KR100781336B1 - Handler for Testing Semiconductor Devices And Method for Controlling the Same - Google Patents

Abstract

The present invention relates to a handler for testing semiconductor devices and a control method thereof, and a control method of a semiconductor device test handler of the present invention comprises the steps of mounting semiconductor elements to be tested in a test tray in a state in which a test tray is placed in a horizontal state ; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed into the first chamber downward by 90 degrees to convert the test tray into a vertical state; Forming a semiconductor element of the test tray in a predetermined temperature state while sequentially transferring the test tray in the first chamber in one direction; Carrying a test tray in a first chamber to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Sequentially transferring the test tray in one direction in the second chamber and reducing the semiconductor elements of the test tray to a normal temperature state; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray conveyed outside the second chamber.

 Semiconductor devices, handlers, rotators, test trays

Description

Technical Field [0001] The present invention relates to a semiconductor device test handler and a control method thereof,

The present invention relates to a handler for testing a semiconductor device, and more particularly, to a handler for testing a semiconductor device that electrically connects a plurality of semiconductor devices to a test head to test the electrical performance of the semiconductor device and a control method thereof.

In general, memory or non-memory semiconductor devices and module ICs, which are suitably formed on one substrate in a circuit, are manufactured after various tests are conducted after production. The handler is a device which is used for electrically connecting and testing semiconductor devices and module ICs as described above to an external test apparatus automatically.

In recent years, the handler has not only performed a general performance test at room temperature but also developed a high temperature or low temperature extreme environment through an electrothermal heater or a liquid nitrogen injection system in a closed chamber, Are also being developed to perform high temperature and low temperature tests to test whether they can perform normal functions.

U.S. Patent No. 5,290,134 discloses a handler capable of performing a temperature test of semiconductor devices by forming a high-temperature or low-temperature environment in the chamber as described above.

The conventional handler comprises a soak chamber, a test chamber, and an unsoak chamber. In the soak chamber, the test trays are conveyed horizontally by one step, and the semiconductor elements of the test tray are heated or cooled to a predetermined temperature. In the test chamber, a test tray is connected to a horizontal test head, and a test is performed at a predetermined temperature. In the un-soak chamber, the test tray is conveyed in horizontal steps one by one, and the semiconductor elements of the test tray are returned to the initial room temperature.

However, the above-described conventional handler has the following problems.

The handler is connected in a state in which the test head is horizontally mounted in the test chamber and the test tray is horizontal.

Therefore, when a plurality of test heads are configured in a test chamber and a large number of semiconductor devices are tested at one time, the area occupied by the test head is widened, so that the size of the chamber is increased and the overall size of the handler is greatly increased .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device having a novel structure capable of efficiently testing a large number of semiconductor devices using a plurality of test heads without significantly increasing the total area and size thereof. A test handler and a control method thereof are provided.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a loading unit for mounting semiconductor devices to be tested on a test tray in a state in which a test tray is placed in a horizontal state; A first chamber for holding or cooling the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature by keeping the inside thereof at a predetermined temperature state; A first rotator rotating the test tray downward by 90 degrees in the first chamber to convert the posture from a horizontal state to a vertical state; A test section having a plurality of test heads through which semiconductor elements of a test tray carried in the first chamber are electrically connected to perform a test; A second chamber for holding the inside of the test tray at a temperature opposite to that of the first chamber to cool or heat the semiconductor elements of the test tray conveyed from the test section to return to a normal temperature state; A second rotator for rotating the test tray 90 degrees in the second chamber to reduce the test tray from a vertical state to a horizontal state; And an unloading unit for separating semiconductor devices from the test tray transferred to the outside of the second chamber.

According to another aspect of the present invention, there is provided a semiconductor device testing apparatus comprising: a loading unit for mounting semiconductor devices to be tested on a test tray in a state in which a test tray is placed in a horizontal state; A first chamber for holding or cooling the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature by keeping the inside thereof at a predetermined temperature state; A test section having a plurality of test heads through which semiconductor elements of a test tray carried in the first chamber are electrically connected to perform a test; A second chamber for holding the inside of the test tray at a temperature opposite to that of the first chamber to cool or heat the semiconductor elements of the test tray conveyed from the test section to return to a normal temperature state; An unloading unit for separating the semiconductor device from the test tray transferred to the outside of the second chamber; A first rotator rotating the test tray downward by 90 degrees in the first chamber to convert the posture from a horizontal state to a vertical state; And a second rotator for rotating the test tray 90 degrees outside the second chamber to reduce the test tray from a vertical state to a horizontal state.

