CN220239316U - sorting machine - Google Patents

Abstract

The present disclosure relates to a sorter. The separator includes: the pressure measuring modules comprise test seats and pressure measuring heads which are oppositely arranged along a second direction perpendicular to the first direction, and the two test seats of the two adjacent pressure measuring modules are positioned at different positions along the second direction; and the first manipulator module is used for taking and discharging the pressure measuring module. The separator can fully utilize vertical space and has high space utilization rate.

Description

Sorting machine

Technical Field

The disclosure relates to the technical field of chip equipment, and in particular relates to a sorting machine.

Background

Integrated circuits are the core of the electronic information industry, and with rapid progress of science and technology, terminal applications are continuously developed in the directions of portability, intelligence, light weight, multifunction and high performance, so that the integrated circuits as core components are continuously developed in the directions of light weight, thinness and smallness. Integrated circuits transition from single functions to complex functions with ever increasing levels of integration. In addition, the functions of network communication, data processing, memory, intelligent AI and the like used in the emerging fields of artificial intelligence, 5G industry, cloud computing, new energy automobiles and the like bring about the requirement of high-speed processing capability of high-end integrated circuits. In the emerging field, the heat generation power of integrated circuits or chips has also evolved from the first few watts to the now kilowatt level of ultra-high power.

With the expansion of the market for chip products, the increasing product lines also place higher demands on test equipment such as system level testers. One of the cores of many requirements is how to improve the test efficiency of a system level tester, in other words how to increase the number of test chips per unit time. It is desirable to have more stations per facility and higher throughput per hour.

In addition, since the use environment of the chip becomes more severe, in order to ensure high stability of the chip in a wide temperature range, it is necessary to perform normal temperature, low temperature and high temperature tests (referred to as "three temperature tests") on the chip in the process of evaluating and checking the reliability of the chip. After the chip design is completed, the performance of the chip needs to be tested and verified repeatedly, and a sorting machine with high and low temperature functions is needed to screen out qualified products. The test handler with superior three-temperature test capability has a greater market competitive advantage.

Disclosure of Invention

Based on this, it is necessary to provide a sorting machine in order to solve the problem of how to improve the chip test efficiency.

Embodiments of the present disclosure provide a classifier including: the pressure measuring modules comprise test seats and pressure measuring heads which are oppositely arranged along a second direction perpendicular to the first direction, and the two test seats of the two adjacent pressure measuring modules are positioned at different positions along the second direction; and the first manipulator module is used for taking and discharging the pressure measuring module.

According to the sorting machine provided by the embodiment of the disclosure, the adjacent pressure measuring modules are arranged in the load direction of the test seat in a staggered manner, so that the vertical space can be fully utilized, the adjacent test seat can be compactly arranged, the pressure measuring modules are compactly arranged, and more pressure measuring modules can be arranged in the limited space; in addition, the movement time of the first manipulator is shortened, the chip circulation speed is improved, and the accuracy of picking and placing operations can be guaranteed. The sorting machine has at least one beneficial effect of compact structure, high space utilization rate, high testing efficiency, strong production capacity and the like.

In some embodiments, the first manipulator module includes a first driving member, a first manipulator mechanism and a first beam, the first manipulator mechanism is slidably connected to the first beam along a third direction, the third direction is perpendicular to the first direction and the second direction, and the first driving member is used for driving the first manipulator mechanism to slide relative to the first beam; the sorting machine further comprises a magnetic grating device for measuring the moving position of the first manipulator mechanism relative to the first beam, wherein the magnetic grating device comprises a magnetic grating ruler and a magnetic grating sensor, the magnetic grating ruler is connected to the first beam, the magnetic grating sensor is connected to the first manipulator mechanism, and the magnetic grating sensor is in communication connection with the first driving piece.

Thus, the precision of the sorting machine can be improved. The magnetic grating sensor reads the position data of the magnetic grating ruler, so that the accurate position of the first manipulator mechanism in the third direction can be judged, the magnetic grating ruler, the magnetic grating sensor and the first driving piece form full-closed loop feedback, and the first driving piece can be accurately controlled to drive the first manipulator mechanism to move to the corresponding position.

