KR100402311B1 - System for testing Semi-conductor and method for controling the same - Google Patents

Abstract

The present invention relates to a semiconductor device test system and a control method thereof capable of improving the efficiency of a test operation of a semiconductor device by dualizing and separating the components of the handler. According to the present invention, the presence or absence of abnormality of a semiconductor device may be tested. A test tray having a plurality of testers for processing, a plurality of test heads electrically connected to each of the testers, and a test socket for mounting semiconductor elements for testing, and a test tray having semiconductor elements to be coupled and tested with each of the test heads. The plurality of handler test sites arranged in a row to be sequentially transferred and mounted in a test socket of the test head to perform a test under a predetermined temperature condition to form a test line; After loading the trays containing the semiconductor devices to be tested, the semiconductor devices of the trays are remounted in the test trays and transported to the test sites, and the tested semiconductor devices are transferred from the test trays transferred from the test sites. A handler loading / unloading unit for performing an unloading operation for classifying the classes according to the test results and mounting them in a predetermined tray is configured separately from the test sites and installed separately at both ends of the test line; Between the test line and the loading / unloading unit, a tray transfer device for transferring the test trays of the loading / unloading unit to each test site of the test line and the test trays of the test sites to the loading / unloading unit is installed. The semiconductor device test system thus constructed is provided.

Description

System for testing Semi-conductor and method for controling the same

The present invention relates to a test system for testing a semiconductor device and the like and a control method of the test system, and in particular, a semiconductor device test system capable of improving the efficiency of the test operation of the semiconductor device by dualizing and separating the components of the handler, and It relates to a control method thereof.

In general, a module RAM produced in a production line or a module RAM which is an independent circuit by soldering and fixing these semiconductor elements on a single printed circuit board (PCB) is mounted on electronic products such as computers. Since it performs a core function, it must be precisely tested to determine whether it is good or bad before shipping.

As is well known, the handler is a device for automatically testing such a semiconductor device or a module through a predetermined process, and is electrically connected to a separate tester (TTester) that performs a substantial test of the semiconductor device. You will configure a test system to perform the test.

That is, as shown in FIG. 1, a plurality of test heads T / H having test sockets (not shown) to which semiconductor devices are mounted are connected to a tester T that performs test processing of semiconductor devices. Each test head T / H is coupled to handlers H / D to form a test system.

2 illustrates an example of a handler of the test system as described above. When the user loads the trays in which the semiconductor devices to be tested are loaded into the loading unit 10 and then operates the handler, the first picker linearly moves on the XY axis. The robot 31 grips the semiconductor elements of the loading unit 10 and temporarily mounts them on the buffer unit 40. Then, the second picker robot 32 grips the semiconductor elements of the buffer unit 40 to exchange the unit. Transfer it to (50) and refit it to the test tray (not shown).

The test tray in which the semiconductor devices to be tested are remounted is transferred to the test site 70 located behind the handler by a separate transfer means (not shown), and thus the plurality of sealed chambers are formed in a high temperature or low temperature environment. The test is performed in a test socket (not shown) of a test site under a predetermined temperature condition.

Then, the tested test tray is transferred to the exchange unit 50 again, and the tested semiconductor elements are temporarily mounted on the buffer unit 40 by the second picker robot 32, and then the first picker robot ( 31 is classified and mounted on a predetermined tray of the unloading unit 20 according to the test result.

However, in the conventional handler as described above, in testing a lot of semiconductor devices, a transfer and mounting operation of the semiconductor device between the loading unit 10, the unloading unit 20, and the exchange unit 30 is performed. Is completed in a very short time, while the test tray is transported from the test site 70 and the test time is relatively long, so that the test is inefficient. As semiconductor devices with larger capacities required are developed, they have become more intensified.

In addition, the conventional semiconductor device test system has a problem that requires a large number of workers because the operator has to perform the operation of loading and separating the tray for each handler.

Accordingly, the present invention has been made in order to solve the above problems, and after separating and configuring the parts to be loaded and unloaded of the handler and the part to be tested, by dividing these components in an appropriate number It is an object of the present invention to provide a semiconductor device test system and a control method thereof, by which the test work can be efficiently performed by properly placing the test line.

1 is a block diagram showing a conventional semiconductor device test system

2 is a configuration diagram schematically showing a configuration of an example of a general handler;

Figure 3 is a plan view showing a semiconductor device test system according to the present invention

4 is a front configuration view of the semiconductor device test system of FIG. 3 viewed from the front.

5 is a flowchart illustrating a control method of the semiconductor device test system of FIG. 3.

