KR101406184B1 - A Semiconductor Tranferring Device and Test handler using thereof - Google Patents

Abstract

The present invention relates to a semiconductor device transferring apparatus and a test handler, wherein the rrm configuration comprises: a loading apparatus in which a plurality of customer trays equipped with semiconductor elements to be tested are loaded; An unloading device in which a plurality of empty customer trays to which tested semiconductor devices are carried are loaded; The semiconductor device is loaded on a test tray, which is provided between the loading device and the unloading device, and transfers the semiconductor device from the test tray on which the tested semiconductor device is loaded to the unloading device. And a transfer device for transferring the image data.

Loading device, unloading device, transfer device

Description

[0001] DESCRIPTION [0002] Semiconductor device transfer devices and test handlers [0003]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler for testing semiconductor devices, and more particularly to a semiconductor device transferring apparatus and a test handler capable of electrically testing a semiconductor device by electrically connecting a plurality of semiconductor devices to a test head.

In general, memory ICs and non-memory semiconductor devices and module ICs, which are suitably formed on a single board, are manufactured after various tests. The handler refers to a device that is used for electrically connecting and testing a semiconductor device, a module IC, or the like, as described above, to an external test apparatus automatically.

In recent years, the handler has not only performed a general performance test at normal temperature but also developed a high temperature and low temperature extreme environment through an electrothermal heater and a liquefied nitrogen injection system in a closed chamber, Are also being developed to perform high-temperature and low-temperature tests to test whether they can perform normal functions.

Figure 1 of the accompanying drawings shows the configuration of such a conventional semiconductor device test handler. As shown in FIG. 1, a loading stacker 1 is mounted on a front portion of a handler, in which user trays are stacked and a plurality of semiconductor elements to be tested are stacked. On the one side portion, the unloading stacker 2, in which the tested semiconductor elements are classified according to the test result and stored in the customer tray, is installed.

A plurality of buffer shuttles (4) for temporarily mounting and transporting the semiconductor elements transferred from the loading stacker (1) are provided on both sides of the middle portion of the handler so as to be movable forward and backward. The operation of transferring the semiconductor elements to be tested of the buffer shuttle 4 to the test tray TT and the operation of transferring the tested semiconductor elements of the test tray TT to the buffer shuttle 4 are carried out between the buffer shuttles 4, And an exchange unit 5 is provided in which an operation for mounting the workpiece is carried out.

The test tray TT has a structure in which a plurality of carrier modules (not shown) capable of fixing and releasing semiconductor elements are arranged at regular intervals on a rectangular frame of a metal material excellent in heat resistance, (Not shown) of the test head 8 to which the test head 8 is connected.

A handler front portion in which the loading stacker 1 and the unloading stacker 2 are disposed and a handler intermediate portion in which the exchanging portion 5 and the buffer shuttle 4 are disposed are linearly moved in the X- A first picker 3a and a second picker 3b for picking up and transporting the elements are provided, respectively. The first picker 3a moves the loading stacker 1 and the unloading stacker 2 and the buffer shuttle 4 to pick up and transfer semiconductor devices. Moves in the X-axis direction and picks up and transports semiconductor elements of the buffer shuttle 4 and the exchange unit 5.

In the rear part of the handler, an environment of a predetermined temperature is formed in the sealing chambers divided into the heating chamber part 7a, the test chamber part 7b and the cooling chamber part 7c, A test chamber (7) for testing the performance of the semiconductor device under predetermined temperature conditions is located in the test tray (TT) sequentially between the chambers.

On the other hand, the buffer shuttle 4 is coupled to a moving block (not shown) provided on both sides of the exchanging part 5 by means of a linear moving device so as to be movable forward and backward.

The handler configured as above operates as follows.

When the handler starts operating, the first picker 3a picks up the semiconductor elements of the loading stacker 1 and conveys them to the buffer shuttle 4. Subsequently, the second picker 3b carries the semiconductor element of the buffer shuttle 4 to the exchanging portion, and the semiconductor element is mounted on the empty test tray TT standing in a horizontal state in the exchanging portion.

