KR20140119243A

KR20140119243A - Semiconductor device inspection apparatus

Info

Publication number: KR20140119243A
Application number: KR1020130032981A
Authority: KR
Inventors: 유홍준
Original assignee: (주)제이티
Priority date: 2013-03-27
Filing date: 2013-03-27
Publication date: 2014-10-10

Abstract

The present invention relates to a device inspection apparatus and, more specifically, to a device inspection apparatus for inspecting the electrical features of devices. The present invention is created to achieve the purpose explained above. The present invention comprises: a loading unit on which one or more trays mounting a plurality of devices are loaded; a loading buffer unit for receiving the devices through a first transferring tool from the trays of the loading unit and temporarily mounting the same; a test unit equipped with a test socket to perform a test after receiving the devices from the loading buffer unit; an unloading buffer unit for receiving the devices, on which the tests are completed by the test unit, which face the loading buffer unit with the test unit at the center; an unloading unit for categorizing the devices mounted on the unloading buffer unit according to the test results of the test unit and mounting the same; and one or more third transferring tools for transferring devices between the loading unit, test unit and unloading unit. The test socket having two or more arrangement structures can be arranged on the test unit.

Description

Semiconductor device inspection apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting an electrical characteristic or the like for a element.

Semiconductor devices (hereinafter referred to as "devices") are subjected to various tests such as electrical characteristics, reliability tests on heat and pressure by a semiconductor device inspection device after completion of the packaging process.

The inspection of the device includes various tests such as a room temperature inspection performed in a room temperature environment and a heating inspection performed in a high temperature environment depending on the kind of a device such as a memory device, a CPU, and a GPU, an LED device, and a solar device.

However, the conventional device inspection apparatus for performing an inspection process on a device has the following problems.

First, although the conventional device testing apparatus can be tested by low-cost equipment, there is a problem that unnecessary waste is incurred on the equipment cost by performing a test on the device by expensive equipment.

The conventional device testing apparatus is expensive because the device is equipped with a heating device for heating the device and an expensive test module is installed so that many types of tests can be performed.

However, depending on the kind of the inspection, the device inspection apparatus can perform a simple room temperature inspection, but the inspection is performed by the high-price and high-performance equipment, and the productivity is lowered compared to the investment cost of the inspection apparatus.

Secondly, the conventional device testing apparatus has a test module capable of various tests, and the installation space occupied by the device is relatively large.

Third, since the conventional device inspection apparatus is designed to enable more various tests, the inspection speed is slowed down at a relatively simple room temperature inspection, thereby deteriorating the productivity as a whole.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for inspecting a device capable of performing simple inspections such as room temperature inspections for non-memory devices, have.

It is another object of the present invention to provide an apparatus for inspecting an apparatus which can remarkably reduce the space occupied by the apparatus by optimizing only the specialized inspections, as well as remarkably improve the inspection speed.

It is still another object of the present invention to provide an apparatus for inspecting an element which can reduce the space occupied by the apparatus by optimizing the transfer of the element for loading, testing and unloading the element.

It is still another object of the present invention to provide an element inspection apparatus which can perform various tests according to the type of element and the kind of test using one element inspection apparatus.

It is still another object of the present invention to provide an apparatus for inspecting an element which can minimize the time required for heating the element.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a loading unit in which one or more trays loaded with a plurality of elements are loaded; A loading buffer unit for receiving elements from the tray of the loading unit through a first transfer tool and temporarily loading the elements; A test unit having test sockets for receiving the elements from the loading buffer unit and performing a test; An unloading buffer unit installed at a position opposite to the loading buffer unit with the testing unit as a center and receiving tested devices by the testing unit; An unloading unit for classifying and loading the elements loaded in the unloading buffer unit through a second transfer tool according to a test result of the test unit; And at least one third transfer tool for transferring a device between the loading unit, the test unit, and the unloading unit, and the test unit may have test sockets 310 having two or more arrangements.

The apparatus for inspecting an element according to the present invention is capable of inspecting only in a room temperature environment without a heating apparatus in the structure of the apparatus and by using a specially designed test module having a relatively small number of test items as a test unit, There is an advantage that can be saved.

