KR100889573B1 - Electronic component testing apparatus and method for configuring electronic component testing apparatus - Google Patents

Abstract

The handler is configured such that the plurality of types of handling modules 2 with different throughput rates and the plurality of types of test modules 1 with different simultaneous measurement numbers and / or test temperatures are detachable and connectable. The throughput of the handling module 2 and the number of simultaneous measurements of the test module 1 based on the maximum number of measurable pins of the tester, the number of terminals of the electronic component under test, and the test time that output the test pattern and examine the response pattern. And / or test temperatures are selected and combined.

Electronic component testing device

Description

ELECTRONIC COMPONENT TESTING APPARATUS AND METHOD FOR CONFIGURING ELECTRONIC COMPONENT TESTING APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component test apparatus for testing various electronic components such as semiconductor integrated circuit elements and a method for organizing an electronic component test apparatus. Even when the maximum number of simultaneous measurements is changed flexibly, the present invention relates to an electronic component test apparatus and a method for organizing an electronic component test apparatus that can be optimized so that the efficiency of the entire test apparatus is not lowered by the performance of the handler.

In the manufacturing process of a semiconductor device, the electronic component test apparatus which tests the electronic component, such as an IC chip manufactured finally, is needed. In the test of this kind of electronic components, a test pattern is input to an IC chip and operated in a state where the test environment is a temperature environment of normal temperature, high temperature or low temperature, and the response pattern is inspected. This is because, as a characteristic of the IC chip, it is necessary to guarantee that the IC chip works well even at room temperature, or at high or low temperatures.

A conventional general electronic component test apparatus includes a test head having a tester storing a program for transmitting a test pattern and inspecting a response pattern, and a contact terminal for electrically connecting the tester and the electronic component under test (DUT). And a handler which sequentially transfers a large number of electronic components under test to contact terminals of the test head, and physically classifies the electronic components under test according to the test results. Then, the electronic component under test is set in the handler and returned to the test head, where an operation test for the purpose of electrically connecting the electronic component under test to the contact terminal of the test head is performed.

By the way, one of the tester's performance is the maximum number of testable pins. This is the number of signal terminals that can be output and input from this tester, and the maximum number of devices that can be tested simultaneously is determined from the relationship between the maximum number of testable pins and the number of pins (terminals) of the electronic component under test. For example, when the maximum number of testable pins of the tester is 100 pins and the number of terminals of the electronic component under test is 20 pins, the maximum simultaneous measurement number is 100 ÷ 20 = 5 pieces.

On the other hand, one of the performances of handlers is throughput. This is the number of electronic components under test that this handler can handle per unit of time. In other words, after setting the electronic component under test, it aligns in front of the test head, conveys it onto the test head, pushes it to the contact terminal, and shows the mechanical operation speed sorted and aligned according to the test result. The higher the throughput, the more productive the handler. However, even in the case of a handler having a large throughput, if the time under which the electronic component under test is pushed to the contact terminal to transmit and receive an operation signal (hereinafter referred to as a test time) is long, a so-called waiting time is generated in the carrier system. However, the maximum throughput is not necessarily achieved. In other words, the maximum throughput may or may not be exhibited in relation to the test time. On the other hand, there is a difficulty in that the apparatus cost increases as the conveying system is speeded up.

As described above, in the electronic component test apparatus, if the number of terminals (pin number) of the electronic component under test varies, the maximum simultaneous measurement number also fluctuates, so that a tester having a different maximum measurable pin number is required to obtain desired productivity. If you publicize, you need a handler with a different throughput. However, it is inefficient to select an optimal throughput handler from the relationship with test time. Moreover, depending on the target test temperature (low temperature, normal temperature, high temperature) and the testable temperature range, the thermostat (chamber) and temperature control apparatus from which a heat insulation structure and a component differ are required.

Moreover, although the external shape and IC pin shape exist according to the kind of the electronic component under test, the electronic component test apparatus can be conveyed to a common test tray by replacing | exchanging the kind correspondence mechanism called a change kit.

In addition, on the tester side provided with a test head, testers of a plurality of types of system configurations exist corresponding to various test devices. Therefore, the maximum number of testable pins (the number of tester channels) provided in the test head varies greatly, for example, 256/512/1024 channels.

According to the present invention, even when the maximum number of simultaneous measurements is flexibly changed from the relationship between the maximum testable pin count of the tester and the pin count of the electronic component under test, the efficiency of the entire test apparatus is not reduced by the performance of the handler. An object of the present invention is to provide an electronic component test apparatus that can be knitted / modified and a knitting method of the electronic component test apparatus.

In order to achieve the above object, according to the present invention, there is provided an electronic component test apparatus for electrically contacting an electronic component under test with a contact portion of a test head, wherein at least one of the units constituting the electronic component test apparatus is replaced, added or An electronic component testing apparatus is provided, characterized in that it is modularly reorganizable (see claim 1).

In the said invention, the unit which comprises the said electronic component test apparatus is made into the stocker unit which stores the electronic component under test before and behind a test, the loader unit which carries out the said electronic component under test, and the temperature made into the electronic component under test. The soak unit, the contact unit which electrically contacts the said electronic component under test to a contact part, the outlet unit which temporarily holds the electronic component under test which completed the test in the said contact unit, or the test unit which ended the test in the said contact unit And at least one unit of an unloader unit for classifying the electronic component under test according to the test result, and at least one unit of the unit can be configured to be modularized for exchange, addition or realignment (claim 2). Reference).

In the present invention, at least one of the units is modularized so as to be exchangeable, addable or realignable, respectively, or a combination unit configured by combining two or more units of the units is configured to be modularized so as to be exchangeable, added or reassembled. can do.

In the above invention, the unit constituting the electronic component test apparatus includes a handling unit and a test unit, and the handling unit stores the electronic component under test before and after the test, takes out the stored electronic component under test, and performs the test. The electronic component to be carried out to the unit and finished testing in the test unit is classified according to the test result, and the test unit is subjected to a temperature at which the target electronic component carried in from the handling unit is subjected to a temperature. The electronic component under test may be electrically contacted with a contact portion of a test head to which a pattern is output and a response pattern is input, such that at least one of the handling unit or the test unit is modularized so that replacement, addition, or realignment is possible. (See claim 3).

In the above invention, the handling unit includes a stocker unit for storing the electronic component under test before and after the test, a loader unit for taking out the electronic component under test stored in the stocker unit and transporting the electronic component under test to the test unit; The electronic component under test can be configured to have an unloader unit for sorting according to the test results (see claim 4).

In the above invention, at least one of the stocker unit, the loader unit, and the unloader unit has a control unit for controlling the unit, in common or in common, and the electronic component testing apparatus is configured to centrally manage the control units. It can be configured to have more centralized management measures (see claim 5).

In the above invention, the test unit includes a soak unit having a temperature for the purpose of the electronic component under test brought from the handling unit, and a contact for electrically contacting the electronic component under test with a contact portion while maintaining the temperature. And an outlet unit for temporarily holding the unit under test and the electronic component under test in the contact unit (see claim 6).

In the above invention, at least one of the soak unit, the contact unit, and the outlet unit has a control unit for controlling the unit, in common or in common, and the electronic component testing apparatus is a centralized unit that centrally manages the control units. It may be configured to have more control measures (see claim 7).

In the above invention, a component of any one of the stocker unit, the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit is modularized to be exchangeable, added or realigned in the unit. Can be configured (see claim 8).

In order to achieve the above object, according to the present invention, a stocker unit for storing the electronic component under test before and after the test, a loader unit for carrying out the electronic component under test, a soak unit having a temperature for the purpose of the electronic component under test, The contact unit which electrically contacts the electronic component under test with the temperature at the temperature maintained, the outlet unit which temporarily holds the electronic component under test which has finished the test in the contact unit, or the test in the contact unit An electronic component testing apparatus having at least one of an unloader unit for sorting finished electronic components under test according to a test result, wherein a component included in any one of the units is modularized so as to be replaced, added, or reorganized in the unit. An electronic component test apparatus is provided (see claim 9).

In the above invention, the loader unit and / or the unloader unit have, as a component, a gripping portion of a moving means for gripping and moving the electronic component under test, wherein the gripping portion is provided in the loader unit and / or the unloader unit. It can be configured to be modular, so that it can be exchanged, added or reorganized (see claim 10).

In the above invention, the gripping portion has a control portion for controlling the gripping portion, and the centralized management means can be configured to manage the control portion (see claim 11).