The test tray TT on which the semiconductor element is mounted in the exchanging part 5 is transferred to the forward position of the test chamber 7 while being switched to the vertical state by rotating the rotary device 6 by 90 degrees, Is conveyed into the heating chamber portion 7a by the conveying device and is heated or cooled to a predetermined temperature.

The test tray TT transferred to the rearmost chamber of the heating chamber portion 7a is again transferred to the test chamber portion 7b by the rear side transfer device and then transferred to the test chamber portion 7b by the contact push unit 9, Is electrically connected to the test head 8 and a test is performed.

When the test is completed, the test tray TT is transported to the cooling chamber portion 7c, and each of the semiconductor elements returns to the normal temperature state. The test tray TT is moved forward from the cooling chamber portion 7c to the front side of the test chamber 7 by the front side transfer device and then switched to a horizontal state by rotating the rotary device 6 by 90 degrees, (5).

Subsequently, the second picker 3b transfers the tested semiconductor elements from the test tray TT to the buffer shuttle 4, and simultaneously moves the new semiconductor elements of the buffer shuttle 4 to the exchange part 5, (TT). Then, the first picker 3a picks up the tested semiconductor elements of the buffer shuttle 4 and categorizes them in the customer tray of the unloading stacker 2 according to the test results.

However, the above-described conventional techniques have the following problems.

In the test handler structure according to the related art, the semiconductor devices placed on the customer tray are picked up and transferred to the buffer shuttle, the semiconductor device is transferred from the buffer shuttle to the test tray of the exchange unit, Since the semiconductor device of the customer tray is conveyed to the test chamber, the testing operation is troublesome and the operation time is long.

In the test handler according to the related art, only one test chamber can be installed, so that the overall operation speed can not be increased any more.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor device transferring apparatus, a test handler, and a semiconductor device testing method using the same, in which a semiconductor device of a customer tray is simply transferred to a test chamber. .

Another object of the present invention is to provide a semiconductor transfer device, a test handler, and a semiconductor device test method using the semiconductor transfer device, in which a plurality of test chambers can be installed in a test handler.

According to another aspect of the present invention, there is provided a semiconductor device transferring apparatus comprising: a loading device loading a plurality of customer trays mounted with semiconductor elements to be tested; An unloading device in which a plurality of empty customer trays to which tested semiconductor devices are carried are loaded; The semiconductor device is loaded on a test tray, which is provided between the loading device and the unloading device, and transfers the semiconductor device from the test tray on which the tested semiconductor device is loaded to the unloading device. And a transfer device for transferring the image data.

Wherein the transfer device comprises: a loading site for transferring semiconductor devices to be tested in the loading device to the test tray; And an unloading site through which the tested semiconductor device is transferred to the customer tray.

And a first picker unit for picking up a semiconductor element of the customer tray of the loading apparatus and transferring the semiconductor element to a test tray of the transfer apparatus.

And a second picker unit for picking up the semiconductor device of the test tray of the transfer device and transferring the semiconductor device to the customer tray of the unloading device.

In addition, the test handler according to another embodiment of the present invention includes the above-described semiconductor element transfer device; And a chamber part provided between the loading device and the unloading device in parallel with the transferring device for testing the semiconductor devices mounted on the test tray.

Wherein the chamber portion comprises: a heating chamber portion for heating the semiconductor element at a predetermined temperature; A test chamber portion for testing the semiconductor device heated in the heating chamber portion; And a cooling chamber unit for cooling the semiconductor devices tested in the test chamber unit.

And a first rotating device for rotating the test tray by 90 degrees is further provided between the transfer device and the heating chamber part.

And a second rotating device for rotating the test tray by 90 degrees is further provided between the transfer device and the heating chamber part.

The test chamber may be arranged in parallel on both sides of the transfer device.

The semiconductor device transfer device and the test handler according to the present invention have the following effects.

