KR100910727B1 - Semiconductor Rotating Apparatus, Handler include the same, and Method of Manufacturing Semiconductor using the same - Google Patents

Abstract

The present invention provides a semiconductor device comprising: a buffer tray including at least one accommodating part in which a plurality of accommodating grooves in which semiconductor elements are stored in one direction are arranged in a matrix; And a rotation unit for rotating the buffer tray so that the arrangement direction of the accommodation groove can be switched, and a handler including the same, and a method of manufacturing the semiconductor device using the same.

According to the present invention, it is possible to optimize the transfer of semiconductor devices so as to simplify the configuration of the handler and to perform the loading process, the test process, and the unloading process for more semiconductor devices in a short time.

Handler, Semiconductor Device, High Fix Board

Description

Semiconductor device rotation apparatus, a handler including the same, and a method for manufacturing a semiconductor device using the same

The present invention relates to a handler for providing a semiconductor device to be tested in a test device for testing a semiconductor device, and classifying the semiconductor device tested by the test device into classes according to test results.

In general, a memory IC or a non-memory semiconductor device and a module IC (hereinafter, referred to as a "semiconductor device") in which these circuits are properly configured on a substrate are manufactured through various test procedures.

The equipment used in the process of testing a semiconductor device is a handler.

The handler is a device that provides a semiconductor device to be tested in a separate test device for testing the semiconductor device, and classifies the semiconductor device tested by the test device according to a test result.

The handler performs a loading process, an unloading process, and a test process by using a test tray having a plurality of sockets for accommodating semiconductor elements.

The loading process picks up the semiconductor device to be tested from the customer tray containing the semiconductor device to be tested and stores it in the test tray. The loading process is performed through a picker including a nozzle capable of absorbing a semiconductor device.

The unloading process separates the tested semiconductor device from the test tray and stores the separated semiconductor device in customer trays located at different locations according to the test result. The unloading process is performed through a picker.

The test process connects the semiconductor device to be tested contained in the test tray to the test equipment. The test equipment tests the semiconductor device to determine electrical characteristics of the semiconductor device connected thereto.

The handler includes a chamber portion including a plurality of closed chambers so that the test equipment can test the semiconductor device not only in a room temperature environment but also in a high or low temperature environment.

1 is a plan view schematically showing the configuration of a conventional handler, Figure 2 is a schematic diagram showing a path in which the test tray is transported in the handler of FIG. In FIG. 2, reference numerals denoted in the test tray indicate a configuration of a handler in which the test tray is located.

1 and 2, the conventional handler 100 includes a chamber unit 101, a loading stacker 102, an unloading stacker 103, a picker unit 104, a buffer unit 105, and An exchange unit 106.

The chamber unit 101 includes a first chamber 1011, a test chamber 1012, and a second chamber 1013.

The first chamber 1011 moves a test tray T therein, and a temperature (hereinafter, referred to as a 'test temperature') to test a semiconductor device to be tested by a test apparatus contained in the test tray T. Heating or cooling).

When the semiconductor device to be tested is adjusted to the test temperature, the test tray T is transferred from the first chamber 1011 to the test chamber 1012.

The test chamber 1012 connects the semiconductor device adjusted to the test temperature to the high fix board H. A part or all of the high fix board H is inserted into and installed in the test chamber 1012, and a contact unit 1121 a for connecting the semiconductor element adjusted to the test temperature to the high fix board H is installed.

When the test on the semiconductor device is completed, the test tray T is transferred from the test chamber 1012 to the second chamber 1013.

The second chamber 1013 restores the tested semiconductor device stored in the test tray T to room temperature while moving the test tray T therein.

When the semiconductor device is restored to room temperature, the test tray T is transferred from the second chamber 1013 to the exchange unit 106.

The loading stacker 102 stores a plurality of customer trays in which semiconductor devices to be tested are stored.

The unloading stacker 103 stores a plurality of customer trays in which the tested semiconductor devices are stored. The tested semiconductor devices are stored in customer trays stored in different locations according to the test results.

The picker unit 104 includes a nozzle capable of absorbing a semiconductor device, and includes a first loading picker 1041, a second loading picker 1042, a first unloading picker 1043, and a second unloading picker. (1044).

The first loading picker 1041 picks up the semiconductor device to be tested from the customer tray located in the loading stacker 102 and stores it in the buffer unit 105. The first loading picker 1041 is installed to be movable in the X-axis direction and the Y-axis direction.

The second loading picker 1042 picks up the semiconductor device to be tested in the buffer unit 105 and stores it in the test tray T located in the exchange unit 106. The second loading picker 1042 is installed to be movable in the X-axis direction.

The first unloading picker 1043 picks up the tested semiconductor device from the buffer unit 105 and stores it in the customer tray located in the unloading stacker 103. The first unloading picker 1043 stores the tested semiconductor device in a customer tray located at different positions for each grade in the unloading stacker 103 according to a test result. The first unloading picker 103 is installed to be movable in the X-axis direction and the Y-axis direction.

The second unloading picker 1044 separates the tested semiconductor device from the test tray T located in the exchanger 106 and stores the separated semiconductor device in the buffer unit 105. The second unloading picker 1044 is installed to be movable in the X-axis direction.

The buffer unit 105 is installed to be movable in the Y-axis direction and temporarily receives a semiconductor device. The buffer unit 105 may include a loading buffer unit 1051 and an unloading buffer unit 1052.

The loading buffer part 1051 is disposed at one side of the exchange part 106 and temporarily receives a semiconductor device transferred from a customer tray positioned at the loading stacker 102 by the first loading picker 1041. .

The unloading buffer part 1052 is disposed on the other side of the exchange part 106 and temporarily transfers a semiconductor device transferred from the test tray T positioned in the exchange part 106 by the second unloading picker 1044. I receive it.

The exchange unit 106 exchanges the test tray T in which the semiconductor element to be tested is accommodated and the test tray T in which the tested semiconductor element is accommodated with the chamber 101. The test tray T in which the semiconductor element to be tested is stored is transferred from the exchange unit 106 to the chamber unit 101, and the test tray T in which the tested semiconductor element is accommodated is transferred from the chamber unit 101. Is transferred to the exchange unit 106.

In the exchange unit 106, a process in which the tested semiconductor device is separated from the test tray T and a process in which the semiconductor device to be tested is accommodated in the test tray T are performed.