In some embodiments, the sorter further comprises a vision module located on a pick-and-place path of the first manipulator module for picking and placing the load cell, the vision module being configured to detect a posture of a chip held by the first manipulator module.

By the arrangement, the space of the sorting machine can be skillfully utilized, the position accuracy of the held chip is checked, and improvement of the discharging accuracy of the first manipulator module is facilitated.

In some embodiments, the separator further comprises a pre-warming tray, the pre-warming tray and the vision module are arranged along a first direction, and the first manipulator module is used for taking and discharging the pre-warming tray.

By the arrangement, the space of the sorting machine can be skillfully utilized, and the preheated chips can be visually positioned.

In some embodiments, the separator further comprises a pre-temperature tray and a temperature control device, wherein the pre-temperature tray is positioned on one side of the pressure measurement module along a third direction, the third direction is perpendicular to the first direction and the second direction, and the temperature control device is used for controlling the temperature of the pre-temperature tray; the first manipulator module is used for moving materials between the preheating disc and the pressure measuring module.

The chip to be measured can be preheated or returned to the temperature, then high-temperature detection or low-temperature detection is achieved, and meanwhile, the arrangement position of the preheating disc is matched with the movement stroke of the first manipulator module, so that compact structural layout and high-efficiency material moving are facilitated.

In some embodiments, the separator further comprises a feed and receive module having a feed level, a receive level, and an empty tray level, and a tray handling module for tray handling of at least two of the three locations.

So set up, accessible supply receive the material module and carry out the feed and receive the material, still the transport of batch pan realizes reliably continuous production.

In some embodiments, the separator further comprises a shuttle module and a second manipulator module, the second manipulator module is used for moving materials between the feeding and receiving module and the shuttle module, and the first manipulator module is used for taking and discharging the shuttle module; the shuttle module includes a rotating shuttle rotatable in a vertical plane in a second direction and/or adapted to move in a first direction.

By the arrangement, the material can be rapidly supplied and received, and the first manipulator module can accurately and rapidly take and discharge. In addition, the rotary material shuttle can rotate, so that the posture of the chip can be quickly adjusted; and the first manipulator mechanism can be transported for a distance, which is beneficial to planning the working stroke of the first manipulator mechanism and improving the working efficiency.

In some embodiments, a pre-temperature tray is located between the shuttle module and the load module, the pre-temperature tray including a pre-cooling tray and a high temperature tray, the high temperature tray being located between the pre-cooling tray and the supply and take-up module.

By the arrangement, the sorting machine with a compact structure can achieve better temperature balance, reduce energy consumption and ensure effective three-temperature test.

In some embodiments, the separator further comprises a positioning disk positioned between the shuttle module and the pre-warming disk; the first manipulator module is suitable for cleaning a positioning surface of the first manipulator module for taking and placing materials on the positioning disc; the preheating plate and the positioning plate are arranged along a first direction.

So set up, the usable positioning disk realizes the location of first manipulator module to the chip better.

In some embodiments, the sorter includes two test zones disposed opposite along the third direction, each test zone including at least two load modules and a first manipulator module; the two test areas are suitable for being fed and received by the same feeding and receiving module.

The sorter that this disclosed embodiment provided can rationally match the beat of a plurality of pressure measurement modules to same supply and receive two test areas of material module correspondence, space utilization is high, and work efficiency is high.

Drawings

FIG. 1 is a top view of a classifier provided by embodiments of the present disclosure;

FIG. 2 is a left side view of a classifier provided by an embodiment of the present disclosure;

FIG. 3 is a rear view of a classifier provided by an embodiment of the present disclosure;

FIG. 4 is a rear view of at least two load modules provided by embodiments of the present disclosure;

FIG. 5 is a schematic view of a partial construction of a classifier provided in an embodiment of the present disclosure;

FIG. 6 is a schematic left side view of a first manipulator module provided by an embodiment of the present disclosure;

FIG. 7 is a schematic isometric view of a feed and receive module provided by an embodiment of the present disclosure;

FIG. 8 is a schematic isometric view of a tray handling module provided by an embodiment of the present disclosure;

FIG. 9 is a schematic isometric view of a second manipulator module provided by an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a puck and a pre-warming plate provided in an embodiment of the present disclosure;

fig. 11 is a schematic block diagram of a communication connection of a classifier provided by an embodiment of the present disclosure.

