KR20080087459A - Semiconductor device tester, test system for semiconductor device having plural semiconductor device tester, and testing method for semiconductor device using the same - Google Patents

Abstract

A semiconductor tester, a semiconductor device test system including the same, and a semiconductor device test method using the same are provided to achieve unmanned automation by using a transfer unit and a pickup transfer unit. A supply and discharge unit(100) supplies a semiconductor device as a test target and discharges the semiconductor device of high quality. A test unit includes a plurality of test regions(210) having an insertion hole into which the semiconductor device is inserted. An inferior semiconductor device loading unit(300) loads the semiconductor device of low quality. A transfer unit(400) is positioned between the supply and discharge unit and the test unit to transfer the semiconductor device from the supply and discharge unit to the test unit.

Description

Semiconductor device tester, a semiconductor device test system having a plurality thereof, and a semiconductor device test method using the same {Semiconductor device tester, test system for semiconductor device having plural semiconductor device tester, and testing method for semiconductor device using the same}

1 is a perspective view of a semiconductor device tester of the present invention;

2 is a side view of a semiconductor device tester of the present invention;

3 is a perspective view of a test area of the semiconductor device tester of the present invention;

4 is a perspective view of a delivery unit of the semiconductor device tester of the present invention;

5 is an enlarged view of a portion A shown in FIG. 4 of a transfer unit of the semiconductor device tester of the present invention;

6 is a perspective view of a grip device for transferring a semiconductor device tester according to the present invention;

7 is a bottom perspective view of a grip device for transferring a semiconductor device tester according to the present invention;

8 is a plan view of a grip device of a transfer unit of a semiconductor device tester of the present invention;

9 is a side view of the grip device of the transfer unit of the semiconductor device tester of the present invention as viewed in the direction B of FIG. 8;

10 is a schematic diagram of an embodiment of a semiconductor device test system of the present invention;

11 is a schematic diagram according to another embodiment of a semiconductor device test system of the present invention;

12 is a flowchart of a semiconductor device test method of the present invention.

＊ Explanation of symbols for main part of drawing ＊

100: supply and discharge section 200: test section

210: test area 211: insertion hole

220: heater 230: windshield

300: bad loading unit 400: transfer unit

410: grip device 411: body

411-1: hinge hole 412: first gripper

413: grip 413-1: finger

414: spacing control unit 414-1: spacing control guider

414-2: Linear Driver 415: Second Gripper

420: feeder 421: X-axis feeder

421-1: First rotary arm 421-2: Second rotary arm

422: Z-axis feeder 422-1: Z-axis body

422-2: Z axis supporter 422-3: Z axis guider

423: Y-axis feeder 423-1: Y-axis body

423-2: Y-axis guider 423-3: Rack gear

500: transfer robot 510: transfer unit

511: transfer rail 520: pickup delivery unit

T: Semiconductor device tester S: Warehouse

The present invention relates to a semiconductor device tester, and more particularly, to a semiconductor device tester capable of unmanned automation and easy maintenance and repair of equipment.

In general, the manufacturing process of a semiconductor device is largely inspection of raw materials for checking wafer defects, and die bonding for attaching a semiconductor chip separated by cutting a wafer to a mounting plate of a lead frame. Process, Wire Bonding process that connects the chip pad provided on the semiconductor chip and the lead of lead frame with wire, Molding that wraps the outside with encapsulant to protect the internal circuit and other components of semiconductor chip (Molding) process, a trimming process for cutting the dam bar connecting the lead and the lead, a foaming process of bending the lead in a desired shape, and a process of inspecting the quality of the semiconductor device completed through the above process.

Herein, the process of inspecting the quality of the semiconductor device is a test circuit board of the semiconductor device in a test chamber in which a general personal computer (PC) environmental condition is formed immediately before the production of the semiconductor device is completed and the product is shipped. It is a mounting test that checks the quality of the plugged into the socket of the motherboard. Therefore, such a mounting test may be conducted in a heat test chamber having a heating function of up to about 80 ° C. to examine the heat resistance of the semiconductor device together.

Conventionally, a worker manually inserts a semiconductor device into a socket of a test circuit board for manual mounting test as described above, and takes it out of the socket after the mounting test. Therefore, it is necessary to secure a wide test chamber or a heating test chamber, and there is a problem that requires a large number of workers.

In addition, after the test is completed, the heating test chamber is waited for cooling to an appropriate low temperature for the safety of the operator, and thus the semiconductor device has to be taken out from the test circuit board. there was.

