KR20120047879A - Semiconductor device inspection apparatus - Google Patents

Abstract

PURPOSE: A device inspecting apparatus is provided to reduce manufacturing costs by using a specific test module with a small number of test items as a test unit. CONSTITUTION: One or more trays are loaded on a loading unit(100). A plurality of devices are loaded on the tray. A loading buffer unit(200) receives devices through a first transfer tool. A test unit(300) tests devices at room temperature. An unloading buffer unit(400) receives devices whose tests are completed. An unloading unit(500) classifies and loads the devices loaded on the unloading buffer unit. One or more third transfer tools transfer the device between the loading unit, the test unit, and the unloading unit.

Description

Device inspection apparatus {Semiconductor device inspection apparatus}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting electrical characteristics and the like of an element.

Semiconductor devices (hereinafter referred to as "devices") are subjected to various inspections such as electrical properties, heat or pressure reliability test by the semiconductor device inspection device after the packaging process.

The inspection of the device includes various tests such as non-memory devices such as memory devices, CPUs and GPUs, room temperature tests performed in a room temperature environment, and heating tests performed in a high temperature environment, depending on the type of devices such as LED devices and solar devices.

However, the conventional device inspection apparatus performing the inspection process for the device has the following problems.

First, although the device inspection apparatus of the related art is capable of testing by low-cost equipment, there is a problem in that an unnecessary waste of equipment cost is performed by performing a test on the device by expensive equipment.

Conventional device inspection apparatus is expensive because the equipment is equipped with a heating device for heating the device is equipped with an expensive test module to enable many kinds of inspection.

However, according to the type of inspection, the device inspection apparatus has a problem that the inspection is performed by the expensive high-end equipment even though a simple room temperature inspection is possible, thereby reducing the productivity against the investment cost for the inspection apparatus.

Second, the conventional device inspection apparatus includes a test module capable of various inspections, and additionally, a heating device is installed, thereby causing a relatively large installation space occupied by the device.

Third, as the device inspection apparatus of the related art is designed to allow more various inspections, the inspection speed becomes slow in a relatively simple room temperature inspection, which lowers the overall productivity.

SUMMARY OF THE INVENTION An object of the present invention is to provide a device inspection apparatus that can greatly improve productivity for investment cost by providing a device inspection apparatus capable of simple inspection such as room temperature inspection for non-memory elements in order to solve the above problems. have.

Another object of the present invention is to provide a device inspection apparatus that can not only significantly reduce the space occupied by the apparatus by optimizing for specialized inspections but also significantly improve the inspection speed.

Another object of the present invention is to provide a device inspection apparatus that can significantly reduce the space occupied by the device by optimizing the transfer of the device for loading, testing and unloading the device.

The present invention has been made to achieve the object of the present invention as described above, the present invention includes a loading unit is loaded with one or more trays loaded with a plurality of elements; A loading buffer unit configured to temporarily receive elements from a tray of the loading unit through a first transfer tool; A test unit which receives the elements from the loading buffer unit and performs a test at room temperature; An unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit; An unloading unit configured to classify and load elements loaded in the unloading buffer unit according to a test result of the test unit through a second transfer tool; Disclosed is a device inspection apparatus comprising at least one third transfer tool for transferring a device between the loading part, the test part and the unloading part.

The loading buffer portion and the unloading buffer portion may include a plate-like plate member having a plurality of loading grooves formed on an upper surface thereof so that elements can be loaded.

Intervals formed by the loading grooves of the plate member may be arranged in accordance with the interval of the test sockets, or may be arranged in accordance with the interval corresponding to the interval of the receiving grooves of the tray.

The loading grooves of the plate member are preferably 1 / n (where n is a natural number of 2 or more) of the intervals of the pickers of the third transfer tool.

The plate member is composed of a pair to move alternately with each other, the pair of plate members are capable of withdrawing the first position and the third transfer tool or the element to receive the elements from the tray of the loading portion The second position may be installed to move alternately with each other.

The plate member is configured in a pair to move alternately with each other, the pair of plate members are a first position and a third transfer tool to transfer the elements to the tray of the unloading unit second loading the element The positions can be installed to move alternately with each other.