The exchange unit 106 may further include a rotator 161 for rotating the test tray (T).

The rotator 1061 may rotate the test tray T to convert the test tray T in which the semiconductor device to be tested is accommodated from a horizontal state to a vertical state. The rotator 1061 may rotate the test tray T to convert the test tray T in which the tested semiconductor device is stored from a vertical state to a horizontal state.

As the rotator 1061 is installed, the handler 100 may perform a test process on a test tray T in a vertical state, and a loading process and an unloading process on a test tray T in a horizontal state. Can be performed.

Here, in recent years, the handler has been developed to perform a loading process, a test process, and an unloading process for more semiconductor devices in a short time in order to enhance the competitiveness of a product such as cost reduction of semiconductor devices.

As one method for this, the handler is developed to accommodate more semiconductor devices in a test tray, so that more semiconductor devices can be connected to the high resolution board at once.

However, this solution has the following problems.

First, storing more semiconductor elements in one test tray means that the size of the test tray becomes larger. This increase in the size of the test tray increases the size of each component of the handler, thereby increasing the size of the entire handler. Increasing the size of the entire handler increases the amount of material required to manufacture the handler, which increases the manufacturing cost.

In addition, an increase in the size of the entire handler requires a larger installation space. Since the rotator 1061 is installed, the amount of increase in the size of the chamber 101 may be reduced to some extent, but this is limited. Moreover, the installation of the rotator 1061 can not affect the increase in the size of other components such as the exchange section 105.

Second, there is a problem that the time for performing the loading process and the unloading process for one test tray is increased. This is because more semiconductor devices to be tested must be accommodated in the test tray during the loading process, and more semiconductor devices must be separated from the test tray and classified according to the test results during the unloading process.

Thus, by storing more semiconductor devices in one test tray, a handler developed to connect more semiconductor devices to a high-fix board at one time is not suitable for enhancing the competitiveness of a product such as cost reduction of semiconductor devices.

The present invention has been made to solve the above problems,

An object of the present invention is to provide a handler that can perform a loading process, a test process, and an unloading process for many semiconductor devices in a short time while minimizing the increase in the size of the handler.

It is another object of the present invention to provide a semiconductor device rotating device which makes it possible to carry out the loading process, the test process, and the unloading process for more semiconductor devices in a short time while simplifying the configuration of the handler.

Still another object of the present invention is to provide a method for manufacturing a semiconductor device, which reduces the time required for the loading process, the test process, and the unloading process, thereby enhancing the competitiveness of the product, such as cost reduction of the semiconductor device.

In order to achieve the object as described above, the present invention includes the following configuration.

In accordance with another aspect of the present invention, there is provided a semiconductor device rotating apparatus including: a buffer tray including at least one accommodating part in which a plurality of accommodating grooves in which semiconductor elements are accommodated in one direction are arranged in a matrix; And a rotating unit for rotating the buffer tray so that the arrangement direction of the receiving groove can be switched.

A handler according to the present invention includes a test tray provided at a side thereof and connected to a high fix board, a socket for storing a semiconductor element, and a connection part for electrically connecting the semiconductor element and the connection portion accommodated in the socket to each other. ; A loading unit accommodating a semiconductor device to be tested contained in a customer tray located in a loading stacker in a test tray located in a loading area; The semiconductor device to be tested stored in the test tray is adjusted to a test temperature, and each connection part provided in a plurality of test trays containing the semiconductor device controlled to the test temperature is connected to a high fix board, and the tested semiconductor device is stored at room temperature. A chamber unit for restoring; An unloading unit disposed next to the loading unit and accommodating the tested semiconductor device stored in a test tray located in the unloading area in a customer tray located in the unloading stacker; And the semiconductor device rotating apparatuses respectively installed in the loading unit and the unloading unit.

A semiconductor device manufacturing method according to the present invention comprises the steps of preparing a semiconductor device to be tested; Accommodating the prepared semiconductor device to be tested in accommodating grooves provided in the semiconductor device rotating apparatus installed in the loading unit; Positioning a test tray in a loading area including a connection portion provided at a side thereof and connected to a high fix board, a socket in which a semiconductor element is stored, and a connection portion electrically connecting the semiconductor element and the connection portion stored in the socket to each other; ; Accommodating a semiconductor device to be tested, which is accommodated in receiving grooves provided in the semiconductor device rotating apparatus installed in the loading unit, in a test tray located in a loading area; Adjusting a semiconductor device to be tested stored in a test tray to a test temperature, connecting each connection part of the plurality of test trays to a high fix board, and restoring the tested semiconductor device to room temperature; Accommodating the tested semiconductor device accommodated in a test tray located in an unloading area in accommodating grooves provided in the semiconductor device rotating apparatus installed in the unloading unit; And classifying the tested semiconductor devices accommodated in the receiving grooves provided in the semiconductor device rotating apparatus installed in the unloading unit by grades according to test results.

According to the present invention, the following effects can be achieved.

The present invention can perform the loading process, the test process, and the unloading process for more semiconductor devices in a short time without increasing or minimizing the time required for the loading process and the unloading process for one test tray. The effect can be obtained.

The present invention can achieve the effect of optimizing the transfer of semiconductor devices so as to simplify the configuration of the handler and to perform the loading process, the test process, and the unloading process for more semiconductor devices in a shorter time. .

The present invention can achieve the effect of enhancing the competitiveness of the product, such as cost reduction of the semiconductor device by reducing the time required for the loading process, the test process, and the unloading process.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the test tray used in the present invention will be described in detail.

Figure 3a is a perspective view schematically showing a test tray used in the present invention, Figure 3b is a conceptual diagram showing a test tray and a customer tray to help the understanding of the present invention.

Referring to FIG. 3A, the test tray 200 used in the present invention is formed in a rectangular plate shape as a whole, and includes a connection portion 201, a connection portion 202, and a socket 203.

The connection part 201 is provided on the side of the test tray 200 and is connected to the high fix board. The connection part 201 may be installed perpendicular to the main body A of the test tray 200.

The connection part 201 may include a plurality of connection pins (not shown) corresponding to the number of semiconductor devices. The high fix board may be electrically connected to the semiconductor device through the connection pin, and the semiconductor device is tested to determine electrical characteristics of the semiconductor device connected thereto.

