Hereinafter, with reference to the accompanying drawings a preferred embodiment of the test tray replacement apparatus according to the present invention will be described in detail.
2 to 7, the test tray replacement apparatus 1 according to the present invention is installed in the inline test handler 100. The inline test handler 100 includes a plurality of chamber units 110 in which a test process is performed on a semiconductor device stored in the test tray 200, and a conveyor unit 120 carrying the test tray 200.
The chamber units 110 connect the semiconductor devices accommodated in the test tray 200 to the test equipment 400, respectively. When the semiconductor device is connected to the test equipment 400, the test equipment 400 performs a test process for testing the semiconductor device.
The conveyor unit 120 carries the test tray 200 such that the test tray 200 in which the loading process is completed passes through at least one of the chamber units 110. In addition, the conveyor unit 120 carries the test tray 200 such that the unloading process is performed on the test tray 200 in which the test process is completed through at least one of the chamber units 110. That is, the conveyor unit 120 carries the test tray 200 along a transport path (MP, shown in FIG. 2), thereby connecting the chamber units 110 in an in-line.
Here, the inline test handler 100 performs the test process using the test tray 200 which differs according to the semiconductor device. For example, when testing a first semiconductor device formed of a first size, the inline test handler 100 may use a first test tray 210 that can accommodate the first semiconductor device. When testing a second semiconductor device formed of a second size smaller than the first size, the inline test handler 100 may use a second test tray 220 that can accommodate the second semiconductor device. . The inline test handler 100 may use the test tray 200 corresponding to the semiconductor device according to at least one of the size of the semiconductor device, the number of semiconductor devices connected to the test equipment 400 at one time, and the type of semiconductor device. Can be.
The test tray replacement apparatus 1 according to the present invention includes a first test tray corresponding to a semiconductor element before the change from the conveyor unit 120 when the semiconductor element is changed in the inline test handler 100. 210 is collected and the second test tray 220 corresponding to the semiconductor device after the change is supplied to the conveyor unit 120. That is, the test tray replacement apparatus 1 according to the present invention may replace the first test tray 210 with the second test tray 220.
Therefore, the test tray replacement apparatus 1 according to the present invention can achieve the following effects.
First, when the semiconductor device is changed, the test tray replacement apparatus 1 according to the present invention may replace the existing test tray 200 with the test tray 200 corresponding to the changed semiconductor device, and thus the semiconductor device may be changed. It can improve your responsiveness.
Second, the test tray replacement apparatus 1 according to the present invention is implemented to replace the existing test tray 200 with the test tray 200 for the changed semiconductor device even when the inline test handler 100 is not stopped. By doing so, it is possible to increase the operation rate for the inline test handler 100. Therefore, the test tray replacement apparatus 1 according to the present invention can improve the productivity of the tested semiconductor device by reducing the time taken for the semiconductor device to be classified according to the grade according to the test result after the test.
To this end, the test tray replacement apparatus 1 according to the present invention includes a main body 2 installed on the conveyor unit 120, a first elevating unit 3 for elevating the test tray 200, and the main body 2. And a carrying unit 4 for carrying out the test tray 200 from, and a carrying unit 5 for carrying the test tray 200 into the main body 2. When the first test tray 210 is replaced with the second test tray 220, the test tray replacement apparatus 1 according to the present invention may operate as follows.
First, as shown in FIG. 4, the first elevating unit 3 raises the first test tray 210 located in the transport path MP to a transport position TP located above the transport path. Let's do it.
Next, as shown in FIG. 5, the carrying unit 4 moves the first test tray 210 located at the transfer position TP to move the first test tray 210 to the main body 2. Export from
Next, when the first test tray 210 is taken out, the loading unit 5 is different from the first test tray 210 (shown in FIG. 5) as shown in FIG. 6. ) Moves the second test tray 220 to the transfer position TP such that the second test tray 220 is supported by the first lifting unit 3.
Next, as shown in FIG. 7, the first lifting unit 3 moves the second test tray 220 to the transport path MP so that the second test tray 220 is supported by the conveyor unit 120. Descend to).
Accordingly, the inline test handler 100 may perform a test process on the changed semiconductor device using the second test tray 220 carried by the conveyor unit 120.
Therefore, the test tray replacement apparatus 1 according to the present invention can not only improve the responsiveness to the change of the semiconductor device, but also increase the productivity of the tested semiconductor device by increasing the operation rate of the inline test handler 100. Can improve.
Hereinafter, the main body 2, the first lifting unit 3, the carrying out unit 4 and the carrying in unit 5 will be described in detail with reference to the accompanying drawings.
2 to 7, the main body 2 is installed in the conveyor unit 120. The main body 2 may be coupled to the conveyor unit 120 to be positioned above the conveyor unit 120. The main body 2 supports the first lifting unit 3, the carrying unit 4 and the carrying unit 5. The main body 2 may be installed on the conveyor unit 120 to be located between the chamber units 110. Although not shown, the main body 2 may be installed in the conveyor unit 120 to be located in front of the chamber unit 110 located at the foremost of the chamber units 110. The main body 2 may be formed in a hollow rectangular parallelepiped shape as a whole, but is not limited thereto and may be formed in another shape as long as the test tray 200 may be positioned therein.
2 to 8, the first lifting unit 3 is coupled to the main body 2. The first elevating unit 3 raises the first test tray 210 positioned in the transport path MP to the transport position TP. As a result, the first test tray 210 is spaced apart from the conveyor unit 120, thereby switching to a state in which the first test tray 210 can be carried out from the main body 2. The first lifting unit 3 may include a first lifting member 31 and a first lifting mechanism 32.
The first elevating member 31 is coupled to the main body 2 to be elevated. The first elevating member 31 may support the first test tray 210 carried out from the main body 2. The first test tray 210 ascends from the transport path MP to the transport position TP in a state supported by the first elevating member 31, and then the main body 2 by the discharging unit 4. Can be taken out. The first elevating member 31 may support the second test tray 220 carried into the main body 2. After the second test tray 220 is supported by the first elevating member 31 as it is carried into the main body 2 by the carrying unit 5, the first elevating member 31 is lowered. Accordingly, it can be supported by the conveyor unit 120 by descending to the transport path (MP) in the transport position (TP).
The first elevating member 31 may include a first guide member 311. The first guide member 311 may guide the first test tray 210 to move in a straight line while the first test tray 210 is taken out of the main body 2. The first guide member 311 may guide the second test tray 220 to move in a straight line while the second test tray 220 is carried into the main body 2. The first guide member 311 may be formed in a needle-shaped shape as a whole. The first guide member 311 may be installed to face in a direction perpendicular to the direction in which the conveyor unit 120 carries the test tray 200.
