CN219324478U - Feeding system and chip test sorting machine - Google Patents

Abstract

The present disclosure relates to a loading system and a chip test handler. This feeding system includes: the feeding device, the classifying device and the direction identifying device are sequentially connected; the direction recognition device comprises a circulation mechanism, a polarity detection unit and a visual detection unit, wherein the polarity detection unit is used for detecting the polarity of a chip borne by the circulation mechanism, and the visual detection unit is used for detecting at least one of a first surface and a second surface opposite to the first surface of the chip borne by the circulation mechanism. The feeding system can realize the classification detection, comprehensively detect each chip, accurately feed, overcome the phenomenon of material flying and realize continuous detection and feeding.

Description

Feeding system and chip test sorting machine

Technical Field

The disclosure relates to the technical field of automation equipment, in particular to a feeding system and a chip testing and sorting machine.

Background

Today's technology is continuously developed and innovated, and applications and demands of integrated circuits (integrated circuit, abbreviated as ICs) are increasing, and since ICs are required to undergo multiple precise manufacturing processes during the production process, a series of electrical performance tests are required to ensure the product quality of the ICs before the ICs are sold by factories. With the continuous development and perfection of the functions of the ICs, the requirements on the testing environment of the ICs are higher and higher, and the testing requirements are wider and wider.

For example, to obtain the performance of an IC at different temperatures, the IC needs to be tested at different temperatures, and it is generally required to test at normal temperature and at high temperature. For ICs with low temperature test requirements, it is also desirable to test in a low temperature environment. In order to meet the requirement of complex testing environment, a heat insulation sealing design is usually required, which increases the structural complexity of the sorting tester and increases the connection error of each system.

In order to automatically test the IC, a feeding system is required to be arranged, and meanwhile, the feeding system is required to have higher precision. The thermal expansion and contraction change caused by the test environment can further generate an error problem, and particularly the feeding error problem is more serious and even difficult to meet the requirement for an IC with smaller size.

Disclosure of Invention

Based on the above, it is necessary to provide a feeding system and a chip test handler for solving the problem of feeding errors in testing chips.

The embodiment of the disclosure provides a feeding system, which comprises: the feeding device, the classifying device and the direction identifying device are sequentially connected; the direction recognition device comprises a circulation mechanism, a polarity detection unit and a visual detection unit, wherein the polarity detection unit is used for detecting the polarity of a chip borne by the circulation mechanism, and the visual detection unit is used for detecting at least one of a first surface and a second surface opposite to the first surface of the chip borne by the circulation mechanism.

The feeding system provided by the embodiment of the disclosure can realize the classification detection, comprehensively detect each chip, accurately feed, overcome the phenomenon of material flying, realize the continuous detection and feeding, and facilitate the precise feeding. The feeding system can be used for testing environments such as low-temperature testing and three-temperature testing, and can realize a translational feeding mode, so that higher cost performance is realized with lower cost.

Illustratively, the feeding system is used for feeding chips with package sizes below 2mm×2 mm.

The smaller the size is, the harder the chip is to be fed, and the feeding system provided by the disclosure can accurately feed the small-size chip.

In some embodiments, the loading device comprises a vibratory pan and a classification track, the classification track comprising a vent, the vent being located upstream of an end of the classification track; the classification device comprises a beating cylinder, a compression bar, a classification motor and a classification mechanism, wherein the classification mechanism is driven by the classification motor and can reciprocate between the tail end of the classification track and the circulation mechanism, the beating cylinder is positioned at the upstream of the tail end of the classification track and is arranged at intervals with the tail end of the classification track, and the compression bar is configured to press the tail end of the classification track.

So set up, can guarantee loading attachment material loading continuous stability, the material is carried generally, is in place to can controllably divide the grain in proper order, avoid the material that flies.

In some embodiments, the circulation mechanism includes a turntable mechanism, and the polarity detection unit and the visual detection unit are disposed in sequence along a circumferential direction of the turntable mechanism.

