KR20210042842A - Pressing module and device handler having the same - Google Patents

Abstract

The present invention relates to a pressurization module and an element handler including the same and, more particularly, to a pressurization module and an element handler including the same, wherein the pressurization module inspects electrical characteristics of the element. The present invention discloses the element handler including: a loading unit (100) for loading a tray (2) on which a plurality of elements (1) are loaded; a test unit (300) for performing a test on the elements (1) received from the loading unit (100); an unloading unit (500) for receiving the elements (1) from the test unit (300) and loading the elements (1) on the tray (2); a buffer unit (200) including at least one buffer tray (210) moving between a first element exchange position (P1) for exchanging the elements (1) with at least one of the loading unit (100) and the unloading unit (500), and a second element exchange position (P2) for exchanging the elements (1) with the test unit (300); an inspection transfer module (800) including a pair of element pressurization units (820) for transferring the elements between the second element exchange position (P2) and the test unit (300) and pressurizing the elements for element inspection in the test unit (300), and a module movement unit (870) for alternately locating the pair of element pressurization units (820) to the second element exchange position (P2) and a position of the test unit (300) by a horizontal rotation; and at least one transfer tool (400) for transferring the elements (1) between the first element exchange position (P1) and the tray (2) of the loading unit (100) and the unloading unit (500).

Description

Pressing module and device handler having the same}

The present invention relates to a pressing module and a device handler having the same, and more particularly, to a pressing module for inspecting electrical characteristics of the device and a device handler having the same.

Semiconductor devices (hereinafter referred to as'devices') are subjected to various tests such as electrical characteristics, heat or pressure reliability tests by a semiconductor device inspection device after completing the package process.

The device inspection is performed at room temperature in a room temperature environment, depending on the type of device such as a memory device or a non-memory device such as a CPU (Central Processing Unit) or a GPU (Graphic Processing Unit), an LED device, or a solar device. There are various tests, such as a heating test performed.

Meanwhile, as the types of IT devices such as smart phones, smart pads, and smart TVs are diversified and popularized, the demand for non-memory devices such as CPUs, that is, LSI (Large Scale Integration), is rapidly increasing.

Devices such as LSI have a problem in that it is difficult to use expensive inspection equipment due to the small quantity of inspection devices compared to standardized memory device inspection devices due to the characteristics of a small number of various types.

Accordingly, various methods have been proposed as in Patent Documents 1 to 3 with respect to a device handler that inspects and classifies devices such as LSI.

However, in the case of the device handler having the arrangement disclosed in Patent Documents 1 to 3, there is a problem that the overall cost is increased because the device is complicated and relatively expensive materials are used when performing an inspection on a relatively small number of devices.

On the other hand, in the case of the device handler, it is necessary to check the operation state of the device under high temperature when checking the electrical characteristics. Due to the structure of the pressurizing module that presses the device into the test socket, the heating of the device is not stable, reducing the reliability of the device test. There is a problem to make.

In particular, devices such as LSI are difficult to use because expensive testing equipment is difficult to use because the number of tests is smaller than that of standardized memory devices due to the characteristics of a small amount of multi-species, and due to the characteristics of thinning, miniaturization, and nano-manufacturing processes, testing Since it is difficult to precisely control the temperature conditions, there is a problem in that the accuracy of the inspection as to whether the LSI device operates smoothly in a high temperature environment or a low temperature environment is lowered.

In relation to this problem, various methods have been proposed as in Patent Documents 1 to 3 with respect to a device handler that inspects and classifies a device such as a conventional LSI, but the above problems are still not solved.

(Patent Document 1) KR10-1177746 B1

(Patent Document 2) KR10-2019-0000477 A

(Patent Document 3) KR10-2019-0107273 A

(Patent Document 4) KR10-2010-0107945 A

(Patent Document 5) KR10-2011-0113930 A

(Patent Document 6) KR10-2019-0109044 A

(Patent Document 7) KR10-2017-0082862 A

(Patent Document 8) KR10-1754628 B1

A first object of the present invention is to provide an element inspection device capable of quickly performing inspection on a small amount of multiple types of elements and significantly reducing the size and manufacturing cost of the apparatus in order to solve the above problems. have.

A second object of the present invention is to provide a pressurizing module capable of applying stable heat to a device in device inspection under a preset temperature condition, and a device handler having the same.

The present invention was created to achieve the object of the present invention as described above, the present invention, the loading unit 100 in which a tray (2) in which a plurality of elements (1) are loaded is loaded; A test unit 300 for performing a test of the plurality of elements 1 received from the loading unit 100; An unloading unit 500 receiving the device 1 from the test unit 300 and loading it on the tray 2; A first element exchange position (P1) for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and a first element exchanging the element 1 with the test unit 300 A buffer unit 200 in which one or more buffer trays 210 are moved between the two element exchange positions P2; A pair of device pressing units 820 for performing device exchange at the second device exchange position P2 and device pressing for device inspection at the test unit 300, respectively, and the pair of device pressing units An inspection transfer module 800 including a module moving unit 870 alternately positioning 820 to the position of the second element exchange position P2 and the test unit 300 by horizontal rotation; And one or more transfer tools 400 for transferring the element 1 between the tray 2 of the loading unit 100 and the unloading unit 500 and the first element exchange position P1 The device handler of the above is started.

The transfer tool 400 is one transfer tool for transferring the element 1 between the tray 2 of the loading unit 100 and the unloading unit 500 and the first element exchange position P1 It may include 430.

The transfer tool 400 includes a loading transfer tool 410 for picking up the element 1 from the loading unit 100 and transferring it to the buffer tray 210 located at the first element exchange position P1; It may include an unloading transfer tool 420 that picks up the inspected element 1 from the buffer tray 210 located at the first element exchange position P1 and delivers it to the unloading unit 500. .

The buffer unit 200 includes at least one buffer tray 210 that is moved between the first element exchange position P1 and the second element exchange position P2, the first element exchange position P1, and It may include a guide unit 220 for guiding the movement of the buffer tray 210 between the second element exchange position (P2).

The first element exchange position (P1) so that the buffer tray 210 is moved in the X-axis direction, which is a direction perpendicular to the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2. ) May be arranged as one on one side in the X-axis direction with respect to the second element exchange position P2.

The first element exchange position (P1) is arranged in a pair on both sides in the X-axis direction with respect to the second element exchange position (P2), and one of the pair of second element exchange positions (P2), The loading part 100 and the device 1 may be exchanged, and the other one may exchange the unloading part 500 and the device 1.

The first element exchange position (P1) is the second element exchange position so that the buffer tray 210 is moved in the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2. It may be disposed to face the test unit 300 based on the position P2.

