Hereinafter, an inline test handler according to the present invention will be described in detail with reference to the accompanying drawings.
2A is a block diagram schematically illustrating a configuration of an inline test handler 100 according to an embodiment of the present invention.
As shown in FIG. 2A, an inline test handler 100 according to an exemplary embodiment of the present invention may include a spin process 1 for rotating a test tray (not shown) and a test process for a semiconductor device housed in the test tray. The plurality of chamber units 110, the sorting unit 120 for performing the loading and unloading process for the semiconductor device, and the conveyor unit 130 for transporting the test tray, and the location of the test tray It may further include a plurality of identification information check unit 102 for checking in real time.
The sorting unit 120 is spaced apart from each of the chamber units 110. The conveyor unit 130 carries the test tray such that the test tray in which the loading process is completed in the sorting unit 120 is performed through at least one of the chamber units 110. In addition, the conveyor unit 130 carries the test tray such that the test tray, which has been completed by the test process through at least one of the chamber units 110, is unloaded from the sorting unit 120. That is, the conveyor unit 130 connects the chamber units 110 and the sorting unit 120 in-line.
Accordingly, the inline test handler 100 according to the present invention may independently perform the test process of the chamber units 11 for the sorting unit 120 to perform the loading process and the unloading process. have. Therefore, the inline test handler 100 according to the present invention can achieve the following effects.
First, since the inline test handler 100 according to the present invention sets the movement path of the test tray so as to minimize the waiting time and the movement time of the test tray before starting the operation, and transfers the test tray according to the set movement path, Time can be minimized.
Second, since the in-line test handler 100 according to the present invention can independently perform the test process for the loading process and the unloading process, any of the chamber units 110 and the sorting unit 120. If one fails, the rest of the working devices can continue to work. Accordingly, the inline test handler 100 according to the present invention prevents the entire system from stopping when a failure occurs in any one of the chamber units 110 and the sorting unit 120, thereby reducing work time. It can prevent.
Third, the in-line test handler 100 according to the present invention allows the semiconductor devices accommodated in the test trays in the chamber units 110 to be tested in the same arrangement with each other by using the spin apparatus 1. It is possible to remove the restriction that the 110 must be installed so that all face the same direction. Accordingly, the inline test handler 100 according to the present invention may improve the ease and freedom of operation of arranging the chamber units 110. In addition, the inline test handler 100 according to the present invention may be implemented in a configuration of minimizing a copper wire for transporting the test tray 200 between the sorting unit 120 and the chamber unit 110.
Fourth, the inline test handler 100 according to the present invention can freely rearrange the chamber unit 110 regardless of the direction when expanding or contracting the process line by adding or removing the chamber unit 110, the process The ease of operation of expanding or contracting the line can be improved.
Fifth, since the sorting unit 120 and the chamber unit 110 are configured as separate devices, the inline test handler 100 according to the present invention reduces the number of devices or devices installed in the sorting unit 120. Can be. Accordingly, the inline test handler 100 according to the present invention may reduce the jam rate for the sorting unit 120. Therefore, the inline test handler 100 according to the present invention increases the operating time for the sorting unit 120 by reducing the time that the sorting unit 120 stops as the jam occurs in the sorting unit 120. You can.
In particular, the chamber unit 110 of the inline test handler 100 according to the present invention includes a control module 101 for determining whether the test tray is loaded or passed in accordance with the state of the chamber unit 110. When the control module 101 determines the state of the chamber unit and determines that the chamber unit 110 can perform a test on the semiconductor device housed in the new test tray, the control module 101 determines the carrying-in of the test tray. If not, it will pass the test tray. Therefore, the inline test handler 100 according to the present invention can achieve the following additional effects.
First, the inline test handler 100 according to the present invention may directly determine whether the chamber unit is to carry or pass the test tray in consideration of the state of the chamber unit 110 during the transfer of the test tray. Therefore, it is possible to adaptively respond to the change in the state of the chamber unit during the transfer of the test tray.
Second, since the inline test handler 100 according to the present invention can adaptively respond to the change in the state of the chamber unit 110 during the transfer of the test tray, it is possible to minimize the work time delay due to the waiting of the test tray.
Hereinafter, each configuration of the inline test handler 100 will be described in more detail. Hereinafter, the control module 101 and the identification information checking unit 102 of the chamber unit 110 which is a feature of the present invention for minimizing the working time will be described first, and then the rest of the configuration will be described.
First, when the arrival of the test tray is detected, the control module 101 determines the state of the chamber unit 110, and as a result of the determination, the control module 101 performs a test on the semiconductor device housed in the test tray where the chamber unit 110 has arrived. If it is determined that it is possible to do so, it is determined to bring in the test tray.
The configuration of the control module 101 of the chamber unit 110 will be described in more detail with reference to FIG. 2B.
Figure 2b is a block diagram schematically showing the configuration of the control module of the chamber unit according to an embodiment of the present invention.
As shown in FIG. 2B, the control module 101 of the chamber unit 110 according to an embodiment of the present invention may include an identification information receiver 103, a first determiner 104, a calculator 105, and a third controller. 2 judgment unit 106, and control command generation unit 107.
First, the identification information receiving unit 103 receives the identification information of the test tray recognized by the identification information confirming unit 102 from the identification information confirming unit 102 matched with the chamber unit 110.
In one embodiment, the identification information of the test tray received by the identification information receiving unit 103 includes the basic ID and COK (Change Over Kit) information of the test tray. In this case, the COK information includes information such as a type of semiconductor device stored in the test tray or a test type (hereinafter, referred to as a 'test type') to be performed on the semiconductor device stored in the test tray.
The identification information receiver 103 extracts the type and the test type of the semiconductor device stored in the test tray from the received identification information, and transmits the type and the test type of the extracted semiconductor device to the first determination unit 104. The first determination unit 104 may determine whether the test is possible.
Next, when the type and test type of the semiconductor device are received from the identification information receiver 103, the first determiner 104 determines whether the corresponding chamber unit 110 supports the test type for the semiconductor device. .
As a result of determination, when it is determined that the chamber unit 110 supports the test type for the semiconductor device, the first determination unit 104 transfers the determination result to the calculation unit 105 to bring in or pass the test tray. To be judged.
If it is determined that the chamber unit 110 does not support the test type for the semiconductor device, the first determination unit 104 transmits the determination result to the control command generation unit 107 so that the semiconductor device is The stored test trays may be transferred to another chamber unit 110 through the corresponding chamber unit 110.
Hereinafter, an operation process of the first determination unit 104 will be briefly described, for example.
For example, when the test type received from the identification information receiving unit 103 is a low temperature test, and the chamber unit 110 includes only a chamber capable of performing a test at a high temperature, the first determination unit 104 determines the semiconductor. It is determined that the test type for the device is not supported, and a result of determining that the test type is not supported for the corresponding chamber unit 110 is transmitted to the control command generation unit 107. On the other hand, when the test type received from the identification information receiving unit 103 is a high temperature test, since the chamber for performing the test at a high temperature is included in the chamber unit 110, the first determination unit 104 corresponds to It is determined that the test type for the semiconductor device is supported, and the determination result is transmitted to the calculator 105.
As described above, the inline test handler 100 according to the present invention first determines whether the test unit 104 supports the test type of the chamber unit 100, and thus, if the test type does not support the test type, the corresponding test tray may be quickly replaced. Passage can be determined, reducing unnecessary latency in the test tray.
Next, when the calculation unit 105 receives a determination result from the first determination unit 104 that the chamber unit 110 supports the test type for the semiconductor device, the test tray waiting for the chamber unit 110 is waiting. The waiting time of the test tray is calculated based on the number of and the average test time required in the chamber unit 110.
To this end, the calculator 105 calculates the number of test trays waiting to be carried in the chamber unit 110 using a counter (not shown) included in the calculator 105.
In one embodiment, the calculator 105 multiplies the number of waiting test trays counted by the counter with the average test time required by the chamber unit 110 to test for the chamber unit 110. The waiting time can be calculated.
The calculator 105 transmits the calculated waiting time to the second determiner 106.
Next, the second determination unit 106 compares the waiting time in the chamber unit 110 calculated by the calculation unit 105 with a predetermined threshold value, and determines whether to carry the test tray into the chamber unit 110. Or finally determine whether to pass.
Specifically, the second determination unit 106 determines to pass the test tray when the waiting time in the chamber unit 110 calculated by the calculation unit 105 exceeds a predetermined threshold. In addition, the second determination unit 106 determines that the test tray is brought into the chamber unit 110 when the waiting time in the chamber unit 110 calculated by the calculation unit 105 is equal to or less than a predetermined threshold value. .
In one embodiment, the predetermined threshold may be variably set according to the number of all test trays (or the number of semiconductor elements) that the inline test handler 100 must process. For example, when the number of all test trays to be processed by the inline test handler 100 is equal to or less than the first reference value, the predetermined threshold may be set to a low value (hereinafter, referred to as a 'minimum value'). In addition, when the number of all the test trays to be processed by the inline test handler 100 is greater than the first reference value and less than or equal to the second reference value, the predetermined threshold value may be set to a value higher than the minimum value (hereinafter, referred to as an intermediate value). . In addition, when the number of all the test trays to be processed by the inline test handler 100 exceeds the second reference value, the predetermined threshold may be set to a value higher than the median (hereinafter, referred to as 'maximum value').
This is because, if the number of all the test trays to be processed by the inline test handler 100 is small, even if the waiting time in the specific chamber unit 110 is long, the waiting time in the other chamber unit 110 may be short, and thus the predetermined threshold value. This is because it may be advantageous in terms of minimizing the work time by allowing the test tray to pass through the specific chamber unit 110 having a long waiting time by setting the minimum value.
