit 500 may classify and load the elements 1 loaded in the unloading buffer unit 400 through an unloading transfer tool 820 according to a test result of the test unit 300.

The device inspection device according to an embodiment of the present invention and the device pressing tool used therein, when heating or cooling the device to maintain a preset test temperature while inspecting the device based on the test temperature during the testing process for the device By minimizing the temperature range, the reliability of inspection of the device can be improved.

In addition, the device inspection device according to an embodiment of the present invention and the device pressurizing tool used therein control the temperature of the device by measuring the temperature of the device by contacting the surface of the device in maintaining the temperature of the device at the test temperature. In the inspection process for the device, the reliability of the device inspection can be improved by minimizing the temperature range of the device based on the test temperature.

In particular, the device inspection device according to an embodiment of the present invention and the device pressing tool used therein are configured to be in close contact with the surface of the device without interfering with the pickup state of the device by the device pressing tool. By measuring the temperature of the device by controlling the temperature of the device, it is possible to improve the reliability of the device inspection by minimizing the temperature range of the device based on the test temperature during the device inspection process.

1 is a plan view schematically showing an element inspection apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view schematically illustrating an example of a plate member of a loading buffer part and an unloading buffer part in the device inspection apparatus of FIG. 1.
3 is a cross-sectional view schematically illustrating a first shuttle portion and a second shuttle portion in the device inspection apparatus of FIG. 1.
4A and 4B are schematic diagrams showing a process in which a pair of device pressing tools alternately move to a pressing position in the device inspection apparatus of FIG. 1, respectively.
5A and 5B are cross-sectional views showing the configuration of the device pressing tool of FIG. 1, respectively, in which FIG. 5A is a diagram showing a device pick-up state, and FIG. 5B is a diagram illustrating a device pressing state.
6 is a block diagram showing temperature control of the device pressing unit of FIG. 5A.

Hereinafter, an element inspection device according to an embodiment of the present invention and an element pressure tool used therein will be described with reference to the accompanying drawings.

An element inspection apparatus according to an embodiment of the present invention, as shown in FIG. 1, includes a loading unit 100 in which a plurality of elements 1 are loaded; A test unit 300 for testing the elements 1 delivered from the loading unit 100; It may include an unloading unit 500 for classifying and loading the devices 1 according to the test result of the test unit 300.

The device 1 to be tested may be a memory semiconductor, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or a system LSI (Large Scale Integration) non-memory device. The element 1 can be a non-memory element, in particular, an element in which ball-shaped connection terminals are formed on a bottom surface.

A method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 may be performed by various methods.

The loading unit 100 and the unloading unit 500 are configured in which one or more trays 2 in which a plurality of elements 1 are loaded are loaded, and various configurations are possible according to design.

The loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) in which a plurality of trays 2 can be loaded.

Meanwhile, in the loading unit 100, a plurality of trays 2 are appropriately disposed so that the elements 1 can be continuously picked up and transported.

In addition, the tray 2 in which the elements 1 are emptied may be replaced with the tray 2 filled with the elements 1. For example, a set of trays 2 may be automatically or manually loaded into the tray loading unit.

The empty tray 2 after the elements 1 are withdrawn from the loading unit 100 may be transferred to the unloading unit 500 by a tray transfer unit (not shown).

In addition, before the empty tray 2 is transferred to the unloading unit 500, the tray 2 is a tray inversion unit (not shown) so that elements 1 that have not been drawn out from the tray 2 can be removed. Can be rotated (inverted) in

Meanwhile, the unloading unit 500 may be configured similarly to the loading unit 100. For example, in the unloading unit 500, a plurality of empty trays 2 may be appropriately disposed according to the classification class so that the elements 1 can be sequentially sorted and stacked according to the test result.

In the unloading unit 500, the tray 2 filled with the tested elements 1 may be replaced with an empty tray 2.

In addition, between the loading unit 100 and the unloading unit 500, a tray buffer unit (not shown) in which the empty tray 2 is temporarily loaded is added so that the empty tray 2 can be temporarily loaded. Can be installed with.

On the other hand, the tray 2 can be any configuration as long as it is a member in which a plurality of elements 1 are loaded and transported, and a standardized JEDEC tray is used, etc. .