A transfer device is provided between the loading device and the unloading device, a test chamber is arranged in parallel to the transfer device, the semiconductor device of the customer tray is mounted as a test tray of the transfer device, and the test tray is transferred into the test chamber, The test process of the device is simplified, thereby reducing the cost and time of the entire process.

In addition, test chambers can be installed on both sides of the transfer device, so that a large amount of semiconductor devices can be tested at a time, and the operation speed can be increased.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a semiconductor device transferring apparatus, a test handler, and a semiconductor device testing method using the same according to the present invention will be described in detail with reference to the accompanying drawings.

A semiconductor device transfer apparatus according to the present invention includes a loading device (10) on which a plurality of customer trays (UT) on which semiconductor elements to be tested are stacked, a plurality of empty customer trays (UT) And a semiconductor device which is provided between the loading device 10 and the unloading device 20 so as to be transferred from the loading device 10 is placed in a test tray TT, And a transfer device (30) for transferring the semiconductor device from the test tray (TT) to the unloading device (20).

First, the test tray TT is formed into a frame having a predetermined shape so that the semiconductor element can be placed thereon. For example, the test tray TT may be formed as a square frame, and may have a structure in which a plurality of carrier modules CM capable of fixing and releasing semiconductor devices therein are arranged at regular intervals.

The gap of the carrier module may be formed to correspond to the test socket of the chamber part 40, which will be described below. The test tray TT may be formed of a metal material having excellent heat resistance so as to be securely held against the thermal test of the semiconductor device.

And, the customer tray (UT) is for temporarily storing the semiconductor element in the semiconductor element manufacturer. The customer tray (UT) is generally formed of a rectangular plate made of synthetic resin such as plastic, and a plurality of grooves on which semiconductor elements are mounted are formed at regular intervals in the plate.

First, the semiconductor device transfer apparatus of the present invention is provided with a loading device 10. As shown in FIG. 2, the loading apparatus 10 includes a loading basin 12 on which customer trays (UT) containing semiconductor elements to be tested are loaded, And a first picker portion 14 for picking up the picked-up image and transferring it to the test tray TT of the transfer device 30. [

A plurality of customer trays (UT), which are formed in a predetermined space and accommodate semiconductor elements to be tested, are loaded in the loading standby portion (12). In the loading standby part 12, a customer tray UT, in which all of the semiconductor devices are picked up and emptied, is transferred, and a customer tray (UT) A unit (not shown) may be provided.

The loading device 10 is provided with a first picker portion 14. The first picker portion 14 picks up a semiconductor device to be tested, which is accommodated in the customer tray UT, and places the semiconductor device on a test tray TT.

The first picker unit 14 includes a picker 14a for picking up the semiconductor device and a conveying rail 14b for allowing the picker 14a to move to a predetermined position . Particularly, the conveying rail 14b should be installed so that the picker 14a can move from the loading standby portion 12 to the loading site 32 of the conveying device 30, which will be described below.

An unloading apparatus 20 is also provided in which the tested semiconductor elements are housed in the customer tray UT again. The unloading device 20 may be installed to be spaced apart from the loading device 10, as shown in FIG.

2, the unloading apparatus 20 includes an unloading standby section 22 on which empty customer trays (UT) for storing tested semiconductor elements are loaded, And a second picker portion 24 for picking up the device and transferring it to the empty customer tray UT.

The unloading standby portion 22 is formed in a predetermined space and has a plurality of empty customer trays UT on which the tested semiconductor elements can be housed. The unloading standby portion 22 is provided with a second transport unit (not shown) for transporting the customer tray UT filled with the semiconductor elements again and transporting the new empty customer tray UT so that the new empty customer tray UT can be exposed upward ) Can be provided.

The unloading apparatus 20 is provided with a second picker section 24. The second picker section 24 picks up the tested semiconductor elements accommodated in the test tray TT and places the semiconductor elements on the empty customer tray UT.

