KR100938170B1 - Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor - Google Patents

Abstract

The present invention includes a first lift unit for lifting and lowering a test tray along a first lift path, and a loading unit including a loading picker performing a loading process on a test tray positioned at the loading position; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; And a second lifting unit for elevating and lowering the test tray along a second elevating path, and an unloading picker for performing an unloading process on a test tray transferred from the chamber unit and positioned at the unloading position. An unloading portion disposed next to the portion; A rotating unit rotating the test tray conveyed from the loading unit from a horizontal state to a vertical state and rotating the test tray conveyed from the chamber unit from a vertical state to a horizontal state; And a transfer unit for transferring a test tray between the loading unit, the rotating unit, and the unloading unit, a test tray transfer method, and a semiconductor device manufacturing method.

According to the present invention, the loading process and the unloading process can be simplified, the frequency of error occurrence can be reduced, and the time taken for the loading process and the unloading process can be shortened by reducing the waiting time of the test tray.

Handlers, Semiconductors, Test Trays, Loading, Unloading

Description

Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor

The present invention relates to a handler for connecting a semiconductor device to be tested to a test device and classifying the semiconductor device tested by the test device according to a test result.

A memory IC or a non-memory semiconductor device and a module IC (hereinafter, referred to as a "semiconductor device") having a circuit structure appropriately configured on one substrate are manufactured through various test procedures.

The equipment used in this test is the handler.

The handler is a device that connects the semiconductor device to be tested to a separate test device for testing the semiconductor device and classifies the semiconductor device tested by the test device according to a grade according to the test result.

The handler performs a loading process, an unloading process, and a test process by using a test tray having a plurality of sockets for accommodating semiconductor elements.

The loading process picks up the semiconductor devices to be tested from the customer tray containing the semiconductor devices to be tested and stores them in the test tray. The loading step is performed by a picker including a nozzle capable of absorbing a semiconductor device.

The unloading process separates the semiconductor devices tested in the test tray and stores the semiconductor devices in customer trays located at different positions according to the grades according to the test results. The unloading process is performed by a picker.

The test process connects the semiconductor devices to be tested contained in the test tray to the test equipment. The test equipment includes a high resolution board to which the semiconductor devices to be tested can be connected. The test equipment tests the semiconductor devices to determine electrical characteristics of the semiconductor devices connected to the high fix board.

1 is a plan view schematically showing a handler according to the prior art, and FIG. 2 is a schematic view showing a path in which a test tray is transported in the handler according to the prior art. In FIG. 2, reference numerals denoted in the test tray indicate the configuration of the handler in which the test tray is located.

1 and 2, the handler 10 according to the related art includes a loading stacker 11, an unloading stacker 12, a picker unit 13, a buffer unit 14, and an exchange unit 15. , And chamber portion 16.

The loading stacker 11 stores a plurality of customer trays containing semiconductor devices to be tested.

The unloading stacker 12 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices are housed in customer trays located at different locations according to the test results.

The picker unit 13 includes a nozzle capable of absorbing a semiconductor device, and includes a first loading picker 131, a second loading picker 132, a first unloading picker 133, and a second unloading picker. 134.

The first loading picker 131 picks up the semiconductor devices to be tested from the customer tray located in the loading stacker 11 and stores them in the buffer unit 14. The first loading picker 131 may be moved in the X-axis direction and the Y-axis direction.

The second loading picker 132 picks up the semiconductor devices to be tested in the buffer unit 14 and stores them in a test tray T located in the exchange unit 15. The second loading picker 132 may be moved in the X-axis direction.

The first unloading picker 133 picks up the semiconductor devices tested by the buffer unit 14 and stores them in a customer tray located in the unloading stacker 12. The first unloading picker 133 may be moved in the X-axis direction and the Y-axis direction.

The second unloading picker 134 separates the semiconductor devices tested in the test tray T located in the exchanger 15, and stores the semiconductor devices in the buffer unit 14. The second unloading picker 134 may be moved in the X-axis direction.

The buffer unit 14 is installed to be movable in the Y-axis direction and temporarily stores semiconductor elements. The buffer unit 14 includes a loading buffer unit 141 and an unloading buffer unit 142.

The loading buffer unit 141 is disposed on one side of the exchange unit 15 to temporarily receive the semiconductor devices to be tested.

The unloading buffer part 142 is disposed at the other side of the exchange part 15 and temporarily receives the tested semiconductor devices.

The exchanger 15 exchanges the test tray T in which the semiconductor elements to be tested are accommodated and the test tray T in which the tested semiconductor elements are accommodated with the chamber part 16. The test tray T in which the semiconductor elements to be tested are stored is transferred from the exchange part 15 to the chamber part 16, and the test tray T in which the tested semiconductor elements are received is stored in the chamber part 16. Transferred to the exchange unit 15.

In the exchange unit 15, the tested semiconductor devices are separated from the test tray T, and the semiconductor devices to be tested are stored in the test tray T.

The exchange unit 15 may further include a rotator 151 for rotating the test tray (T).

The rotator 151 may rotate from the horizontal state to the vertical state by rotating the test tray T in which the semiconductor elements to be tested are accommodated. The rotator 151 may rotate from the vertical state to the horizontal state by rotating the test tray T in which the tested semiconductor elements are accommodated.

The chamber unit 16 includes a first chamber 161, a test chamber 162, and a second chamber 163 so that the test equipment can test the semiconductor device not only at room temperature but also at high or low temperature. It includes.

The first chamber 161 moves the test tray T therein, and heats or cools the semiconductor devices to be tested contained in the test tray T. The semiconductor devices to be tested are controlled by the test equipment to a temperature to be tested (hereinafter referred to as a 'test temperature'). When the semiconductor devices to be tested are adjusted to the test temperature, the test tray T is transferred from the first chamber 161 to the test chamber 162.

The test chamber 162 connects the semiconductor devices adjusted to the test temperature to the high fix board H. A part or all of the high fix board H is inserted into and installed in the test chamber 162, and a contact unit 162 a is installed to connect the semiconductor devices controlled to the test temperature to the high fix board H. The handler 10 may include a plurality of test chambers 162. When the test for the semiconductor devices is completed, the test tray T is transferred from the test chamber 162 to the second chamber 163.

The second chamber 163 moves the test tray T therein and restores the tested semiconductor devices accommodated in the test tray T to room temperature. When the semiconductor devices are restored to or close to room temperature, the test tray T is transferred from the second chamber 163 to the exchange unit 15.

Since the handler 10 includes both the process of accommodating the semiconductor devices to be tested in the test tray T and the process of separating the tested semiconductor devices from the test tray T in the exchange unit 15. I have the following problem.