The present invention also includes a loading unit 100 in which a tray 2 in which a plurality of elements 1 are loaded is loaded; A test unit 300 for performing a test of the plurality of elements 1 received from the loading unit 100; An unloading unit 500 receiving the device 1 from the test unit 300 and loading it on the tray 2; A first element exchange position (P1) for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and a first element exchanging the element 1 with the test unit 300 A buffer unit 200 in which one or more buffer trays 210 are moved between the two element exchange positions P2; A pair of device pressing units 820 for performing device exchange at the second device exchange position P2 and device pressing for device inspection at the test unit 300, respectively, and the pair of device pressing units A test transfer module 800 including a module moving unit 870 alternately positioning 820 to the position of the second element exchange position P2 and the test unit 300; One or more transfer tools for transferring the element 1 between the loading unit 100 and the tray 2 of the unloading unit 500 and the buffer tray 210 located at the first element exchange position P1 In the device handler, characterized in that it comprises 400, the device pressing portion 820, the support portion 850 supported by the module moving portion 870, and the arrangement of the test socket 310 A fixed support unit 1400 that corresponds to and includes a plurality of pressing modules 1000 for picking up the element 1, and is fixed to the support unit 850 directly or indirectly supported by the module moving unit 870; A pressing member 1510 installed in the fixed support part 1400 so as to move upwardly; A diaphragm (1530) installed on the fixing support (1400) to pressurize the pressing member (1510) downward by pneumatic pressure; A pickup head 1100 in which a temperature control unit 1150 for picking up the element 1 by vacuum pressure and heating or cooling the element 1 at a preset test temperature is installed; A guide support portion 1200 coupled from a lower side of the fixed support portion 1400 to support the pickup head 1100 and move upwardly with respect to the fixed support portion 1400; Disclosing a pressurizing module comprising a contact member 1520 installed at the end of the pressurizing member 1510 to press the upper surface of the pickup head 1100 to minimize heat transfer through the pressurizing member 1510 do.

The pickup head 1100 includes a lower member 1110 formed of a metal material through which the first pickup passage 1180 is vertically penetrated and picks up the element 1 from the lower end; It may include an upper member 1120 coupled to an upper portion of the lower member 1110 so that the temperature control unit 1150 is interposed therebetween and having a second pickup passage 1190 connected to the pneumatic transmission pipe 1920 formed therein. have.

The guide support part 1200 has an inner circumferential surface of the pickup head 1100 and a gap G between the side surfaces of the pickup head 1100 and the pickup head 1100 vertically penetrating through the upper and lower surfaces of the guide support part 1200. A through hole 1290 is formed, and at least one side through hole 1280 that is formed through the side so that the control line 1151 for controlling the pneumatic transmission pipe 1920 and the temperature control unit 1150 can be penetrated and installed. ) Can be formed.

The guide support part 1200 may include a plurality of guide rods 1250 that are vertically inserted into the fixed support part 1410 to guide the vertical movement of the fixed support part 1410.

In order to minimize heat transfer with the pickup head 1100, the inner circumferential surface passes through the guide support part 1200 so that the pickup head 1100 can be fixed with the side surface of the pickup head 1100 and a gap G. The pickup head 1110 may be fixed to the guide support part 1200 by a plurality of screw members 1140 installed.

The plurality of screw members 1140 may have sharp ends.

The pressing member 1510 is formed integrally with a rod portion 1511 at a lower end to which the contact member 1520 is coupled, and an upper end of the rod portion 1511 and extends in a horizontal direction to the diaphragm 1530 It includes a head portion 1512 pressed by the, and the fixed support portion 1400 is formed with a through hole 1431 which supports the head portion 1512 from an upper side and the rod portion 1511 protrudes downward. A lower fixing member 1430; The upper part is fixedly coupled to the upper side of the lower fixing member 1430 so that the diaphragm 1530 is installed in the middle, and a pneumatic control space 1541 for pressing downward by pneumatic pressure from the upper surface of the diaphragm 1530 is formed. It may include a fixing member (1440).

The device handler according to the first aspect of the present invention alternately rotates 180 degrees horizontally between the device pickup position for picking up the device from the buffer tray receiving the device loaded by the tray and the test unit, that is, a position on the test socket. By providing a pair of moving inspection and transfer units, there is an advantage in that the structure of the device is simple, manufacturing cost is reduced, and a test on the device can be performed quickly.

In particular, in performing inspections on devices with relatively small quantities and severe change in specifications, replacement of trays, test sockets, etc. according to device specifications is easy, and the structure is simple, so that manufacturing costs can be significantly reduced.

Meanwhile, in the pressurization module and the element handler having the same according to the second aspect of the present invention, in maintaining a preset test temperature such as heating or cooling the element, the contact area between the pickup head for picking up the element and the support members supporting the same is determined. There is an advantage of improving the reliability and accuracy of the device inspection by minimizing the temperature range of the device based on the test temperature during the device inspection process.

Specifically, the pressing module according to the second aspect of the present invention and the device handler having the same, must press the device downward against the test socket during device inspection, and the contact area such as point contact when pressing the pickup head from the top to the bottom. By minimizing the device, the contact area between the pickup head and the supporting members that supports it is minimized, thereby minimizing the temperature range of the device based on the test temperature during the device inspection process, thereby improving the reliability and accuracy of the device inspection. There is this.

In addition, in supporting the pickup head, a support structure for supporting the pickup head by supporting the pickup head using a screw having a pointed end with a gap between the pickup head and the inner circumferential surface of the support member installed so that the pickup head penetrates vertically. There is an advantage in that the reliability and accuracy of the inspection of the device can be improved by minimizing the heat transfer through the device by minimizing the temperature range of the device based on the test temperature during the inspection process of the device.

1 is a conceptual diagram showing an element handler according to a first embodiment of the present invention.
2 is a conceptual diagram showing an element handler according to a second embodiment of the present invention.
3A and 3B are schematic diagrams illustrating a transfer process of a device between a test unit and a buffer tray positioned at a second device exchange position in the device handler of FIG. 1.
3C is a conceptual diagram illustrating an example of a buffer unit in the device handler of FIG. 1.
4 is a front view showing an example of a pressing module according to the present invention.
5 is a side view showing an example of a pressing module according to the present invention.
6 is a plan view showing a part of the pressing module shown in FIG. 4.
7A and 7B are a side view and a front view of the pressing module shown in FIG. 4, respectively.
8A to 8C are cross-sectional views of VIII-VIII in FIG. 6, respectively, illustrating a process of picking up and pressing an element.
9A to 9C are cross-sectional views of IX-IX in FIG. 6 and are cross-sectional views illustrating various embodiments of a screw member.
10 is a cross-sectional view of X-X in FIG. 9A, showing a state in which the pickup head is supported by a screw member.

Hereinafter, with reference to the accompanying drawings with respect to the pressing module and the element handler having the same according to the present invention will be described as follows.

An element handler according to the present invention, as shown in Figs. 1 to 3C, includes a loading unit 100 in which a tray 2 in which a plurality of elements 1 are loaded is loaded; A test unit 300 for performing a test of the plurality of devices 1 received from the loading unit 100; An unloading unit 500 receiving the device 1 from the test unit 300 and loading it on the tray 2; A first element exchange position (P1) for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and a second element exchange for exchanging the test unit 300 and the element 1 A buffer unit 200 to which one or more buffer trays 210 are moved between positions P2; A pair of device pressurizing units 820 and a pair of devices respectively performing device exchange at the second device exchange position P2 and device transfer between the test unit 300 and the second transfer position P3 An inspection transfer module 800 including a module moving unit 870 alternately positioning the pressing unit 820 to the position of the first element exchange position P1 and the test unit 300 by horizontal rotation; One or more transfer tools 400 for transferring the element 1 between the tray 2 of the loading unit 100 and the unloading unit 500 and the buffer tray 210 located at the second element exchange position P2 Includes.

