KR101029064B1 - Apparatus for Transferring Semiconductor chips and Test Handler having the same - Google Patents

Abstract

According to an embodiment of the present invention, a plurality of first moving members coupled to a plurality of pickers for adsorbing semiconductor elements are movable in an X axis direction, and the pickers coupled to the first moving members are movable to a Y axis direction perpendicular to the X axis direction. A second moving member to be movable, a first interval adjusting part to adjust a distance to which the first moving members are moved in the Y-axis direction, respectively, and the second moving members to be movable A semiconductor device transfer device and a test handler including the same, which includes a second gap adjusting unit coupled to adjust a distance that the second moving members move in the X-axis direction, respectively.

According to the present invention, it is possible to precisely control the distance between semiconductor devices with a simple structure and to reduce the time required for the loading process and the unloading process by transferring more semiconductor devices in a short time.

Semiconductor device, picker, loading process, unloading process, test handler

Description

Apparatus for Transferring Semiconductor chips and Test Handler having the same}

The present invention relates to a handler for connecting semiconductor devices to be tested to test equipment and classifying the tested semiconductor devices according to test results.

Memory or non-memory semiconductor devices (hereinafter referred to as "semiconductor devices") are manufactured through various test procedures. The equipment used in this test is the handler.

The handler is connected to a separate test equipment for testing the semiconductor device. The test equipment includes a high fix board having a plurality of test sockets to which semiconductor devices are connected. The high fix board is coupled to the handler.

The handler performs a loading process, a test process, and an unloading process by using a test tray provided with a plurality of sockets for accommodating semiconductor devices.

The semiconductor devices to be tested in the customer tray are transferred from the customer tray to the test tray through the loading buffer through the loading process. Transfer of the semiconductor devices to be tested in the loading process is performed by a semiconductor device transfer device. The semiconductor element transfer device includes a picker capable of adsorbing a semiconductor element.

The semiconductor device transfer device picks up the semiconductor devices to be tested from the customer tray containing the semiconductor devices to be tested and stores them in the loading buffer. The semiconductor device transfer device picks up the semiconductor devices to be tested in the loading buffer and stores them in a test tray.

The handler includes a semiconductor device transfer device for transferring semiconductor devices from the loading buffer to a test tray, in addition to the semiconductor device transfer device for transferring semiconductor devices from the customer tray to the loading buffer. That is, the handler includes a plurality of semiconductor element transfer devices used in the loading process.

The semiconductor devices to be tested which are stored in the test tray after the loading process are connected to the test sockets through the test process. The test equipment tests semiconductor devices connected to the test sockets to determine electrical characteristics of the semiconductor devices.

The handler includes a plurality of chambers capable of heating or cooling the semiconductor devices so that the test equipment can determine whether the semiconductor devices operate normally in extreme environments of high or low temperature as well as at room temperature.

The semiconductor devices tested through the test process are transferred from the test tray to the customer tray through the unloading buffer through the unloading process. Transfer of the semiconductor devices tested in the unloading process is performed by a semiconductor device transfer device.

The semiconductor device transfer device picks up the tested semiconductor devices from a test tray in which the tested semiconductor devices are stored and stores them in an unloading buffer. The semiconductor device transfer device picks up the semiconductor devices tested in the unloading buffer and stores them in a customer tray corresponding to the class according to the test result.

The handler includes a semiconductor device transfer device for transferring semiconductor devices from the unloading buffer to a customer tray, in addition to the semiconductor device transfer device for transferring semiconductor devices from the test tray to the unloading buffer. That is, the handler includes a plurality of semiconductor element transfer devices used in the unloading process.

Here, the semiconductor devices are stored at different intervals in the customer tray, the buffer unit including the loading buffer and the unloading buffer, and the test tray, respectively. Therefore, the semiconductor device transfer device must adjust the spacing of the semiconductor devices during the loading process and the unloading process.

1 is a schematic diagram illustrating an interval at which semiconductor devices are accommodated in a customer tray, a buffer unit, and a test tray.

Referring to FIG. 1, in the customer tray C, the buffer unit B, and the test tray T, semiconductor elements are spaced apart at different intervals and stored in a matrix.

The semiconductor devices are spaced apart from each other in the customer tray C at intervals of C1 in the X-axis direction and spaced at intervals of C2 in the Y-axis direction and stored in a matrix.

The semiconductor devices are spaced apart from the buffer unit B at intervals of B1 in the X-axis direction and spaced apart at intervals of B2 in the Y-axis direction to form a matrix.

The semiconductor devices are spaced apart in the test tray T at intervals of T1 in the X-axis direction and spaced apart at intervals of T2 in the Y-axis direction to form a matrix.

The semiconductor devices are spaced apart from each other in the customer tray C at narrower intervals than in the test tray T in the X-axis direction and the Y-axis direction, so that more semiconductor devices are accommodated in one customer tray C. To do this.

The semiconductor devices are spaced apart at a wider interval from the test tray T in the X-axis direction and the Y-axis direction than at the customer tray C, in order to connect the semiconductor devices to the test socket during the test process.