Particularly, since the device inspection apparatus according to the present invention is capable of inspecting devices in a heating environment and is capable of inspecting devices in various environments, the manufacturing cost of the device is remarkably reduced as compared with a conventional device inspection device, There is an advantage that contrast productivity can be remarkably improved.

Further, the device testing apparatus according to the present invention is advantageous in that it can be inspected only in a room temperature environment without a heating device, thereby simplifying the device, reducing its size, and significantly reducing the space occupied by the device.

Furthermore, as the size of the device becomes smaller, the movement distance and the exchange time of the device are shortened and the entire inspection speed can be remarkably improved.

In addition, since the device testing apparatus according to the present invention can be installed with test sockets having two or more arrangement types together or can be installed interchangeably, it is possible to use one device to control the type of device including the device size, Depending on the type of test and the speed of the test process, the device can be tested.

Further, the device for inspecting an element according to the present invention is constituted so as to circulate a tray in which an element heating part for heating a device is loaded, thereby to continuously heat a plurality of devices for a time required for heating the device to a preset temperature It can be heated. Therefore, it is possible to reduce the waiting time for the device to be heated, thereby reducing the time required to inspect the device.

1 is a plan view showing an apparatus for inspecting an element according to the present invention.
FIG. 2 is a plan view showing an example of a loading buffer unit and an unloading buffer unit in the device testing apparatus of FIG. 1. FIG.
FIG. 3 is a cross-sectional view showing a section of the loading buffer unit and the unloading buffer unit of FIG. 2;
4B to 4F are side views showing an operation process from the loading buffer unit to the unloading buffer unit in the device testing apparatus of FIG.
5 is a plan view showing a modification of the device testing apparatus according to the present invention.
FIG. 6 is a view showing an operation of an example of a loading buffer unit and an unloading buffer unit in the device testing apparatus of FIG. 1. FIG.
7 is a plan view showing another modification of the device testing apparatus having the loading buffer unit and the unloading buffer unit of FIG.
FIGS. 8A to 8C are diagrams showing a process of transferring a device from the loading buffer unit to the unloading buffer unit in the device inspection apparatus of FIG. 1 having the modified third transfer tool. FIG.
Fig. 9 is a side view showing a modified third transfer tool of the element inspection apparatus of Fig. 1; Fig.
Figs. 10A and 10B are views showing an operation process when the third transfer tool of Fig. 9 is placed on the test section.
FIGS. 11 to 17 are schematic views showing the arrangement of the loading grooves of the loading buffer unit and the unloading buffer unit, the test socket of the test unit, and the pickers of the third transfer tool in the device testing apparatus according to another embodiment of the present invention.
18 is a schematic view showing an element heating section in the element inspection apparatus according to another embodiment.

Hereinafter, a device testing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view showing an example of a loading buffer unit and an unloading buffer unit in the device testing apparatus of FIG. 1, FIG. 3 is a plan view showing the loading buffer unit and the unloading buffer unit of FIG. 2, 4B is a side view showing an operation process from the loading buffer unit to the unloading buffer unit in the device testing apparatus of FIG. 1, and FIG. 5 is a side view of the device testing apparatus of FIG. Fig. 6 is a plan view showing a modification example.

The apparatus for inspecting an element according to the present invention includes a loading unit 100 for loading one or more trays 2 loaded with a plurality of elements 1, as shown in FIGS. 1 to 4F; A loading buffer unit 200 for receiving and temporarily loading the elements 1 from the tray 2 of the loading unit 100 through the first transfer tool 610; A test unit 300 for receiving the devices 1 from the loading buffer unit 200 and performing a test; An unloading buffer unit 400 installed at a position opposite to the loading buffer unit 200 with respect to the testing unit 300 and receiving the tested devices 1 by the testing unit 300; And an unloading unit 500 for sorting and loading the devices 1 loaded in the unloading buffer unit 400 through the second transfer tool 620 according to the test result of the test unit 300 do.

Here, the transfer of the element 1 between the loading part 100, the test part 300 and the unloading part 500 can be realized by various methods, and one or more third transferring tools, for example, The third transfer tool 630, 640 may be realized by a pair of third transfer tools 630, 640.