The pair of plate members are installed at intervals up and down so as not to interfere with each other, one or more guide members for guiding the linear movement of the plate member and a linear driving device for driving the linear movement of the plate member. can do.

The loading grooves of the plate member and the test socket of the test part may be replaced according to the pitch interval between the elements.

The third transfer tool may be installed to cyclically move back to the loading buffer part via the loading buffer part, the test part, and the unloading buffer part.

The third transfer tool may be configured to lower the semiconductor devices picked up by the picker units in the test unit to press the test socket during the test time.

The device inspecting apparatus includes a pair of the third transfer tools, and the pair of third transfer tools connect the loading buffer portion and the unloading buffer portion, respectively, and have a first guide portion and a second portion installed in parallel with each other. Guided by the guide portion can be moved.

The device inspection apparatus is provided with a pair of the third transfer tool, the pair of the third transfer tool is characterized in that the movement to the upper or lower side at the time of cross movement to prevent interference when moved cross each other Device inspection device.

The device inspection apparatus is provided with a pair of the third transfer tools, one of the pair of the third transfer tools to transfer the device between the loading buffer portion and the test unit, a pair of the third The other of the transfer tools may transfer the device between the test unit and the unloading buffer unit.

The loading buffer part, the test part and the unloading buffer part may be arranged in a line, and a guide part may be installed on the upper side thereof to guide the movement of the third transfer tool.

The third transfer tool may cyclically move from the loading buffer unit, the test unit, and the unloading buffer unit back to the loading buffer unit.

The third transfer tool includes a transfer tool body moving along the guide portion; A picker support rotatably hinged to said transfer tool body and provided with a plurality of pickers for picking up elements; And a tool rotating part driving part for rotating the picker support part between a parallel position parallel to an upper surface of a tray and an inclined position forming an inclination with the parallel position.

The tool rotation driving part may include a cylinder portion of which one end is hinged to the transfer tool body and the other end is hinged to the picker support portion to adjust its length to rotate the picker support portion about the hinge axis of the transfer tool body. have.

At least one of the transfer tool body and the picker support portion may be installed to be movable up and down.

At least one of the transfer tool body and the picker support part may include a vertical drive part for driving a vertical movement.

Pressurizing the picker support of the third transfer tool to maintain contact with the test socket of the test portion of the elements picked up by the third transfer tool when the third transfer tool is positioned above the test portion An additional may be installed.

The device inspection apparatus is provided with a pair of the third transfer tool, the pair of third transfer tool is at least one of the inclined state in order to prevent the movement is interfered when moving cross each other along the guide portion You can go to

The pitch formed by the loading grooves installed in at least one of the loading buffer portion and the unloading buffer portion may vary.

The pitch formed by the loading grooves installed in at least one of the loading buffer portion and the unloading buffer portion is a link portion of a link structure connecting the support members on which the loading grooves are installed, and the link portion to drive between the support members. It can be varied by the drive adjusting the gap.

The test unit may only test at room temperature for the devices.

The loading unit and the unloading unit may include a tray loading unit in which a plurality of trays are stacked.

The loading unit and the unloading unit may include a tray moving unit for transferring a tray orthogonal to a movement path of the third transfer tool, and the trays empty in the loading unit may be transferred to the unloading unit by a tray transfer unit. have.

The device inspection apparatus according to the present invention enables the inspection only in a room temperature environment without a heating device in the configuration of the device, and significantly reduces the manufacturing cost of the device by using a specialized test module having a relatively small number of inspection items as a test section. There is an advantage to reduce.

In particular, the device inspection apparatus according to the present invention is capable of inspecting the device in a heating environment, and because it is configured to enable the device inspection in various environments, the investment cost by significantly reducing the manufacturing cost of the device compared to the conventional expensive device inspection device There is an advantage that can significantly improve the productivity.

In addition, the device inspection apparatus according to the present invention has an advantage that the device can be inspected only at room temperature environment without a heating device, thereby simplifying the device and reducing its size, thereby significantly reducing the space occupied by the device.