Here, the device 1 to be inspected by the device handler according to the present invention may be a memory semiconductor, a central processing unit (CPU), a graphics processing unit (GPU), a system large scale integration (LSI), or the like.

In particular, the device 1 may be any device in which one or more external terminals are formed for performing a preset test by being pressed against the test socket 310 of the test unit 300.

For example, the device 1 may be a BGA device in which ball-shaped external terminals are formed on a bottom surface.

The loading unit 100 is a configuration in which a tray 2 loaded with a plurality of elements 1 for testing is loaded, and various configurations are possible.

For example, the loading unit 100 may include a pair of guide rails for guiding the tray 2 to be moved, and a driving unit (not shown) for moving the tray 2.

For reference, the loading unit 100 may have the same or similar configuration as the loading unit shown in FIG. 2 of Patent Document 4.

In addition, it goes without saying that two or more loading units 100 may be disposed as shown in FIGS. 1 and 2 in order to load a larger number of elements 1.

The unloading unit 500 is configured to receive the device 1 from the test unit 300 and load the device 1 on the tray 2, and various configurations are possible.

In particular, the unloading unit 500, as shown in Figs. 1 and 2, classifies the device 1 according to the test result of the test unit 300 and classifies it in advance so that it can be loaded on the tray 2 Depending on the grade, it can be placed in multiple numbers.

More specifically, the unloading unit 500 is disposed in plural and a good unloading unit 510, 520, 530 and the rest of the trays in which the elements 1 inspected as good are loaded on some of the trays 2 In (2), a defective unloading unit 540 may be included in which the elements 1 inspected as non-defective by the test unit 300 are loaded.

On the other hand, the unloading unit 500 is classified into good products and defective products, but a classification grade is separately assigned according to the inspection contents, and the elements 1 may be loaded according to the classification grade.

On the other hand, the loading unit 100 and the unloading unit 300, as in Patent Literature 1 and Patent Literature 3, the tray 2 is exposed to the upper side of the device body, and a configuration for transporting and reloading the tray 2, etc. May be configured to be installed within the device body.

In addition, the loading unit 100 and the unloading unit 300 may include a guide installed so that the tray 2 can be linearly moved in the Y-axis direction or the X-axis direction, as in Patent Document 2.

The test unit 300 is a component that performs a test of the plurality of elements 1 received from the loading unit 100, and the DC characteristics of the plurality of elements 1 received from the loading unit 100 It is a configuration for performing tests such as the same electrical characteristics, and various configurations are possible according to the type of test and device specifications such as room temperature test and hot temperature test.

For example, the test unit 300 may include one or more test sockets 310 to perform a test on each device 1.

The test socket 310 is a configuration installed so that the devices 1 can be electrically connected, and various configurations are possible according to the type of test and device standard.

As an example, the test socket 310 is a plurality of m×n (one of m and n is a natural number of 1 or more, and the other is a natural number of 2 or more) to match the number and arrangement of the devices to be tested. Can be arranged in an array.

In particular, the test socket 310 of the present invention can have a variety of arrangements such as 1×1, 1×2, 2×2, 4×2, 8×2, etc. have.

Specifically, in the test socket 310, as shown in FIGS. 3A and 3B, an element 1 may be seated and an element seating groove 311 electrically connected to the element 1 may be formed.

In addition, the test result of the device 1 tested by the test socket 310 is used as data for classification in the unloading unit 500 to be described later.

The buffer unit 200 includes a first element exchange position P1 for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and the test unit 300 and the element 1 As a configuration in which one or more buffer trays 210 are moved between the second element exchange positions P2 for exchanging ), various configurations are possible according to the moving configuration of the buffer tray 210.

Here, the first element exchange position P1 is defined as a position where the buffer tray 210 is positioned to exchange the element 1 with at least one of the loading unit 100 and the unloading unit 500, and loading One or more positions may be set according to the device exchange method for the unit 100 and the unloading unit 500, and the number of transfer tools for device transfer.

For example, the first element exchange position P1 may be set to one position, as shown in FIG. 1.

In this case, the device 1, which has been inspected at the first device replacement position P1, is pulled out from the buffer tray 210 to the tray 2 located at the unloading unit 500, and then transferred to the loading unit 100. The device 1 to be inspected can be loaded from the positioned tray 2 to the buffer tray 210.

In this case, element exchange between the buffer tray 210 and the loading unit 100 and the unloading unit 500 may be performed by a single transfer tool 400.

As another example, the first element exchange position P1 may be set to two positions, as shown in FIG. 2.

In this case, one of the pair of first element replacement positions P1-the loading position-is the tray 2 located in the unloading unit 500 in the buffer tray 210 of the tested element 1 The other one-the unloading position-may be set as a position to load the element 1 to be inspected into the buffer tray 210 from the tray 2 located in the loading unit 100. have.

At this time, the element exchange between the buffer tray 210 and the loading unit 100 and the unloading unit 500 is performed by picking up the element 1 from the loading unit 100 to obtain a first element exchange position (P1)-loading position- Loading and transfer tool 410 that delivers to the loading tray (210) located in; and picked up the inspected device (1) from the buffer tray (210) located in the first device exchange position (P1)-unloading position- This may be accomplished by an unloading transfer tool 420 that is transferred to the unloading unit 500.

The second element exchange position P2 is defined as a position where the buffer tray 210 is positioned to exchange the test unit 300 and the element 1, and the loading unit 100 and the unloading unit 500 It can be set to one or more positions according to the device exchange method for the device and the number of transfer tools for device transfer.

On the other hand, the arrangement of the first element exchange position (P1) and the second element exchange position (P2) may be set in various ways according to the number of the first element exchange position (P1) and the number of the buffer tray 210 and the moving direction. I can.

For example, the first element exchange position P1 may be located at a position opposite to the position of the test unit 300 around the second element exchange position P2, as shown in FIG. 1.

In this case, the first element exchange position P1, the second element exchange position P2, and the test unit 300 may be arranged in a row, that is, in a row in the Y-axis direction.

That is, so that the buffer tray 210 is moved in the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2, the first element exchange position P1 is the second element exchange position ( It may be disposed to face the test unit 300 based on P2).

In this case, as shown in FIG. 3C, the buffer tray 210 may be arranged vertically and alternately moved between the first element exchange position P1 and the second element exchange position P2.

As another modified example, the first element exchange position so that the buffer tray 210 is moved in the X-axis direction, which is a direction perpendicular to the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2. One (P1) may be disposed on one side in the X-axis direction with respect to the second element exchange position P2.

As another example, as shown in FIG. 2, the first element exchange positions P1 may be opposed to each other around the second element exchange positions P2 and may be arranged in a pair.

At this time, the pair of the first element exchange position (P1) and the second element exchange position (P2) are arranged in the X-axis direction, and the test unit 300 and the second element exchange position (P2) are the X-axis It may be arranged in a line in a direction perpendicular to the direction, that is, in the Y-axis direction.