The semiconductor devices may be accommodated in the buffer unit B at the same interval as in the customer tray C in the X axis direction and at the same interval as the test tray T in the Y axis direction. That is, the interval in which the semiconductor elements are accommodated in the customer tray C, the buffer unit B, and the test tray T is C1 = B1 <T1 in the X-axis direction, and C2 <B2 = T2 in the Y-axis direction. Can be achieved.

Accordingly, in the semiconductor device transfer device for transferring the semiconductor devices from the customer tray C to the buffer part B, the gap between the semiconductor devices must be adjusted in the Y-axis direction, and the test tray (B) in the buffer part B is used. In the semiconductor device transport apparatus for transporting semiconductor devices in T), the distance between the semiconductor devices must be adjusted in the X-axis direction.

In addition, the semiconductor element transfer device for transferring the semiconductor element from the test tray (T) to the buffer unit (B) should adjust the distance of the semiconductor element in the X-axis direction, the semiconductor from the buffer unit (B) to the customer tray (C) The semiconductor element transfer device for transferring the element should be adjusted at intervals of the semiconductor element in the Y-axis direction.

Recently, handlers have been developed to classify more semiconductor devices in less time. To this end, the test tray can accommodate a larger number of semiconductor devices, so that a larger number of semiconductor devices can be connected to the test socket at one time.

As the test tray can accommodate a larger number of semiconductor devices, the time taken for the loading process and the unloading process for one test tray may increase. In order to minimize this increase in time, the semiconductor device transfer device should be able to transfer more semiconductor devices in a short time.

However, there is a problem that there is a limit in reducing the time taken for the loading process and the unloading process by using the semiconductor element transfer device as described above.

The present invention has been made to solve the above problems, an object of the present invention can transfer more semiconductor devices in a short time, thereby reducing the time taken for loading and unloading process To provide a feeder and a test handler.

In order to achieve the object as described above, the present invention includes the following configuration.

In accordance with another aspect of the present invention, there is provided a semiconductor device transporting device including: a first moving member having a plurality of pickers for adsorbing semiconductor elements to be movable in an X-axis direction; A second moving member coupled to the first moving member to be movable in a Y axis direction perpendicular to an X axis direction; A first interval adjusting unit coupled to the first moving members to be movable and adjusting a distance at which the first moving members are moved in the Y-axis direction; And a second interval adjusting part to which the second moving members are movably coupled and adjust the distance that the second moving members are moved in the X-axis direction, respectively.

In accordance with another aspect of the present invention, a semiconductor device transfer device includes: a first moving member having a plurality of pickers for adsorbing a semiconductor device to be movable in a first direction; A second movable member coupled to the first movable member to be movable in a second direction perpendicular to the first direction; A first interval adjusting unit coupled to the first movable members so as to be movable and adjusting a distance between the first movable members in the second direction; And a second interval adjusting part to which the second moving members are movably coupled and adjust the distance of the second moving members in the first direction.

The test handler according to the present invention includes a loading unit which performs a loading process for accommodating semiconductor devices to be tested in a test tray; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading unit which separates the semiconductor elements tested in the test tray transferred from the chamber unit, performs an unloading process for classifying them according to a test result, and is installed next to the loading unit; And the semiconductor device transfer device installed in the loading unit.

The test handler according to the present invention includes a loading unit which performs a loading process for accommodating semiconductor devices to be tested in a test tray; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading unit which separates the semiconductor elements tested in the test tray transferred from the chamber unit, performs an unloading process for classifying them according to a test result, and is installed next to the loading unit; And the semiconductor device transfer device installed in the unloading unit.

According to the present invention, the following effects can be achieved.

According to the present invention, the distance between semiconductor devices can be precisely controlled with a simple structure, and the time required for the loading and unloading processes can be reduced by transferring more semiconductor devices in a shorter time.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the semiconductor device transfer apparatus according to the present invention will be described in detail.

2 is a perspective view schematically showing a semiconductor device transfer device according to the present invention, FIG. 3 is a perspective view schematically showing a picker in the semiconductor device transfer device according to the present invention, and FIGS. 4 to 7 are semiconductor device transfer devices according to the present invention. Schematic diagram showing the operation relationship of.

Referring to FIG. 2, the semiconductor device transport apparatus 1 according to the present invention includes a picker 2, a first moving member 3, a second moving member 4, a first interval adjusting part 5, and a first It includes two interval adjusting unit (6).

2 to 4, the picker 2 includes a nozzle 21 capable of absorbing a semiconductor device. The semiconductor device may be adsorbed in contact with the nozzle 21.

The picker 2 may be coupled to the first movable member 3 in a first direction, and may be coupled to the second movable member 4 in a second direction. The second direction is a direction perpendicular to the first direction. The first and second directions may be directions perpendicular to each other on a horizontal plane, or may be directions perpendicular to each other on a vertical plane.

As shown in FIG. 4, the picker 2 may be movably coupled to the first moving member 3 in the X-axis direction, and may be moved to the second moving member 4 in the Y-axis direction. Possibly combined.

The picker 2 may include a first through hole 22 into which the first moving member 3 is inserted and coupled, and a second through hole 23 into which the second moving member 4 is inserted and coupled. . The first through hole 22 may be formed to penetrate the picker 2 in the first direction, and the second through hole 23 may be formed to penetrate the picker 2 in the second direction. Can be.