The first elevating mechanism 32 elevates the first elevating member 31. The first elevating mechanism 32 raises the first elevating member 31 while the first elevating member 31 supports the first test tray 210, thereby raising the first test tray 210. ) Can be raised to the transfer position (TP). The first elevating mechanism 32 lowers the first elevating member 31 while the first elevating member 31 supports the second test tray 220, thereby lowering the second test tray 220. ) Can be lowered to the transport path (MP). When the conveyor unit 120 carries the test tray 200 along the transport path MP such that the conveyor unit 120 passes through the test tray replacement device 1 according to the present invention, the first lifting mechanism 32 may be configured as the first lifting mechanism 32. The first elevating member 31 may raise the first elevating member 31 so as to avoid the test tray 200 carried along the carrying path MP. Accordingly, the conveyor unit 120 may continuously carry the test tray 200 along the transport path MP without being disturbed by the first elevating member 31.
The first lifting mechanism 32 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a motor, a rack gear and a pinion gear, and the like. The first elevating member 31 may be elevated by using a gear method using a motor, a belt method using a motor, a pulley, a belt, and the like, and a linear motor using a coil and a permanent magnet. The first elevating mechanism 32 may be coupled to the main body 2. The first elevating member 31 may be coupled to the first elevating mechanism 32.
2 to 9, the first lifting unit 3 may include a first stopper 33 (shown in FIG. 8).
The first stopper 33 is coupled to the first elevating member 31. Accordingly, the first stopper 33 may be elevated together as the first elevating mechanism 32 elevates the first elevating member 31. The first stopper 33 stops the first test tray 210 carried along the transport path MP at a position that can be supported by the first elevating member 31. When the first test tray 210 is stopped by the first stopper 33, the first elevating mechanism 32 lifts the first elevating member 31 to lift the first test tray 210. It can be raised to the transfer position (TP). Therefore, the test tray replacement apparatus 1 according to the present invention can improve the accuracy of the operation of raising the first test tray 210 to the transfer position TP.
The first stopper 33 may include a first stop member 331 (shown in FIG. 9) and a first moving means 332 (shown in FIG. 9).
The first stop member 331 may be coupled to the first elevating member 31 to be positioned above the first guide member 311. When the first elevating mechanism 32 lowers the first elevating member 31, the first stop member 331 is positioned in the transport path MP. Accordingly, the first stop member 331 may stop the first test tray 210 by supporting the first test tray 210 carried along the transport path MP. When the first test tray 210 is stopped by the first stop member 331, the first test member 31 is lifted by the first lifting mechanism 32 in the process of being lifted by the first test tray 32. The support 210 may be raised to support it. The first stop member 331 is coupled to the first moving means 332. The first stop member 331 may be formed of a material having a predetermined elastic force. Accordingly, in the test tray replacement apparatus 1 according to the present invention, the first test tray 210 is damaged or damaged while the first test tray 210 is in contact with the first stop member 331. It can prevent damage.
The first moving means 332 moves the first stop member 331. The first moving means 332 is configured such that the first stop member 331 protrudes from the first guide member 311 before the first test tray 210 enters the main body 2. The first stop member 331 may be moved in the first direction. When the first moving member 332 is supported by the first elevating member 31 after the first test tray 210 is stopped, the first stop member 331 is the first guide member 311. The first stop member 331 may be moved in the second direction so as not to protrude from The second direction is a direction opposite to the first direction.
The first moving means 332 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, etc., a motor, a pulley and a belt, etc. The first stop member 331 may be moved by using a linear belt using a belt method, a coil and a permanent magnet. The first moving means 332 may be coupled to the first elevating member 31.
2 to 12, the first lifting unit 3 may include a first moving mechanism 34.
The first moving mechanism 34 moves the first elevating member 31 so that the first test tray 210 is supported by the first elevating member 31. As shown in FIG. 9, when the first test tray 210 is stopped by the first stopper 33, the first moving mechanism 34 may have the first guide member as shown in FIG. 11. 311 may be moved toward the first test tray 210. Accordingly, the first guide member 311 is positioned below the first test tray 210. Thereafter, as shown in FIG. 12, as the first elevating mechanism 32 raises the first elevating member 31, the first guide member 311 moves to the first test tray 210. It can be raised to the transfer position (TP) by supporting.
The first moving mechanism 34 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear, and a pinion gear, a motor, a pulley, a belt, and the like. The first elevating member 31 may be moved using a linear belt using a belt method, a coil and a permanent magnet. The first moving mechanism 34 may be coupled to the first elevating member 31.
2 to 12, the test tray replacement apparatus 1 according to the present invention may further include a second lifting unit 6.
The second lifting unit 6 is coupled to the main body 2. The second elevating unit 6 is coupled to the main body 2 so as to be positioned opposite to the first elevating unit 3 based on the first test tray 210 supported by the first elevating unit 3. Can be. That is, the first test tray 210 is located between the second lifting unit 6 and the first lifting unit 3. The second elevating unit 6 raises the first test tray 210 located in the transport path MP together with the first elevating unit 3 to the transport position TP. Accordingly, the test tray replacement apparatus 1 according to the present invention stably raises the first test tray 210 to the transfer position TP while preventing the first test tray 210 from tilting. The first test tray 210 is separated from the conveyor unit 120 so as to be taken out from the main body 2. The second elevating unit 6 may include a second elevating member 61, a second elevating mechanism 62, and a second moving mechanism 63.
The second elevating member 61 is coupled to the main body 2 to be elevated. The second lifting member 61 may support the first test tray 210 carried out from the main body 2. The first test tray 210 has the one side supported by the first elevating member 31 and the other side supported by the second elevating member 61 in the transport path MP in the transport position TP. After ascending to the can be carried out from the main body 2 by the carrying out unit (4). The second lifting member 61 may support the second test tray 220 carried into the main body 2. As the second test tray 220 is carried into the main body 2 by the carrying unit 5, one side of the second test tray 220 is supported by the first elevating member 31 and the other side of the second elevating member 61. After being supported, the first lifting member 31 and the second lifting member 61 are supported by the conveyor unit 120 by descending from the transfer position TP to the transport path MP as the lowering. Can be.
The second lifting member 61 may include a second guide member 611 (shown in FIG. 9). The second guide member 611 may guide the first test tray 210 to move in a straight line while the first test tray 210 is taken out from the main body 2. One side of the first test tray 210 is guided to the first guide member 311, and the other side is guided to the second guide member 611, so that the first test tray 210 is moved in a straight line to be taken out of the main body 2. have. The second guide member 611 may guide the second test tray 220 to move in a straight line while the second test tray 220 is carried into the main body 2. One side of the second test tray 220 is guided to the first guide member 311, and the other side of the second test tray 220 is guided to the second guide member 611, so that the second test tray 220 can be moved in a straight line and brought into the main body 2. have. The second guide member 611 may be formed in a needle-shaped shape as a whole. The second guide member 611 may be installed to face in a direction perpendicular to the direction in which the conveyor unit 120 carries the test tray 200.