The loading unit 100 and the unloading unit 500 are configured such that one or more trays 2 loaded with a plurality of devices 1 are loaded and may have various configurations according to design and design, 2) may be stacked on a tray mounting portion (not shown).

As shown in FIG. 1, the loading unit 100 may include a plurality of trays 2 suitably arranged so that the first transfer tool 610 can pick up and transfer the element 1 without interruption , The tray 2 from which the elements 1 are emptied can be configured to be replaced with the tray 2 in which the elements 1 are filled. Here, the tray 2 is automatically transported from the tray stacking portion to a position where the first transporting tool 610 can pull the element 1 after a certain number of the trays 2 are loaded on the tray stacking portion or automatically .

At this time, the empty tray 2 from which the devices 1 are taken out can be transferred to the unloading unit 500 by a tray transferring unit (not shown), and the tray 2 can be transferred to the unloading unit 500, (Not shown) so as to remove the element 1 that has not been drawn out of the tray.

The unloading unit 500 is configured similarly to the loading unit 100. As shown in FIG. 1, the unloading unit 500 classifies the devices 1 according to a test result without interrupting the second feeding tool 620, A plurality of empty trays 2 are arranged appropriately in accordance with the sorting class so that the tray 2 filled with the elements 1 can be replaced with the empty tray 2.

Further, a tray buffer unit (not shown) may be additionally installed between the loading unit 100 and the unloading unit 500 so that the empty tray 2 can be temporarily loaded.

The tray 2 may have a variety of configurations, for example, the receiving grooves 2a are formed according to a predetermined standard such as 8 × 16 so that a plurality of devices 1 can be stacked.

The device 1 to be inspected may be a non-memory device such as a memory semiconductor, a CPU, a GPU, and a system LSI. Particularly, it is preferable that the object to be inspected be a non-memory element, particularly a device having ball-shaped contact terminals formed on the bottom face thereof.

The loading unit 100 and the unloading unit 500 may be installed in the apparatus as shown in FIG. 1, or may be installed in the loading buffer unit 100 and the unloading unit 100, as shown in FIG. And may be installed below the loading buffer unit 500.

5, the loading unit 100 and the unloading unit 500 may include a tray moving unit (not shown) installed to feed the tray 2 in a direction perpendicular to the moving path of the third feeding tools 630 and 640, 110, 510).

The tray moving units 110 and 510 can be configured in various ways as a structure for moving the device 1 to the withdrawing or stacking position of the device 1 and the replacing position of the tray 2 while the tray 2 is supported. A pair of guide members 111 and 511 for guiding the movement of the tray 2 and a driving unit (not shown) for moving the tray 2 can be included.

The trays 2 emptied from the loading unit 100 may be transferred to the unloading unit 500 by the tray transfer unit 660.

It is preferable that the tray moving units 110 and 510 are configured to move the trays 2 in opposite directions according to the loading unit 100 and the unloading unit 500.

The loading buffer unit 200 receives the element 1 from the loading unit 100 and temporarily loads the element 1 to the testing unit 300. The unloading buffer unit 400 receives the element 1 from the testing unit 300, 1 to the unloading unit 500, and various configurations are possible.

Particularly, the loading buffer unit 200 and the unloading buffer unit 400 can transfer a relatively large number of devices 1 to the test unit 300 in the tray 2 on which the relatively small number of the devices 1 are loaded. It is preferable that the tray 1 is configured to load a larger number of elements 1 than the number of elements 1 that the tray 1 can load.

1 and 2, the loading buffer unit 200 and the unloading buffer unit 400 have a plurality of loading grooves 211 and 411 formed on the upper surface thereof so that the devices 1 can be loaded thereon. And plate members 210 and 410 in the form of plates.

The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be substantially identical to each other. However, There is a difference such that a device for giving the condition is added.

The loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are aligned with the intervals of the test sockets 310 of the test unit 300 , And the intervals corresponding to the intervals of the receiving grooves 2a of the tray 2.

The loading grooves 211 and 411 of the plate members 210 and 410 may be formed in a spacing of the pickers 631 and 641 of the third conveying tools 630 and 640 1 / n, for example, 1/2. Where n is a natural number greater than or equal to 2.