Furthermore, as the size of the device becomes smaller, there is an advantage that the moving distance and the exchange time of the device can be shortened, thereby significantly improving the overall inspection speed.

1 is a plan view showing a device inspection apparatus according to the present invention.
2 is a plan view illustrating an example of a loading buffer unit and an unloading buffer unit in the device inspection apparatus of FIG. 1.
3 is a cross-sectional view illustrating a cross section of the loading buffer part and the unloading buffer part of FIG. 2.
4B to 4F are side views illustrating an operation process from the loading buffer unit to the unloading buffer unit in the device inspection apparatus of FIG. 1.
5 is a plan view showing a modification of the device inspection apparatus according to the present invention.
FIG. 6 is a view illustrating an operation process of an example of a loading buffer unit and an unloading buffer unit in the device inspection apparatus of FIG. 1.
FIG. 7 is a plan view illustrating another modified example of the device inspection apparatus in which the loading buffer part and the unloading buffer part of FIG. 6 are installed.
8A to 8C are views illustrating a process of transferring a device from a loading buffer unit to an unloading buffer unit in the device inspection apparatus of FIG. 1 having a modified third transfer tool.
9 is a side view illustrating a modified third transfer tool of the device inspection apparatus of FIG. 1.
10A and 10B are views illustrating an operation process when the third transfer tool of FIG. 9 is positioned on the test unit.

Hereinafter, a device inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view showing a device inspection apparatus according to the present invention, Figure 2 is a plan view showing an example of the loading buffer unit and the unloading buffer unit in the device inspection apparatus of Figure 1, Figure 3 is a loading buffer and unloading of Figure 2 Figure 4 is a cross-sectional view showing a cross section of the loading buffer portion, Figures 4b to 4f are side views showing the operation process from the loading buffer portion to the unloading buffer portion in the device inspection apparatus of Figure 1, Figure 5 is a device inspection apparatus of the present invention It is a top view which shows a modification.

The device inspection apparatus according to the present invention, as shown in Figures 1 to 4f, a loading unit 100 is loaded with at least one tray (2) loaded with a plurality of devices (1); A loading buffer unit 200 for temporarily receiving the elements 1 from the tray 2 of the loading unit 100 through the first transfer tool 610; A test unit 300 receiving the elements 1 from the loading buffer unit 200 and performing a test; An unloading buffer unit 400 installed at a position opposite to the loading buffer unit 200 with respect to the test unit 300 to receive the elements 1 that have been tested by the test unit 300; And an unloading unit 500 for classifying and loading the elements 1 loaded in the unloading buffer unit 400 through the second transfer tool 620 according to the test result of the test unit 300. do.

Here, the transfer of the device 1 between the loading unit 100, the test unit 300 and the unloading unit 500 may be implemented by various methods, one or more third transfer tool, for example, It may be implemented by a pair of third transfer tools (630, 640).

The loading unit 100 and the unloading unit 500 are configurations in which one or more trays 2 in which a plurality of elements 1 are loaded are loaded, and various configurations are possible according to a design and a design. 2) may include a tray loading portion (not shown) is stacked.

For example, as shown in FIG. 1, the loading unit 100 includes a plurality of trays 2 that are properly disposed so that the first transfer tool 610 may pick up and transfer the device 1 without interruption. The tray 2 in which the elements 1 are emptied can be configured to be replaced with the tray 2 in which the elements 1 are filled. Here, the tray 2 is automatically transferred to a position where the first transfer tool 610 can withdraw the element 1 from the tray loading portion after the trays 2 are automatically loaded into the tray loading portion or automatically. Can be.

In this case, the empty tray 2 from which the elements 1 are drawn out may be transferred to the unloading unit 500 by a tray transfer unit (not shown), and before the tray 2 is transferred to the unloading unit 500. It may be rotated in a tray inverting portion (not shown) to remove the element 1 that is not drawn out therein.

Meanwhile, the unloading unit 500 is configured similarly to the loading unit 100, and as shown in FIG. 1, the second transfer tool 620 is classified and loaded according to a test result without disconnecting the elements 1. A plurality of empty trays 2 are suitably arranged according to the classification class, and the tray 2 filled with the elements 1 may be configured to be replaced with the empty tray 2.

