KR100901976B1 - Handler, Method of Manufacturing Semiconductor using the same, and Method of Transferring Test-tray - Google Patents

Abstract

The present invention is a test tray that can accommodate a plurality of semiconductor elements, the connection portion for the electrical connection is provided on the outer peripheral surface, the test tray having a connection portion for connecting the connection portion and the semiconductor element; A loading unit accommodating a semiconductor device to be tested in a test tray; An unloading unit which separates the tested semiconductor device from the test tray; A first chamber configured to adjust the semiconductor device to be tested stored in the test tray to a test temperature; A test chamber accommodating a plurality of test trays and connecting the connection portion of the test trays to a high fix board; A second chamber for restoring the tested semiconductor element stored in the test tray to room temperature; And a transfer unit for transferring a test tray from the first chamber to the test chamber and transferring a test tray from the test chamber to the second chamber, a method for manufacturing a semiconductor device using the same, and a test tray transfer method. As,

According to the present invention, a loading process, a test process, and an unloading process for more semiconductor devices can be performed in a short time while minimizing an increase in the size of the handler, thereby reinforcing the competitiveness of the product such as cost reduction of the semiconductor devices. You can.

Test, Handler, Chamber, Semiconductor Device, High Fix Board

Description

Handler, Method of Manufacturing Semiconductor using the same, and Method of Transferring Test-tray}

The present invention relates to a handler. Specifically, a semiconductor device is connected to a test device, and a handler for classifying the semiconductor device tested by the test device according to a test result according to a test result, a semiconductor device manufacturing method using the same, and a test tray transfer. It is about a method.

In general, a memory IC or a non-memory semiconductor device and a module IC (hereinafter, referred to as a "semiconductor device") in which these circuits are properly configured on a substrate are manufactured through various test procedures.

The equipment used in the process of testing a semiconductor device is a handler.

The handler is a device that connects the semiconductor device to a separate test device for testing the semiconductor device, and classifies the semiconductor device tested by the test device according to a grade according to the test result.

That is, the handler can be shipped only semiconductor devices determined as good quality, thereby contributing to quality control and improved product reliability.

Such a handler performs a loading process, an unloading process, and a test process, and performs the process by using a test tray having a plurality of sockets for accommodating semiconductor devices.

The loading process is a process of separating a semiconductor device to be tested in a customer tray, transferring the separated semiconductor device, and storing the semiconductor device in a test tray. This process takes place via a plurality of pickers. The picker includes a plurality of adsorption nozzles capable of adsorbing a plurality of semiconductor elements.

The unloading process is a process of separating the semiconductor device tested by the test equipment from the test tray and storing the separated semiconductor device in a customer tray at different positions according to the test result. This process is performed through a plurality of pickers as in the loading process.

The test process is a process of connecting the semiconductor device stored in the test tray to the test equipment so that the test equipment can test the electrical characteristics of the semiconductor device.

In addition, the handler is composed of a plurality of hermetically sealed chambers so that the test equipment can not only test the semiconductor device at room temperature, but also the test equipment can test the semiconductor device in the extreme state of high temperature or low temperature. It is made to include a chamber portion.

1 is a plan view schematically showing the configuration of a conventional handler, Figure 2 is a schematic diagram showing a path in which the test tray is transported in the handler of FIG. In FIG. 2, reference numerals denoted in the test tray indicate a configuration of a handler in which the test tray is located.

1 and 2, the conventional handler 10 includes a loading stacker 11, an unloading stacker 12, a picker unit 13, a buffer unit 14, an exchange unit 15, and And a chamber portion 16.

The loading stacker 11 stores a plurality of customer trays in which semiconductor devices to be tested are stored. The customer tray, in which all the semiconductor elements are transported and emptied, is transferred to the unloading stacker 12.

The unloading stacker 12 stores a plurality of customer trays in which the tested semiconductor devices are stored. The tested semiconductor devices are stored in customer trays stored in different locations according to the test results.

The picker unit 13 includes a nozzle capable of absorbing a plurality of semiconductor elements, and includes a first picker 131 and a second picker 132.

The first picker 131 is installed to move in the X-axis direction and the Y-axis direction, and includes a first loading picker 131a and a first unloading picker 131b.

The first loading picker 131a picks up the semiconductor device to be tested from the customer tray of the loading stacker 11 and transfers the picked up semiconductor device to the buffer unit 14.

The first unloading picker 131b picks up the tested semiconductor device from the buffer unit 14 and transfers the picked-up semiconductor device to the customer tray of the unloading stacker 12. In this case, the first unloading picker 131b stores the semiconductor device in a customer tray of the unloading stacker 12 stored at different positions for each grade according to the test result.

The second picker 132 is installed to move in the X-axis direction, and includes a second loading picker 132a and a second unloading picker 132b.

The second loading picker 132a picks up the semiconductor device from the buffer unit 14, transfers the picked up semiconductor device to be stored in the test tray T of the exchanger 15.

The second unloading picker 132b picks up the semiconductor device from the test tray T of the exchanger 15, and transfers the picked up semiconductor device to the buffer unit 14.

The buffer unit 14 temporarily stores a semiconductor device and includes a loading buffer unit 141 and an unloading buffer unit 142.

The loading buffer unit 141 is installed to move in the Y-axis direction from one side of the exchange unit 15, and is a semiconductor device transferred from the customer tray of the loading stacker 11 by the first loading picker (131a) Temporarily store The semiconductor device accommodated in the loading buffer unit 141 is transferred to the exchange unit 15 by the second loading picker 132a and stored in the test tray T of the exchange unit 15.

The unloading buffer part 142 is installed to move in the Y-axis direction from the other side of the exchange part 15, and is discharged from the test tray T of the exchange part 15 by the second unloading picker 132b. The semiconductor element to be transferred is temporarily stored. The semiconductor device accommodated in the unloading buffer unit 142 is transferred to the customer tray of the unloading stacker 12 by the first unloading picker 131b and the customer tray of the unloading stacker 12. It is stored according to the test results.

The exchange part 15 exchanges the chamber part 16 and the test tray T. The exchanger 15 supplies a test tray T in which the semiconductor element to be tested is stored to the chamber unit 16, and a test tray T in which the tested semiconductor element is stored from the chamber unit 16. To be supplied.

In addition, the exchange unit 15 includes a process of accommodating the semiconductor device to be tested in the test tray T, and a process of separating the tested semiconductor device from the test tray T. Here, the process of accommodating the semiconductor device to be tested in the test tray T is part of the loading process, and the process of separating the tested semiconductor device from the test tray T is part of the unloading process.

Meanwhile, the exchange unit 15 includes a rotator 151.

The rotator 151 may rotate the test tray T, thereby converting the test tray T into a horizontal state or a vertical state.

In this case, the rotator 151 converts the test tray T in which the semiconductor element to be tested is stored into a vertical state, and converts the test tray T in which the tested semiconductor element is stored into a horizontal state.

Accordingly, the rotator 151 allows the test process to be performed on the test tray T in the vertical state, and the loading and unloading process is performed on the test tray T in the horizontal state.

As the rotator 151 is installed, the amount of increase in the size of the chamber 16 due to the increase in the size of the test tray T may be reduced.

The chamber part 16 includes a first chamber 161, a test chamber 162, and a second chamber 163.

The first chamber 161 moves the test tray T in the vertical state transferred from the exchanger 15 by one step, and the temperature at which the semiconductor device to be tested is to be tested by the test equipment (hereinafter, 'test temperature'). Heating or cooling). When the semiconductor device is adjusted to the test temperature, the test tray T in the vertical state is transferred from the first chamber 161 to the test chamber 162.