The picker 2 may be guided to the first moving member 3 coupled to the first through hole 22 and moved in the first direction, and coupled to the second through hole 23. Guided by the second moving member 4 can be moved in the second direction.

The picker 2 is formed in such a way that the first through-hole 22 and the second moving member 4 are formed to be inserted and coupled to the first moving member 3. It may include a second through hole (23). The first through hole 22 and the second through hole 23 may be formed in a cylindrical shape as shown in FIG. 4, and may be formed in various shapes such as a rectangular shape although not shown.

The picker 2 may have the first through hole 22 and the second through hole 23 formed at different heights in a vertical direction (arrow A direction). Accordingly, the first moving member 3 and the second moving member 4 may be prevented from interfering with each other.

The picker 2 may include at least one first protrusion 24 movably coupled to the first moving member 3. The first protrusion 24 may be formed to protrude toward the first through hole 22 at the surface on which the first through hole 22 is formed.

The picker 2 may include at least one second protrusion 25 movably coupled to the second moving member 4. The second protrusion 25 may be formed to protrude toward the second through hole 23 from the surface on which the second through hole 23 is formed.

The picker 2 may be stably moved in the first direction and the second direction without deviating from the movement path by the first protrusion 24 and the second protrusion 25.

2 to 5, a plurality of pickers 2 are coupled to the first moving member 3 to be movable in the first direction. The pickers 2 may be coupled to the first moving member 3 to be movable in the X-axis direction. The first moving member 3 may be formed in a rectangular rod shape that is elongated in the first direction.

The first moving member 3 may include at least one first guide groove 31. The first protrusion 24 may be inserted into the first guide groove 31. The first protrusion 24 may be guided to the first guide groove 31 to move in the first direction. Thus, the pickers 2 can be stably moved in the first direction without deviating from the movement path.

Although not shown, the first moving member 3 may include at least one protrusion, and the picker 2 includes at least one guide groove into which the protrusion of the first moving member 3 is inserted. can do.

2 to 5, the second moving member 4 is coupled to the picker 2 such that the picker 2 is movable in the second direction. The pickers 2 may be coupled to the second moving member 4 to be movable in the Y-axis direction. The second moving member 4 may be formed in a rectangular rod shape that is elongated in the second direction.

The second moving member 4 may include at least one second guide groove 41. The second protrusion 25 may be inserted into the second guide groove 41. The second protrusion 25 may be guided to the second guide groove 41 to move in the second direction. Thus, the pickers 2 can be moved in the second direction without deviating from the movement path.

Although not shown, the second moving member 4 may include at least one protrusion, and the picker 2 includes at least one guide groove into which the protrusion of the second moving member 4 is inserted. can do.

The semiconductor device transfer device 1 includes a plurality of first moving members 3 and a plurality of second moving members 4. Accordingly, the pickers 2 may be coupled to the first moving members 3 and the second moving members 4 to form a matrix, and the first moving members 3 and the first moving members 3 may be formed in a matrix. According to the movement of the second movable member 4, the distance may be adjusted in the first direction and the second direction.

Therefore, since the semiconductor device transfer apparatus 1 according to the present invention can adjust the first and second direction intervals of the semiconductor elements, the semiconductor device transfer device 1 can accommodate the plurality of semiconductor elements in the test tray only by adjusting the interval once. A plurality of semiconductor devices can be stored in the customer tray or the buffer unit only by adjusting the spacing.

2 to 5, a plurality of first moving members 3 are coupled to the first interval adjusting part 5 so as to be movable. The first interval adjusting part 5 may adjust the distance that the first moving member 3 coupled thereto is moved in the second direction, respectively. The first interval adjusting part 5 may adjust the distance that the first moving member 3 is moved in the Y-axis direction, respectively.

The first interval adjusting part 5 may adjust the interval of the first moving member 3 in the second direction. The first interval adjusting part 5 may adjust the distance between the first moving members 3 by adjusting the distances in which the first moving members 3 are respectively moved in the second direction.

The first interval adjusting part 5 may include a plurality of first cam grooves 51 to which the first moving members 3 are movably coupled, respectively. The first cam grooves 51 may be formed at different inclinations in the second direction.

As illustrated in FIG. 2, the first cam grooves 51 may be formed at different inclinations in the Y-axis direction. Each of the first moving members 3 may be moved along the first cam grooves 51 to which the first moving members 3 are coupled, and the distance may be adjusted while moving to different distances according to the inclination of the first cam grooves 51. Can be. The first cam grooves 51 on the left side and the first cam grooves 51 on the right side may be formed symmetrically with respect to the center of the first interval adjusting unit 5.

As shown in FIG. 2, the first interval adjusting part 5 may include the first cam grooves 51 formed to have a wider interval from the upper side to the lower direction (arrow D direction).

Accordingly, the first moving members 3 may be spread at maximum intervals when they are positioned at the lowermost side in the first cam grooves 51, and are positioned at the uppermost side in the first cam grooves 51. Can be narrowed to a minimum interval. The maximum interval may be the same as the interval at which the semiconductor elements are accommodated in the test tray, and the minimum interval may be the same as the interval at which the semiconductor elements are accommodated in the customer tray.