In addition, a tray buffer unit (not shown) may be additionally installed between the loading unit 100 and the unloading unit 500 to allow the empty tray 2 to be temporarily loaded.

The tray 2 may be configured in various ways such that the receiving grooves 2a are formed according to a predetermined standard such as 8 × 16 so that a plurality of elements 1 may be loaded.

The device 1 to be inspected may be a non-memory device such as a memory semiconductor, a CPU, a GPU, and a system LSI. In particular, the inspection object is preferably a non-memory device, in particular, a device in which contact terminals in the form of balls are formed on the bottom thereof.

On the other hand, the configuration of the loading unit 100 and the unloading unit 500 is installed inside the device, such as the device inspection apparatus shown in Figure 1, or as shown in Figure 5, the loading buffer unit 100 and unloading It may be installed on the lower side of the loading buffer unit 500.

At this time, the loading unit 100 and the unloading unit 500, as shown in Figure 5, the tray moving unit which is installed to transfer the tray 2 orthogonal to the movement path of the third transfer tool (630, 640) ( 110, 510).

The tray moving parts 110 and 510 are configured to move to the withdrawal or stacking position of the element 1 and the exchange position of the tray 2 in the state in which the tray 2 is supported. As shown, a pair of guide members 111 and 511 for guiding the movement of the tray 2 and a driving unit (not shown) for moving the tray 2 may be included.

Here, the trays 2 emptied from the loading unit 100 may be transferred to the unloading unit 500 by the tray transfer unit 660.

Meanwhile, the tray moving parts 110 and 510 may be configured such that the moving directions of the trays 2 are opposite to each other according to the loading part 100 and the unloading part 500.

The loading buffer unit 200 receives the device 1 from the loading unit 100 and temporarily loads the device 1 to the test unit 300, and the unloading buffer unit 400 receives the device (from the test unit 300). 1) As a configuration for receiving the delivery to the unloading unit 500, various configurations are possible.

In particular, the loading buffer unit 200 and the unloading buffer unit 400 transfer a relatively large number of elements 1 to the test unit 300 in a tray 2 in which a relatively small number of elements 1 are loaded. As a configuration for delivery, the tray 1 is preferably configured to load a larger number of elements 1 than the number of elements 1 that can be loaded.

Meanwhile, as shown in FIGS. 1 and 2, the loading buffer unit 200 and the unloading buffer unit 400 have a plurality of loading grooves 211 and 411 formed on the upper surface thereof so that the elements 1 may be loaded. It may be configured to include a plate-like plate member (210, 410).

Here, the loading buffer part 200 and the plate members 210 and 410 of the unloading buffer part 400 may be configured to be substantially identical to each other, but the heater may be required depending on the conditions required before the test, such as a little heating required for the test. There may be differences such as the addition of a device for imparting the condition.

In addition, the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be disposed at intervals between the test sockets 310 of the test unit 300. It may be arranged in accordance with the interval corresponding to the interval of the receiving groove (2a) of the tray (2).

In addition, the loading grooves 211 and 411 of the plate members 210 and 410 may be disposed at intervals between the pickers 631 and 641 of the third transfer tool 630 and 640 to facilitate device exchange with the test unit 300. 1 / n, for example 1/2. N is a natural number of two or more.

For example, the interval between the receiving grooves 2a of the tray 2 and the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer 200 and the unloading buffer 400 may be In the same way, the spacing of the test sockets 310 of the test unit 300 may be formed n times, for example, twice the spacing of the receiving grooves 2a of the tray 2.

In particular, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are disposed at 16 × 8, and the test sockets 310 of the test unit 300 are disposed at 8 × 4. In this case, the third transfer tools 630 and 640 described later include 8 × 4 pickers 631 and 641 arranged at 8 × 4 at intervals corresponding to the test sockets 310 of the test unit 300. It is possible to transfer the elements (1) of.