The test chamber 162 is a part or all of the high fix board (H) of the test equipment is inserted and coupled, and connects the semiconductor element adjusted to the test temperature to the high fix board (H). When the test of the semiconductor device by the test equipment is completed, the test tray T in the vertical state is transferred from the test chamber 162 to the second chamber 163.

The second chamber 163 restores the tested semiconductor device to room temperature while moving the test tray T in the vertical state step by step. When the semiconductor device is restored to room temperature, the test tray T in the vertical state is transferred from the second chamber 163 to the exchange unit 15.

When the test tray T is transferred to the exchange unit 15, the handler 10 performs an unloading process on the tested semiconductor device stored in the test tray T, and tests the test tray T. A loading process for accommodating a semiconductor device to be performed is performed.

By repeatedly performing the above process, the handler 10 completes the manufacture of the semiconductor device.

Here, in recent years, the handler has been developed to perform a loading process, a test process, and an unloading process for more semiconductor devices in a short time in order to enhance the competitiveness of a product such as cost reduction of semiconductor devices.

As one method for this, the handler is developed to accommodate more semiconductor devices in a test tray, so that more semiconductor devices can be connected to the high resolution board at once.

However, this solution has the following problems.

First, storing more semiconductor elements in one test tray means that the size of the test tray becomes larger. This increase in the size of the test tray increases the size of each component of the handler, thereby increasing the size of the entire handler.

Increasing the size of the entire handler increases the amount of material required to manufacture the handler, which increases the manufacturing cost.

In addition, an increase in the size of the entire handler requires a larger installation space. As described above, the size increase of the chamber portion 16 can be reduced to some extent by installing the rotator 151, but this is limited. In addition, the installation of the rotator 151 cannot affect the increase in the size of other components such as the exchange unit 15.

Second, there is a problem that the time for performing the loading process and the unloading process for one test tray is increased.

This is because more semiconductor devices must be stored in one test tray during the loading process, and more semiconductor devices must be separated from one test tray and classified according to the test results during the unloading process.

Thus, by storing more semiconductor devices in one test tray, a handler developed to connect more semiconductor devices to a high-fix board at one time is not suitable for enhancing the competitiveness of a product such as cost reduction of semiconductor devices.

The present invention has been made to solve the above problems,

SUMMARY OF THE INVENTION An object of the present invention is a handler capable of performing a loading process, a test process, and an unloading process for more semiconductor devices in a short time while minimizing an increase in the size of the handler, a semiconductor device manufacturing method using the same, and a test tray transfer method. The purpose is to provide.

Another object of the present invention is to reduce the time required for the loading process, the test process, and the unloading process, a handler that can lead to an effect that can enhance the competitiveness of the product, such as cost reduction of the semiconductor device, It is an object of the present invention to provide a semiconductor device manufacturing method and a test tray transfer method using the same.

In order to achieve the object as described above, the present invention includes the following configuration.

A handler according to the present invention may include a test tray configured to accommodate a plurality of semiconductor devices, and a connection part provided at an outer circumferential surface thereof, the connection part connecting the connection part and the semiconductor element to each other; A loading unit accommodating a semiconductor device to be tested in a test tray; An unloading unit which separates the tested semiconductor device from the test tray; A first chamber configured to adjust the semiconductor device to be tested stored in the test tray to a test temperature; A test chamber accommodating a plurality of test trays and connecting the connection portions of the test trays to a high fix board; A second chamber for restoring the tested semiconductor element stored in the test tray to room temperature; And a transfer unit for transferring a test tray from the first chamber to the test chamber and transferring a test tray from the test chamber to the second chamber.

A handler according to the present invention may include a test tray configured to accommodate a plurality of semiconductor devices, and a connection part provided at an outer circumferential surface thereof, the connection part connecting the connection part and the semiconductor element to each other; A loading unit accommodating a semiconductor device to be tested in a test tray; An unloading unit which separates the tested semiconductor device from the test tray; A first chamber configured to adjust the semiconductor device to be tested stored in the test tray to a test temperature; A plurality of test chambers including an upper chamber and a lower chamber accommodating a plurality of test trays, connecting the connection parts of the test trays to the high fix board, and adjacently installed in a horizontal direction; A second chamber for restoring the tested semiconductor element stored in the test tray to room temperature; And a transfer unit including a test tray accommodating the tested semiconductor element and a plurality of exchange units exchanging the test tray accommodating the semiconductor element to be tested with at least one of the upper chamber and the lower chamber.

The test tray transfer method according to the present invention is capable of accommodating a plurality of semiconductor elements, the connection portion for the electrical connection is provided on the outer peripheral surface, the test tray having a connection portion for connecting the connection portion and the semiconductor element to be tested Accommodating the semiconductor device in a loading unit; Adjusting the semiconductor device to be tested stored in the test tray to the test temperature in the first chamber; Transferring a test tray containing the semiconductor device to be tested from the first chamber to the exchange unit; Exchanging a test tray containing the tested semiconductor elements and a test tray containing the semiconductor elements to be tested; Connecting the connection part of the test tray containing the semiconductor device to be tested to the high fix board; Transferring a test tray containing the tested semiconductor elements from the exchange unit to the second chamber; Restoring the tested semiconductor device stored in a test tray to room temperature in the second chamber; Separating the semiconductor device tested in the unloading unit from the test tray, and classifying the separated semiconductor device according to a grade according to a test result; And transferring a test tray from which the semiconductor device is separated and emptied from the unloading part to the loading part.

Therefore, by accommodating a plurality of test trays in a horizontal state, and connecting the semiconductor elements stored in the test tray in a horizontal state to the high-fix board through a vertically installed connection portion, more semiconductors without the need to increase the size of the test tray The device can be connected to a high resolution board.

In addition, the loading process, the test process, and the unloading process for more semiconductor devices can be performed in a short time while minimizing the size increase of the handler.

A semiconductor device manufacturing method according to the present invention comprises the steps of preparing a semiconductor device to be tested; The semiconductor device to be tested may be accommodated in the loading unit in a test tray including a plurality of semiconductor elements, a connecting portion for electrical connection disposed on an outer circumferential surface thereof, and a connecting portion connecting the connecting portion and the semiconductor elements to each other. Making a step; Adjusting the semiconductor device to be tested stored in the test tray to the test temperature in the first chamber; Transferring a test tray containing the semiconductor device to be tested from the first chamber to the exchange unit; Exchanging a test tray containing the tested semiconductor elements and a test tray containing the semiconductor elements to be tested; Connecting the connection part of the test tray containing the semiconductor device to be tested to the high fix board; Transferring a test tray containing the tested semiconductor elements from the exchange unit to the second chamber; Restoring the tested semiconductor device stored in a test tray to room temperature in the second chamber; Separating the semiconductor device tested in the unloading unit from the test tray, and classifying the separated semiconductor device according to a grade according to a test result; And transferring a test tray from which the semiconductor device is separated and emptied from the unloading part to the loading part.

Therefore, by minimizing the increase in the size of the handler to implement the manufacturing of more semiconductor devices in a short time, it is possible to enhance the competitiveness of the product, such as cost reduction of the semiconductor device.

According to the present invention, the following effects can be achieved.

The present invention is implemented so that more semiconductor devices can be connected to the high fix board (H) in a short time without increasing or minimizing the time required for the loading and unloading processes for one test tray. The loading process, the test process, and the unloading process for more semiconductor devices can be performed in a short time.

The present invention can be implemented to perform a loading process, a test process, and an unloading process for more semiconductor devices in a short time while minimizing the increase in the size of the handler, thereby enhancing the competitiveness of the product, such as cost reduction of the semiconductor device. You can get the effect.