One object of the present invention for solving the above problems is to provide a semiconductor device tester capable of unattended automation of the semiconductor device mounting test process, and can minimize the space required for the semiconductor device mounting test.

In addition, another object of the present invention, regardless of the spacing of the semiconductor elements loaded on the supply and loading section and the socket spacing of the test section, two or more semiconductor devices can be taken out or inserted into the insertion port at the same time, the high-temperature mounting test To provide a semiconductor device tester that can be quickly performed.

In addition, another object of the present invention is to provide a semiconductor device tester, each component is provided in the form of an open type module can freely add and expand equipment, easy to maintain and repair the equipment.

The semiconductor device tester of the present invention for achieving the above object is a supplying and discharging unit for supplying the semiconductor device to be tested, discharged the semiconductor device determined as good after the test, the insertion hole into which the semiconductor device is inserted A test section including a plurality of test regions each of which is provided, a defective loading section on which semiconductor elements determined as defective by the test section are loaded, and located between the supply and discharge sections and the test section, wherein the supply and And a transfer unit which picks up the semiconductor device from the discharge unit and transfers the semiconductor element to the test unit.

The transfer unit includes a grip device for holding or separating the semiconductor device, and a transfer device for transferring the grip device from the supply and discharge unit to the test unit or from the test unit to the supply and discharge unit or the defective loading unit. can do.

The plurality of test areas may be provided in a stacked form in the Y-axis and Z-axis directions.

The plurality of test regions may further include heaters for heating the semiconductor devices inserted into the insertion holes to a predetermined temperature.

The plurality of test regions may further include one or more windshields provided on at least one side of the insertion hole and prevent the semiconductor device heated by the heater from being cooled by external wind.

The supply and discharge parts may include a plurality of trays arranged in a line for loading the semiconductor device.

The semiconductor device tester may be provided to deliver the tested semiconductor device to the tray where the semiconductor device is picked up.

The grip device has a hinge hole coupled to a hinge axis at a central portion thereof, the body being provided to be rotated about the hinge hole, and the semiconductor device mounted on the supply and loading portions to be mounted on the insertion hole. A first gripper and a second gripper which takes out the semiconductor element inserted into the insertion hole and loads the semiconductor element into the supplying and loading part or the defective loading part according to the positive part, wherein the first gripper and the second gripper It may be provided to be coupled to the body spaced apart by the same distance from the center of the hinge hole.

The first gripper and the second gripper may include a pair of grips, each of which has a pair of fingers holding both ends of the semiconductor device, so that the first gripper and the second gripper may be simultaneously held by a pair of semiconductor devices. have.

The first gripper and the second gripper may further include a gap adjusting part for adjusting a gap of the pair of grip parts.

The gap adjusting part may include a gap adjusting guider for guiding a horizontal movement of the pair of grip parts, and one or more linear drivers for horizontally moving any one of the pair of grip parts to adjust the gap of the pair of grip parts. have.

The semiconductor device test system of the present invention includes a delivery robot for supplying a semiconductor device to be tested and collecting a tested semiconductor device, and the semiconductor device tester provided in plural and arranged in a pair of rows on both sides of the delivery device. do.

The transfer robot may include a transfer unit that loads a semiconductor element and reciprocates along a transfer rail, and a pickup transfer unit that picks up a semiconductor element of the transfer unit and transfers the semiconductor element to the semiconductor device tester.

In the semiconductor device test system according to a preferred embodiment of the present invention, the pickup transfer unit may be provided in the transfer unit.

In the semiconductor device test method of the present invention, a) the step of supplying the semiconductor device under test to the supply and discharge unit, b) the transfer unit using the grip device to pick up the test target semiconductor device using the grip device after C) inserting the test target semiconductor device picked up by the grip device into an insertion hole of the test area, and d) for the semiconductor device inserted into the insertion hole. Starting the test.

The step c) may further include taking out the tested semiconductor device before inserting the semiconductor device picked up by the grip device when the tested semiconductor device is mounted in the insertion hole.

In the step c), the second gripper of the grip device grips the tested semiconductor element and is taken out of the insertion hole, and the body of the grip device rotates to position the first gripper in the space where the second gripper is located. And inserting the semiconductor element picked up by the first gripper of the grip device into the insertion hole.

In the semiconductor device test method, the transfer unit may further include the step of re-loading the determination of good quality out of the semiconductor device taken out, the loading and discharge unit, and separately loading the defective determination unit in the defective loading unit. .