In the above invention, the contact unit has, as a component, a pressing means for simultaneously pressing a plurality of the electronic component under test to a contact portion, and the pressing means is configured to be modularized so that the contact unit can be exchanged, added, or reorganized. (See claim 12).

In the above invention, the pressing means may have a control portion for controlling the pressing means, and the centralized management means may be configured to manage the control portion (see claim 13).

In the above invention, at least one of the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit includes a test tray on which the electronic component under test is mounted or the electronic component under test itself as an adjacent unit. It may be configured to have a conveying means between the delivering units (see claim 14).

In the said invention, the component which the said conveyance means has can be comprised so that it may be modularized so that exchange, addition, or reorganization may be carried out in the said conveyance means between units (refer Claim 15).

In the said invention, the component of the conveying means between the units can be comprised so that it may be supported by the moving mechanism which reciprocates between adjacent units, and will be the shuttle which holds the electronic component under test (refer Claim 16).

In the above invention, the shuttle has a control unit for controlling the shuttle, and the centralized management means can be configured to manage the control unit (see claim 17).

In order to achieve the above object, according to the present invention, at least one of the units constituting the electronic component test apparatus for electrically contacting the electronic component under test with the contact portion of the test head is modularized so as to be exchangeable, additional, or realignable, There is provided a method of knitting an electronic component test apparatus, wherein the modular unit is selected from a plurality of units having different specifications to form an electronic component test apparatus (see claim 18).

In the said invention, the unit which comprises the said electronic component test apparatus is a stocker unit which stores the electronic component under test before and behind a test, the loader unit which carries out the electronic component under test, and the soak made into the temperature for the purpose of an electronic component under test. Unit, a contact unit for electrically contacting the electronic component under test with a contact portion, an outlet unit for temporarily holding an electronic component under test that has finished the test at the contact unit, or an end of the test at the contact unit At least one unit of the unloader unit that sorts the test electronics according to the test results, wherein at least one of the units is modularized to be replaceable, addable or realignable, and the modularized unit The electronic component test apparatus can be configured to be selected from a plurality of different types of units. See Section 19).

In the above invention, the unit constituting the electronic component test apparatus stores the electronic component under test before and after the test, takes out the stored electronic component under test, takes it out to the test unit, and ends the test in the test unit. Electronic components are classified according to the test results. The electronic component under test is contacted with a plurality of types of handling units having different processing rates and contact portions of a test head at which a temperature for a target electronic component carried in from the handling unit is set to a temperature and a test pattern is output and a response pattern is input. And a plurality of test units having different simultaneous measurement numbers and / or test temperatures for electrical contact, wherein either one of the handling unit or the test unit is modularized to be interchangeable, add or reorganize, and output the test pattern. And at the same time, based on the maximum measurable pin number of the tester inspecting the response pattern, the number of terminals of the electronic component under test, and the test time, the throughput of the handling unit of the corresponding type or the simultaneous Select at least one of the number of measurements and / or the test temperature to It can be configured to organize a magnetic part test apparatus.

In the above invention, the plurality of handling units may be configured such that the throughput is different because the number of simultaneous grips and / or the conveyance speed at the time of conveying the electronic component under test are different.

In the above invention, the handling unit includes a stocker unit for storing the electronic component under test before and after the test, a loader unit for taking out the electronic component under test stored in the stocker unit and transporting the electronic component under test to the test unit; The electronic component under test can be configured to have an unloader unit for classifying according to the test result.

In the above invention, the test unit includes a soak unit having a temperature for the purpose of the electronic component under test brought from the handling unit, and a contact for electrically contacting the electronic component under test with a contact portion while maintaining the temperature. The unit and the outlet unit which hold temporarily the electronic component under test which completed the test in the said contact unit can be comprised.

 In the above invention, the plurality of test units may be configured such that the number of simultaneously contacting the electronic component under test with the contact portion in the contact unit is different.

In the above invention, the plurality of test units may be configured such that the performance of using the electronic component under test as a target temperature is different in the soak unit and the outlet unit.

In the above invention, a component of any one of the stocker unit, the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit is modularized to be exchangeable, added or realigned in the unit. It can be configured to select a component mounted in the unit from the plurality of the components of different types and specifications.

In the said invention, the said loader unit and / or the said unloader unit have a moving means which moves an electronic component under test as a component, and the holding part which grips the said electronic component under test replaces and adds in the said moving means. Or it can be comprised so that the holding | gripping part mounted on the said moving means may be comprised among the said several holding | gripping tool types which are modularizable so that it can be reorganized (refer Claim 20).

In the above invention, the contact unit has a pressing means for simultaneously pressing a plurality of the electronic component under test as a component to the contact portion, and the pressing means is modularized so that the contact unit can be exchanged, added or reorganized. It can be configured to select the pressing means mounted on the contact unit from the plurality of the pressing means having different specifications (see claim 21).

In the above invention, at least one of the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit includes a test tray on which the electronic component under test is mounted or the electronic component under test itself as an adjacent unit. The component which the conveying means has between a unit to guide, and the component which the inter-unit conveying means has is modularized so that exchange | exchange, addition, or reorganization is carried out by the said inter-unit conveyance means, and conveys between the said units among the several types of components from which a specification differs. It may be configured to select the component to be mounted on the means (see claim 22).

In the above invention, the component of the conveying means between the units can be configured to be a shuttle that is supported by a moving mechanism that reciprocates between adjacent units and holds the electronic component under test (see claim 23).

In the above invention, the mechanical interface, the electrical interface, the software interface, and the power supply connection portion may be formed in positions of the respective handling units and the respective test units (see claim 24).

In the combination method of the electronic component test apparatus and the electronic component test apparatus of this invention, an electronic component test apparatus is modularized by a unit. As a result, since the electronic component test apparatus can be individually selected according to the required specifications in units of units, even when the maximum simultaneous measurement number is flexibly changed from the relationship between the maximum testable pin number of the tester and the pin number of the electronic component under test, the test apparatus can be changed. It is possible to configure / modify the optimal system configuration without degrading the overall efficiency according to the performance of the handler.

For example, when the electronic component test apparatus is modularized into a handling module and a test module, a plurality of handling modules having different throughputs may be used because the number of simultaneous grips and / or the conveying speed of conveying the electronic component under test is different from the handling module. Get ready. In the test module, for example, a plurality of test modules having different numbers of simultaneous measurements and test temperature (temperature control function for the electronic component under test) are prepared.

Then, based on the maximum number of measurable pins of the tester, the number of terminals of the electronic component under test, and the test time, a handling module having an optimum throughput and a test module having an optimal simultaneous measurement number and / or a test temperature are selected. By combining, the electronic component test apparatus is organized.

Thereby, even when the maximum simultaneous measurement number is flexibly changed from the relationship between the maximum testable pin number of the tester and the pin number of the electronic component under test, the efficiency of the entire test apparatus is not reduced by the performance of the handler, but the system of the electronic component test apparatus You can optimize your configuration. As a result, even if the test specification and the test conditions are changed, it is enough to change only the minimum required modularization, and thus the design development time and the manufacturing cost can be reduced.

In order to achieve the above object, according to the present invention, at least one of the units constituting the electronic component test apparatus is modularized so as to be exchangeable, addable, or realignable, and there are a plurality of the units of different specifications, and Each unit is provided with ID information for recognizing each type, and the electronic component testing apparatus selects a predetermined unit from a plurality of units, forms a system, reads the ID information from each unit, and On the basis of the read ID information, there is provided an electronic component test apparatus that performs operation control corresponding to each unit (see claim 25).

In the said invention, the unit which comprises the said electronic component test apparatus is a stocker unit which stores the electronic component under test before and behind a test, the loader unit which carries out the electronic component under test, and the soak made into the temperature for the purpose of an electronic component under test. Unit, a contact unit for electrically contacting the electronic component under test with a contact portion, an outlet unit for temporarily holding an electronic component under test that has finished the test at the contact unit, or an end of the test at the contact unit At least one of the unloader units for classifying the test electronics according to the test results, and at least one of the units can be configured to be modularized so that exchange, addition or realignment is possible (see claim 26). .

In the above invention, the unit constituting the electronic component test apparatus includes a handling unit and a test unit, and the handling unit stores the electronic component under test before and after the test, takes out the stored electronic component under test, and performs the test. The electronic component to be carried out to the unit and finished testing in the test unit is classified according to the test result, and the test unit is subjected to a temperature at which the target electronic component carried in from the handling unit is subjected to a temperature. The electronic component under test may be electrically contacted with a contact portion of a test head to which a pattern is output and a response pattern is input, such that at least one of the handling unit or the test unit is modularized so that replacement, addition, or realignment is possible. (See claim 27).