In addition, a plurality of receiving grooves 2a may be formed in the tray 2 so that a plurality of elements 1 can be loaded. For example, the plurality of receiving grooves 2a may be formed in a matrix such as 8×16 in the tray 2.

Accordingly, the loading unit 100 between the loading unit 100 and the test unit 300 so that the speed at which the device 1 is transported can be increased and/or the plurality of devices 1 can be sufficiently preheated. A loading buffer unit 200 in which the elements 1 transferred from the tray 2 of) are temporarily loaded may be installed.

Here, in the case of inspecting the element 1, when the inspection is performed at a predetermined test temperature, for example, a test temperature higher than room temperature, heating of the element 1 may be shortened through preheating, thereby increasing the process speed.

In addition, between the test unit 300 and the unloading unit 500, the devices 1 tested by the test unit 300 are temporarily loaded so that the speed at which the device 1 is transported can be increased. The unloading buffer unit 400 may be provided.

The unloading buffer unit 400 may be installed at a position facing the loading buffer unit 200 with the test unit 300 as the center.

Accordingly, the device 1 to be tested may be transferred from the loading unit 100, temporarily loaded in the loading buffer unit 200, and then transferred to the test unit 300, and the device ( 1) may be transmitted from the test unit 300 and temporarily loaded in the unloading buffer unit 400 and then transferred to the unloading unit 500.

In particular, in the loading buffer unit 200 and the unloading buffer unit 500, in order to improve the inspection speed, a relatively large number of elements ( 1) can be loaded.

The loading buffer unit 200 and the unloading buffer unit 400 are, as shown in Figs. 2 and 3, a plurality of loading grooves 211 and 411 on the upper surface so that a plurality of elements 1 can be loaded. ) May include plate-shaped plate members 210 and 410 formed therein.

The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be configured substantially the same as each other. However, when it is necessary to heat (preheat) the element 1 in order to test the element 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer unit 200.

The loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer part 200 and the unloading buffer part 400 are matched to the spacing of the test sockets 310 of the test part 300. It may be arranged, or may be arranged according to the spacing of the receiving grooves (2a) of the tray (2).

For example, the spacing of the receiving grooves 2a of the tray 2 and the spacing of the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer part 200 and the unloading buffer part 400 Is the same, and the spacing of the test sockets 310 of the test unit 300 may be formed n times, for example, twice the spacing of the receiving grooves 2a of the tray 2.

The plate members 210 and 410 are a component for exchanging elements with the test unit 300 by temporarily loading the elements 1, and are installed in a fixed state or movably installed inside the element inspection device. Etc. Various configurations are possible.

As shown in FIG. 1, the test unit 300 is for testing the device 1 transmitted from the loading buffer unit 200, and various configurations are possible according to the type of test. A plurality of test sockets 310 to which the device 1 is pressed are installed in the test unit 300.

For example, the plurality of test sockets 310 are provided with terminals corresponding to the terminals of the device 1 and connected to the test board, and under the test temperature through the process of pressing the device 1 to the terminals. An inspection such as whether the device 1 is operated or not may be performed.

The test sockets 310 may be arranged in various matrices such as 8×2 and 8×4.

The test socket 310 is a configuration for connection between the device 1 and a terminal for testing the device 1, and various configurations are possible. The test socket 310 may be installed to be replaceable according to the type of device, the type of test, and the like.

Meanwhile, the test unit 300 may be an independent configuration in which the test socket 310 and the rest of the configuration are modularized, and may be implemented as a PCB board with the test socket 310 installed as a simple configuration.

In particular, when the test unit 300 is implemented as a PCB board on which the test socket 310 is installed, the test socket 310 is characterized for each test, thereby significantly reducing the configuration cost of the relatively expensive test unit 300 can do.

Meanwhile, in the test unit 300, various tests may be performed. More preferably, the test unit 300 may be configured to enable testing of the device 1 under test temperatures such as high temperature and low temperature.

In the case of a test related to temperature, such as a high temperature test, the test unit 300 may include a test socket 310 and a chamber member surrounding a partial area to minimize temperature change.

On the other hand, the element exchanged between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is transferred from the loading buffer unit 200 rather than directly It may be achieved by the shuttle units 610 and 620 that transfer (1) toward the test unit 300 and transfer the element 1 transferred from the test unit 300 toward the unloading buffer unit 400.

The shuttle units 610 and 620 are various configurations as a configuration for exchanging elements between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 This is possible.

