KR20070089118A - Handler for testing semiconductor devices and method for controlling the same - Google Patents

Abstract

A handler for testing semiconductor devices and a method for controlling the same are provided to improve space utility by loading and unloading a semiconductor in a horizontal direction and testing the semiconductor in a vertical direction. A loading unit(30) loads semiconductor devices to be tested on a test tray. A first chamber heats or cools the semiconductor devices of the test tray to a given test temperature. A first rotator(52) rotates the test tray in the first chamber at a right angle. A test unit has a test head(62) which is electrically connected to the semiconductor devices. A second chamber cools or heats the semiconductor devices carried from the test unit. A second rotator(72) rotates the test tray in the second chamber at a right angle. An unloading unit(40) unloads the semiconductor devices from the test tray.

Description

Handler for Testing Semiconductor Devices And Method for Controlling the Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler for testing a semiconductor device, and more particularly, to a handler for a semiconductor device test and a control method thereof for electrically connecting a plurality of semiconductor devices to a test head to test electrical performance of the semiconductor device.

In general, memory ICs or non-memory semiconductor devices and module ICs having them properly configured on a substrate are shipped after various tests after production. The handler is a device that is used to electrically connect the semiconductor device, the module IC, and the like to the external test device for testing.

In recent years, the handlers can be used not only for general performance tests at room temperature, but also for extreme temperature conditions such as semiconductor devices and module ICs through the use of heat heaters or liquefied nitrogen injection systems in closed chambers. In addition, the high temperature test and the low temperature test to test whether it can perform a normal function are also being developed.

US Pat. No. 5,290,134 discloses a handler capable of performing a temperature test of semiconductor devices by creating a high or low temperature environment in a chamber as described above.

The conventional handler consists of a soak chamber, a test chamber and an unsoak chamber. The soak chamber conveys the test trays one by one in a horizontal state and heats or cools the semiconductor elements of the test tray to a predetermined temperature. In the test chamber, the test tray is connected to a test head placed in a horizontal state, and the test is performed at a predetermined temperature state. The unsoak chamber conveys the test tray step by step in a horizontal state, and returns the semiconductor elements of the test tray to the initial room temperture.

However, the conventional handler as described above has the following problems.

The handler is mounted in the test chamber in a horizontal state, and the connection is made in a state where the test tray is horizontal.

Therefore, when a plurality of test heads are configured in the test chamber to test a large number of semiconductor devices at one time, the area of the test head becomes large, thereby increasing the size of the chamber, thereby greatly increasing the overall size of the handler. .

The present invention is to solve the above problems, an object of the present invention is a semiconductor device of a new structure that can efficiently test a large amount of semiconductor devices using a plurality of test heads without significantly increasing the overall area and size Its purpose is to provide a test handler and its control method.

According to an aspect of the present invention for achieving the above object, the loading unit is a semiconductor device to be tested is mounted on the test tray in a state where the test tray is placed in a horizontal state; A first chamber for keeping the inside at a predetermined temperature to heat or cool the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature; A first rotator for changing a posture from a horizontal state to a vertical state by rotating the test tray downward by 90 degrees in the first chamber; A test unit including a plurality of test heads in which the semiconductor elements of the test tray conveyed from the first chamber are electrically connected and tested; A second chamber which maintains an interior at a temperature opposite to the first chamber, and cools or heats semiconductor elements of the test tray conveyed from the test unit to return to a room temperature state; A second rotator for reducing the test tray from the vertical state to the horizontal state by rotating the test tray 90 degrees in the second chamber; And an unloading unit configured to separate the semiconductor device from the test tray conveyed to the outside of the second chamber.

