KR100305985B1 - Loading semiconductor devices using temporary buffers in handlers - Google Patents

Abstract

The present invention relates to a method of loading a semiconductor device using a temporary buffer that allows the semiconductor device to be smoothly loaded during the supply tray replacement time when the semiconductor device is loaded in the handler. According to the present invention, a microprocessor checks whether a temporary buffer is empty when there is no request for supplying a semiconductor device to a loading buffer, and if the temporary buffer is empty, the semiconductor device located in the supply tray as an XY axis picker as a temporary buffer. Transporting, if there is a request for supplying a semiconductor device to the loading buffer, checking whether there is a semiconductor device in the supply tray in the microprocessor, requesting a supply tray replacement in the microprocessor if there is no semiconductor device in the supply tray, If the supply tray is replaced, the microprocessor checks whether the replaced supply tray is the n-1th, and if the replaced supply tray is not the n-1th, transfers the semiconductor element located in the temporary buffer to the loading buffer with the XY axis picker. Semiconductor device To provide a method of loading.

[Index]

Handler, Temporary Buffer, Semiconductor Device, Loading Method

Description

Loading method of semiconductor device using temporary buffer in handler

The present invention relates to a method of loading a semiconductor device using a temporary buffer in a handler, and in particular, a temporary buffer that allows the semiconductor device to be smoothly loaded during the supply tray replacement time when loading the semiconductor device in the handler. It relates to a method of loading a semiconductor device using.

In general, manufactured semiconductor devices are shipped after testing final electrical characteristics. The semiconductor device is tested by a test device, and a handler is used to transfer the mass-produced semiconductor device to the test device. The handler is largely composed of an elevator unit, a robot unit, an exchanger unit, and a chamber.

The elevator unit consists of an elevator, a multi stacker, and a tray transfer, and the robot unit consists of an XY robot, a left X robot, and a right X robot. The exchanger part includes a buffer, an aligner, an exchanger body, an exchanger. It consists of a head and a rotator.

The chamber is composed of a heating chamber, a test site and a cooling chamber, wherein the heating chamber heats the semiconductor device under a predetermined test temperature condition, and the heated semiconductor device is tested by a test device installed at the test site. After the test is completed, the semiconductor device is cooled to room temperature in the cooling chamber and then unloaded from the cooling chamber.

Meanwhile, the semiconductor device loaded into the chamber is loaded through a supply tray, a loading buffer, and an aligner.

Supply trays are used to supply semiconductor devices, and X-Y axis pickers are used to transfer semiconductor devices located on the supply trays to the unloading buffer. The semiconductor element transferred to the loading buffer by the X-Y axis picker is transferred to the aligner by the loading picker. The semiconductor device transferred to the aligner is mounted on the test tray and then moved in the chamber while mounted on the test tray to perform the test.

To load and test the semiconductor device into a test device connected to the chamber, the X-Y axis picker repeatedly supplies the semiconductor device located in the supply tray to the loading buffer. This continuous operation ensures that all semiconductor devices located in the supply trays are transferred to the loading buffer and replaced with new supply trays. During the supply tray replacement time, the XY-axis picker is held in a standby state, which causes delays in supplying the semiconductor device during the replacement time of the supply tray when the semiconductor device needs to be supplied to the loading buffer. There is a problem.

The present invention loads a semiconductor device by transferring a semiconductor device located in a supply tray to a temporary buffer using a temporary buffer when the semiconductor device is loaded in a handler, and then transferring the semiconductor device transferred to a temporary buffer during a replacement time of the supply tray to a loading buffer. An object of the present invention is to provide a method of loading a semiconductor device that can facilitate the work.

In order to achieve the above object, the present invention provides a step of checking whether a temporary buffer is empty in a microprocessor if there is no request for supplying a semiconductor device as a loading buffer, and temporarily clearing a semiconductor device located in a supply tray with an XY axis picker if the temporary buffer is empty. Transferring to the buffer, checking if there is a semiconductor element in the supply tray if there is a request for supply of the semiconductor element to the loading buffer, and requesting a supply tray replacement in the microprocessor if there is no semiconductor element in the supply tray. If the supply tray is replaced, the microprocessor checks whether the replaced supply tray is the n-1th, and if the replaced supply tray is not the n-1th, loads the semiconductor element located in the temporary buffer with the XY axis picker. Is composed of the steps of It features.

1 is a flowchart illustrating a method of loading a semiconductor device using a temporary buffer in a handler according to the present invention;

2 is a block diagram of a loading device of a semiconductor device to which the present invention is applied;

3 is a plan view showing the configuration of a handler to which the present invention is applied.

＊ Description of Signs of Main Parts

100: handler 110: chamber

120: work table 121: sorting tray

122: supply tray 123a: loading buffer

123b: unloading buffer 124: aligner

A method of loading a semiconductor device using a temporary buffer in the handler of the present invention will be described with reference to the accompanying drawings.