The connection part 202 electrically connects the semiconductor element and the connection part 201 to each other. One side of the connection portion 202 is connected to the semiconductor element, and the other side is connected to the connection portion 201, thereby electrically connecting the semiconductor element and the connection portion 201. The connection part 202 may be connected to a semiconductor device in one side of the horizontal state, and may be connected to a connection pin of the connection part 201 in which the other side is vertically installed.

The connection part 202 may be a substrate including a plurality of connection lines connecting one side and the other side.

The socket 203 may accommodate a semiconductor device, and a plurality of sockets may be installed while being spaced apart from the main body A of the test tray 200 at a predetermined interval. The socket 203 may accommodate the semiconductor device in a horizontal state. Although only one socket 203 is specifically illustrated for convenience of the socket 203, the socket 203 may be installed in a matrix corresponding to the number of semiconductor devices.

The socket 203 may include a latch (not shown) for fixing or releasing a semiconductor device. The latch may apply a constant pressure to the semiconductor device, thereby stably maintaining the state in which the semiconductor device and the connection part 202 are connected.

3A and 3B, the test tray 200 is formed to have a horizontal length 200L longer than the vertical length 200H to facilitate its manufacture. Since the connection part 201 should include the number of connection pins (not shown) corresponding to the semiconductor elements accommodated in the test tray 200, the connection pins (not shown) are distributed and installed in a larger area. This is to facilitate the manufacture. That is, the connection portion 201 is provided on the side surface of the main body A in the horizontal length 200L.

Accordingly, the socket 203 accommodates the semiconductor device in a direction different from the direction in which the customer tray C accommodates the semiconductor device, as shown in FIG. 3B.

Therefore, the test tray 200 is a method for accommodating a semiconductor device stored in a customer tray C into the socket 203 or a semiconductor device stored in the socket 203 in a customer tray C. ) Or the customer tray (C) is a way to change the direction of either.

However, changing the direction of the test tray 200 means that the connection portion 201 should be installed on the side surface of the body A in the longitudinal length 200H. That is, since the connection portion 201 must be installed in a relatively narrow area, there is a burden of making the test tray 200 difficult to manufacture.

Changing the direction of the customer tray C has a burden of increasing the size of the handler.

After the semiconductor device is accommodated in the test tray 200, there is a method of rotating the test tray 200, but this means that a separate device for rotating the test tray 200 must be provided. That is, a complex device must be provided to rotate the test tray 200, and a space for rotating the test tray 200 must be secured, which not only complicates the configuration of the handler but also increases the size of the handler. There is a burden.

Accordingly, in order to minimize the increase in the size of the handler while maintaining the ease of manufacturing the test tray 200, and to match the directions of the semiconductor elements accommodated in the socket 203 and the customer tray C in a concise configuration, the present invention In accordance with the semiconductor device rotating device has been devised.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a semiconductor device rotating apparatus according to the present invention will be described in detail. The semiconductor device rotating apparatus according to the present invention includes three embodiments, which will be described sequentially.

4 is a plan view schematically showing one embodiment of a semiconductor device rotating apparatus according to the present invention, FIG. 5 is a plan view schematically showing another embodiment of a semiconductor device rotating apparatus according to the present invention, and FIG. 6 is a semiconductor according to the present invention. 2 is a plan view schematically showing another embodiment of the device rotating apparatus.

Referring to FIG. 4, the semiconductor device rotating apparatus 1 according to an exemplary embodiment of the present invention includes a buffer tray 2 and a rotating unit (not shown).

The buffer tray 2 may accommodate a plurality of semiconductor elements in one direction and is rotated by the rotation unit (not shown). The buffer tray 2 may be formed in a disc shape.

At least one accommodating part in which a plurality of accommodating grooves 211 in which the semiconductor elements are accommodated are arranged in a matrix so that the buffer tray 2 may accommodate the plurality of semiconductor elements in one direction. 21) is formed.

The accommodating part 21 is disposed on the buffer tray 2 and spaced apart from each other. Therefore, the number of semiconductor devices that can be stored in the buffer tray 2 at one time can be increased.

When the buffer tray 2 is rotated, the arrangement direction of the accommodating groove 211 is changed, and accordingly, the arrangement direction of the semiconductor elements accommodated in the accommodating groove 211 is changed.

The rotation unit rotates the buffer tray 2 so that the arrangement direction of the accommodation grooves 211 can be switched. The rotating unit may be coupled to the rotating shaft 2a of the buffer tray 2 and may include a motor.

Referring to FIGS. 3B and 4, the rotation unit (not shown) includes an arrangement of the accommodation grooves 211 when the semiconductor elements accommodated in the customer tray C are moved to and accommodated in the accommodation grooves 211. The buffer tray 2 is rotated so that the direction coincides with the arrangement direction of the semiconductor elements housed in the customer tray C.

When the semiconductor element transferred from the customer tray C is accommodated in the accommodating groove 211, the rotation unit includes a socket 203 in which an arrangement direction of the semiconductor element accommodated in the accommodating groove 211 is provided in the test tray 200. The buffer tray 2 is rotated to coincide with the array direction.

The rotation unit, when the semiconductor element accommodated in the socket 203 provided in the test tray 200 is moved to the receiving groove 211 is received, the arrangement direction of the receiving groove 211 is the socket 203 The buffer tray 2 is rotated to coincide with the arrangement direction of the semiconductor element housed therein.

When the semiconductor element transferred from the test tray 200 is accommodated in the accommodating groove 211, the rotation unit is arranged such that the arrangement of the semiconductor elements accommodated in the accommodating groove 211 is accommodated in the customer tray C. The buffer tray 2 is rotated to match the arrangement direction.

As such, the semiconductor device rotating apparatus 1 according to the exemplary embodiment of the present invention may maintain the ease of manufacturing the test tray 200 by changing the arrangement direction of the semiconductor device so that the semiconductor device faces the proper arrangement direction. .

In addition, since the semiconductor device rotating apparatus 1 according to the exemplary embodiment of the present invention rotates the buffer tray 2 having a smaller size than the test tray 200, the semiconductor device rotating apparatus 1 can be realized in a concise configuration and the size of the handler can be increased. Can be minimized.

3B and 5, in the semiconductor device rotating apparatus 1 according to another embodiment of the present invention, the rotating unit and the buffer tray 2 may be made as follows.