For example, as shown in Figs. 1 and 3, the shuttle units 610 and 620 have a first element transfer position for receiving the element 1 from the loading unit 100, the test unit 300, and The first shuttle unit 610 and the loading unit 100 are moved between the element exchange position for exchanging the element 1 and the second element transfer position for transferring the element 1 to the unloading unit 500 The first device transfer position for receiving the device 1 from the device 1, the device exchange position for exchanging the test unit 300 and the device 1, and a second device for transferring the device 1 to the unloading unit 500 It may include a second shuttle unit 620 that is moved between the device transfer position.

Here, the first device transmission position, the device exchange position, and the second device transmission position may be variously arranged according to the configuration of the device, and may be sequentially arranged in a straight line.

The first shuttle unit 610 and the second shuttle unit 620 may be disposed on both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween.

The first shuttle unit 610 and the second shuttle unit 620 are horizontally arranged along the guide rails 611 and 621 that are installed opposite to each other around the test unit 300 and the guide rails 611 and 621. While moving to, the first device transfer position for receiving the device from the loading buffer unit 200, the device exchange position with the test unit 300, the second device transfer position for transferring the device to the unloading buffer unit 400 One or more shuttle plates 612 and 622 in which the elements 1 are mounted and the shuttle plates 612 and 622 are detachably coupled and are installed to move along the guide rails 611 and 621 Governments 613 and 623 may be included.

The guide rails 611 and 621 are configured to guide the movement of the shuttle plates 612 and 622, and various configurations are possible.

In the shuttle plates 612 and 622, for element exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400, the element 1 ) One or more device seating grooves are formed.

The plate fixing portions 613 and 623 are installed for convenient replacement of the shuttle plates 612 and 622, and may have various configurations, and a heater for heating the element 1 may be provided.

Since the shuttle plates 612 and 622 are detachably installed on the plate fixing portions 613 and 623, the device 1 is seated when the type of the device 1 to be inspected, in particular, the size of the device 1 is different. Shuttle plates 612 and 622 that are used may be replaced.

The plate fixing portions 613 and 623 may be provided with plate detachable portions 614 and 624 for detachably fixing the shuttle plates 612 and 622 to the plate fixing portions 613 and 623.

The plate detachment part 614, 624 is a configuration for detaching and detaching the shuttle plates 612 and 622 from the plate fixing parts 613 and 623, and various configurations are possible, and the shuttle plate 612 and 622 by a simple manual operation It may be configured to be detachable.

On the other hand, while moving between the loading unit 100 and the shuttle unit (610, 620), one or more loading transfer tools that pick up the element 1 from the loading unit 100 and deliver it to the shuttle unit (610, 620) ( 810, 814) may be installed.

In this case, while the one loading transfer tool 810, 814 moves between the loading unit 100 and the shuttle unit 610, 620, the element 1 is picked up from the loading unit 100 and the shuttle unit 610 , 620).

And, as described above, when the loading buffer unit 200 is installed, the loading transfer tools 810 and 814 pick up the element 1 from the loading unit 100 and deliver it to the loading buffer unit 200. It may include a first loading transfer tool 810 and a second loading transfer tool 814 that picks up the element 1 from the loading buffer unit 200 and delivers it to the shuttle units 610 and 620.

In addition, while moving between the shuttle units 610 and 620 and the unloading unit 500, one or more unloading transfers that pick up the element 1 from the shuttle units 610 and 620 and deliver it to the unloading unit 500 Tools 820 and 824 may be installed.

In this case, while the one unloading and transfer tool (820, 824) moves between the shuttle units (610, 620) and the unloading unit 500, picking up the element 1 from the shuttle units (610, 620) It may be configured to be transmitted to the unloading unit 500.

And, as described above, when the unloading buffer unit 400 is installed, the unloading transfer tools 820 and 824 pick up the element 1 from the unloading buffer unit 400, and the unloading unit 500 ) And a second unloading transfer tool 824 that picks up the element 1 from the shuttle units 610 and 620 and delivers it to the unloading buffer unit 400 Can include.

The loading and transfer tools 810 and 814 and the unloading and transfer tools 820 and 824 may be configured to be the same as or similar to each other.