* Description of reference numerals in the main parts of the drawings *

50-test tray 100-first loading / unloading unit

200-2nd loading / unloading unit 300-Tray feeder

T-Tester T / H-Test Head

T / S-Test Site

According to an aspect of the present invention to achieve the above object, a plurality of testers for testing and processing the presence or absence of a semiconductor device, and a test socket electrically connected to each of the testers and the semiconductor device is mounted for the test A plurality of test heads and a plurality of test trays, each of which is coupled to each of the test heads and equipped with semiconductor devices to be tested, are sequentially transferred and mounted in a test socket of the test head to perform a test under a predetermined temperature condition. The handler test sites are arranged in a line to form a test line; After loading the trays containing the semiconductor devices to be tested, the semiconductor devices of the trays are remounted in the test trays and transported to the test sites, and the tested semiconductor devices are transferred from the test trays transferred from the test sites. A handler loading / unloading unit for performing an unloading operation for classifying the classes according to the test results and mounting them in a predetermined tray is configured separately from the test sites and installed separately at both ends of the test line; Between the test line and the loading / unloading unit, a tray transfer device for transferring the test trays of the loading / unloading unit to each test site of the test line and the test trays of the test sites to the loading / unloading unit is installed. The semiconductor device test system thus constructed is provided.

In addition, according to another aspect of the invention, the step of loading the tray containing the semiconductor elements to be tested in the first and second loading / unloading unit, and mounting the semiconductor elements of these trays to the test trays; Sequentially feeding and supplying test trays of the first loading / unloading unit to respective test sites of a test line using a tray transfer means; Performing testing of the semiconductor elements of the test tray at each test site, and sequentially transferring the tested test trays to the first loading / unloading unit in the order of completion of the test; In the process of transferring the tested test trays from the test site to the first loading / unloading unit, the test trays of the second loading / unloading unit are transferred to the respective test sites in the order in which the test trays are transferred. And carrying out the test by sequentially feeding the feed, and then the above steps are continuously and repeatedly performed, and supplying a test tray to the test site alternately in the first loading / unloading unit and the second loading / unloading unit. Provided is a control method of a semiconductor device test system adapted to perform a test of a semiconductor device.

Hereinafter, an embodiment of a semiconductor device test system and a control method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 illustrate the configuration of a semiconductor device test system according to the present invention. In the semiconductor device test system of the present invention, a plurality of testers (T; testers) for substantially performing test and processing of semiconductor devices are installed in a line. Each tester T is electrically connected to two test heads T / H having test sockets (not shown) in which semiconductor elements are mounted.

Each test head T / H is mounted on a test socket (not shown) of the test head T / H while sequentially transferring the test trays 50 on which the semiconductor devices to be tested are mounted, to a predetermined temperature. The test site (T / S) is connected to perform the test under the conditions.

The tester T, the test head T / H, and the test site T / S are arranged in a line to form a test line.

Then, at both ends of the test line, loading the tray containing the semiconductor devices to be tested, and then loading the semiconductor devices of these trays in the test tray 50 to transfer to each of the test site (T / S) And first and second unloading operations for classifying the tested semiconductor devices from the test trays 50 transferred from the respective test sites T / S into grades according to test results and mounting them in predetermined trays. Loading unloading unit (100, 200) is installed as a separate from the test site (T / S).

In addition, between the test line and the first and second loading and unloading units 100 and 200, the test trays of the first and second loading and unloading units 100 and 200 are each test sites (T / S) of the test line. As a result, a tray feeder 300 for transferring the test trays of the respective test sites T / S to the first and second loading unloading units 100 and 200 is installed.

The first and second loading and unloading units 100 and 200 are individual equipments to perform similar configurations and roles as the front parts of the handlers described in the prior art, and are loaded with a plurality of trays in which semiconductor devices to be tested are stored. The unit 110 and 210, the unloading units 120 and 220 for classifying the tested semiconductor devices according to a test result and mounting the same on a tray, and the semiconductor devices to be tested by the loading units 110 and 210 are transferred and tested. An exchanger 130 (230; 230 exchanger) for performing the operation of remounting the tray 50 and separating the tested semiconductor devices from the test tray transferred from the test site (T / S); Picker robots 140 and 240 which hold and transfer the semiconductor devices to the unloading parts 120 and 220 and the exchange parts 130 and 230 are provided.

In addition, appropriate components may be additionally provided in each of the first and second loading and unloading units 100 and 200 in order to efficiently load the semiconductor devices to be tested and unload the tested semiconductor devices. Of course.

On the other hand, the test site (T / S) can also be configured similar to the test site (T / S) of the handler described in the prior art, the test site (T / S) is a semiconductor while moving the test tray step by step A preheat chamber (not shown) configured to heat and cool the devices to a predetermined temperature, and the semiconductor devices of the test tray coupled to the test socket of the test head and transferred from the preheat chamber under a predetermined temperature condition (not shown) And a test chamber (not shown) for performing a test and returning the tested semiconductor devices to an initial room temperature or removing frost while moving a test tray transferred from the test chamber by one step. It consists of a defrosting chamber (not shown) to be performed.