The rotation unit rotates the buffer tray 2 about the rotation shaft 2a so that any one of the plurality of accommodating parts 21 is positioned in the first buffer region D, and one of the other is the second. It is located in the buffer area E.

In the first buffer area D, a semiconductor device accommodated in the customer tray C is transferred to the receiving grooves 211, or a semiconductor device stored in the storage grooves 211 is transferred to the customer tray C. In order to be stored, it is an area where the accommodating portion 21 is located. The accommodating grooves 211 provided in the accommodating portion 21 positioned in the first buffer region D are switched so that the arrangement direction thereof matches the arrangement direction in which the semiconductor element is accommodated in the customer tray C.

In the second buffer region E, the semiconductor elements stored in the test tray 200 are transferred to the receiving grooves 211, or the semiconductor elements stored in the receiving grooves 211 are transferred to the test tray 200. In order to be stored, it is an area where the accommodating portion 21 is located. The receiving grooves 211 provided in the accommodating portion 21 positioned in the second buffer region E have an arrangement direction in which the semiconductor elements are accommodated in the socket 203 provided in the test tray C. Switch to match.

The rotation unit rotates the buffer tray 2 to position at least one accommodating portion 21 not located in the first buffer region D and the second buffer region E in the standby region. The standby area F is an area in which the accommodating part 21 is positioned before being located in the first buffer area D or the second buffer area E. FIG. In the standby area F, a plurality of accommodating parts 21 may be located.

When the buffer tray 2 is rotated by the rotating unit, the accommodating parts 21 having a plurality of the buffer trays 2 are sequentially formed in the first buffer region D and the second buffer region E. FIG. Is located. Accordingly, the receiving grooves 211 provided in the accommodating parts 21 are sequentially positioned in the first buffer area D and the second buffer area E while the arrangement directions thereof are changed. At least one accommodating portion 21 not positioned in the first buffer region D and the second buffer region E may be sequentially positioned in the standby region F. FIG.

The accommodating part 21 is formed on the buffer tray 2 in plurality. When any one of the plurality of accommodating parts 21 is located in the first buffer area D, one of the other parts may be located in the second buffer area E. FIG.

Therefore, the work performed in the first buffer region D and the work performed in the second buffer region E can be performed at the same time with respect to the semiconductor device, thereby reducing the work time and improving the work efficiency.

At least one accommodating part 21 of the accommodating parts 21 that is not located in the first buffer area D and the second buffer area E may be located in the standby area F, and thus, the first buffer area. The working time can be further shortened by reducing the waiting time for the (D) or the second buffer area (E).

The accommodating grooves 211 provided in the accommodating parts 21 may be formed in the buffer tray 2 so as to face an array direction orthogonal to each other in the first buffer area D and the second buffer area E. FIG. have. That is, the semiconductor devices accommodated in the accommodation grooves 211 of the first buffer region D and the second buffer region E are arranged such that their arrangement directions are perpendicular to each other. This applies to the case where the direction of the semiconductor element accommodated in the customer tray C and the direction of the semiconductor element accommodated in the test tray 200 are oriented at right angles to each other.

The accommodating parts 21 may be formed at the same distance 21D from the rotation shaft 2a and formed on the buffer tray 2. Accordingly, the accommodating parts 21 may be positioned such that the accommodating grooves 211 always face the same position and direction in the first buffer area D and the second buffer area E. FIG.

Therefore, the work performed in the first buffer region D and the work performed in the second buffer region E with respect to the semiconductor element may be always performed at the same position, thereby improving work efficiency.

The accommodating parts 21 are disposed on the buffer tray 2 so as to be spaced apart from each other at the same rotation angle 2b along the rotation direction with respect to the rotation shaft 2a. In this case, the rotation unit may rotate the buffer tray 2 by a rotation angle 2b in which the accommodating parts 21 are spaced apart.

As shown in FIG. 5, when four accommodating parts 21 are formed in the buffer tray 2, the accommodating parts 21 are disposed at the buffer tray 2 by being spaced apart by 90 °. . The rotating unit rotates the buffer tray 2 by 90 ° at a time.

Although not shown, when eight storage units 21 are formed in the buffer tray 2, the storage units 21 are disposed at the buffer tray 2 spaced apart by 45 °. The rotating unit rotates the buffer tray 2 by 45 ° at a time.

As the number of accommodating portions 21 is formed in the buffer tray 2, the rotating unit may rotate the buffer tray 2 by a small rotation angle at a time. Therefore, the time required for positioning the next accommodating parts 21 in the first buffer area D and the second buffer area E can be reduced.

In this case, as the number of the accommodating portions 21 is formed in the buffer tray 2, the size of the buffer tray 2 increases, so that the number of the accommodating portions 21 is connected to the handler. 1) It should be decided considering the space where it can be installed.

3B and 6, in the semiconductor device rotating apparatus 1 according to another embodiment of the present invention, the buffer tray 2 may be formed as follows.

On the buffer tray 2, the first storage portion 21a, the second storage portion 21b, the third storage portion 21c, and the fourth storage portion 21d spaced apart from each other with a rotation angle of 90 ° to each other. ) Is formed.

When the buffer tray 2 is rotated, the first storage portion 21a, the second storage portion 21b, the third storage portion 21c, and the fourth storage portion 21d are formed in the first buffer region D. FIG. ), The second buffer region E, and the standby region F.

The first accommodating part 21a and the third accommodating part 21c are disposed with a rotation angle of 180 ° based on the rotation shaft 2a. The first storage portion 21a and the third storage portion 21c are arranged diagonally on the buffer tray 2. The accommodating grooves 211a provided in the first accommodating portion 21a and the accommodating grooves 211c provided in the third accommodating portion 21c are disposed on the buffer tray 2 so as to face the same arrangement direction. Formed.

The second accommodating portion 21b and the fourth accommodating portion 21d are disposed with a rotation angle of 180 ° based on the rotation shaft 2a. The second accommodating portion 21b and the fourth accommodating portion 21d are diagonally orthogonal to a diagonal direction in which the first accommodating portion 21a and the third accommodating portion 21c are formed on the buffer tray 2. It is arranged in the direction. The accommodating grooves 211b provided in the second accommodating portion 21b and the accommodating grooves 211d provided in the fourth accommodating portion 21d are disposed on the buffer tray 2 so as to face the same arrangement direction. Formed.