Although not shown, the first interval adjusting part 5 may include the first cam grooves 51 formed to narrow the gap from the upper side to the lower side. Accordingly, the first moving members 3 may be narrowed at a minimum interval when they are positioned at the lowermost side in the first cam grooves 51, and are positioned at the uppermost side in the first cam grooves 51. It can be spread at maximum intervals.

The first interval adjusting part 5 is such that one side of each of the first moving members 3 is movable so that the first lifting plate 5a and the other sides of the first moving members 3 are respectively movable. It may include a second lifting plate (5b) to be coupled. A plurality of first cam grooves 51 are formed in the first elevating plate 5a and the second elevating plate 5b, respectively.

By the first lifting plate 5a and the second lifting plate 5b, the first moving members 3 may be moved at the same distance and height without both sides inclined, and thus the interval may be adjusted. Therefore, the semiconductor device transfer device 1 according to the present invention can accurately adjust the spacing of the semiconductor devices.

2 to 5, a plurality of second moving members 4 are coupled to the second interval adjusting part 6 so as to be movable. The second interval adjusting part 6 may adjust the distance that the second moving members 4 coupled thereto are moved in the first direction, respectively. The second interval adjusting unit 6 may adjust the distance that the second moving member 4 is moved in the X-axis direction, respectively.

The second gap adjusting part 6 may adjust the gap of the second moving members 4 in the first direction. The second interval adjusting part 6 may adjust the distance between the second moving members 4 by adjusting the distance that the second moving members 4 move in the first direction, respectively.

The second interval adjusting part 6 may include a plurality of second cam grooves 61 to which the second moving members 4 are movably coupled, respectively. The second cam grooves 61 may be formed at different inclinations in the first direction.

As shown in FIG. 2, the second cam grooves 61 may be formed at different inclinations in the Y-axis direction. Each of the second moving members 4 may be moved along the second cam grooves 61 to which it is coupled, and the distance may be adjusted while moving to different distances according to the inclination of the second cam grooves 61. Can be. The second cam grooves 61 on the left side and the second cam grooves 61 on the right side may be formed symmetrically with respect to the center of the second gap adjusting unit 6.

As shown in FIG. 2, the second interval adjusting part 6 may include the second cam grooves 61 formed to have a wider interval from the upper side to the downward direction (arrow D direction).

Accordingly, the second moving members 4 may be spread at maximum intervals when they are positioned at the lowermost side in the second cam grooves 61, and are positioned at the uppermost side in the second cam grooves 61. Can be narrowed to a minimum interval. The maximum interval may be the same as the interval at which the semiconductor elements are accommodated in the test tray, and the minimum interval may be the same as the interval at which the semiconductor elements are accommodated in the customer tray.

Although not shown, the second interval adjusting part 6 may include the second cam grooves 61 formed to have a narrower interval from the upper side to the lower side. Accordingly, the second moving members 4 may be narrowed at minimum intervals when the second moving members 4 are positioned at the lowermost side of the second cam grooves 61, and are positioned at the uppermost side of the second cam grooves 61. It can be spread at maximum intervals.

The second interval adjusting part 6 may enable the other side of the third lifting plate 6a and the second moving member 4 to which one side of the second moving member 4 is movably coupled, respectively. It may include a fourth lifting plate (6b) to be coupled. A plurality of second cam grooves 61 are formed in the third elevating plate 6a and the fourth elevating plate 6b, respectively.

By the third lifting plate 6a and the fourth lifting plate 6b, the second moving members 4 may be moved at the same distance and height without both sides being inclined, and thus the interval may be adjusted. Therefore, the semiconductor device transfer device 1 according to the present invention can accurately adjust the spacing of the semiconductor devices.

The first moving members 3 and the second moving members 4 are respectively moved in the second direction and the first direction by the first interval adjusting part 5 and the second interval adjusting part 6. The intervals may be adjusted so that the pickers 2 coupled in a matrix to the first and second movable members 3 and 4 may be disposed in the second and first directions. The interval can be adjusted. The pickers 2 may be spaced apart in the Y-axis direction and the X-axis direction.

This will be described in more detail with reference to FIGS. 6 and 7 as follows.

Referring to FIG. 6, the first gap adjusting part 5 and the second gap adjusting part 6 are formed in the Y-axis direction and the first moving members 3 and the second moving members 4, respectively. The pickers 2 may also be adjusted at maximum intervals by moving them at maximum intervals in the X-axis direction. Accordingly, semiconductor devices adsorbed on the pickers 2 may also be adjusted at maximum intervals.

Referring to FIG. 7, the first gap adjusting part 5 and the second gap adjusting part 6 are formed in the Y-axis direction and the first moving members 3 and the second moving members 4, respectively. The pickers 2 may also be adjusted at minimum intervals by moving them at minimum intervals in the X-axis direction. Accordingly, semiconductor devices adsorbed on the pickers 2 may also be adjusted at minimum intervals.

2 to 7, the semiconductor device transport apparatus 1 according to the present invention may further include a lifting unit 7.