In addition, when the number of all the test trays to be processed by the inline test handler 100 is large, the waiting time in most chamber units 110 is likely to be long, so that a predetermined threshold value is set to a maximum value. Even if the waiting time at 110 is long, it may be advantageous in terms of minimizing working time to allow the test tray to be processed in the chamber unit 110.
The second determination unit 106 transmits a determination result regarding whether the test tray is carried in or passed to the control command generation unit 107.
In the above-described embodiment, the first determination unit 104, the calculation unit 105, and the second determination unit 106 has been described as having a separate configuration, but this is only one example, in the modified embodiment The first determining unit 104, the calculating unit 105, and the second determining unit 106 may be integrated into one configuration.
In addition, in the above-described embodiment, the calculation unit 105 calculates the waiting time in the chamber unit 110 by using the number of test trays waiting in the chamber unit 110 and the average test time, and the second The determination unit 106 has been described as determining whether the test tray is loaded or passed by comparing the waiting time with a predetermined threshold.
However, this is only one example, and in the modified embodiment, the calculation unit 105 counts only the number of test trays waiting in the chamber unit 110, and the second determination unit 106 waits for the test. The number of trays may be compared with a predetermined threshold number to determine whether the test tray is loaded or passed.
That is, the second determination unit 106 determines that the test trays are brought into the corresponding chamber unit 110 when the number of waiting test trays calculated by the calculation unit 105 is less than or equal to the threshold number, and the waiting test trays are determined. When the number of times exceeds the threshold number, it may be determined that the test tray is passed.
As such, the inline test handler 100 according to the present invention determines the passage of the test tray within a short time when the waiting time exceeds the threshold even if the chamber unit 110 supports the test type. The time reduction can be maximized.
Next, the control command generation unit 107 generates a control command for the transfer of the test tray according to the determination results from the first determination unit 104 and the second determination unit 106.
In detail, the control command generation unit 107 receives a determination result from the first determination unit 104 that the corresponding chamber unit 110 does not support the test type, or the waiting time is previously received from the second determination unit 104. Upon receiving the determination result that the predetermined threshold is exceeded, a first control command for passing the test tray is generated.
In addition, the control command generation unit 107 receives a second control command for carrying the test tray into the chamber unit 110 when the determination result that the waiting time is less than or equal to the predetermined threshold value is received from the second determination unit 104. Create
The control command generation unit 107 transmits the generated first control command or the second control command to the conveyor unit 130, so that the test tray is connected to the chamber unit 110 according to the first control command. Pass the test tray or allow the test tray to be loaded into the chamber unit 110 according to the second control command.
On the other hand, although not shown in Figure 2b, the control module 102 of the chamber unit 110 may further include a database. In such a database, the average test duration of the test time performed in each chamber unit 110 and the average time of the tests performed for a predetermined period are recorded. The test duration recorded in the database is newly recorded each time a new test is performed, and the average test duration is updated every time a certain period elapses.
As described above, the inline test handler 100 according to the present invention passes or passes the test tray according to its own state whenever the chamber unit 110 receives the identification information of the test tray from the identification information confirming unit 102. Since it can be determined whether or not to, the test tray can adaptively respond to the state change of the chamber unit 110 generated during the transfer, thereby minimizing the delay of the working time.
Referring again to FIG. 2A, the identification information confirming unit 102 is installed at each predetermined point on the inline test handler 100 to recognize identification information of the test tray transferred on the inline test handler 100, and to determine the test tray. Whenever the identification information is recognized, the identification information of the recognized test tray is transferred to the chamber unit 110 matching with the identification information.
In one embodiment, the identification information confirming unit 102 may be installed to match 1: 1 with each chamber unit 110, as shown in Figure 2a. More specifically, the identification information confirming unit 102 may be mounted so as to be connected to each chamber unit 110 by wire or wirelessly at a branch point that may enter the chamber unit 110 on the conveyor unit 130.
The identification information confirming unit 102 may be implemented using an RFID reader, a barcode reader, or a Bluetooth module. According to this embodiment, the test tray may be equipped with an RFID tag, a barcode, or a Bluetooth module including identification information of the test tray.
The spin apparatus 1 is for rotating the test tray in the inline test handler 100. Here, as shown in FIG. 2A, the inline test handler 100 includes a first chamber unit 111 and a second chamber unit 112 spaced apart from each other to face different directions. . The spin apparatus 1 according to the present invention rotates the test tray 200 carried between the first chamber unit 111 and the second chamber unit 112 spaced apart from each other to face different directions. Accordingly, the spin apparatus 1 according to the present invention may be implemented such that the semiconductor devices accommodated in the test tray 200 in the first chamber unit 111 and the second chamber unit 112 are tested in the same arrangement. have.
Hereinafter, the spin apparatus 1 will be described in detail.
First, as shown in FIGS. 3A and 3B, the first chamber unit 111 and the second chamber unit 112 may be spaced apart from each other to face in opposite directions. In this case, unless the test tray 200, which is carried out from the first chamber unit 111 and supplied to the second chamber unit 112, is not rotated, the semiconductor devices accommodated in the test tray 200 are stored in the first chamber. The unit 111 and the second chamber unit 112 are tested in different arrangements. To clearly illustrate this, any one of semiconductor devices 300 of the semiconductor devices accommodated in the test tray 200 is shown as hatched rectangles in FIGS. 3A and 3B.
As shown in FIG. 3A, the test tray 200 is connected to the semiconductor device (111) in the first chamber unit 111 based on the direction in which the first chamber unit 111 is viewed from the front (A arrow direction). The test process is performed with 300) positioned on the upper left side. However, if the test tray 200 carried out from the first chamber unit 111 is not rotated, the second chamber is based on a direction (B arrow direction) facing the second chamber unit 112 from the front. In the unit 112, the test tray 200 may perform a test process with the semiconductor device 300 positioned below the right side. That is, the semiconductor devices accommodated in the test tray 200 are tested in different arrangements in the first chamber unit 111 and the second chamber unit 112.
Accordingly, the sorting unit 120 has a problem in that it is difficult to separate the semiconductor device 300 by grade in performing the unloading process. The grade according to the test process performed in the chamber unit 110 is given based on the coordinates at which the semiconductor device is located, and the semiconductor device 300 is tested at the first coordinate C1 in the first chamber unit 111. This is because the second chamber unit 112 is tested at a second coordinate C2 different from the first coordinate C1. Accordingly, since the grades of the semiconductor devices positioned in the first coordinate C1 in the first chamber unit 111 and the second chamber unit 112 are given to different semiconductor devices, the sorting unit ( 120 may not accurately perform the unloading process.
In order to solve this problem, the spin apparatus 1 according to the present invention tests the semiconductor devices accommodated in the test tray 200 in the first chamber unit 111 and the second chamber unit 112 in the same arrangement. The test tray 200 is rotated so as to.
Accordingly, as shown in FIG. 3B, the test tray 200 is connected to the first chamber unit 111 based on the direction (A arrow direction) facing the first chamber unit 111. The test process is performed with the semiconductor device 300 positioned on the upper left side. In addition, in the second chamber unit 112, the test tray 200 has a corresponding semiconductor element 300 on the left upper side of the second chamber unit 112 based on the direction of looking at the front side of the second chamber unit 112. The test process is performed in the positioned state. That is, the semiconductor device 300 is tested in a state in which the first chamber unit 11 and the second chamber unit 112 are positioned at the same first coordinate C1. As such, the semiconductor devices accommodated in the test tray 200 are tested in the same arrangement in the first chamber unit 111 and the second chamber unit 112.
Therefore, the spin apparatus 1 according to the present invention allows the semiconductor elements accommodated in the test tray 200 in the first chamber unit 111 and the second chamber unit 112 to be tested in the same arrangement, thereby sorting the sorting. The accuracy and ease of the unloading process performed by the unit 120 may be improved. In addition, the spin apparatus 1 according to the present invention can achieve the following effects.
First, the spin apparatus 1 according to the present invention allows the semiconductor devices accommodated in the test tray 200 in the chamber units 110 to be tested in the same arrangement, and thus, the chamber in the inline test handler 100. It is possible to remove the restriction that the units 110 must be installed so that they all face the same direction. Accordingly, the spin apparatus 1 according to the present invention may improve the ease and freedom of the work of arranging the chamber units 110 in the inline test handler 100. In addition, the spin apparatus 1 according to the present invention is arranged in such a way that the inline test handler 100 minimizes the copper wire for transporting the test tray 200 between the sorting unit 120 and the chamber unit 110. Can contribute to implementation.
Second, the spin apparatus 1 according to the present invention, when the in-line test handler 100 adds or removes the chamber unit 110 to expand or contract the process line, regardless of the direction of the chamber unit 110. Since it can be rearranged freely, it is possible to improve the ease of operation to expand or shrink the process line.
Third, the spin apparatus 1 according to the present invention allows the semiconductor devices accommodated in the test tray 200 in the chamber units 110 to be tested in the same arrangement, so that the loading process, the unloading process and the test are performed. In consideration of the time taken to perform each process, the conveyor unit 130 may be implemented to distribute the test tray 200 efficiently regardless of the direction in which the chamber units 110 are installed. Accordingly, the spin apparatus 1 according to the present invention can contribute to improving the equipment operation rate in the inline test handler 100 and reducing the time taken for the loading process, the test process and the sorting process to be completed for the semiconductor device. have.
To this end, the spin apparatus 1 according to the present invention may include the following configuration.
4 to 6, the spin apparatus 1 according to the present invention includes a support mechanism 2 for supporting the test tray 200, and a base mechanism 3 rotatably coupled to the support mechanism 2. And a rotation mechanism 4 (shown in FIG. 6) for rotating the support mechanism 2 to rotate the test tray 200 supported by the support mechanism 2.