The loading and transfer tools 810 and 814 and the unloading and transfer tools 820 and 824 are configured for transferring the element 1, respectively, and a plurality of pickers for picking up the element 1 and a vertical direction (Z direction) ) And a driving device for driving the movement of a plurality of pickers in a horizontal direction (XY direction), and the like.

The picker is a configuration for picking up the device 1 and transferring it to a predetermined position, and various configurations are possible, and an adsorption pad that forms vacuum pressure on the upper surface of the device 1 and a pneumatic cylinder that transfers pneumatic pressure to the adsorption pad It can be composed of.

The pickers are spaced between the receiving grooves 2a of the tray 2 of the loading part 100 and the unloading part 500, and the plate member 210 of the loading buffer part 200 and the unloading buffer part 400. , In consideration of the case where the spacing of the loading grooves 211 and 411 of the 410 is different from each other, it may be configured to be able to adjust the horizontal and vertical spacing, but The vertical spacing can be fixed.

The driving device for moving the plurality of pickers may have various configurations according to the driving mode of the pickers, and may include a vertical movement device for moving the pickers up and down and a left and right movement device for moving the pickers in the left and right directions. .

The up-and-down device may be configured to move all of the pickers up and down at a time, or may be individually connected to each picker so that each picker is independently moved up and down.

The left and right movement device may be configured in various ways according to the mode of movement of the pickers, and may be configured to enable movement in a single direction in the X or Y direction, or in the X-Y direction.

Meanwhile, while moving between the test unit 300 and the shuttle units 610 and 620, the device 1 is picked up from the shuttle units 610 and 620 and pressurized with the test socket 310, and then applied to the test socket 310. One or more device pressing units 830 and 840 may be installed to deliver the pressurized and tested devices to the shuttle units 610 and 620.

The device pressing units 830 and 840 are configured for transferring the device 1 between the test unit 300 and the first shuttle unit 610 and between the test unit 300 and the second shuttle unit 620 As such, various configurations are possible depending on the mode of transport of the element 1.

As shown in FIGS. 4A and 4B, the device pressing parts 830 and 840 move between the first shuttle part 610 and the test part 300, while moving between the first shuttle part 610 and the device 1 ) Picked up, pressurized by the test socket 310, and pressurized against the test socket 310 to deliver the tested element to the first shuttle unit 610, the first device self-pressing unit 830, and the second shuttle unit ( While moving between the test unit 620 and the test unit 300, the device 1 is picked up from the second shuttle unit 620 and is pressed with the test socket 310, and the test is completed by pressing the test socket 310. A second device self-pressing unit 840 that is transmitted to the shuttle unit 620 may be included.

As described above, when the device pressing units 830 and 840 are configured as a pair, the pair of device pressing units 830 and 840 may be moved in conjunction with each other for convenience of element exchange.

Meanwhile, the device pressing units 830 and 840 are installed in one or more, and include one or more pickup heads 700 for picking up the device 1 by vacuum pressure, directly or indirectly from the loading unit 100. A loading position to receive the device 1, a pressing position for performing a test while pressing the device 1 to the test socket 310, and an unloading unit for the device 1 tested in the test unit 300 As a configuration for sequentially moving the unloading position for directly or indirectly transferring the device 1 to 500, various configurations other than the embodiments of FIGS. 4A and 4B are possible.

As an example, the device pressing units 830 and 840 may include one or more pickup heads 700; A support part 700 to which the pickup head 700 is detachably coupled; The support part 700 may include a tool moving part for sequentially moving the loading position, the pressing position and the unloading position.

The support part 700 is a configuration in which one or more pickup heads 700 are detachably coupled to support the pickup head 700, and various configurations are possible according to the support structure of the pickup head 700.

As an example, the support part 700 includes a main body 832a, 842a coupled to a moving structure (not shown) so as to be moved by a tool moving unit to be described later, and one or more pickups in a state coupled to the main body 832a, 842a. A buffer member (not shown) to which the head 700 is detachably coupled may be included.

The main bodies 832a and 842a are configured to be coupled to a moving structure (not shown) so as to be moved by a tool moving unit, and various configurations are possible.

The buffer member is a configuration in which at least one pickup head 700 is detachably coupled in a state coupled to the main bodies 832a and 842a, and various configurations are possible.

In particular, the buffer member is a detachable coupling structure to the test unit 300, vacuum pressure transmission to the pickup head 700, auxiliary components for power supply and signal transmission and reception of sensors installed in the pickup head 700 are installed. I can.