The rotary table mechanism is arranged, so that the feeding system is compact in structure, and a plurality of feeding levels can be provided while each item of detection is ensured to be accurate and efficient.

The embodiment of the disclosure also provides a chip testing and sorting machine, which comprises the feeding system, the first material shuttle device, the material taking device, the second material shuttle device and the pressure measuring area which are sequentially connected.

The chip testing and sorting machine provided by the embodiment of the disclosure can realize automatic continuous testing and has at least one beneficial effect of low cost, high cost performance, stable feeding, accurate feeding, simple congestion treatment, high output per hour and the like. In addition, the chip test separator has the advantages of short time, high efficiency, high cost performance, low test replacement cost and the like compared with gravity type equipment and the like.

The chip test handler is used for testing chips of a package size of 2mm×2mm or less, for example.

The smaller the size is, the harder the chip is to feed and test, and the chip test sorting machine provided by the disclosure can accurately feed the small-size chip and then finish the test.

In some embodiments, the reclaimer device comprises a reclaimer mechanism and a visual positioning mechanism positionally interconnected; the first shuttle device comprises a first calibration block suitable for being identified by the visual positioning mechanism, and the second shuttle device comprises a second calibration block suitable for being identified by the visual positioning mechanism.

By the arrangement, the material taking device can transfer the chip to be tested more accurately. The chip test sorting machine can detect and sort small-size chips.

In some embodiments, the material taking mechanism comprises a row frame, a bidirectional driver, a cross beam and a manipulator, wherein the manipulator is arranged on the cross beam, the manipulator is driven by the bidirectional driver to move along the cross beam, and the cross beam is driven by the bidirectional driver to move along the row frame; the manipulator comprises a lifter and a suction nozzle module driven by the lifter; the visual positioning mechanism includes a camera positionally coupled to the manipulator.

The material taking mechanism has the advantages of large stroke range, comprehensive stroke coverage position, reliable and accurate movement and positioning, and is also beneficial to compensating part precision errors caused by thermal expansion and cold contraction. The chip testing and sorting machine provided by the embodiment of the disclosure is reliable in operation and good in performance.

In some embodiments, the take off mechanism further comprises a first magnetic grid configured to measure the relative position of the carriage and the cross beam and a second magnetic grid configured to measure the relative position of the robot and the cross beam.

By the arrangement, accurate movement of the manipulator can be realized, movement errors are reduced, correction response time is shortened, and the working efficiency and the working quality of the chip testing and sorting machine are ensured.

In some embodiments, the chip test handler further includes a pre-warming tray, an effective stroke of the take-off device covering the pre-warming tray; the chip testing and sorting machine is provided with a first sealing cavity and a second sealing cavity, and the first sealing cavity is filled with drying gas; the material taking device, the second material shuttle device and the pressure measuring area are at least partially positioned in the first sealing cavity, and the material feeding system and the first material shuttle device are at least partially positioned in the second sealing cavity.

The arrangement is beneficial to regulating and controlling the working space in the chip test sorting machine and ensuring the stable and reliable working environment of core functional areas such as the pressure measuring area. The chip testing and sorting machine is suitable for low-temperature testing of chips, and can avoid the problems of frosting, condensation and the like possibly caused by a low-temperature environment.

In some embodiments, the chip test handler further includes a temperature control system including a coolant passage in communication with the pre-warming tray, the second shuttle device, and the pressure zone, and a heating rod configured to controllably heat the coolant passage.

The temperature of the preheating disc and the temperature measuring area can be regulated and controlled more accurately, and high-temperature test can be realized. The chip test sorting machine provided by the embodiment of the disclosure has abundant test items, can realize three-temperature test at low temperature, normal temperature and high temperature, has excellent test performance, realizes short conversion time with lower equipment cost, simple Jam processing and high output per hour, and realizes cost reduction and synergy.