According to another feature of the invention, the loading unit is a semiconductor device to be tested is mounted on the test tray in a state where the test tray is placed in a horizontal state; A first chamber for keeping the inside at a predetermined temperature to heat or cool the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature; A test unit including a plurality of test heads in which the semiconductor elements of the test tray conveyed from the first chamber are electrically connected and tested; A second chamber which maintains the interior at a temperature opposite to the first chamber, and cools or heats the semiconductor elements of the test tray conveyed from the test unit to return to a room temperature state; An unloading unit configured to separate the semiconductor device from the test tray conveyed to the outside of the second chamber; A first rotator for changing a posture from a horizontal state to a vertical state by rotating the test tray downward by 90 degrees in the first chamber; The semiconductor device test handler includes a second rotator configured to rotate the test tray 90 degrees outside the second chamber to reduce the vertical state from the vertical state to the horizontal state.

The test unit may be disposed in a third chamber formed separately between the first chamber and the second chamber.

The loading unit is located in front of the first chamber.

The unloading part may be located in front of the second chamber.

According to still another aspect of the present invention, there is provided a method, comprising: mounting semiconductor devices to be tested on a test tray while the test tray is placed in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed into the first chamber by 90 degrees downward to convert it into a vertical state; Returning the test tray to the test unit to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Rotating the test tray 90 degrees in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; It provides a control method of a semiconductor device test handler comprising the step of separating the semiconductor device from the test tray conveyed to the outside of the second chamber.

In the first chamber, the semiconductor element of the test tray is brought into a predetermined temperature state while the test tray is sequentially transferred in one direction.

Rotating the test tray 90 degrees in the first chamber is performed immediately after the test tray is conveyed into the first chamber.

Rotating the test tray by 90 degrees in the first chamber is performed immediately before returning the test tray to the test unit.

The second chamber is characterized by reducing the semiconductor element of the test tray to room temperature while sequentially transporting the test tray in one direction.

Rotating the test tray 90 degrees in the second chamber is performed immediately after the test tray is conveyed into the second chamber.

Rotating the test tray 90 degrees in the second chamber is performed immediately before conveying the test tray to the outside of the second chamber.

Still another aspect of the present invention includes the steps of mounting the semiconductor devices to be tested on the test tray with the test tray in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed to the first chamber by 90 degrees to convert it into a vertical state; Returning the test tray to the test unit to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Conveying the test tray out of the second chamber; Rotating the test tray 90 degrees outside of the second chamber to reduce from the vertical state to the horizontal state; According to an aspect of the present invention, there is provided a method of controlling a semiconductor device test handler, the method comprising: sequentially removing the semiconductor device from the test tray reduced to the horizontal state.

In the first chamber, the semiconductor element of the test tray is brought into a predetermined temperature state while the test tray is sequentially transferred in one direction.

Rotating the test tray 90 degrees in the first chamber is performed immediately after the test tray is conveyed into the first chamber.

Rotating the test tray by 90 degrees in the first chamber is performed immediately before returning the test tray to the test unit.

The second chamber is characterized by reducing the semiconductor element of the test tray to room temperature while sequentially transporting the test tray in one direction.

According to still another aspect of the present invention, there is provided a method, comprising: mounting semiconductor devices to be tested on a test tray while the test tray is placed in a horizontal state; Rotating the test tray on which the semiconductor devices are mounted by 90 degrees to a vertical state; Conveying the test tray into the first chamber to heat or cool to a predetermined temperature state; Returning the test tray to the test unit to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Rotating the test tray 90 degrees in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; It provides a control method of a semiconductor device test handler comprising the step of separating the semiconductor device from the test tray conveyed to the outside of the second chamber.

According to still another aspect of the present invention, there is provided a method, comprising: mounting semiconductor devices to be tested on a test tray while the test tray is placed in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed into the first chamber by 90 degrees to convert it into a vertical state; Making the semiconductor element of the test tray to a predetermined temperature while sequentially transferring the test tray in one direction from the first chamber; Conveying the test tray to the test unit in the first chamber, electrically connecting semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Sequentially transferring the test trays in one direction in the second chamber and reducing the semiconductor elements of the test trays to room temperature; Rotating the test tray 90 degrees in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; It provides a control method of a semiconductor device test handler comprising the step of separating the semiconductor device from the test tray conveyed to the outside of the second chamber.