And the test unit is disposed inside the third chamber separately formed between the first chamber and the second chamber.

And the loading part is located in front of the first chamber.

And the unloading portion is located in front of the second chamber.

According to another aspect of the present invention, there is provided a method of testing a semiconductor device, comprising: mounting semiconductor elements to be tested in a test tray in a state in which a test tray is placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed into the first chamber downward by 90 degrees to convert the test tray into a vertical state; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray transferred to the outside of the second chamber.

And the semiconductor device of the test tray is brought into a predetermined temperature state while the test tray is sequentially transferred in one direction in the first chamber.

The rotation of the test tray in the first chamber by 90 degrees is performed immediately after the test tray is conveyed into the first chamber.

And rotating the test tray 90 degrees in the first chamber is performed immediately before returning the test tray to the test section.

And the semiconductor device of the test tray is reduced to a room temperature state while the test tray is sequentially transferred in one direction in the second chamber.

The rotation of the test tray in the second chamber by 90 degrees is performed immediately after the test tray is transported into the second chamber.

The rotation of the test tray in the second chamber by 90 degrees is performed immediately before returning the test tray to the outside of the second chamber.

According to another aspect of the present invention, there is provided a method of testing a semiconductor device, comprising: mounting semiconductor elements to be tested on a test tray in a state in which a test tray is placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed to the first chamber by 90 degrees to convert it into a vertical state; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Conveying the test tray out of the second chamber; Rotating the test tray 90 degrees outside the second chamber to reduce the test tray from a vertical state to a horizontal state; And separating the semiconductor device from the test tray reduced to the horizontal state, in a sequential manner.

And the semiconductor device of the test tray is brought into a predetermined temperature state while the test tray is sequentially transferred in one direction in the first chamber.

The rotation of the test tray in the first chamber by 90 degrees is performed immediately after the test tray is transported into the first chamber.

And rotating the test tray 90 degrees in the first chamber is performed immediately before returning the test tray to the test section.

And the semiconductor device of the test tray is reduced to a room temperature state while the test tray is sequentially transferred in one direction in the second chamber.

According to another aspect of the present invention, there is provided a method of testing a semiconductor device, comprising: mounting semiconductor elements to be tested in a test tray in a state in which a test tray is placed in a horizontal state; Rotating the test tray on which the semiconductor elements are mounted by 90 degrees to a vertical state; Conveying the test tray into the first chamber and heating or cooling the test tray to a predetermined temperature; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray transferred to the outside of the second chamber.

According to another aspect of the present invention, there is provided a method of testing a semiconductor device, comprising: mounting semiconductor elements to be tested in a test tray in a state in which a test tray is placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed into the first chamber by 90 degrees into a vertical state; Forming a semiconductor element of the test tray in a predetermined temperature state while sequentially transferring the test tray in the first chamber in one direction; Carrying a test tray in a first chamber to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Sequentially transferring the test tray in one direction in the second chamber and reducing the semiconductor elements of the test tray to a normal temperature state; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray transferred to the outside of the second chamber.

As described above, according to the present invention, loading and unloading operations of a semiconductor element are performed in a horizontal state of a test tray, and semiconductor elements are connected to a test head of a test section in a vertical state, The total area and size of the handler are not greatly increased, so space utilization can be improved

Hereinafter, preferred embodiments of a semiconductor device test handler and a control method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

First, a semiconductor device test handler and a control method thereof according to the present invention will be described with reference to FIGS. 1 and 2. FIG.

The semiconductor device test handler of the present invention mainly includes a loading stacker 10, a loading unit 30, a preheating chamber 50, a test chamber 60, a heat generating chamber 70, an unloading unit 40 An unloading stacker 20, a loading picker 81, and an unloading picker 82. The unloading stacker 20 includes a loading /

The loading stacker 10 and the unloading stacker 20 are disposed in front of the handler. The loading stacker 10 is loaded with a plurality of customer trays CT (customer trays) accommodating semiconductor elements to be tested. The unloading stacker 20 is loaded with a plurality of blank customer trays (CT) in which the tested semiconductor devices are sorted according to the test results and stored.

The loading unit 30 is disposed behind the loading stacker 10, and the test tray TT on which the semiconductor devices transferred from the loading stacker 10 are mounted is placed in a horizontal state and waits. The test tray (TT) has a structure in which a plurality of carrier modules (CM) capable of fixing and releasing semiconductor devices are arranged at regular intervals on a square frame made of a metal having excellent heat resistance.