In some embodiments, the chip test handler further comprises a third shuttle device, a discharging device and a receiving device sequentially connected downstream of the pressure measuring area, wherein the third shuttle device, the discharging device and the receiving device are at least partially positioned in the first sealing cavity; the number of the second material shuttle devices, the number of the third material shuttle devices and the number of the material receiving devices are at least two respectively.

By the arrangement, the chip test sorting machine can realize stable and accurate feeding, testing and sorting processes, and enriches sorting types.

Drawings

Fig. 1 is a schematic structural view of a chip test handler provided in an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a feeding system provided in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a classification device in a feeding system according to an embodiment of the present disclosure;

FIG. 4 is a schematic block diagram of a reclaimer device provided by an embodiment of the present disclosure;

FIG. 5 is a partial schematic view of a first shuttle device according to an embodiment of the present disclosure;

fig. 6 is a partial schematic view of a chip test handler provided by an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a chip test handler provided in an embodiment of the present disclosure.

Reference numerals illustrate: 1000. a chip test handler; 1. a feeding system; 2. a feeding device; 3. a classification device; 4. a direction recognition device; 5. a first shuttle device; 50. a first calibration block; 6. a material taking device; 7. a pre-heating plate; 8. a second shuttle device; 9. a pressure measuring area; 10. a third shuttle device; 11. a manual tray; 12. a magazine; 13. a discharging device; 14. a material receiving device; 15. color disc; 16. a black plate; 17. a vibration plate; 18. a classification track; 19. a circulation mechanism; 20. a polarity detection unit; 21. a visual detection unit; 22. a vent hole; 23. a classification motor; 24. a classification mechanism; 25. a compression bar; 26. beating the air cylinder; 27. a row rack; 28. a bi-directional driver; 29. a cross beam; 30. a visual positioning mechanism; 31. a manipulator; 32. a suction nozzle module; 33. and a lifter.

Detailed Description

In order to make the above objects, features and advantages of the embodiments of the present disclosure more comprehensible, a detailed description of specific embodiments of the present disclosure is provided below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. The disclosed embodiments may be embodied in many other forms other than described herein and similar modifications may be made by those skilled in the art without departing from the spirit of the disclosed embodiments, so that the disclosed embodiments are not limited to the specific examples of embodiments described below.

In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the embodiments of the present disclosure and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present disclosure.

In the presently disclosed embodiments, unless expressly stated and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. For example, the first face may also be referred to as the second face, and the second face may also be referred to as the first face. In the description of the embodiments of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the presently disclosed embodiments, the terms "connected," "connected," and the like are to be construed broadly and, unless otherwise specifically indicated and defined, as being either fixedly connected, detachably connected, or integrally formed, for example; can be flexible connection or rigid connection along at least one direction; can be mechanically or electrically connected; either directly, indirectly, through intermediaries, or both, or in which case the intermediaries are present, or in which case the two elements are in communication or in which case they interact, unless explicitly stated otherwise. The terms "mounted," "disposed," "secured," and the like may be construed broadly as connected. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

Referring to fig. 1, fig. 1 illustrates a chip test handler in an embodiment of the present disclosure. The chip test handler 1000 provided in the embodiments of the present disclosure may include a loading system 1, a first shuttle device 5, a take-out device 6, a second shuttle device 8, and a load cell 9. The functional modules included in the chip test handler 1000 may be sequentially connected in the direction of the pipeline of materials. The chip to be tested can be fed through the feeding system 1, and one path of the chip to be tested is transported to the pressure measuring area 9 for testing.

Referring to fig. 2, fig. 2 illustrates a loading system in an embodiment of the disclosure. The disclosed embodiments provide a feeding system 1, the feeding system 1 including: the feeding device 2, the classifying device 3 and the direction identifying device 4 are sequentially connected.

The feeding system 1 can be used for feeding various types of testing machines, can realize accurate and stable feeding, can comprehensively and accurately identify the information of the chip to be tested, and ensures smooth operation of the assembly line.