As described above, according to the present invention, the loading and unloading operations of the semiconductor elements are performed in the horizontal state of the test tray, and the semiconductor elements are connected to the test head of the test unit in the vertical state of the test tray, so that the test is performed. Configuration of the test head does not significantly increase the total area and size of the handler, thus improving space utilization.

Hereinafter, exemplary embodiments of a semiconductor device test handler and a control method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

First, a semiconductor device test handler and a control method thereof according to the present invention will be described with reference to FIGS. 1 and 2.

The semiconductor device test handler of the present invention includes a loading stacker 10, a loading unit 30, a preheating chamber 50, a test chamber 60, a heat removal chamber 70, and an unloading unit 40. ), An unloading stacker 20, a loading picker 81, and an unloading picker 82.

The loading stacker 10 and the unloading stacker 20 are disposed at the front of the handler. The loading stacker 10 includes a plurality of customer trays (CTs) in which semiconductor devices to be tested are stored. In addition, the unloading stacker 20 is loaded with a plurality of empty customer trays CT in which the tested semiconductor devices are classified and stored according to the test result.

The loading unit 30 is disposed at the rear of the loading stacker 10, and the test tray TT on which the semiconductor elements conveyed from the loading stacker 10 is mounted is placed in a horizontal state and waits. The test tray TT has a structure in which a plurality of carrier modules CM for fixing and releasing a semiconductor device are arranged at regular intervals in a rectangular frame made of metal having excellent heat resistance.

The unloading part 40 is disposed at the rear of the unloading stacker 20, and preferably, is disposed directly in front of the heat removing chamber 70 to transfer the test tray TT conveyed from the heat removing chamber 70. Receive immediately. In the unloading unit 40, the semiconductor devices are separated from the test tray TT conveyed from the heat removal chamber 70.

The preheating chamber 50 is disposed immediately behind the loading part 30, and moves the semiconductor element backward by one step in a vertical state while moving the test tray TT conveyed from the loading part 30 in a vertical state. It functions to bring the temperature state. To this end, a first tray conveying unit (not shown) for moving the test tray TT step by step in the preheating chamber 50 and a high temperature hot air or a low temperature cooling gas into the preheating chamber 50. A first temperature composition unit (not shown) for selectively supplying is installed.

The first tray conveying unit (not shown) may be configured by employing a 'tray feeder of a handler' of, for example, Patent Registration No. 10-0367994 (registered December 30, 2002) filed and filed by the present applicant. will be.

In addition, a first rotator 52 is installed at the front of the preheating chamber 50 to rotate the horizontal test tray TT transferred from the loading part 30 to 90 degrees to convert it to a vertical state. More specifically, as shown in FIG. 2, the first rotator 52 is configured to increase the space utilization inside the preheating chamber 50 by rotating the test tray TT in a horizontal state downward by 90 degrees. do.

The test chamber 60 is disposed between the preheating chamber 50 and the heat removing chamber 70, and performs a function of testing a semiconductor element of the test tray TT conveyed from the preheating chamber 50 under a predetermined temperature state. Perform. In the test chamber 60, a test head 62 having a plurality of test sockets (not shown) that electrically connects the semiconductor elements of the test tray TT to perform a test is vertically coupled. In front of the test head 62, a contact push unit 64 presses the semiconductor element of the test tray TT toward the test head 62 and connects it to a test socket (not shown) at a predetermined pressure. It is installed to reciprocate.

Like the preheating chamber 50, the test chamber 60 is provided with a second temperature composition unit (not shown) for selectively supplying hot hot air or low temperature cooling gas into the test chamber 60.

The test head 62 is electrically connected to a separate test equipment called an external tester (TESTER) to exchange electrical signals.