1 is a flowchart illustrating a method of loading a semiconductor device using a temporary buffer in a handler according to the present invention, FIG. 2 is a block diagram of a loading device of a semiconductor device to which the present invention is applied, and FIG. It is a top view which showed the structure. As shown in the drawing, after the initialization of the handler 100 is completed, the microprocessor 30 checks whether there is a request for supplying the semiconductor device to the loading buffer 123a, and supplies the semiconductor device to the loading buffer 123a. If there is no request, the microprocessor 30 checks whether the temporary buffer 70 is empty (S2), and if the temporary buffer 70 is empty, the semiconductor device located in the supply tray 122 with the XY axis picker 44. To the temporary buffer 70 (S3), and if there is a request to supply the semiconductor device to the loading buffer 123a, the microprocessor 30 checks whether there is a semiconductor device in the supply tray 122 (S4). ), If there is no semiconductor element in the supply tray 122, step S6 of requesting replacement of the supply tray 122 in the microprocessor 30, and in the microprocessor 30 when the supply tray 122 is replaced. Supply Step S7 of checking whether the ray 122 is n-th and if the replaced supply tray 122 is not n-th, the semiconductor device positioned in the temporary buffer 70 by the XY-axis picker 44 is removed. It is configured to transfer to the loading buffer 123a (S8).

Referring to the configuration of the present invention in detail as follows.

The test apparatus 10 tests the semiconductor device and transmits the result to the computer 20 through a general purpose interface bus (GPIB) 10a. The computer 20 receives the test result from the test device 10 and transmits the test result to the microprocessor 30. The microprocessor 30 classifies and loads the tested semiconductor devices according to grades according to the received results.

In order to classify and load the tested semiconductor device, the semiconductor device is first transferred from the chamber 110 to the aligner 124, and the semiconductor device transferred to the aligner 124 is unloaded into the unloading buffer 123b. The unloading picker 123b is used to unload the semiconductor device from the aligner 124 to the unloading buffer 123b, and the unloading picker 123b is an unloading picker driver controlled by the microprocessor 30. The driver 61 and the fourth motor M4 are driven to reciprocate in the X-axis direction of the work table 120 to unload the semiconductor device.

The unloading picker 63 sucks the semiconductor element located in the aligner 124 with the nozzle 63a driven by the unloading picker nozzle driver 62 and transfers it to the unloading buffer 123b. The semiconductor device transferred to the unloading buffer 123b sorts and stacks semiconductor devices rated by the X-Y-axis picker 44 on the sorting tray 121 located in the sorting stacking portion to sort the semiconductor devices.

After the semiconductor device is loaded and tested by the test device 10, the semiconductor device is loaded into the test device 10 in order to classify and load the semiconductor device. In order to load the semiconductor device into the test apparatus 10, the semiconductor device is first mounted on the supply tray 122. The supply tray 122 is mounted with a predetermined number of semiconductor elements, and a plurality of supply trays 122 are simultaneously loaded in the handler 100. In the present invention, it is set that n supply trays 122 are loaded in the handler 100.

The supply tray 122 loaded on the handler 100 sequentially moves over the work table 120 to load the semiconductor device to be tested into the chamber 110. When the supply tray 122 is moved to the work table 120, the microprocessor 30 moves the X and Y axis picker drivers 41 and 42, the first motor M1 and the second motor M2. The X-axis picker 44 is moved in the X-axis or Y-axis direction to drive the semiconductor device positioned on the supply tray 122 to the loading buffer 123a.

The XY-axis picker 44 moves in the X-axis or Y-axis direction of the work table 120 while being guided by the guide axes 125 and 126 and is mounted on the supply tray 122. Is sucked by the nozzle 44a and transferred to the loading buffer 123a (S1). The nozzle 44a is driven by the XY-axis picker nozzle driver 43 controlled by the microprocessor 30, and is controlled at the completion of the movement of the XY-axis picker 44 to operate to adsorb or release the semiconductor element. .

The semiconductor device transferred to the loading buffer 123 by the X-Y-axis picker 44 is transferred to the aligner 124 by the loading picker 53 and mounted thereon. The loading picker 53 is guided and moved by the guide shaft 127, and moves in a state in which the semiconductor element mounted in the loading buffer 123a is adsorbed by the nozzle 53a controlled by the loading picker nozzle driver 52. To the aligner 124.

As such, the X-Y-axis picker 44 and the loading picker 53 are used to transfer the semiconductor devices positioned in the supply tray 122 to the loading buffer 123a and the aligner 124. The X-Y axis picker 44 and the loading picker 53 are returned to the home position when the handler 100 is initialized. In this state, it is checked whether there is a supply request of the semiconductor device to be tested by the loading buffer 123a in the microprocessor 30 (S1).

The microprocessor 30 has a control program for controlling the handler 100 as a whole in a built-in ROM or an external ROM (not shown). The semiconductor device is supplied by a procedure for executing the program. The request, the number of semiconductor elements, and the number of supply trays 122 are recognized. When the microprocessor 30 confirms that there is no request for supply of the semiconductor device to the loading buffer 123a by the recognition method, it is checked whether the temporary buffer 70 is empty in the next execution (S2).