The semiconductor device test method may further include the step of collecting, by the delivery device, the semiconductor device, which has been tested, from the supply and discharge parts and the defective loading part, separately from good and bad.

The step d) may further include heating the test target semiconductor inserted into the insertion hole to a predetermined temperature before the test unit starts the test.

In addition, the step c) may further include the step of adjusting the distance between the pair of grip portions of the first gripper or the second gripper before the grip device to take out or insert the semiconductor device.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Hereinafter, a semiconductor device tester according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 9.

The semiconductor device tester T according to the preferred embodiment of the present invention, as shown in Figs. 1 and 2, the supply and discharge unit 100, the test unit 200, the defective loading unit 300, and It includes a delivery unit 400.

The supply and discharge unit 100 is a place for supplying a test target semiconductor device to the transfer unit 400 and temporarily receiving a test-completed semiconductor device from the transfer unit 400 before discharge. The test unit 200 is a place where a mounting test of a semiconductor device is performed, and the defective loading unit 300 is a place where a semiconductor device determined as a defective product is loaded after the test is completed. The transfer unit 400 picks up the semiconductor device from the supply and discharge unit 100 and transfers the semiconductor element to the test unit 200 located on the opposite side.

Hereinafter, a description will be given of a semiconductor device tester for mounting and testing a memory module, which is a type of semiconductor device. In the present embodiment, the memory module will be described, but the type of semiconductor device is not limited thereto.

The memory module supplied for the mounting test is loaded in the supply and discharge unit 100 in the form of a tray. In the supply and discharge unit 100, as shown in FIGS. 1 and 2, a plurality of trays are arranged in a line. However, the trays of the supply and discharge portions 100 may be arranged in multiple rows as required.

A plurality of trays provided in the supply and discharge units 100 are stacked at regular intervals to receive a mounting test. To this end, a plurality of grooves may be formed in the tray of the supply and discharge unit 100 so that a plurality of memory modules may be stacked and loaded. On the other hand, in the trays of the plurality of supply and discharge sections 100, the memory module determined as good after the mounting test is loaded again.

The semiconductor device tester T gives an address to a tray loaded in the supply and discharge unit 100, and grasps a test completion state of memory modules in each tray according to the address information. In this case, the semiconductor device tester T may further include a memory unit (not shown) that stores an address and related information of each tray.

The supply and discharge unit 100 is located on the other side of the test unit 200, thereby providing a sufficient working space of the transfer robot for supplying and collecting the tray of the semiconductor device test system to be described later.

The test unit 200 applies an electrical signal to the memory module to perform a mounting test. As illustrated in FIGS. 1 to 3, the test unit 200 is located on the opposite side of the supply and discharge unit 100, and a plurality of test areas 210 are stacked in the Y-axis and Z-axis directions. It is provided in the form. Such a configuration enables the maximum test area 210 to be disposed in a narrow space, thereby enabling efficient use of the work space.

Each of the plurality of test regions 210 includes a pair of insertion holes 211, an electric circuit is configured, and a pair of memory modules mounted in the pair of insertion holes 211 by applying power. Perform the test. The pair of insertion openings 211 are provided side by side at regular intervals.

In a preferred embodiment of the present invention, the test region 210 is provided with a pair of insertion holes 211, but the number is not limited thereto. For example, two pairs of insertion holes 211 may be provided in one test area 210.

Each of the plurality of test regions 210 may further include a heater 220 and a windshield 230.

As shown in FIG. 3, the heater 220 is provided as a pair on an upper portion of the pair of insertion holes 211, and provides a pair of memory modules inserted into the pair of insertion holes 211. Heat to a temperature of about 80 ° C. That is, when the heater 220 is operated, the semiconductor device tester T of the present invention can perform a high temperature mounting test up to about 80 ° C.

The windbreak plate 230 is provided in the form of a plate surrounding the three sides of the insertion hole 211, to prevent the memory module from being cooled by the outside wind during the high temperature mounting test. However, the windbreak plate 230 is sufficient if it is provided to prevent the outside wind, the shape and number is not necessarily limited thereto.

The defective loading unit 300 is a place where the memory module determined as defective after the mounting test is loaded. The defective loading unit 300, as shown in Figure 1, is provided in the form of a tray empty in the side in the supply and discharge unit 120. Therefore, after all the mounting tests are completed, the defective memory module loaded on the tray of the defective loading unit 300 may be separately processed.

In the preferred embodiment of the present invention, the defective stacking unit 300 is provided in the form of one empty tray, but is not limited thereto, and may be a structure capable of collecting a defective memory module.