First, in the exchange unit 15, a process of storing the semiconductor elements to be tested is continuously performed in a socket that is emptied by separating the tested semiconductor elements from the test tray T. Therefore, not only is the process complicated, but there is a problem that the error occurrence frequency is high.

Second, if an error occurs in any one of a process of accommodating the semiconductor devices to be tested in the test tray T and a process of separating the tested semiconductor devices from the test tray T, the remaining process that can be normally operated may be performed. Operation stops. Therefore, there is a problem that the efficiency of the process is lowered.

Third, recently, the handler 10 has been developed in a high speed type to perform a loading process, an unloading process, and a test process for more semiconductor devices in a short time. In particular, it has been developed in the direction of reducing the time taken for the loading process and the unloading process. However, as described above, there is a limit in shortening the process time in a complicated process, a high frequency of error occurrence, and an inefficient process.

The present invention has been made to solve the above problems,

An object of the present invention is to provide a handler which can reduce the frequency of error occurrence by simplifying the loading process and the unloading process, and even if an error occurs in one of the loading process and the unloading process, the rest of the process can be normally performed. .

Another object of the present invention is to implement a test tray to be efficiently transported to reduce the waiting time of the test tray, thereby providing a handler and test tray transport method that can reduce the time taken for the loading and unloading process It is.

Another object of the present invention is to reduce the time taken for the loading and unloading process, thereby completing the manufacturing of more semiconductor devices in a short time, thereby enhancing the competitiveness of the product, such as cost reduction It is to provide a method for manufacturing a semiconductor device that can be.

In order to achieve the object as described above, the present invention includes the following configuration.

The handler according to the present invention includes a loading position where a test tray is located when the semiconductor elements to be tested are stored in the test tray, a first loading position under the loading position, and a test tray being loaded therein, and the first loading position. A first lifting unit positioned below and lifting the test tray along a first lifting path formed between the first carrying out positions at which the test trays are carried out, and a loading process for loading the test trays located at the loading positions; A loading unit including a picker; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading position in which the test tray is located when the semiconductor elements tested are separated from the test tray transferred from the chamber part, a second export position located below the unloading position, and a test tray being carried out; A second lifting unit for lifting and lowering the test tray along a second lifting path formed under the position and formed between the second loading positions into which the test tray is loaded, and an unloading process for the test tray positioned at the unloading position. An unloading unit including an unloading picker to be performed and disposed next to the loading unit; The test tray, which is disposed between the first carrying out position and the second carrying position, rotates the test tray transferred from the loading unit from a horizontal state to a vertical state, and rotates the test tray transferred from the chamber unit from a vertical state to a horizontal state. At least one rotating unit; And transferring a test tray containing the tested semiconductor elements from the rotating unit to the second loading position, transferring a test tray having a loading process completed from the first exporting position to the rotating unit, and completing a test tray having an unloading process completed. And a conveying part for transferring from the second carrying out position to the first carrying in position.

The test tray transfer method according to the present invention comprises the steps of: performing a loading process on a test tray located at a loading position where a test tray is located when semiconductor elements to be tested are stored in the test tray; Lowering the test tray having a loading process completed from the loading position to a first discharging position located below the loading position, and then transferring the test tray to the rotating unit; Transferring the test tray positioned in the rotating unit and the loading process completed from the horizontal state to the vertical state, and then transferring the rotating test tray to the chamber unit; Adjusting the semiconductor devices to be tested stored in the test tray at a test temperature in the chamber part to a test temperature, connecting the semiconductor devices controlled at the test temperature to a high fix board, and restoring the tested semiconductor devices to room temperature; Transferring a test tray containing the tested semiconductor elements from the chamber part to the rotating part, and then rotating the test tray from the vertical state to the horizontal state; After transferring the test tray located in the rotating part and containing the tested semiconductor elements to the second loading position located below the unloading position where the test tray is located when the tested semiconductor elements are separated from the test tray, Ascending to the loading position; Performing an unloading process on a test tray positioned at the unloading position; And a second loading position positioned between the unloading position and the second loading position, and a first loading position positioned between the loading position and the first loading position, at the unloading position. Via, the step of transferring to the loading position.

A semiconductor device manufacturing method according to the present invention comprises the steps of preparing a semiconductor device to be tested; Performing a loading process of storing the prepared semiconductor devices to be tested in a test tray located at a loading position where a test tray is located when the semiconductor devices to be tested are stored in a test tray; Lowering the test tray having a loading process completed from the loading position to a first carrying position positioned below the loading position, and then transferring the test tray to the rotating unit; Transferring the test tray positioned in the rotating unit and the loading process completed from the horizontal state to the vertical state, and then transferring the rotating test tray to the chamber unit; Adjusting the semiconductor devices to be tested stored in the test tray at a test temperature in the chamber part to a test temperature, connecting the semiconductor devices controlled at the test temperature to a high fix board, and restoring the tested semiconductor devices to room temperature; Transferring a test tray containing the tested semiconductor elements from the chamber part to the rotating part, and then rotating the test tray from the vertical state to the horizontal state; After transferring the test tray located in the rotating part and containing the tested semiconductor elements to the second loading position located below the unloading position where the test tray is located when the tested semiconductor elements are separated from the test tray, Ascending to the loading position; Performing an unloading process on a test tray positioned at the unloading position; And a second loading position positioned between the unloading position and the second loading position, and a first loading position positioned between the loading position and the first loading position, at the unloading position. Via, the step of transferring to the loading position.

According to the present invention, the following effects can be achieved.

The present invention implements the loading process and the unloading process at different positions, thereby simplifying the loading process and the unloading process and reducing the frequency of error occurrence. In addition, even if an error occurs in one of the loading process and the unloading process, the rest of the process can be performed normally, thereby improving the efficiency of the loading process and the unloading process.

The present invention can be implemented so that the test tray can be efficiently transported, it is possible to reduce the waiting time of the test tray, it is possible to obtain the effect of reducing the time taken for the loading and unloading process.

The present invention can shorten the time required for the loading process and the unloading process, thereby completing the manufacturing of more semiconductor devices in a short time, thereby enhancing the competitiveness of the product, such as cost reduction Can be achieved.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a handler according to the present invention will be described in detail.