The support mechanism 2 supports the test tray 200 (shown in FIG. 4) carried out from the chamber units 110 (shown in FIG. 4). The support mechanism 2 may support the test tray 200 carried out from the first chamber unit 111 (shown in FIG. 4). In this case, the test tray 200 is carried out from the first chamber unit 111 and rotated while being supported by the support mechanism 2, and then the second tray unit 112 (shown in FIG. 4) is rotated. Can be supplied. The support mechanism 2 may support the test tray 200 carried out from the second chamber unit 112. In this case, the test tray 200 may be removed from the second chamber unit 112, rotated while being supported by the support mechanism 2, and then supplied to the first chamber unit 111.
The support mechanism 2 may be installed to be positioned between the first chamber unit 111 and the second chamber unit 112. The support mechanism 2 may connect the first chamber unit 111 and the second chamber unit 112 in-line via the conveyor unit 130 (shown in FIG. 4). For example, the conveyor unit 130 may include a first conveyor mechanism 131 (shown in FIG. 4) connecting the first chamber unit 111 and the sorting unit 120 inline, and the second chamber unit ( 112 may include a second conveyor mechanism 132 (shown in FIG. 4) that connects the sorting unit 120 inline. In this case, the support mechanism 2 is installed between the first conveyor mechanism 131 and the second conveyor mechanism 132, thereby providing the first conveyor mechanism 131 and the second conveyor mechanism 132. You can connect inline. Accordingly, the support mechanism 2 may connect the first chamber unit 111 and the second chamber unit 112 inline.
The support mechanism 2 may include a passage hole 21 through which the test tray 200 passes. By the through hole 21, the support mechanism 2 may be formed in a form in which one side is open. The test tray 200 may be carried into the support mechanism 2 through the through hole 21, and may be carried out from the support mechanism 2.
The support mechanism 2 may include guide members 22 and 22 ′ for guiding the movement of the test tray 200. Both sides of the test tray 200 may be inserted into the guide members 22 and 22 'to move along the guide members 22 and 22'. Accordingly, the spin apparatus 1 according to the present invention provides the accuracy of the process of bringing the test tray 200 into the support mechanism 2 and the process of carrying out the test tray 200 from the support mechanism 2. Can be improved. The guide members 22 and 22 'may also perform a function of supporting the test tray 200 in parallel. The guide members 22 and 22 'may be formed in the form of digital devices.
4 to 6, the base mechanism 3 supports the support mechanism 2. The support mechanism 2 is rotatably coupled to the base mechanism 3. The support mechanism 2 may be rotatably coupled to the base mechanism 3 via a bearing (not shown). The base mechanism 3 is coupled to the body 10. The main body 10 has the support mechanism 2 at a height at which a test tray 200 (shown in FIG. 4) can be transferred between the support mechanism 2 and the conveyor unit 130 (shown in FIG. 4). It can support the base mechanism (3) to be located. The main body 10 includes the base mechanism such that the support mechanism 2 is positioned between the first conveyor mechanism 131 (shown in FIG. 4) and the second conveyor mechanism 132 (shown in FIG. 4). 3) can be supported.
3 to 6, the rotation mechanism 4 is installed in the base mechanism 3. The rotary mechanism 4 may rotate the support mechanism 2. Accordingly, the rotation mechanism 4 may rotate the test tray 200 supported by the support mechanism 2. Accordingly, the rotation mechanism 4 rotates the test tray 200 such that the semiconductor devices accommodated in the test tray 200 are tested in the same arrangement in the first chamber unit 111 and the second chamber unit 112. You can.
The rotating mechanism 4 may be installed to be located below the base mechanism 3. In this case, the base mechanism 3 may be installed to be located between the rotary mechanism 4 and the support mechanism 2. The rotary mechanism 4 may be coupled to the support mechanism 2 through the base mechanism 3. The rotating mechanism 4 is supported by the support mechanism 2 about a rotation axis 4a (shown in FIG. 6) formed in the vertical direction (Z-axis direction) from the base mechanism 3 toward the support mechanism 2. Can be rotated. Accordingly, the rotary mechanism 4 can rotate while maintaining the test tray 200 in a horizontal state.
As shown in FIG. 3B, when the first chamber unit 111 and the second chamber unit 112 are installed to face in opposite directions to each other, the rotating mechanism 4 and 6 shown in FIG. The tray 200 may be rotated 180 degrees. Accordingly, the test tray 100 may be supplied to the second chamber unit 112 in a direction reversed by 180 degrees as compared with when it is carried out from the first chamber unit 111. Therefore, the rotating mechanism 4 may allow the semiconductor devices accommodated in the test tray 200 to be tested in the same arrangement in the first chamber unit 111 and the second chamber unit 112.
Although not shown, when the first chamber unit 111 and the second chamber unit 112 are installed to face different directions at a 90 degree angle, the rotating mechanism 4 rotates the test tray 200 by 90 degrees. Can also be rotated. That is, the rotation mechanism 4 may rotate the test tray 200 at an angle corresponding to the angle formed by the first chamber unit 111 and the second chamber unit 112 in different directions. have. The rotation mechanism 4 may rotate the test tray 200 in a clockwise or counterclockwise direction about the rotation shaft 4a (shown in FIG. 6).
The rotary mechanism 4 may include a motor (not shown) for generating a rotational force for rotating the support mechanism (2). The motor may be directly coupled to the support mechanism 2 to rotate the support mechanism 2. When the motor and the support mechanism 2 are spaced apart from each other by a predetermined distance, the rotation mechanism 4 may further include connecting means for connecting the motor and the support mechanism 2. The connecting means may be a pulley and a belt.
3, 6 to 12, the spin apparatus 1 according to the present invention may further include a transfer mechanism 5 installed in the support mechanism 2 to transfer the test tray 200. have.
The transfer mechanism 5 transfers the test tray 200 carried out from the first chamber unit 111 (shown in FIG. 4) to the support mechanism 2. The transfer mechanism 5 may transfer the test tray 200 carried out from the first conveyor mechanism 131 (shown in FIG. 4) to the support mechanism 2. In this case, the test tray 200 carried out from the first conveyor mechanism 131 is carried out from the first chamber unit 111. When the test tray 200 is supported by the support mechanism 2, the rotary mechanism 4 rotates the support mechanism 2 to rotate the test tray 200 supported by the support mechanism 2.
The transfer mechanism 5 is a test tray from the support mechanism 2 such that the test tray 200 rotated by the rotation mechanism 4 is supplied to the second chamber unit 112 (shown in FIG. 4). Export 200). The transfer mechanism 5 may carry out the test tray 200 rotated by the rotation mechanism 4 to the second conveyor mechanism 132 (shown in FIG. 4). In this case, the test tray 200 carried out from the second conveyor mechanism 131 may be supplied to the second chamber unit 111.
As described above, the spin apparatus 1 according to the present invention tests the semiconductor devices accommodated in the test tray 200 in the first chamber unit 111 and the second chamber unit 112 to be tested in the same arrangement. In addition to rotating the tray 200, a function of transporting the test tray 200 between the first chamber unit 111 and the second chamber unit 112 may be performed. In the above description, a case in which the test tray 200 is carried out from the first chamber unit 111 and supplied to the second chamber unit 112 has been described. However, the transfer mechanism 5 may include the second chamber unit 112. Rotation and transfer may also be performed on the test tray 200 which is carried out from the first tray unit 111 and is supplied to the first chamber unit 111.
3, 6 to 12, the transfer mechanism 5 is an insertion member 51 (shown in FIG. 6) to be inserted into the test tray 200, and the lifting member to which the insertion member 51 is coupled. The member 52 (shown in FIG. 6), the elevating mechanism 53 (shown in FIG. 6) for elevating the elevating member 52, and the drive mechanism 54 for moving the elevating mechanism 53. , As shown in FIG. 6).
The insertion member 51 is formed to protrude from the elevating member 52 in an upward direction (D arrow direction, shown in FIG. 7) from the base mechanism 3 toward the support mechanism 2. When the elevating mechanism 53 raises the elevating member 52, the insertion member 51 is inserted into a transfer groove 210 (shown in FIG. 7) formed in the test tray 200. Accordingly, the test tray 200 is in a state that can be transferred as the insertion member 51 moves. When the elevating mechanism 53 lowers the elevating member 52, the insertion member 51 is separated from the conveying groove 210. Accordingly, the test tray 200 is in a state that can be carried out from the support mechanism 2 to the conveyor unit 130 (shown in FIG. 3B) without being disturbed by the insertion member 51. In addition, the test tray 200 may be transferred from the conveyor unit 130 to the support mechanism 2 without being disturbed by the insertion member 51.
The insertion member 51 may be formed in a cylindrical shape as a whole, but is not limited thereto. If the insertion member 51 is inserted into the transfer groove 210 or may be separated from the transfer groove 210, the insertion member 51 may be formed in another form such as a rectangular parallelepiped. It may be. The transfer mechanism 5 may include a plurality of insertion members 51. In this case, the insertion members 51 may be formed to be spaced apart from each other by a predetermined distance. 6, the transfer mechanism 5 is illustrated as including three insertion members 51, but is not limited thereto. The transfer mechanism 5 may include two or four or more insertion members 51. It may be. The test tray 200 may include a transfer groove 210 having a number approximately equal to the number of the insertion members 51.
The elevating member 52 is coupled to the elevating mechanism 53. The insertion member 51 is coupled to the lifting member 52. Accordingly, when the elevating mechanism 53 raises the elevating member 52, the insertion member 51 is raised together. When the elevating mechanism 53 lowers the elevating member 52, the insertion member 51 is lowered together. The lifting member 52 may include a supporting member 521 to which the insertion member 51 is coupled, and a supporting member 522 for supporting the test tray 200.