The present invention can reduce the index time by replacing a test tray in which a test for a semiconductor device is completed first among a plurality of test trays with a test tray containing a semiconductor device to be tested.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a handler according to the present invention will be described in detail.

First, a preferred embodiment of the configuration of the test tray used in the handler according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic perspective view of a test tray housing a semiconductor device in a handler according to the present invention.

Referring to FIG. 3, the test tray 100 is generally formed in a square plate shape, and includes a connection part 101, a connection part 102, and a socket 103.

The connecting portion 101 is installed perpendicular to the main body A of the test tray 100 and connected to the high fix board.

The connection unit 101 may include a plurality of connection pins (not shown) corresponding to the number of semiconductor elements accommodated therein. The high fix board may be electrically connected to the semiconductor device through the connection pin, and may test electrical characteristics of the semiconductor device.

The connection part 102 connects the semiconductor element accommodated in a horizontal state with the connection part 101. One side of the connection portion 102 is connected to the semiconductor element, and the other side is connected to the connection portion 101, thereby electrically connecting the semiconductor element and the connection portion 101.

The connection part 102 may be connected to a semiconductor device in one side of the horizontal state, and may be connected to a connection pin of the connection part 101 in which the other side is installed vertically. The connection unit 102 may be a substrate including a plurality of connection lines connecting one side and the other side.

The socket 103 may accommodate a semiconductor device in a horizontal state, and a plurality of sockets may be installed at regular intervals from the main body A of the test tray 100. The socket 103 may include a latch (not shown) for fixing or releasing a semiconductor device.

Although only one socket 103 is illustrated in FIG. 3 for convenience, the socket 103 may be installed in a matrix corresponding to the number of semiconductor devices.

The latch may apply a constant pressure to the semiconductor device, thereby stably maintaining the state in which the semiconductor device and the connection unit 102 are connected.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the configuration of the handler using the above-described test tray 100 will be described in detail. The handler according to the present invention is divided into one embodiment and another embodiment, which will be described sequentially.

Figure 4 is a plan view schematically showing the configuration of the handler according to an embodiment of the present invention, Figure 5 is a front view schematically showing the chamber and the transfer unit in the handler according to an embodiment of the present invention, Figure 6 is a view of the present invention A front view schematically showing the exchange unit in the handler according to the embodiment.

4 and 5, the handler 1 according to the embodiment of the present invention may include a chamber part 2, a transfer part 3, a loading part 4, an unloading part 5, and a loading stacker ( 6), an unloading stacker 7 and a buffer section 8.

The chamber unit 2 may not only test the semiconductor device at room temperature with the high fix board H, but also test the semiconductor device in the extreme state where the high fix board H is hot or cold. The first chamber 21, the test chamber 22, and the second chamber 23 may be included.

The first chamber 21 adjusts the semiconductor device to be tested contained in the test tray 100 at a test temperature. The first chamber 21 may heat or cool the semiconductor device to be tested, and may include any one or more of an electrothermal heater or a liquid nitrogen injection system for this purpose.

The first chamber 21 may adjust the semiconductor device to be tested contained in the test tray 100 in a horizontal state at a test temperature. The first chamber 21 may adjust the semiconductor device to be tested at a test temperature while raising the test tray 100 in a horizontal state.

The first chamber 21 may include a carrying out portion (not shown).

The carrying out portion is an outlet for the test tray 100 to be transferred from the first chamber 21 to another configuration of the handler.

When the semiconductor device to be tested is adjusted to the test temperature, the test tray 100 may be transferred from the first chamber 21 to the test chamber 22 through the carrying out portion.

The test chamber 22 accommodates the plurality of test trays 100 in a horizontal state, and connects the connecting portion 101 of the test tray 100 to the high fix board H.

The high fix board H may be vertically installed in the test chamber 22, and a part or all of the high fix board H may be inserted into the test chamber 22.

Here, since the test chamber 22 can accommodate the plurality of test trays 100 in a horizontal state, more semiconductor devices are connected to the high fix board H in a short time without increasing the size of the test tray. You can.

Accordingly, the handler 1 can connect more semiconductor devices to the high fix board H in a short time without increasing or minimizing the time required for the loading process and the unloading process for one test tray. Can be.

The test chamber 22 may include any one or more of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor device at a test temperature.

The test chamber 22 includes a moving unit (not shown) for moving the plurality of test trays 100 individually or simultaneously in a direction in which the high fix board H is installed.

The mobile unit connects the connecting portion 101 to the high fix board H by moving the test tray 100 in the direction in which the high fix board H is installed.

A typical actuator may be used as the mobile unit, and a plurality of mobile units may be installed to individually move the plurality of test trays 100.

The test chamber 22 may include an upper chamber 221 and a lower chamber 222 stacked up and down.

Therefore, the volume of each of the upper chamber 221 and the lower chamber 222 can be reduced, and accordingly, the handler 1 can easily maintain the semiconductor device accommodated in the test tray 100 at a test temperature.

The upper chamber 221 and the lower chamber 222 each accommodate a plurality of test trays 100 in a horizontal state, and connect the connecting portions 101 of the test trays 100 to the high fix board H. . A high fix board H may be vertically installed in the upper chamber 221 and the lower chamber 222, respectively.

The upper chamber 221 and the lower chamber 222 may each include any one or more of a heat transfer heater or a liquid nitrogen injection system, each may include at least one moving unit.

The second chamber 23 restores the tested semiconductor device accommodated in the test tray 100 to room temperature. The second chamber 23 may heat or cool the tested semiconductor device, and may include any one or more of an electrothermal heater or a liquid nitrogen injection system.

The second chamber 23 may restore the tested semiconductor device accommodated in the test tray 100 in a horizontal state to room temperature. The second chamber 23 may restore the tested semiconductor device to room temperature while lowering the test tray 100 in a horizontal state.

The second chamber 23 may include an import unit (not shown).

The loading part is an inlet for the test tray 100 to be transferred to the second chamber 23 in another configuration of the handler. The test tray 100 in which the tested semiconductor device is accommodated may be transferred from the test chamber 22 to the second chamber 23 through the carry-in unit.

The transfer unit 3 transfers the test tray 100 containing the semiconductor device to be tested from the first chamber 21 to the test chamber 22, and transfers the test tray 100 containing the tested semiconductor device from the first chamber 21. The test chamber 22 is transferred from the test chamber 22 to the second chamber 23.

Here, since the test chamber 22 may connect the plurality of test trays 100 to the high fix board H, the time required for the test may vary for each test tray 100.

Therefore, the index time can be reduced by exchanging the test tray 100 of the plurality of test trays 100 for the test of the semiconductor device to another test tray 100 containing the semiconductor device to be tested.

The index time means that a semiconductor device stored in one test tray 100 is connected to the high fix board H, and then a semiconductor device stored in another test tray 100 is connected to the high fix board H. Tell the time until.

By reducing the index time, it is possible to reduce the waiting time until the test tray having completed the loading process and the unloading process is transferred to the configuration for performing the next process.

To this end, the transfer part 3 comprises an exchange unit 31.

The exchange unit 31 exchanges the test tray 100 containing the tested semiconductor elements and the test tray 100 containing the semiconductor elements to be tested with the test chamber 22.

That is, the exchange unit 31 separates the test tray 100 in which the test for the semiconductor device is completed in the test chamber 22, and the semiconductor to be tested in the test chamber 22 in which the test tray 100 is separated. The test tray 100 in which the device is accommodated may be supplied.

The test tray 100 separated from the test chamber 22 is transferred from the exchange unit 31 to the second chamber 23. The test tray 100 supplied to the test chamber 22 is a test tray 100 transferred from the first chamber 21 to the exchange unit 31.