3 is a plan view schematically showing a handler according to the present invention, FIG. 4 is a front view schematically showing a loading part, a rotating part, and an unloading part in a handler according to the present invention, and FIG. 5 is a loading part in a handler according to the present invention; 4 is a schematic view showing a path in which a test tray is transported between a rotating part and an unloading part, FIG. 6 is a perspective view schematically showing a first guide part according to the present invention, and FIGS. 7A and 7B are diagrams illustrating a state in which the first guide part operates. 8 is a perspective view schematically showing the second guide portion according to the present invention, FIG. 8 is a perspective view schematically showing the second guide portion according to the present invention, and FIGS. 9A and 9B are side schematic views showing the state in which the second guide portion operates in the direction of the arrow F of FIG. 4, FIG. 10 is a schematic diagram showing a path in which the test tray is transported in the handler according to the present invention.

In FIG. 5 and FIG. 10, the reference numerals denoted in the test tray indicate the configuration of the handler in which the test tray is located. The test trays shown by dotted lines in FIG. 10 represent the transfer paths of the test trays transported from the rotating part and the chamber part. It is shown.

3 and 4, the handler 1 according to the present invention includes a loading part 2, an unloading part 3, a guide part 4, a rotating part 5, a chamber part 6, and a transfer part. (Not shown).

The loading unit 2 performs a loading process and includes a loading stacker 21, a loading picker 22, a loading buffer 23, and a first lifting unit 24.

The loading stacker 21 stores a plurality of customer trays containing semiconductor devices to be tested.

The loading picker 22 performs a loading process on the test tray T located at the loading position 2a. The test tray T is located at the loading position 2a when the semiconductor elements to be tested are accommodated therein.

The loading picker 22 may move in the X-axis direction and the Y-axis direction (shown in FIG. 3), and may move up and down. The loading picker 22 includes a nozzle capable of absorbing a semiconductor device. The loading picker 22 includes a first loading picker 221 and a second loading picker 222.

The first loading picker 221 picks up the semiconductor devices to be tested from the customer tray located in the loading stacker 21 and stores them in the loading buffer 23. The handler 1 may include a plurality of first loading pickers 221.

The second loading picker 222 picks up the semiconductor devices to be tested in the loading buffer 23 and stores them in the test tray T located at the loading position 2a. The handler 1 may include a plurality of second loading pickers 222.

The loading buffer 23 can be moved in the Y-axis direction (shown in FIG. 3) and temporarily houses the semiconductor devices to be tested. The loading buffer 23 may be moved in the X-axis direction and the Y-axis direction (shown in FIG. 3). The handler 1 may include a plurality of loading buffers 23.

The loading buffer 23 may be moved above the test tray T located at the loading position 2a. Accordingly, the second loading picker 222 picks up the semiconductor devices to be tested from the loading buffer 23 moved over the test tray T positioned at the loading position 2a, and then loads the semiconductor elements to the loading position 2a. It can be stored in the test tray (T) located.

Therefore, the handler 1 may reduce the distance that the second loading picker 222 is moved to perform the loading process, thereby reducing the time required for the loading process.

4 and 5, the first lifting unit 24 is a first lifting path A formed between the loading position 2a, the first loading position 2b, and the first carrying out position 2c. Raise and lower the test tray (T). The loading position 2a, the first loading position 2b, and the first carrying out position 2c are positioned in the downward direction (L arrow direction, shown in FIG. 4) from the upper side of the first lifting path A. do.

The first loading position 2b is a position at which the test tray T transferred from the unloading unit 3 is loaded. The test tray T transferred from the unloading unit 3 is a test tray T in which the unloading process is completed and waits at the first loading position 2b before being transferred to the loading position 2a. .

The first carrying out position 2c is a position at which the test tray T having completed the loading process is carried out to the rotating part 5. The test tray T in which the loading process is completed waits at the first discharging position 2c before being transferred to the rotating part 5. The first carrying out position 2c may be located on the same horizontal plane as the rotating part 5.

The first lift part 24 includes a first support 241 and a first lift unit 242.

The first support 241 may support the test tray T, and may be lifted up and down along the first lifting path A by the first lifting unit 242. The first support 241 may contact the bottom surface of the test tray T to support the test tray T.

The first support 241 may be formed to be opened in the direction (M arrow direction, shown in Figure 4) toward the unloading portion 3 from the loading portion (2). Accordingly, the test tray (T) can be transferred to the rotating part (5) in the first discharging position (2c) without being disturbed by the first support (241), the unloading portion (3) May be transferred to the first loading position (2b).

The first elevating unit 242 may elevate the first support 241. The first elevating unit 242 may elevate the first support 241 along the first elevating path (A). By the first lifting unit 242, the first support 241 can be raised and lowered between the loading position (2a), first loading position (2b), and the first carrying out position (2c). have.

The first lifting unit 242 may include a plurality of cylinders, and a rod moved by the cylinder. The first support 241 is coupled to the rod, the cylinder can be raised and lowered by moving the rod.

3 and 4, the unloading unit 3 performs an unloading process and is disposed next to the loading unit 2. The unloading part 3 includes an unloading stacker 31, an unloading picker 32, an unloading buffer 33, and a second lifting part 34.

The unloading stacker 31 stores a plurality of customer trays containing the tested semiconductor devices. The tested semiconductor devices are stored in a customer tray located at different positions for each grade in the unloading stacker 31 according to a test result.

The unloading picker 32 performs an unloading process on the test tray T located at the unloading position 3a. The test tray T is located at the unloading position 3a when the tested semiconductor elements stored therein are separated.

The unloading picker 32 may move in the X-axis direction and the Y-axis direction (shown in FIG. 3), and may be moved up and down. The unloading picker 32 includes a nozzle capable of absorbing a semiconductor device. The unloading picker 32 includes a first unloading picker 321 and a second unloading picker 322.

The first unloading picker 321 picks up the semiconductor devices tested by the unloading buffer 33 and stores them in a customer tray located in the unloading stacker 31. The handler 1 may include a plurality of first unloading pickers 321.

The second unloading picker 322 separates the semiconductor devices tested in the test tray T located at the unloading position 3a and stores the semiconductor devices in the unloading buffer 33. The handler 1 may include a plurality of second unloading pickers 322.

The unloading buffer 33 can be moved in the Y-axis direction (shown in FIG. 3) to temporarily receive the tested semiconductor elements. The handler 1 may include a plurality of unloading buffers 33. The unloading buffer 33 may be installed between the loading position 2a and the unloading position 3a.

4 and 5, the second lifting unit 34 may include a second lifting path formed between the unloading position 3a, the second carrying out position 3b, and the second loading position 3c ( Raise and lower the test tray (T) along B). The unloading position 3a, the second carrying out position 3b, and the second loading position 3c are disposed in the downward direction (the L arrow direction, shown in FIG. 4) from the upper side of the second lifting path B. Located.