Particularly, the auxiliary components installed in the buffer member may be automatically coupled or connected to at least some of the auxiliary components installed in the pickup head 700 when the pickup head 700 is detachably coupled.

The tool moving part is a configuration that sequentially moves the loading position, the pressing position and the unloading position of the support part 700, that is, the pickup head 700 coupled to the support part 700, and various configurations are possible according to the moving structure. Do.

Since various embodiments are presented in the prior art documents presented in the background technology, a detailed description of the tool moving unit is omitted.

The pickup head 700 is configured to pick up the element 1 by vacuum pressure, and various configurations are possible.

In particular, the pickup head 700 includes a main block 710 having a vacuum forming means for picking up the element 1 by vacuum pressure; A temperature change unit 720 that is coupled to the main block 710 and changes the temperature of the main block 710 in order to control the test temperature for the element 1 picked up by the main block 710; A first temperature sensor 731 coupled to the temperature change unit 720 to directly or indirectly measure the temperature of the temperature change unit 720; A second temperature sensor 732 coupled to the main block 710 to directly or indirectly measure the temperature of the main block 710; A third temperature sensor installed in the main block 710 and for measuring the temperature of the element 1 picked up in the main block 710 in contact with the upper surface of the element 1 picked up in the main block 710 ( 733) may be included.

The main block 710 is configured to pick up the element 1 by vacuum pressure, and various configurations are possible.

The vacuum forming means is provided in the main block 710 and is a means for picking up the element 1 by vacuum pressure, and various configurations are possible.

As an example, the vacuum forming means may be configured as disclosed in Patent Document 7.

At this time, the main block 710 may be connected to a pneumatic transmission pipe connected to a pneumatic generating device to form a vacuum pressure forming passage to form a vacuum pressure on the suction surface of the main block 710.

Meanwhile, the main block 710 picks up the element 1 by vacuum pressure and presses the element 1 on the test socket 310, and thus may have a suitable shape and structure.

The temperature change unit 720 is a configuration that changes the temperature of the main block 710 in order to control the test temperature for the element 1 that is coupled to the main block 710 and picked up in the main block 710. , Various configurations are possible depending on the heating and/or cooling function.

For example, the temperature change unit 720 may be configured as a thermoelectric module capable of absorbing heat and dissipating heat in a portion coupled to the main block 710, or configured as a heater that performs only a heating function.

In addition, the temperature change part 720 may be directly coupled to the above-described main bodies 832a and 842a, or may be indirectly coupled to the main bodies 832a and 842a by interposing the buffer member.

At this time, the temperature change part 720 may be directly or indirectly coupled to the main bodies 832a and 842a together with a heat insulating means for preventing transmission to the main bodies 832a and 842a, such as an insulating member.

The first temperature sensor 731 is a component that is coupled to the temperature change unit 720 to directly or indirectly measure the temperature of the temperature change unit 720, and includes a thermocouple, a resistance temperature sensor (RTD), etc. Can be used.

The second temperature sensor 732 is coupled to the main block 710 to directly or indirectly measure the temperature of the main block 710, and a thermocouple, a resistance temperature sensor (RTD), etc. may be used. have.

The third temperature sensor 733 is installed in the main block 710 and is in contact with the upper surface of the element 1 picked up in the main block 710, and the element 1 picked up in the main block 710 is As a configuration for measuring temperature, a thermocouple, a resistance temperature sensor (RTD), or the like may be used.

In particular, it is preferable that the third temperature sensor 733 uses a resistance temperature sensor (RTD) for more precise temperature measurement.

Meanwhile, the third temperature sensor 733 is preferably measured by contacting the temperature of the element 1 picked up in the main block 710, but the third temperature sensor 733 and the upper surface of the element 1 There is a problem that may interfere with the device pickup of the main block 710 due to the contact of.

Accordingly, when the third temperature sensor 733 is adsorbed on the main block 710, the element 1 is adsorbed on the main block 710 so that the element 1 can maintain a close contact state with the main block 710. It is preferable to be installed on the main block 710 so as to be movable in the adsorption direction (Z-axis direction).

A configuration in which the third temperature sensor 733 is installed to be movable in the adsorption direction (Z-axis direction) can be variously configured.