4 to 6, the exchange unit 31 includes a tray storage unit 311 capable of accommodating a plurality of test trays 100.

The tray accommodating part 311 separates from the test chamber 100 a test tray 100 in which a test on a semiconductor device is first completed among the plurality of test trays 100 accommodated in the test chamber 22. The test tray 100 separated from the test chamber 100 is transferred from the exchange unit 31 to the second chamber 23.

The tray storage unit 311 supplies a test tray 100 in which a semiconductor device to be tested is stored in the test chamber 22 in which the test tray 100 is separated. The test tray 100 in which the semiconductor element to be tested is accommodated is a test tray 100 transferred from the first chamber 21 to the exchange unit 31.

When the test chamber 22 includes the upper chamber 221 and the lower chamber 222, the tray accommodating part 311 includes a test tray 100 in which a test on a semiconductor device is completed first. It may be separated from at least one of the 221 or the lower chamber 222.

The tray accommodating part 311 may supply the test tray 100 containing the semiconductor device to be tested to at least one of the upper chamber 221 and the lower chamber 222 in which the test tray 100 is separated.

Although not shown, the tray accommodating part 311 has a number of test trays 100 approximately equal to the number of test trays 100 that each of the upper chamber 221 and the lower chamber 222 can accommodate. ) Can be implemented to accommodate.

In this case, although not shown, the first chamber 21 may be installed at one side of the tray housing 311, and the second chamber 23 may be installed at the other side of the tray storage 311. That is, the first chamber 21, the tray storage part 311, and the second chamber 23 may be installed on the same line in the X-axis direction (shown in FIG. 4).

Referring to FIG. 6, the tray storage unit 311 may be installed to be elevated.

In this case, the tray storage unit 311 is implemented to accommodate the number of the test tray 100 less than the number of test tray 100 that each of the upper chamber 221 and the lower chamber 222 can accommodate. Can be.

The tray storing unit 311 may include a storage space for accommodating the test tray 100 in which at least one semiconductor device to be tested is stored, and at least one empty storage space. The empty storage space may accommodate the test tray 100 in which the tested semiconductor device is stored.

The tray accommodating part 311 is moved up or down between the upper chamber 221 and the lower chamber 222, the test tray 100 containing the tested semiconductor elements and the test tray 100 containing the semiconductor elements to be tested. ) May be exchanged with at least one of the upper chamber 221 and the lower chamber 222.

The tray housing 311 may be provided in plural numbers.

The tray storage unit 311, which is provided with plural numbers, is individually raised or lowered, and the test tray 100 in which the tested semiconductor device is accommodated and the test tray 100 in which the semiconductor device to be tested is accommodated are arranged in the upper chamber 221. ) Or at least one of the lower chambers 222.

To this end, the exchange unit 31 includes a lift driver 312 for lifting and lowering the plurality of tray storage units 311 individually.

The elevating driver 312 may use a conventional actuator, and may be configured by a chain or a belt connecting a plurality of pulleys to elevate the tray storing unit 311.

4 and 6, the tray housing 311 may be installed to face the high fix board H in an opposite direction in which the high fix board H is installed in the test chamber 22. . That is, the tray housing 311, the test chamber 22, and the high fix board H may be installed in the order.

4 to 6, the transfer part 3 may include a tray loading part 32 and a tray unloading part 33.

The tray loading part 32 is provided between the first chamber 21 and the exchange unit 31 and accommodates a test tray 100 in which a semiconductor element to be tested is stored.

As the tray loading unit 32 is provided, the test tray 100 containing the semiconductor element to be tested is transferred from the first chamber 21 to the exchange unit 31 via the tray loading unit 32. Can be transported.

The tray loading part 32 may be installed between the upper chamber 221 and the lower chamber 222 when the test chamber 22 includes the upper chamber 221 and the lower chamber 222. have.

Accordingly, the tray loading unit 32 moves separately in the Y-axis direction such that the exchange unit 31 receives the test tray 100 containing the semiconductor element to be tested from the first chamber 21. Without the test tray 100 can be transported.

In addition, since the tray loading unit 32 is positioned on an area where the tray storage unit 311 is raised or lowered, a test tray containing a semiconductor device to be tested while the tray storage unit 311 is raised or lowered ( 100) to be transported.

The tray loading part 32 is preferably formed at the same height as the carrying out portion of the first chamber 21. The test tray 100 in which the semiconductor device to be tested is accommodated may be transferred from the first chamber 21 to the tray loading part 32 through the carrying part.

Although not shown, the tray loading unit 32 may include any one or more of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor device at a test temperature.

The traceunloading unit 33 is installed between the exchange unit 31 and the second chamber 23 and accommodates the test tray 100 in which the tested semiconductor elements are stored.

As the tray loading unit 33 is provided, the test tray 100 in which the tested semiconductor device is stored is transferred from the exchange unit 31 to the second chamber 23 via the tray loading unit 33. Can be transferred.

When the test chamber 22 includes the upper chamber 221 and the lower chamber 222, the tracer loading part 33 may be installed between the upper chamber 221 and the lower chamber 222. Can be. In this case, the tray unloading unit 33 may be installed above or below the tray loading unit 32.

Accordingly, the tray unloading unit 33 moves in the Y-axis direction such that the exchange unit 31 transfers the test tray 100 in which the semiconductor element tested in the second chamber 23 is stored. It is possible to transfer the test tray 100 without moving.

In addition, since the tray loading part 33 is positioned on an area where the tray storage part 311 is raised or lowered, a test tray in which the tested semiconductor device is accommodated while the tray storage part 311 is raised or lowered. Allow 100 to be transported.

By installing the tray loading unit 33 and the tray loading unit 32, the handler 1 can transfer the test tray 100 more efficiently, and further reduce the index time.

The non-loading portion 33 is preferably formed at the same height as the carry-in portion of the second chamber 23. The test tray 100 in which the tested semiconductor device is accommodated may be transferred from the tracer loading part 33 to the second chamber 23 through the carry-in part.

Referring to FIG. 5, the tray loading unit 32 and the tray loading unit 33 may accommodate a plurality of test trays 100 stacked up and down, and the tray loading unit 33 may be a tray loading unit. It may be installed above or below 32.

4 to 6, the loading unit 4 accommodates the semiconductor device to be tested in the test tray 100 and includes a loading picker 41.

The loading picker 41 is provided to be movable in the X-axis direction and the Y-axis direction, and includes a plurality of adsorption nozzles capable of adsorbing a plurality of semiconductor elements.

The loading picker 41 picks up a semiconductor device to be tested in a customer tray located in the loading stacker 6 and performs a loading process of storing the picked-up semiconductor device in a test tray 100 located in the loading area 4a. do.

The loading picker 41 may be installed in plural so as to reduce the time required for the loading process.

The test tray 100 in which the loading process is completed is transferred to the first chamber 21 in the loading area 4a.

The unloading unit 5 separates the tested semiconductor device from the test tray 100 and includes an unloading picker 51.

The unloading picker 51 is provided to be movable in the X-axis direction and the Y-axis direction, and includes a plurality of adsorption nozzles capable of adsorbing a plurality of semiconductor elements.

The unloading picker 51 picks up the tested semiconductor device from the test tray 100 located in the unloading area 5a and stores the picked-up semiconductor device in a customer tray located in the unloading stacker 7. Perform the loading process.

The unloading picker 51 may store the tested semiconductor device in a customer tray located at different positions for each grade according to a test result.

A plurality of unloading pickers 51 may be installed to reduce the time required for the unloading process.

The test tray 100, which is empty after the unloading process is completed, is transferred from the unloading area 5a to the loading area 4a.