In particular, the third transfer tool (630, 640) is the element 1 in the loading grooves (211, 411) of the plate member 210, 410 of the loading buffer portion 200 and the unloading buffer portion 400 By skipping the cells one by one or by stacking them, it is unnecessary to adjust the spacing between the pickers 631 and 641, thereby speeding up device transfer.

Meanwhile, the plate members 210 and 410 may be variously configured as elements for exchanging elements with the test unit 300 by temporarily loading the elements 1, as shown in FIGS. 1 and 2. 210 and 410 may be configured in a pair to move alternately with each other.

In addition, the pair of plate members 210 of the loading buffer unit 200 may include a first position ① and a third transfer tool (1) capable of receiving the elements 1 from the tray 2 of the loading unit 100. The second and second positions 630 and 640 may be installed to alternately move the second position ②, which allows the device 1 to be drawn out.

In addition, the pair of plate members 410 of the unloading buffer part 400 may have a first position (③) and a third transfer tool capable of transferring the elements 1 to the tray 2 of the unloading part 400. 630 and 640 may be installed to alternately move the second position ④ on which the device 1 may be loaded.

In addition, the pair of plate members 210 and 410 are installed at intervals up and down so as not to interfere with each other as shown in FIGS. 2 and 3, and guide the linear movement of the plate members 210 and 410. One or more guide members 212 and 412 and linear driving devices 213 and 413 for driving linear movement of the plate members 210 and 410 may be included.

On the other hand, the non-memory elements may vary in size and type, and the plate members 210 and 410 may have loading grooves 211 and 411 having different intervals so as to correspond to the size of each element according to the type of each element. And the test socket 310 of the test unit 300 is preferably replaceable according to the pitch interval between the elements (1).

FIG. 6 is a view illustrating an example of an operation process of the loading buffer unit and the unloading buffer unit in the device inspecting apparatus of FIG. 1, and FIG. It is a top view showing.

Meanwhile, the loading buffer 200 and the unloading buffer 400 may have a pitch between the test sockets 310 of the test unit 300 and the tray 2 of the loading unit 100 or the unloading unit 500. There is a difference in the picture interval. Therefore, it is preferable that the pitch between the elements 1 is adjusted in addition to the transfer tool in order to smooth the speed of the element 1 in consideration of the size of the element 1 or the pitch difference with other configurations.

Therefore, the loading buffer unit 200 and the unloading buffer unit 400 are pitches formed in the X-axis direction of the loading grooves 211 and 411 on which the elements 10 are loaded, as shown in FIGS. 6 and 7. May be configured to be variable.

As a configuration for varying the pitch in the X-axis direction of the loading grooves 211 and 411 installed in the loading buffer unit 200 and the unloading buffer unit 400, various configurations are possible, as shown in FIG. The link members 214 and 414 having a link structure connecting the support members 215 and 415 to which the loading grooves 211 and 411 are installed, and the support members 213 and 413 by driving the link portions 214 and 414. It may be configured to include a drive unit (217, 417) for adjusting the distance between them.

That is, the loading buffer unit 200 and the unloading buffer unit 400, as shown in Figures 6 and 7, to replace the element 10 with the loading unit 100 or unloading unit 500 ① , ③ in the X-axis direction to minimize the pitch of the loading grooves (211, 411) in the X-axis direction and to replace the element (1) with the test unit 300, if the position is located in the ②, ④ The pitch can be configured to vary to maximize.

In particular, when the loading buffer unit 200 and the unloading buffer unit 400 are located at an element exchange position with the test unit 300, that is, ② and ④, the X-axis pitches of the loading grooves 211 and 411 may be measured by the test unit. The test socket 310 of (300) to achieve the same size as the pitch in the X-axis direction.

In addition, when the loading buffer 200 and the unloading buffer 400 simultaneously change the pitch in the Y-axis direction, the apparatus becomes very complicated. The pitch of the loading grooves 211 and 411 in the Y-axis direction is determined by a test unit ( It is preferable that the test socket 310 of 300 be set to have the same pitch in the Y-axis direction.

Meanwhile, unlike the embodiment of FIG. 2, the loading buffer unit 200 and the unloading buffer unit 400 may be configured as a single layer to simplify the apparatus rather than the second stage.