The second picker section 24 includes a picker 24a for picking up the semiconductor element and a feed rail 24b for allowing the picker 24a to move to a predetermined position . Particularly, the conveying rail 24b should be installed so that the picker 24a can move from the unloading standby portion 22 to the unloading site 34 of the conveying device 30, which will be described below.

Meanwhile, a transfer device 30 is provided between the loading device 10 and the unloading device 20. The transfer device 30 allows the semiconductor device of the customer tray UT to be easily operated when the chamber part 40 is tested as will be described below.

More specifically, the transfer device 30 is provided with the test tray TT. After the semiconductor devices accommodated in the customer tray UR are accommodated in the test tray TT, TT) is returned to the chamber part 40 to be described below and the test is performed.

The transporting device 30 is provided with a loading site 32 through which the semiconductor device to be tested is transferred to the test tray TT by the loading device 12, The unloading site 34 is provided.

The transfer unit 30 is provided with a third transfer unit (not shown) for allowing the test tray TT to move between the loading site 32 and the unloading site 34.

The third conveying unit conveys the test tray TT to which the semiconductor elements have been received from the loading site 32 to the chamber part 40 and the test tray TT in which the tested semiconductor elements are housed, (TT) to the unloading site (34).

In the third transport unit, all of the semiconductor devices tested in the unloading site 34 are transported to the unloading device 22 so that the empty test tray TT is transported to the loading site 32 .

Referring to FIG. 2, a test handler employing the above-described semiconductor element transfer apparatus of the present invention is provided with a chamber section 40 in which the semiconductor device is tested.

The chamber portion 40 is a space for inspecting whether or not the semiconductor elements placed on the test tray TT are deformed at a predetermined temperature. The chamber section 40 includes a heating chamber section 42 for heating the semiconductor element at a predetermined temperature as shown in FIG. 2, a test chamber 42 for testing the semiconductor element heated in the heating chamber section 42, And a cooling chamber part 46 for cooling the tested semiconductor device in the test chamber part 44. [

Each of the heating chamber portion 42, the test chamber portion 44, and the cooling chamber portion 46 may be configured as a separate chamber that is isolated in the chamber portion 40, respectively.

The test tray TT of the loading site 32 is first conveyed to the heating chamber section 42 and the test tray TT having passed through the heating chamber section 42 is conveyed to the test chamber section 44 The test tray TT conveyed to the test chamber portion 44 is again conveyed to the cooling chamber portion 46 and then conveyed to the unloading site 34. This is accomplished by a fourth transfer unit (not shown) provided in the chamber part 40. [

First, the heating chamber portion 42 is positioned adjacent to the loading site 32. The heating chamber unit 42 is provided with a first temperature composition unit (not shown). The first temperature composition unit serves to heat the semiconductor element placed in the test tray TT to a predetermined temperature state.

The test chamber 44 serves to test the semiconductor device under a predetermined temperature condition. The test chamber portion 44 is detachably mounted with a test head 48 having a plurality of test sockets (not shown) for electrically connecting the semiconductor elements of the test tray TT and performing a test.

The test head 48 is electrically connected to a separate test device called an external tester so as to exchange electric signals.

A contact push unit 50 may be further provided in front of the test head 48 to press the semiconductor device of the test tray TT toward the test head 48 to connect the test socket 48 to the test socket at a predetermined pressure.

The cooling chamber portion 46 may also be provided with a second temperature composition unit (not shown) for cooling the semiconductor elements of the test tray TT to a predetermined temperature in the same manner as the heating chamber portion 42 . The second temperature composition unit serves to cool the semiconductor device heated in the heating chamber part 42 to a temperature before the heating.

2, the chamber part 40 may be configured so that the test tray TT can be tested in a vertically erected state. This is to prevent the space inside the chamber part 40 from being horizontally enlarged.

The rotatable unit 52, 54 may be further provided so that the test tray TT is vertically erected and transported and tested within the chamber part 40. 2, a first rotating device 52 is provided between the loading site 32 and the heating chamber part 42 and between the unloading site 34 and the cooling chamber part 46, A second rotating device 54 may be provided.