The unloading unit 40 is disposed behind the unloading stacker 20 and is preferably disposed immediately in front of the heat generating chamber 70 to receive a test tray TT conveyed from the heat generating chamber 70 I receive it immediately. In the unloading portion 40, an operation for separating semiconductor devices from the test tray TT conveyed from the heat generating chamber 70 is performed.

The preheating chamber 50 is disposed immediately behind the loading section 30 and moves the test tray TT conveyed from the loading section 30 backward by one step in a vertical state, It functions to make the temperature state. A first tray transport unit (not shown) for moving the test tray TT step by step in the interior of the preheating chamber 50; and a second tray transport unit And a first temperature composition unit (not shown) is provided to selectively supply the temperature.

The first tray transport unit (not shown) can be configured by adopting a "tray transport device for handler" of the patent registration 10-0367994 (registered on December 30, 2002) filed by the present applicant and registered will be.

A first rotator 52 is installed in front of the preheating chamber 50 to rotate the test tray TT in a horizontal direction by 90 degrees from the loading unit 30 to convert the test tray TT into a vertical state. More specifically, as shown in FIG. 2, the first rotator 52 rotates the test tray TT in a horizontal direction downward by 90 degrees to increase the space utilization inside the preheating chamber 50 do.

The test chamber 60 is disposed between the preheating chamber 50 and the heat generating chamber 70 and has a function of testing the semiconductor elements of the test tray TT conveyed from the preheating chamber 50 under a predetermined temperature condition . The test chamber 60 is vertically coupled with a test head 62 having a plurality of test sockets (not shown) for electrically connecting semiconductor devices of the test tray TT. A contact push unit 64 for pressing the semiconductor element of the test tray TT toward the test head 62 and connecting the semiconductor element of the test tray TT to the test socket (not shown) at a predetermined pressure is provided in front of the test head 62, And is reciprocally movable.

The test chamber 60 is provided with a second temperature composition unit (not shown) for selectively supplying hot air or a low-temperature cooling gas into the test chamber 60, as in the preheating chamber 50.

The test head 62 is electrically connected to a separate test device called an external tester to exchange electrical signals.

The heat generating chamber 70 moves the test tray TT conveyed from the test chamber 60 in the vertical direction by one step at a time to apply a thermal stress opposite to the preheating chamber 50, And performs a function of reducing to a normal temperature state.

The heat-generating chamber 70 includes a second tray transport unit (not shown) for moving the test tray TT step by step like the preheating chamber 50, and a second hot- And a third temperature composition unit (not shown) for selectively supplying the third temperature.

A second rotator 72 for rotating the test tray TT in the vertical direction by 90 degrees to a horizontal state is installed forward of the interior of the heat generating chamber 70.

The test chamber 60 and the heat generating chamber 70 may be formed of a single layer but two test trays TT may be formed in the test chamber 60, May be configured to be tested at the same time.

In this case, a tray elevating device (not shown) for elevating and lowering the test tray TT to the upper and lower layers, respectively, is formed at the rear end of the preheating chamber 50 and the heat generating chamber 70.

A loading side tray transfer 32 for horizontally transporting the test tray TT is installed between the loading unit 30 and the preheating chamber 50. An unloading side tray transfer 42 is also provided between the unloading portion 40 and the heat generating chamber 70 to transfer the test tray TT horizontally.

The loading picker 81 and the unloading picker 82 are mounted on the upper side of the handler so as to be movable in the X and Y directions so that the semiconductor elements to be tested of the loading stacker 10 are vacuum- And vacuum-adsorbs the tested semiconductor elements of the unloading section 40 and returns the unloaded stacker 20 to the unloading stacker 20.

The semiconductor device test handler configured as described above operates as follows.

The loading picker 81 adsorbs and loads the semiconductor elements to be tested of the loading stacker 10 by loading the customer trays CT in which the semiconductor elements to be tested are housed in the loading stacker 10 and activating the handler, Is mounted on the carrier module (CM) of the test tray (TT) which stands by in the horizontal position on the tray (30). At this time, the preheating chamber 50 and the heat-generating chamber 70 maintain a predetermined temperature state by the first and second temperature composition units (not shown).

The loading side tray transfer 32 horizontally moves the test tray TT into the preheating chamber 50 when the operation of mounting the semiconductor elements in the test tray TT in the loading unit 30 is completed.

Then, the first rotator 52 rotates the test tray TT downward by 90 degrees to change the posture of the test tray TT from the horizontal state to the vertical state.