The second elevating mechanism 62 elevates the second elevating member 61. The second elevating mechanism 62 lifts the second elevating member 61 while the second elevating member 61 supports the first test tray 210, thereby raising the first test tray 210. ) Can be raised to the transfer position (TP). The second elevating mechanism 62 lowers the second elevating member 61 while the second elevating member 61 supports the second test tray 220, thereby causing the second test tray 220 to be lowered. ) Can be lowered to the transport path (MP). When the conveyor unit 120 carries the test tray 200 along the transport path MP such that the conveyor unit 120 passes the test tray replacement device 1 according to the present invention, the second elevating mechanism 62 may be formed of the first lifting mechanism 62. The second elevating member 61 may raise the second elevating member 61 to avoid the test tray 200 carried along the carrying path MP. Accordingly, the conveyor unit 120 may continuously carry the test tray 200 along the transport path MP without being disturbed by the second elevating member 61.
The second elevating mechanism 62 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a motor, a rack gear and a pinion gear, and the like. The second elevating member 61 may be elevated by using a gear method using a belt, a belt method using a motor, a pulley, a belt, and the like, and a linear motor using a coil and a permanent magnet. The second lifting mechanism 62 may be coupled to the main body 2. The second elevating member 61 may be coupled to the second elevating mechanism 62.
The second moving mechanism 63 moves the second lifting member 61 so that the first test tray 210 is supported by the second lifting member 61. The second moving mechanism 63 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear, and a pinion gear, a motor, a pulley, a belt, and the like. The second lifting member 61 may be moved by using a linear belt using a belt method, a coil and a permanent magnet. The second moving mechanism 63 may be coupled to the second lifting member 61.
5 and 9 to 12, the second lifting unit 6 and the first lifting unit 3 is operated as follows to the first test tray carried by the conveyor unit 120 ( 210 may be switched to a state in which the body 2 can be taken out.
First, as shown in FIG. 9, the second elevating mechanism 62 raises the second elevating member 61 so that the second elevating member 61 is positioned above the carrying path MP. The first elevating mechanism 31 lowers the first elevating member 31 such that the first stop member 331 is positioned on the transport path MP. When the first stop member 331 is positioned on the transport path MP, the first moving means 332 moves the first stop member 331 in the first direction. Accordingly, the first test tray 210 carried by the conveyor unit 120 (shown in FIG. 5) passes after the second lifting member 61 passes below the first stop member 331. It is stopped by being supported by.
Next, as shown in FIG. 10, the second elevating mechanism 62 lowers the second elevating member 61. In this case, the second elevating member 61 and the first elevating member 31 are moved by the second moving mechanism 63 and the first moving mechanism 34 in a direction in which a gap between them is opened. to be. This is because the second guide member 611 is spaced apart from the second guide member 611 and the first guide member 311 by the second moving mechanism 63 and the first moving mechanism 34. And by moving the first guide member 311.
Next, as shown in FIG. 11, the second moving mechanism 63 and the first moving mechanism 34 are narrowed so that the distance between the second lifting member 61 and the first lifting member 31 is narrowed. The second elevating member 61 and the first elevating member 31 are moved. The second guide member 611 is narrowed so that the distance between the second guide member 611 and the first guide member 311 is narrowed between the second moving mechanism 63 and the first moving mechanism 34. And by moving the first guide member 311. Accordingly, the second elevating member 61 and the first elevating member 31 are positioned below the first test tray 210.
Next, as shown in FIG. 12, the second elevating mechanism 62 raises the second elevating member 61. At the same time, the first lifting mechanism 32 raises the first lifting member 31. Accordingly, the first test tray 210 is raised to the transfer position TP after one side is supported by the first elevating member 31 and the other side is supported by the second elevating member 61. It switches to the state which can be carried out from the said main body 2.
Next, as shown in FIG. 5, the carrying unit 4 moves the first test tray 210 so that the first test tray 210 located at the transfer position TP is taken out from the main body 2. Move it. In this case, the first guide member 311 (shown in FIG. 12) and the second guide member 611 (shown in FIG. 12) move the first test tray 210 in a straight line so that the main body (2). The first test tray 210 may be guided to be taken out of the first test tray 210.
Through the above-described process, the test tray replacement apparatus 1 according to the present invention converts the first test tray 210 carried by the conveyor unit 120 into a state capable of carrying out from the main body 2. Afterwards, the first test tray 210 may be taken out of the main body 2.
6, 7, and 13 to 15, the second lifting unit 6 and the first lifting unit 3 is operated as follows to the second test tray 220 corresponding to the changed semiconductor device ) Can be converted into a state capable of being transported by the conveyor unit 120.
First, as shown in FIG. 6, the carry-in unit 5 includes the second test tray such that the second test tray 220 is supported by the first elevating member 31 and the second elevating member 61. Move 220 to the transfer position TP. In this case, the first guide member 311 (shown in FIG. 13) and the second guide member 611 (shown in FIG. 13) move the second test tray 220 in a straight line to the transfer position ( The second test tray 220 may be guided to be positioned at the TP).
Next, as shown in FIG. 13, the second elevating mechanism 62 lowers the second elevating member 61. The second elevating mechanism 62 may lower the second elevating member 61 so that the second guide member 611 is positioned below the transport path MP. At the same time, the first lifting mechanism 32 lowers the first lifting member 31. The first elevating mechanism 32 may lower the first elevating member 31 such that the first guide member 311 is positioned below the transport path MP. Accordingly, one side and the other side of the first test tray 220 are supported by the conveyor unit 120 (shown in FIG. 6).
Next, as shown in FIG. 14, the second moving mechanism 63 and the first moving mechanism 34 are formed such that a gap between the second lifting member 61 and the first lifting member 31 is widened. The second elevating member 61 and the first elevating member 31 are moved. This is because the second guide member 611 is spaced apart from the second guide member 611 and the first guide member 311 by the second moving mechanism 63 and the first moving mechanism 34. And by moving the first guide member 311.
Next, as shown in FIG. 15, the second lifting mechanism 62 raises the second lifting member 61. At the same time, the first lifting mechanism 32 raises the first lifting member 31. Accordingly, the second elevating member 61 and the first elevating member 31 are positioned above the transport path MP. Accordingly, the conveyor unit 120 (shown in FIG. 6) may be configured such that the second test tray 220 passes under the second elevating member 61 or the first elevating member 31. The tray 220 may be carried.
Through the above-described process, the test tray replacement apparatus 1 according to the present invention carries the second test tray 210 corresponding to the changed semiconductor element into the main body 2 and then the second test tray 220. ) Can be converted into a state capable of being transported by the conveyor unit 120.
2 to 5, the carrying out unit 4 performs a function of carrying out the first test tray 210 from the main body 2. The carrying unit 4 may be coupled to the main body 2. The carrying unit 4 moves the first test tray 210 by moving the first test tray 210 positioned at the transfer position TP in the carrying out direction (the direction of the E arrow, shown in FIG. 5). It can carry out from the said main body 2. The carrying out unit 4 may include a first carrying out mechanism 41.