That is, the first element exchange position (P1) is arranged in a pair on both sides in the X-axis direction with respect to the second element exchange position (P2), and one of the pair of first element exchange positions (P1), The loading unit 100 and the element 1 may be exchanged, and the other one, the unloading unit 500 and the element 1 may be exchanged.

On the other hand, the buffer unit 200 is a configuration in which the buffer tray 210 is moved between the first element exchange position (P1) and the second element exchange position (P2). Therefore, various configurations are possible.

For example, the buffer unit 200 includes one or more buffer trays 210 that are moved between a first element exchange position P1 and a second element exchange position P2, a first element exchange position P1, and It may include a guide unit 220 for guiding the movement of the buffer tray 210 between the second element exchange position (P2).

The buffer tray 210 is a configuration installed to temporarily load the device 1 that has been tested or the device 1 to be tested, and may have various configurations.

For example, in the buffer tray 210, one or more seating grooves 211 for temporarily loading the device 1 may be formed to transport the devices 1.

In this case, the arrangement and number of the seating grooves 211 may be the same as the arrangement and number of the test sockets 310 to be described later.

For example, the seating groove 211 may be arranged in an array of m×n (one of m and n is a natural number of 1 or more, and the other is a natural number of 2 or more).

In addition, the placement position of the seating groove 211 on the buffer tray 210 is the placement position of the test socket 310 of the test unit 300 in consideration of the efficiency of pickup and placement of the device pressing unit 820 to be described later. It is preferable to position it in the same way as.

Specifically, the pitch in the X-axis direction and the pitch in the Y-axis direction of the mounting groove 211 arranged in m×n are the same as the pitch in the X-axis direction and the pitch in the Y-axis direction of the test sockets 310 of the test unit 300 desirable.

Meanwhile, when the pitch in the X-axis direction and the pitch in the Y-axis direction of the seating groove 211 of the buffer tray 210 are the same as the pitch in the X-axis direction and the pitch in the Y-axis direction of the test sockets 310, The tray 2 or the tray 2 of the unloading unit 500 is preferably formed to be larger than the pitch in the X-axis direction and the pitch in the Y-axis direction.

That is, the pitch in the X-axis direction and the pitch in the Y-axis direction of the test sockets 310 of the test unit 300 is the mounting of the tray 2 of the loading unit 100 or the tray 2 of the unloading unit 500 The pitch in the X-axis direction and the pitch in the Y-axis direction formed by the grooves are different from each other, and in particular, may be formed to be larger.

In this case, the difference between the pitch in the X-axis direction and the pitch in the Y-axis direction between the tray 2 of the loading unit 100 or the tray 2 of the unloading unit 500 and the buffer tray 210 In order to reflect, the transfer tools 400, 410, and 420 are preferably configured such that the pitch of the pickers picking up each element 1 is variable.

The guide unit 220 is a configuration for guiding the movement of the buffer tray 210 between the first element exchange position (P1) and the second element exchange position (P2), the guide structure of the buffer tray 210 Therefore, various configurations are possible.

On the other hand, the buffer unit 200, as an example, as shown in Figure 1, one buffer tray 210 is moved between the first element exchange position (P1) and the second element exchange position (P2). It can be configured to be.

Furthermore, the buffer unit 200 includes two or more buffer trays 210 between the first element exchange position P1 and the second element exchange position P2 for efficiency of loading and unloading of the element 1. It is more preferable that it is configured to move in

To this end, the two or more buffer trays 210 are arranged vertically in the arrangement of FIG. 1, as shown in FIG. 3C, and the guide part 220 is a guide rail for moving each buffer tray 210. 212 and a movement driving unit 213 for driving the movement of each buffer tray 210 along the guide rail 212.

On the other hand, the buffer unit 200, as another example, as shown in Figure 2, the first element exchange position (P1) in the X-axis direction with respect to the first element exchange position (P1) in a pair on both sides. When arranged, a first buffer tray 210 and a second element exchange position (the first buffer tray 210 that is moved between one (loading position) of the pair of first element exchange positions P1 and the second element exchange position P2) and the second element exchange position ( It may include a second buffer tray 210 that is moved between P2) and the other (unloading position) of the pair of first element exchange positions P1.

At this time, the first buffer tray 210 receives the element 1 to be inspected from the loading unit 100 at the loading position and moves to the first element exchange position P1 to the inspection transfer module 800, which will be described later. Deliver.

In addition, the second buffer tray 210 receives the device 1 that has been tested at the first device exchange position P1 from the test transfer module 800 and moves to the unloading position, so that the unloading unit 500 The element 1 can be delivered to the furnace.

On the other hand, the first element exchange position (P1) is, when the inspection speed of the element (1) in the test unit (300) to be described later is relatively slow, the second element exchange position (P2) of the element (1). As shown in Fig. 1, the unloading and loading times are sufficient, and it is efficient in the device configuration to be set to one.

And the first element exchange position (P1) is, when the test speed of the element 1 in the test unit 300 to be described later is relatively high, the first element exchange position (P1) of the element (1). In consideration of the efficiency of unloading and loading, as shown in FIG. 2, it is effective in the device configuration to be set as a pair.

On the other hand, the at least one transfer tool 400, between the tray 2 of the loading unit 100 and the unloading unit 500 and the buffer tray 210 located at the first element exchange position (P1) ( As a configuration for transferring 1), various configurations are possible according to the arrangement of the second element exchange position P2, the arrangement of the tray 2 of the loading unit 100 and the unloading unit 500, and the like.

For example, the transfer tool 400 is between the tray 2 of the loading unit 100 and the unloading unit 500 and the buffer tray 210 located at the second element exchange position P2. ) Can only be configured as one to transport.

In this case, the device handler may include an X-Y robot to move the transfer tool 400 in the X-Y direction.

As another example, the transfer tool 400 is a loading transfer tool 410 that picks up the element 1 from the loading unit 100 and delivers it to the buffer tray 210 located at the first element exchange position P1. and; It may include an unloading transfer tool 420 that picks up the inspected element 1 from the buffer tray 210 located at the first element exchange position P1 and transfers it to the unloading unit 500.

Even in this case, the device handler may include an X-Y robot to move the transfer tools 410 and 420 in the X-Y direction.

Meanwhile, the transfer tools 400, 410, 420 are configured to pick up or place the element 1 in the tray 2 and the buffer tray 210 and transfer the element 1 in the pickup state, and various configurations are possible. Do.

For example, the transfer tools 400, 410, 420 include pickers for picking up the elements 1 by vacuum pressure to pick up the plurality of elements 1, 4×1, 8×1, 4×2 , May be installed in plural in an arrangement of 8×2, etc.

In addition, the pickers are configured to pick up and place the element 1, respectively, and may be configured to be sucked by vacuum pressure according to a pickup method, and so on.

As an example, the pickers are configured for picking up the element 1 by vacuum pressure, and various configurations such as the picker disclosed in Patent Document 5 are possible.

In addition, the transfer tools 400, 410, 420 allow each picker to move at least one of an individual θ axis rotation movement and a total θ axis rotation movement in consideration of correction of the rotation error of the picked up element 1 Can be configured.