The first storage portion 21a and the third storage portion 21c and the second storage portion 21b and the fourth storage portion 21d are disposed in the buffer tray 2 so as to face in directions perpendicular to each other. Formed. In this case, the receiving grooves 211a and 211c provided in the first and third receiving parts 21a and 21c and the second and second receiving parts 21b and 21d are provided. The receiving grooves 211b and 211d are formed in the buffer tray 2 so as to face in directions perpendicular to each other.

That is, the arrangement direction of the semiconductor elements accommodated in the first and second accommodating portions 21a and 21c and the semiconductor elements accommodated in the second and fourth receiving portions 21b and 21d. The direction of the arrangement may be perpendicular to each other.

Therefore, the semiconductor device rotating apparatus 1 according to another embodiment of the present invention can reduce the size of the buffer tray 2, thereby reducing the space for installing the semiconductor device rotating apparatus 1 in the handler. have.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a handler according to the present invention will be described in detail.

Figure 7 is a schematic perspective view of the handler according to the present invention, Figure 8 is a front view schematically showing the chamber portion in the handler according to the present invention.

7 and 8, the handler 10 according to the present invention includes a chamber portion 11, a loading portion 12, an unloading portion 13, and a semiconductor device rotating apparatus 1.

The chamber unit 11 includes the first chamber 111, the test chamber 112, and the second chamber so that the high fix board H can test the semiconductor device not only at room temperature but also at high or low temperature. (113).

The first chamber 111 adjusts the semiconductor device to be tested contained in the test tray 200 to a test temperature. The first chamber 111 may include at least one of an electrothermal heater or a liquid nitrogen injection system so as to heat or cool the semiconductor device to be tested.

The first chamber 111 may adjust the semiconductor device to be tested at a test temperature while raising the test tray 200 by one step. When the semiconductor device to be tested is adjusted to a test temperature, the test tray 200 is transferred from the first chamber 111 to the test chamber 112.

The test chamber 112 connects the connection part 201 provided in the test tray 200 to the high fix board H. The high fix board H may be vertically installed in the test chamber 112, and part or all of the high fix board H may be inserted into the test chamber 112.

The test chamber 112 may include at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor device at a test temperature.

The test chamber 112 may include a receiving part 300 and a moving unit 301.

The accommodation part 300 is provided in plural to accommodate the plurality of test trays 200. The accommodation units 300 may accommodate the plurality of test trays 200 in a horizontal state such that the connection part 201 of the test tray 200 faces the high fix board H in a horizontal state. In this case, the plurality of test trays 200 are stacked in the vertical direction.

Although not shown, the receiving parts 300 may accommodate the plurality of test trays 200 in a vertical state such that the connection part 201 of the test tray 200 faces the high fix board H in a vertical state. have. In this case, the plurality of test trays 200 are adjacently received in the horizontal direction.

The mobile unit 301 may move the plurality of test trays 200 individually or simultaneously in a direction in which the high fix board H is installed. The mobile unit 301 connects the connection part 201 to the high fix board H by moving the test tray 200 in the direction in which the high fix board H is installed.

A typical actuator may be used for the mobile unit 301, and a plurality of mobile units 301 may be installed to individually move the plurality of test trays 200. The mobile unit 301 may be installed in each of the receiving portion 300 is provided with a plurality.

Here, the test chamber 112 may accommodate a plurality of test trays 200, so that more semiconductor devices are connected to the high fix board H in a short time without increasing the size of the test tray 200. You can.

Therefore, the handler 10 does not increase or minimize the time required for the loading and unloading processes for one test tray 200, while increasing the number of semiconductor devices in a short time. Can be connected to

When the test for the semiconductor device is completed, the test tray 200 containing the tested semiconductor device is transferred from the test chamber 112 to the second chamber 113.

At least one or more test chambers 112 may be installed. High test boards (H) are respectively installed in the test chambers (112).

The plurality of test chambers 112 may be adjacently installed in a horizontal direction (X-axis direction, shown in FIG. 7). As the number of installations of the test chamber 112 increases, the handler 10 may connect more semiconductor devices to the high fix board H in a short time. However, since the size of the handler 10 increases as the number of installations of the test chamber 112 increases, the number of installations of the test chamber 112 should be determined in consideration of the size increase of the handler 1.

As illustrated in FIG. 7, the handler 10 according to the exemplary embodiment of the present invention may include a first test chamber 112a and a second test chamber 112b installed adjacent to each other in a horizontal direction. The first test chamber 112a may be installed adjacent to the first chamber 111, and the second test chamber 112b may be installed adjacent to the second chamber 113.

As illustrated in FIG. 8, the test chamber 112 may include an upper chamber 1121 and a lower chamber 1122 stacked on top of each other.

Therefore, the test chamber 112 is divided into the upper chamber 1121 and the lower chamber 1122, thereby reducing the volume of each, thereby facilitating the semiconductor element accommodated in the test tray 200 at the test temperature. Can be maintained.

The upper chamber 1121 and the lower chamber 1122 each receive a plurality of test trays 200, and connect the connection portions 201 of the test trays 200 to the high fix board H. A high fix board H may be installed in the upper chamber 1121 and the lower chamber 1122, respectively.

The upper chamber 1121 and the lower chamber 1122 may each include at least one of a heat transfer heater or a liquid nitrogen injection system, and each may include at least one moving unit 301.

The second chamber 113 restores the tested semiconductor device accommodated in the test tray 200 to room temperature. The second chamber 113 may include at least one of an electrothermal heater or a liquid nitrogen injection system to restore the tested semiconductor device to room temperature. The second chamber 113 may restore the tested semiconductor device to room temperature while lowering the test tray 200 by one step.

Here, the handler 10 may include a test tray feeder (not shown, which will be described below), which may allow the test chamber 112 to connect the plurality of test trays 200 to the high fix board H. This is because the time required for the test may vary for each test tray 200.

Accordingly, the test tray 200 is detached from the test chamber 112 from the test tray 200 in which a test for a semiconductor device is completed among the plurality of test trays 200, and the test tray 200 in which the semiconductor device to be tested is stored is tested. Transferring to the chamber 112 can reduce the index time.