The first discharge mechanism 41 is coupled to the body 2. The first discharging mechanism 41 may move in the discharging direction (E arrow direction) by pushing the first test tray 210 positioned at the transfer position TP. As shown in FIG. 4, when the first elevating unit 3 raises the first test tray 210 to the transfer position TP, the first discharging mechanism 41 is illustrated in FIG. 5. The first test tray 210 supported by the first lifting unit 3 may be pushed out of the main body 2 by pushing. The first discharge mechanism 41 may include a first discharge member 411 and a first operating mechanism 412.
The first discharge member 411 is coupled to the first operating mechanism 412. The first carrying member 411 is moved by the first operating mechanism 412, thereby pushing the first test tray 210 located at the transfer position TP to move in the carrying out direction (E arrow direction). You can. The first carrying member 411 may be formed in a rectangular plate shape as a whole, but is not limited thereto and may be formed in another form as long as the first test tray 210 can be moved by pushing the first test tray 210.
The first actuating mechanism 412 moves the first discharge member 411. The first actuating mechanism 412 is coupled to the body 2 so as to be located outside of the body 2. When the first lifting unit 3 raises the first test tray 210 to the transfer position TP, the first operating mechanism 412 moves the first discharge member 411 to the transfer position ( The first test tray 210 may be moved in the discharge direction (E arrow direction) by moving toward the first test tray 210 located at TP). The first operating mechanism 412 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, etc., a motor, a pulley and a belt, etc. The first carrying member 411 may be moved using a belt method, a linear motor using a coil and a permanent magnet, or the like.
2, 3 and 5 to 7, the carrying unit 5 performs a function of bringing the second test tray 220 into the main body 2. The carrying unit 5 may be coupled to the main body 2. The carry-in unit 5 moves the second test tray 220 in the carry-in direction (I arrow direction, shown in FIG. 6), thereby bringing the second test tray 220 into the main body 2. Can be. The carry-in direction (I arrow direction) and the carry-out direction (E arrow direction) are opposite to each other. The carrying unit 5 may include a carrying member 51 and a carrying mechanism 52.
The carrying member 51 is coupled to the carrying mechanism 52. The loading member 51 may be moved by the loading mechanism 52 to push the second test tray 220 to move in the loading direction (the arrow direction I). The carrying member 51 may be formed in the shape of a square plate as a whole, but is not limited thereto and may be formed in another shape as long as the second test tray 220 can be moved by pushing the second test tray 220.
The loading mechanism 52 moves the loading member 51. The loading mechanism 52 is coupled to the body 2 so as to be located outside of the body 2. The loading mechanism 52 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The carrying member 51 may be moved using a linear motor using a method, a coil, a permanent magnet, or the like.
The loading mechanism 52 may lift the loading member 51. Before the first test tray 210 located at the transfer position TP is taken out of the main body 2, as shown in FIG. The carrying member 51 may be raised so as not to interfere with the first test tray 210. When a part of the second test tray 220 is carried in the main body 2, as shown in FIG. 6, the loading mechanism 52 allows the carrying member 51 to enter the second test tray 220. The second test tray 220 may be moved to the transfer position TP by lowering the carrying member 51 so as to contact the moving member 51.
2 to 7, 16 and 17, the test tray replacement apparatus 1 according to the present invention may further include a transport unit (7, shown in Figure 3).
The conveying unit 7 is coupled to the body 2. The conveying unit 7 may support the bottom surface of the first test tray 210 carried out from the main body 2 and the bottom surface of the second test tray 220 carried into the main body 2. It may be coupled to the body 2 to be located outside of 2).
The conveying unit 7 moves the first test tray 210 in the carrying out direction (E arrow direction). As shown in FIG. 5, the first test tray 210 is moved by moving the first test tray 210 positioned at the transfer position TP in the discharge direction (E arrow direction). When a part of 210 is taken out from the main body 2, the first test tray 210 is supported by the transfer unit 7 with a part located outside the main body 2. When a part of the first test tray 210 is supported by the conveying unit 7, as shown in FIG. 16, the conveying unit 7 moves the first test tray 210 in the discharge direction (E arrow). Direction), the first test tray 210 can be completely removed from the main body 2.
As shown in FIG. 17, the transfer unit 7 moves the second test tray 220 in the carry-in direction (I arrow direction). When a part of the second test tray 220 is brought into the main body 2 as the transfer unit 7 moves the second test tray 220 in the carry-in direction (the arrow direction I), the A part of the second test tray 220 is supported by the first lifting unit 3. When a part of the second test tray 220 is supported by the first lifting unit 3, the loading unit 5 moves the second test tray 220 in the loading direction as shown in FIG. 6. The second test tray 220 can be completely brought into the main body 2 by continuously moving in the direction of arrow I).
2 to 7, 16, and 17, the conveying unit 7 may include a lower rotating roller 71 (shown in FIG. 16) and a rotating mechanism 72 (shown in FIG. 16). have.
The lower rotary roller 71 is rotatably installed in the main body (2). The lower rotating roller 71 may support the bottom surface of the first test tray 210 carried out from the main body 2 and the bottom surface of the second test tray 220 carried into the main body 2. It can be coupled to the body 2 to be located outside of (2).
The rotating mechanism 72 rotates the lower rotating roller 71. The rotating mechanism 72 may be installed on the main body 2 or the conveyor unit 120. As shown in FIG. 16, in the state where the first test tray 210 is carried out from the main body 2 and supported by the lower rotating roller 71, the rotating mechanism 72 is the lower rotating roller 71. The first test tray 210 can be moved in the discharging direction (E arrow direction) by rotating)) in the first rotation direction. As shown in FIG. 17, in a state in which the second test tray 220 is supported by the lower rotating roller 71, the rotating mechanism 72 rotates the lower rotating roller 71 in the second rotation direction. By doing so, the second test tray 220 can be moved in the carry-in direction (I arrow direction). The second rotation direction is a rotation direction opposite to the first rotation direction.
The rotating mechanism 72 may include a motor directly coupled to the rotating shaft of the lower rotating roller 71 to rotate the lower rotating roller 71 about the rotating shaft. When the rotating shafts of the motor and the lower rotating rollers 71 are spaced apart by a predetermined distance, the rotating mechanism 72 may further include connecting means for connecting the rotating shafts of the motor and the lower rotating rollers 71. . The connecting means may be a chain, a belt, a gear, or the like.
The conveying unit 7 may include a plurality of lower rotating rollers 71. The lower rotating rollers 71 are spaced apart from each other in the carrying out direction (E arrow direction). Accordingly, the test tray replacement apparatus 1 according to the present invention may increase the distance for moving the first test tray 210 in the carrying out direction (E arrow direction). In addition, the test tray replacement apparatus 1 according to the present invention may increase the distance for moving the second test tray 220 in the carry-in direction (I arrow direction). In this case, the conveying unit 7 may include an interlock mechanism 73.
The linkage mechanism 73 connects the lower rotating rollers 71 to each other. Accordingly, when the rotating mechanism 72 rotates any one of the lower rotating rollers 71, the remaining lower rotating rollers 71 may also rotate in conjunction with the interlocking mechanism 73. Therefore, since the test tray replacement apparatus 1 according to the present invention can rotate the plurality of lower rotary rollers 71 by using one rotating mechanism 72, not only the overall size can be reduced, but also the first Power energy consumed to carry the test tray 210 and the second test tray 220 may be reduced. The linkage mechanism 73 may be a belt, a chain, a gear, or the like.