Illustratively, the loading device 2 includes a vibratory pan 17. By designing the track of the vibrating plate 17, a batch of chips to be tested can be transported along the track. The loading device 2 may also comprise a mechanism such as a hopper.

The classifying device 3 may be connected to the feeding device 2, and is used for classifying the continuously conveyed chips to be tested, so as to convey the chips to be tested to the direction identifying device 4 one by one.

The direction recognition device 4 may include a circulation mechanism 19, a polarity detection unit 20, and a visual detection unit 21. The circulation mechanism 19 can receive chips to be tested from the classification device 3. The polarity detecting unit 20 and the visual detecting unit 21 are respectively matched with the circulation mechanism 19 to identify the chips conveyed by the circulation mechanism 19. The polarity detection unit 20 is configured to detect the polarity of the chip carried by the circulation mechanism 19, and can perform identification and judgment on the PIN chip without PIN1 point. The vision detecting unit 21 is configured to detect at least one of a first surface and a second surface opposite to the first surface of the chip carried by the circulation mechanism 19.

Illustratively, the chips transported by the circulation mechanism 19 may be placed horizontally, with the top and bottom surfaces of the chips being the identified surfaces. Optionally, the feeding posture of the chip can be controlled by the front feeding device 2 or the classifying device 3 by using the shape of the chip. Then, for the chip with the PIN1 point at the bottom, the vision detection unit 21 may configure the lower vision module to identify and judge the direction of the chip; for chips with PIN1 points on the top, the vision detection unit 21 may be configured with an upper vision module to recognize and judge the direction of the chip; alternatively, the vision detecting unit 21 may be configured with both the lower vision module and the upper vision module.

The feeding system provided by the embodiment of the disclosure can comprehensively and accurately identify various chips and stably and continuously feed the chips.

Fig. 3 illustrates a classification apparatus in an embodiment of the disclosure. In some embodiments, the loading device 2 includes a vibratory pan 17 and a classification track 18. The classification track 18 may be regarded as a part of the track of the loading device 2. In other embodiments, the classification device 3 may be considered to comprise a classification track 18, and the classification track 18 is continued to the feeding device 2.

Illustratively, the classification track 18 included in the loading system 1 includes a vent 22. The vent holes 22 are located upstream of the ends of the classification tracks 18 and can be used to blow air into the classification tracks 18 from an external air source to ensure that chips within the classification tracks 18 reach the ends of the classification tracks 18 under the action of vibration and compressed air.

Illustratively, the classification device includes a beating cylinder 26, a pressing rod 25, a classification motor 23, and a classification mechanism 24. The rapping cylinder 26 is located upstream of the end of the classification track 18 and spaced from the end of the classification track 18. The classification mechanism 24 is driven by a classification motor 23, and the classification mechanism 24 can reciprocate between the end of the classification track 18 and the circulation mechanism 19 to perform classification feeding. The pressing lever 25 is configured to press against the end of the classification track 18. When the sorting mechanism 24 leaves the sorting track 18, the pressing rod 25 is used for pressing the next chip, so that material dropping and material flying can be avoided.

Referring to fig. 2, the circulation mechanism 19 illustratively includes a turntable mechanism, and the polarity detection unit 20 and the visual detection unit 21 are disposed in order along the circumferential direction of the turntable mechanism. The visual detection unit 21 is further away from the circulation mechanism 19 than the polarity detection unit 20, so that the visual detection unit 21 has a larger installation space and design space. The space utilization capability of the feeding system 1 is strong, and flexible production can be performed on chips to be tested of different types. Referring to fig. 2, the dial mechanism is rotatable in a clockwise direction, and the polarity detecting unit 20 and the visual detecting unit 21 are disposed in the clockwise direction; alternatively, the dial mechanism may be rotated in a counterclockwise direction, and the polarity detection unit 20 and the visual detection unit 21 may be disposed in a counterclockwise direction.