The transfer unit 400 reciprocates the supply and discharge unit 100, the test unit 200, and the defective loading unit 300, and transfers a semiconductor device, that is, a memory module. As shown in FIG. 4, the transfer unit 400 includes a grip device 410 and a transfer device 420.

The grip device 410 is installed in the transfer device 420, and simultaneously grips or separates a pair of memory modules and inserts them into the pair of insertion holes 211, or inserts them into the pair of insertion holes 211. Take out a pair of memory modules. As shown in FIGS. 4 to 9, the grip device 410 includes a body 411, a first gripper 412, and a second gripper 415.

The body 411 is installed in the X-axis transfer unit 421 of the transfer device 420 to be described later, the hinge hole 411-1 is provided at the center thereof. As shown in FIG. 6, the body 411 is fixedly coupled to the first gripper 412 and the second gripper 415 at one end thereof. The body 411 rotates around the hinge hole 411-1 so that the first gripper 412 and the second gripper 415 may be alternately corresponded to the same position.

The first gripper 412 grips both ends of a pair of memory modules loaded in the supply and discharge units 100 and inserts the pair of memory modules into the pair of insertion holes 211, respectively. As illustrated in FIGS. 6 to 8, the first gripper 412 includes a pair of grip parts 413 and a gap adjusting part 414.

The pair of grip parts 413 are provided to simultaneously hold or separate a pair of memory modules. Accordingly, the pair of grip parts 413 are provided to be horizontally moved in the left and right directions, respectively, and include a pair of fingers 413-1 that hold or separate both ends of the memory module, respectively.

The gap adjusting unit 414 is provided with a linear driver to be described later to transfer any one of the pair of grips 413 in a direction perpendicular to the direction in which the pair of fingers 413-1 are horizontally moved. The gap between the pair of grip portions 413 is adjusted. This means that the first gripper 412 can handle a pair of memory modules at the same time even if the distance between the memory modules loaded in the supply and discharge portions 100 and the pair of insertion holes 211 are different. To make it work.

For example, when the interval between the memory modules loaded in the supply and discharge unit 100 is narrower than the interval between the pair of insertion openings 211, the first gripper 412 is the supply and discharge unit ( Holds a pair of memory modules from 100). In addition, after the gap between the pair of grip parts 413 is widened by using the gap adjusting part 414, a pair of gripped memory modules are simultaneously inserted into the pair of insertion holes 211.

In order to perform the function as described above, the gap adjusting unit 414 includes a gap adjusting guider 414-1 and a linear driver 414-2, as shown in FIG. 8.

The gap adjusting guider 414-1 guides the transfer of any one of the pair of grip parts 413. The linear driver 414-2 adjusts the distance between the pair of grip portions 413 by transferring any one of the pair of grip portions 413. The linear driver 414-2 is preferably provided with a linear stepping motor for fine adjustment. However, the linear actuator 414-2 is not necessarily limited thereto, and may be provided in the form of a cylinder or piston using hydraulic pressure or pneumatic pressure.

The second gripper 415 grips both ends of the pair of memory modules having completed the mounting test and is taken out from the pair of insertion holes 211. In addition, the pair of taken out memory modules are separately loaded into the supply and discharge unit 100 or the defective loading unit 300 according to the determination result of the mounting test.

The structure of the second gripper 415 that performs this role is similar to that of the first gripper 412 described above. That is, the second gripper 415 also includes a pair of grip parts 413 and a gap adjusting part 414 provided with a pair of fingers 413-1, respectively, to simultaneously take out a pair of memory modules. Or it is provided to be loaded.

In a preferred embodiment of the present invention, the first gripper 412 and the second gripper 415 is provided separately, such that the gripper to be inserted and the gripper to be taken out based on the pair of insertion holes 211 are provided. Are separated.

Therefore, when the grip device 410 is transferred to the test unit 200 by the transfer device 420, the pair of memory modules having a mounting test completed using the second gripper 415 is completed. After simultaneously taking out from the insertion hole 211, a new pair of memory modules to be subjected to the mounting test using the first gripper 412 in succession can be inserted into the pair of insertion holes 211. Therefore, the grip device 410 does not need to be transported separately for insertion after taking out.

In addition, as described above, the grip device 410 is provided so that the first gripper 412 and the second gripper 415 correspond to the same position only by the rotation of the body 411. Therefore, the grip device 410 may perform a continuous operation of taking out and inserting it within a short time.