Then, the first tray transport unit (not shown) conveys the test tray TT in one direction (from front to back) one by one to heat or cool the semiconductor devices to a predetermined test temperature state.

When the test tray TT is moved to the rearmost chamber of the preheating chamber 50, a separate tray transfer not shown in the drawing horizontally moves the test tray TT to the inside of the test chamber 60.

When the test tray TT moved into the test chamber 60 is aligned to the front of the test head 62, the contact push unit 64 moves backward to press the carrier module CM of the test tray TT Thereby connecting the semiconductor devices to a test socket (not shown) of the test head 62 at a predetermined pressure. As described above, when semiconductor devices are connected to a test socket (not shown) of the test head 62, a test is performed while a predetermined electric signal is applied from an external tester (not shown).

When the test is completed, the contact push unit 64 moves forward to release the connection between the semiconductor element and the test head 62, and a separate tray transfer (not shown) horizontally moves the test tray TT laterally And transferred to the heat generating chamber (70).

The test tray TT conveyed to the heat generating chamber 70 is conveyed one step forward by the second tray conveyance unit (not shown), and the semiconductor elements are subjected to thermal stress opposite to that of the preheating chamber 50, Heated and restored to a normal temperature state.

The test tray TT transferred to the foremost side of the heat generating chamber 70 is rotated 90 degrees by the second rotator 72 and is reduced to a horizontal state in the vertical state.

The test tray TT reduced in a horizontal state in the heat generating chamber 70 is horizontally moved by the unloading side tray transfer 42 and conveyed to the unloading portion 40 outside the heat generating chamber 70.

The unloading picker 82 then separates the semiconductor elements from the test tray TT of the unloading section 40 and classifies them into each customer tray CT of the unloading stacker 20 according to the test results.

The handler of the present invention performs the above-described process repeatedly and performs testing of semiconductor devices.

In the embodiment of the handler described above, the first rotator 52 is positioned at the foremost position of the preheating chamber 50 and configured to rotate the test tray TT conveyed from the loading section 30 vertically. Alternatively, the first rotator 52 may be disposed behind the preheating chamber 50 so that the posture of the test tray TT may be changed from a horizontal state to a vertical state before the test tray TT is moved to the test chamber 60. [ State.

In this case, in the preheating chamber 50, it is preferable that the test tray TT is moved in a horizontal state upward or downward by one step to preheat or precool.

Likewise, the second rotator 72 may not be disposed in front of the heat generating chamber 70 but may be disposed behind the heat generating chamber 70. In this case, the handler causes the second rotator to switch the test tray conveyed from the test chamber 60 directly from the vertical state to the horizontal state, then moves the test tray in the horizontal state one step upward or downward, Is restored to a normal temperature state.

Any one of the first rotator 52 and the second rotator 72 may be configured outside the heat generating chamber 70 without being formed inside the heat generating chamber 70. [

1 is a plan view schematically showing an embodiment of a configuration of a semiconductor device test handler according to the present invention;

Fig. 2 is a side view of the handler of Fig. 1

Description of the Related Art [0002]

10: Loading stacker 20: Unloading stacker

30: Loading section 32: Loading side tray transfer

40: unloading section 42: unloading side tray transfer

50: preheating chamber 52: first rotator

60: Test chamber 62: Test head

64: contact push unit 70: heat generating chamber

72: second rotator 81: loading picker

82: Unloading picker CT: Customer tray

TT: Test tray CM: Carrier module

Claims (19)