The second carry-out position 3b is a position at which the test tray T having completed the unloading process is carried out to the first carry-in position 2b. The test tray T in which the unloading process is completed, waits at the second carrying out position 3b before being transferred to the first carrying in position 2b. The second carrying out position 3b and the first carrying out position 2b may be located on the same horizontal plane.

The second loading position 3c is a position where the test tray T transferred from the rotating part 5 is loaded. The test tray T transferred from the rotating part 5 is a test tray T containing the tested semiconductor elements, and at the second loading position 3c before being transferred to the unloading position 3a. Wait The second loading position 3c may be located on the same horizontal plane as the rotating part 5 and the first loading position 2c.

The second lifting unit 34 includes a second support 341 and a second lifting unit 342.

The second support 341 may support the test tray T, and may be lifted up and down along the second lifting path B by the second lifting unit 342. The second support 341 may be in contact with the bottom surface of the test tray T to support the test tray T.

The second support 341 may be formed to be opened in the direction from the unloading part 3 toward the loading part 2 (the direction opposite to the M arrow, shown in FIG. 4). Accordingly, the test tray T can be transferred from the second carry-out position 3b to the first carry-in position 2b without being disturbed by the second support 341, and the rotary part 5 ) May be transferred to the second loading position 3c.

The second lifting unit 342 may raise and lower the second support 341. The second elevating unit 342 may raise and lower the second support 341 along the second elevating path (B). By the second lifting unit 342, the second support 341 can be lifted up and down between the unloading position 3a, the second carrying out position 3b, and the second loading position 3c. have.

The second lifting unit 342 may include a plurality of cylinders, and a rod moved by the cylinders. The second support 341 is coupled to the rod, so that the cylinder can be raised and lowered by moving the rod.

As described above, the handler 1 may simplify the loading process and the unloading process by allowing the loading process and the unloading process to be performed at different positions. Accordingly, the frequency of error occurrence can be reduced during the loading and unloading processes, and even if an error occurs in one of the loading and unloading processes, the rest of the processes can be performed normally, thereby improving the efficiency of the loading and unloading processes. Can be improved.

In addition, by implementing the test tray T to move up and down in the loading unit 2 and the unloading unit 3, it is possible to reduce the length (1L, shown in Figure 3) of the handler (1).

4 to 6, the guide part 4 is transported from the test tray T in which the unloading process is carried out from the second carry-out position 3b and carried into the first carry-in position 2b. To guide.

The guide part 4 may be in contact with two sides facing each other in the test tray T and the bottom of the sides to guide the transfer of the test tray T. The two sides in contact with the guide part 4 in the test tray T may be two sides opposing each other in a direction orthogonal to the transfer direction of the test tray T.

The guide part 4 includes a first guide part 41 and a second guide part 42.

The first guide part 41 is installed in the loading part 2 at the first loading position 2b. The first guide part 41 includes a first rail 411 and a first driving unit 412.

The first rail 411 supports the test tray T on which the unloading process is completed at the first loading position 2b. The first rail 411 may be in contact with two sides and bottom surfaces of the test tray T facing each other to support the test tray T.

5, 7A and 7B, the first rail 411 may be moved between the inside and the outside of the first lifting path A by the first driving unit 412. The inner side of the first elevating path (A) is a position where the first rail 411 can support the test tray (T), and the outer side of the first elevating path (A) is the first rail (411) The test tray T cannot be supported.

The first rail 411 is as shown in FIG. 7A when the test tray T in which the unloading operation is completed is carried out from the second export position 3b and brought into the first import position 2b. It can be moved to the inside of the first lifting path (A) as well. Accordingly, the first rail 411 may support the test tray T carried into the first loading position 2b and guide the transfer of the test tray T.

The first rail 411, when the test tray (T) is completed, the loading operation is lowered from the loading position (2a) to the first carrying out position (2c), as shown in Figure 7b first lifting path It can be moved out of (A). Accordingly, the test tray T in which the loading operation is completed may be lowered from the loading position 2a to the first carrying out position 2c without being disturbed by the first rail 411.

Therefore, the handler 1 may not only stably transfer the test tray T in which the unloading operation is completed from the second carrying out position 3b to the first loading position 2b, but also completes the loading operation. The test tray T can be stably lowered from the loading position 2a to the first carrying out position 2c.

6 to 7B, the first rail 411 may be rotatably coupled to the loading unit 2 at the first loading position 2b. The loading unit 2 may include a first coupling hole 25 to which the first rail 411 is rotatably coupled around the rotation shaft 411a. The first rail 411 is rotated about the rotation shaft 411a by the first driving unit 412, and may be moved between the inside and the outside of the first lifting path A. FIG.

Therefore, the size of the space to be secured in order to move the first rail 411 to the outside of the first lifting path A can be reduced, and the moving distance of the first rail 411 can be reduced.

The first rail 411 includes a first frame 411b and a first roller 411c.

The first frame 411b contacts the side of the test tray T and is coupled to the first driving unit 412. Side surfaces of the test tray T to which the first frame 411b contacts are two sides facing each other in the test tray T, and two sides corresponding to a direction orthogonal to the transfer direction of the test tray T. Can be heard. The first frame 411b may be rotatably coupled to the first coupler 25.

The first roller 411c supports the bottom surface of the test tray T, and a plurality of first rollers 411c are coupled to the first frame 411b. The first roller 411c may be rotatably coupled to the first frame 411b. Accordingly, the first roller 411c may be rotated in contact with the test tray T. Therefore, it is possible to prevent the test tray T and the first roller 411c from being damaged by friction due to contact.

6, 7A and 7B, the first driving unit 412 may move the first rail 411 between the inside and the outside of the first lifting path A. Referring to FIGS. The first driving unit 412 may include a plurality of cylinders 412a and a rod 412b moved by the cylinder 412a. The first frame 411b may be coupled to the rod 412b.

The first driving unit 412 may move the first rail 411 to the outside of the first lifting path A when the first support 241 is lowered. . The first support unit 241 (shown in FIG. 4) is configured to lower the test tray T having completed the loading process from the loading position 2a to the first carrying out position 2c. (242, shown in FIG. 4).

As shown in FIGS. 7A and 7B, the first driving unit 412 may move between the inside and the outside of the first lifting path A by rotating the first rail 411.

5 and 6, the first guide part 41 may further include a positioning tool 413.

The positioning tool 413 is coupled to the loading part 2 at the first loading position 2b. The positioning tool 413 is brought into contact with the test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b, so that the test tray T is moved to the first lifting path ( Can be positioned on A). The test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b is brought into contact with the positioning tool 413 to be stopped, whereby the first lift path A Can be accurately positioned on the phase.