16 and 17, the conveying unit 7 may include an upper rotating roller 74 and a roller elevating mechanism 75.
The upper rotary roller 74 is rotatably installed in the main body (2). The upper rotary roller 74 may be coupled to the main body 2 to be positioned above the lower rotary roller 71. The upper rotary roller 74 may support the upper surface of the first test tray 210 carried out from the main body 2 and the upper surface of the second test tray 220 carried into the main body 2. It can be coupled to the body 2 to be located outside of (2).
The roller elevating mechanism 75 elevates the upper rotary roller 74. The upper rotary roller 74 is coupled to the roller elevating mechanism 75. The roller elevating mechanism 75 may be coupled to the main body 2 such that the upper rotating roller 74 is positioned above the lower rotating roller 71. The roller elevating mechanism 75 may be coupled to the main body 2 to be positioned outside the main body 2.
The roller elevating mechanism 75 may raise the upper rotating roller 74 before the first test tray 210 located at the transfer position TP is discharged from the main body 2. When the carrying out unit 4 is carried out from the main body 2 so that the first test tray 210 positioned at the transfer position TP is supported by the lower rotating roller 71, the roller raising mechanism 75 By lowering the upper rotating roller 74 may be in contact with the upper surface of the first test tray 210 supported by the lower rotating roller (71).
Accordingly, the first test tray 210 moves in the carrying out direction (E arrow direction) while passing between the upper rotating roller 74 and the lower rotating roller 71, thereby moving the carrying out direction (E arrow direction). Shaking may be prevented from occurring in the process of moving to). In this case, the upper rotary roller 74 is moved to the first test tray 210 as the first test tray 210 is moved in the discharge direction (E arrow direction) by the lower rotary roller 71. It can rotate in contact. Therefore, the test tray replacement apparatus 1 according to the present invention can not only stably move the first test tray 210 in the discharge direction (E arrow direction), but also the first test tray 210 As it moves in contact with the upper rotating roller 74, it may be prevented from being damaged or broken.
The roller elevating mechanism 75 may raise the upper rotating roller 74 before the second test tray 220 is supported by the lower rotating roller 71. When the second test tray 220 is supported by the lower rotating roller 71, the roller elevating mechanism 75 lowers the upper rotating roller 74 so that the second supporting tray 220 is supported by the lower rotating roller 71. The upper surface of the test tray 220 may be contacted.
Accordingly, the second test tray 220 moves in the carrying direction (I arrow direction) while passing between the upper rotating roller 74 and the lower rotating roller 71, thereby moving in the carrying direction (I arrow direction). Shaking may be prevented from occurring in the process of moving to). In this case, the upper rotary roller 74 is moved to the second test tray 220 as the second test tray 220 is moved in the loading direction (the arrow direction I) by the lower rotary roller 71. It can rotate in contact. Therefore, the test tray replacement apparatus 1 according to the present invention may not only stably move the second test tray 220 in the loading direction (the arrow direction I), but also the second test tray 220 may be As it moves in contact with the upper rotating roller 74, it may be prevented from being damaged or broken.
The roller elevating mechanism 75 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor and a rack gear and a pinion gear, a motor, a pulley and a belt, etc. The upper rotary roller 74 may be elevated by using a linear motor using a belt method, a coil, a permanent magnet, or the like.
2 to 18, the test tray replacement apparatus 1 according to the present invention may further include a storage unit 8.
The storage unit 8 is installed to be spaced apart from the conveyor unit 120. The storage unit 8 stores the first test tray 210 carried out from the main body 2. The storage unit 8 stores a second test tray 220 for carrying in the main body 2. Accordingly, the test tray replacement apparatus 1 according to the present invention includes a step of carrying out the first test tray 210 from the main body 2, and the second test tray 220 to the main body 2. The import process can be carried out continuously. Therefore, the test tray replacement apparatus 1 according to the present invention can quickly respond to the change in the semiconductor device by reducing the time taken to replace the first test tray 210 with the second test tray 220. have.
The storage unit 8 may include a storage member 81 and a discharge mechanism (82).
The storage member 81 may store the first test tray 210 and the second test tray 220. The storage member 81 may store the plurality of second test trays 220 stacked up and down. To this end, the storage member 81 may include a plurality of support means which are spaced apart from each other up and down. The second test trays 220 may be stored in the storage member 81 by being supported by the support means, respectively. The storage member 81 may be elevated by the driving mechanism 83. Accordingly, the second test tray 220 which is moved by the discharge mechanism 82 may be stored by being stacked up and down on the storage member 81. The drive mechanism 83 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The storage member 81 may be elevated by using a linear motor using a method, a coil, a permanent magnet, or the like.
The storage member 81 may store the first test tray 210 by using a support means that is empty as the second test tray 220 is carried into the main body 2. Accordingly, the storage member 81 may store the plurality of first test trays 210 stacked up and down. The driving mechanism 83 may elevate the storage member 81 such that the first test tray 210 transferred from the transfer unit 7 is stacked and stored on the storage member 81 vertically.
The storage member 81 may be formed in a rectangular parallelepiped shape as a whole, but is not limited thereto and may be formed in another form as long as the plurality of support means may be spaced apart vertically.
The discharge mechanism 82 moves the second test tray 220 to the transfer unit 7 so that the second test tray 220 stored in the storage member 81 is supported by the transfer unit 7. Let's do it. The discharge mechanism 82 may move the second test tray 220 to the transfer unit 7 by pushing the second test tray 220 in the loading direction (the arrow direction I). The loading unit 5 supports the second test tray 220 so that the second test tray 220 moved by the discharge mechanism 82 is supported by the first lifting unit 3. It can be carried in. The discharge mechanism 82 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor and a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The second test tray 220 can be moved by operating a linear motor using a method, a coil, a permanent magnet, or the like.
2 to 19, the carrying unit 4 may include a second carrying mechanism 42 (shown in FIG. 19).
The second discharge mechanism 42 moves the first test tray 210 supported by the transfer unit 7 to the storage unit 8. The first test tray 210 may be stored in the storage member 81 by being moved into the storage member 81 by the second discharge mechanism 42. The second discharging mechanism 42 may be coupled to the main body 2. The second discharging mechanism 42 may include a second discharging member 421 and a second operating mechanism 422.
The second discharge member 421 is coupled to the second actuating mechanism 422. The second carrying member 421 may be moved by the second operating mechanism 422 to move the first test tray 210 in the carrying out direction (E arrow direction). The second carrying member 421 may be formed in the shape of a square plate as a whole, but is not limited thereto and may be formed in another form as long as it can be moved by pushing the first test tray 210.