In the above invention, it is possible to configure such that each unit has unique unit unique information corresponding to the ID information (see claim 28).

In the above invention, in response to the system configuration thus organized, it may be configured to have control software for controlling the operation of each unit (see claim 29).

In the above invention, between the first unit and the second unit that form the system, the connection site for connecting the two is mechanically connected so that the electronic component under test can be operated, and the electronic component under test is tested. It is possible to configure that the electrical connection is possibly carried out (see claim 30).

In the above invention, it can be configured to be operated by replacing at any time with a first unit of a different specification or a second unit of a different specification than the system configuration originally organized (see claim 31).

1 is a schematic diagram showing a first embodiment of a test module according to the present invention.

2 is a schematic diagram (front view) showing a first embodiment of a handling module according to the present invention.

Figure 3 is a schematic diagram showing the first embodiment of the handling module according to the present invention (at the back).

4 is a view for explaining the type and combination of the handling module and the test module according to the present invention.

Fig. 5 is a conceptual diagram showing a processing method of an electronic component under test and a tray in the electronic component testing apparatus according to the present invention.

6 is a view for explaining the selection method based on the number of simultaneous measurements of the test module according to the present invention.

7 is a view for explaining the selection method based on the throughput of the handling module and the number of simultaneous measurements of the test module according to the present invention.

8 is an exploded perspective view showing a second embodiment of a handler according to the present invention;

9 is a perspective view showing a second embodiment of a handler according to the present invention;

10 is an enlarged cross-sectional view illustrating a pusher module according to a second embodiment of the present invention.

FIG. 11A is a plan view of the variation of the pusher module and illustrates a type with 256 pushers; FIG.

Fig. 11B is a plan view showing the variation of the pusher module, showing a type with 128 pushers.

12 is a side view of the contact arm module.

FIG. 13A is a side view illustrating the variation of a contact arm module, and showing a type having four contact arms. FIG.

FIG. 13B is a side view illustrating the variation of a contact arm module, and showing a type having six contact arms. FIG.

FIG. 13C is a side view illustrating the variation of a contact arm module, and illustrates a type having six contact arms. FIG.

It is a side view which shows the holding head module of the XYZ conveyance apparatus in 2nd Embodiment of this invention.

Fig. 15A is a side view showing the variation of the gripping head module, showing a first type.

Fig. 15B is a side view showing the variation of the holding head module, and a second type.

Fig. 15C is a side view showing the variation of the holding head module, and a third type.

Fig. 15D is a side view showing the variation of the gripping head module, and shows a fourth type.

FIG. 16 is an exploded perspective view of a loader / unloader module mounted on the handler shown in FIG. 8; FIG.

17 is a perspective view of the handler shown in FIG. 16 assembled;

Fig. 18 is an exploded perspective view showing a contact module and an outlet module in the second embodiment of the present invention.

FIG. 19 is a front view of the contact module and the outlet module shown in FIG. 18; FIG.

Fig. 20 is a schematic perspective view showing the interior of the contact module and the outlet module in the third embodiment of the present invention.

FIG. 21 is a plan view showing the interior of the contact module and the outlet module shown in FIG. 20; FIG.

Fig. 22 is an exploded perspective view showing electrical wiring and the like of the handler according to the second embodiment of the present invention.

Fig. 23 is a block diagram showing an overall configuration of a control system of a handler according to the second embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

[First Embodiment]

1 is a schematic diagram showing a first embodiment of a test module according to the present invention, Figure 2 is a schematic diagram (front view) showing a first embodiment of a handling module according to the present invention, Figure 3 is the same schematic diagram (back view), 4 is a view for explaining the type and combination of the handling module and the test module according to the present invention, Figure 5 is a conceptual diagram showing a processing method of the electronic component under test and the tray in the electronic component test apparatus according to the present invention, 6 is a view for explaining a selection method based on the simultaneous measurement number of the test module according to the present invention, Figure 7 is a view for explaining a selection method based on the throughput and the simultaneous measurement number of the test module according to the present invention. to be. On the other hand, FIG. 5 is a figure for understanding the processing method of the electronic component under test and the tray in the electronic component test apparatus of this embodiment, In fact, there exists a part which shows planarly the member arrange | positioned in the up-down direction. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIGS.

The electronic component test apparatus according to the present embodiment tests whether the electronic component under test operates properly in a state in which a desired high or low temperature stress is applied to the electronic component under test or in a normal temperature at which temperature stress is not applied. It is a device to classify the electronic component under test by good / bad / categories according to the result, and return the electronic component under test to the contact terminal installed in the test head sequentially, and classify the electronic component under test according to the test result. A tester having a handler stored in a predetermined tray, a tester (not shown) that sends out a predetermined test pattern and test-evaluates the electronic component under test based on the response signal, and a contact terminal, which functions as an interface between the handler and the tester. It consists of the head 8 (refer FIG. 5). The tester and the test head 8, and the handler and the tester are electrically connected through signal lines such as cables. On the other hand, a contact terminal has a contact terminal which contacts the drive terminal of the electronic component under test, and the contact terminal which contacts the input / output terminal of the electronic component under test, and these are collectively called a contact terminal. The contact terminal inputs and outputs various signals from the tester via the socket and the wiring board provided in the test head.

The test apparatus according to the present invention is mainly a handler portion, and in this embodiment, the handler is composed of a test module 1 shown in FIG. 1 and a handling module 2 shown in FIGS. 2 and 3. .

The test module 1 maintains the temperature at which the electronic component under test is carried from the handling module 2 at the target temperature, and simultaneously delivers the electronic component under test to the contact portion of the test head to which the test pattern is output and the response pattern is input. Contact with

As shown in FIG. 1 and FIG. 5, the test module 1 of the present example includes a soak unit 11 for raising and lowering the temperature to a target temperature of the electronic component under test carried from the handling module 2, and a temperature. The contact unit 12 which electrically contacts the electronic component under test with the contact part in the state which hold | maintained is maintained, and the outlet unit 13 which temporarily hold | maintains the electronic component under test which terminated the test in the contact unit 12 is comprised. And the units are detachably formed. That is, the frames constituting the skeletons of the units 12, 13, and 14 constituting the test module 1 are standardized, and the frames are detachable from each other via the frames.

Incidentally, the processing of the electronic component under test in the test module 1 is, for example, a test tray 91 shown in FIG. 5, which is indicated by an arrow in the same drawing by a conveyor other than the drawing. As described above, the test module 1 and the handling module 2 are circulated. Then, the electronic component under test mounted on the customer tray (C-Tray) 10 is transferred from the loader unit 21 described later to the test tray 91, and the test tray 91 is transferred to the soak unit 11 →. The test of the electronic component under test is performed while the contact unit 12 → exit unit 13 → unloader unit 22 is processed.

In the test module 1 of this example, as shown in FIG. 4, two types of simultaneous measurement number in the contact unit 12 and 256 types and 128 types are prepared, and the test temperature is -40 ° C to 135 ° C. The two types of types which can be made in the range of and the types which are possible in the range of room temperature to 135 degreeC are prepared, and these four types of test modules are prepared together. That is, as shown in the figure, the number of simultaneous measurements is 256, the type (1A) of the test temperature is -40 ° C to 135 ° C, the number of simultaneous measurements is 256, and the type (1B) is the room temperature to 135 ° C. The test temperature is 128 (type C) of -40 degreeC-135 degreeC, and the number of simultaneous measurements is 128, and the test temperature is type (1D) of room temperature-135 degreeC.

The difference between the number of simultaneous measurements of 256 and 128 is that the number of pushers for pushing the electronic component under test to the contact portion of the contact unit 12 is set to 256 but is set to 128. The shapes of the frames constituting the skeleton are all formed to be the same (shape). The layout shown above in FIG. 6 is an arrangement of 256 pushers for simultaneous measurement, and the layout shown below in FIG. 6 is an arrangement of 128 simultaneous measurements pushers. Of course, the specifications of the contact portion of the test head are also provided with two types of 256 sockets and 128 sockets.

The difference between the type of test temperature in the range of -40 ° C to 135 ° C and the type of room temperature to 135 ° C is whether or not the electronic component under test can be cooled down to about -40 ° C. In the electronic type, a cooling device capable of cooling the electronic component under test to −40 ° C. is provided in the soak unit 11, and condensation is generated in the electronic component under test cooled to such a low temperature in the outlet unit 13. A condensation prevention device is installed to prevent this. In addition to the cooling device and the condensation preventing device, a heating device for heating the electronic component under test to room temperature to 135 ° C is provided. In contrast, in the latter type test module 1, only a heating device for heating the electronic component under test to room temperature to 135 ° C is provided. As a cooling apparatus which cools to cryogenic temperature, a soak unit is comprised by the chamber and cooling gas, such as nitrogen gas, flows in this chamber. Moreover, as a dew condensation prevention apparatus, the apparatus which heats the to-be-tested electronic component hold | maintained at low temperature to the room temperature vicinity can be illustrated.