Reference numerals illustrate: 1. a pressure measuring module; 101. a first pressure measurement module; 102. a second pressure measurement module; 11. measuring a pressure head; 111. a first pressure head; 112. a second pressure head; 12. a test seat; 121. a first test socket; 122. a second test seat;

2. a first manipulator module; 21. a first track; 22. a first beam; 23. a first manipulator mechanism; 24. a first slider mechanism; 25. a first manipulator; 3. a vision module; 4. a positioning plate; 5. a pre-heating plate; 51. a high temperature tray; 52. pre-cooling disc; 6. a feeding and receiving module; 61. empty disc positions; 62. a feed level; 63. receiving a material level; 7. a tray handling module; 71. a second track; 72. a tray manipulator; 8. a second manipulator module; 81. a third track; 82. a second beam; 83. a second manipulator; 9. a shuttle module; 91. rotating the material shuttle; 92. a fourth track;

100. a separator; 200. a first test zone; 300. a second test zone; 400. a frame; 500. a magnetic grating device; 600. a magnetic grid sensor; 700. a magnetic grating ruler; 800. a first driving member.

Detailed Description

In order to make the above objects, features and advantages of the embodiments of the present disclosure more comprehensible, a detailed description of specific embodiments of the present disclosure is provided below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. The disclosed embodiments may be embodied in many other forms other than described herein and similar modifications may be made by those skilled in the art without departing from the spirit of the disclosed embodiments, so that the disclosed embodiments are not limited to the specific examples of embodiments described below.

In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the embodiments of the present disclosure and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present disclosure.

In the presently disclosed embodiments, unless expressly stated and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. For example, the first pressure measurement module may also be referred to as a second pressure measurement module, and the second pressure measurement module may also be referred to as a first pressure measurement module. In the description of the embodiments of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the presently disclosed embodiments, the terms "connected," "connected," and the like are to be construed broadly and, unless otherwise specifically indicated and defined, as being either fixedly connected, detachably connected, or integrally formed, for example; can be flexible connection or rigid connection along at least one direction; can be mechanically or electrically connected; either directly, indirectly, through intermediaries, or both, or in which case the intermediaries are present, or in which case the two elements are in communication or in which case they interact, unless explicitly stated otherwise. The terms "mounted," "disposed," "secured," and the like may be construed broadly as connected. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

Referring to fig. 1, fig. 1 illustrates a classifier in an embodiment of the present disclosure. The sorter 100 provided in the embodiment of the present disclosure includes a first manipulator module 2 and at least two pressure measuring modules 1. The first manipulator module 2 is used for taking and discharging the pressure measuring module 1.

Illustratively, the sorter 100 may include two test zones, such as a first test zone 200 and a second test zone 300. The first test zone 200 and the second test zone 300 may be aligned in the Z-axis direction, and the first test zone 200 may include a first robot module 2 and at least two load modules 1; the second test zone 300 may comprise further first manipulator modules 2 and at least two load modules 1. The load modules 1 within each test zone may be aligned along an X-axis direction, which may be parallel to the first direction. The loading side of the first test zone 200 and the loading side of the second test zone 300 may be on the same side along the X-axis direction.

As shown in connection with fig. 2 and 3, fig. 2 shows a left side view of fig. 1, and fig. 3 shows a rear view of fig. 1. The pressure measuring module 1 comprises a pressure measuring head 11 and a test seat 12, and the pressure measuring head 11 and the test seat 12 can be oppositely arranged along the Y-axis direction. The Y-axis direction may be parallel to the second direction and the Z-axis line of defense may be parallel to the third direction. The testing head 11 may be on the upper side of the testing seat 12, the testing seat 12 may be used for carrying a chip, and the testing head 11 may slide along the second direction and may be used for performing, for example, a pressure test on the chip. The first manipulator module 2 can take and discharge the test seat 12 when the pressure measuring head 11 is separated from the test seat 12.