The heat removal chamber 70 applies a thermal stress opposite to the preheat chamber 50 described above while moving the test tray TT conveyed from the test chamber 60 one step forward in a vertical state, thereby removing the semiconductor device from the original state. It performs a function of reducing to room temperature.

To this end, the heat removal chamber 70 also has a second tray conveying unit (not shown) that moves the test tray TT step by step, as in the preheating chamber 50, and a high temperature hot air or a low temperature cooling gas into the chamber. It is provided with a third temperature composition unit (not shown) for selectively supplying.

In addition, a second rotator 72 is installed at the front of the heat removal chamber 70 to rotate the test tray TT in a vertical state to make the horizontal state by 90 degrees.

The preheating chamber 50, the test chamber 60, and the heat removing chamber 70 may be formed in a single layer, but two test trays TT are formed in the test chamber 60 by forming two chambers at the rear of each chamber. May be configured to be tested simultaneously.

In this case, a tray elevating device (not shown) for elevating the test tray TT to the upper and lower layers may be formed at the rear of the preheating chamber 50 and the heat removing chamber 70.

A loading side tray transfer 32 for conveying the test tray TT in a horizontal state is installed between the loading unit 30 and the preheating chamber 50. In addition, an unloading side tray transfer 42 for conveying the test tray TT in a horizontal state is also provided between the unloading part 40 and the heat removal chamber 70.

The loading picker 81 and the unloading picker 82 are installed on the upper side of the handler so as to be movable in the XYZ direction, respectively, and vacuum-adsorb the semiconductor elements to be tested of the loading stacker 10 to the loading unit 30. Then, the unloaded unit 40 is vacuum-adsorbed and tested to the unloading stacker 20.

The semiconductor device test handler configured as described above operates as follows.

When the user loads the customer trays CT containing the semiconductor devices to be tested in the loading stacker 10 and operates the handler, the loading picker 81 adsorbs and loads the semiconductor devices to be tested in the loading stacker 10. It is attached to the carrier module CM of the test tray TT which waits in a horizontal state to the part 30. At this time, the preheating chamber 50 and the heat removing chamber 70 maintain a predetermined temperature state by the first and second temperature composition units (not shown).

When the loading of the semiconductor device is mounted on the test tray TT in the loading unit 30, the loading tray transfer 32 horizontally moves the test tray TT into the preheating chamber 50.

Subsequently, the first rotator 52 rotates the test tray TT 90 degrees downward to change the attitude of the test tray TT from a horizontal state to a vertical state.

Then, the first tray conveying unit (not shown) heats or cools the semiconductor elements to a predetermined test temperature state while transferring the test tray TT step by step in one direction (front to back).

When the test tray TT moves to the rear of the preheating chamber 50, a separate tray transfer, not shown in the drawing, horizontally moves the test tray TT to the side and conveys the inside of the test chamber 60.

When the test tray TT moved into the test chamber 60 is aligned with the front of the test head 62, the contact push unit 64 moves backward to pressurize the carrier module CM of the test tray TT. The semiconductor elements are thereby connected to a test socket (not shown) of the test head 62 at a predetermined pressure. As described above, when the semiconductor devices are connected to a test socket (not shown) of the test head 62, a test is performed while a predetermined electric signal is applied from an external tester (not shown).

When the test is completed, the contact push unit 64 is moved forward to release the connection between the semiconductor device and the test head 62, and a separate tray transfer (not shown) horizontally moves the test tray TT laterally. Transfer to the heat removal chamber 70 is carried out.

The test tray TT conveyed to the heat removal chamber 70 is conveyed one step forward by a second tray conveying unit (not shown), and the semiconductor devices are cooled or subjected to a thermal stress opposite to that of the preheat chamber 50. Heated and restored to room temperature.

The test tray TT transferred to the foremost of the heat removal chamber 70 is rotated by 90 degrees by the second rotator 72 and is reduced from the vertical state to the horizontal state.