The second operating mechanism 422 moves the second discharge member 421. The second actuating mechanism 422 is coupled to the body 2 so as to be located outside of the body 2. The second operating mechanism 422 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, and the like, a motor, a pulley and a belt, and the like. The second carrying member 421 may be moved using a belt method, a linear motor using a coil and a permanent magnet, or the like.
The second actuating mechanism 422 may lift the second carrying member 421 up and down. Before the first test tray 210 located at the transfer position TP is taken out of the main body 2, the second actuating mechanism 422 is operated by the second carrying member 421 to perform the first test. The second carrying member 421 may be raised to not interfere with the tray 210. When the first test tray 210 is supported by the conveying unit 7 and moved a predetermined distance, the second actuating mechanism 422 causes the second discharging member 421 to have the first test tray 210. The first test tray 210 may be moved to the storage unit 8 by lowering the second carrying member 421 so as to contact the second carrying member 421.
Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the inline test handler according to the present invention will be described in detail.
2 to 25, the inline test handler 100 according to the present invention includes a plurality of chamber units 110 (shown in FIG. 20) in which a test process for a semiconductor device is performed, and the chamber units 110 are inlined. Conveyor unit 120 (shown in FIG. 20) for transporting the test tray 200 to be connected to, the sorting unit 130 (shown in FIG. 20) spaced apart from the chamber unit 110, and the first The first test tray 210 may include a replacement device 1 for replacing the second test tray 220. The replacement device 1 may include the first test tray according to at least one of a size of a semiconductor device, a number of semiconductor devices connected to the test equipment 400 (shown in FIG. 21), and a type of semiconductor devices. The second test tray 220 may be replaced with the second test tray 220. Since the replacement device 1 is as described in the test tray replacement device 1 according to the present invention described above, a detailed description thereof will be omitted.
The sorting unit 130 performs a loading process and an unloading process for the semiconductor device. The loading process refers to a process of accommodating a semiconductor device to be tested in a test tray 200 (shown in FIG. 21). The unloading process refers to a process of separating the tested semiconductor device from the test tray 200 and classifying the grades according to test results. The chamber units 110 each perform the test process. The chamber units 110 are provided in plural along the conveyor unit 120. The conveyor unit 120 connects the sorting unit 130 and the chamber unit 110 which are installed to be spaced apart from each other inline. Accordingly, the inline test handler 100 according to the present invention may independently perform the test process of the chamber units 11 for the sorting unit 130 to perform the loading process and the unloading process. have. Therefore, the inline test handler 100 according to the present invention can achieve the following effects.
First, since the inline test handler 100 according to the present invention can independently perform the test process for the loading process and the unloading process, any one of the chamber units 110 and the sorting unit 130 may be used. If one fails, the rest of the working devices can continue to work. Accordingly, the inline test handler 100 according to the present invention prevents the entire system from stopping when a failure occurs in any one of the chamber units 110 and the sorting unit 130, thereby reducing work time. It can prevent.
Second, the inline test handler 100 according to the present invention efficiently distributes the test tray 200 by the conveyor unit 120 in consideration of the time taken to perform each of the loading process, the unloading process and the test process. can do. Thus, the inline test handler 100 according to the present invention can improve the equipment operation rate.
Third, when the semiconductor device is changed, the inline test handler 100 according to the present invention may replace the existing test tray 200 with a test tray 200 corresponding to the changed semiconductor device. It can improve your responsiveness.
Fourth, since the sorting unit 130 and the chamber unit 110 are configured as separate devices, the inline test handler 100 according to the present invention reduces the number of devices or devices installed in the sorting unit 130. Can be. Accordingly, the inline test handler 100 according to the present invention may reduce the jam rate for the sorting unit 130. Therefore, the inline test handler 100 according to the present invention increases the operating time for the sorting unit 130 by reducing the time that the sorting unit 130 stops as the jam occurs in the sorting unit 130. You can.
Hereinafter, the chamber unit 110, the conveyor unit 120, and the sorting unit 130 will be described in detail with reference to the accompanying drawings.
20 and 21, the chamber unit 110 performs the test process. The chamber unit 110 may perform the test process by connecting the semiconductor device accommodated in the test tray 200 to the test equipment 400. When the test device 400 is electrically connected to the semiconductor device as the semiconductor device is connected, the test device 400 tests the semiconductor device. The test tray 200 may accommodate a plurality of semiconductor devices. In this case, the chamber unit 110 may connect a plurality of semiconductor devices to the test equipment 400, and the test equipment 400 may test a plurality of semiconductor devices. The test equipment 400 may include a hi-fix board.
The chamber unit 110 includes a first chamber 110a (shown in FIG. 21) in which the test process is performed. The test equipment 400 is installed in the first chamber 110a. The test equipment 400 is installed so that some or all of the test equipment 400 is inserted into the first chamber 110a. The test equipment 400 includes test sockets (not shown) to which semiconductor devices stored in the test tray 200 are connected. The test equipment 400 may include a number of test sockets approximately equal to the number of semiconductor devices accommodated in the test tray 200. For example, the test tray 200 may accommodate 64, 128, 256, and 512 semiconductor devices. When the semiconductor devices stored in the test tray 200 are connected to the test sockets, the test equipment 400 may test the semiconductor devices connected to the test sockets. The first chamber 110a may be formed in a rectangular parallelepiped shape in which a portion into which the test equipment 400 is inserted is opened.
The chamber unit 110 includes a contact unit 110b (shown in FIG. 21) for connecting the test tray 200 to the test equipment 400. The contact unit 110b is installed in the first chamber 110a. The contact unit 110b connects the semiconductor devices accommodated in the test tray 200 to the test equipment 400. The contact unit 110b may move the semiconductor devices accommodated in the test tray 200 in a direction closer to the test equipment 400 and in a direction away from the test apparatus 400. When the contact unit 110b moves the semiconductor devices stored in the test tray 200 in a direction closer to the test equipment 400, the semiconductor devices stored in the test tray 200 are transferred to the test equipment 400. Connected. Accordingly, the test equipment 400 may test the semiconductor devices. When the test for the semiconductor devices is completed, the contact unit 110b may move the semiconductor devices accommodated in the test tray 200 in a direction away from the test equipment 400.
The test tray 200 is provided with carrier modules for accommodating semiconductor devices. Each of the carrier modules may accommodate at least one semiconductor device. The carrier modules are elastically movable to the test tray 200 by springs (not shown), respectively. When the contact unit 110b pushes the semiconductor devices accommodated in the test tray 200 in a direction close to the test equipment 400, the carrier modules may move in a direction close to the test equipment 400. When the contact unit 110b removes the force pushing the semiconductor elements stored in the test tray 200, the carrier modules may move away from the test equipment 400 by the restoring force of the spring. While the contact unit 110b moves the carrier modules and the semiconductor devices, the test tray 200 may move together.
Although not shown, the contact unit 110b may include a plurality of contact sockets for contacting the semiconductor devices accommodated in the test tray 200. The contact sockets may contact the semiconductor devices stored in the test tray 200 to move the semiconductor devices, thereby connecting the semiconductor devices to the test equipment 400. The contact unit 110b may include a number of contact sockets approximately equal to the number of semiconductor devices accommodated in the test tray 200. The contact unit 110b is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. It can be moved by a linear motor using a method, a coil and a permanent magnet or the like.