The lifting unit 7 may raise and lower the first interval adjusting part 5 and the second interval adjusting part 6.

The lifting unit 7, as shown in Figure 2, may be coupled to the coupling member (W). The coupling member W is coupled to a gantry for moving the semiconductor device transfer device 1 in the X-axis direction and the Y-axis direction in the test handler. The coupling member (W) may be coupled to the gantry to be lowered.

At least one of the first interval adjusting part 5 and the second interval adjusting part 6 may be coupled to the coupling member W so as to be lifted and lowered. In this case, at least one of the first interval control unit 5 or the second interval control unit 6, as shown in Figure 5, at least one EL block may be installed. Although not shown, the coupling member W may be provided with an LG guide rail to which the L block is movably coupled.

The first moving member 3 may be adjusted in the Y-axis direction according to the rising and falling of the first interval adjusting unit 5, the second moving member 4 is the second interval adjusting unit ( The gap may be adjusted in the X-axis direction according to the rising and falling of 6).

The first moving members 3 and the second moving members 4 are respectively moved in the second direction and the second as the first interval adjusting part 5 and the second interval adjusting part 6 move up and down. The gap can be adjusted in the first direction.

The first interval adjusting part 5 and the second interval adjusting part 6 may be combined with each other to move up and down together. In this case, the lifting unit 7 may include a lifting member 71 coupled to any one of the first interval adjusting part 5 or the second interval adjusting part 6. Therefore, the first interval adjusting unit 5 and the second interval adjusting unit 6 may be elevated by one lifting unit 7.

The lifting unit 7 may include a hydraulic cylinder or a pneumatic cylinder. The lifting member 71 is coupled to the rod of the hydraulic cylinder or pneumatic cylinder can be raised and lowered according to the movement of the rod.

The lifting unit 7 may include a motor, a ball screw rotated by the motor. In this case, the elevating member 71 may be elevated according to the rotation of the ball screw including a fastening hole (71a) is fastened to the ball screw.

The lifting unit 7 may include a motor, a driving pulley and a driven pulley, and a belt connecting the driving pulley and the driven pulley. When the motor rotates the drive pulley, the belt can be moved while the driven pulley rotates together. In this case, the elevating member 71 is coupled to the belt can be raised and lowered according to the movement of the belt.

The first interval adjusting part 5 includes the first lifting plate 5a and the second lifting plate 5b, and the second interval adjusting part 6 includes the third lifting plate 6a and When the fourth lifting plate 6b is included, the first lifting plate 5a, the second lifting plate 5b, the third lifting plate 6a and the fourth lifting plate 6b are mutually different. Can be combined and raised and lowered together.

As shown in FIG. 6, the first elevating plate 5a, the second elevating plate 5b, the third elevating plate 6a, and the fourth elevating plate 6b are coupled to each other to form a rectangular shape. Can be achieved.

When the first elevating plate 5a, the second elevating plate 5b, the third elevating plate 6a and the fourth elevating plate 6b are combined with each other to elevate together, the elevating member 71 ) May be coupled to at least one of the first elevating plate 5a, the second elevating plate 5b, the third elevating plate 6a, and the fourth elevating plate 6b.

Hereinafter, a preferred embodiment of a test handler according to the present invention will be described in detail with reference to the accompanying drawings.

8 is a plan view schematically showing a test handler according to the present invention, FIG. 9 is a schematic view showing a path in which a test tray is moved in a chamber part according to an embodiment of the present invention, and FIG. 10 is a view showing another embodiment of the present invention. A schematic diagram showing a path in which the test tray is moved in the chamber part. In FIG. 9 and FIG. 10, reference numerals denoted in the test tray indicate the configuration of the handler in which the test tray is located.

2 to 8, the test handler 10 according to the present invention includes a loading unit 11, an unloading unit 12, and a chamber unit 13.

The loading unit 11 performs a loading process of accommodating the semiconductor devices to be tested in the test tray T. The above-mentioned semiconductor device transfer device 1 may be installed in the loading unit 11.

The loading unit 11 may include a loading stacker 111.

The loading stacker 111 stores a plurality of customer trays containing semiconductor devices to be tested.

The semiconductor device transfer device 1 performs a loading process on the test tray T located at the loading position 11a. The test tray T is located at the loading position 11a when the semiconductor devices to be tested are accommodated therein. A plurality of semiconductor device transfer devices 1 may be installed in the loading unit 11.

The loading unit 11 includes an X-axis frame 11b and a Y-axis frame 11c. The Y-axis frame 11c is movably coupled to the X-axis frame 11b in the X-axis direction. The above-described semiconductor device transfer device 1 may be installed on the Y-axis frame 11c through the coupling member W. The coupling member (W) is coupled to the Y-axis frame (11c) so as to be movable in the Y-axis direction, and coupled to move up and down. Accordingly, the semiconductor device transfer device 1 may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down.

Therefore, the semiconductor device transfer device 1 picks up the semiconductor devices to be tested from the customer tray located in the loading stacker 111, and transfers the picked-up semiconductor devices to the test tray T located at the loading position 11a. Can be stored in.