As a result of the check, if the temporary buffer 70 is empty, the microprocessor 30 drives the X-Y-axis picker 44 to transfer the semiconductor device located in the supply tray 122 to the temporary buffer 70 (S3). On the contrary, if a supply request for a semiconductor device is received from the loading buffer 123a, the microprocessor 30 checks whether there is a semiconductor device in the supply tray 122 (S4).

In step S4, if there is a semiconductor device in the supply tray 122, if there is a semiconductor device in the supply tray 122, the semiconductor device positioned in the supply tray 122 is transferred to the loading buffer 123a by the XY axis picker 44. Transfer (S5). That is, if there is a semiconductor device in the supply tray 122 currently located on the work table 120, the X-Y-axis picker 44 transfers the semiconductor device in the supply tray 122 to the loading buffer 123a.

On the contrary, if there is no semiconductor element in the supply tray 122, the microprocessor 30 requires replacement of the supply tray 122 (S6). When the supply tray 122 is replaced, it is checked whether the supply tray 122 replaced by the microprocessor 30 is the n-1 th time (S7). If the replaced supply tray 122 is not the n-1st supply tray 122

The semiconductor device positioned in the temporary buffer 70 is transferred to the loading buffer 123a by the X-Y-axis picker 44 (S8).

By transferring the semiconductor element located in the temporary buffer 70 to the loading buffer 123a during the replacement time of the supply tray 122, the waiting time of the XY axis picker 44 can be reduced, and the supply tray 122 During the replacement, the semiconductor element can be continuously supplied to the loading buffer 123a to facilitate the loading operation.

Loading the semiconductor device during the replacement time of the supply tray 123a may facilitate the loading operation and reduce the number of tests during the last test operation. That is, it is checked whether the replaced supply tray 122 is the n-1 th supply tray 122, and if the replaced supply tray 122 is the n-1 th supply tray 122, the n-axis picker 44 is n−. The semiconductor device positioned in the first supply tray 122 is filled in the temporary buffer 70 (S9).

When all of the semiconductor devices are filled in the temporary buffer 70, the XY-axis picker 44 loads the semiconductor devices remaining in the n−1 th supply tray 122 and the semiconductor devices mounted in the last n th supply tray 122. Transfer to the buffer 123a (S10). When all the semiconductor devices in the n-th supply tray 122 are loaded, the microprocessor 30 checks whether the n-th supply tray 122 is empty (S11).

As a result of the check, when the n-th supply tray 122 becomes empty, the mode in which the semiconductor element is supplied from the loading buffer 123a to the aligner 124 is changed (S12). For example, when sixteen semiconductor elements are mounted in a line in the aligner 124, eight semiconductor elements may be mounted by skipping the mounting positions of the semiconductor elements one by one.

When eight semiconductor devices are mounted on the aligner 124, the test devices 10 may complete the test at a time when the semiconductor device is tested in the test apparatus 10. That is, when 16 semiconductor elements are mounted on the aligner 124, the test apparatus 10 performs the test twice.

This is because the semiconductor devices mounted on the test trays are dense, while the spacing of the sockets (not shown) of the test apparatus 10 is large. Therefore, by mounting eight test elements on the aligner 124, the test tray may be mounted to complete the test once in the last test.

As described above, the present invention facilitates the loading operation of the semiconductor device by loading the semiconductor device by transferring the semiconductor device located in the temporary buffer to the loading buffer during the replacement time of the supply tray using the temporary buffer when loading the semiconductor device in the handler. Provide an effect that can be performed.

In addition, the test apparatus performs the test once by changing the mode in which the remaining semiconductor elements are mounted on the aligner at the end of the test, thereby increasing the test work efficiency.

Claims (3)

In the method of loading a semiconductor device in the handler, Checking, by the microprocessor, if the temporary buffer is empty when there is no request to supply the semiconductor device to the loading buffer; Transferring the semiconductor device located in the supply tray to the temporary buffer with an X-Y axis picker if the temporary buffer is empty; Checking whether there is a semiconductor device in a supply tray in a microprocessor when a semiconductor device is supplied to the loading buffer; Requesting a supply tray replacement in a microprocessor if there is a semiconductor device in the supply tray; If the supply tray is replaced, confirming whether the replaced supply tray is n-1th in a microprocessor; And And transferring the semiconductor device located in the temporary buffer to the loading buffer by using an X-Y-axis picker, if the replaced supply tray is not the n-1th. The method of claim 1, The step of checking whether there is a semiconductor device in the supply tray is configured to transfer the semiconductor device located in the supply tray to a loading buffer by using an XY axis picker if there is a semiconductor device in the supply tray. Method of loading semiconductor device. The method of claim 1, The determining whether the replaced supply tray is the n-1 th step comprises: filling a temporary buffer with a semiconductor device located in the n-1 th supply tray with an X-Y axis picker when the replaced supply tray is the n-1 th time; Transferring a semiconductor device located in an n-th supply tray to a loading buffer by using an X-Y axis picker when the semiconductor device is filled in the temporary buffer; Checking at the microprocessor whether the nth supply tray is empty; And And a step of changing a mode for supplying the aligner from the loading buffer when the n-th supply tray becomes empty, wherein the handler is configured to supply a semiconductor device using a temporary buffer.