The test tray TT reduced in the horizontal state in the heat removal chamber 70 is horizontally moved by the unloading side tray transfer 42 and conveyed to the unloading part 40 outside the heat removal chamber 70.

Subsequently, the unloading picker 82 separates the semiconductor devices from the test tray TT of the unloading unit 40, and classifies and stores the semiconductor devices in each customer tray CT of the unloading stacker 20 according to the test result.

The handler of the present invention repeatedly performs the above process and performs testing of semiconductor devices.

On the other hand, in the above-described embodiment of the handler, the first rotator 52 is located at the forefront of the preheating chamber 50 and is configured to immediately rotate the test tray TT conveyed from the loading unit 30 vertically. However, unlike this, the first rotator 52 is configured at the rear of the preheating chamber 50 so that the posture of the test tray TT is vertical in the horizontal state just before the test tray TT moves to the test chamber 60. You can also switch to the state.

In this case, in the preheating chamber 50, the test tray TT is preferably preheated or precooled while moving up or down by a step in a horizontal state.

Similarly, the second rotator 72 may be configured behind the heat removal chamber 70 without being configured in front of the heat removal chamber 70. In this case, the handler converts the test tray conveyed from the test chamber 60 from the vertical chamber to the horizontal state, and then moves the horizontal test tray one step upwards or downwards. Is preferably configured to restore to room temperature.

In addition, any one of the first rotator 52 and the second rotator 72 may be configured outside the heat removal chamber 70 without being configured inside the heat removal chamber 70.

1 is a plan view schematically showing one embodiment of a configuration of a semiconductor device test handler according to the present invention;

2 is a side view as seen from the side of the handler of FIG.

Explanation of symbols on the main parts of the drawings

10: loading stacker 20: unloading stacker

30: loading part 32: loading side tray transfer

40: unloading portion 42: unloading side tray transfer

50: preheat chamber 52: first rotator

60: test chamber 62: test head

64: contact push unit 70: heat removal chamber

72: second rotator 81: loading picker

82: unloading picker CT: customer tray

TT: Test Tray CM: Carrier Module

Claims (19)