Here, the θ-axis rotational movement refers to a direction in which the picker picks up the element 1, that is, rotation with the Z-axis as a rotation axis.

Meanwhile, as described above, the pitch in the X-axis direction and the pitch in the Y-axis direction of the test sockets 310 of the test unit 300 are the tray 2 of the loading unit 100 or the tray of the unloading unit 500 ( The pitch in the X-axis direction and the pitch in the Y-axis direction formed by the 2) seating grooves are different from each other, and may be formed particularly larger.

That is, the pitch in the X-axis direction and the pitch in the Y-axis direction formed by the seating grooves between the tray 2 of the loading unit 100 or the tray 2 of the unloading unit 500 and the buffer tray 210 are different from each other. I can.

Accordingly, in order to reflect the pitch difference, the transfer tools 400, 410, and 420 are preferably configured such that the pitches of the pickers picking up each element 1 are variable.

Here, the transfer tools 400, 410, 420 are pitch control structures formed by a plurality of pickers, and may have various structures such as a cam structure and a belt structure.

Specifically, the transfer tool (400, 410, 420) may adopt the structure suggested by Patent Documents 6 to 8 and the like.

On the other hand, the transfer tool (400, 410, 420) uses a tool in which the pitch formed by a plurality of pickers is fixed, and ultimately to reflect the difference in the pitch of the seating grooves of the test socket 310 and the tray 2 The pitch in the X-axis direction and the pitch in the Y-axis direction formed by the seating grooves 211 of the buffer tray 210 may be varied.

Here, as an example of a configuration in which the pitch in the X-axis direction and the pitch in the Y-axis direction formed by the seating grooves 211 of the buffer tray 210 are variable, the plate member disclosed in FIGS. 6 and 7 of Patent Document 1 may be adopted. .

On the other hand, it is preferable that the tray 2 of the loading unit 100 is transferred to the unloading unit 500 by a tray transfer unit (not shown) when the element 1 is completely emptied.

At this time, since the element 1 may remain in the tray 2, the element 1 remaining in the tray 2 before the tray 2 is transferred from the loading unit 100 to the unloading unit 500 A tray rotation unit (not shown) may be installed to remove the remaining elements 1 by rotating the tray 2 in order to remove them.

The tray rotation unit is installed on the transfer path of the tray 2 between the loading unit 100 and the unloading unit 500, and receives the tray 2 from the loading unit 100 by the tray transfer unit and receives the tray 2 ) May be configured to transmit the tray 2 to the unloading unit 500 after rotating.

In addition, an empty tray unit 190 capable of supplying the empty tray 2 to the unloading unit 500 or the like or temporarily loading the empty tray 2 from the loading unit 100 may be additionally installed. .

Meanwhile, the loading unit 100 and the unloading unit 500 may be arranged in various ways according to design conditions, but as shown in FIGS. 1 and 2, the loading unit 100 and the unloading unit 500 may be arranged in a line around the test unit 300. However, it is not necessarily limited thereto.

In addition, after all the elements 1 are withdrawn from the tray 2 of the loading unit 100, the empty trays 2 are unloaded so that the tested elements 1 can be loaded by the tray transfer unit (not shown). It may be delivered to the loading unit 500.

On the other hand, the inspection and transfer module 800, a pair of device pressing unit 820 that performs the device exchange at the second device exchange position (P2) and device pressure for device inspection in the test unit 300, respectively. And, as a configuration including a configuration including a module moving unit 870 alternately positioned to the position of the second device exchange position (P2) and the test unit 300 of the pair of device pressing parts 820, various configurations are possible.

The pair of device pressing units 820 are configured to perform device exchange at the second device exchange position P2 and device pressurization for device inspection at the test unit 300 by alternating movement, respectively, and a buffer Various configurations are possible according to the arrangement and movement of the tray 210.

For example, in the case of the device handler according to the embodiment of FIGS. 1 and 2, the pair of device pressing parts 820 are moved to the first device exchange position P1 and the test part 300 by horizontal rotation. It can be configured to be positioned alternately.

On the other hand, the device pressing unit 820 is a support unit 850 supported by a module moving unit 870 to be described later, and a plurality of pressing modules corresponding to the arrangement of the test socket 310 and picking up the device 1 It may contain (1000).

The support part 850 is a configuration for supporting a plurality of pressing modules 1000 to be described later and supported by a module moving part 870 to be described later, and various configurations are possible.

As an example, the support part 850 may have a rectangular plate shape, and various configurations such as control for a plurality of pressing modules 1000 to be described later, electrical connection for temperature sensing, etc., a configuration for pneumatic transmission, etc. Can be installed.

The pressurization module 1000 is a configuration installed to pick up and place the element 1 and pressurize the test unit 300 or the buffer tray 210, and it is possible to pick up, place, and pressurize the element 1 If so, it can have a variety of shapes and structures.

For example, the pressing module 1000 may include a hollow coupling member fixed to the picker support block, and a hollow suction pad detachably coupled to an end of the coupling member.

In addition, the adsorption pad may be made of a flexible material such as rubber or synthetic resin.

On the other hand, the pressurizing module 1000, in order to perform the element exchange at the second element exchange position (P2) and the element pressurization for the element inspection in the test unit 300, the second element exchange position (P2) and It needs to be moved up and down on the test unit 300.

Accordingly, the element pressing unit 820 may be moved up and down by the vertical movement device 840.

Here, the vertical movement device 840 is a configuration for moving each element pressing unit 820 in the vertical direction, and any configuration for moving each element pressing unit 820 such as a pneumatic cylinder and a hydraulic cylinder in the vertical direction. Configuration is also possible.

In addition, the vertical movement device 840 may have various configurations as long as it is installed to vertically move and pressurize the element 1 adsorbed by the pressing module 1000.

On the other hand, the module moving part 870 is configured to alternately position the pair of device pressing parts 820 to the position of the second device exchange position (P2) and the test unit 300, and the buffer tray 210 Various configurations are possible according to the arrangement and movement method of the device.

As an example, the pair of device pressing parts 820 may be alternately positioned in the second device exchange position P2 and the position of the test part 300 by horizontal rotation, and the module moving part 870 is , Various configurations such as a rotation motor are possible according to the rotation structure of the pair of device pressing units 820.

The module moving part 870 is a pair of elements so that a pair of element pressing units 820 are symmetrically arranged with respect to the drive shaft 871 so as to be coupled to the drive shaft 871 and rotate 180° alternately. The main support portion 830 to which the pressing portion 820 is coupled may be coupled.

Meanwhile, the device handler according to the present invention needs to heat or cool to a preset test temperature such as high or low temperature when testing the device 1 seated on the test socket 310.

At this time, the pickup head 1110 that picks up the element 1 is heated or cooled to heat or cool the element 1 to maintain a preset test temperature.

Accordingly, in order to improve the reliability and accuracy of the inspection of the element 1 by minimizing the temperature range of the element 1 based on the test temperature during the inspection process for the element 1, the pickup head 1110 and a support supporting the same. It needs to be configured to minimize the contact area between the members.