The intervals between the receiving grooves 2a of the tray 2 and the spacing between the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 The intervals of the test receptacles 310 of the test portion 300 may be formed to be n times, for example, twice as long as the intervals of the receiving grooves 2a of the tray 2. [

Particularly, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are arranged in 16 × 8 and the test sockets 310 of the test unit 300 are arranged in 8 × 4 The third conveying tool 630 and 640 described later may include 8 × 4 pickers 631 and 641 disposed at intervals corresponding to the test receptacles 310 of the test portion 300 so that 8 × 4 Of the devices 1 of the present invention.

Particularly, the third transfer tool 630 and 640 transfer the element 1 to the loading grooves 211 and 411 of the loading member 200 and the plate members 210 and 410 of the unloading buffer unit 400, respectively. It is unnecessary to adjust the interval between the pickers 631 and 641 by skipping the chips or by stacking the chips, so that the device can be transported faster.

Meanwhile, the plate members 210 and 410 can be variously configured as elements for element exchange with the test unit 300 by temporarily loading the elements 1, and as shown in FIGS. 1 and 2, (210, 410) may be configured as a pair to be moved alternately.

A pair of plate members 210 of the loading buffer unit 200 are connected to a first position ① in which the elements 1 can be received from the tray 2 of the loading unit 100, 630, and 640 can alternately move at a second position (2) where the device 1 can be drawn out.

A pair of plate members 410 of the unloading buffer unit 400 are connected to a first position 3 for transmitting the devices 1 to the tray 2 of the unloading unit 400, (6) and 640 can be alternately moved in a second position (4) where the device (1) can be loaded.

As shown in FIGS. 2 and 3, the pair of plate members 210 and 410 are vertically spaced apart from each other so as not to interfere with each other, and guide the linear movement of the plate members 210 and 410 One or more guide members 212 and 412 for driving the plate members 210 and 410 and linear drive units 213 and 413 for driving linear movement of the plate members 210 and 410.

Meanwhile, the non-memory device includes plate members 210 and 410 having stacking grooves 211 and 411 having different intervals so as to correspond to various sizes and types of the devices, And the test socket 310 of the test portion 300 are preferably replaceable according to the pitch interval between the elements 1. [

FIG. 6 is a view showing an operation process of an example of the loading buffer unit and the unloading buffer unit in the device testing apparatus of FIG. 1, FIG. 7 is a view showing another modification of the device testing apparatus having the loading buffer unit and the unloading buffer unit of FIG. Fig.

Meanwhile, the loading buffer unit 200 and the unloading buffer unit 400 may transmit the pitch between the test receptacles 310 of the test unit 300 and the pitch between the test receptacles 310 of the loading unit 100 or the unloading unit 500, There is a difference in the pitch interval of the video signal. Therefore, it is preferable that the pitch between the elements 1 is adjusted in addition to the feed tool for the smooth speed of the element 1 in consideration of the size of the element 1 or the difference in pitch between the elements.

6 and 7, the loading buffer unit 200 and the unloading buffer unit 400 may have a pitch (pitch) in the X-axis direction of the loading grooves 211 and 411 in which the devices 10 are loaded, Can be varied.

Various arrangements are possible for varying the pitch in the X-axis direction of the loading grooves 211 and 411 provided in the loading buffer unit 200 and the unloading buffer unit 400. As shown in FIG. 7, The link members 214 and 414 of the link structure connecting the support members 215 and 415 on which the loading grooves 211 and 411 are installed and the support members 213 and 413 by driving the link portions 214 and 414, And driving devices 217 and 417 for adjusting the distance between the two devices.

6 and 7, the loading buffer unit 200 and the unloading buffer unit 400 may be configured to exchange the element 10 with the loading unit 100 or the unloading unit 500, The pitch in the X-axis direction of the mounting grooves 211 and 411 is minimized and the pitch in the X-axis direction when positioned at (2) and (4) for exchanging the element 1 with the test portion 300 is So that the pitch can be varied to maximize it.

Particularly, when the loading buffer unit 200 and the unloading buffer unit 400 are located at the element exchange positions with respect to the test unit 300, Axis direction pitch formed by the test socket 310 of the test socket 300.