As shown in fig. 3, two test seats 12 of two adjacent load modules 1 are located at different positions along the second direction. Referring to fig. 4, the plurality of pressure measuring modules 1 includes a first pressure measuring module 101 and a second pressure measuring module 102, and the first pressure measuring module 101 and the second pressure measuring module 102 are adjacent. The first pressure measurement module 101 includes a first pressure measurement head 111 and a first test seat 121, and the second pressure measurement module 102 includes a second pressure measurement head 112 and a second test seat 122. The first test seat 121 and the second test seat 122 are arranged along the X-axis direction and are located at different height positions along the Y-axis direction. For example, the first manipulator module 2 may take and discharge at least one load cell 1. The first manipulator module 2 may have a stroke along the Y-axis to pick and place test seats 12 of different heights.

The sorter provided by the embodiment of the disclosure has the characteristics of compact structure and high space utilization rate. And then the movement time of the first manipulator can be shortened, and the chip circulation speed is improved.

In the exemplary embodiment, sorter 100 includes a total of eight load modules 1, with each test zone including four load modules 1. The separator 100 has high detection capability and good circulation efficiency. Illustratively, the handler 100 includes a frame 400, and each test zone may be mounted to the frame 400.

Referring to fig. 1, 5 and 6, the first manipulator module 2 includes a first driver 800 (fig. 11), a first manipulator mechanism 23 and a first beam 22. The first manipulator mechanism 23 is slidably connected to the first beam 22 along the Z-axis direction, and the first driving member 800 is configured to drive the first manipulator mechanism 23 to slide relative to the first beam 22.

Illustratively, the first manipulator module 2 comprises a first rail 21, and the first beam 22 is slidably connected to the first rail 21 along the X-axis direction. Illustratively, the first manipulator module 2 of the second test zone 300 may be substantially mirror-image disposed with the first manipulator module 2 of the first test zone 200, with the plane of symmetry being parallel to the XY plane.

Illustratively, the first manipulator mechanism 23 includes a first slider mechanism 24 and a first manipulator 25. The first slider mechanism 24 is slidably connected to the first beam 22, and the first robot 25 is slidably connected to the first slider mechanism 24 along the Y-axis direction. Illustratively, the first robot 25 may be a suction nozzle, and a lower end surface thereof may be a positioning surface for contacting and limiting the chip due to suction force. Illustratively, the first manipulator mechanism 23 may include a plurality of first manipulators 25, each first manipulator 25 being slidably coupled to the first slider mechanism 24 relatively independently. Therefore, the multiplexing capability of the stroke can be improved, and the detection and separation efficiency can be improved.

Referring to fig. 1 and 5, the sorter 100 further includes a vision module 3. The vision module 3 is located on the picking and placing path of the first manipulator module 2 for picking and placing the pressure measuring module 1. The first robot module 2 may grip or suck the chip and move the chip. For example, the positioning surface of the first manipulator module 2, i.e. the positioning surface of the first manipulator 25, may carry a chip movement, which movement may form a pick-and-place path in the XZ plane. Other paths may also be devised for the first manipulator module 2. The detection direction of the vision module 3 may be set in the Y-axis direction, for example, the vision detection is performed from the lower side on the chip passing thereon, and the arrangement position of the vision module 3 may effectively utilize space. The vision module 3 is used for detecting the gesture of the chip held by the first manipulator module 2, and is helpful for improving the judgment of the position accuracy of the chip, so that the discharging accuracy of the first manipulator module 2 at the pressure measuring module 1 is improved, and the detection process can be accurately and reliably executed. The detection of the vision module 3 does not delay the movement of the first manipulator module 2 to the chip, so that the working flow of the sorting machine 100 is smooth and the working efficiency is high.

Illustratively, the sorter 100 also includes a pre-warming tray 5. The pre-warming tray 5 and the vision module 3 may be arranged along a first direction. The first manipulator module 2 is used for taking and placing materials from the preheating disc 5. For example, the first robot module 2 may put the chip into the pre-temperature tray 5 first and then move the chip subjected to the pre-temperature to the first pressure measuring module 1. The first manipulator module 2 may approach the vision module 3 while moving past the pre-warmed chip.