Here, in the customer tray and the test tray T located in the loading stacker 111, semiconductor elements are stored in a matrix by being spaced apart at different intervals. As described above, the intervals in which the semiconductor elements stored in the test tray T are spaced apart in the X-axis direction and the Y-axis direction are spaced apart from the semiconductor elements stored in the customer tray in the X-axis direction and the Y-axis direction. Wider

As described above, the semiconductor device transfer device 1 according to the present invention has a Y-axis of pickers 2 coupled in a matrix to the first moving members 3 and the second moving members 4. It can be adjusted at intervals in the direction and X-axis direction.

The semiconductor device transfer device 1 picks up a plurality of semiconductor devices at a time from the customer tray located in the loading stacker 111 after adjusting the pickers 2 to have a minimum distance in the X-axis direction and the Y-axis direction. can do. In addition, the semiconductor device transport apparatus 1 adjusts the pickers 2 to have a maximum distance in the X-axis direction and the Y-axis direction, and then picks up the semiconductor device in the test tray T located at the loading position 11a. You can store them all at once.

Therefore, the test handler 10 according to the present invention can transfer the semiconductor devices directly from the customer tray to the test tray T without passing through the buffer unit, thereby loading more semiconductor devices in a shorter time. Can be done.

The loading unit 11 may further include a loading picker 112 and a loading buffer 113.

The loading picker 112 picks up the semiconductor devices from a customer tray located in the loading stacker 111 and stores the picked up semiconductor devices in a loading buffer 113 that stores the semiconductor devices at the same interval as the customer tray. Can be.

The loading picker 112 may move in the X-axis direction and the Y-axis direction, and may be moved up and down. The loading unit 11 may include a plurality of loading pickers 112.

The loading buffer 113 temporarily stores the semiconductor devices to be tested. The loading unit 11 may include a plurality of loading buffers 113.

As the loading buffer 113 and the loading picker 112 are provided, the semiconductor device transfer device 1 picks up the semiconductor devices from the loading buffer 113, and a test tray located at the loading position 11a. The semiconductor elements picked up in (T) can be accommodated. Therefore, the time taken for the loading process can be further reduced by reducing the distance that the semiconductor device transfer device 1 is moved.

Even when there is no test tray T in the loading position 11a, the loading picker 112 continuously picks up semiconductor devices from a customer tray located in the loading stacker 111, and picks up the semiconductor devices. It may be stored in the loading buffer 113. When the test tray T is positioned at the loading position 11a, the semiconductor device transport apparatus 1 picks up the semiconductor devices to be tested at the loading buffer 113 and performs a test located at the loading position 11a. It can be accommodated in the tray T.

Therefore, the loading process can be continued even when there is no test tray T temporarily in the loading position 11a, thereby preventing the work time from being lost.

The loading buffer 113 may be moved in the Y-axis direction. Although not shown, the loading buffer 113 may be coupled to a belt connecting the plurality of pulleys so that the motor may move as the at least one of the pulleys rotates.

The unloading unit 12 performs an unloading process of separating the tested semiconductor elements stored in the test tray T transferred from the chamber unit 13 and classifying them according to a test result. The unloading part 12 may be installed next to the loading part 11.

The unloading unit 12 may include an unloading stacker 121, an unloading picker 122, and an unloading buffer 123.

The unloading stacker 121 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices are stored in a customer tray corresponding to a test result among customer trays located at different positions for each grade in the unloading stacker 121.

The unloading picker 122 performs an unloading process on the test tray T located at the unloading position 12a. The test tray T is located at the unloading position 12a when the tested semiconductor elements stored therein are separated. As shown in FIG. 8, the loading position 11a and the unloading position 12a may be the same position. Although not shown, the unloading position 12a may be located next to the loading position 11a.

The unloading unit 12 may include a plurality of unloading pickers 122.

The unloading picker 122 includes a first unloading picker 1221 and a second unloading picker 1222.

The first unloading picker 1221 may be coupled to the Y-axis frame 1221a so as to be movable in the Y-axis direction, and may be coupled to move up and down. The Y-axis frame 1221a may be coupled to the X-axis frame 1221b so as to be movable in the X-axis direction.

The semiconductor device transfer device 1 may be used as the first unloading picker 1221. The above-described semiconductor device transfer device 1 may be installed in the Y-axis frame 1221a through the coupling member W. The coupling member W is coupled to the Y-axis frame 1221a so as to be movable in the Y-axis direction, and coupled to a lowering direction. Accordingly, the semiconductor device transfer device 1 may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down.

The first unloading picker 1221 may pick up the semiconductor devices tested in the unloading buffer 123 and accommodate the semiconductor devices picked up in a customer tray located in the unloading stacker 121.

The second unloading picker 1222 may pick up the semiconductor devices from the test tray T located at the unloading position 12a and accommodate the semiconductor devices picked up in the unloading buffer 123. The second unloading picker 1222 may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down. The unloading unit 12 may include a plurality of second unloading pickers 1222. The semiconductor device transfer device 1 may be used as the second unloading picker 1222.

The unloading buffer 123 temporarily stores the tested semiconductor devices. The unloading unit 12 may include a plurality of unloading buffers 123.