Further, when the pitches of the loading buffer unit 200 and the unloading buffer unit 400 are changed simultaneously, the apparatus becomes complicated. The pitches of the loading grooves 211 and 411 in the Y- Axis direction of the test socket 310 in the Y-axis direction.

Unlike the embodiment of FIG. 2 described above, the loading buffer unit 200 and the unloading buffer unit 400 may be configured as a single layer for simplification of apparatuses rather than two stages.

The test unit 300 is configured to receive the element 1 from the loading buffer unit 200 and to transfer the element 1 to the unloading buffer unit 400 in order to classify the element according to the test result after the test. As shown in FIG. 1, a plurality of test sockets 310 are installed.

The test socket 310 is configured for connection with a terminal of the device 1 for testing the device 1, and may have various configurations. As described above, the test socket 310 can be replaced in accordance with the type of device, Can be installed.

Meanwhile, the test unit 300 can be configured as a PCB board having a test socket 310, which is a simple structure according to the configuration, and can be independently configured as a modularized structure.

Particularly, when the test unit 300 is implemented as a PCB board having the test socket 310, it is possible to significantly reduce the configuration cost of the test unit 300, which is relatively expensive.

On the other hand, the test unit 300 can be variously tested, and more preferably, can be configured to be capable of only testing at room temperature.

The first transfer tool 610 and the second transfer tool 620 transfer the data from the loading unit 100 to the loading buffer unit 200 and from the unloading buffer unit 400 to the unloading unit 500, A plurality of pickers for picking up the element 1 and a driving device for driving movement of a plurality of pickers in the vertical direction (Z direction) and the horizontal direction (XY direction) .

The picker has a pickup head for picking up the element 1 and transferring it to a predetermined position, which can be variously configured and forms a vacuum pressure on the upper surface of the element 1, and a pneumatic cylinder Lt; / RTI >

The pickers are mounted on the tray 2 of the loading unit 100 and the unloading unit 500 and the loading grooves 211 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 And 411 may be arranged to be adjustable in consideration of the case where the intervals of the semiconductor elements 10 are different from each other. However, in order to allow a greater number of semiconductor elements 10 to be transferred, have.

The pickers of the first transfer tool 610 are arranged in 2x8 so that the pickers 631 and 641 of the third transfer tool 630 and 640 can be moved 4 x 8 < / RTI > Here, the second transfer tool 620 may be configured to be the same as or similar to the configuration of the first transfer tool 610.

The driving device may be configured in various ways according to the driving mode of the pickers, and may include a vertical movement device for moving the pickers up and down and a horizontal movement device for moving in the horizontal direction.

The up-and-down moving device may be configured to move the entire pickers up and down at a time, or may be connected to each of the pickers such that each of the pickers is independently moved up and down.

The horizontal direction moving device can be configured in various ways according to the moving mode of the pickers, and can be configured to move in a single direction in the X direction or the Y direction, or in the X-Y direction.

The third transfer tool 630 and 640 are configured to sequentially transfer the loading buffer unit 200, the test unit 300 and the unloading buffer unit 400, Configuration is possible.

Meanwhile, the third transfer tools 630 and 640 are installed as a pair and are configured to transfer the test unit 300 and the unloading buffer unit 400, respectively, between the loading buffer unit 200 and the test unit 300 .

The third transfer tool 630 and 640 may be reloaded through the loading buffer unit 200, the test unit 300 and the unloading buffer unit 400 as shown in FIGS. 1 and 4A to 4F And may be installed to circulate to the buffer unit 200.

At this time, the third transfer tool 630 and 640 directly lower the devices 1 picked up by the picker parts 631 and 641 in the test part 300 and press them to the test socket 310 during the test time Lt; / RTI >

And, the third transfer tool 630, 640 may be interfered when moving at the intersection with each other, and may be moved upward or downward during the intersecting movement, as shown in FIG. 4F, to prevent interference therebetween.

Particularly, the third transfer tool 630, 640 is a constitution for eliminating interference when the third transfer tool 630, 640 moves. The third transfer tool 630, 640 connects the loading buffer unit 200 and the unloading buffer unit 400, 653 and a second guide part 654, as shown in FIG.