The support member 521 is coupled to the lifting mechanism 53. The insertion member 51 is formed in the support member 521 to protrude from the support member 521 in the upper direction (D arrow direction). The support member 521 may be formed in a rectangular plate shape as a whole.
The support member 522 is coupled to the support member 521. The support member 522 is coupled to the support member 521 to protrude from the support member 521 in the upward direction (D arrow direction). The support member 522 supports the side of the test tray 200 supported by the support mechanism 2 when the rotation mechanism 4 rotates the support mechanism 2. The separation by centrifugal force can be prevented. The support member 522 may support the test tray 200 such that the test tray 200 transferred to the support mechanism 2 by the conveyor unit 130 is stopped at the loading position. The loading position is a position where the transfer groove 210 of the test tray 200 is positioned above the insertion member 51. That is, the support member 522 may function as a stopper for the test tray 200 to stop the test tray 200 accurately at the loading position.
The support member 522 and the support member 521 may be integrally formed. By the support member 522 and the support member 521, the lifting member 52 may be formed in the shape of a needle. The support member 522, the support member 521, and the insertion member 51 may be integrally formed.
The lifting mechanism 53 is coupled to the drive mechanism 54. The elevating mechanism 53 may elevate the elevating member 52. The lifting mechanism 53 may insert the insertion member 51 into the transfer groove 210 by raising the lifting member 52 when the test tray 200 is positioned at the carrying position. When the rotating mechanism 4 rotates the support mechanism 2 to rotate the test tray 200 supported by the support mechanism 2, the lifting mechanism 53 lowers the lifting member 52. The insertion member 51 may be separated from the transfer groove 210.
The lifting mechanism 53 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a motor and a rack gear and a pinion gear, etc. The elevating member 52 may be elevated by using a gear method, a belt method using a motor, a pulley, a belt, or the like, or a linear motor using a coil, a permanent magnet, or the like.
The drive mechanism 54 moves the lifting mechanism 53. As the lifting mechanism 53 moves, the lifting member 52 and the insertion member 51 move. The drive mechanism 54 is coupled to the support mechanism 2. The driving mechanism 54 may move the lifting mechanism 53 so that the test tray 200 located at the loading position is transferred to the rotation position. The rotation position is a position where the test tray 200 is located inside the support mechanism 2 and does not protrude from the support mechanism 2. Accordingly, when the rotary mechanism 4 rotates the support mechanism 2, it is possible to prevent the test tray 200 from colliding with another mechanism. When the rotary mechanism 4 rotates the test tray 200 located at the rotational position, the driving mechanism 54 moves the lifting mechanism (the lift mechanism) such that the test tray 200 located at the rotational position is transported to the unloading position. 53) can be moved. The carrying out position is a position where the test tray 200 can be taken out from the support mechanism 2 by the conveyor unit 130.
The drive mechanism 54 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The lifting mechanism 53 may be moved using a linear motor using a method, a coil, a permanent magnet, or the like. The driving mechanism 54 may include an LM Guide Rail and an LM Guide Block for guiding the lifting mechanism 53 to linearly move. The LM guide rail may be coupled to the support mechanism 2. The LM guide block is linearly coupled to the LM guide rail. The lifting mechanism 53 may be coupled to the LM guide block.
As described above, the feed mechanism 5 and the rotation mechanism 4 including the insertion member 51, the lifting member 52, the lifting mechanism 53, and the driving mechanism 54 are as follows. It can work.
First, when the first conveyor mechanism 131 (shown in FIG. 4) carries the test tray 200 to the support mechanism 2, as shown in FIG. 7, the drive mechanism 54 moves the elevator. The sphere 53 is moved toward the first conveyor mechanism 131 (shown in FIG. 4). In this case, the lifting mechanism 53 is in a state in which the lifting member 52 is lowered so that the insertion member 51 does not collide with the test tray 200. The elevating mechanism 53 is provided with the elevating member (a) such that the support member 522 can support the side of the test tray 200 without the insertion member 51 colliding with the test tray 200. 52) height can also be adjusted. Accordingly, the support member 522 may support the test tray 200 such that the test tray 200 stops accurately at the loading position.
Next, when the test tray 200 is located in the loading position, the lifting mechanism 53 raises the lifting member 52 as shown in FIG. 8. Accordingly, the insertion member 51 is inserted into the transfer groove 210.
Next, when the insertion member 51 is inserted into the transfer groove 210, as shown in FIG. 9, the driving mechanism 54 is configured such that the test tray 200 is transferred from the loading position to the rotation position. The lifting mechanism 53 is moved. Accordingly, the test tray 200 is located inside the support mechanism 2 so as not to protrude from the support mechanism 2.
Next, when the test tray 200 is located in the rotation position, the rotary mechanism 4 rotates the support mechanism 2 as shown in FIG. Accordingly, the test tray 200 is rotated in a direction in which the semiconductor devices can be tested in the same arrangement in the first chamber unit 111 and the second chamber unit 112. For example, the rotation mechanism 4 may rotate the support mechanism 2 by 180 degrees about the rotation shaft 4a. While the rotary mechanism 4 rotates the support mechanism 2, the elevating mechanism 53 maintains the elevating member 52 such that the insertion member 51 is inserted into the transfer groove 210. ) Can be kept raised. Accordingly, the insertion member 51 and the support member 522 can prevent the test tray 200 from being separated by the centrifugal force.
Next, when the test tray 200 is rotated, as shown in FIG. 11, the driving mechanism 54 moves the lifting mechanism 53 so that the test tray 200 is transferred from the rotational position to the carrying out position. Let's do it. Accordingly, the test tray 200 is positioned at a position where the second conveyor mechanism 132 (shown in FIG. 3B) can be taken out of the test tray 200 from the support mechanism 2.
Next, when the test tray 200 is located in the carrying out position, as shown in FIG. 12, the lifting mechanism 53 lowers the lifting member 52. Accordingly, the insertion member 51 is separated from the transfer groove 210. When the insertion member 51 is separated from the transfer groove 210, the second conveyor mechanism 132 (shown in FIG. 3B) is a test tray for carrying out the test tray 200 from the support mechanism 2. 200 may be carried.
Next, when the test tray 200 is taken out from the support mechanism 2, as shown in FIG. 7, the rotating mechanism 4 is another test tray from the first conveyor mechanism 131 (shown in FIG. 4). The support mechanism 2 can be rotated so that the 200 can be carried in. The rotary mechanism 4 may stand by without rotating the support mechanism 2 so that another test tray 200 can be loaded from the second conveyor mechanism 132 (shown in FIG. 3B).
6, 13 and 14, the spin apparatus 1 according to the present invention is a projection (6, shown in Figure 13) formed in the support mechanism 2, and the base mechanism (3, Fig. It may further comprise a shock absorbing mechanism (7) coupled to 6).
The projection 6 is formed to protrude from the support mechanism 2 in a downward direction (E arrow direction, shown in FIG. 6) from the support mechanism 2 toward the base mechanism 3. That is, the projection 6 is located between the support mechanism 2 and the base mechanism 3. The protrusion 6 is formed to be positioned in contact with the buffer mechanism 7 when the rotary mechanism 4 stops after rotating the support mechanism 2 to rotate the test tray 200. do. The protrusion 6 may be formed in a rectangular parallelepiped shape as a whole, but is not limited thereto and may be formed in other shapes such as a disc shape as long as the protrusion 6 may contact the buffer mechanism 7.
The shock absorbing mechanism 7 elastically supports the projection 6 in the process of stopping the rotation mechanism 4 after the rotating mechanism 4 rotates the support mechanism 2 and the support mechanism. The impact applied to the test tray 200 supported by (2) can be alleviated. Accordingly, the shock absorbing mechanism 7 may prevent the semiconductor device accommodated in the test tray 200 from being separated from the test tray 200 by vibration, shaking, or the like. The shock absorbing mechanism 7 may include an elastic member (not shown) for elastically supporting the protrusion 6. The elastic member may be a spring. The shock absorbing mechanism 7 is coupled to one surface facing the support mechanism 2 in the base mechanism 3. That is, the shock absorbing mechanism 7 is located between the supporting mechanism 2 and the base mechanism 3.
When the rotating mechanism 4 rotates the test tray 200 supported by the supporting mechanism 2 by 180 degrees, the shock absorbing mechanism 7 rotates by 180 degrees as the supporting mechanism 2 is rotated 180 degrees. The protrusion 6 can be elastically supported. When the rotating mechanism 4 rotates the test tray 200 supported by the supporting mechanism 2 by 90 degrees, the shock absorbing mechanism 7 rotates by 90 degrees as the supporting mechanism 2 is rotated by 90 degrees. It is also possible to elastically support the protrusions 6.
15 to 18, the spin apparatus 1 according to the present invention may further include an elevating unit 8 (shown in FIG. 15) for elevating the support mechanism 2.
The lifting unit 8 may be coupled to the main body 10. The base mechanism 3 may be coupled to the lifting unit 8. Accordingly, the elevating unit 8 can elevate the support mechanism 2 by elevating the base mechanism 3. As the lifting unit 8 lifts and lowers the base mechanism 3, the support mechanism 2, the rotation mechanism 4, and the transfer mechanism 5 may move up and down together.
The lifting unit 8 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The base mechanism 3 can be elevated by using a linear motor or the like using a method, a coil and a permanent magnet. When the lifting unit 8 raises and lowers the base mechanism 3 by using a cylinder method, the base mechanism 3 is coupled to the rod of the cylinder, and thus can be lifted as the rod of the cylinder moves. Although not shown, the lifting unit 8 may be directly coupled to the support mechanism 2 to elevate the support mechanism 2.