The unloading buffer 123 may be moved in the Y-axis direction. Although not shown, the unloading buffer 123 may be coupled to a belt connecting the plurality of pulleys so that the motor may move as the motor rotates at least one of the pulleys.

The unloading buffer 123 may reduce the distance that the first unloading picker 1221 and the second unloading picker 1222 are moved during the unloading process, and thus the handler 1 may be faster. The unloading process can be carried out at speed.

The unloading buffer 123 may accommodate the semiconductor devices at the same interval as that of the customer tray located in the unloading stacker 121. In this case, the semiconductor device transfer device 1 may be used as the second unloading picker 1222.

The unloading buffer 123 may accommodate the semiconductor devices at the same interval as the test tray T located at the unloading position 12a. In this case, the semiconductor device transfer device 1 may be used as the first unloading picker 1221.

The chamber 13 may include a first chamber 131, a test chamber 132, and a second chamber 133 so that the test equipment may test the semiconductor devices not only at room temperature but also at high or low temperature. ).

The first chamber 131 adjusts the semiconductor devices to be tested contained in the test tray T to a first temperature. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor devices to be tested are connected to the high fix board H provided in the test equipment and tested. The test tray T in which the semiconductor devices to be tested are accommodated is a test tray T transferred from the loading unit 11. The test tray T may be a test tray T transferred from the loading position 11a.

At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the first chamber 131 to adjust the semiconductor devices to be tested to a first temperature. The first chamber 131 may move the test tray T in a vertical state therein.

When the semiconductor devices to be tested are adjusted to the test temperature, the test tray T is transferred from the first chamber 131 to the test chamber 132.

The test chamber 132 connects the semiconductor devices adjusted to the first temperature stored in the test tray T to the high fix board H. A part or all of the high fix board H is inserted into the test chamber 132, and a contact unit 1321 is provided to connect the semiconductor devices adjusted to the first temperature to the high fix board H. The test equipment tests the semiconductor devices to determine electrical characteristics of the semiconductor devices to be tested connected to the high fix board H.

The test chamber 132 may be provided with at least one of a heat transfer heater or a liquid nitrogen injection system to maintain the semiconductor devices to be tested at a first temperature. The handler 1 may include a plurality of test chambers 132, and a high fix board H may be installed in each of the plurality of test chambers 132.

When the test for the semiconductor devices is completed, the test tray T is transferred from the test chamber 132 to the second chamber 133.

The second chamber 133 adjusts the tested semiconductor devices stored in the test tray T to a second temperature. The second temperature is a temperature range including at or near room temperature. At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the second chamber 133 to adjust the tested semiconductor elements to a second temperature. The second chamber 133 may move the test tray T in a vertical state therein.

When the tested semiconductor devices are adjusted to the second temperature, the test tray T is transferred from the second chamber 133 to the unloading part 12. The test tray T may be transferred from the second chamber 133 to the unloading position 12a.

As shown in FIG. 9, the first chamber 131, the test chamber 132, and the second chamber 133 may be installed in a horizontal direction. The test chamber 132 may be installed in a plurality of stacked up and down.

As shown in FIG. 10, the first chamber 131, the test chamber 132, and the second chamber 133 may be stacked up and down. In this case, the first chamber 131 may be installed above the test chamber 132, and the second chamber 133 may be installed below the test chamber 132.

The test tray T in which the semiconductor devices tested through the chamber part 13 are accommodated may be transferred to the unloading position 12a. The test tray T in which the semiconductor devices to be tested are accommodated may be transferred to the chamber part 13 at the loading position 11a.

The loading position 11a and the unloading position 12a may be the same position. In this case, a rotator R for rotating the test tray T may be installed at the loading position 11a and the unloading position 12a.

The rotator R rotates the test tray T in which the semiconductor devices to be tested are accommodated, thereby switching from the horizontal state to the vertical state. The rotator R rotates the test tray T in which the tested semiconductor devices are accommodated, thereby switching from the vertical state to the horizontal state.

Accordingly, the test handler 1 may perform a loading process and an unloading process on the test tray T in a horizontal state, and a test process on the test tray T in a vertical state.

The loading position 11a and the unloading position 12a may be different positions. In this case, the loading position 11a and the unloading position 12a may be provided with a rotator R for rotating the test tray T, respectively.

Although not shown in the loading position (11a) and the unloading position (12a), a plurality of pulleys, a belt connecting the pulleys, and a conveying means coupled to the belt to push or pull the test tray (T) for conveyance This can be installed. The transfer means may be installed in the chamber portion 14.

The test handler 1 may further include a transfer unit (not shown).

The transfer unit may transfer the test tray T, which is emptied through the unloading process, from the unloading position 12a to the loading position 11a. Although not shown, the transfer part may include a plurality of pulleys, a belt connecting the pulleys, and a moving member coupled to the belt to push or pull the test tray T.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a schematic view showing the interval at which semiconductor elements are accommodated in a customer tray, a buffer unit, and a test tray;

Figure 2 is a perspective view schematically showing a semiconductor device transfer apparatus according to the present invention

Figure 3 is a perspective view schematically showing a picker in the semiconductor device transfer apparatus according to the present invention

4 to 7 is a schematic diagram showing the operating relationship of the semiconductor device transfer apparatus according to the present invention

8 is a plan view schematically showing a test handler according to the present invention.