However, the frames constituting the skeleton of the soaking unit 11 and the outlet unit 13 are all the same shape (shape), and any type of unit is configured to be detachable from neighboring units.

As shown in FIG. 1, an inlet opening 111 into which a test tray equipped with a plurality of electronic components under test is carried on the near side of the soak unit 11 (the surface on which the handling module 2 described later is assembled). ) Is formed. Moreover, the exit opening part 131 is formed in the near side of the exit unit 13 for carrying out the test tray which arrived at the exit unit 13 after completion | finish of a test in the contact unit 12 to the handling module 2. And the position and shape (size) of these inlet opening part 111 and the outlet opening part 131 are a fixed shape, and the soaking unit 11 and the outlet unit 13 of any type are also the same position and the same shape. In addition, corresponding to the inlet opening 111, the loader unit 21 of the handling module 2 is provided with an outlet opening 219 of the same position and shape as shown in FIG. 3, and the handling module ( In the unloader unit 22 of 2), the inlet opening part 229 of the same position and shape is formed as shown in the same figure. When the test module 1 and the handling module 2 are assembled together, the inlet opening 111 of the soak unit 11 and the outlet opening 219 of the loader unit 21 are joined to each other, and the outlet unit 13 is attached. The outlet opening 229 of) and the inlet opening 111 of the unloader unit 22 are joined, whereby the delivery of the test tray is performed.

On the other hand, as shown in Fig. 3, at least one of the modules 1, (for the member 23, which performs mechanical positioning of both when assembling and attaching the test module 1 and the handling module 2, ( It is preferable to install in 2).

Returning to FIG. 1, the breaker unit related to the power supply used by the said test module 1, the terminal power supply unit, and the control unit 15 are provided in the lower part of the frame of the test module 1. As shown in FIG. The mechanical interface 16 of the air piping constituting the operation circuits of various fluid pressure cylinders, etc., and the power supply are located at the correct position of the close side (assembly attaching surface to the handling module 2) of the test module 1. A connector 17, a software interface 18 for communicating ID data for identifying a module or a unit and data for temperature control, and an electrical interface 19 such as an electric motor or a sensor are provided. In addition, the above element may be provided in each module.

Here, the software for driving control of each module reads ID data for recognizing each module, and can apply software corresponding to each ID data.

Moreover, it is preferable to prepare the software corresponding to the module which can be combined beforehand. In this case, the system configuration of the electronic component test apparatus can be immediately changed and operated in response to the electronic component under test.

In addition, it is preferable to provide information unique to each module, for example, operation correction data, maintenance management count, and the like, corresponding to the ID data.

Here, the motion correction data will be described. Each module has non-uniformity such as mechanical position error and movement amount. Here, the mechanical position, the movement amount, and the like are measured in advance and stored as corresponding to the ID data as motion correction data for each module. When the module is replaced, the correction is applied by applying the motion correction data corresponding to the ID data. As a result, it is possible to obtain a great advantage of being able to control each module unitarily by the same logical control data without recognizing the mechanical error of the replaced module. Therefore, it is possible to obtain an advantage that replacement with a module having a different specification can be performed at a production site from time to time.

Next, the maintenance management count will be described. The maintenance management count records, in each module, the number of operations for each movement element (adsorption pad, AIR cylinder, etc.) and the number of contacts to contact terminals in correspondence with ID data. As a result, mechanical load information of each moving element and consumable parts included in each module can be obtained. As a result, it is possible to accurately manage the timing of maintenance, replacement time of life parts, and the like.

These mechanical interfaces 16, the power connector 17, the software interface 18, and the electrical interface 19 each have the mechanical interface shown in FIG. 3 when assembling and attaching the test module 1 and the handling module 2 to each other. And a position and shape that can be connected corresponding to the power supply connector 17, the software interface 28, and the electrical interface 29.

2 and 3 are the handling module 2 according to the present embodiment, FIG. 2 is a front view when the assembly is attached as a handler, and FIG. 3 is the assembly view of the test module 1 described above as a back view thereof. It is a figure which mainly shows a surface. The handling module 2 stores the electronic components under test before and after the test, removes the stored electronic components under test, carries them out to the test module 1, and ends the electronic components under test in the test module 1. Classification is based on test results.

2, 3, and 5, the handling module 2 of this example takes out the stocker unit 24 which stores the electronic component under test before and after a test, and the electronic component under test stored in the stocker unit 24, The loader unit 21 carried out to the test module 1 and the unloader unit 22 which classify the electronic component under test by the test module 1 according to a test result are comprised, and each unit ( 21, 22, and 24 are formed in a detachable manner. That is, the frames constituting the skeletons of the units 21, 22, and 24 constituting the handling module 2 are shaped, and the frames are detachable from each other via the frames.

As shown in FIG. 7, the handling module 2 of this example has two types, a type 2A having a maximum throughput of 11000 units / hour and a type 2B of 6000 units / hour. The difference between these two types is XYZ conveyance apparatus 211 and 221 (so-called pick and place conveyance apparatus of FIG. 5) of the electronic component under test installed in each of the loader unit 21 and the unloader unit 22, and FIG. ) Is the operating speed and the number of electronic components under test that can be gripped at the same time. The larger the maximum throughput is 11000 pieces / hour, the faster the operation speed of the XYZ axis conveying devices 211 and 221, and the larger the number of electronic components under test that can be gripped at once. According to the difference in the above specifications, the price of the device is greatly different.

As shown in FIG. 5, the stocker unit 24 includes a stocker unit 24A for stacking and storing a customer tray 92 in which a plurality of electronic components under test are mounted, and a plurality of electronic subjects after the end of the test. It has stocker part 24B which stores and stacks the customer tray 92 sorted according to the test result. Then, using the tray conveying device 24C, the customer tray 92 is sequentially taken out from the stocker portion 24A in which the electronic component under test before the test is stored to the loader unit 21, and mounted on the customer tray 92. The test electronic component is moved to the test tray 91 using the XYZ axis conveying apparatus 211 of the loader unit 21 mentioned above. For this reason, an opening part for guiding the customer tray 92 is provided between the stocker unit 24 and the loader unit 21. Similarly, using the XYZ conveying device 221, the electronic component under test is transferred from the test tray 91 on which the electronic component under test is mounted to the customer tray 92 according to the test result, and the customer tray 92 is loaded. Is conveyed to the stocker part 24B of the stocker unit 24 using the tray conveyance apparatus 24C. For this reason, an opening part for guiding the customer tray 92 is provided between the stocker unit 24 and the unloader unit 22.

The stocker unit 24 may need to be replaced with another stocker unit depending on the type or shape of the customer tray. In this case, since the replacement with the corresponding stocker unit 24 is possible in the present application, the general purpose of the electronic component test apparatus can be further improved.

2, the main power supply 25 used by the said handling module 2, and the control unit 30 are provided in the lower part of the frame of the handling module 2. As shown in FIG.

In the electronic component test apparatus according to the present embodiment configured as described above, a desired type is selected from the two types of handling modules 2 and the four types of test modules 1 shown in FIG. . Since the handling module 2 has a maximum throughput of 11000 pieces / hour type 2A and 6000 pieces / hour type 2B, the specifications required for the line are selected. Note, however, that the maximum throughput may or may not be exhibited by the test time of the electronic component under test.