The loading stacker 6 stores a plurality of customer trays in which semiconductor elements to be tested are stored. The customer tray, in which all of the semiconductor elements to be tested are transferred and emptied, is transferred to the unloading stacker 7.

The unloading stacker 7 stores a plurality of customer trays in which the tested semiconductor devices are stored. The plurality of customer trays stored in the unloading stacker 7 are stored in different positions for each grade so as to accommodate the tested semiconductor device according to the test result.

The buffer unit 8 temporarily stores a plurality of semiconductor elements to reduce the time required for the loading process and the unloading process.

The buffer unit 8 is installed to be movable in the Y-axis direction (shown in FIG. 4), and includes a loading buffer 81 and an unloading buffer 82.

The loading buffer 81 temporarily stores a semiconductor device to be tested transferred from a customer tray located in the loading stacker 6.

That is, the semiconductor device to be tested is stored in the test tray 100 located in the loading area 4a via the loading buffer 81 in the customer tray located in the loading stacker 6.

The unloading buffer 82 temporarily stores the tested semiconductor device transferred from the test tray 100 located in the unloading area 5a.

That is, the tested semiconductor device is stored in the customer tray located in the unloading stacker 7 via the unloading buffer 82 in the test tray 100 located in the unloading area 5a.

The loading buffer 81 and the unloading buffer 82 may be provided in plural numbers, thereby further reducing the time required for the loading process and the unloading process.

As the buffer unit 8 is installed, the loading picker 41 includes a first loading picker 411 and a second loading picker 412, and the unloading picker 51 includes a first unloading picker. 511 and the second unloading picker 512.

The first loading picker 411 picks up the semiconductor device to be tested from the customer tray located in the loading stacker 6 and stores the picked up semiconductor device in the loading buffer 81.

The second loading picker 412 picks up the semiconductor device to be tested in the loading buffer 81 and stores the picked-up semiconductor device in the test tray 100 located in the loading area 4a.

The first unloading picker 511 picks up the semiconductor device tested in the unloading buffer 82 and stores the picked-up semiconductor device in a customer tray stored at different positions for each grade in the unloading stacker 7. .

The second unloading picker 512 picks up the tested semiconductor device from the test tray 100 located in the unloading area 5a and stores the picked-up semiconductor device in the unloading buffer 82.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the configuration of a handler according to another embodiment of the present invention will be described in detail.

Here, since the handler according to another embodiment of the present invention includes a configuration substantially identical to the above-described embodiment, a description of these configurations will be omitted so as not to obscure the subject matter of the present invention. Only configurations that differ from the examples are described.

7 is a plan view schematically showing the configuration of a handler according to another embodiment of the present invention, FIG. 8 is a perspective view schematically showing a chamber part and a transfer part in a handler according to another embodiment of the present invention, and FIG. 9 is another view of the present invention. Front view schematically showing the exchange unit in the handler according to the embodiment, FIG. 10 is a front view of FIG. 8.

7 to 9, the handler 1 according to another embodiment of the present invention has a configuration different from the above-described embodiment, the test chamber 22, the exchange unit 31, the trading unit ( 32, and a non-loading unit 33.

The plurality of test chambers 22 are adjacently installed in a horizontal direction (X-axis direction, shown in FIG. 7). The high fix board H is inserted into the test chamber 22.

The test chamber 22 may include an upper chamber 221 and a lower chamber 222, respectively.

Therefore, more semiconductor devices can be connected to the high fix board H in a shorter time than one embodiment of the present invention.

8 and 9, a plurality of the exchange unit 31 is adjacently installed in the horizontal direction. That is, a plurality of exchange units 31 may be installed in parallel to the plurality of test chambers 22.

Referring to FIG. 9, a plurality of tray loading parts 32 are disposed adjacent to each other in the horizontal direction between the upper chamber 221 and the lower chamber 222.

That is, a plurality of the tray loading part 32 may be installed in parallel to the plurality of test chambers 22.

A plurality of the trailing rod 33 is adjacently installed in the horizontal direction between the upper chamber 221 and the lower chamber 222.

That is, the traceunloading unit 33 may be provided in plural in parallel to the plurality of test chambers 22.

The tray unloading part 33 is preferably installed above or below the tray loading part 32.

7 to 9, in the handler 1 according to another embodiment of the present invention, the test chamber 22, the exchange unit 31, the tray loading part 32, and the trace loading part It is preferable that 33 is provided in the same number.

The handler 1 according to another embodiment of the present invention may connect more semiconductor devices to the high fix board H in a short time as the number of installations of the test chamber 22 increases. However, in proportion to the increase in the number of installation of the test chamber 22, the size of the handler 1 is increased.

Therefore, the number of installation of the test chamber 22 should be determined in consideration of the increase in the size of the handler (1).

Hereinafter, as an embodiment of the handler 1 according to another embodiment of the present invention, an embodiment in which two test chambers 22 are installed will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 7 and 8, the test chamber 22 includes a first test chamber 22a and a second test chamber 22b which are adjacently installed in a horizontal direction (X-axis direction, shown in FIG. 7). do.

The first test chamber 22a is disposed adjacent to the first chamber 21 and includes a first upper chamber 221a and a first lower chamber 222a that are stacked up and down.

The first upper chamber 221a and the first lower chamber 222a may each accommodate a plurality of test trays 100 in a horizontal state.

High fix boards H are inserted into the first upper chamber 221a and the first lower chamber 222a, respectively.

The second test chamber 22b is disposed adjacent to the second chamber 23, and includes a second upper chamber 221b and a second lower chamber 222b stacked up and down.

The second upper chamber 221b and the second lower chamber 222b may each accommodate a plurality of test trays 100 in a horizontal state.

A high fix board H is inserted into the second upper chamber 221b and the second lower chamber 222b, respectively.

The exchange unit 31 includes a first exchange unit 31a and a second exchange unit 31b which are adjacently installed in the horizontal direction (X-axis direction, shown in FIG. 7).

7 to 10, the first exchange unit 31a is installed to correspond to the first test chamber 22a.

The first exchange unit 31a includes a first tray storage portion 311a and a first lift driver 312a.

The first tray storage unit 311a may accommodate a plurality of test trays 100 and includes a first upper storage unit 3111a and a first lower storage unit 3112a.

The semiconductor device, which has been tested in at least one of the first upper chamber 221a or the first lower chamber 222a while the first upper accommodating part 3111a and the first lower accommodating part 3112a is raised or lowered, Separate the received test tray 100.

The first upper accommodating part 3111a and the first lower accommodating part 3112a may be tested in at least one of the first upper chamber 221a or the first lower chamber 222a in which the test tray 100 is separated. The test tray 100 in which the semiconductor elements are stored is supplied.

The first upper storage part 3111a may exchange the first lower chamber 222a and the test tray 100, and the first lower storage part 3112a may replace the first upper chamber 221a and the test tray 100. 100) may be exchanged.

This is a test tray in which semiconductor devices to test a test tray 100 in which a test for a semiconductor device is first completed among a plurality of test trays 100 accommodated in the first upper chamber 221a and the first lower chamber 222a are stored. This is for exchange with 100.

The first elevating driver 312a may elevate the first upper accommodating part 3111a and the first lower accommodating part 3112a separately.

The second exchange unit 31b is installed to correspond to the second test chamber 22b.

The second exchange unit 31b may include a test tray 100 containing the tested semiconductor elements and a test tray 100 containing the semiconductor elements to be tested, in the second upper chamber 221b or the second lower chamber 222b. It can be exchanged with at least one of them.

To this end, the second exchange unit 31b, like the first exchange unit 31a, includes a second tray storage portion 311b and a second lift driver 312b.

The second tray storage unit 311b includes a second upper storage unit 3111b and a second lower storage unit 3112b similarly to the first tray storage unit 311a.