The index time means that after the semiconductor device housed in one test tray 200 is connected to the high fix board H, the semiconductor device housed in another test tray 200 is connected to the high fix board H. Says time. By reducing the index time, it is possible to reduce the waiting time until the test trays having completed the loading process and the unloading process are transferred to the configuration for performing the next process.

The test tray transfer apparatus is separated from the test tray 200 in which the test for the semiconductor device is completed first from the accommodating part 300, and the test tray 200 is separated from the test tray 200. The test tray 200 in which the semiconductor device is accommodated may be transferred.

The test tray feeder may be installed to face the high fix board H in an opposite direction in which the high fix board H is installed in the test chamber 112. The test tray transport apparatus may be installed in a number corresponding to the test chamber 112 when a plurality of test chambers 112 are installed.

In order to accommodate the test tray transport apparatus, the chamber part 11 may further include a third chamber 114 capable of accommodating the test tray transport apparatus therein.

The third chamber 114 may include at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor device to be tested contained in the test tray 200 at a test temperature.

Therefore, even if the test tray 200 containing the semiconductor device to be tested is transferred from the first chamber 111 to the test chamber 112 via the test tray transfer device, the semiconductor device to be tested is maintained at the test temperature. Can be.

3 to 7, the loading unit 12 accommodates the semiconductor device to be tested in the test tray 200. The loading unit 12 may include a loading stacker 121, a loading picker 122, and a first rotating device 1a.

The loading stacker 121 stores a plurality of customer trays in which semiconductor devices to be tested are stored.

The loading picker 122 is installed to be movable in the X-axis direction and the Y-axis direction, and includes a nozzle capable of absorbing the semiconductor device. The loading picker 122 may include a first loading picker 122a and a second loading picker 122b.

The first loading picker 122a picks up the semiconductor device to be tested from the customer tray located in the loading stacker 121 and loads the first loading among the receiving grooves 211 provided in the first rotating device 1a. It is accommodated in the receiving grooves 211 located in the buffer area D1.

The first loading buffer area D1 is used to transfer the semiconductor elements to be tested and accommodated in the customer tray positioned in the loading stacker 121 to the receiving grooves 211 provided in the first rotating device 1a. This is an area where the accommodating part 21 is located. The receiving grooves 211 provided in the accommodating portion 21 positioned in the first loading buffer region D1 are switched so that their directions coincide with the directions of the semiconductor device to be tested stored in the customer tray.

The second loading picker 122b is a semiconductor device to be tested in the receiving grooves 211 located in the second loading buffer region E1 among the receiving grooves 211 provided in the first rotating device 1a. Is picked up and stored in the test tray 200 located in the loading area 12a.

The second loading buffer area E1 is an area in which the accommodating part 21 is positioned so that the semiconductor device to be tested accommodated in the accommodating grooves 211 is transferred to the test tray 200 and accommodated. The receiving grooves 211 provided in the accommodating portion 21 positioned in the second loading buffer region E1 have a direction in which the semiconductor element to be tested is accommodated in the socket 203 provided in the test tray 200. To match.

The first rotating device 1a may be installed on a path in which the semiconductor device to be tested is transferred from the customer tray located in the loading stacker 121 to the test tray 200 located in the loading area 12a. .

The accommodating parts 21 provided in the first rotating device 1a are sequentially positioned in the first loading buffer region D1 and the second loading buffer region E1.

At least one accommodating portion 21 that is not positioned in the first loading buffer region D1 and the second loading buffer region E1 is positioned in the loading standby region F1. The loading standby region F1 may be a position where the accommodating portion 21 in which the semiconductor device to be tested is accommodated through the first loading buffer region D1 is waiting before being placed in the second loading buffer region E1.

3 to 7, the unloading unit 13 is disposed next to the loading unit 12, and the test completed semiconductor device accommodated in the test tray 200 is separated from the test tray 200 and tested. Classify according to the result. The unloading unit 13 may include an unloading stacker 131, an unloading picker 132, and a second rotating device 1b.

The unloading stacker 131 stores a plurality of customer trays in which the tested semiconductor devices are stored. The plurality of customer trays stored in the unloading stacker 131 are stored in different positions for each grade in the unloading stacker 131 to accommodate the tested semiconductor device according to the test result.

The unloading picker 132 may include a first unloading picker 132a and a second unloading picker 132b.

The first unloading picker 132a is tested in the receiving grooves 211 located in the first unloading buffer region D2 among the receiving grooves 211 provided in the second rotating device 1b. The device is picked up and stored in a customer tray located in the unloading stacker 131.

The first unloading buffer area D2 includes the receiving part 21 so that the tested semiconductor device accommodated in the receiving grooves 211 is transferred to the customer tray located in the unloading stacker 131. The area where it is located. The receiving grooves 211 provided in the accommodating portion 21 positioned in the first unloading buffer area D2 are accommodated in the direction of the customer tray positioned in the unloading stacker 131. Switch to match the direction in which

The second unloading picker 132b separates the tested semiconductor device from the test tray 200 located in the unloading area 13a and includes the receiving grooves 211 provided in the second rotating device 1b. It is accommodated in the receiving grooves 211 located in the second unloading buffer area (E2).

The second unloading buffer area E2 is an area where the accommodating part 21 is positioned so that the tested semiconductor device accommodated in the test tray 200 is transferred to the accommodating grooves 211 and accommodated therein. The receiving grooves 211 provided in the accommodating portion 21 positioned in the second unloading buffer region E2 have their tested semiconductor elements stored in the sockets 203 provided in the test tray 200. Switch to match the direction in which

The accommodating parts 21 provided in the second rotating device 1b are sequentially positioned in the first unloading buffer area D2 and the second unloading buffer area E2.

At least one accommodating portion 21 that is not positioned in the first unloading buffer region D2 and the second unloading buffer region E2 is positioned in the unloading standby region F2. The unloading standby area F2 may be a position where the accommodating part 21, which is emptied through the first unloading buffer area D2, waits before being placed in the second unloading buffer area E2.

7 and 8, the handler 10 may further include a tray loading unit 14 and a tray unloading unit 15.

The tray loading unit 14 is installed between the upper chamber 1121 and the lower chamber 1122, and accommodates at least one test tray 200 in which the semiconductor device to be tested is accommodated.