For example, the main block 710 may be provided with an installation recess 712 such that the elastic member holder 950 is inserted and installed on the suction surface.

The installation groove 712 is formed on the adsorption surface of the main block 710 so that the elastic member holder 950 is inserted and installed, and may be variously formed according to the shape of the elastic member holder 950.

Here, the elastic member holder 950 forms an installation space SS in which an elastic member 930 for pressing the sensor member 920 out of the suction surface of the main block 710 in the installation groove 712 is installed. And, when the sensor member 920 is pressed by the elastic member 930, various configurations are possible, such as forming a locking protrusion for preventing the sensor member 920 from being separated outward.

For example, the elastic member holder 950 may be composed of a cylinder member having an upper end opening to fit the elastic member 930 and a lower end having an opening having a size smaller than the upper opening.

In addition, the elastic member holder 950 may be composed of a disc having an open center to simply form a locking protrusion for preventing the sensor member 920 from being separated outward when the sensor member 920 is pressed by the elastic member 930. .

The elastic member 930 is installed in the installation space SS formed by the elastic member holder 950 to press the sensor member 920 to the outside of the adsorption surface of the main block 710, a coil spring, Various configurations such as leaf springs are possible.

The sensor member 920 is pressurized by the elastic force of the elastic member 920 to protrude to the outside of the adsorption surface of the main block 710, and is installed to be movable in the adsorption direction (Z-axis direction). It is possible to maintain the state of adhesion to the device 1 without disturbing adsorption by ).

Here, the sensor member 920 is directly or indirectly in surface contact with the element 1 by a surface contact expansion member 910 to be described later, and is connected to a temperature control unit 739 to be described later by a wiring 950. As a member that measures the temperature of (1), various configurations are possible according to the measurement principle and structure of the temperature sensor.

Here, in the main block 710, a hole 714 for installing the wiring 950 may be formed.

The surface contact expansion member 910 is a member for increasing a contact area with the device 1 and may have various shapes such as a plate shape having a flat surface for increasing surface contact with the device 1.

At this time, the main block 710 may have a receiving groove 713 in which the surface contact expansion member 910 is accommodated so that the element 1 can be in close contact with the suction surface of the main block 710 by vacuum pressure. have.

Meanwhile, when the element 1 is adsorbed on the adsorption surface of the main block 710 by vacuum pressure, the element 1 is adsorbed to the adsorption surface of the main block 710 by an adsorption force greater than the elastic force of the elastic member 930. At this time, the sensor member 920 is pushed upward by an adsorption force greater than the elastic force of the elastic member 930 and rises.

At this time, the elastic force of the elastic member 930 is still acting on the sensor member 920, and the sensor member 920 maintains a direct or indirect contact with the device 1, Temperature measurement becomes possible.

Meanwhile, when the temperature of the element 1 by the third temperature sensor 700 is measured, distortion due to the temperature of the main block 710 may occur. In order to prevent this, the main block 710 is provided with the main block ( A temperature cutoff means for blocking the temperature of 710 from affecting the third temperature sensor 733 may be additionally provided.

The temperature blocking means is configured to block the temperature of the main block 710 from affecting the third temperature sensor 733, and various configurations are possible.

For example, the temperature blocking means may be composed of a heat insulating member in which the third temperature sensor 733 is installed between the main blocks 710.

Specifically, since the surface contact expansion member 910 is formed of a heat insulating member, the temperature of the main block 710, that is, heat is blocked from being transferred to the third temperature sensor 733, so that the temperature of the main block 710 is reduced. It is possible to block the influence on the third temperature sensor 733.

In addition, the temperature blocking means may be configured as a means for maintaining a non-contact state of the third temperature sensor 733 to the main block 710.

Meanwhile, the device inspection apparatus according to the present invention includes a temperature control unit 739 for controlling the temperature of the device 1 picked up in the pickup head 700.

The temperature control unit 739 is a configuration for controlling the temperature of the element 1 picked up by the pickup head 700, and various configurations are possible.

In particular, the temperature control unit 739 uses the first temperature sensor 731, the second temperature sensor 732, and the third temperature sensor 733 to determine the temperature of the element 1 picked up by the pickup head 700. It is configured to control, in particular, to control the temperature change unit 720.