Thus, the pressing module 1000 according to the present invention, as shown in Figs. 4 to 10, a fixed support unit 1400 fixed to the support unit 850 directly or indirectly supported by the module moving unit 870 and ; A pressing member 1510 installed in the fixed support part 1400 so as to move upwardly; A diaphragm 1530 installed on the fixed support unit 1400 to press the pressing member 1510 downward by pneumatic pressure; A pickup head 1100 in which a temperature control unit 1150 for picking up the element 1 by vacuum pressure and heating or cooling the element 1 at a preset test temperature is installed; A guide support unit 1200 coupled from a lower side of the fixed support unit 1400 so as to support the pickup head 1100 and move upward with respect to the fixed support unit 1400; It may include a contact member 1520 that is installed at the end of the pressing member 1510 and presses the upper surface of the pickup head 1100 to minimize heat transfer through the pressing member 1510.

Here, the fixed support part 1400 is a structure that is fixed to the support part 850 directly or indirectly supported by the module moving part 870, and various configurations are possible.

In particular, the fixing support 1400 may have various configurations according to the structure of the coupling structure with the support 850 and the pressing member 1510 to be described later.

Here, as described above, the element pressing unit 820 needs to be moved up and down, and the support 850 may be coupled to the lower end of the vertical moving device 840 coupled to the module moving unit 870.

In addition, the support 850 may have a rectangular plate shape, and various configurations such as a configuration for controlling a plurality of pressing modules 1000 to be described later, electrical connection for temperature sensing, etc., and a configuration for pneumatic transmission may be installed. .

In addition, the fixing support unit 1400 may be installed by being fixed to the support unit 850 by one or more coupling auxiliary members 861 and 862 as shown in FIGS. 4 and 5 for convenience of installation.

The coupling auxiliary members 861 and 862 are configured for electrical connection for control of the plurality of pressing modules 1000, temperature sensing, etc., for the convenience of coupling the fixed support unit 1400 to the support unit 850. A first coupling auxiliary member 861 provided with a socket that can be connected at once, and a second coupling auxiliary member 862 coupled to the first coupling auxiliary member 861 in a fixed state of one or more pressing modules 1000 It can be composed of.

The fixing support part 1400 may have a coupling protrusion 1420 formed at an upper end thereof so as to be inserted through the second coupling auxiliary member 862 vertically and fixed by a bolt or the like.

And the fixing support part 1400, in connection with the structure of the pressing member 1510 to be described later, supports the head portion 1512 from the upper side and the through hole 1431 through which the rod portion 1511 protrudes downward is formed. A fixing member 1430; The upper fixing member (1530) is fixedly coupled to the upper side of the lower fixing member (1430) so that the diaphragm (1530) is installed in the middle, and formed with a pneumatic control space (1541) for pressing downward by pneumatic pressure from the upper surface of the diaphragm (1530) ( 1440).

The lower fixing member 1430 is configured to support the head portion 1512 from the upper side and a through hole 1431 through which the rod portion 1511 protrudes downward, and may have various configurations.

It goes without saying that the lower fixing member 1430 may have one or more fixing portions 1260 to be coupled with the upper fixing member 1440 as shown in FIGS. 7A and 7B.

Here, the pressing member 1510 has a vertical cross-sectional shape of a'T' shape, and the through hole 1431 is a space 1542 in which the pressing member 1510 can move up and down, as shown in FIG. 8B. ) Is preferably formed.

The upper fixing member 1440 is fixedly coupled to the upper side of the lower fixing member 1430 so that the diaphragm 1530 is installed in the middle, and a pneumatic control space for pressing downward by pneumatic pressure from the upper surface of the diaphragm 1530 As a configuration in which 1541 is formed, various configurations are possible.

The upper fixing member 1440 may have various configurations together with the lower fixing member 1430 according to the direct or indirect coupling structure to the support part 850 described above, and the upward movement and pressing structure of the pressing member 1510.

The pneumatic control space 1541 is a pneumatic pressure for pressing the pressing member 1510 downward so that the element 1 picked up by the pickup head 1100 to be described later can be pressed downward with respect to the test socket 310. As a control space, various configurations are possible as long as the diaphragm 1530 is pressurized downward by pneumatic pressure.

Meanwhile, the upper fixing member 1440 may be connected to a pneumatic control pipe 1410 for pneumatic control in the pneumatic control space 1541.

The diaphragm 1530 is a member that is installed on the fixing support unit 1400 and presses the pressing member 1510 downward by pneumatic pressure, and is a thin elastic membrane that can be deformed by pneumatic pressure formed in the pneumatic control space 1541. It is preferably formed.

And the diaphragm 1530 is interposed on the upper surface of the lower fixing member 1430 and the bottom surface of the upper fixing member 1440, as shown in Figs. 8A to 8C, in the pneumatic control space 1541 formed on the upper side. It can be deformed by pneumatic pressure.

That is, the diaphragm 1530 may be deformed by pneumatic pressure, as shown in FIGS. 8A to 8C, so that the pressing member 1510 can be moved upwardly.

For reference, FIG. 8A is a view showing a state after picking up the device 1 with respect to the test socket 310 or before loading the device 1 into the test socket 310.

In addition, FIG. 8B is a diagram showing a state in which the device 1 is seated with respect to the test socket 310 or a state immediately before the device 1 is picked up with respect to the test socket 310.

In addition, FIG. 8C shows that the pick-up head 1100 presses the element 1 against the test socket 310 by pressing the pick-up head 1100 downward by the pressing member 1510 by the operation of the diaphragm 1530. It is a diagram showing the state.

Here, the pressing member 1510 is installed in the fixed support unit 1400 so as to move upwardly and moves the pickup head 1100 from an upper side to a lower side to pressurize an element, and various configurations are possible.

For example, the pressing member 1510 has a'T' shape in a vertical cross section, that is, integrally formed with a rod portion 1511 to which the contact member 1520 is coupled to a lower end, and an upper end of the rod portion 1511. It may include a head portion 1512 that is expanded in the horizontal direction and pressed by the diaphragm 1530.

Hereinafter, a method of pressing the element 1 by pushing the pickup head 1110 by the pressing member 1510 will be described.

The pressing member 1510 is, as shown in FIG. 8A, until the lower member 1110, which will be described later, seats the element 1 on the test unit 300, and then descends by the vertical movement device 840. The lower surface of the head portion 1512 is brought into contact with the upper surface of the lower fixing member 1430, and as shown in FIG. 8B, the lower member 1110 mounts the element 1 on the test unit 300. The guide support unit 1200 and the pickup head 1100, which will be described later, are moved upward along the guide rod 1250, and the pressing member 1510 in contact with the upper surface of the pickup head 1100 is also the pickup head 1100. It is pushed by and moves upward.

At this time, the pressing member 1510 stops upward movement as soon as the upper surface of the pressing member 1510 contacts the lower surface of the diaphragm 1530.

And, as shown in Fig. 8c, in order to pressurize the element 1, the diaphragm 1530 is bent downward by applying pneumatic pressure to the pneumatic control space S through the pneumatic control tube 1410. By deforming so that the pressure member 1510 in contact with the upper surface of the pickup head 1100 is pushed downward, the pickup head 1100 in contact with the upper surface of the device 1 is pushed downward, thereby pushing the element (1). Will pressurize.