As the tray loading unit 14 is installed, the test tray 200 containing the semiconductor device to be tested is transferred from the first chamber 21 to the test tray transfer device via the tray loading unit 14. Can be. The tray loading unit 14 may be formed at the same height as a passage through which the test tray 200 is carried out from the first chamber 111.

Although not shown, the tray loading unit 14 may include at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor device to be tested at a test temperature.

The traceunloading unit 15 is installed on either side of the upper or lower side of the tray loading unit 14 and accommodates at least one test tray 200 in which the tested semiconductor device is accommodated.

As the tray loading unit 15 is installed, the test tray 200 in which the tested semiconductor device is accommodated is transferred to the second chamber 113 via the tray loading unit 15 in the test tray transfer device. Can be transferred to. The tracer loading part 15 is preferably formed at the same height as a passage through which the test tray 200 is carried in the second chamber 113.

Although not shown, the traceunloading unit 15 may include at least one of an electrothermal heater or a liquid nitrogen injection system to restore the tested semiconductor device to room temperature.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in detail.

Referring to Figures 3 to 8, the semiconductor device manufacturing method according to the present invention includes the configuration as follows.

First, a semiconductor device to be tested is prepared. Such a process may be performed by storing a semiconductor device to be tested in a customer tray and storing it in the loading stacker 121. In addition, the semiconductor device may include a memory or non-memory semiconductor device, a module IC, and the like.

Next, the prepared semiconductor device to be tested is accommodated in the receiving grooves 211 provided in the semiconductor device rotating apparatus 1 installed in the loading unit 12.

In this process, the first loading picker 122a picks up the prepared semiconductor device to be tested from the customer tray located in the loading stacker 121, and the receiving grooves 211 provided in the first rotating device 1a. ) May be accommodated in the receiving grooves 211 located in the first loading buffer region D1.

The accommodating parts 211 provided in the first rotating device 1a are sequentially positioned in the first loading buffer area D1, the second loading buffer area E1, and the loading standby area F1. This may be achieved by rotating the buffer tray 2 by a rotating unit provided in the first rotating device 1a.

Next, the connection part 201 provided at the side surface and connected to the high fix board H, the socket 203 for accommodating the semiconductor element, and the semiconductor element and the connection part 201 accommodated in the socket 203 are mutually connected. The test tray 200 including the connecting portion 202 for electrically connecting is positioned in the loading area 12a.

This process may be performed by a conveying means (not shown) for transferring the test tray 200, and the loading of the test tray 200 in the unloading area 13a where the unloading process is completed and emptied. This can be done by transferring to area 12a. The conveying means may comprise a conventional actuator.

Next, the semiconductor device to be tested, which is accommodated in the accommodation grooves 211 provided in the semiconductor device rotating apparatus 1 installed in the loading unit 12, is placed in the test tray 200 located in the loading area 12a. It is stored.

This process is to be tested in the receiving grooves 211 located in the second loading buffer region E1 among the receiving grooves 211 in which the second loading picker 122b is provided in the first rotating device 1a. The semiconductor device may be picked up and accommodated in the test tray 200 located in the loading area 12a.

The accommodating parts 211 provided in the first rotating device 1a are sequentially positioned in the first loading buffer area D1, the second loading buffer area E1, and the loading standby area F1. This may be achieved by rotating the buffer tray 2 by a rotating unit provided in the first rotating device 1a.

Next, the semiconductor device to be tested stored in the test tray 200 is adjusted to a test temperature, and each connection unit 201 provided in the plurality of test trays 200 is connected to the high fix board H, and the tested semiconductor is completed. Restore the device to room temperature.

In this process, the test tray 200 containing the semiconductor device to be tested is first raised by one step inside the first chamber 111, and the test is performed by heating or cooling the semiconductor device to be tested stored in the test tray 200. Adjust to temperature.

Thereafter, the test tray 200 in which the semiconductor element adjusted to the test temperature is accommodated is moved by a mobile unit (not shown) provided in the test chamber 112, whereby the connection part provided in the test tray 200 ( 201 is connected to the high fix board H. FIG. The high fix board H may test the semiconductor device to determine electrical characteristics of the semiconductor device through the connection unit 201.

When the test for the semiconductor device is completed, the test tray 200 in which the tested semiconductor device is stored is lowered by one step in the second chamber 113, and the tested semiconductor device stored in the test tray 200 is stored at room temperature. It can be made by restoring to.

The test tray 200 may be transferred to the loading area 12a, the first chamber 111, the test chamber 112, the second chamber 113, and the unloading area 13a by the transfer means.

Next, the receiving grooves 211 provided in the semiconductor device rotating apparatus 1 installed in the unloading unit 13 are tested semiconductor elements stored in the test tray 200 located in the unloading area 13a. ) Is stored.

In this process, the second unloading picker 132b separates the tested semiconductor device from the test tray 200 located in the unloading area 13a, and is provided in the second rotating device 1b. It may be made by accommodating the receiving grooves 211 located in the second unloading buffer region E2 among the fields 211.

The accommodating parts 211 provided in the second rotating device 1b are sequentially positioned in the second unloading buffer region E1, the first unloading buffer region D1, and the unloading standby region F2. . This may be achieved by rotating the buffer tray 2 by a rotating unit provided in the second rotating device 1b.

Next, the tested semiconductor devices accommodated in the receiving grooves 211 provided in the semiconductor device rotating apparatus 1 installed in the unloading unit 13 are classified by grade according to the test results.

In this process, the receiving grooves 211 located in the first unloading buffer region D2 among the receiving grooves 211 in which the first unloading picker 132a is provided in the second rotating device 1b. The semiconductor device can be made by picking out the tested semiconductor device in the customer tray located in the unloading stacker 131.

The accommodating parts 211 provided in the second rotating device 1b are sequentially positioned in the second unloading buffer region E1, the first unloading buffer region D1, and the unloading standby region F2. . This may be achieved by rotating the buffer tray 2 by a rotating unit provided in the second rotating device 1b.