Illustratively, the sorter 100 further includes a temperature control device (not shown) for controlling the temperature of the pre-warming tray 5. The temperature control device may be, for example, a compressor, a refrigerator, a heater, or the like. The preheating plate 5 is located on one side of the load cell 1 in the Z-axis direction, for example between two rows of load cells 1. The temperature control device can be arranged at one side of the test area along the X-axis direction.

Illustratively, the pre-warm tray 5 includes a pre-cool tray 52 and a high temperature tray 51. The first manipulator module 2 is used for moving materials between the preheating disc 5 and the pressure measuring module 1, namely, the first manipulator module 2 can also move chips subjected to pressure measurement to the preheating disc 5. In some aspects, the chips after the low temperature test may be moved to the high temperature tray 51, and the high temperature tray 51 may be regarded as a reflow tray; in other aspects, the chips after high temperature testing may be moved to pre-chill plate 52, and pre-chill plate 52 may be considered a chill plate. By the back temperature, the chip subjected to the high/low temperature test is allowed to return to approximately room temperature.

Referring to fig. 1, 2 and 5, the sorter 100 further includes a supply-receiving module 6 and a tray-handling module 7. The supply and receiving module 6 may be located at one side of the test area in the X-axis direction. Referring to fig. 7, the supply and take-up module 6 may have a supply level 62, a take-up level 63, and an empty tray 61. The empty tray position 61 and the collection position 63 may be located on both sides of the supply position 62 in the Z-axis direction. The supply and take-up module 6 may comprise a plurality of tray lifting devices. The feeding and receiving module 6 can be mounted on the frame 400, and the tray lifting device can extend into the frame 400 to realize a longer lifting space so as to accommodate more trays.

Illustratively, the supply and take-up module 6 may include one supply location 62, two empty trays 61, and four take-up locations 63. Referring to fig. 8, the tray conveying module 7 is configured to convey trays at least two of three positions, i.e., a supply position 62, a receiving position 63, and an empty position 61. For example, empty trays at the feed level 62 may be transported to the empty tray level 61, empty trays of the empty tray level 61 may be transported to the receiving level 63, and, illustratively, empty trays at the feed level 62 may also be transported to the receiving level 63.

The tray handling module 7 may comprise a second rail 71 and a tray robot 72. The tray robot 72 is slidably connected to the second rail 71 along the Z-axis direction. The tray handling module 7 may include a slider mechanism slidably coupled to the second rail 71 in the Z-axis direction, and the tray robot 72 may be slidably coupled to the slider mechanism in the Y-axis direction.

Referring to fig. 1, 2, 3, 5, and 9, the sorter 100 further illustratively includes a shuttle module 9 and a second robot module 8. The shuttle module 9 includes a rotary shuttle 91 rotatable in a vertical plane in the Y-axis direction. The second manipulator module 8 is used for transferring material between the feeding and receiving module 6 and the shuttle module 9. The first manipulator module 2 is used for taking and placing the shuttle module 9.

The second manipulator module 8 may pick up chips from the supply 62 and put them on the rotary shuttle 91, and the first manipulator module 2 may pick up the chips from the rotary shuttle 91, which may be rotated or not. The first manipulator module 2 may place the inspected chip on the rotary shuttle 91 and the second manipulator module 8 may pick up the chip from the rotary shuttle 91 and place it at the receiving station 63. Illustratively, the chips that are tested have been ranked or judged to be unacceptable, and the chips of the same rank may be placed at the same receiving level 63.

Referring to fig. 9, the second robot module 8 may include a third rail 81, a second beam 82, and a second robot 83. The second beam 82 is slidably connected to the third rail 81 in the Z-axis direction, the second robot 83 is connected to the third rail 81 through the second beam 82, and the second robot 83 is slidably connected to the second beam 82 in the X-axis direction. In some embodiments, the second robot 83 may be lifted and lowered in the Y-axis direction.