Therefore, in order to accurately position the test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b, on the first lift path A, the transfer part is precisely located. This can reduce the burden on the implementation to be controlled.

5 and 8 to 9b, the second guide part 42 is installed in the unloading part 3 at the second carrying out position 3b. The second guide part 42 includes a second rail 421 and a second driving unit 422.

The second rail 421 supports the test tray T on which the unloading process is completed at the second discharge position 3b. The second rail 421 may be in contact with two sides and bottom surfaces of the test tray T facing each other to support the test tray T.

The second rail 421 may be moved between the inside and the outside of the second lifting path B by the second driving unit 422. The inner side of the second elevating path (B) is a position where the second rail 421 can support the test tray (T), and the outer side of the second elevating path (B) is the second rail (421) The test tray T cannot be supported.

4, 5, and 9A, when the second rail 421 descends the second support 341, the second lifting path B is driven by the second driving unit 422. ) Can be moved to the inside. Accordingly, the second rail 421 may support the test tray T at the second discharge position 3b.

The second rail 421 is not in contact with the second support 341 even when the second support 341 is lowered from the unloading position 3a to the second loading position 3c. To this end, the second rail 421 and the second support 341 support different portions of the test tray (T). The second rail 421 may support at least one of two sides corresponding to a direction orthogonal to two sides supported by the second support 341 or a bottom surface of the sides.

Accordingly, the handler 1 moves the second rail 421 to the inside of the second lifting path B, and moves the second support 341 at the unloading position 3a. By lowering to the second carry-in position 3c, the test tray T on which the unloading process is completed can be located in the said 2nd carry-out position 3b. That is, the handler 1 does not need to stop the second support 341 at the second discharge position 3b.

Therefore, even if the test tray T in which the unloading process is completed is located at the second carry-out position 3b, the second support 341 holds new tested semiconductor elements at the second carry-in position 3c. The test tray T can be transferred. Accordingly, by shortening the waiting time of the test tray T, the time taken for the unloading process can be shortened.

4, 5, and 9B, the second rail 421 is lifted by the second driving unit 422 by the second driving unit 422 when the second support 341 is raised. Can be moved outward. The second support 341 is lifted to transfer the test tray T in which the tested semiconductor elements are stored from the second loading position 3c to the unloading position 3a.

Accordingly, the test tray T in which the tested completed semiconductor elements are accommodated may be raised from the second loading position 3c to the unloading position 2a without being disturbed by the second rail 421. Can be.

Accordingly, the handler 1 may not only stably transfer the test tray T in which the unloading operation is completed from the second export position 3b to the first import position 2b, but also test the semiconductor device. The test tray T accommodated therein can be stably raised from the second loading position 3c to the unloading position 3a.

The second rail 421 may be rotatably coupled to the unloading part 3 at the second discharge position 3b. The unloading unit 3 may include a second coupling hole 35 to which the second rail 421 is rotatably coupled around the rotation shaft 421a. The second rail 421 is rotated about the rotation shaft 421a by the second driving unit 422, and may be moved between the inside and the outside of the second lifting path B. FIG.

Therefore, the size of the space to be secured in order for the second rail 421 to move to the outside of the second lifting path B can be reduced, and the moving distance of the second rail 421 can be reduced.

8 to 9B, the second rail 421 includes a second frame 421b and a second roller 421c.

The second frame 421b contacts the side of the test tray T and is coupled to the second driving unit 422. Side surfaces of the test tray T in contact with the second frame 421b are two sides facing each other in the test tray T, and two sides corresponding to a direction orthogonal to the transfer direction of the test tray T. Can be entered. The second frame 421b may be rotatably coupled to the second coupling hole 35.

The second roller 421c supports the bottom of the test tray T, and a plurality of the second rollers 421c are coupled to the second frame 421b. The second roller 421c may be rotatably coupled to the second frame 421b. Accordingly, the second roller 421c may rotate in contact with the test tray T. Therefore, it is possible to prevent the test tray T and the second roller 421c from being damaged by friction due to contact.

5, 9A and 9B, the second driving unit 422 may move the second rail 421 between the inside and the outside of the second lifting path B. Referring to FIGS. The second driving unit 422 may include a plurality of cylinders 422a and a rod 422b that is moved by the cylinders 422a. The second frame 421b may be coupled to the rod 422b.

The second driving unit 422 may move the second rail 421 to the outside of the second lifting path B when the second support 341 (shown in FIG. 4) is raised. . The second driving unit 422 may move the second rail 421 to the inside of the second lifting path B when the second support 341 (shown in FIG. 4) is lowered. . The second driving unit 422 may rotate between the inside and the outside of the second lifting path B by rotating the second rail 421.

Although not shown, the guide portion 4 may include a third guide portion disposed between the second carry-out position 3b and the first carry-in position 2b. The third guide part may guide the transfer of the test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b.

3 and 10, the rotating part 5 rotates the test tray T transferred from the loading part 2 from a horizontal state to a vertical state. The test tray T rotated vertically by the rotating part 5 is transferred from the rotating part 5 to the chamber part 6. The rotating part 5 rotates the test tray T transferred from the chamber part 6 from a vertical state to a horizontal state. The handler 1 may include a plurality of rotating parts 5.

Accordingly, the handler 1 may perform a loading process and an unloading process on the test tray T in a horizontal state and a test process on a test tray T in a vertical state.

Although not shown, the rotating part 5 may be provided with a plurality of pulleys, a belt connecting the pulleys, and a conveying means coupled to the belt and pushing or pulling the test tray T. The transfer means may be installed in the chamber part 6.

The rotary part 5 may be disposed between the first carry-out position 2c and the second carry-in position 3c. The rotating part 5 may be disposed on the same horizontal plane as the first carry-out position 2c and the second carry-in position 3c.

Referring to FIGS. 3 and 10, the chamber part 6 may include a first chamber 61 and a test chamber so that the test equipment may test the semiconductor device not only at room temperature but also at high or low temperature. 62), and a second chamber (63).

The first chamber 61 adjusts the semiconductor devices to be tested contained in the test tray T to a test temperature. The test tray T in which the semiconductor devices to be tested are accommodated is a test tray T transferred from the rotating part 5.

At least one of an electrothermal heater or a liquefied nitrogen injection system may be installed in the first chamber 61 to adjust the semiconductor devices to be tested to a test temperature. The first chamber 61 may move the test tray T in a vertical state therein.

When the semiconductor devices to be tested are adjusted to the test temperature, the test tray T is transferred from the first chamber 61 to the test chamber 62.