Meanwhile, as described above, the pressing member 1510 is configured to press the upper surface of the pickup head 1100 in order to press the pickup head 1100 from the upper side to the lower side. It can be configured in a direction that minimizes the contact area so as to minimize temperature change.

Accordingly, it is preferable that the pressing member 1510 has a pointed portion in contact with the pickup head 1100 to achieve line contact or contact contact.

However, there is a problem in that the pickup head 1100 is damaged or a load is not uniformly applied to the lower side when the end shape of the pressing member 1510 is formed sharply and thus makes line contact or contact contact.

Accordingly, the pressing member 1510 is a contact member 1520 that presses the upper surface of the pickup head 1100 to minimize heat transfer through the pressing member 1510, as shown in FIGS. 8A to 8C. 1510) can be installed at the end.

Here, the contact member 1520 is a configuration that is installed at the end of the pressing member 1510 and presses the upper surface of the pickup head 1100 to minimize heat transfer through the pressing member 1510. ), a rod for line contact (arranged parallel to the upper surface of the pickup head 1100), and the like may be used.

Here, it is preferable that the contact member 1520 is formed of a ball having a spherical shape so that the contact area can be minimized and manufacturing is easy.

On the other hand, the pickup head 1100 is a configuration in which a temperature control unit 1150 for heating or cooling the device 1 at a preset test temperature is installed to pick up the device 1 by vacuum pressure, and various configurations are possible. Do.

For example, the pickup head 1100 may include a lower member 1110 formed of a metal material through which the first pickup passage 1180 penetrates vertically and picks up the element 1 from the lower end; The temperature control unit 1150 may include an upper member 1120 coupled to an upper portion of the lower member 1110 so that the temperature control unit 1150 is interposed therebetween and forming a second pickup passage 1190 connected to the pneumatic transmission pipe 1920.

The temperature control unit 1150 is a component for heating or cooling the element 1 at a preset test temperature. For heating, a heater such as a ceramic heater may be used, and for cooling, a member capable of cooling such as a thermoelectric module may be used. I can.

Meanwhile, in the pickup head 1100, although not shown, one or more temperature sensors (not shown) may be installed in appropriate places to control the temperature control unit 1150 to heat or cool the element 1 at a preset test temperature. have.

The guide support unit 1200 is a configuration that is coupled from the lower side of the fixed support unit 1400 so as to support the pickup head 1100 and move up and down with respect to the fixed support unit 1400. Various configurations are possible according to the fixed support structure.

Here, it is preferable that the guide support part 1200 fixedly support the pickup head 1100 by a method of minimizing heat transfer with the pickup head 1100.

As an example, the guide support unit 1200, as shown in Figs. 8A to 8C, has an inner circumferential surface of the pickup head 1100 and a gap G in order to minimize heat transfer with the pickup head 1100. The upper and lower through-holes 1290 through which the head 1100 is vertically penetrated may be formed.

The upper and lower through holes 1290 are through holes formed by penetrating up and down through the guide support unit 1200 so that the pickup head 1100 can be installed vertically, and the inner circumferential surface thereof is a side surface of the pickup head 1100 and a gap ( It is preferable that the pickup head 1100 is fixedly supported to have G).

In this case, as shown in FIG. 9A, the upper member 1120 constituting the pickup head 1100 may be fixedly coupled to the guide support unit 1200 in a state in which heat transfer with the lower member 1110 is blocked.

At this time, the upper member 1120 may have a cooling passage through which a cooling water supply pipe 1910 supplied with cooling water is coupled to block heat transfer with the lower member 1110, as shown in FIGS. 8A to 8C. .

On the other hand, when the coolant flows out, it acts as a cause of malfunction, such as damage to the element 1, and there is a problem in that it is not easy to control the temperature of the pickup head 1100 due to the coolant.

As a more preferable example, the guide support part 1200 has a side surface and a gap (G) of the pickup head 1100 in order to minimize heat transfer with the pickup head 1100, as shown in FIGS. 8A to 8C. The pickup head 1100 may have an upper and lower through hole 1290 through which the pickup head 1100 is formed vertically.

The upper and lower through holes 1290 are through holes formed by penetrating up and down through the guide support unit 1200 so that the pickup head 1100 can be installed vertically, and the inner circumferential surface thereof is a side surface of the pickup head 1100 and a gap ( It is preferable that the pickup head 1100 is fixedly supported to have G).

At this time, as shown in FIG. 9A, in order to minimize heat transfer with the pickup head 1100, the inner circumferential surface has a side surface and a gap G of the pickup head 1100 so that the pickup head 1100 can be fixed, a guide The pickup head 1110 may be fixed to the guide support 1200 by means of a plurality of screw members 1140 installed passing through the support 1200.

Herein, the plurality of screw members 1140 may have an inner circumferential surface of the pickup head 1100 and a gap G so that the pickup head 1100 can be fixed to minimize heat transfer with the pickup head 1100, As a configuration installed through the guide support portion 1200, various configurations are possible.

That is, the plurality of screw members 1140 may pass through the guide support portion through hole 1210 formed by penetrating the guide support portion 1200 in a horizontal direction to fix the pickup head 1100.

The plurality of screw members 1140 may have various configurations, such as being formed to have a pointed end.

For example, the plurality of screw members 1140, as shown in Figs. 9A to 9B, may have a pointed end so as to make point contact with the side surface of the pickup head 1100, as shown in Fig. 9C. As described above, an end of the pickup head 1100 may be formed to penetrate the pickup head 1100 so as to stably fix the pickup head 1100.

In this case, it goes without saying that the plurality of screw members 1140 may have a head part formed at one end to prevent the screw member 1140 from being separated from the guide support part through hole 1210.

On the other hand, the guide support unit 1200 has one or more side through-holes 1280 formed through the side so that the control line 1151 for controlling the pneumatic transmission pipe 1920 and the temperature control unit 1150 can be penetrated and installed. Can be formed.

In addition, the guide support portion 1200 is a coupling structure capable of vertical movement with respect to the fixed support portion 1410, and a plurality of guide rods that are inserted up and down into the fixed support portion 1410 to guide the vertical movement of the fixed support portion 1410 ( 1250).

The plurality of guide rods 1250, as a coupling structure capable of moving up and down with respect to the fixed support part 1410, are inserted up and down in the fixed support part 1410 to guide the moving up and down with respect to the fixed support part 1410. This is possible

Specifically, the plurality of guide rods 1250 may be installed in four so as to correspond to the shape of the fixing support portion 1410 having a rectangular planar shape so as to be positioned at the positions of each vertex.

And the plurality of guide rods 1250, the lower end is fixed to the fixed support portion 1410, the upper end is installed to be movable through the fixed support portion 1410 up and down, and the upper end is separated from the fixed support portion 1410. A head portion for preventing it may be formed.

On the other hand, it goes without saying that various embodiments of the above-described pressing module 1000 can be applied to various device handlers disclosed in Patent Documents 1 to 3, and the like.