7 to 10, the tray loading part 32 includes a first tray loading part 32a and a second tray loading part 32b which are adjacently installed in the horizontal direction.

The first tray loading part 32a is installed between the first upper chamber 221a and the first lower chamber 222a.

The second tray loading part 32b is installed between the second upper chamber 221b and the second lower chamber 222b.

Accordingly, the test tray 100 in which the semiconductor device to be tested is accommodated may be transferred from the first chamber 21 to the first exchange unit 31a via the first tray loading part 32a.

Alternatively, the test tray 100 containing the semiconductor device to be tested is transferred from the first chamber 21 to the second tray loading part 32b via the first tray loading part 32a. The tray loading part 32b may be transferred to the second exchange unit 31b.

The tray unloading unit 33 includes a first tray unloading unit 33a and a second tray unloading unit 33b which are installed adjacent to each other in the horizontal direction.

The first tray loading part 33a is installed above or below the first tray loading part 32a.

The second tray loading part 33b is installed above or below the second tray loading part 32b.

Accordingly, the test tray 100 in which the tested semiconductor device is accommodated may be transferred from the second exchange unit 31b to the second chamber 23 via the second tray loading unit 33b.

Alternatively, the test tray 100 containing the tested semiconductor elements is transferred from the first exchange unit 31a to the second tray loading unit 33b via the first tray loading unit 33a. It may be transferred from the second trailing rod 33 (b) to the second chamber (23).

Here, the handler according to the above-described embodiments of the present invention and another embodiment may further include a rotator. Hereinafter, a preferred embodiment of the rotator will be described in detail with reference to the accompanying drawings.

11 is a perspective view schematically showing a rotator according to the present invention.

11, the rotator 9 according to the present invention can be rotated clockwise or counterclockwise while maintaining the horizontal test tray 100 in a horizontal state.

Referring to FIGS. 3, 4, 7, and 11, the reason why the rotator 9 is installed in the handler 1 is as follows.

The semiconductor device may be formed in various shapes and sizes according to the type, and the lengths in the horizontal direction and the vertical direction may be different from each other. For example, the semiconductor device may be formed longer in the vertical direction than in the horizontal length.

In the test tray 100 accommodating the semiconductor elements, the socket 103 is formed in an m X n matrix (m, n is an integer greater than 1) to accommodate a plurality of semiconductor elements. For example, the test tray 100 capable of accommodating 64 semiconductor devices may have a socket 103 formed in an 8 × 8 matrix.

Here, since the socket 103 is formed in a shape corresponding to the semiconductor element, it may be formed longer in the longitudinal direction than the length in the horizontal direction. Accordingly, the test tray 100 may also be formed longer in the longitudinal direction than the length in the horizontal direction.

The test tray 100 according to the present invention includes a connection portion 101, and the connection portion 101 includes a plurality of connection pins corresponding to the number of semiconductor elements accommodated in the socket 103. The high fix board H may be electrically connected to the semiconductor device through the connection pin, and may test electrical characteristics of the semiconductor device.

Therefore, the connection portion 101 should be installed in the test tray 100 in a direction that can be connected to the high-fix board (H).

However, since the test tray 100 is formed longer in the longitudinal direction than the length in the horizontal direction, it is difficult to form the connection portion 101 in the relatively narrow transverse direction in the test tray 100.

When the connecting portion 101 is installed in the longitudinal direction of the test tray 100, the test tray 100 can be easily manufactured. In this case, the connection part 101 may be installed in the test tray 100 in a direction orthogonal to the high fix board H in the test chamber 22.

Therefore, as one method for connecting the connection portion 101 to the high fix board H, the test tray 100 is rotated in a direction in which the connection portion 101 can be connected to the high fix board H. There is a way.

To this end, the rotator 9 is installed in the handler 1.

The handler 1 has a rotator 9 is installed, the loading process, the test process, for a semiconductor device that can be formed in a variety of shapes and sizes depending on the type, such as the length of the transverse direction and the longitudinal direction are different from each other, And an unloading process.

In addition, since the handler 1 is provided with a rotator 9, even if the semiconductor device is formed in a square shape, the test tray 100 may have different rows and columns of the socket 103 formed in a matrix in the test tray 100. 100 may be appropriately formed when the length is formed longer in the lengthwise direction than in the lengthwise direction.

4, 7, and 11, the rotator 9 includes a loading rotator 91 and an unloading rotator (not shown). Although not shown, the unloading rotator may be formed to have a structure substantially coincident with the loading rotator 91.

The loading rotator 91 is installed between the loading unit 4 and the first chamber 21, and the test unit 100 of the test tray 100 faces the direction in which the high fix board H is installed. Rotate the tray 100.

The loading rotator 91 may be installed to be elevated to lower the test tray 100. The loading rotator 19 is preferably installed to be elevated in the first chamber (21).

This is because the position 91a receiving the test tray 100 from the loading unit 4 is formed at a position higher than the position 91b for transferring the test tray 100 to the first chamber 21. .

The loading rotator 91 may rotate the test tray 100 while lowering the test tray 100.

In this case, the connecting portion 101 faces the direction orthogonal to the direction in which the high fix board H is installed at the position 91a where the test tray 100 is transferred from the loading unit 4. The connecting portion 101 is rotated to face the direction in which the high fix board H is installed at a position 91b for transferring the test tray 100 to the first chamber 21.

Accordingly, the test tray 100 has the first chamber 21, the test chamber 22, and the second chamber 23 in a state in which the connecting portion 101 is rotated to face the direction in which the test board H is installed. Is transferred to).

The unloading rotator is installed between the unloading part 5 and the second chamber 23, and rotates the test tray 100 in the opposite direction rotated by the loading rotator 91.

Accordingly, the test tray 100 may be rotated such that the connection portion 101 faces the direction orthogonal to the direction in which the high fix board H is installed. That is, the test tray 100 is restored to a state before the rotation by the loading rotator (91).

The unloading rotator may be installed to be liftable to raise the test tray 100. The unloading rotator is preferably installed to be elevated in the second chamber (23).

This is because the position for transferring the test tray 100 to the unloading part 5 is formed at a position higher than the position for receiving the test tray 100 from the second chamber 23.

The unloading rotator may rotate the test tray 100 while raising the test tray 100.

In this case, the connecting portion 101 faces the direction in which the high fix board H is installed at the position where the test tray 100 is transferred from the second chamber 23. The connection part 101 is rotated to face in a direction orthogonal to the direction in which the high fix board H is installed at a position for transferring the test tray 100 to the unloading part 5.

Accordingly, the test tray 100 is transferred to the unloading part 5 and the loading part 4 in a state in which the connection part 101 is rotated to face in a direction orthogonal to the direction in which the test board H is installed. Can be.

The loading rotator 91 and the unloading rotator may be moved up and down by receiving a driving force by a driving unit consisting of a chain or a belt connecting a plurality of pulleys to each other, and receiving a rotational force by a rotating motor to receive a test tray 100. Can be rotated.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the test tray transfer method according to the present invention will be described in detail.

4 to 10, the test tray transfer method according to the present invention includes the following configuration.

First, the semiconductor device to be tested is accommodated in the loading unit 4 in the test tray 100.

In this process, the loading picker 41 picks up a semiconductor device to be tested in a customer tray located in the loading stacker 6, and the picked-up semiconductor device is loaded through the loading buffer unit 81 to the loading area 4a. It can be made by accommodating the test tray (T) located in.

Next, the semiconductor device to be tested stored in the test tray 100 is adjusted to the test temperature in the first chamber 21.

This process may be performed by heating or cooling the semiconductor device to be tested contained in the test tray 100 while raising the test tray T having completed the loading process in the first chamber 21.