For example, when it is determined that the element 1 is not picked up based on whether the element 1 is picked up by the main block 710, the temperature control unit 739 A standby mode in which the temperature change unit 720 is controlled so that the temperature of the main block 710 becomes a preset temperature using the temperature sensor 732, and when it is determined that the element 1 is picked up, the first temperature sensor ( 731) and the third temperature sensor 733 to control the temperature change unit 720 through the operation mode of controlling the temperature change unit 720 so that the temperature of the third temperature sensor 733 becomes a preset temperature. I can.

In the standby mode, when it is determined that the element 1 is not picked up based on whether the element 1 is picked up by the main block 710, the first temperature sensor 731 and the second temperature sensor 732 are operated. As a mode for controlling the temperature change unit 720 so that the temperature of the main block 710 becomes a preset temperature, the temperature change unit 720 is controlled while the main block 710 does not pick up the element 1 As a mode, the temperature change unit 720 may be controlled by the method disclosed in Patent Document 7.

On the other hand, whether the element 1 is picked up by the main block 710 is determined whether the element 1 is picked up from the pressure change in the vacuum pressure flow path or not through a separate sensor according to whether the element 1 is picked up or not. It can be performed by various methods, such as measuring whether the device 1 is picked up or not.

For reference, when the element 1 is picked up by the main block 710, the pressure in the vacuum pressure flow path is rapidly lowered, and when the element 1 is not picked up by the main block 710, the suction pressure is maintained as it is.

The operation mode is a temperature so that the temperature of the third temperature sensor 733 becomes a preset temperature using the first temperature sensor 731 and the third temperature sensor 733 when it is determined that the element 1 is picked up. As a mode for controlling the change unit 720, unlike the use of the second temperature sensor 732 in the standby mode in the control of the temperature change unit 720, the temperature change unit ( 720) is used to control.

Here, by controlling the temperature change unit 720 using the third temperature sensor 733 that can accurately measure the temperature of the element 1, it is possible to optimally maintain the test temperature condition for the element 1 .

Specifically, when the second temperature sensor 732 is used to control the test temperature for the device 1, the temperature of the device 1 is indirectly measured from the temperature of the main block 710 that picks up the device 1 According to the measurement, the sensitivity to temperature change of the device 1 is low, and there is a problem that the time to reach the test temperature condition for the device 1 increases.

In addition, as the temperature of the element 1 is measured indirectly from the temperature of the main block 710, the sensitivity to the temperature change of the element 1 is low, and the reaction to the temperature change of the temperature of the element 1 is slow. (1) There is a problem of not being able to quickly cope with the temperature change.

In contrast, the device inspection apparatus according to the present invention controls the temperature change unit 720 by using the third temperature sensor 733 that can accurately measure the temperature of the device 1 to test the device 1 Temperature conditions can be maintained optimally.

In addition, the device inspection apparatus according to the present invention can quickly reach a test temperature for the device 1 and can respond quickly to a temperature change of the device 1.

Meanwhile, the temperature control unit 739 may switch to the standby mode when the temperature of the third temperature sensor 733 changes beyond a preset size after the operation mode.

In addition, when it is determined that the element 1 is not picked up after the operation mode, the temperature control unit 739 may switch to the standby mode.

On the other hand, if the pick-up condition is poor or the pick-up is defective, such as a failure to pick-up the element after being recognized as the pick-up condition of the element 1 by the main block 710, the third temperature is even though the main block 710 is sufficiently heated. Since the temperature measured by the sensor 733 is low, there is a problem in that the temperature change unit 720 may be overheated and damaged.

Specifically, when the pickup is defective, the temperature measured by the third temperature sensor 733 is low as the temperature measured by the third temperature sensor 733 is low as the main block 710 is sufficiently heated as it is cooled by the air flow around the third temperature sensor 733. 720) has a problem that can be damaged by overheating.

Accordingly, the temperature control unit 739 may switch from the operation mode to the standby mode when an abnormal situation occurs, such as when the temperature measured by the second temperature sensor 732 is greater than a preset temperature after the operation mode.

At this time, the device inspection apparatus according to the present invention may notify a user of a malfunction by various methods such as sound and time when an abnormal situation occurs.

Meanwhile, it goes without saying that the configuration of the device pressing unit and the pickup head described above may be variously applied in addition to the device inspection apparatus of the above-described embodiment.

In the above, preferred embodiments of the present invention have been exemplarily described, but the scope of the present invention is not limited to such specific embodiments, and can be appropriately changed within the scope described in the claims.