Since the above is only described with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as well known, should not be limited to the above embodiments and should not be interpreted, It will be said that both the technical idea and the technical idea together with its fundamental are included in the scope of the present invention.

100: loading unit 210: loading buffer unit
220: unloading buffer unit 500: unloading unit

Claims (14)

A loading unit 100 on which a tray 2 in which a plurality of elements 1 are loaded is loaded;
A test unit 300 for performing a test of the plurality of elements 1 received from the loading unit 100;
An unloading unit 500 receiving the device 1 from the test unit 300 and loading it on the tray 2;
A first element exchange position (P1) for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and a first element exchanging the element 1 with the test unit 300 A buffer unit 200 in which one or more buffer trays 210 are moved between the two element exchange positions P2;
A pair of device pressing units 820 for performing device exchange at the second device exchange position P2 and device pressing for device inspection at the test unit 300, respectively, and the pair of device pressing units An inspection transfer module 800 including a module moving unit 870 alternately positioning 820 to the position of the second element exchange position P2 and the test unit 300 by horizontal rotation;
One or more transfer tools for transferring the element 1 between the loading unit 100 and the tray 2 of the unloading unit 500 and the buffer tray 210 located at the first element exchange position P1 An element handler comprising (400). The method according to claim 1,
The transfer tool 400,
One transfer tool for transferring the element 1 between the loading unit 100 and the tray 2 of the unloading unit 500 and the buffer tray 210 located at the first element exchange position P1 Device handler comprising a (430). The method according to claim 1,
The transfer tool 400,
A loading transfer tool 410 for picking up the element 1 from the loading unit 100 and transferring it to the buffer tray 210 located at the first element exchange position P1;
And an unloading transfer tool 420 for picking up the inspected element 1 from the buffer tray 210 located at the first element exchange position P1 and transferring it to the unloading unit 500 Element handler. The method according to any one of claims 1 to 3,
The buffer unit 200,
One or more buffer trays 210 that are moved between the first element exchange position (P1) and the second element exchange position (P2),
And a guide unit 220 for guiding the movement of the buffer tray 210 between the first element exchange position (P1) and the second element exchange position (P2). The method of claim 4,
The first element exchange position (P1) so that the buffer tray 210 is moved in the X-axis direction, which is a direction perpendicular to the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2. ) Is an element handler, characterized in that one disposed on one side in the X-axis direction with respect to the second element exchange position (P2). The method of claim 5,
The first element exchange position (P1) is,
The second element exchange position (P2) is arranged in a pair on both sides in the X-axis direction, and one of the pair of first element exchange positions (P1) is the loading part (100) and the element (1) The device handler, characterized in that the exchange of and the other, the unloading unit 500 and the device (1). The method of claim 4,
The first element exchange position (P1) is the second element exchange position so that the buffer tray 210 is moved in the Y-axis direction, which is the arrangement direction of the test unit 300 and the second element exchange position P2. The device handler, characterized in that disposed to face the test unit 300 based on the position P2. A loading unit 100 on which a tray 2 in which a plurality of elements 1 are loaded is loaded;
A test unit 300 for performing a test of the plurality of elements 1 received from the loading unit 100;
An unloading unit 500 receiving the device 1 from the test unit 300 and loading it on the tray 2;
A first element exchange position (P1) for exchanging the element 1 with at least one of the loading unit 100 and the unloading unit 500, and a first element exchanging the element 1 with the test unit 300 A buffer unit 200 in which one or more buffer trays 210 are moved between the two element exchange positions P2;
A pair of device pressing units 820 for performing device exchange at the second device exchange position P2 and device pressing for device inspection at the test unit 300, respectively, and the pair of device pressing units A test transfer module 800 including a module moving unit 870 alternately positioning 820 to the position of the second element exchange position P2 and the test unit 300;
One or more transfer tools for transferring the element 1 between the loading unit 100 and the tray 2 of the unloading unit 500 and the buffer tray 210 located at the first element exchange position P1 In the element handler comprising the (400),
The device pressing part 820 corresponds to the arrangement of the support part 850 supported by the module moving part 870 and the test socket 310 of the test part 300 and picks up the device 1. It includes a plurality of pressing modules 1000,
A fixed support part 1400 fixed to a support part 850 supported directly or indirectly by the module moving part 870;
A pressing member 1510 installed in the fixed support part 1400 so as to be able to move up and down;
A diaphragm (1530) installed on the fixing support (1400) to pressurize the pressing member (1510) downward by pneumatic pressure;
A pickup head 1100 in which a temperature control unit 1150 for picking up the element 1 by vacuum pressure and heating or cooling the element 1 at a preset test temperature is installed;
A guide support portion 1200 coupled from a lower side of the fixed support portion 1400 to support the pickup head 1100 and move upwardly with respect to the fixed support portion 1400;
And a contact member (1520) installed at an end of the pressing member (1510) to press the upper surface of the pickup head (1100) to minimize heat transfer through the pressing member (1510). The method of claim 8,
The pickup head 1100,
A lower member 1110 made of a metal material through which the first pickup passage 1180 is vertically penetrated and picks up the element 1 from the lower end;
Includes an upper member 1120 coupled to an upper portion of the lower member 1110 so that the temperature control unit 1150 is interposed therein and having a second pickup passage 1190 connected to the pneumatic transmission pipe 1920 therein. Pressurizing module, characterized in that the. The method of claim 9,
The guide support part 1200,
In order to minimize heat transfer with the pickup head 1100, an inner circumferential surface of the pickup head 1100 has a side surface and a gap G, and an upper and lower through hole 1290 through which the pickup head 1100 is vertically penetrated is formed. ,
A pressurizing module, characterized in that at least one side through hole 1280 is formed through the side so that the control line 1151 for controlling the pneumatic transmission pipe 1920 and the temperature control unit 1150 can be penetrated and installed. . The method of claim 8,
The guide support part 1200,
A pressurizing module comprising a plurality of guide rods (1250) which are inserted up and down into the fixed support part (1400) to guide the vertical movement of the fixed support part (1400). The method of claim 8,
In order to minimize heat transfer with the pickup head 1100, the pickup head 1100 may be fixed with an inner circumferential surface having a side surface and a gap G of the pickup head 1100,
A pressurizing module, characterized in that the pickup head (1100) is fixed to the guide support (1200) by a plurality of screw members (1140) installed passing through the guide support (1200). The method of claim 12,
The plurality of screw members (1140), a pressing module, characterized in that the pointed end is formed. The method of claim 8,
The pressing member 1510 is formed integrally with a rod portion 1511 at a lower end to which the contact member 1520 is coupled, and an upper end of the rod portion 1511 and extends in a horizontal direction to the diaphragm 1530 It includes a head portion 1512 pressed by,
The fixed support part 1400,
A lower fixing member (1430) supporting the head portion (1512) from an upper side and having a through hole (1431) through which the rod portion (1511) protrudes downward;
The upper part is fixedly coupled to the upper side of the lower fixing member 1430 so that the diaphragm 1530 is installed in the middle, and a pneumatic control space 1541 for pressing downward by pneumatic pressure from the upper surface of the diaphragm 1530 is formed. A pressing module comprising a fixing member (1440).

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