Here, the first conveyor mechanism 131 (shown in FIG. 17) and the second conveyor mechanism 132 (shown in FIG. 17) are each a plurality of conveyors 130a (FIG. 17) for carrying a test tray 200. Shown in the figure).
The first conveyor mechanism 131 may include a plurality of conveyors 130a formed to be spaced apart from each other in the vertical direction (Z-axis direction). Accordingly, the first conveyor mechanism 131 may individually transport the plurality of test trays 200 along the plurality of transport paths formed in the vertical direction (Z-axis direction). For example, the first conveyor mechanism 131 may include a conveyor 130a for carrying the test tray 200 along the first transportation path P1 (shown in FIG. 17), and the second transportation path P2 (FIG. 17). It may include a conveyor (130a) for carrying the test tray 200 along the (shown). The second transportation path P2 is formed in a lower direction (E arrow direction) than the first transportation path P1. In this case, the first conveyor mechanism 131 forms the second transportation path P2 even when the conveyor 130a forming the first transportation path P1 stops the test tray 200. The conveyor 130a may be operated to carry the test tray 200.
The second conveyor mechanism 132 may include a plurality of conveyors 130a spaced apart from each other in the vertical direction (Z-axis direction). Accordingly, the second conveyor mechanism 132 may individually transport the plurality of test trays 200 along the plurality of transport paths formed in the vertical direction (Z-axis direction). For example, the second conveyor mechanism 132 may include a conveyor 130a for carrying the test tray 200 along the first transport path P1, and a test tray 200 along the second transport path P2. It may include a conveyor (130a) for transporting. In this case, the second conveyor mechanism 132 forms the second transportation path P2 even when the conveyor 130a forming the first transportation path P1 stops the test tray 200. The conveyor 130a may be operated to carry the test tray 200.
The lifting unit 8 may raise and lower the support mechanism 2 to adjust the height at which the test tray 200 is transferred between the support mechanism 2 and the conveyor unit 130 (shown in FIG. 4). have. In this case, the elevating unit 8 can elevate the support mechanism 2 by elevating the base mechanism 3. Accordingly, the spin apparatus 1 according to the present invention can change the transport path of the test tray 200 carried between the first conveyor mechanism 131 and the second conveyor mechanism 132.
For example, as illustrated in FIG. 17, the test tray 200 transported along the first transport path P1 by the first conveyor mechanism 131 may have a height corresponding to the first transport path P1. It can be conveyed to the positioned support mechanism 2. In this case, the lifting unit 8 is in a state in which the base mechanism 3 is raised so that the support mechanism 2 is positioned at a height corresponding to the first transportation path P1. The test tray 200 includes a support mechanism 2 positioned at a height corresponding to the first transportation path P1 from the conveyor 130a of the first conveyor mechanism 131 forming the first transportation path P1. By being transferred to, it can be supported by the guide member 22 of the support mechanism (2).
When the test tray 200 is supported by the support mechanism 2, the lifting unit 8 adjusts the height of the test tray 200 supported by the support mechanism 2 by elevating the base mechanism 3. Can be. For example, as shown in FIG. 18, the lifting unit 8 may lower the base mechanism 3 so that the support mechanism 2 is positioned at a height corresponding to the second transportation path P2. Accordingly, the test tray T supported by the support mechanism 2 may be lowered to a height corresponding to the second transport path P2. The test tray 200 is a conveyor 130a of the second conveyor mechanism 132 which forms the second transportation path P2 from the support mechanism 2 located at a height corresponding to the second transportation path P2. Can be transferred to. Accordingly, the spin apparatus 1 according to the present invention transfers the transport path of the test tray 200 transferred from the first conveyor mechanism 131 to the second conveyor mechanism 132 in the first transportation path P1. It may be changed to the second transport path (P2) in.
Although not shown, the spin apparatus 1 according to the present invention transfers the transport path of the test tray 200 transferred from the first conveyor mechanism 131 to the second conveyor mechanism 132 in the second transportation path P2. ) May be changed to the first transport path P1. Spin device 1 according to the present invention is the first conveying path (P1) and the first conveying path of the test tray 200 is transferred from the second conveyor mechanism 132 to the first conveyor mechanism (131) It is also possible to change between the two transport paths (P2). In the spin apparatus 1 according to the present invention, the test tray 200 is transported without changing the transport path of the test tray 200 transferred between the first conveyor mechanism 131 and the second conveyor mechanism 132. It may be operable to transfer between the first conveyor mechanism 131 and the second conveyor mechanism 132 while maintaining a path.
Referring back to FIG. 2A, the chamber unit 110 performs the test process. The configuration of the chamber unit 110 will be described in more detail with reference to FIGS. 19 to 21.
The chamber unit 110 may perform the test process by connecting the semiconductor device accommodated in the test tray 200 to the test equipment 400 as shown in FIG. 19. When the test device 400 is electrically connected to the semiconductor device as the semiconductor device is connected, the test device 400 tests the semiconductor device. The test tray 200 may accommodate a plurality of semiconductor devices. In this case, the chamber unit 110 may connect a plurality of semiconductor devices to the test equipment 400, and the test equipment 400 may test a plurality of semiconductor devices. The test equipment 400 may include a hi-fix board.
As shown in FIG. 19, the chamber unit 110 includes a first chamber 110a in which the test process is performed. The test equipment 400 is installed in the first chamber 110a. The test equipment 400 is installed so that some or all of the test equipment 400 is inserted into the first chamber 110a. The test equipment 400 includes test sockets (not shown) to which semiconductor devices stored in the test tray 200 are connected. The test equipment 400 may include a number of test sockets approximately equal to the number of semiconductor devices accommodated in the test tray 200. For example, the test tray 200 may accommodate 64, 128, 256, and 512 semiconductor devices. When the semiconductor devices stored in the test tray 200 are connected to the test sockets, the test equipment 400 may test the semiconductor devices connected to the test sockets. The first chamber 110a may be formed in a rectangular parallelepiped shape in which a portion into which the test equipment 400 is inserted is opened.
As illustrated in FIG. 19, the chamber unit 110 includes a contact unit 110b for connecting the test tray 200 to the test equipment 400. The contact unit 110b is installed in the first chamber 110a. The contact unit 110b connects the semiconductor devices accommodated in the test tray 200 to the test equipment 400. The contact unit 110b may move the semiconductor devices stored in the test tray 200 in a direction closer to or farther from the test equipment 400. When the contact unit 110b moves the semiconductor devices stored in the test tray 200 in a direction closer to the test equipment 400, the semiconductor devices stored in the test tray 200 are transferred to the test equipment 400. Connected. Accordingly, the test equipment 400 may test the semiconductor devices. When the test for the semiconductor devices is completed, the contact unit 110b may move the semiconductor devices accommodated in the test tray 200 in a direction away from the test equipment 400.
The test tray 200 is provided with carrier modules for accommodating semiconductor devices. Each of the carrier modules may accommodate at least one semiconductor device. The carrier modules are elastically movable to the test tray 200 by springs (not shown), respectively. When the contact unit 110b pushes the semiconductor devices accommodated in the test tray 200 in a direction close to the test equipment 400, the carrier modules may move in a direction close to the test equipment 400. When the contact unit 110b removes the force pushing the semiconductor elements stored in the test tray 200, the carrier modules may move away from the test equipment 400 by the restoring force of the spring. While the contact unit 110b moves the carrier modules and the semiconductor devices, the test tray 200 may move together.
Although not shown, the contact unit 110b may include a plurality of contact sockets for contacting the semiconductor devices accommodated in the test tray 200. The contact sockets may contact the semiconductor devices stored in the test tray 200 to move the semiconductor devices, thereby connecting the semiconductor devices to the test equipment 400. The contact unit 110b may include a number of contact sockets approximately equal to the number of semiconductor devices accommodated in the test tray 200. The contact unit 110b is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. It can be moved by a linear motor using a method, a coil and a permanent magnet or the like.
Referring to FIGS. 2A, 20, and 21, the chamber unit 110 may allow the test equipment 400 to test the semiconductor device not only at room temperature but also at high or low temperature. It further includes a chamber 110c and a third chamber 110d.
The second chamber 110c adjusts the semiconductor device accommodated in the test tray 200 to a first temperature. The test tray 200 located in the second chamber 110c is a semiconductor device to be tested by the sorting unit 120, and is conveyed toward the chamber unit 110 by the conveyor unit 130. It is then transferred to the second chamber (110c). The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor device to be tested is tested by the test equipment 400. The second chamber 110c includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the semiconductor device to be tested to the first temperature. When the semiconductor device to be tested is adjusted to the first temperature, the test tray 200 is transferred from the second chamber 110c to the first chamber 110a.
The third chamber 110d adjusts the semiconductor device accommodated in the test tray 200 to a second temperature. The test tray 200 positioned in the third chamber 110d is a semiconductor device tested through the test process, and is transferred from the first chamber 110a. The second temperature is a temperature range including or close to room temperature. The third chamber 110d includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the tested semiconductor device to the second temperature. When the tested semiconductor device is adjusted to the second temperature, the test tray 200 is transferred to the conveyor unit 130.
Although not shown, the chamber unit 110 may include a transfer unit (not shown) for transferring the test tray 200. The transfer means may push the test tray 200 or pull the test tray 200 to transfer. The transfer means may transfer the test tray 200 containing the semiconductor device to be tested from the second chamber 110c to the first chamber 110a. The transfer means may transfer the test tray 200 containing the tested semiconductor device from the first chamber 110a to the third chamber 110d. The conveying means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, a coil, and the like. And the test tray 200 can be transferred using a linear motor using a permanent magnet or the like.