A loading unit for mounting semiconductor devices to be tested on a test tray in a state where the test tray is placed in a horizontal state; A first chamber for holding or cooling the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature by keeping the inside thereof at a predetermined temperature state; A first rotator rotating the test tray downward by 90 degrees in the first chamber to convert the posture from a horizontal state to a vertical state; A test section having a test head in which semiconductor elements of a test tray conveyed in the first chamber are electrically connected and tested; A second chamber for holding the inside of the test tray at a temperature opposite to that of the first chamber to cool or heat the semiconductor elements of the test tray conveyed from the test section to return to a normal temperature state; A second rotator for rotating the test tray 90 degrees in the second chamber to reduce the test tray from a vertical state to a horizontal state; And And an unloading unit for separating the semiconductor device from the test tray transferred to the outside of the second chamber. A loading unit for mounting semiconductor devices to be tested on a test tray in a state where the test tray is placed in a horizontal state; A first chamber for holding or cooling the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature by keeping the inside thereof at a predetermined temperature state; A test section having a test head in which semiconductor elements of a test tray conveyed in the first chamber are electrically connected and tested; A second chamber for holding the inside of the test tray at a temperature opposite to that of the first chamber to cool or heat the semiconductor elements of the test tray conveyed from the test section to return to a normal temperature state; An unloading unit for separating the semiconductor device from the test tray transferred to the outside of the second chamber; A first rotator rotating the test tray downward by 90 degrees in the first chamber to convert the posture from a horizontal state to a vertical state; And And a second rotator for rotating the test tray 90 degrees outside the second chamber to reduce the test tray from a vertical state to a horizontal state. 3. The method according to claim 1 or 2, Wherein the test unit is disposed inside a third chamber separately formed between the first chamber and the second chamber. 3. The method according to claim 1 or 2, Wherein the loading portion is located in front of the first chamber. 3. The method according to claim 1 or 2, Wherein the unloading portion is located in front of the second chamber. Mounting the semiconductor elements to be tested in a test tray with the test tray placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed into the first chamber downward by 90 degrees to convert the test tray into a vertical state; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray carried out of the second chamber. 7. The method according to claim 6, wherein in the first chamber, the semiconductor elements of the test tray are brought into a predetermined temperature state while sequentially transferring the test tray in one direction. 8. The method according to claim 6 or 7, wherein rotating the test tray 90 degrees in the first chamber is performed immediately after the test tray is transferred into the first chamber. The method according to claim 6 or 7, wherein rotating the test tray 90 degrees in the first chamber is performed immediately before returning the test tray to the test section. 7. The method according to claim 6, wherein in the second chamber, the semiconductor elements of the test tray are reduced to normal temperature while sequentially transferring the test trays in one direction. The control method of a semiconductor device test handler according to claim 6 or 10, wherein rotating the test tray 90 degrees in the second chamber is performed immediately after the test tray is transferred into the second chamber . The control method of a semiconductor device test handler according to claim 6 or 10, wherein rotating the test tray 90 degrees in the second chamber is performed immediately before the test tray is returned to the outside of the second chamber . Mounting the semiconductor elements to be tested in a test tray with the test tray placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed to the first chamber downward by 90 degrees to convert it to a vertical state; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the plurality of test heads to perform a test of a large amount of semiconductor elements; Returning the test tray to the second chamber after completion of the test; Conveying the test tray out of the second chamber; Rotating the test tray 90 degrees outside the second chamber to reduce the test tray from a vertical state to a horizontal state; And separating the semiconductor elements from the test tray reduced to the horizontal state in sequence. 14. The method according to claim 13, wherein in the first chamber, the semiconductor elements of the test tray are brought into a predetermined temperature state while sequentially transferring the test tray in one direction. 15. The semiconductor device test handler control method according to claim 13 or 14, wherein rotating the test tray by 90 degrees in the first chamber is performed immediately after the test tray is transferred into the first chamber . The control method of a semiconductor device test handler according to claim 13 or 14, wherein rotating the test tray 90 degrees in the first chamber is performed immediately before returning the test tray to the test section. 14. The method according to claim 13, wherein in the second chamber, the semiconductor elements of the test tray are reduced to normal temperature while sequentially transferring the test trays in one direction. Mounting the semiconductor elements to be tested in a test tray with the test tray placed in a horizontal state; Rotating the test tray on which the semiconductor elements are mounted by 90 degrees to convert the test tray into a vertical state; Conveying the test tray into the first chamber and heating or cooling the test tray to a predetermined temperature; Carrying a test tray to a test section to electrically connect the semiconductor elements of the test tray to the plurality of test heads to perform a test of a large amount of semiconductor elements; Returning the test tray to the second chamber after completion of the test; Rotating the test tray in the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray carried out of the second chamber. Mounting the semiconductor elements to be tested in a test tray with the test tray placed in a horizontal state; Conveying the test tray equipped with the semiconductor elements horizontally into the first chamber; Rotating the test tray conveyed into the first chamber downward by 90 degrees to convert the test tray into a vertical state; Forming a semiconductor element of the test tray in a predetermined temperature state while sequentially transferring the test tray in the first chamber in one direction; Carrying a test tray in a first chamber to a test section to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after completion of the test; Sequentially transferring the test tray in one direction in the second chamber and reducing the semiconductor elements of the test tray to a normal temperature state; Rotating the test tray 90 degrees inside the second chamber to reduce the test tray from a vertical state to a horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray carried out of the second chamber.

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