1: device 310: test socket
830, 840: element pressure section

Claims (10)

A loading unit 100 on which a plurality of elements 1 are loaded;
A test unit 300 provided with a plurality of test sockets 310 for testing the element 1 transferred from the loading unit 100;
An unloading unit 500 for classifying the device 1 tested by the test unit 300 according to a test result;
At least one pickup head 700 for picking up the device 1 by vacuum pressure is provided, and a loading position receiving the device 1 directly or indirectly from the loading unit 100, the test socket 310 The device 1 is transferred directly or indirectly to the unloading unit 500 at the pressing position where the test is performed while the device 1 is pressed, and the device 1 that has been tested in the test unit 300 At least one element pressing unit (830, 840) for sequentially moving the unloading position;
It includes a temperature control unit 739 for controlling the temperature of the element 1 picked up in the pickup head 700,
The pickup head 700,
A main block 710 having a vacuum forming means for picking up the element 1 by vacuum pressure;
A temperature change unit 720 that is coupled to the main block 710 and changes the temperature of the main block 710 in order to control a test temperature for the element 1 picked up in the main block 710;
A first temperature sensor 731 coupled to the temperature change unit 720 to directly or indirectly measure the temperature of the temperature change unit 720;
A second temperature sensor 732 coupled to the main block 710 to directly or indirectly measure the temperature of the main block 710;
A third installed in the main block 710 and for measuring the temperature of the element 1 picked up in the main block 710 in contact with the upper surface of the element 1 picked up in the main block 710 Element inspection apparatus comprising a temperature sensor (733). The method according to claim 1,
The main block 710,
The device inspection device, characterized in that it further comprises a temperature cut-off means for blocking the temperature of the main block (710) from affecting the third temperature sensor (733). The method according to claim 2,
The temperature blocking means,
Device inspection device, characterized in that the third temperature sensor (733) is a heat insulating member installed between the main block (710). The method according to claim 2,
The temperature blocking means,
The device inspection apparatus, characterized in that the third temperature sensor (733) maintains a non-contact state with the main block (710). The method according to any one of claims 1 to 4,
When the third temperature sensor 733 is adsorbed on the main block 710, the element 1 is connected to the main block 710 so as to maintain a close contact state of the element 1 with the main block 710. Device inspection device, characterized in that installed on the main block (710) so as to be movable in the direction of adsorption when adsorbed to the device. The method according to any one of claims 1 to 4,
The temperature control unit 739,
When it is determined that the element 1 is not picked up based on whether the element 1 is picked up by the main block 710, the first temperature sensor 731 and the second temperature sensor 732 are used. A standby mode for controlling the temperature change unit 720 so that the temperature of the main block 710 becomes a preset temperature, and
When it is determined that the element 1 is picked up, the temperature of the third temperature sensor 733 is changed to a preset temperature using the first temperature sensor 731 and the third temperature sensor 733. Device inspection device, characterized in that performing an operation mode for controlling the unit 720. The method of claim 6,
The temperature control unit 739,
And switching to the standby mode when the temperature of the third temperature sensor (733) changes beyond a preset size after the operation mode. The method of claim 6,
The temperature control unit 739,
When it is determined that the device (1) is not picked up after the operation mode, the device is switched to the standby mode. The method according to any one of claims 1 to 4,
The device pressing parts 830 and 840,
At least one pickup head 700;
A support part 700 to which the pickup head 700 is detachably coupled;
And a tool moving part for sequentially moving the support part 700 to the loading position, the pressing position, and the unloading position. The method according to any one of claims 1 to 4,
The loading unit 100 is loaded with one or more trays 2 on which a plurality of elements 1 are loaded,
A loading buffer unit 200 for receiving and temporarily loading the elements 3 from the tray 2 of the loading unit 100 through the loading transfer tool 810 is installed,
The test unit 300 performs a test by receiving the elements 3 from the loading buffer unit 200,
An unloading buffer part 400 is installed with the test part 300 at a position opposite to the loading buffer part 200 to receive the devices 1 tested by the test part 300. And
The unloading unit 500 classifies and loads the elements 1 loaded in the unloading buffer unit 400 according to the test result of the test unit 300 through the unloading transfer tool 820. Device inspection device characterized in that.

Images