Next, the test tray 100 containing the semiconductor device to be tested is transferred from the first chamber 21 to the exchange unit 31.

Such a process may be performed by the transfer unit 3, and the semiconductor device to be tested contained in the test tray 100 may be a semiconductor device adjusted to a test temperature in the first chamber 21.

Next, the test tray 100 in which the tested semiconductor elements are stored and the test tray 100 in which the semiconductor elements to be tested are accommodated are exchanged.

In this process, the exchange unit 31 separates the test tray 100 in which the test for the semiconductor device is completed first from the test chamber 22, and tests the test tray 100 in the separated test chamber 22. This may be achieved by supplying a test tray 100 in which semiconductor elements are stored.

In addition, when the test chamber 22 includes the upper chamber 221 and the lower chamber 222, the exchange unit 31 may test the test tray 100 containing the tested semiconductor elements and the test chamber 22. The test tray 100 in which the semiconductor device is accommodated may be exchanged with at least one of the upper chamber 221 and the lower chamber 222.

Next, the connection portion 101 of the test tray 100 containing the semiconductor device to be tested is connected to the high fix board H.

This process may be performed by moving the test tray 100 containing the semiconductor device to be tested in the test chamber 22 in the direction in which the high fix board H is installed by the mobile unit. The semiconductor device connected to the connection portion 101 connected to the high fix board H is tested for electrical characteristics by the high fix board H.

Next, the test tray 100 containing the tested semiconductor elements is transferred from the exchange unit 31 to the second chamber 23. This process can be done by the transfer unit (3).

Next, the tested semiconductor device stored in the test tray 100 is restored to room temperature in the second chamber 23.

This process may be performed by lowering the test tray T in which the tested semiconductor device is stored in the second chamber 23, and restoring the tested semiconductor device stored in the test tray 100 to room temperature.

Next, the semiconductor device tested in the unloading unit 5 is separated from the test tray 100, and the separated semiconductor device is classified according to a grade according to the test result.

In this process, the unloading picker 51 picks up the tested semiconductor device from the test tray 100 located in the unloading area 5a and tests the picked-up semiconductor device via the unloading buffer unit 82. According to the result it can be made by accommodating the customer loading tray stored in different positions for each grade in the unloading stacker (7).

In the process, the tested semiconductor device accommodated in the test tray 100 is preferably a semiconductor device restored to room temperature in the second chamber 23.

Next, the test tray 100 in which the semiconductor elements are separated and emptied is transferred from the unloading unit 5 to the loading unit 4.

This process may be performed by transferring the test tray 100 having completed the unloading process from the unloading area 5a to the loading area 4a.

In the test tray transfer method according to the present invention, the step of transferring the test tray 100 containing the semiconductor element to be tested from the first chamber 21 to the exchange unit 31 includes the following steps. Can be.

First, the test tray 100 containing the semiconductor device to be tested is transferred from the first chamber 21 to the tray loading part 32. This process can be done by the transfer unit (3).

Here, the tray loading portion 32 may be installed between the first chamber 21 and the exchange unit 31. In addition, when the test chamber 22 includes the upper chamber 221 and the lower chamber 222, the tray loading part 32 may be installed between the upper chamber 221 and the lower chamber 222. Can be.

Next, the test tray 100 containing the semiconductor device to be tested is transferred from the tray loading part 32 to the exchange unit 31. This process can be done by the transfer unit (3).

 In the test tray transfer method according to the present invention, the step of transferring the test tray 100 containing the tested semiconductor element from the exchange unit 31 to the second chamber 23 includes the following steps. Can be.

First, the test tray 100 containing the tested semiconductor elements is transferred from the exchange unit 31 to the tray unloading unit 33. This process can be done by the transfer unit (3).

Here, the tray unloading unit 33 may be installed between the exchange unit 31 and the second chamber (23). In addition, the tracer loading part 33 is installed between the upper chamber 221 and the lower chamber 222 when the test chamber 22 includes the upper chamber 221 and the lower chamber 222. Can be.

Next, the test tray 100 containing the tested semiconductor elements is transferred from the tray unloading unit 33 to the second chamber 23. This process can be done by the transfer unit (3).

4, 7, and 11, the test tray transfer method according to the invention may further comprise the following steps.

First, the connection unit 101 rotates the test tray 100 in which the semiconductor device to be tested is stored so as to face the direction in which the high fix board H is installed.

This process may be performed by the loading rotator 91 installed between the loading unit 4 and the first chamber 21.

In addition, the process may be achieved by the loading rotator 91 is rotated clockwise or counterclockwise while maintaining the test tray 100 in a horizontal state.

Next, the test tray 100 containing the tested semiconductor device is rotated such that the connection part 101 faces the original direction.

This process may be performed by the unloading rotator provided between the unloading part 5 and the second chamber 23. By this process, the connection portion 101 can be rotated in a direction orthogonal to the direction in which the high fix board H is installed.

In addition, the process may be performed by the unloading rotator rotates clockwise or counterclockwise while maintaining the test tray 100 in a horizontal state. The semiconductor device accommodated in the test tray 100 may be a semiconductor device restored to room temperature in the second chamber 23.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in detail.

Here, the semiconductor device manufacturing method includes a process similar to the test tray transfer method described above, the description of such a process will be omitted so as not to obscure the subject matter of the present invention, and will be described only the difference process. do.

4 to 11, the method of manufacturing a semiconductor device according to the present invention includes the following steps as a process that differs from the test tray transfer method described above.

First, a semiconductor device to be tested is prepared. Such a process may be performed by storing a semiconductor device to be tested in a customer tray and storing it in the loading stacker 6. In addition, the semiconductor device may include a memory or non-memory semiconductor device, a module IC, and the like.

Next, the prepared semiconductor device to be tested is accommodated in the loading unit 4 in the test tray 100.

In this process, the loading picker 41 picks up the prepared semiconductor device to be tested from the customer tray located in the loading stacker 6 and transfers the picked-up semiconductor device to the loading area via the loading buffer unit 81. It may be made by accommodating the test tray 100 located in 4a).

By repeatedly performing the above process, the manufacturing of the semiconductor device is completed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a plan view schematically showing the configuration of a conventional handler

Figure 2 is a schematic diagram showing a path in which the test tray is transported in the handler of Figure 1

3 is a schematic perspective view of a test tray accommodating a semiconductor device in a handler according to the present invention;

Figure 4 is a plan view schematically showing the configuration of a handler according to an embodiment of the present invention

Figure 5 is a front view schematically showing the chamber and the transfer unit in the handler according to an embodiment of the present invention

6 is a front view schematically showing an exchange unit in a handler according to an embodiment of the present invention;

7 is a plan view schematically showing the configuration of a handler according to another embodiment of the present invention.

8 is a perspective view schematically showing a chamber part and a transfer part in a handler according to another embodiment of the present invention;

9 is a front view of FIG. 8

10 is a front view schematically showing an exchange unit in a handler according to another embodiment of the present invention.