As shown in FIG. 20, the chamber unit 110 may include the second chamber 110c, the first chamber 110a, and the third chamber 110d side by side in a horizontal direction. In this case, the chamber unit 110 may include a plurality of first chambers 110a. A plurality of the first chambers 110a may be stacked up and down.
As shown in FIG. 21, the chamber unit 110 may have the second chamber 110c, the first chamber 110a, and the third chamber 110d stacked in a vertical direction. That is, the second chamber 110c, the first chamber 110a, and the third chamber 110d may be stacked up and down. The second chamber 110c may be installed to be positioned above the first chamber 110a, and the third chamber 110d may be installed to be positioned below the first chamber 110a.
2A, 20, and 21, the chamber unit 110 may include a rotator 110e for rotating the test tray 200 between a horizontal state and a vertical state.
The rotator 110e is installed in the chamber unit 110. The rotator 110e may rotate the test tray 200 containing the semiconductor device to be tested from a horizontal state to a vertical state. Accordingly, the first chamber 110a may perform the test process with respect to the test tray 200 standing in a vertical state. In addition, the sorting unit 120 may perform the loading process on the test tray 200 laid down in a horizontal state. The rotator 110e may rotate the test tray 200 containing the tested semiconductor device from a vertical state to a horizontal state. Accordingly, the sorting unit 120 may perform the unloading process on the test tray 200 laid down in a horizontal state.
The chamber unit 110 may include one rotator 110e, as shown in FIGS. 20 and 21. In this case, the rotator 110e may be installed between the second chamber 110c and the third chamber 110d. The test tray 200 containing the semiconductor device to be tested is rotated to be vertical by the rotator 110e and then transferred from the rotator 110e to the second chamber 110c by the transfer means. have. The test tray 200 in which the tested semiconductor device is accommodated may be rotated to be horizontal by the rotator 110e after being transferred from the third chamber 110d to the rotator 110e by the transfer means. have.
Although not shown, the chamber unit 110 may include a first rotator for rotating the test tray 200 containing the semiconductor device to be tested and a second rotator for rotating the test tray 200 containing the tested semiconductor device. It may also include. The first rotator may be installed to be located inside the second chamber 110c or outside the second chamber 110c. The second rotator may be installed to be located inside the third chamber 110d or outside the third chamber 110d.
Although not shown, the chamber unit 110 may perform a test process on the test tray 200 in a horizontal state without the rotator 110e. In this case, the test tray 200 may be transferred between the second chamber 110c, the first chamber 110a, and the third chamber 110d in a horizontal state to perform the test process.
2A, 3B, and 4, the transfer means may transfer the test tray 200 supported by the conveyor unit 130 to the chamber unit 110. The transfer means may transfer the test tray 200 supported by the conveyor unit 130 to the first chamber 110a. When the chamber unit 110 includes the second chamber 110c, the transfer means may include a test tray 200 supported by the conveyor unit 130 via the second chamber 110c. It can be transferred to one chamber (110a).
The transfer means may transfer the test tray 200 in which the test process is completed, to the conveyor unit 130. The transfer means may transfer the test tray 200 in which the test process is completed, from the first chamber 110a to the conveyor unit 130. When the chamber unit 110 includes the third chamber 110d, the transfer means may include a test tray 200 in which the test process is completed, and the third chamber 110d in the first chamber 110a. It can be transferred to the conveyor unit 130 via.
2A, 3B, and 4, a plurality of chamber units 110 are installed along the conveyor unit 130. The inline test handler 1 according to the present invention includes the first chamber unit 111 and the second chamber unit 112 installed to face different directions.
The first chamber unit 111 is connected inline with the sorting unit 120 by the first conveyor mechanism 131. The transfer means of the first chamber unit 111 may transfer the test tray 200 supported by the first conveyor mechanism 131 to the first chamber 110a (refer to FIG. 19). When the first chamber unit 111 includes the second chamber 110c (shown in FIG. 19), the transport means of the first chamber unit 111 is supported by the first conveyor mechanism 131. The test tray 200 may be transferred to the first chamber 110a (shown in FIG. 19) via the second chamber 110c (shown in FIG. 19).
The transfer means of the first chamber unit 111 may transfer the test tray 200 in which the test process is completed, to the first conveyor mechanism 131. The transfer means of the first chamber unit 111 may transfer the test tray 200 in which the test process is completed from the first chamber 110a (shown in FIG. 19) to the first conveyor mechanism 131. have. When the first chamber unit 111 includes the third chamber 110d (shown in FIG. 19), the transfer means of the first chamber unit 111 may include a test tray 200 in which the test process is completed. May be transferred from the first chamber 110a (shown in FIG. 19) to the first conveyor mechanism 131 via the third chamber 110d (shown in FIG. 19).
The inline test handler 1 according to the present invention may include a plurality of first chamber units 111. In this case, the first chamber units 111 may be installed to be spaced apart from each other in a first axial direction (X-axis direction) along the first conveyor mechanism 131.
2A, 3B, and 4, the second chamber unit 112 is connected inline with the sorting unit 120 by the second conveyor mechanism 132. The transfer means of the second chamber unit 112 may transfer the test tray 200 supported by the second conveyor mechanism 132 to the first chamber 110a (FIG. 19). When the second chamber unit 112 includes the second chamber 110c (shown in FIG. 19), the conveying means of the second chamber unit 112 is supported by the second conveyor mechanism 132. The test tray 200 may be transferred to the first chamber 110a (shown in FIG. 19) via the second chamber 110c (shown in FIG. 19).
The transfer means of the second chamber unit 112 may transfer the test tray 200 in which the test process is completed, to the second conveyor mechanism 132. The transfer means of the second chamber unit 112 may transfer the test tray 200 in which the test process is completed, from the first chamber 110a (shown in FIG. 19) to the second conveyor mechanism 132. have. When the second chamber unit 112 includes the third chamber 110d (shown in FIG. 19), the transfer means of the second chamber unit 112 may include a test tray 200 in which the test process is completed. May be transferred from the first chamber 110a (shown in FIG. 19) to the second conveyor mechanism 132 via the third chamber 110d (shown in FIG. 19).
The inline test handler 1 according to the present invention may include a plurality of the second chamber units 112. In this case, the second chamber units 112 may be installed to be spaced apart from each other in the first axial direction (X-axis direction) along the second conveyor mechanism 132. The second chamber units 112 and the first chamber units 111 may be spaced apart from each other in a second axis direction (Y axis direction) perpendicular to the first axis direction (X axis direction). . In this case, the first conveyor mechanism 131 and the second conveyor mechanism 132 may be installed to be spaced apart from each other in the second axial direction (Y-axis direction). The spin device 1 is located between the first conveyor mechanism 131 and the second conveyor mechanism 132 to connect the first conveyor mechanism 131 and the second conveyor mechanism 132 inline. Can be installed.
The second chamber unit 112 and the first chamber unit 111 may test the semiconductor device in different temperature environments. For example, the first chamber unit 111 may test the semiconductor device in a high temperature environment, and the second chamber unit 112 may be implemented to test the semiconductor device in a low temperature environment. In this case, the conveyor unit 130 carries the test tray 200 toward the first chamber unit 111 so that the semiconductor device is first tested in a high temperature environment, and then a test process is performed from the first chamber unit 111. When the completed test tray 200 is discharged, the semiconductor device may be tested in a low temperature environment by carrying it toward the second chamber unit 112. The conveyor unit 130 carries a test tray 200 toward the second chamber unit 112 so that the semiconductor device is first tested in a low temperature environment, and then a test tray in which the test process is completed from the second chamber unit 112. When 200 is discharged, the semiconductor device may be tested in a high temperature environment by transporting it toward the first chamber unit 111. In this process, the spin apparatus 1 includes the first chamber unit such that the semiconductor elements accommodated in the test tray 200 are tested in the same arrangement in the first chamber unit 111 and the second chamber unit 112. The test tray 200 carried between the 111 and the second chamber unit 112 may be rotated.
2A, 3B, 4, and 22, the sorting unit 120 performs the loading process and the unloading process. The sorting unit 120 is installed to be spaced apart from the chamber units 110. The sorting unit 120 may include a loading unit 121 (shown in FIG. 22) for performing the loading process.
The loading unit 121 transfers the semiconductor device to be tested from the customer tray to the test tray 200. The loading unit 121 may include a loading stacker 1211 (shown in FIG. 22) and a loading picker 1212 (shown in FIG. 22).
The loading stacker 1211 supports the customer tray. The customer tray supported by the loading stacker 1211 contains semiconductor devices to be tested. The loading stacker 1211 may store a plurality of customer trays containing semiconductor devices to be tested. The customer trays may be stacked up and down and stored in the loading stacker 1211.
The loading picker 1212 may pick up the semiconductor device to be tested from the customer tray located in the loading stacker 1211 and store it in the test tray 200. When the semiconductor device to be tested is accommodated in the test tray 200, the test tray 200 may be positioned at a loading position 121a (shown in FIG. 22). The loading picker 1212 may transfer the semiconductor device to be tested while moving in the first axis direction (X axis direction) and the second axis direction (Y axis direction). The loading picker 1212 may move up and down.
The loading unit 121 may further include a loading buffer 1213 (shown in FIG. 22) to temporarily receive the semiconductor device to be tested. In this case, the loading picker 1212 picks up the semiconductor device to be tested from the customer tray, and then, the test tray 200 located at the loading position 121a via the loading buffer 1213. Can be stored in. The loading picker 1212 may include a first loading picker 1212a (shown in FIG. 22) for transferring the semiconductor device to be tested from the customer tray to the loading buffer 1213, and the loading buffer 1213. The second loading picker 1212b (shown in FIG. 22) may be included in the test tray 200.