In addition, the tray conveying apparatus 300 is configured in the form of a hoist to transfer the trays in a straight reciprocating motion at the top of the first and second loading unloading units 100 and 200 and the test line.

To this end, the tray conveying apparatus 300 includes a guide rail 310 extending from the top of each of the first and second loading unloading units 100 and 200 and the entire test line, and the guide rail 310. It is configured to be movable along the holder portion 320 for holding and transporting the test tray, and a driving means for moving the holder (not shown).

And, a control unit (not shown) for controlling the operation of each of the first and second loading unloading units (100, 200) and a control unit for controlling the operation of each tester (T) and test site (T / S) of the test line (Not shown) are connected to each other via a wired or wireless communication network, and each of them is organically controlled. Each component is configured independently, but a series of organic test operations are performed so that each component can operate without time delay. Thus, the test can be made efficiently.

On the other hand, the number of test sites (T / S) installed in the semiconductor device test system of the present invention is the loading / unloading operation time in the loading / unloading unit (100, 200) and the test performed for each test site unit It should be installed in an appropriate number taking into account time.

If the number of installed test sites is too small, the first and second loading and unloading units 100 and 200 do not have time to perform work, and thus have inefficiency as a conventional problem. This is because, in too many cases, the first and second loading and unloading units 100 and 200 may not immediately process the test trays, causing congestion.

Hereinafter, a control method of the semiconductor device test system configured as described above will be described.

As shown in FIG. 5, the process of testing a semiconductor device in the semiconductor device test system of the present invention includes loading trays in which the semiconductor devices to be tested are stored in the first and second loading / unloading units, Remounting the devices on the test trays (S1); A step (S2) of sequentially feeding and feeding the test trays of the first loading / unloading unit to respective test sites of the test line using a tray transfer means; Performing a test of the semiconductor devices of the test tray at each test site, and then transferring the tested test trays to the first loading / unloading unit sequentially in the test completed order (S3); During the step of transferring the test trays tested from the test site to the first loading / unloading unit, the test trays of the second loading / unloading unit are sequentially assigned to the respective test sites according to the order in which the test trays are transferred. It is made of a step (S4) to perform a test by feeding the feed to, and then these steps (S1, S2, S3, S4) are carried out continuously and repeatedly in the first loading / unloading unit and the second loading / unloading unit In turn, a test tray is supplied to a test site to test a semiconductor device.

In detail, each loading unit of the first and second loading and unloading units 100 and 200 may be loaded in trays containing the semiconductor devices to be tested by the operator in a first step S1. When the stacks are loaded on the stacks 110 and 210, the picker robots 140 and 240 grip and transfer the semiconductor devices from the stacked trays and remount them to the test trays in the exchange units 130 and 230.

Subsequently, in the second step S2, the holder part 320 of the tray feeder 300 grips the test tray located at the exchange part 130 of the first loading unloading unit 100, and then guide rails 310. The test trays are sequentially supplied to each test site (T / S) while moving along.

In the third step S3, at each test site T / S, the test trays are sequentially moved to the preheating chamber, the test chamber and the defrosting chamber, and the test is carried out under a predetermined temperature condition, and then each test site ( The test trays of T / S are transferred to the first loading unloading unit 100 in the order of completion of the test.

The transfer operation of the tested test tray is performed by the tray transfer device 300.

Then, in the fourth step S4, the test trays of the second loading unloading unit 200 are sequentially transferred to each test site T / S to perform a test. In this case, the second loading unloading unit is performed. The test trays of 200 are transferred in the order in which the test trays tested at the test site T / S are transferred.

The third step S3 and the fourth step S4 are performed almost simultaneously without time difference.

That is, while the test trays transferred from the first loading unloading unit 100 are performing tests at each test site T / S, the test process of the test tray is completed at the first test site T / S. When the transfer to the first loading unloading unit 100, the first test site is notified by communication to the second loading unloading unit 200 that the test is completed, accordingly the second loading unloading unit 200 The test tray is transferred to the first test site (T / S) by the tray feeder 300 to perform a test process.

Of course, when the test at the other test site (T / S) is completed and the test tray 50 is transferred to the corresponding loading / unloading unit (100 or 200), soon another loading / unloading unit (200 or 100) The test tray of is transferred to the test site (T / S) and the test is carried out so that the test can be carried out continuously in each test site (T / S).

Accordingly, the loading and unloading operations in the first and second loading and unloading units 100 and 200 and the test operations in each test site can be continuously performed without interruption.

Meanwhile, the test trays supplied from the first loading unloading unit 100 and tested in the above test process are returned to the first loading unloading unit 100, and the second loading unloading unit 200 is performed. The test trays supplied and tested from the test trays are returned to the original second loading and unloading unit 200 to be unloaded.