Referring to this point, Fig. 7 is a graph in which the throughput is plotted on the vertical axis and the test time on the horizontal axis for the handler of the present example, and X in the figure forms a handling module 2A having a maximum throughput of 11000 / hour. The processing rate at one time is shown. That is, when the test time of the electronic component under test is A 'time or less, the capability of 11000 pieces / hour is exhibited, and when the test time exceeds A', the throughput decreases. In contrast, Y in the figure shows the throughput when the handling module 2B having the maximum throughput is 6000 pieces / hour, and when the test time is less than or equal to B, the maximum throughput is 6000 pieces / hour, but the test time is shown. If this B is exceeded, the throughput decreases. Here, when the test time in a semiconductor manufacturing line exceeds B, even if a 2A type or a 2B type is organized as a handling module, the throughput is the same, so the handling module 2B is considered from the viewpoint of cost execution. Can be said to be appropriate. Similarly, in the case where the test time is A 'or less, the handling module 2A exhibits the maximum throughput, and therefore, the handling module 2A is appropriately adopted from the viewpoint of productivity. When the test time is A time between A 'and B, although there is a difference in throughput as indicated by Z in the same drawing, when the difference in throughput can afford to compensate for the cost difference, the handling It is appropriate to employ the module 2A, but otherwise it is also appropriate for the cost to employ the handling module 2B. From this point of view, handling modules 2A and 2B are selected. As described above, in the present application, modules having different performances can be combined. Thereby, even if the test head to be connected to the system configuration at the time of installation is changed or the device type of the test object is changed, it is possible to obtain a great advantage of reconfiguring and fixing to the optimum system configuration corresponding to the device. Therefore, the big advantage which can utilize the electronic component test apparatus flexibly and effectively can be acquired. Moreover, instead of developing and manufacturing individual electronic component test apparatuses corresponding to the new devices, it is only necessary to develop and manufacture only the corresponding modules, and to share the other electronic components. It can be realized. In addition, the cost of the device system can be reduced. In addition, in the pause period for performing repair or maintenance of a failed module, it is also possible to temporarily replace the replacement module with a same or different performance to test the electronic component under test. As a result, the uptime can be substantially improved.

On the other hand, since the test module 1 has four types (1A to 1D) shown in the same figure, the specifications required for the line are selected in consideration of the number of simultaneous measurements and the test temperature. For example, when a cryogenic test with a test temperature of -40 ° C is required, type 1A or 1C is selected.

A combination example is shown at the right end of FIG. The upper right part of the figure shows an electronic component composed of a handling module 2A having a maximum throughput of 11000 units / hour and a test module 1A having a test temperature of -40 ° C to 135 ° C with 256 simultaneous measurements. The test device, which is the same as shown below, is an electronic component test device composed of a handling module 2B having a maximum throughput of 6000 pieces / hour and a test module 1D having a test temperature of room temperature to 135 ° C with 128 simultaneous measurements. to be. Although the former test apparatus has a good test efficiency with a wide range of tests, the disadvantage is that the cost is increased by the amount thereof, and the latter test apparatus is reversed. Therefore, although it is important to balance performance and cost in response to the test specification required by the semiconductor manufacturing line, the electronic component test apparatus of the present embodiment is a test that constitutes the test apparatus in any combination once. The module 1 and the handling module 2 can then be knitted and fixed. At that time, some of the units constituting each of the modules 1 and 2 are replaced.

Thus, in the electronic component test apparatus of this embodiment, even when the maximum simultaneous measurement number is flexibly changed from the relationship between the maximum testable pin number of the tester and the pin number of the electronic component under test, the efficiency of the entire test apparatus is determined by the performance of the handler. The electronic component test apparatus can be optimized without deterioration. As a result, even when the test specification and the test conditions are changed, it is sufficient to change only the minimum modules necessary, so that the design development time and the manufacturing cost can be reduced.

In the first embodiment described above, the test module 1 and the handling module 2 are configured so as to be separated from each other and connected to each other, and the knitting is possible. However, the test module 1 includes the soak unit 11 and the contact unit. The stocker unit 24, the loader unit 21, and the unloader unit 22 can be further modularized in the outlet unit 13 and the handling module 2, and the XYZ conveyance in each unit can be further modularized. The pusher or the like for the adsorption head or contact portion of the apparatus may be further modularized.

In the following 2nd Embodiment, the case where the lower unit of the test module 1 and the handling module 2 is modularized, they are combined, and a handler is comprised is demonstrated.

Second Embodiment

FIG. 8 is an exploded perspective view showing a second embodiment of the handler according to the present invention, and FIG. 9 is a perspective view in which the handler shown in FIG. 8 is assembled.

The handler which concerns on this embodiment is comprised from the contact module 3, the exit module 4, the load module 5, the unloader module 6, and the stocker module 7. As shown in FIG. Each of these modules 3 to 7 modularizes the test modules 1 and the lower units 11 to 13, 21, 22, and 24 of the handling module 2 according to the first embodiment. will be. Here, the modularization forms a unit constituting the electronic component test apparatus so as to be detachable and connectable (exchangeable) with respect to a unit adjacent thereto, and at least two or more units having different specifications are prepared as the replaceable unit. Means that.

Fig. 10 is a side view showing a pusher module in a second embodiment of the present invention, Figs. 11A and 11B are plan views showing variations of the pusher module, Fig. 12 is a side view showing a contact arm module, Figs. 13A to 13C. Is a plan view showing the variation of the contact arm module.

The contact module 3 integrally modularizes the soak unit 11 and the contact unit 12 in 1st Embodiment. As the variation of the contact module 3, for example, two kinds of test temperature ranges different from each other can be mentioned as in the first embodiment.

As shown in Fig. 10, the contact module 3 is provided with a number of pushers 32 corresponding to the number of simultaneous measurements, and each pusher 32 connects the contact portion 81 to the electronic component under test. The test is carried out by simultaneously pressing against. In this embodiment, the pusher 32 of the simultaneous measurement number share is provided in the base member 311, and is submoduleed as the pusher module 31. This pusher module 3 can be separated from and connected to the contact module 3.

As the variation of this pusher module 31, for example, a type 31A having 256 pushers 32 as shown in Fig. 11A and a type having 128 pushers 32 as shown in Fig. 11B are shown. 31B is prepared.

In addition, in the logic IC test apparatus, instead of the pusher, as shown in FIG. 12, a plurality of contact arms 301 may be provided in the base member 302 and modularized as the contact head module 300. As the variation of the contact arm module 300, for example, as shown in Figs. 13A to 13C, other types 300A to 300C such as four, six, or eight contact arms can be given. On the other hand, the specifications of the contact arm module may be changed by changing the shape (size), arrangement, mechanism, and the like of the contact arm.

In the present embodiment, one of the two types of contact modules 3 is selected based on the required test temperature. Next, a pusher module of either type 31A or 31B is selected based on the required number of simultaneous measurements. The selected pusher module is then mounted to the contact module 3.

In this way, by submoduleing the plurality of pushers 32 as the pusher module 31 in the contact module 3, the contact module 3 can be flexibly knitted / modified by an optimal system configuration without changing the entire contact module 3. .

The outlet module 4 modularizes the outlet unit 13 in 1st Embodiment. As the variation of the outlet module 4, two types, for example, the type which provided only the heating apparatus and the type which provided the heating apparatus and the dew condensation prevention apparatus are mentioned.

In this embodiment, as shown in FIG. 8 and FIG. 9, the contact module 3 and the outlet module 4 are provided on the first main frame 10. On the base 101 of the first main frame 10, a plurality of guide holes 102 are formed at a predetermined pitch. In contrast, a plurality of guide pins 33 protruding downward are provided at four corners of the lower surface of the contact module 3. The guide pins 33 are provided at intervals of an integral multiple of the pitch of the guide holes 102 (two times in the example shown in FIG. 8). Similarly, a plurality of guide pins 41 protruding downward are also provided at four corners of the lower surface of the outlet module 4. The guide pins 41 are also provided at intervals of an integer multiple of the pitch of the guide holes 102 (four times in the example shown in FIG. 8). Then, the guide pins 33 and 41 are screwed into the guide holes 102 so that the contact module 3 and the outlet module 4 are positioned relative to the first main frame 10. After this positioning, the contact module 3 and the outlet module 4 are fixed to the first main frame 10 by, for example, bolting, clamping, magnetic force, or the like.

Modules of different types are also manufactured and standardized based on the pitch of the guide holes 102 of the first main frame 10. In addition, when a module is newly manufactured, it is manufactured and standardized based on the pitch of the guide hole 102.

It is a side view which shows the holding head module of the XYZ conveyance apparatus in 2nd Embodiment of this invention, and FIG. 15A-FIG. 15D are the side view which showed the variation of a holding head module.

The loader module and the unloader module 6 are modules of the load unit 921 and the unloader unit 22 according to the first embodiment, respectively, and the XYZ conveying apparatus (symbol in FIG. 5) is used to convey the electronic component under test. 211 and 221) are provided in each of the modules 5 and 6. As a result, these modules have a relatively short test time, which is suitable for a case where fast loading and unloading are required.

The XYZ conveying apparatuses 211 and 221 which each module 5 and 6 are equipped with the movable head 212 and 222 which can move to an X-Y-Z axis direction. As shown in FIG. 14, the movable heads 212 and 222 are a plurality of holding heads 214 and a plurality of holding heads 214 capable of holding and holding and holding and holding an electronic component under test by a suction pad 215. ) Has a base member 213 to which it is mounted.