The test unit 300 receives the device 1 from the loading buffer unit 200 and transfers the device 1 to the unloading buffer unit 400 for classifying the device according to the test result after the test. It is possible to configure, as shown in Figure 1, a plurality of test sockets 310 are installed.

The test socket 310 is a configuration for connecting with the terminal of the device 1 for the test of the device 1, various configurations are possible, as described above, replaceable according to the type of device, test type, etc. Can be installed.

Meanwhile, the test unit 300 may be configured independently of the rest of the configuration, and may be configured as a PCB board in which a test socket 310, which is a simple configuration, is installed according to the configuration.

In particular, when the test unit 300 is implemented as a PCB board in which the test socket 310 is installed, it is possible to remarkably reduce the configuration cost of the relatively high test unit 300 by characterizing each test.

On the other hand, the test unit 300 may be a variety of tests, and more preferably can be configured to test only at room temperature.

The first conveying tool 610 and the second conveying tool 620 are respectively loaded from the loading part 100 to the loading buffer part 200 and the unloading buffer part 400 to the unloading part 500. ), A configuration including a plurality of pickers for picking up the element (1) and a driving device for driving the movement of the plurality of pickers in the vertical direction (Z direction) and the horizontal direction (XY direction), etc. Can be.

The picker is a component for picking up the element 1 and transporting it to a predetermined position. The picker is capable of various configurations and includes a pick-up head for forming a vacuum pressure on the upper surface of the element 1 and a pneumatic cylinder for transferring pneumatic pressure to the pick-up head. Can be configured.

The pickers are loaded grooves 211 of the tray 2 of the "loading unit 100 and the unloading unit 500" and the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400. , 411 may be configured to adjust the horizontal and vertical spacing in consideration of the case where the spacing is different from each other, but the horizontal and vertical spacing may be fixed to enable the transfer of a greater number of semiconductor devices 10. have.

In particular, the pickers of the first transfer tool 610 may be picked up at 2 × 8 so that the pickers 631 and 641 of the third transfer tool 630 and 640 may be moved to allow a larger number of semiconductor elements 10 to be transferred. It can be arranged in 4 × 8. Here, the second transfer tool 620 may be configured the same as or similar to the configuration of the first transfer tool 610.

The driving device may be configured in various ways according to the driving aspect of the pickers, and may include a moving device for moving the pickers up and down and a horizontal moving device for moving in the horizontal direction.

The moving device may be configured to move all the pickers up and down at once, or may be connected to each picker so that each picker moves up and down independently.

The horizontal moving device may be configured in various ways according to the movement mode of the pickers, and may be configured to enable a single direction movement in the X direction or the Y direction, or the X-Y direction movement.

The third transfer tools 630 and 640 are configured to sequentially transfer the loading buffer unit 200, the test unit 300, and the unloading buffer unit 400. Configuration is possible.

Meanwhile, the third transfer tools 630 and 640 may be installed in pairs to transfer the test unit 300 and the unloading buffer unit 400 between the loading buffer unit 200 and the test unit 300, respectively. Can be.

In addition, the third transfer tools 630 and 640 are reloaded through the loading buffer unit 200, the test unit 300, and the unloading buffer unit 400, as shown in FIGS. 1 and 4A to 4F. It may be installed to cyclically move to the buffer unit 200.

In this case, the third transfer tool 630 and 640 directly lowers the elements 1 picked up by the picker units 631 and 641 in the test unit 300 to press the test socket 310 during the test time. Can be configured.

In addition, the third transfer tools 630 and 640 may be interfered when they cross each other. In order to prevent the interference, as shown in FIG.

In particular, the third transfer tool (630, 640) is a configuration for excluding the interference during the movement, the first guide portion (parallel to each other connecting the loading buffer 200 and the unloading buffer 400, respectively) 653) and may be guided and moved by the guide part 650 including the second guide part 654.