The transfer device 420 transfers the grip device 410 from the supply and discharge unit 100 to the test unit 200 or from the test unit 200 to the supply and discharge unit 100 or the Transfer to the defective loading unit 300. As illustrated in FIG. 4, the transfer apparatus 420 includes an X-axis transfer unit 421, a Z-axis transfer unit 422, and a Y-axis transfer unit 423.

The X-axis transfer unit 421 transfers the grip device in the X-axis direction. As shown in FIG. 5, the X-axis transfer unit 421 includes a first rotary arm 421-1, a second rotary arm 421-2, and two X-axis transfer motors (not shown). do.

One end of the first rotary arm 421-1 is connected to the Z-axis feeder 422 by a hinge shaft. The first rotary arm 421-1 may be transferred in the X-axis direction through a rotational movement about a hinge axis based on the Z-axis transfer unit 422.

One end of the second rotation arm 421-2 is connected to the first rotation arm 421-1 by a hinge shaft, and the other end of the second rotation arm 421-2 is hinged with the hinge hole 411-1 of the grip device 410. Connected by an axis. The second rotary arm 421-2 may be transferred in the X-axis direction based on the first rotary arm 421-1 through a rotational movement about a hinge axis.

The two X-axis feed motors (not shown) are the Z-axis feeder 422 and the first rotary arm 421-1, and the first rotary arm 421-1 and the second rotary arm 421. -2) Rotate the hinge shaft connecting each. Accordingly, the first rotary arm 421-1 is in the X axis direction with respect to the Z axis transfer part 422, and the second rotary arm 421-2 is in the X axis direction with respect to the first rotary arm 421-1. It can be transported.

The Z-axis transfer unit 422 is connected to the X-axis transfer unit 421 and transfers the X-axis transfer unit 421 in the Z-axis direction. As shown in FIG. 4, the Z-axis feeder 422 includes a Z-axis body 422-1, a Z-axis supporter 422-2, a Z-axis guider 422-3, and a belt (not shown). , Main and driven pulleys (not shown), and Z-axis motors (not shown).

The Z-axis body 422-1 is connected to the X-axis transfer unit 421 by a hinge shaft. The grip unit 410 connected to the X-axis transfer unit 421 is moved up and down along the Z-axis support unit 422-2 while the Z-axis body 422-1 is connected to the X-axis transfer unit 421. Allow to get on and off.

As illustrated in FIG. 4, the Z-axis supporter 422-2 is formed in a columnar structure in which the Z-axis body 422-1 can move up and down, thereby When lifting, the load is supported.

The Z-axis guider 422-3 is provided on the Z-axis supporter 422-2 to guide the Z-axis movement of the Z-axis body 422-1. In a preferred embodiment of the present invention, the Z-axis guider 422-3 is provided with grooves and protrusions, but a linear guide system generally used is used, but is not limited thereto.

The belt (not shown) is fixedly coupled to the Z-axis body 422-1 so that the Z-axis body 422-1 can be elevated together according to the operation of the belt. The main and driven pulleys (not shown) are provided to engage the inner circumferential surface of the belt and to operate the belt according to its rotation. The Z-axis motor (not shown) provides power to elevate the Z-axis body 422-1 by driving the coarse pulley to operate the belt.

The Y-axis transfer unit 423 is connected to the Z-axis transfer unit 422 and is fixedly installed under the semiconductor device tester to horizontally transfer the Z-axis transfer unit 422 in the Y-axis direction. As shown in FIG. 4, the Y-axis feeder 423 includes a Y-axis body 423-1, a Y-axis guider 423-2, a rack gear 423-3, and a pinion gear (not shown). , And a Y-axis motor (not shown).

The Y-axis body 423-1 is fixedly coupled to the Z-axis supporter 422-2, and loads the grip device 410, the X-axis feeder 421, and the Z-axis feeder 422. I support it. In addition, the Y-axis body 423-1 is provided to be horizontally transported in the Y-axis direction along the Y-axis guider 423-2.

As shown in FIG. 4, the Y-axis guider 423-2 is provided under the semiconductor device tester and guides the Y-axis direction transfer of the Y-axis body 423-1. In a preferred embodiment of the present invention, the Y-axis guider (423-2), such as the Z-axis guider (422-3), a linear guide system is generally used that is provided with grooves and protrusions, but is not limited thereto. It doesn't happen.