The base member 213 is provided with a connection port for separately supplying electricity, a driving source, and the like to each gripping head module, and a bus line to which an I / O control unit of each module is connected.

In this embodiment, the holding head 214 is submodulated as a holding head module, and it can isolate | separate and connect from the XYZ conveying apparatus 211,221. As a variation of a holding head module, the type shown to FIG. 15A-FIG. 15D is mentioned.

The variation shown in FIG. 15A is a first type 214A in which one or more (one in the example shown in FIG. 15A) adsorption pads 215 are used as a unit. In the example shown in FIG. 15A, four holding head modules 214A are bolted to the base member 213. The variation shown in Fig. 15B is a second type 214B having a large shape (size) of the gripping pad 215 in order to correspond to the electronic component under test having a large size.

The variation shown in FIG. 15C is a third type 214C using an air cylinder 216 as a shock absorbing mechanism. The variation shown in FIG. 15D is a fourth type 214D using the motor 217 and the rack and pinion mechanism 218 as the shock absorbing mechanism. The holding head module 214C of the type shown in Fig. 15C is low cost but suitable for low speed processing because of its low buffer capacity. On the other hand, the holding head module 214D of the type shown in Fig. 15D is expensive, but is suitable for high speed processing because of its excellent buffer performance. On the other hand, in the holding head modules 214C and 214D of the third and fourth types, four suction pads 215 are united.

The system configuration is performed without changing the loader module 5 or the unloader module 6 as a whole by replacing the holding head modules 214A to 214C of the above variations according to the size, test time, etc. of the electronic component under test. It is more flexible to organize / change.

As shown in FIG. 8 and FIG. 9, the loader module 5 and the unloader module 6 are provided on the second main frame 20. A plurality of guide holes 202 are formed at a predetermined pitch on the base 201 of the second main frame 20. In contrast, a plurality of guide pins 51, 61 protruding downward are provided at four corners of the loader module 5 and the unloader module 6. The guide pins 51 and 61 are provided at intervals of an integral multiple of the pitch of the guide hole 202 (four times in the example shown in FIG. 8). Then, the guide pins 51 and 61 engage the guide holes 202 so that the loader module 5 and the unloader module 6 are positioned in the second main frame. After this positioning, the loader module 5 and the unloader module 6 are fixed to the second main frame 20 by, for example, bolting, clamping, magnetic force, or the like.

Modules of different types are also manufactured and standardized based on the pitch of the guide holes 202 of the second main frame 20. In addition, when a module is newly manufactured, it is manufactured and standardized based on the pitch of the guide hole 202.

The stocker module 7 is a modularized stocker unit 24 according to the first embodiment, and is provided in the second main frame 20 in the present embodiment. The stocker module 7 guides the customer tray to the loader module 21 and the unloader module 22 via an opening (not shown) formed in the base 201. The stocker module 7 may need to be replaced with another stocker module depending on the type or shape of the customer tray. In this case, since it is possible in this application to replace with the corresponding stocker module 7, general use of the electronic component test apparatus is further attained.

8 and 9, the first main frame 10 to which the contact module 3 and the outlet module 4 are fixed, and the loader module 5 and the unloader module 6 are fixed. The second main frame 20 is fixed. The first main frame 10 is provided with guide pins 103 at four corners of the surface opposite to the second main frame. In contrast, a guide hole 203 is formed in the second main frame at a position opposite to the guide pin 103. The first main frame 10 and the second main frame are positioned by coupling the guide pin 102 to the guide hole 202. After the positioning, the main frames 10 and 20 are fixed to each other by, for example, bolting, clamping, or magnetic force.

FIG. 16 is an exploded perspective view when the loader / unloader module is attached to the handler shown in FIG. 8, and FIG. 17 is a perspective view of the handler shown in FIG. 16 assembled.

In the present embodiment, as shown in Figs. 16 and 17, loader modules 5 'of the type having different specifications from the above modules 5 and 6 are also prepared. As shown in FIG. 14 and FIG. 15, the loader module 5 'is a modularized unit of the loader units 21 and 22 and the unloader unit 22. It is comprised so that both the loader side and the unloader side can be used. Therefore, when the test time is relatively long and rapid loading and unloading are not required, the above-described loader module 5 and unloader module 6 are replaced with the loader module 5 '.

Guide pins 51 'are provided at four corners of the lower surface of the loader module 5' at intervals of an integer multiple of the pitch of the guide hole 202 (seven times in the example shown in FIG. 16), and the loader module 5 ') Can be positioned in the second main frame 20.

FIG. 18 is an exploded perspective view showing the contact module and the outlet module in the second embodiment of the present invention, and FIG. 19 is a front view showing the contact module and the outlet module shown in FIG. 18.

As mentioned above, in the handler comprised from the modules 3-7, it is necessary to perform delivery of the electronic component under test between modules. As a method of delivering the electronic component under test between each module, the method of delivering the test tray 91 which mounts the electronic component under test, and the method of delivering the electronic component under test itself are mentioned.

In the present embodiment, the former method is employed, and the test tray 91 is used as the loader module 5 → contact module 3 → exit module 4 → unloader module 6 → loader module 5. The test of the electronic component under test is carried out during processing.

In this embodiment, in order to guide the test tray 91 between each module, as shown in FIG. 18 and FIG. 19, the near side of the contact module 3 (the surface on which the loader module 5 was assembled and attached). ), An inlet opening 34 through which the test tray 91 is carried is formed. Moreover, the exit opening part 42 which carries out a test tray is formed in the near side of the exit module 4. The positions of the openings 34 and 42 are formed on the basis of the guide pin 103 provided in the first main frame 10 as shown in FIG. 19. In addition, the shape (size) of these opening parts 34 and 42 is shaped.

Although not shown in particular, corresponding to the inlet opening portion 34 of the contact module 3, the outlet openings of the same position and shape are formed in the loader module, and similarly in the outlet opening 52 of the outlet module 4. Correspondingly, the unloading module 6 is also provided with an inlet opening of the same position and shape.

In addition, as shown in FIG. 18, an outlet opening 35 through which the test tray is carried out to one side surface (the surface on which the outlet module is assembled) of the contact module 3 is formed. Corresponding to the outlet opening 35, the outlet module 4 is provided with an inlet opening 43 of the same position and the same shape. When the contact module 3 and the outlet module 4 are assembled together, the openings 35 and 43 communicate with each other. Although not shown in particular, opening portions communicated between the unloader module 6 and the loader module 5 are respectively formed.

A belt conveyor (not shown) is provided between the modules so as to pass through the openings communicated with each other. The test tray 91 is guided by the belt conveyor from the previous process (predecessor module) to the next process (post-module). In addition, as a mechanism for conveying the test tray 91 between modules, an air cylinder, a ball screw mechanism, etc. are mentioned besides a belt conveyor.

Fig. 20 is a schematic perspective view showing the interior of the contact module and the outlet module in the third embodiment of the present invention, and Fig. 21 is a plan view showing the interior of the contact module and the outlet module shown in Fig. 22.

Next, a third embodiment of the present invention for guiding the electronic component under test itself between modules without using a test tray will be described. In the third embodiment of the present invention, as shown in Figs. 20 and 21, for example, the shuttle unit 36 is provided so as to pass between the contact module 3 and the outlet module 4, respectively on both sides thereof. XYZ conveying apparatus 37 and 44 are provided.

The shuttle unit 36 has a base 361 that can reciprocate between the modules 3 and 4 and a shuttle 362 detachably mounted on the base 36. The base 361 is comprised with a belt conveyor, an air cylinder, a ball screw mechanism, etc., for example. In addition, the base 361 is provided with a connection port for separately supplying electricity, a driving source, or the like to each shuttle 362, and a bus line for connecting an I / O control unit included in each shuttle 362, respectively. . In the shuttle 362, a plurality of concave pockets 362 holding the electronic component under test are formed (four in the example shown in FIG. 21). The positioning of the shuttle 362 relative to the base 361 is performed using guide pins or the like.

And the XYZ conveyance apparatus 37 moves the shuttle 362 to the electronic component which completed the test in the contact module, the base 361 moves to the exit module 4, and the XYZ conveyance apparatus ( 44 transfers the electronic component under test from the shuttle 36 to the unlocked position, whereby the electronic component under test is guided between the modules 3 and 4.

In this embodiment, the shuttle 362 is modularized in the shuttle unit 36, and the number of the pockets 363 can be replaced with another type of shuttle, or the number of the shuttles 362 itself can be increased or decreased.