Referring back to fig. 1, a chip test handler 1000 provided by an embodiment of the present disclosure may include the aforementioned loading system 1. For example, two first shuttle devices 5 can be provided, each of which cooperates with the loading system 1 to receive chips transferred by the loading system 1. Thus, the production elasticity of the production line can be improved.

Fig. 4 illustrates a take-off device provided by an embodiment of the present disclosure. The take-off device 6 may be used to divert chips from the flow direction of the first shuttle device 5 to the flow direction of the second shuttle device 8. As shown in fig. 4, the reclaimer device 6 may illustratively include a reclaimer mechanism and a visual positioning mechanism 30 positionally interconnected. Fig. 5 illustrates a first shuttle device provided by an embodiment of the present disclosure. Illustratively, the first shuttle device 5 includes a first calibration block 50 adapted for identification by the visual positioning mechanism 30. Similarly, the second shuttle device 8 comprises a second calibration block suitable for recognition by the visual positioning mechanism 30. Referring back to fig. 1, in some embodiments, the chip test handler 1000 further includes a pre-warming tray 7. The effective travel of the take-off device 6 covers the pre-warming tray 7, and the take-off device 6 can be used for transferring chips from the first shuttle device 5 to the flow direction of the pre-warming tray 7 and also can be used for transferring chips from the pre-warming tray 7 to the flow direction of the second shuttle device 8. Illustratively, the pre-warming plate 7 may include a third calibration block adapted to be identified by the visual positioning mechanism 30.

As shown in fig. 4, the take off mechanism may include a carriage 27, a bi-directional drive 28, a beam 29, and a robot 31. The cross member 29 is provided to the row frame 27 and movable in the Y-axis direction with respect to the row frame 27. The robot arm 31 is provided to the beam 29 and movable in the X-axis direction with respect to the beam 29. The bi-directional driver 28 may be used to drive the beam 29 and the robot 31. The strokes of the beam 29 and the robot 31 in the XY plane cover the first shuttle device 5, the second shuttle device 8, and the preheating tray 7. The robot 31 is driven by the bi-directional driver 28 to move along the cross member 29, and the cross member 29 is driven by the bi-directional driver 28 to move along the row frame 27. The robot 31 may include a lifter 33 and a nozzle module 32 driven by the lifter 33. The suction nozzle module 32 is driven by the lifter 33 to lift along the Z-axis direction. The suction nozzle module 32 may have three degrees of freedom in the X-axis direction, the Y-axis direction, and the Z-axis direction, and the suction nozzle module 32 may be used to suck and deliver chips.

The vision positioning mechanism 30 can be calibrated with the manipulator 31, and then the positions of the suction nozzle modules 32 in the XY plane can be accurately judged through the identification of the calibration blocks. For example, the position of the manipulator 31 relative to the first shuttle device 5 can be accurately judged through the identification of the first calibration block 50 so as to accurately pick up the chip; then, through the identification of the second calibration block, the position of the moved manipulator 31 relative to the second shuttle device 8 can be accurately judged, and then the chip is accurately put in. The material taking device 6 can overcome the problems of size deviation and structural deformation of the chip testing and sorting machine 1000 caused by heat expansion and cold contraction. Illustratively, the visual positioning mechanism 30 includes a camera positionally coupled to the robotic arm 31. Illustratively, the visual positioning mechanism 30 further includes a judging unit communicatively coupled to the camera for judging the pictures taken by the camera.

Illustratively, the take off mechanism further includes a first magnetic grating (not shown) and a second magnetic grating. The first magnetic grid is configured to measure the relative position of the row rack 27 and the beam 29, and the second magnetic grid is configured to measure the relative position of the robot 31 and the beam 29. Illustratively, when the bi-directional driver 28 is a moving part, the first magnetic grid may be configured to measure the relative position of the gantry 27 and the bi-directional driver 28, and the second magnetic grid may be configured to measure the relative position of the bi-directional driver 28 and the cross beam 29, and then indirectly obtain the movement stroke of the manipulator 31 relative to the gantry 27. The first and second magnetic grids help to ensure accurate and controlled operation of the robot 31.