FIGS. 8A to 8C are diagrams showing a process of transferring a device from the loading buffer unit to the unloading buffer unit in the device testing apparatus of FIG. 1 having the modified third transfer tool, Figs. 10A and 10B are views showing an operation procedure when the third transfer tool of Fig. 9 is placed on the test portion. Fig.

Meanwhile, the third transfer tools 630 and 640 are installed to be cyclically moved to the loading buffer unit 200 through the loading buffer unit 200, the test unit 300, and the unloading buffer unit 400 by various methods. .

As another example, the third transfer tool 630, 640 may include a transfer tool body 634, 644 which moves along the guide portion 650, as shown in Figs. 8A to 10B; (632, 642) rotatably hinged to the transport tool bodies (634, 644) and provided with a plurality of pickers (631) for picking up the element (1); And a tool rotating part driving part 633 for rotating the picking parts 632 and 642 between a parallel position parallel to the upper surface of the test part 300 and an inclined position inclining in parallel.

The tool rotation unit driving unit 633 is configured such that one end P1 is hinged to the conveying tool bodies 634 and 644 and the other end P2 is hinged to the picking units 632 and 642, And a cylinder portion that rotates the hinge shafts 632 and 642 about the hinge axis C1 of the transfer tool bodies 634 and 644.

At least one of the conveying tool bodies 634 and 644 and the picker support units 632 and 642 may be installed to be movable up and down and the conveying tool bodies 634 and 644 and the picker support units 632, 642 may include an up-and-down driving unit (not shown) for driving up-and-down movement.

The device inspection apparatus according to the present invention can detect the devices 1 picked up by the third conveying tool 630 or 640 when the third conveying tool 630 or 640 is positioned above the testing unit 300, A pressing portion 670 for pressing the picked up portions 632 and 642 of the third conveying tool 300 may be additionally provided so as to maintain contact with the test socket 310 of the third conveying tool 300. [

The pressing unit 670 is positioned on the upper side of the test unit 300 so that the picking units 632 and 642 of the third feeding tool 300 picking up the devices 1 are positioned on the upper side of the testing unit 300 Various configurations are possible as a configuration in which the devices 1 are held in contact with the test socket 310 of the test unit 300 by pressing the picked up portions 632 and 642 downward.

9 to 10B, the pressing portion 670 includes a pressing member 671 for pressing the picked up portions 632 and 642 and a driving portion 673 for driving the pressing member 671 up and down. . &Lt; / RTI >

The pressing member 671 may have any structure as long as it can press the picked up portions 632 and 642 and is provided with a plurality of rollers 642 and 643 for smoothly moving the picked up portions 632 and 642 in the lateral direction (672) may be installed.

Meanwhile, the number of the third transfer tools 630 and 640 is determined in consideration of the transfer speed and the convenience of the transfer, and the transfer tools 630 and 640 may be installed in pairs as shown in FIGS. 8A to 10B.

As described above, when the third transfer tools 630 and 640 are installed as a pair, the pair of third transfer tools 630 and 640 may guide the guide part 650 Therefore, at least one of them can move in an inclined state in order to prevent the movement from interfering with each other when they cross each other.

That is, as shown in FIG. 9, when any one of the pair of third transfer tools 630 and 640 passes through the pressing portion 670 or intersects with the other third transfer tool 630 and 640 Any one or both of the pair of third transfer tools 630 and 640 can move along the guide portion 650 while maintaining the inclined state.

The transfer of the element 1 by the third transfer tool 630, 640 having the above-described configuration operates as shown in Figs. 8A to 10B, and substantially similar to the transfer of the similar So that detailed description will be omitted.

Hereinafter, a device testing apparatus according to another embodiment of the present invention will be described with reference to FIGS. 11 to 17. FIG.

11 to 17 show the loading slots 211 and 411 of the loading buffer unit 200 and the unloading buffer unit 400, the test socket 310 of the testing unit 300, the third feeding tools 630 and 640, And the arrangement of the pickers 631 and 641 of FIG. 11 to 16, the specific configurations of the loading grooves 211, 411, the test socket 310, and the pickers 631, 641 are omitted and are shown by a simple rectangle.