4, the first rotating device 52 is provided between the loading site 32 and the heating chamber part 42 and is connected to a test tray (not shown) TT) by 90 degrees so as to be vertically conveyed to be transferred to the heating chamber portion 42.

5, the second rotating device 54 is provided between the unloading site 34 and the cooling chamber part 46 and is moved vertically in the cooling chamber part 46, The test tray TT is rotated by 90 degrees so that the test tray TT can be horizontally laid to be transmitted to the unloading site 34.

Further, a horizontal moving device (not shown) may be further provided for moving the test tray TT loaded on the loading site 32 to the first rotating device 52. The horizontal moving device horizontally moves the test tray (TT) horizontally loaded on the loading site (32) by the first rotating device (52).

The second rotating device 54 may further include a horizontal moving device (not shown). The horizontal movement device provided in the second rotary device 54 is configured such that when the test tray TT vertically erected in the cooling chamber part 46 by the second rotary device 54 is horizontally rotated, The device serves to move the test tray (TT) to the unloading site (34).

As shown in FIGS. 4 and 5, the loading site 32 and the unloading site 34 are provided with elevating devices (not shown) for moving the stacked test trays TT up and down by a predetermined pitch, City) can be provided.

2, the chamber unit 40 may be formed in parallel to the conveying apparatus 30, and may be provided in parallel with the conveying apparatus 30, as shown in FIG. .

Hereinafter, the operation of the semiconductor element transfer apparatus and test handler according to the present invention having the above-described configuration will be described in detail.

First, the first transport unit is operated in the loading apparatus 10 so that the customer tray UT on which the semiconductor device to be tested is loaded in the loading standby unit 12 is exposed upward. Then, the picker 14a of the first picker section 14 operates to pick up the semiconductor elements accommodated in the customer tray UT. The picker 14a moves to the loading site 32 of the conveying device 30 along the conveying rail 14b of the first picker portion 14. [

The picker 14a of the first picker portion 14 places the semiconductor element on a test tray TT provided on the loading site 32. [ Then, the picker 14a of the first picker section 14 stores semiconductor elements in the test tray TT while repeating the above-described process. When all of the semiconductor devices are placed on the test tray TT of the loading site 32, the third transport unit provided in the transport device 30 operates.

The third conveying unit operates so that the test tray TT is guided to the heating chamber portion 42 of the chamber portion 40. At this time, the test tray TT is rotated 90 degrees by the first rotating device 52 and is vertically erected.

When the test tray TT is transported to the heating chamber portion 42 by the third transport unit, the vertically erected test tray TT is heated by the first temperature control of the heating chamber portion 42 The unit is activated.

The first temperature adjusting unit of the heating chamber portion 42 heats the semiconductor element at a temperature preset by the user, that is, the temperature at which the semiconductor element is to be tested. The test tray (TT) containing the semiconductor element heated by the first temperature adjusting unit is guided to the test chamber section (44) by the fourth transfer unit.

The contact pushing unit 50 approaches the test tray TT in the test chamber 44 and a test socket of the test head 48 corresponding to the semiconductor elements of the test tray TT in one- Respectively.

Then, the tested information of the semiconductor device is transmitted to a tester connected to the test head 48. The test tray (TT) in which the semiconductor devices tested in the test chamber section 44 are accommodated is conveyed to the cooling chamber section 46 by the fourth conveyance unit.

When the test tray TT is transferred to the cooling chamber part 46, the second temperature control unit of the cooling chamber part 46 operates to cool the semiconductor element heated in the heating chamber part 42 do. When the cooling of the semiconductor element is completed in the cooling chamber portion 46, the third conveying unit of the conveying device 30 is operated.

The third conveying unit operates to convey the test tray TT of the cooling chamber portion 46 to the unloading site 34. [ At this time, the test tray TT which has been transferred vertically is rotated 90 degrees by the second rotating device 54 and horizontally positioned.

Then, the test tray (TT) is transferred to the unloading site (34) by the third transport unit. Thereafter, the picker 24a of the second picker section 24 of the unloading apparatus 20 is operated.