The rack gear 423-3 is provided under the semiconductor device tester in parallel with the Y-axis guider 423-2. The pinion gear (not shown) meshes with the rack gear 423-3, and converts the rotational motion into a linear motion of the Y-axis body 423-1. The Y-axis motor (not shown) is fixedly coupled to the Y-axis body 423-1, and provides power to drive the pinion gear to transfer the Y-axis body 423-1 in the Y-axis direction.

As described above, in the preferred embodiment of the present invention, the X-axis feeder 421 is a rotary arm, the Z-axis feeder 422 is a belt and pulley, the Y-axis feeder 423 is a rack gear and It is implemented as a pinion gear, but is not necessarily limited thereto.

For example, the Z-axis feeder 422 may be implemented as a rack gear and a pinion gear, and the X-axis feeder 421 may be implemented as a hydraulic cylinder and a piston. That is, the X-axis transfer unit 421, the Z-axis transfer unit 422, and the Y-axis transfer unit 423 may move the grip device 410 in the X-axis, Z-axis, and Y-axis directions, respectively. Could be implemented in any way.

In the semiconductor device tester of the present invention, as shown in FIGS. 1 and 2, all components are open independently. That is, all the components are not provided inside the sealed case and are exposed to the outside. Therefore, the semiconductor device test system of the present invention can be easily accessed by external workers to each component, it is advantageous in the maintenance and repair of equipment.

Hereinafter, a semiconductor device test system according to a preferred embodiment of the present invention will be described in detail. Semiconductor device test system according to a preferred embodiment of the present invention, as shown in Figure 10, includes a transfer robot 500, and the semiconductor device tester (T).

The transfer robot 500 supplies the semiconductor device under test to the semiconductor device tester T, and collects the semiconductor device on which the test is completed. As shown in FIG. 10, the delivery robot 500 includes a transfer unit 510 and a pickup transfer unit 520.

The transfer unit 510 transports the semiconductor device under test from the supply warehouse S to the vicinity of the supply and discharge unit 100 of the semiconductor device tester T. In addition, the transfer unit 510 classifies and collects the semiconductor elements which are determined as good or defective after testing.

To this end, the transfer unit 510 is configured in the form of a kind of truck, and is preferably provided as a rail guided vehicle (RGV) which is transferred along a transfer rail 511 installed on the floor of the workplace.

As illustrated in FIG. 1, the transfer rail 511 is disposed between the pair of semiconductor device testers T. As illustrated in FIG. In this case, since the transfer unit 510 guided by the transfer rail 511 is accessible to both the supply and discharge portions 100 of the semiconductor device tester T located at both sides, space can be used more efficiently. have.

The pickup transfer unit 520 transfers a test target semiconductor device from the transfer unit 510 to the supply and discharge unit 100, or loads the tested semiconductor device into the supply and discharge unit 100 or the defective unit. Transfer from the unit 300 to the transfer unit 510.

The pickup transfer unit 520 is preferably provided in the transfer unit 510. When the semiconductor device test system includes a plurality of semiconductor device testers T positioned at both sides of the transfer unit rail 511, the pickup transfer unit 520 may be disposed at both sides of the transfer unit 510. The semiconductor device is supplied to the plurality of supply and discharge units 100.

In a preferred embodiment of the present invention, the pick-up transfer unit 520 is provided in the transfer unit 510 one by one, but the number is not necessarily limited to this. For example, the pickup transfer unit 520 may be provided in plural at regular intervals on the front surface of the semiconductor device tester (T).

As described above, the semiconductor device automatic test system according to the preferred embodiment of the present invention has a modular form so that the semiconductor device tester T can independently test the semiconductor device. Therefore, by additionally installing the semiconductor device tester T which is modularized, it is possible to easily expand the equipment.

One example of the semiconductor device test system of the present invention in this manner is as shown in FIG. In this case, the plurality of semiconductor device testers T are provided with two rows, and the transfer rail 511 is provided between the semiconductor device testers T. Therefore, the transfer unit 510 reciprocating through the transfer rail 511 supplies the test target semiconductor device to the plurality of semiconductor device testers T.

An example of the additional equipment of the semiconductor device test system of the present invention is as shown in FIG. In this case, the bandoteche test system as described above is provided with three rows. As described above, since the semiconductor device test system of the present invention is composed of the modular semiconductor device tester T, the expansion and reduction of facilities are free.

Hereinafter, the semiconductor device test method of the present invention, which is an operation of the semiconductor device tester T according to the preferred embodiment of the present invention, will be described.