On the other hand, the shuttle unit 36 of the above structure is not limited between the contact module 3 and the exit module 4, The exit module 4 and the unloader between the loader module 5 and the contact module 3 are not limited. It is also provided between the modules 6.

As another method of guiding the electronic component under test itself between modules, the XYZ conveying apparatus 37 on the contact module 3 side moves the electronic component under test to a predetermined position without interposing the shuttle unit 36, The XYZ transport apparatus on the outlet module 4 side may receive the electronic component under test.

Fig. 22 is an exploded perspective view showing electrical wiring of a handler according to the second embodiment of the present invention, and Fig. 23 is a block diagram showing the overall configuration of a control system of the handler according to the second embodiment of the present invention.

As shown in Fig. 22, the contact module 3 and the outlet module 4 are provided with connection panels 38 and 45, respectively. In addition, a main connection panel 104 is also provided in the first main frame 10. Then, power and air are supplied to each of the modules 3 and 4 by connecting the connection panels 38 and 45 to the main connection panel 104 with a power cable, an I / O cable, and air piping. It is supposed to be.

Similarly, although not shown in particular, the connection module is provided also in the loader module 5, the unloader module 6, and the stocker module 7. As shown in FIG. The main connection panel 204 is also provided in the second main frame 20. Then, power and air are supplied to each of the modules 5 to 7 by connecting between each connection panel and the main connection panel with a power cable, an I / O cable, and an air pipe.

As shown in FIG. 23, each module 3-7 has the control part 39-79 for controlling the said module 3-7 itself. Each control unit 39 to 79 is connected to the main control unit 105 (central management means) through a connection panel and an I / O cable, and the main control unit 105 intensively manages each control unit 39 to 79. Doing. As shown in FIG. 22, the main control device 105 is provided inside the first main frame 10.

The main control device 105 has software for driving control of each module, and reads the ID data for recognizing each module, so that the software corresponding to each ID data can be applied. Thereby, the system configuration of the electronic component test apparatus can be changed and operated on the spot corresponding to the electronic component under test.

In addition, embodiment described above is described in order to make understanding of this invention easy, and is not described in order to limit this invention. Therefore, each element disclosed in the said embodiment is intended to include all the design changes and equivalents which belong to the technical scope of this invention.

For example, when the tray which mounts an electronic component and carries out an external hand is the same as the test tray 91 used internally, the module of the stocker unit 24 is removed, and the test tray 91 is connected with the outside. This can be replaced with an import / export module that can be delivered directly.

In addition, even when the external conveying system is changed to the form which applies a self-propelled bogie (for example, a mono rail self-propelled bogie, a tracked bogie, a trolley | bogie trolley | bogie (AGV)), the stocker unit 24 is removed, and it is in between. You only need to replace the import / export modules that can accept the tray. On the other hand, when it does not return to carrying in / out of an operator, it may replace with the original stocker unit 24, and can respond quickly to the change of the form of external conveyance. Therefore, the effective utilization of the current electronic component test apparatus can be generated, and the obsolescence of equipment can be prevented. As a result, a significant reduction merit of equipment cost is also obtained.

 In addition, when a large number of electronic component test apparatuses are installed and operated, it is also possible to replace them with modules of different specifications at the production site at any time, and as a result, the system configuration of the entire facility can be organized so as to achieve the best throughput. . In particular, when the variety of mass-produced electronic components (for example, memory devices) is changed, the throughput is improved by replacing the modules and rebuilding the entire facility.

In addition, when a failure occurs in the electronic component device, the failed module can be restarted in a short time by replacing the failed module with a module having the same specification or a replacement module having different specifications. On the other hand, it is sufficient to repair the failed module from time to time.

Claims (43)