By repeatedly performing the above process, the manufacturing of the semiconductor device is completed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a plan view schematically showing the configuration of a conventional handler

Figure 2 is a schematic diagram showing a path in which the test tray is transported in the handler of Figure 1

Figure 3a is a perspective view schematically showing a test tray used in the present invention

3b is a conceptual diagram showing a test tray and a customer tray to help understanding of the present invention;

Figure 4 is a plan view schematically showing an embodiment of a semiconductor device rotating apparatus according to the present invention

5 is a plan view schematically showing another embodiment of a semiconductor device rotating apparatus according to the present invention

6 is a plan view schematically showing still another embodiment of a semiconductor device rotating apparatus according to the present invention;

7 is a schematic perspective view of a handler according to the present invention;

8 is a front view schematically showing a chamber part in a handler according to the present invention;

* Description of the symbols for the main parts of the drawings *

1: semiconductor device rotating apparatus according to the present invention 2: buffer tray 3: rotating unit

21: accommodating part 211: accommodating groove D: first buffer area E: second buffer area F: standby area

10 handler according to the present invention 11 chamber portion 12 loading portion 13 unloading portion

1a: first rotating device 1b: second rotating device D1: first loading buffer area

E1: second unloading buffer area D2: first unloading buffer area E2: second unloading buffer area

Claims (15)

A buffer tray including at least one accommodating part in which a plurality of accommodating grooves in which the semiconductor element is accommodated in one direction are arranged in a matrix; And And a rotating unit coupled to the rotating shaft of the buffer tray and rotating the buffer tray about the rotating shaft so that the arrangement direction of the receiving groove can be switched. The semiconductor device rotating apparatus according to claim 1, wherein a plurality of accommodating parts are disposed on the buffer tray and spaced apart from each other. The semiconductor device rotating apparatus according to claim 2, wherein the buffer tray is disc-shaped. The method of claim 2, And the rotating unit rotates the buffer tray so that any one of the plurality of accommodating parts is positioned in the first buffer area, and one of the other parts is located in the second buffer area. The method of claim 4, wherein And the rotating unit rotates the buffer tray to position at least one accommodating part not positioned in the first buffer area and the second buffer area in a standby area. The method of claim 4, wherein The accommodating parts are disposed on the buffer tray so as to be spaced apart from each other at the same rotation angle in a rotational direction about a rotational axis, And the rotating unit rotates the buffer tray by a rotation angle at which the accommodating parts are spaced apart. The semiconductor device rotating apparatus according to claim 6, wherein the accommodating parts are disposed on the buffer tray spaced apart by 90 ° in a rotational direction about a rotation axis. The semiconductor device rotating apparatus according to claim 4, wherein the accommodating parts are disposed at the same distance from the rotation shaft and spaced apart from each other with the same rotation angle. The method of claim 4, wherein And the semiconductor devices accommodated in the accommodation grooves of the first buffer region and the second buffer region are arranged such that their arrangement directions are perpendicular to each other. The method of claim 4, wherein The first tray, the second housing, the third housing, and the fourth housing are formed on the buffer tray and are spaced apart from each other with a rotation angle of 90 °. The first and third receiving parts are disposed with a rotation angle of 180 ° based on the rotation axis, The second housing portion and the fourth housing portion is disposed with a rotation angle of 180 ° with respect to the rotation axis, An arrangement direction of the semiconductor elements accommodated in the first and third accommodating parts and an arrangement direction of the semiconductor elements accommodated in the second and fourth accommodating parts are perpendicular to each other. Rotator. A test tray provided at a side thereof and connected to a high fix board, a socket configured to house a semiconductor element, and a connection unit electrically connecting the semiconductor element and the connection unit accommodated in the socket; A loading unit accommodating a semiconductor device to be tested contained in a customer tray located in a loading stacker in a test tray located in a loading area; The semiconductor device to be tested stored in the test tray is adjusted to a test temperature, and each connection part provided in a plurality of test trays containing the semiconductor device controlled to the test temperature is connected to a high fix board, and the tested semiconductor device is stored at room temperature. A chamber unit for restoring; An unloading unit disposed next to the loading unit and accommodating the tested semiconductor device stored in a test tray located in the unloading area in a customer tray located in the unloading stacker; And The handler comprising any one of the semiconductor device rotation device of claim 1 which is installed in the loading section and the unloading section, respectively. The apparatus of claim 11, wherein the semiconductor device rotating device is A first rotating device installed on a path from which a semiconductor device to be tested is transferred from a customer tray located in the loading stacker to a test tray located in a loading area; And And a second rotating device installed on a path from which the tested semiconductor device is transferred from the test tray located in the unloading area to the customer tray located in the unloading stacker. The method of claim 12, wherein the loading unit A first loading picker for receiving the semiconductor device to be tested stored in the customer tray positioned in the loading stacker, in the receiving grooves located in the first loading buffer area among the receiving grooves provided in the first rotating device; And And a second loading picker for accommodating a semiconductor device to be tested, which is accommodated in storage grooves located in a second loading buffer area, among the storage grooves provided in the first rotating device, in a test tray located in a loading area. Handler. The method of claim 12, wherein the unloading unit A first unloading picker for accommodating the tested semiconductor device accommodated in the accommodating grooves located in the first unloading buffer area among the accommodating grooves provided in the second rotating device in a customer tray located in the unloading stacker. ; And A second unloading picker configured to receive the tested semiconductor device stored in the test tray positioned in the unloading area, in the receiving grooves located in the second unloading buffer area among the receiving grooves provided in the second rotating device. A handler comprising: a. Preparing a semiconductor device to be tested; Accommodating the prepared semiconductor device to be tested in accommodation grooves provided in the semiconductor device rotating apparatus of any one of claims 1 to 10 installed in the loading unit; Positioning a test tray in a loading area including a connection portion provided at a side thereof and connected to a high fix board, a socket in which a semiconductor element is stored, and a connection portion electrically connecting the semiconductor element and the connection portion stored in the socket to each other; ; Accommodating a semiconductor device to be tested, which is accommodated in receiving grooves provided in the semiconductor device rotating apparatus installed in the loading unit, in a test tray located in a loading area; Adjusting a semiconductor device to be tested stored in a test tray to a test temperature, connecting each connection part of the plurality of test trays to a high fix board, and restoring the tested semiconductor device to room temperature; Receiving the tested semiconductor device stored in the test tray positioned in the unloading area in the receiving grooves provided in the semiconductor device rotating apparatus of any one of claims 1 to 10 installed in the unloading unit; And And classifying the tested semiconductor devices accommodated in the receiving grooves provided in the semiconductor device rotating apparatus installed in the unloading unit by grades according to test results.

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