Although not shown, the loading unit 121 may include a loading transfer means for transferring the test tray 200. The loading transfer means may transfer the test tray 200 or by pulling the test tray 200. The loading transfer means may transfer the test tray 200 in which the loading process is completed, to the conveyor unit 130 at the loading position 121a. The loading transfer means may transfer the empty test tray 200 from the conveyor unit 130 to the loading position 121a. The loading transfer means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, The test tray 200 may be transferred using a linear motor using a coil and a permanent magnet.
2A, 3B, 4, and 22, the sorting unit 120 may include an unloading unit 122 (shown in FIG. 22) for performing the unloading process.
The unloading unit 122 separates the tested semiconductor device from the test tray 200 and transfers it to the customer tray. The unloading unit 122 may include an unloading stacker 1221 (shown in FIG. 22) and an unloading picker 1222 (shown in FIG. 22).
The unloading stacker 1221 supports the customer tray. The customer tray supported by the unloading stacker 1221 contains the tested semiconductor devices. The unloading stacker 1221 may store a plurality of customer trays containing the tested semiconductor devices. The customer trays may be stacked up and down and stored in the unloading stacker 1221.
The unloading picker 1222 may pick up the tested semiconductor device from the test tray 200 and store it in a customer tray located in the unloading stacker 1221. When the tested semiconductor device is picked up from the test tray 200, the test tray 200 may be located at an unloading position 122a (shown in FIG. 22). The unloading picker 1222 may store the tested semiconductor device in a customer tray corresponding to the grade for each grade according to the test result. The unloading picker 1222 may transfer the tested semiconductor device while moving in the first axis direction (X axis direction) and the second axis direction (Y axis direction). The unloading picker 1222 may move up and down. When the test tray 200 becomes empty as the unloading unit 122 separates all the tested semiconductor devices from the test tray 200, the sorting unit 120 unloads the empty test tray 200. The unit 122 may be transferred to the loading unit 121.
The unloading unit 122 may further include an unloading buffer 1223 (shown in FIG. 22) to temporarily receive the tested semiconductor device. In this case, the unloading picker 1222 picks up the tested semiconductor device from the test tray 200 located at the unloading position 122a and passes the picked-up semiconductor device through the unloading buffer 1223. It can be stored in the customer tray. The unloading picker 1222 may include a first unloading picker 1223a (shown in FIG. 22) that transfers the tested semiconductor device from the test tray 200 to the unloading buffer 1223, and the tested semiconductor device. The unloading buffer 1223 may include a second unloading picker 1223b (shown in FIG. 22) transferred to the customer tray.
Although not shown, the unloading unit 122 may include an unloading transport means for transporting the test tray 200. The unloading transfer means may transfer the test tray 200 by pulling the test tray 200 or by pulling the test tray 200. The unloading transfer means may transfer the test tray 200 in which the test process is completed, from the conveyor unit 130 (shown in FIG. 21) to the unloading position 122a. The unloading transfer means may transfer the test tray 200, which is empty as the unloading process is completed, from the unloading position 122a to the conveyor unit 130. The unloading transfer means may transfer the test tray 200, which becomes empty as the unloading process is completed, from the unloading position 122a to the loading position 121a. The unloading transfer means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. The test tray 200 may be transferred using a linear motor using a coil, a permanent magnet, or the like.
Although not shown, the inline test handler 1 according to the present invention may include a plurality of the sorting units 120. In this case, the sorting units 120 may be spaced apart from each other along the conveyor unit 130. According to a modified embodiment of the present invention, the sorting unit 120 may be installed spaced apart from the loading unit 121 and the unloading unit 122. Accordingly, the inline test handler 100 according to the present invention may be implemented to perform the loading process and the unloading process independently of each other. Therefore, the inline test handler 100 according to the present invention can minimize the work time required for each process as the loading process, the unloading process and the test process are performed independently of each other. . The loading unit 121 and the unloading unit 122 may be spaced apart from each other along the conveyor unit 130.
2A, 3B, and 4, the conveyor unit 130 carries the test tray 200 such that the test tray 200 is transferred between the sorting unit 120 and the chamber units 110. do. The conveyor unit 130 carries the test tray 200 such that the test tray 200 discharged from the sorting unit 120 is supplied to the chamber unit 110. The conveyor unit 130 carries the test tray 200 such that the test tray 200 discharged from the chamber unit 110 is supplied to the sorting unit 120. Therefore, the inline test handler 100 according to the present invention circulates the test tray 200 between the sorting unit 120 and the chamber unit 110 installed to be spaced apart from each other through the conveyor unit 130, the test tray The loading process, the test process, and the unloading process may be performed on the semiconductor device accommodated in the 200.
Referring to FIG. 23, the conveyor unit 130 includes a conveyor 130a for carrying the test tray 200. The conveyor 130a may include a plurality of rotating members 130b installed to be spaced apart from each other by a predetermined distance. The conveyor 130a rotates the rotating members 130b about their respective rotation shafts. The test tray 200 may be transported as the rotating members 130b rotate while being supported by the rotating members 130b. The conveyor 130a may rotate the rotating members 130b in a clockwise and counterclockwise direction with respect to their respective rotation shafts. Accordingly, the conveyor 130a may adjust the direction in which the test tray 200 is transported by adjusting the direction in which the rotating members 130b rotate. The rotating members 130b may be formed in a cylindrical shape, respectively.
Although not shown, the conveyor 130a may include a power source for rotating the rotating members 130b about respective rotation shafts. The power source may be a motor. The conveyor 130a may include a connecting means for connecting the rotating shaft of each of the power source and the rotating member 130b. The connecting means may be a pulley and a belt. The conveyor 130a may further include a circulation member (not shown) coupled to surround the rotating members 130b. The test tray 200 is supported by the circulation member. The circulation member may carry the test tray 200 while circularly moving as the rotation members 130b located therein rotate about the respective rotation shafts.
The conveyor 130a includes an installation mechanism 130c for supporting the rotating members 130b. The installation mechanism 130c supports the rotating members 130b such that the test tray 200 supported by the rotating members 130b is positioned at a predetermined height. The installation mechanism 130c has a test tray 200 supported by the rotating members 130b as the chamber unit 110 (shown in FIG. 4) and the sorting unit 120 (shown in FIG. 4). The rotating members 130b are supported to be positioned at a height that can be transferred. The installation mechanism 130c includes a test tray 200 discharged from the chamber units 110 (shown in FIG. 4) and the sorting unit 120 (shown in FIG. 3B) as the rotating members 130b. The rotating members 130b are supported to be positioned at a height that can be transferred.
The conveyor unit 130 may include a plurality of the conveyor (130a). The conveyors 130a are installed adjacent to each other. The test tray 200 may be transported along the conveyors 130a to be transported between the chamber unit 110 (shown in FIG. 4) and the sorting unit 120 (shown in FIG. 4). The conveyors 130a may move the test tray 200 individually while operating individually. For example, while at least one of the conveyors 130a is stopped, the other conveyor 130a may operate to carry the test tray 200. The first conveyor mechanism 131 and the second conveyor mechanism 132 may include a plurality of the conveyor (130a), respectively.
2A and 24, the conveyor unit 130 may include the first conveyor mechanism 131 and the second conveyor mechanism 132.
The first conveyor mechanism 131 connects the sorting unit 120 and the first chamber unit 111 inline. The first conveyor mechanism 131 may include a plurality of conveyors 130a (shown in FIG. 23). When the inline test handler 100 according to the present invention includes a plurality of first chamber units 111, the first chamber units 111 may be installed along the first conveyor mechanism 131. One side of the spin device 1 is connected to the first conveyor mechanism 131. Accordingly, the test tray 200 may be transported between the first conveyor mechanism 131 and the spin apparatus 1.
Although not shown, the first conveyor mechanism 131 may include a first transfer means for transferring the test tray 200. The first transfer means may transfer the test tray 200 or by pulling the test tray 200. The first transfer means may transfer the test tray 200 in which the loading process is completed, to the first chamber unit 111. The first transfer means may carry out the test tray 200 from which the test process is completed, from the first chamber unit 111. The test tray 200 may be transported between the first chamber unit 111 and the first conveyor mechanism 131 by operating a combination of the first transfer means and the transfer means of the first chamber unit 111. Can be.
The first transfer means may transfer the test tray 200 carried out from the first chamber unit 111 to the spin apparatus 1. The first transfer means may carry out the test tray 200 carried out from the second chamber unit 112 from the spin apparatus 1. The test tray 200 is operated by a combination of the first transfer means and the transfer mechanism 5 (shown in FIG. 5) of the spin apparatus 1, thereby providing the first conveyor mechanism 131 and the spin apparatus 1. ) Can be carried between.
The first transfer means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. In addition, the test tray 200 may be transferred using a linear motor using a coil and a permanent magnet, a conveyor method using a roller, a belt, or the like.
The second conveyor mechanism 132 connects the sorting unit 120 and the second chamber unit 112 inline. The second conveyor mechanism 132 may include a plurality of conveyors 130a (shown in FIG. 23). When the inline test handler 100 according to the present invention includes a plurality of second chamber units 112, the second chamber units 112 may be installed along the second conveyor mechanism 132. The second conveyor mechanism 132 and the first conveyor mechanism 131 may be installed to be spaced apart from each other in the second axial direction (Y-axis direction). The other side of the spin device 1 is connected to the second conveyor mechanism 132. Accordingly, the test tray 200 may be transported between the second conveyor mechanism 132 and the spin apparatus 1. The spin apparatus 1 may have one side connected to the first conveyor mechanism 131 and the other side connected to the second conveyor mechanism 132. Accordingly, the test tray 200 may be transported between the first conveyor mechanism 131, the spin apparatus 1, and the second conveyor mechanism 132.