Illustratively, the pre-warming plate 5 is located between the shuttle module 9 and the load module 1. Specifically, for the pick and place stroke of the first manipulator module 2 to pick and place material to the load cell module 1, the pre-warming plate 5 is located between the shuttle module 9 and the load cell module 1. Referring to fig. 1 and 10, the pre-warming tray 5 includes a pre-cooling tray 52 and a high temperature tray 51, the high temperature tray 51 being located between the pre-cooling tray 52 and the supply and receiving module 6. This facilitates planning the travel that the first manipulator module 2 has and may also facilitate thermal balancing of the sorter 100. The pre-chill plate 52 may include a pre-chill chamber and a removable cover that helps to maintain the temperature of the pre-chill chamber while allowing the first manipulator module 2 to pick and place materials.

In some embodiments, the sorter 100 further includes a puck 4. The positioning disk 4 may be located between the shuttle module 9 and the pre-warming disk 5, for example may be located between the vision module 3 and the shuttle module 9. The pre-warming plate 5 and the positioning plate 4 may be aligned in the X-axis direction and may be substantially aligned. The first manipulator module 2 is adapted to clean the positioning surface of the first manipulator module 2 for picking and placing material at the positioning plate 4, for example, the lower end surface of the first manipulator 25 may be cleaned.

Illustratively, the rotary hook 91 is adapted to move in the X-axis direction. Referring to fig. 1 and 5, the shuttle module 9 may include a rotary shuttle 91 and a fourth rail 92. The rotary hook 91 is slidably connected to the fourth rail 92 in the X-axis direction. The rotation axis of the rotary hook 91 may be parallel to the Y-axis direction.

The travel of the first manipulator module 2 and the second manipulator module 8 is facilitated to be linked, and the first manipulator module 2 and the second manipulator module 8 can be guaranteed to perform actions efficiently. Illustratively, the shuttle module 9 may include a sensor that may be used to detect whether the rotating shuttle 91 carries a chip; the sensor may be used to detect whether there is a stacking phenomenon on the rotary hook 91. When the chips have pins, the rotation of the rotary shuttle 91 can ensure that the chips carried each time have a consistent arrangement mode of the pins, and then the first manipulator module 2 can pick up the chips with the adjusted angle positions.

Illustratively, each test zone may correspond to a shuttle module 9, and each shuttle module 9 may include two or other numbers of rotating shuttles 91. The shuttle module 9 can efficiently adjust and move the chip.

Illustratively, the first test zone 200 may include at least two load modules 1, a first manipulator module 2, and a shuttle module 9; the second test zone 300 may include others. The first manipulator module 2 of the first test zone 200 and the first manipulator module 2 of the second test zone 300 may have a stroke that does not interfere with each other. The first test zone 200 and the second test zone 300 are adapted to be fed by the same feeding and receiving module 6.

Referring to fig. 11, in an exemplary embodiment, the sorter 100 further includes a magnetic grid apparatus 500 for measuring the position of the first manipulator mechanism 23 relative to the first beam 22. The magnetic grid apparatus 500 may include a magnetic grid scale 700 and a magnetic grid sensor 600, the magnetic grid scale 700 being coupled to the first beam 22, the magnetic grid sensor 600 being coupled to the first manipulator mechanism 23, the magnetic grid sensor 600 being in communication with the first drive 800.

The first driving member 800 is used to drive the first manipulator mechanism 23 to move relative to the first beam 22, and as the first manipulator mechanism 23 moves, the magnetic scale sensor 600 also moves relative to the magnetic scale 700. The readings of the magnetic grid sensor 600 may be fed back to the first drive 800 and in response to reaching a specified reading position, the first drive 800 stops driving the first robot mechanism 23. The first driving piece 800, the first manipulator module 2 and the magnetic grid device 500 form full-closed loop feedback, so that the driving precision of the first driving piece 800 to the first manipulator mechanism 23 can be improved, the motion deviation can be reduced, and the actual position of the first manipulator mechanism 23 is guaranteed to be close to the theoretical output position.

The technical features of the embodiments disclosed above may be combined in any way, and for brevity, all of the possible combinations of the technical features of the embodiments described above are not described, however, they should be considered as the scope of the description provided in this specification as long as there is no contradiction between the combinations of the technical features.