The picker 24a of the second picker section 24 moves along the conveying rail 24b and moves to the unloading site 34. [ Then, the tested semiconductor device housed in the test tray TT of the unloading site 34 is picked up.

The picker 24a of the second picker portion 24 picks up the semiconductor device and moves to the unloading device 22 along the transfer rail 24b again. Then, the semiconductor device is put down on a customer tray (UT) of the unloading device (22).

The above-described process is repeatedly performed, and all the semiconductor devices tested in the test tray TT are transferred to the customer tray UT of the unloading device 22. [ At this time, the test tray TT, in which all the semiconductor devices are picked up and emptied, is moved to the loading site 32 again by the third transport unit.

The semiconductor device to be tested by the picker 14a of the first picker section 14 is again fed from the loading apparatus 10 to the test tray TT of the loading site 32 in the loading apparatus 10 While transferring, the above-described process is repeated again.

When all of the tested semiconductor devices are stored in the customer tray (UT) in the unloading device (22), the second transport unit operates to expose the empty customer tray (UT) And the picker 24a of the lead portion 24 moves to a position where the semiconductor element can be picked up.

3, the chambers 40 are provided on both sides of the chamber 40, and the semiconductor device is tested from the loading device 10 to the unloading device 20 in the above-described testing process Moving speed doubles.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. The point is self-evident.

1 is a plan view schematically showing a configuration of a conventional semiconductor device test handler.

2 is a plan view schematically showing a configuration of a test handler employing a semiconductor element transfer apparatus according to the present invention.

3 is a plan view schematically showing the configuration of another embodiment of a test handler employing a semiconductor element transfer device according to the present invention.

4 is a side view schematically showing a configuration of a first rotator constituting a semiconductor element transfer device according to the present invention;

5 is a side view schematically showing a configuration of a second rotator constituting a semiconductor element transfer apparatus according to the present invention;

Description of the Related Art [0002]

10: loading device 12: loading base

14: first pick part 20:

22: unloading standby part 24: second pick part

30: transfer device 32: loading site

34: unloading site 40: chamber part

42: heating chamber part 44: test chamber part

46: Cooling chamber part 48: Test head

50: contact push unit

Claims (9)

A loading device loading a plurality of customer trays mounted with semiconductor elements to be tested; An unloading device in which a plurality of empty customer trays to which tested semiconductor devices are carried are loaded; And, A loading unit which is provided between the loading unit and the unloading unit and which loads the semiconductor elements transferred from the loading unit into a test tray and transfers the semiconductor elements from the test tray loaded with the tested semiconductor elements to the unloading unit Comprising: The transfer device A loading site through which the semiconductor device to be tested is transferred to the test tray in the loading apparatus; And, And an unloading site for transferring the tested semiconductor elements to the customer tray. delete The method according to claim 1, Further comprising: a first picker unit for picking up a semiconductor element of a customer tray of the loading apparatus and transferring the semiconductor element to a test tray of the transfer apparatus. The method according to claim 1, Further comprising a second picker section for picking up the semiconductor element of the test tray of the transfer apparatus and transferring it to the customer tray of the unloading apparatus. A semiconductor device transferring apparatus according to any one of claims 1, 3, and 4; And, And a chamber part provided between the loading device and the unloading device in parallel with the transfer device for testing the semiconductor devices mounted on the test tray. 6. The method of claim 5, Wherein the chamber portion includes: A heating chamber portion for heating the semiconductor element at a predetermined temperature; A test chamber portion for testing the semiconductor device heated in the heating chamber portion; And, And a cooling chamber for cooling the tested semiconductor devices in the test chamber. The method according to claim 6, And a first rotating device for rotating the test tray by 90 degrees is further provided between the transfer device and the heating chamber part. The method according to claim 6, And a second rotating device for rotating the test tray by 90 degrees is further provided between the transfer device and the cooling chamber part. The method according to claim 6, Wherein the test chamber is configured in parallel on both sides of the transfer device.

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