Inline test handler 100 according to the present invention may include a plurality of the spin device (1). In this case, the spin devices 1 are along the first conveyor mechanism 131 and the second conveyor mechanism 132 so as to be located between the first conveyor mechanism 131 and the second conveyor mechanism 132. Can be installed. The spin devices 1 may be installed to be spaced apart from each other in the first axial direction (X-axis direction). Therefore, the inline test handler 100 according to the present invention takes the loading process, the unloading process, and the test process, respectively, regardless of the direction in which the chamber units 110 are installed through the spin devices 1. In consideration of time, the test tray 200 may be efficiently distributed. Accordingly, the inline test handler 100 according to the present invention can improve the equipment operation rate and reduce the time taken for the loading process, the test process and the sorting process to be completed for the semiconductor device.
Although not shown, the second conveyor mechanism 132 may include a second transfer means for transferring the test tray 200. The second transfer means may transfer the test tray 200 or by pulling the test tray 200. The second transfer means may transfer the test tray 200 in which the loading process is completed, to the second chamber unit 112. The second transfer means may carry out the test tray 200 from which the test process is completed, from the second chamber unit 112. The test tray 200 may be transported between the second chamber unit 112 and the second conveyor mechanism 132 by combining the second transfer means and the transfer means of the second chamber unit 112. Can be.
The second transfer means may transfer the test tray 200 carried out from the second chamber unit 112 to the spin apparatus 1. The second transfer means may carry out the test tray 200 carried out from the second chamber unit 112 from the spin apparatus 1. The test tray 200 is operated by a combination of the second transfer means and the transfer mechanism 5 (shown in FIG. 5) of the spin apparatus 1, thereby providing the second conveyor mechanism 132 and the spin apparatus 1. ) Can be carried between.
The second transfer means is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and a belt method using a motor, a pulley and a belt. In addition, the test tray 200 may be transferred using a linear motor using a coil and a permanent magnet, a conveyor method using a roller, a belt, or the like.
2A, 17, and 18, the first conveyor mechanism 131 and the second conveyor mechanism 132 are each a plurality of conveyors 130a formed to be spaced apart from each other in the vertical direction (Z-axis direction). , As shown in FIG. 17).
The first conveyor mechanism 131 may individually transport the plurality of test trays 200 along the plurality of transport paths formed in the vertical direction (Z-axis direction). For example, the first conveyor mechanism 131 may include a conveyor 130a for carrying a test tray 200 along the first transportation path P1 (shown in FIG. 17), and the second transportation path P2 (FIG. And a conveyor 130a for carrying the test tray 200 along the side (shown in FIG. 17). In this case, the first conveyor mechanism 131 forms the second transportation path P2 even when the conveyor 130a forming the first transportation path P1 stops the test tray 200. The conveyor 130a may be operated to carry the test tray 200.
The second conveyor mechanism 132 may individually transport the plurality of test trays 200 along the plurality of transport paths formed in the vertical direction (Z-axis direction). For example, the second conveyor mechanism 132 may include a conveyor 130a for carrying the test tray 200 along the first transport path P1, and a test tray 200 along the second transport path P2. It may include a conveyor (130a) for transporting. In this case, the second conveyor mechanism 132 forms the second transportation path P2 even when the conveyor 130a forming the first transportation path P1 stops the test tray 200. The conveyor 130a may be operated to carry the test tray 200.
The inline test handler 100 according to the present invention transfers a test tray 200 from the conveyor unit 130 to the chamber unit 110, or transfers a test tray 200 from the chamber unit 110 to the conveyor unit. When transferring to 130, the test tray 200 may be transferred using the first transport path P1. The inline test handler 100 according to the present invention avoids the test tray 200 in which another test tray 200 is waiting when there is a test tray 200 waiting in the first transport path P1. The test tray 200 may be transferred using the second transportation path P2 to move.
When the inline test handler 100 according to the present invention transfers the test tray 200 passing through the first chamber unit 111 directly to the sorting unit 120 without passing through the second chamber unit 112. In addition, the test tray 200 may be transferred using the second transportation path P2. When the inline test handler 100 according to the present invention transfers the test tray 200 which has passed through the second chamber unit 112 directly to the sorting unit 120 without passing through the first chamber unit 111. In addition, the test tray 200 may be transferred using the second transportation path P2. In this case, the spin apparatus 1 may change a transport path of the test tray 200 transported between the first conveyor mechanism 131 and the second conveyor mechanism 132.
Hereinafter, a test tray transfer control method in an inline test handler according to the present invention will be described with reference to FIG. 25.
25 is a flowchart illustrating a method of controlling an inline test handler according to an embodiment of the present invention. The control method shown in FIG. 25 is a method of controlling an inline test handler having the configuration as shown in FIG. 2A, and firstly, identification is provided on a branch point where the chamber unit 110 may enter the corresponding chamber unit 110. The identification information of the test tray in which the semiconductor device to be tested is stored is received from the information checking unit 102 (S2500).
In one embodiment, the identification information of the test tray includes a basic ID and COK information of the test tray, and the type of semiconductor device housed in the test tray or the semiconductor device housed in the test tray. Information such as the type of test to be performed is included.
Thereafter, the chamber unit 110 extracts the type and the test type of the semiconductor device from the received identification information (S2510).
Next, the chamber unit 110 determines whether to support the test type for the semiconductor device based on the type and the test type of the extracted semiconductor device (S2520).
As a result of the determination, when the test type for the semiconductor device is not supported, the chamber unit 110 generates a control command for passing the test tray (S2530).
For example, when the test type is a low temperature test and the chamber unit 110 includes only a chamber capable of performing the test at a high temperature, the chamber unit 110 determines that the test type for the semiconductor device is not supported. In other words, it generates control commands to pass the test tray.
On the other hand, if it is determined in S2520 that it supports the test type for the semiconductor device, the chamber unit 110 counts the number of test trays waiting in the chamber unit 110 (S2540), and the test trays waiting. The waiting time in the chamber unit 110 is calculated using the number and the average test time required in the chamber unit 110 (S2550).
For example, when the test type is a high temperature test and the chamber unit 110 includes a chamber capable of performing the test at a high temperature, the chamber unit 110 determines that the test unit supports the test type for the semiconductor device, and thus the test tray. It will be finally determined whether or not to be carried into the chamber unit 110.
In one embodiment, the average test duration is a value obtained by averaging the time required for the tests performed for a certain period, and is updated every time a certain period elapses.
Subsequently, the chamber unit 110 determines whether the waiting time calculated in S2550 is equal to or less than a predetermined threshold (S2560), and if it is less than or less, generates a control command for carrying the test tray into the chamber unit (S2570). On the other hand, the chamber unit 110 generates a control command for passing the test tray when the waiting time calculated as a result of the determination of S2560 exceeds a predetermined threshold (S2530).
In one embodiment, the predetermined threshold may be variably set according to the number of all test trays (or the number of semiconductor elements) that the inline test handler 100 must process. For example, when the number of all test trays to be processed by the inline test handler 100 is equal to or less than the first reference value, the predetermined threshold may be set to a low value (hereinafter, referred to as a 'minimum value'). In addition, when the number of all the test trays to be processed by the inline test handler 100 is greater than the first reference value and less than or equal to the second reference value, the predetermined threshold value may be set to a value higher than the minimum value (hereinafter, referred to as an intermediate value). . In addition, when the number of all the test trays to be processed by the inline test handler 100 exceeds the second reference value, the predetermined threshold may be set to a value higher than the median (hereinafter, referred to as 'maximum value').
This is because, if the number of all the test trays to be processed by the inline test handler 100 is small, even if the waiting time in the specific chamber unit 110 is long, the waiting time in the other chamber unit 110 may be short, and thus the predetermined threshold value. This is because it may be advantageous in terms of minimizing the work time by allowing the test tray to pass through the specific chamber unit 110 having a long waiting time by setting the minimum value.
In addition, when the number of all the test trays to be processed by the inline test handler 100 is large, the waiting time in most chamber units 110 is likely to be long, so that a predetermined threshold value is set to a maximum value. Even if the waiting time at 110 is long, it may be advantageous in terms of minimizing working time to allow the test tray to be processed in the chamber unit 110.
Thereafter, the conveyor unit 130 carries in or passes the test tray to the chamber unit according to the control command generated in S2530 and S2570 (S2580).
In the above-described embodiment, the waiting time in the chamber unit 110 is calculated using the number of test trays waiting for the chamber unit 110 and the average test time, and the waiting time is compared with a predetermined threshold value. It has been described as determining whether the test tray is carried or passed.
However, in the modified embodiment, the chamber unit 110 counts only the number of test trays waiting in the chamber unit 110, and carries or passes the test trays by comparing the number of waiting test trays with a predetermined threshold number. You can also determine whether or not.
Specifically, the chamber unit 110 determines that the test trays are brought into the chamber unit 110 when the number of waiting test trays is less than or equal to the threshold number, and when the number of waiting test trays exceeds the threshold number, the test trays are removed. It can be judged to pass.
The above-described inline test handler control method may be implemented in the form of a program that can be executed using various computer means. In this case, the program for performing the inline test handler control method may include a hard disk, a CD-ROM, a DVD, a ROM ( ROM), RAM, or flash memory, such as a computer readable recording medium.
Those skilled in the art to which the present invention pertains will understand that the above-described present invention can be implemented in other specific forms without changing the technical spirit or essential features.
Therefore, it is to be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.