Figure 9 is a schematic diagram showing a path in which the test tray is moved in the chamber portion according to an embodiment of the present invention

10 is a schematic view showing a path in which the test tray is moved in the chamber according to another embodiment of the present invention

Claims (14)

A first moving member coupled to a plurality of pickers for adsorbing the semiconductor element to be movable in the X-axis direction; A second moving member coupled to the first moving member to be movable in a Y axis direction perpendicular to an X axis direction; A first interval adjusting unit coupled to the first moving members to be movable and adjusting a distance at which the first moving members are moved in the Y-axis direction; And The second moving member is movably coupled, and includes a second interval adjusting unit for adjusting the distance that the second moving member is moved in the X-axis direction, respectively, The first interval adjusting part includes a plurality of first cam grooves in which the first moving members are movably coupled to each other, wherein the first cam grooves have different inclinations in the Y-axis direction and have a wider interval from the upper side to the lower side. Formed; The second interval adjusting part includes a plurality of second cam grooves to which the second moving members are movably coupled, respectively, wherein the second cam grooves have different inclinations in the X-axis direction and have a wider interval from the upper side to the lower side. A semiconductor element transfer device, characterized in that formed. delete delete The method of claim 1, It further includes a lifting unit for raising and lowering the first interval control unit and the second interval control unit, The first moving members are adjusted in the Y-axis direction according to the lifting and lowering of the first interval adjusting unit, the second moving members are adjusted in the X-axis direction according to the lifting and lowering of the second interval adjusting unit. A semiconductor device transfer device characterized in that. The method of claim 4, wherein The first spacing control unit and the second spacing control unit are combined with each other to move up and down, The elevating unit is a semiconductor device transfer device, characterized in that it comprises a lifting member coupled to any one of the first interval control unit or the second interval control unit. The method of claim 1, The first interval adjusting part is coupled to one side of each of the first moving members, the first lifting plate having the first cam grooves formed therein, and the other side of the first moving members coupled to the first cam groove formed therein. Including 2 platform The second interval adjusting part includes a third lifting plate on which one side of the second moving members is coupled and the second cam grooves are formed, and the other side of the second moving members are respectively coupled, and the second cam grooves are formed. Including 4 platform The first elevating plate, the second elevating plate, the third elevating plate, and the fourth elevating plate are combined with each other to lift up and down, The semiconductor device transfer apparatus further includes a lifting unit having a lifting member coupled to at least one of the first lifting plate, the second lifting plate, the third lifting plate, and the fourth lifting plate. Semiconductor element transfer device. The method of claim 1, The picker has a first through hole into which the first moving member is inserted and coupled, and a second through hole into which the second moving member is inserted and coupled. And the first through hole and the second through hole are formed at different heights in the vertical direction. The method of claim 7, wherein The first moving member includes at least one first guide groove, The second moving member includes at least one second guide groove, The picker includes at least one first protrusion movably coupled to the first guide groove and at least one second protrusion movably coupled to the second guide groove. A first moving member coupled to a plurality of pickers for adsorbing a semiconductor element to be movable in a first direction; A second movable member coupled to the first movable member to be movable in a second direction perpendicular to the first direction; A first interval adjusting unit coupled to the first movable members so as to be movable and adjusting a distance between the first movable members in the second direction; And The second moving members are movably coupled to each other, and include a second gap adjusting part configured to adjust a distance between the second moving members in the first direction, The first interval adjusting part includes a plurality of first cam grooves to which the first moving members are movably coupled, respectively, wherein the first cam grooves form different inclinations in the second direction and have a wider interval from the upper side to the lower side. Formed in a fork; The second interval adjusting part includes a plurality of second cam grooves to which the second moving members are movably coupled, respectively, wherein the second cam grooves form different inclinations in the first direction and have a wider interval from the upper side to the lower side. A semiconductor device transfer device, characterized in that the fork is formed. delete delete A loading unit performing a loading process for accommodating the semiconductor devices to be tested into a test tray; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading unit which separates the semiconductor elements tested in the test tray transferred from the chamber unit, performs an unloading process for classifying them according to a test result, and is installed next to the loading unit; And A test handler comprising the semiconductor device transfer apparatus of any one of claims 1, 4, 5, 6, 7, 8, and 9 installed in the loading unit. The method of claim 12, The loading unit includes a loading buffer for storing the semiconductor elements at the same interval as the customer tray and a loading picker for transferring the semiconductor elements from the customer tray to the loading buffer. The semiconductor device transfer device is installed in the loading unit, the test handler, characterized in that for transferring the semiconductor devices to the test tray located in the loading position from the loading buffer. A loading unit performing a loading process for accommodating the semiconductor devices to be tested into a test tray; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading unit which separates the semiconductor elements tested in the test tray transferred from the chamber unit, performs an unloading process for classifying them according to a test result, and is installed next to the loading unit; And Claim 1, 4, 5, 6, 7, 8, 9, characterized in that it comprises a semiconductor device transfer device installed in the unloading unit. Test handler.

Images