The test chamber 62 connects the semiconductor devices adjusted to the test temperature stored in the test tray T to the high fix board H. A part or all of the high fix board H is inserted into the test chamber 62, and a contact unit 621 is installed to connect the semiconductor devices controlled to the test temperature to the high fix board H. The test equipment tests the semiconductor devices to determine electrical characteristics of the semiconductor devices to be tested connected to the high fix board H.

The test chamber 62 may be provided with at least one of a heat transfer heater or a liquid nitrogen injection system to maintain the semiconductor devices to be tested at a test temperature. The handler 1 may include a plurality of test chambers 62, and a high fix board H may be installed in each of the plurality of test chambers 62.

When the test for the semiconductor devices is completed, the test tray T is transferred from the test chamber 62 to the second chamber 63.

The second chamber 63 restores the tested semiconductor devices stored in the test tray T to room temperature. At least one of a heat transfer heater or a liquid nitrogen injection system may be installed in the second chamber 63 to restore the tested semiconductor devices to room temperature. The second chamber 63 may move the test tray T in a vertical state therein.

When the tested semiconductor devices are restored to or near room temperature, the test tray T is transferred from the second chamber 63 to the rotating part 5.

As shown in FIG. 10, the first chamber 61, the test chamber 62, and the second chamber 63 may be installed in a horizontal direction. The test chamber 62 may be provided in a plurality of stacked up and down.

Although not shown, the first chamber 61, the test chamber 62, and the second chamber 63 may be stacked up and down. In this case, the first chamber 61 may be installed above the test chamber 62, and the second chamber 63 may be installed below the test chamber 62.

The transfer unit transfers the test tray (T). Although not shown, the transfer part may include a plurality of pulleys, a belt connecting the pulleys, and a moving member coupled to the belt to push or pull the test tray T.

The transfer unit may include a first transfer unit (not shown), a second transfer unit (not shown), and a third transfer unit (not shown).

The first transfer unit transfers the test tray T containing the tested semiconductor elements from the rotating part 5 to the second loading position 3c.

The second transfer unit transfers the test tray T in which the unloading process is completed, from the second export position 3b to the first import position 2b.

The third transfer unit transfers the test tray T in which the loading process is completed, to the rotating part 5 at the first discharge position 2c.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the test tray transfer method according to the present invention will be described in detail.

3 to 10, the test tray transfer method according to the present invention includes the following configuration.

First, when the semiconductor devices to be tested are stored in the test tray T, a loading process is performed on the test tray T located at the loading position 2a where the test tray T is located.

In this process, after the loading picker 22 picks up the semiconductor devices to be tested from the customer tray located in the loading stacker 21, the picked-up semiconductor devices are loaded via the loading buffer 23 to the loading position. It can be made by accommodating the test tray (T) located in (2a).

Next, the test tray T having completed the loading process is lowered from the loading position 2a to the first carrying out position 2c positioned below the loading position 2a, and then transferred to the rotating part 5. .

In this process, the first lifting unit 24 lowers the test tray T from which the loading process is completed, from the loading position 2a to the first discharging position 2c, and the third transfer unit loads the loading process. This completed test tray (T) can be made by transferring to the rotating part (5) in the first carrying out position (2c).

In this case, when the test tray T in which the loading process is completed is lowered from the loading position 2a to the first carrying out position 2c by the first lifting unit 24, the first rail 411. ) Is the state moved to the outside of the first lifting path (A) by the first driving unit (412).

Next, after rotating the test tray (T), which is located in the rotating part 5 and the loading process is completed, is transferred from the rotating part 5 to the chamber part 6 after rotating from the horizontal state to the vertical state.

In this process, after the rotating part 5 rotates the test tray T in which the loading process 2a is completed, from the horizontal state to the vertical state, the transfer means installed in the rotating part 5 or the chamber part 6. The test tray (T) rotated in the vertical state can be made by transferring from the rotating part (5) to the first chamber (61).

Next, the semiconductor device to be tested contained in the test tray T in the chamber part 6 is adjusted to a test temperature, and the semiconductor devices controlled to the test temperature are connected to the high fix board H to be tested. Restored semiconductor devices to room temperature.

In this process, the semiconductor devices to be tested contained in the test tray in the first chamber 61 are adjusted to the test temperature, and the semiconductor devices adjusted to the test temperature in the test chamber 62 are adjusted to the high fix board H. It may be made by connecting to the test, and by restoring the semiconductor devices tested in the second chamber 63 to room temperature. The test tray T may be transferred to the first chamber 61, the test chamber 62, and the second chamber 63.

Next, the test tray T containing the tested semiconductor elements is transferred from the chamber part 6 to the rotating part 5, and then rotated from the vertical state to the horizontal state.

In this process, the test tray T in which the semiconductor elements tested by the transfer means installed in the rotating part 5 or the chamber part 6 are stored is transferred from the second chamber 63 to the rotating part 5. Afterwards, the rotating part 5 may be formed by rotating the test tray T in which the semiconductor elements tested are accommodated, from a vertical state to a horizontal state.

Next, an unloading position in which the test tray T located in the rotating part 5 and the tested semiconductor elements are accommodated, and the test tray T is located when the tested semiconductor elements are separated from the test tray T ( After transferring to the 2nd loading position 3c located under 3a), it raises to the unloading position 3a.

In this process, the test tray (T) containing the semiconductor elements tested by the first transfer unit is transferred from the rotating part (5) to the second loading position (3c), and the second lifting part (34) The test tray T in which the tested semiconductor devices are accommodated may be raised from the loading position 3c to the unloading position 3a.

In this case, when the test tray T containing the tested semiconductor elements is lifted from the loading position 3c to the unloading position 3a by the second lifting unit 34, the second rail Reference numeral 421 is a state in which the second driving unit 422 is moved to the outside of the second lifting path (B).

Next, an unloading process is performed on the test tray T located at the unloading position 3a.

In this process, the unloading picker 32 separates the tested semiconductor devices from the test tray T located at the unloading position 3a and removes the separated semiconductor devices via the unloading buffer 33. It can be made by accommodating the customer tray located in the unloading stacker 31.

The tested semiconductor devices are stored by the unloading picker 32 in a customer tray located at different positions for each grade in the unloading stacker 31 according to a test result.

Next, the test tray T in which the unloading process is completed, is placed in the unloading position 3a, between the unloading position 3a and the second loading position 3c, and Via the first loading position 2b located between the loading position 2a and the first carrying out position 2c, it is transferred to the loading position 2a.