20 to 25, the chamber unit 110 allows the test equipment 400 (shown in FIG. 21) to test the semiconductor device not only at room temperature but also at high or low temperature. It further includes a second chamber 110c (shown in FIG. 21) and a third chamber 110d (shown in FIG. 21).
The second chamber 110c adjusts the semiconductor device accommodated in the test tray 200 to a first temperature. The test tray 200 located in the second chamber 110c includes a semiconductor element to be tested by the sorting unit 130, and the chamber unit is disposed by the conveyor unit 120 (shown in FIG. 20). After being conveyed to 110, it is transferred to the second chamber 110c. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor device to be tested is tested by the test equipment 400. The second chamber 110c includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the semiconductor device to be tested to the first temperature. When the semiconductor device to be tested is adjusted to the first temperature, the test tray 200 is transferred from the second chamber 110c to the first chamber 110a.
The third chamber 110d adjusts the semiconductor device accommodated in the test tray 200 to a second temperature. The test tray 200 positioned in the third chamber 110d is a semiconductor device tested through the test process, and is transferred from the first chamber 110a. The second temperature is a temperature range including or close to room temperature. The third chamber 110d includes at least one of an electrothermal heater and a liquefied nitrogen injection system to adjust the tested semiconductor device to the second temperature. When the tested semiconductor device is adjusted to the second temperature, the test tray 200 is transferred to the conveyor unit 120.
Although not shown, the chamber unit 110 may include a transfer unit (not shown) for transferring the test tray 200. The transfer means may transfer the test tray 200 by pushing or pulling. The transfer means may transfer the test tray 200 containing the semiconductor device to be tested from the second chamber 110c to the first chamber 110a. The transfer means may transfer the test tray 200 containing the tested semiconductor device from the first chamber 110a to the third chamber 110d. The conveying means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, a coil, and the like. And the test tray 200 can be transferred using a linear motor using a permanent magnet or the like.
As shown in FIG. 22, the chamber unit 110 may have the second chamber 110c, the first chamber 110a, and the third chamber 110d side by side in a horizontal direction. In this case, the chamber unit 110 may include a plurality of first chambers 110a. A plurality of the first chambers 110a may be stacked up and down.
As shown in FIG. 23, the chamber unit 110 may include the second chamber 110c, the first chamber 110a, and the third chamber 110d stacked in a vertical direction. That is, the second chamber 110c, the first chamber 110a, and the third chamber 110d may be stacked up and down. The second chamber 110c may be installed to be positioned above the first chamber 110a, and the third chamber 110d may be installed to be positioned below the first chamber 110a.
20 to 25, the chamber unit 110 may include a rotator 110e (shown in FIG. 22) for rotating the test tray 200 between a horizontal state and a vertical state.
The rotator 110e is installed in the chamber unit 110. The rotator 110e may rotate the test tray 200 containing the semiconductor device to be tested from a horizontal state to a vertical state. Accordingly, the first chamber 110a may perform the test process with respect to the test tray 200 standing in a vertical state. In addition, the sorting unit 130 may perform the loading process on the test tray 200 laid down in a horizontal state. The rotator 110e may rotate the test tray 200 containing the tested semiconductor device from a vertical state to a horizontal state. Accordingly, the sorting unit 130 may perform the unloading process on the test tray 200 laid down in a horizontal state.
The chamber unit 110 may include one rotator 110e, as shown in FIGS. 22 and 23. In this case, the rotator 110e may be installed between the second chamber 110c and the third chamber 110d. The test tray 200 containing the semiconductor device to be tested is rotated to be vertical by the rotator 110e and then transferred from the rotator 110e to the second chamber 110c by the transfer means. have. The test tray 200 in which the tested semiconductor device is accommodated may be rotated to be horizontal by the rotator 110e after being transferred from the third chamber 110d to the rotator 110e by the transfer means. have.
Although not shown, the chamber unit 110 may include a first rotator for rotating the test tray 200 containing the semiconductor device to be tested and a second rotator for rotating the test tray 200 containing the tested semiconductor device. It may also include. The first rotator may be installed to be located inside the second chamber 110c or outside the second chamber 110c. The second rotator may be installed to be located inside the third chamber 110d or outside the third chamber 110d.
Although not shown, the chamber unit 110 may perform a test process on the test tray 200 in a horizontal state without the rotator 110e. In this case, the test tray 200 may be transferred between the second chamber 110c, the first chamber 110a, and the third chamber 110d in a horizontal state to perform the test process.
Although not shown, the transfer means may transfer the test tray 200 supported by the conveyor unit 120 to the chamber unit 110. The transfer means may transfer the test tray 200 supported by the conveyor unit 120 to the first chamber 110a. When the chamber unit 110 includes the second chamber 110c, the transfer means may include a test tray 200 supported by the conveyor unit 120 via the second chamber 110c. It can be transferred to one chamber (110a). The transfer means may transfer the test tray 200 in which the test process is completed, to the conveyor unit 120. The transfer means may transfer the test tray 200 in which the test process is completed, from the first chamber 110a to the conveyor unit 120. When the chamber unit 110 includes the third chamber 110d, the transfer means may include a test tray 200 in which the test process is completed, and the third chamber 110d in the first chamber 110a. It can be transferred to the conveyor unit 120 via.
2 and 20, a plurality of chamber units 110 are installed along the conveyor unit 120. The chamber units 110 are installed to be spaced apart from each other along the conveyor unit 120 by a predetermined distance. For example, the first chamber unit and the second chamber unit may be installed in the conveyor unit 120 to be spaced apart from each other by a predetermined distance. The inline test handler 100 according to the present invention may include N chamber units 110 (N is an integer greater than 2).
2 and 20, the conveyor unit 120 carries the test tray 200 such that the test tray 200 is transferred between the sorting unit 130 and the chamber units 110. The conveyor unit 120 carries the test tray 200 such that the test tray 200 discharged from the sorting unit 130 is supplied to the chamber unit 110. The conveyor unit 120 carries the test tray 200 such that the test tray 200 discharged from the chamber unit 110 is supplied to the sorting unit 130. Accordingly, the inline test handler 1 according to the present invention circulates the test tray 200 between the sorting unit 130 and the chamber unit 110 installed to be spaced apart from each other through the conveyor unit 120, and the test tray. The loading process, the test process, and the unloading process may be performed on the semiconductor device accommodated in the 200.
Referring to FIG. 24, the conveyor unit 120 includes a conveyor 120a for carrying the test tray 200. The conveyor 120a may include a plurality of rotating members 120b installed to be spaced apart from each other by a predetermined distance. The conveyor 120a rotates the rotating members 120b about respective rotation shafts. The test tray 200 may be transported as the rotating members 120b rotate while being supported by the rotating members 120b. The conveyor 120a may rotate the rotating members 120b clockwise and counterclockwise about their respective rotation shafts. Accordingly, the conveyor 120a may adjust the direction of transporting the test tray 200 by adjusting the direction in which the rotating members 120b rotate. The rotating members 120b may each be formed in a cylindrical shape.