As shown in fig. 6 and referring to fig. 1, the chip test handler 1000 has a first sealed cavity and a second sealed cavity. The first sealed cavity may encompass the first area a, in particular, the take-off device 6, the second shuttle device 8 and the load cell 9 are at least partially located within the first sealed cavity. Illustratively, the chip test handler 1000 further includes a pre-temperature tray 7, the pre-temperature tray 7 being at least partially located in the first sealed cavity. The loading system 1 and the first shuttle device 5 are at least partially located within the second sealed cavity. The first sealing cavity is filled with drying gas and is used for containing the drying gas and is isolated from an external space relatively, so that the drying gas is prevented from escaping and air containing water vapor is prevented from entering. The drying gas may be an anti-frost gas, and the first sealed chamber is configured as an anti-frost chamber or an anti-dewing chamber. The first sealed cavity may include, for example, a movable window to controllably communicate with, for example, the second sealed cavity.

As shown in fig. 1 and 6, the first shuttle device 5 is illustratively located at least partially in the second zone B and the loading system 1 is located at least partially in the third zone C. The feeding system 1 may also be in communication with a fourth zone D.

In an exemplary embodiment, the chip test handler 1000 further includes a temperature control system. The temperature control system comprises a refrigerant passage and a heating rod, wherein the refrigerant passage can be communicated with the preheating disc 7, the second material shuttle device 8 and the pressure measuring area 9, and the heating rod is configured to controllably heat the refrigerant passage. During low-temperature test, the refrigerant passage can directly cool the preheating disc 7, the second shuttle device 8 and the pressure measuring area 9; during high-temperature test, the heating rod works, and the refrigerant passage can cool the preheating disc 7, the second material shuttle device 8 and the pressure measuring area 9. The preheating plate 7 can preheat the chip to be tested. The pressure measuring area 9 can perform, for example, three-temperature test on the chip, and can perform electrical performance tests such as pressure test on the chip under different temperature environments. The chip test handler 1000 may implement automatic temperature control.

In the exemplary embodiment, the chip test handler 1000 further includes a third shuttle device 10, a discharging device 13, and a receiving device 14, which are sequentially connected downstream of the load cell 9. A third shuttle device 10 may be used to remove the tested chip from the load cell 9. The discharging device 13 is configured to: the pick-up chips of the same type are placed in a designated location in the receiving means 14, for example in a tray for holding chips of the same type. The accuracy of the movement of the discharge device 13 may be lower than the accuracy of the movement of the take-out device 6.

Illustratively, at the receiving device 14, a different type of carrier for collecting chips, such as a manual tray 11 or a magazine 12, may be provided. The chip test handler 1000 may also be provided with carriers such as color wheel 15, black wheel 16, and the like, for example.

The third shuttle device 10, the discharge device 13 and the receiving device 14 are at least partially located in the first sealed cavity.

The number of the second material shuttle devices 8, the number of the third material shuttle devices 10 and the number of the material receiving devices 14 are at least two respectively. The second shuttle device 8 and the third shuttle device 10 may be, for example, two parts of the same device.

Fig. 7 shows a structure of a chip test handler 1000 of another embodiment. In the chip test handler 1000 shown in fig. 7, the hand tray 11 and the magazine 12 may be arranged in the X-axis direction. In the chip test handler 1000 shown in fig. 1, the hand tray 11 and the magazine 12 may be arranged in the Y-axis direction.

The technical features of the embodiments disclosed above may be combined in any way, and for brevity, all of the possible combinations of the technical features of the embodiments described above are not described, however, they should be considered as the scope of the description provided in this specification as long as there is no contradiction between the combinations of the technical features.