The above disclosed examples represent only a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which is intended to be within the scope of the utility model as claimed. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. A classifier, comprising:

the pressure measuring device comprises at least two pressure measuring modules (1), wherein the pressure measuring modules (1) are sequentially arranged along a first direction, each pressure measuring module (1) comprises a test seat (12) and a pressure measuring head (11) which are oppositely arranged along a second direction perpendicular to the first direction, and the two test seats (12) of two adjacent pressure measuring modules (1) are positioned at different positions along the second direction; a kind of electronic device with high-pressure air-conditioning system

And the first manipulator module (2) is used for taking and discharging the pressure measuring module (1).

2. The sorting machine according to claim 1, wherein the first manipulator module (2) comprises a first drive (800), a first manipulator mechanism (23) and a first beam (22), the first manipulator mechanism (23) being slidably connected with the first beam (22) in a third direction, the third direction being perpendicular to the first direction and the second direction, the first drive (800) being adapted to drive the first manipulator mechanism (23) to slide with respect to the first beam (22);

the sorting machine (100) further comprises a magnetic grating device (500) for measuring the moving position of the first manipulator mechanism (23) relative to the first beam (22), the magnetic grating device (500) comprises a magnetic grating ruler (700) and a magnetic grating sensor (600), the magnetic grating ruler (700) is connected to the first beam (22), the magnetic grating sensor (600) is connected to the first manipulator mechanism (23), and the magnetic grating sensor (600) is in communication connection with the first driving piece (800).

3. The sorting machine according to claim 1, further comprising a vision module (3), wherein the vision module (3) is located on a pick-and-place path of the first manipulator module (2) for picking and placing the load cell (1), and the vision module (3) is used for detecting the gesture of a chip held by the first manipulator module (2).

4. A separator according to claim 3, further comprising a pre-warming tray (5), the pre-warming tray (5) being aligned with the vision module (3) along the first direction, the first manipulator module (2) being for taking and placing the pre-warming tray (5).

5. The sorting machine according to claim 1, further comprising a pre-warming tray (5) and a temperature control device, the pre-warming tray (5) being located on one side of the pressure measuring module (1) in a third direction, the third direction being perpendicular to the first direction and the second direction, the temperature control device being adapted to control the temperature of the pre-warming tray (5);

the first manipulator module (2) is used for transferring materials between the preheating disc (5) and the pressure measuring module (1).

6. The sorting machine according to claim 5, further comprising a feed and receive module (6) and a tray handling module (7), the feed and receive module (6) having a feed level (62), a receive level (63) and a empty tray level (61),

the tray conveying module (7) is used for carrying the tray on at least two of the three positions of the feeding position (62), the receiving position (63) and the empty tray position (61).

7. The sorting machine according to claim 6, further comprising a shuttle module (9) and a second manipulator module (8), the second manipulator module (8) being adapted to move material between the feed and receive module (6) and the shuttle module (9), the first manipulator module (2) being adapted to pick and place the shuttle module (9);

the shuttle module (9) comprises a rotating shuttle (91), the rotating shuttle (91) being rotatable in a vertical plane of the second direction, and/or

The rotary hook (91) is adapted to move in the first direction.

8. The sorting machine according to claim 7, wherein the pre-warming tray (5) is located between the shuttle module (9) and the load module (1), the pre-warming tray (5) comprising a pre-cooling tray (52) and a high temperature tray (51), the Gao Wenpan (51) being located between the pre-cooling tray (52) and the feed and take-up module (6).

9. The sorting machine according to claim 7, further comprising a positioning disc (4), the positioning disc (4) being located between the shuttle module (9) and the pre-warming disc (5);

the first manipulator module (2) is suitable for cleaning a positioning surface of the first manipulator module (2) for taking and placing materials on the positioning disc (4);

the preheating disc (5) and the positioning disc (4) are arranged along the first direction.

10. The sorting machine according to claim 6, wherein the sorting machine (100) comprises two test zones arranged opposite in a third direction, each test zone comprising the at least two load modules (1) and the first manipulator module (2);

the two test zones are adapted to be fed by the same feeding and receiving module (6).