Figs. 11 to 17 show examples of the loading grooves 211, 411, the test socket 310 and the pickers 631, 641 in which at least one of the left-right pitch and the vertical pitch, the row pitch and the column pitch are arranged in different arrangements. / RTI >

11, the stacking grooves 211, 411, the test socket 310, and the pickers 631, 641 may be arranged in two rows spaced apart at a predetermined interval. For example, the stacking grooves 211 and 411, the test socket 310, and the pickers 631 and 641 may be arranged in a total of 32 in a 16 × 2 array.

12, the stacking grooves 211, 411, the test socket 310, and the pickers 631, 641 may be arranged in two rows spaced apart at a predetermined interval. For example, the stacking grooves 211 and 411, the test socket 310, and the pickers 631 and 641 may be arranged in a total of 16 in an array of 8 × 2.

The stacking grooves 211 and 411, the test socket 310 and the pickers 631 and 641 may be arranged in two rows spaced apart by a predetermined distance as shown in FIG. Here, the interval between the two rows may be narrower than that shown in Figs. 11 and 12. For example, the stacking grooves 211 and 411, the test socket 310, and the pickers 631 and 641 may be arranged in a total of 16 in an array of 8 × 2.

Fig. 14 shows an arrangement of 16x2 as shown in Fig. 11 and an arrangement of 8x2 as shown in Fig. According to this embodiment, two sets of loading grooves 211, 211 having an array of 8x2 are arranged in the space between the loading slots 211, 411, test socket 310 and pickers 631, 411, the test socket 310, and the pickers 631 and 641 are disposed. In such a case, space utilization can be improved.

Fig. 15 shows a 16x2 array as shown in Fig. 11 and a 3x2 array of four sets together. According to this, four sets of stacking grooves 211 (411) having a 3x2 array in the space between the stacking grooves 211, 411 having the arrangement of 16x2, the test socket 310 and the pickers 631, 411, a test socket 310, and a picker 631, 641 are arranged. In such a case, the space utilization can be greatly improved.

16, three sets of the test socket 310 and the loading grooves 211, 411 having the arrangement of 16 x 2 as shown in Fig. 11 can be arranged. That is, the loading grooves 211 and 411 and the test socket 310 may be arranged in a 16 × 6 array.

In such a case, as shown in FIG. 17, the pickers 631 and 641 may be arranged in a 16 × 2 array as shown in FIG. 11, and an 8 × 2 array And the pickers 631 and 641 may be disposed together or interchangeably in an arrangement of 16x2 and an arrangement of 8x2.

In such a case, the third transfer tool 630, 640 reciprocates twice so that the element can be transferred from the two sets of the loading grooves 211, 411 having the arrangement of 16 × 2, By reciprocating the tools 630 and 640 once, the elements can be transferred from the loading grooves 211 and 411 having an array of 8 × 2.

According to the above-described configuration, since the test sockets 310 having two or more arrangements can be disposed together or interchangeably, it is possible to use one device to measure the type of the device including the size of the device, Depending on the type of test and the speed of the test process, the device can be tested.

Further, since the test sockets 310 having the same arrangement form are arranged together in two or more sets, each set can be independently driven. That is, in the process of testing a device in the test socket 310 corresponding to one set, the device to be tested in the test socket 310 corresponding to another set may be in a state of being picked up, Accordingly, when the test for the device in one test socket 310 is completed, the device to be tested in the test socket 310 corresponding to the other set can be tested immediately. Therefore, it is possible to minimize the time required for performing the test on the device.

Hereinafter, another embodiment of the present invention will be described with reference to Figs. 1 and 18. Fig.

As shown in FIG. 1, an element heating unit for heating a device may be disposed between the loading unit 100 and the test unit 300.

As shown in Fig. 18, the element heating portion 900 includes a heating chamber 910 having an accommodation space which is maintained at an ambient temperature of room temperature or higher, and a plurality of A circulation device 920 for circulating the tray 2 and a heater 930 for heating the inside of the heating chamber 910. [

As the heater 930, a hot air supplier or a heater that supplies hot air to the inside of the heating chamber 910 may be used.