8A to 8C are views illustrating a process of transferring a device from a loading buffer portion to an unloading buffer portion in the device inspection apparatus of FIG. 1 having a modified third transfer tool, and FIG. 9 is a view illustrating the device inspection apparatus of FIG. 10A and 10B are views illustrating an operation process when the third transfer tool of FIG. 9 is positioned on the test unit.

Meanwhile, the third transfer tools 630 and 640 are installed to cyclically move back to the loading buffer unit 200 through the loading buffer unit 200, the test unit 300, and the unloading buffer unit 400 by various methods. Can be.

As another example, the third transfer tool 630 and 640 may include a transfer tool body 634 and 644 moving along the guide part 650, as shown in FIGS. 8A to 10B; Picker supports 632 and 642 rotatably hinged to the transfer tool bodies 634 and 644 and provided with a plurality of pickers 631 for picking up the element 1; And a tool rotating part driving part 633 for rotating the picker support parts 632 and 642 between a parallel position parallel to the upper surface of the test unit 300 and an inclined position forming a parallel position and an inclination.

The tool rotation driving unit 633 has one end (P1) is hinged to the transfer tool body (634, 644) and the other end (P2) is hinged to the picker support (632, 642) to adjust the length of the picker support It may be configured to include a cylinder portion for rotating the (632, 642) about the hinge axis (C1) of the transfer tool body (634, 644).

At least one of the transfer tool bodies 634 and 644 and the picker support portions 632 and 642 may be installed to move upward and downward. The transfer tool bodies 634 and 644 and the picker support portions 632 and At least one of the 642 may include a vertical driving part (not shown) for driving the vertical movement.

On the other hand, the device inspection apparatus according to the present invention is a test unit for the elements (1) picked up by the third transfer tool (630, 640) when the third transfer tool (630, 640) is located above the test unit 300 In order to maintain contact with the test socket 310 of the 300, the pressing unit 670 for pressing the picker support units 632 and 642 of the third transfer tool 300 may be additionally installed.

The pressing unit 670 is positioned above the test unit 300 so that the picker supporting units 632 and 642 of the third transfer tool 300 picking up the elements 1 are positioned above the test unit 300. When the picker support parts 632 and 642 are pressed downward, the elements 1 are maintained in contact with the test socket 310 of the test part 300.

As shown in FIGS. 9 to 10B, the pressing part 670 may include a pressing member 671 for pressing the picker supporting parts 632 and 642 and a driving part 673 for driving the pressing member 671 up and down. It may include.

The pressing member 671 may have any configuration as long as it can press the picker supporting portions 632 and 642, and the plurality of rollers may smoothly move the picker supporting portions 632 and 642 in the lateral direction (x direction). 672 may be installed.

On the other hand, the number of the third transfer tool (630, 640) is determined in consideration of the device transfer speed and convenience, as shown in Figure 8a to 10b, may be installed in a pair.

As described above, when the third transfer tools 630 and 640 are installed in pairs, as illustrated in FIG. 9, the pair of third transfer tools 630 and 640 may move the guide portion 650. Therefore, at least one may move in an inclined state to prevent the movement from interfering when moving cross each other.

That is, as shown in FIG. 9, any one of the pair of third transfer tools 630 and 640 passes through the pressing unit 670 or crosses the other third transfer tools 630 and 640. When moving by any one or all of the pair of the third transfer tool (630, 640) can be moved along the guide portion 650 while maintaining the inclined state.

The transfer of the device 1 by the third transfer tool 630, 640 having the configuration as described above operates as shown in Figs. 8A to 10B, and is substantially similar to that shown in Figs. 4A to 4F described above. Will not be explained in detail.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

100: loading unit 200: loading buffer unit
300: test unit 400: unloading buffer unit
500: unloading unit

Claims (1)

A loading unit in which one or more trays in which a plurality of elements are loaded are loaded;
A loading buffer unit configured to temporarily receive elements from a tray of the loading unit through a first transfer tool;
A test unit which receives the elements from the loading buffer unit and performs a test at room temperature;
An unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit;
An unloading unit configured to classify and load elements loaded in the unloading buffer unit according to a test result of the test unit through a second transfer tool;
And at least one third transfer tool for transferring the device between the loading unit, the test unit, and the unloading unit.

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