The above disclosed examples represent only a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which is intended to be within the scope of the utility model as claimed. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. Feeding system, its characterized in that includes: a feeding device (2), a classification device (3) and a direction identification device (4) which are connected in sequence;

the direction identification device (4) comprises a circulation mechanism (19), a polarity detection unit (20) and a visual detection unit (21), wherein the polarity detection unit (20) is used for detecting the polarity of a chip borne by the circulation mechanism (19), and the visual detection unit (21) is used for detecting at least one of a first surface of the chip borne by the circulation mechanism (19) and a second surface opposite to the first surface.

2. The feeding system according to claim 1, wherein the feeding device (2) comprises a vibrating disc (17) and a classification track (18), the classification track (18) comprising a vent (22), the vent (22) being located upstream of the end of the classification track (18);

the classifying device comprises a beating cylinder (26), a pressing rod (25), a classifying motor (23) and a classifying mechanism (24), wherein the classifying mechanism (24) is driven by the classifying motor (23) and can reciprocate between the tail end of the classifying rail (18) and the circulating mechanism (19), the beating cylinder (26) is positioned at the upstream of the tail end of the classifying rail (18) and is arranged at intervals with the tail end of the classifying rail (18), and the pressing rod (25) is configured to press the tail end of the classifying rail (18).

3. The feeding system according to claim 2, wherein the circulation mechanism (19) comprises a turntable mechanism, and the polarity detection unit (20) and the visual detection unit (21) are sequentially arranged along a circumferential direction of the turntable mechanism.

4. Chip test handler, characterized by comprising a feeding system (1), a first shuttle device (5), a take-out device (6), a second shuttle device (8) and a load cell (9) according to any one of claims 1 to 3, which are connected in sequence.

5. Chip test handler according to claim 4, wherein the pick-up device (6) comprises a pick-up mechanism and a visual positioning mechanism (30) positionally interconnected;

the first shuttle device (5) comprises a first calibration block (50) suitable for the visual positioning mechanism (30) identification, and the second shuttle device (8) comprises a second calibration block suitable for the visual positioning mechanism (30) identification.

6. The chip test handler of claim 5, wherein the take-out mechanism includes a row rack (27), a bi-directional driver (28), a beam (29) and a robot (31),

the manipulator (31) is arranged on the cross beam (29), the manipulator (31) is driven by the bidirectional driver (28) to move along the cross beam (29), and the cross beam (29) is driven by the bidirectional driver (28) to move along the row frame (27);

the manipulator (31) comprises a lifter (33) and a suction nozzle module (32) driven by the lifter (33);

the visual positioning mechanism (30) includes a camera positionally coupled to the manipulator (31).

7. The chip test handler of claim 6, wherein the take-off mechanism further comprises a first magnetic grid configured to measure the relative position of the row rack (27) and the cross beam (29) and a second magnetic grid configured to measure the relative position of the robot arm (31) and the cross beam (29).

8. Chip test handler according to claim 4, further comprising a pre-warming tray (7), the effective stroke of the pick-up device (6) covering the pre-warming tray (7);

the chip test handler (1000) has a first sealed cavity and a second sealed cavity, the first sealed cavity being filled with a drying gas;

the material taking device (6), the second material shuttle device (8) and the pressure measuring area (9) are at least partially positioned in the first sealing cavity, and the material feeding system (1) and the first material shuttle device (5) are at least partially positioned in the second sealing cavity.

9. The chip test handler of claim 8, further comprising a temperature control system including a coolant passage communicating with the pre-warming tray (7), the second shuttle device (8), and the load cell (9), and a heating rod configured to controllably heat the coolant passage.

10. Chip test handler according to claim 9, further comprising a third shuttle device (10), a discharge device (13) and a receiving device (14) connected in sequence downstream of the pressure measuring area (9), the third shuttle device (10), the discharge device (13) and the receiving device (14) being at least partially located in the first sealed cavity;

the number of the second material shuttle devices (8), the number of the third material shuttle devices (10) and the number of the material receiving devices (14) are at least two respectively.

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