11 is a perspective view schematically showing a rotator according to the present invention

* Description of the symbols for the main parts of the drawings *

DESCRIPTION OF SYMBOLS 1 Handler 2 Chamber part 3 Transfer part 4 Loading part 5 Unloading part

6 Loading Stacker 7 Unloading Stacker 8 Buffer 9 Rotator 21 First Chamber

22: test chamber 23: second chamber 31: exchange unit 32: tray loading unit

33: Unloading part 41: Loading picker 51: Unloading picker 81: Loading buffer part

82: unloading buffer portion 91: loading rotator 100: test tray 101: connection

102 connection portion 103 socket 221 upper chamber 222 lower chamber

311: Tray storing unit 312: Lift driving unit 411: First loading picker 412: Second loading picker

511: first unloading picker 512: second unloading picker 4a: loading area 5a: unloading area

22a: first test chamber 22b: second test chamber 31a: first exchange unit

31b: 2nd exchange unit 32a: 1st tray loading part 32b: 2nd tray loading part

33a: first train-loading unit 33b: second train-loading unit 221a: first upper chamber

221b: second upper chamber 222a: first lower chamber 222b: second lower chamber

311a: 1st tray storage part 311b: 2nd tray storage part 312b: 2nd lifting drive part

312a: first lift drive section 3111a: first upper storage section 3111b: second upper storage section

3112a: first lower compartment 3112b: second lower compartment

DESCRIPTION OF SYMBOLS 10 Conventional handler 11 Loading stacker 12 Unloading stacker 13 Picker part

Reference numerals 14 buffer portion 15 exchange portion 16 chamber portion 131 first picker 132 second picker

Reference numeral 141: loading buffer portion 142: unloading buffer portion 161: first chamber 162: test chamber

163: second chamber 131a: first loading picker 131b: first unloading picker

132a: second loading picker 132b: second unloading picker 151: rotator

Claims (22)

A test tray capable of accommodating a plurality of semiconductor elements, having a connection portion provided at an outer circumferential surface thereof, the connection portion connecting the connection portion and the semiconductor element to each other; A loading unit accommodating a semiconductor device to be tested in a test tray; An unloading unit which separates the tested semiconductor device from the test tray; A first chamber configured to adjust the semiconductor device to be tested stored in the test tray to a test temperature; A test chamber accommodating a plurality of test trays in a horizontal state and connecting the connection portions respectively provided in the test trays to a high fix board installed vertically; A second chamber for restoring the tested semiconductor element stored in the test tray to room temperature; And A transfer unit for transferring a test tray from the first chamber to the test chamber and transferring a test tray from the test chamber to the second chamber; Handler comprising a. The handler of claim 1, wherein the transfer unit comprises a test tray accommodating the tested semiconductor element and an exchange unit for exchanging the test tray accommodating the semiconductor element to be tested with the test chamber. According to claim 2, wherein the exchange unit comprises a tray housing for accommodating a plurality of test trays, And the tray storage unit separates a test tray in which the tested semiconductor device is stored from the test chamber, and supplies a test tray in which the semiconductor device to be tested is stored to the test chamber. The test chamber of claim 2, wherein the test chamber includes an upper chamber and a lower chamber stacked on top of each other. The exchange unit includes a tray housing for accommodating a plurality of test trays, And the tray storing unit separates a test tray from at least one of the upper chamber and the lower chamber, and supplies a test tray to at least one of the upper chamber and the lower chamber. The method of claim 2, wherein the transfer unit A tray loading unit disposed between the first chamber and the exchange unit and accommodating a test tray in which a semiconductor element to be tested is stored; And a non-loading unit installed between the exchange unit and the second chamber and receiving a test tray in which the tested semiconductor device is accommodated. The method of claim 5, wherein the test chamber comprises an upper chamber and a lower chamber stacked on top of each other, And the tray loading unit and the tray loading unit are disposed between the upper chamber and the lower chamber. A test tray capable of accommodating a plurality of semiconductor elements, having a connection portion provided at an outer circumferential surface thereof, the connection portion connecting the connection portion and the semiconductor element to each other; A loading unit accommodating a semiconductor device to be tested in a test tray; An unloading unit which separates the tested semiconductor device from the test tray; A first chamber configured to adjust the semiconductor device to be tested stored in the test tray to a test temperature; A plurality of tests including an upper chamber and a lower chamber respectively accommodating a plurality of test trays in a horizontal state, and connecting the connecting portions respectively installed in the test trays to a high fix board installed vertically and adjacently installed in a horizontal direction. chamber; A second chamber for restoring the tested semiconductor element stored in the test tray to room temperature; And And a transfer unit including a test tray accommodating the tested semiconductor element and a plurality of exchange units exchanging the test tray accommodating the semiconductor element to be tested with at least one of the upper chamber and the lower chamber. The method of claim 7, wherein the exchange unit comprises a tray housing for accommodating a plurality of test trays, And the tray storing unit separates a test tray from at least one of the upper chamber and the lower chamber, and supplies a test tray to at least one of the upper chamber and the lower chamber. The handler according to any one of claims 3, 4, and 8, wherein the tray storage part is provided to be elevated. The method of claim 9, wherein the tray storage portion is provided with a plurality, The exchange unit is a handler, characterized in that it comprises a lifting drive unit for lifting the plurality of tray receiving units individually. 9. The handler as claimed in any one of claims 3, 4 and 8, wherein the tray housing is provided to face the high fix board in an opposite direction in which the high fix board is installed in the test chamber. The method of claim 7, wherein the transfer unit A plurality of tray loading units adjacent to the upper chamber and the lower chamber in a horizontal direction and accommodating a test tray in which semiconductor elements to be tested are accommodated; And a plurality of non-loading portions disposed between the upper chamber and the lower chamber in a horizontal direction and accommodating a test tray accommodating the tested semiconductor elements. The method of claim 5 or 12, wherein the first chamber comprises a carrying out portion to which the test tray is carried out, The second chamber includes an carry-in portion into which a test tray is carried in. The carrying out portion is formed at the same height as the tray loading portion, And the carrying-in part is formed at the same height as the trace-unloading part. The method of claim 5 or 12, wherein the tray loading unit and the tray unloading unit stacks a plurality of test trays up and down, And the tray loading unit is installed above or below the tray loading unit. The handler according to claim 12, wherein the test chamber, the exchange unit, the tray loading part, and the tray loading part are installed in a same number. delete Storing a semiconductor element to be tested in a loading section in a test tray including a plurality of semiconductor elements, a connecting portion for electrical connection disposed on an outer circumferential surface thereof, and a connecting portion connecting the connecting portion and the semiconductor elements to each other; ; Adjusting the semiconductor device to be tested stored in the test tray to the test temperature in the first chamber; Transferring a test tray containing the semiconductor device to be tested from the first chamber to the exchange unit; Exchanging a test tray containing the tested semiconductor elements and a test tray containing the semiconductor elements to be tested; Connecting the connecting portions provided in the test trays in the horizontal state in which the semiconductor device to be tested is accommodated, to the high fix board installed perpendicular to the test chamber; Transferring a test tray containing the tested semiconductor elements from the exchange unit to the second chamber; Restoring the tested semiconductor device stored in a test tray to room temperature in the second chamber; Separating the semiconductor device tested in the unloading unit from the test tray, and classifying the separated semiconductor device according to a grade according to a test result; And The test tray transfer method comprising the step of transferring the test tray from which the semiconductor element is separated and emptied from the unloading unit to the loading unit. 18. The method of claim 17, wherein transferring the test tray containing the semiconductor device to be tested from the first chamber to the exchange unit comprises: transferring a test tray containing the semiconductor device to be tested from the first chamber to the tray loading unit; And transferring a test tray containing the semiconductor element to be tested from the tray loading unit to the exchange unit. The transferring of the test tray containing the tested semiconductor device from the exchange unit to the second chamber may include transferring the test tray containing the tested semiconductor device from the exchange unit to the tray loading unit, and the tested semiconductor device may be And transferring the accommodated test tray from the tray unloading unit to the second chamber. 18. The method of claim 17, wherein the test tray transfer method Rotating a test tray containing a semiconductor device to be tested so that the connection part faces a direction in which the high fix board is installed; And And rotating the test tray in which the tested semiconductor device is accommodated such that the connection part faces the original direction. delete delete delete

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