Although not shown, the conveyor 120a may include a power source for rotating the rotating members 120b about respective rotation shafts. The power source may be a motor. The conveyor 120a may include connecting means for connecting the rotational shaft of each of the power source and the rotating members 120b. The connecting means may be a pulley and a belt. The conveyor 120a may further include a circulation member (not shown) coupled to surround the rotating members 120b. The test tray 200 is supported by the circulation member. The circulation member may transport the test tray 200 while the rotation members 120b located therein are cyclically moved as they rotate about each rotation axis.
The conveyor 120a includes an installation mechanism 120c for supporting the rotating members 120b. The installation mechanism 120c supports the rotating members 120b such that the test tray 200 supported by the rotating members 120b is positioned in the transport path MP (shown in FIG. 4).
The conveyor unit 120 may include a plurality of the conveyor (120a). The conveyors 120a are installed adjacent to each other. The test tray 200 may be transported along the conveyors 120a to be transported between the chamber unit 110 (shown in FIG. 20) and the sorting unit 130 (shown in FIG. 20). The conveyors 120a may move the test trays 200 individually while operating individually. For example, while at least one of the conveyors 120a is stopped, the other conveyor 120a may operate to carry the test tray 200. The conveyor unit 120 may include a number of conveyors 120a corresponding to the number of the chamber units 110.
2 and 25, the sorting unit 130 performs the loading process and the unloading process. The sorting unit 130 is installed to be spaced apart from the chamber units 110. The sorting unit 130 may include a loading unit 131 (shown in FIG. 25) for performing the loading process.
The loading unit 131 transfers the semiconductor device to be tested from the customer tray to the test tray 200. The loading unit 131 may include a loading stacker 1311 (shown in FIG. 25) and a loading picker 1312 (shown in FIG. 25).
The loading stacker 1311 supports the customer tray. The customer tray supported by the loading stacker 1311 contains semiconductor devices to be tested. The loading stacker 1311 may store a plurality of customer trays containing semiconductor devices to be tested. The customer trays may be stacked up and down and stored in the loading stacker 1311.
The loading picker 1312 may pick up the semiconductor device to be tested from the customer tray located in the loading stacker 1311 and store it in the test tray 200. When the semiconductor device to be tested is accommodated in the test tray 200, the test tray 200 may be positioned at a loading position 131a (shown in FIG. 25). The loading picker 1312 may transfer the semiconductor device to be tested while moving in the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The loading picker 1312 may move up and down.
The loading unit 131 may further include a loading buffer 1313 (shown in FIG. 25) to temporarily receive the semiconductor device to be tested. In this case, the loading picker 1312 picks up the semiconductor device to be tested from the customer tray, and then transfers the picked-up semiconductor device to the test tray 200 at the loading position 131a via the loading buffer 1313. Can be stored in. The loading picker 1312 may include a first loading picker 1312a (shown in FIG. 25) to transfer the semiconductor device to be tested from the customer tray to the loading buffer 1313, and the loading buffer 1313 to the semiconductor device to be tested. It may also include a second loading picker (1312b, shown in Figure 25) to transfer to the test tray 200 in the.
Although not shown, the loading unit 131 may include a loading transfer means for transferring the test tray 200. The loading transfer means may transfer the test tray 200 by pushing or pulling. The loading transfer means may transfer the test tray 200 in which the loading process is completed, to the conveyor unit 120 at the loading position 131a. The loading transfer means may transfer the empty test tray 200 from the conveyor unit 120 to the loading position 131a.
2 and 25, the sorting unit 130 may include an unloading unit 132 (shown in FIG. 25) for performing the unloading process.
The unloading unit 132 separates the tested semiconductor device from the test tray 200 and transfers it to the customer tray. The unloading unit 132 may include an unloading stacker 1321 (shown in FIG. 25) and an unloading picker 1322 (shown in FIG. 25).
The unloading stacker 1321 supports the customer tray. The customer trays supported by the unloading stacker 1321 contain the tested semiconductor devices. The unloading stacker 1321 may store a plurality of customer trays containing the tested semiconductor devices. The customer trays may be stacked up and down and stored in the unloading stacker 1321.
The unloading picker 1322 may pick up the tested semiconductor device from the test tray 200 and store it in a customer tray located in the unloading stacker 1321. When the tested semiconductor device is picked up from the test tray 200, the test tray 200 may be located at an unloading position 132a (shown in FIG. 25). The unloading picker 1322 may store the tested semiconductor device in a customer tray corresponding to the grade for each grade according to the test result. The unloading picker 1322 may transfer the tested semiconductor device while moving in the first axis direction (X axis direction) and the second axis direction (Y axis direction). The unloading picker 1322 may move up and down. When the test tray 200 becomes empty as the unloading unit 132 separates all the tested semiconductor devices from the test tray 200, the sorting unit 130 unloads the empty test tray 200. The unit 132 may be transferred to the loading unit 131.
The unloading unit 132 may further include an unloading buffer 1323 (shown in FIG. 25) to temporarily receive the tested semiconductor device. In this case, the unloading picker 1322 picks up the tested semiconductor device from the test tray 200 located at the unloading position 132a and passes the picked-up semiconductor device through the unloading buffer 1323. It can be stored in the customer tray. The unloading picker 1322 may include a first unloading picker 1322a (shown in FIG. 25) for transferring the tested semiconductor device from the test tray 200 to the unloading buffer 1323, and the tested semiconductor device. It may also include a second unloading picker 1322b (shown in FIG. 25) transferred from the unloading buffer 1323 to the customer tray.
Although not shown, the unloading unit 132 may include an unloading transport means for transporting the test tray 200. The unloading transfer means may transfer the test tray 200 by pushing or pulling. The unloading transfer means may transfer the test tray 200 in which the test process is completed, from the conveyor unit 120 to the unloading position 132a. The unloading transfer means may transfer the test tray 200, which is empty as the unloading process is completed, to the conveyor unit 120 at the unloading position 132a. The unloading transfer means may transfer the test tray 200, which becomes empty as the unloading process is completed, from the unloading position 132a to the loading position 131a.
Although not shown, the inline test handler 1 according to the present invention may include a plurality of the sorting units 130. In this case, the sorting units 130 may be spaced apart from each other along the conveyor unit 120. According to a modified embodiment of the present invention, the sorting unit 130 may be installed spaced apart from the loading unit 131 and the unloading unit 132. Accordingly, the inline test handler 1 according to the present invention may be implemented such that the loading process and the unloading process are independently performed. Therefore, the inline test handler 1 according to the present invention can minimize the work time required for each process as the loading process, the unloading process and the test process are performed independently of each other. . The loading unit 131 and the unloading unit 132 may be spaced apart from each other along the conveyor unit 120.
The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.