First, the transfer robot 500 supplies the tray on which the semiconductor device to be tested is loaded to the supply and discharge unit 100. (S100) Specifically, the transfer unit 510 of the transfer robot 500 supplies the supply warehouse (S). When the tray loaded with the semiconductor device under test is transferred near the supply and discharge unit 100 of the semiconductor device tester, the pickup transfer unit 520 picks up the tray loaded with the semiconductor device under test and supplies the supplied and Supply it to the discharge unit 100.

Next, the transfer unit 400 picks up the test target semiconductor device from the tray of the supply and discharge unit 100 using the first gripper 412 of the grip device 410 to test the test unit 200 on the opposite side. The semiconductor device is transferred to the region 210 (s150). The semiconductor device, which is picked up by the first gripper 412, is inserted into the insertion hole 211 of the test region 210 (s400).

In this case, when the tested semiconductor device is inserted into the insertion hole 211, the transfer unit 400 tests the second gripper 415 of the grip device 410 before inserting the picked-up semiconductor device. (S250) Before the extraction, if the distance between the pair of grip portions 413 of the second gripper 415 is different from the distance between the pair of insertion holes 211, the gap adjusting portion ( 414 adjusts the distance between the pair of grip portion 413 (s200).

 Then, the body 411 of the grip device 410 is rotated to position the first gripper 412 in the space where the second gripper 415 is located (s300) Next, as described above The semiconductor device picked up by the one gripper 412 is inserted. (S400) Before the insertion, the interval between the pair of grip portions 413 of the first gripper 412 is equal to the interval between the pair of insertion holes 211. If different, the spacing adjuster 414 adjusts the spacing between the pair of grips 413 (s350).

In addition, the test unit 200 starts a test on the semiconductor device inserted into the insertion hole 211 (s500). In this case, when the semiconductor device test system performs a high temperature test, the heater 220 before the test. Is operated to heat the inserted semiconductor device (s450).

Next, the transfer unit 400 receives test result data of the tested semiconductor device taken out by the second gripper 415. (s550) First, when the taken-out test completed semiconductor device is a good product, the transfer unit In operation 400, the taken-out semiconductor device is loaded on the tray of the supply and discharge unit 100. (S600) In contrast, when the tested semiconductor device taken out is a defective product, the transfer unit 400 fails the taken-out semiconductor device. It is loaded in the tray of the stacking unit 300. (s650)

Thereafter, the transfer robot 500 separates the tray on which the semiconductor device, which has been tested, is loaded, from the supply and discharge unit 100 and the defective loading unit 300 by separating good and bad goods.

In the semiconductor device test method of the present invention, the transfer robot 500 may supply the test target semiconductor device with a predetermined amount or more to the supply and discharge unit 100 at a time. In addition, the transfer robot 500 may be provided to collect a plurality of semiconductor devices at a time, when a predetermined amount of the semiconductor device is completed.

As described above, according to the semiconductor device test system of the present invention, in the test of the semiconductor device, the transfer unit and the pickup transfer unit supply the test target semiconductor device, collect the tested semiconductor device, and the transfer unit the semiconductor device in the test unit. Unattended automation is possible by inserting and taking out.

In addition, the gap adjusting part is provided to adjust the gap of the pair of grip parts, so that two or more semiconductor devices can be simultaneously taken out or inserted from the insertion hole regardless of the distance between the semiconductor elements loaded in the supply and discharge parts and the insertion hole spacing between the test parts. Can be.

In addition, the test circuit board is provided in a stacked form in the Y-axis direction and Z-axis direction to maximize the use efficiency of the working space, it is equipped with a heater can be quickly performed high-temperature mounting test.

In addition, each component of the semiconductor device test system is provided as an open module so that the equipment can be added and expanded freely, and the equipment can be easily maintained and repaired.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims. will be.

Claims (21)