Recognizing the test trays at the test site and returning them to the initially loaded loading / unloading units 100 and 200 as described above is a technique known in the field of handlers, and includes ID check holes or ID check holes engraved in the test trays. By identifying the barcode with the identification device.

On the other hand, in the above-described embodiment, the operation of supplying and loading trays containing semiconductor elements to be tested to the first and second loading and unloading units 100 and 200 and stacking the trays which have been tested and unloaded may be performed. Although described as being made manually by the operator, alternatively, an automatic tray multi-stacker (not shown) configured to automatically perform tray loading and separating operations may be performed.

As described above, according to the present invention, the loading / unloading unit for loading / unloading the handler and the test site for performing the test are separately configured, and the test execution time is relatively large compared to the number of test sites. By placing fewer loading / unloading units on the test line with a relatively short time, the test efficiency can be improved and the space occupied by the test system can be greatly reduced, thereby increasing space utilization.

In addition, since only a few loading / unloading units need to be managed, the number of workers can be drastically reduced when the test is performed, and thus unmannedness can be easily reduced, thereby reducing costs.

Claims (9)

A plurality of test heads having a plurality of testers for testing and processing abnormalities of semiconductor devices, a test socket electrically connected to each of the testers, and equipped with semiconductor devices for testing; A test line configured to sequentially transfer test trays in which the devices are mounted, and to be mounted on a test socket of the test head to independently perform a test, wherein each test site is arranged in a line; After loading the trays in which the semiconductor devices to be tested are stored, reloading the semiconductor devices of the trays into the test trays, and receiving the test trays tested at each test site, and classifying the tested semiconductor devices according to the test results. Perform the unloading operation of sorting and mounting the predetermined trays, wherein the first and second loading / unloading units are configured to be arranged separately from the test sites and arranged in line with the test lines on both outer sides of the test line; ; A guide rail installed in a straight line so as to cross the upper part of the first and second loading / unloading units and the upper part of the test line, and a holder part installed to be movable along the guide rail to hold and transport the test tray; A drive unit configured to drive the holder unit, including a tray transfer device for linearly reciprocating along the guide rail and transferring the test trays to the first and second loading / unloading units and each test site; The control unit for controlling the operation of the first and second loading / unloading unit and the control unit for controlling the operation of each tester and the test site of the test line is connected to each other by a wired or wireless communication network characterized in that each of the organic control. Semiconductor device test system. delete delete delete The semiconductor device of claim 1, wherein each of the first and second loading / unloading units includes a loading unit in which a plurality of trays in which the semiconductor devices to be tested are stored, and the tested semiconductor devices are classified into test trays according to a test result. An unloading unit for transferring the semiconductor elements to be tested and remounting the loading unit in a test tray and separating the tested semiconductor elements from the test trays transferred from the test site; And a picker robot for holding and transferring the semiconductor devices to the loading unit, the unloading unit, and the exchange unit. The test chamber of claim 1, wherein each of the test sites comprises a preheating chamber configured to heat and cool the semiconductor devices to a predetermined temperature while moving the test tray by one step, and coupled with the test socket of the test head to be transferred from the preheating chamber. A test chamber for performing a test by mounting semiconductor elements of a test tray to a test socket under a predetermined temperature state, and returning the tested semiconductor elements to an initial room temperature state by moving a test tray transferred from the test chamber by one step. Or a defrosting chamber (defrosting) for performing a process of removing or defrosting. 2. The automatic tray of claim 1, wherein the trays for supplying and loading the trays in which the semiconductor devices to be tested are stored are loaded into the first and second loading / unloading units, and the operation of separating the unloaded trays after testing is automatically performed. The semiconductor device test system further comprises a multi-stacker. Loading trays in which the semiconductor devices to be tested are stored in the first and second loading / unloading units, and remounting the semiconductor devices of the trays to the test trays; Sequentially transferring the test trays of the first loading / unloading unit to respective test sites of a test line using a tray transfer means; Performing testing of the semiconductor devices of the test tray at each test site, and sequentially transferring the tested test trays to the first loading / unloading unit in the order of completion of the test; In the process of transferring the tested test trays from the test site to the first loading / unloading unit, the test trays of the second loading / unloading unit are transferred to the respective test sites in the order in which the test trays are transferred. Sequentially carrying out feeding to perform a test; Then, the above steps are repeatedly performed, and the first loading / unloading unit and the second loading / unloading unit alternately supply a test tray to the test site to perform the test of the semiconductor device. A method of controlling a semiconductor device test system. The method of claim 8, wherein the first loading / unloading unit and the second loading / unloading unit is characterized in that the trays containing the semiconductor elements to be tested are continuously supplied by one lot (load) and loaded and unloaded A control method of a semiconductor device test system.