A loading unit in which a semiconductor device to be tested is mounted on the test tray while the test tray is placed in a horizontal state; A first chamber for keeping the inside at a predetermined temperature to heat or cool the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature; A first rotator for changing a posture from a horizontal state to a vertical state by rotating the test tray downward by 90 degrees in the first chamber; A test unit including a test head to which the semiconductor elements of the test tray conveyed from the first chamber are electrically connected and tested; A second chamber which maintains the interior at a temperature opposite to the first chamber, and cools or heats the semiconductor elements of the test tray conveyed from the test unit to return to a room temperature state; A second rotator for reducing the test tray from the vertical state to the horizontal state by rotating the test tray 90 degrees in the second chamber; And And an unloading unit configured to separate the semiconductor device from the test tray conveyed to the outside of the second chamber. A loading unit in which a semiconductor device to be tested is mounted on the test tray while the test tray is placed in a horizontal state; A first chamber for keeping the inside at a predetermined temperature to heat or cool the semiconductor elements of the test tray conveyed from the loading unit to a predetermined test temperature; A test unit including a test head to which the semiconductor elements of the test tray conveyed from the first chamber are electrically connected and tested; A second chamber which maintains the interior at a temperature opposite to the first chamber, and cools or heats the semiconductor elements of the test tray conveyed from the test unit to return to a room temperature state; An unloading unit configured to separate the semiconductor device from the test tray conveyed to the outside of the second chamber; A first rotator for changing a posture from a horizontal state to a vertical state by rotating the test tray downward by 90 degrees in the first chamber; And And a second rotator configured to rotate the test tray 90 degrees outside the second chamber to reduce it from a vertical state to a horizontal state. The method according to claim 1 or 2, The test unit is a semiconductor device test handler, characterized in that disposed in the third chamber formed separately between the first chamber and the second chamber. The method according to claim 1 or 2, And the loading part is located in front of the first chamber. The method according to claim 1 or 2, The unloading unit is a semiconductor device test handler, characterized in that located in front of the second chamber. Mounting semiconductor elements to be tested on the test tray while the test tray is placed in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed into the first chamber by 90 degrees downward to convert it into a vertical state; Returning the test tray to the test unit to electrically connect the semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Rotating the test tray 90 degrees in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray conveyed to the outside of the second chamber. 7. The method of claim 6, wherein the first chamber transfers the test tray sequentially in one direction to bring the semiconductor device of the test tray to a predetermined temperature state. 8. The method according to claim 6 or 7, wherein rotating the test tray 90 degrees in the first chamber is performed immediately after the test tray is conveyed into the first chamber. 8. The method according to claim 6 or 7, wherein rotating the test tray 90 degrees in the first chamber is performed immediately before conveying the test tray to the test unit. The method of claim 6, wherein the second chamber reduces the semiconductor elements of the test tray to room temperature while sequentially transferring the test trays in one direction. The method according to claim 6 or 10, wherein the rotation of the test tray by 90 degrees in the second chamber is performed immediately after the test tray is conveyed into the second chamber. . The method according to claim 6 or 10, wherein the rotating of the test tray by 90 degrees in the second chamber is performed immediately before conveying the test tray to the outside of the second chamber. . Mounting semiconductor elements to be tested on the test tray while the test tray is placed in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed to the first chamber by 90 degrees downward to convert it to a vertical state; Returning the test tray to the test unit, electrically connecting the semiconductor elements of the test tray to the plurality of test heads, to test a plurality of semiconductor elements; Returning the test tray to the second chamber after the test is completed; Conveying the test tray out of the second chamber; Rotating the test tray 90 degrees outside of the second chamber to reduce from the vertical state to the horizontal state; And sequentially separating the semiconductor device from the test tray reduced to the horizontal state. The method of claim 13, wherein the first chamber transfers the test tray sequentially in one direction to bring the semiconductor device of the test tray to a predetermined temperature state. 15. The method of claim 13 or 14, wherein rotating the test tray in the first chamber by 90 degrees is performed immediately after the test tray is conveyed into the first chamber. . 15. The method of claim 13 or 14, wherein rotating the test tray 90 degrees in the first chamber is performed immediately before returning the test tray to the test unit. The method of claim 13, wherein the second chamber reduces the semiconductor elements of the test tray to room temperature while sequentially transferring the test trays in one direction. Mounting semiconductor elements to be tested on the test tray while the test tray is placed in a horizontal state; Rotating the test tray on which the semiconductor devices are mounted to a vertical state by rotating the test tray downward by 90 degrees; Conveying the test tray into the first chamber to heat or cool to a predetermined temperature state; Returning the test tray to the test unit, electrically connecting the semiconductor elements of the test tray to the plurality of test heads, to test a plurality of semiconductor elements; Returning the test tray to the second chamber after the test is completed; Rotating the test tray in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray conveyed to the outside of the second chamber. Mounting semiconductor elements to be tested on the test tray while the test tray is placed in a horizontal state; Conveying the test tray on which the semiconductor devices are mounted, into the first chamber in a horizontal state; Rotating the test tray conveyed into the first chamber by 90 degrees downward to convert it into a vertical state; Making the semiconductor element of the test tray to a predetermined temperature while sequentially transferring the test tray in one direction from the first chamber; Conveying the test tray to the test unit in the first chamber, electrically connecting semiconductor elements of the test tray to the test head to perform a test; Returning the test tray to the second chamber after the test is completed; Sequentially transferring the test trays in one direction in the second chamber and reducing the semiconductor elements of the test trays to room temperature; Rotating the test tray 90 degrees in the second chamber to reduce the vertical state from the vertical state to the horizontal state; Conveying the test tray out of the second chamber; And separating the semiconductor device from the test tray conveyed to the outside of the second chamber.

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