In this process, the second lifting unit 34 lowers the test tray T on which the unloading process is completed, from the unloading position 3c to the second discharging position 3b, wherein the second transfer unit A step of transferring the test tray T transferred from the second carrying out position 3b to the first carrying in position 2b from the second carrying out position 3b, and the first lifting unit 24 The test tray T transferred from the first loading position 2b may be raised from the first loading position 2b to the loading position 2a.

3 to 10, the test tray T in which the unloading process is completed is performed at the unloading position 3a via the second carrying out position 3b and the first loading position 2b. The transferring to the loading position 2a may further include the following process.

First, the second rail 421 which guides the transfer of the test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b at the second carry-out position 3b is , And moves to the inside of the second lifting path (B).

This process may be performed by the second driving unit 422 moving the second rail 421 to the inside of the second lifting path B. By this process, the second rail 421 is moved to a position capable of supporting the test tray T at the second carrying out position 3b.

Next, the second support 341 which is lifted and lowered along the second lifting path B and supports the test tray T passes from the unloading position 3a to the second carrying position 3b. By lowering to the second loading position 3c, the test tray T on which the unloading process is completed is lowered from the unloading position 3a to the second carrying out position 3b.

In this process, the second lifting unit 342 lowers the second support 341 from the unloading position 3a to the second loading position 3c after passing through the second carrying out position 3b. This can be done by.

In this case, since the second rail 421 is moved to the position capable of supporting the test tray T at the second export position 3b by the second driving unit 422, the unloading is performed. The test tray T having completed the process is supported by the second rail 421 and is positioned at the second export position 3b.

Next, the first rail 411 for guiding the transport of the test tray T carried out from the second carry-out position 3b and carried into the first carry-in position 2b at the first carry-in position 2b. , And moves to the inner side of the first lifting path (A).

This process may be performed by the first driving unit 412 moving the first rail 411 to the inside of the first lifting path A. FIG. By this process, the first rail 411 is moved from the first loading position (2b) to a position capable of supporting the test tray (T).

Next, the test tray T located at the second carry out position 3b is transferred from the second carry out position 3b to the first carry in position 2b.

This process may be performed by the second transfer unit transferring the test tray T located at the second carry out position 3b from the second carry out position 3b to the first carry in position 2b. . The test tray T may be accurately positioned on the first lifting path A at the first loading position 2b by being stopped in contact with the positioning tool 413.

Next, the first support 241 which is descended along the first lifting path A and supports the test tray T passes from the first carrying out position 2c to the first carrying in position 2b. The test tray T located at the first loading position 2b is raised from the first loading position 2b to the loading position 2a by raising to the loading position 2a.

In this process, the first lifting unit 242 raises the first support 241 from the first carrying out position 2c to the loading position 2a after passing through the first carrying in position 2b. Can be done.

In this case, since the first rail 411 supports the test tray T at the first loading position 2b, the first support 241 is tested from the first loading position 2b. By supporting the tray (T) it can be raised to the loading position (2a).

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in detail.

Here, the manufacturing method of the semiconductor device comprises a configuration similar to the test tray transfer method described above, the description of such a configuration will be omitted so as not to obscure the subject matter of the present invention, only to explain the configuration of the difference do.

Referring to Figures 3 to 10, the semiconductor device manufacturing method according to the present invention is a configuration different from the test tray transfer method described above, and includes the following configuration.

First, the semiconductor devices to be tested are prepared.

This process can be achieved by storing the semiconductor devices to be tested in a customer tray and storing them in the loading stacker 21. In addition, the semiconductor device may include a memory or non-memory semiconductor device, a module IC, and the like.

Next, a loading process of storing the prepared semiconductor devices to be tested in the test tray T located at the loading position 2a is performed.

This process is performed after the loading picker 22 picks up the prepared semiconductor devices to be tested from the customer tray located in the loading stacker 21, and then picks up the semiconductor devices via the loading buffer 23. It can be made by accommodating the test tray (T) located at the loading position (2a).

By repeatedly performing the process as described above, the manufacturing of the semiconductor device can be completed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a plan view schematically showing a handler according to the prior art

Figure 2 is a schematic diagram showing a path in which the test tray is transported in the handler according to the prior art

3 is a plan view schematically showing a handler according to the present invention;

4 is a front view schematically showing a loading part, a rotating part, and an unloading part in a handler according to the present invention;

5 is a schematic diagram showing a path in which a test tray is transferred between a loading part, a rotating part, and an unloading part in a handler according to the present invention.

Figure 6 is a perspective view schematically showing a first guide portion according to the present invention

7A and 7B are side schematic views showing the state in which the first guide part operates in the direction of the arrow E of FIG.

8 is a perspective view schematically showing a second guide portion according to the present invention;

9A and 9B are side schematic views showing the state in which the second guide part operates in the direction of the F arrow of FIG.

10 is a schematic diagram showing a path in which the test tray is transported in the handler according to the present invention.

Claims (15)