A semiconductor device tester for inspecting the quality of a semiconductor device, A supply and discharge unit to which a semiconductor device to be tested is supplied and to which the semiconductor device determined as good after the test is discharged; A test unit including a plurality of test areas each having an insertion hole into which the semiconductor device is inserted; A defective loading portion into which a semiconductor element determined as defective by the test portion is loaded; And A transfer unit positioned between the supply and discharge units and the test unit, and configured to pick up the semiconductor device from the supply and discharge units and transfer the semiconductor element to the test unit; Semiconductor device tester comprising a. The method of claim 1, The delivery unit, A grip device for holding or separating the semiconductor device; And A transfer device for transferring the grip device from the supply and discharge unit to the test unit or from the test unit to the supply and discharge unit or the defective loading unit; The semiconductor device tester comprising a. The method of claim 1, The plurality of test areas, The semiconductor device tester, characterized in that it is provided in a stacked form in the Y-axis and Z-axis direction. The method of claim 1, The plurality of test areas, A heater for heating the semiconductor element inserted into the insertion hole to a predetermined temperature; Each of the semiconductor device tester further comprises a. The method of claim 4, wherein The plurality of test areas, At least one windbreak plate provided on at least one side of the insertion hole and preventing the semiconductor device heated by the heater from being cooled by the outside air; The semiconductor device tester further comprises. The method of claim 1, The supply and discharge unit, A plurality of trays arranged in a row for loading the semiconductor devices; The semiconductor device tester comprising a. The method of claim 6, And the transfer unit transfers the tested semiconductor device to a tray where the semiconductor device is picked up. The method of claim 2, The grip device, A hinge hole formed at a center thereof and coupled to the hinge axis, the body being provided to be rotated about the hinge hole; A first gripper configured to grip the semiconductor elements loaded on the supply and loading portions and to mount them to the insertion holes, respectively; And A second gripper which takes out the semiconductor element inserted into the insertion hole and loads the semiconductor element into the supplying and stacking portion or the defective loading portion according to its portions; Including, the first gripper and the second gripper, The semiconductor device tester, characterized in that coupled to the body spaced apart by the same distance from the center of the hinge hole. The method of claim 8, The first gripper and the second gripper, A pair of grip portions each provided with a pair of fingers holding both ends of the semiconductor device; Including each, The semiconductor device tester, characterized in that it can hold a pair of semiconductor devices at the same time. The method of claim 9, The first gripper and the second gripper, A gap adjusting part for adjusting a gap of the pair of grip parts; Each of the semiconductor device tester further comprises a. The method of claim 10, The gap adjusting unit, A spacing guider for guiding a horizontal movement of the pair of grips; And One or more linear drivers for horizontally moving any one of the pair of grip portions to adjust the spacing of the pair of grip portions; The semiconductor device tester comprising a. In the semiconductor device test system for inspecting the quality of the semiconductor device, A delivery robot for supplying a semiconductor device to be tested and collecting the tested semiconductor device; And The semiconductor device tester according to any one of claims 1 to 11, which is provided in plural and arranged in a pair of rows on both sides of the delivery device; Semiconductor device test system comprising a. The method of claim 12, The delivery robot, A transfer unit which loads the semiconductor element and reciprocates along the transfer rail; And A pickup transfer unit which picks up a semiconductor element of the transfer unit and transfers the semiconductor element to the semiconductor element tester; The semiconductor device test system comprising a. The method of claim 13, The pickup delivery unit, The semiconductor device test system, characterized in that provided in the transfer unit. In the semiconductor device test method for inspecting the quality of the semiconductor device, a) supplying, by the delivery device, the semiconductor element to be tested to the supply and discharge portions; b) a transfer unit picking up the test target semiconductor device of the supply and discharge unit using a grip device and transferring the test device to a test region of a test unit located on the opposite side; c) inserting the test target semiconductor device picked up by the grip device into an insertion hole of the test area; And d) starting a test of a semiconductor device inserted into the insertion hole by the test unit; Semiconductor device test method comprising a. The method of claim 15, C), If the tested semiconductor device is mounted in the insertion hole, taking out the tested semiconductor device before inserting the semiconductor device picked up by the grip device; The semiconductor device test method further comprising. The method of claim 16, C), A second gripper of the grip device grips the tested semiconductor device and is taken out of the insertion hole; Rotating the body of the grip device to position the first gripper in a space where the second gripper is located; And Inserting the semiconductor element picked up by the first gripper of the grip device into the insertion hole; The semiconductor device test method, characterized in that consisting of. The method of claim 16, The transfer unit reloading the ones determined to be good among the taken out semiconductor elements into the supplying and discharging unit, and separately loading the ones determined as defective to the defective loading unit; The semiconductor device test method further comprising. The method of claim 18, Collecting, by the delivery device, the semiconductor device having been tested separately from the supply and discharge parts and the defective loading part by separating good and bad goods; The semiconductor device test method further comprising. The method of claim 15, Step d), Before the test unit starts a test, heating a test target semiconductor inserted into the insertion hole by a heater of the test unit to a predetermined temperature; The semiconductor device test method further comprising. The method of claim 17, C), Adjusting, by the gap adjusting unit, the gap between the pair of grip portions of the first gripper or the second gripper before the grip device pulls out or inserts the semiconductor element; The semiconductor device test method further comprising.

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