The heating chamber 910 is disposed between the loading unit 100 and the test unit 300 and is configured to include a circulation path of the plurality of trays 2. [ The heating chamber 910 is provided with an opening through which the first transfer tool 610 enters and exits so that the first transfer tool 610 can pick up the elements loaded on the tray 2 circulating inside the heating chamber 910. [ (911) may be formed. The elements stacked on the tray 2 circulating up and down inside the heating chamber 910 are moved to the heating chamber 910 by the first feeding tool 610 which goes through the opening 911 of the heating chamber 910 910. < / RTI >

The circulating device 920 may include a linear feed mechanism for linearly feeding the tray 2 transferred from the loading section 100 in the up-down direction and the back-and-forth direction.

For example, the linear conveying mechanism may include a horizontal conveying mechanism for horizontally moving the tray 2 and a vertical conveying mechanism for vertically moving the tray 2. As the horizontal transfer mechanism, for example, a configuration including a horizontally extending guide rail and a support block for supporting both ends of the tray 2 and the lower surface of the tray 2 and moving along the guide rail may be used . As the vertical transfer mechanism, a structure including a support block for supporting both ends of the tray 2 and a lower surface of the tray 2, and an actuator for moving the support block in the vertical direction can be used. In addition to this configuration, various mechanisms such as a conveyor belt may be used as the horizontal transfer mechanism, and various mechanisms such as a robot may be used as the vertical transfer mechanism.

Here, the horizontal conveying mechanism may include a first horizontal conveying mechanism and a second horizontal conveying mechanism arranged in two layers in the vertical direction. The vertical conveying mechanism may include a first vertical conveying mechanism disposed at a position adjacent to the loading unit 100 and a second vertical conveying mechanism disposed at a position adjacent to the testing unit 300. The first vertical conveying mechanism may also serve to transfer the tray 2 loaded in the loading unit 100 to the first horizontal conveying mechanism.

According to this configuration, the tray 2 loaded into the loading unit 100 can be transferred to the first horizontal transport mechanism by the first vertical transport mechanism and transported horizontally by the first horizontal transport mechanism. The tray 2 horizontally conveyed by the first horizontal conveying mechanism can be conveyed to the second horizontal conveying mechanism by the second vertical conveying mechanism and horizontally conveyed by the second horizontal conveying mechanism. The tray 2 horizontally conveyed by the second horizontal conveying mechanism can be conveyed to the unloading portion 500 by the tray conveying portion. Therefore, the circulation path of the tray 2 by this linear feed mechanism can be the clockwise direction in Fig.

As described above, the tray 2 is circulated in the heating chamber 41 while being moved in the horizontal direction and the vertical direction by the linear feed mechanism in which the first horizontal feed mechanism and the second horizontal feed mechanism are arranged vertically The empty tray 2 may be moved to the unloading unit 500 after moving to the loading unit 100 again after the device is picked up.

The device testing apparatus according to an embodiment of the present invention is configured to circulate a tray on which an element is mounted to heat an element for heating the element so that a plurality of elements are continuously Lt; / RTI > Therefore, it is possible to reduce the waiting time for the device to be heated, thereby reducing the time required to inspect the device.

The device inspection apparatus according to an embodiment of the present invention is configured to circulate the tray on which the device is mounted up and down by heating the device so that the length and width in the horizontal direction of the device heating unit for heating the device Can be reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading section 200: loading buffer section
300: Test section 400: Unloading buffer section
500: Unloading section

Claims

A loading unit for loading one or more trays on which a plurality of elements are loaded; A loading buffer unit for receiving elements from the tray of the loading unit through a first transfer tool and temporarily loading the elements; A test unit having a test socket for receiving the elements from the loading buffer unit and performing a test; An unloading buffer unit installed at a position opposite to the loading buffer unit with the testing unit as a center and receiving tested devices by the testing unit; An unloading unit for classifying and loading the elements loaded in the unloading buffer unit through a second transfer tool according to a test result of the test unit; And at least one third transfer tool for transferring the element between the loading section, the test section and the unloading section,
Wherein the test unit is provided with test sockets having two or more arrangements.