A loading position where the test tray is located when the semiconductor devices to be tested are stored in the test tray, a first loading position located below the loading position and a test tray loaded therein, and a test tray positioned below the first loading position A loading unit including a first lifting unit for lifting up and down a test tray along a first lifting path formed between first and second carrying out positions, and a loading picker performing a loading process on a test tray positioned at the loading position; A chamber unit including a test chamber in which semiconductor elements to be tested received in the test tray transferred from the loading unit are connected to a high fix board and tested; An unloading position where the test tray is located when the tested semiconductor devices are separated from the test tray, a second export position below the unloading position, and a test tray to be carried out, and positioned below the second export position and tested A second lifting unit for lifting up and down the test tray along a second lifting path formed between the second loading positions into which the tray is loaded, and an unloading process for the test tray transferred from the chamber unit and positioned at the unloading position. An unloading unit including an unloading picker to be performed and disposed next to the loading unit; The test tray, which is disposed between the first carrying out position and the second carrying in position, rotates a test tray conveyed from the loading unit from a horizontal state to a vertical state, and rotates a test tray conveyed from the chamber unit from a vertical state to a horizontal state. At least one rotating part to make; And The test tray containing the tested semiconductor elements are transferred from the rotating unit to the second loading position, the loading test tray is transferred from the first exporting position to the rotating unit, and the unloading test tray is completed. A handler comprising a transfer unit for transferring from the second carrying position to the first carrying position. The method of claim 1, And further comprising a guide for guiding the transfer of the test tray is completed from the second carrying out the unloading process carried out from the second carrying out position to the first carrying in position; And the guide part comprises a first guide part installed in the loading part in the first loading position, and a second guide part installed in the unloading part in the second carrying out position. The method of claim 2, The first lifting unit includes a first support for supporting a test tray; And a first elevating unit for elevating the first support; The first guide may include: a first rail supporting a test tray in which an unloading process is completed at the first loading position; And a first driving unit for moving the first rail between an inner side and an outer side of the first elevation path. The method of claim 3, wherein And the first driving unit moves the first rail to the outside of the first lifting path when the first supporting unit descends. The method of claim 3, wherein The first rail is rotatably coupled to the loading unit in the first loading position, And the first driving unit rotates the first rail to move between the inside and the outside of the first elevation path. The method of claim 3, wherein the first rail A first frame in contact with a side of the test tray and coupled to the first driving unit; And And a plurality of first rollers rotatably coupled to the first frame to support the bottom of the test tray and to rotate in contact with the test tray. The method of claim 2, The first guide portion is coupled to the loading portion at the first loading position, contacts the test tray carried out from the second loading position and brought into the first loading position, thereby placing the test tray on the first lifting path. And a positioning tool positioned in the handler. The method of claim 2, The second lifting unit includes a second support for supporting the test tray; And a second elevating unit for elevating the second support; The second guide portion may include: a second rail supporting a test tray in which an unloading process is completed in the second export position; And a second driving unit for moving the second rail between an inner side and an outer side of the second lifting path. The method of claim 8, The second driving unit moves the second rail to the outside of the second lifting path when the second support is raised, and moves the second rail to the inside of the second lifting path when the second support is lowered. Handler. The method of claim 8, The second rail is rotatably coupled to the unloading portion in the second unloading position, And the second driving unit rotates the second rail to move between the inside and the outside of the second lifting path. The method of claim 8, wherein the second rail A second frame in contact with a side of the test tray and coupled to the second driving unit; And And a plurality of second rollers rotatably coupled to the second frame to support the bottom of the test tray and to be rotated in contact with the test tray. Performing a loading process on a test tray positioned at a loading position at which the test tray is located when the semiconductor devices to be tested are stored in the test tray; Lowering the test tray having a loading process completed from the loading position to a first discharging position located below the loading position, and then transferring the test tray to the rotating unit; Transferring the test tray positioned in the rotating unit and the loading process completed from the horizontal state to the vertical state, and then transferring the rotating test tray to the chamber unit; Adjusting the semiconductor devices to be tested stored in the test tray at a test temperature in the chamber part to a test temperature, connecting the semiconductor devices controlled at the test temperature to a high fix board, and restoring the tested semiconductor devices to room temperature; Transferring a test tray containing the tested semiconductor elements from the chamber part to the rotating part, and then rotating the test tray from the vertical state to the horizontal state; After transferring the test tray located in the rotating part and the semiconductor elements tested are received from the test tray to a second loading position below the unloading position where the test tray is located when the tested semiconductor elements are separated from the test tray. Raising to an unloading position; Performing an unloading process on a test tray positioned at the unloading position; And The test tray having completed the unloading process, the unloading position, a second unloading position located between the unloading position and the second unloading position, and a first unloading position located between the loading position and the first unloading position. Via a test tray transfer method comprising the step of transferring to the loading position. The method of claim 12, wherein the step of transferring the test tray having completed the unloading process from the unloading position to the loading position via a second carrying position and a first carrying position, A second rail for guiding the transfer of the test tray carried out from the second carrying out position into the first carrying out position at the second carrying out position, the unloading position, the second carrying out position, and the second Moving to the inside of the second lifting path formed between the loading positions; The second support, which is lowered and lowered along the second lifting path and supports the test tray, is lowered from the unloading position to the second loading position after passing through the second carrying out position, so that the unloading test tray is completed. Lowering from the unloading position to the second discharging position; A first rail for guiding the transfer of the test tray carried out from the second carrying position to the first carrying position at the first carrying position, the loading position, the first carrying position and the first carrying out position; Moving inward of the first elevation path formed between locations; Transferring a test tray positioned at the second carrying out position from the second carrying out position to the first carrying in position; And A test tray positioned at the first loading position by raising and lowering a first support supporting the test tray up and down along the first lifting path to the loading position from the first carrying out position to the loading position; The test tray transfer method further comprising the step of raising from the first loading position to the loading position. Preparing semiconductor devices to be tested; Performing a loading process of storing the prepared semiconductor devices to be tested in a test tray located at a loading position where a test tray is located when the semiconductor devices to be tested are stored in a test tray; Lowering the test tray having a loading process completed from the loading position to a first discharging position located below the loading position, and then transferring the test tray to the rotating unit; Transferring the test tray positioned in the rotating unit and the loading process completed from the horizontal state to the vertical state, and then transferring the rotating test tray to the chamber unit; Adjusting the semiconductor devices to be tested stored in the test tray at a test temperature in the chamber part to a test temperature, connecting the semiconductor devices controlled at the test temperature to a high fix board, and restoring the tested semiconductor devices to room temperature; Transferring a test tray containing the tested semiconductor elements from the chamber part to the rotating part, and then rotating the test tray from the vertical state to the horizontal state; After transferring the test tray located in the rotating part and the semiconductor elements tested are received from the test tray to a second loading position below the unloading position where the test tray is located when the tested semiconductor elements are separated from the test tray. Raising to an unloading position; Performing an unloading process on a test tray positioned at the unloading position; And The test tray having completed the unloading process, the unloading position, a second unloading position located between the unloading position and the second unloading position, and a first unloading position located between the loading position and the first unloading position. Via, the semiconductor device manufacturing method comprising the step of transferring to the loading position. 15. The method of claim 14, wherein the step of transferring the test tray on which the unloading process is completed to the loading position via the second unloading position and the first unloading position from the unloading position, A second rail for guiding the transfer of the test tray carried out from the second carrying out position into the first carrying out position at the second carrying out position, the unloading position, the second carrying out position, and the second Moving to the inside of the second lifting path formed between the loading positions; The second support, which is lowered and lowered along the second lifting path and supports the test tray, is lowered from the unloading position to the second loading position after passing through the second carrying out position, so that the unloading test tray is completed. Lowering from the unloading position to the second discharging position; A first rail for guiding the transfer of the test tray carried out from the second carrying position to the first carrying position at the first carrying position, the loading position, the first carrying position and the first carrying out position; Moving inward of the first elevation path formed between locations; Transferring a test tray positioned at the second carrying out position from the second carrying out position to the first carrying in position; And A test tray positioned at the first loading position by raising and lowering a first support for lifting and lowering along the first lifting path and supporting the test tray to the loading position from the first carrying out position to the loading position; And increasing the load from the first loading position to the loading position.

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