delete In the electronic component handling apparatus used to test the electronic component under test, Equipped with stocker unit, loader unit, soak unit, contact unit, outlet unit and unloader unit, The stocker unit may include a first stocker for storing a customer tray for accommodating an electronic component under test, a second stocker for storing a customer tray for accommodating an electronic component under test, and storing the customer tray in the loader unit or Having a tray conveying apparatus for supplying the unloader unit, The loader unit has a first moving means for moving the electronic component under test from the customer tray supplied by the stocker unit to the test tray, and after loading the electronic component under test, the test tray is taken out to the soak unit, The soak unit has a heating device or a cooling device for raising or lowering the temperature of the electronic component under test, and after raising or lowering the temperature of the electronic component under test with the electronic component under test stored in the test tray. Export the test tray to the contact unit, The contact unit has a pressing means for pressing the electronic component under test in the contact portion of the test head while storing the electronic component under test in the test tray, The outlet unit temporarily holds the electronic component under test having completed the test in the contact unit while storing the electronic component under test in the test tray, The unloader unit has a second moving means for carrying the electronic component under test while sorting according to the test result from the test tray brought in from the outlet unit to the customer tray supplied by the stocker unit, At least one of the stocker unit, the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit is modularized so that replacement, addition, or realignment is possible. The method of claim 2, At least one of the stocker unit, the loader unit or the unloader unit has a control unit for controlling the unit, The electronic component handling apparatus further comprises a centralized management means for intensively managing the respective control units. The method of claim 2, At least one of the soak unit, the contact unit, or the outlet unit has a control unit for controlling the unit, The electronic component handling apparatus further comprises a centralized management means for intensively managing the respective control units. The method of claim 2, The components of any one of the stocker unit, the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit are modularized in the unit so that they can be exchanged, added or reorganized. Electronic component handling device The method of claim 5, The holding part of the said 1st-2nd moving means is an electronic component handling apparatus characterized by the modularization so that exchange | exchange, addition, or reorganization is possible in the said loader unit and / or said unloader unit. The method of claim 6, The gripping portion has a control unit for controlling the gripping portion, The electronic component handling apparatus further has a centralized management means for centrally managing the respective control units, And said centralized management means manages said controller. The method of claim 5, The pressing means of the contact unit is an electronic component handling device, characterized in that modularized to be replaced, added or reorganized in the contact unit. The method of claim 8, The pressing means has a control unit for controlling the pressing means, The electronic component handling apparatus further has a centralized management means for centrally managing the respective control units, And said centralized management means manages said control unit. In the electronic component handling apparatus used to test the electronic component under test, With handling unit and test unit, The handling unit stores the electronic components under test before and after the test, removes the stored electronic components under test and exports them to the test unit, classifies the electronic components under test in the test unit according to the test results, The test unit makes a temperature for the purpose of the electronic component under test brought from the handling unit, and electrically contacts the electronic component under test with a contact portion of a test head to which a test pattern is output and a response pattern is input. At least one of the handling unit or the test unit is an electronic component handling device, characterized in that the modularized to be replaced, added or reorganized. The method of claim 10, The handling unit has a stocker unit, a loader unit and an unloader unit, The stocker unit may include a first stocker for storing a customer tray for accommodating an electronic component under test, a second stocker for storing a customer tray for accommodating an electronic component under test, and storing the customer tray in the loader unit or Having a tray conveying apparatus for supplying the unloader unit, The loader unit has a first moving means for moving the electronic component under test from the customer tray supplied by the stocker unit to the test tray, and carries out the test tray loaded with the electronic component under test to the test unit, The unloader unit has a second moving means for moving the electronic component under test from the test tray conveyed from the test unit to the customer tray supplied by the stocker unit according to a test result. Handling device The method of claim 11, At least one of the stocker unit, the loader unit or the unloader unit has a control unit for controlling the unit, The electronic component handling apparatus further comprises a centralized management means for intensively managing the respective control units. The method of claim 11, A component of at least one of the stocker unit, the loader unit, or the unloader unit is modular in the unit so that it can be exchanged, added, or reorganized. The method of claim 13, An electronic component handling device, characterized in that the gripping portion having the first and second moving means is modularized so that the loader unit or the unloader unit can be exchanged, added or realigned. The method of claim 14, The gripping portion has a control unit for controlling the gripping portion, The electronic component handling apparatus further has a centralized management means for centrally managing the respective control units, And said centralized management means manages said control unit. The method of claim 10, The test unit has a soak unit, a contact unit and an outlet unit, The soak unit has a heating device or a cooling device for raising or lowering the temperature of the electronic component under test and storing the electronic component under test in the test tray carried in the handling unit. After raising or lowering the temperature, the test tray is taken out to the contact unit, The contact unit has a pressing means for electrically contacting the electronic component under test with a contact portion in the state of storing the electronic component under test in the test tray and pressing the electronic component under test to the contact portion, The outlet unit temporarily retains the electronic component under test that has been tested in the contact unit while the electronic component under test is stored in the test tray. The method of claim 16, At least one of the soak unit, the contact unit or the outlet unit has a control unit for controlling the unit, The electronic component handling apparatus further includes a centralized management means for intensively managing the respective control units. The method of claim 16, A component of any one of the soak unit, the contact unit, or the outlet unit is modular in the unit so that it can be exchanged, added, or reorganized. The method of claim 18, The pressing means of the contact unit is an electronic component handling device, characterized in that the modularized to be replaced, added or reorganized in the contact unit. The method of claim 19, The pressing means has a control unit for controlling the pressing means, The electronic component handling apparatus further has a centralized management means for intensively managing the respective control units, The centralized management means for managing the electronic component, characterized in that for managing the control unit The method according to any one of claims 2, 11 or 16, At least one of the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit has an inter-unit transfer means for guiding a test tray on which the electronic component under test is mounted to an adjacent unit. Electronic component handling device The method of claim 21, An electronic component handling apparatus characterized in that the components of the inter-unit transfer means are modularized so as to be exchangeable, added or reorganized in the inter-unit transfer means. delete delete In the electronic component handling apparatus used to test the electronic component under test, Equipped with stocker unit, loader unit, soak unit, contact unit, outlet unit and unloader unit, The stocker unit may include a first stocker for storing a customer tray for accommodating an electronic component under test, a second stocker for storing a customer tray for accommodating an electronic component under test, and storing the customer tray in the loader unit or Having a tray conveying apparatus for supplying the unloader unit, The loader unit has a first moving means for moving the electronic component under test from the customer tray supplied by the stocker unit to the test tray, and after loading the electronic component under test, the test tray is taken out to the soak unit, The soak unit has a heating device or a cooling device for raising or lowering the temperature of the electronic component under test, and raising or lowering the temperature of the electronic component under test while the electronic component under test is stored in the test tray. Later, the test tray is taken out to the contact unit, The contact unit has a pressing means for pressing the electronic component under test in the contact portion of the test head while storing the electronic component under test in the test tray, The outlet unit temporarily holds the electronic component under test having completed the test in the contact unit while storing the electronic component under test in the test tray, The unloader unit has a second moving means for carrying the electronic component under test while sorting according to the test result from the test tray brought in from the outlet unit to the customer tray supplied by the stocker unit, Electronic component handling device, characterized in that the component of any one of the units is modularized to be exchangeable, added or reorganized in the unit The method of claim 25, The holding part of the first and second moving means is modularized so that the loader unit or the unloader unit can be exchanged, added or reorganized. The method of claim 26, The gripping portion has a control unit for controlling the gripping portion, The electronic component handling apparatus further has a centralized management means for centrally managing the respective control units, And said centralized management means manages said control unit. The method of claim 25, The pressing means of the contact unit is an electronic component handling device, characterized in that the modularized to be replaced, added or reorganized in the contact unit. The method of claim 28, The pressing means has a control unit for controlling the pressing means, The electronic component handling apparatus further has a centralized management means for centrally managing the respective control units, And said centralized management means manages said control unit. delete In the electronic component handling apparatus used to test the electronic component under test, The electronic component handling device has a stocker unit, a loader unit, a soak unit, a contact unit, an outlet unit and an unloader unit, The stocker unit may include a first stocker for storing a customer tray for accommodating an electronic component under test, a second stocker for storing a customer tray for accommodating an electronic component under test, and storing the customer tray in the loader unit or Having a tray conveying apparatus for supplying the unloader unit, The loader unit has a first moving means for moving the electronic component under test from the customer tray supplied by the stocker unit to the test tray, and after loading the electronic component under test, the test tray is taken out to the soak unit, The soak unit has a heating device or a cooling device for raising or lowering the temperature of the electronic component under test, and after raising or lowering the temperature of the electronic component under test with the electronic component under test stored in the test tray. Export the test tray to the contact unit, The contact unit has a pressing means for pressing the electronic component under test in the contact portion of the test head while storing the electronic component under test in the test tray, The outlet unit temporarily holds the electronic component under test having completed the test in the contact unit while storing the electronic component under test in the test tray, The unloader unit has a second moving means for carrying the electronic component under test while sorting according to the test result from the test tray brought in from the outlet unit to the customer tray supplied by the stocker unit, And at least one of the units is modularized to be interchangeable, add or realign, A method for organizing an electronic component handling device, characterized in that the electronic unit handling device is formed by selecting the modular unit from a plurality of units having different specifications. The method of claim 31, wherein The holding part of the said 1st and 2nd moving means is modularized so that exchange | exchange, addition, or reorganization is possible in the said moving means, A knitting method for handling an electronic component, characterized in that a holding portion mounted on the moving means is selected from the plurality of holding portions having different specifications. The method of claim 31, wherein The pressing means of the contact unit is modularized so that the contact unit can be exchanged, added or reorganized. A method for knitting an electronic component handling apparatus, characterized in that the pressing means mounted to the contact unit is selected from the plurality of the pressing means having different specifications. The method of claim 31, wherein At least one of the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit has an inter-unit transfer means for guiding a test tray on which the electronic component under test is mounted to an adjacent unit, The components of the inter-unit transfer means are modularized to be interchangeable, added or reorganized in the inter-unit transfer means, A method for organizing an electronic component handling apparatus, comprising selecting a component mounted on the conveying means between the units among a plurality of components having different specifications. delete The method of claim 31, wherein A mechanical interface, an electrical interface, a software interface, and a power supply connection portion are formed at respective positions of the loader unit, the soak unit, the contact unit, the outlet unit, and the unloader unit. Organization method In the electronic component handling apparatus used to test the electronic component under test, At least one of the units constituting the electronic component handling device is modularized to be interchangeable, add or reorganize, There are a plurality of said units of different specifications, Each unit of the plurality of types is provided with ID information for recognizing each kind, The electronic component handling apparatus organizes a system for selecting a predetermined unit from a plurality of respective units, And read out the ID information from each unit and perform operation control corresponding to each unit based on the read ID information. The method of claim 37, wherein The unit constituting the electronic component test apparatus includes a stocker unit, a loader unit, a soak unit, a contact unit, an outlet unit and an unloader unit, The stocker unit may include a first stocker for storing a customer tray for accommodating an electronic component under test, a second stocker for storing a customer tray for accommodating an electronic component under test, and storing the customer tray in the loader unit or Having a tray conveying apparatus for supplying the unloader unit, The loader unit has a first moving means for moving the electronic component under test from the customer tray supplied by the stocker unit to the test tray, and after loading the electronic component under test, the test tray is taken out to the soak unit, The soak unit has a heating device or a cooling device for raising or lowering the temperature of the electronic component under test, and after raising or lowering the temperature of the electronic component under test with the electronic component under test stored in the test tray. Export the test tray to the contact unit, The contact unit has a pressing means for pressing the electronic component under test in the contact portion of the test head while storing the electronic component under test in the test tray, The outlet unit temporarily holds the electronic component under test having completed the test in the contact unit while storing the electronic component under test in the test tray, The unloader unit has a second moving means for carrying the electronic component under test while sorting according to the test result from the test tray brought in from the outlet unit to the customer tray supplied by the stocker unit, At least one of the stocker unit, the loader unit, the soak unit, the contact unit, the outlet unit, or the unloader unit is modularized so that replacement, addition, or realignment is possible. The method of claim 37, wherein The unit constituting the electronic component handling device includes a handling unit and a test unit, The handling unit stores the electronic components under test before and after the test, removes the stored electronic components under test and exports them to the test unit, classifies the electronic components under test in the test unit according to the test results, The test unit makes a temperature for the purpose of the electronic component under test brought from the handling unit, and electrically contacts the electronic component under test with a contact portion of a test head to which a test pattern is output and a response pattern is input. At least one of the handling unit or the test unit is an electronic component handling device, characterized in that the modularization so that replacement, addition or reorganization The method according to any one of claims 37 to 39, Electronic component handling apparatus characterized in that each unit has unique unit unique information corresponding to the ID information. The method according to any one of claims 37 to 39, Electronic component handling apparatus comprising control software for controlling the operation of each unit in response to the system configuration. The method according to any one of claims 37 to 39, The connection part which connects both between the 1st unit and the 2nd unit which comprises a system performs a mechanical connection so that the electronic component under test can be transported, and an electrical connection is performed so that an electronic component under test can be tested. Electronic component handling device, characterized in that The method according to any one of claims 37 to 39, Electronic component handling device, characterized in that the operation is replaced at any time by the first unit of a different specification or the second unit of a different specification than the originally configured system configuration

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